Frame and outer shroud for a laser processing system

Abstract

To provide a frame for a laser processing module.SOLUTION: A frame includes: a platform having an upper surface and a lower surface; an optics bridge separated from the upper surface of the platform and extending over the upper surface of the platform; and a bridge support interposed between and coupled to the platform and the optics bridge. The sandwich panel can include a first plate, a second plate, and a core interposed between the first plate and the second plate. The first plate and the second plate can be indirectly attached to each other by the core, and the core can define at least one channel extending between the first plate and the second plate. The sandwich panel can also include a first port and a second port that are formed at an exterior of the sandwich panel and in fluid communication with the at least one channel.SELECTED DRAWING: Figure 2

Description

Related Applications

[0001] This application claims the benefit of U.S. Provisional Patent Application No. 62 / 788,216, filed January 4, 2019, and U.S. Provisional Patent Application No. 62 / 746,364, filed October 16, 2018, each of which is incorporated herein by reference in its entirety.

[0002] I.Technical field SUMMARY OF THE INVENTION Embodiments of the present invention relate to frames, shrouds, signal communications, and related aspects used in processing systems, such as laser processing systems.

[0003] II. Description of Related Art Laser processing systems use a variety of gases to control and influence countless different aspects of the process. Gases are often used to hold substrates, collect debris, move parts, remove heat, stabilize temperatures, and the like. Routing and utilizing these gases can present a variety of problems and challenges. Using standard pipes, tubes, and hoses is often cumbersome, messy, and difficult. Passing large amounts of airflow over structural elements can have limited impact on process and structural stability. It is with these and other limitations of the prior art that the exemplary embodiments described in the following disclosure were developed. Overview

[0004] One embodiment described herein can be characterized as a frame for a laser processing module, including a platform having an upper surface and a lower surface, an optical component bridge spaced apart from and extending above the upper surface of the platform, and a bridge support disposed between the platform and the optical component bridge and coupled to the platform and the optical component bridge. At least one selected from the group consisting of the platform and the optical component bridge includes a sandwich panel. The sandwich panel can include a first plate, a second plate, and a core disposed between the first plate and the second plate. The first plate and the second plate are indirectly attached to each other by the core, and the core can define at least one channel extending between the first plate and the second plate. The sandwich panel can also include a first port formed on an exterior of the sandwich panel and fluidly connected to the at least one channel, and a second port formed on an exterior of the sandwich panel and fluidly connected to the at least one channel.

[0005] Another embodiment described herein can be characterized as a laser processing module for processing a workpiece, the laser processing module including a frame (e.g., as described above or elsewhere herein) and a laser source supported by the optical component bridge, wherein the workpiece is supportable on the platform.

[0006] Yet another embodiment described herein can be characterized as a laser processing module comprising a system frame and a laser source supported by the system frame, wherein the system frame can include at least one sandwich panel including two plates indirectly attached to one another by a core disposed therebetween.

[0007] Yet another embodiment described herein can be characterized as a laser processing module including a carbon dioxide laser capable of generating a laser beam having an average power of 200 W or more, and a frame, wherein the laser is supported by the frame, and the frame does not include at least one material selected from the group consisting of granite, diabase, and concrete.

[0008] Yet another embodiment described herein can be characterized as a laser processing module comprising a carbon dioxide laser capable of producing a laser beam having an average power of 200 W or more, and a frame, wherein the laser is supported by the frame, and the frame is supported on an exterior surface by three or less support pads.

[0009] Still other embodiments described herein may be characterized as a laser processing module comprising: a frame, a chuck supported by the frame and configured to support a workpiece within a process bay, a laser capable of generating a laser beam configured to process the workpiece, a visual signal processing system including at least one light emitting element capable of emitting light (e.g., the visual signal processing system capable of irradiating the light onto at least one object exposed in the process bay), and a controller communicatively coupled to the visual signal processing system, wherein the controller is capable of controlling the visual signal processing system to vary at least one characteristic of the light in response to at least one selected from the group consisting of a functional status of the laser processing module, a type of workpiece being processed in the laser processing module, a pattern of features formed in or on the workpiece during processing, a status of a production run, a throughput of the laser processing module, a cycle time during processing of a workpiece, and a takt time. [Brief explanation of the drawings]

[0010] [Figure 1]FIG. 1 is a front perspective view of a laser processing module according to one embodiment. [Figure 2-3] 2 and 3 are a front perspective view and a side view, respectively, of the laser processing module shown in FIG. 1, in which a shroud is configured to allow a user to access the interior of the laser processing module. [Figure 4-5] 4 and 5 are front and rear perspective views, respectively, of a system frame in the laser processing module shown in FIG. 1 according to one embodiment. [Figure 6] FIG. 6 is a cross-sectional perspective view of the base of the system frame shown in FIGS. 4 and 5 taken at a plane below the platform of the system frame, illustrating the placement of supports in one embodiment. [Figure 7] FIG. 7 is a bottom perspective view of the base of the system frame shown in FIGS. 4 and 5 in one embodiment. [Figure 8] FIG. 8 is an enlarged rear perspective view of an embodiment of the electronic exhaust system as shown in FIG. [Figure 9] FIG. 9 is an enlarged rear perspective view of an embodiment of the electronic exhaust system as shown in FIG. 16, with the outer plates removed to reveal the internal reinforcement. [Figure 10] FIG. 10 is an enlarged perspective view of the platform of the system frame in one embodiment shown in FIGS. 4 and 5, with the outer plates removed to reveal the internal stiffeners. [Figure 11] FIG. 11 is an enlarged perspective view of the vacuum connection system integrated into the platform of the system frame in one embodiment shown in FIGS. [Figure 12] FIG. 12 is a perspective view of the optical component bridge of the system frame in one embodiment shown in FIGS. 4 and 5, with the outer plates removed to reveal the internal stiffeners. [Figure 13-14]13 and 14 are cross-sectional perspective views taken along different planes intersecting the optical component bridge and platform of the system frame shown in FIGS. [Figure 15] FIG. 15 is an enlarged perspective view of the underside of the optical component bridge with dashed lines depicting paths through which fluids (eg, including one or more gases and debris generated during processing of a workpiece) may be transported. [Figure 16] FIG. 16 is an enlarged perspective view of the optics bay purge system in one embodiment as shown in FIG. [Figure 17] Figure 17 is a perspective view of the purge system shown in Figures 12 and 16, highlighting the tubing that fluidly connects the purge system in one embodiment to the inlets formed in the walls of the system frame shown in Figures 4 and 5. In Figure 17, the purge connection tubing is highlighted to show its configuration within the system frame. Detailed Description of the Preferred Embodiments

[0011] Examples of embodiments will now be described with reference to the accompanying drawings. Unless explicitly stated, in the drawings, the sizes, positions, etc. of components, features, elements, etc., and the distances therebetween, are not necessarily to scale and have been exaggerated for clarity. Like numbers refer to like elements throughout the drawings. Thus, the same or similar numbers may be described with reference to other drawings even if they are not mentioned or described in the corresponding drawings. Also, elements without reference numbers may be described with reference to other drawings.

[0012] The terminology used in the specification is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. As used herein, the singular is intended to include the plural unless the content clearly dictates otherwise. Furthermore, it should be understood that the terms "comprises" and / or "comprising," when used herein, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. Unless otherwise indicated, when a range of values ​​is recited, the range includes the upper and lower limits, as well as any subranges between the upper and lower limits of the range. Unless otherwise indicated, terms such as "first" and "second" are used merely to distinguish elements from one another. For example, one node can be referred to as a "first node," and similarly, another node can be referred to as a "second node," or vice versa.

[0013] Unless otherwise indicated, the terms "about," "around," "approximately," and the like mean that amounts, sizes, compositions, parameters, and other quantities and characteristics are not, and need not be, exact, but may be approximate and / or larger or smaller, as appropriate, or to reflect tolerances, conversion factors, rounding, measurement error, and the like, as well as other factors known to those skilled in the art. Spatially relative terms such as "below," "down," "lower," "upper," and "above" may be used herein for ease of description when describing the relationship of an element or feature to another element or feature, as depicted in the figures. It should be understood that spatially relative terms are intended to encompass different orientations in addition to those depicted in the figures. For example, an element described as being "below" or "below" another element or feature would be oriented "above" that other element or feature if the object in the figure were inverted. Thus, the exemplary term "below" can encompass both an orientation of above and below. If the object is oriented in other ways (e.g., rotated 90 degrees or at other orientations), the spatially relative descriptors used herein may be interpreted accordingly.

[0014] The section headings used herein, unless specifically stated, are for organizational purposes only and should not be construed as limiting the subject matter described. It will be understood that many different forms, embodiments, and combinations are possible without departing from the spirit and teachings of the present disclosure, and that the present disclosure should not be construed as limited to the example embodiments set forth herein. Rather, these examples and embodiments are provided so that this disclosure will be complete and all-inclusive, and will fully convey the scope of the disclosure to those skilled in the art.

[0015] I. Overview

[0003] Embodiments described herein generally relate to frames, outer shrouds, visual status indicators, and components thereof for laser processing systems capable of processing, altering, or modifying a workpiece. Generally, a workpiece can be fully or partially processed by irradiating the workpiece with a beam of laser energy to heat, melt, vaporize, ablate, crack, bleach, abrade, roughen, carbonize, foam, or otherwise modify one or more characteristics or properties (e.g., chemical composition, atomic structure, ionic structure, molecular structure, electronic structure, microstructure, nanostructure, density, viscosity, refractive index, magnetic permeability, dielectric constant, texture, color, hardness, transmissivity to electromagnetic radiation, etc., or any combination thereof) of one or more materials forming the workpiece. Processing may occur external to the workpiece or entirely within the workpiece.

[0016] Specific examples of processes that can be performed with the disclosed laser processing apparatus include via drilling or other hole formation, cutting, punching, welding, scribing, engraving, marking (e.g., surface marking, subsurface marking, etc.), laser-induced forward transfer, cleaning, bleaching, bright pixel repair (e.g., color filter darkening, OLED material modification, etc.), film removal, surface texturing (e.g., roughening, smoothing, etc.), or the like, or any combination thereof. Thus, one or more features that may be formed on or in a workpiece as a result of processing may include openings, slots, vias or other holes, grooves, trenches, scribe lines, kerfs, recesses, conductive traces, ohmic contacts, resistor patterns, human-readable or machine-readable indicia (e.g., comprising one or more areas in or on the workpiece having one or more visually or texturally distinct characteristics), or the like, or any combination thereof. Apertures, slots, vias, holes, and other features may have any suitable or desirable shape when viewed from above (e.g., circular, oval, square, rectangular, triangular, tubular, or the like, or any combination thereof). Furthermore, apertures, slots, vias, holes, and other features may extend completely through the workpiece (e.g., to form so-called "through vias," "through holes," etc.) or may extend only partially through the workpiece (e.g., to form so-called "blind vias," "blind holes," etc.).

[0017] The workpieces that can be machined can be generally characterized as being formed from one or more metals, polymers, ceramics, composites, or any combination thereof (e.g., whether alloys, compounds, mixtures, solutions, composites, etc.). Thus, materials that may be processed include one or more metals such as Al, Ag, Au, Cr, Cu, Fe, In, Mg, Mo, Ni, Pt, Sn, Ti, and the like, or any combination thereof (e.g., whether alloyed, composite, etc.), conductive metal oxides (e.g., ITO, etc.), transparent conductive polymers, ceramics, waxes, resins, interlayer dielectric materials (e.g., silicon oxide, silicon nitride, silicon oxynitride, etc., low-k dielectric materials such as methyl silsesquioxane (MSQ), hydrogen silsesquioxane (HSQ), fluorotetraethyl orthosilicate (FTEOS), etc., or any combination thereof), organic dielectric materials (e.g., SILK, benzocyclobutene, Nautilus (all manufactured by Dow), polyfluorotetraethylene (manufactured by DuPont), FLARE (Allied or any combination thereof), semiconductor or optical element substrate materials (e.g., Al2O3, AlN, BeO, Cu, GaAS, GaN, Ge, InP, Si, SiO2, SiC, Si 1-x Ge x(0.0001 < x < 0.9999), or any combination thereof or alloys), glass (e.g., fused quartz, soda-lime glass, sodium borosilicate glass, lead oxide glass, aluminosilicate glass, germanium oxide glass, aluminate glass, phosphate glass, borate glass, chalcogenide glass, amorphous metal, etc., or any combination thereof), sapphire, polymer materials (e.g., polyamide, polyimide, polyester, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyacetal, polycarbonate, modified polyphenylene ether, polybutylene terephthalate, polyphenylene sulfide, polyethersulfone, polyetherimide, polyetheretherketone, liquid crystal polymer, acrylonitrile butadiene styrene, or any compound, composite, or alloy thereof), leather, paper, assembly materials (e.g., Ajinomoto build-up film also known as "ABF"), solder resist, etc., or any composite, laminate, or other combination thereof is included.

[0018] Specific examples of workpieces that may be processed include printed circuit board (PCB) panels (also referred to herein as "PCB panels"), PCBs, PCB laminates (e.g., FR4, high Tg epoxy, BT, polyimide, etc., or any combination thereof), PCB laminate prepregs, substrate-like PCBs (SLPs), flexible printed circuit (FPC) panels (also referred to herein as "FPC panels"), FPCs, laminates for FPCs (also referred to as "FPC laminates"), coverlay films, integrated circuits (ICs), IC substrates, IC packages (ICPs), light emitting diodes (LEDs), LED packages, semiconductor wafers, electronic or optical device substrates, interposers, lead frames, lead frame blanks, display substrates (e.g., Examples of suitable substrates include substrates having formed thereon TFTs, color filters, organic light emitting diode (OLED) arrays, quantum dot (QD) LED arrays, and the like, or any combination thereof, lenses, mirrors, turbine blades, powders, films, foils, plates, molds (e.g., wax molds, molds for injection molding or investment casting processes, etc.), textiles (woven fabrics, felt, etc.), surgical instruments, medical implants, packaged products, shoes, bicycles, automobiles, automobile or aviation parts (e.g., frames, body panels, etc.), appliances (e.g., microwave ovens, ovens, refrigerators, etc.), device housings (e.g., for watches, computers, smartphones, tablet computers, wearable electronic devices, etc., or any combination thereof).

[0019] Generally, a laser processing system includes a laser source capable of generating a beam of laser energy and at least one positioner. Laser processing systems also typically include a positioner that positions the laser energy beam generated by the laser source before it reaches the workpiece. FocusingThe laser processing system may include one or more optical elements (e.g., harmonic generating crystals, beam expanders, beam shapers, apertures, filters, collimators, lenses, mirrors, polarizers, wave plates, diffractive optical elements, refractive optical elements, optical shutters, prisms, pulse gating or picking devices, etc., or any combination thereof) used to converge, expand, collimate, shape, wavelength convert, polarize, filter, split, combine, crop, or otherwise modify, condition, etc. The laser processing system may also include one or more other devices that support the operation of the laser source and at least one positioner. Examples of such other devices include a controller, a computer, a chiller, a fan, a sensor, a vacuum system, etc.

[0020] The laser energy beam output by the laser source can have one or more wavelengths in the ultraviolet (UV), visible, or infrared (IR) regions of the electromagnetic spectrum. Laser light in the UV region of the electromagnetic spectrum can have one or more wavelengths in the range of 10 nm (or thereabouts) to 385 nm (or thereabouts), such as 100 nm, 121 nm, 124 nm, 157 nm, 200 nm, 334 nm, 337 nm, 351 nm, 380 nm, etc., or wavelengths between any of these values. Laser light in the visible green region of the electromagnetic spectrum can have one or more wavelengths in the range of 500 nm (or thereabouts) to 560 nm (or thereabouts), such as 511 nm, 515 nm, 530 nm, 532 nm, 543 nm, 568 nm, etc., or wavelengths between any of these values. Laser light in the IR region of the electromagnetic spectrum may have one or more wavelengths in the range of 750 nm (or thereabouts) to 15 μm (or thereabouts), such as 600 nm to 1000 nm, 752.5 nm, 780 nm to 1060 nm, 799.3 nm, 980 nm, 1047 nm, 1053 nm, 1060 nm, 1064 nm, 1080 nm, 1090 nm, 1152 nm, 1150 nm to 1350 nm, 1540 nm, 2.6 μm to 4 μm, 4.8 μm to 8.3 μm, 9.4 μm, 10.6 μm, etc., or wavelengths between any of these values.

[0021] The laser energy beam output by the laser source can optionally be represented as a train of laser pulses having pulse widths (i.e., based on the full width at half maximum (FWHM) of the optical power in the pulse with respect to time) ranging from 10 fs to 900 ms, although it will be understood that the pulse durations can be shorter than 10 fs or longer than 900 ms. Thus, the at least one laser pulse output by the laser source may be 10 fs, 15 fs, 30 fs, 50 fs, 100 fs, 150 fs, 200 fs, 300 fs, 500 fs, 600 fs, 750 fs, 800 fs, 850 fs, 900 fs, 950 fs, 1 ps, 2 ps, 3 ps, 4 ps, 5 ps, 7 ps, 10 ps, ​​15 ps, 25 ps, 50 ps, ​​75 ps, 100 ps, ​​200 ps, ​​500 ps, ​​1 ns, 1.5 ns, 2 ns, 5 ns, 10 ns, 20 ns, 50 ns, 100 The pulse duration may be shorter, longer, or equal to ns, 200 ns, 400 ns, 800 ns, 1000 ns, 2 μs, 5 μs, 10 μs, 15 μs, 20 μs, 25 μs, 30 μs, 40 μs, 50 μs, 100 μs, 300 μs, 500 μs, 900 μs, 1 ms, 2 ms, 5 ms, 10 ms, 20 ms, 50 ms, 100 ms, 300 ms, 500 ms, 900 ms, 1 s, etc., or any value between these values.

[0022] The laser energy beam output by the laser source can have an average power ranging from 5 mW to 50 kW. However, it will be understood that the average power can be less than 5 mW or greater than 50 kW. Thus, the laser energy beam output by the laser source can have an average power less than, greater than, or equal to 5 mW, 10 mW, 15 mW, 20 mW, 25 mW, 50 mW, 75 mW, 100 mW, 300 mW, 500 mW, 800 mW, 1 W, 2 W, 3 W, 4 W, 5 W, 6 W, 7 W, 10 W, 15 W, 18 W, 25 W, 30 W, 50 W, 60 W, 100 W, 150 W, 200 W, 250 W, 500 W, 2 kW, 3 kW, 20 kW, 50 kW, etc., or any value between these values.

[0023] When the laser energy beam is represented as a train of laser pulses, the laser energy beam may be output by the laser source at a pulse repetition rate ranging from 5 kHz to 5 GHz, although it will be understood that the pulse repetition rate may be less than 5 kHz or greater than 5 GHz. Thus, laser pulses can be output by the laser source at pulse repetition rates less than, greater than, or equal to 5 kHz, 50 kHz, 100 kHz, 175 kHz, 225 kHz, 250 kHz, 275 kHz, 500 kHz, 800 kHz, 900 kHz, 1 MHz, 1.5 MHz, 1.8 MHz, 1.9 MHz, 2 MHz, 2.5 MHz, 3 MHz, 4 MHz, 5 MHz, 10 MHz, 20 MHz, 50 MHz, 60 MHz, 100 MHz, 150 MHz, 200 MHz, 250 MHz, 300 MHz, 350 MHz, 500 MHz, 550 MHz, 600 MHz, 900 MHz, 2 GHz, 10 GHz, etc., or any value between these values.

[0024] In addition to wavelength, pulse duration, average power, and pulse repetition rate, the laser pulses irradiating the workpiece may be characterized by one or more other properties, such as pulse energy, peak power, etc. Such properties determine the optical intensity (W / cm) sufficient to process the workpiece (e.g., to form one or more features having one or more desired properties). 2 (measured in J / cm) and fluence (J / cm 2 The laser beam may be selected (e.g., based on one or more other characteristics, such as wavelength, pulse duration, average power, pulse repetition rate, etc., as needed) to illuminate a process spot on the workpiece with a laser beam (measured by a laser beam intensity (e.g., irradiance) of 1000 Å or more) at a wavelength of 1000 Å or more.

[0025] Examples of types of lasers that can characterize a laser source include gas lasers (e.g., carbon dioxide lasers, carbon monoxide lasers, excimer lasers, etc.), solid-state lasers (e.g., Nd:YAG lasers, etc.), rod lasers, fiber lasers, photonic crystal rod / fiber lasers, passively modelocked solid-state bulk or fiber lasers, dye lasers, modelocked diode lasers, pulsed lasers (e.g., ms pulsed lasers, ns pulsed lasers, ps pulsed lasers, fs pulsed lasers), CW lasers, quasi-CW lasers, etc., or any combination thereof. Depending on the configuration, gas lasers (e.g., carbon monoxide lasers, carbon dioxide lasers, etc.) can be configured to operate in one or more modes (e.g., CW mode, quasi-CW mode, pulsed mode, or any combination thereof). Specific examples of laser sources that can be provided as the laser source include BOREAS, HEGOA, SIROCCO, or CHINOOK series lasers manufactured by EOLITE, PYROFLEX series lasers manufactured by PYROPHOTONICS, PALADIN Advanced 355 or DIAMOND series (e.g., DIAMOND E series, G series, J-2 series, J-3 series, J-5 series), FLARE NX series, MATRIX QS DPSS series, MEPHISTO Q series, AVIA LX series, AVIA NX series, RAPID NX series, HYPERRAPID NX series, RAPID series, HELIOS series, FIDELITY series, MONACO series, OPERA series, or RAPID FX series lasers manufactured by COHERENT, and PALADIN Advanced 355 series and DIAMOND series (e.g., DIAMONDE series, G series, J-2 series, J-3 series, J-5 series), ASCEND series, EXCELSIOR series, EXPLORER series, HIPPO series, NAVIGATOR series, QUATA-RAY series, QUASAR series, SPIRIT series, TALON series, or VGEN series lasers, PULSTAR series or FIRESTAR series lasers manufactured by SYNRAD, TRUFLOW series lasers (e.g., TRUFLOW 2000, 2600, 3000, 3200, 3600, 4000, 5000, 6000, 8000, 10000, 12000, 15000, 20000), TRUCOAX series lasers (e.g., TRUCOAX 1000) or TRUDISK series, TRUPULSE series, TRUDIODE series, TRUFIBER series, or TRUMICRO series lasers, FCPA μJEWEL or FEMTOLITE series lasers manufactured by IMRA AMERICA, TANGERINE and SATSUMA series lasers (and MIKAN and T-PULSE series oscillators) manufactured by AMPLITUDE SYSTEMES, IPGand one or more laser sources such as the CL series, CLPF series, CLPN series, CLPNT series, CLT series, ELM series, ELPF series, ELPN series, ELPP series, ELR series, ELS series, FLPN series, FLPNT series, FLT series, GLPF series, GLPN series, GLR series, HLPN series, HLPP series, RFL series, TLM series, TLPN series, TLR series, ULPN series, ULR series, VLM series, VLPN series, YLM series, YLPF series, YLPN series, YLPP series, YLR series, YLS series, FLPM series, FLPMT series, DLM series, BLM series, or DLR series lasers manufactured by PHOTONICS (including, for example, GPLN-100-M, GPLN-500-QCW, GPLN-500-M, GPLN-500-R, GPLN-2000-S, etc.), or the like, or any combination thereof.

[0026] The at least one positioner can move the laser energy beam relative to the workpiece (in which case the at least one positioner can be provided as one or more galvanometer mirrors, polygon scanning mirrors, fast steering mirrors, acousto-optic deflectors, electro-optic deflectors, etc., or any combination thereof), or can move the workpiece relative to the laser energy beam (in which case the at least one positioner can be provided as one or more linear motion stages, rotary motion stages, etc., or any combination thereof), or any combination thereof.

[0027] To the extent that any of the laser source, optical elements, or positioners affect the ability of the laser processing system to accurately and reliably apply a beam of laser energy to a specific location on or within a workpiece (or within a certain range of a specific location), such elements are collectively referred to herein as "process components."

[0028] As described in more detail below, a laser processing system includes a laser source, at least one positioner, and a system frame for supporting any of the optical elements or other devices described above. The laser processing system may also include one or more shrouds to minimize or prevent particulate matter (whether generated during processing of a workpiece or present in the environment external to the laser processing system) from accumulating on the optical surfaces of the laser source and optical elements. The one or more shrouds may also help prevent or minimize particulate matter generated during processing of a workpiece (such particulate matter may potentially be harmful to human health) from spreading to the external environment surrounding the laser processing system.

[0029] II. Outer Shroud Embodiments Referring generally to FIGS. 1 through 3 , the laser processing systems described above may include a laser processing module, such as laser processing module 100. Although not shown, laser processing module 100 may include a laser source (e.g., as described above), at least one positioner (e.g., as described above), one or more optical elements (e.g., as described above), and one or more other devices (e.g., as described above). Laser processing module 100 includes a system frame (partially shown in FIGS. 1 and 3 but more clearly and completely shown in FIGS. 4 through 6 ) for supporting the laser source, at least one positioner, and any of the optical elements or other devices described above. Laser processing module 100 also includes multiple outer shrouds that define the appearance (e.g., at least structurally) of laser processing module 100. The outer shrouds may be attached to the system frame, to each other, or a combination thereof.

[0030] The outer shrouds may include a process bay shroud 102 mounted to the system frame, a first door shroud 104 mounted to the first shroud 102, a plurality of second door shrouds 106 mounted to the system frame, a plurality of third door shrouds 108 mounted to the system frame, and an optics bay door shroud 110 mounted to the system frame. One or more user interface components may be integrated into any of the outer shrouds. For example, a user interface component such as a computer monitor 101 (e.g., a display screen, a touch screen, etc.) may be integrated into the first shroud 102 to display information to a user. The first shroud 102 may also include a bay 103 for providing a user interface component such as a keyboard, trackpad, computer mouse, microphone, or other device to allow a user to input information (e.g., to control one or more operations supported by the laser processing module 100 or, more generally, to control the laser processing system). The user interface component may be communicatively coupled to one or more other devices (e.g., one or more controllers, computers, etc.) that support the operation of the laser source, at least one positioner, or other devices (e.g., one or more chillers, fans, sensors, vacuum devices, etc.).

[0031] Generally, the process bay shroud 102 is defined in part by the system frame and encloses a space (also referred to herein as a "process bay") in which a workpiece can be supported during processing. Thus, laser energy is present within the process bay when a workpiece is being processed. In the illustrated embodiment, the process bay shroud 102 includes one or more ports (e.g., port 112) formed in its side through which a workpiece can be loaded into the laser processing module 100 (e.g., from a loader module, not shown, attached to the laser processing module 100) or unloaded from the laser processing module 100 (e.g., to an unloader module, not shown, attached to the laser processing module 100). In this case, the loader module and unloader module can be considered part of the laser processing system. However, in other embodiments, the process bay shroud 102 does not include any such ports and thus extends to the system frame on all sides of the space in which a workpiece can be supported during processing.

[0032] The first door shroud 104 is mounted to the process bay shroud 102 so that it can rotate, for example, from the state shown in FIG. 1 to the state shown in FIG. 2 and FIG. 3. Optionally, the first door shroud 104 may include a window 114 (e.g., to allow a person to look into the process bay). The window 114 may be provided to filter or block the propagation of light at the wavelength of the laser energy beam, as known in the art. The plurality of second door shrouds 106 are mounted to the system frame so that they can rotate, for example, from the state shown in FIG. 1 to the state shown in FIG. 2 and FIG. 3.

[0033] When the first door shroud 104 and the plurality of second door shrouds 106 are in the “open” position (e.g., as shown in FIGS. 2 and 3 ), a person (e.g., an operator, a technician, etc.) can access the process bay. Accessing the process bay can involve cleaning, removing, replacing, installing, aligning, etc., one or more objects disposed within the process bay. Examples of objects that can be disposed within the process bay include a workpiece, a scan lens, a galvanometer mirror, a vacuum debris capture nozzle, a chuck, a motion stage, etc. As described in more detail below, a recess may be formed in the system frame to allow a person to enter the process bay when the first door shroud 104 and the plurality of second door shrouds 106 are in the “open” position (e.g., as shown in FIGS. 2 and 3 ). In this manner, the system frame allows a person to easily access the process bay to clean, remove, replace, install, align, etc., one or more objects disposed within the process bay.

[0034] The plurality of third door shrouds 108 may be mounted to the system frame so as to be rotatable, for example, from the state shown in Figure 1 to an "open" state similar to the state of any of the plurality of second door shrouds 106 shown in Figures 2 and 3. When any of the third door shrouds 108 is in the open state, a person (e.g., an operator, technician, etc.) can access an electronics bay within the system frame. electronic When accessing the bay, one or more objects located within the electronics bay can be cleaned, removed, replaced, installed, aligned, etc. Examples of objects that can be located within the electronics bay include one or more controllers, computers, pumps, chillers, fans, etc.

[0035] Generally, the optics bay door shroud 110 is partially defined by the system frame and surrounds a space (also referred to herein as the "optics bay") in which the laser source and any of the optical elements described above are housed. The optics bay door shroud 110 is mounted to the system frame so that it can be rotated, for example, from the state shown in FIG. 1 to an "open" state similar to the open state of the first door shroud 104 shown in FIGS. 2 and 3. When the optics bay door shroud 110 is in the open state, personnel (e.g., operators, technicians, etc.) can access the optics bay. Access to the process bay allows for cleaning, removal, replacement, installation, alignment, etc. of the laser source, one or more optical elements, or other objects located within the optics bay.

[0036] III. System Frame Embodiments Generally, the system frame can be characterized as including a plurality of sandwich panels interconnected to support or house a laser source, at least one positioner, any of the optical elements or other devices described above. As used herein, "sandwich panel" refers to a structure in which a pair of relatively thin, strong, and rigid plates are indirectly attached to one another by a core interposed between the plates. In one embodiment, the plates are formed from a material such as sheet metal (e.g., steel). The core is typically provided as one or more plates, tubes, etc. (each collectively referred to herein as "stiffeners") attached to the plates, or any combination thereof. Generally, the dimensions, mechanical properties (e.g., which may include one or more of elastic modulus, tensile strength, elongation, hardness, and fatigue limit), number, and arrangement of the stiffeners in the core are selected to ensure that the plates of the sandwich panel maintain their relative positions during loading (e.g., mechanical loading, thermal loading, etc.) of the sandwich panel. In one embodiment, the plates and stiffeners are formed from a material such as sheet metal (which may be formed, for example, from steel), and each plate is attached to the stiffener (e.g., by welding, adhesive, the like, or a combination thereof). In one embodiment, each stiffener may be formed as a perforated or non-perforated plate.

[0037] If properly designed, the sandwich panels of the system frame can help to at least partially isolate the process components from external vibrations (i.e., vibrations present in the environment surrounding the laser processing system) and internal vibrations (i.e., vibrations generated within the laser processing module 100, such as during operation of the at least one positioner) without requiring the use of a large mass base, gantry, or other support that is conventionally formed as a block of granite, diabase, concrete, steel, wood, etc. Furthermore, if properly designed, the sandwich panels of the system frame can help to support the laser source, at least one positioner, any of the optical elements or other devices described above without requiring the use of a tubular beam frame structure.

[0038] Additionally, as described in more detail below, internal channels may be formed within the system frame to perform one or more functions such as purging the optical component bay, debris extraction, heat extraction, thermal loading stabilization, vacuum chucking, hose and cable routing, and the like, or any combination thereof.

[0039] As exemplarily shown in Figures 4 and 5, in one embodiment, the system frame may be provided as a system frame 400 including a base 402, a platform 404, and an optical component bridge 406. The base 402 supports the platform 404, which in turn supports the optical component bridge 406. Also shown in Figures 4 and 5 is a motion stage 401 mounted to the platform 404 and a chuck 403 mounted to the motion stage 401. Although not shown, the optical component bridge may support or house one or more objects, such as a laser source, any of the optical elements described above, any of the positioners described above capable of moving the laser energy beam relative to a workpiece, a vacuum debris capture nozzle, etc., or any combination thereof.

[0040] In the illustrated embodiment, motion stage 401 is a so-called "stacked" motion stage (i.e., a motion stage assembly in which one motion stage is mounted on and carried by another motion stage). Motion stage 401 is configured to linearly move chuck 403 along two motion axes (e.g., in a plane parallel to the top surface of platform 404). However, in other embodiments, motion stage 401 may be configured to linearly move chuck 403 along a single motion axis, or to move the chuck along more than two motion axes (e.g., linearly, rotationally, or any combination thereof). Chuck 403 may be provided as a vacuum chuck, electrostatic chuck, mechanical chuck, magnetic chuck, etc., or any combination thereof.

[0041] A. Base-Related Embodiments For example, with reference to FIGS. 4-9, the base 402 includes a foundation panel 408, a plurality of base supports 410a, and a plurality of base supports 410b (collectively referred to as base supports 410).

[0042] Generally, the exterior side of the foundation panel 408 is defined by a plurality of exterior walls (e.g., a front exterior wall 412a, a recessed exterior wall 412b, a lateral exterior wall 412c, and a rear exterior wall 412d). The spaces between the front exterior walls 412a, which are laterally spaced apart by the recessed exterior wall 412b, help define the aforementioned recesses in the system frame 400, thereby allowing personnel access to the process bays as described above. As shown in FIGS. 5 and 9, the rear exterior wall 412d defines a plurality of openings 414. While the openings 414 are illustrated as being defined in the rear exterior wall 412d, it will be understood that one or more openings 414 may additionally or alternatively be defined in one or more of the aforementioned exterior walls.

[0043] The foundation panel 408 may be provided as a sandwich panel formed from a pair of plates (e.g., a first foundation plate 416a and a second foundation plate 416b) and a core (e.g., provided as a plurality of stiffeners 416c as shown in FIG. 9). As shown in FIG. 9, the stiffeners 416c may have holes (i.e., openings 418) formed therein. The size, number, and placement of the openings 418 in the stiffeners 416c may be selected to facilitate airflow in the space between the first foundation plate 416a and the second foundation plate 416b (within the foundation panel 408), to facilitate routing of cables or hoses to different areas within the foundation panel 408, or the like, or a combination thereof.

[0044] 8, one or more openings 800 may be formed in the first base plate 416a to fluidly connect the interior of the foundation panel 408 with an area exterior to the foundation panel 408. In one embodiment, one or more fans (not shown) may be provided (e.g., adjacent to or within one or more of the openings 800) to draw air from the exterior of the foundation panel 408 into the interior. The size, number, and placement of the openings 418 in the stiffener 416c may also facilitate airflow through the interior of the foundation panel 408 and out of the interior of the foundation panel 408 (e.g., as drawn by one or more fans) through the openings 414. FIG. 9 also illustrates how the openings 800 may be formed within the interior of the foundation panel 408.

[0045] Referring to FIG. 7 , system frame 400 may include multiple support pads 700 attached to second base plate 416b of foundation panel 408. As described above, the sandwich panels of system frame 400 may serve to preferably isolate process components from external and internal vibrations (at least to a suitable or beneficial degree) without requiring the use of large mass bases, gantries, or other supports conventionally formed as blocks of granite, diabase, concrete, steel, wood, or the like. System frame 400 of laser processing module 100 may be small, lightweight, and sturdy enough that only three support pads 700 can suitably support laser processing module 100 (e.g., on a manufacturing facility floor or other platform). Thus, assuming the manufacturing facility floor is sufficiently level, laser processing module 100 will also be level (assuming support pads 700 are uniform distances from system frame 400) or can be quickly leveled (e.g., by adjusting only one support pad 700).

[0046] Generally, the base support 410 extends from a base panel 408 of the platform 404. The base support 410 may be secured to the base panel 408 of the platform 404 in any suitable or desirable manner (e.g., by welding, adhesive, screws, rivets, clamps, etc., or any combination thereof). One or more areas between the base panel 408, the platform 404, and the base support 410 may be used as an electronics bay that may house one or more controllers, computers, pumps, chillers, fans, etc., as described above.

[0047] For example, with reference to FIGS. 4-6 , the base support 410 may include a plurality of beams 410 a and a plurality of plates 410 b. The beams 410 a may be provided as tubular beams disposed along the periphery of the base panel 408. The plates 410 b may be disposed along the periphery of the base panel 408 within a central region of the base panel 408 (e.g., as shown). Openings of various sizes and shapes may be formed in the plates 410 b to facilitate airflow between different regions between the base panel 408 and the platform 404, to facilitate cable or hose routing between different regions between the base panel 408 and the platform 404, or for any other suitable or desirable purpose. Notwithstanding the above, it will be understood that the number, type, and arrangement of the base supports 410 within the base 402 may differ from those shown in the drawings and may be selected as suitable or desirable.

[0048] 6, the base 402 may include a plurality of attachment structures (e.g., posts) attached to a portion of the base support (e.g., to a portion of the beam 410a). Each of the plurality of second door shrouds 106 may be connected to a respective first attachment structure 600. Similarly, each of the plurality of third door shrouds 108 may be connected to a respective second attachment structure 602.

[0049] B. Platform Implementation For example, with reference to Figures 4, 5, 10, 11, 13, and 14, the platform 404 may be provided as a sandwich panel formed from a pair of plates (e.g., a first platform plate 420a and a second platform plate 420b) and a core (e.g., provided as a plurality of stiffeners 420c as shown in Figure 9). As shown in Figures 10, 13, and 14, the stiffeners 420c may have holes (i.e., openings 422) formed therein. The size, number, and placement of the openings 422 in the stiffeners 420c may be selected to facilitate airflow in the space between the first and second platform plates 420a and 420b (within the platform 404), to facilitate routing of cables or hoses to different areas within the platform 404, or the like, or a combination thereof. Referring to FIG. 10, the placement of the stiffeners 420c between the first platform plate 420a and the second platform plate 420b, the number, size, and placement of the openings 422 in the stiffeners 420c, or any combination thereof, may be selected or provided to advantageously or preferably facilitate the flow of air through at least a majority of the interior of the platform 404.

[0050] Generally, the outer side of the platform 404 is defined by a plurality of outer walls (e.g., a front outer wall 424a, a recessed outer wall 424b, a lateral outer wall 424c, and a rear outer wall 424d). The spaces between the front outer walls 424a, which are laterally spaced apart by the recessed outer wall 424b, help define the aforementioned recesses in the system frame 400, thereby allowing personnel access to the process bays as described above. As shown in FIGS. 5 and 9, a plurality of openings 414 are formed in the rear outer wall 412d. While the openings 414 are shown as being formed in the rear outer wall 412d, it will be understood that one or more openings 414 may additionally or alternatively be formed in one or more of the aforementioned outer walls.

[0051] 11 , the platform 404 may also include a chuck connection module (e.g., integrated within the platform 404). The chuck connection module may include a first connection port 1100 (e.g., formed in the rear outer wall 424d) and one or more second connection ports 1102 (e.g., formed in the first platform plate 420a). The chuck connection module may define a plenum sealed from other portions of the interior of the platform 404 (e.g., to prevent fluid transfer from the plenum into the interior of the platform 404). The first connection port 1100 is fluidly connected to each of the second connection ports 1102 via the plenum. Electrical cables or vacuum hoses may be routed through the chuck connection module such that one end of the cable or hose can be suitably connected to a chuck (e.g., chuck 403).

[0052] 13, one or more openings 1300 (also referred to herein as "platform openings") may be formed in the platform 404 (e.g., in the first platform plate 420a as shown, or in the second platform plate 420b, or in any of the outer walls 424a, 424b, 424c, or 424d, or any combination thereof) to fluidly connect the platform 404 to an area external to the platform 404. As described in more detail below, a fluid (e.g., air, nitrogen, etc.) may be introduced into the interior of the platform 404 through the platform openings 1300, or removed from the interior of the platform 404 through the platform openings 1300, or a combination thereof.

[0053] C. Optical Component Bridge Embodiments 4, 5, 12, and 14, the optical component bridge 406 includes an optical component table 500, an optical component wall 502, and a process wall 426. The optical component bridge 406 may be mounted on the platform 404 by a pair of opposing bridge supports 116a and 116b. Generally, the bridge supports 116a and 116b are referred to herein simply as "bridge supports 116." Generally, the optical component table 500, the optical component wall 502, and the bridge supports 116, together with the optical component bay shroud 110, help to define the aforementioned optical component bay. The aforementioned process bay shroud 102 may be attached to the system frame 400 at the optical component bridge 406 (e.g., at an upper shelf 428 extending between the optical component wall 502 and the process wall 426, at an outer surface of the bridge support 116, at the front of the support 430, or at a combination thereof). Similarly, the optics bay shroud 110 may be attached to the system frame 400 at the optics bridge 406 (eg, at the upper shelf 428 of the optics bridge 406).

[0054] Generally, the optical component table 500, the optical component wall 502, or a combination thereof can support a laser source. The optical component wall 502, and optionally the optical component table 500, can support any of the optical elements described above, any of the positioners described above that can move the laser energy beam relative to the workpiece, the like, or any combination thereof. Similarly, the process wall 426 can support any of the optical elements described above, any of the positioners described above that can move the laser energy beam relative to the workpiece, the like, or any combination thereof. However, typically, a scan lens (not shown) is supported by (i.e., mounted to) the process wall 426 to focus the incident laser energy beam before it is irradiated onto the workpiece. Although not shown, a positioner such as a galvo block (e.g., including a pair of orthogonally rotatable galvanometer mirrors) is also supported by (i.e., mounted to) the process wall 426 to move the incident laser energy beam before it is transmitted to the scan lens, as is known in the art.

[0055] The optical bridge 406 further includes one or more optical ports, such as optical port 432, that extend from the optical wall 502 to the process wall 426 and allow the laser energy beam to propagate from the optical bay to the process bay (e.g., using one or more mirrors, prisms, etc., by known methods known to those skilled in the art).

[0056] 12-14, the optical component table 500, the optical component wall 502, and the process wall 426 are different sides of a common bridge panel provided as a sandwich panel formed from a pair of plates (e.g., a first bridge plate and a second bridge plate) and a core (e.g., provided as stiffeners 1200). In this case, as best shown in FIGS. 13 and 14, the first bridge plate can be bent to form the optical component table 500 and the optical component wall 502, and the second bridge plate can be bent to form the process wall 426 (e.g., parallel to the optical component wall 502) and also extend below the optical component table 500 (e.g., parallel to the optical component table 500). As shown in Figures 12-14, stiffener 1200 may have holes formed therein, the size, number, and placement of which may be selected to facilitate airflow in the space between the first and second bridge plates (within the bridge panel), or to facilitate routing of cables or hoses to different areas within the bridge panel, or the like, or a combination thereof.

[0057] For example, with reference to Figures 5, 12 to 16, the bridge panel may include a debris capture tube 1202 (e.g., integrated into the interior of the bridge panel) and may include a first connection port 504 (e.g., formed on the rear surface of the system frame 400) and one or more second connection ports (e.g., formed on a second bridge plate such as shown at 1500 in Figure 15). The debris capture tube 1202 may be sealed from the rest of the interior of the bridge panel (e.g., to prevent fluid from being transferred from the debris capture tube 1202 into the interior of the bridge panel). The first connection port 504 is fluidly connected to each of the second connection ports. In Figure 15, dashed lines 1502 depict paths along which fluids (e.g., one or more gases and debris generated during processing of a workpiece) may be transferred within the debris capture tube 1202 (from the second connection port 1500 to the first connection port 504). A vacuum hose may be routed through the debris capture tube 1202 so that one end of the vacuum hose can be conveniently connected to the debris capture nozzle. In other embodiments, the debris capture tube 1202 may itself function as a vacuum hose to which the debris capture nozzle can be connected (at the second connection port), and a vacuum pump can be connected to the first connection port 504.

[0058] In one embodiment, each bridge support 116 may be provided as a sandwich panel formed from a pair of plates indirectly attached to one another by an intervening core, for example, in a manner similar to the other sandwich panels described above. To this end, the reinforcement in the core of each bridge support 116 may be perforated, the size, number, and placement of which may be selected to facilitate airflow through the spaces between the plates (within the bridge support 116), or to facilitate the routing of cables or hoses to different areas within the bridge panel, or the like, or a combination thereof.

[0059] 13 and 14 , one or more bridge supports 116 may include a table connecting tube (not shown) and a wall connecting tube (not shown) integrated therein. In one embodiment, one or both of the table connecting tube and the wall connecting tube are sealed from the interior of the bridge support 116 (e.g., to prevent fluid from being transferred from either of the connecting tubes into the interior of the bridge support 116). One end of the table connecting tube may intersect a plate of the bridge support 116 at a first opening 1302, and the other end of the table connecting tube may be fluidly connected to the interior of the optical component bridge 406 (e.g., via an opening formed in a second bridge plate) at a location below the optical component table 500. Similarly, one end of the wall connecting tube may intersect a plate of the bridge support 116 at a second opening 1304, wall The other end of the connecting tube may be fluidly connected to the interior of the optical component bridge 406 at a location between the optical component wall 502 and the process wall 426. As described in more detail below, fluid (e.g., air, nitrogen, etc.) may be introduced into (or removed from) the interior of the optical component bridge 406 through the table opening 1302, the wall opening 1304, or a combination thereof.

[0060] 5 and 13-17, optical components bridge 406 may further include a purge system configured to introduce a fluid into the optical components bay. For example, a fluid (e.g., a gas such as air) may be introduced into the optical components bay for one or more reasons, such as to prevent or minimize particles in the optical components bay from collecting on optical surfaces of optical elements in the optical components bay, to pressurize the optical components bay (e.g., relative to a process bay, or relative to the environment external to laser processing module 100, or a combination thereof), or a combination thereof.

[0061] The purge system may include one or more purge assemblies. Each purge assembly includes a purge head 506 and a purge connection tube 508. The purge connection tube 508 may include a first end coupled to the purge head 506 and a second end (e.g., intersecting the plate of the bridge support 116 at a third opening 1306 as exemplarily shown in FIGS. 13 and 14 ). Generally, the purge head 506 defines an internal plenum and includes a plurality of purge holes 510 fluidly connected to the purge connection tube 508 via the internal plenum. In one embodiment, the purge connection tube 508 is sealed from the interior of the bridge panel (e.g., to prevent fluid from being transferred from the purge connection tube 508 to the interior of the bridge panel). As described in more detail below, fluid (e.g., air, nitrogen, etc.) may be introduced into the optical component bay through the purge holes 510.

[0062] 4, the purge system may be configured as needed to transfer fluid from the purge head 506 or purge connection tube 508 to the process bay (e.g., via process bay purge opening 434). For example, a process bay purge tube (not shown) may extend from the purge head 506 through the bridge panel and open into the process bay. The process bay purge tube may be sealed from the rest of the interior of the bridge panel (e.g., to prevent fluid from being transferred from the process bay purge tube into the interior of the bridge panel).

[0063] 15 and 17, the purge system may be configured as needed to transfer fluid from the purge head 506 or purge connection tube 508 to the electronics bay (e.g., via the electronic vapor purge opening 1504). For example, an electronic vapor purge tube (not shown) may extend from the purge connection tube 508 through the platform 404 and open into the electronics bay. The electronic vapor purge tube may be sealed from the rest of the interior of the platform 404 (e.g., to prevent fluid from being transferred from the electronic vapor purge tube into the interior of the platform 404).

[0064] IV. Fluidic Embodiments The "fluid" referred to above may have a temperature higher than, lower than, or the same as the temperature of the ambient environment (i.e., the environment surrounding laser processing module 100). In one embodiment, the fluid introduced into the interior of platform 404, the interior of a bridge panel of optical bridge 406, an optical bay, etc., or a combination thereof, may contain less particulate matter than is present in the air of the ambient environment (i.e., "ambient air"), or may contain the same or more particulate matter than is present in the ambient air.

[0065] In one embodiment, a fluid (e.g., air, nitrogen, etc.) may be introduced into the interior of the platform 404 through a platform opening 1300 formed in the platform 404 (e.g., in the first platform plate 420a) at a position near one of the bridge supports 116 (e.g., bridge support 116a), and a fluid may be removed from the platform 404 through a platform opening 1300 formed in the platform 404 (e.g., in the first platform plate 420a) at a position near another one of the bridge supports 116 (e.g., bridge support 116b).

[0066] In one embodiment, a fluid (e.g., air, nitrogen, etc.) may be introduced into the interior of the bridge panel through a table opening 1302 and a wall opening 1304, both formed in one of the bridge supports 116 (e.g., bridge support 116a), and a fluid may be removed from the optical component bridge 406 through a table opening 1302 and a wall opening 1304, both formed in another of the bridge supports 116 (e.g., bridge support 116b).

[0067] As described above, fluid is introduced into (or removed from) the interiors of the bridge panels of the platform 404 and the optical component bridge 406 through openings formed in the same bridge support 116. In this case, each of the openings 1300, 1302, and 1304 may be connected to a different hose for introducing or removing fluid from the system frame 400, as described above. In other embodiments, the system frame 400 may include a shell, such as the shell 1000 shown in FIG. 10 , which is sealed with respect to the bridge support 116 and the platform 404 to prevent fluid from leaking directly from the interior of the shell 1000 to an area outside the shell 1000. The above-described openings 1300, 1302, 1304, and 1306 may all be exposed to the interior of the shell 1000 and may be adapted to receive fluid introduced into the interior of the shell 1000. Fluid may be introduced into the interior of the shell 1000 in any suitable or desirable manner (e.g., through opening 1104 formed in plate 1106, which is sealed to the shell 1000 and bridge support 116, as illustratively shown in FIG. 11 ). In other optional embodiments, fluid may be introduced separately to the purge assembly through third opening 1306 (e.g., by inserting a purge hose (not shown) into the interior of the shell 1000 through opening 1104 and connecting the purge hose directly to third opening 1306).

[0068] V. Visual Signal Processing Embodiments Traditionally, laser processing systems often include one or more mechanisms that visually communicate information about the system's functional status (e.g., to a laser processing system operator or technician). Examples of such mechanisms include a visual display screen (e.g., a computer monitor), a beacon tower light (e.g., the TL50BL beacon tower light manufactured by Banner Engineering), or other exterior lights (e.g., similar to the Plate LASER 1530 metal cutting machine manufactured by Piranha-Whitney). However, such mechanisms are typically limited in the amount of information they can effectively communicate and (in the case of mechanisms like display screens, beacon tower lights, and other exterior lights) are difficult to view from a distance. Furthermore, mechanisms like beacon tower lights are often limited in the number of light-emitting elements they can include and the colors each light-emitting element can emit when activated. Therefore, users of beacon tower lights may attempt to increase the amount of information they can communicate by encoding information as the combination of light-emitting elements that are activated, as the sequence in which the light-emitting elements are activated, or as the rate at which the light-emitting elements are intermittently activated (such as to blink or flash the light-emitting elements). Therefore, as more information is attempted to be visually conveyed by the beacon tower light, the resulting visual signal becomes more difficult for a viewer to quickly interpret. This problem can be exacerbated when many laser processing machines (each with its own beacon tower light) are grouped together on a factory floor.

[0069] The DATRON M8CUBE CNC milling machine, manufactured by DAYTRON DYNAMICS, is understood to incorporate a three-color LED indirect lighting system into the gantry that supports the machine bit, making it possible to indicate the machine's status. While the three-color LED indirect lighting system eliminates the need for externally installed beacon light towers, the indirect lighting system incorporated into the gantry system remains visually small and difficult to see from a distance.

[0070] Other mechanisms, such as those used in the DWX-4W wet dental milling machine manufactured by ROLAND DG, illuminate the interior of the windowed enclosure (i.e., within which the mechanical milling of workpieces occurs) with different colors depending on the status of the milling machine. In the DWX-4W wet dental milling machine, a blue light indicates the machine is in a "standby" state, and all lights are turned off if operation does not begin within five minutes. A white light indicates that milling operation has been paused, and a yellow light indicates that an error has occurred and the machine is paused. A red light indicates that milling has stopped due to an error and user intervention is required. A flashing red light indicates that the user must restart the machine. The status lighting system on the DWX-4W wet dental milling machine is more easily visible from a distance than the other visual status indication systems mentioned above, but it is relatively limited in the amount of information it can effectively convey.

[0071] To overcome problems associated with conventional mechanisms for communicating information, such as those described above, laser processing module 100 may include a visual signal processing system configured to emit a light (also referred to herein as a "signal light") into the process bay such that the signal light is visible from outside laser processing module 100 (e.g., through window 114). As described in more detail below, the visual signal processing system may be used to communicate information by selecting or varying one or more characteristics of the signal light. Example characteristics of the signal light include color, brightness, and persistence (i.e., whether the signal light is solid or flashing, and if flashing, the duration of each flash, and the rate at which the light flashes).

[0072] The visual signal processing system may include one or more light emitting elements (e.g., one or more LEDs, OLEDs, QD LEDs, etc., or any combination thereof) positioned and configured to respectively illuminate one or more objects within the process bay with signal light. Optionally, the visual signal processing system may include one or more light guides, diffusers, etc., or any combination thereof, as known in the art, to spread or guide light emitted by the one or more light emitting elements to a desired location.

[0073] To facilitate viewing of the signal light from outside the laser processing module through window 114, one or more surfaces exposed to the process bay (e.g., the inner surface of first shroud 102, a surface of process wall 426, a surface of first platform plate 420a, etc., or any combination thereof) may be configured to reflect (e.g., in a relatively diffuse manner) the signal light emitted by one or more light-emitting elements. For example, one or more of the surfaces may be painted white or another color, or one or more of the surfaces may be coated with a reflective layer, foil, or film.

[0074] The functional status of laser processing module 100 (or, more generally, a laser processing system) (e.g., "idle," "operating," "operation paused," "operation error," "maintenance required," etc.), the type of workpiece being processed in laser processing module 100 (e.g., FPC laminate "A," FPC laminate "B," PCB panel "A," PCB panel "B," etc.), the pattern of features being formed in or on the workpiece during processing (e.g., feature pattern "A," feature pattern "B," etc.), the status of a production run ("production run" refers to the number of workpieces being processed), the status of the laser processing module 100 (or, more generally, a laser processing system), the type of workpiece being processed in laser processing module 100 (e.g., FPC laminate "A," FPC laminate "B," PCB panel "A," PCB panel "B," etc.), the pattern of features being formed in or on the workpiece during processing (e.g., feature pattern "A," feature pattern "B," etc.), the status of a production run ("production run" refers to the number of workpieces being processed), the status of the laser processing module 100 (e.g., " ... The operation of the visual signal processing system may be controlled (e.g., by a controller, computer, etc. located in the electronics bay) to vary one or more characteristics of the signal light (e.g., color, brightness, persistence, etc.) in response to the throughput of the machining module 100 (or, more generally, the laser machining system), the cycle time during machining of a workpiece ("cycle time" refers to the total time required to machine a single workpiece), the takt time ("takt time" refers to the total time elapsed between the completion of machining of one workpiece and the start of machining a different workpiece), etc., or any combination thereof.

[0075] Generally, at least one characteristic of a signal light associated with a functional state of laser processing module 100 (or, more generally, a laser processing system) is different from a corresponding characteristic of a signal light associated with a different functional state of laser processing module 100 (or, more generally, a laser processing system). At least one characteristic (e.g., color, etc.) of a signal light associated with a type of workpiece or a pattern of features formed on a workpiece may be the same as or different from a corresponding characteristic of a signal light associated with one or more functional states of laser processing module 100 (or, more generally, a laser processing system). For example, an "idle" functional state may be represented by a non-flashing yellow signal light, an "operation suspended" functional state may be represented by a flashing signal light of a first color (e.g., yellow), an "operation error" functional state may be represented by a signal light of a second color (e.g., red), a "maintenance required" functional state may be represented by a signal light of a third color (e.g., amber), etc. The "operating" functional state may be indicated by a non-blinking signal light of a fourth color (e.g., blue, purple, pink, cyan, magenta, etc.) also associated with the type of workpiece currently being processed or the pattern of features currently being formed on the workpiece.

[0076] The characteristic (e.g., color) of the signal light associated with the cycle time during processing of the workpiece may be the same as the corresponding characteristic of the signal light associated with the type of workpiece being processed (or the pattern of features formed on the workpiece during processing). However, at least one other characteristic (e.g., intensity, persistence, etc.) of the signal light associated with the cycle time during processing of the workpiece may be different from the corresponding characteristic of the signal light associated with the type of workpiece being processed (or the pattern of features formed on the workpiece during processing). For example, a signal light associated with the type of workpiece being processed (or the pattern of features formed on the workpiece during processing) and processed in a production run (or the pattern of features formed on the workpiece during processing) may be a non-flashing green color, but the signal light may increase or decrease in intensity (i.e., become brighter or dimmer) and / or begin to flash (e.g., steadily or progressively faster) over time to qualitatively communicate that processing of the workpiece is nearing or has completed. Alternatively, the color of the signal light associated with the cycle time during processing of the workpiece may be different from the color characteristics of the signal light associated with the type of workpiece processed (or the pattern of features formed on the workpiece during processing).

[0077] The characteristic (e.g., color) of the signal light associated with the state of the production run may be the same as the corresponding characteristic of the signal light associated with the type of workpieces processed in the production run (or the pattern of features formed on the workpieces during the production run). However, at least one other characteristic (e.g., intensity, persistence, etc.) of the signal light associated with the state of the production run may be different from the corresponding characteristic of the signal light associated with the type of workpieces processed in the production run (or the pattern of features formed on the workpieces during the production run). For example, the signal light associated with the type of workpieces processed in the production run (or the pattern of features formed on the workpieces during the production run) may be a non-flashing green color, but the signal light may increase or decrease in intensity (i.e., become brighter or dimmer) and / or begin to flash (e.g., steadily or progressively faster) over time to qualitatively communicate that the production run is nearing completion or has completed. Alternatively, the color of the signal light associated with the state of the production run may be different from the color characteristic of the signal light associated with the type of workpiece processed in the production run (or the pattern of features formed on the workpiece during the production run). If desired, the characteristic (e.g., intensity, persistence, etc.) of the signal light associated with the state of the production run may be different from the corresponding characteristic of the signal light associated with the cycle time for processing the workpiece in the production run.

[0078] The characteristics (e.g., color) of the signal light associated with the takt time may be the same as the corresponding characteristics of the signal light associated with the functional state (e.g., idle, suspended operation, operational error, etc.). However, at least one other characteristic (e.g., intensity, persistence, etc.) of the signal light associated with the takt time may be different from the corresponding characteristic of the signal light associated with the functional state (e.g., idle, suspended operation, operational error, etc.). For example, the signal light associated with the takt time and associated with the functional state (e.g., idle) may be a non-flashing yellow color, but the signal light may increase or decrease in intensity (i.e., become brighter or dimmer) and / or begin flashing (e.g., steadily or progressively faster) over time to qualitatively communicate that laser processing module 100 (or the laser processing system) has remained idle for a predetermined threshold amount of time.

[0079] Although the above examples and embodiments describe the visual signal processing system as a replacement for conventional information transmission mechanisms such as beacon tower lights and display screens, it will be understood that the visual signal processing system can be used in conjunction with such conventional information transmission mechanisms.

[0080] Although the operation of the visual signal processing system has been described as being controllable in response to the functional state of laser processing module 100, the type of workpiece being processed in laser processing module 100, the pattern of features being formed in or on the workpiece during processing, the state of the production run, the throughput of laser processing module 100 (or, more generally, the laser processing system), the cycle time during processing of the workpiece, and the takt time, it will be understood that the visual signal processing system may be controlled in any other suitable or desirable manner. For example, the visual signal processing system may be controlled in response to user commands (eg, via one or more user interface components).

[0081] VI. Conclusion The foregoing describes embodiments and examples of the present invention and is not to be construed as limiting thereof. While several specific embodiments and examples have been described with reference to the drawings, those skilled in the art will readily recognize that many modifications to the disclosed embodiments and examples and other embodiments are possible without materially departing from the novel teachings and advantages of the present invention. Accordingly, all such modifications are intended to be included within the scope of the present invention as defined in the claims. For example, those skilled in the art will understand that the subject matter of any sentence, paragraph, example, or embodiment can be combined with part or all of the subject matter of any other sentence, paragraph, example, or embodiment, except where such combinations are mutually exclusive. Therefore, the scope of the present invention should be determined by the following claims and any equivalents of such claims to be included therein.

Claims

1. 1. A frame for a laser processing module, comprising: Platform and a bridge support coupled to the platform; an optical component bridge coupled to the platform, the optical component bridge extending above and spaced from the platform; Equipped with the bridge support comprises a bridge support sandwich panel; The bridge-supported sandwich panel is a first bridge support plate; a second bridge support plate; a bridge support core disposed between the first bridge support plate and the second bridge support plate, the bridge support core being attached to the first bridge support plate and the second bridge support plate inside the bridge-supported sandwich panel such that the first bridge support plate and the second bridge support plate are indirectly attached to each other by the bridge support core; Including, the optical component bridge includes an optical component bridge sandwich panel; The optical component bridge sandwich panel is a first optical component bridge plate; a second optical component bridge plate; an optical component bridge core disposed between the first optical component bridge plate and the second optical component bridge plate, the optical component bridge core being attached to the first optical component bridge plate and the second optical component bridge plate inside the optical component bridge sandwich panel such that the first optical component bridge plate and the second optical component bridge plate are indirectly attached to each other by the optical component bridge core; Including, an interior of the bridge support sandwich panel in fluid communication with an interior of the optical component bridge sandwich panel; the frame further comprises at least one tube disposed within the bridge support sandwich panel and in fluid communication with the interior of the optical component bridge sandwich panel. Frame.

2. The frame of claim 1 , wherein the bridge support core includes at least one plate.

3. A frame as described in claim 2, wherein an opening is formed in at least one plate of the bridge support core.

4. A frame described in any one of claims 1 to 3, wherein the optical component bridge core includes at least one plate.

5. A frame as described in claim 4, wherein an opening is formed in at least one plate of the optical component bridge core.

6. 6. A frame according to claim 1, wherein the at least one tube terminates at an outer surface of the bridge support sandwich panel.

7. The bridge-supported sandwich panel is a first plurality of plates spaced apart from one another along a first direction; a second plurality of plates spaced apart from one another along a second direction; and 7. A frame according to claim 1, comprising:

8. The frame of claim 7 , wherein the distances that the first plurality of plates are spaced apart from one another along the first direction vary along the first direction.

9. The frame of claim 8 , wherein the distance that at least some of the second plurality of plates are spaced apart from one another along the second direction is constant along the second direction.

10. 1. A laser processing module for processing a workpiece, comprising: A frame according to any one of claims 1 to 9; a motion stage supported by the platform, the motion stage configured to move the workpiece relative to the frame; a laser source supported by the optical component bridge, the laser source capable of generating laser energy propagable along a beam path to the workpiece; at least one optical component supported by the optical bridge and positioned in the beam path; A laser processing module comprising:

11. The laser processing module of claim 10 , wherein the at least one optical component includes at least one selected from the group consisting of a mirror and a lens.

12. The laser processing module of claim 10 , wherein the at least one optical component comprises at least one selected from the group consisting of an acousto-optic deflector and a galvanometer mirror.

13. 1. A frame for a laser processing module, comprising: The base panel and a plurality of base supports coupled to the foundation panel; a platform coupled to the plurality of base supports, the platform extending above and spaced from the foundation panel; a bridge support coupled to the platform; an optical component bridge coupled to the bridge support, the optical component bridge extending above and spaced apart from the platform; Equipped with the platform includes a platform sandwich panel; The platform sandwich panel is a first platform plate; a second platform plate; a platform core disposed between the first platform plate and the second platform plate, the platform core being attached to the first platform plate and the second platform plate within the platform sandwich panel such that the first platform plate and the second platform plate are indirectly attached to each other by the platform core; Including, The foundation panel comprises a foundation panel sandwich panel; The foundation panel sandwich panel is a first base panel plate; a second base panel plate; a foundation panel core disposed between the first foundation panel plate and the second foundation panel plate, the foundation panel core being attached to the first foundation panel plate and the second foundation panel plate inside the foundation panel sandwich panel so that the first foundation panel plate and the second foundation panel plate are indirectly attached to each other by the foundation panel core; Multiple foundation panel outer walls and Including, a plurality of openings formed in at least one of the plurality of foundation panel outer walls; At least one of the first and second base panel plates is formed with at least one opening for fluidly connecting the interior of the base panel with an area exterior to the base panel such that air can pass through the interior of the base panel and exit the base panel through the plurality of openings. Frame.

14. The plurality of base supports include: a plurality of beams disposed around the periphery of the foundation panel; a plurality of plates disposed in a central region of the foundation panel; Including, 14. The frame of claim 13.

15. The plurality of base supports include: a plurality of beams disposed around the periphery of the platform; a plurality of plates disposed in a central region of the platform; Including, 14. The frame of claim 13.

16. The frame of claim 13 , wherein the platform core includes at least one plate.

17. A frame as described in claim 16, wherein at least one plate of the platform core has an opening formed therein.

18. The at least one plate of the platform core includes a plurality of plates; the first platform plate and the second platform plate extend completely across a space defined between the plates; 18. A frame according to claim 16 or 17.

19. The plurality of plates include: a first plurality of plates spaced apart from one another along a first direction; a second plurality of plates spaced apart from one another along a second direction; and Including, 16. The frame of claim 15.

20. 1. A laser processing module for processing a workpiece, comprising: A frame according to any one of claims 13 to 19; a laser source supported by the optical component bridge; a motion stage supported by the platform, the motion stage configured to move the workpiece relative to the frame; A laser processing module comprising:

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