Probe unit manufacturing method, probe unit, probe mounting body, and electrical testing device

Abstract

A method for manufacturing a probe unit according to an embodiment of the present invention is for manufacturing a probe unit that is to be installed on an electrical inspection device for inspecting electrical characteristics of an electronic circuit board and that includes a probe pin 11 that can contact the surface of the electronic circuit board, the method comprising using a pedestal 10 having an alignment mechanism that determines the position in the electrical inspection device, adjusting the relative position and orientation of the tip of the probe pin 11 with respect to the pedestal 10, and fixing the probe pin 11 to the pedestal 10 while maintaining the relative position.

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a probe unit, a probe unit, a probe mounting body, and an electrical inspection device. [Background technology]

[0002] Electrical testing equipment is used to test the electrical characteristics of printed circuit boards. A known example of this electrical testing equipment is one equipped with a probe pin that can contact the surface of an electronic circuit board and a microscope that can magnify and observe the area around the tip of the probe pin (see Japanese Patent Laid-Open Publication No. 4-158541).

[0003] In this conventional electrical testing device, after the probe pin is brought close to the surface of the electronic circuit board, the tip of the probe pin is observed under a microscope and aligned so that it properly contacts the designated electrode on the electronic circuit board. In this electrical testing device, a two-wire probe is attached via an attachment to the tip of a positioner that is responsible for this alignment, and the attachment has a rotation mechanism that rotates the two-wire probe around a vertical line. This rotation mechanism enables accurate and highly efficient probing in this electrical testing device. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 4-158541 Summary of the Invention [Problem to be solved by the invention]

[0005] In the conventional electrical testing device, the alignment work is performed directly on the actual electronic circuit board mounted on the electrical testing device, which may result in the probe pins being pressed against the board, causing unnecessary damage to the board.

[0006] Furthermore, since the alignment is performed on the electrical inspection device, the electrical inspection device cannot perform electrical measurements, which is its original purpose, during that time, and this may result in a decrease in the availability of the device.

[0007] The present invention has been made based on the above circumstances, and aims to provide a method for manufacturing a probe unit, a probe unit, a probe mounting body, and an electrical testing device, in which the tips of the probe pins can be aligned with high precision and there is no need to align them on an electrical testing device. [Means for solving the problem]

[0008] A method for manufacturing a probe unit according to one aspect of the present invention is a method for manufacturing a probe unit that is mounted on an electrical testing device that tests the electrical characteristics of an electronic circuit board and has a probe pin that can contact the surface of the electronic circuit board, and uses a base having an alignment mechanism that determines its position in the electrical testing device, adjusts the relative position and attitude of the tip of the probe pin with respect to the base, and fixes the probe pin to the base while maintaining the relative position.

[0009] A probe unit according to another aspect of the present invention is a probe unit that can be mounted on an electrical testing device that tests the electrical characteristics of an electronic circuit board, and comprises a base having an alignment mechanism that determines its position in the electrical testing device, and a probe pin that is fixed to the base and can contact the surface of the electronic circuit board, and the base has a position adjustment mechanism that can adjust the position and attitude of the tip of the probe pin, and a fixing mechanism that can fix the position and attitude of the tip of the probe pin at a desired position.

[0010] A probe mounting body according to yet another aspect of the present invention is a probe mounting body that can be attached to an electrical testing device that tests the electrical characteristics of an electronic circuit board, and includes a probe unit and a probe mounting base to which the probe unit is fixed, the probe unit including a base having an alignment mechanism that determines its position in the electrical testing device, and a probe pin that is fixed to the base and can contact the surface of the electronic circuit board, and the probe mounting base includes an alignment target for the alignment mechanism.

[0011] An electrical testing device according to yet another aspect of the present invention is an electrical testing device for testing the electrical characteristics of an electronic circuit board, comprising a probe unit and an testing head to which the probe unit is fixed, the probe unit comprising a base having an alignment mechanism for determining its position in the electrical testing device, and a probe pin fixed to the base and capable of contacting the surface of the electronic circuit board, and the testing head comprising an alignment target for the alignment mechanism. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a schematic perspective view showing a probe unit according to one embodiment of the present invention. [Figure 2] FIG. 2 is a schematic enlarged view showing the tip portion of the probe pin of FIG. [Figure 3] FIG. 3 is a schematic perspective view showing a probe mounting body on which the probe unit of FIG. 1 is mounted. [Figure 4] FIG. 4 is a flow diagram showing a method for manufacturing a probe unit according to one embodiment of the present invention. [Figure 5] FIG. 5 is a schematic perspective view showing an alignment jig used when manufacturing the probing unit of FIG. [Figure 6] FIG. 6 is a schematic perspective view showing a state in which the probing unit of FIG. 1 is set on the alignment jig of FIG. [Figure 7] FIG. 7 is a schematic perspective view showing a probe unit according to an embodiment different from that shown in FIG. [Figure 8] FIG. 8 is a schematic partial perspective view showing the probe unit of FIG. 7 in the middle of its manufacture. DETAILED DESCRIPTION OF THE INVENTION

[0013] A method for manufacturing a probe unit according to one aspect of the present invention is a method for manufacturing a probe unit that is mounted on an electrical testing device that tests the electrical characteristics of an electronic circuit board and has a probe pin that can contact the surface of the electronic circuit board, and uses a base having an alignment mechanism that determines its position in the electrical testing device, adjusts the relative position and attitude of the tip of the probe pin with respect to the base, and fixes the probe pin to the base while maintaining the relative position.

[0014] In the probe unit manufacturing method of the present invention, the base has an alignment mechanism that determines its position on the electrical testing device, making it less likely for the base to shift position on the electrical testing device. Furthermore, in the probe unit manufacturing method, the relative position and orientation of the probe pin tips with respect to the base are adjusted and fixed. Therefore, when using this probe unit manufacturing method, simply by mounting the base on the electrical testing device, it is possible to align the probe pin tips in advance so that they can contact the surface of an electronic circuit board, eliminating the need to align the probe pin tips on the electrical testing device.

[0015] It is advisable to use an adhesive to fix the probe pin.

[0016] When adjusting the relative position and attitude of the tip of the probe pin, an alignment jig is used that can align and fix the base using the alignment mechanism, and the alignment jig preferably has a position adjustment mark for adjusting the relative position and attitude of the tip of the probe pin with respect to the base.

[0017] The position adjustment mark is an electrical pattern having a known impedance, and when adjusting the relative position and attitude of the tip of the probe pin, the relative position and attitude are adjusted so that the impedance measured by the probe pin approaches the known value.

[0018] The base has a position adjustment mechanism that can adjust the position and attitude of the tip of the probe pin, and a fixing mechanism that can fix the position and attitude of the tip of the probe pin at a desired position, and the alignment jig has a fine movement mechanism that controls the position adjustment mechanism, and when adjusting the relative position and attitude of the tip of the probe pin, the fine movement mechanism controls the position adjustment mechanism.

[0019] A probe unit according to another aspect of the present invention is a probe unit that can be mounted on an electrical testing device that tests the electrical characteristics of an electronic circuit board, and comprises a base having an alignment mechanism that determines its position in the electrical testing device, and a probe pin that is fixed to the base and can contact the surface of the electronic circuit board, and the base has a position adjustment mechanism that can adjust the position and attitude of the tip of the probe pin, and a fixing mechanism that can fix the position and attitude of the tip of the probe pin at a desired position.

[0020] A probe mounting body according to yet another aspect of the present invention is a probe mounting body that can be attached to an electrical testing device that tests the electrical characteristics of an electronic circuit board, and includes a probe unit and a probe mounting base to which the probe unit is fixed, the probe unit including a base having an alignment mechanism that determines its position in the electrical testing device, and a probe pin that is fixed to the base and can contact the surface of the electronic circuit board, and the probe mounting base includes an alignment target for the alignment mechanism.

[0021] The alignment target may be a protrusion protruding from the surface of the probe mounting base, and the alignment mechanism may be a recess or a through-hole that fits into the protrusion.

[0022] The base may have a position adjusting mechanism that can adjust the position and attitude of the tip of the probe pin, and a fixing mechanism that can fix the position and attitude of the tip of the probe pin at a desired position.

[0023] The probe unit may be configured to be detachable from the probe mounting base.

[0024] An electrical testing device according to yet another aspect of the present invention is an electrical testing device for testing the electrical characteristics of an electronic circuit board, comprising a probe unit and an testing head to which the probe unit is fixed, the probe unit comprising a base having an alignment mechanism for determining its position in the electrical testing device, and a probe pin fixed to the base and capable of contacting the surface of the electronic circuit board, and the testing head comprising an alignment target for the alignment mechanism.

[0025] The alignment target may be a protrusion protruding from the surface of the inspection head, and the alignment mechanism may be a recess or a through-hole that fits into the protrusion.

[0026] The base may have a position adjusting mechanism that can adjust the position and attitude of the tip of the probe pin, and a fixing mechanism that can fix the position and attitude of the tip of the probe pin at a desired position.

[0027] The probe unit may be configured to be detachable from the inspection head.

[0028] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Note that with respect to the numerical values ​​described in this specification, it is possible to adopt only one of the stated upper and lower limit values, or to arbitrarily combine the upper and lower limit values.

[0029] [First embodiment] A method for manufacturing a probe unit according to one embodiment of the present invention is a method for manufacturing a probe unit to be mounted on an electrical testing device that tests the electrical characteristics of an electronic circuit board. First, a probe unit manufactured by the method for manufacturing a probe unit, which is itself another embodiment of the present invention, will be described.

[0030] [Probe unit] 1 is a probe unit that can be mounted on an electrical testing device that tests the electrical characteristics of an electronic circuit board. The probe unit 1 includes a base 10 and a probe pin 11.

[0031] As shown in Figure 1, the base 10 has a rectangular, plate-shaped base 12 in a planar view, a first block 13 stacked on the base 12, a second block 14 stacked on the first block 13, a third block 15 stacked on the second block 14, and a fourth block 16 stacked on the third block 15.

[0032] The probe pins 11 are fixed to the base 10 and configured to be able to come into contact with the surface of the electronic circuit board. In the probe unit 1, the probe pins 11 are fixed to a fourth block 16 of the base 10. As shown in FIG. 2, the probe pins 11 have one signal probe 11a at their tips and a pair of ground probes 11b arranged to sandwich the signal probe 11a. These three probes in total come into contact with the surface of the electronic circuit board to inspect its electrical characteristics. Note that the number of probes is merely an example, and the number of probes is not limited to three in the present invention.

[0033] In the probe unit 1, the base 10 has an alignment mechanism that determines the position in the electrical testing device, a position adjustment mechanism that can adjust the position and attitude of the tip of the probe pin 11, and a fixing mechanism that can fix the position and attitude of the tip of the probe pin 11 at a desired position.

[0034] (Alignment mechanism) The alignment mechanism is configured in the base 12 of the pedestal 10, and specifically, the alignment mechanism is configured with a pair of through holes 12a as shown in Fig. 1. These through holes 12a are configured to fit into protrusions 21 of the probe mounting body 2, which will be described later, or protrusions of an electrical testing device. Note that the alignment mechanism may also be configured as recesses that fit into the protrusions, instead of the through holes 12a.

[0035] The alignment mechanism can also be realized with a single through-hole 12a. However, if realized with a single through-hole 12a, there is a risk that the base 10 may be prone to rotation even after alignment. One method of preventing rotation is to make the through-hole 12a polygonal (e.g., triangular or rectangular) in plan view, but it is preferable to provide multiple through-holes 12a. By providing multiple through-holes 12a, rotation of the base 10 can be more reliably prevented. In particular, it is more preferable that the alignment mechanism be a pair of through-holes 12a. If the base 10 is configured with three or more through-holes 12a, the base 10 becomes large, which may reduce the handleability of the probe unit 1.

[0036] However, simply fitting the base 10 into the protrusion may result in the base 10 coming off due to unavoidable circumstances during the inspection. Therefore, it is preferable that the base 10 has a mechanism for fixing the base 10 to prevent it from coming off the electrical inspection device, for example, by using a base fixing screw 12c.

[0037] (position adjustment mechanism) In the probe unit 1, the position adjustment mechanism is configured by combining a base 12 and a first block 13 to a fourth block 16. The configuration will be described below.

[0038] The base 12 is provided with a first rail portion 12b extending across the width on the side where the first block 13 is stacked, and the first block 13 is provided with a first notch 13a that fits into this first rail portion 12b. By fitting the two together, the first block 13 can move in the width direction of the base 12, and its position in the width direction relative to the base 12 can be adjusted. Because the second block 14 to the fourth block 16 are stacked directly or indirectly on the first block 13, the positions of the first block 13 to the fourth block 16 as a whole can be adjusted in the width direction relative to the base 12. As a result, the position of the probe pin 11 fixed to the fourth block 16 can also be adjusted in the width direction relative to the base 12.

[0039] A second rail portion 13b extending along the length of the base 12 is provided on the side of the first block 13 where the second block 14 is stacked, and a second notch 14a that fits into this second rail portion 13b is provided in the second block 14. By fitting the two together, the second block 14 can move along the length of the base 12, and its position in the length direction relative to the base 12 can be adjusted. Because the third block 15 and the fourth block 16 are stacked directly or indirectly on the second block 14, the positions of the second block 14 to the fourth block 16 as a whole can be adjusted along the length direction relative to the base 12. As a result, the position of the probe pin 11 fixed to the fourth block 16 can also be adjusted along the length direction relative to the base 12.

[0040] The second block 14 is provided with a protruding portion 14b that protrudes in the length direction of the base 12. A third block 15 is stacked on this protruding portion 14b. The stacking surface of the protruding portion 14b on which the third block 15 is stacked is arch-shaped with the center raised in the width direction of the base 12. The third block 15 is configured so that the stacking surface can slide in the width direction of the base 12, and sliding the third block 15 can tilt the third block 15 in the width direction of the base 12. This tilt rotates the probe pin 11 around its central axis via the fourth block 16, making it possible to adjust the contact state of the single signal probe 11a and the pair of ground probes 11b with the surface of the electronic circuit board (probe contact positions).

[0041] It is preferable that the central axis of the arch (the virtual central axis of the stacked surface) passes through the tip of the probe pin 11, is located on a plane parallel to the bottom surface of the base 12, and is arranged parallel to the rail of the second rail portion 13b. By configuring the stacked surface in this way, the contact state of the probe pin 11 can be adjusted around the tip of the probe pin 11, thereby reducing changes in the coordinate position of the tip of the probe pin 11. In other words, the coordinate position and contact state of the tip of the probe pin 11 can be adjusted independently, making it easy to adjust the position of the probe pin 11. Note that "tip" includes not only the exact tip position but also the vicinity thereof. Furthermore, "parallel" includes not only exact parallelism but also a case with an inclination of, for example, ±3 degrees or less.

[0042] With the above configuration, the probe pin 11 can be adjusted in the width direction and length direction relative to the base 12, and the state of contact with the surface of the electronic circuit board can be adjusted. Furthermore, if height adjustment is required relative to the base 12, this can be done by inserting an adjustment plate of the desired height between the third block 15 and the fourth block 16, for example.

[0043] (Fixing mechanism) The fixing mechanism is composed of fixing screws in the probe unit 1. Specifically, the fixing mechanism is composed of a first fixing screw 13c that fixes the first block 13 to the base 12, a second fixing screw 14c that fixes the second block 14 to the first block 13, a third fixing screw 15c that fixes the third block 15 to the second block 14, and a fourth fixing screw 16c that fixes the fourth block 16 to the third block 15.

[0044] For example, when the first fixing screw 13c is loosened, the position of the first block 13 becomes adjustable relative to the base 12, and when the first fixing screw 13c is tightened, the first block 13 is fixed to the base 12 so that it cannot move.

[0045] A plurality of each fixing screw may be provided depending on the size of the block to be fixed, etc. In the probe unit 1 shown in Fig. 1, two first fixing screws 13c are provided.

[0046] Since the position and attitude of the tip of the probe pin 11 of the probe unit 1 can be adjusted in advance, there is no need to adjust the position and attitude of the tip of the probe pin 11 again after mounting it on the electrical inspection device.

[0047] [Probe mounting body] As shown in Fig. 3, the probe unit 1 can be attached to an electrical inspection device via a probe mounting body 2. The probe mounting body 2 is another embodiment of the present invention.

[0048] The probe mounter 2 is a probe mounter that can be attached to an electrical testing device that tests the electrical characteristics of an electronic circuit board Y. The probe mounter 2 can be attached to a probe mounter attachment portion X of the electrical testing device, for example, as shown in FIG. 3, and can test the electrical characteristics of the electronic circuit board Y.

[0049] The probe mounting body 2 includes a probe unit 1 and a probe mounting base 20 to which the probe unit 1 is fixed.

[0050] <Probe unit> As described above, the probe unit 1 is the probe unit of the present invention shown in Fig. 1. That is, the probe unit 1 includes a base 10 having an alignment mechanism that determines a position in the electrical testing device, and probe pins 11 that are fixed to the base 10 and can contact the surface of the electronic circuit board Y. The base 10 also has a position adjustment mechanism that can adjust the position and attitude of the tip of the probe pin 11, and a fixing mechanism that can fix the position and attitude of the tip of the probe pin 11 at a desired position. The alignment mechanism, the position adjustment mechanism, and the fixing mechanism can be configured in the same way as the probe unit 1 shown in Fig. 1, so detailed description thereof will be omitted.

[0051] Since the probe unit 1 allows for easy fine adjustment of the position and posture of the tip of the probe pin 11, it is possible to perform highly accurate and efficient adjustment of the relative position and posture in the probe mounting body 2, and ultimately in the electrical inspection device.

[0052] The probe units 1 are preferably configured to be detachable from the probe mounting base 20. For example, the probe mounting body 2 shown in FIG. 3 can mount up to 12 probe units 1, of which six are mounted in FIG. 3. If the probe units 1 are detachable, it is possible to change the mounting positions and number of the probe units 1 according to the configuration of the electronic circuit board Y while using the same probe mounting base 20. Therefore, one probe mounting body 2 can be used for multiple types of electronic circuit boards Y.

[0053] <Probe mounting base> The probe mounting base 20 is provided with an alignment target for the alignment mechanism. The alignment mechanism of the probe unit 1 shown in Fig. 1 is a through hole 12a, while the alignment target is a convex portion 21 protruding from the surface of the probe mounting base 20, as shown in Fig. 3, and the through hole 12a fits into this convex portion 21. By configuring the alignment mechanism and alignment target in this way, alignment can be easily achieved, and the probe unit 1 can be mounted on the probe mounting base 20 with high precision.

[0054] The probe mounting base 20 also has a screw hole 22 for fixing the probe unit 1. By fastening the base fixing screw 12c into this screw hole 22, the base 10 of the probe unit 1 is fixed to the probe mounting base 20, and it is possible to prevent the probe unit 1 from coming off the probe mounting base 20 due to an unavoidable force or the like during an inspection.

[0055] 3, in the probe mounting structure 2, the electronic circuit board Y is located on the side opposite to the side of the probe mounting base 20 on which the probe units 1 are mounted. For this reason, the probe mounting base 20 has access holes 23, and is configured so that the probe pins 11 pass through these access holes 23 and come into contact with the surface of the electronic circuit board Y. Note that in the probe mounting structure 2 shown in FIG. 3, one access hole 23 is provided for each probe unit 1, but it is also possible to provide one access hole 23 for multiple probe units 1. In this case, the access hole 23 is provided across the multiple probe units 1, and multiple probe pins 11 pass through one access hole 23 in parallel.

[0056] When attaching the probe unit 1 of the present invention to an electrical inspection device, it is necessary for the device to have an alignment target for the alignment mechanism. However, by attaching the probe unit 1 to the electrical inspection device via the probe mounting body 2, it becomes possible to mount the probe unit 1 of the present invention on an existing electrical inspection device that does not have an alignment target.

[0057] [Method for manufacturing probe unit] The method for manufacturing the probe unit is a method for manufacturing a probe unit having probe pins 11 that can come into contact with the surface of an electronic circuit board, and uses a base 10 having an alignment mechanism that determines the position in the electrical testing device.

[0058] As shown in FIG. 4, the method for manufacturing the probe unit includes adjusting the relative position and posture of the tip of the probe pin 11 with respect to the base 10 (S1), and fixing the probe pin 11 to the base 10 while maintaining the relative position (S2).

[0059] <s1> In the manufacturing method of the probe unit, as shown in Figures 5 and 6, when adjusting the relative position and attitude of the tip of the probe pin 11, an alignment jig 3 is used that can align and fix the base 10 using the alignment mechanism.

[0060] The alignment jig 3 has a jig base 30, an alignment target (convex portion 31) for the alignment mechanism of the probe unit 1, a fine movement mechanism (first micrometer 33, second micrometer 34, and third micrometer 35) for controlling the position adjustment mechanism of the probe unit 1, and a position adjustment mark 36 for adjusting the relative position and attitude of the tip of the probe pin 11 with respect to the base 10 (alignment mechanism of the base 10).

[0061] (Alignment target) The alignment target is a replica of the alignment target used when the probe unit 1 is mounted on an electrical testing device. For example, when the probe unit 1 manufactured by the probe unit manufacturing method is mounted on the probe-mounted body 2 shown in Fig. 3, the alignment target provided on the alignment jig 3 has the same configuration as the alignment target provided on the probe-mounted body 2. That is, the alignment target provided on the alignment jig 3 is a convex portion 31 protruding from the surface of the jig base 30, and the through-hole 12a fits into this convex portion 31. Furthermore, since the probe-mounting base 20 has a screw hole 22 for fixing the probe unit 1, the jig base 30 is also provided with a screw hole 32 for fixing the probe unit 1.

[0062] (Fine movement mechanism) 5 and 6, the fine movement mechanism is composed of a first micrometer 33, a second micrometer 34, and a third micrometer 35. In the method for manufacturing the probe unit, the fine movement mechanism controls the position adjustment mechanism when adjusting the relative position and attitude of the tip of the probe pin 11. By using the fine movement mechanism in this way, it is easy to finely adjust the position and attitude of the tip of the probe pin 11, and therefore the adjustment of the relative position and attitude can be performed highly accurately and efficiently.

[0063] The tip of the first micrometer 33 is in contact with the side surface of the first block 13 of the base 10 of the probe unit 1, and can push the first block 13 in the width direction of the base 12. This allows the tip of the probe pin 11 to be slightly moved in the width direction of the base 12.

[0064] The tip of the second micrometer 34 is in contact with the rear surface of the second block 14 of the base 10 of the probe unit 1, and can push the second block 14 in the lengthwise direction of the base 12. This allows the tip of the probe pin 11 to be slightly moved in the lengthwise direction of the base 12.

[0065] The tip of the third micrometer 35 contacts the side surface of the third block 15 of the base 10 of the probe unit 1, and can push the third block 15 in the width direction of the base 12. As described above, the stacking surface of the protruding portion 14b on which the third block 15 is stacked has an arch shape with the center raised in the width direction of the base 12, so that when the third micrometer 35 pushes the third block 15, the probe pin 11 can be rotated around its central axis.

[0066] As described above, by using the fine movement mechanism, the relative positions of the tips of the probe pins 11 can be adjusted using the first micrometer 33 and the second micrometer 34, and the attitude of the tips of the probe pins 11 can be adjusted using the third micrometer 35. In the embodiment shown in FIG. 1, each micrometer is configured to be adjusted by pushing each block, but each micrometer can also have a structure that can be pushed and pulled. By adopting a structure that can be pushed and pulled, position adjustment can be made even easier.

[0067] (Position adjustment mark) The position adjustment marks 36 are arranged so that their relative positions as seen from the alignment target are the same as the relative positions of the probe contact positions on the surface of the electronic circuit board as seen from the alignment target in the electrical testing device. By arranging them in this manner, if the probe unit 1 in which the relative positions and attitudes of the tips of the probe pins 11 have been adjusted so that the probe pins 11 properly contact the position adjustment marks 36 on the alignment jig 3 are mounted on the electrical testing device, the probe pins 11 will properly contact the surface of the electronic circuit board without further adjustment of their position or attitude. Therefore, by using the alignment jig 3, the tips of the probe pins 11 can be aligned with high precision before the probe unit 1 is mounted on the electrical testing device.

[0068] As shown in Figure 2, a position adjustment mark 36 is prepared for each probe. The smaller the size of the position adjustment mark 36, the higher the adjustment accuracy, but on the other hand, if it is too small, the adjustment itself becomes difficult. For this reason, the smallest adjustable size is used for the position adjustment mark 36. For example, the position adjustment mark 36 can be rectangular with a width of 0.1 mm to 0.2 mm and a length of 0.3 mm to 0.5 mm.

[0069] In S1, the relative position and posture of the tip of the probe pin 11 are adjusted so that the tip of the probe pin 11 properly contacts the position adjustment mark 36, and this adjustment can be performed while visually observing the tip of the probe pin 11 with a microscope, for example.

[0070] For even higher precision adjustment, an electrical pattern having a known impedance can be used as the position adjustment mark 36. In this case, when adjusting the relative position and attitude of the tip of the probe pin 11, it is advisable to adjust the relative position and attitude so that the impedance measured by the probe pin 11 approaches the known value.

[0071] When a known impedance is measured using a probe unit 1 whose relative position and posture are adjusted correctly, the measurement result should be a known value. By utilizing this principle and adjusting the relative position and posture so that the impedance approaches the known value, it is believed that high precision adjustment can be ensured.

[0072] The electrical pattern can be one type, but more precise adjustment can be achieved by preparing multiple types and sequentially switching between these multiple types of electrical patterns to check the impedance measured by the probe pins 11. When multiple types of electrical patterns are used, the relative position and posture may be adjusted using the first electrical pattern, and the second and subsequent electrical patterns may be used to verify the probe unit 1 after the probe pins 11 are fixed to the base 10 (S2).

[0073] When adjusting the relative position and attitude of the tip of the probe pin 11 with respect to the base 10, the first fixing screw 13c to the fourth fixing screw 16c, which are the fixing mechanism of the probe unit 1, are loosened.

[0074] <s2> The probe pins 11 can be fixed to the base 10 by tightening the first fixing screw 13c to the fourth fixing screw 16c, which are the fixing mechanism of the probe unit 1. By fixing the probe unit 1 to the base 10, fluctuations in the relative position and posture of the probe pins 11 can be prevented even when the probe unit 1 is removed from the alignment jig 3. Therefore, when the probe unit 1 is mounted on an electrical inspection device, it can be properly brought into contact with the surface of the electronic circuit board without having to adjust the position and posture again.

[0075] In this manner, the probe unit 1 in which the relative positions and attitudes of the probe pins 11 are adjusted can be manufactured.

[0076] [Second embodiment] Another embodiment of the present invention relates to a method for manufacturing a probe unit, which is mounted on an electrical testing device that tests the electrical characteristics of an electronic circuit board and has a probe pin 11 that can contact the surface of the electronic circuit board. As shown in Figures 7 and 8, a base 17 having an alignment mechanism that determines the position in the electrical testing device is used, and as shown in Figure 4, the relative position and attitude of the tip of the probe pin 11 with respect to the base 17 is adjusted (S1), and the probe pin 11 is fixed to the base 17 while maintaining the relative position (S2).

[0077] <Probe unit> The probe unit 4 shown in Fig. 7 is manufactured by the probe unit manufacturing method. Like the probe unit 1 of the first embodiment, the probe unit 4 can be attached to an electrical inspection device via a probe mounting body or directly.

[0078] 7, the base 17 is integrally formed. Note that although the base 17 of the probe unit 4 may be composed of multiple blocks, the relative positions of the multiple blocks are fixed.

[0079] The positioning mechanism of the base 17 is composed of a pair of through holes 12a, as shown in Fig. 7. The base 17 also has a mechanism for fixing the base 17 with a base fixing screw 12c so that it does not come off the electrical inspection device. The through holes 12a and the base fixing screw 12c can be configured in the same way as the probe unit 1 of the first embodiment, so detailed description will be omitted.

[0080] As shown in FIG. 7, the probe unit 4 includes a plurality of probe pins 11 (three in FIG. 7), and is fixed to a base 17 by an adhesive layer .

[0081] <s1> In the method for manufacturing the probe unit, a manipulator or the like is used to position the multiple probe pins 11 so that the relative position of the tip of the probe pin 11 with respect to the alignment mechanism is the same as the relative position of the needle contact position on the surface of the electronic circuit board as seen from the alignment target in the electrical inspection device.

[0082] For this alignment, an alignment jig can be used as in the first embodiment. The alignment jig has a jig base, an alignment target for the alignment mechanism of the probe unit 4, and position adjustment marks for adjusting the relative position and attitude of the tip of the probe pin 11. Note that the alignment jig does not require a fine movement mechanism. The other configurations can be configured in the same way as the alignment jig 3 of the first embodiment, so detailed explanations will be omitted.

[0083] When a manipulator is used, it is also possible to use a method in which the coordinates of the alignment mechanism, for example, the coordinates of the center of the through-hole 12a, are recognized and the tip of the probe pin 11 is controlled to be at a desired position and angle using these coordinates as a starting point. In this case, an alignment jig is not required.

[0084] 8, slide rails 17a for guiding the probe pins 11 may be provided at the portions of the base 17 where the probe pins 11 are fixed. The number of slide rails 17a provided is the same as the number of probe pins 11. In other words, one slide rail 17a is provided for one probe pin 11. By providing the slide rails 17a in this manner, the relative positions and attitudes of the tips of a plurality of probe pins 11 can be adjusted simultaneously and with high precision.

[0085] <s2> In the method for manufacturing the probe unit, an adhesive is used to fix the probe pins 11. When one probe unit 4 includes a plurality of probe pins 11, as in the probe unit 4 shown in FIG. 7, the distance between the probe pins 11 tends to be narrow. When the distance between adjacent probe pins 11 is narrow, for example, when attempting to fasten the probe pins 11 by screws, it may be difficult to firmly fix the individual probe pins 11. In contrast, by using an adhesive, the probe pins 11 can be easily fixed even when the distance between adjacent probe pins 11 is narrow.

[0086] The adhesive is preferably an instant adhesive. By using an instant adhesive as the adhesive, the time for maintaining the relative position can be shortened, and the occurrence of positional deviation of the probe pin 11 can be prevented. In particular, a UV-curable instant adhesive is more preferable as the adhesive. Since the start of curing of a UV-curable instant adhesive can be controlled by UV irradiation, the probe pin 11 can be quickly fixed after the relative position and attitude of the tip of the probe pin 11 have been adjusted.

[0087] [Other embodiments] The above-described embodiments do not limit the configuration of the present invention. Therefore, the above-described embodiments may include omissions, substitutions, or additions of components based on the description in this specification and common general technical knowledge, and all of these should be construed as falling within the scope of the present invention.

[0088] In the first embodiment, the pedestal is described as being composed of a plate-shaped base that is rectangular in plan view and the first to fourth blocks, but this configuration and the shapes of each part are not limited to the above. Other configurations may be adopted as long as the pedestal has an alignment mechanism that determines the position in the electrical inspection device, a position adjustment mechanism that can adjust the position and attitude of the tip of the probe pin, and a fixing mechanism that can fix the position and attitude of the tip of the probe pin at a desired position.

[0089] In the above embodiment, the alignment target is a protrusion protruding from the surface of the probe mounting base or the electrical testing device, and the alignment mechanism of the probe unit is a recess or a through-hole that fits into the protrusion, but other configurations may also be adopted. For example, the alignment mechanism of the probe unit may be a protrusion, and the alignment target of the probe mounting base or the electrical testing device may be a recess.

[0090] In the above embodiment, the fixing mechanism is configured by a fixing screw, but the fixing mechanism is not limited to this. Other fixing mechanisms include a pressing fixing mechanism using an eccentric cam, and a mechanism that combines a latch such as a claw with a spring pressing against the latch.

[0091] In the above embodiment, the probe unit of the present invention is described as being attached to an electrical testing apparatus via a probe mounter, but the probe unit of the present invention can also be attached directly to the electrical testing apparatus. An electrical testing apparatus to which the probe unit of the present invention is directly attached is also another embodiment of the present invention. That is, an electrical testing apparatus according to another embodiment of the present invention is an electrical testing apparatus for testing the electrical characteristics of an electronic circuit board, and includes a probe unit and a testing head to which the probe unit is fixed, the probe unit includes a base having an alignment mechanism that determines its position in the electrical testing apparatus, and probe pins that are fixed to the base and can contact the surface of the electronic circuit board, and the testing head includes an alignment target for the alignment mechanism.

[0092] In this electrical testing device, the probe unit is mounted directly on the electrical testing device without going through a probe mounting base or the like, thereby eliminating the effects of manufacturing tolerances of the probe mounting base or the like, and therefore making it less likely that errors will occur in the relative position and posture of the probe pins after adjustment.

[0093] It is preferable that the alignment target is a convex portion protruding from the surface of the inspection head, and the alignment mechanism is a concave portion or a through hole that fits into the convex portion. By configuring the alignment mechanism and alignment target in this manner, alignment can be easily performed, and the probe unit can be accurately mounted on the electrical inspection device.

[0094] It is preferable that the base has a position adjustment mechanism that can adjust the position and attitude of the tip of the probe pin, and a fixing mechanism that can fix the position and attitude of the tip of the probe pin at a desired position. That is, it is preferable that the configuration of the base is the same as that of the probe unit 1 shown in Fig. 1. The probe unit 1 shown in Fig. 1 allows easy fine adjustment of the position and attitude of the tip of the probe pin 11, and therefore allows for highly accurate and efficient adjustment of the relative position and attitude in the electrical inspection device.

[0095] It is preferable that the probe unit is configured to be detachable from the inspection head. If the probe unit is detachable, it is possible to change the mounting position and number of the probe unit according to the configuration of the electronic circuit board while using the same electrical inspection device. Therefore, one electrical inspection device can be used for multiple types of electronic circuit boards. [Industrial Applicability]

[0096] As described above, the probe unit manufacturing method, probe unit, probe mounting body, and electrical testing device according to one embodiment of the present invention enable the tip of the probe pin to be aligned with high precision, and there is no need to perform alignment on the electrical testing device. [Explanation of symbols]

[0097] 1, 4 Probe unit 10 Pedestal 11 probe pins 11a Signal Probe 11b Ground probe 12 base 12a Through hole 12b First rail section 12c Base fixing screw 13 Block 1 13a First notch 13b Second rail section 13c First fixing screw 14 Block 2 14a Second notch 14b Projection 14c Second fixing screw 15 Third Block 15c Third fixing screw 16 4th Block 16c 4th fixing screw 17 Pedestal 17a Slide rail 18 Adhesive layer 2 Probe mounting body 20 Probe mounting base 21 Convex part 22 screw holes 23 Access hole 3 Alignment jig 30 Jig base 31 Convex part 32 screw holes 33 1st micrometer 34 2nd micrometer 35 3rd micrometer 36 Position adjustment mark X Probe mounting unit mounting part Y Electronic Circuit Board

Claims

1. 1. A method for manufacturing a probe unit that is mounted on an electrical testing device that tests electrical characteristics of an electronic circuit board and has probe pins that can contact a surface of the electronic circuit board, comprising: a base having an alignment mechanism for determining a position in the electrical testing device; adjusting the relative position and attitude of the tip of the probe pin with respect to the base; Fixing the probe pin to the base while maintaining the relative position; When adjusting the relative position and attitude of the tip of the probe pin, an alignment jig is used that can align and fix the base by the alignment mechanism, the alignment jig has a position adjustment mark for adjusting the relative position and attitude of the tip of the probe pin with respect to the base, the alignment mark is an electrical pattern having a known impedance; A method for manufacturing a probe unit, the method comprising adjusting the relative position and attitude so that the impedance measured by the probe pin approaches the known value.

2. 1. A method for manufacturing a probe unit that is mounted on an electrical testing device that tests electrical characteristics of an electronic circuit board and has probe pins that can contact a surface of the electronic circuit board, comprising: a base having an alignment mechanism for determining a position in the electrical testing device; adjusting the relative position and attitude of the tip of the probe pin with respect to the base; Fixing the probe pin to the base while maintaining the relative position; When adjusting the relative position and attitude of the tip of the probe pin, an alignment jig is used that can align and fix the base by the alignment mechanism, the alignment jig has a position adjustment mark for adjusting the relative position and attitude of the tip of the probe pin with respect to the base, a position adjustment mechanism for adjusting the position and attitude of the tip of the probe pin; a fixing mechanism capable of fixing the position and posture of the tip of the probe pin at a desired position; and the alignment jig has a fine movement mechanism for controlling the position adjustment mechanism, A method for manufacturing a probe unit in which the position adjustment mechanism is controlled by the fine movement mechanism.

3. 3. The method for manufacturing a probe unit according to claim 1, wherein an adhesive is used to fix the probe pins.

4. A probe unit that can be mounted on an electrical testing device that tests electrical characteristics of an electronic circuit board, a base having an alignment mechanism for determining a position in the electrical testing device; a probe pin fixed to the base and capable of contacting the surface of the electronic circuit board; Equipped with The base is a position adjustment mechanism capable of adjusting the position and attitude of the tip of the probe pin; a fixing mechanism capable of fixing the position and posture of the tip of the probe pin at a desired position; and When adjusting the relative position and attitude of the tip of the probe pin, an alignment jig is used that can align and fix the base by the alignment mechanism, the alignment jig has a position adjustment mark for adjusting the relative position and attitude of the tip of the probe pin with respect to the base, the alignment mark is an electrical pattern having a known impedance; The probe unit adjusts the relative position and attitude so that the impedance measured by the probe pin approaches the known value.

5. A probe unit that can be mounted on an electrical testing device that tests electrical characteristics of an electronic circuit board, a base having an alignment mechanism for determining a position in the electrical testing device; a probe pin fixed to the base and capable of contacting the surface of the electronic circuit board; Equipped with The base is a position adjustment mechanism capable of adjusting the position and attitude of the tip of the probe pin; a fixing mechanism capable of fixing the position and posture of the tip of the probe pin at a desired position; and When adjusting the relative position and attitude of the tip of the probe pin, an alignment jig is used that can align and fix the base by the alignment mechanism, the alignment jig has a position adjustment mark for adjusting the relative position and attitude of the tip of the probe pin with respect to the base, the alignment jig has a fine movement mechanism for controlling the position adjustment mechanism, A probe unit that controls the position adjustment mechanism by the fine movement mechanism.

6. A probe mounting body that can be attached to an electrical testing device that tests electrical characteristics of an electronic circuit board, A probe unit; a probe mounting base to which the probe unit is fixed; Equipped with The probe unit is a base having an alignment mechanism for determining a position in the electrical testing device; a probe pin fixed to the base and capable of contacting the surface of the electronic circuit board; Equipped with the probe mounting base includes an alignment target of the alignment mechanism; When adjusting the relative position and attitude of the tip of the probe pin, an alignment jig is used that can align and fix the base by the alignment mechanism, the alignment jig has a position adjustment mark for adjusting the relative position and attitude of the tip of the probe pin with respect to the base, the alignment mark is an electrical pattern having a known impedance; The probe mounter adjusts the relative position and attitude so that the impedance measured by the probe pin approaches the known value.

7. A probe mounting body that can be attached to an electrical testing device that tests electrical characteristics of an electronic circuit board, A probe unit; a probe mounting base to which the probe unit is fixed; Equipped with The probe unit is a base having an alignment mechanism for determining a position in the electrical testing device; a probe pin fixed to the base and capable of contacting the surface of the electronic circuit board; Equipped with the probe mounting base includes an alignment target of the alignment mechanism; a position adjustment mechanism for adjusting the position and attitude of the tip of the probe pin; a fixing mechanism capable of fixing the position and posture of the tip of the probe pin at a desired position; and When adjusting the relative position and attitude of the tip of the probe pin, an alignment jig is used that can align and fix the base by the alignment mechanism, the alignment jig has a position adjustment mark for adjusting the relative position and attitude of the tip of the probe pin with respect to the base, the alignment jig has a fine movement mechanism for controlling the position adjustment mechanism, The probe mounter controls the position adjustment mechanism by the fine movement mechanism.

8. the alignment target is a protrusion protruding from a surface of the probe mounting base, 8. The probe mounting assembly according to claim 6, wherein the alignment mechanism is a recess or a through-hole that fits into the protrusion.

9. The base is a position adjustment mechanism capable of adjusting the position and attitude of the tip of the probe pin; a fixing mechanism capable of fixing the position and posture of the tip of the probe pin at a desired position; The probe mounting assembly according to claim 6 , comprising:

10. 8. The probe mounter according to claim 6, wherein the probe unit is configured to be detachable from the probe mount base.

11. An electrical testing device for testing electrical characteristics of an electronic circuit board, A probe unit; an inspection head to which the probe unit is fixed; Equipped with The probe unit is a base having an alignment mechanism for determining a position in the electrical testing device; a probe pin fixed to the base and capable of contacting the surface of the electronic circuit board; Equipped with the inspection head includes an alignment target of the alignment mechanism; When adjusting the relative position and attitude of the tip of the probe pin, an alignment jig is used that can align and fix the base by the alignment mechanism, the alignment jig has a position adjustment mark for adjusting the relative position and attitude of the tip of the probe pin with respect to the base, the alignment mark is an electrical pattern having a known impedance; An electrical testing device that adjusts the relative position and orientation so that the impedance measured by the probe pin approaches the known value.

12. An electrical testing device for testing electrical characteristics of an electronic circuit board, A probe unit; an inspection head to which the probe unit is fixed; Equipped with The probe unit is a base having an alignment mechanism for determining a position in the electrical testing device; a probe pin fixed to the base and capable of contacting the surface of the electronic circuit board; Equipped with the inspection head includes an alignment target of the alignment mechanism; a position adjustment mechanism for adjusting the position and attitude of the tip of the probe pin; a fixing mechanism capable of fixing the position and posture of the tip of the probe pin at a desired position; and When adjusting the relative position and attitude of the tip of the probe pin, an alignment jig is used that can align and fix the base by the alignment mechanism, the alignment jig has a position adjustment mark for adjusting the relative position and attitude of the tip of the probe pin with respect to the base, the alignment jig has a fine movement mechanism for controlling the position adjustment mechanism, The electrical inspection device controls the position adjustment mechanism using the fine movement mechanism.

13. the alignment target is a convex portion protruding from a surface of the inspection head, 13. The electrical inspection device according to claim 11, wherein the alignment mechanism is a recess or a through hole that fits into the protrusion.

14. The base is a position adjustment mechanism capable of adjusting the position and attitude of the tip of the probe pin; a fixing mechanism capable of fixing the position and posture of the tip of the probe pin at a desired position; 12. The electrical testing device of claim 11, comprising:

15. 13. The electrical inspection device according to claim 11, wherein the probe unit is configured to be detachable from the inspection head.

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