Method for manufacturing a SiC-based UV radiation detector device and a SiC-based UV radiation detector device

Abstract

To provide a UV-radiation detector device capable of overcoming the drawbacks of the prior art, and a method for manufacturing the same.SOLUTION: A device (50) for detecting UV radiation includes: a SiC substrate (53) having an N doping; a SiC drift layer (52) having an N doping, which extends over the substrate (53); a cathode terminal; and an anode terminal. The anode terminal includes: a doped anode region (59) having a P doping, which extends in the drift layer (52); and an ohmic-contact region (60) including one or more carbon-rich layers, in particular graphene and / or graphite layers, which extends in the doped anode region (59). The ohmic-contact region (60) is transparent to the UV radiation to be detected.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a UV radiation detector device and to a UV radiation detector device. In particular, the present invention relates to a photodetector diode having an anode terminal and / or a cathode terminal that is transparent to the UV radiation to be detected. [Background technology]

[0002] As is known, a wide band gap, especially a band gap energy value Eg higher than 1.1 eV, a low on-state resistance (R ON Semiconductor materials possessing high thermal conductivity, high operating frequencies, and high saturation velocities of charge carriers are ideal for fabricating electronic devices, such as diodes or transistors for power applications. A material that possesses these properties and is intended to be used for fabricating electronic components is silicon carbide (SiC). In particular, silicon carbide, in its different polytypes (e.g., 3C-SiC, 4H-SiC, 6H-SiC), is more advantageous than silicon as far as the aforementioned properties are concerned.

[0003] Electronic devices built on silicon carbide offer numerous advantages over similar devices built on silicon substrates, including low output on-state resistance, low leakage current, high operating temperature, and high operating frequency. In particular, the detection of ultraviolet (UV) radiation, e.g., from the sun, space objects, or artificial sources (in the medical, military, environmental, and space fields), has attracted considerable attention in the past few years. Therefore, the fabrication of highly sensitive diode arrays is of particular interest. In this context, wide-bandgap materials are excellent candidates for detecting UV radiation, and as a result, silicon carbide is particularly suitable for this purpose. Among the SiC polytypes, 4H-SiC is well-suited for detecting UV radiation due to its wide bandgap (approximately 3.3 eV).

[0004] Known types of Schottky or PN photodiodes for UV radiation detection are fabricated on 4H—SiC epitaxial layers grown on highly doped substrates. A Schottky contact is provided on the front of the photodiode by forming a metal region that provides the Schottky contact, while an ohmic contact is provided on the back of the photodiode by, for example, forming a nickel layer followed by rapid thermal annealing (at about 950-1000°C). The Schottky contact on the front is obtained by lithographically defining a titanium or nickel silicide structure, typically in the shape of an interdigitated tooth. The geometry of the Schottky contact (front electrode) on the front is selected to allow direct exposure to the radiation to be detected and vertical conduction electrical operation of the Schottky photodiode thus fabricated.

[0005] The area of ​​a single diode that is directly exposed to UV radiation and is electro-optically active is limited by the presence of the front Schottky contact, which reflects and / or absorbs UV radiation and thus reduces the useful area that is effectively exposed.

[0006] FIG. 1 shows a cross-sectional side view of a vertical conduction Schottky diode 1 of known type in a (three-axis) Cartesian reference system consisting of axes X, Y and Z.

[0007] The Schottky diode 1 has a surface 3a opposite to the surface 3b and is highly doped with N-type (e.g., 1×10 20 atoms / cm 3 ) a SiC substrate 3 having an N-type dopant concentration lower than that of the substrate 3 and epitaxially grown on the surface 3 a of the substrate 3; an SiC drift layer 2 having an N-type dopant concentration lower than that of the substrate 3 and epitaxially grown on the surface 3 a of the substrate 3; ohmic contact regions 6 (e.g., made of nickel silicide) extending on the surface 3 b of the substrate 3; a cathode metallization 16 extending on the ohmic contact regions 6; and an anode metallization 8 extending on the upper surface 2 a of the drift layer 2.

[0008] Consequently, a Schottky contact or junction (of the semiconductor-metal type) is formed at the interface between the drift layer 2 and the anode metallization 8. In particular, a Schottky junction is formed by each portion of the drift layer 2 being in direct electrical contact with a respective portion of the anode metallization 8.

[0009] As mentioned above, a drawback of this device is the reduction of the active area, that is the area that contributes to the generation of charge carriers following interaction with the UV radiation to be detected. Indeed, the part of the surface 2a that is covered by the anode metallization 8 does not contribute to the detection of UV radiation and the subsequent generation of charge carriers due to absorption and / or reflection of the UV radiation to be detected itself by the anode metallization 8. [Prior art documents] [Non-patent literature]

[0010] [Non-Patent Document 1] Maxime G. Lemaitre, "Low-temperature, site selective graphitization of SiC via ion implantation and pulsed laser annealing," Applied Physics Letters 100, 193105 (2012) Summary of the Invention [Problem to be solved by the invention]

[0011] SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a UV radiation detector device and a UV radiation detector device that can overcome the drawbacks of the prior art. [Means for solving the problem]

[0012] According to the present invention there is provided a method for manufacturing a UV radiation detector device and a UV radiation detector device as defined in the claims.

[0013] For a better understanding of the invention, preferred embodiments thereof will now be described, purely by way of non-limiting example, with reference to the accompanying drawings, in which: [Brief explanation of the drawings]

[0014] [Figure 1] 1 is a cross-sectional view of a Schottky photodiode according to a known embodiment; [Figure 2] 1 is a schematic cross-sectional view of a UV radiation detector apparatus according to one embodiment of the present invention. [Figure 3] 3A-3C are schematic cross-sectional views of the device of FIG. 2 at various steps in the process of fabricating the device according to one embodiment of the present invention. [Figure 4] 3A-3C are schematic cross-sectional views of the device of FIG. 2 at various steps in the process of fabricating the device according to one embodiment of the present invention. [Figure 5] 3A-3C are schematic cross-sectional views of the device of FIG. 2 at various steps in the process of fabricating the device according to one embodiment of the present invention. [Figure 6] FIG. 1 is a graph showing measured transmittance of devices made in accordance with the present invention. [Figure 7] 3 is a schematic cross-sectional view of a UV radiation detector device according to a further embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0015] 2 shows a cross-sectional side view of an apparatus 50, specifically a PN diode, for detecting ultraviolet (UV) radiation in accordance with one aspect of the present invention, in a (three-axis) Cartesian coordinate system with axes X, Y, and Z. In this context, apparatus 50 is configured to detect radiation having wavelengths in the range of 200 nm to 380 nm.

[0016] The device 50 comprises a substrate 53 made of N-type SiC having a thickness between 50 μm and 350 μm, e.g., equal to 180 μm, with a surface 53 a opposite a surface 53 b, and a first dopant concentration; a (e.g., epitaxially grown) drift layer 52 made of N-type SiC having a thickness between 5 μm and 100 μm, e.g., a second dopant concentration lower than the first dopant concentration, extending on the surface 53 a of the substrate 53; and a (e.g., epitaxially grown) drift layer 52 made of N-type SiC having a thickness between 5 μm and 100 μm, e.g., a second dopant concentration lower than the first dopant concentration, extending on the surface 53 b of the substrate 53. a cathode metallization 57, for example of Ti / NiV / Ag or Ti / NiV / Au, extending over the ohmic contact region 56; a P-type injector anode region 59 facing the upper surface 52 a of the drift layer 52 and extending within the drift layer 52; and an ohmic contact layer 60 extending within the injector anode region 59 and facing the upper surface 52 a of the drift layer 52.

[0017] The doping level of the substrate 53 is, for example, 1×10 19 and 1×10 22 atoms / cm 3 and the doping level of the drift layer 52 is, for example, between 1×10 13 and 5×10 16 atoms / cm 3 and the doping level of the injection anode region 59 is between, for example, 1×10 18 atoms / cm 3 That's all.

[0018] According to one aspect of the present invention, the ohmic contact layer 60 includes one or more carbon-rich layers, such as a graphite layer or graphene multilayers. More specifically, the ohmic contact layer 60 includes a Si / C amorphous layer on the surface 52a, in which carbon atoms predominate (e.g., at least twice as much, particularly 2 to 100 times as much) compared to silicon atoms due to phase separation between silicon and carbon atoms in the SiC substrate. Beneath this amorphous layer, the ohmic contact layer 60 can provide a layer containing carbon clusters (e.g., a graphite layer) having a thickness greater than that of the amorphous layer. The formation of this ohmic contact layer 60 results from the thermal decomposition of silicon carbide as a result of the manufacturing process described below.

[0019] In accordance with a further aspect of the present invention, ohmic contact layer 60 is self-aligned with implanted region 59 on surface 52a (i.e., in plan view in the XY plane, ohmic contact layer 60 has the same shape and extent as implanted region 59).

[0020] Furthermore, in accordance with a further aspect of the present invention, ohmic contact layer 60 does not extend along the Z axis beyond surface 52 a; i.e., ohmic contact layer 60 has an upper surface 60 a that is coplanar with surface 52 a (i.e., aligned along the X axis) and extends (along the Z axis) within implanted region 59 to a depth of between 1 nm and tens of nm (e.g., between 1 nm and 20 nm) measured from surface 52 a.

[0021] The planar shape, or "layout," of implant region 59 (and thus ohmic contact layer 60) in the XY plane can be selected as desired during the design stage. In particular, implant region 59 can extend continuously (in plan view in the XY plane) across the entire active area of ​​device 50, or across only a portion of the active area of ​​device 50, or can be formed by multiple implant subregions separated from one another by portions of drift layer 52.

[0022] The inventors have found that ohmic contact layers 60 of the type described above are transparent, i.e., transmissive, to UV radiation, particularly radiation in the range of 200 nm to 380 nm. Therefore, when used, even if ohmic contact layer 60 covers the entire active area of ​​device 50, UV radiation to be detected will traverse ohmic contact layer 60 and reach drift layer 52, generating charge carriers in a manner known per se. By appropriately polarizing device 50 between its anode and cathode (e.g., by means of bonding wires), the current induced by the UV radiation can be collected and measured in a manner known per se, which does not form part of the present invention.

[0023] Some steps for forming device 50 are described below, but only those relating to the formation of ohmic contact layer 60 (the remaining steps are performed according to conventional techniques).

[0024] Referring to FIG. 3, a wafer 100 is provided that includes a substrate 53 made of SiC (specifically, 4H—SiC, although other polytypes such as, but not limited to, 2H—SiC, 3C—SiC, and 6H—SiC may also be used).

[0025] As previously mentioned, the substrate 53 has a first conductivity type (in this example, N-type doping) and has a front surface 53a and a back surface 53b opposite each other along the axis Z. The substrate 53 has a thickness of 1×10 19 and 1×10 22 atoms / cm 3 The dopant concentration is between 0.01 and 0.1.

[0026] The front of wafer 100 corresponds to front surface 53a, and the back of wafer 100 corresponds to back surface 53b. The resistivity of substrate 30 is, for example, between 2 mΩ·cm and 40 mΩ·cm.

[0027] On the front surface 53a of the substrate 53, a drift layer 52 of silicon carbide is formed, for example by epitaxial growth, which has a first conductivity type (N) and a dopant concentration lower than that of the substrate 53, for example 1×10 13 and 5×10 16 atoms / cm 3 The drift layer 52 is made of SiC, particularly 4H—SiC, although other SiC polytypes such as 2H, 6H, 3C, or 15R may also be used.

[0028] Drift layer 52 has a thickness defined between a top side 52a and a bottom side 52b (the latter in direct contact with front surface 53a of substrate 53).

[0029] Next (FIG. 4), an implantation of a dopant species (e.g., boron or aluminum) having a second conductivity type (in this case, P conductivity type) is performed. The implantation (represented in the figure by arrow 72) can be performed with or without an implantation mask, depending on the design requirements, as previously described. In the absence of an implantation mask, the implanted region extends across the entire XY plane of the Cartesian coordinate system of the drift layer 52 and along the Z axis, as shown in the figure, to a depth that depends on the implantation energy. In the presence of an implantation mask, one or more implanted regions extend where the implantation mask is transparent or transmissive to the implantation.

[0030] In the example given by way of example, the implantation step of FIG. 12 atoms / cm 2 and 1×10 15 atoms / cm 2 The method includes implanting one or more dopant species having a second dopant type at an implantation energy between 30 keV and 500 keV at a dose between 1×10 and 1×10. A subsequent thermal anneal allows activation of the dopants so implanted and provides a 1×10 18 atoms / cm 3 3. The implanted anode region 59 is formed having a dopant concentration higher than that of the surface 52a and having a depth measured starting from the surface 52a of between 0.3 μm and 1 μm.

[0031] Next (FIG. 5), a thermal history designed to favor the generation of one or more carbon-rich layers (e.g., graphene and / or graphite layers) as described above within implanted region 59 is generated on surface 52a. To that end, a laser source 80 configured to generate a suitable beam 82 is used.

[0032] The laser 80 is, for example, a UV excimer laser. Other types of lasers can also be used, among them lasers with wavelengths in the visible light range.

[0033] The operating parameters and configuration of laser 80 that are optimized for the purposes of the present invention, i.e., that allow for the formation of an ohmic contact in injection region 59, are as follows: wavelength between 290 and 370 nm, in particular 310 nm; pulse duration between 100 ns and 300 ns, in particular 160 ns; number of pulses (scans) between 1 and 5; and energy density of 1.5 J / cm. 2 and 4 J / cm 2 Between 3J / cm 2(evaluated at the level of the surface 52a) and the temperature is between 1400 and 2600°C, in particular 1600°C (evaluated at the level of the surface 52a). The area of ​​the spot of the beam 82 at the level of the surface 52a is between 0.7 and 1.5 cm 2 Between.

[0034] One or more scans of the laser 80 are performed in the XY plane (e.g., multiple scans parallel to each other and parallel to the X and / or Y axes) to cover the entire wafer 100 or a sub-region of the wafer 100 to be heated.

[0035] Given the depth of implanted region 59, a temperature of approximately 2000° C. at the level of surface 52 a is sufficient to ensure a temperature within the above-mentioned range even at the maximum depth (e.g., 1 μm) reached by implanted region 59 to ensure activation of all dopants without the need to perform a dedicated thermal budget.

[0036] This temperature favors the formation of a carbon-rich ohmic contact compound exclusively in the implanted region 59, and not in the surface 52a free of the implanted region 59. This effect is of a known type and is described, for example, in Maxime G. Lemaitre, "Low-temperature, site selective graphitization of SiC via ion implantation and pulsed laser annealing," Applied Physics Letters 100, 193105 (2012).

[0037] In one embodiment, the conversion of a portion of implanted region 59 into ohmic contact layer 60 is achieved by heating the entire wafer 100 while moving laser 80 accordingly. At beam 82 energy densities between 1.5 and 3 J / cm, a localized surface temperature increase causes the formation of ohmic contact layer 60. This effect is not observed if implanted region 59 is not present.

[0038] In a different embodiment, the conversion of the surface portion of implanted region 59 into ohmic contact layer 60 is achieved by processing only a portion of wafer 100, which may not correspond to the entire extent of implanted region 59 (e.g., excluding portions that are not of interest during use of device 50 as a UV detector, as long as those portions do not participate in charge generation and transport).

[0039] In a further embodiment, a mask can be placed over surface 52a (in contact with or at a distance from surface 52a) that has one or more regions transparent to beam 82 (i.e., regions through which beam 82 traverses them) and a plurality of regions opaque to beam 82 (i.e., regions through which beam 82 does not traverse them or traverses them in an attenuated manner so as not to significantly heat portions of wafer 100 extending below them). The transparent regions of the mask, aligned with implanted region 59 (or each implanted region), allow the formation of respective ohmic contact layers 60. Regions of drift layer 52 without P implantation are covered and protected by the mask. In this case, the energy density of beam 82 is 4.5 J / cm. 2 In fact, to create ohmic contacts in doped regions during epitaxial growth, the energy density of the laser beam needs to be much higher than that needed to create ohmic contacts in doped regions via an ion implantation process (specifically, about 3 J / cm 2 ). 2 even higher).

[0040] In this embodiment, because there is a mask that exposes only implanted regions 59, a dose of 3 J / cm 2 can be achieved without the risk of forming ohmic contacts on the N-type regions of drift layer 52. 2 It is possible to use much higher energy densities than

[0041] The thermal annealing step for activating the dopants in implanted region 59 may, in one embodiment, coincide with the step of forming ohmic contact layer 60, so long as the temperature reached by laser beam 82 is sufficient to activate the dopants. Alternatively, a conventional thermal anneal can be performed in either case before forming ohmic contact layer 60.

[0042] The conversion of P-type SiC to ohmic contacts occurs at temperatures between 1200° C. and 2600° C., more particularly at temperatures higher than 1600° C. These temperatures are reached in the surface portion of implanted region 59 (a few nanometers, e.g., 1-20 nm).

[0043] For greater depths, the temperature drops to a value that no longer causes the conversion of silicon carbide to a carbon-rich layer (graphene and / or graphite layer). Thus, the formation of the ohmic contact is self-limiting. As a result, the ohmic contact layer 60 does not extend through the entire thickness of each implanted region, but only at its surface level.

[0044] The inventors have determined that the laser configuration and operating parameters described above provide the desired electrical and optical behavior for device 50. In this regard, Figure 6 illustrates experimental data of transmittance after forming ohmic contact layer 60 and exposing device 50 to UV radiation at various wavelengths, the behavior of which is as predicted and comparable to that of conventional UV detectors.

[0045] Figure 7 illustrates a detector apparatus 150 in accordance with a further aspect of the present invention. Elements of apparatus 150 that are common to apparatus 50 of Figure 2 are given the same reference numerals and will not be described again.

[0046] Unlike device 50, device 150 does not have a nickel silicide ohmic contact layer 56 and cathode metallization 57. Instead, device 150 has an ohmic contact layer 156 extending over surface 53b of substrate 53. This ohmic contact layer 156 is similar to ohmic contact layer 60 (in particular, it may have one or more carbon-rich layers, such as graphite layers or graphene multilayers) and is transparent to the UV radiation to be detected (e.g., having a wavelength in the range of 200 nm to 380 nm).

[0047] Formation of ohmic contact layer 156 involves laser processing (similar to that described above for formation of ohmic contact layer 60).

[0048] Optimizing the ohmic properties of the contact 156 at the back of the substrate 53 (which has N doping) requires a different energy density of the beam 82 than the energy required for optimizing the ohmic properties of the layer 60 in the implanted region (which has P doping). Indeed, as previously mentioned, to generate an ohmic contact on a substrate with N doping, the energy density of the laser beam is required to be greater than that required to generate an ohmic contact in the doped region P via an implantation process. To that end, each beam is configured to generate a respective layer with ohmic properties, and the operating parameters of the laser 80 can be adjusted to generate beams with different properties based on the ohmic contact layer 60 or 156 that it is desired to form.

[0049] Therefore, it is possible to use a laser 80 having the following configuration and operating parameters to form an ohmic contact 156 on the back side 53b of the substrate 53: wavelength between 290 and 370 nm, in particular 310 nm; pulse duration between 100 ns and 300 ns, in particular 160 ns; number of pulses (scans) between 1 and 5; and energy density between 3 and 4.5 J / cm. 2 Especially between 3.2J / cm 2 and 4.5 J / cm 2 and temperatures between 1400° C. and 2600° C., in particular above 1800° C. (assessed at the level of the surface 53b).

[0050] In this way, a UV detector is obtained that can receive UV radiation from both sides (front and back).

[0051] By examining the characteristics of the invention provided in accordance with this disclosure, the advantages it offers are clear: in particular, the detector response is maximized due to the possibility of using all of the available surface by optical detection, regardless of whether electrical contacts are present (which, according to the invention, as previously mentioned, are transparent to the UV radiation to be detected); furthermore, the manufacturing process flow is simplified compared to the prior art.

[0052] Furthermore, the present invention makes it possible to provide a UV detector configured to detect radiation incident on both surfaces (front and back), which can be used, for example, to manufacture windows, eyeglasses, etc. in space stations and / or buildings.

[0053] Additionally, the present invention provides the ability to modulate the shape and size of the area that senses UV radiation by directing the laser beam as needed, i.e., without the use of photomask techniques.

[0054] Although specific embodiments of the present invention have been described in detail above, the present invention should not be limited to any of these specific examples, and it goes without saying that various modifications are possible without departing from the technical scope of the present invention.

Claims

1. A method of manufacturing a detector device (50, 150) for detecting UV radiation, comprising: providing a SiC substrate (53) having opposite front and back sides (53a, 53b), the SiC substrate (53) having a first conductivity type (N) and a first concentration of a dopant species; forming a drift layer (52) made of SiC on the front side (53a) of the substrate (53) having a first conductivity type (N) and a second concentration of a dopant species that is lower than the first concentration; forming a cathode terminal of the detector device (50) on the back side of the substrate (53); and forming an anode terminal of the detector device (50, 150) in the drift layer (52); The method includes the steps of forming the anode terminal, implanting dopant species having a second conductivity type (P) opposite to the first conductivity type (N) into the drift layer (52) to form a doped anode region (59); and generating a first laser beam (82) toward the doped anode region (59) to heat the doped anode region (59) to a temperature between 1500°C and 2600°C to form a first ohmic contact region (60) in the doped anode region (59), the first ohmic contact region (60) comprising one or more carbon-rich layers and transparent to UV radiation; The method according to claim 1, further comprising:

2. 2. The method of claim 1, wherein the doped anode region (59) begins at an upper surface (52 a) of the drift layer (52) and extends a depth into the drift layer (52), and the first ohmic contact region (60) has an upper surface thereof coincident with the upper surface (52 a) of the drift layer (52).

3. 3. The method of claim 1, wherein heating the doped anode region (59) with the first laser beam (82) causes activation of dopant species having the second conductivity type (P) in the doped anode region (59).

4. The first laser beam (82) has the following parameters: Wavelength: between 290 nm and 370 nm, Pulse duration: between 100 and 300 ns, Energy density: 1.5 and 4.5 J / cm ２ During 4. The method of claim 1, wherein the signal is generated based on:

5. 5. The method of claim 1, wherein forming the first ohmic contact region (60) comprises forming the one or more carbon-rich layers exclusively within the doped anode region (59).

6. 6. The method of any one of claims 1 to 5, wherein the first ohmic contact region (60) extends into the doped anode region (59) to a depth of between 1 nm and 20 nm.

7. 7. The method of claim 1, wherein the step of forming the cathode termination comprises generating a second laser beam toward the back side (53b) of the substrate (53) to heat the substrate (53) to a temperature between 1500°C and 2600°C to form a second ohmic contact region (156) on the back side (53b) of the substrate (53), the second ohmic contact region (156) including one or more carbon-rich layers.

8. the second laser beam having the following parameters: Wavelength: between 290 nm and 370 nm, Pulse duration: between 100 and 300 ns, Energy density: 3 and 4.5 J / cm ２ During The method of claim 7, wherein the signal is generated based on

9. A detector device (50, 150) for detecting UV radiation, comprising: a SiC substrate (53) having opposite front and back sides (53a, 53b), the SiC substrate (53) having a first conductivity type (N) and a first concentration of a dopant species; a SiC drift layer (52) extending over the front side (53 a) of the substrate (52) and having a dopant species of the first conductivity type (N) and a second concentration lower than the first concentration; a cathode terminal on the back side of the substrate (53); and an anode terminal in the drift layer (52); and the anode terminal has a doped anode region (59) in the drift layer (52) containing a dopant species having a second conductivity type (P) opposite to the first conductivity type (N); a first ohmic contact region (60) extending within the doped anode region (59), the first ohmic contact region (60) including one or more carbon-rich layers and transparent to UV radiation; A device having:

10. the doped anode region (59) originating from an upper surface (52a) of the drift layer (52) and extending to a depth within the drift layer (52); and The device of claim 9, wherein the first ohmic contact region (60) has an upper surface thereof coincident with the upper surface (52a) of the drift layer (52).

11. 11. The device of claim 9 or 10, wherein the first ohmic contact region (60) comprises the one or more carbon-rich layers exclusively within the doped anode region (59).

12. 12. The device of any one of claims 9 to 11, wherein the first ohmic contact region (60) extends into the doped anode region (59) to a depth of between 1 nm and 20 nm.

13. An apparatus according to any one of claims 9 to 11, wherein the substrate (53) is made of 4H-SiC.

14. 12. The device of any one of claims 9 to 11, wherein the cathode termination has a second ohmic contact region (156) comprising one or more carbon-rich layers.

15. 15. The device of claim 14, wherein the second ohmic contact region (156) has its surface coinciding with the back side (53b) of the substrate (53).

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