High current contact device and method for manufacturing the same

Abstract

To improve a high-current contact device and a manufacturing method of the high-current contact device.SOLUTION: A high-current contact device 10 includes at least one first contact element 25, a circuit carrier 30, at least one first data contact 40 transmitting a data signal and at least one data interface. The first contact element 25 extends through the circuit carrier 30 along a mating axis 110 at a feedthrough 175. A first conductor track 145 of the circuit carrier 30 electrically connects the first data contact 40 to the data interface. The circuit carrier 30 is designed as an injection-molded circuit carrier. A carrier 115 of the circuit carrier 30 mechanically supports the first data contact 40, the first contact element 25 and the data interface.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The invention relates to a high-current contact device according to claim 1 and to a method for manufacturing a high-current contact device according to claim 14. [Background technology]

[0002] DE 102016107401 A1 discloses a plug-in device insert including contact elements, such as contact pins for conducting electrical current. The contact elements include a contact area where the contact element contacts a complementary contact element and a connection area where a conductor is connected. The temperature of at least one contact element is detected in a measurement area located between the contact area and the connection area. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] DE102016107401A1 Summary of the Invention [Problem to be solved by the invention]

[0004] SUMMARY OF THE INVENTION It is an object of the present invention to provide an improved high current contact device for transmitting electrical energy and a method for manufacturing the improved high current contact device. [Means for solving the problem]

[0005] This object is achieved by a high-current contact device according to claim 1 and by a method for manufacturing a high-current contact device according to claim 14. Advantageous embodiments are specified in the dependent claims.

[0006] It has been recognized that an improved high current contact device for a motor vehicle or charging station can be provided, the high current contact device having at least one first contact element designed to transfer electrical energy, a circuit carrier, at least one first data contact for transmitting data signals, and at least one data interface, wherein the first contact element extends through the circuit carrier along a mating axis in a feedthrough. Conductor tracks of the circuit carrier electrically connect the first data contact to the data interface, the circuit carrier being designed as an injection-molded circuit carrier, the carrier of the circuit carrier mechanically supporting the first data contact and the data interface.

[0007] This design has the advantage that the assembly costs for assembling the high-current contact device are significantly reduced by providing the circuit carrier, resulting in a particularly fast and cost-effective assembly of the high-current contact device, and the number of parts of the high-current contact device is also particularly low.

[0008] In a further embodiment, the high current contact device has a contact housing defining a housing interior, the first data contact, the circuit carrier, and the first contact element are disposed within the housing interior, and the data interface extends laterally through the contact housing in a plane oblique to the mating axis. As a result, the data interface can be contacted particularly easily from the outside. Furthermore, since the data interface is guided laterally from the contact housing, the data interface can be easily sealed and the interior of the housing can be protected from the ingress of corrosive media via the data interface.

[0009] It is particularly advantageous if the carrier is integrally formed from the same material. The carrier has a first portion and a second portion connected to the first portion. The second portion is offset from the first portion with respect to the mating axis. The feedthroughs are located on the first portion and the data contacts are located on the second portion. This design has the advantage that, because the carrier is integrally formed from the same material and the first and second portions are offset along the mating axis, the carrier can be flexibly adapted to the geometric design of the high-current contact device. Because the carrier is integrally formed from the same material, part count and assembly costs are kept low.

[0010] It is particularly advantageous if the high-current contact device has a second contact element designed to transmit electrical energy, which has a different design from the first contact element and is arranged in the second section. This design has the advantage that, for example, one free end of the first and second contact elements is arranged in a common plane, even if in each case the first and second contact elements have contact sections designed to be different lengths. As a result, existing machine tools for manufacturing the first and second contact elements do not need to be retrofitted, as the carrier can compensate for different geometric designs of the contact elements, resulting in particularly low installation costs for manufacturing high-current contact devices.

[0011] It is particularly advantageous if, for example, a direct current is transmitted by the first contact element and an alternating current, in particular a three-phase alternating current, is transmitted by the second contact element, the current transmitted by the second contact element being, for example, significantly lower than the current transmitted by the first contact element, so that, for example, the second contact element can be designed to be significantly smaller than the first contact element and, for example, significantly shorter due to the contact portion.

[0012] The carrier has at least one reinforcing rib extending along the mating axis, thereby providing a particularly rigid circuit carrier, which reduces bending when inserting the first contact element and / or the second contact element and / or the data contact into the carrier, thereby preventing mechanical damage to the conductor tracks arranged on the carrier.

[0013] In a further embodiment, the high-current contact device has at least one seal sleeve fixed to the circuit carrier. The seal sleeve is axially adjacent to the feedthrough with respect to the mating axis. The seal sleeve fluid-tightly engages around the first contact element. The seal sleeve prevents the ingress of corrosive media laterally through the contact element via the circuit carrier. Corrosion within the housing interior is prevented by seals on both sides of the housing interior at both the data interface and the first contact element.

[0014] It is particularly advantageous if the sealing sleeve is connected to the circuit carrier in a materially bonded manner, preferably by form-fitting. Two-component injection molding is particularly suitable here for manufacturing the sealing sleeve and the circuit carrier. The materially bonded connection of the sealing sleeve prevents creep gaps of the sealing sleeve relative to the circuit carrier. A secure fixation of the sealing sleeve relative to the circuit carrier is also ensured, thereby preventing undesired removal of the sealing sleeve when inserting the first contact element through the carrier's feed-through.

[0015] In a further embodiment, the carrier has a retaining structure at the feedthrough, which comprises at least one recess and a web defining the recess, the sealing sleeve closing the recess, the web being embedded in at least some area of ​​the sealing sleeve. This design has the advantage that the sealing sleeve is mechanically connected to the carrier in a particularly stable manner.

[0016] In a further embodiment, an electric circuit is arranged on the circuit carrier, the electric circuit being designed to identify information about operating parameters of the high-current contact device. The circuit carrier is electrically connected to a data interface by further conductor tracks arranged on the carrier and is designed to provide the information to the data interface. This design has the advantage that by providing the operating parameters, the high-current contact device can be monitored by an evaluation device that can be connected to the data interface, and thus, for example, the ingress of moisture into the housing interior and / or the temperature inside the housing and / or the current transmitted through the first contact element can be monitored.

[0017] In a further embodiment, the electric circuit has at least one temperature measuring device including at least one temperature sensor, which is designed to measure the temperature of the first contact element as an operating parameter.

[0018] A particularly good thermal connection of the temperature sensor is achieved by embedding the temperature sensor in a sealing sleeve, which is of a thermally conductive design and thermally connects the temperature sensor to the first contact element.

[0019] In a further embodiment, the sealing sleeve is constructed from at least one of the following materials: copper, aluminum, aluminum oxide, aluminum nitrate, silicon oxide, silicon nitrate, boron nitride, plastic, heat resistant plastic, silicone, polyurethane.

[0020] It is also advantageous if the sealing sleeve is injection molded and the temperature sensor is connected to the sealing sleeve by a material bond and is overmolded with the sealing sleeve, so that a particularly good thermal connection of the sealing sleeve to the temperature sensor can be ensured.

[0021] The high-current contact device can be produced in a particularly simple and cost-effective manner, as the carrier of the circuit carrier of the high-current contact device is injection-molded, the conductor tracks are formed on the carrier, and the data interface is fixed to the circuit carrier, so that firstly, the high-current contact device can be produced with variable geometries and secondly, the number of parts is reduced, resulting in particularly few assembly steps.

[0022] The invention will now be explained in more detail with reference to the drawings. [Brief explanation of the drawings]

[0023] [Figure 1] FIG. 1 is a first perspective view of a high current contact device. [Figure 2] 2 is a second perspective view of the high-current contact device shown in FIG. 1. [Figure 3] FIG. 2 is a third perspective view of the high-current contact device shown in FIG. [Figure 4] 2 is a cross-sectional view of the high current contact device shown in FIG. 1 along section AA shown in FIG. 1. [Figure 5] FIG. 4 is a perspective view of the carrier of the circuit carrier shown in FIG. 3. [Figure 6] FIG. 5 is a diagram showing a part of the cross-sectional view shown in FIG. [Figure 7] 7A-7C illustrate a portion of the high current contact device shown in FIGS. 1-6 during manufacture of the high current contact device. [Figure 8] 7A-7C illustrate a portion of the high current contact device shown in FIGS. 1-6 during manufacture of the high current contact device. [Figure 9] 7A-7C illustrate a portion of the high current contact device shown in FIGS. 1-6 during manufacture of the high current contact device. [Figure 10] 7A-7C illustrate a portion of the high current contact device shown in FIGS. 1-6 during manufacture of the high current contact device. [Figure 11]7A-7C illustrate a portion of the high current contact device shown in FIGS. 1-6 during manufacture of the high current contact device. [Figure 12] 7A-7C illustrate a portion of the high current contact device shown in FIGS. 1-6 during manufacture of the high current contact device. DETAILED DESCRIPTION OF THE INVENTION

[0024] In the following diagrams, reference is made to a coordinate system, which by way of example is configured as a right-hand system, with an x-axis (longitudinal), a y-axis (lateral), and a z-axis (vertical).

[0025] FIG. 1 is a first perspective view of a high current contact device 10. As shown in FIG.

[0026] The high current contact device 10 includes a contact housing 15, a first contact arrangement 20 including at least one first contact element 25, a circuit carrier 30 (hidden in FIG. 1 ), and a data contact arrangement 35 including at least one first data contact 40. The data contact arrangement 35 may further include a second data contact 45. The high-current contact device 10 may also have a second contact arrangement 50 including at least one second contact element 55. In an embodiment, the first contact arrangement 20 is offset in the z-direction from the second contact arrangement 50. The data contact arrangement 35 is positioned adjacent to the second contact arrangement 50 on the opposite side of the z-direction from the first contact arrangement 20.

[0027] Additionally, the high current contact device 10 has at least one laterally disposed data interface 60. The data interface 60 can have a first data contact device 65 and a second data contact device 70, shown in dashed lines in FIG.

[0028] Furthermore, the first contact arrangement 20 can have a third contact element 75. The third contact element 75 can be of the same design as the first contact element 25. In this case, for example, the third contact element 75 is arranged offset in the y direction from the first contact element 25, and for example, the first contact element 25 and the third contact element 75 are arranged in a common xy plane. In this case, in Fig. 1, the first contact element 25 and the third contact element 75 contact a counter contact 80 of a further high-current contact device 85, which counter contact is in each case designed correspondingly to the first contact element 25 and the third contact element 75. The further high-current contact device 85 is only indicated diagrammatically in Fig. 1 by dashed lines.

[0029] The second contact arrangement 50 can have at least one fourth contact element 90 in addition to the second contact element 55. In an embodiment, the second contact arrangement 50 further has a fifth contact element 95, where the second contact element 55 and the fourth contact element 90 are designed identically to each other but differently from the first contact element 25 and the third contact element 75, and the fifth contact element 95 is designed differently from the first contact element 25, the second contact element 55, the third contact element 75, and the fourth contact element 90.

[0030] In the embodiment, the second contact arrangement 50 is designed as a five-pole contact arrangement, for example. In this case, the third contact element 75 and the fourth contact element 90 are arranged in a circular track around the fifth contact element 95. The first data contact 40 and the second data contact 45 are arranged in a common xy-plane and are also arranged in a circular track around the fifth contact element 95.

[0031] For each contact element 25, 55, 75, 90, 95 and data contact 40, 45, the contact housing 15 has in each case an associated contact receptacle 120 extending through the contact housing 15 along the mating axis 110. The contact receptacle 120 is partially closed by the circuit carrier 30, in particular at the rear side of the high-current contact device 10 shown in FIG.

[0032] In this case, the contact housing 15 is designed to mechanically support and electrically insulate the contact elements 25, 55, 75, 90, 95 and the data contacts 40, 45, respectively, so that the contact elements 25, 55, 75, 90, 95 and the associated data contacts 40, 45 can be pressed into the associated contact receptacle 120 in certain areas.

[0033] The high current contact device 10 and the further high current contact device 85 can be designed to be hermetically sealed, thereby preventing the ingress of moisture, liquids, and / or other corrosive media into the housing interior 100 of the contact housing 15 (see FIG. 2).

[0034] The first contact arrangement 20 and the second contact arrangement 50 can be connected to a high current cable 105, for example on the side facing away from the viewer. The high current cable 105 can be connected to, for example, an electrical energy storage device, a drive motor of a vehicle, or a control device of the vehicle. The high current cable 105 can also be connected to a charging station to provide a charging current for charging the electrical energy storage device. 1 serves to connect a charging plug of a charging station to an internal charging device of a vehicle to charge an electric energy storage device. For this purpose, the first contact arrangement 20 is designed to transfer the electric energy present in the first contact element 25 and the third contact element 75 to the charging device by means of a DC voltage.

[0035] For example, the first contact element 25 and the third contact element 75 are designed to transmit a current of at least 30 to 1000 amperes, particularly 50 to 500 amperes, for a period of at least 30 seconds. The voltage present between the first contact element 25 and the third contact element 75 can be 48 to 500 volts. The voltage present between the first contact element 25 and the third contact element 75 is therefore significantly different from the 12- or 24-volt networks of conventional automobiles.

[0036] The second contact arrangement 50 is also designed to transmit electrical energy. In this case, the electrical energy transmitted via the second contact arrangement 50 can be present at the second contact arrangement as alternating current, in particular as three-phase alternating current. Depending on the alternating current present, the second contact arrangement 50 has a corresponding number of second contact elements 55, fourth contact elements 90, and fifth contact elements 95. If the electrical energy is supplied as three-phase alternating current, as shown in FIG. 1, the second contact arrangement 50 accordingly has five contact elements 55, 90, and 95. In this case, the fifth contact element 95 can be connected to a ground connection / protective earth conductor, and the second contact element 55 and the fourth contact element 90 can be connected to an external conductor. The AC voltage can be supplied, for example, by a household connection.

[0037] The current transmitted through the second contact element 55, the fourth contact element 90, and the fifth contact element 95 is significantly lower than the current transmitted through the first contact element 25 and the third contact element 75, for example, 1 ampere to 32 amperes, particularly 1 ampere to 16 amperes. The AC voltage present between the second contact element 55, the fourth contact element 90, or the fifth contact element 95 can be up to about 600 volts.

[0038] The data contact arrangement 35 serves to transmit data and therefore not to transmit electrical energy for charging the energy storage device or driving the drive motor, but rather to transmit information to the charging station, for example about the operating state of the energy storage device or charging information of the charging device. As a result, the electrical energy transmitted by the data contact device is particularly low, not exceeding a current of 0.1 Ampere sent through the data contact arrangement 35.

[0039] In the embodiment, the first contact element 25 extends in a straight line along a mating axis 110. The mating axis 110 is oriented to extend parallel to the x-axis. The second contact element 55, the third contact element 75, the fourth contact element 90, and the fifth contact element 95, as well as the data contact elements 40, 45, are similarly designed to extend parallel to the mating axis 110.

[0040] The first contact element 25, the second contact element 55, the third contact element 75, the fourth contact element 90 and the fifth contact element 95 are, for example, designed as pin contacts and serve for electrical contact connection of a mating contact 80, for example, designed as a socket contact which is also designed as a pin contact.

[0041] FIG. 2 is a second perspective view of the high current contact device shown in FIG.

[0042] The circuit carrier 30 is disposed in the housing interior 100 of the contact housing 15. In an embodiment, the circuit carrier 30 is designed as an injection-molded circuit carrier, commonly referred to as a molded integrated device (MID). The circuit carrier 30 has a carrier 115. The carrier 115 is made of an electrically insulating material. The electrically insulating material may be polypropylene, polyethylene, and / or a heat-resistant plastic, among others.

[0043] At a first end face 135, facing away from the viewer in Fig. 2, the first data contact device 65 and the second data contact device 70 are mechanically connected to the carrier 115. The data contact devices 65, 70 are guided laterally through the contact housing 15 in a plane perpendicular to the mating axis 110, so that a data connection device 140 designed to correspond to the first data contact device 65 and / or the second data contact device 70 can contact the data contact devices 65, 70 on the outside. The first data contact device 65 and the second data contact device 70 are, for example, designed to be hermetically sealed, thereby preventing fluids or liquids between the contact housing 15 and the data contact devices 65, 70 from penetrating into the housing interior 100.

[0044] 2, the respective contact elements 25, 55, 75, 90, 95 may be electrically connected, e.g., crimped, to electrical conductors of a high current cable 105. The data contacts 40, 45 may be connected, e.g., crimped, to a data cable, e.g., a twisted pair cable, on the side shown in FIG.

[0045] FIG. 3 is a perspective view of the high current contact device 10, with the contact housing 15 omitted from view for clarity.

[0046] The circuit carrier 30 exemplarily has one or more exemplary conductor tracks 145, 150, 155, 160, 252 arranged on the first end surface 135 of the carrier 115. In this case, exemplarily, the first conductor track 145 connects the first data contact 40 to the first data contact device 65. Furthermore, the second conductor track 150 electrically connects the first data contact device 65 to the second data contact 45.

[0047] At least one electric circuit 165 can be arranged on the circuit carrier 30. The electric circuit 165 is electrically connected to the second data contact device 70, for example by means of the third conductor track 155 and the fourth conductor track 160. The electric circuit 165 is designed to identify information about the operating parameters of the high current contact device 10. The electric circuit 165 is designed to provide information about the operating parameters of the high current contact device 10 to the second data contact device 70 by means of the third conductor track 155 and the fourth conductor track 160.

[0048] 3, the carrier 115 is, by way of example, free of the conductor tracks 145, 150, 155, 160. The conductor tracks 145, 150, 155, 160 are formed, for example, from copper and / or aluminum and / or aluminum oxide and / or aluminum nitrate and / or silicon oxide and / or silicon nitrate and / or boron nitride and / or conductive and / or non-conductive chemical modifications of ferrous and / or non-ferrous metals. The circuit carrier 30 may be designed in a multi-layer manner such that the conductor tracks 145, 150, 155, 160 extend partially into the interior of the carrier 115.

[0049] The operating parameters may for example be the temperature of the high current contact device 10 and / or the current transmitted through the high current contact device 10 and / or the power of the first contact arrangement 20 and / or the second contact arrangement 50. For example, the functionality, e.g. the polarity of the contact elements 25, 55, 75, 90, 95 may also be checked and corresponding information may be provided to the second data contact device 70 by the electrical circuit 165.

[0050] In the carrier 115, a respective feedthrough 175 is arranged for each contact element 25, 55, 75, 90, 95 and data contact 40, 45. The feedthrough 175 is designed like a bore. The associated contact element 25, 55, 75, 90, 95 or, respectively, the associated data contact 40, 45 extends through the feedthrough 175 along the mating axis 110. In this case, the feedthrough 175 opens into the contact receptacle 120 at the second end face 240. The contact elements 25, 55, 75, 90, 95 and the data contacts 40, 45 protrude beyond the carrier 115 on both sides.

[0051] The carrier 115 of the circuit carrier 30 is integrally formed from the same material. It is particularly advantageous if the carrier 115 has a first portion 180, a second portion 185, and a connecting portion 190. The first portion 180 and the second portion 185 extend in different yz planes that are offset in the x direction. For example, the first portion 180 in FIG. 3 is offset from the second portion 185 in the x direction, away from the viewer. The first portion 180 and the second portion 185 are of a generally flat design.

[0052] The connecting portion 190 is disposed between the first portion 180 and the second portion 185 and connects the first portion 180 to the second portion 185. The connecting portion 190 is designed to be obliquely inclined relative to the first portion 180 and the second portion 185.

[0053] Furthermore, the carrier 115 may have at least one reinforcing rib 195. For example, the reinforcing rib 195 is arranged on the first portion 180 between the first contact element 25 and the third contact element 75. In this case, for example, the reinforcing rib 195 extends in the xz plane. A collar 200 may also be arranged circumferentially on the first portion 180, protruding beyond the first portion 180 in the x direction and arranged on the second portion 185 side.

[0054] The reinforcing ribs 195 terminate on one side in the collar 200 and on the other side in the connecting portion 190. The collar 200 and the reinforcing ribs 195 reinforce the carrier 115 in the first portion 180 and the connecting portion 190. As a result, the mating force when inserting the high-current contact device 10 into the further high-current contact device 85 can be particularly well supported, and deformation of the carrier 115 can be prevented.

[0055] Furthermore, the carrier 115 can have a first recess 205 in the second part 185. The first recess 205 is designed as a recess in the second part 185 and is connected to a side surface 201 of the carrier. The side surface 201 extends, for example, approximately in the xz direction. The first recess 205 receives the first data contact device 65 and is shaped accordingly. For example, the first recess 205 extends in the x direction toward the surface facing the contact receptacle 120.

[0056] The first conductor track 145 and the second conductor track 150 are also led from the data contacts 40, 45 through the second portion 185 into the first recess 205, and the first track 145 and the second conductor track 150 are electrically contacted in the first recess 205 via the first data contact device 65.

[0057] Adjacent to the side surface 201 of the carrier 115, the carrier 115 has a second recess 210. The second recess 210 is disposed perpendicular to the kink between the second portion 185 and the connecting portion 190 and extends in the x-direction toward the contact receptacle 120. The second recess 210 receives the second data contact device 70 and is designed to correspond to the second data contact device 70.

[0058] The data contact devices 65, 70 may be positioned in an optimal manner and are particularly easily accessible from the side of the contact housing by means of the first recess 205 and the second recess 210.

[0059] The high-current contact device 10 includes a respective seal sleeve 230 for each of the contact elements 25, 55, 75, 90, 95 and data contacts 40, 45. The seal sleeve 230 is made of a flexible matrix material, such as silicone and / or polyurethane and / or plastic. The seal sleeve 230 is materially bonded to the carrier 115 at the first end surface 135. The carrier 115 and the seal sleeve 230 are preferably manufactured using a two-component injection molding process.

[0060] The electrical circuit 165 may include a temperature measuring device 170. The temperature measuring device 170 may include at least one first temperature sensor 235. The first temperature sensor 235 is located physically distant from the first contact elements 25 in an area adjacent to the feedthrough 175 through which the first contact elements 25 extend. The first temperature sensor 235 may be embedded in, for example, the sealing sleeve 230. The sealing sleeve 230 preferably includes a matrix material with a specific filler material, which may be, for example, copper and / or aluminum and / or silver. The sealing sleeve 230 has a thermal conductivity of approximately 0.3 W / (m·K) to 2 W / (m·K), in particular 0.3 W / (m·K) to 1.7 W / (m·K). The sealing sleeve 230 thermally connects the first temperature sensor 235 to the first contact element 25. The first temperature sensor 235 is electrically connected to the second data contact device 70 by means of the third conductor track 155 and the fourth conductor track 160.

[0061] By designing the circuit carrier 30 as an injection-molded circuit carrier, the third conductor track 155 and the fourth conductor track 160 are led to the second recess 210 in the first end face 135 via the first portion 180 and the connecting portion 190. The second data contact device 70 contacts the third conductor track 155 and the fourth conductor track 160. The second data contact device 70 is also mechanically connected to the carrier 115 in the second recess 210.

[0062] The conductor tracks 145, 150, 155, 160 follow the contour of the carrier 115. In this case, the injection-molded design of the circuit carrier 30 not only allows the conductor tracks 145, 150, 155, 160 to be designed in one piece, as is the case with conventional printed circuit boards, but also allows the conductor tracks 145, 150, 155, 160 to follow the contour of the carrier 115. As a result, the circuit carrier 30 has a particularly flat and compact design.

[0063] Furthermore, the temperature measuring device 170 can have a second temperature sensor 245 and / or a third temperature sensor 250. The descriptions given in the context of the first temperature sensor 235 equally apply to the second 245 and third temperature sensor 250. The second temperature sensor 245 can be arranged, for example, in the region of the second contact arrangement 50 in the second part 185 of the carrier 115 and can be thermally connected to the second contact element 55, the fourth contact element 90, and the fifth contact element 95.

[0064] The third temperature sensor 250 can be disposed, for example, in a region 275 of the feedthrough 175 through which the third contact element 75 extends and can be thermally coupled to the third contact element 75. The sealing sleeve 230 over the third contact element 75 can also be disposed, in particular injection molded, on the carrier 115 such that the sealing sleeve 230 completely surrounds the third temperature sensor 250 on its periphery. As a result, the third temperature sensor 250 is embedded in the sealing sleeve 230, similar to how the first temperature sensor 235 is embedded in its associated sealing sleeve 230. As a result, the third temperature sensor 250 is particularly well thermally coupled to the third contact element 75.

[0065] The second temperature sensor 245 is also electrically connected via a conductor track (hidden in Figure 3) to the first data contact device 65. In a similar way, the third temperature sensor 250 can be electrically connected to the second data contact device 70 via a further conductor track 252 (not shown in Figure 3).

[0066] For example, when a current of at least 10 amperes, preferably at least 50 amperes, is sent through the first contact arrangement 20, the first contact arrangement 20 heats up. Thermal coupling of the first contact element 25 and the third contact element 75 via the associated sealing sleeve 230 enables the first temperature sensor 235 and the third temperature sensor 250 to measure the temperature of the associated first contact element 25 and the third contact element 75, respectively, and to provide corresponding temperature information to the second data contact device 70.

[0067] The temperature information about the temperatures of the first and third contact elements 25, 75 provided to the second data contact device 70 can be used, for example, when controlling a charging process, particularly a rapid charging process. By monitoring the temperatures of the first and third contact elements 25, 75, overheating of the first and third contact elements 25, 75 as well as overheating of the first part 180 of the carrier 115 arranged adjacent to the first and third contact elements 25, 75 can be prevented.

[0068] The temperature of the second contact arrangement 50 is also measured and corresponding temperature information is provided to the first data contact device 65. In particular, this temperature information can be used to prevent overheating of the second contact arrangement 50 during the transfer of electrical energy.

[0069] FIG. 4 is a cross-sectional view of the high current contact device 10 shown in FIG. 1 along section AA shown in FIG.

[0070] Each of the contact elements 25, 55, 75, 90, 95 and each of the data contacts 40, 45 has a respective contact portion 215, a sealing portion 220, and a connecting portion 225. The sealing portion 220 is disposed axially between the contact portion 215 and the connecting portion 225 with respect to the mating axis 110. The contact portion 215 allows the contact elements 25, 55, 75, 90, 95 to make electrical contact with the associated mating contact 80, or the data contacts 40, 45 to make electrical contact with the associated mating data contact. The sealing portion 220 is immediately adjacent to the contact portion 215 with respect to the mating axis 110. 4, a connecting portion 225 adjoins the sealing portion 220, and the contact elements 25, 55, 75, 90, 95 are connected to the associated electrical conductors of the high-current cable 105 or the data contacts 40, 45 via the connecting portion 225. The data contacts 40, 45 are connected to the data cable instead of the high-current cable 105 at the connecting portion 225.

[0071] The sealing sleeve 230 fluid-tightly surrounds the associated contact element 25, 55, 75, 90, 95 or the associated data contact 40, 45 with the sealing portion 220. The sealing sleeve 230 abuts with its outer peripheral surface 231 against the inner peripheral surface of the sealing area 232 of the contact receptacle 120. The sealing sleeve 230 thereby prevents the ingress of moisture and / or fluids into the housing interior 100 and thus corrosion of the high-current contact device 10.

[0072] The first contact arrangement 20 is arranged in the first portion 180. The second contact arrangement 50 and the data contact arrangement 35 are arranged in the second portion 185. The obliquely extending connecting portion 190 allows, for example, a physical offset of the first contact arrangement 20 relative to the second contact arrangement 50 and the data contact arrangement 35 in the longitudinal direction, so that in each case one free end of the contact elements 25, 55, 75, 90, 95 and the data contacts 40, 45 are arranged in approximately a common yz-plane 251. As a result, for example, the first contact element 25 and the third contact element 75 can be designed to be longer overall in the longitudinal direction than the second contact element 55, the fourth contact element 90, and / or the fifth contact element 95, and / or the data contacts 40, 45. This has the advantage that the first contact element 25 and the third contact element 75 can have an extended contact portion 215 in order to transmit particularly high currents between the first contact element 25 and the third contact element 75, respectively, and the associated mating contact 80.

[0073] FIG. 5 is a perspective view of carrier 115 of circuit carrier 30 shown in FIG.

[0074] For clarity, the contact arrangements 20, 50, the data contact arrangement 35, and the sealing sleeve 230 have been omitted from FIG.

[0075] The carrier 115 illustratively has a retention structure 255 adjacent to the feedthroughs 175. The retention structure 255 may be disposed on each of the feedthroughs 175 or on only some of the feedthroughs 175. The retention structure 255 is disposed on the feedthroughs 175 circumferentially about the mating axis 110. The retention structure 255 may have a plurality of recesses 260 disposed circumferentially about the mating axis 110. The second temperature sensor 245 may be disposed on the first end face 135 at the center of the three feedthroughs 175 through which the second contact element 25, the fourth contact element 90, and the fifth contact element 95 extend. The recesses 260 are designed as passage openings and are designed in the shape of a portion of a ring, the recesses 260 being interrupted in each case by webs 265 which extend radially up to the feedthrough 175, the first temperature sensor 235 or the third temperature sensor 250 being arranged on one of the webs 265.

[0076] FIG. 6 shows a portion of the cross-sectional view shown in FIG.

[0077] In the feedthrough 175, the retaining structures 255 have respective grooves 266 formed circumferentially in the second end face 240. The grooves 266 circumferentially connect the recesses 260 to one another on the surface facing the second end face 240. When the sealing sleeve 230 is injection molded onto the carrier 115 by a two-component injection molding method, the recesses 260 and grooves 266 are filled by the matrix material (and possibly the filler material) of the sealing sleeve 230, which must be further hardened. The retaining structure 255 has the advantage that the sealing sleeve 230 is connected to the carrier 115 by a material bond and over a particularly large surface area. The sealing sleeve 230 is also connected to the carrier 115 by a form fit via the grooves 266 due to the undercuts in the webs 265. As a result, the sealing sleeve 230 is prevented from being undesirably torn off from the carrier 115 when inserting the associated contact element 25, 55, 75, 90, 95 or data contact 40, 45 into the associated feedthrough 175.

[0078] 7 to 12 show a portion of the high-current contact device 10 shown in FIGS. 1 to 6, in each case after a manufacturing step.

[0079] In a first manufacturing step (see FIG. 7), the carrier 115 is manufactured using injection molding, whereby the retaining structure 255 can also be extruded axially along the mating axis 110 at the feedthrough 175, in contrast to the design shown in FIGS.

[0080] In a second manufacturing step (see FIG. 8), which preferably follows the first manufacturing step, the first end face 135 is surface treated in at least some areas, for example by laser. The treatment is carried out so that tracks 270 are formed on the first end face 135. The tracks 270 determine the subsequent contours of the conductor tracks 145, 150, 155, 160, 252 and the fixing areas 275 for fixing the temperature sensors 235, 245, 250.

[0081] In a third manufacturing step (see Figure 9) following the second manufacturing step, the carrier 115 is galvanized and the metal evaporated to form the conductor tracks 145, 150, 155, 160, 252 is evaporated onto the tracks 270 and the fixing areas 275 produced in the second manufacturing step.

[0082] In a fourth manufacturing step (see FIG. 10), which is carried out after the third manufacturing step, the components of the electrical circuit 165 are positioned on the associated conductor tracks 145, 150, 155, 160, 252 and soldered thereto, for example by a reflow soldering method. The data contact devices 65, 70 are likewise positioned on the fixing areas 275 and soldered thereto.

[0083] In a fifth manufacturing step (see FIG. 11 ) following the fourth manufacturing step, the seal sleeves 230 are injection molded onto the carrier 115 by a two-component injection molding method and cured. Here, the shapes of the individual seal sleeves 230 are designed so that they are arranged adjacent to each other at a distance in the y direction without touching each other. This has the advantage that less material is consumed for manufacturing the seal sleeves 230 and that the mold for forming the seal sleeves 230 can sufficiently engage between the individual seal sleeves 230.

[0084] Furthermore, when the carrier 115 is injection molded onto the second end face 240, a reinforcing structure 280 can be formed to the design shown in Figures 1 to 6. The reinforcing structure 280 serves to reduce bending during assembly of the data contact devices 65, 70, thereby reducing deformation of the conductor tracks 145, 150, 155, 160, 252. As a result, damage to the conductor tracks 145, 150, 155, 160, 252 can be prevented.

[0085] 1-12 has the advantage that the number of parts in the high-current contact device 10 is significantly reduced. Reliable and simple sealing of the housing interior 100 of the contact housing 15 is ensured by the sealing sleeve 230 on each of the data contacts 40, 45 and / or contact elements 25, 55, 75, 90, 95. Complex manual assembly, particularly for the data contacts 40, 45, required to thread the cable through the seal is also avoided.

[0086] The high-current contact device 10 shown in Figures 1 to 12 is particularly suitable for fully automated manufacturing and wiring. Assembly costs are also reduced by introducing the circuit carrier 30 into the housing interior 100, resulting in particularly short assembly times. Overall, assembly time savings of more than 50 percent are realized compared to known high-current contact devices. [Explanation of symbols]

[0087] 10 High Current Contact Device 15 Contact housing 20 first contact arrangement portion 25 First Contact Element 30 Circuit Carrier 35 Data contact placement section 40 First Data Contact 45 Second Data Contact 50 second contact arrangement 55 Second Contact Element 60 Data Interface 65 First Data Contact Device 70 Second data contact device 75 Third Contact Element 80 Counterpart Contact 85 Further high current contact devices 90 Fourth Contact Element 95 Fifth Contact Element 100 Inside the housing 105 High Current Cable 110 Mating shaft 115 Career 120 Contact Receptacle 135 first end face 140 Data Connected Devices 145 First Conductor Track 150 Second Conductor Track 155 Third Conductor Track 160 4th conductor track 165 Electrical Circuits 170 Temperature measuring devices 175 Feedthrough 180 First Part 185 Second Part 190 Connection part 195 Reinforcing rib 200 colors 201 First Aspect (of Career) 205 First Hole 210 Second Hole 215 Contact part 220 Seal part 225 Connection 230 Seal sleeve 231 Outer surface 232 Seal Area 235 First Temperature Sensor 240 Second end face 245 Second Temperature Sensor 250 Third Temperature Sensor 251 Common aspect 252 More Conductor Tracks 255 Retention structure 260 recess 265 Web 266 Groove 270 trucks 275 Fixed area 280 Reinforcement Structure

Claims

1. A high current contact device (10) for a motor vehicle or a charging station, said high current contact device (10) comprising: at least one first contact element (25) designed to transmit electrical energy; a circuit carrier (30); - at least one first data contact (40) for transmitting a data signal; - at least one data interface (60), the first contact element (25) extends through the circuit carrier (30) along a mating axis (110) at a feedthrough (175); a conductor track (145) of the circuit carrier (30) electrically connecting the first data contact (40) to the data interface (60); a carrier (115) of the circuit carrier (30) is injection molded and mechanically supports the first data contacts (40), the conductor tracks (145) and the data interface (60); The carrier (115) has a first portion (180) and a second portion (185) connected to the first portion (180); the feedthrough (175) is disposed in the first portion (180); the carrier (115) is integrally formed from the same electrically insulating material; the second portion (185) of the carrier (115) is positioned offset from the first portion (180) of the carrier (115) with respect to the mating axis (110); The high current contact device (10) has a second contact element (55) designed to transmit electrical energy, the second contact element (55) is of a different design than the first contact element (25); the first data contact (40) and the second contact element (55) are disposed on the second portion (185) of the carrier (115); A high current contact device (10).

2. The high current contact device (10) has a contact housing (15) defining a housing interior (100); the first data contact (40), the circuit carrier (30), and the first contact element (25) are disposed within the housing interior (100); The data interface (60) extends laterally through the contact housing (15) in a plane inclined relative to the mating axis (110). The high current contact device (10) of claim 1.

3. A connecting portion (190) for connecting the first portion (180) and the second portion (185) of the carrier (115) is disposed between the first portion (180) and the second portion (185), The connecting portion (190) is designed to be obliquely inclined relative to the first portion (180) and the second portion (185). A high current contact device (10) according to claim 1 or 2.

4. A direct current is transmitted by the first contact element (25), and an alternating current is transmitted by said second contact element (55); A high current contact device (10) according to any one of claims 1 to 3.

5. The carrier (115) has at least one reinforcing rib (195); The reinforcing rib (195) extends along the mating axis (110). A high current contact device (10) according to any one of claims 1 to 4.

6. The high current contact device (10) has at least one sealing sleeve (230), The sealing sleeve (230) is fixed to the circuit carrier (30), and the mating shaft (175) adjacent to said feedthrough in an axial direction with respect to (110); The sealing sleeve (230) is in fluid-tight engagement around the first contact element (25). A high current contact device (10) according to any one of claims 1 to 5.

7. The sealing sleeve (230) is connected to the circuit carrier (30) by material bonding or by form-fitting. The high current contact device (10) of claim 6.

8. The carrier (115) has a retaining structure (255) in the feedthrough (175) including at least one recess (260) and a web (265) defining the recess (260); The sealing sleeve (230) closes the recess (260), and the web (265) is embedded in at least a region of the sealing sleeve (230). A high current contact device (10) according to claim 6 or 7.

9. An electrical circuit (165) is disposed on the circuit carrier (30); The electrical circuit (165) is designed to identify information about the operating parameters of the high current contact device (10); the circuit carrier (30) is designed to electrically connect the electric circuit (165) to the data interface (60) by means of further conductor tracks (155, 160) and to provide the information to the data interface (60); A high current contact device (10) according to any one of claims 1 to 8.

10. the electrical circuit (165) has at least one temperature measuring device (170) including at least one temperature sensor (235, 245, 250); the temperature sensor (235, 245, 250) is designed to measure the temperature of the first contact element (25) as an operating parameter; The high current contact device (10) of claim 9.

11. The high current contact device (10) has at least one sealing sleeve (230), The sealing sleeve (230) is fixed to the circuit carrier (30), and the mating shaft (175) adjacent to said feedthrough in an axial direction with respect to (110); The sealing sleeve (230) is fluid-tightly engaged around the first contact element (25); The temperature sensors (235, 245, 250) are embedded in the sealing sleeve (230); the sealing sleeve (230) is of a thermally conductive design and thermally connects the temperature sensor (235, 245, 250) to the first contact element (25); The high current contact device (10) of claim 10.

12. The sealing sleeve (230) is made of at least one of the following materials: copper, aluminum, aluminum oxide, aluminum nitrate, silicon oxide, silicon nitrate, boron nitride, plastic, heat-resistant plastic, silicone, polyurethane. The high current contact device (10) of claim 11.

13. The sealing sleeve (230) is injection molded, and the temperature sensors (235, 245, 250) are connected to the sealing sleeve (230) by material bonding. A high current contact device (10) according to claim 11 or 12.

Images