Substrate processing apparatus and substrate processing method

Abstract

To provide a substrate processing device capable of highly accurately acquiring the state of a nozzle and a substrate processing method.SOLUTION: The substrate processing device includes a substrate for inspection which includes a base part and an imaging part arranged in the base part, a holding part which is configured so as to hold a substrate or the substrate for inspection, a driving part which is configured so as to rotationally drive the holding part, a processing liquid supply part which includes a nozzle configured so as to discharge a processing liquid to the substrate held by the holding part, and a control part. The control part is configured so as to execute first processing for rotating the holding part by controlling the driving part in such a state that the substrate for inspection is held by the holding part, to adjust the position of the imaging part with respect to the nozzle to a predetermined first imaging position and second processing for controlling the imaging part, to image the nozzle in the first imaging position, after the first processing.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method. [Background technology]

[0002] Patent Document 1 discloses a substrate processing apparatus including a holding section for holding a substrate, a splash prevention cup arranged around the holding section, a processing liquid supply nozzle for supplying processing liquid to the substrate held in the holding section, an imaging means arranged above the processing liquid supply nozzle and the splash prevention cup for imaging the processing liquid supply path between the processing liquid supply nozzle and the substrate surface, and a control means for performing a predetermined operation if the supply state of the processing liquid imaged by the imaging means is abnormal. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 11-329936 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure describes a substrate processing apparatus and a substrate processing method that are capable of accurately acquiring the state of a nozzle. [Means for solving the problem]

[0005] An example of a substrate processing apparatus includes a testing substrate including a base and an imaging unit arranged on the base, a holding unit configured to hold a substrate or the testing substrate, a drive unit configured to rotate the holding unit, a processing liquid supply unit including a nozzle configured to discharge a processing liquid onto the substrate held by the holding unit, and a control unit. The control unit is configured to perform a first process of adjusting the position of the imaging unit relative to the nozzle to a predetermined first imaging position by controlling the drive unit to rotate the holding unit while the testing substrate is held by the holding unit, and a second process of controlling the imaging unit to capture an image of the nozzle at the first imaging position after the first process. [Effects of the Invention]

[0006] According to the substrate processing apparatus and substrate processing method of the present disclosure, it is possible to acquire the state of the nozzle with high accuracy. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view schematically illustrating an example of a substrate processing system. [Figure 2] FIG. 2 is a side view schematically illustrating an example of the liquid processing unit. [Figure 3] FIG. 3 is a block diagram showing an example of a main part of a substrate processing system. [Figure 4] FIG. 4 is a schematic diagram illustrating an example of a hardware configuration of the controller. [Figure 5] FIG. 5 is a flowchart illustrating an example of a procedure for inspecting the state of the nozzles. [Figure 6] FIG. 6 is a top view of the inspection substrate for explaining an example of adjusting the imaging position. [Figure 7] FIG. 7 is a diagram showing an example of a captured image for explaining a method for calculating the nozzle height. [Figure 8]Figure 8 is a diagram for explaining a method for calculating the center position of the nozzle tip, where Figure 8(a) shows an example of an image captured when the imaging position is 0°, Figure 8(b) is a graph showing the change in brightness value in the horizontal direction at a specified position in the image captured in Figure 8(a), Figure 8(c) shows an example of an image captured when the imaging position is 90°, and Figure 8(d) is a graph showing the change in brightness value in the horizontal direction at a specified position in the image captured in Figure 8(c). [Figure 9] Figure 9 is a diagram for explaining a method for calculating the center position of the nozzle tip, where Figure 9(a) shows an example of an image captured when the imaging position is 180°, Figure 9(b) is a graph showing the change in brightness value in the horizontal direction at a specified position in the image captured in Figure 9(a), Figure 9(c) shows an example of an image captured when the imaging position is 270°, and Figure 9(d) is a graph showing the change in brightness value in the horizontal direction at a specified position in the image captured in Figure 9(c). [Figure 10] Figure 10 is a diagram for explaining a method for calculating the nozzle inclination, where Figure 10(a) shows an example of an image captured when the imaging position is 0°, Figure 10(b) shows an example of an image captured when the imaging position is 90°, Figure 10(c) shows an example of an image captured when the imaging position is 180°, and Figure 10(d) shows an example of an image captured when the imaging position is 270°. [Figure 11] FIG. 11 is a diagram for explaining a method for calculating the nozzle inclination vector. [Figure 12] FIG. 12 is a diagram for explaining a method for calculating an abnormality on the surface of the nozzle, and shows an example of an image obtained by expanding an image of the outer peripheral surface of the nozzle over substantially the entire circumference onto a plane. [Figure 13] FIG. 13 is a side view showing another example of the testing board. [Figure 14] FIG. 14 is a side view showing another example of the testing board. [Figure 15] FIG. 15 is a side view showing another example of the testing board. DETAILED DESCRIPTION OF THE INVENTION

[0008] In the following description, the same elements or elements having the same functions will be designated by the same reference numerals, and redundant explanations will be omitted. Note that in this specification, when referring to the top, bottom, right, and left of a figure, the directions of the reference numerals in the figure will be used as the reference.

[0009] [Substrate processing system] 1, a substrate processing system 1 (substrate processing apparatus) configured to process a substrate W will be described. The substrate processing system 1 includes a loading / unloading station 2, a processing station 3, and a controller Ctr (controller). The loading / unloading station 2 and the processing station 3 may be aligned in a horizontal line, for example.

[0010] The substrate W may be disk-shaped or may be a non-circular plate-shaped such as a polygon. The substrate W may have a cutout portion cut out of a portion. The cutout portion may be, for example, a notch (a U-shaped, V-shaped groove, or the like) or a linear portion extending linearly (so-called orientation flat). The substrate W may be, for example, a semiconductor substrate (silicon wafer), a glass substrate, a mask substrate, an FPD (Flat Panel Display) substrate, or any other type of substrate. The diameter of the substrate W may be, for example, approximately 200 mm to 450 mm.

[0011] The loading / unloading station 2 includes a mounting section 4, a loading / unloading section 5, and a shelf unit 6 (accommodation chamber). The mounting section 4 includes a plurality of mounting tables (not shown) arranged in the width direction (the vertical direction in FIG. 1). Each mounting table is configured to be able to mount a carrier 7 thereon. The carrier 7 is configured to accommodate at least one substrate W in a sealed state. The carrier 7 includes an opening / closing door (not shown) for loading and unloading the substrate W.

[0012] The loading / unloading section 5 is disposed adjacent to the mounting section 4 in the direction in which the loading / unloading stations 2 and the processing stations 3 are lined up (the left-right direction in FIG. 1). The loading / unloading section 5 includes an opening / closing door (not shown) provided for the mounting section 4. When the carrier 7 is placed on the mounting section 4, the opening / closing door of the carrier 7 and the opening / closing door of the loading / unloading section 5 are both opened, thereby connecting the inside of the loading / unloading section 5 and the inside of the carrier 7.

[0013] The loading / unloading section 5 incorporates a transport arm A1 and a shelf unit 6. The transport arm A1 is configured to be able to move horizontally in the width direction of the loading / unloading section 5, move up and down in the vertical direction, and rotate around a vertical axis. The transport arm A1 is configured to take out a substrate W from a carrier 7 and pass it to the shelf unit 6, and also to receive a substrate W from the shelf unit 6 and return it to the carrier 7. The shelf unit 6 is located near the processing station 3, and is configured to store substrates W and inspection substrates J (described in detail below).

[0014] The processing station 3 includes a transport section 8 and a plurality of liquid processing units U. The transport section 8 extends horizontally, for example, in the direction in which the loading / unloading station 2 and the processing station 3 are lined up (the left-right direction in FIG. 1). The transport section 8 incorporates a transport arm A2 (transport section). The transport arm A2 is configured to be able to move horizontally in the longitudinal direction of the transport section 8, move up and down in the vertical direction, and pivot about a vertical axis. The transport arm A2 is configured to take out a substrate W or a substrate J for testing from the shelf unit 6 and pass it to the liquid processing unit U, and to receive a substrate W or a substrate J for testing from the liquid processing unit U and return it to the shelf unit 6.

[0015] [Liquid processing unit] Next, the liquid processing unit U will be described in detail with reference to Fig. 2. The liquid processing unit U is configured to perform a predetermined liquid processing (e.g., processing to remove dirt or foreign matter, etching processing, etc.) on the substrate W. The liquid processing unit U may be, for example, a single-wafer cleaning apparatus that cleans the substrates W one by one by spin cleaning.

[0016] The liquid processing unit U includes a chamber 10 (processing chamber), a blower 20, a rotary holder 30, a supply unit 40 (processing liquid supply unit, cleaning liquid supply unit), and a cup member 50.

[0017] The chamber 10 is a housing configured so that the substrate W or the substrate for testing J can be loaded and unloaded therein. A loading / unloading port (not shown) is formed in the side wall of the chamber 10. The substrate W or the substrate for testing J is transported into the chamber 10 and unloaded from the chamber 10 to the outside through the loading / unloading port by the transport arm A2.

[0018] The blower 20 is attached to the ceiling wall of the chamber 10. The blower 20 is configured to form a downward flow in the chamber 10 based on a signal from the controller Ctr.

[0019] The rotation holding unit 30 includes a drive unit 31, a shaft 32, and a holding unit 33. The drive unit 31 is configured to operate based on an operation signal from the controller Ctr and rotate the shaft 32. The drive unit 31 may be a power source such as an electric motor.

[0020] The holding unit 33 is provided at the tip of the shaft 32. The holding unit 33 is configured to hold the back surface of the substrate W or the substrate J for testing by suction, for example, by suction. In other words, the rotation holding unit 30 may be configured to rotate the substrate W or the substrate J for testing around a rotation center axis Ax that is perpendicular to the front surface of the substrate W or the substrate J for testing while the substrate W or the substrate J for testing is in a substantially horizontal position.

[0021] The supply unit 40 is configured to supply a plurality of different types of processing liquids from a nozzle N onto the surface of the substrate W. The supply unit 40 includes liquid sources 41 and 42, valves 43 and 44, pipes 45 to 47, the nozzle N, an arm Ar, and a drive unit 48 (nozzle drive unit).

[0022] The liquid source 41 may be configured as a supply source of a processing liquid. The processing liquid may be, for example, an acid processing liquid or an alkaline processing liquid. The acid processing liquid may include, for example, an SC-2 liquid (a mixture of hydrochloric acid, hydrogen peroxide, and pure water), an SPM (a mixture of sulfuric acid and hydrogen peroxide), an HF liquid (hydrofluoric acid), a DHF liquid (dilute hydrofluoric acid), or an HNO3+HF liquid (a mixture of nitric acid and hydrofluoric acid). The alkaline processing liquid may include, for example, an SC-1 liquid (a mixture of ammonia, hydrogen peroxide, and pure water), or hydrogen peroxide. The liquid source 41 is connected to the nozzle N via pipes 45 and 47.

[0023] The liquid source 42 may be configured as a supply source of a cleaning liquid. The cleaning liquid may be, for example, an organic cleaning liquid or a rinse liquid. The organic cleaning liquid may contain, for example, IPA (isopropyl alcohol). The rinse liquid may contain, for example, deionized water (DIW), ozone water, carbonated water (CO2 water), ammonia water, etc. The liquid source 41 is connected to the nozzle N via pipes 46 and 47.

[0024] The valves 43 and 44 are respectively provided in the pipes 45 and 46. The valves 43 and 44 are each configured to open and close based on an operation signal from the controller Ctr.

[0025] The nozzle N is held by an arm Ar. A drive unit 48 is connected to the arm Ar. The drive unit 48 is configured to operate based on an operation signal from the controller Ctr and move the arm Ar horizontally or up and down. Therefore, the nozzle N is configured to move horizontally or up and down above the substrate W. The drive unit 48 may be configured to operate based on an operation signal from the controller Ctr and to change the angle of the arm Ar relative to the vertical axis. In this case, the angle of the nozzle N also changes as the angle of the arm Ar relative to the vertical axis changes. In other words, the attitude (horizontal position, vertical position, or angle) of the nozzle N may be adjusted by driving the arm Ar with the drive unit 48.

[0026] When the processing liquid or cleaning liquid is discharged from the nozzle N onto the surface of the substrate W, the nozzle N may be disposed above the substrate W so that its discharge outlet faces the surface of the substrate W. Furthermore, when inspecting the state of the nozzle N, which will be described later, the nozzle N may be disposed above the substrate J for testing so that its discharge outlet faces the surface of the substrate J for testing.

[0027] The cup member 50 is provided to surround the periphery of the holder 33. The cup member 50 is configured to collect the processing liquid that splashes around from the outer periphery of the substrate W when the substrate W is held and rotated by the rotary holder 30. A drain port 51 and an exhaust port 52 are provided at the bottom of the cup member 50.

[0028] The drain outlet 51 is configured to discharge the processing liquid or cleaning liquid collected by the cup member 50 to the outside of the liquid processing unit U. The exhaust outlet 52 is configured to discharge the downward flow formed around the substrate W by the blower 20 to the outside of the liquid processing unit U. The downward flow is accompanied by gas generated around the substrate W as the substrate W is processed with the processing liquid.

[0029] [Test board] The inspection board J is configured to inspect the state of the nozzle N. As illustrated in FIG. 2, the inspection board J includes a base portion J1, an imaging portion J2, an illumination portion J3, a battery J4, and a communication portion J5. The base portion J1 may be disk-shaped, similar to the board W, or may be a non-circular plate-shaped portion such as a polygon. The base portion J1 holds the imaging portion J2, the illumination portion J3, the battery J4, and the communication portion J5.

[0030] The imaging unit J2 is configured to operate based on an operation signal from the controller Ctr and capture an image of the exterior of the nozzle N. The imaging unit J2 may be, for example, a CCD camera or a CMOS camera. The imaging unit J2 is disposed on the base unit J1. The imaging unit J2 may be disposed on the base unit J1 so as to be located closer to the outer periphery of the base unit J1 than the nozzle N when capturing an image of the nozzle N. The imaging unit J2 may be configured so that its angle of elevation can be changed by a driving unit (not shown). The angle of elevation may be, for example, 0° to 90°.

[0031] The illumination unit J3 operates based on an operation signal from the controller Ctr and is configured to irradiate light onto the nozzle N when the imaging unit J2 captures an image of the nozzle N. The illumination unit J3 is disposed on the base unit J1. The illumination unit J3 may also be disposed near the imaging unit J2.

[0032] The battery J4 is configured to supply power to electronic devices provided on the test board J. To charge the battery J4, a charging port may be provided, for example, on the shelf unit 6. In this case, the battery J4 is charged through the charging port while the test board J is retracted to the shelf unit 6 and held thereon. The charging method for the battery J4 may be contact charging, in which charging is performed by contacting a metal terminal of the charging port, or contactless charging, in which power is transmitted without passing through a metal terminal or the like.

[0033] The communication unit J5 is configured to be able to communicate with a controller Ctr (for example, a processing unit M3 described later). The communication unit J5 can receive operation signals for operating the image capture unit J2 and the illumination unit J3 from the controller Ctr. The communication unit J5 can transmit data of images captured by the image capture unit J2 to the controller Ctr. The communication method between the communication unit J5 and the controller Ctr is not particularly limited, and may be, for example, wireless communication or wired (communication cable) communication. Examples of wireless communication methods that may be used include LTE (Long Term Evolution), LTE-A (LTE-Advanced), SUPER3G, IMT-Advanced, 4G, 5G, FRA (Future Radio Access), W-CDMA (registered trademark), GSM (registered trademark), CDMA2000, UMB (Ultra Mobile Broadband), IEEE 802.11 (Wi-Fi), IEEE 802.16 (WiMAX), IEEE 802.20, UWB, Bluetooth (registered trademark), and other communication methods.

[0034] [Controller Details] The controller Ctr is configured to partially or entirely control the substrate processing system 1. As illustrated in FIG. 3, the controller Ctr has functional modules including a reading unit M1, a memory unit M2, a processing unit M3, an instruction unit M4, and a communication unit M5. These functional modules merely divide the functions of the controller Ctr into a plurality of modules for convenience, and do not necessarily mean that the hardware constituting the controller Ctr is divided into such modules. Each functional module is not limited to being realized by executing a program, but may also be realized by a dedicated electric circuit (e.g., a logic circuit) or an integrated circuit (ASIC: Application Specific Integrated Circuit) that integrates such circuits.

[0035] The reading unit M1 is configured to read a program from a computer-readable recording medium RM. The recording medium RM stores a program for operating each unit of the substrate processing system 1. The recording medium RM may be, for example, a semiconductor memory, an optical recording disk, a magnetic recording disk, or a magneto-optical recording disk. Note that, hereinafter, each unit of the substrate processing system 1 may include the air blower 20, the spinning holder 30, the supply unit 40, the imaging unit J2, the illumination unit J3, and the communication unit J5.

[0036] The memory unit M2 is configured to store various data. The memory unit M2 may store, for example, a program read from a recording medium RM by the reading unit M1, setting data input by an operator via an external input device (not shown), etc. The memory unit M2 may store, for example, data on processing conditions (processing recipes) for processing the substrate W. The memory unit M2 may store, for example, data on images captured by the imaging unit J2 transmitted via the communication units J5, M5.

[0037] The processing unit M3 is configured to process various types of data. The processing unit M3 may generate signals for operating each unit of the substrate processing system 1 based on, for example, various types of data stored in the memory unit M2. The processing unit M3 may generate, for example, an operation signal for causing the imaging unit J2 to start or stop imaging. The processing unit M3 may generate, for example, an operation signal for adjusting the elevation angle or focus of the imaging unit J2. The processing unit M3 may generate, for example, an operation signal for causing the illumination unit J3 to start or stop irradiating light.

[0038] The processing unit M3 may calculate the state of the nozzle N based on, for example, data of the captured image captured by the imaging unit J2. The state of the nozzle N may include, for example, the attitude of the nozzle (the height of the nozzle N, the center position of the tip of the nozzle N, the inclination of the nozzle N, etc.) and abnormalities on the surface of the nozzle N. The processing unit M3 may calculate an expected landing position of the processing liquid discharged from the nozzle N on the surface of the substrate W based on the calculated attitude of the nozzle N. The processing unit M3 may calculate a deviation between the calculated expected landing position and the rotation center axis Ax of the spin holder 30. If the calculated deviation is outside a predetermined range or if there is an abnormality on the surface of the nozzle N, the processing unit M3 may issue an alarm from an alarm unit (not shown) (for example, an alarm may be displayed on a display, or an alarm sound or alarm guide may be issued from a speaker).

[0039] The instruction unit M4 is configured to transmit the operation signal generated in the processing unit M3 to each unit of the substrate processing system 1. As described above, the communication unit M5 is configured to be able to communicate with the communication unit J5. When the communication unit M5 performs wireless communication with the communication unit J5, the communication unit M5 may be configured similarly to the communication unit J5.

[0040] The hardware of the controller Ctr may be configured, for example, by one or more control computers. The controller Ctr may include a circuit C1 as a hardware configuration, as exemplified in Fig. 4. The circuit C1 may be configured by electric circuit elements. The circuit C1 may include, for example, a processor C2, a memory C3, a storage C4, a driver C5, and an input / output port C6.

[0041] The processor C2 may be configured to execute a program in cooperation with at least one of the memory C3 and the storage C4 and to implement each of the above-mentioned functional modules by inputting and outputting signals via the input / output port C6. The memory C3 and the storage C4 may function as the storage unit M2. The driver C5 may be a circuit configured to drive each component of the substrate processing system 1. The input / output port C6 may be configured to mediate the input and output of signals between the driver C5 and each component of the substrate processing system 1.

[0042] The substrate processing system 1 may include one controller Ctr, or may include a controller group (controller) composed of multiple controllers Ctr. When the substrate processing system 1 includes a controller group, each of the above-mentioned functional modules may be realized by one controller Ctr, or may be realized by a combination of two or more controllers Ctr. When the controller Ctr is composed of multiple computers (circuits C1), each of the above-mentioned functional modules may be realized by one computer (circuit C1), or may be realized by a combination of two or more computers (circuits C1). The controller Ctr may include multiple processors C2. In this case, each of the above-mentioned functional modules may be realized by one processor C2, or may be realized by a combination of two or more processors C2.

[0043] [How to inspect the nozzle condition] Next, an example of a method for inspecting the state of the nozzle N will be described with reference to Figures 5 to 11. Note that the following describes an example in which the inspection is started when the inspection board J is placed on the shelf unit 6. Also, the image captured by the imaging unit J2 may be a grayscale image or a color image.

[0044] First, the controller Ctr controls the transport arm A2 to transport the test substrate J from the shelf unit 6 to the liquid processing unit U. Next, the test substrate J is held by the rotation holder 30 of the liquid processing unit U (see step S1 in FIG. 5). Next, the controller Ctr controls the drive unit of the nozzle N to move the nozzle N so that the nozzle N is positioned at the origin.

[0045] The origin is set so that when a processing liquid or cleaning liquid is discharged from the nozzle N positioned at the origin onto the surface of the substrate W, the liquid landing position substantially coincides with the rotation center axis Ax (the center of the substrate W). However, due to influences such as the inclination of the nozzle N or a positional deviation of the arm Ar, the liquid landing position may deviate from the rotation center axis Ax even when the nozzle N is positioned at the origin. Furthermore, due to influences such as the inclination of the arm Ar, the height position of the tip of the nozzle N when the nozzle N is positioned at the origin may deviate from the predetermined set position.

[0046] Next, the controller Ctr controls the rotation holding unit 30 to rotate the inspection substrate J via the rotation holding unit 30 so that the imaging unit J2 relative to the nozzle N is positioned at a predetermined imaging position P1 (see FIG. 6) (see step S2 in FIG. 5). Note that if the imaging unit J2 is positioned at the imaging position when the inspection substrate J is held by the rotation holding unit 30 from the transport arm A2, the processing of step S2 does not need to be executed.

[0047] Next, the controller Ctr controls the imaging unit J2 and the lighting unit J3 via the communication units M5 and J5, and while the lighting unit J3 irradiates the nozzle N with light, the imaging unit J2 captures an image of the nozzle N (see step S3 in FIG. 5). Data on the captured image is transmitted to the controller Ctr via the communication units M5 and J5. Note that before capturing an image of the nozzle N, the controller Ctr may control the imaging unit J2 via the communication units M5 and J5 to adjust the elevation angle and focus of the imaging unit J2.

[0048] Steps S2 and S3 may be repeated as necessary for inspection, and the nozzle N may be imaged by the imaging unit J2 from different directions while changing the imaging position. For example, as illustrated in FIG. 6, the nozzle N may be imaged by the imaging unit J2 from different imaging positions P1 to P4, each spaced approximately 90° apart. In this case, four images are obtained by imaging from each of the imaging positions P1 to P4. Alternatively, although not shown, the nozzle N may be imaged by the imaging unit J2 from different imaging positions spaced approximately 15° apart. In this case, 24 images are obtained by imaging from each imaging position. Alternatively, although not shown, the nozzle N may be imaged continuously by the imaging unit J2 while the inspection board J is rotated. In this case, images of the entire circumference of the nozzle N (so-called panoramic images) are obtained. Note that when the nozzle N is imaged from different directions while changing the imaging position, these multiple imaging positions may be spaced apart at approximately equal intervals in the rotation direction of the inspection board J (i.e., they may be spaced apart by a predetermined angle), or the spacing may not be equal.

[0049] Next, the controller Ctr processes data of at least one captured image captured by the imaging unit J2 to calculate the attitude of the nozzle N (see step S4 in FIG. 5). Here, an example will be described in which the attitude of the nozzle N is calculated by calculating (A) the height of the nozzle N, (B) the center position of the tip of the nozzle N, and (C) the inclination of the nozzle N.

[0050] (A) Height of nozzle N First, the lowest end of the nozzle N is identified in the captured image (see FIG. 7). Methods for identifying the lowest end of the nozzle N include, for example, a method in which an operator observes the captured image and specifies the lowest end of the nozzle N, and a method in which the controller Ctr processes the captured image using a known edge detection technique and detects the lowest end of the nozzle N based on the processed image.

[0051] Next, the linear distance between the bottom end of the nozzle N and the surface of the base part J1 is calculated to obtain the height of the nozzle N. Specifically, the controller Ctr may calculate the number of pixels between the bottom end of the nozzle N and the surface of the base part J1, and multiply this by the length per pixel (mm / pixel) obtained in advance to calculate the height (mm) of the nozzle N. Alternatively, as illustrated in FIG. 7, the height of the nozzle N may be obtained by an operator reading the height of the bottom end of the nozzle N using an image of the scale SC captured simultaneously with the nozzle N. The scale SC may be provided on the base part J1 facing upward from the surface of the base part J1 so as to be located near the nozzle N, or may be provided in front of the lens of the imaging part J2.

[0052] (B) Center position of the tip of nozzle N Below, we will explain an example of calculating the center position of the tip of the nozzle N based on four captured images obtained by capturing images of the nozzle N from different imaging positions P1 to P4, each approximately 90° apart, using the imaging unit J2, as illustrated in Figure 6.

[0053] First, in an image obtained by imaging the nozzle N with the imaging unit J2 from imaging position P1 (for example, an image captured at a position of 0° around the rotation center axis Ax), a horizontal line L passing through the tip of the nozzle N is designated (see FIG. 8(a)). Methods for designating the horizontal line L include, for example, a method in which an operator designates the tip of the nozzle N by observing the captured image, and a method in which the controller Ctr compares a previously acquired image of the tip of the nozzle N with the captured image using a known image recognition technique to automatically determine the tip of the nozzle N in the captured image.

[0054] Next, the controller Ctr calculates the change in brightness value on the horizontal line L (see FIG. 8(b)). In the example of FIG. 8(a), the brightness value of nozzle N is smaller than the background, so the coordinates where the brightness value suddenly decreases can be determined to be the side edges of the tip of nozzle N. In the example of FIG. 8(b), two coordinates where the brightness is 100 are determined to be the side edges of the tip of nozzle N, and the distance between these two coordinates is found to be the width of the tip of nozzle N, and the coordinate midway between these two coordinates is found to be the center position of the tip of nozzle N.

[0055] Next, the controller Ctr calculates the deviation ΔX1 between the coordinate of the rotation center axis Ax in the captured image and the center of the tip of the nozzle N. Note that the coordinate of the rotation center axis Ax in the captured image is 300 pixels in the example of FIG. 8(b), but it may also be calculated using the average value of the coordinates of the center of the tip of the nozzle N in multiple captured images.

[0056] Next, the controller Ctr performs the same process as above on the other captured images, thereby calculating the width of the tip of the nozzle N, the central position of the tip of the nozzle N, and the deviation ΔY1 (see FIG. 8(d)) based on the captured image (for example, an image captured at a 90° position around the rotation center axis Ax) (see FIG. 8(c)) obtained by capturing an image of the nozzle N by the imaging unit J2 from the imaging position P2.

[0057] Furthermore, based on an image obtained by imaging the nozzle N with the imaging unit J2 from imaging position P3 (for example, an image obtained at a position 180° around the rotation center axis Ax) (see FIG. 9(a)), the width of the tip of the nozzle N, the central position of the tip of the nozzle N, and the deviation ΔX2 are each calculated (see FIG. 9(b)). Furthermore, based on an image obtained by imaging the nozzle N with the imaging unit J2 from imaging position P4 (for example, an image obtained at a position 270° around the rotation center axis Ax) (see FIG. 9(c)), the width of the tip of the nozzle N, the central position of the tip of the nozzle N, and the deviation ΔY2 are each calculated (see FIG. 9(d)).

[0058] Next, the controller Ctr calculates the center position of the tip of the nozzle N based on the calculated ΔX1, ΔX2, ΔY1, and ΔY2. Specifically, in the above example, four captured images captured from imaging positions that are 90° apart are used, so the coordinate (pixel) in the X direction of the captured image is obtained from the average value of ΔX1 and ΔX2 (=(ΔX1+ΔX2) / 2), and the coordinate (pixel) in the Y direction of the captured image is obtained from the average value of ΔY1 and ΔY2 (=(ΔY1+ΔY2) / 2). The coordinate (pixel) in the captured image is then multiplied by the length per pixel (mm / pixel) obtained in advance to calculate the actual coordinate (mm) of the center position of the tip of the nozzle N.

[0059] The actual coordinates (mm) of the center position of the tip of the nozzle N may be calculated based on at least two captured images taken from different imaging positions. However, if at least three captured images taken from different imaging positions are used, errors due to the rotation of the base part J1 and errors in the images taken by the imaging part J2 are smoothed out, so that the actual coordinates (mm) of the center position of the tip of the nozzle N can be calculated with higher accuracy.

[0060] (C) Nozzle N inclination Below, we will explain an example of calculating the center position of the tip of the nozzle N based on four captured images obtained by capturing images of the nozzle N from different imaging positions P1 to P4, each approximately 90° apart, using the imaging unit J2, as illustrated in Figure 6.

[0061] First, the controller Ctr uses a known image recognition technique to identify corners Q11 and Q12 (see FIG. 10(a)) that form the tip of the nozzle N in an image obtained by imaging the nozzle N with the imaging unit J2 from imaging position P1 (for example, an image captured at a position of 0° around the rotation center axis Ax). Next, the controller Ctr obtains the coordinates (pixels) of the corners Q11 and Q12 in the image, and calculates the perpendicular bisector H1 (see FIG. 10(a)) of the line segment connecting the corners Q11 and Q12. Next, the controller Ctr calculates the angle θ1 (see FIG. 10(a)) of the perpendicular bisector H1 with respect to a vertical line.

[0062] Next, the controller Ctr performs the same process as above on the other captured images, thereby calculating the corners Q21 and Q22, the perpendicular bisector H2, and the angle θ2 based on the captured images (e.g., images captured at a 90° angle around the rotation center axis Ax) obtained by capturing an image of the nozzle N from the imaging position P2 by the imaging unit J2 (see FIG. 10(b)).

[0063] Further, based on an image obtained by imaging the nozzle N with the imaging unit J2 from imaging position P3 (for example, an image obtained at a position 180° around the rotation center axis Ax), corners Q31 and Q32, the perpendicular bisector H3, and the angle θ3 are calculated (see FIG. 10(c)). Further, based on an image obtained by imaging the nozzle N with the imaging unit J2 from imaging position P4 (for example, an image obtained at a position 270° around the rotation center axis Ax), corners Q41 and Q42, the perpendicular bisector H4, and the angle θ4 are calculated (see FIG. 10(d)).

[0064] Next, the controller Ctr calculates the tilt of the nozzle N based on the calculated angles θ1 to θ4. Specifically, the controller Ctr first calculates the amount of tilt per unit height (e.g., 1 mm), i.e., tilt vectors I1 to I4, based on the angles θ1 to θ4 (see FIG. 11). In the above example, four captured images captured from imaging positions that differ by 90° are used, so the Y coordinates of tilt vectors I1 and I3 can be set to 0, and the X coordinates of tilt vectors I2 and I4 can be set to 0. Therefore, tilt vector I1 can be set to (Xi1, 0, 1), tilt vector I2 can be set to (0, Yi2, 1), tilt vector I3 can be set to (Xi3, 0, 1), and tilt vector I4 can be set to (0, Yi4, 1). Then, by using trigonometric ratios, Xi1 can be calculated by tan θ1, Yi2 can be calculated by tan θ2, Xi3 can be calculated by tan θ3, and Yi4 can be calculated by tan θ4 (see the same figure). Next, the controller Ctr combines the calculated tilt vectors I1 to I4 to calculate the amount of tilt per unit height of the nozzle N, i.e., the tilt vector I of the nozzle N.

[0065] The tilt vector I may be calculated based on at least two captured images taken from different imaging positions. However, if at least three captured images taken from different imaging positions are used, errors due to the rotation of the base unit J1 and errors in the images captured by the imaging unit J2 are smoothed, allowing the tilt vector I to be calculated more accurately.

[0066] Next, the controller Ctr calculates an expected landing position of the processing liquid discharged from the nozzle N on the surface of the substrate W based on the attitude of the nozzle N calculated in step S4 (see step S5 in FIG. 5). For example, the controller Ctr may calculate the expected landing position using at least one of the height of the nozzle N calculated in step S4, the actual coordinates of the center position of the tip of the nozzle N, and the tilt vector I of the nozzle N.

[0067] Next, the controller Ctr calculates the deviation between the predicted liquid landing position calculated in step S5 and the rotation center axis Ax (see step S6 in FIG. 5). Next, the controller Ctr determines whether the deviation is within a predetermined allowable range (see step S7 in FIG. 5). The allowable range may be determined based on various conditions, such as the processing accuracy of the substrate W, the rotation speed during processing of the substrate W, the type of processing liquid, and the discharge flow rate of the processing liquid.

[0068] If the deviation is not within a predetermined tolerance (NO in step S7 in FIG. 5), the controller Ctr proceeds to step S10 and issues an alarm to the effect that adjustment of the nozzle N is necessary. Based on the alarm, an operator may manually adjust the nozzle N, or the controller Ctr may control each part of the liquid processing unit U (e.g., drive unit 48, etc.) to automatically adjust the nozzle N. Thereafter, the controller Ctr controls the transport arm A2 to unload the test substrate J from the liquid processing unit U and transport the test substrate J to the shelf unit 6 (see step S11 in FIG. 5).

[0069] The controller Ctr may determine whether the attitude of the nozzle N calculated in step S4 (e.g., the height of the nozzle N, the actual coordinates of the center position of the tip of the nozzle N, the tilt vector I of the nozzle N, etc.) is within a predetermined tolerance range. In this case, the controller Ctr may also issue an alarm when the attitude of the nozzle N is not within the predetermined tolerance range. Alternatively, when the attitude of the nozzle N is not within the predetermined tolerance range, the controller Ctr may control each part of the liquid processing unit U (e.g., the drive unit 48, etc.) to automatically adjust the nozzle N. In this case, maintenance of the nozzle N can be performed efficiently.

[0070] On the other hand, if the result of the determination in step S7 is that the deviation is within a predetermined allowable range (YES in step S7 in FIG. 5), the controller Ctr detects whether or not there is an abnormality on the surface of the nozzle N (see step S8 in FIG. 5). Below, an example of detecting whether or not there is an abnormality on the surface of the nozzle N based on a panoramic image of the entire circumference of the nozzle N, as exemplified in FIG. 12, will be described.

[0071] First, a panoramic image of a nozzle N without an abnormality is acquired in advance as a reference image. Next, the controller Ctr subtracts the brightness value for each pixel located at corresponding coordinates between the reference image and the panoramic image of the inspection target to calculate a corrected image. Next, the controller Ctr processes the corrected image using a known edge detection technique to calculate the size of an area where the edges are enhanced. Next, the controller Ctr determines whether the size of the area is within a predetermined tolerance. If the size of the area is not within the predetermined tolerance, the controller Ctr determines that an abnormality Ab (see FIG. 12) exists in the nozzle N. Note that the reference image may be obtained by averaging the brightness values ​​of all pixels in the panoramic image of the inspection target. Alternatively, the panoramic image of the inspection target may be directly processed using a known edge detection technique without using the reference image.

[0072] When the controller Ctr determines that an abnormality Ab exists in the nozzle N (NO in step S9 of FIG. 5), the process proceeds to step S10, where it issues an alarm to notify the user that an abnormality exists in the nozzle N. When an alarm is issued, the operator may replace the nozzle N with a new nozzle N. Alternatively, when the abnormality Ab of the nozzle N is an attachment attached to the surface of the nozzle N, the controller Ctr may control each part of the liquid processing unit U to supply a processing liquid or a cleaning liquid to the nozzle N and remove the attachment from the nozzle N.

[0073] On the other hand, if the result of the determination in step S9 is that no abnormality Ab exists in the nozzle N (YES in step S9 in FIG. 5), the process proceeds to step S11, where the controller Ctr controls the transport arm A2 to transport the test substrate J out of the liquid processing unit U and to transport the test substrate J to the shelf unit 6. This completes the inspection of the state of the nozzle N.

[0074] After the inspection of the state of the nozzles N of one liquid processing unit U is completed, the inspection substrate J may be transported to another liquid processing unit U to inspect the state of the nozzles N of that other liquid processing unit U, without returning the inspection substrate J to the shelf unit 6. Alternatively, the inspection substrate may be periodically transported into the liquid processing unit U every time a predetermined number of substrates W are processed in the liquid processing unit U, to inspect the state of the nozzles N of the liquid processing unit U. In this case, the controller Ctr may compare data on the current state of the nozzles N with data on the previous state of the nozzles N, and determine whether the current state of the nozzles N is within a predetermined tolerance range. If it is not within the tolerance range, the controller Ctr may issue an alarm as in step S10.

[0075] [Effect] According to the above example, with the inspection substrate J held by the rotational holding unit 30, the position of the imaging unit J2 relative to the nozzle N is adjusted to a predetermined imaging position by rotating the rotational holding unit 30. As a result, there is no obstruction between the imaging unit J2 and the nozzle N being imaged, and the nozzle N is imaged from an appropriate position. Therefore, it is possible to accurately acquire the state of the nozzle N.

[0076] According to the above example, the nozzle is imaged from a plurality of imaging positions, which makes it possible to acquire the state of the nozzle N with higher accuracy.

[0077] According to the above example, the nozzle N can be imaged from a plurality of imaging positions spaced apart at approximately equal intervals in the rotation direction of the test substrate J. In this case, the outer peripheral surface of the nozzle N is imaged over approximately the entire circumference. This makes it possible to obtain the state of the nozzle N with even greater accuracy.

[0078] According to the above example, when the nozzle N is imaged, the nozzle N can be positioned on the side of the rotational axis Ax of the rotation holding unit 30 relative to the imaging unit J2. In this case, even if the imaging unit J2 rotates via the testing board J, the position of the nozzle N relative to the imaging unit J2 is unlikely to change. Therefore, it is possible for the imaging unit J2 to continuously image the nozzle N without adjusting the orientation of the imaging unit J2, for example.

[0079] According to the above example, the presence or absence of an abnormality on the surface of the nozzle N is detected by image processing of the image captured by the imaging unit J2. Therefore, it is possible to detect the presence or absence of adhesions or scratches on the surface of the nozzle N, and the presence or absence of deformation of the nozzle N. Therefore, by adjusting (e.g., replacing or cleaning) the nozzle N based on the detection results, it is possible to eliminate in advance the influence of an abnormality on the surface of the nozzle N on the substrate processing.

[0080] According to the above example, the presence or absence of an abnormality on the surface of the nozzle N is detected by comparing an image of the nozzle N taken by the imaging unit J2 before the substrate W is treated with the treatment liquid (an image of the nozzle N without an abnormality) with an image of the nozzle N taken by the imaging unit J2 after the substrate W is treated with the treatment liquid. Therefore, by comparing the two images, the location of an abnormality on the surface of the nozzle N becomes more prominent. This makes it possible to more accurately detect the presence or absence of an abnormality on the surface of the nozzle N.

[0081] According to the above example, by processing the image captured by the imaging unit J2, it is possible to detect at least one of the attitudes of the nozzle N, namely, the height of the nozzle N, the central position of the tip of the nozzle N in the horizontal direction, and the inclination of the nozzle N. Therefore, it is possible to identify the attitude of the nozzle N based on the detection results.

[0082] According to the above example, the predicted landing position of the processing liquid discharged from the nozzle N on the surface of the substrate W is calculated based on the detected attitude of the nozzle N. Therefore, it is possible to know the predicted landing position in advance without actually discharging the processing liquid onto the substrate W.

[0083] According to the above example, the deviation between the calculated predicted liquid landing position and the rotation center axis Ax of the spin holder 30 is calculated. Therefore, by adjusting the nozzle N based on the deviation, it becomes possible to align the landing position of the processing liquid from the nozzle N with the origin in advance, without actually discharging the processing liquid onto the substrate W.

[0084] According to the above example, an alarm is issued when it is determined that the calculated deviation is outside a predetermined allowable range, thereby making it possible to eliminate in advance the influence of the deviation on the substrate processing.

[0085] According to the above example, when the imaging unit J2 captures an image of the nozzle N, the illumination unit J3 irradiates the nozzle N. This makes it possible to capture an image of the nozzle N more clearly.

[0086] According to the above example, the imaging unit J2 and the controller Ctr can be connected to each other wirelessly so that they can communicate with each other. In this case, there is no need to connect a communication cable to the testing board J, so the rotation of the testing board J by the rotation holder 30 is less likely to be hindered. This allows for greater freedom in the imaging position of the nozzle N.

[0087] According to the above example, the inspection board J includes a battery J4 that supplies power to the imaging unit J2 and is configured to be rechargeable. This eliminates the need to connect a power cable to the inspection board J, making it less likely that the rotation of the inspection board J by the rotation holder 30 will be hindered. This allows for greater freedom in the imaging position of the nozzle N.

[0088] According to the above example, the test substrate J is transported by the transport arm A2 between the liquid processing unit U and the shelf unit 6. Therefore, when the substrate is processed by the liquid processing unit U, the test substrate J can be retracted to the shelf unit 6.

[0089] [Variations] The disclosure in this specification should be considered to be illustrative in all respects and not restrictive. Various omissions, substitutions, modifications, etc. may be made to the above examples without departing from the scope and spirit of the claims.

[0090] (1) In the above example, the substrate processing system 1 is a substrate cleaning apparatus, but the substrate processing system 1 may also be a coating / developing apparatus. That is, the processing liquid supplied to the surface of the substrate W may be, for example, a coating liquid for forming a film on the surface of the substrate W, or a developing liquid for developing a resist film.

[0091] (2) The testing board J may not include the illumination unit J3. Alternatively, the testing board J may include multiple illumination units J3. In this case, as illustrated in FIG. 13, the multiple illumination units J3 may be spaced apart from each other at approximately equal intervals in the rotation direction of the testing board J.

[0092] (3) The inspection board J may include multiple imaging units J2. In this case, as illustrated in FIG. 13, the multiple imaging units J2 may be spaced apart from one another at approximately equal intervals in the rotation direction of the inspection board J. When the nozzle N is imaged by multiple imaging units J2, multiple locations on the nozzle N can be simultaneously imaged simply by adjusting the positions of the multiple imaging units J2 relative to the nozzle N to predetermined imaging positions. Therefore, it is possible to accurately and quickly obtain the state of the nozzle N.

[0093] (4) The imaging unit J2 may be disposed on the surface of the base unit J1, or may be built into the base unit J1.

[0094] (5) In the above example, the state of the nozzles N that eject the processing liquid or cleaning liquid is inspected, but the nozzles that eject gas (for example, nitrogen gas) may also be inspected.

[0095] (6) In the above example, the holder 33 holds the substrate W by suction, but the substrate W may also be held mechanically.

[0096] (7) The controller Ctr may generate three-dimensional shape data of the nozzle N by image processing a plurality of captured images obtained by capturing images of the nozzle N from different directions with the imaging unit J2 while changing the imaging position. In this case, the nozzle N can be observed in more detail based on the generated three-dimensional shape data. This makes it possible to obtain the state of the nozzle N with greater accuracy. Note that the three-dimensional shape data of the nozzle N may be obtained using a non-contact 3D scanner instead of the imaging unit J2.

[0097] (8) The imaging unit J2 may capture an image of the nozzle N while the treatment liquid is being discharged. In this case, the actual state of the treatment liquid being discharged from the nozzle N can be confirmed. Therefore, if the state of the nozzle N is abnormal, the abnormality can be detected early. In this case, the imaging unit J2 may be waterproof, or may be located away from the flow of the treatment liquid to prevent the treatment liquid from adhering to the imaging unit J2.

[0098] Alternatively, as illustrated in FIG. 14, the inspection substrate J may include a transparent member J6 disposed on the base portion J1 so as to cover the imaging unit J2. In this case, the nozzle N is imaged by the imaging unit J2 through the transparent member J6. Therefore, even if the processing liquid drops or is ejected from the nozzle N, the transparent member J6 prevents the processing liquid from adhering to the imaging unit J2. This makes it possible to accurately obtain the state of the nozzle N while protecting the imaging unit J2. Furthermore, the imaging unit J2 can capture an image while the processing liquid remains ejected from the nozzle N. This makes it possible to grasp the actual landing position of the processing liquid on the substrate W. The transparent member J6 may be made of a material (e.g., quartz, resin, etc.) that is resistant to the processing liquid.

[0099] (9) As shown in Fig. 15, the nozzle N may be imaged by the imaging unit J2 from directly below. In this case, the center position of the tip of the nozzle N and the presence or absence of an abnormality in the tip surface of the nozzle N can also be detected.

[0100] [Other examples] Example 1. An example of a substrate processing apparatus includes a base portion, a test substrate including an imaging unit disposed on the base portion, a holding portion configured to hold a substrate or the test substrate, a drive portion configured to rotate the holding portion, a processing liquid supply portion including a nozzle configured to discharge a processing liquid onto the substrate held by the holding portion, and a control unit. The control unit is configured to control the drive portion to rotate the holding portion while the test substrate is held by the holding portion, thereby performing a first process of adjusting the position of the imaging unit relative to the nozzle to a predetermined first imaging position, and after the first process, control the imaging unit to capture an image of the nozzle at the first imaging position. Meanwhile, in the substrate processing apparatus described in Patent Document 1, the imaging means is disposed above the processing liquid supply nozzle and the splash prevention cup. Therefore, when attempting to image the vicinity of the tip of the nozzle, these may function as an obstruction, blocking the target area or preventing light from illuminating the target area evenly, potentially preventing a clear image of the target area. Furthermore, since it is necessary to take an image while avoiding the processing liquid supply nozzle and the anti-scattering cup, and the image capturing direction is limited to an obliquely upward direction, the image capturing range may be limited. However, with the device of Example 1, while the test substrate is held by the holder, the drive unit is controlled to rotate the holder, thereby adjusting the position of the image capturing unit relative to the nozzle to a predetermined first image capturing position. Therefore, there is no obstruction between the image capturing unit and the nozzle to be imaged, and the nozzle is captured from an appropriate position. Therefore, it is possible to accurately obtain the state of the nozzle.

[0101] Example 2: In the device of Example 1, the control unit may be configured to execute a third process after the second process in which, with the testing board held by the holding unit, the control unit controls the drive unit to rotate the holding unit to adjust the position of the imaging unit relative to the nozzle to a second imaging position different from the first imaging position, and a fourth process after the third process in which the control unit controls the imaging unit to image the nozzle at the second imaging position. In this case, the nozzle is imaged from multiple imaging positions. This makes it possible to obtain the state of the nozzle with greater accuracy.

[0102] Example 3 In the device of Example 2, the control unit may be configured to sequentially perform the first process, the second process, the third process, and the fourth process while controlling the drive unit to rotate the holding unit.

[0103] Example 4. In the device of Example 2 or Example 3, the control unit is configured to execute a fifth process after the fourth process in which, with the testing board held by the holding unit, the control unit controls the drive unit to rotate the holding unit to adjust the position of the imaging unit relative to the nozzle to a third imaging position different from the first imaging position and the second imaging position, and a sixth process after the fifth process in which the control unit controls the imaging unit to image the nozzle at the third imaging position, wherein the first imaging position, the second imaging position, and the third imaging position may be spaced apart from one another at approximately equal intervals in the rotation direction of the testing board. In this case, the nozzle is imaged from three imaging positions spaced apart from one another at approximately equal intervals in the rotation direction of the testing board. In other words, the outer circumferential surface of the nozzle is imaged over approximately the entire circumference. This makes it possible to obtain the state of the nozzle with even greater accuracy.

[0104] Example 5: In the devices of Examples 2 to 4, the control unit may be configured to execute a seventh process of generating three-dimensional shape data of the nozzle by image processing a plurality of captured images captured by the imaging unit. In this case, the nozzle can be observed in more detail based on the generated three-dimensional shape data. Therefore, it is possible to obtain the state of the nozzle with higher accuracy.

[0105] Example 6: In any of the devices of Examples 1 to 5, the imaging unit may be located closer to the outer periphery of the base than the nozzle when imaging the nozzle. In this case, the nozzle is located closer to the rotation axis of the holder relative to the imaging unit. Therefore, even if the imaging unit rotates via the testing board, the position of the nozzle relative to the imaging unit is less likely to change. Therefore, it is possible to continuously image the nozzle using the imaging unit without adjusting the orientation of the imaging unit.

[0106] Example 7: In the apparatus of any of Examples 1 to 6, the control unit may be configured to execute an eighth process of detecting the presence or absence of an abnormality on the surface of the nozzle by processing the image captured by the imaging unit. In this case, the presence or absence of deposits or scratches on the surface of the nozzle, the presence or absence of deformation of the nozzle, etc. are detected. Therefore, by adjusting (e.g., replacing or cleaning) the nozzle based on the detection results, it is possible to prevent the influence of the abnormality on the surface of the nozzle on the substrate processing.

[0107] Example 8: In the apparatus of Example 7, the eighth process may include detecting the presence or absence of an abnormality on the nozzle surface by comparing an image captured by the imaging unit before the substrate is treated with the treatment liquid with an image captured by the imaging unit after the substrate is treated with the treatment liquid. In this case, the comparison of the two captured images makes the location of an abnormality on the nozzle surface more prominent. Therefore, it is possible to more accurately detect the presence or absence of an abnormality on the nozzle surface.

[0108] Example 9. In the device of any of Examples 1 to 8, the control unit may be configured to execute a ninth process of detecting at least one of the nozzle orientations, i.e., the nozzle height, the central position of the nozzle tip in the horizontal direction, and the nozzle inclination, by performing image processing on the image captured by the imaging unit. In this case, it is possible to identify the nozzle orientation based on the detection result.

[0109] Example 10. In the apparatus of Example 9, the control unit may be configured to execute a tenth process of calculating an expected landing position of the processing liquid ejected from the nozzle on the surface of the substrate based on the nozzle attitude detected in the ninth process. In this case, it becomes possible to know the expected landing position in advance without actually ejecting the processing liquid onto the substrate.

[0110] Example 11 In the apparatus of Example 10, the control unit may be configured to execute an eleventh process of calculating a deviation between the predicted liquid landing position calculated in the tenth process and the central axis of rotation of the holder. In this case, by adjusting the nozzle based on the calculated deviation, it becomes possible to align the landing position of the processing liquid from the nozzle with the origin in advance without actually discharging the processing liquid onto the substrate.

[0111] Example 12. In the apparatus of Example 11, the control unit may be configured to execute a twelfth process of issuing an alarm when it is determined that the deviation calculated in the eleventh process is outside a predetermined allowable range. In this case, it is possible to prevent the influence of the deviation on the substrate processing in advance.

[0112] Example 13 The device of Example 11 or Example 12 may further include a nozzle drive unit configured to change the attitude of the nozzle, and the control unit may be configured to execute a thirteenth process in which, when it is determined that the deviation calculated in the eleventh process is outside a predetermined tolerance range, the control unit controls the nozzle drive unit to adjust the attitude of the nozzle so that the deviation falls within the tolerance range. In this case, the control unit automatically controls the attitude of the nozzle when the deviation is outside the tolerance range, making it possible to efficiently perform nozzle maintenance.

[0113] Example 14: In the device of any one of Examples 1 to 13, the second process may include capturing an image of the nozzle at the first imaging position while the treatment liquid is being discharged. In this case, the actual state of the treatment liquid being discharged from the nozzle can be confirmed. Therefore, if the state of the nozzle is abnormal, the abnormality can be detected early.

[0114] Example 15: In the device of any one of Examples 1 to 14, the inspection substrate may include a transparent member arranged to cover the imaging unit, and the second process may include imaging the nozzle through the transparent member at the first imaging position. In this case, even if the treatment liquid drops or is ejected from the nozzle, the transparent member makes it difficult for the treatment liquid to adhere to the imaging unit. Therefore, it is possible to accurately obtain the state of the nozzle while protecting the imaging unit. Furthermore, the imaging unit can capture an image while the treatment liquid remains ejected from the nozzle. Therefore, it is possible to grasp the actual position where the treatment liquid lands on the substrate.

[0115] Example 16: In the device of any one of Examples 1 to 15, the testing board may include an illumination unit disposed on the base unit, and the illumination unit may be configured to irradiate light onto the nozzle when the imaging unit images the nozzle. In this case, it is possible to image the nozzle more clearly.

[0116] Example 17: In any of the devices of Examples 1 to 16, the testing board may include another imaging unit disposed in a location on the base portion separate from the imaging unit. In this case, the nozzle is imaged by the multiple imaging units. Therefore, simply by adjusting the positions of the multiple imaging units relative to the nozzle to predetermined imaging positions, multiple locations on the nozzle can be simultaneously imaged. This makes it possible to accurately and quickly obtain the state of the nozzle.

[0117] Example 18: In any of the devices of Examples 1 to 17, the imaging unit and the control unit may be connected to each other so that they can communicate with each other wirelessly. In this case, there is no need to connect a communication cable to the testing board, so the rotation of the testing board by the holding unit is less likely to be hindered. This allows for greater freedom in the imaging position of the nozzle.

[0118] Example 19: In any of the devices of Examples 1 to 18, the testing board may include a battery configured to supply power to the imaging unit and be rechargeable. In this case, there is no need to connect a power cable to the testing board, so that the rotation of the testing board by the holding unit is less likely to be hindered. This allows for greater freedom in the imaging position of the nozzle.

[0119] Example 20. The apparatus of any one of Examples 1 to 19 may include a processing chamber configured to accommodate the holder, the drive unit, and the nozzle, a storage chamber configured to accommodate a test substrate, and a transport unit configured to transport the test substrate between the processing chamber and the storage chamber. In this case, the test substrate can be retracted into the storage chamber during substrate processing in the processing chamber.

[0120] Example 21. An example of a substrate processing method includes a first step of holding a test substrate, which includes a base portion and an imaging unit arranged on the base portion, in a holding unit; a second step of adjusting the position of the imaging unit relative to the nozzle of the treatment liquid supply unit to a predetermined first imaging position by rotating the holding unit after the first step; a third step of imaging the nozzle at the first imaging position after the second step; a fourth step of unloading the test substrate from the holding unit after the third step; a fifth step of holding the substrate in the holding unit after the fourth step; and a sixth step of processing the substrate by having the treatment liquid supply unit supply treatment liquid to the substrate through the nozzle after the fifth step. In this case, the same effects as those of the apparatus of Example 1 can be obtained. [Explanation of symbols]

[0121] 1...substrate processing system (substrate processing apparatus), 6...shelf unit (accommodation chamber), 10...chamber (processing chamber), 30...rotational holding unit, 31...drive unit, 33...holding unit, 40...supply unit (processing liquid supply unit, cleaning liquid supply unit), 48...drive unit (nozzle drive unit), 50...cup member, A2...transport arm (transport unit), Ax...rotation center axis, Ctr...controller (control unit), J...inspection substrate, J1...base unit, J2...imaging unit, J3...illumination unit, J4...battery, J5...communication unit, J6...transparent member, N...nozzle, U...liquid processing unit, W...substrate.

Claims

1. a testing substrate including a base portion and an imaging portion disposed on the base portion; a holding portion configured to hold a substrate or the test substrate; a drive unit configured to rotationally drive the holding unit; a processing liquid supply unit including a nozzle configured to dispense a processing liquid onto the substrate held by the holder; a control unit; The control unit a first process of controlling the drive unit to rotate the holding unit while the testing board is held by the holding unit, thereby adjusting the position of the imaging unit with respect to the nozzle to a predetermined first imaging position; a second process of controlling the imaging unit to capture an image of the nozzle at the first imaging position after the first process; a third process of adjusting a position of the imaging unit with respect to the nozzle to a second imaging position different from the first imaging position by controlling the drive unit to rotate the holding unit while the testing board is held by the holding unit after the second process; the substrate processing apparatus is configured to execute, after the third process, a fourth process of controlling the imaging unit to take an image of the nozzle at the second imaging position.

2. The apparatus according to claim 1 , wherein the control unit is configured to sequentially perform the first process, the second process, the third process, and the fourth process while controlling the drive unit to rotate the holding unit.

3. The control unit a fifth process of adjusting a position of the imaging unit with respect to the nozzle to a third imaging position different from the first imaging position and the second imaging position by controlling the drive unit to rotate the holding unit while the testing board is held by the holding unit after the fourth process; and and a sixth process of controlling the imaging unit to capture an image of the nozzle at the third imaging position after the fifth process, 3. The device according to claim 1, wherein the first imaging position, the second imaging position, and the third imaging position are spaced apart at substantially equal intervals in the rotation direction of the test board.

4. The device according to any one of claims 1 to 3, wherein the control unit is configured to execute a seventh process of generating three-dimensional shape data of the nozzle by image processing a plurality of images captured by the imaging unit.

5. The device according to any one of claims 1 to 4, wherein the imaging unit is located closer to the outer periphery of the base portion than the nozzle when imaging the nozzle.

6. The device described in any one of claims 1 to 5, wherein the control unit is configured to perform an eighth process of detecting the presence or absence of an abnormality on the surface of the nozzle by image processing the image captured by the imaging unit.

7. The apparatus of claim 6, wherein the eighth process includes detecting the presence or absence of an abnormality on the surface of the nozzle by comparing an image captured by the imaging unit before the substrate is processed with the processing liquid with an image captured by the imaging unit after the substrate is processed with the processing liquid.

8. An inspection board including a base portion and an imaging portion disposed on the base portion; a holding portion configured to hold a substrate or the test substrate; a drive unit configured to rotationally drive the holding unit; a processing liquid supply unit including a nozzle configured to dispense a processing liquid onto the substrate held by the holder; a control unit; The control unit a first process of controlling the drive unit to rotate the holding unit while the testing board is held by the holding unit, thereby adjusting the position of the imaging unit with respect to the nozzle to a predetermined first imaging position; a second process of controlling the imaging unit to capture an image of the nozzle at the first imaging position after the first process; and a third process of detecting the presence or absence of an abnormality on the surface of the nozzle by performing image processing on the image captured by the imaging unit.

9. The device described in Claim 8, wherein the third processing includes detecting the presence or absence of an abnormality on the surface of the nozzle by comparing an image captured by the imaging unit before the substrate is treated with the treatment liquid with an image captured by the imaging unit after the substrate is treated with the treatment liquid.

10. The device according to any one of claims 1 to 9, wherein the control unit is configured to execute a ninth process of detecting at least one of the nozzle attitudes, i.e., the height of the nozzle, the central position of the tip of the nozzle in the horizontal direction, and the inclination of the nozzle, by image processing the image captured by the imaging unit.

11. The apparatus according to claim 10, wherein the control unit is configured to execute a tenth process of calculating an expected landing position of the processing liquid ejected from the nozzle on the surface of the substrate based on the attitude of the nozzle detected in the ninth process.

12. The device according to claim 11, wherein the control unit is configured to execute an eleventh process that calculates a deviation between the predicted liquid landing position calculated in the tenth process and a rotation center axis of the holding unit.

13. The device according to claim 12, wherein the control unit is configured to execute a twelfth process of issuing an alarm when it is determined that the deviation calculated in the eleventh process is outside a predetermined tolerance range.

14. Further, a nozzle driving unit configured to change the attitude of the nozzle is provided, 14. The device according to claim 12, wherein the control unit is configured to execute a thirteenth process in which, when it is determined that the deviation calculated in the eleventh process is outside a predetermined tolerance range, the control unit controls the nozzle drive unit to adjust the attitude of the nozzle so that the deviation falls within the tolerance range.

15. An inspection board including a base portion and an imaging portion disposed on the base portion; a holding portion configured to hold a substrate or the test substrate; a drive unit configured to rotationally drive the holding unit; a processing liquid supply unit including a nozzle configured to dispense a processing liquid onto the substrate held by the holder; a control unit; The control unit a first process of controlling the drive unit to rotate the holding unit while the testing board is held by the holding unit, thereby adjusting the position of the imaging unit with respect to the nozzle to a predetermined first imaging position; a second process of controlling the imaging unit to capture an image of the nozzle at the first imaging position after the first process; a third process of detecting at least one of the nozzle attitudes, i.e., the height of the nozzle, the center position of the tip of the nozzle in the horizontal direction, and the inclination of the nozzle, by performing image processing on the captured image taken by the imaging unit; a fourth process of calculating an expected landing position of the processing liquid discharged from the nozzle on the surface of the substrate based on the attitude of the nozzle detected in the third process; a fifth process for calculating a deviation between the predicted liquid landing position calculated in the fourth process and the rotation center axis of the holder; and a sixth process of issuing an alarm when it is determined that the deviation calculated in the fifth process is outside a predetermined allowable range.

16. 16. The apparatus according to claim 1, wherein the second process includes capturing an image of the nozzle in a state where the treatment liquid is being discharged at the first imaging position.

17. the testing board includes a transparent member disposed so as to cover the imaging unit, The apparatus according to any one of claims 1 to 15, wherein the second processing includes imaging the nozzle through the transparent member at the first imaging position.

18. 18. The device according to claim 1, wherein the testing board includes another imaging unit disposed at a location on the base portion separate from the imaging unit.

19. The device according to any one of claims 1 to 18, wherein the imaging unit and the control unit are connected to each other wirelessly so as to be able to communicate with each other.

20. 20. The device according to claim 1, wherein the inspection board includes a battery configured to supply power to the imaging unit and to be rechargeable.

21. a processing chamber configured to house the holder, the actuator, and the nozzle; a receiving chamber configured to receive the test substrate; The apparatus according to any one of claims 1 to 20, further comprising: a transport section configured to transport the substrate for testing between the processing chamber and the receiving chamber.

22. An inspection board including a base portion and an imaging portion disposed on the base portion; a holding portion configured to hold a substrate or the test substrate; a drive unit configured to rotationally drive the holding unit; a processing liquid supply unit including a nozzle configured to dispense a processing liquid onto the substrate held by the holder; a control unit; The control unit a first process of controlling the drive unit to rotate the holding unit while the testing board is held by the holding unit, thereby adjusting the position of the imaging unit with respect to the nozzle to a predetermined first imaging position; a second process of controlling the imaging unit to image the nozzle at the first imaging position after the first process; The substrate processing apparatus, wherein the second process includes capturing an image of the nozzle in a state in which a processing liquid is being discharged at the first imaging position.

23. An inspection board including a base portion and an imaging portion disposed on the base portion; a holding portion configured to hold a substrate or the test substrate; a drive unit configured to rotationally drive the holding unit; a processing liquid supply unit including a nozzle configured to dispense a processing liquid onto the substrate held by the holder; a control unit; the testing board includes a transparent member disposed so as to cover the imaging unit, The control unit a first process of controlling the drive unit to rotate the holding unit while the testing board is held by the holding unit, thereby adjusting the position of the imaging unit with respect to the nozzle to a predetermined first imaging position; a second process of controlling the imaging unit to image the nozzle at the first imaging position after the first process; The substrate processing apparatus, wherein the second process includes capturing an image of the nozzle through the transparent member at the first imaging position.

24. An inspection board including a base portion and an imaging portion disposed on the base portion; a holding portion configured to hold a substrate or the test substrate; a drive unit configured to rotationally drive the holding unit; a processing liquid supply unit including a nozzle configured to dispense a processing liquid onto the substrate held by the holder; a control unit; the testing board includes another imaging unit that is disposed in a different location from the imaging unit on the base unit, The control unit a first process of controlling the drive unit to rotate the holding unit while the testing board is held by the holding unit, thereby adjusting the position of the imaging unit with respect to the nozzle to a predetermined first imaging position; the substrate processing apparatus is configured to execute, after the first process, a second process of controlling the imaging unit to capture an image of the nozzle at the first imaging position.

25. An inspection board including a base portion and an imaging portion disposed on the base portion; a holding portion configured to hold a substrate or the test substrate; a drive unit configured to rotationally drive the holding unit; a processing liquid supply unit including a nozzle configured to dispense a processing liquid onto the substrate held by the holder; a control unit; the imaging unit and the control unit are connected to each other wirelessly so as to be able to communicate with each other; The control unit a first process of controlling the drive unit to rotate the holding unit while the testing board is held by the holding unit, thereby adjusting the position of the imaging unit with respect to the nozzle to a predetermined first imaging position; the substrate processing apparatus is configured to execute, after the first process, a second process of controlling the imaging unit to capture an image of the nozzle at the first imaging position.

26. An inspection board including a base portion and an imaging portion disposed on the base portion; a holding portion configured to hold a substrate or the test substrate; a drive unit configured to rotationally drive the holding unit; a processing liquid supply unit including a nozzle configured to dispense a processing liquid onto the substrate held by the holder; a control unit; the inspection board includes a battery configured to supply power to the imaging unit and to be rechargeable; The control unit a first process of controlling the drive unit to rotate the holding unit while the testing board is held by the holding unit, thereby adjusting the position of the imaging unit with respect to the nozzle to a predetermined first imaging position; the substrate processing apparatus is configured to execute, after the first process, a second process of controlling the imaging unit to capture an image of the nozzle at the first imaging position.

27. ​​An inspection board including a base portion and an imaging portion disposed on the base portion; a holding portion configured to hold a substrate or the test substrate; a drive unit configured to rotationally drive the holding unit; a processing liquid supply unit including a nozzle configured to dispense a processing liquid onto the substrate held by the holder; a processing chamber configured to house the holder, the actuator, and the nozzle; a receiving chamber configured to receive the test substrate; a transport unit configured to transport the test substrate between the processing chamber and the receiving chamber; a control unit; The control unit a first process of controlling the drive unit to rotate the holding unit while the testing board is held by the holding unit, thereby adjusting the position of the imaging unit with respect to the nozzle to a predetermined first imaging position; the substrate processing apparatus is configured to execute, after the first process, a second process of controlling the imaging unit to capture an image of the nozzle at the first imaging position.

28. the testing board includes an illumination unit disposed on the base unit, The device according to any one of claims 1 to 27, wherein the illumination unit is configured to irradiate the nozzle with light when the imaging unit captures an image of the nozzle.

29. a first step of holding a test board including a base portion and an imaging portion disposed on the base portion in a holding portion; a second step of adjusting a position of the imaging unit with respect to a nozzle of a processing liquid supply unit to a predetermined first imaging position by rotating the holding unit after the first step; a third step of capturing an image of the nozzle at the first imaging position after the second step; a fourth step of, after the third step, adjusting a position of the imaging unit with respect to the nozzle to a second imaging position different from the first imaging position by rotating the holding unit while the testing board is held by the holding unit; a fifth step of capturing an image of the nozzle at the second imaging position after the fourth step; a sixth step of carrying out the test substrate from the holding unit after the fifth step; a seventh step of holding the substrate on the holder after the sixth step; an eighth step, after the seventh step, in which the processing liquid supply unit supplies a processing liquid to the substrate through the nozzle to process the substrate.

30. The method described in claim 29, configured to perform the second step, the third step, the fourth step and the fifth step consecutively while rotating the holding portion.

31. A ninth step of, after the fifth step, adjusting the position of the imaging unit relative to the nozzle to a third imaging position different from the first imaging position and the second imaging position by rotating the holding unit while the inspection board is held by the holding unit; a tenth step of capturing an image of the nozzle at the third imaging position after the ninth step, 31. The method according to claim 29, wherein the first imaging position, the second imaging position, and the third imaging position are spaced apart from one another at substantially equal intervals in the rotation direction of the test board.

32. A method described in any one of claims 29 to 31, further comprising an eleventh step of generating three-dimensional shape data of the nozzle by image processing multiple images captured by the imaging unit.

33. A method described in any one of claims 29 to 31, further comprising a 12th step of detecting the presence or absence of an abnormality on the surface of the nozzle by image processing the image captured by the imaging unit.

34. The method described in claim 33, wherein the 12th step includes detecting the presence or absence of an abnormality on the surface of the nozzle by comparing an image captured by the imaging unit before the substrate is treated with the treatment liquid with an image captured by the imaging unit after the substrate is treated with the treatment liquid.

35. A first step of holding an inspection board including a base portion and an imaging portion disposed on the base portion in a holding portion; a second step of adjusting a position of the imaging unit with respect to a nozzle of a processing liquid supply unit to a predetermined first imaging position by rotating the holding unit after the first step; a third step of capturing an image of the nozzle at the first imaging position after the second step; a fourth step of carrying out the test substrate from the holding unit after the third step; a fifth step of holding the substrate on the holder after the fourth step; a sixth step of processing the substrate by supplying a processing liquid to the substrate through the nozzle by the processing liquid supply unit after the fifth step; and a seventh step of detecting the presence or absence of an abnormality on the surface of the nozzle by performing image processing on the image captured by the imaging unit.

36. The method described in claim 35, wherein the seventh step includes detecting the presence or absence of an abnormality on the surface of the nozzle by comparing an image captured by the imaging unit before the substrate is treated with the treatment liquid with an image captured by the imaging unit after the substrate is treated with the treatment liquid.

37. A thirteenth step of detecting at least one of the nozzle attitudes, i.e., the height of the nozzle, the central position of the tip of the nozzle in the horizontal direction, and the inclination of the nozzle, by performing image processing on the image captured by the imaging unit; a fourteenth step of calculating an expected landing position of the processing liquid discharged from the nozzle on the surface of the substrate based on the attitude of the nozzle detected in the thirteenth step; a fifteenth step of calculating a deviation between the predicted liquid landing position calculated in the fourteenth step and a rotation center axis of the holder; The method according to any one of claims 29 to 36, further comprising: a sixteenth step of issuing an alarm when it is determined that the deviation calculated in the fifteenth step is outside a predetermined tolerance range.

38. A first step of holding an inspection board including a base portion and an imaging portion disposed on the base portion in a holding portion; a second step of adjusting a position of the imaging unit with respect to a nozzle of a processing liquid supply unit to a predetermined first imaging position by rotating the holding unit after the first step; a third step of capturing an image of the nozzle at the first imaging position after the second step; a fourth step of carrying out the test substrate from the holding unit after the third step; a fifth step of holding the substrate on the holder after the fourth step; a sixth step of processing the substrate by supplying a processing liquid to the substrate through the nozzle by the processing liquid supply unit after the fifth step; a seventh step of detecting at least one of the nozzle attitudes, i.e., the height of the nozzle, the center position of the tip of the nozzle in the horizontal direction, and the inclination of the nozzle, by performing image processing on the image captured by the imaging unit; an eighth step of calculating an expected landing position of the processing liquid discharged from the nozzle on the surface of the substrate based on the attitude of the nozzle detected in the seventh step; a ninth step of calculating a deviation between the predicted liquid landing position calculated in the eighth step and a rotation center axis of the holder; a tenth step of issuing an alarm when it is determined that the deviation calculated in the ninth step is outside a predetermined allowable range.

39. A method according to any one of claims 29 to 38, wherein the third step includes imaging the nozzle at the first imaging position while the processing liquid is being ejected.

40. The inspection substrate includes a transparent member arranged to cover the imaging unit, The method according to any one of claims 29 to 39, wherein the third step includes imaging the nozzle through the transparent member at the first imaging position.

41. A method described in any one of claims 29 to 40, wherein the inspection board includes another imaging unit arranged in a location on the base portion separate from the imaging unit.

42. A method described in any one of claims 29 to 41, wherein the inspection board includes a battery that supplies power to the imaging unit and is configured to be rechargeable.

43. A first step of holding an inspection board including a base portion and an imaging portion disposed on the base portion in a holding portion; a second step of adjusting a position of the imaging unit with respect to a nozzle of a processing liquid supply unit to a predetermined first imaging position by rotating the holding unit after the first step; a third step of capturing an image of the nozzle at the first imaging position after the second step; a fourth step of carrying out the test substrate from the holding unit after the third step; a fifth step of holding the substrate on the holder after the fourth step; a sixth step of, after the fifth step, supplying a processing liquid to the substrate through the nozzle by the processing liquid supply unit to process the substrate; The third step includes capturing an image of the nozzle in a state in which a processing liquid is being discharged at the first imaging position.

44. A first step of holding an inspection board including a base portion and an imaging portion disposed on the base portion in a holding portion; a second step of adjusting a position of the imaging unit with respect to a nozzle of a processing liquid supply unit to a predetermined first imaging position by rotating the holding unit after the first step; a third step of capturing an image of the nozzle at the first imaging position after the second step; a fourth step of carrying out the test substrate from the holding unit after the third step; a fifth step of holding the substrate on the holder after the fourth step; a sixth step of, after the fifth step, supplying a processing liquid to the substrate through the nozzle by the processing liquid supply unit to process the substrate; the testing board includes a transparent member disposed so as to cover the imaging unit, The third step includes capturing an image of the nozzle through the transparent member at the first imaging position.

45. A first step of holding an inspection board including a base portion and an imaging portion disposed on the base portion in a holding portion; a second step of adjusting a position of the imaging unit with respect to a nozzle of a processing liquid supply unit to a predetermined first imaging position by rotating the holding unit after the first step; a third step of capturing an image of the nozzle at the first imaging position after the second step; a fourth step of carrying out the test substrate from the holding unit after the third step; a fifth step of holding the substrate on the holder after the fourth step; a sixth step of, after the fifth step, supplying a processing liquid to the substrate through the nozzle by the processing liquid supply unit to process the substrate; A substrate processing method, wherein the inspection substrate includes another imaging unit disposed at a location on the base portion separate from the imaging unit.

46. A first step of holding an inspection board including a base portion and an imaging portion disposed on the base portion in a holding portion; a second step of adjusting a position of the imaging unit with respect to a nozzle of a processing liquid supply unit to a predetermined first imaging position by rotating the holding unit after the first step; a third step of capturing an image of the nozzle at the first imaging position after the second step; a fourth step of carrying out the test substrate from the holding unit after the third step; a fifth step of holding the substrate on the holder after the fourth step; a sixth step of, after the fifth step, supplying a processing liquid to the substrate through the nozzle by the processing liquid supply unit to process the substrate; The substrate processing method, wherein the inspection substrate includes a battery configured to supply power to the imaging unit and to be rechargeable.

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