Evaluation jig and method for attaching the evaluation jig

Abstract

To securely attach a semiconductor device without any damage.SOLUTION: A bottom plate 30 is plate-like, and has a top surface large in area enough to overlap with a cooling bottom plate of a cooling device 20, which is arranged on the top surface. A frame part 40 surrounds the four sides of the cooling device 20 in plan view together with the four sides of the bottom plate 30. Consequently, a semiconductor device 2 is securely attached to an evaluation tool 3. Consequently, the semiconductor device 2 is suppressed from rattling on the evaluation tool 3 to be prevented from being damaged by the evaluation tool 3. The evaluation tool 3 can be thereby securely attached without damaging the semiconductor device 2.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an evaluation jig and a method for attaching the evaluation jig. [Background technology]

[0002] To maintain the reliability of a semiconductor module including power semiconductor elements, the semiconductor module is mounted on a cooling device, which allows the power semiconductor elements to be cooled efficiently and stably.

[0003] For a semiconductor device including such a semiconductor module and a cooling device, characteristic evaluations are performed at room temperature and at high temperatures. The characteristics include, for example, static characteristics, dielectric strength, and heat transfer. When the characteristic evaluations are performed, a predetermined evaluation jig is attached to the semiconductor device (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Publication number 07-74374 Summary of the Invention [Problem to be solved by the invention]

[0005] When evaluating the characteristics of a semiconductor device, it is necessary to firmly and reliably attach an evaluation jig to the semiconductor device. If the evaluation jig is not firmly attached to the semiconductor device, a gap may occur between the semiconductor device and the evaluation jig, causing the semiconductor device to wobble relative to the evaluation jig, making it impossible to properly evaluate the characteristics of the semiconductor device. If the semiconductor device wobble relative to the evaluation jig, there is a risk that the semiconductor device will be damaged.

[0006] The present invention has been made in view of the above points, and has as its object to provide an evaluation jig and an evaluation jig mounting method that can reliably mount a semiconductor device without damaging it. [Means for solving the problem]

[0007] According to one aspect of the present invention, a semiconductor device is attached to a semiconductor device having a cooling device at its bottom that is rectangular in plan view, and includes a bottom plate and a frame portion, the bottom plate is flat, the cooling device is disposed on a front surface, and the frame portion is rectangular in plan view on all four sides of the cooling device. The whole of The four sides of the bottom plate The whole of and an evaluation fixture is provided, each surrounding the other. Also provided is a method for attaching the evaluation jig to a semiconductor device. [Effects of the Invention]

[0008] According to the disclosed technique, the semiconductor device can be securely attached without being damaged, and stable evaluation can be performed. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is a plan view of the evaluation structure according to the first embodiment. [Figure 2] FIG. 2 is a cross-sectional side view of the evaluation structure according to the first embodiment. [Figure 3] FIG. 1 is a cross-sectional view of a semiconductor device. [Figure 4] FIG. 2 is a perspective view of a cooling device included in the semiconductor device. [Figure 5] FIG. 2 is an exploded view of a cooling device included in the semiconductor device. [Figure 6] FIG. 2 is a rear view of a cooling device included in the semiconductor device. [Figure 7] FIG. 2 is a plan view of the evaluation jig according to the first embodiment. [Figure 8] FIG. 2 is a side cross-sectional view of the evaluation jig according to the first embodiment. [Figure 9] FIG. 2 is a rear view of the evaluation jig according to the first embodiment. [Figure 10] FIG. 2 is an exploded view of the evaluation jig according to the first embodiment. [Figure 11]3 is a perspective view of the rear surface side of a bottom plate included in the evaluation jig in the first embodiment. FIG. [Figure 12] 4 is a perspective view (part 1) of a side frame portion included in the evaluation jig according to the first embodiment. FIG. [Figure 13] 10 is a perspective view (part 2) of a side frame portion included in the evaluation jig according to the first embodiment. FIG. [Figure 14] FIG. 4 is a cross-sectional view of a connection point of a frame portion in the first embodiment. [Figure 15] 4 is a flowchart of a method for attaching an evaluation jig according to the first embodiment. [Figure 16] 5A to 5C are diagrams illustrating a sheet placement step in the method for attaching the evaluation jig according to the first embodiment. [Figure 17] 4A to 4C are diagrams illustrating a device placement step of the evaluation jig mounting method according to the first embodiment. [Figure 18] 5A to 5C are diagrams illustrating a frame attachment step in the method for attaching the evaluation jig according to the first embodiment. [Figure 19] FIG. 10 is a diagram showing a frame attachment step (before attachment) of the attachment method of the evaluation jig according to the second embodiment. [Figure 20] FIG. 10 is a diagram showing a frame attachment step (after attachment) of the evaluation jig attachment method according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments will be described with reference to the drawings. In the following description, the terms "front surface" and "upper surface" refer to the XY plane facing upward (+Z direction) in the evaluation structure 1 and semiconductor device 2 shown in the drawings. Similarly, "up" refers to the upward (+Z direction) direction in the evaluation structure 1 and semiconductor device 2 shown in the drawings. The terms "back surface" and "lower surface" refer to the XY plane facing downward (-Z direction) in the evaluation structure 1 and semiconductor device 2 shown in the drawings. Similarly, "lower" refers to the downward (-Z direction) direction in the evaluation structure 1 and semiconductor device 2 shown in the drawings. Similar orientations will be used in other drawings as necessary. The terms "front surface," "upper surface," "upper," "back surface," "lower surface," "lower," and "side surface" are merely convenient expressions for specifying relative positional relationships and do not limit the technical concept of the present invention. For example, "upper" and "lower" do not necessarily refer to the vertical direction relative to the ground. In other words, the "upper" and "lower" directions are not limited to the direction of gravity. In the following description, the term "main component" refers to a component containing 80 vol% or more of a component.

[0011] [First embodiment] An evaluation structure 1 according to a first embodiment will be described with reference to Figures 1 and 2. Figure 1 is a plan view of the evaluation structure according to the first embodiment, and Figure 2 is a cross-sectional side view of the evaluation structure according to the first embodiment. Figure 2 is a cross-sectional view taken along the dashed dotted line Y1-Y1 in Figure 1. Note that in Figure 1, the case 25 and sealing member 26 of the semiconductor device 2 are not shown.

[0012] The evaluation structure 1 includes a semiconductor device 2 and an evaluation jig 3. The semiconductor device 2 includes a semiconductor module 10 and a cooling device 20. The cooling device 20 is provided on the back surface of the semiconductor module 10. In other words, the cooling device 20 is provided on the bottom of the semiconductor device 2.

[0013] The cooling device 20 has an inlet through which a refrigerant flows into the interior and an outlet through which the refrigerant that has circulated inside flows out to the outside. The cooling device 20 cools the semiconductor module 10 by dissipating heat from the semiconductor module 10 through the refrigerant. The refrigerant may be, for example, water, antifreeze (ethylene glycol aqueous solution), or long-life coolant (LLC). The cooling device 20 has a rectangular shape including long sides 20a and 20c and short sides 20b and 20d (see FIG. 4) in a plan view. The cooling device 20 also has fastening holes 20e formed at at least four corners in a plan view. The fastening holes 20e are through-holes into which bosses or the like of an external device on which the semiconductor device 2 is mounted are inserted to fasten the cooling device to the external device.

[0014] This figure shows a case in which three insulating circuit boards 11 included in semiconductor modules 10 are mounted along long sides 20a, 20c in the center of the front surface of such cooling device 20 (see FIG. 1). The number of insulating circuit boards 11 is not limited to three. Furthermore, as long as insulating circuit board 11 is disposed in the center of cooling device 20 (the cooling region described below), the arrangement position and size of insulating circuit board 11 are not limited to those shown in FIG. 1. Furthermore, cooling device 20 may also include a pump and a heat dissipation device (radiator). The pump introduces refrigerant into the inlet of cooling device 20 and circulates the refrigerant by causing the refrigerant that flows out of the outlet to flow back into the inlet. The heat dissipation device dissipates heat from the refrigerant, to which heat from semiconductor module 10 has been transferred, to the outside. Details of semiconductor device 2 will be described later.

[0015] The evaluation jig 3 is attached to the cooling device 20 of the semiconductor device 2. The evaluation jig 3 includes a bottom plate 30 and a frame 40. The bottom plate 30 is flat, and its front surface overlaps with the bottom surface of the cooling device 20, with the cooling device 20 placed on the front surface. The frame 40, together with the four sides of the bottom plate 30, surrounds the cooling device 20 on all four sides in a plan view. The top surface of the frame 40 is at a height that forms the same plane as the front surface of a top plate 21 (described later) of the cooling device 20 of the semiconductor device 2. Details of the evaluation jig 3 will be described later.

[0016] Next, the semiconductor device 2 will be described with reference to FIGS. 3 to 6. FIG. 3 is a cross-sectional view of the semiconductor device. FIG. 4 is a cross-sectional view of the semiconductor device. cooling system FIG. 5 is a perspective view of a cooling device included in a semiconductor device. Decomposition 6 is a rear view of the cooling device included in the semiconductor device. Long side It corresponds to the cross-sectional location on the centerline passing through the center of the

[0017] The semiconductor device 2 includes a semiconductor module 10 and a cooling device 20. The semiconductor module 10 includes an insulating circuit board 11, a semiconductor chip 12, a case 25, and a sealing member 26. The semiconductor module 10 may have a wiring member (not shown) that electrically and mechanically (directly) connects the front surface of the insulating circuit board 11 and the main electrodes of the semiconductor chip 12. The wiring member is, for example, a bonding wire, a bus bar, or a lead frame.

[0018] The insulating circuit board 11 includes an insulating plate 11a, a circuit pattern 11b, and a metal plate 11c. The insulating plate 11a and the metal plate 11c are rectangular in plan view. The corners of the insulating plate 11a and the metal plate 11c may be rounded or C-chamfered. The size of the metal plate 11c is smaller than the size of the insulating plate 11a in plan view and is formed inside the insulating plate 11a. The insulating plate 11a is made of a material that has insulating properties and excellent thermal conductivity. The insulating plate 11a is made of ceramics or insulating resin. Ceramics include aluminum oxide, aluminum nitride, silicon nitride, etc. The insulating resin is, for example, a paper phenol substrate, a paper epoxy substrate, a glass composite substrate, or a glass epoxy substrate. The thickness of the insulating plate 11a is 0.2 mm or more and 2.5 mm or less.

[0019] The circuit pattern 11b is formed on the front surface of the insulating plate 11a. The circuit pattern 11b is made of a metal with excellent conductivity. Such a metal is, for example, copper, aluminum, or an alloy containing at least one of these as a main component. The thickness of the circuit pattern 11b is 0.1 mm or more and 2.0 mm or less. The surface of the circuit pattern 11b may be plated. In this case, the plating material used is, for example, nickel, a nickel-phosphorus alloy, or a nickel-boron alloy. The plated circuit pattern 11b has improved corrosion resistance. The circuit pattern 11b is formed on the front surface of the insulating plate 11a as follows. A metal plate is formed on the front surface of the insulating plate 11a, and the metal plate is then subjected to etching or other processing to obtain the circuit pattern 11b with a predetermined shape. Alternatively, the circuit pattern 11b may be cut out from a metal plate and then pressure-bonded to the front surface of the insulating plate 11a. Note that the circuit pattern 11b is merely an example. If necessary, the number, shape, size, and position of the circuit patterns 11b may be selected appropriately.

[0020] The metal plate 11c is formed on the back surface of the insulating plate 11a. The metal plate 11c is rectangular. The area of ​​the metal plate 11c in a plan view is smaller than that of the insulating plate 11a and larger than the area of ​​the region where the circuit pattern 11b is formed. The corners of the metal plate 11c may be chamfered into an R-shape or a C-shape. The metal plate 11c is smaller than the insulating plate 11a and is formed on the entire surface of the insulating plate 11a except for the edges. The metal plate 11c is mainly composed of a metal with excellent thermal conductivity. The metal is, for example, copper, aluminum, or an alloy containing at least one of these. The thickness of the metal plate 11c is 0.1 mm or more and 2.5 mm or less. The surface of the metal plate 11c may be plated. In this case, the plating material used is, for example, nickel, a nickel-phosphorus alloy, or a nickel-boron alloy. The plated metal plate 11c has improved corrosion resistance. The metal plate 11c is formed on the rear surface of the insulating plate 11a as follows. A metal plate is formed on the rear surface of the insulating plate 11a, and then the metal plate is subjected to a process such as etching to obtain the metal plate 11c. Alternatively, the metal plate 11c may be cut out from a metal plate in advance and then attached to the rear surface of the insulating plate 11a. back The corners of the metal plate 11c provided on the back surface of the insulating plate 11a in this manner may be processed into an R-shape or a C-shape.

[0021] Examples of insulating circuit boards 11 having such a configuration include DCB (Direct Copper Bonding) boards, AMB (Active Metal Brazed) boards, and resin insulating boards. Insulating circuit board 11 may be attached to the front surface of cooling device 20 via bonding member 14. Heat generated in semiconductor chip 12 can be conducted to cooling device 20 via circuit pattern 11b, insulating plate 11a, and metal plate 11c, and dissipated.

[0022] The joining member 14 is solder, brazing material, or a metal sintered body. Lead-free solder is used as the solder. Lead-free solder is primarily composed of an alloy containing at least two of tin, silver, copper, zinc, antimony, indium, and bismuth. The solder may also contain additives, such as nickel, germanium, cobalt, or silicon. Additives improve the wettability, gloss, and bonding strength of the solder, thereby improving reliability. The brazing material is primarily composed of at least one of an aluminum alloy, a titanium alloy, a magnesium alloy, a zirconium alloy, and a silicon alloy. The insulating circuit board 11 can be joined to the cooling device 20 by brazing using such joining member 14. The metal sintered body is primarily composed of silver or a silver alloy. Alternatively, the joining member 14 may be a thermal interface material. The thermal interface material is, for example, an adhesive material including an elastomer sheet, RTV (Room Temperature Vulcanization) rubber, gel, phase change material, etc. By attaching the semiconductor module 10 to the cooling device 20 via such a brazing material or thermal interface material, the heat dissipation performance of the semiconductor module 10 can be improved.

[0023] The semiconductor chip 12 includes a power device element made of silicon, silicon carbide, or gallium nitride. The thickness of the semiconductor chip 12 is, for example, 40 μm or more and 250 μm or less. The power device element is a switching element or a diode element.

[0024] One semiconductor chip 12 includes a switching element. The switching element is, for example, an IGBT (Insulated Gate Bipolar Transistor) or a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor). Such semiconductor chip 12 has, for example, a drain electrode (or collector electrode) as a main electrode on the back surface, and a gate electrode and a source electrode (or emitter electrode) as a control electrode and a main electrode on the front surface.

[0025] The other semiconductor chip 12 includes a diode element. The diode element is, for example, an FWD (Free Wheeling Diode) such as an SBD (Schottky Barrier Diode) or a PiN (P-intrinsic-N) diode. Such semiconductor chip 12 has a cathode electrode as a main electrode on the back surface and an anode electrode as a main electrode on the front surface.

[0026] The semiconductor chip 12 is selected as at least one of a switching element and a diode element as needed, and its back surface is directly bonded to a predetermined circuit pattern 11b by a bonding member 13. The semiconductor chip 12 may be one or more. The bonding member 13 is solder or a metal sintered body. Lead-free solder is used as the solder. Lead-free solder mainly contains an alloy containing at least two of tin, silver, copper, zinc, antimony, indium, and bismuth. The solder may further contain additives. Examples of additives include nickel, germanium, cobalt, and silicon. Additives improve the wettability, gloss, and bonding strength of the solder, thereby improving reliability. Examples of metals used in the metal sintered body include silver and silver alloys.

[0027] An RC (Reverse-Conducting)-IGBT having both the functions of an IGBT and an FWD may be used instead of such a semiconductor chip 12. Also, instead of or together with the semiconductor chip 12, for example, a lead frame, external connection terminals (pin terminals, contact components, etc.), and electronic components (thermistors, current sensors) may be arranged.

[0028] The case 25 is disposed on the cooling device 20, surrounding the insulating circuit board 11 and the semiconductor chip 12 disposed on the front surface of the cooling device 20. The case 25 may be adhered to the cooling device 20 via an adhesive (not shown). The adhesive is mainly composed of an organic adhesive. The organic adhesive has a heat resistance temperature of approximately 100°C to 200°C. Specifically, it is an epoxy-based, silicone-based, or acrylic-based adhesive. The adhesive may be in either a paste form or a sheet form. The case 25 may include a lid. The lid is attached to cover the opening of the case 25.

[0029] Such a case 25 is made of resin. This resin is mainly composed of a thermoplastic resin. Examples of the thermoplastic resin include polyphenylene sulfide resin, polybutylene terephthalate resin, polybutylene succinate resin, polyamide resin, and acrylonitrile butadiene styrene resin. Such a resin is filled into a predetermined mold, solidified, and then the mold is removed to form the case 25.

[0030] The sealing member 26 fills the case 25 to a height sufficient to seal the insulating circuit board 11 and the semiconductor chip 12. The sealing member 26 contains a thermosetting resin and a filler contained in the thermosetting resin as a filler. Examples of the thermosetting resin include epoxy resin, phenolic resin, and maleimide resin. Examples of the filler include silicon dioxide, aluminum oxide, boron nitride, and aluminum nitride. An example of such a sealing member 26 contains epoxy resin and a filler. At least one of the fillers described above is used as the filler.

[0031] The cooling device 20 has a top plate 21, side walls 22, and a cooling bottom plate 23. The top plate 21 has a rectangular shape in plan view, with long sides 20a and 20c and short sides 20b and 20d, and fastening holes 20e are formed in each of the four corners. The corners of the top plate 21 in plan view may be rounded.

[0032] As shown in FIG. 3, the top plate 21 is divided into a flow path region 21a and peripheral regions 21e and 21f. As will be described later, a sidewall 22 is connected to the back surface of the top plate 21. The flow path region 21a is an area surrounded by the sidewall 22. The flow path region 21a is further divided into a cooling region 21b and communication regions 21c and 21d parallel to the long sides 20a and 20c. The cooling region 21b is a central rectangular region parallel to the long sides 20a and 20c (longitudinal direction) of the top plate 21. A plurality of semiconductor modules 10 are arranged in the cooling region 21b on the front surface of the top plate 21. A plurality of heat dissipation fins 24f are formed in the cooling region 21b on the back surface of the top plate 21. The thickness T1 (length in the Z direction) of the top plate 21 is uniform overall. The thickness T1 is equal to or greater than 2.0 mm and equal to or less than 5.0 mm.

[0033] The multiple heat dissipation fins 24f extend to connect the cooling area 21b on the back surface of the top plate 21 and the cooling bottom plate 23. The height (length in the Z direction) of the multiple heat dissipation fins 24f is 1.5 mm or more and 15.0 mm or less, and preferably 2.0 mm or more and 12.0 mm or less. Note that FIG. 3 shows a side view of the heat dissipation fins 24f, and FIG. 6 shows a plan view of the heat dissipation fins 24f. However, FIG. 6 shows the heat dissipation fins 24f schematically and does not necessarily match FIG. 3.

[0034] The heat dissipation fins 24f have upper and lower ends in the ±Z directions. The upper ends of the heat dissipation fins 24f are thermally and mechanically connected to the rear surface of the top plate 21. The upper ends of the heat dissipation fins 24f are integrally formed with the top plate 21; that is, the heat dissipation fins 24f protrude integrally from the rear surface of the top plate 21 in the -Z direction. On the other hand, the lower ends of the heat dissipation fins 24f are fixed to the front surface of the cooling bottom plate 23 (the inner side of the cooling device 20). The extension direction of the heat dissipation fins 24f in the Z direction is approximately perpendicular to the respective main surfaces of the top plate 21 and the cooling bottom plate 23. The heat dissipation fins 24f may each be a pin fin. Each of the multiple heat dissipation fins 24f has a rectangular cross section parallel to the main surface of the top plate 21. In FIG. 6, they are rhombic. This allows the surface area of ​​the heat dissipating fins 24f that comes into contact with the refrigerant to be increased compared to when the cross-sectional shape of the heat dissipating fins 24f is circular, thereby improving the heat dissipation efficiency.

[0035] The communication regions 21c and 21d are adjacent to both sides of the cooling region 21b on the top plate 21 and extend along the cooling region 21b. The communication regions 21c and 21d are regions extending from the cooling region 21b to the sidewalls 22 (on the long sides 20a and 20c side). In the case of FIG. 3, the communication regions 21c and 21d are rectangular. Furthermore, in a plan view, the corners of the communication regions 21c and 21d may be rounded to have a curvature. This is achieved by rounding the joints of the sidewalls 22 that form the communication regions 21c and 21d. This allows the refrigerant flowing through the communication regions 21c and 21d to flow more easily without remaining in the smooth corners. This prevents corrosion of the corners. The communication regions 21c and 21d do not necessarily have to be symmetrical. Furthermore, outlet 23b and inlet 23a, which will be described later, are formed closer to short sides 20b and 20d in correspondence with communication regions 21c and 21d. Outlet 23b and inlet 23a are formed in the center of communication regions 21c and 21d in the X direction. Communication regions 21c and 21d may be shaped to facilitate the flow of refrigerant into and out of outlet 23b and inlet 23a. For example, communication region 21c may be shaped to narrow closer to outlet 23b so as to drive the refrigerant toward outlet 23b.

[0036] The outer edge regions 21e and 21f are regions on the top plate 21 that are outside the flow path region 21a (the cooling region 21b and the communication regions 21c and 21d). That is, the outer edge regions 21e and 21f are regions that extend from the side wall 22 of the top plate 21 to the outer edge of the top plate 21 in a plan view. The fastening holes 20e and fastening reinforcement portions 20e1 described above are formed in the outer edge regions 21e and 21f. The thicknesses of the outer edge regions 21e and 21f of the top plate 21 are the thickness T1 of the top plate 21.

[0037] The sidewall 22 is formed in an annular shape on the back surface of the top plate 21, surrounding the cooling region 21b and the communication regions 21c and 21d. The upper end of the sidewall 22 in the +Z direction is fixed to the back surface of the top plate 21. The lower end of the sidewall 22 in the -Z direction is fixed to the front surface of the cooling bottom plate 23. In the case of FIG. 6, the sidewall 22 has eight sides, including a portion parallel to the short sides 20b and 20d along the cooling region 21b, a portion parallel to the long sides 20a and 20c along the communication regions 21c and 21d, and a portion connecting these portions. The corners of the inner joints of the annular sidewall 22 may be rounded. The sidewall 22 does not have to be composed of eight sides as long as it includes the cooling region 21b, which is rectangular in plan view, and includes the communication regions 21c and 21d on both sides of the cooling region 21b. The height (length in the Z direction) of the sidewall 22 corresponds to the height of the plurality of heat dissipation fins 24f and is, for example, 1.5 mm or more and 15.0 mm or less. Preferably, it is 2.0 mm or more and 12.0 mm or less. The thickness of the sidewall 22 is such that, when sandwiched between the top plate 21 and the cooling bottom plate 23 as described below, the strength of the cooling device 20 is maintained without reducing the cooling performance. The thickness of such a sidewall 22 is, for example, 1.0 mm or more and 3.0 mm or less.

[0038] A fastening reinforcement portion 20e1 may be formed around the fastening hole 20e on the rear surface of the top plate 21 (inside the cooling device 20). The fastening reinforcement portion 20e1 is a screw frame with a through hole formed therein corresponding to the fastening hole 20e. The side wall 22 is sandwiched between the top plate 21 and the cooling bottom plate 23 to maintain the strength of the cooling device 20. Therefore, the height of the fastening reinforcement portion 20e1 is approximately the same as the height of the side wall 22. More specifically, the height of the fastening reinforcement portion 20e1 is approximately the same as the height of the outer edge region of the side wall 22. Area 2 The height of the fastening reinforcement portion 20e1 may be approximately the same as the height of the heat dissipation fins 24f. The width of the fastening reinforcement portion 20e1 (the radial length from the center of the fastening hole 20e in plan view) is 0.7 to 2.0 times the diameter of the fastening hole 20e.

[0039] The cooling bottom plate 23 is flat and has the same shape as the top plate 21 in a plan view. That is, the cooling bottom plate 23 has a rectangular shape surrounded by long and short sides in a plan view, and fastening holes corresponding to the top plate 21 are formed at each of the four corners. The corners of the cooling bottom plate 23 may also be rounded. The front and back surfaces of the cooling bottom plate 23 are parallel to each other. The back surface of the cooling bottom plate 23 is flat and has no steps, forming the same plane. The back surface of the cooling bottom plate 23 and the front surface of the top plate 21 may also be parallel to each other. The fastening holes are not limited to the four corners. For example, in addition to the four corners, they may also be located midway along each of the long sides 20a, 20c.

[0040] The cooling bottom plate 23 is formed with an inlet 23a and an outlet 23b. The refrigerant flows into the cooling device 20 through the inlet 23a. The inlet 23a is formed on the long side 20c side and the short side 20b side, corresponding to the communication region 21d. The outlet 23b is formed on the long side 20a side and the short side 20d side, corresponding to the communication region 21c. That is, the inlet 23a and the outlet 23b are formed at positions that are point-symmetric with respect to the center point of the cooling bottom plate 23. When such a cooling bottom plate 23 is connected to the side wall 22, the fastening reinforcement portion 20e1 is connected around the fastening hole of the cooling bottom plate 23. The cooling bottom plate 23 needs to have a thickness that maintains the overall strength of the cooling device 20 without reducing the cooling performance. Furthermore, the cooling bottom plate 23 must be strong enough to allow drainage pipes to be attached to the inlet 23a and the outlet 23b. Therefore, the thickness T2 of the cooling bottom plate 23 is 1.0 to 5.0 times the thickness T1 of the top plate 21, and more preferably 2.0 to 3.0 times. The thickness T2 of the cooling bottom plate 23 is preferably, for example, 2.0 mm to 10.0 mm.

[0041] The interior of the cooling device 20 configured in this manner defines a flow path section 24 surrounded by the top plate 21, sidewall 22, and cooling bottom plate 23. The flow path section 24 is further divided into a cooling section 24a corresponding to the cooling region 21b and communication sections 24b and 24c corresponding to the communication sections 21c and 21d. A plurality of heat dissipation fins 24f extend from the cooling section 24a, connecting the top plate 21 and the cooling bottom plate 23. The communication sections 24b and 24c are formed by the communication sections 21c and 21d of the top plate 21, the sidewall 22, and the cooling bottom plate 23. The communication section 24c is connected to the cooling section 24a. The refrigerant flowing in from the inlet 23a flows through the communication section 24c to the cooling section 24a. The communication section 24b is connected to the cooling section 24a. The refrigerant from the cooling section 24a flows into the communication section 24b and out from the outlet 23b.

[0042] In this case, a drain head is attached to the inlet 23a via an annular rubber packing that surrounds the periphery of the inlet 23a. A drain pipe is attached to the drain head. In addition, a drain head is attached to the outlet 23b via an annular rubber packing that surrounds the periphery of the outlet 23b. A drain pipe is attached to the drain head. The drain pipe is connected to a pump. A refrigerant is circulated inside the cooling device 20 by the pump.

[0043] Furthermore, the outer edge portion of the outer edge region 21e of the cooling device 20 is outside the side wall 22 in a side view, and a recessed portion 22a is formed by the top plate 21 and the cooling bottom plate 23. The recessed portion 22a is formed around the entire periphery of the side portion of the cooling device 20.

[0044] Each cooling device 20 is primarily composed of a metal with excellent thermal conductivity. The metal may be, for example, copper, aluminum, or an alloy containing at least one of these metals. The surface of the cooling device 20 may be plated. Examples of plating materials used include nickel, nickel-phosphorus alloys, and nickel-boron alloys. Plated cooling devices 20 have improved corrosion resistance. The top plate 21 on which the heat dissipation fins 24f are formed is formed by, for example, forging or die casting. For forging, a block-shaped member primarily composed of the metal is pressurized using a die to plastically deform the top plate 21 on which the heat dissipation fins 24f and the side walls 22 are formed. For die casting, molten die-cast material is poured into a predetermined mold, cooled, and then removed from the mold to obtain the top plate 21 on which the heat dissipation fins 24f and the side walls 22 are formed. The die-cast material used in this process is, for example, an aluminum-based alloy. Alternatively, the top plate 21 on which the heat dissipation fins 24f and the side walls 22 are formed may be formed by cutting a block-shaped member containing the above metal as a main component.

[0045] The cooling bottom plate 23 is joined to the multiple heat dissipation fins 24f and side walls 22 of the top plate 21. This joining is performed by brazing. Therefore, the back surface, which is the end of the side walls 22 extending from the main surface (back surface) of the top plate 21, and the end of the heat dissipation fins 24f are joined to the front surface of the cooling bottom plate 23 via brazing material. When the top plate 21 is formed by casting, the brazing material used in the brazing process has a lower melting point than die-cast material. Such brazing material is, for example, an alloy containing aluminum as its main component.

[0046] Note that fastening reinforcement portions 20e1 may also be separately formed on the top plate 21 and joined to the cooling bottom plate 23 by brazing. In addition, in this embodiment, a case where a plurality of heat dissipation fins 24f are connected to the top plate 21 is shown. However, this is not limited to this case, and a plurality of heat dissipation fins 24f may be formed in an area corresponding to the cooling area 21b of the cooling bottom plate 23. In this manner, the cooling device 20 is obtained.

[0047] Next, the evaluation jig 3 will be described with reference to FIGS. 7 to 14. FIG. 7 is a plan view of the evaluation jig according to the first embodiment, FIG. 8 is a side cross-sectional view of the evaluation jig according to the first embodiment, and FIG. 9 is a back view of the evaluation jig according to the first embodiment. FIG. 10 is an exploded view of the evaluation jig according to the first embodiment. FIG. 11 is a perspective view of the back side of the bottom plate included in the evaluation jig according to the first embodiment, and FIGS. 12 and 13 are perspective views of the side frame included in the evaluation jig according to the first embodiment. FIG. 14 is a cross-sectional view of the connection points of the frame in the first embodiment. FIG. 8 is a cross-sectional view taken along the dashed-dotted line Y1-Y1 in FIG. 7. FIG. 10 shows a plan view of (part of) the side wall portion and the bottom plate disassembled from the evaluation jig 3 (excluding the carbon sheet). The dashed lines in the bottom plate 30 in FIG. 10 indicate the positions of the grooves formed on the back surface. The dashed lines in FIG. 11 indicate the positions of the insertion holes in the grooves. 14A is a cross-sectional view taken along the dashed dotted line Y2-Y2 in FIG. 7, and FIG. 14B is a cross-sectional view taken along the dashed dotted line X2-X2 in FIG.

[0048] The evaluation jig 3 includes a bottom plate 30, a frame 40, and a carbon sheet 50. The bottom plate 30 and the frame 40 are made of a metal with excellent electrical and thermal conductivity. Such a metal is, for example, copper, aluminum, or an alloy containing at least one of these as a main component. In the evaluation jig 3, the carbon sheet 50 is disposed on the front surface of the bottom plate 30. The bottom plate 30 is surrounded on all four sides by the frame 40.

[0049] The bottom plate 30 has a rectangular shape in plan view, surrounded on all four sides by first and third long sides 30a, 30c and second and fourth short sides 30b, 30d. The four corners of the bottom plate 30 may be rounded or chamfered. Here, a case where rounded corners are applied is illustrated. The front, back, and side surfaces of the bottom plate 30 may be smooth and substantially flat.

[0050] The front surface of the bottom surface 30 is the cooling bottom of the cooling device 20 in a plan view. board In other words, the long and short sides of the outer periphery of the front surface of the bottom surface 30 are the same as the back surface of the cooling device 20. board The long and short sides of the outer periphery of the back surface of the cooling device 23 are the same as those of the cooling bottom surface 30. board 23 overlap. Here, the area of ​​the front surface of the bottom plate 30 is configured to be slightly larger than the area of ​​the back surface of the cooling bottom plate 23 of the cooling device 20. A pair of fastening holes 35a, 35b is formed near diagonal corners on the front surface of the bottom plate 30. The pair of fastening holes 35a, 35b corresponds to a pair of fastening holes 20e on the diagonal line among the fastening holes 20e at the four corners of the cooling device 20. In FIG. 10, the fastening hole 35a is formed in the corner formed by the second and third sides 30b, 30c. The fastening hole 35b is formed in the corner formed by the first and fourth sides 30a, 30d. The pair of fastening holes 35a, 35b may also be formed in the corner formed by the first and second sides 30a, 30b and the corner formed by the third and fourth sides 30c, 30d. The thickness (length in the Z direction) of the bottom plate 30 may be any thickness that can stably support the semiconductor device 2 and maintain the strength of the evaluation jig 3. Such a thickness T1 is, for example, not less than 5.0 mm and not more than 15 mm.

[0051] First to fourth grooves 31 to 34 are formed on the back surface and side portions of the bottom plate 30. The first to fourth grooves 31 to 34 are formed by scraping away rectangular shapes from the sides of the first to fourth sides 30a to 30d to the back surface. The first to fourth grooves 31 to 34 form steps with respect to the back surface of the bottom plate 30.

[0052] First to fourth through-holes 31a to 34a are formed inside the first to fourth groove portions 31 to 34, respectively, and extend into the interior of the groove portions. The widths of the first to fourth through-holes 31a to 34a are narrower than the widths of the first to fourth groove portions 31 to 34, and each has a rectangular shape (indicated by the dashed lines in FIG. 11). The widths of the first to fourth through-holes 31a to 34a are 30% to 40% of the widths of the first to fourth groove portions 31 to 34. The first to fourth through-holes 31a to 34a are formed at the center of the widths of the first to fourth groove portions 31 to 34. The first to fourth through-holes 31a to 34a are carved into the bottom plate 30 along the XY planes of the first to fourth groove portions 31 to 34. The depths of the first to fourth grooves 31 to 34 (including the first to fourth insertion holes 31a to 34a) are lengths within a range in which they do not come into contact with each other within the bottom plate 30. The thicknesses (lengths in the Z direction) of the first to fourth grooves 31 to 34 are 30% to 60% of the thickness of the bottom plate 30.

[0053] First side insertion holes 31b1 are formed on both sides of the first groove 31 on the side of the first side 30a, which is the long side of the bottom plate 30. The depth of the first side insertion holes 31b1 is long enough not to interfere with the first to fourth grooves 31 to 34. Similarly, third side insertion holes (not shown) are formed on both sides of the third groove 33 on the side of the third side 30c, which is the long side of the bottom plate 30.

[0054] The frame portion 40 includes first to fourth side frame portions 41 to 44. The first to fourth side frame portions 41 to 44 are attached to the first to fourth sides 30a to 30d, respectively, of the bottom plate 30. As illustrated in FIG. 12, the first side frame portion 41 includes a first member 41a, a first support portion 41b, and a first protrusion portion 41c.

[0055] The first member 41a has a flat plate shape. The width (length in the Y direction) of the first member 41a is configured to be slightly longer than the width of the first side 30a of the bottom plate 30. Fitting portions 41a1 are formed on both sides of the first member 41a in the ±Y directions. The fitting portions 41a1 are concave. The height (length in the Z direction) of the fitting portions 41a1 corresponds to the thickness (length in the Z direction) of a fourth protrusion 44c (described later). The width (length along the longitudinal direction of the first member 41a) of the fitting portions 41a1 corresponds to the amount of protrusion of the fourth protrusion 44c (described later) from the fourth member 44a. Insertion holes 41e1 and 41e2 are formed in the upper surface of both ends of the first member 41a, respectively, along the Z direction. The insertion holes 41e1 and 41e2 are formed in the first member 41a from the front surface of the first member 41a, sandwiching the fitting portion 41a1 between them.

[0056] The first support portion 41b is formed on the first member 41a. The first support portion 41b extends perpendicularly to the main surface of the first member 41a from the lower end (-Z direction) of the first member 41a. The first support portion 41b includes a first tip support portion 41b1 having a narrow width at its tip in a plan view. The first tip support portion 41b1 is configured so that the front surface of the first support portion 41b is flush with the first support portion 41b. The thickness T3 of the first tip support portion 41b1 is 40% to 60% of the thickness T2 of the first support portion 41b. The width W2 of the first tip support portion 41b1 is 50% to 70% of the width W1 of the first support portion 41b. The length L1 from the first member 41a to the first tip support portion 41b1 of the first support portion 41b is 40% or more and 60% or less of the length L2 from the first member 41a to the tip of the first tip support portion 41b1. The first side frame portion 41 is also formed with first support shaft portions 41b2. The first support shaft portions 41b2 are columnar. The first support shaft portions 41b2 are formed on the first member 41a on both sides of the first support portion 41b in the ±Y directions. The first support shaft portions 41b2 extend in the same manner as the first support portion 41b.

[0057] The first protrusion 41c is formed between the fitting portions 41a1 on both sides of the first member 41a. The first protrusion 41c protrudes perpendicularly to the main surface of the first member 41a. The protrusion amount of the first protrusion 41c is a length that allows it to enter the recessed portion 22a of the cooling device 20. The height (length in the Z direction) of the first protrusion 41c corresponds to the height of the fitting portions 41a1 of the first member 41a.

[0058] Furthermore, although not shown in detail, the third side frame portion 43 includes the same components as the first side frame portion 41. That is, the third side frame portion 43 also includes a third member 43a, a third support portion 43b, a third protrusion portion 43c, and a third support shaft portion.

[0059] 13, the fourth side frame portion 44 includes a fourth member 44a, a fourth support portion 44b, and a fourth protrusion portion 44c. The fourth member 44a has a flat plate shape. The width (length in the X direction) of the fourth member 44a is approximately the same as the width of the fourth side 30d of the bottom plate 30.

[0060] The fourth support portion 44b is formed on the fourth member 44a. The fourth support portion 44b extends perpendicularly to the main surface of the fourth member 44a from the lower end (-Z direction) of the fourth member 44a. The fourth support portion 44b includes a narrow fourth tip support portion 44b1 at its tip in a plan view. The fourth tip support portion 44b1 is configured so that the front surface of the fourth support portion 44b is flush with the fourth tip support portion 44b. The thickness T5 of the fourth tip support portion 44b1 is 40% to 60% of the thickness T4 of the fourth support portion 44b. The width W4 of the fourth tip support portion 44b1 is 50% to 70% of the width W3 of the fourth support portion 44b. The length L3 from the fourth member 44a to the fourth tip support portion 44b1 of the fourth support portion 44b is 40% or more and 60% or less of the length L4 from the fourth member 44a to the tip of the fourth tip support portion 44b1.

[0061] The fourth protrusion 44c protrudes parallel to the ±X directions from both sides of the fourth member 44a in the ±X directions. Furthermore, the fourth protrusion 44c protrudes perpendicularly (in the +Y direction) to the main surface of the fourth member 44a. This main surface is the surface on which the fourth support portion 44b is formed. The protrusion amount of the fourth protrusion 44c in the +Y direction is a length that allows it to enter the recessed portions of the first and third side frame portions 41 and 43. The protrusion amount of the fourth protrusion 44c in the ±X directions corresponds to the depth of the fitting portion 41a1 of the first and third side frame portions 41 and 43. The height (length in the Z direction) of the fourth protrusion 44c corresponds to the height of the fitting portion 41a1 of the first member 41a.

[0062] Insertion holes 44e1 and 44e2 are formed along the Z direction on the upper surfaces of both ends of the fourth protrusion 44c in the ±X directions. The insertion holes 44e1 and 44e2 penetrate the fourth protrusion 44c in the Z direction. Furthermore, a fourth handle 44d is formed on the fourth side frame portion 44. The fourth handle 44d extends perpendicular to the fourth member 44a on the main surface of the fourth member 44a opposite to the main surface on which the fourth support portion 44b is formed.

[0063] Furthermore, although not shown in detail, the second side frame portion 42 includes the same components as the fourth side frame portion 44. That is, the second side frame portion 42 also includes a second member 42a, a second support portion 42b, a second protrusion portion 42c, and a second handle 42d.

[0064] The carbon sheet 50 is made of carbon. The carbon sheet 50 has a rectangular shape in a plan view, with rounded corners. The front surface of the carbon sheet 50 faces the front surface of the bottom plate 30. The carbon sheet 50 has fastening openings 52a and 52b formed therein, which correspond to the fastening holes 35a and 35b of the bottom plate 30 when the carbon sheet 50 is placed on the bottom plate 30. The carbon sheet 50 has an inlet opening 51a and an outlet opening 51b formed therein at locations corresponding to the inlet 23a and the outlet 23b when the cooling device 20 is placed on the carbon sheet 50. The carbon sheet 50 may have any thickness that can reliably prevent contact between the cooling device 20 and the bottom plate 30 when the cooling device 20 is placed on the carbon sheet 50. The thickness is, for example, 100 μm or more and 1000 μm or less.

[0065] The connection (combination) of the first to fourth side frame portions 41 to 44 in such a frame portion 40 will be described. Note that, when assembling the evaluation jig 3, the first to fourth side frame portions 41 to 44 are attached to the bottom plate 30 and connected to one another. Details of such an assembly method (attachment method) will be described later. Here, the connection of the first to fourth side frame portions 41 to 44 will be described. Also, as an example of connection, the first side frame portion 41 and the fourth side frame portion 44 will be described.

[0066] The first member 41a of the first side frame portion 41 and the fourth member 44a of the fourth side frame portion 44 are positioned so that their longitudinal directions are perpendicular to each other. The fourth protrusion 44c of the fourth member 44a is fitted into and meshed with the fitting portion 41a1 of the first member 41a. This causes the first member 41a of the first side frame portion 41 and the fourth member 44a of the fourth side frame portion 44 to form a substantially right angle. Furthermore, the insertion hole 41e2 of the first side frame portion 41 and the insertion hole 44e1 of the fourth side frame portion 44 are aligned vertically. As shown in FIG. 14 , a pin 45 is inserted from above the first side frame portion 41 through the aligned insertion holes 41e2 and 44e1. Similarly, pins 45 are inserted through the first side frame portion 41 and the second side frame portion 42, the second side frame portion 42 and the third side frame portion 43, and the third side frame portion 43 and the fourth side frame portion 44. In this manner, the frame portion 40 is formed.

[0067] Next, a method for attaching the evaluation jig 3 to the semiconductor device 2 will be described with reference to FIGS. 15 to 18 and 1 and 2. FIG. 15 is a flowchart of the method for attaching the evaluation jig in the first embodiment. FIG. 16 is a diagram showing a sheet arrangement step of the method for attaching the evaluation jig in the first embodiment, FIG. 17 is a diagram showing an apparatus arrangement step of the method for attaching the evaluation jig in the first embodiment, and FIG. 18 is a diagram showing a frame attachment step of the method for attaching the evaluation jig in the first embodiment. FIGS. 16 to 18 are cross-sectional views corresponding to the cross section taken along dashed dotted line Y1-Y1 in FIG. 1.

[0068] First, a preparation step is performed to prepare the semiconductor device 2 and the evaluation jig 3 (step S1). The evaluation jig 3 is prepared by separately preparing the bottom plate 30 and the separated frame portion 40 and carbon sheet 50. Next, a bottom plate setting step is performed to set the bottom plate 30 (step S2). The bottom plate 30 is set, for example, on a mounting table on which the evaluation jig 3 is attached. The set bottom plate 30 is maintained without shifting from the set position.

[0069] Next, a sheet placement step is performed (step S3) in which the carbon sheet 50 is placed on the bottom plate 30. As shown in FIG. 16, the carbon sheet 50 is placed on the front surface of the bottom plate 30. The entire front surface of the bottom plate 30 is covered with the carbon sheet 50. The fastening holes 35a and 35b of the bottom plate 30 are aligned with the fastening openings 52a and 52b of the carbon sheet 50, respectively (see FIG. 7).

[0070] Next, an apparatus placement step is performed in which the semiconductor device 2 is placed on the front surface of the bottom plate 30 via the carbon sheet 50 (step S4). The inlet 23a and outlet 23b of the cooling device 20 of the semiconductor device 2 on the carbon sheet 50 are aligned with the inlet opening 51a and outlet opening 51b of the carbon sheet 50, respectively, as shown in FIG. 17 (FIG. 17 shows the inlet 23a and the inlet opening 51a). The carbon sheet 50 protects the periphery of the inlet 23a and outlet 23b of the cooling device 20, making the inlet 23a and outlet 23b less susceptible to damage. Therefore, when a drainage head is attached via rubber packing to the inlet 23a and outlet 23b of the semiconductor device 2 from which the evaluation jig 3 has been removed, the airtightness of the inlet 23a and outlet 23b is maintained.

[0071] Furthermore, the diagonal fastening holes 20e of the cooling device 20 of the semiconductor device 2 are aligned with the fastening holes 35a and 35b of the bottom plate 30 via the fastening openings 52a and 52b of the carbon sheet 50, respectively. The diagonal fastening holes 20e of the cooling device 20 are fastened to the fastening holes 35a and 35b of the bottom plate 30 by screwing screws (not shown). When fastening the semiconductor device 2 to the bottom plate 30, using two of the four diagonal fastening holes 20e of the cooling device 20 can reduce the fastening work time. Furthermore, the semiconductor device 2 is firmly fixed to the bottom plate 30 because it is fastened to the bottom plate 30 using the diagonal fastening holes 20e of the cooling device 20.

[0072] Next, a frame attachment step is performed to attach the frame 40 to the semiconductor device 2 and the bottom plate 30 (step S5). The first to fourth side frame portions 41 to 44 of the frame 40 are not yet assembled. The first to fourth side frame portions 41 to 44 are attached to the first to fourth sides 30a to 30d of the bottom plate 30. The order in which the first to fourth side frame portions 41 to 44 are attached does not matter. The first to fourth side frame portions 41 to 44 may be attached to the bottom plate 30, respectively. Alternatively, the first and third side frame portions 41 and 43 may be attached to the opposing first and third sides 30a and 30c of the bottom plate 30, or the second and fourth side frame portions 42 and 44 may be attached to the second and fourth sides 30b and 30d, respectively, simultaneously so that they are sandwiched between them. The order in which the first and third side frame portions 41 and 43 and the second and fourth side frame portions 42 and 44 are attached does not matter either.

[0073] FIG. 18 illustrates an example in which the first and third side frame portions 41, 43 are attached to the first and third sides 30a, 30c of the bottom plate 30. The first and third side frame portions 41, 43 are attached to the first and third sides 30a, 30c of the bottom plate 30 by the first and third support portions 41b, 43b (and 2nd The first and third side frame portions 41, 43 are set so that the first and third support shaft portions 41, 43 face each other. The first and third side frame portions 41, 43 are slid toward the first and third sides 30a, 30c of the bottom plate 30. As a result, the first and third support portions 41b, 43b are inserted into the first and third groove portions 31, 33 of the bottom plate 30. In addition, the first and third support shaft portions are inserted into the first side insertion hole 31b1 and the third side insertion hole of the bottom plate 30.

[0074] The first side frame portion 41 is pushed in until the first tip support portion 41b1 of the first support portion 41b fits into the first insertion hole 31a in the first groove portion 31. Furthermore, at this time, the first protrusion portion 41c of the first member 41a of the first side frame portion 41 fits into the recess portion 22a on the side of the cooling device 20.

[0075] Similarly, the third side frame portion 43 is pushed in until the third tip support portion of the third support portion 43b fits into the third insertion hole 33a in the third groove portion 33. The third protrusion portion 43c of the third member 43a of the third side frame portion 43 fits into the recess portion 22a on the side of the cooling device 20.

[0076] The second and fourth side frame portions 42, 44 are also slid and attached to the second and fourth sides 30b, 30d of the bottom plate 30 in the same manner as above. In this case, the second and fourth support portions 42b, 44b of the second and fourth side frame portions 42, 44 fit into the second and fourth groove portions 32, 34 of the bottom plate 30. The second and fourth protrusion portions 42c, 44c of the second and fourth side frame portions 42, 44 fit into the recess portions 22a on the sides of the cooling device 20.

[0077] Furthermore, at this time, the second and fourth protrusions 42c, 44c of the second and fourth side frame portions 42, 44 fit into the fitting portions 41a1 on both sides of the first member 41a of the first side frame portion 41. That is, the second and fourth protrusions 42c, 44c of the second and fourth side frame portions 42, 44 respectively fit into the fitting portions 41a1 on both sides of the first member 41a. The second and fourth protrusions 42c, 44c of the second and fourth side frame portions 42, 44 also fit into fitting portions on both sides of the fourth member 44a of the fourth side frame portion 44. That is, the second and fourth protrusions 42c, 44c of the second and fourth side frame portions 42, 44 respectively fit into fitting portions on both sides of the fourth member 44a.

[0078] When pins 45 are inserted from the front side into each of the four combined side portions of the first to fourth side frame portions 41 to 44, an evaluation structure 1 is obtained in which an evaluation jig 3 is attached to the semiconductor device 2 shown in Figures 1 and 2.

[0079] Furthermore, when removing the evaluation jig 3 from the semiconductor device 2, the pins 45 attached to the evaluation jig 3 at four locations are pulled upward. This allows the frame 40 to be disassembled and detached from the bottom plate 30. This allows the semiconductor device 2 to be removed from the evaluation jig 3.

[0080] The evaluation jig 3 described above is attached to a semiconductor device 2 having a cooling device 20 at its bottom, which is rectangular in plan view. Such an evaluation jig 3 includes a bottom plate 30 and a frame 40. The bottom plate 30 is flat, and its front surface overlaps with the cooling bottom plate 23 of the cooling device 20, with the cooling device 20 disposed on the front surface. The frame 40, together with the four sides of the bottom plate 30, surrounds all four sides of the cooling device 20 in plan view. This allows the semiconductor device 2 to be firmly attached to the evaluation jig 3. This prevents the semiconductor device 2 from rattling relative to the evaluation jig 3, preventing damage caused by the evaluation jig 3. This allows the evaluation jig 3 to be securely attached without damaging the semiconductor device 2.

[0081] In particular, the side surface surrounding the cooling device 20 at the bottom of the semiconductor device 2 is fixed by a frame 40. Furthermore, first to fourth protrusions of a frame 4 included in the evaluation jig 3 fit into recesses 22a around the side surface of the cooling device 20. When thermally evaluating the semiconductor device 2, it is possible to promote temperature rise and fall of the semiconductor device 2 from the side surface of the cooling device 20. By using the evaluation jig 3, it is possible to ensure the thermal conductivity performance of the semiconductor device 2.

[0082] Furthermore, the evaluation jig 3 has second and fourth handles 42d, 44d provided on the second and fourth side frame portions 42, 44. The second and fourth handles 42d, 44d can be used when moving the evaluation structure 1, improving the ease of handling of the evaluation structure 1. Such handles are not limited to the second and fourth side frame portions 42, 44, but may also be attached to the first and third side frame portions 41, 43, or may also be attached to all of the first to fourth side frame portions 41-44.

[0083] Therefore, by using the evaluation jig 3, the ease of handling the semiconductor device 2 and the efficiency of the work of attaching the evaluation jig 3 are improved. Furthermore, the semiconductor device 2 is not damaged, and the electrical conductivity and thermal conductivity of the semiconductor device 2 can be maintained. This allows stable evaluation of the semiconductor device 2 to which the evaluation jig 3 is attached.

[0084] [Second embodiment] In the second embodiment, a case where the back surfaces (surfaces facing the first to fourth support parts) of the first to fourth protrusions 41c to 44c included in the frame part 40 of the evaluation jig 3 are inclined will be described with reference to Figures 19 and 20. Figure 19 is a diagram showing the frame part mounting step (before mounting) of the mounting method of the evaluation jig in the second embodiment, and Figure 20 is a diagram showing the frame part mounting step (after mounting) of the mounting method of the evaluation jig in the second embodiment.

[0085] The second embodiment has the same configuration as the first embodiment except for the first to fourth protrusions 41c to 44c. The first embodiment can be referred to for the semiconductor device 2 and the evaluation jig 3 (excluding the first to fourth protrusions 41c to 44c) of the second embodiment, and the method of attaching the evaluation jig 3 to the semiconductor device 2.

[0086] In the second embodiment, the back surfaces of the first to fourth protrusions 41c to 44c of the first to fourth side frame portions 41 to 44 are inclined. For example, as shown in FIG. 19, the first and third protrusion back surfaces 41c1 and 43c1, which are the back surfaces of the first and third protrusions 41c and 43c, are surfaces that face the first and third support portions 41b and 43b. The first and third protrusion back surfaces 41c1 and 43c1 are inclined so that the tips of the first and third protrusions 41c and 43c narrow. Similarly, the second and fourth protrusion back surfaces (not shown) of the second and fourth protrusions 42c and 44c are also inclined so that the tips of the first and third protrusions 41c and 43c narrow, similar to the first and third protrusion back surfaces 41c1 and 43c1.

[0087] The evaluation jig 3 including such first to fourth side frame portions 41 to 44 can also be attached in the same manner as in Fig. 15. In the case of the second embodiment, step S5 in Fig. 15 is performed as follows.

[0088] The first and third side frame portions 41, 43 are set so that the first and third support portions 41b, 43b (and the first and third support shaft portions) face the first and third sides 30a, 30c of the bottom plate 30. As shown in FIG. 19, the first and third side frame portions 41, 43 are slid toward the first and third sides 30a, 30c of the bottom plate 30. As a result, the first and third support portions 41b, 43b are inserted into the first and third groove portions 31, 33 of the bottom plate 30. In addition, the first and third support shaft portions are inserted into the first side insertion hole 31b1 and the third side insertion hole of the bottom plate 30.

[0089] During sliding, the first protrusions 41c of the first side frame portion 41 fit into the recessed portions 22a of the cooling device 20. At this time, as shown in Fig. 20, the first-protrusion back surfaces 41c1 of the first protrusions 41c press the outer edge of the cooling bottom plate 23 of the recessed portion 22a toward the bottom plate 30 (-Z direction). Similarly, the third side frame portion 43 presses the outer edge of the cooling bottom plate 23 of the recessed portion 22a of the cooling device 20 toward the bottom plate 30 (-Z direction) with the third-protrusion back surfaces 43c1 of the third protrusions 43c. Similarly, the second and fourth protrusion back surfaces of the second and fourth protrusions 42c and 44c of the second and fourth side frame portions 42 and 44 press the outer edge of the cooling bottom plate 23 of the recessed portion 22a of the cooling device 20 toward the bottom plate 30 (-Z direction).

[0090] In this way, the side of the cooling device 20 of the semiconductor device 2 is firmly attached by the evaluation jig 3, and furthermore, the cooling device 20 is firmly pressed against the bottom plate 30. Therefore, compared to the first embodiment, the occurrence of rattle of the semiconductor device 2 with respect to the evaluation jig 3 is suppressed, and it is possible to prevent damage caused by the evaluation jig 3. Therefore, the evaluation jig 3 can be securely attached without damaging the semiconductor device 2.

[0091] The side surface surrounding the cooling device 20 at the bottom of the semiconductor device 2 is fixed by a frame 40. First to fourth protrusions 41c to 44c of the frame 40 included in the evaluation jig 3 fit into recesses 22a around the sides of the cooling device 20. Furthermore, the cooling device 20 is pressed against the bottom plate 30. Therefore, when thermally evaluating the semiconductor device 2, it is possible to promote temperature rise and fall of the semiconductor device 2 from the side surface of the cooling device 20. By using the evaluation jig 3, it is possible to ensure the thermal conductivity performance of the semiconductor device 2. [Explanation of symbols]

[0092] 1 Evaluation Structure 2. Semiconductor Devices 3 Evaluation jig 10 Semiconductor Module 11. Insulated circuit board 11a Insulating plate 11b Circuit pattern 11c metal plate 12 Semiconductor chips 13,14 Joint members 20 Cooling device 20a, 20c long side 20b, 20d short side 20e,35a,35b fastening hole 20e1 Fastening reinforcement part 21 Top plate 21a Flow path area 21b Cooling area 21c,21d Communication area 21e, 21f Outer region 22 Side wall 22a Recess 23 Cooling bottom plate 23a Inlet 23b Outlet 24 Flow path section 24a Cooling section 24b,24c Communication part 24f Heat dissipation fin 25 cases 26 Sealing member 30 Bottom plate 30a, 30b, 30c, 30d 1st, 2nd, 3rd, 4th sides 31, 32, 33, 34 First, second, third, fourth grooves 31a, 32a, 33a, 34a First, second, third, and fourth insertion holes 31b1 First side insertion hole 40 Frame 41,42,43,44 1st, 2nd, 3rd, 4th side frame part 41a, 42a, 43a, 44a First, second, third, and fourth members 41a1 Fitting part 41b, 42b, 43b, 44b 1st, 2nd, 3rd, 4th support part 41b1,44b1 1st, 4th tip support part 41b2 1st support shaft part 41c, 42c, 43c, 44c 1st, 2nd, 3rd, 4th protrusion 41c1, 43c1 Back side of 1st and 3rd protrusions 41e1, 41e2, 44e1, 44e2 Insertion holes 42d, 44d 2nd and 4th handles 45-pin 50 carbon sheet 51a Inflow opening 51b Outflow opening 52a,52b Fastening opening

Claims

1. The cooling device is attached to a semiconductor device having a rectangular shape in a plan view at its bottom, The base plate and the frame portion are included. the bottom plate is flat, and the cooling device is disposed on a front surface thereof; The frame portion surrounds the entire four sides of the cooling device together with the entire four sides of the bottom plate in a plan view. Evaluation fixture.

2. The front surface of the bottom plate has the same shape as the bottom surface of the cooling device in a plan view, and the bottom surface is arranged to overlap the front surface. The evaluation jig according to claim 1 .

3. a cooling device provided between the bottom plate and the cooling device, the back surface of which is in direct contact with the bottom plate and the front surface of which is in direct contact with the bottom surface of the cooling device; an inlet opening formed in correspondence with an inlet formed in the bottom surface of the cooling device; and an outlet opening formed in correspondence with an outlet formed in the bottom surface of the cooling device. Further comprising a carbon sheet, The evaluation jig according to claim 1 or 2.

4. the frame portion includes a first side frame portion, a second side frame portion, a third side frame portion, and a fourth side frame portion that correspond to the sides of the bottom plate and the cooling device in that order in a plan view; The evaluation jig according to any one of claims 1 to 3.

5. The first side frame portion, the second side frame portion, the third side frame portion, and the fourth side frame portion each include a flat plate-shaped first support portion, a flat plate-shaped second support portion, a flat plate-shaped third support portion, and a flat plate-shaped fourth support portion, which extend toward the bottom plate and support the bottom surface of the bottom plate. The evaluation jig according to claim 4 .

6. The bottom plate has fastening holes at a pair of diagonally opposite corners for fastening the cooling device. The evaluation jig according to any one of claims 1 to 5.

7. a bottom surface of the bottom plate is formed with a first groove portion, a second groove portion, a third groove portion, and a fourth groove portion, into which the first support portion, the second support portion, the third support portion, and the fourth support portion are fitted, corresponding to the first support portion, the second support portion, the third support portion, and the fourth support portion, respectively; The evaluation jig according to claim 5 or 6.

8. The cooling device includes a flat top plate, a side wall annularly connected to the rear surface of the top plate, and a flat cooling bottom plate facing the top plate and connected to the rear surface of the side wall, the inlet and the outlet being formed inside the side wall in a plan view, and a gap between the top plate and the cooling bottom plate is configured in an annular shape on the side, the first side frame portion, the second side frame portion, the third side frame portion, and the fourth side frame portion include a first protrusion portion, a second protrusion portion, a third protrusion portion, and a fourth protrusion portion, respectively, which are convex and protrude toward the gap; The evaluation jig according to any one of claims 4 to 7.

9. the first protrusion, the second protrusion, the third protrusion, and the fourth protrusion each have a protrusion back surface facing the cooling bottom plate, the protrusion rear surface is inclined so that the tips of the first protrusion portion, the second protrusion portion, the third protrusion portion, and the fourth protrusion portion become narrower; The evaluation jig according to claim 8 .

10. front surfaces of the first side frame portion, the second side frame portion, the third side frame portion, and the fourth side frame portion are flush with the front surface of the top plate of the cooling device. The evaluation jig according to claim 8 or 9.

11. The frame portion is configured by connecting adjacent ends of the first side frame portion, the second side frame portion, the third side frame portion, and the fourth side frame portion. The evaluation jig according to any one of claims 4 to 10.

12. The frame portion further includes a pin that is inserted from the front surface of the frame portion into the adjacent meshed ends of the first side frame portion, the second side frame portion, the third side frame portion, and the fourth side frame portion, with the adjacent meshed ends being engaged with each other. The evaluation jig according to claim 11 .

13. A preparation process for preparing a semiconductor device having a cooling device at its bottom that is rectangular in plan view, and an evaluation tool that is attached to the semiconductor device and includes a bottom plate and a frame portion, the bottom plate being flat with the cooling device disposed on its front surface, and the frame portion surrounding the cooling device on all four sides together with the four sides of the bottom plate in plan view; a device placement step of placing the cooling device of the semiconductor device on the bottom plate; a frame attachment step of attaching the frame to the bottom plate so that the frame surrounds all four sides of the cooling device together with all four sides of the bottom plate in a plan view; A method for attaching an evaluation jig having the above structure.

14. In the preparing step, a carbon sheet is further prepared, the carbon sheet including an inlet opening formed in correspondence with an inlet formed in a bottom surface of the cooling device, and an outlet opening formed in correspondence with an outlet formed in the bottom surface of the cooling device, a sheet placement step of placing the carbon sheet on the front surface of the bottom plate before the device placement step; In the device placement step, the cooling device of the semiconductor device is placed on the bottom plate via the carbon sheet. A method for attaching the evaluation jig according to claim 13.

15. the frame portion includes a first side frame portion, a second side frame portion, a third side frame portion, and a fourth side frame portion that correspond to respective sides of the bottom plate and the cooling device in order in a plan view, In the frame portion attaching step, the first side frame portion, the second side frame portion, the third side frame portion, and the fourth side frame portion are attached to respective sides of the bottom plate and the cooling device. A method for attaching the evaluation jig according to claim 14.

16. the frame further includes flat plate-shaped first support portions, second support portions, third support portions, and fourth support portions extending outward at bottoms of the first side frame portion, the second side frame portion, the third side frame portion, and the fourth side frame portion, In the frame portion attachment step, the first side frame portion, the second side frame portion, the third side frame portion, and the fourth side frame portion are placed opposite the respective sides of the bottom plate and the cooling device, and are slid toward the respective sides, so that the bottom surface of the bottom plate is supported by the first support portion, the second support portion, the third support portion, and the fourth support portion. A method for attaching the evaluation jig according to claim 15.

17. The cooling device includes a flat top plate, a side wall annularly connected to the rear surface of the top plate, and a flat cooling bottom plate facing the top plate and connected to the rear surface of the side wall, the inlet and the outlet being formed inside the side wall in a plan view, and a gap between the top plate and the cooling bottom plate is configured in an annular shape on the side, the first side frame portion, the second side frame portion, the third side frame portion, and the fourth side frame portion each include a first protrusion portion, a second protrusion portion, a third protrusion portion, and a fourth protrusion portion, each of which is convex and protrudes perpendicularly outward; In the frame portion attaching step, the first side frame portion, the second side frame portion, the third side frame portion, and the fourth side frame portion are slid toward the respective sides of the bottom plate and the cooling device, and the first protrusion portion, the second protrusion portion, the third protrusion portion, and the fourth protrusion portion are inserted into the gaps. A method for attaching the evaluation jig according to claim 16.

18. In the frame portion attaching step, the first side frame portion, the second side frame portion, the third side frame portion, and the fourth side frame portion that have been slid are brought into contact with the respective sides of the bottom plate and the cooling device, Adjacent ends of the first side frame portion, the second side frame portion, the third side frame portion, and the fourth side frame portion are interlocked with each other, and a pin is inserted into the interlocked adjacent ends from the front surface. A method for attaching the evaluation jig according to claim 16 or 17.

19. The cooling device is attached to a semiconductor device having a bottom portion, the cooling device being rectangular in shape in a plan view and having an inlet through which a coolant flows into the inside and an outlet through which the coolant flows out of the inside provided on the bottom portion, a flat bottom plate having a front surface overlapping with a bottom surface of the cooling device, the cooling device being disposed on the front surface; a carbon sheet provided between the bottom plate and the cooling device, the carbon sheet having an inlet opening and an outlet opening formed thereon corresponding to the inlet and the outlet of the cooling device disposed on the bottom plate; An evaluation fixture including:

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