Mounting machine

Abstract

To improve recognition accuracy of a recognition mark to achieve high mounting accuracy by performing at least one type of high-accuracy recognition processing when a controller determines that the high mounting accuracy is required.SOLUTION: A mounting machine 13 can switch standard recognition processing and high-accuracy recognition processing whose recognition accuracy is higher than that of the standard recognition processing as recognition processing for recognizing a plurality of FID marks 52 provided on a substrate B. The mounting machine 13 determines whether or not a production type of the substrate B requires high mounting accuracy. The mounting machine 13 includes a controller 46 for controlling to perform at least one type of high-accuracy recognition processing among a plurality of types of high-accuracy recognition processing when the production type is determined to require high mounting accuracy.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to a mounting machine. [Background technology]

[0002] In a mounting machine that mounts components on a board, the position of the board is recognized by image recognition of recognition marks provided on the board. JP 2005-93490 A (Patent Document 1 below) describes a recognition process in which, in a process of recognizing the component holding position, the recognition mark is positioned within a predetermined area set in the center of the recognition field, and the component holding position is recognized based on the result of image recognition of the recognition mark. This recognition process enables highly accurate position recognition without being affected by lens aberration. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-93490 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the above Patent Document 1 does not disclose criteria for determining when to apply the above recognition process. Furthermore, while the above recognition process can perform position recognition with high accuracy, it incurs tact time loss due to performing image recognition of the recognition mark twice. Therefore, it is desirable to prepare in advance multiple types of high-accuracy recognition processes, including recognition processes that further reduce tact time loss, and to be able to select from them appropriately depending on the type of board to be produced. [Means for solving the problem]

[0005] The mounting machine of the present disclosure is a mounting machine that can switch between a standard recognition process and a high-precision recognition process that has higher recognition accuracy than the standard recognition process as a recognition process for recognizing multiple recognition marks provided on a board, and is equipped with a controller that determines whether the production type of the board is a production type that requires high mounting accuracy, and if it determines that it is a production type that requires high mounting accuracy, controls the mounting machine to perform at least one type of high-precision recognition process out of the multiple types of high-precision recognition processes. [Effects of the Invention]

[0006] According to the present disclosure, when the controller determines that high mounting accuracy is required, at least one type of high-precision recognition processing is performed to increase the recognition accuracy of the recognition mark, thereby achieving high mounting accuracy. [Brief explanation of the drawings]

[0007] [Figure 1] Figure 1 is a diagram showing the configuration of a component mounting line. [Figure 2] FIG. 2 is a plan view of the mounting machine. [Figure 3] FIG. 3 is a schematic diagram showing how a component picked up by a suction nozzle is transported. [Figure 4] FIG. 4 is a block diagram showing the electrical configuration of the mounting machine. [Figure 5] FIG. 5 is a diagram showing the structure of the board data. [Figure 6] FIG. 6 is a diagram illustrating the recognition process of the first embodiment. [Figure 7] FIG. 7 is a diagram illustrating the recognition process of the second embodiment. [Figure 8A] FIG. 8A is a diagram illustrating the recognition process of the third embodiment. [Figure 8B] FIG. 8B is a diagram illustrating the timing of the third embodiment. [Figure 9] FIG. 9 is a diagram illustrating the recognition process of the fourth embodiment. [Figure 10A] FIG. 10A is a diagram illustrating the recognition process of the fifth embodiment. [Figure 10B]FIG. 10B is a diagram illustrating an application example of the fifth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] [Description of the embodiments of the present disclosure] First, embodiments of the present disclosure will be listed and described. (1) The mounting machine of the present disclosure is a mounting machine that can switch between a standard recognition process and a high-precision recognition process that has higher recognition accuracy than the standard recognition process as a recognition process for recognizing multiple recognition marks provided on a board, and is equipped with a controller that determines whether the production type of the board is a production type that requires high mounting accuracy, and if it determines that the production type requires high mounting accuracy, controls the mounting machine to perform at least one type of high-precision recognition process out of the multiple types of high-precision recognition processes.

[0009] The recognition accuracy of recognition marks is directly linked to the accuracy of component placement. However, high-precision recognition processing, which has higher recognition accuracy than standard recognition processing, has a larger tactile loss than standard recognition processing, so it is not realistic to perform all recognition processing using high-precision recognition processing. Therefore, the system determines whether the production type of board requires high placement accuracy, and if it determines that it does, it performs at least one type of high-precision recognition processing, thereby achieving high placement accuracy while minimizing tactile loss.

[0010] (2) It is preferable that the apparatus further includes a plurality of board recognition cameras that recognize the plurality of recognition marks, and that the controller performs at least one of the following three types of high-precision recognition processing. 1. Recognizing the plurality of recognition marks using only one of the plurality of board recognition cameras. 2. The recognition mark is recognized within a predetermined area in the center of the field of view of the board recognition camera. 3. When three or more recognition marks are set on one substrate, the three or more recognition marks are recognized.

[0011] According to the high-precision recognition process of 1, by performing the recognition process using only one of the board recognition cameras, it is possible to eliminate the effect on mounting accuracy of changes in the distance between multiple board recognition cameras caused by thermal expansion and contraction of the support member that supports the board recognition cameras, thereby improving mounting accuracy. 2. The high-precision recognition process reduces the reduction in recognition accuracy caused by aberration in the lenses that make up the board recognition camera, making it possible to obtain the position of the recognition mark with high accuracy and reducing component placement misalignment. 3. The high-precision recognition processing allows for more accurate correction of errors between the mounter's XY coordinate system and the board coordinate system than when only two recognition marks are set on one board, reducing component placement misalignment caused by coordinate system errors.

[0012] (3) It is preferable that the controller is provided with a recognition processing judgment unit that judges whether the high-precision recognition processing is necessary, and when the recognition processing judgment unit judges that the high-precision recognition processing is necessary, it automatically switches from the standard recognition processing to the high-precision recognition processing. Since the recognition process determination unit determines whether high-precision recognition process is necessary, the mounting machine can automatically switch from standard recognition process to high-precision recognition process without relying on an operator.

[0013] (4) It is preferable that the recognition process determination unit determines that the high-precision recognition process is necessary when the component to be mounted on the board is a component that requires high mounting precision. The system can switch from standard recognition processing to high-precision recognition processing when the component requires high mounting precision.

[0014] (5) It is preferable that the controller includes a board data storage means for storing board data including at least component information and mounting information, calculates an adjacent distance between a pair of adjacent components from the mounting positions and sizes of the components based on the board data, and the recognition processing judgment unit judges that the high-precision recognition processing is necessary when the smallest adjacent distance is equal to or less than a certain distance. The adjacent distance is calculated by referring to the board data, and the system can switch from standard recognition processing to high-precision recognition processing when the smallest adjacent distance is less than a certain distance.

[0015] (6) It is preferable that the recognition processing judgment unit judges that the high-precision recognition processing is necessary when an inspection machine located downstream of the mounting machine detects that the amount of mounting deviation of the component mounted by its own mounting machine is equal to or greater than a certain amount of mounting deviation, and that the controller automatically switches the recognition processing on the mounting machine from the standard recognition processing to the high-precision recognition processing after it has been determined that the high-precision recognition processing is necessary. When the component placement deviation exceeds a certain level, the system can switch from standard recognition processing to high-precision recognition processing.

[0016] (7) The controller is preferably provided with a substrate data storage means for storing substrate data including at least substrate information, and for production types requiring high mounting accuracy, a high-precision mode is set in the substrate information to instruct the recognition process to be performed using the high-precision recognition process. The standard recognition process can be switched to high-precision recognition process when the high-precision mode is set in the board information of the board data.

[0017] (8) The controller is preferably provided with a substrate data storage means for storing substrate data including at least mark information, and for production types requiring high mounting accuracy, a high-precision mode is set in the mark information to instruct the recognition process to be performed using the high-precision recognition process. The activation condition is that high-precision mode is set in the mark information of the board data, and the system can switch from standard recognition processing to high-precision recognition processing. For example, if there is a block on a part of the board that requires high-precision mounting, you can set a recognition mark specifically for that block, and perform high-precision recognition processing only for that recognition mark, while performing standard recognition processing for other recognition marks, thereby minimizing tactile loss.

[0018] [Details of the embodiments of the present disclosure] Specific examples of the mounting machine of the present disclosure will be described below with reference to the drawings. Note that the present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims.

[0019] [Component mounting line] 1 is a diagram showing the configuration of component mounting line 11. Component mounting line 11 is a production line that produces component-mounted boards on which components P are mounted, and includes a printer 12, a mounter 13, a reflow oven 14, and an inspection machine 15.

[0020] The printer 12, the mounter 13, the reflow oven 14, and the inspection machine 15 are connected in series via a transfer conveyor 16 (see FIG. 2). The transfer conveyor 16 transfers the substrate B to be worked on along the component mounting line 11.

[0021] The printer 12 is a work device that performs a printing process on the board B. The printing process is a process of printing solder paste on the board B. The mounting machine 13 is a work device that performs a process of mounting components P on the board B after the printing process. The reflow furnace 14 is a work device that heats the solder paste to solder the components P to the board B, completing a component-mounted board. The inspection machine 15 is a work device that inspects the component-mounted board to which the components P are soldered.

[0022] The printer 12, mounter 13, reflow oven 14, and inspection machine 15 are connected to a server 18 via a LAN. The server 18 is a device that manages the component mounting line 11. The server 18 stores information on board data, production plan information, etc. The production plan information includes the type of board B and the type of component P used in production. The board data information will be described later.

[0023] [Mounting machine] 2 is a plan view of the mounting machine 13. The mounting machine 13 is equipped with a pair of transport conveyors 16 that are arranged on a base 30 and transport a board B, component supply units 31 that are arranged on both the front and rear sides of the transport conveyors 16, and a component mounting head unit 32 that is provided above the base 30.

[0024] The component supply units 31 are provided at four locations in total, at upstream and downstream portions on the front and rear sides of both transport conveyors 16. In each component supply unit 31, a plurality of tape feeders 33, each holding a plurality of components P, are arranged in parallel.

[0025] As shown in Fig. 3, the head unit 32 is movable between the component supply unit 31 and the board B so as to pick up a component P from a component supply position of the component supply unit 31 and mount it on the board B. Specifically, as shown in Fig. 2, the head unit 32 is supported by a head unit support member 34 extending in the X-axis direction (the direction indicated by X in Fig. 2) so as to be movable in the X-axis direction, and this head unit support member 34 is supported at both ends thereof by a pair of guide rails 35 extending in the Y-axis direction (the direction indicated by Y in Fig. 2) so as to be movable in the Y-axis direction. The head unit 32 is driven in the X-axis direction by an X-axis motor 36 and in the Y-axis direction by a Y-axis motor 37.

[0026] A plurality of heads 38 are mounted on the head unit 32 and aligned in the X-axis direction. Each head 38 is driven in the Z-axis direction (a direction perpendicular to both the X-axis and Y-axis directions, indicated by Z in FIG. 2) by an elevation mechanism using a Z-axis motor 39 as its drive source, and is also driven in the rotational direction by a rotation drive mechanism using an R-axis motor 40 as its drive source.

[0027] A suction nozzle 41 is provided at the tip of each head 38 for suctioning a component P and mounting it at a predetermined mounting position on the top surface of the board B. An air pressure supply means (not shown) is provided inside the head 38 to supply negative pressure while the component P is being suctioned, while the component P is being transported, and while the head 38 is being lowered, and to supply positive pressure at the moment the component P is being mounted.

[0028] As shown in Fig. 2, component recognition cameras 42 are installed on the base 30 on the front and rear sides of both transport conveyors 16. The component recognition cameras 42 capture images of the suction posture of the component P picked up by the suction nozzle 41 from below in the Z axis direction, thereby obtaining captured images of the underside of the component P. The component recognition cameras 42 convert the obtained images into image signals, and these image signals are output to an image processing unit 45. As shown in Fig. 3, an illumination device 43 is provided near the component recognition cameras 42 to illuminate the component P picked up by the suction nozzle 41.

[0029] A side-view camera 44 is installed on the underside of the head unit support member 34. The side-view camera 44 is formed to extend downward from the center of the underside of the head unit support member 34, and is able to capture an image of the suction posture of a component P that has been picked up by a suction nozzle 41 at its lower end from the rear side in the Y-axis direction, thereby obtaining a captured image of the side of the component P. The other configuration is the same as that of the component recognition camera 42, and the obtained image is converted into an image signal, which is output to an image processing unit 45.

[0030] A pair of board recognition cameras 51A, 51B are attached integrally to both sides of the head unit 32 on the outer surface of the head unit 32. The board recognition camera 51A on the left side in FIG. 3 corresponds to the board recognition camera 1 in FIG. 4, and similarly, the board recognition camera 51B on the right side in FIG. 3 corresponds to the board recognition camera 2. As shown in FIG. 2, a pair of fiducial marks (hereinafter sometimes referred to as "FID marks") 52 are provided at both diagonally opposite corners of the board B. These board recognition cameras 51A, 51B are used to capture images of the pair of FID marks 52 and recognize the position of the board B. The other configuration is the same as that of the component recognition camera 42, and the obtained image is converted into an image signal, which is output to the image processing unit 45.

[0031] [Electrical configuration of mounting machine] Next, the electrical configuration of the mounting machine 13, centered around the controller 46, will be described with reference to Fig. 4. The controller 46 includes an arithmetic processing unit 47, a recognition processing judgment unit 48, a board data storage means 49, a transport system data storage means 50, a motor control unit 53, and an image processing unit 45. A display unit 54 is connected to the arithmetic processing unit 47.

[0032] The motor control unit 53 is connected to the X-axis motor 36, Y-axis motor 37, Z-axis motor 39, and R-axis motor 40. The motor control unit 53 supplies the voltage and current required to drive each of the motors 36, 37, 39, and 40 based on mounting information in the board data, which will be described below. This allows the component P to be freely transported in the X-axis, Y-axis, Z-axis, and R-axis directions.

[0033] As shown in FIG. 5, the board data includes board information, component information, mark information, fiducial information, and mounting information. The board information includes information such as board size, fixing method, and high-precision mode. The component information includes information such as component size and recognition information. The mark information includes information such as mark size, recognition information, and high-precision mode of the FID mark 52. The fiducial information includes information such as the fiducial type and fiducial position of the FID mark 52. The mounting information includes information such as the mounting position and mounting angle. Each piece of board data information can be obtained by referencing the server 18, and each piece of board data information read from the server 18 is read and stored in the board data storage means 49 at the start of the mounting process.

[0034] Component recognition camera 42, side-view camera 44, and board recognition cameras 51A and 51B are connected to image processing unit 45. Image processing unit 45 recognizes component P based on the image captured by component recognition camera 42, and inspects the suction state of component P based on this recognized image. The presence or absence of component P may be inspected using side-view camera 44 instead of component recognition camera 42, or may be inspected using both component recognition camera 42 and side-view camera 44.

[0035] Recognition processes for recognizing the FID mark 52 can be broadly divided into standard recognition processes and high-precision recognition processes. The mark recognition accuracy of the FID mark 52 is directly linked to mounting accuracy. High-precision recognition processes prioritize mark recognition accuracy at the expense of takt time compared to standard recognition processes in order to achieve a mounting accuracy of, for example, 15 μm. When the FID mark 52 is recognized using high-precision recognition processes, the position of the substrate B can be obtained more accurately than with standard recognition processes, enabling mounting at a more accurate XY coordinate position.

[0036] [Examples of high-precision recognition processing] The multiple types of high-precision recognition processing include, for example, the following three types of processing: Any one of 1 to 3 may be performed, or an appropriate combination of these may be performed.

[0037] 1. Fix the board recognition camera to one specified camera In standard recognition processing, of the two board recognition cameras 51A, 51B, the one closest to the FID mark 52 is used. For example, in FIG. 2, the left board recognition camera 51A is used to capture the FID mark 52 in the front left, and the right board recognition camera 51B is used to capture the FID mark 52 in the back right. The head unit 32 moves to the fiducial position of the board data to perform mark recognition, and acquires position data of the FID mark 52 based on the relative position of the FID mark 52 with respect to the center of the field of view of the board recognition camera. Standard recognition processing has the advantage of shortening the takt time because the movement distance of the head unit 32 is short.

[0038] On the other hand, in high-precision recognition processing, one of the two board recognition cameras 51A, 51B that can reach the positions of all of the FID marks 52 is selected and fixed, and the single board recognition camera is used to capture images of the two FID marks 52. The reason for this is that it is possible to improve mounting accuracy by eliminating the effect on mounting accuracy of changes in the distance between the two board recognition cameras 51A, 51B caused by thermal expansion and contraction of the head unit 32 that supports the two board recognition cameras 51A, 51B.

[0039] 2. Centering (Fine Recognition) when recognizing FID marks When recognizing FID mark 52 at a position away from the center within the field of view of board recognition cameras 51A and 51B, the influence of aberrations of the lenses constituting board recognition cameras 51A and 51B cannot be avoided, and errors occur in the acquired position data of FID mark 52. For this reason, in order to reduce errors due to lens aberrations, it is preferable to capture an image of FID mark 52 at the center of the lens.

[0040] Therefore, the high-precision recognition process includes a first recognition process in which the FID mark 52 is imaged and recognized; a centering process in which, if the first recognition result shows that the FID mark 52 is not within a predetermined area from the center of the field of view, the positions of the board recognition cameras 51A and 51B are corrected so that the FID mark 52 is positioned at the center of the field of view; a second recognition process in which the FID mark 52 is imaged and recognized after the position correction; and a process in which, if the second recognition result shows that the FID mark 52 is within a predetermined area from the center of the field of view, the position data of the FID mark 52 is obtained based on the second recognition result.

[0041] In this way, although there is a tactile loss due to performing the recognition process twice, by centering after the first recognition process, fine recognition can be performed in the second recognition process without being affected by lens aberration.

[0042] If the first recognition result shows that the FID mark 52 is within a predetermined range from the center of the field of view, the high-precision recognition process is terminated without performing the centering step and the second recognition step. If the second recognition result shows that the FID mark 52 is not within a predetermined range from the center of the field of view, the centering step and the recognition step are repeated until the FID mark 52 is positioned within a predetermined range from the center of the field of view.

[0043] 3. For board data with three or four FID marks, the three or four FID marks are recognized and corrected.

[0044] In board data where there are three or four FID marks 52 on one board B, the error between the XY coordinate system of the mounting machine and the board coordinate system can be corrected by recognizing and correcting the three or four FID marks 52, and component mounting deviations caused by errors in the coordinate systems can be reduced. Compared to board data where there are only two FID marks 52 on one board B, there is a disadvantage in that the travel distance of the board recognition cameras 51A and 51B is longer, resulting in tactile loss.

[0045] [Recognition processing and judgment section] The recognition process determination unit 48 determines whether high-precision recognition process is necessary according to the conditions for invoking the recognition process described in any one of Examples 1 to 5. If any of the conditions for invoking the recognition process is met, the recognition process determination unit 48 determines that high-precision recognition process is necessary, and the controller 46 controls the process to automatically switch from the standard recognition process to the high-precision recognition process.

[0046] [Example 1] The recognition process of Example 1 will be described with reference to FIG. 6. At the start of the mounting process, board data corresponding to the production type of board B is read from server 18. The read board data is stored in board data storage means 49 in the machine settings or internal machine settings of mounting machine 13. The component information in the board data can refer to information on all components P to be mounted on board B. Controller 46 references the board data and controls to automatically switch from standard recognition processing to high-precision recognition processing for a production type that contains at least one component P requiring high mounting accuracy (a component P for which the high-precision mode of the board data is enabled). An example of such a component P is a lead component. On the other hand, for a production type that does not contain any component P requiring high mounting accuracy, standard recognition processing is performed without switching from standard recognition processing to high-precision recognition processing.

[0047] In the case of a mounting machine having two parallel lanes along which substrates B are transported, in which substrates B are mounted by the front head unit on a substrate B transported to an upstream working position on the front lane, and in parallel with this mounting, substrates B are mounted by the rear head unit on another substrate B transported to a downstream working position on the rear lane, it is possible to switch and control only the recognition processing of the front head unit to high precision mode, while the recognition processing of the rear head unit remains in standard mode.

[0048] [Example 2] The recognition process of Example 2 will be described with reference to FIG. 7. At the start of the mounting process, board data corresponding to the production type of board B is read from server 18. The read board data includes at least component information and mounting information, and a simulation of the case where all components P are mounted on board B is performed using the production type program. Through the simulation, controller 46 calculates the adjacent distance between a pair of adjacent components P from the mounting positions and sizes of components P based on the board data stored in board data storage means 49. Recognition process determination unit 48 determines that high-precision recognition process is necessary if the minimum adjacent distance is equal to or less than a certain distance. For example, if a large chip component P1 and a small chip component P2 are mounted adjacent to each other and there is a location where the adjacent distance D is equal to or less than a certain distance (e.g., 60 μm), control may be performed to automatically switch from standard recognition process to high-precision recognition process.

[0049] [Example 3] The recognition process of the third embodiment will be described with reference to FIGS. 8A and 8B. As shown in FIG. 8A, the component mounting line 11A of the third embodiment includes a printer 12, three mounters 13A, 13B, and 13C, and an inspection machine 19. The three mounters 13A, 13B, and 13C are, from the upstream side, the first mounter 13A, the second mounter 13B, and the third mounter 13C. The inspection machine 19 is located downstream of the third mounter 13C. Each mounter 13A, 13B, and 13C mounts a component P on a board B, and the inspection machine 19 in the subsequent process measures the amount of mounting misalignment of the component P. The measured amount of mounting misalignment is transmitted to each of the upstream mounters 13A, 13B, and 13C via a communication means such as a LAN.

[0050] For example, if the inspection machine 19 detects that the amount of mounting deviation of the component P mounted by the second mounting machine 13B is greater than a certain amount of deviation, the recognition processing judgment unit 48 of the second mounting machine 13B determines that high-precision recognition processing is necessary, and the controller 46 of the second mounting machine 13B controls the recognition processing in the second mounting machine 13B to automatically switch from standard recognition processing to high-precision recognition processing after it is determined that high-precision recognition processing is necessary.

[0051] 8B, the timing when Examples 1 and 2 are applied is when the board data corresponding to the production type of board B is read from server 18 and loaded into board data storage means 49 at the start of the mounting process (step S1), whereas Example 3 is applied during production in the mounting process. It is assumed that the recognition process is determined based on Examples 1 and 2 (step S2) and standard mode is selected. After the recognition process of FID mark 52 is performed in standard mode, if production of mounting components P on board B is started (step S3), controller 46 controls inspection machine 19 so that, if a mounting deviation of a certain amount or more occurs in inspection machine 19, the recognition process for subsequent boards B following the currently being produced board B is automatically switched from standard mode to high-precision mode (step S4).

[0052] [Example 4] The recognition processing of the fourth embodiment will be described with reference to Fig. 9. In the fourth embodiment, when the board data corresponding to the production type of board B is read from the server 18 at the start of the mounting process and loaded into the board data storage means 49, if the high-precision mode of the board information of the board data is set to be enabled, the conditions for invoking the high-precision recognition processing are applied.

[0053] [Example 5] The recognition processing of Example 5 will be described with reference to Figures 10A and 10B. In Example 5, as shown in Figure 10A, when board data corresponding to the production type of board B is read from server 18 at the start of the mounting process and loaded into board data storage means 49, if the high-precision mode of the mark information of the board data is set to be enabled, the conditions for invoking high-precision recognition processing are applied.

[0054] As shown in Figure 10B, a first block B1, a second block B2, and a third block B3 are set on one board B, and high mounting accuracy is required for the second block B2 and the third block B3. The first block B1 is recognized using two recognition marks M1, the second block B2 is recognized using three recognition marks M2, and the third block B3 is recognized using three recognition marks M3. In this case, the mark information for the board data is set to standard mode for recognition mark M1, and high-precision mode for recognition marks M2 and M3. This allows standard recognition processing and high-precision recognition processing to be used on a block-by-block basis for one board B.

[0055] [Effects of the embodiment] The mounting machine 13 of the present disclosure is a mounting machine 13 that can switch between a standard recognition process and a high-precision recognition process that has higher recognition accuracy than the standard recognition process as a recognition process for recognizing multiple FID marks 52 provided on a substrate B, and is equipped with a controller 46 that determines whether the production type of substrate B is a production type that requires high mounting accuracy, and if it is determined that it is a production type that requires high mounting accuracy, controls the mounting machine 13 to perform at least one type of high-precision recognition process out of the multiple types of high-precision recognition processes.

[0056] The recognition accuracy of the FID mark 52 is directly linked to the placement accuracy of the component P. However, high-precision recognition processing, which has higher recognition accuracy than standard recognition processing, has a larger tactile loss than standard recognition processing, so it is not realistic to perform all recognition processing using high-precision recognition processing. Therefore, a determination is made as to whether the production type of board B requires high placement accuracy, and if it is determined that it does, at least one type of high-precision recognition processing is performed, thereby minimizing tactile loss and achieving high placement accuracy.

[0057] It is preferable that the device further includes a plurality of substrate recognition cameras 51A, 51B for recognizing a plurality of FID marks 52, and that the controller 46 performs at least one of the following three types of high-precision recognition processing. 1. Recognize the plurality of FID marks 52 using only one of the plurality of substrate recognition cameras 51A and 51B. 2. The FID mark 52 is recognized within a predetermined area at the center of the field of view of the substrate recognition cameras 51A and 51B. 3. When three or more FID marks 52 are set on one substrate B, the three or more FID marks 52 are recognized.

[0058] According to the high-precision recognition process of 1, by performing the recognition process using only one of the board recognition cameras, it is possible to eliminate the effect on mounting accuracy of changes in the distance between multiple board recognition cameras caused by thermal expansion and contraction of the support member that supports the board recognition cameras, thereby improving mounting accuracy. According to the high-precision recognition process of 2, the deterioration of recognition accuracy caused by the aberration of the lens that constitutes the board recognition camera is reduced, so that the position of the FID mark 52 can be obtained with high precision, and the misalignment of the component P when it is mounted can be reduced. 3. According to the high-precision recognition process, the error between the XY coordinate system of the mounting machine 13 and the substrate coordinate system can be corrected more easily than when only two FID marks 52 are set on one substrate B, thereby reducing the misalignment of the component P caused by the error in the coordinate system.

[0059] The controller 46 preferably includes a recognition processing determination unit 48 that determines whether high-precision recognition processing is required, and if the recognition processing determination unit 48 determines that high-precision recognition processing is required, it automatically switches from standard recognition processing to high-precision recognition processing. Since the recognition process determination unit 48 determines whether high-precision recognition process is necessary, the mounting machine 13 can automatically switch from standard recognition process to high-precision recognition process without relying on an operator.

[0060] It is preferable that the recognition processing determination unit 48 determines that high-precision recognition processing is necessary when the component P to be mounted on the board B is a component P that requires high mounting precision. The standard recognition process can be switched to the high-precision recognition process when the part P requires high mounting precision.

[0061] The controller 46 preferably includes a board data storage means 49 for storing board data including at least component information and mounting information, and calculates an adjacent distance D, which is the distance between a pair of adjacent components, from the mounting position and size of the component P based on the board data. The recognition processing judgment unit 48 preferably judges that high-precision recognition processing is required when the smallest adjacent distance D is equal to or less than a certain distance. The adjacent distance D is calculated by referencing the board data, and the system can switch from standard recognition processing to high-precision recognition processing when the minimum adjacent distance D is equal to or less than a certain distance.

[0062] When the inspection machine 19 located downstream of the second mounting machine 13B detects that the amount of mounting deviation of the component P mounted by the second mounting machine 13B is equal to or greater than a certain amount of mounting deviation, the recognition processing judgment unit 48 judges that high-precision recognition processing is necessary, and it is preferable that the controller 46 automatically switches the recognition processing by the second mounting machine 13B from standard recognition processing to high-precision recognition processing after it is determined that high-precision recognition processing is necessary. When the amount of misplacement of the component P reaches a certain level or more, the standard recognition process can be switched to the high-precision recognition process.

[0063] The controller 46 is provided with a substrate data storage means 49 for storing substrate data including at least substrate information, and for production types that require high mounting accuracy, it is preferable that a high precision mode be set in the substrate information, which instructs that recognition processing be performed using high precision recognition processing. The standard recognition process can be switched to high-precision recognition process when the high-precision mode is set in the board information of the board data.

[0064] The controller 46 is provided with a substrate data storage means 49 for storing substrate data including at least mark information, and for production types that require high mounting accuracy, it is preferable that a high precision mode be set in the mark information, which instructs that recognition processing be performed using high precision recognition processing. The activation condition is that high-precision mode is set in the mark information of the board data, and the system can switch from standard recognition processing to high-precision recognition processing. For example, if part of board B contains a second block B2 and a third block B3 that require high-precision mounting, you can set recognition marks 2 and 3 specifically for those blocks B2 and B3, and perform high-precision recognition processing only for those recognition marks 2 and 3, while performing standard recognition processing for the other recognition marks 1, thereby minimizing tactile loss.

[0065] [Other embodiments] (1) In the above embodiment, the mounting machine 13 is provided with the recognition processing judgment unit 48, but the server may be provided with the recognition processing judgment unit, or the inspection machine may be provided with the recognition processing judgment unit.

[0066] (2) In the above embodiment, it is determined that high-precision recognition processing is necessary when the adjacent distance D between a pair of adjacent components P is equal to or less than a certain distance. However, it may also be determined that high-precision recognition processing is necessary when the distance between the narrowest parts of a pair of adjacent lands is equal to or less than a certain distance. Also, it may be determined that high-precision recognition processing is necessary when the solder width of the solder paste is measured in an inspection after the printing process and the solder width is equal to or less than a certain width.

[0067] (3) In the above embodiment, it is determined that high-precision recognition processing is necessary when the amount of mounting misalignment of the component P is equal to or greater than a certain amount of misalignment. However, it may also be determined that high-precision recognition processing is necessary when the rate of occurrence of mounting misalignment defects is equal to or greater than a certain threshold. After that, when the rate of occurrence of mounting misalignment defects becomes smaller than the certain threshold, it may be possible to return to standard recognition processing.

[0068] (4) In the above embodiment, three types of high-precision recognition processing are exemplified, but other processing methods may be used. For example, vibration suppression control of the board recognition cameras 51A and 51B may be performed before the FID mark 52 is recognized. [Explanation of symbols]

[0069] 11, 11A: Component mounting line 12: Printer 13: Mounting machine 13A: First mounting machine 13B: Second mounting machine 13C: Third mounting machine 14: Reflow oven 15: Inspection machine 16: Transfer conveyor 18: Server 19: Inspection machine 30: Base 31: Component supply unit 32: Head unit 33: Tape feeder 34: Head unit support member 35: Guide rail 36: X-axis motor 37: Y-axis motor 38: Head 39: Z-axis motor 40: R-axis motor 41: Suction nozzle 42: Component recognition camera 43: Lighting device 44: Side-view camera 45: Image processing unit 46: Controller 47: Arithmetic processing unit 48: Recognition processing judgment unit 49: Board data storage means 50: Transport system data storage means 51A, 51B: Board recognition camera 52: Fiducial mark (recognition mark) 53: Motor control unit 54: Display unit B: Board B1: 1st block B2: 2nd block B3: 3rd block D: Adjacent distance P: Component PB: Component mounting board

Claims

1. A mounting machine capable of switching between a standard recognition process and a high-precision recognition process having higher recognition accuracy than the standard recognition process as a recognition process for recognizing a plurality of recognition marks provided on a board, A mounting machine comprising a controller that determines whether the production type of the substrate is a production type that requires high mounting accuracy, and, if it is determined that the production type requires high mounting accuracy, controls to perform at least one type of high-precision recognition processing out of multiple types of high-precision recognition processing.

2. Further provided is a plurality of substrate recognition cameras that recognize the plurality of recognition marks, The mounting machine according to claim 1 , wherein the controller performs at least one of the following three types of high-precision recognition processing:

1. Recognizing the plurality of recognition marks using only one of the plurality of board recognition cameras.

2. The recognition mark is recognized within a predetermined area in the center of the field of view of the board recognition camera.

3. When three or more recognition marks are set on one substrate, the three or more recognition marks are recognized.

3. 3. The mounting machine according to claim 2, wherein the controller includes a recognition processing determination unit that determines whether the high-precision recognition processing is necessary, and when the recognition processing determination unit determines that the high-precision recognition processing is necessary, the controller automatically switches from the standard recognition processing to the high-precision recognition processing.

4. The mounting machine according to claim 3 , wherein the recognition process determination unit determines that the high-precision recognition process is necessary when the component to be mounted on the board is a component that requires high mounting precision.

5. the controller includes board data storage means for storing board data including at least component information and mounting information, and calculates an adjacent distance between a pair of adjacent components from component mounting positions and component sizes based on the board data; The mounting machine according to claim 3 , wherein the recognition process determination unit determines that the high-precision recognition process is necessary when the smallest adjacent distance is equal to or less than a certain distance.

6. the recognition processing determination unit determines that the high-precision recognition processing is necessary when an inspection machine located downstream of the mounting machine detects that a mounting deviation amount of a component mounted by the mounting machine is equal to or greater than a certain mounting deviation amount; The mounting machine according to claim 3 , wherein the controller automatically switches the recognition process in the mounting machine from the standard recognition process to the high-precision recognition process after it is determined that the high-precision recognition process is necessary.

7. 2. The mounting machine according to claim 1, wherein the controller includes a board data storage means for storing board data including at least board information, and for a production type requiring high mounting accuracy, a high precision mode is set in the board information to instruct the recognition process to be performed using the high precision recognition process.

8. 2. The mounting machine according to claim 1, wherein the controller includes a board data storage means for storing board data including at least mark information, and for production types requiring high mounting accuracy, a high precision mode is set in the mark information to instruct the recognition process to be performed using the high precision recognition process.

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