Laminating system, film laminating and cutting device, laminating method, and method for manufacturing laminated product

Abstract

To provide a lamination system capable of improving the yield of laminated products formed through lamination processing. [Solution] A laminating system according to one embodiment includes a film laminating / cutting device 1 that laminates film F unwound from a roll onto a workpiece W and cuts the film F at a position where it does not overlap with the workpiece W, and a laminator 4 that receives the workpiece W delivered from the film laminating / cutting device 1 and pressurizes and bonds the film F laminated to the workpiece W to the workpiece W. The film laminating / cutting device 1 includes a cooling section 2S that cools the workpiece W or the film F with air before cutting the film F. The laminating system may also include a cooling device 6 that supplies air to the film F on the workpiece W delivered from the laminator 4 to cool the film F, and a film peeling device that peels off a portion of a layer from the film F on the workpiece W.

Description

[Technical Field]

[0001] The present invention relates to a laminating system and a film laminating and cutting device for laminating, for example, a wiring board with an insulating resin film, and also to a laminating method and a method for manufacturing a laminated product. [Background technology]

[0002] BACKGROUND ART Lamination systems equipped with vacuum laminators have been known for some time (see, for example, Patent Document 1).

[0003] For example, in a lamination system equipped with a vacuum laminator, a film unwound from a roll is first temporarily attached to a workpiece such as a wiring board. Next, the film extending between the roll and the workpiece is cut, and the temporarily attached film is separated from the roll. After that, the workpiece with the film attached is transported to a vacuum chamber equipped in the vacuum laminator.

[0004] The interior of the vacuum chamber is controlled to a vacuum state after the workpiece is transported, and then a pressure difference is created, and the film is pressed against the workpiece while being heated by a pressure means such as a diaphragm.The pressure means is then separated from the film.In such a lamination process, a film having a bonding layer that is bonded to the workpiece and a support layer that supports the bonding layer may be used.In this case, after the pressure means is separated from the film, a process of peeling the support layer from the film is usually performed.

[0005] A vacuum laminator removes air from between the workpiece and film before laminating. This prevents air bubbles from getting trapped between the workpiece and film. Reducing air bubbles can prevent air bubbles from adversely affecting subsequent processes. Furthermore, the finished laminate formed through the lamination process has a better finish, improving yield. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] International Publication No. 2016 / 199687 Summary of the Invention [Problem to be solved by the invention]

[0007] In the processing of the above-mentioned laminating system, depending on the condition of the film or the workpiece, the film may not be cut properly, or one layer of a two-layer film may not be peeled properly.

[0008] For example, when a film is temporarily attached to a workpiece and then cut, depending on the ambient temperature and the temperature of the workpiece, part of the film may melt or the entire film may soften, causing the cut surface of the film to become rough and causing wrinkles or stretching.

[0009] Furthermore, after vacuum lamination, the film and workpiece become hot, which can reduce the adhesiveness between the layers of a two-layer film. If peeling is performed in this state, part of the workpiece layer may adhere to the peeled layer and be peeled off, resulting in a rough surface for the workpiece layer. If the workpiece is a wiring board and the laminated layer is an insulating layer, a rough surface for the insulating layer may increase the risk of short circuits. Furthermore, if the wiring board is incorporated into a multilayer board, the multilayer board may become defective.

[0010] Furthermore, after vacuum lamination, the film and workpiece become hot and expand. In this case, warping may occur due to the difference in the linear expansion coefficient between the film and the workpiece. If such warping occurs, the yield will decrease.

[0011] An object of the present invention is to provide a laminating system, a film laminating and cutting device, a laminating method, and a method for manufacturing a laminated product that can improve the yield rate of laminated products formed through a laminating process. [Means for solving the problem]

[0012] A lamination system according to one embodiment of the present invention comprises: a film laminating and cutting device that laminates a film unwound from a roll onto a workpiece and cuts the film at a position that does not overlap the workpiece; A laminator that receives the work sent out from the film laminating and cutting device and pressurizes the film laminated to the work to bond it to the work, A cooling device is provided that cools the workpiece or the film with air before the film is cut by the film laminating and cutting device, The cooling device is a lamination system that supplies air to the workpiece before it reaches the lamination position of the film in the film laminating and cutting device to cool the workpiece, or supplies air to the film before it is laminated to the workpiece to cool the film. A film bonding and cutting device according to one embodiment of the present invention is A film laminating and cutting device that laminates a film unwound from a roll onto a workpiece and cuts the film at a position that does not overlap the workpiece, A cooling unit is provided that cools the workpiece or the film with air before cutting the film, The cooling section is a film laminating and cutting device that supplies air to the workpiece before it reaches the laminating position of the film to cool the workpiece, or supplies air to the film before it is laminated to the workpiece to cool the film. A lamination method according to one embodiment of the present invention includes: a film laminating and cutting process of laminating a film unwound from a roll onto a workpiece and cutting the film at a position where the film does not overlap with the workpiece; A lamination process of receiving the work sent out after the film laminating and cutting process, and pressing the film laminated to the work to bond it to the work, A cooling step of cooling the workpiece or the film with air before cutting the film in the film laminating and cutting step is provided, In the cooling process, air is supplied to the work before it reaches the lamination position of the film in the film laminating and cutting process to cool the work, or air is supplied to the film before it is laminated to the work to cool the film. A method for manufacturing a laminate according to one embodiment of the present invention includes: a film laminating and cutting process of laminating a film unwound from a roll onto a workpiece and cutting the film at a position where the film does not overlap with the workpiece; A lamination process of receiving the work sent out after the film laminating and cutting process, and pressing the film laminated to the work to bond it to the work, A cooling step of cooling the workpiece or the film with air before cutting the film in the film laminating and cutting step is provided, In the cooling process, air is supplied to the work before it reaches the lamination position in the film laminating and cutting process to cool the work, or air is supplied to the film before it is laminated to the work to cool the film, which is a method for manufacturing a laminated product. A laminating system according to one embodiment of the present invention includes a film laminating / cutting device that laminates a film unwound from a roll onto a workpiece and cuts the film at a position where the film does not overlap with the workpiece, and a laminator that receives the workpiece delivered from the film laminating / cutting device and pressurizes and bonds the film laminated to the workpiece to the workpiece, A cooling device is provided that cools the workpiece or the film with air before the film is cut by the film laminating and cutting device. The cooling device may supply air to the workpiece before it reaches the lamination position of the film in the film laminating and cutting device to cool the workpiece, or may supply air to the film before it is laminated to the workpiece to cool the film, or may supply air to the film on the workpiece between the lamination position of the film and the cutting position of the film in the film laminating and cutting device to cool the film.

[0013] A lamination system according to one embodiment of the present invention comprises: a vacuum laminator that receives a workpiece in a vacuum chamber, the workpiece being a laminate of a film having a support layer and a bonding layer, with the bonding layer in direct contact with the workpiece, and puts the vacuum chamber into a vacuum state, and bonds the film to the workpiece by applying pressure to the film while heating it; a cooling device that supplies air to the film on the workpiece fed from the vacuum laminator to cool the film; a film peeling device that peels the support layer from the film on the workpiece sent out from the cooling device, The cooling device changes the amount of air supplied depending on the transport pattern of the workpiece and / or the state of the film on the workpiece.

[0014] A cooling device for a substrate lamination system according to one embodiment of the present invention includes: An inlet for the work before the film is superposed or after the film is superposed, and an outlet for the work, Between the inlet and the outlet, air is supplied to the work before the film is superimposed or the film on the work after the film is superimposed to cool it; The amount of air supplied is changed depending on at least one of the transport pattern of the workpiece, the state of the workpiece, and the state of the film on the workpiece.

[0015] A film bonding and cutting device according to one embodiment of the present invention is A film laminating and cutting device that laminates a film unwound from a roll onto a workpiece and cuts the film at a position that does not overlap the workpiece, A cooling section is provided that cools the workpiece or the film with air before cutting the film. The cooling section may supply air to the workpiece before it reaches the lamination position of the film to cool the workpiece, or may supply air to the film before it is laminated to the workpiece to cool the film, or may supply air to the film on the workpiece between the lamination position of the film and the cutting position of the film to cool the film.

[0016] A film peeling device according to one embodiment of the present invention comprises: A film peeling device for peeling off a support layer from a film on a workpiece in a state where a film having a support layer and a bonding layer is bonded to the workpiece and the bonding layer is directly bonded to the workpiece, a cooling unit that supplies air to the film on the workpiece to cool the film before the support layer is peeled off; The cooling section changes the amount of air supplied depending on the transport pattern of the workpiece and / or the state of the film on the workpiece.

[0017] A laminating method according to one embodiment of the present invention includes a film laminating and cutting process of laminating a film unwound from a roll onto a workpiece and cutting the film at a position where the film does not overlap with the workpiece, and a laminating process of receiving the workpiece sent out after the film laminating and cutting process and pressing the film laminated to the workpiece to bond the film to the workpiece, The film laminating and cutting step includes a cooling step of cooling the workpiece or the film with air before cutting the film. In the cooling process, air may be supplied to the workpiece before it reaches the lamination position of the film in the film laminating and cutting process to cool the workpiece, or air may be supplied to the film before it is laminated to the workpiece to cool the film, or air may be supplied to the film on the workpiece between the lamination position of the film and the cutting position of the film in the film laminating and cutting process to cool the film. Further, a method for manufacturing a laminate according to an embodiment of the present invention includes: a film laminating and cutting process of laminating a film unwound from a roll onto a workpiece and cutting the film at a position where the film does not overlap with the workpiece; A lamination process of receiving the work sent out after the film laminating and cutting process, and pressing the film laminated to the work to bond it to the work, The film laminating and cutting step includes a cooling step of cooling the workpiece or the film with air before cutting the film.

[0018] A lamination method according to one embodiment of the present invention includes: a vacuum lamination process in which a workpiece having a film having a support layer and a bonding layer bonded thereto, with the bonding layer being in direct contact with the workpiece, is received in a vacuum chamber, the vacuum chamber is evacuated, and the film is heated and pressed against the workpiece to bond the film; a cooling step of supplying air to the film on the workpiece delivered after the vacuum lamination to cool the film; a film peeling step of peeling the support layer from the film on the workpiece fed after the cooling step, In the cooling step, the amount of air supplied is changed depending on the transport pattern of the workpiece and / or the state of the film on the workpiece. Further, a method for manufacturing a laminate according to an embodiment of the present invention includes: a vacuum lamination process in which a workpiece having a film having a support layer and a bonding layer bonded thereto, with the bonding layer being in direct contact with the workpiece, is received in a vacuum chamber, the vacuum chamber is evacuated, and the film is heated and pressed against the workpiece to bond the film; a cooling step of supplying air to the film on the workpiece delivered after the vacuum lamination to cool the film; a film peeling step of peeling the support layer from the film on the workpiece fed after the cooling step, In the cooling step, the amount of air supplied is changed depending on the transport pattern of the workpiece and / or the state of the film on the workpiece. [Effects of the Invention]

[0019] According to the present invention, the yield of non-defective laminate products can be improved. [Brief explanation of the drawings]

[0020] [Figure 1] 1 is a diagram schematically illustrating a substrate laminating system according to a first embodiment. [Figure 2] 1 is a schematic enlarged view of a film laminating and cutting device provided in a substrate laminating system according to a first embodiment. FIG. [Figure 3] 4 is a diagram showing a graph illustrating the relationship between the workpiece transport pattern and the airflow patterns of the cooling section in the film laminating and cutting device and the downstream cooling device in the substrate laminating system according to the first embodiment. FIG. [Figure 4] FIG. 10 is a diagram schematically illustrating a substrate laminating system according to a second embodiment. [Figure 5] FIG. 10 is a diagram schematically illustrating a substrate laminating system according to a third embodiment. [Figure 6] FIG. 10 is a diagram schematically illustrating a substrate laminating system according to a fourth embodiment. [Figure 7] FIG. 10 is a diagram schematically illustrating a substrate laminating system according to a fifth embodiment. [Figure 8] FIG. 13 is a diagram schematically showing a semiconductor manufacturing system including a film bonding and cutting device according to a sixth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0021] Each embodiment will be described in detail below with reference to the accompanying drawings.

[0022] First Embodiment Fig. 1 shows a schematic diagram of a substrate laminating system S1 as a laminating system according to a first embodiment. The substrate laminating system S1 shown in Fig. 1 includes a film laminating and cutting device 1, a conveying sheet feeding device 3, a vacuum laminator 4, a flat press device 5, a downstream cooling device 6, and a conveying sheet winding device 7.

[0023] The substrate lamination system S1 is a system that continuously laminates sequentially conveyed workpieces W. The workpieces W pass through a film laminating and cutting device 1, a conveying sheet feeding device 3, a vacuum laminator 4, a flat press device 5, a downstream cooling device 6, and a conveying sheet winding device 7 in this order.

[0024] The workpiece W is transported by a conveyor C, which is simply shown, from the film laminating and cutting device 1 to the entrance of the conveying sheet feeding device 3. Thereafter, the workpiece W is transported by a conveying sheet TS, which extends from the conveying sheet feeding device 3 to the conveying sheet winding device 7.

[0025] The workpiece W is, for example, a printed circuit board, and insulating layers are laminated on both sides as bonding layers. The printed circuit board may be either a flexible type or a rigid type. The workpiece W is not particularly limited, and may be a semiconductor wafer. If the workpiece W is a semiconductor wafer, a dry resist film may be laminated on the semiconductor wafer. Also, lamination may be performed on only one side of the workpiece W.

[0026] The film laminating and cutting device 1 has a pair of film supply rolls 11 around which film F is wound, a pair of laminating members 12 that press the film F fed from each film supply roll 11 against the workpiece W to laminate it, a pair of cutters 13 that cut the film F, and an upstream cooling section 2S. In this embodiment, a conveyor C is arranged to pass through the film laminating and cutting device 1, and the film laminating and cutting device 1 is provided with a transport path 1R through which part of the conveyor C passes.

[0027] The pair of film supply rolls 11, the pair of laminating members 12, and the pair of cutters 13 are respectively arranged on one side (upper side in FIG. 1) and the other side (lower side in FIG. 1) of the conveying path 1R. The laminating member 12 on one side is arranged close to the conveying path 1R, and the film supply roll 11 on one side is arranged at a position farther from the conveying path 1R than the laminating member 12. The cutter 13 on one side is arranged so as to be able to approach and move away from a portion of the film F extending between the film supply roll 11 on one side and the laminating member 12 on one side. Similarly, the laminating member 12 on the other side is arranged close to the conveying path 1R, and the film supply roll 11 on the other side is arranged at a position farther from the conveying path 1R than the laminating member 12. The cutter 13 on the other side is arranged so as to be able to approach and move away from a portion of the film F extending between the film supply roll 11 on the other side and the laminating member 12 on the other side.

[0028] In the film laminating / cutting device 1, the workpiece W received from the outside onto the conveying path 1R is first cooled by the upstream cooling section 2S. The workpiece W is then sent from the upstream cooling section 2S toward the laminating member 12, where the laminating member 12 bonds the film F and the cutter 13 cuts the film F. In FIG. 1, the symbol Cp indicates a cooling position determined by the upstream cooling section 2S within the film laminating / cutting device 1. The upstream cooling section 2S has an entrance 2A and an exit 2B for the workpiece W, and the cooling position Cp is determined between the entrance 2A and the exit 2B. The symbol Pp indicates a laminating position (processing position) determined within the film laminating / cutting device 1 by the laminating member 12. In other words, the upstream cooling section 2S supplies air to the workpiece W before it reaches the laminating position Pp of the film F to cool the workpiece W.

[0029] The upstream cooling section 2S has a first cooling section 2U arranged on one side of the transport path 1R and a second cooling section 2D arranged on the other side of the transport path 1R. The first cooling section 2U and the second cooling section 2D each have a temperature-controlled air supply source 20, a duct 21, a fan filter unit 22, and an air discharge section 23.

[0030] The temperature-controlled air supply source 20 may be, for example, an air conditioning device having a refrigeration circuit. The duct 21 circulates the temperature-controlled air from the temperature-controlled air supply source 20. The fan filter unit 22 has a fan and a filter, and sends the air from the duct 21 through the filter by rotating the fan to the air discharge section 23 side. The filter may be a HEPA filter or a ULPA filter. The air discharge section 23 supplies the air from the fan filter unit 22 to the workpiece W on the conveying path 1R.

[0031] In this embodiment, air is supplied from the air discharge portion 23 of the first cooling section 2U to the front surface of the workpiece W, thereby cooling the workpiece W. Air is supplied from the air discharge portion 23 of the second cooling section 2D to the rear surface of the workpiece W, thereby cooling the workpiece W. The air discharge portion 23 may be configured as a punched plate having a plurality of through holes regularly arranged in a flat plate. In this case, the flow rate and pressure of air flowing from the entire area of ​​the air discharge portion 23 toward the workpiece W can be made uniform, allowing the workpiece W to be cooled uniformly overall.

[0032] The upstream cooling section 2S in this embodiment is capable of adjusting the amount of air supplied from the first cooling section 2U and the amount of air supplied from the second cooling section 2D. The amount of air supplied may be adjusted by adjusting the rotation speed of the fan in the fan filter unit 22. Alternatively, the amount of air supplied may be adjusted by adjusting the flow rate of air supplied by the temperature-controlled air supply source 20.

[0033] More specifically, the upstream cooling section 2S in this embodiment is capable of changing the amount of air supplied depending on the transport pattern of the workpiece W and / or the state of the workpiece W. Specifically, the upstream cooling section 2S in this embodiment gradually increases the amount of air supplied as the workpiece W moves from the inlet 2A toward the intermediate position between the inlet 2A and the outlet 2B in each of the first cooling section 2U and the second cooling section 2D, then maintains the amount of air supplied constant, and then gradually decreases the amount of air supplied.

[0034] More specifically, in this embodiment, the workpiece W is transported by periodically repeating stops and movements. A series of acceleration / deceleration signals and stop signals are input to the conveyor C, which is the transport mechanism, the transport sheet payout device 3, and the transport sheet winding device 7 at a predetermined cycle, thereby realizing a transport pattern of intermittent movement of the workpiece W, in which stops and movements are periodically repeated. Here, the upstream cooling section 2S receives the acceleration / deceleration signals and stop signals, synchronizes with these signals, and converts the acceleration / deceleration signals and stop signals into signals for increasing / decreasing and maintaining the amount of air supply, thereby controlling the amount of air supply.

[0035] Specifically, an acceleration command signal for the workpiece W is converted into a command signal to decrease the amount of air supplied. A speed maintenance signal for the workpiece W at a constant speed is converted into a command signal to maintain the amount of air supplied at a constant value. A deceleration command signal for the workpiece W is converted into a command signal to increase the amount of air supplied. A stop signal for the workpiece W is converted into a command signal to maintain the amount of air supplied at a constant value.

[0036] In this embodiment, the workpiece W stops at the cooling position Cp in the film laminating and cutting device 1, the laminating position Pp in the film laminating and cutting device 1, the conveying sheet feeding device 3, the vacuum laminator 4, the flat press device 5, the downstream cooling device 6 and the conveying sheet winding device 7, and then moves toward the downstream device.

[0037] Then, by converting the above-mentioned signal, the upstream cooling section 2S gradually increases the amount of air supplied to the workpiece W from the inlet 2A until the workpiece W stops inside the upstream cooling section 2S. The upstream cooling section 2S also maintains a constant amount of air supplied to the workpiece W that has stopped inside the upstream cooling section 2S. The upstream cooling section 2S also gradually reduces the amount of air supplied to the workpiece W that accelerates from a stopped state and is sent from the outlet 2B.

[0038] On the other hand, as described above, the upstream cooling section 2S can also change the amount of air supplied depending on the state of the workpiece W. In this case, the upstream cooling section 2S may supply air at a constant amount until the temperature of the workpiece W therein drops below a predetermined temperature.

[0039] The workpiece W cooled by the upstream cooling section 2S as described above is sent from the upstream cooling section 2S to the side of the bonding member 12. Figure 2 shows a schematic enlarged view of the periphery of the bonding member 12 in the film bonding and cutting device 1.

[0040] 1 and 2, the laminating member 12 holds the leading end of the film F unwound from the film supply roll 11, and as the workpiece S moves, presses the leading end of the held film F against the front end of the workpiece S, and then presses the film F unwound as the workpiece S moves against the front or back surface of the workpiece S, thereby laminating or overlapping it with the workpiece W.

[0041] Then, in the present embodiment, the cutter 13 cuts the film F in the direction of arrow A1 in Fig. 2 at a position where the film F does not overlap with the workpiece W while the laminating member 12 is laminating the film F. As a result, the film F laminated to the workpiece W is separated from the film supply roll 11. The portion of the film F on the workpiece W side cut by the cutter 13 before lamination is then caught between the workpiece W and the laminating member 12 as the workpiece W moves, and is laminated up to the rear end of the workpiece W.

[0042] On the other hand, the leading end of the film F on the film supply roll 11 side cut by the cutter 13 is held by the laminating member 12, for example, in conjunction with the cutting. This makes it possible to similarly laminate the film F to the next workpiece W being conveyed. The laminating and cutting operations described above are performed simultaneously by the laminating member 12 and cutter 13 on one side of the conveyance path 1R and the laminating member 12 and cutter 13 on the other side of the conveyance path R. The cutter 13 may also be a slit cutter or a roll cutter.

[0043] In addition, in this embodiment, the position of the film F bonded to the workpiece W may be maintained by a melted portion partially provided between the workpiece W and the film F. In this case, the melted portion is formed by melting a portion of the film F, and a heating and pressurizing means (not shown) is provided. In addition, the position of the film F may be maintained by an adhesive partially provided between the workpiece W and the film F.

[0044] Furthermore, the film F used in this embodiment has a support layer F1 and an insulating layer F2, which is a bonding layer. The film F is bonded to the workpiece W with the insulating layer F2 in direct contact with the workpiece W. However, the film F may be a single-layer film. As will be described in detail later, the conveying sheet take-up device 7 also functions as a peeling device for the support layer F1. Peeling is performed by attaching the support layer F1 to the conveying sheet TS taken up by the conveying sheet take-up device 7. To achieve this peeling, in this embodiment, an adhesive portion is provided on the support layer F1. Then, when the workpiece W is conveyed to the conveying sheet feed device 3, the adhesive portion provided on the support layer F1 is attached to the conveying sheet TS fed by the conveying sheet feed device 3.

[0045] The conveying sheet feeding device 3 has a pair of conveying sheet supply rolls 31, each of which has a conveying sheet TS wound thereon. The downstream end of the conveyor C is located inside the conveying sheet feeding device 3. One of the pair of conveying sheet supply rolls 31 is arranged on one side of the conveyor C and the workpiece W (the upper side in FIG. 1), and the other of the pair of conveying sheet supply rolls 31 is arranged on the other side of the conveyor C and the workpiece W (the lower side in FIG. 1).

[0046] The leading end of the conveying sheet TS fed from the conveying sheet feeding device 3 is connected to the conveying sheet winding device 7. The conveying sheet TS extending between the conveying sheet feeding device 3 and the conveying sheet winding device 7 passes through a vacuum laminator 4, a flat press device 5, and a downstream cooling device 6.

[0047] The conveying sheet unwinding device 3 holds the workpiece W with the film F attached between the conveying sheets TS unwound from a pair of conveying sheet supply rolls 31. At this time, in this embodiment, the above-mentioned adhesive portion provided on the support layer F1 of the film F is adhered to the conveying sheet TS. When the conveying sheet TS is taken up by the conveying sheet take-up device 7, the workpiece W held between the pair of conveying sheets TS moves toward the conveying sheet take-up device 7. As a result, the workpiece W with the film F attached passes through the vacuum laminator 4, the flat press device 5, and the downstream cooling device 6 in this order, and reaches the conveying sheet take-up device 7.

[0048] The vacuum laminator 4 has a first chamber half 41 and a second chamber half 42. The first chamber half 41 is disposed on one side (upper side in FIG. 1) of the transport path formed by the pair of transport sheets TS, and the second chamber half 42 is disposed on the other side (lower side in FIG. 1) of the transport path formed by the pair of transport sheets TS.

[0049] When the workpiece W with the film F attached is transported, the vacuum laminator 4 sandwiches the workpiece W with the film F attached between the first chamber half 41 and the second chamber half 42 via a pair of transport sheets TS. The first chamber half 41 and the second chamber half 42 come into contact with each other to form a vacuum chamber 40, and the workpiece W with the film F is received inside the vacuum chamber 40. The vacuum laminator 4 then evacuates the vacuum chamber 40, creating a vacuum in the vacuum chamber 40, and heats and pressurizes the film F onto the workpiece W to bond it.

[0050] In this embodiment, the film F is heated by a first heater 43 provided in the first chamber half 41 and a second heater 44 provided in the second chamber half 42. Furthermore, the film F is pressed against the workpiece W by diaphragms (not shown) provided in each of the first chamber half 41 and the second chamber half 42. The diaphragms can pressurize the workpiece W by creating an air pressure difference between the workpiece W side and the opposite side. However, the means for pressing the film F against the workpiece W is not particularly limited, and pressure may be applied mechanically by driving a press plate with a cylinder or the like.

[0051] In this embodiment, the vacuum laminator 4 is used because it is necessary to prevent air from being trapped between the workpiece W and the film F. However, if there is no strong need to prevent air from being trapped, a general heat and pressure type laminator may be used instead of the vacuum laminator 4.

[0052] The planar press device 5 has a first press plate 51 and a second press plate 52. The first press plate 51 is arranged on one side (upper side in FIG. 1) of the transport path formed by the pair of conveying sheets TS, and the second press plate 52 is arranged on the other side (lower side in FIG. 1) of the transport path formed by the pair of conveying sheets TS. When a workpiece W with a film F is transported, the planar press device 5 sandwiches the workpiece W with the film F between the first press plate 51 and the second press plate 52 via the pair of conveying sheets TS, and heats and presses the workpiece W. The first press plate 51 and the second press plate 52 each have a built-in heater, and the workpiece W with the film F is heated by each heater.

[0053] The downstream cooling device 6 cools the workpiece W with the film F attached thereto that is sent out from the flat press device 5. The configuration of the downstream cooling device 6 is basically the same as that of the upstream cooling section 2S, and the amount of air supplied is also controlled in the same way as in the upstream cooling section 2S.

[0054] The downstream cooling device 6 has a first downstream cooling section 6U arranged on one side of the transport path formed by the pair of conveying sheets TS, and a second downstream cooling section 6D arranged on the other side of the transport path formed by the pair of conveying sheets TS. Each of the first downstream cooling section 6U and the second downstream cooling section 6D has a temperature-adjusted air supply source 60, a duct 61, a fan filter unit 62, and an air discharge section 63.

[0055] Air is supplied from the air discharge section 63 of the first downstream cooling section 6U to the film F on the front surface of the workpiece W, cooling the film F. Air is supplied from the air discharge section 63 of the second downstream cooling section 6D to the film F on the back surface of the workpiece W, cooling the film F. The temperature-regulated air supply source 60, duct 61, fan filter unit 62, and air discharge section 63 are configured in the same way as those on the upstream cooling section 2S side, so detailed description thereof will be omitted.

[0056] Like the upstream cooling section 2S, the downstream cooling device 6 can also change the amount of air supplied depending on the transport pattern of the workpiece W, the condition of the workpiece W, and more specifically, the condition of the film F on the workpiece W. Specifically, in each of the first downstream cooling section 6U and the second downstream cooling section 6D, the downstream cooling device 6 gradually increases the amount of air supplied as the workpiece W moves from the entrance 6A toward an intermediate position between the entrance 6A and the exit 6B, then maintains the amount of air supplied constant, and then gradually decreases the amount of air supplied. This control of the air supply amount is similar to that in the upstream cooling section 2S and is performed based on a series of acceleration / deceleration signals and stop signals for the conveyor C, the conveying sheet unwinding device 3, and the conveying sheet winding device 7, so a detailed description thereof will be omitted.

[0057] On the other hand, as described above, the downstream cooling device 6 can also change the amount of air supplied depending on the state of the film F on the workpiece W. In this case, the downstream cooling device 6 may supply air at a constant amount until the film F drops to a predetermined temperature or below.

[0058] The conveying sheet take-up device 7 has a pair of conveying sheet take-up rolls 71 that each take up a conveying sheet TS. One of the pair of conveying sheet take-up rolls 71 is arranged on one side (the upper side in FIG. 1) of the conveying path formed by the pair of conveying sheets TS, and the other of the pair of conveying sheet take-up rolls 71 is arranged on the other side (the lower side in FIG. 1) of the conveying path formed by the pair of conveying sheets TS.

[0059] The conveying sheet take-up device 7 moves the workpiece W held between the pair of conveying sheets TS toward the conveying sheet take-up device 7 by winding up the conveying sheet TS with a pair of conveying sheet take-up rolls 71. In this embodiment, the conveying sheet take-up device 7 also functions as a film peeling device that peels off the support layer F1 from the film F on the workpiece W. This peeling is achieved by adhering the support layer F1 to the conveying sheet TS via an adhesive portion, as described above. Then, after the support layer F1 is peeled off, the workpiece W laminated with only the insulating layer F2 is taken out of the conveying sheet take-up device 7.

[0060] FIG. 3 is a graph showing the relationship between the transport pattern of the workpiece W in the substrate laminating system S1 according to this embodiment and the air blowing patterns of the upstream cooling section 2S and downstream cooling device 6 in the film laminating and cutting device 1.

[0061] The upper graph in Fig. 3 shows the transport pattern of the workpiece W. In the upper graph in Fig. 3, the horizontal axis represents time, and the vertical axis represents the transport speed (m / s) of the workpiece W. The lower graph in Fig. 3 shows the air blowing patterns of the upstream cooling section 2S and the downstream cooling device 6. In the lower graph in Fig. 3, the horizontal axis represents time, and the vertical axis represents the air supply amount (L / s).

[0062] The range indicated by symbol S1 corresponds to the acceleration / deceleration command signal. The range indicated by symbol S2 corresponds to the stop command signal. In this embodiment, as indicated by the acceleration / deceleration command signal S1, the workpiece W is accelerated at a constant acceleration, then maintained at a constant speed, and then decelerated at a constant deceleration until it stops. Then, as indicated by the stop command signal S2, the workpiece W is stopped for a certain period of time. Thereafter, it is accelerated and decelerated in the same pattern. As a result, the workpiece W is intermittently transported by repeatedly stopping and moving.

[0063] The workpiece W stops at the cooling position Cp in the film laminating and cutting device 1, the laminating position Pp in the film laminating and cutting device 1, the conveying sheet feeding device 3, the vacuum laminator 4, the flat press device 5, the downstream cooling device 6, and the conveying sheet winding device 7. Of these, the workpiece W stops at the cooling position Cp in the film laminating and cutting device 1 and is cooled. At the laminating position Pp in the film laminating and cutting device 1, the workpiece W is cut by the cutter 13 while stopped. At the vacuum laminator 4, the workpiece W is heated and pressurized while stopped. At the flat press device 5, the workpiece W is also heated and pressurized while stopped. At the downstream cooling device 6, the workpiece W is cooled while stopped.

[0064] The upstream cooling unit 2S and downstream cooling device 6 then control the amount of air supplied in synchronization with the acceleration / deceleration command signal S1 and the stop command signal S2. Specifically, the upstream cooling unit 2S and downstream cooling device 6 convert an acceleration command signal for the workpiece W into a command signal to decrease the amount of air supplied, as indicated by arrow T1. The upstream cooling unit 2S and downstream cooling device 6 convert a speed maintenance signal for the workpiece W at a constant speed into a command signal to maintain the amount of air supplied at a constant value, as indicated by arrow T2. The upstream cooling unit 2S and downstream cooling device 6 convert a deceleration command signal for the workpiece W into a command signal to increase the amount of air supplied, as indicated by arrow T3. The upstream cooling unit 2S and downstream cooling device 6 convert a stop signal for the workpiece W into a command signal to maintain the amount of air supplied at a constant value, as indicated by arrow T4.

[0065] The command signal for maintaining the air supply amount at a constant value corresponding to the signal for maintaining the speed of the workpiece W at a constant speed is lower than the command signal for maintaining the air supply amount at a constant value corresponding to the signal for stopping the workpiece W. In other words, the air supply amount corresponding to the former signal is smaller than the air supply amount corresponding to the latter signal.

[0066] By converting the signals as described above, the upstream cooling section 2S and downstream cooling device 6 gradually increase the amount of air supplied to the workpiece W that has entered through the inlets 2A, 6A until it stops inside. The upstream cooling section 2S and downstream cooling device 6 also maintain a constant amount of air supplied to the workpiece W that has stopped inside. The upstream cooling section 2S and downstream cooling device 6 also gradually decrease the amount of air supplied to the workpiece W that accelerates from a stopped state and is sent out from the outlets 2B, 6B.

[0067] In this embodiment, the upstream cooling unit 2S and downstream cooling device 6 control the amount of air supplied using acceleration / deceleration command signals S1 and stop command signals S2 for the conveyor C, conveying sheet feed device 3, and conveying sheet take-up device 7. In this case, the conveyor C, conveying sheet feed device 3, and conveying sheet take-up device 7 may be connected in series via a field network, and the upstream cooling unit 2S and downstream cooling device 6 may also be connected in series to the same field network. In this case, it is preferable to send and receive signals using a communication method similar to EtherCat. This simplifies the wiring configuration and increases the speed of control operations.

[0068] Next, the operation and effects of this embodiment will be described.

[0069] First, the workpiece W is received from the outside into the conveying path 1R of the film laminating and cutting device 1, and is cooled by the upstream cooling section 2S of the film laminating and cutting device 1 (first cooling step). Thereafter, the workpiece W is sent from the upstream cooling section 2S to the laminating member 12 side, and the laminating member 12 laminates the film F, and the cutter 13 cuts the film F (film laminating and cutting step).

[0070] Thereafter, the workpiece W with the film F attached thereto is transported to a vacuum laminator 4, where the film F is heated and pressed to the workpiece W in a vacuum state to be bonded thereto (vacuum lamination process). Next, the workpiece W with the film F attached thereto is transported to a flat press device 5, where it is sandwiched between a first press plate 51 and a second press plate 52 and heated and pressed thereto.

[0071] Thereafter, the workpiece W with the film F attached thereto is cooled in the downstream cooling device 6 (second cooling step). Thereafter, the workpiece W with the film F attached thereto is transported to the conveying sheet take-up device 7, where the support layer F1 is peeled off from the film F on the workpiece W (film peeling step). Thereafter, the workpiece W with only the insulating layer F2 laminated thereon is taken out from the conveying sheet take-up device 7 to the outside.

[0072] In this lamination process, in this embodiment, the upstream cooling section 2S cools the workpiece W before the workpiece W reaches the lamination position Pp of the film F by the laminating member 12. This cools the film F that will subsequently be laminated to the workpiece W, and cools the cutting portion of the film F that will be cut by the cutter 13 before cutting. This prevents a situation in which a portion of the film F melts or softens due to the temperature environment or the like before cutting, making it difficult to cut. This allows the film F to be cut properly. Furthermore, because the film F becomes difficult to cut, it is possible to prevent a situation in which the cut surface of the film F becomes rough or the film F becomes wrinkled or stretched.

[0073] The workpiece W with the film F, which has been heated and pressurized by the vacuum laminator 4 and the flat press device 5, is cooled by the downstream cooling device 6, and then the support layer F1 is peeled off by the conveying sheet take-up device 7. This prevents a part of the insulating layer F2 from adhering to the support layer F1 and being peeled off when the support layer F1 is peeled off due to the high temperature, thereby preventing the surface of the insulating layer F2 from becoming rough.

[0074] Furthermore, in this embodiment, the downstream cooling device 6 gradually increases the amount of air supplied to the workpiece W from the inlet 6A until the workpiece W stops inside. Thereafter, the downstream cooling device 6 maintains a constant amount of air supplied to the workpiece W that has stopped inside. This allows the film F on the workpiece W to be cooled gradually, preventing warping of the workpiece W with the film F attached due to a sudden temperature change. In particular, in this embodiment, the film F on both sides of the workpiece W is cooled gradually with the same amount of air supplied, suppressing the difference in shrinkage rate between the films F and effectively suppressing warping. Furthermore, since the amount of air supplied is temporarily reduced, energy consumption can also be reduced.

[0075] Therefore, according to this embodiment, it is possible to manufacture with a high yield the workpieces W in which the insulating layer F2 is free from wrinkles and stretches, has a smooth surface, and is free from warping, thereby improving the yield rate of the workpieces W laminated with the insulating layer F2, which is a laminated product.

[0076] In this embodiment, the workpieces are transported by a transport mechanism to which acceleration / deceleration command signals and stop command signals are input at a predetermined cycle, and the upstream cooling section 2S and downstream cooling device 6 synchronize with the acceleration / deceleration command signals and stop command signals, converting them into command signals to increase / decrease and maintain the amount of air supply, thereby controlling the amount of air supply. This simplifies the control process and speeds up the control operation.

[0077] In this embodiment, the film bonding and cutting device 1 includes the upstream cooling section 2S, but the upstream cooling section 2S may be configured as an independent cooling device separated from the film bonding and cutting device 1.

[0078] <Second embodiment> Next, a substrate laminating system S2 according to a second embodiment will be described. The same components in this embodiment as those in the first embodiment will be given the same reference numerals, and redundant description will be omitted.

[0079] 4 is a schematic diagram of a substrate laminating system S2 according to a second embodiment. In this embodiment, the configuration of the film laminating / cutting device 1 differs from that of the first embodiment. The film laminating / cutting device 1 has a first section 1X disposed upstream in the conveying direction of the workpiece W, and a second section 1Y disposed downstream and spaced apart from the first section 1X.

[0080] The first section 1X is provided with a pair of film supply rolls 11 and a pair of laminating members 12. The second section 1Y is provided with a pair of cutters 13. The second section 1Y is also provided with a pair of film take-up rolls 15. The leading end of the film F unwound from each film supply roll 11 is connected to the corresponding film take-up roll 15.

[0081] In this embodiment, conveyors C are arranged on the upstream and downstream sides of the film laminating and cutting device 1 in the transport direction of the workpiece W, but no conveyors C are arranged inside the film laminating and cutting device 1. On the other hand, the transport path 1R of the film laminating and cutting device 1 is formed so as to be linearly connected to the upstream conveyor C and the downstream conveyor C. The pair of film supply rolls 11, the pair of laminating members 12, the pair of cutters 13, and the pair of film take-up rolls 15 are arranged on one side (upper side in FIG. 1) and the other side (lower side in FIG. 1) of the transport path 1R, respectively.

[0082] In this embodiment, the film F extending between the film supply roll 11 and the film take-up roll 15 comes into contact with the laminating member 12 from the film supply roll 11 side, changes direction, extends linearly, and then reaches the film take-up roll 15. The portion of the film F that extends linearly from the laminating member 12 toward the film take-up roll 15 side extends along the transport path 1R. The cutter 13 is positioned in front of the film take-up roll 15 so that it can move toward and away from the portion of the film F that extends linearly from the laminating member 12 toward the film take-up roll 15 side.

[0083] The symbol Xp in FIG. 4 indicates the cutting position of the film F by the cutter 13. In the film bonding and cutting device 1 of this embodiment, as the film take-up roll 15 takes up the film F, the workpiece W on the upstream conveyor C is drawn between the pair of bonding members 12 and transported to the bonding position Pp. As the workpiece W moves at the bonding position Pp, the bonding members 12 bond the film F to the front and back surfaces of the workpiece W. As the film take-up roll 15 further takes up the film F, the workpiece W reaches the cutting position Xp. At this time, the workpiece W is moved while being sandwiched between the film F. Then, at the cutting position Xp, the film F is cut at a position where it does not overlap with the workpiece W. As a result, the film F bonded to the workpiece W is separated from the film F extending between the film supply roll 11 and the film take-up roll 15. The cutter 13 may be freely movable in a two-dimensional plane.

[0084] In this embodiment, an upstream cooling device 2 is provided between a lamination position Pp of the film F and a cutting position Xp of the film F. The upstream cooling device 2 supplies air to the film F on the workpiece W at a cooling position Cp between the lamination position Pp and the cutting position Xp to cool the film F.

[0085] The upstream cooling device 2 differs from the upstream cooling section 2S of the first embodiment in that it is separate from the film laminating and cutting device 1. The upstream cooling device 2 is also located in a different position from the upstream cooling section 2S of the first embodiment. The upstream cooling device 2 also differs from the upstream cooling section 2S of the first embodiment in that it directly cools the film F. However, the other configuration of the upstream cooling device 2 is the same as the upstream cooling section 2S of the first embodiment, and the air supply volume is controlled in the same manner as in the first embodiment. While the upstream cooling device 2 is separate from the film laminating and cutting device 1 in this embodiment, it may be incorporated as a component of the film laminating and cutting device 1. The configurations of the conveying sheet feeding device 3, vacuum laminator 4, flat press device 5, downstream cooling device 6, and conveying sheet winding device 7 are the same as those in the first embodiment.

[0086] In this embodiment as well, the cutting portion of the film F to be cut by the cutter 13 is cooled by the upstream cooling device 2 before cutting. This prevents a situation in which the film F is partially melted or softened due to the temperature environment or the like before being cut, making it difficult to cut. This allows the film F to be cut properly. Furthermore, making the film F difficult to cut prevents the cut surface of the film F from becoming rough, or the film F from wrinkling or stretching. This improves the yield rate of the workpiece W laminated with the insulating layer F2, which is a laminated product.

[0087] <Third embodiment> Next, a substrate laminating system S3 according to a third embodiment will be described. Components in this embodiment that are the same as those in the first and second embodiments are given the same reference numerals, and duplicated descriptions will be omitted.

[0088] 5 is a schematic diagram of a substrate laminating system S3 according to a third embodiment. In this embodiment, a conveying sheet winding device 7 includes a downstream cooling section 6S. However, the downstream cooling device 6 described in the first and second embodiments is not provided.

[0089] The downstream cooling section 6S supplies air to the film F on the front and back surfaces of the workpiece W fed out from the vacuum laminator 4 to cool the film F before the support layer F1 is peeled off from the film F on the front and back surfaces of the workpiece W.

[0090] The downstream cooling section 6S has a first downstream cooling section 6U and a second downstream cooling section 6D. Although shown simply in Figure 5, the first downstream cooling section 6U and the second downstream cooling section 6D have the same configurations as the first downstream cooling section 6U and the second downstream cooling section 6D described in the first embodiment. Furthermore, the downstream cooling section 6S controls the amount of air supplied in the same manner as in the first embodiment.

[0091] In this embodiment, the workpiece W with the film F, which has been heated and pressurized by the vacuum laminator 4 and the flat press device 5, is cooled in the downstream cooling section 6S, and then the support layer F1 is peeled off by the conveying sheet take-up device 7. This prevents a part of the insulating layer F2 from adhering to the support layer F1 and being peeled off when the support layer F1 is peeled off due to high temperatures, thereby preventing the surface of the insulating layer F2 from becoming rough.

[0092] Also in this embodiment, the downstream cooling section 6S gradually increases the amount of air supplied to the workpiece W until the workpiece W stops inside. Thereafter, the downstream cooling section 6S maintains a constant amount of air supplied to the workpiece W that has stopped inside. This allows the film F on the workpiece W to be cooled gradually, preventing warping of the workpiece W with the film F attached due to a sudden temperature change. In particular, in this embodiment, the film F on both sides of the workpiece W is cooled gradually with the same amount of air supplied, reducing the difference in shrinkage speed between the films F and effectively preventing warping.

[0093] Therefore, the yield of the workpiece W laminated with the insulating layer F2, which is a laminated product, can be improved.

[0094] <Fourth embodiment> Next, a substrate laminating system S4 according to a fourth embodiment will be described. Components in this embodiment that are the same as those in the first to third embodiments are given the same reference numerals, and duplicated descriptions will be omitted.

[0095] FIG. 6 shows a schematic diagram of a substrate laminating system S4 according to a fourth embodiment, and in detail shows a film laminating and cutting device 1 provided in the substrate laminating system S4.

[0096] The film bonding and cutting device 1 in this embodiment differs from the first embodiment in the manner in which air is supplied from the upstream cooling section 2S. That is, the upstream cooling section 2S supplies air to the film F before it is bonded to the workpiece W to cool the film F before cutting.

[0097] Specifically, the laminating member 12 on one side is disposed close to the conveying path 1R, and the film supply roll 11 on one side is disposed at a position farther from the conveying path 1R than the laminating member 12. The cutter 13 on one side is disposed so as to be able to approach and move away from a portion of the film F extending between the film supply roll 11 on one side and the laminating member 12 on one side. Similarly, the laminating member 12 on the other side is disposed close to the conveying path 1R, and the film supply roll 11 on the other side is disposed at a position farther from the conveying path 1R than the laminating member 12. The cutter 13 on the other side is disposed so as to be able to approach and move away from a portion of the film F extending between the film supply roll 11 on the other side and the laminating member 12 on the other side.

[0098] The first cooling section 2U in the upstream cooling section 2S supplies air to a portion of the film F extending between the film supply roll 11 on one side and the laminating member 12 on one side, at a position closer to the film supply roll 11 on one side than the cutter 13 on one side. The second cooling section 2D in the upstream cooling section 2S supplies air to a portion of the film F extending between the film supply roll 11 on the other side and the laminating member 12 on the other side, at a position closer to the film supply roll 11 on the other side than the cutter 13 on the other side.

[0099] The configurations of the first cooling section 2U and the second cooling section 2D in the upstream cooling section 2S are basically the same as those in the first embodiment, but differ from the first embodiment in that the air path from the fan filter unit 22 to the air discharge section 23 is formed by an airflow guide plate 24 so that the cross-sectional area gradually decreases as the air approaches the air discharge section 23. On the other hand, the control of the amount of air supplied by the upstream cooling section 2S may be the same as or different from that in the first embodiment.

[0100] In this embodiment, too, the cutting portion of the film F to be cut by the cutter 13 is cooled by the upstream cooling section 2S before cutting. This prevents the film F from being partially melted or softened due to the temperature environment or the like before being cut, making it difficult to cut. This allows the film F to be cut properly. Furthermore, making the film F difficult to cut prevents the cut surface of the film F from becoming rough, or wrinkles or stretching from occurring in the film F. This improves the yield rate of the workpiece W laminated with the insulating layer F2, which is a laminate-formed product.

[0101] <Fifth embodiment> Next, a substrate laminating system S5 according to a fifth embodiment will be described. The same components in this embodiment as those in the first to fourth embodiments will be given the same reference numerals, and duplicated descriptions will be omitted.

[0102] FIG. 7 shows a schematic diagram of a substrate laminating system S5 according to a fifth embodiment. The substrate laminating system S5 laminates a film F on only one side of a workpiece W. Therefore, the upstream cooling section 2S of the film laminating and cutting device 1 described in the first embodiment does not have a second cooling section 2D. The film supply roll 11, laminating member 12, and cutter 13 are not provided on the lower side of FIG. 7. Furthermore, the downstream cooling device 6 does not have a second downstream cooling section 6D. The other configurations are the same as those of the first embodiment.

[0103] When the film F is laminated only on one side of the workpiece W, the same members and devices as those in the fifth embodiment may be omitted in the second to fourth embodiments.

[0104] Sixth Embodiment Next, a sixth embodiment will be described. The same components in this embodiment as those in the first to fifth embodiments are designated by the same reference numerals, and redundant explanations will be omitted. Fig. 8 is a diagram schematically illustrating a semiconductor manufacturing system SS equipped with a film bonding and cutting device 1 according to the sixth embodiment.

[0105] The semiconductor manufacturing system SS includes the film bonding and cutting device 1 described in the fifth embodiment, an exposure device 101, and a developing device .

[0106] The film laminating and cutting device 1 laminates a dry resist film as a film F onto a workpiece W, which is a semiconductor wafer. The exposure device 101 exposes the film F to light and hardens a portion of the film F in a predetermined pattern. The developing device 102 removes unnecessary portions of the film F. The developing device 102 may be, for example, a spin rotation type or a dipping type. Note that a laminator that presses the film F onto the workpiece W may be provided between the exposure device 101 and the film laminating and cutting device 1.

[0107] Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments. [Explanation of symbols]

[0108] S1, S2, S3, S4, S5... Substrate lamination system SS: Semiconductor manufacturing system 1...Film laminating and cutting device 1R...Transportation route 1X…first part 1Y…Second part F...Film F1…Support layer F2: Insulating layer 11...Film supply roll 12...Laminated material 13...Cutter 15...Film take-up roll 2...Upstream cooling device 2S…Upstream cooling section 2A…Entrance 2B…Exit 2U…1st cooling section 2D…Second cooling section 20...Temperature-controlled air supply source 21...Duct 22...Fan filter unit 23...Air discharge section 3...Transport sheet feeding device 4...Vacuum laminator 40...Vacuum chamber 41...First chamber half 42...Second chamber half 5...Flat press device 6…Downstream cooling device 6U…1st downstream cooling section 6D…Second downstream cooling section 6S…Downstream cooling section 60...Temperature-controlled air supply source 61...Duct 62...Fan filter unit 63...Air discharge section 7...Transport sheet winding device TS...Transport sheet

Claims

1. a film laminating and cutting device that laminates a film unwound from a roll onto a workpiece and cuts the film at a position that does not overlap the workpiece; A laminator that receives the work sent out from the film laminating and cutting device and pressurizes the film laminated to the work to bond it to the work, A cooling device is provided that cools the workpiece or the film with air before the film is cut by the film laminating and cutting device, The cooling device supplies air to the work before it reaches the lamination position of the film in the film laminating and cutting device to cool the work, or supplies air to the film before it is laminated to the work to cool the film.

2. A film laminating and cutting device that laminates a film unwound from a roll onto a workpiece and cuts the film at a position that does not overlap the workpiece, A cooling unit is provided that cools the workpiece or the film with air before cutting the film, The cooling section supplies air to the workpiece before it reaches the lamination position of the film to cool the workpiece, or supplies air to the film before it is laminated to the workpiece to cool the film.

3. a film laminating and cutting process of laminating a film unwound from a roll onto a workpiece and cutting the film at a position where the film does not overlap with the workpiece; A lamination process of receiving the work sent out after the film laminating and cutting process, and pressing the film laminated to the work to bond it to the work, A cooling step of cooling the workpiece or the film with air before cutting the film in the film laminating and cutting step is provided, In the cooling process, air is supplied to the work before it reaches the lamination position of the film in the film laminating and cutting process to cool the work, or air is supplied to the film before it is laminated to the work to cool the film.

4. a film laminating and cutting process of laminating a film unwound from a roll onto a workpiece and cutting the film at a position where the film does not overlap with the workpiece; A lamination process of receiving the work sent out after the film laminating and cutting process, and pressing the film laminated to the work to bond it to the work, A cooling step of cooling the workpiece or the film with air before cutting the film in the film laminating and cutting step is provided, In the cooling process, air is supplied to the work before it reaches the lamination position of the film in the film laminating and cutting process to cool the work, or air is supplied to the film before it is laminated to the work to cool the film, in this method for manufacturing a laminated product.

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