Substrate Processing System Carrier

Abstract

To provide a substrate processing system carrier that is a carrier for carrying a process kit ring (e.g., an edge ring) and / or the other chamber component between stations in a substrate processing system.SOLUTION: A carrier 200 contains: a rigid body 210 forming a plurality of open parts; and a plurality of fasteners 230 that is detachably attached to the rigid body via the plurality of open parts. A first set (e.g., three fingers) of a finger 240 is detachably attached to the rigid body via the plurality of fasteners and the plurality of open parts. The first set of each finger, supports a first content in a first conveyance of a carrier within a substrate processing system. The second set of each finger is detachably attached to the rigid body via the plurality of fasteners and the plurality of open parts. The second set of each finger supports a second content in a second conveyance of the carrier within the substrate processing system.SELECTED DRAWING: Figure 2A

Description

[Technical Field]

[0001] FIELD Embodiments of the present disclosure relate to apparatus and methods for transporting content, and more particularly, to carriers for transporting content, such as process kit rings, within a substrate processing system.

[0002] In semiconductor processing and other electronic processing, platforms are often used that use robotic arms to transport objects (e.g., wafers) between processing chambers, from storage areas (e.g., Front Opening Unified Pods (FOUPs)) to processing chambers, from processing chambers to storage areas, etc.

[0003] The following is a simplified summary of the disclosure to provide a basic understanding of some aspects of the disclosure. This summary is not an extensive overview of the disclosure. It is not intended to identify key or critical elements of the disclosure, nor to identify the scope or claims of particular implementations of the disclosure. Its sole purpose is to present some concepts of the disclosure in a simplified form as a prelude to the more detailed description that is presented later.

[0004] In one aspect of the disclosure, a carrier includes a rigid body defining a plurality of openings and a plurality of fasteners configured to removably attach to the rigid body via the plurality of openings. A first set of fingers is configured to be removably attached to the rigid body via the plurality of fasteners and the plurality of openings. The first set of fingers is configured to support first contents during a first transfer of the carrier within a substrate processing system. A second set of fingers is configured to be removably attached to the rigid body via the plurality of fasteners and the plurality of openings. The second set of fingers is configured to support second contents during a second transfer of the carrier within the substrate processing system.

[0005] In another aspect of the present disclosure, a finger is configured to be removably attached to a carrier of a substrate processing system. The finger includes a first upper surface disposed substantially in a first plane and a second upper surface disposed in a second plane substantially above the first plane. The first upper surface is configured to support contents during transport of the carrier. The finger further includes a sidewall disposed between the first upper surface and the second upper surface. The finger further includes a lower surface. A first opening is formed through the finger from the second upper surface to the lower surface. The lower surface forms a recess that receives a portion of the carrier, forming the second opening. The finger is attached to the carrier via a fastener inserted through the first opening in the finger and the second opening in the carrier.

[0006] In another aspect of the present disclosure, a method includes determining a first condition associated with a first transfer in a substrate processing system and identifying a first set of fingers corresponding to the first condition. The method further includes attaching the first set of fingers to a rigid body of a carrier via a plurality of fasteners and placing a first content on the first set of fingers that is transferred within the substrate processing system via the carrier. [Brief explanation of the drawings]

[0007] The present disclosure is illustrated by way of example, and not limitation, in the figures of the accompanying drawings in which like references indicate like elements. It should be noted that different references to "a" or "one" embodiment in the present disclosure are not necessarily to the same embodiment, and such references mean at least one. [Figure 1] 1 illustrates a processing system in accordance with certain embodiments. [Figure 2A] ~ [Figure 2N] 1 illustrates a diagram of a carrier according to certain embodiments. [Figure 3A] ~ [Figure 3B] 10A-10C illustrate fingers of a carrier according to certain embodiments. [Figure 4A] ~ [Figure 4F] 10A-10C illustrate fingers and fasteners of a carrier according to certain embodiments. [Figure 5] 1 illustrates a method of using a carrier, according to certain embodiments. Detailed Description of the Embodiments

[0008] Embodiments described herein relate to substrate processing system carriers. Certain embodiments relate to carriers configured to transport process kit rings (e.g., edge rings) and / or other chamber components between stations within a substrate processing system. The carriers are picked up, moved, and placed by a robot arm configured to pick up, move, and place substrates, such as wafers. The carriers allow other types of objects (e.g., process kit rings, etc.) to be handled by a robot arm configured to process substrates.

[0009] A processing system (e.g., a wafer processing system) has one or more processing chambers for processing substrates. Gases are used to etch the substrate within the processing chamber (e.g., the substrate is etched while electrostatically clamped in place within the etching chamber). The substrate support assembly typically includes one or more process kit rings that surround the substrate (e.g., to protect one or more portions of the processing chamber, the substrate). For example, a circular component called an edge ring or process kit ring is positioned just outside the outer diameter of the substrate to prevent the etchant chemistry from etching the top surface of the chuck (e.g., an electrostatic chuck) that supports the substrate. Process kit rings can be fabricated from several different materials and have different shapes, both of which affect the process uniformity near the process kit ring. During processing, the process kit ring and other components of the processing chamber are etched over time, resulting in changes in shape and process uniformity.

[0010] Process kit rings and other components are replaced to address changes in processing uniformity due to degradation of the process kit rings and other components. Some components (e.g., process kit rings, etc.) are replaced according to a schedule. Traditionally, to replace a component (e.g., process kit rings, etc.), an operator opens the processing chamber to access the internal components, manually removes and replaces the component, and then closes the processing chamber. While the processing chamber is open, the processing chamber and processing system may become contaminated with cells, hair, dust, etc. After opening, the processing chamber and / or processing system undergoes a requalification process that removes the processing chamber and / or processing system from operation for several days to several weeks. The requalification process impacts production line yield, scheduling, quality (e.g., when variables are added to the system), user time, energy usage, etc.

[0011] The devices, systems, and methods disclosed herein provide a substrate processing system carrier (also referred to herein as a chamber component carrier or simply a carrier). The carrier enables automated exchange of various types of contents under various types of conditions (e.g., without opening the process chamber while maintaining a sealed environment). The carrier includes a rigid body forming an opening and fasteners configured to removably attach to the rigid body through the opening. A first set of fingers (e.g., three fingers) are configured to removably attach to the rigid body through the fasteners and the openings. The first set of fingers is configured to support a first content during a first transfer of the carrier (e.g., via a robot arm) within the substrate processing system. A second set of fingers (e.g., three fingers) is configured to removably attach to the rigid body through the fasteners and the openings. The second set of fingers is configured to support a second content during a second transfer of the carrier (e.g., via a robot arm) within the substrate processing system. In some embodiments, the first content and the second content are different types of content. In some examples, the content includes one or more of a new process kit ring, a used process kit ring, a new chamber component of a substrate processing system, a used chamber component of a substrate processing system, and the like.

[0012] In some embodiments, the first transfer and the second transfer are under different conditions. In some embodiments, each finger of the first set of fingers includes a first material configured for a first condition and each finger of the second set of fingers includes a second material configured for a second condition different from the first condition. In some examples, the conditions include one or more of a corrosive condition, a clean condition, an electrostatic condition, a high temperature, a high pressure, an atmospheric pressure, a vacuum, etc.

[0013] In some embodiments, each finger has a first upper surface, a second upper surface, sidewalls, and a lower surface. The first upper surface is disposed substantially in a first plane and configured to support content during transport of the carrier. The second upper surface is disposed substantially in a second plane above the first plane. The sidewalls are disposed between the first and second upper surfaces. A first opening is formed through the fingers from the second upper surface to the lower surface. The lower surface forms a recess that receives a portion of the carrier forming the second opening. The fingers are removably attached to the carrier via fasteners inserted through the first openings in the fingers and the second openings in the carrier. In some embodiments, content contacts the set of fingers without contacting the rigid body during transport of the carrier. In some embodiments, the openings formed in the rigid body are slots, and each finger is adjustably positioned on the rigid body via the slot. In some examples, the position of the fingers is adjusted based on finger wear. In some examples, the position of the fingers is adjusted based on the type (e.g., size, etc.) of content transported by the carrier.

[0014] In some embodiments, the sidewalls of the fingers have an upper portion that is angled at about 100-110° (e.g., about 15° from perpendicular) relative to the first top surface and a lower portion that is angled at about 90-100° (e.g., about 5° from perpendicular). In some embodiments, the fingers further include a chamfer between the first top surface and the sidewalls. In some embodiments, the fingers are configured to dissipate static charge.

[0015] The carrier (e.g., rigid body) includes one or more lower surfaces configured to interface with an end effector of a robot arm. The carrier (e.g., rigid body) includes one or more lower surfaces (e.g., solid planar central regions) configured to interface with a vacuum chuck.

[0016] The devices, systems, and methods disclosed herein have advantages over conventional solutions. The substrate processing system carrier allows for automated exchange of various types of contents in various types of conditions without opening the process chamber and without a subsequent requalification process. The substrate processing system carrier is configured to interface with equipment used to transport wafers (e.g., end effectors of a robot arm, vacuum chucks, lift pins, etc.). The use of the substrate processing system carrier allows the wafer handling components of the wafer processing system (e.g., vacuum chucks, end effectors, robot arms, slit valves, load ports, etc.) to also handle process kit rings and other components with no or minimal adaptation. The use of the substrate processing system carrier to exchange components has less impact on line yield, scheduling, substrate quality, user time, energy usage, etc. than conventional solutions. Furthermore, the use of the substrate processing system carrier allows robots and / or stations configured for handling substrates to also handle other types of objects (e.g., chamber components) without modification, thereby reducing the total cost of ownership of the substrate processing system.

[0017] Although portions of this description refer to process kit rings, this description may be applicable to different types of components (e.g., different types of chamber components in addition to process kit rings, such as edge rings, showerheads, masks, mask handlers, half rings, etc.) Although portions of this description refer to substrate processing systems, this description may be applicable to other types of systems.

[0018] FIG. 1 illustrates a processing system 100 (e.g., a wafer processing system, a substrate processing system, a semiconductor processing system) in accordance with certain embodiments. The processing system 100 includes a factory interface 101 and load ports 128 (e.g., load ports 128A-D). In some embodiments, the load ports 128A-D are directly attached (e.g., sealed) to the factory interface 101. An enclosure system 130 (e.g., a cassette, FOUP, process kit enclosure system, etc.) is configured to removably couple (e.g., dock) to the load ports 128A-D. In FIG. 1, enclosure system 130A is coupled to load port 128A, enclosure system 130B is coupled to load port 128B, enclosure system 130C is coupled to load port 128C, and enclosure system 130D is coupled to load port 128D. In some embodiments, one or more enclosure systems 130 are coupled to the load ports 128 to transport wafers and / or other substrates to and from the processing system 100. Each of the enclosure systems 130 is sealed to its respective load port 128. In some embodiments, a first enclosure system 130A is docked to the load port 128A (e.g., to replace a used process kit ring). Once one or more such operations are performed, the first enclosure system 130A is undocked from the load port 128A, and then a second enclosure system 130 (e.g., a FOUP containing wafers) is docked to the same load port 128A. In some embodiments, carriers (e.g., configured to use different types of fingers) are used to transport different types of contents between the enclosure system 130 and other parts of the processing system 100.

[0019] In some embodiments, the load port 128 includes a front interface that forms a vertical opening (or a substantially vertical opening). Additionally, the load port 128 includes a horizontal surface for supporting an enclosure system 130 (e.g., a cassette, a process kit enclosure system). Each enclosure system 130 (e.g., a wafer FOUP, a process kit enclosure system) has a front interface that forms a vertical opening. The front interface of the enclosure system 130 is sized to interface (e.g., seal) with the front interface of the load port 128 (e.g., the vertical opening of the enclosure system 130 is approximately the same size as the vertical opening of the load port 128). The enclosure system 130 is positioned on the horizontal surface of the load port 128, and the vertical opening of the enclosure system 130 is aligned with the vertical opening of the load port 128. The front interface of the enclosure system 130 interconnects (e.g., clamps, fastens, seals, etc.) with the front interface of the load port 128. The bottom (e.g., base plate) of the enclosure system 130 has features (e.g., load port dynamic pin features such as recesses or receptacles, load port features for pin clearance, and / or enclosure system docking tray latch clamp features) that engage with the horizontal surfaces of the load port 128. The same load port 128 can be used for different types of enclosures (e.g., process kit enclosure systems, cassettes containing wafers, etc.).

[0020] In some embodiments, enclosure system 130 (e.g., a process kit enclosure system) contains one or more items of contents 110 (e.g., one or more process kit rings, empty process kit ring carriers, process kit rings positioned on process kit ring carriers, placement verification wafers, components of processing system 100, etc.). In some examples, enclosure system 130 is coupled to factory interface 101 (e.g., via load port 128) and can automatically transport process kit rings on process kit ring carriers to processing system 100 for replacement of used process kits.

[0021] In some embodiments, the processing system 100 also includes first vacuum ports 103a, 103b coupling the factory interface 101 to each of the degassing chambers 104a, 104b. Second vacuum ports 105a, 105b are coupled to each of the degassing chambers 104a, 104b and are disposed between the degassing chambers 104a, 104b and the transfer chamber 106 to facilitate transfer of wafers and contents 110 (e.g., process kit rings) to the transfer chamber 106. In some embodiments, the processing system 100 includes and / or uses one or more degassing chambers 104 and a corresponding number of vacuum ports 103, 105 (e.g., the processing system 100 includes a single degassing chamber 104, a single first vacuum port 103, and a single second vacuum port 105). The transfer chamber 106 includes multiple processing chambers 107 (e.g., four processing chambers 107, six processing chambers 107, etc.) disposed around and coupled thereto. The processing chambers 107 are coupled to the transfer chamber 106 through respective ports 108 (e.g., slit valves, etc.). In some embodiments, the factory interface 101 is at high pressure (e.g., atmospheric pressure) and the transfer chamber 106 is at low pressure (e.g., vacuum). Each degassing chamber 104 (e.g., load lock, pressure chamber) has a first door (e.g., first vacuum port 103) to seal the degassing chamber 104 from the factory interface 101 and a second door (e.g., second vacuum port 105) to seal the degassing chamber 104 from the transfer chamber 106. Contents are transferred from the factory interface 101 to the degassing chamber 104 while the first door is open and the second door is closed. When the first door is closed, the pressure in the degassing chamber is reduced to match that of the transfer chamber 106, and when the second door is opened, contents are transferred from the degassing chamber 104. A local center finder (LCF) device is used to align the contents within the transfer chamber 106 (eg, before entering the processing chamber 107, after exiting the processing chamber 107).

[0022] In some embodiments, the processing chamber 107 includes one or more of an etch chamber, a deposition chamber (including atomic layer deposition, chemical vapor deposition, physical vapor deposition, or plasma-enhanced versions thereof), an anneal chamber, or the like.

[0023] The factory interface 101 includes a factory interface robot 111. The factory interface robot 111 includes a robot arm (e.g., a selective compliance assembly robot arm (SCARA). Examples of SCARA robots include a two-link SCARA robot, a three-link SCARA robot, a four-link SCARA robot, etc.). The factory interface robot 111 includes an end effector at the end of the robot arm. The end effector is configured to lift and handle particular objects (e.g., wafers, etc.). Alternatively or additionally, the end effector is configured to handle objects (e.g., carriers and / or process kit rings (edge ​​rings), etc.). The robot arm has one or more links or members (e.g., wrist members, upper arm members, forearm members, etc.) configured to be moved to move the end effector to different orientations and positions.

[0024] The factory interface robot 111 is configured to transfer objects between the enclosure system 130 (e.g., cassettes, FOUPs) and the degassing chambers 104a, 104b (or load ports). While conventional systems involve opening (e.g., disassembly, breaking seals, contamination) a processing system (e.g., factory interface, transfer chamber, processing chamber) to exchange different types of content, the processing system 100 is configured to facilitate content transfer and exchange without an operator having to open (e.g., disassembly, breaking seals, contamination) the processing system 100. Thus, in some embodiments, a sealed environment including the interior volumes of the enclosure system 130 and the factory interface 101 is maintained during content exchange (e.g., via a carrier with interchangeable fingers).

[0025] The transfer chamber 106 includes a transfer chamber robot 112. The transfer chamber robot 112 includes a robot arm having an end effector at its end. The end effector is configured to handle a particular object (e.g., a wafer, etc.). In some embodiments, the transfer chamber robot 112 is a SCARA robot, but in some embodiments, it has fewer links and / or fewer degrees of freedom than the factory interface robot 111.

[0026] Controller 109 controls various aspects of processing system 100. Controller 109 may be and / or include a computing device (e.g., a personal computer, a server computer, a programmable logic controller (PLC), a microcontroller, etc.). Controller 109 includes one or more processing devices, which in some embodiments are general-purpose processing devices (e.g., a microprocessor, a central processing unit, etc.). More specifically, in some embodiments, the processing device is a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor that executes other instruction sets or combinations of instruction sets.

[0027] In some embodiments, the processing device is one or more special-purpose processing devices (e.g., an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), a network processor, etc.). In some embodiments, the controller 109 includes data storage (e.g., one or more disk drives and / or solid state drives), main memory, static memory, a network interface, and / or other components. In some embodiments, the controller 109 executes instructions to perform any one or more of the methods or processes described herein. The instructions are stored on a computer-readable storage medium, which may include one or more of the main memory, static memory, secondary storage, and / or a processing unit (during execution of the instructions). In some embodiments, the controller 109 receives signals from and sends controls to the factory interface robot 111 and the wafer transfer chamber robot 112.

[0028] FIG. 1 schematically illustrates the transfer of contents 110 (e.g., a process kit ring coupled to a process kit ring carrier) to a processing chamber 107. According to one aspect of the present disclosure, the contents 110 are removed from the enclosure system 130 via a factory interface robot 111 located within the factory interface 101. The factory interface robot 111 transfers the contents 110 into each of the evacuation chambers 104a and 104b via one of the first vacuum ports 103a and 103b. A transfer chamber robot 112 located within the transfer chamber 106 removes the contents 110 from one of the evacuation chambers 104a and 104b via a second vacuum port 105a or 105b. The transfer chamber robot 112 moves the contents 110 into the transfer chamber 106, where the contents 110 are transferred to the processing chambers 107 via respective ports 108. Although not explicitly shown in FIG. 1, the transfer of contents 110 may include the transfer of process kit rings arranged on process kit ring carriers, the transfer of empty process kit ring carriers, the transfer of placement verification wafers, and the like.

[0029] While FIG. 1 illustrates one example of the transfer of contents 110, other examples are contemplated. In some examples, it is contemplated that the enclosure system 130 may be coupled to the transfer chamber 106 (e.g., via a load port attached to the transfer chamber 106). From the transfer chamber 106, the contents 110 are loaded into the processing chamber 107 by the transfer chamber robot 112. Furthermore, in some embodiments, the contents 110 are loaded onto a substrate support pedestal (SSP). In some embodiments, an additional SSP is positioned in communication with the factory interface 101 opposite the illustrated SSP. Processed contents 110 (e.g., used process kit rings) are removed from the processing system 100 in a manner reverse to that described herein. While multiple enclosure systems 130 or a combination of enclosure systems 130 and SSPs may be utilized, in some embodiments, one SSP or enclosure system 130 is used for unprocessed contents 110 (e.g., new process kit rings) and another SSP or enclosure system 130 is used to receive processed contents 110 (e.g., used process kit rings).

[0030] The processing system 100 includes a factory interface 101 (e.g., an Equipment Front End Module (EFEM)) and chambers, such as an adjacent chamber adjacent to the factory interface 101 (e.g., a load port 128, an enclosure system 130, an SSP, an evacuation chamber 104 of a load lock 102, etc.). One or more chambers are sealed (e.g., each chamber is sealed). The adjacent chambers are sealed to the factory interface 101. In some embodiments, an inert gas (e.g., one or more of nitrogen, argon, neon, helium, krypton, or xenon) is provided to one or more chambers (e.g., the factory interface 101 and / or adjacent chambers) to provide one or more inert environments. In some examples, the factory interface 101 is an inert EFEM that maintains an inert environment (e.g., an inert EFEM mini-environment) within the factory interface 101, thereby eliminating the need for a user to enter the factory interface 101 (e.g., the processing system 100 is configured such that there is no manual access within the factory interface 101).

[0031] In some embodiments, a gas flow (e.g., inert gas, nitrogen) is provided to one or more chambers (e.g., factory interface 101) of processing system 100. In some embodiments, the gas flow is greater than leakage through one or more chambers, maintaining a positive pressure in the one or more chambers. In some embodiments, the inert gas in factory interface 101 is recirculated. In some embodiments, a portion of the inert gas is exhausted. In some embodiments, the gas flow of non-recirculated gas into factory interface 101 is greater than the exhaust gas flow and gas leakage, maintaining a positive pressure of inert gas in factory interface 101. In some embodiments, factory interface 101 is coupled to one or more valves and / or pumps to provide gas flow into and out of factory interface 101. A processing device (e.g., controller 109) controls the gas flow into and out of factory interface 101. In some embodiments, the processing device receives sensor data from one or more sensors (e.g., oxygen sensors, moisture sensors, motion sensors, door operation sensors, temperature sensors, pressure sensors, etc.) and determines the flow rate of the inert gas flow into and out of the factory interface 101 based on the sensor data.

[0032] The enclosure system 130 allows for the transport and exchange of different types of content 110 (e.g., via carriers with interchangeable fingers) without opening the sealed environment within the factory interface 101 and adjacent chambers. The enclosure system 130 seals the load port 128 in response to docking to the load port 128. The enclosure system 130 provides access to a purge port, which allows the interior of the enclosure system 130 to be purged before opening it, minimizing the adverse effects of the inert environment within the factory interface 101.

[0033] 2A-N show diagrams of a carrier 200 according to certain embodiments.

[0034] 2A-D and 2G-L show views of carrier 200. FIG. 2A shows a top perspective view of carrier 200 including rigid body 210, fasteners 230, and fingers 240, according to certain embodiments. FIG. 2B shows a bottom perspective view of carrier 200 including rigid body 210, fasteners 230, and fingers 240, according to certain embodiments. FIG. 2C shows a top view of rigid body 210 of carrier 200 (e.g., without fasteners 230 and fingers 240), according to certain embodiments. FIG. 2D shows a bottom view of rigid body 210 of carrier 200 (e.g., without fasteners 230 and fingers 240), according to certain embodiments. FIG. 2G shows a top view of carrier 200 including rigid body 210, fasteners 230, and fingers 240, according to certain embodiments. Figure 2H shows a bottom view of carrier 200 including rigid body 210, fasteners 230, and fingers 240, according to certain embodiments. Figure 21 shows a front view of carrier 200 including rigid body 210, fasteners 230, and fingers 240, according to certain embodiments. Figure 2J shows a back view of carrier 200 including rigid body 210, fasteners 230, and fingers 240, according to certain embodiments. Figure 2K shows a left side elevation view of carrier 200 including rigid body 210, fasteners 230, and fingers 240, according to certain embodiments. Figure 2L shows a right side elevation view of carrier 200 including rigid body 210, fasteners 230, and fingers 240, according to certain embodiments.

[0035] Carrier 200 includes rigid body 210 with opening 220 (see, e.g., FIGS. 2C-D). In some embodiments, opening 220 is threaded to receive threaded fastener 230. Carrier 200 further includes fastener 230 (e.g., a screw, bolt, rivet, etc.) configured to removably attach to rigid body 210 through opening 220. In some embodiments, fastener 230 is threaded for securing to threaded opening 220. In some embodiments, fastener 230 is threaded for securing to threaded fingers 240. In some embodiments, each fastener 230 includes a first portion and a second portion (e.g., a bolt and nut, etc.) configured to secure to one another to secure fingers 240 to rigid body 210.

[0036] Fingers 240 are configured to be removably attached to rigid body 210 via fasteners 230 and openings 220. In some embodiments, each finger 240 defines an opening, and fastener 230 is configured to be inserted through the opening in finger 240 and opening 220 in rigid body 210, thereby removably attaching finger 240 to rigid body 210.

[0037] The set of fingers 240 (e.g., three fingers 240) is configured to be removably attached to the rigid body 210. The set of fingers 240 is configured to support the contents (e.g., a process kit ring) during transport of the carrier (e.g., via a robot) within the substrate processing system. In some embodiments, the contents contact the set of fingers 240 without contacting the rigid body 210 during transport within the substrate processing system.

[0038] In some embodiments, a first set of fingers 240 (e.g., three fingers) are removably attached to the rigid body 210 via fasteners 230 and openings 220 and configured to support a first content during a first transfer within the substrate processing system (e.g., via a robotic arm), and a second set of fingers 240 (e.g., three different fingers) are removably attached to the rigid body 210 (e.g., via the same fasteners 230 and the same openings 220 as used in the first set) and configured to support a second content during a second transfer of the carrier 200 within the substrate processing system (e.g., via the same robotic arm).

[0039] In some embodiments, different sets of fingers 240 are used for different types of content. In some examples, the different types of content include new content and used content (e.g., a first set of fingers 240 secured to the rigid body 210 to transport used content and a second set of fingers 240 secured to the same rigid body 210 to transport new content). In some examples, the different types of content include different sizes and / or shapes of content (e.g., a first set of fingers 240 secured to the rigid body 210 to transport content of a first size and / or shape and a second set of fingers secured to the same rigid body 210 to transport content of a different size and / or shape). In some examples, the different types of content include a process kit ring, a chamber component of a substrate processing system, a used chamber component of a substrate processing system, a showerhead, a component having a substantially round perimeter (e.g., inner perimeter, outer perimeter), etc.

[0040] In some embodiments, different sets of fingers 240 are used for different conditions. In some embodiments, each finger 240 of a first set of fingers 240 includes a first material configured for a first condition, and each finger of a second set of fingers includes a second material configured for a second condition different from the first condition. In some examples, the material of the fingers 240 includes one or more of polyethylene terephthalate (PET), ceramic material, polytetrafluoroethylene (PTFE) (e.g., Teflon), ultra-high molecular weight (UHMW) polyethylene, absorbent material, non-absorbent material, coated material, deformable material, electrostatic dissipative material, etc. In some embodiments, the fingers 240 have a particular conductivity (e.g., less than perfect conductivity, some conductivity to allow dissipation at a controlled rate, prevention of a conductive path for high arcing, approximately 10 5 from about 10 9 In some examples, the different conditions include one or more of a corrosion condition, a cleaning condition, an electrostatic condition, a particular process (e.g., a substrate fabrication process, atomic layer deposition, chemical vapor deposition, physical vapor deposition, plasma-enhanced versions thereof, etc.), a particular chemical (e.g., fluorine, acid, base, etc.), a particular temperature range (e.g., high temperature), a particular pressure range (e.g., high pressure), atmospheric pressure, vacuum pressure, etc.

[0041] In some embodiments, carrier 200 is a customized mechanical adapter that allows automated handling of process kit rings through tools designed for wafer handling. Interchangeable fingers 240 allow for maintenance of carrier 200, and the replacement of different finger material types depending on the needs of the particular process kit ring. Carrier 200 with interchangeable fingers 240 allows for current process kit ring compatibility and future compatibility with various sizes and material types of process kit rings.

[0042] In some embodiments, different rigid bodies 210 are used for different contents and / or different conditions. In some embodiments, each rigid body 210 is made of a different type of material. In some examples, rigid body 210 is fabricated from one or more of carbon fiber, aluminum, cast aluminum (e.g., MIC-6®), hard-anodized aluminum, ceramic material, titanium, etc. In some embodiments, rigid body 210 is the same or similar material as a robot blade (e.g., end effector). In some embodiments, carrier 200 has no bonded components (e.g., no adhesive). In some embodiments, carrier 200 has no heat-fit components. In some embodiments, all features of carrier 200 are mechanically engaged (e.g., via fasteners 230) or machined into rigid body 210.

[0043] In some embodiments, carrier 200 includes pads 250 (e.g., mushroom pads, perfluoroelastomer pads, Kalrez™ friction pads, nine Kalrez mushroom pads, calibration mushrooms, pads integrated into rigid body 210, etc.) for non-slip interfaces (e.g., automation interface faces) of atmospheric robot end effectors (e.g., factory interface robot 111 of FIG. 1) and vacuum robot end effectors (e.g., transfer chamber robot 112 of FIG. 1). In some embodiments, pads 250 are used for one or more non-slip interfaces of LCF devices, aligner devices, etc.

[0044] In some embodiments, the carrier 200 has pads 260 (aluminum pads, pads integrated into a rigid body, etc.) for positioning the carrier 200 within an enclosure system (e.g., enclosure system 130, FOUP in FIG. 1) and a load lock (e.g., degassing chamber 104 in FIG. 1).

[0045] In some embodiments, rigid body 210 forms a window 270 (e.g., an opening, a slot, etc.). In some embodiments, window 270 is used by tool automation (e.g., by an aligner device, by an LCF device) to view placement accuracy through carrier 200 (e.g., to view objects on the other side of carrier 200). In some embodiments, window 270 is used to reduce the mass of carrier 200 (e.g., rigid body 210).

[0046] In some embodiments, rigid body 210 has a substantially planar (e.g., substantially flat) lower surface. In some embodiments, the lower surface of rigid body 210 is substantially flat except for pads 250 and 260 on the lower surface of rigid body 210. In some embodiments, carrier 200 (e.g., rigid body 210) does not have dynamic positioning features (e.g., no dynamic positioning features on the lower surface of rigid body 210). In some embodiments, rigid body 210 and / or fingers 240 have one or more coatings. In some examples, fingers 240 have coatings configured to transport content in particular conditions (e.g., compatible with particular chemistries and / or processes). In some embodiments, fingers 240 have one or more coatings providing one or more coefficients of friction, allowing content to be aligned on the fingers. In some examples, the sidewalls of each finger 240 have a lower coefficient of friction than the first top surface of each finger, allowing content to slide down the sidewalls and stop at the first top surface. In some examples, the upper portion of the sidewall of each finger 240 has a lower coefficient of friction than the lower portion of the sidewall of each finger 240, allowing the contents to slide down the upper portion of each sidewall and slow down at the lower portion of the sidewall.

[0047] In some embodiments, the outer shape of rigid body 210 differs from the outer shape shown in Figures 2A-D. In some embodiments, the size, shape, quantity, etc. of opening 220 (e.g., for receiving fastener 230), pad 250, pad 260, and / or window 270 differs from that shown in Figures 2A-D.

[0048] In some embodiments, fingers 240 are machined with markings that indicate their location on carrier 200 (e.g., rigid body) (e.g., after assembly to rigid body 210, after being removably attached to rigid body 210 via fasteners 230 when assembled with rigid body 210). In some examples, a first finger 240 is machined with a first mark (e.g., a first identifier) ​​that indicates a first location on rigid body 210, a second finger is machined with a second mark (e.g., a second identifier) ​​that indicates a second location on rigid body 210, and a third finger is machined with a third mark (e.g., a third identifier) ​​that indicates a third location on rigid body 210. In some embodiments, different locations on rigid body 210 are machined with similar marks (e.g., identifiers) machined on different fingers 240. The markings on rigid body 210 and / or fingers 240 indicate an attachment pattern. In some examples, the identifier includes one or more of hash marks (e.g., I, II, III), numbers, letters, colors, symbols, etc. By matching the identifier on the rigid body 210 with the identifier on the fingers 240, one opening 220 in the rigid body 210 corresponds to a particular finger 240, avoiding tolerance stacking (e.g., of bosses on the rigid body 210) due to different fingers 240 being used for the same opening in the rigid body 210. In some embodiments, any finger 240 in the set of fingers 240 can be used with any opening 220 (e.g., any boss) on the rigid body 210.

[0049] In some embodiments, one or more fingers 240 are attached to the rigid body 210 and support content. In some embodiments, two or more fingers 240 are attached to the rigid body 210 and support content. In some embodiments, three or more fingers 240 are attached to the rigid body 210 and support content. In some embodiments, each of the fingers 240 is substantially equally spaced around the rigid body 210 (e.g., approximately 120° between each of the three fingers 240). In some embodiments, the first finger 240 and the second finger 240 are symmetrically positioned on the rigid body 210, and the third finger 240 is equally spaced from the first finger 240 and the second finger 240.

[0050] In some embodiments, the fingers 240 support the content (e.g., process kit ring) adjacent to the inner periphery (e.g., inner sidewall) of the content. In some embodiments, the fingers 240 support the content (e.g., process kit ring) adjacent to the outer periphery (e.g., outer sidewall) of the content.

[0051] In some embodiments, different fasteners 230 are used for one or more of different rigid bodies 210, openings 220, fingers 240, states, etc. In some embodiments, the different fasteners 230 are one or more of different sizes, different shapes, different materials, etc. In some embodiments, the material of fasteners 230 includes one or more of aluminum, ceramic, stainless steel, electropolished (EP) stainless steel, etc.

[0052] In some embodiments, the fingers 240 have downwardly extending lips to support content. In some embodiments, the fingers 240 are positioned around the rigid body 210 to support content having a circular perimeter (e.g., a process kit ring, a showerhead, etc.). In some embodiments, the fingers 240 are replaceable to support content with different perimeter sizes. In some embodiments, the fingers 240 are attached to the rigid body 210 via slots that allow the position of the fingers 240 to be adjusted (e.g., radially from a central portion of the rigid body 210) to support content with different perimeter sizes. In some embodiments, as the fingers 240 wear over time, the position of the fingers 240 becomes adjustable (e.g., radially from a central region 280 of the rigid body 210) to continue to support content with the same perimeter size. In some embodiments, when the fingers 240 wear out and can no longer continue to support content with the same perimeter size, the worn fingers 240 are replaced with new fingers 240.

[0053] Carrier 200 includes one or more lower surfaces (e.g., pads 250) configured to interface with an end effector of a robotic arm. Carrier 200 (e.g., rigid body 210) includes one or more lower surfaces (e.g., solid planar central region 280) configured to interface with a vacuum chuck.

[0054] In some embodiments, rigid body 210 forms a boss 222 around each opening 220. In some embodiments, boss 222 is a protruding feature on rigid body 210. In some embodiments, boss 222 is used to position fingers 240 on rigid body 210. In some embodiments, fingers 240 have recesses that match the protruding bosses 222. In some embodiments, boss 222 allows fingers 240 to be mounted in the correct orientation on rigid body 210.

[0055] 2E-F and 2M show views of a carrier 200 supporting a process kit ring 290, according to certain embodiments. FIG. 2E shows a top view of a carrier 200 supporting a process kit ring 290, according to certain embodiments. FIG. 2F shows a side cross-sectional view of a carrier 200 supporting a process kit ring 290, according to certain embodiments. FIG. 2M shows a top perspective view of a carrier 200 supporting a process kit ring 290, according to certain embodiments.

[0056] Carrier 200 includes a rigid body 210 and fingers 240 attached to rigid body 210 via fasteners 230. A process kit ring 290 is disposed on fingers 240.

[0057] In some embodiments, the carrier 200 is sized and shaped to provide one or more gaps between the process kit ring 290 and one or more portions of the periphery of the carrier 200. In some embodiments, the one or more gaps are used by an aligner device (LCF device) to align the carrier 200 and / or the process kit ring 290. In some examples, the one or more gaps allow an optical beam to be used to detect a flat inner wall feature or other registration feature of the process kit ring 290. In some embodiments, the one or more gaps allow lift pins to be used to lift the process kit ring 290 from the carrier 200 (e.g., within a processing chamber). In some embodiments, the periphery of the carrier 200 is configured to interface with a shelf of an enclosure system (e.g., a FOUP) of a substrate processing system.

[0058] 2N illustrates a carrier 200 disposed on a shelf 294 within an enclosure system 292 (e.g., a FOUP) according to certain embodiments. The enclosure system 292 includes one or more shelves 294. In some embodiments, each shelf 294 is configured to receive a carrier 200 and a process kit ring 290 disposed on the carrier 200. In some embodiments, a robot arm lowers the carrier 200 supporting the process kit ring 290 onto the shelf 294 within the enclosure system 292. In some embodiments, as the robot arm lowers the carrier 200 supporting the process kit ring 290 onto the shelf 294, a first portion of the shelf 294 supports the process kit ring 290. A second portion of the shelf 294 then supports the carrier 200, such that the process kit ring 290 is supported above the carrier 200 on the shelf 294 (e.g., the process kit ring 290 does not contact the carrier 200).

[0059] 3A-B illustrate fingers 340A-B (e.g., fingers 240 of FIGS. 2A-F) of a carrier (e.g., carrier 200 of FIGS. 2A-F) according to certain embodiments. In some embodiments, fingers 340A and 340B are configured to be removably attached to the same rigid body (e.g., rigid body 210 of FIGS. 2A-F). For example, finger 340A is removably attached to the rigid body and configured to deliver a first content under a first condition, and finger 340B is removably attached to the same rigid body and configured to deliver one or more second contents different from the first content and / or under a second condition different from the first condition.

[0060] In some embodiments, each finger 340 has a first upper surface 342A, a second upper surface 342B, a sidewall 350, and a lower surface 360. The first upper surface 342A is disposed substantially in a first plane and is configured to support content during transport of the carrier. The second upper surface 342B is disposed substantially in a second plane above the first plane. The sidewall 350 is disposed between the first upper surface 342A and the second upper surface 342B. A first opening 362 is formed through the finger 340 from the second upper surface 342B to the lower surface 360. In some embodiments, the lower surface 360 ​​forms a recess (see, e.g., FIG. 4A ) to receive a portion of the carrier that forms the second opening (e.g., to receive the protruding boss 222 disposed around the opening 220 of the rigid body 210 in FIGS. 2A-F ). The fingers 340 are removably attached to the carrier via fasteners inserted through first openings in the fingers and second openings in the carrier. In some embodiments, content contacts the set of fingers without contacting the rigid body during transport of the carrier. In some embodiments, the openings formed by the rigid body are slots, and each finger 340 is adjustably positioned on the rigid body via the slot. In some examples, the position of the fingers 340 is adjusted based on wear of the fingers 340. In some examples, the position of the fingers 340 is adjusted based on the type (e.g., size, etc.) of content being transported by the carrier.

[0061] In some embodiments, the sidewall 350 of the finger 340 has an upper portion 352A that is at a first angle 354A (e.g., about 100° to 110°, about 15° from perpendicular) relative to the first top surface 342A. The sidewall 350 has a lower portion 352B that is at a second angle 354B (e.g., about 90° to 100°, about 5° from perpendicular) relative to the first top surface 342A. Furthermore, in some embodiments, the sidewall 350 includes a substantially vertical portion 352C that is substantially perpendicular (e.g., about 85-95°) to the first top surface 342A. Furthermore, in some embodiments, the finger 340 includes a chamfer 356 between the first top surface 342A and the sidewall 350. In some embodiments, the chamfer 356 of the finger 340 matches (e.g., is substantially the same size as, does not interfere with) the chamfer of the content (e.g., process kit ring) disposed on the finger 340. In some embodiments, the bottom surface of the content (e.g., process kit ring) disposed on the finger contacts the first top surface 342A of the finger 340. In some embodiments, the angle 354 of the sidewall 350 (e.g., the upper portion 352A, the lower portion 352B, and / or the substantially vertical portion 352C) is configured to guide (e.g., align) the content (e.g., process kit ring) onto the finger 340 for transfer. Conventional carriers transfer content misaligned within a substrate processing system, causing the content to fall off. The angle 354 of the sidewall 350 of the finger 340 prevents the content from becoming one or more misaligned, bent, non-parallel, unstable (e.g., falling off), etc. on the carrier.

[0062] In some embodiments, the first top surface 342A has a first coefficient of friction that is greater than a second coefficient of friction of one or more portions of the side wall 350 (e.g., to help secure content to the fingers 340, to help align content on the fingers 340, etc.).

[0063] 4A-F illustrate a carrier 400 (e.g., carrier 200 of FIGS. 2A-F) including a rigid body 410 (e.g., rigid body 210 of FIGS. 2A-F) according to certain embodiments. FIG. 4A is a side cross-sectional view of carrier 400 including fingers 440 (e.g., fingers 240 of FIGS. 2A-F, fingers 340 of FIGS. 3A-B) disposed on bosses 422 (e.g., bosses 222 of FIGS. 2A-F) of rigid body 410. FIG. 4B is a perspective view of carrier 400 including fingers 440 (e.g., fingers 240 of FIGS. 2A-F, fingers 340 of FIGS. 3A-B) removably attached to rigid body 410. FIG. 4C is a top view of rigid body 410 of carrier 400 including bosses 422 (e.g., bosses 222 of FIGS. 2A-F) disposed around openings 420 (e.g., openings 220 of FIGS. 2A-F). FIG. 4D is a cross-sectional side view of carrier 400 including finger 440 (e.g., finger 240 in FIGS. 2A-F, finger 340 in FIGS. 3A-B) disposed on boss 422 (e.g., boss 222 in FIGS. 2A-F) of rigid body 410. FIG. 4E is a cross-sectional side view of carrier 400 including finger 440 (e.g., finger 240 in FIGS. 2A-F, finger 340 in FIGS. 3A-B) disposed on boss 422 (e.g., boss 222 in FIGS. 2A-F) of rigid body 410. FIG. 4F is a perspective view of carrier 400 including finger 440 (e.g., finger 240 in FIGS. 2A-F, finger 340 in FIGS. 3A-B) removably attached to rigid body 410.

[0064] In some embodiments, features of rigid body 410 (e.g., boss 422, protruding feature 412, etc.) are configured to orient (e.g., align) fingers 440 on rigid body 410. In some embodiments, the underside of fingers 440 forms a recess configured to receive boss 422. In some embodiments, the left side, right side, and / or rear side of fingers 440 are positioned proximate (e.g., adjacent) to protruding features 412 on the top surface of rigid body 410. In some embodiments, protruding features 412 and / or boss 422 on the top surface orient fingers 440 (e.g., precisely position fingers on rigid body 410, precisely align openings in fingers with openings on rigid body 410 to receive fasteners 430, etc.).

[0065] In some embodiments, the fingers 440 of the carrier 400 support one or more process kit rings 490 (e.g., process kit ring 290 in FIGS. 2E, 2F, and / or 2M). Referring to FIGS. 4D-F, in some embodiments, the fingers 440 support process kit ring 490A, and process kit ring 490B is disposed on process kit ring 490A. The process kit ring 490A may include a first top surface, a second top surface lower than the first top surface, an inner sidewall, an outer sidewall, and a bottom surface. The first top surface may be substantially parallel to the second top surface. The outer sidewall may connect the first top surface and the second top surface. The inner sidewall may connect the first top surface and the bottom surface. The inner sidewall may contact at least a portion of a sidewall of the fingers 440 (e.g., sidewall 350 in FIGS. 3A-B). The bottom surface of the process kit ring 490A can contact the top surface of the finger 440 (eg, the first top surface 342A in FIGS. 3A-B).

[0066] Process kit ring 490B may include a top surface, a bottom surface, an inner sidewall connecting the top surface and the bottom surface, and an outer sidewall connecting the top surface and the bottom surface. In some embodiments, process kit ring 490B is disposed below the first and second top surfaces of process kit ring 490A. In some embodiments, the inner sidewall of process kit ring 490B may contact the outer sidewall of process kit ring 490A. In some embodiments, process kit ring 490A is a support ring and process kit ring 490B is an insert ring.

[0067] Referring to FIG. 4D, in some embodiments, the fingers 440 extend below a portion of the process kit ring 490A. Referring to FIGS. 4E-F, in some embodiments, the fingers 440 extend below the process kit rings 490A-B. The fingers 440 can form recesses that receive one or more of the process kit rings 490. The recesses of the fingers 440 can have a first sidewall (e.g., sidewall 350 in FIGS. 3A-B), a top surface (e.g., the first top surface in FIGS. 3A-B), and a second sidewall (e.g., opposite the first sidewall). The first sidewall of the fingers 440 contacts the inner sidewall of the process kit ring 490A, and the second sidewall of the fingers 440 contacts the outer sidewall of the process kit ring 490B.

[0068] In some embodiments, each of the fingers 440 (e.g., three fingers 440) of the carrier 400 includes a recess formed therein for receiving one or more process kit rings 490 (see, e.g., FIGS. 4E-F). In some embodiments, one or more of the fingers 440 of the carrier 400 includes a recess for receiving one or more process kit rings 490 (see, e.g., FIGS. 4E-F), and one or more of the fingers 440 of the carrier 400 is partially disposed under at least one of the one or more process kit rings 490 (see, e.g., FIG. 4D).

[0069] In some embodiments, the carrier 400 can control the concentricity of the process kit rings 490. The carrier 400 can maintain the concentricity of stacked process kit rings during transport (e.g., overhead transport (OHT) and manual FOUP loading and / or vibration). The carrier 400 can maintain the concentricity of stacked process kit rings during robotic (e.g., factory interface (FI), mainframe (MF), transfer chamber, etc.) transfer to a process chamber. In some embodiments, the carrier 400 supports one or more process kit rings 490. In some embodiments, the carrier 400 supports two or more stacked process kit rings 490 (e.g., a ring stack). In some embodiments, the carrier 400 supports two or three stacked process kit rings 490. In some embodiments, the carrier maintains the same gap (e.g., the gap between the process kit rings 490 and the carrier 400) around the entire circumference while the process kit rings 490 are transported by automation (e.g., FI, MF, transfer chamber, etc.). In some embodiments, the underside of the carrier 400 is configured to interface with an FI blade, an MF robot blade, a FOUP (e.g., a FOUP shelf), a load lock fin, an LCF, an aligner (e.g., an FI aligner), lift pins of a processing chamber, etc.

[0070] In some embodiments, the fingers 440 of the carrier 400 are interchangeable. In some embodiments, different sets of fingers 440 are made of different materials (e.g., different temperatures, processes, chemistries, thermal expansion, etc.). In some embodiments, the set of fingers 440 is made of one or more of ceramic, titanium, and / or the like. In some embodiments, the thermal expansion of the set of fingers 440 matches the thermal expansion of the rigid body 410, one or more process kit rings 490, fasteners 430, etc. (e.g., with the temperature of the carrier 400).

[0071] 5 illustrates a method 500 of using a carrier in a substrate processing system, according to certain embodiments. In some embodiments, one or more of the operations of method 500 are performed by a robotic arm (e.g., the robotic arm of the factory interface robot 111 in FIG. 1 ) and / or a controller (e.g., the controller 109 in FIG. 1 ). Although shown in a particular order or sequence, the order of processes can be changed unless otherwise specified. Therefore, the illustrated embodiment should be understood as an example only, and the illustrated processes can be performed in a different order, and some processes can be performed in parallel. Furthermore, in various embodiments, one or more processes can be omitted. Thus, not all processes are required in all embodiments.

[0072] 5, at block 502, first conditions associated with a first transfer in a substrate processing system are determined. In some embodiments, the first conditions include one or more of the substrate processing operation, chemistry, type of content being transferred, temperature, pressure, clearance available to the carrier, etc. In some embodiments, the first conditions are determined based on a recipe (e.g., a future operation of the substrate processing system). In some embodiments, the first conditions are determined based on current conditions of one or more portions of the substrate processing system.

[0073] A first set of fingers corresponding to the first condition is identified at block 504. In some embodiments, the first set of fingers have one or more of a material, roughness, coating, size, sidewall height, sidewall angle, shape, quantity, etc. that is compatible with the first condition.

[0074] At block 506, the first set of fingers are attached to the rigid body of the carrier via fasteners. In some embodiments, the first set of fingers are attached to the rigid body autonomously (e.g., via a robot). In some embodiments, the first set of fingers are attached to the rigid body manually. In some embodiments, the first set of fingers are attached to the rigid body outside of the substrate processing system. In some embodiments, the first set of fingers are attached to the rigid body within the substrate processing system. In some embodiments, the fingers, fasteners, and rigid body are stored within one or more of an enclosure system (e.g., a FOUP), an SSP, a factory interface, etc. In some embodiments, the fingers are attached to the rigid body via fasteners using a fastening device (e.g., a fastening robot). In some embodiments, the controller determines conditions within the substrate processing system, selects one or more of fingers, fasteners, and / or rigid bodies based on the conditions, secures the fingers, fasteners, and / or rigid bodies to a fastening device, and causes the fastening device to attach the fingers to the rigid bodies using the fasteners. In some embodiments, a first set of fingers is attached to the rigid bodies based on the first conditions. In some examples, the orientation, position, flip position, quantity, etc. of the set of fingers is based on the first conditions.

[0075] At block 508, the positions of the first set of fingers on the rigid body are adjusted via fasteners. In some embodiments, the fasteners attach the fingers to slots in the rigid body. In some embodiments, the positions of the fingers are measured and adjusted. In some examples, a process kit ring is placed on the fingers, and a gap width between the sidewalls of the fingers and the process kit ring is measured (e.g., via feeler gauges, imaging devices, visual inspection, determining the radial play of the process kit ring on the fingers, etc.). In response to determining that the gap width is greater than a threshold width (e.g., in response to the fingers being worn), the positions of the fingers are adjusted. In some embodiments, to adjust the positions of the fingers, the fingers are moved radially through the slots relative to a central region of the rigid body. In some embodiments, to adjust the positions of the fingers, a set screw is adjusted to move the fingers radially.

[0076] At block 510, first contents are placed on a first set of fingers transported via a carrier into the substrate processing system. In some embodiments, the first contents include one or more of a process kit ring, an edge ring, a showerhead, a mask, a mask handler, a half ring, a stack of two or more process kit rings, etc.

[0077] At block 512, second conditions associated with the second transfer in the substrate processing system are determined. In some embodiments, the second conditions are different from the first conditions. In some examples, the second conditions are one or more of a substrate processing operation, chemistry, type of content being transferred, temperature, pressure, etc. that are different from the first conditions.

[0078] At block 514, a second set of fingers corresponding to the second condition is identified. In some embodiments, the second set of fingers is different from the first set of fingers. In some examples, the second set of fingers conforms to the second condition and has one or more different materials, sizes, shapes, quantities, etc. than the first set of fingers.

[0079] At block 516, a second set of fingers is attached to the rigid body of the carrier via fasteners. In some embodiments, block 516 is similar to block 506. In some embodiments, the rigid body is the same as that of block 506. In some embodiments, the rigid body is different from that of block 506. In some embodiments, the fasteners are different from that of block 506. In some embodiments, the rigid body is different from that of block 506.

[0080] The position of the second set of fingers on the rigid body is adjusted via the fasteners at block 518. In some embodiments, block 516 is similar to block 508.

[0081] In block 520, the second contents are placed on a second set of fingers that are transported into the substrate processing system via a carrier. In some embodiments, block 516 is similar to block 510. In some embodiments, the second contents are different from those in block 510.

[0082] In some embodiments, each of the operations of method 500 is performed while maintaining a sealed environment (eg, without opening a factory interface, without opening an enclosure system).

[0083] Unless otherwise specified, in some embodiments, terms such as "determining," "identifying," "mounting," "adjusting," "locating," "transporting," "moving," "lowering," "causing," "removing," "arranging," "positioning," and the like refer to actions and processes performed or implemented by a computer system that manipulate and transform data represented as physical (electrical) quantities in computer system registers and memory into other data similarly represented as physical quantities in the computer system's memory or registers or other information storage, transmission, or display devices. Also, as used herein, the terms "first," "second," "third," "fourth," and the like are intended as labels to distinguish between different elements and do not have an ordinal meaning due to their numerical designations.

[0084] Examples of the description herein also relate to apparatus for performing the methods described herein. In some embodiments, this apparatus is specially constructed to perform the methods described herein, or comprises a general-purpose computer system selectively programmed by a computer program stored on the computer system. In some embodiments, such a computer program is stored on a computer-readable tangible storage medium.

[0085] The methods and illustrative examples described herein are not inherently related to any particular computer or other apparatus. Various general-purpose systems may be used in accordance with the teachings described herein, or more specialized apparatus may be constructed to perform the methods described herein and / or each of their individual functions, routines, subroutines, or operations. Examples of structures for a variety of these systems are set forth in the description above.

[0086] The above description sets forth numerous specific details, such as examples of particular systems, components, methods, etc., to provide a thorough understanding of some embodiments of the present disclosure. However, it will be apparent to one skilled in the art that at least some embodiments of the present disclosure can be practiced without these specific details. In other instances, well-known components or methods are not described in detail or are presented in simple block diagram form to avoid unnecessarily obscuring the present disclosure. Thus, the specific details described are merely exemplary. Particular implementations can vary from these example details, and variations are still considered to be within the scope of the present disclosure.

[0087] References throughout this specification to "one embodiment" or "one embodiment" mean that a particular feature, structure, or characteristic described in connection with that embodiment is included in at least one embodiment. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or." When the term "about" or "approximately" is used herein, it is intended to mean that the stated nominal value is accurate to within ±10%.

[0088] Although the operations of the methods herein are shown and described in a particular order, the order of the operations of each method may be changed, such that certain operations are performed in reverse order, or such that certain operations are performed at least partially concurrently. In other embodiments, instructions or sub-operations of separate operations are intermittent and / or interleaved.

[0089] It should be understood that the above description is intended to be illustrative, and not limiting. Many other embodiments will become apparent to those skilled in the art upon reading and understanding the above description. The scope of the disclosure should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

Claims

1. A career a carrier body configured to be removably supported on an end effector of a robot for transporting one or more process kit rings within a substrate processing system; a carrier comprising: a plurality of fingers extending from a carrier body, extending beyond a periphery of the carrier body to beneath one or more process kit rings, and supporting the one or more process kit rings, wherein a first finger of the plurality of fingers has an upper surface that forms a recess for receiving the one or more process kit rings.

2. 2. The carrier of claim 1, wherein the upper surface includes a first recessed side surface, a second recessed side surface opposite the first recessed side surface, and a recessed lower surface disposed between the first recessed side surface and the second recessed side surface.

3. the first recessed side is configured to be positioned proximate to one or more inner surfaces of one or more process kit rings; the second recessed side is configured to be positioned proximate to one or more outer surfaces of the one or more process kit rings; The carrier of claim 2 , wherein the recessed lower surface is configured to be positioned beneath one or more process kit rings.

4. 10. The carrier of claim 1, wherein the one or more process kit rings include at least two process kit rings, and the first finger is configured to control concentricity of the at least two process kit rings relative to one another during transport of the at least two process kit rings.

5. 10. The carrier of claim 1, wherein the one or more process kit rings include at least two process kit rings, and the first finger is configured to maintain a gap between the at least two process kit rings substantially the same during transport of the one or more process kit rings.

6. The first finger is a first top surface disposed substantially in a first plane, the first top surface configured to receive one or more process kit rings; a second upper surface disposed substantially in a second plane located above the first plane; The carrier of claim 1 , comprising a sidewall disposed between the first and second upper surfaces.

7. 7. The carrier of claim 6, wherein the sidewall comprises an upper portion having an angle of 15 degrees relative to the first top surface and a lower portion having an angle of 5 degrees relative to the first top surface.

8. The carrier of claim 6 , wherein the first finger comprises a chamfer between the first top surface and the sidewall.

9. 7. The carrier of claim 6, wherein the sidewall has a first coefficient of friction and the first top surface has a second coefficient of friction greater than the first coefficient of friction.

10. The carrier of claim 1 , wherein the first finger is configured to dissipate static electricity.

11. The carrier of claim 1 , wherein the one or more process kit rings contact the first finger without contacting the carrier body during transport of the carrier.

12. The carrier of claim 1 , wherein the plurality of fingers includes a second finger and a third finger each forming a corresponding recess for receiving one or more process kit rings.

13. The carrier of claim 1 , wherein the carrier body defines an opening configured to receive a fastener, and the first finger is configured to be removably attached to the carrier body through the fastener and the opening.

14. 14. The carrier of claim 13, wherein the opening is a slot and the first finger is adjustably positioned on the carrier body.

15. a finger configured to extend from a carrier body of a carrier of a substrate processing system, a first recessed side configured to be positioned proximate to one or more inner surfaces of one or more process kit rings; a second recess side opposite the first recess side, the second recess side configured to be positioned proximate to one or more outer surfaces of the one or more process kit rings; A finger including a recessed lower surface disposed between the first recessed side and the second recessed side, the recessed lower surface configured to be disposed beneath one or more process kit rings.

16. 16. The finger of claim 15, wherein the one or more process kit rings include at least two process kit rings, and the finger is configured to control the concentricity of the at least two process kit rings relative to one another during transport of the at least two process kit rings.

17. 16. The finger of claim 15, wherein the one or more process kit rings include at least two process kit rings, and the finger is configured to maintain a gap between the at least two process kit rings substantially the same during transport of the one or more process kit rings.

18. 16. The finger of claim 15, wherein the finger is configured to be removably attached to the carrier body via openings and fasteners formed by the carrier body.

19. A career a carrier body configured to be supported on a robot for transporting two or more process kit rings within a substrate processing system; A carrier comprising: a plurality of fingers extending from a carrier body configured to support two or more process kit rings, a first finger of the plurality of fingers configured to control the concentricity of the two or more process kit rings relative to one another during transport of the two or more process kit rings.

20. 20. The carrier of claim 19, wherein the first finger is configured to maintain a substantially identical gap between two or more process kit rings during transport of the two or more process kit rings.

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