Printing device and solder supply method

Abstract

To provide a technique which supplies solder in a printer without waste.SOLUTION: A printer 1 for printing solder on a substrate P includes: a mask 12 which has an opening 12A formed therein; a solder supply part 16C which supplies the solder onto the mask 12; a squeegee 16E which slides relative to the mask 12 supplied with the solder to transfer the solder to the substrate P through the opening 12A; and a control unit 30. The control unit 30 executes: distribution range acquisition processing for acquiring a distribution range of the opening 12A in the mask 12; supply range set processing for setting a supply range in which the solder is supplied in the distribution range of the opening 12A in a long side direction of the squeegee 16E; and solder supply processing for supplying the solder to the supply range by the solder supply part 16C.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a printing device and a solder supply method. [Background technology]

[0002] A known screen printing machine that supplies solder onto a mask and performs screen printing is described in Japanese Patent Application Laid-Open No. 2013-199073 (Patent Document 1 below). This screen printing machine acquires an image of the mask before screen printing, calculates the sum of the areas of the mask openings from the acquired mask image, and calculates the amount of solder required per board for screen printing using that mask from the sum of the areas of the mask openings and a predetermined mask thickness. This allows the correct amount of solder to be supplied onto the mask. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-199073 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the above configuration does not provide a detailed description of the range of solder supply on the mask. It is known that in printing devices such as those described above, the solder moves toward the outside of the mask as the solder is squeezed. Therefore, for example, solder supplied to the outside of the mask beyond the position where the mask opening is located will not move toward the inside of the mask even with repeated squeezing, and will not be transferred to the board through the opening. Therefore, in order to supply solder without waste in a printing device, it is important to consider the solder supply range. [Means for solving the problem]

[0005] The printing device disclosed herein is a printing device that prints solder on a substrate, and includes a mask having openings formed therein, a solder supply unit that supplies solder onto the mask, a squeegee that slides against the mask onto which the solder has been supplied, thereby transferring the solder to the substrate through the openings, and a control unit, wherein the control unit executes a distribution range acquisition process that acquires the distribution range of the openings in the mask, a supply range setting process that sets a supply range for supplying solder within the distribution range of the openings in the long side direction of the squeegee, and a solder supply process that supplies solder to the supply range using the solder supply unit.

[0006] The solder supply method of the present disclosure is a solder supply method using a printing device that prints solder on a substrate, the printing device including a mask having openings formed therein, a solder supply unit that supplies solder onto the mask, and a squeegee that slides over the mask onto which the solder has been supplied, thereby transferring the solder to the substrate via the openings, the solder supply method including a distribution range acquisition step that acquires the distribution range of the openings in the mask, a supply range setting step that sets a supply range into which solder is to be supplied within the distribution range of the openings in the long side direction of the squeegee, and a solder supply step that supplies solder to the supply range by the solder supply unit. [Effects of the Invention]

[0007] According to the present disclosure, it is possible to provide a technique for supplying solder without waste in a printing device. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view illustrating the appearance of a printing apparatus according to a first embodiment. [Figure 2] FIG. 2 is a front view of the printing device. [Figure 3] FIG. 3 is a side view of the printing device. [Figure 4] FIG. 4 is a diagram showing the electrical configuration of the printing device. [Figure 5]5A and 5B are explanatory diagrams illustrating the solder supply range, in which Fig. 5A is a front view showing the solder supply range, and Fig. 5B is a plan view showing the solder supply range. [Figure 6] FIG. 6 is a diagram showing a text file that is an example of data on the distribution range of openings. [Figure 7] FIG. 7 is a flowchart showing the setting of the solder supply range. [Figure 8] FIG. 8 is a flowchart showing the solder supply execution determination. [Figure 9] 9A and 9B are explanatory diagrams illustrating the solder supply range according to embodiment 2. Fig. 9A is a front view showing the solder supply range, and Fig. 9B is a plan view showing the solder supply range. [Figure 10] FIG. 10 is a diagram showing a text file as an example of data on the distribution range of openings according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] [Description of the embodiments of the present disclosure] First, embodiments of the present disclosure will be listed and described.

[0010] (1) The printing device disclosed herein is a printing device that prints solder on a substrate, and includes a mask having openings formed therein, a solder supply unit that supplies solder onto the mask, a squeegee that slides over the mask onto which the solder has been supplied to transfer the solder to the substrate through the openings, and a control unit, wherein the control unit executes a distribution range acquisition process that acquires the distribution range of the openings in the mask, a supply range setting process that sets a supply range for supplying solder within the distribution range of the openings in the long side direction of the squeegee, and a solder supply process that supplies solder to the supply range using the solder supply unit.

[0011] According to this configuration, the solder is supplied within the distribution range of the openings in the mask, so that excessive supply of solder is suppressed and waste of supplied solder can be eliminated.

[0012] (2) Preferably, the printing device further includes a storage unit that stores data on the distribution range of the openings.

[0013] With this configuration, data on the distribution range of the openings can be acquired from the storage unit.

[0014] (3) It is preferable that the printing device further includes an inspection unit that captures an image of the mask, and in the distribution range acquisition process, the control unit acquires the distribution range of the openings in the mask based on the image of the mask captured by the inspection unit.

[0015] With this configuration, the distribution range of the openings can be obtained based on the captured image of the inspection unit.

[0016] (4) The supply range coincides with the distribution range of the opening in the long side direction of the squeegee, and the amount of solder that the solder supply unit supplies continuously from one end of the supply range to the other end while moving to one side in the long side direction of the squeegee is a unit supply amount, and when the amount of solder consumed exceeds the unit supply amount, the control unit executes the solder supply process, and in the solder supply process, it is preferable that the control unit supplies the unit supply amount or twice the unit supply amount of solder to the supply range.

[0017] With this configuration, the timing of supplying solder can be determined based on the unit supply amount for each type of mask and the amount of solder consumed.

[0018] (5) The printing device further includes a squeegee unit that supports the solder supply unit and the squeegee and is movable in a sliding direction of the squeegee that is perpendicular to the long side direction of the squeegee, and the solder supply unit is movable in the long side direction of the squeegee relative to the squeegee unit, and in the solder supply process, the control unit preferably moves the squeegee unit in the sliding direction of the squeegee to slide the squeegee against the mask, while the solder supply unit supplies solder to the supply range that extends in the sliding direction of the squeegee.

[0019] With this configuration, by moving the squeegee unit that supports the solder supply unit and the squeegee in the sliding direction, the squeegee can be slid relative to the mask, and the solder can be supplied while printing the solder onto the board, thereby improving production efficiency compared to when solder is supplied after the printing operation is completed.

[0020] (6) It is preferable that the supply area does not overlap with the opening.

[0021] With this configuration, the supply range does not overlap with the opening, so when supplying solder, it is possible to prevent solder from dropping from the opening into the inside of the device or solder from being supplied in excess to the board.

[0022] (7) In the solder supplying process, the control unit preferably moves the solder supply unit in the direction of a long side of the squeegee.

[0023] With this configuration, the solder can be supplied to different positions along the long side of the squeegee.

[0024] (8) The solder supply method of the present disclosure is a solder supply method using a printing device that prints solder on a substrate, the printing device including a mask having openings formed therein, a solder supply unit that supplies solder onto the mask, and a squeegee that slides over the mask onto which the solder has been supplied to transfer the solder to the substrate through the openings, the solder supply method including a distribution range acquisition step that acquires the distribution range of the openings in the mask, a supply range setting step that sets a supply range for supplying solder within the distribution range of the openings in the long side direction of the squeegee, and a solder supply step that supplies solder to the supply range by the solder supply unit.

[0025] (9) It is preferable that the printing device further includes a storage unit that stores data on the distribution range of the openings.

[0026] (10) It is preferable that the printing device further includes an inspection unit that captures an image of the mask, and that in the distribution range acquisition process, information on the distribution range of the openings in the mask is acquired based on the image of the mask captured by the inspection unit.

[0027] (11) The supply range coincides with the distribution range of the opening in the long side direction of the squeegee, and the amount of solder that the solder supply unit supplies continuously from one end of the supply range to the other end while moving to one side in the long side direction of the squeegee is a unit supply amount, and when the amount of solder consumed exceeds the unit supply amount, the solder supply process is executed, and it is preferable that in the solder supply process, the unit supply amount or twice the unit supply amount of solder is supplied to the supply range.

[0028] (12) The printing device preferably further includes a squeegee unit that supports the solder supply section and the squeegee and is movable in a sliding direction of the squeegee that is perpendicular to the long side direction of the squeegee, the solder supply section being movable in the long side direction of the squeegee relative to the squeegee unit, and in the solder supply step, the squeegee unit being moved in the sliding direction of the squeegee to slide the squeegee against the mask while the solder supply section supplies solder to the supply range that extends in the sliding direction of the squeegee.

[0029] (13) It is preferable that the supply area does not overlap with the opening.

[0030] (14) In the solder supplying step, it is preferable that the solder supplying unit is moved in the direction of the long side of the squeegee.

[0031] [Details of the embodiments of the present disclosure] The present disclosure will be described below with reference to exemplary embodiments. The present disclosure is not limited to these examples, but is defined by the scope of the claims, and is intended to include all modifications within the meaning and scope of the claims.

[0032] <Embodiment 1> A first embodiment of the present disclosure will be described with reference to Figures 1 to 8. In the following description, the left-right direction shown in Figure 1 will be referred to as the X direction, the front-rear direction as the Y direction, and the up-down direction as the Z direction. Note that, for multiple identical components, only some of the components will be assigned reference numerals, and the reference numerals for the other components may be omitted.

[0033] [Overall configuration of the printing device] The printing device 1 according to the first embodiment is a device that prints solder on a substrate P using a mask 12. As shown in FIG. 1, the printing device 1 includes a box-shaped housing 10. An opening is formed in the right wall of the housing 10 through which the substrate P is carried in. An opening is formed in the left wall of the housing 10 through which the substrate P is carried out. The substrate P is carried into the housing 10 through the opening in the right wall, and after a circuit pattern is printed with solder inside the housing 10, it is carried out through the opening in the left wall.

[0034] As shown in FIG. 2, the printing apparatus 1 includes a metal base 11, a mask 12, a mask holder 13, a substrate transport unit 14, a printing table 15, a printing unit 16, an inspection unit 17, and the like.

[0035] Although not shown, the mask 12 includes a frame-shaped mask frame and a plate-shaped mask body supported inside the mask frame via an elastic member. The mask body is made of aluminum, iron, or the like. The mask body has openings 12A (see FIG. 5(B)) formed therein that correspond to the circuit pattern to be printed. The elastic member is made of a plate-shaped resin, rubber, or the like.

[0036] As shown in FIG. 2, the mask holder 13 is provided between the printing unit 16 and the inspection unit 17. The mask holder 13 is composed of two rail portions 13A that are spaced apart in the X direction and extend in the Y direction (perpendicular to the paper surface). The left rail portion 13A has a sidewall portion that rises upward from the left edge. The right rail portion 13A has a sidewall portion that rises upward from the right edge. The mask 12 is supported on both sides in the X direction by the two rail portions 13A.

[0037] The board transport unit 14 has three conveyors (upstream conveyor 14A, main conveyor 14B, and downstream conveyor 14C) lined up in the X direction. The upstream conveyor 14A and downstream conveyor 14C are provided on the base 11, and the main conveyor 14B is provided on the printing table 15. Each conveyor has a pair of conveyor belts (not shown) that are spaced apart in the Y direction and driven to circulate in the X direction, a motor (not shown) that drives the conveyor belts, and the like.

[0038] 2 and 3, the printing table 15 is provided on the upper surface of the base 11. The printing table 15 includes a flat table 20, a ball screw 21 extending in the vertical direction, a motor (not shown) that rotates the ball screw 21, a substrate fixing unit 22 that fixes the substrate P, and a backup unit 23 that supports from below the substrate P fixed to the substrate fixing unit 22. The table 20 moves up and down as the ball screw 21 rotates.

[0039] 3, the substrate fixing unit 22 is composed of a pair of clamps 22A that clamp and fix the substrate P, which has been transported to a printing position above the backup unit 23, from both sides in the Y direction, and a motor (not shown) that drives the clamps 22A. A through-hole that passes through the clamps 22A in the vertical direction is formed in the clamps 22A. The lower side of the through-hole is connected to an air supply device via an air hose. When the table 20 is raised while the substrate P is fixed by the substrate fixing unit 22, the upper surface of the clamps 22A comes into close contact with the lower surface of the mask body of the mask 12, and in this state, negative pressure is supplied to the through-hole, causing the mask body to be adsorbed to the clamps 22A.

[0040] 2 and 3, backup unit 23 includes a plate-shaped lower plate 23A, a plate-shaped upper plate 23B disposed above lower plate 23A, a plurality of backup pins 23C that support substrate P from below, a ball screw 23D extending vertically, and a motor (not shown) that rotates ball screw 23D. Backup unit 23 moves up and down as ball screw 23D rotates.

[0041] Although not shown, upper plate 23B has a plurality of holes aligned in a row in the Y direction and a plurality of rows spaced apart in the X direction. Backup pins 23C are inserted into these holes. The positions of the holes into which backup pins 23C are inserted vary depending on the type of substrate P. When the type of substrate P to be produced is changed, the arrangement of backup pins 23C is changed according to the type of substrate P after the change.

[0042] 2, a pair of guide rails 16B that support the squeegee unit 16A so that the squeegee unit 16A can move back and forth in the Y direction, a ball screw (not shown), a motor (not shown) that rotates the ball screw, etc. The rotation of the ball screw causes the squeegee unit 16A to move in the Y direction.

[0043] 2 and 3, the squeegee unit 16A includes a solder supply unit 16C that supplies paste solder onto the mask 12 (mask body), a squeegee 16E that evens out the supplied solder, a motor (not shown) that raises and lowers the squeegee 16E, and a motor (not shown) that rotates the squeegee 16E around a rotation axis that extends in the X direction (the direction perpendicular to the paper surface in FIG. 3). The squeegee 16E is elongated in the X direction.

[0044] 2, the inspection unit 17 is provided between the mask holder 13 and the printing table 15. The inspection unit 17 is configured to capture images of the underside of the mask 12 and the upper surface of the substrate P to inspect the condition of the underside of the mask 12 and the circuit pattern printed on the substrate P. The inspection unit 17 includes a camera unit 17A, a beam 17B that supports the camera unit 17A so that it can move back and forth in the X direction, a ball screw 17C that is fixed to the beam 17B and extends in the X direction, a pair of guide rails 17D that are disposed on both sides of the beam 17B in the X direction and extend in the Y direction, a ball screw (not shown) that extends in the Y direction, and a motor (not shown) that rotates the ball screw.

[0045] A mask imaging camera 17E that images the lower surface of the mask 12 and a substrate imaging camera 17F that images the upper surface of the substrate P are fixed to the camera unit 17A. The camera unit 17A moves in the X and Y directions within a predetermined movable range as the ball screws rotate. The inspection section 17 may be configured to move the camera unit 17A using a linear motor. Inspection by inspection unit 17 may be performed for each substrate P, or for multiple substrates P. Alternatively, inspection may be performed at regular time intervals, or when a specified time is reached.

[0046] As shown in FIG. 3, a detection sensor 16F for measuring the volume of solder R1 (solder roll, described later) on the mask 12 is attached to the squeegee unit 16A. The detection sensor 16F is attached with its detection surface facing downward. The detection sensor 16F is, for example, a reflective optical sensor, and detects the presence or absence of solder R1 supplied onto the mask 12 based on the level of a light reception signal obtained by receiving light reflected from the surface of the mask 12. In particular, the detection sensor 16F can be used to detect the width (dimension in the Y direction) of the solder R1, etc., and measure the volume of the solder R1.

[0047] [Electrical configuration of the printing device] The electrical configuration of the printing device 1 will be described with reference to Fig. 4. The printing device 1 includes a control unit 30, a display unit 31, and an input unit 32. The control unit 30 includes a CPU 30A, a RAM 30B, and a memory unit 30C. The memory unit 30C is a storage device having a non-volatile storage medium such as a hard disk. Various programs and data executed by the CPU 30A are stored in the memory unit 30C. The control unit 30 is connected to a display unit 31, an input unit 32, a substrate transport unit 14, a printing table 15, a printing unit 16, an inspection unit 17, and the like. The display unit 31 is a display device such as a liquid crystal display, etc. The input unit 32 is an input device such as a touch panel, a mouse, or a keyboard.

[0048] [Printing Processing] The printing apparatus 1 transports the substrate P to the printing position using the substrate transport unit 14, and raises the table 20 to place the substrate P on the lower surface of the mask 12. Next, the printing device 1 ejects solder from the nozzle 16D of the solder supply unit 16C and supplies it onto the surface of the mask 12. In this embodiment, as will be described later, the solder is supplied in the form of a rod extending in the X direction (see FIG. 5). Note that if a sufficient amount of solder has already been supplied onto the mask 12 by the previous printing process, no solder is supplied.

[0049] After supplying the solder, the printer 1 lowers the squeegee 16E onto the mask 12. Thereafter, as shown in FIG. 3, the squeegee 16E slides over the surface of the mask 12 while moving in the Y direction (front-to-back direction). The sliding of the squeegee 16E causes the solder R1 to spread over the mask 12 and fill the openings 12A formed in the mask 12. This allows the solder to be printed on the substrate P superimposed on the lower surface of the mask 12 (printing process).

[0050] [Solder supply] In this embodiment, the control unit 30 of the printing device 1 acquires the distribution range of the openings 12A formed in the mask 12 (distribution range acquisition process), sets a range (supply range) to which solder is supplied so that it coincides with the distribution range of the openings 12A in the long side direction (X direction) of the squeegee 16E (supply range setting process), and controls the solder supply unit 16C to supply solder to the supply range (solder supply process).This prevents solder from being supplied outside the distribution range of the openings 12A in the X direction, thereby eliminating wasted solder supply.

[0051] [Distribution range acquisition process] In the distribution range acquisition process, the control unit 30 can acquire data on the distribution range of the openings 12A in the mask 12 from the storage unit 30C. In this embodiment, this data on the distribution range of the openings 12A is, for example, a text file as shown in FIG. 6. This text file describes the names of the masks 12 corresponding to the substrates P to be produced and the distribution range of the openings 12A in the X direction. In the first line of the text file in FIG. 6, AAA indicates the name of the mask. The -90,70 written to the right of AAA indicates the distribution range of the openings 12A, which ranges from -90 mm to 70 mm when the center of the mask 12 in the X direction is set to 0. That is, of the multiple openings 12A formed in the mask 12 named AAA, the position of one edge of the opening 12A arranged at one end in the X direction (the positive side of the X axis) is 70 mm, and the position of the other edge of the opening 12A arranged at the end on the other end in the X direction (the negative side of the X axis) is -90 mm.

[0052] Data on the distribution range of openings 12A is created in advance by an operator and stored in storage unit 30C. Control unit 30 can acquire the distribution range of openings 12A from a text file based on the mask name included in the substrate data of the production program.

[0053] Furthermore, the control unit 30 may obtain the distribution range of the openings 12A based on an image of the mask 12 captured by the inspection unit 17.

[0054] [Supply range setting process] The control unit 30 sets the solder supply range based on data on the distribution range of the openings 12A. In this embodiment, as shown in FIG. 5, the supply range of the solder S1 is set to coincide with the distribution range of the openings 12A in the X direction. Specifically, the positions of both end edges in the X direction of the supply range of the solder S1 and the positions of both end edges in the X direction of the distribution range of the openings 12A are set to be the same. That is, the edge on one side is X=X1, and the edge on the other side is X=X2.

[0055] The supply range in the Y direction is preferably arranged outside the distribution range of the openings 12A in the Y direction. This allows the solder S1 to be filled into all of the openings 12A by sliding the squeegee 16E once toward the front (front side) or the back (rear side) in the Y direction relative to the mask 12. For example, the supply range in the Y direction may be fixed to a range on the mask 12 behind the area where the substrate P overlaps.

[0056] The procedure for setting the solder supply range according to this embodiment will be described below with reference to the flowchart in Fig. 7. Setting the solder supply range includes a distribution range acquisition process and a supply range setting process. The solder supply range is set, for example, before printing or when the type of substrate P is changed.

[0057] The control unit 30 reads the mask name from the board data (S10), and acquires the distribution range of the openings 12A from this mask name (S20). Specifically, the control unit 30 acquires the distribution range of the openings 12A stored in association with the mask name in the data on the distribution range of the openings 12A. If the acquisition of the distribution range of the openings 12A is successful (S30: Yes), the control unit 30 sets the solder supply range based on the distribution range of the openings 12A (S40).

[0058] If the acquisition of the distribution range of the openings 12A fails (S30: No), the control unit 30 may set the solder supply range based on the dimension of the squeegee 16E in the X direction (S50). That is, the range in the X direction in which the squeegee 16E slides on the surface of the mask 12 (for example, the range from X3 to X4 in FIG. 5B) may be set as the X direction range of the solder supply range. Here, cases in which the acquisition of the distribution range of the openings 12A fails include, for example, cases in which the substrate data does not include a mask name, or cases in which the data on the distribution range of the openings 12A does not include a mask name or the distribution range of the openings 12A. Note that the flow from S50 onwards is similar to that of the prior art, and therefore detailed description thereof will be omitted. This completes the setting of the solder supply range.

[0059] [Solder supply processing] The solder supply unit 16C supplies solder to the supply range set as described above. In this embodiment, as shown in FIG. 5A, the control unit 30 moves the solder supply unit 16C in the X direction while discharging solder S1 from the solder supply unit 16C to supply the solder S1 to the supply range. Therefore, the solder S1 supplied onto the mask 12 is in the form of a rod extending in the X direction, and is continuously distributed from one edge of the supply range in the X direction to the other edge.

[0060] [Unit supply amount] In this embodiment, the amount of solder supplied onto the mask 12 during the solder supply process is a unit supply amount or twice the unit supply amount. Here, the unit supply amount refers to the amount (volume) of solder supplied continuously from one end of the supply area to the other as the solder supply unit 16C moves to one side (right or left) in the X direction. That is, if the X-direction dimension of the supply area is W1, the cross-sectional area of ​​the solder dispensed from the solder supply unit 16C is A1, and the unit supply amount is V1, then the relationship V1 = W1 × A1 holds. Strictly speaking, V1 may be slightly larger or smaller than W1 × A1 depending on the shape of the solder dispensed from the nozzle 16D of the solder supply unit 16C (particularly at both ends in the X direction). However, for simplicity, V1 = W1 × A1 is used here. Because the distribution range of the openings 12A varies depending on the type of mask 12, W1 also varies depending on the type of mask 12. Therefore, V1 varies depending on the type of mask 12. It should be noted that A1 is an amount that depends on the inner diameter of nozzle 16D of solder supply unit 16C, the speed at which solder supply unit 16C is moved in the X direction, and the like.

[0061] As described above, the control unit 30 supplies a unit supply amount V1 of solder by continuously discharging solder from the solder supply unit 16C while moving the solder supply unit 16C to one side (right or left) in the X direction. For example, in the case shown in FIG. 5A, the control unit 30 first aligns the right end of the nozzle 16D of the solder supply unit 16C with the right edge of the supply area (X=X2) and starts discharging solder S1 from the solder supply unit 16C. Once solder S1 has been supplied to the right edge of the supply area, the control unit 30 continues discharging solder S1 from the solder supply unit 16C while moving the solder supply unit 16C to the left. When the left end of the nozzle 16D is aligned with the left edge of the supply area (X=X1), the control unit 30 stops discharging solder S1. This completes the supply of the unit supply amount V1 of solder S1 onto the mask 12.

[0062] Similarly, the control unit 30 can supply twice the unit supply amount V1 of solder by continuously discharging solder from the solder supply unit 16C while moving the solder supply unit 16C to one side in the X direction and then to the other side in the X direction (i.e., while moving it back and forth).

[0063] In the first embodiment, the timing at which solder is supplied by the above solder supply process is before printing and when it is determined that solder should be supplied by a solder supply execution determination, which will be described later.

[0064] Typically, the amount of solder supplied onto the mask 12 before printing is greater than the amount of solder filled into the openings 12A during the printing process. Therefore, after the printing process is completed, solder that was not filled into the openings 12A during the printing process (hereinafter referred to as solder roll) remains at the end of the mask 12 in the Y direction. However, as the printing process is repeated, the amount (volume) of the solder roll decreases. Therefore, in this embodiment, a determination is made at a predetermined timing during production as to whether or not solder supply should be executed (solder supply execution processing). Here, the predetermined timing during production may be, for example, the timing when the printing process has been completed for a predetermined number of substrates P.

[0065] [Solder supply execution decision] Hereinafter, the procedure for determining whether or not to supply solder according to this embodiment will be described with reference to the flowchart of FIG.

[0066] First, the control unit 30 controls the detection sensor 16F to calculate the current volume V2 of the solder roll (S110). Specifically, the detection sensor 16F may measure the dimension of the solder roll in the Y direction, and calculate the current volume V2 of the solder roll by approximating the solder roll as having a shape such as a cylinder cut in half. In this calculation, the X direction dimension of the solder roll can be determined using the actual measurement value measured by the detection sensor 16F, the X direction dimension of the supply range, the X direction dimension of the squeegee 16E, etc. Further, the current volume V2 of the solder roll may be calculated by measuring the height of the solder roll at a plurality of positions in the Y direction by the detection sensor 16F and obtaining the cross-sectional area of the solder roll.

[0067] Then, the control unit 30 calculates the solder consumption amount dV (= V3 - V2) from the difference between the target volume V3 of the solder roll and the current volume V2 of the solder roll (S120). Here, the target volume V3 of the solder roll may be the amount of solder supplied before printing (for example, twice the unit supply amount V1), or may be arbitrarily set by the operator. The target volume V3 of the solder roll is set to a volume sufficiently larger than the volume of solder filled in the opening 12A in one printing process.

[0068] Next, the control unit 30 calculates the unit supply amount V1 (S130) and determines the magnitude relationship between the solder consumption amount dV and the unit supply amount V1 (S140). When the solder consumption amount dV is larger than the unit supply amount V1 (S140: Yes), the control unit 30 determines to supply solder (S150). When the solder consumption amount dV is less than or equal to the unit supply amount V1 (S140: No), the control unit 30 determines not to supply solder (S160). Thus, the determination of whether to execute solder supply is completed.

[0069] After S150, before the next printing process or after the printing process is executed a predetermined number of times (for example, once), the solder supply process is executed. After S160, the printing process is performed without executing the solder supply process.

[0070] When the solder supply process is performed, whether the supply amount of solder is the unit supply amount V1 or twice the unit supply amount V1 may be determined based on the magnitude relationship between the solder consumption amount dV and a predetermined threshold value V4 (> V1). That is, the control unit 30 may be configured to supply solder of the unit supply amount V1 when the relationship V1 < dV < V4 holds, and supply solder twice the unit supply amount V1 when the relationship V4 ≤ dV holds.

[0071] [Operation and Effect of Embodiment 1] As described above, the printing device 1 of embodiment 1 is a printing device 1 that prints solder on a substrate P, and includes a mask 12 having openings 12A formed therein, a solder supply unit 16C that supplies solder onto the mask 12, a squeegee 16E that slides against the mask 12 onto which the solder has been supplied, thereby transferring the solder to the substrate P through the openings 12A, and a control unit 30.The control unit 30 is a printing device 1 that performs a distribution range acquisition process that acquires the distribution range of the openings 12A in the mask 12, a supply range setting process that sets a supply range for supplying solder within the distribution range of the openings 12A in the long side direction of the squeegee 16E, and a solder supply process that supplies solder to the supply range using the solder supply unit 16C.

[0072] With this configuration, the solder is supplied within the distribution range of the openings 12A of the mask 12, so that excessive supply of solder is suppressed and waste of supplied solder can be eliminated.

[0073] In the first embodiment, the printing device 1 preferably further includes a storage unit 30C that stores data on the distribution range of the openings 12A.

[0074] With this configuration, data on the distribution range of the openings 12A can be acquired from the storage unit 30C.

[0075] In embodiment 1, the printing device 1 further includes an inspection unit 17 that captures an image of the mask 12, and in the distribution range acquisition process, the control unit 30 preferably acquires the distribution range of the openings 12A in the mask 12 based on the image of the mask 12 captured by the inspection unit 17.

[0076] With this configuration, the distribution range of the openings 12A can be obtained based on the image captured by the inspection unit 17.

[0077] In embodiment 1, the supply range coincides with the distribution range of the openings 12A in the long side direction of the squeegee 16E, and the amount of solder that the solder supply unit 16C supplies continuously from one end of the supply range to the other while moving to one side in the long side direction of the squeegee 16E is set to unit supply amount V1, and when the solder consumption amount dV exceeds the unit supply amount V1, the control unit 30 executes a solder supply process, and in the solder supply process, it is preferable that the control unit 30 supplies unit supply amount V1 or twice the unit supply amount V1 of solder to the supply range.

[0078] With this configuration, the timing of supplying solder can be determined based on the unit supply amount V1 for each type of mask 12 and the solder consumption amount dV.

[0079] The solder supply method of embodiment 1 is a solder supply method using a printing device 1 that prints solder on a substrate P, and the printing device 1 includes a mask 12 having openings 12A formed therein, a solder supply unit 16C that supplies solder onto the mask 12, and a squeegee 16E that slides over the mask 12 onto which the solder has been supplied, thereby transferring the solder to the substrate P through the openings 12A.The solder supply method includes a distribution range acquisition process that acquires the distribution range of the openings 12A in the mask 12, a supply range setting process that sets a supply range for supplying solder within the distribution range of the openings 12A in the long side direction of the squeegee 16E, and a solder supply process that supplies solder to the supply range by the solder supply unit 16C.

[0080] In the solder supplying method according to the first embodiment, the printing device 1 preferably further includes a storage unit 30C that stores data on the distribution range of the openings 12A.

[0081] In the solder supply method of embodiment 1, the printing device 1 further includes an inspection unit 17 that captures an image of the mask 12, and in the distribution range acquisition process, it is preferable to acquire information on the distribution range of the openings 12A in the mask 12 based on the image of the mask 12 captured by the inspection unit 17.

[0082] In the solder supply method of embodiment 1, the supply range coincides with the distribution range of the openings 12A in the long side direction of the squeegee 16E, and the amount of solder that the solder supply section 16C supplies continuously from one end of the supply range to the other while moving to one side in the long side direction of the squeegee 16E is set to unit supply amount V1, and when the solder consumption amount dV exceeds the unit supply amount V1, a solder supply process is executed, and in the solder supply process, it is preferable to supply unit supply amount V1 or twice the unit supply amount V1 of solder to the supply range.

[0083] <Embodiment 2> A second embodiment of the present disclosure will be described with reference to Figures 9 and 10. Hereinafter, descriptions of configurations, processes, actions and effects similar to those of the first embodiment may be omitted. In embodiment 2, the control unit 30 of the printing device 101 acquires the distribution range of the openings 12A formed in the mask 12 (distribution range acquisition process), sets a range (supply range) in which solder is supplied inside the distribution range of the openings 12A in the long side direction (X direction) of the squeegee 16E (supply range setting process), and controls the solder supply unit 16C to supply solder to the supply range (solder supply process).

[0084] [Distribution range acquisition process] FIG. 10 shows an example of data on the distribution range of the openings 12A in the second embodiment. The text file shows the distribution range of the openings 12A in each mask 12. This text file includes the same mask names and distribution ranges of the openings 12A in the X direction as in the first embodiment, as well as the range of the mask 12 in which no openings 12A are provided within the distribution range of the openings 12A. For example, in the first line of FIG. 10, AAA indicates the mask name, and -90,70 written to the right of AAA indicates the distribution range of the openings 12A. Furthermore, -20,0,-20,80 written to the right of -90,70 (the distribution range of the openings 12A) indicates the range of the mask 12 in which no openings 12A are provided. In detail, it shows that no openings 12A are provided in the ranges from -20 mm to 0 mm when the center of the mask 12 is set to 0 in the X direction, and from -20 mm to 80 mm when the center of the mask 12 is set to 0 in the Y direction.

[0085] The control unit 30 acquires the mask name of the substrate data and the distribution range of the openings 12A (specifically, the range where the openings 12A are not provided) from the above-mentioned text file stored in advance in the storage unit 30C.

[0086] [Supply range setting process] In the second embodiment, as shown in FIG. 9B, the control unit 30 sets a solder supply range within a range where the openings 12A are not provided, which is located inside the distribution range of the openings 12A in the X direction. That is, the supply range is set so as not to overlap with the openings 12A. Specifically, in FIG. 9B, the range of the mask 12 where the openings 12A are not provided is the range bounded by four straight lines X=X5, X=X6, Y=Y1, and Y=Y2, and the supply range within which the solder S2 is supplied is set. The supply range extends in the sliding direction (Y direction) in which the squeegee 16E slides relative to the mask 12.

[0087] [Solder supply processing] 9, in this embodiment, the control unit 30 moves the squeegee unit 16A in the Y direction (the direction perpendicular to the paper surface in FIG. 9(A)) while discharging the solder S2 from the solder supply unit 16C, and supplies the solder S2 to a supply range that is elongated in the Y direction. At this time, by keeping the squeegee 16E in a sliding state on the mask 12, the solder S2 can be supplied while the printing process is being performed during production. In other words, the solder S2 can be replenished without interrupting the printing process, thereby improving the productivity of the printing device 101.

[0088] 9B illustrates one supply range that is elongated in the Y direction, but the supply range may be elongated in both the Y and X directions. Also, there may be multiple supply ranges that are elongated in the Y direction. When the supply range extends in both the Y and X directions, or when multiple supply ranges are set at different positions in the X direction, the control unit 30 may move the solder supply unit 16C in the X direction relative to the squeegee unit 16A during the solder supply process. This allows multiple rod-shaped solder extending in the Y direction to be supplied to different positions in the X direction, or solder extending in an oblique direction to be supplied.

[0089] In this embodiment, the squeegee 16E is slid in the Y direction while supplying the solder to the supply area in a form extending at least in the Y direction. Therefore, if the solder supply process of this embodiment is performed before a solder roll is formed, it may be necessary to slide the squeegee 16E in the Y direction several times to fill the openings 12A located at both ends of the distribution range of the openings 12A in the X direction with solder. Therefore, it is preferable to perform the solder supply process of embodiment 1 when forming a solder roll before printing, and then perform the solder supply process of this embodiment when replenishing solder during production.

[0090] [Effects of Embodiment 2] The printing device 101 of embodiment 2 further includes a squeegee unit 16A that supports the solder supply section 16C and the squeegee 16E and is movable in the sliding direction of the squeegee 16E perpendicular to the long side direction of the squeegee 16E, and the solder supply section 16C is movable in the long side direction of the squeegee 16E relative to the squeegee unit 16A. In the solder supply process, the control section 30 moves the squeegee unit 16A in the sliding direction of the squeegee 16E, causing the squeegee 16E to slide against the mask 12, while the solder supply section 16C supplies solder to a supply range extending in the sliding direction of the squeegee 16E.

[0091] With this configuration, by moving the squeegee unit 16A that supports the solder supply part 16C and the squeegee 16E in the sliding direction, the squeegee 16E can be slid relative to the mask 12, and the solder can be supplied while being printed on the substrate P. Therefore, production efficiency can be improved compared to when solder is supplied after the printing operation is completed.

[0092] In the second embodiment, it is preferable that the supply area does not overlap with the opening 12A.

[0093] With this configuration, the supply range does not overlap with the opening 12A, so when solder is supplied, it is possible to prevent the solder from dropping into the inside of the device from the opening 12A and the solder from being excessively supplied to the substrate P.

[0094] In the second embodiment, in the solder supplying process, the control unit 30 preferably moves the solder supply unit 16C in the direction of the long side of the squeegee 16E.

[0095] With this configuration, solder can be supplied to different positions along the long side of the squeegee 16E.

[0096] In the solder supply method of embodiment 2, the printing device 101 further includes a squeegee unit 16A that supports the solder supply section 16C and the squeegee 16E and is movable in a sliding direction of the squeegee 16E that is perpendicular to the long side direction of the squeegee 16E, and the solder supply section 16C is movable in the long side direction of the squeegee 16E relative to the squeegee unit 16A. In the solder supply process, the squeegee unit 16A is moved in the sliding direction of the squeegee 16E, causing the squeegee 16E to slide against the mask 12, and the solder supply section 16C supplies solder to a supply range that extends in the sliding direction of the squeegee 16E.

[0097] In the solder supplying method of the second embodiment, it is preferable that the supply range does not overlap with the opening 12A.

[0098] In the solder supplying method of the second embodiment, it is preferable that the solder supplying part 16C is moved in the direction of the long side of the squeegee 16E in the solder supplying step.

[0099] <Other embodiments> (1) In the first embodiment, the supply range coincides with the distribution range of the openings 12A in the X direction. However, the supply range may be set inside the distribution range of the openings in the X direction. (2) The solder supply method according to the first embodiment was applied to both the formation of a solder roll before printing and the replenishment of solder during production, but the solder supply method according to the present disclosure may be applied to at least one of the formation of a solder roll before printing and the replenishment of solder during production. (3) In the first embodiment, the squeegee unit 16A is provided to support the squeegee 16E and the solder supply unit 16C. However, the solder supply unit may be provided so as to be movable in the Y direction independently of the squeegee. [Explanation of symbols]

[0100] 1,101:Printing device 10: Housing, 11: Base, 12: Mask, 12A: Opening, 13: Mask holder, 13A: Rail section 14: substrate transport section, 14A: upstream conveyor, 14B: main conveyor, 14C: downstream conveyor 15: Printing table, 16: Printing unit, 16A: Squeegee unit, 16B: Guide rail, 16C: Solder supply unit, 16D: Nozzle, 16E: Squeegee, 16F: Detection sensor 17: Inspection unit, 17A: Camera unit, 17B: Beam, 17C: Ball screw, 17D: Guide rail, 17E: Mask imaging camera, 17F: Board imaging camera 20: table, 21: ball screw, 22: board fixing unit, 22A: clamping portion, 23: backup unit, 23A: lower plate, 23B: upper plate, 23C: backup pin, 23D: ball screw 30: Control unit, 30A: CPU, 30B: RAM, 30C: Storage unit, 31: Display unit, 32: Input unit P: PCB, R1, S1, S2: Solder V1: unit supply amount, V2: current volume of solder roll, V3: target volume of solder roll, V4: threshold, dV: solder consumption

Claims

1. A printing device for printing solder on a substrate, a mask having an opening formed therein; a solder supply unit that supplies solder onto the mask; a squeegee unit having a squeegee that slides over the mask to which solder has been supplied, thereby transferring the solder to the substrate through the opening; a control unit, a detection sensor for measuring the volume of the solder on the mask is attached to the squeegee unit; The control unit a distribution range acquisition process for acquiring a distribution range of the openings in the mask; a supply range setting process for setting a supply range for supplying solder within the distribution range of the opening in the long side direction of the squeegee; a solder consumption amount calculated based on the difference between a target volume of solder and the current volume of solder measured by the detection sensor; a unit supply amount is defined as the amount of solder that the solder supply unit supplies continuously from one end of the supply range to the other end while moving to one side in the long side direction of the squeegee; and if the solder consumption amount exceeds the unit supply amount, the solder supply unit performs a solder supply process to supply solder to the supply range.

2. The printing device according to claim 1 , further comprising a storage unit that stores data on the distribution range of the openings.

3. further comprising an inspection unit that captures an image of the mask; The printing apparatus according to claim 1 , wherein in the distribution range acquisition process, the control unit acquires the distribution range of the openings in the mask based on an image of the mask captured by the inspection unit.

4. A printing device for printing solder on a substrate, comprising: a mask having an opening formed therein; a solder supply unit that supplies solder onto the mask; a squeegee that slides over the mask to which the solder has been supplied, thereby transferring the solder to the substrate through the openings; a control unit, The control unit a distribution range acquisition process for acquiring a distribution range of the openings in the mask; a supply range setting process for setting a supply range for supplying solder within the distribution range of the opening in the long side direction of the squeegee; a solder supply process of supplying solder to the supply range by the solder supply unit; the supply range coincides with the distribution range of the openings in the long side direction of the squeegee, the amount of solder supplied continuously from one end of the supply range to the other end while the solder supply unit moves to one side in the long side direction of the squeegee is defined as a unit supply amount; the control unit executes the solder supply process when the consumed amount of solder exceeds the unit supply amount; In the solder supply process, the control unit supplies the unit supply amount or twice the unit supply amount of solder to the supply range.

5. A printing device for printing solder on a substrate, comprising: a mask having an opening formed therein; a solder supply unit that supplies solder onto the mask; a squeegee that slides over the mask to which the solder has been supplied, thereby transferring the solder to the substrate through the openings; a control unit, The control unit a distribution range acquisition process for acquiring a distribution range of the openings in the mask; a supply range setting process for setting a supply range for supplying solder within the distribution range of the opening in the long side direction of the squeegee; a solder supply process of supplying solder to the supply range by the solder supply unit; a squeegee unit that supports the solder supply unit and the squeegee and is movable in a sliding direction of the squeegee that is perpendicular to a long side direction of the squeegee; the solder supply unit is movable relative to the squeegee unit in a long side direction of the squeegee, In the solder supply process, the control unit moves the squeegee unit in the sliding direction of the squeegee, sliding the squeegee against the mask, and supplies solder to the supply range that expands in the sliding direction of the squeegee using the solder supply unit.

6. The printing device according to claim 5 , wherein the supply area does not overlap with the opening.

7. 7. The printing apparatus according to claim 5, wherein in the solder supplying process, the control unit moves the solder supply unit in a direction of a long side of the squeegee.

8. A solder supply method using a printing device that prints solder on a substrate, comprising: the printing device includes a mask having openings formed therein, a solder supply unit that supplies solder onto the mask, a squeegee unit having a squeegee that slides over the mask onto which the solder has been supplied to transfer the solder onto the substrate through the openings, and a detection sensor; The solder supply method is as follows: a distribution range acquisition step of acquiring a distribution range of the openings in the mask; a supply range setting step of setting a supply range for supplying solder within the distribution range of the opening in the long side direction of the squeegee; a solder supply step of calculating a consumption amount of solder based on the difference between a target volume of solder and the current volume of solder measured by the detection sensor, defining the amount of solder that the solder supply unit supplies continuously from one end of the supply range to the other end while moving to one side in the long side direction of the squeegee as a unit supply amount, and supplying solder to the supply range by the solder supply unit when the consumption amount of solder exceeds the unit supply amount.

9. The solder supply method according to claim 8 , wherein the printing device further comprises a storage unit that stores data on the distribution range of the openings.

10. the printing apparatus further includes an inspection unit that captures an image of the mask; 9. The solder supply method according to claim 8, wherein the distribution range acquisition step acquires information about the distribution range of the openings in the mask based on an image of the mask captured by the inspection unit.

11. A solder supply method using a printing device that prints solder on a substrate, comprising: the printing device includes a mask having openings formed therein, a solder supply unit that supplies solder onto the mask, and a squeegee that slides over the mask onto which the solder has been supplied, thereby transferring the solder to the substrate through the openings; The solder supply method is as follows: a distribution range acquisition step of acquiring a distribution range of the openings in the mask; a supply range setting step of setting a supply range for supplying solder within the distribution range of the opening in the long side direction of the squeegee; a solder supply step of supplying solder to the supply range by the solder supply unit, the supply range coincides with the distribution range of the openings in the long side direction of the squeegee, the amount of solder supplied continuously from one end of the supply range to the other end while the solder supply unit moves to one side in the long side direction of the squeegee is defined as a unit supply amount; When the consumed amount of solder exceeds the unit supply amount, the solder supply step is executed; In the solder supplying step, the unit supply amount or twice the unit supply amount of solder is supplied to the supply range.

12. A solder supply method using a printing device that prints solder on a substrate, comprising: the printing device includes a mask having openings formed therein, a solder supply unit that supplies solder onto the mask, and a squeegee that slides over the mask onto which the solder has been supplied, thereby transferring the solder to the substrate through the openings; The solder supply method is as follows: a distribution range acquisition step of acquiring a distribution range of the openings in the mask; a supply range setting step of setting a supply range for supplying solder within the distribution range of the opening in the long side direction of the squeegee; a solder supply step of supplying solder to the supply range by the solder supply unit, the printing device further includes a squeegee unit that supports the solder supply unit and the squeegee and is movable in a sliding direction of the squeegee that is perpendicular to a long side direction of the squeegee; the solder supply unit is movable relative to the squeegee unit in a long side direction of the squeegee, In the solder supply process, the squeegee unit is moved in the sliding direction of the squeegee, and the squeegee is slid against the mask, while the solder supply unit supplies solder to the supply range that expands in the sliding direction of the squeegee.

13. The solder supply method of claim 12 , wherein the supply area does not overlap the opening.

14. 14. The solder supplying method according to claim 12, wherein in the solder supplying step, the solder supply unit is moved in a direction of a long side of the squeegee.

Images