Solder printing position measuring method, solder printing position measuring device, and printed circuit board product

Abstract

To provide a solder printing position measurement method capable of measuring a solder printing position without using any measuring device even before the solder melts after solder printing or after the solder melts after the reflow process.SOLUTION: A solder printing position measurement device measures a solder printing position by using a printed circuit board 1 with multiple pads 2 on which solder is printed and measurement pads 3 placed, and a metal mask 4 that has multiple openings 5, and an opening 6 for measurement placed at a first distance apart from the measurement pad 3 in the first direction. A solder printing position measurement method includes: a printing step of printing solder onto the printed circuit board 1 through multiple openings 5 of the metal mask 4 and the opening 6 for measurement after aligning the printed circuit board 1 and metal mask 4; and a measurement step of determining presence or absence of solder contact on the measurement pad 3 and measuring the print position in the first direction of the solder on the basis of the determination result.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a solder printing position measuring method for measuring solder printing positions on a printed circuit board, a solder printing position measuring device, and a printed circuit board product. [Background technology]

[0002] In reflow soldering, a printer prints cream solder onto the copper foil on a printed circuit board, then mounts the electronic components to be soldered on top of it, and the printed circuit board with the electronic components mounted is heated in a reflow furnace to melt the solder. If the solder printing position is off during this process, the soldering will not be performed properly, and defects such as short circuits, open circuits, and misaligned mounting will occur.

[0003] In Patent Document 1, in order to ascertain the printing position of the cream solder on the printed circuit board, a solder print inspection device is arranged after the cream solder is printed, and the solder printing position is measured. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 4-48248 Summary of the Invention [Problem to be solved by the invention]

[0005] The technology in Patent Document 1 requires a dedicated solder print inspection device to determine the solder print position, which has the problem of being costly. Also, Patent Document 1 is a technology that measures after solder printing before the solder melts, which has the problem of not being able to measure the solder print position after the solder melts in the reflow process.

[0006] The present disclosure has been made in view of the above, and provides a method for manufacturing a solder paste, whether before the solder melts after solder printing or after the solder melts after the reflow process.Dedicated solder print inspection The present invention aims to provide a method for measuring a solder printing position that can measure the solder printing position without using any device. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems and achieve the object, the solder printing position measuring method of the present disclosure measures the solder printing position using a printed circuit board on which a plurality of pads onto which solder is to be printed and first measurement pads are arranged, and a mask member having a plurality of openings arranged at positions corresponding to the plurality of pads, and a first measurement opening that, when aligned with the printed circuit board, is arranged a first distance in a first direction from the first measurement pads. The solder printing position measuring method includes a printing step of aligning the printed circuit board and the mask member and printing solder on the printed circuit board through the plurality of openings and the first measurement opening of the mask member, and a measurement step of determining whether or not the solder on the first measurement pads is in contact and measuring the solder printing position in the first direction based on the determination result. [Effects of the Invention]

[0008] According to the solder printing position measuring method of the present disclosure, whether before the solder melts after solder printing or after the solder melts after the reflow process, Dedicated solder print inspection This provides the effect of being able to measure the solder printing position without using any device. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view showing a configuration of a printed circuit board and the like for explaining a solder printing position measuring method according to a first embodiment. [Figure 2] 10A and 10B are diagrams showing the measurement pads and the printed solder paste before and after reflow when there is no misalignment between the printed circuit board and the metal mask in the first embodiment; [Figure 3]10A and 10B are diagrams showing the measurement pads and the printed solder paste before and after reflow when there is misalignment between the printed circuit board and the metal mask in the first embodiment; [Figure 4] 1 is a flowchart showing a solder printing position measuring method according to the first embodiment. [Figure 5] 10A and 10B are diagrams showing the measurement pads and the printed solder paste before and after reflow when there is no misalignment between the printed circuit board and the metal mask in the second embodiment. [Figure 6] 10A and 10B are diagrams showing the measurement pads and the printed solder paste before and after reflow when the metal mask is misaligned in the −X direction relative to the printed circuit board in the second embodiment; [Figure 7] 10A and 10B are diagrams showing the measurement pads and the printed solder paste before and after reflow when the metal mask is misaligned in the +X direction relative to the printed circuit board in the second embodiment; [Figure 8] 10 is a flowchart showing a solder printing position measuring method according to a second embodiment. [Figure 9] FIG. 10 is a diagram showing the state of the measurement pad and the printed cream solder before reflow when there is no misalignment between the printed circuit board and the metal mask in the third embodiment. [Figure 10] 10 is a flowchart showing a solder printing position measuring method according to a third embodiment. [Figure 11] 10A and 10B are diagrams showing a state of the measurement pad and the printed cream solder before reflow when there is no misalignment between the printed circuit board and the metal mask, and a state of the measurement pad and the printed cream solder before reflow in the fourth embodiment; [Figure 12] FIG. 10 shows a modified example of the fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, a solder printing position measuring method, a solder printing position measuring device, and a printed circuit board product according to embodiments will be described in detail with reference to the drawings.

[0011] Embodiment 1 FIG. 1 is a perspective view showing the configuration of a printed circuit board and the like for explaining the solder printing position measuring method of the first embodiment. In FIG. 1, printed circuit board 1 is provided with a plurality of pads 2 made of copper foil for mounting and soldering electronic components, which are mounted components. The pads 2 also include the concept of lands, which are copper foil around through holes or vias for attaching mounted components or for interlayer connection. Pads 2 also include pads or lands made of materials other than copper. The direction parallel to one side of printed circuit board 1 is defined as the X direction, and the direction perpendicular to the X direction is defined as the Y direction.

[0012] In FIG. 1, a metal mask 4 is shown as a masking member above a printed circuit board 1. The metal mask 4 has a plurality of openings 5 ​​for soldering at positions corresponding to the positions of the pads 2. The printed circuit board 1 and the metal mask 4 are aligned so that the openings 5 ​​overlap the pads 2, and then a printer prints cream solder onto each pad 2 through the openings of the openings 5. If there is no misalignment between the printed circuit board 1 and the metal mask 4, the cream solder is printed onto each pad 2. Then, a mounter mounts electronic components onto the printed circuit board 1 with the cream solder printed on each pad 2. The printed circuit board 1 with the mounted electronic components is then placed in a reflow furnace and heated to melt the solder, thereby performing soldering.

[0013] Here, misalignment measurement pads 3 are provided on the printed circuit board 1 as first measurement pads. Hereinafter, the misalignment measurement pads 3 will sometimes be simply referred to as measurement pads 3. The measurement pads 3 are arranged on the printed circuit board 1 in isolated locations where no wiring or electronic components are present, such as at the corners of the four sides. Furthermore, the metal mask 4 has misalignment measurement openings 6 as first measurement openings. Hereinafter, the misalignment measurement openings 6 will sometimes be simply referred to as measurement openings 6. The measurement openings 6 are not positioned so as to overlap the measurement pads 3 when the printed circuit board 1 and the metal mask 4 are aligned, but are positioned a predetermined distance away from the measurement pads 3 in the first direction. In the case of FIG. 1 , the measurement openings 6 are positioned a distance x1 away from the measurement pads 3 in the +X direction. Therefore, if there is no misalignment between the printed circuit board 1 and the metal mask 4, cream solder printing is performed through the measurement openings 6 at a position away from the measurement pads 3. The distance x1 corresponds to the first distance.

[0014] Next, a method for measuring the misalignment of printed solder paste using the misalignment measurement pads 3 and misalignment measurement openings 6 will be described. FIG. 2 illustrates the state of the measurement pads 3 and printed solder paste before and after reflow in the case where there is no misalignment between the printed circuit board 1 and the metal mask 4 in the first embodiment. The left side of FIG. 2 shows the state before reflow, and the right side of FIG. 2 shows the state after reflow. When the printed circuit board 1 and the metal mask 4 are aligned, the measurement pads 3 and the measurement openings 6 are spaced a distance x1 apart in the +X direction. Therefore, if there is no misalignment between the printed circuit board 1 and the metal mask 4, as shown in the left side of FIG. 2, the solder print 7 formed by the measurement openings 6 is printed a distance x1 apart from the measurement pads 3 in the +X direction. If the reflow process is performed in this state, the measurement pads 3 and the molten solder 8 will not come into contact with each other even after the solder melts, as shown in the right side of FIG. 2.

[0015] FIG. 3 illustrates the measurement pads 3 and the printed solder paste before and after reflow when there is misalignment between the printed circuit board 1 and the metal mask 4 in the first embodiment. The left side of FIG. 3 shows the state before reflow, and the right side of FIG. 3 shows the state after reflow. In FIG. 3, the metal mask 4 is misaligned in the -X direction relative to the printed circuit board 1. If there is a print misalignment in the -X direction of at least x1, the solder print 7 formed by the measurement opening 6 will contact the measurement pads 3, as shown in the left side of FIG. 3. If the reflow process is performed in this state, some of the molten solder 8 will remain on the measurement pads 3 even after the solder melts, as shown in the right side of FIG. 3. This indicates that the solder was in contact with the measurement pads 3 during solder printing, even after the solder melts.

[0016] FIG. 4 is a flowchart showing the solder-printing position measuring method according to the first embodiment. The processes in steps S11, S12, and S13 in FIG. 4 are executed by a determination unit (not shown). First, before reflow after solder printing, the measurement pads 3 and the solder-printed portion 7 formed by the measurement openings 6 are observed, or after reflow, the measurement pads 3 and the molten solder 8 formed by the measurement openings 6 are observed (Step S10). This observation may be visual or using an observation device such as a camera. Next, if the measurement is before reflow, the presence or absence of contact between the measurement pads 3 and the solder-printed portion 7 formed by the measurement openings 6 is measured, and if the measurement is after reflow, the presence or absence of contact between the measurement pads 3 and the molten solder 8 formed by the measurement openings 6 is measured (Step S11). If there is no contact (Step S11: No), it is determined that the deviation between them is less than distance x1 (Step S12). If there is contact (Step S11: Yes), it is determined that the deviation between them is distance x1 or more (Step S13).

[0017] In other words, whether the solder is melted after solder printing or after the solder is melted after the reflow process, it is possible to visually or by using an observation device to check whether there is contact between the measurement pad 3 and the solder at the measurement opening 6, and to determine whether there is a deviation of a distance x1 or more in the -X direction.

[0018] After the reflow process is completed, electronic components are mounted on the pads 2, and a printed circuit board product is manufactured as a finished product. In the printed circuit board product, which is a normal finished product with electronic components mounted on the pads 2 and wiring formed, solder is formed at a position a first distance away from the measurement pad 3 in a first direction. In the printed circuit board product, the measurement pad 3 is not connected to the electronic components and wiring, and the solder disposed the first distance away from the measurement pad 3 in the first direction is also not connected to the electronic components and wiring.

[0019] As described above, according to the first embodiment, the measurement pads 3 are provided on the printed circuit board 1, the measurement openings 6 are provided in the metal mask 4, and the measurement pads 3 and the measurement openings 6 are arranged at a predetermined distance x1. Then, by measuring whether or not there is contact between the measurement pads 3 and the measurement openings 6 and the solder, it is possible to determine whether the solder misalignment is less than the distance x1 or greater than the distance x1. Dedicated solder print inspection This allows the solder printing position to be measured even in printed circuit board assembly facilities that do not have the equipment.The solder printing position can also be measured before the solder melts after solder printing, or after the solder melts after the reflow process.

[0020] In addition, in embodiment 1, the direction in which the measurement pad 3 and the measurement opening 6 are separated may be the Y direction as long as it is a direction included in the XY plane, or any other direction including ±X direction components and ±Y direction components.

[0021] Embodiment 2 In the second embodiment, two measurement pads 3a and 3b are arranged at two locations, serving as first and second measurement pads, and a measurement opening 6 is arranged between the two measurement pads 3a and 3b at a distance from the measurement pads 3a and 3b. Specifically, when the printed circuit board 1 and the metal mask 4 are aligned, the measurement opening 6 is arranged in the +X direction from the measurement pad 3a at a first distance x2 and in the -X direction from the measurement pad 3b at a second distance x3. The + direction corresponds to the positive direction, and the - direction corresponds to the negative direction. FIG. 5 shows the measurement pads 3a and 3b and the printed solder paste before and after reflow when there is no misalignment between the printed circuit board 1 and the metal mask 4 in the second embodiment. The left diagram in FIG. 5 shows the state before reflow, and the right diagram in FIG. 5 shows the state after reflow.

[0022] When the printed circuit board 1 and metal mask 4 are aligned, measurement pad 3a and measurement opening 6 are separated by a distance x2 in the +X direction, and measurement pad 3b and measurement opening 6 are separated by a distance x3 in the -X direction. Therefore, if there is no misalignment between the printed circuit board 1 and metal mask 4, the solder print section 7 formed by measurement opening 6 will be printed at a distance x2 from measurement pad 3a in the +X direction and a distance x3 from measurement pad 3b in the -X direction, as shown in the left diagram of Figure 5. If the reflow process is performed in this state, the measurement pads 3a and 3b will not come into contact with the molten solder 8, even after the solder has melted, as shown in the right diagram of Figure 5.

[0023] FIG. 6 shows the measurement pads 3a and 3b and the printed solder paste before and after reflow when the metal mask 4 is misaligned in the -X direction relative to the printed circuit board 1 in the second embodiment. The left side of FIG. 6 shows the state before reflow, and the right side of FIG. 6 shows the state after reflow. When the printing position is misaligned in the -X direction by a distance of x2 or more, the solder print 7 formed by the measurement opening 6 comes into contact with the measurement pad 3a, as shown in the left side of FIG. 6. When the reflow process is performed in this state, a portion of the molten solder 8 remains on the measurement pad 3a even after the solder melts, as shown in the right side of FIG. 6. This indicates that the solder was in contact with the measurement pad 3a during solder printing, even after the solder melts.

[0024] FIG. 7 shows the measurement pads 3a and 3b and the printed solder paste before and after reflow when the metal mask 4 is misaligned in the +X direction relative to the printed circuit board 1 in the second embodiment. The left side of FIG. 7 shows the state before reflow, and the right side of FIG. 7 shows the state after reflow. When the printing position is misaligned in the +X direction by a distance of x3 or more, the solder print 7 formed by the measurement opening 6 comes into contact with the measurement pad 3b, as shown in the left side of FIG. 7. When the reflow process is performed in this state, a portion of the molten solder 8 remains on the measurement pad 3b even after the solder melts, as shown in the right side of FIG. 7. This shows that the solder was in contact with the measurement pad 3b during solder printing, even after the solder melts.

[0025] 8 is a flowchart showing the solder printing position measuring method of the second embodiment. First, before reflow after solder printing, the measurement pads 3a, 3b and the solder printing portion 7 are observed through the measurement opening 6, or after reflow, the measurement pads 3a, 3b and the molten solder 8 through the measurement opening 6 are observed (step S20). This observation may be visual or using an observation device such as a camera. Next, if the measurement is before reflow, the presence or absence of contact between the measurement pad 3a and the solder printing portion 7 through the measurement opening 6 is measured, and if the measurement is after reflow, the presence or absence of contact between the measurement pad 3a and the molten solder 8 through the measurement opening 6 is measured (step S21). If the determination in step S21 is No, if the measurement is before reflow, the presence or absence of contact between the measurement pad 3b and the solder printing portion 7 through the measurement opening 6 is measured, and if the measurement is after reflow, the presence or absence of contact between the measurement pad 3b and the melted solder 8 through the measurement opening 6 is measured (step S22).

[0026] If there is no contact with the measurement pads 3a, 3b (step S22: No), the solder misalignment is determined to be less than distance x2 in the -X direction and less than distance x3 in the +X direction (step S23). If there is contact with one of the measurement pads 3b (step S22: Yes), the solder misalignment is determined to be distance x3 or more in the +X direction (step S24). If there is contact with the other measurement pad 3a (step S21: Yes), the solder misalignment is determined to be distance x2 or more in the -X direction (step S25).

[0027] In other words, whether the solder is melted after solder printing or after the solder is melted after the reflow process, it is possible to visually or by using an observation device to measure whether or not there is contact between the measurement pads 3a, 3b and the solder at the measurement opening 6, and to determine whether or not there is a deviation of a distance of x2 or more in the -X direction, and whether or not there is a deviation of a distance of x3 or more in the +X direction.

[0028] As described above, according to the second embodiment, two measurement pads 3a, 3b are provided on the printed circuit board 1, and the measurement opening 6 is disposed between the measurement pads 3a, 3b at a distance from the measurement pads 3a, 3b. Then, by measuring whether or not the measurement pads 3a, 3b are in contact with the solder through the measurement opening 6, it is possible to determine whether or not the solder position deviation is a distance x3 or more in the +X direction, and whether or not the solder position deviation is a distance x2 or more in the -X direction. This makes it possible to determine whether or not the solder is melted after solder printing, or after the solder is melted after the reflow process. Dedicated solder print inspection The solder printing position can be measured in one dimension without using any equipment.

[0029] In the second embodiment, the direction in which measurement pads 3a, 3b and measurement opening 6 are spaced apart may be the Y direction, or any other direction including ±X and ±Y direction components, as long as it is a direction included in the XY plane. Furthermore, if two measurement pads and measurement openings are provided aligned in the Y direction in addition to measurement pads 3a, 3b and measurement opening 6 aligned in the X direction, the printing position on the + and - sides in two-dimensional directions can be measured.

[0030] Embodiment 3 In Embodiment 3, print position deviation is measured using a plurality of sets of measurement pads and measurement openings spaced apart by different distances in the same direction. FIG. 9 is a diagram showing the state before reflow of the cream solder printed on the measurement pads 3c, 3d, 3e when there is no positional deviation between the printed circuit board 1 and the metal mask 4 in Embodiment 3. In Embodiment 3, specifically, a measurement opening 6a (not shown) through which the cream solder forming the solder printing portion 7a passes is arranged at a distance x4 from the measurement pad 3c in the +X direction when the printed circuit board 1 and the metal mask 4 are aligned. Further, a measurement opening 6b (not shown) through which the cream solder forming the solder printing portion 7b passes is arranged at a distance x5 from the measurement pad 3d in the +X direction when the printed circuit board 1 and the metal mask 4 are aligned. Further, a measurement opening 6c (not shown) through which the cream solder forming the solder printing portion 7c passes is arranged at a distance x6 from the measurement pad 3e in the +X direction when the printed circuit board 1 and the metal mask 4 are aligned. x4 < x5 < x6. For example, the measurement pad 3c corresponds to the first measurement pad, the measurement pad 3d corresponds to the third measurement pad, the measurement opening 6a of Embodiment 3 corresponds to the first measurement opening, the measurement opening 6b of Embodiment 3 corresponds to the second measurement opening, the distance x4 corresponds to the first distance, and the distance x5 corresponds to the third distance.

[0031] When the printed circuit board 1 and the metal mask 4 are aligned, the measurement pad 3c and the measurement opening 6a are separated by a distance x4 in the +X direction, the measurement pad 3d and the measurement opening 6b are separated by a distance x5 in the +X direction, and the measurement pad 3e and the measurement opening 6c are separated by a distance x6 in the +X direction. Therefore, if there is no misalignment between the printed circuit board 1 and the metal mask 4, as shown in FIG. 9 , the solder-printed portion 7a formed by the measurement opening 6a is printed at a distance x4 from the measurement pad 3c in the +X direction, the solder-printed portion 7b formed by the measurement opening 6b is printed at a distance x5 from the measurement pad 3d in the +X direction, and the solder-printed portion 7c formed by the measurement opening 6c is printed at a distance x6 from the measurement pad 3e in the +X direction. Furthermore, as described above, if the reflow process is performed in this state, the measurement pads 3c, 3d, and 3e will not come into contact with the molten solder, even after the solder melts.

[0032] FIG. 10 is a flowchart showing a solder-printing position measuring method according to the third embodiment. The following describes measurements before reflow after solder printing, but measurements after reflow can also be performed in a similar manner. First, the measurement pad 3c and the solder-printed portion 7a, the measurement pad 3d and the solder-printed portion 7b, and the measurement pad 3e and the solder-printed portion 7c are observed (step S30). This observation may be performed visually or using an observation device such as a camera. Next, the presence or absence of contact between the measurement pad 3c and the solder-printed portion 7a is measured (step S31). If the determination in step S31 is Yes, the presence or absence of contact between the measurement pad 3d and the solder-printed portion 7b is measured (step S32). If the determination in step S32 is Yes, the presence or absence of contact between the measurement pad 3e and the solder-printed portion 7c is measured (step S33).

[0033] If there is no contact with measurement pad 3c (step S31: No), the solder misalignment is determined to be less than distance x4 in the +X direction (step S34). If there is no contact with measurement pad 3d (step S32: No), the solder misalignment is determined to be distance x4 or more but less than distance x5 in the +X direction (step S35). If there is no contact with measurement pad 3e (step S33: No), the solder misalignment is determined to be distance x5 or more but less than distance x6 in the +X direction (step S36). If there is contact with measurement pad 3e (step S33: Yes), the solder misalignment is determined to be distance x6 or more in the +X direction (step S37).

[0034] In this way, in the third embodiment, the printing position deviation is measured using a plurality of sets of measurement pads 3c, 3d, 3e and measurement openings 6a, 6b, 6c spaced apart at a plurality of different distances in the same direction, and thereafter, by measuring whether or not there is contact between the measurement pads 3c, 3d, 3e and the measurement openings 6a, 6b, 6c and the solder, it is possible to precisely determine whether or not the solder position deviation is within a range of a plurality of different distances. This makes it possible to accurately determine whether or not the solder is melted after solder printing, whether or not the solder is melted after the reflow process. Dedicated solder print inspection The solder printing position can be measured with high precision without using any equipment.

[0035] In addition, in embodiment 3, the direction in which the measurement pads 3c, 3d, and 3e are spaced apart from the measurement openings 6a, 6b, and 6c may be the Y direction, or any other direction including ±X direction components and ±Y direction components, as long as it is a direction included in the XY plane.

[0036] Furthermore, if multiple measurement pads and multiple measurement openings are provided in the Y direction in addition to measurement pads 3c, 3d, and 3e and measurement openings 6a, 6b, and 6c arranged in the X direction, the printing position on the + and - sides in two dimensions can be measured. For example, printed circuit board 1 may have fourth and fifth measurement pads, and metal mask 4 may have a third measurement opening arranged a fourth distance away from the fourth measurement pad in the Y direction (a second direction) and a fourth measurement opening arranged a fifth distance away from the fifth measurement pad in the Y direction, and the presence or absence of contact between the solder on the fourth and fifth measurement pads may be determined, and the printing position of the solder in the Y direction may be measured based on the determination result.

[0037] Furthermore, by increasing the number of pairs of measurement pads and measurement openings, it is possible to perform measurements over a wider range and with higher accuracy. Also, by increasing the number of pairs of measurement pads and measurement openings at locations with short distances and decreasing the number of pairs at locations with long distances, it is possible to finely adjust the measurement accuracy.

[0038] Embodiment 4 In the fourth embodiment, printing positional deviation is measured using a plurality of measurement pads arranged at equal intervals on concentric circles and a measurement opening arranged at the center of the concentric circles of the plurality of measurement pads. Fig. 11 is a diagram showing the state of measurement pads 11a-11h and the printed cream solder before reflow when there is no positional deviation between the printed circuit board 1 and the metal mask 4, and the state of measurement pads 12a-12h and the printed cream solder before reflow in the fourth embodiment. Measurement pads 11a-11h correspond to the sixth measurement pads, and measurement pads 12a-12h correspond to the seventh measurement pads.

[0039] In Embodiment 4, a measurement opening 6d (not shown) through which the cream solder forming the solder printing portion 7d passes is arranged at a distance x7 from the measurement pads 11a to 11h when the printed circuit board 1 and the metal mask 4 are aligned. Also, a measurement opening 6e (not shown) through which the cream solder forming the solder printing portion 7e passes is arranged at a distance x8 from the measurement pads 12a to 12h when the printed circuit board 1 and the metal mask 4 are aligned. x7 < x8. The measurement opening 6d in Embodiment 4 corresponds to the fifth measurement opening, the measurement opening 6e corresponds to the sixth measurement opening, the distance x7 corresponds to the sixth distance, and the distance x8 corresponds to the seventh distance.

[0040] When the printed circuit board 1 and the metal mask 4 are aligned, the measurement pads 11a to 11h and the measurement opening 6d are separated from each other by a distance x7, and the measurement pads 12a to 12h and the measurement opening 6e are separated from each other by a distance x8. Therefore, when there is no misalignment between the printed circuit board 1 and the metal mask 4, as shown in FIG. 11, the solder printing portion 7d by the measurement opening 6d is printed at a distance x7 from each of the measurement pads 11a to 11h, and the solder printing portion 7e by the measurement opening 6e is printed at a distance x8 from each of the measurement pads 12a to 12h. Also, as described above, when the reflow process is performed in this state, even after the solder melts, the measurement pads 11a to 11h do not come into contact with the melted solder, and the measurement pads 12a to 12h do not come into contact with the melted solder.

[0041] However, when there is a misalignment between the printed circuit board 1 and the metal mask 4 during solder printing, contact occurs between one of the measurement pads 11a to 11h and the measurement pads 12a to 12h and the solder printing portions 7d, 7e, and the contact state changes depending on the magnitude and direction of the misalignment. Therefore, by determining which of the measurement pads 11a to 11h and the measurement pads 12a to 12h where contact has occurred, the magnitude and direction of the misalignment can be determined.

[0042] FIG. 12 is a diagram showing a modification of Embodiment 4. In the modification shown in FIG. 12, the positional relationship between the measurement pads and the measurement openings is reversed from that in FIG. 11. FIG. 12 shows the state before reflow of the measurement pads 13a to 13h and the printed cream solder and the state before reflow of the measurement pads 14a to 14h and the printed cream solder when there is no misalignment between the printed circuit board 1 and the metal mask 4. The measurement pads 13a to 13h correspond to the eighth measurement pads, and the measurement pads 14a to 14h correspond to the ninth measurement pads.

[0043] In the modification of FIG. 12, the measurement openings 15a to 15h (not shown) through which the cream solder forming the solder printing portions 7f to 7n passes are arranged outside the measurement pads 13a to 13h at a distance x9 from the measurement pads 13a to 13h when the printed circuit board 1 and the metal mask 4 are aligned. Also, the measurement openings 16a to 16h (not shown) through which the cream solder forming the solder printing portions 7o to 7v passes are arranged outside the measurement pads 14a to 14h at a distance x10 from the measurement pads 14a to 14h when the printed circuit board 1 and the metal mask 4 are aligned. x9 < x10. The measurement openings 15a to 15h of Embodiment 4 correspond to the seventh measurement openings, the measurement openings 16a to 16h correspond to the eighth measurement openings, the distance x9 corresponds to the eighth distance, and the distance x10 corresponds to the ninth distance.

[0044] When the printed circuit board 1 and the metal mask 4 are aligned, the measurement pads 13a-13h and the measurement openings 15a-15h are each spaced a distance x9 apart, and the measurement pads 14a-14h and the measurement openings 16a-16h are each spaced a distance x10 apart. Therefore, if there is no misalignment between the printed circuit board 1 and the metal mask 4, as shown in FIG. 12 , the solder-printed portions 7f-7n formed by the measurement openings 15a-15h are printed a distance x9 away from the measurement pads 13a-13h, respectively, and the solder-printed portions 7o-7v formed by the measurement openings 16a-16h are printed a distance x10 away from the measurement pads 14a-14h, respectively. Furthermore, as described above, if the reflow process is performed in this state, even after the solder melts, the measurement pads 13a-13h will not come into contact with the molten solder, and the measurement pads 14a-14h will not come into contact with the molten solder.

[0045] However, if there is misalignment between the printed circuit board 1 and the metal mask 4 during solder printing, contact will occur between one of the measurement pads 13a-13h and the measurement pads 14a-14h and the solder-printed portions 7f-7n, 7o-7v, and the state of contact will change depending on the magnitude and direction of the misalignment. Therefore, by determining which of the measurement pads 13a-13h and the measurement pads 14a-14h has contacted, the magnitude and direction of the misalignment can be determined.

[0046] In Figures 11 and 12, the range of measurable positional deviation and measurement accuracy can be adjusted by changing the number of measurement pads, the number of measurement openings, the number of pairs of measurement pads and measurement openings, and the distance between the measurement pads and measurement openings.

[0047] As described above, according to the fourth embodiment, whether before the solder melts after solder printing or after the solder melts after the reflow process, Dedicated solder print inspection The two-dimensional solder printing position can be measured without using any equipment.

[0048] The configurations shown in the above embodiments are examples of the contents of the present disclosure, and may be combined with other known technologies, and parts of the configurations may be omitted or modified within the scope of the gist of the present disclosure. [Explanation of symbols]

[0049] 1 printed circuit board, 2 pad, 3, 3a to 3e, 11a to 11h, 12a to 12h, 13a to 13h, 14a to 14h measurement pad, 4 metal mask, 5 opening, 6 measurement opening, 7, 7a to 7v solder printing part, 8 melted solder.

Claims

1. a printed circuit board on which a plurality of pads onto which solder is printed and first measurement pads are arranged; a mask member having a plurality of openings arranged at positions corresponding to the plurality of pads, and a first measurement opening arranged at a first distance in a first direction from the first measurement pad when aligned with the printed circuit board; A solder printing position measuring method for measuring the solder printing position using a printing step of aligning the printed circuit board and the mask member, and printing solder on the printed circuit board through the plurality of openings and the first measurement opening of the mask member; a measuring step of determining whether or not the solder on the first measurement pad is in contact with the pad, and measuring the printing position of the solder in the first direction based on the determination result; A solder printing position measuring method comprising:

2. In the measuring step, it is determined whether or not the positional deviation of the solder in the first direction is equal to or greater than the first distance.

2. The solder printing position measuring method according to claim 1, wherein:

3. The printed circuit board has a second measurement pad disposed a second distance away from the first measurement opening when the printed circuit board and the mask member are aligned in the negative direction of the first direction of the first measurement pad across the first measurement opening. and In the measuring step, it is determined whether or not the solder on the first measurement pad and the second measurement pad is in contact with each other, and the printing position of the solder in the first direction is measured based on the determination result.

2. The solder printing position measuring method according to claim 1, wherein:

4. In the measuring step, If it is determined that the solder on the first measurement pad is in contact, it is determined that the positional deviation of the solder in one of the positive and negative directions of the first direction is equal to or greater than the first distance; If it is determined that the solder on the second measurement pad is in contact, it is determined that the positional deviation of the solder in the other of the positive and negative directions of the first direction is equal to or greater than the second distance.

4. The solder printing position measuring method according to claim 3, wherein:

5. the printed circuit board has a third measurement pad; the mask member has a second measurement opening portion disposed at a third distance, which is longer than the first distance, from the third measurement pad in the first direction; In the measuring step, it is determined whether or not the solder on the first measurement pad and the third measurement pad is in contact with each other, and the printing position of the solder in the first direction is measured based on the determination result.

2. The solder printing position measuring method according to claim 1, wherein:

6. In the measuring step, If it is determined that the solder on the first measurement pad is not in contact, it is determined that the positional deviation of the solder in the first direction is less than the first distance; when it is determined that the solder on the first measurement pad is in contact and when it is determined that the solder on the third measurement pad is not in contact, it is determined that the positional deviation of the solder in the first direction is equal to or greater than the first distance and less than the third distance; If it is determined that the solder on the third measurement pad is in contact, it is determined that the positional deviation of the solder in the first direction is equal to or greater than the third distance.

6. The solder printing position measuring method according to claim 5, wherein:

7. the printed circuit board has a fourth measurement pad and a fifth measurement pad; the mask member has a third measurement opening arranged at a fourth distance from the fourth measurement pad in a second direction different from the first direction, and a fourth measurement opening arranged at a fifth distance from the fifth measurement pad in the second direction, In the measuring step, it is determined whether or not the solder on the fourth measurement pad and the fifth measurement pad is in contact with each other, and the printing position of the solder in the second direction is measured based on the determination result.

7. The solder printing position measuring method according to claim 5 or 6.

8. a printed circuit board on which a plurality of pads onto which solder is printed are arranged and on which a plurality of sixth measurement pads are arranged concentrically; a mask member having a plurality of openings arranged at positions corresponding to the plurality of pads, and a fifth measurement opening arranged at the center of the plurality of sixth measurement pads and spaced a sixth distance from the sixth measurement pads when aligned with the printed circuit board; A solder printing position measuring method for measuring the solder printing position using a printing step of aligning the printed circuit board and the mask member, and printing solder onto the printed circuit board through the plurality of openings and the plurality of sixth measurement pads of the mask member; a measuring step of determining whether or not the solder is in contact with the sixth measurement pads and measuring the printing position of the solder based on the determination result; A solder printing position measuring method comprising:

9. the printed circuit board has a plurality of seventh measurement pads arranged concentrically; the mask member has a sixth measurement opening disposed at the center of the seventh measurement pads and spaced a seventh distance from the seventh measurement pads; In the measuring step, it is determined whether or not the solder is in contact with the sixth measurement pads and the seventh measurement pads, and the printing position of the solder is measured based on the determination result.

9. The solder printing position measuring method according to claim 8, wherein:

10. a printed circuit board on which a plurality of pads onto which solder is printed are arranged and on which a plurality of eighth measurement pads are arranged concentrically; a mask member having a plurality of openings arranged at positions corresponding to the plurality of pads, and a plurality of seventh measurement openings arranged concentrically outside the plurality of eighth measurement pads and spaced an eighth distance from the plurality of eighth measurement pads when aligned with the printed circuit board; A solder printing position measuring method for measuring the solder printing position using a printing step of aligning the printed circuit board and the mask member, and printing solder onto the printed circuit board through the plurality of openings and the plurality of eighth measurement pads of the mask member; a measuring step of determining whether or not the solder is in contact with the eighth measurement pads and measuring the printing position of the solder based on the determination result; A solder printing position measuring method comprising:

11. the printed circuit board has a plurality of ninth measurement pads arranged concentrically; the mask member has a plurality of eighth measurement openings arranged concentrically outside the plurality of ninth measurement pads and spaced a ninth distance from the plurality of ninth measurement pads, In the measuring step, it is determined whether or not the solder is in contact with the eighth measurement pads and the ninth measurement pads, and the printing position of the solder is measured based on the determination result.

11. The solder printing position measuring method according to claim 10.

12. a printed circuit board on which a plurality of pads onto which solder is printed and first measurement pads are arranged; a mask member having a plurality of openings arranged at positions corresponding to the plurality of pads, and a first measurement opening arranged at a first distance in a first direction from the first measurement pad when aligned with the printed circuit board; a determination unit that determines whether or not the solder contacts the first measurement pads after printing the solder on the printed circuit board through the aligned printed circuit board and the plurality of openings and the first measurement opening of the mask member, and measures the printing position of the solder in the first direction based on the determination result. A solder printing position measuring device characterized by:

13. a printed circuit board on which electronic components are mounted and wiring is formed; a first measurement pad disposed on the printed circuit board and not connected to the electronic component or the wiring; a solder piece that is disposed at a first distance in a first direction from the first measurement pad and that is not connected to the electronic component or the wiring; A printed circuit board product comprising:

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