Dynamic glazing comprising a substrate having interlaced mesh electrodes

Abstract

Some embodiments are directed to a light modulator comprising a transparent or reflective substrate, with a plurality of electrodes applied to the substrate in a pattern across the substrate. A controller may apply electrical potentials to the electrodes to obtain an electric field between the electrodes that results in electrophoresis of particles towards or away from the electrodes, the electrodes being a plurality of interlaced mesh electrodes (210, 230) comprising a plurality of main lines (211, 212, 213, 214, 215) that are connected to a plurality of other main lines through a plurality of interconnects (221, 241, 242, 222, 223, 243).

Description

[Technical Field]

[0001] The subject matter of the present disclosure relates to dynamic glazing, light modulators, substrates, methods of manufacturing substrates, methods of manufacturing light modulators, dynamic glazing methods, and computer-readable media. [Background technology]

[0002] US Patent Application No. 11 / 041579, "Optically active glazing," Publication No. US20050185104A1, discloses optically active glazing based on the known dielectrophoretic effect and is incorporated herein by reference.

[0003] This known system comprises two parallel plates made of a transparent dielectric material, such as glass or a plastic material. The internal volume defined between the plates is subdivided into a plurality of independent small volumes or individual cells filled with a dielectric liquid. This liquid contains a suspension of particles of the dielectric material. The opposing faces of the two plates carry electrodes facing each other. These electrodes are connected to a power source associated with control means.

[0004] The electrodes on each plate are formed by pairs of interleaved combs. The electrodes of the two interleaved combs can be voltaged with the same or opposite polarities. With the appropriate voltage on the electrodes, particles can be collected at various locations between the electrodes to give the system either a transparent or opaque appearance.

[0005] There are various drawbacks associated with this known system. For example, it would be desirable if the electric field were uniform across the substrate. Another drawback of the known system is that in the opaque configuration, a uniform appearance of the glazing is desirable. This aspect can also have safety implications. For example, if the glazing is configured intermediate between opaque and transparent, the lack of uniformity may be confusing or distracting. Yet another drawback is that when the glazing transitions from an opaque configuration to a transparent configuration, it is desirable that the transition proceed at a uniform rate across the glazing.

[0006] Furthermore, the expected lifespan of known devices is limited. After repeated transparency change cycles, electrodes may break. When this occurs, parts of known devices cease to function. The problem of broken electrode lines may also arise during manufacturing. Breaking of the long, narrow lines used in conventional dynamic glazing affects manufacturing yields. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] US Patent Application Publication No. 2005 / 0185104 Summary of the Invention [Problem to be solved by the invention]

[0008] It would be beneficial to have an improved dynamic glazing that addresses the above and other problems. The dynamic glazing is provided with at least two substrates, each having at least two mesh electrodes. The mesh electrodes on the substrates are interlaced, also referred to as interdigitated, and an electromagnetic field can be created between the mesh electrodes on the substrates by applying an electric potential or current to the mesh electrodes. In an interdigitated pattern, a main line lies directly between two other main lines of a different mesh electrode or multiple different mesh electrodes (or, if at an edge, adjacent to a single main line of a different mesh electrode). Such an electromagnetic field is used to control the movement of charged particles between the substrates by electrophoresis. This, in turn, changes the optical properties of the dynamic glazing. Examples of optical properties that can be changed in this way, with appropriate particle selection, activation, etc., include transparency, translucency, and reflectivity, among others. [Means for solving the problem]

[0009] In embodiments, multiple interlaced mesh electrodes intersect at multiple crossing points, where two main lines of the same mesh electrode may be connected through interconnection lines, e.g., conductive bridges, for example, to equalize the potential at the mesh electrode, particularly across a large surface of the substrate, and the conductive bridges may be insulated from other mesh electrodes.

[0010] Dynamic glazing according to embodiments improves yield and lifespan due to possible rerouting in the mesh electrode. For example, a cut line in the electrode may be caused by a defect during fabrication. If the current and / or potential is rerouted around the cut, the defect will not cause a new defect, thus improving yield. For example, a cut line in the electrode may be caused by electrochemical decomposition during product use. Rerouting around such a cut avoids product replacement, thus improving lifespan.

[0011] The interconnections allow the mesh electrodes on the substrate to connect to the controller at points closer to each other. As a result, the mesh electrodes have a more uniform potential across the mesh electrodes. This allows for better control over the potential difference between two opposing points on two opposing mesh electrodes. As a result, unwanted field lines are reduced. For example, when the dynamic glazing is open (also known as vertical drive), mesh electrodes on the same substrate can be driven to the same potential; using mesh electrodes allows the mesh electrodes' potentials to be closer to each other across the substrate. This improves the transition from the closed state to the open state. The increased potential uniformity also reduces unwanted electrochemical processes driven by unwanted potential differences between the two electrodes.

[0012] The use of interlaced mesh electrodes makes the light modulator more homogeneous locally with respect to the electrical potential. Interlaced mesh electrodes also improve large-scale homogeneity; this is even more so when the electrode material is highly conductive.

[0013] The mesh electrodes intersect at multiple crossing points on the substrate. At such crossing points, there is a chance that current will flow from one mesh electrode to another. It is desirable to control the flow of such current. For example, a dielectric may be disposed between the two mesh electrodes to block both of these currents. In embodiments, the current may not always be blocked, but may be allowed when a predetermined criterion is met. For example, the current may be controlled to flow only when the potential difference between the two mesh electrodes is greater than a threshold value. For example, a current control component may be obtained by depositing and / or patterning a semiconductor at the crossing point. For example, a diode, such as a Zener diode, may be placed at the crossing point between the two mesh electrodes. The Zener diode may have two opposing junctions; alternatively, several spacers may include Zener junctions in different orientations.

[0014] When substrates are used in optical modulators, it is often desirable to keep the two substrates at a fixed distance from each other. Such a fixed distance can be achieved by placing a number of spacers between the two substrates. Advantageously, the spacers can be placed at the intersections, for example, above or below the interconnects at the intersections. This reduces the optical impact of the spacers. The spacers can include an electrically insulating material. The spacers can include a semiconductor material. The spacers are preferably transparent.

[0015] There may be additional spacers that are not located on the cross points. Such spacers may be insulating and may serve to keep the substrates in the optical modulator at a constant distance. Advantageously, additional spacers, particularly those not located at the cross points, may be conductive and may be configured to connect the mesh electrodes to connection points on the opposing substrate. Preferably, such spacers are transparent.

[0016] The spacer material is typically a dielectric that blocks current from flowing from one substrate to another, although the spacer may be configured to allow current flow if some predetermined condition is met, for example, if the potential difference between the mesh electrode on one substrate and the mesh electrode on the other substrate is above a threshold value.

[0017] The substrate according to the embodiment can be used in a light modulator, also known as an optical modulator. Dynamic glazing is an important application of light modulators. For example, a transparent or reflective substrate for applications such as dynamic glazing can have two mesh electrodes, each having multiple main lines. These main lines are arranged alternately on the substrate, so that an electric field can be established between subsequent or adjacent lines by applying a potential difference to the electrodes.

[0018] For example, two such substrates may be positioned opposite each other, such that application of a voltage to the electrodes allows movement of charged particles suspended in a fluid between the substrates. Typically, the electrode designs for the lower and upper substrates are identical, but this is not required. Similarly, the two designs are typically aligned with each other, but this is also not required. The particles may absorb or reflect light. The reflection may be specular, diffuse, or something in between. The particles may emit light, for example, with phosphorescence or fluorescence.

[0019] The light modulator provides a panel whose transparency or reflectivity, etc. can be modified. In embodiments, the color or color intensity, etc. may be changed. The light modulator may be used as a cover, for example, for a closed container, such as a cabinet. A particularly useful application is in dynamic glazing, also known as smart windows or optically active glazing.

[0020] In an embodiment, the controller is configured to apply a potential to electrodes on the substrate of the light modulator to obtain an electromagnetic field between the electrodes. This electromagnetic field causes electrophoresis of particles toward or away from the electrodes. As the particles change position, the optical properties of the panel, such as its transparency or reflectivity, change. If the particles are colored, the color of the panel may also change. By changing the electrode pair between which an electric field is established, the particles can be moved in a desired direction. The inventors have discovered that control of the light modulator need not be limited to simply changing the electrodes between which an electric field is applied or not, but can also include changing the maximum amplitude. It should be noted that an alternating current is advantageously used. For example, the rate of change in the light modulator is changed by driving with a lower maximum amplitude. This is advantageous because, for example, the maximum amplitude can be reduced to avoid overshoot when driving toward a desired target transparency or reflectivity. The maximum amplitude can also or alternatively be increased once driving toward the target transparency or reflectivity begins. For example, by using an AC voltage of one of a plurality of maximum amplitudes, the controller can be configured to obtain one of a plurality of levels of transparency or reflectivity in the light modulator. This relationship can be represented by an algorithm or the like. The relationship between the level of transparency or reflectivity and the maximum amplitude can be managed, for example, by a lookup table showing a series of maximum amplitudes that drive toward transparency or reflectivity. It should be noted that an AC voltage is also possible. The controller can be configured to interface between the mesh electrode and the power source.

[0021] The controller may be implemented as a single integrated device, such as a microchip, or may be distributed across multiple subcontrollers. The multiple subcontrollers may, for example, control different parts of the device. For example, there may be a subcontroller assigned to each substrate. The controller may be integrated with the substrate, for example, in the spacer, in the optical layer, on the substrate outside the optical layer, or may be external to the light modulator. The multiple controllers may communicate wirelessly or via wires. The controller may comprise one or more microchips that implement the functionality of the controller.

[0022] A further aspect of the invention is a building comprising a light modulator according to the embodiments to provide dynamic glazing. The light modulator may, for example, modulate the optical properties of a window pane. A further aspect of the invention is a vehicle comprising a light modulator according to the embodiments. For example, the vehicle and / or building may comprise a light modulator and a controller configured to control the transparency or reflectivity of the light modulator by controlling a voltage on an electrode of the light modulator, the controller being electrically connected or connectable to the light modulator.

[0023] A further aspect of the invention is a light modulator that may be applied in applications other than dynamic glazing.A further aspect of the invention is a substrate for use in a light modulator.

[0024] A further aspect of the present invention is a method for manufacturing a substrate and / or a light modulator, for example, for dynamic glazing. Interestingly, the substrate can be first manufactured in a default configuration, for example, a rectangular configuration, and then the substrate is cut into a desired shape, for example, a non-rectangular shape. The mesh electrodes retain their interconnectivity even when cut into a certain shape. This cutting can also be done, for example, after the substrate manufactured in the default configuration has been assembled into a light modulator including an optical layer. In this case, a seal can be applied to the edges of the cut light modulator.

[0025] Fabricating a substrate with multiple interlaced mesh electrodes can be done in a variety of ways, some of which have additional advantages, such as having all the main lines in the same plane, having all the main lines configured for fluid contact, e.g., exposed on the surface of the substrate, avoiding the use of vias, etc.

[0026] Dynamic glazing is an electronic device and may be driven, for example, by a power source under the control of a controller. For example, the controller may instruct the power source to apply specific waveforms to specific electrodes to achieve various transparency or reflectivity effects, or lack thereof. The controller may include a microprocessor.

[0027] The method embodiments may be implemented on a computer as a computer-implemented method, or in dedicated hardware, or a combination of both. Executable code of the method embodiments may be stored in a computer program product. Examples of computer program products include memory devices, optical storage devices, integrated circuits, servers, online software, etc. Preferably, the computer program product includes non-transitory program code stored on a computer-readable medium for performing the method embodiments when the program product is run on a computer.

[0028] In an embodiment, the computer program comprises computer program code adapted to perform all or part of the steps of the method embodiments when the computer program is run on a computer. Preferably, the computer program is embodied on a computer-readable medium.

[0029] Further details, aspects, and embodiments are described, by way of example only, with reference to the drawings, in which elements are illustrated for simplicity and clarity and are not necessarily drawn to scale, and in which elements corresponding to elements already described may have the same reference numerals. [Brief explanation of the drawings]

[0030] [Figure 1] 1A-1C are diagrams illustrating examples of embodiments of a substrate. [Figure 2a] 1A-1C are diagrams illustrating examples of embodiments of a substrate. [Figure 2b] 1A-1C are diagrams illustrating examples of embodiments of a substrate. [Figure 2c] 1A and 1B are schematic diagrams illustrating examples of embodiments of intersections; [Figure 3] 1A-1C are diagrams illustrating examples of embodiments of a substrate. [Figure 4] 1A-1C are diagrams illustrating examples of embodiments of a substrate. [Figure 5a] 1A-1C are diagrams illustrating an example of an embodiment for manufacturing a substrate. [Figure 5b] 1A-1C are diagrams illustrating an example of an embodiment for manufacturing a substrate. [Figure 5c] 1A-1C are diagrams illustrating an example of an embodiment for manufacturing a substrate. [Figure 5d] 1A-1C are diagrams illustrating an example of an embodiment for manufacturing a substrate. [Figure 5e] 1A-1C are diagrams illustrating an example of an embodiment for manufacturing a substrate. [Figure 6a] 1A-1C are diagrams illustrating an example of an embodiment for manufacturing a substrate. [Figure 6b] 1A-1C are diagrams illustrating an example of an embodiment for manufacturing a substrate. [Figure 6c] 1A-1C are diagrams illustrating an example of an embodiment for manufacturing a substrate. [Figure 6d] 1A-1C are diagrams illustrating an example of an embodiment for manufacturing a substrate. [Figure 6e] 1A-1C are diagrams illustrating an example of an embodiment for manufacturing a substrate. [Figure 6f] 1A-1C are diagrams illustrating an example of an embodiment for manufacturing a substrate. [Figure 6g] 1A-1C are diagrams illustrating an example of an embodiment for manufacturing a substrate. [Figure 7a] 1A-1C are diagrams illustrating an example of an embodiment for manufacturing a substrate. [Figure 7b] 1A-1C are diagrams illustrating an example of an embodiment for manufacturing a substrate. [Figure 7c] 1A-1C are diagrams illustrating an example of an embodiment for manufacturing a substrate. [Figure 8a] 1A and 1B are schematic diagrams illustrating examples of embodiments of intersections; [Figure 8b] 1A and 1B are schematic diagrams illustrating examples of embodiments of intersections; [Figure 8c] 1A and 1B are diagrams illustrating an example of an embodiment for manufacturing a crossover; [Figure 8d] 1A and 1B are diagrams illustrating an example of an embodiment for manufacturing a crossover; [Figure 8e] 1A and 1B are diagrams illustrating an example of an embodiment for manufacturing a crossover; [Figure 9a] 1A-1C are schematic diagrams illustrating examples of electrode embodiments. [Figure 9b] 1A-1C are schematic diagrams illustrating examples of electrode embodiments. [Figure 9c] 1A-1C are diagrams illustrating examples of embodiments of a substrate. [Figure 9d] 1A-1C are diagrams illustrating an example of an embodiment for manufacturing a substrate. [Figure 9e] 1A-1C are diagrams illustrating an example of an embodiment for manufacturing a substrate. [Figure 9f] 1A-1C are diagrams illustrating an example of an embodiment for manufacturing a substrate. [Figure 9g] 1A-1C are diagrams illustrating an example of an embodiment for manufacturing a substrate. [Figure 9h] 1A-1C are diagrams illustrating an example of an embodiment for manufacturing a substrate. [Figure 10a] 1A-1C are diagrams illustrating examples of embodiments of a substrate. [Figure 10b] 1A-1C are diagrams illustrating examples of embodiments of a substrate. [Figure 10c] 1A-1C are diagrams illustrating an example of an embodiment of cutting out a substrate. [Figure 10d] 1A-1C are diagrams illustrating an example of an embodiment of cutting out a substrate. [Figure 11a] 1A-1C are diagrams illustrating examples of embodiments of a substrate. [Figure 11b] 1A-1C are diagrams illustrating examples of embodiments of a substrate. [Figure 11c] 1A-1C are diagrams illustrating examples of embodiments of a substrate. [Figure 11d] 1A-1C are diagrams illustrating examples of embodiments of a substrate. [Figure 11e] 1A-1C are diagrams illustrating examples of embodiments of a substrate. [Figure 11f] 1A-1C are diagrams illustrating examples of embodiments of a substrate. [Figure 12a] 1A and 1B are diagrams illustrating examples of embodiments of optical modulators. [Figure 12b] 1A and 1B are diagrams illustrating examples of embodiments of optical modulators. [Figure 12c] 1 is a diagram illustrating an example of an embodiment of a vehicle; [Figure 13a] 1A and 1B are diagrams illustrating an embodiment of an optical modulator. [Figure 13b] 1A and 1B are diagrams illustrating an embodiment of an optical modulator. [Figure 13c] 1A and 1B are diagrams illustrating an embodiment of an optical modulator. [Figure 14a] 1A-1C are diagrams illustrating an example of an embodiment of a method for manufacturing a substrate. [Figure 14b] 1A-1C are schematic diagrams illustrating examples of embodiments of constructing mesh electrodes from main wires and interconnecting wires. [Figure 14c] 1A-1C are schematic diagrams illustrating examples of embodiments of building an optical modulator from a substrate. [Figure 14d] 1A-1C are schematic diagrams illustrating examples of embodiments for operating dynamic glazing. [Figure 15a] 1 is a diagram illustrating a computer-readable medium having a writable portion comprising a computer program according to an embodiment; [Figure 15b] FIG. 1 is a diagram that schematically illustrates a representation of a processor system according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0031] List of Reference Numbers The following list of reference symbols and abbreviations is provided to facilitate interpretation of the drawings and should not be construed as limiting the scope of the claims. 10 Optical Modulator 11 First substrate 12 Second board 13,13a,13b electrode 14,14a,14b electrode 15 Fluid 16 Controllers 30 particles 20. Automobiles 21 Optical Modulator 40 Optical Modulator 41 First substrate 42 Second board 43 Third Board 46 Controller 100 boards 101 First Direction 102 Second Direction 110 first mesh electrode 120 Second mesh electrode 111-113 Main line 121-123 Main line 151 Interconnect 200-205 PCB 210 first mesh electrode 211-215 Main line 221-223 interconnection line 230 Second mesh electrode 231-235 Main line 231' Main line passing below 241-243 interconnection line 251-253 intersection 254 Current Control Components 261-266 Main line 271-273 interconnection line 281 First mesh electrode 282 Second Mesh Electrode 283 Dielectrics 284.1, 284.2 via 285.1, 285.2 via 286 Interconnection Line 287 Cutting line 288 Distance between consecutive vias 291-293 Mesh electrodes Distances smaller than 294 Distance greater than 295 296 Interconnection Lines 297 Beer Group 301 First mesh electrode 302 Second mesh electrode 351 Interconnection Line 352 Insulator 400 boards 411 Electrical Connections 412 Cutting line 421 First Edge 422 Second Edge 431 First mesh electrode 432 Second mesh electrode 811 Second conductive pattern formation 812 First conductive pattern forming 821-823 Main line 831 Interconnection Line 842-844 Main line 851 Dielectric 852 interconnection lines 853 Spacer 901 Mesh electrode 902, 903 Main line 904 Interconnection Line 905, 906 Mesh electrodes 907 Dielectric 1210 first mesh electrode 1211 Second mesh electrode 1212 Dielectric 1213 Electrical Connection Foil 1214 Cutting line 1000, 1001 Computer-readable medium 1010 Writable area 1020 Computer Program 1110 Integrated Circuits 1120 Processing Unit 1122 memory 1124 dedicated integrated circuits 1126 Communication Elements 1130 Interconnect 1140 Processor System

[0032] While the subject matter of the present disclosure is susceptible to embodiment in many different forms, one or more specific embodiments have been shown in the drawings and are described in detail herein, it being understood that the present disclosure is to be considered as an example of the principles of the subject matter of the present disclosure and is not intended to be limited to the specific embodiments shown and described.

[0033] In the following, for the sake of understanding, elements of the embodiments are described in terms of their operation, although it will be apparent that each element is configured to perform the functions described as being performed by those elements. Furthermore, the subject matter disclosed herein is not limited to only the embodiments, but also includes all other combinations of features described herein or recited in mutually different dependent claims.

[0034] Figure 1 is a schematic diagram of an example embodiment of a substrate 100. There are at least two mesh electrodes arranged in a pattern across the surface of the substrate 100. Figure 1 shows two electrodes on the same surface: a first electrode 110 and a second electrode 120.

[0035] Electrodes 110 and 120 shown in Figure 1 are mesh electrodes. The fingers of the mesh electrodes are interconnected through multiple interconnects. Shown is one such interconnect: interconnect 151.

[0036] The first mesh electrode 110 and the second mesh electrode 120 each include a plurality of main lines. As shown in FIG. 1 , the first mesh electrode 110 includes main lines 111, 112, and 113, and the second mesh electrode 120 includes main lines 121, 122, and 123. Typically, each mesh electrode may include more than three lines. The main lines extend across the substrate. The mesh electrodes are, or can be, electrically isolated from one another. The main lines of the first and second electrodes are arranged alternately with respect to one another on the substrate. The main lines extend across the substrate in a first direction 101. When viewed in a second direction 102, the main lines are alternately encountered from different main lines, e.g., the first and second main lines of the first and second mesh electrodes, respectively. The first and second directions form an angle with each other; this angle may be approximately perpendicular, but is not required. The first and second directions may each be parallel to a side of the substrate, but this is not required.

[0037] Interleaved mesh electrodes, such as those shown in Figure 1, are combs interleaved with each other in pairs. Each mesh electrode in this figure has connecting lines that, in this case, run along the left and right sides of the substrate without intersecting the main lines. Note that, due to the presence of the interconnects, such connecting lines are not necessary and, in fact, are preferably avoided.

[0038] The two mesh electrodes are interlaced; for example, each of the mesh electrodes comprises multiple main lines arranged alternately on the substrate. Such an alternating arrangement is also referred to as interdigitated. These mesh electrodes have increased internal connectivity through interconnects. For example, there are multiple electrical paths from most or even nearly all of the main lines to electrical connectors.

[0039] More than two electrodes can be present on the same side of the substrate, for example, to facilitate finer-grained control. For example, when three or more mesh electrodes are used on a single substrate, different voltages can be applied to the mesh electrodes, causing effects on particles that cannot be achieved with two mesh electrodes. For example, multiple electrodes can be used to facilitate segmented substrates, for example, for segmented light modulators. For example, in segmented light modulators, some zones can have different optical properties, such as different transparency or reflectivity. While embodiments with two electrodes are shown below, additional electrodes can be added to the two, for example, by replicating similar structures next to each other.

[0040] At least a portion of first mesh electrode 110 and second mesh electrode 120 are applied to the same side of the substrate. For example, the main lines may be in fluid contact with the fluid in the optical layer. In this case, interconnects such as interconnect 151 may be applied in a different layer or plane as the main lines. This may be, but is not required to be, such that in different arrangements, some of the main lines are not in fluid contact, e.g., to electrically isolate mesh electrodes 120 and 110 in different ways.

[0041] These two electrodes are arranged in a pattern across the substrate. For example, one, two, or more electrodes may be present on the other surface of substrate 100 to facilitate stacking of three or more substrates. Applying the electrodes to the substrate can be done, for example, by photolithography using a mask representing the electrode pattern. Electrodes can also be applied by embedding them into the substrate.

[0042] Two or more substrates, such as substrate 100, can be combined into a light modulator. A prime example of an application for a light modulator is dynamic glazing, also known as smart glazing, which can be applied to homes, offices, greenhouses, automobiles, and the like. The optical properties, such as the level of transparency or reflectivity, of the dynamic glazing can be electrically tailored. For example, in dynamic glazing, two substrates, such as substrate 100, can be stacked so that the sides to which the two electrodes are applied face each other. A fluid containing particles is enclosed between the two substrates and is known as the optical layer. The particles are charged or can be charged. The optical properties that are changed can depend on various factors, including the type of particle. For example, if the particles absorb light, a change in transparency can be obtained. For example, if the particles reflect, a change in reflectivity can be obtained.

[0043] By generating an electromagnetic field between different mesh electrodes, e.g., between mesh electrodes on the same substrate or between mesh electrodes on opposing substrates, particles can be moved towards or away from one of the multiple mesh electrodes by electrophoresis, causing modulation of the optical properties of the light modulator.

[0044] For example, the non-transparent or non-reflective state may be switched by creating an AC voltage on at least one of the first and second substrates and applying an AC current between at least the first and second mesh electrodes on the first substrate and / or the first and second mesh electrodes on the second substrate.

[0045] For example, the transparent or reflective state may be switched by creating an AC voltage between the first substrate and the second substrate and applying an AC current between a first mesh electrode on the first substrate and a first mesh electrode on the second substrate and / or between a second mesh electrode on the first substrate and a second mesh electrode on the second substrate.

[0046] Where mesh electrodes cross each other, there are intersections. Figure 1 shows one interconnect 151 having an intersection with a main line 112. Typically, there are many intersections. They can be distributed in a regular pattern across the substrate. They can also be distributed in a random pattern across the substrate.

[0047] In an embodiment, a plurality of interconnects extend in a second direction. In the example shown, interconnects 151 extend in a second direction 102 that is orthogonal to first direction 101, the direction in which the main lines extend. A perpendicular or substantially perpendicular angle is convenient, but not required. The angle between the interconnects and the main lines affects diffraction in the light modulator. For example, in an embodiment, the angle varies, for example, in a pattern or randomly across the substrate to reduce diffraction.

[0048] A controller may be electrically connected to the plurality of electrodes. The controller may control an electric field between the electrodes. For example, the controller may include a processor and a connected memory. The memory includes processor instructions for execution by the processor. The processor instructions cause the processor to control the electric field. In an embodiment, the controller includes a sub-controller for each substrate.

[0049] In FIG. 1, the main lines of the mesh electrodes are connected to connecting lines that connect the main lines of the mesh electrodes to each other without crossing another mesh electrode on the substrate, and in FIG. 1, the connecting lines extend to the left for electrode 120 and to the right for electrode 110. Interestingly, the mesh electrodes do not require such connecting lines. If the connecting lines were removed from FIG. 1, a voltage or current could be applied to both mesh electrodes from any point along the left or right edge of substrate 1. This is useful, for example, in installing substrate 100 in certain dynamic glazing applications, such as in a light modulator. Dynamic glazing embodiments are discussed further elsewhere in this document.

[0050] In an embodiment, an electrode, e.g., two or more electrodes, is applied to one surface of each substrate. One, two, or more electrodes may be present on the other surface of substrate 100, e.g., to facilitate stacking of three or more substrates.

[0051] Some of the following embodiments illustrate examples of modulating transparency or reflectivity levels. Light modulators can be adapted for other optical effects. For example, embodiments can be modified for different translucency levels, rather than different transparency levels, if desired. If desired, the types of particles used in embodiments can be varied, for example, to particles that absorb or reflect different wavelengths and how specular or diffuse the reflection is. For example, in embodiments, light modulators can modulate different reflectivity levels. Particles can also emit light. Stacking multiple optical layers further increases the possibilities.

[0052] Having two sets of alternating main lines is sufficient to provide electrically adaptable glazing; due to the two alternating sets, the electric field in any part of the substrate can be controlled when two opposing electrodes border the part from two opposing sides. Instead of being straight as shown in FIG. 1, the lines can be modified in many ways. For example, the shape of lines, such as main lines or interconnecting lines, can be modified, for example, making them wavy instead of straight. For example, short branch lines extending from the main lines or interconnecting lines can be added. Such modifications can change the diffraction of the display, and in particular reduce diffraction. These modifications are not shown in the figures, but can be added as needed.

[0053] FIG. 2a is a schematic diagram illustrating an example embodiment of a substrate 200. The substrate 200 can be used for dynamic glazing. Multiple mesh electrodes are applied to the substrate 200: two mesh electrodes are shown in FIG. 2a: mesh electrode 210 and mesh electrode 230. These two mesh electrodes can be used to create an electromagnetic field between them. When an optical fluid is used, such an electromagnetic field can be used to cause electrophoresis of particles toward or away from the electrodes. Two mesh electrodes are sufficient to create a light modulator, e.g., dynamic glazing, but better control of the electromagnetic field is possible when more than two mesh electrodes are present.

[0054] In this embodiment, each of the plurality of mesh electrodes comprises a plurality of main lines extending in a first direction. For example, mesh electrode 210 comprises a plurality of main lines: shown are main lines 211, 212, 213, 214, and 215. For example, mesh electrode 230 comprises a plurality of main lines: shown are main lines 231, 232, 233, 234, and 235.

[0055] Producing long, thin electrode lines, such as these main lines, can be susceptible to manufacturing defects. If a main line is connected to the controller through only a single path, a notch in that main line may electrically isolate the main line after the break. In dynamic glazing, this may be seen as a loss of controllable area, e.g., a line failure. For example, a line failure may be visible in a grayscale panel as a black line. Adding interconnects, e.g., interconnect lines, mitigates this issue.

[0056] In the illustrated embodiment, the main lines of the multiple mesh electrodes, e.g., mesh electrodes 210 and 230, extend in the same direction, e.g., first direction 101, e.g., they are parallel. The main lines can be used to control the optical properties of the light modulator. It should be noted that the main lines of the multiple mesh electrodes are arranged on the substrate in an interspersed, alternating pattern. Such a pattern is also referred to as interdigitated. For example, the main lines of mesh electrodes 210 and 230 are arranged one after the other; two by two, arranged in sequence on the substrate.

[0057] The main wires of the mesh electrode are connected to one another through a plurality of interconnection lines, which electrically connect the main wires of the mesh electrode together, and in particular, the main wires of the mesh electrode are connected to other main wires of the mesh electrode through a plurality of interconnection lines.

[0058] For example, the main lines of mesh electrode 210 are connected to other main lines of the same mesh electrode through multiple interconnect lines: shown are interconnect lines 221, 222, and 223. For example, main lines 211 and 212 are connected through interconnect line 221; main lines 213 and 214 are connected through interconnect line 222, etc. Similarly, the main lines of mesh electrode 230 are interconnected through interconnect lines: shown are interconnect lines 241, 242, and 243. In practice, there may be more than the five main lines shown for those two mesh electrodes; and there may be more than the three interconnect lines shown for each mesh electrode.

[0059] An interconnect line crosses another mesh electrode to form a crossing point. For example, interconnect line 221 connects two main lines of mesh electrode 210, but crosses main line 231 of mesh electrode 230. Six crossing points are shown in FIG. 2a, one for each interconnect line. An intersection point is marked with a dashed circle and reference number 251. In practice, there may be more crossing points.

[0060] The interconnect lines are connected to mesh electrodes that have the same potential when the substrate is used in an optical modulator, and in an embodiment, the lines of different potential are insulated from each other at their crossing points or cross sections by intermediate dielectrics.

[0061] In addition to increasing the substrate's service life by protecting electrodes from unwanted disconnections, such as those caused by minor defects during manufacturing or due to device aging, interconnects have another surprising benefit. Long, thin lines impose limitations on the scale of optical modulators because their resistance increases with their length. As a result, the electromagnetic field is not uniform. Adding interconnect lines improves the uniformity of the electromagnetic field, especially when mesh electrodes on the substrate are powered from the same edge or even the same point on the edge of the substrate, resulting in more uniform transparency or reflectivity levels.

[0062] The multiple intersection points can be distributed in various ways across the substrate. For example, the multiple intersection points can be randomly distributed across the substrate. For example, the multiple intersection points can be distributed in a regular pattern. For example, the distribution can be the result of an optimization process, such as optimizing for diffraction, homogeneity, or possibly other desirable properties.

[0063] It may be beneficial to connect a main line to one or more other main lines of the same mesh electrode, for example, to protect a particular main line from being cut. It may be beneficial, but not necessary, for all main lines to be provided with interconnect lines. For example, in embodiments, the number of main lines in a mesh electrode having at least two interconnect lines may be at least 2, at least 10, at least half of the number of main lines, at least 90% of the main lines, or substantially all of the main lines. For example, in embodiments, a main line may be connected to at least two, at least four, at least eight, or at least 16 interconnect lines. For example, a main line may be connected to an interconnect line within a distance of the edge of the substrate, the distance being less than 10%, less than 10 cm, less than 5 cm, etc., of the length of the main line.

[0064] In embodiments, a substantial portion of the mesh electrodes on the substrate are exposed above the surface of the substrate, thereby providing fluid contact with the optical layer when the substrate is used in a light modulator. It is not necessary for all of the mesh electrodes to be exposed in this manner. For example, at an intersection, a first of two intersecting mesh electrodes may extend under a second of the two intersecting mesh electrodes, resulting in a portion of the first mesh electrode not being exposed and therefore not in fluid contact. However, this non-exposed portion does not significantly affect the optical properties of the light modulator. For example, a substantial portion of the mesh electrodes, e.g., at least 80%, 90%, etc., may be arranged to be in fluid contact. For example, in embodiments, all of the main lines may be in fluid contact.

[0065] The substrate shown in FIG. 2a can be manufactured, for example, by performing the following operations.

[0066] A first mesh electrode is patterned on the substrate, the mesh electrode comprising a plurality of main lines and a plurality of interconnect lines, in an embodiment, the main lines may be regularly distributed across the substrate, while the plurality of interconnect lines may be randomly distributed.

[0067] - Patterning electrically insulating areas (also called islands or patches) on top of the interconnect lines, in particular on the interconnect lines where the second mesh electrode crosses, and on top of the main lines of the first mesh electrode that will later be crossed by the interconnect lines of the second mesh electrode.

[0068] - patterning a second mesh electrode on the substrate, the second mesh electrode also including a plurality of main lines and a plurality of interconnecting lines; the plurality of main lines of the second mesh electrode may be interdigitated with main lines of the first plurality of main lines; the main lines of the second mesh electrode intersect with the interconnecting lines of the first mesh electrode where insulating islands are patterned; and the interconnecting lines of the second mesh electrode intersect with the main lines of the first mesh electrode where insulating islands are patterned on the main lines of the first mesh electrode.

[0069] Using a regular pattern for the main lines, e.g., equal distance between the main lines of the first and second mesh electrodes, creates a homogeneous electric field. Random distribution of interconnecting lines reduces the contribution to diffraction. The above fabrication is scalable to more than two mesh electrodes.

[0070] In the above manufacturing, the electrode lines do not have to be at the same level. It is also possible to place the main lines at the same level on the entire surface of the dielectric. For example, the main lines of all mesh electrodes can be patterned, and the interconnects can be placed below the dielectric, for example, covering the entire surface. The electrical connection between the interconnects and the electrode lines can be made using vias, for example, holes in the dielectric at specific locations of the intersections, and covered with metal. Typically, the substrate is itself a dielectric.

[0071] Regardless of how the interconnection lines are placed, they prevent loss of electrical connection due to, for example, breakage during production or due to galvanic corrosion of the lines. This structure increases production yields and also extends the life of the product.

[0072] Interestingly, the interconnects improve resistance reduction at greater distances from the substrate connector. In conventional interdigitated lines, very thin electrodes have significant resistance, especially for very large displays. By having interconnects between the interdigitated lines, the electrodes become mesh electrodes from an electrical point of view. This causes a reduction in the resistance of the electrical tracks and a better distribution of the electric field, resulting in greater uniformity in the device's operation.

[0073] This interconnection allows the mesh electrodes to receive power from points close to each other, such as the same edge or connector, offering several advantages. Without interconnection lines, for example, when powered from opposing edges of the substrate, localized potential differences may exist between the main wires even with the same input voltage. In a fixed area of ​​the device, this difference is created by the distance from the connector, creating a specific electrode wire resistance. This distance, and therefore resistance, differs between the two interdigitated electrodes and varies across the substrate when the area under consideration is closer to one connector or the other. As shown in Figure 2a, the end of electrode wire 215 is significantly longer than the points on electrode wires 235 or 234 near the end of electrode wire 215. Such a potential difference creates a DC shift, thus maintaining a fixed, low rate of electrolytic corrosion. For example, it is often desirable for neighboring main wires on a substrate to have the same potential, which can be used, for example, when the display is open (also known as being driven vertically). However, without interconnect lines, e.g., mesh electrodes, a slight horizontal electric field is still generated due to the fact that two opposing points have different distances to the connector, e.g., when measured along their main lines. This slight, undesirable potential difference on the substrate interferes with the electric field direction and display performance. Therefore, the use of interconnect lines can be used to ensure that opposing points on nearby main lines have closer potentials when corresponding mesh electrodes have the same input voltage.

[0074] FIG. 2b is a schematic diagram illustrating an example embodiment of substrate 201. If finer control of particle movement is desired in a light modulator, such as one used in dynamic glazing, more electrodes can be added to the substrate. For example, in a light modulator, at least two electrodes are present on each substrate, although more than two electrodes may be present. For example, at least three electrodes may be applied to at least one of the first and second substrates. For example, in an embodiment, two electrodes may be applied to the first substrate and three electrodes may be applied to the second substrate. For many examples of configurations with different numbers of electrodes, which may be implemented as mesh electrodes, see, for example, U.S. Patent Application No. 16 / 994,918, incorporated herein by reference.

[0075] A system in which one substrate has at least two electrodes and the other substrate has at least three electrodes has various advantages. For example, such a light modulator can be driven to reduce the so-called curtain effect. This curtain effect occurs when a window is closed, making it appear as if a curtain is drawn between the electrodes. This curtain effect is a drawback, inherently visually distracting, and further increases diffraction. On the side with three electrodes, the electrodes can be closer than on the side with two electrodes, for example, less than 50 micrometers, more preferably less than 40 micrometers, e.g., closer than 35 micrometers. This means that the electric field is stronger. Correspondingly, closing is faster and the curtain effect is reduced. Moving the electrodes closer together using a 2+2 panel would result in a decrease in maximum transparency or reflectivity. However, this can be avoided if additional electrodes are available. When open, some of the additional electrodes may be unused, thus resulting in only a small loss in maximum transparency or reflectivity. Additional electrodes on the substrate, for example, more than two electrodes, can be configured to not attract particles when the panel is open but to attract particles when the panel is closed. For example, a panel in which each substrate has at least two electrodes can have a total of at least four electrodes. The substrates in the panel can have at least five electrodes, such as in a 2+3 design; or at least six electrodes, such as in a 2+4 or 3+3 design; or at least eight electrodes, such as in a 4+4 design, or when two 2+2 designs are stacked together using three substrates, the middle substrate has two electrodes on each side.

[0076] Substrates with more than two electrodes can also benefit from the use of mesh electrodes. For example, at least three mesh electrodes can be applied to the substrate. The same techniques as for two electrodes can be extended to three electrodes. For example, FIG. 2b shows a substrate 201 with three mesh electrodes: a first mesh electrode showing main lines 261 and 264 and interconnect line 271; a second mesh electrode showing main lines 262 and 265 and interconnect line 272; and a third mesh electrode showing main lines 263 and 266 and interconnect line 273. The interconnect lines of the mesh electrodes intersect with one or more main lines of other mesh electrodes on the substrate. For example, in this case, interconnect line 271 has two intersection points: intersection points 252 and 253. These intersection points can be made as in the embodiment with two mesh electrodes. For example, a dielectric can be placed between the interconnect lines, e.g., interconnect line 271, and the main lines of the other mesh electrodes. Depending on the manufacturing method, the interconnect lines may be in a different plane than the mesh electrodes; the mesh electrodes may be in the same plane or a different plane.

[0077] Substrate 201 employs three mesh electrodes, although more mesh electrodes, such as four or more, may be used. When the substrate is used in an optical modulator, the opposing substrate may also have at least three, four, or more mesh electrodes. The opposing substrate may have a different number of electrodes.

[0078] FIG. 2c is a schematic diagram illustrating an example of an embodiment of an intersection point. FIG. 2c shows two main lines 211 and 212 belonging to the same first mesh electrode. For example, the two main lines may be main lines of mesh electrode 210. FIG. 2c also shows an interconnection line 221 between main lines 211 and 212. Interconnection line 221 intersects with main line 231 of a different second mesh electrode, creating an intersection point. Because different mesh electrodes sometimes need to have different potentials and sometimes need to have the same potential, it is important that the potentials of the first and second mesh electrodes be controllable independently of each other.

[0079] This can be achieved by disposing the current control component 254 between the interconnect line 221 and the main line 231. Part of the interconnect line 221 runs under the current control component 254, while the interconnect line 221 runs above it. The part of the main line 231 that runs under the current control component 254 is indicated by a dashed line and reference number 231′. The reverse is also possible, for example, the interconnect line 221 runs partially under the current control component 254, and the main line 231 runs above it. The latter has the advantage that the entire main line is accessible to fluid contact at the light modulator.

[0080] Typically, the current control component 254 is made of a transparent material. The current control component 254 may include only a semiconducting material or an insulating material. For example, the component 254 may include an inorganic material, such as silica, or an organic material, such as polyamide, photoresist, acrylic resist, etc.

[0081] The current control component controls the current that can flow between the main line 231 and the interconnect line 221 between the two mesh electrodes. An often used option for the current control component is to use a dielectric; in this case, the current is controlled by blocking it.

[0082] Another option for the current control component is to configure it to pass current when the potential between interconnect line 221 and main line 231 meets a criterion. For example, if the voltage difference between interconnect line 221 and main line 231 is high, e.g., if the voltage difference is higher than a threshold, current may be allowed to pass through current control component 254. For example, if the voltage difference between interconnect line 221 and main line 231 is low, e.g., if the voltage difference is lower than a threshold, current may be blocked and not allowed to pass through current control component 254. Note that interconnect line 221 is part of the same mesh electrode as main line 211. Therefore, if the potential difference between the first and second mesh electrodes is high, e.g., at the crossing point, e.g., higher than the threshold of the current control component, current may be allowed to pass between the first and second mesh electrodes. Various semiconductor components exist for controlling current; for example, the current control component may be a Zener diode.

[0083] In an embodiment, the Zener diode comprises two back-to-back Zener junctions in series with opposite polarities. If the voltage difference is greater than a threshold T or less than a threshold −T, current can flow; otherwise, it does not. Such a Zener diode prevents large voltage differences that would otherwise damage the system, e.g., so-called overvoltages. Zener diodes are also useful when the connection points of the mesh electrodes are significantly separated.

[0084] For example, an interdigitated pattern in which the interconnect lines are equipped with current-controlling components such as Zener diodes has several advantages, such as when the display is open (also known as vertical drive). This drive can be done at high voltages. The diodes pass current for both high positive and negative voltages. At higher voltages, the mesh density increases because the current-controlling components connect two mesh electrodes. In the open phase, it is preferable to have mesh electrodes on the same substrate at the same potential. This is also beneficial for product lifespan.

[0085] In one example, the open drive is 24V AC across both Mesh 1 and Mesh 2 of the substrate. The Zener diodes are configured to pass current when the potential difference is greater than 23V. Thus, if a portion of Mesh 1 breaks and becomes insulated, Mesh 1 will be at 0V, but Mesh 2 will be at 24V. At that point, the Zener diodes become conductive, causing Mesh 1's potential to equal that of Mesh 2, in this case 24V. Closing Mesh 1 may result in a potential of 10V, in one example, and Mesh 2 may therefore be at a potential of -10V. The potential difference across the Zener diode is therefore 20V, which is less than 23V, and therefore the Zener diode blocks the current, meaning a horizontal electric field has been created.

[0086] When closing the device (also known as horizontal drive), it is advantageous to insulate each of the mesh electrodes so that this horizontal drive only occurs at low voltages, preventing conduction through the Zener diodes.

[0087] It is possible that a portion of the electrode mesh 1 becomes insulated. This can occur, for example, when there are two breaks between the two interconnects. In that case, there is a floating wire. Using a Zener diode approach to the dielectric interconnect of the second mesh helps to discharge that insulated portion. Driving at high voltage charges the electrode portion of mesh 1. When the device is closed, the Zener diode from the interconnect of mesh 2 discharges the insulated branch wire until it is below the potential that activates the Zener diode. Therefore, this portion of the electrode mesh 1 does not remain transparent as the device is driven to the opaque state.

[0088] FIG. 3 is a schematic diagram illustrating an example embodiment of a substrate. Shown in FIG. 3 are portions of two mesh electrodes 301 and 302. The main lines of the two mesh electrodes are shown on the left with the reference numbers of the two mesh electrodes 301 and 302, respectively. Shown in FIG. 3 are interconnect lines 351 and insulators 352. The insulator insulates the two mesh electrodes 301 and 302 from each other. Note that some of the interconnect lines shown in FIG. 3 connect the two main lines of mesh electrode 301, and some of the interconnect lines connect the two main lines of mesh electrode 302.

[0089] In the embodiment of FIG. 3 , the main lines are wavy rather than straight, but the interconnecting lines are straight. Additionally or alternatively, the interconnecting lines may be wavy. Using non-straight lines has the advantage of having a lower effect on diffraction and, because many possible non-straight lines exist, their effect on diffraction can be optimized. The contribution of an electrode line to diffraction depends on its shape, and changing the shape can change this contribution. For example, wavy lines can be constructed by connecting shapes such as line segments, semicircles, and sinusoidal shapes. While FIG. 3 shows two mesh electrodes, more non-straight mesh electrodes may be combined.

[0090] FIG. 4 is a schematic diagram illustrating an example embodiment of a substrate 400. Shown in FIG. 4 are multiple mesh electrodes, in this example, two mesh electrodes 431 and 432. Each of the mesh electrodes includes multiple main lines and multiple interconnecting lines. The substrate has four edges. Two opposing edges have reference numerals: edge 421 and edge 422. Edges 421 and 422 are positioned to align with the main lines of all of the mesh electrodes. For example, the main lines of mesh electrode 4341 and mesh electrode 432 reach edges 421 and 422.

[0091] Connector 411 is disposed on edge 421, which is electrically connected to all of the mesh electrodes, for example, one or more main wires of mesh electrodes 431 and 432. A controller can conveniently control all of the mesh electrodes by connecting the controller to connector 411. For example, connector 411 may have an interface for connecting a wire to connector 411. The other end of the wire may be connected to the controller. For interconnection, connector 411 may be disposed on one edge of the substrate, or even at a point on one edge of the substrate.

[0092] Preferably, the connection points on the substrate (whether after cutting or not) where the mesh electrodes connect to a power source, e.g., a cable connected to a controller, are close to each other. For example, the connection points may be on the same edge of the substrate. These connection points do not necessarily have to be on an edge. The connection points can also be on the substrate, e.g., on the back side of the substrate opposite the mesh electrodes. Still, it is preferable that the connection points are close together. For example, the connection points may be within a single connector. For example, the connection points may be no more than 10 cm or no more than 5 cm from each other.

[0093] The use of mesh electrodes has the additional important advantage that the substrate can be cut into various shapes. For example, substrate 400 may be manufactured in a rectangular form. However, once the rectangular form is created, it can be cut into different shapes. FIG. 4 shows cutting lines 412 in the form of thick dashed lines along which substrate 400 can be cut. An unlimited number of shapes can be cut from substrate 400 without modifying the fabrication of the substrate itself. Even after the substrate is cut, connectors 411 connect all of the mesh electrodes. In conventional designs without interconnecting lines, cutting the design is not possible because the main lines are susceptible to breakage.

[0094] The substrates may be cut before or after the two substrates are combined into a light modulator. For example, in an assembly comprising at least two substrates, an optical layer with fluid and particles between the two substrates can form a light modulator. The assembly may be cut after assembly to obtain a light modulator of a particular shape.

[0095] Non-rectangular substrates can be provided by first fabricating a rectangular substrate and then cutting it. Connection points can be allocated on the substrate. For example, an electrical connector can be provided at a single point for a mesh electrode on the substrate.

[0096] A connector such as connector 411 may be attached to the optical modulator before or after cutting. For example, the connector may be attached to the edge of the substrate, and the connector may be connected to all of the mesh electrodes on the substrate, or even all of the mesh electrodes on both substrates. Alternatively, the connector may be connectable to a controller.

[0097] It is possible to obtain machinability of the device without electrical breakdown. The cut may even include a hole. Upon cutting, the cut edges of the substrates may be closed, for example by melting or gluing. The closure keeps the fluid between the substrates.

[0098] Cutting the device after module fabrication can remove the device encapsulation. A welding process can be used to recreate the module insulation / encapsulation after cutting. Fusing is particularly efficient for plastic substrates. Fusing can be done using, for example, a laser, which can also be used for the cutting itself. Glass substrates can also be cut and sealed. If the cut is made before assembly at the substrate level, it can be cut without leaving any edges accessible.

[0099] An edge strip of contact foil can be placed on the edge of the module, and if the cut is made ensuring that a small edge is left corresponding to the distance between the two interdigitated electrode lines, the device will function.

[0100] Yet another advantage of using interconnect lines is that the light modulator is highly resistant to damage. For example, if a portion of the light modulator is accidentally severed due to a collision with an object, the light modulator remains functional. If fluid leaks due to the collision, this can be stopped by gluing, melting, or otherwise closing the severed portion of the light modulator.

[0101] In an embodiment, the controller is electrically connected to the multiple mesh electrodes on the substrate at a connection area on the substrate. Connecting through such a connection area equalizes the distance to the power source, thus minimizing the difference in potential between two points on two consecutive main lines of the two mesh electrodes that are opposite each other. For example, the connection area may be formed by a connector connected to one or more substrates. For example, the connection points on the substrate in the connection area may be close to each other, e.g., at most 10 cm, at most 5 cm, at most 1 cm, or even closer. Connecting to the mesh electrodes close to each other reduces the resistance to a location on the substrate, e.g., to two opposite points on opposing main lines, to each other. In an embodiment, the resistance from points on opposing main lines to the power source is within a range of 10%, 5%, 1%, and below (e.g., measured as a percentage of the smaller resistance, i.e., the larger resistance minus the smaller resistance).

[0102] The connection area may be at the edge of the substrate or on the backside of the substrate, etc.

[0103] There are several ways in which substrates according to embodiments can be manufactured. For example, methods for manufacturing substrates used in light modulators for dynamic glazing include: - providing a substrate, for example a dielectric substrate, such as a plastic or glass substrate; applying a plurality of interlaced mesh electrodes on a substrate, the plurality of interlaced mesh electrodes extending in a two-dimensional pattern across the substrate, and two mesh electrodes of the plurality of mesh electrodes on the substrate intersecting at a plurality of intersection points distributed across the substrate; may include:

[0104] For example, applying a mesh electrode can include applying a plurality of main lines and a plurality of interconnect lines. Applying the electrodes, e.g., main lines and / or interconnect lines, can be done, for example, by patterning using thin-film techniques such as spin coating, flexographic printing, slit coating, etc., using a conductive material deposition followed by an etching process, photolithography with laser patterning, etc. For example, the electrode can be applied by coating with a layer of conductive material, e.g., metal, and partially removing the coating to leave the electrode. Applying can be done using direct printing. Mesh electrodes can also be created by directly patterning a conductive photoresist using conventional photolithography processes, or by direct laser writing, etc.

[0105] The fabrication method may also include aligning current-controlling components at the intersections between two mesh electrodes, for example, between main lines and interconnect lines, for example, by patterning insulating patches or islands on the main lines and / or interconnect lines. Interconnecting conductive lines may be obtained by following similar production techniques as used for electrode mesh patterning.

[0106] There are many ways in which such manufacturing methods can be varied or changed, examples of which are provided herein.

[0107] 5a-5e are schematic diagrams illustrating an example embodiment for manufacturing a substrate.

[0108] FIG. 5a shows the provision of a substrate. For example, the substrate may be a plastic or glass substrate. In FIGS. 5b and 5c, multiple interconnect lines are patterned on the substrate. FIG. 5b shows the deposition of a conductive layer onto the substrate for patterning, and FIG. 5c shows the result after patterning. In this example, the interconnect lines are applied to the substrate before the main lines. In this example, the interconnect lines are insulated from each other after the patterning step. In this example, the interconnect lines are patterned by photolithography and / or etching processes. For example, the interconnect lines can be applied by directly printing in the expected pattern via techniques such as inkjet printing, screen printing, etc. To improve the resolution of the printed process, additional local photolithography or dry etching can be performed after printing to thin the lines.

[0109] In Figure 5d, the substrate is coated with a dielectric layer. Holes are created in the dielectric to create vias. In this example, interconnects are created underneath the interdigitated pattern and are separated from the mesh electrodes by a dielectric layer. Figure 5e shows the application of multiple main lines to multiple mesh electrodes, in this case two mesh electrodes. The main lines of the multiple electrodes are alternately positioned relative to each other on the substrate. Note that these main lines are connected to the interconnect lines applied in Figure 5c through vias. These vias connect the applied main lines within the multiple mesh electrodes. In this process, all of the main lines lie in the same plane parallel to the substrate, but the interconnect lines lie in different planes.

[0110] Beneficially, when the substrate is used in an optical modulator, all of the principal lines are in fluid contact with the optical layer, but none of the interconnects are in fluid contact. A drawback of these processes shown in Figures 5a-5e is that a dielectric layer remains everywhere across the surface. Such a pervasive dielectric layer can alter the optical performance of the device. The disadvantage of the remaining dielectric layer can be overcome by additional patterning of that layer, but this adds complexity.

[0111] This can be avoided by using an alternative manufacturing process that may still use photolithographic processes, but that does not leave any dielectric layers behind and does not require vias for connections. Figures 6a-6g show schematic diagrams of example embodiments for manufacturing a substrate.

[0112] FIG. 6a shows providing a substrate. FIG. 6b shows coating the substrate with a first conductive layer. FIG. 6c shows the result after patterning the first conductive layer to form interconnects. In this example, the interconnect lines are applied to the substrate before the main lines. Unlike FIG. 5c, the interconnect lines are not insulated from each other after this patterning process. The interconnect lines are patterned by removing the conductive material above and below them. However, at the ends of the interconnect lines, the conductive material in FIG. 6b is not removed. The latter material will be used later to connect to the mesh electrodes instead of using vias. In this example, the interconnect lines are patterned by photolithography and / or etching processes.

[0113] Figure 6d shows the coating, e.g., deposition, with a dielectric layer. The dielectric layer is patterned to obtain insulating patches on the interconnect lines shown in Figure 6c. The result is shown in Figure 6e. Alternatively, the dielectric layer can be deposited locally. This dielectric only remains to cover the area of ​​the interconnect.

[0114] Figure 6f shows the deposition of a second metal layer covering the entire substrate. This substrate is patterned in Figure 6g to expose the interdigitated main lines. Note that the latter patterning removes part of the coating shown in Figure 6f and part of the coating shown in Figure 6b. Figure 6g shows the result of the patterning. For the most part, the main lines include two metal layers: one layer deposited in Figure 6b and the other layer deposited in Figure 6f. Only the parts where the main lines go over the insulating patches use only a single layer.

[0115] 7a-7c are schematic diagrams illustrating an example embodiment of fabricating a substrate, whereby a plurality of main lines of at least two mesh electrodes are printed or patterned onto the substrate, as shown in FIG.

[0116] In Figure 7b, a dielectric material is printed onto the main lines. Figure 7c shows printing a conductor material onto the dielectric to join two main lines of the same mesh electrode. In an embodiment, the patterning of the main lines is combined with the direct printing of dielectric patches and interconnect lines.

[0117] In an embodiment, the dielectric can be printed in black and thus used as an optical mask to pattern a thick resist on top via photolithography, which can be used as a spacer when the substrate is mated with a second substrate into a light modulator.

[0118] This dielectric may also be used as a spacer itself, for example by making it thick enough, which may be done by ensuring that electrodes from other substrates in the optical modulator are not in the same position, although the latter may be possible if, for example, insulation is placed between them.

[0119] Note that in the embodiment of Figures 7a-7c, the main lines of the mesh electrode lie in the same plane, parallel to the substrate.

[0120] Figure 8a is a diagram illustrating an example embodiment of an intersection. For example, the intersection of Figure 8a can be created using a process such as that illustrated with Figures 6a-6g. A lower level of Figure 8a is illustrated schematically in Figure 8b.

[0121] Shown in Figures 8a and 8b are three main lines: main lines 821, 822, and 823. Main lines 821 and 823 belong to the same first mesh electrode. Main line 822 belongs to a different second mesh electrode. Main lines 821 and 823 are connected through interconnect line 831. Interconnect line 831 runs under dielectric 851, as seen in the plan view of Figure 8b. Dielectric 851 is shown by a dashed line in Figure 8b. Main line 822 runs over dielectric 851. Preferably, dielectric 851 is transparent. Note that main lines 821-823 comprise metal on two levels: lower level 812 and upper level 811, except where the main lines run over the dielectric, in which case only upper level 811 is used, or where the main lines run under the dielectric, in which case only lower level 812 is used. This structure avoids the use of vias to connect the main lines to the interconnect lines. Lower level 812 is also shown schematically in Figure 8b.

[0122] 8c-8e are schematic diagrams illustrating examples of embodiments for manufacturing intersections. Shown in Fig. 8c are three main lines: main lines 842, 843, and 844. On main line 843, an insulating patch 851 is applied, for example, by pattern molding or direct printing. As shown in Fig. 8d, a connecting bridge 852 is applied on top of the insulating patch. The connecting bridge 852 is an example of an interconnecting line.

[0123] The connecting bridge electrically connects two main lines of the same mesh electrode, i.e., is a conductive bridge. This connecting bridge is insulated from other meshes on this substrate or another substrate. If the connecting bridge were to connect to another mesh electrode, a short circuit would result. The conductive bridge is preferably made from a conductive material, particularly a metal trace, but may also be made from other materials, such as semiconductor materials.

[0124] Optionally, in Fig. 8e, further components may be placed on top of the connecting bridge. For example, a spacer 853 may be applied. The spacer maintains a distance from another substrate in the optical modulator. For example, two substrates may be placed in the optical modulator such that the spacer contacts both substrates.

[0125] The spacer may include a current control component configured to control current between the first mesh electrode on the first substrate and the second mesh electrode on the second substrate. The spacer may be a dielectric to block the current. For example, the current control component may be arranged to allow current to pass when a voltage difference exceeds a threshold and block the current when the threshold is not exceeded. For example, the spacer may include a Zener diode. The number of spacers with current control functionality may be limited to one or more, or all, of the spacers.

[0126] 8e is placed at an intersection; where two mesh electrodes cross each other; in this case, where the interconnect between main lines 842 and 844 of the same mesh electrode crosses main portion 843 of a different electrode. Additionally or alternatively, spacers may be placed at different locations on the substrate, for example, not at intersections.

[0127] In an embodiment, one or more spacers are disposed between the first and second substrates of the optical modulator, and the spacers are electrically connected to the mesh electrodes on the first substrate but not to the mesh electrodes on the second substrate. The spacers on the second substrate may be connected to a controller. In particular, there may be at least one such connecting spacer for each mesh electrode on the first substrate. In this way, all mesh electrodes may be connected from one side of the optical modulator, for example, from one side of the optical modulator. The connecting spacers are preferably conductive and transparent. The connecting spacers may be constructed as conductive pillars.

[0128] For example, in an embodiment, a first mesh electrode on a first substrate can be electrically connected to a conductive spacer, for example, by placing a spacer on top of the first mesh electrode or by connecting the conductive spacer and mesh electrode with, for example, a metal trace. The conductive spacer can then be connected to a connection point on the second substrate. For example, the conductive spacer can be connected to a via located in the second mesh, for example, the via can be opposite the conductive spacer. For example, the conductive spacer can be connected to an additional electrode, such as a metal. The connection point can then be connected to a controller, for example, to control the potential on the mesh electrode of the first substrate. This allows the electrode meshes of both substrates to be powered from one side of the light modulator.

[0129] When more than two substrates, for example, three or more substrates, are stacked on top of each other, the mesh electrode on the first substrate may be connected to the second substrate through a conductive spacer, then to the third substrate through a conductive spacer, and so on up to the last substrate. Thus, the mesh electrode on a substrate may connect to a connection point on the last substrate through one or more conductive spacers disposed between the substrates. This allows control of all mesh electrodes in the stack from one side of the optical modulator.

[0130] Providing spacers between substrates in a light modulator, such as a light modulator used in dynamic glazing, is also beneficial when interdigitated electrodes other than mesh electrodes are used. An example of such dynamic glazing is dynamic glazing comprising a light modulator having: a first substrate and a second substrate facing each other; a plurality of interlaced electrodes extending in a two-dimensional pattern across the first substrate and across the second substrate; and an optical layer between the first and second substrates, the optical layer containing a fluid containing particles, the particles being charged or chargeable. When mesh electrodes are used, the controller may be connected or connectable to the electrodes on the substrates. Spacers may be disposed on the first and / or second substrates to separate the substrates from each other. A conductive spacer may be connected to the electrode on one substrate and insulated from the electrode on the opposing substrate, and the spacer may be connected to the controller through connection points, vias, or other additional electrodes on the opposing substrate, including, for example, the backside of the opposing substrate. In embodiments, connection points to electrodes on the substrate can be located on the backside of the substrate, for example, to electrodes on the substrate. The connection points can be located near the edges of the light modulator. Connection points to electrodes on the opposing substrate can also be provided, for example, connected through spacers. In embodiments, all electrodes in the light modulator can be controlled from the same side of the substrate.

[0131] It is also possible to use a semiconductor spacer with a non-mesh electrode, for example, the spacer may be connected to an electrode on the first substrate and to an electrode on the second substrate, the spacer comprising a semiconductor material, for example a Zener diode, for example a unidirectional or bidirectional Zener diode.

[0132] FIG. 9a is a schematic diagram illustrating an example embodiment of a mesh electrode 901. The two-dimensional pattern of the mesh electrode across the substrate includes a regular hexagonal pattern. Beneficially, this pattern fills the substrate. Such a substrate is also referred to as tiling, in the sense that one tile is regularly repeated on the substrate. Instead of the hexagonal tiling shown, for example, triangular tiling, square tiling, etc., may be used. Note that while the mesh electrode shown in FIG. 9a is generally in one plane, other mesh electrodes combined with it on the same substrate may be in different planes. The hexagonal pattern shown in FIG. 9a may be viewed as a combination of main lines and interconnect lines. For example, as shown in FIG. 9b, the pattern may be viewed as a plurality of main lines in the form of a regular sawtooth pattern; shown in FIG. 9b are main lines 902 and 903. Interconnect lines are applied between the main lines to form the main lines within the mesh electrode. Shown in FIG. 9b are three interconnect lines, one of which has the number 904.

[0133] FIG. 9c is a schematic diagram illustrating an example embodiment of a substrate. Two mesh electrodes, a mesh electrode 905 with a hexagonal pattern and a mesh electrode 906, are applied onto the substrate. For example, to fabricate the substrate of FIG. 9c, a first mesh electrode is applied onto the substrate, then a current-controlling component 907, e.g., a dielectric and / or a diode, is applied onto the first mesh electrode, and finally a second mesh electrode is applied onto the substrate, where the second mesh electrode may be insulated from the first mesh electrode through the current-controlling component. The mesh electrodes and / or dielectric may be applied by patterning and / or direct printing. Note that a relatively small dielectric is required compared to the area of ​​the mesh electrodes.

[0134] The mesh electrodes may have a period in which the pattern repeats. For example, the period may be a vector indicating the repetition of the cells of the mesh electrodes. A second mesh electrode may be shifted relative to the first mesh electrode by half a period. If there are more than two, e.g., n, mesh electrodes, where n may be greater than 2, mesh electrode k may be shifted relative to the first mesh electrode by (k-1) / n periods; herein, mesh electrodes are numbered from 1 to n.

[0135] More than two mesh electrodes can be applied when using non-linear mesh electrodes, including the regular type mesh electrode shown in Figure 9a. For example, Figures 9d-9h are schematic diagrams illustrating example embodiments for fabricating a substrate.

[0136] For example, to fabricate the substrate of Figure 9h, a first mesh electrode may be applied to the substrate as shown in Figure 9d, followed by application of current-controlling components, such as a dielectric and / or a diode, onto the first mesh electrode as shown in Figure 9e. A second mesh electrode is then applied as shown in Figure 9f. The second mesh electrode is insulated from the first mesh electrode through the current-controlling components. Next, a second set of current-controlling components is applied as shown in Figure 9g, followed by application of a third mesh electrode on top. The mesh electrodes and / or dielectric may be applied by patterning and / or direct printing.

[0137] The three mesh electrodes can be shifted relative to one another to establish an electric field on the substrate as needed, for example to control an optical modulator. As an example, the mesh electrode of Figure 9f can be shifted horizontally by 12.5 micrometers and vertically by 25 micrometers relative to the mesh electrode of Figure 9d.

[0138] Substrates with three or more mesh electrodes can be used in light modulators, for example, for dynamic glazing in a 2+3 or 3+3 configuration, i.e., a substrate with two mesh electrodes can be positioned opposite a substrate with three mesh electrodes (2+3), a substrate with three mesh electrodes can be positioned opposite a substrate with three mesh electrodes (3+3), etc.

[0139] A strip of electrically connecting foil can be applied to at least one edge of the substrate. The strip includes conductors that connect to mesh electrodes on the substrate. The strip can optionally be cut along with the substrate. A connector can be applied to the remaining portion of the strip, connecting the mesh electrodes to a controller through the conductors in the foil and through the connector. In embodiments, the strip of foil can be applied to at least two edges. For example, the two edges can share a common corner of the substrate. For example, the two edges can be opposite edges of the substrate. For example, the two opposite edges can be perpendicular to the major line. For example, the two opposite edges can be parallel to the major line. In embodiments, the strip of foil is applied to all edges of the substrate.

[0140] 10a-10b are schematic diagrams illustrating example embodiments of a substrate. Shown are a first mesh electrode 1210, a second mesh electrode 1211, and a dielectric 1212, with an electrical connection foil 1213 surrounding the mesh electrodes. There are various ways to connect the mesh electrodes on the substrate to a controller, for example, on a PCB. For example, the mesh electrodes could be connected through a cable assembly to a PCB-mounted connector or the like, but using foil 1213 has the added advantage that it can be cut to support different connection points.

[0141] For example, the foil 1213 may comprise a conductor connecting to the mesh electrode. The foil 1213 itself is typically an insulator. For example, the conductor may be an etched copper conductor. The foil 1213 may be made of a polyimide material. The foil 1213 may comprise a flexible printed circuit (FPC). For example, the foil may be a polyimide interconnect foil for connecting a substrate, such as glass, to a circuit board. Note that the foil 1213 is not behind the mesh electrode. Typically, only the edges of the foil are adhered to the substrate and aligned with the electrode pattern. The foil 1213 connects the substrate to the PCB. For example, it may be a floating plastic foil.

[0142] The foil 1213 may be present only to allow for the placement of the substrate. The substrate itself may be a glass or plastic substrate. The latter may or may not be the same type of plastic as the foil 1213. Any foil not used to connect to the mesh electrode may be cut off.

[0143] An adhesive may be used to attach the foil to the mesh electrode and substrate. Typically, the adhesive is configured to conduct current in only one direction, e.g., vertically and not laterally; for example, the adhesive may be doped with gold particles. The adhesive may be applied between the foil and the electrode pattern on the substrate.

[0144] FIG. 10a shows a zoomed-out view, while FIG. 10b shows an enlarged detail. Mesh electrodes 1210 and 1211 each comprise multiple main lines connected with multiple interconnect lines. Where the interconnect lines cross the main lines, a dielectric 1212 is applied between them. Note that foil supports the connecting lines. On the left and right sides, the connecting lines connect to the first two main lines from the edge of the substrate, while the top and bottom connecting lines connect to all the main lines. Numbers 1210 and 1211 in FIG. 10b indicate the connecting lines of each mesh electrode. The connecting lines on the left or right, or on the top or bottom, are optional, as long as both mesh electrodes remain connectable from the outside of the substrate.

[0145] An advantage of this embodiment is that it can be cut. In Figure 10c, cutting lines 1214 for the shape are shown. The actual shape is arbitrary, as long as connection points for the substrate remain accessible for at least one main line of each mesh electrode. Holes can also be cut into the shape. In this example, all of the foil, along with all of the connecting lines, is cut away except for the bottom strip. The strip includes connecting lines for each of the mesh electrodes. For example, connectors can be applied to the strip. Figure 10d is a schematic diagram illustrating an example of how the substrate can be cut out. Note that any non-rectangular shape can be obtained in this way. This cutting method is beneficial because it can support windows of any shape. For example, this cutting method can be used to cut dynamic glazing for automobiles. If the substrate is flexible, this method can also support any curve in the dynamic glazing.

[0146] In the example shown in Figures 10a-10d, cutting is performed on the substrate before assembly into dynamic glazing. However, this is not required. The substrate can be combined with one or more other substrates into a light modulator, e.g., for dynamic glazing. The two substrates can be cut together. For example, they can be cut using a laser or the like. The optical layers in the assembled light modulator can be sealed, e.g., by melting or gluing, during or after cutting.

[0147] The substrate of Figures 10a-10c allows small segments to be cut from the substrate. If the cut-out panes share a portion with the edge of the original substrate, the electrodes on that pane can be easily connected to a controller. Arbitrary segmentation of the substrate with easy connectability is also possible, for example, using transparent contacts placed on the outer surfaces of two (or more) substrates. These transparent contacts can be applied during or after the manufacture of the mother substrate and can be connected to the electrodes by conduction through vias in the substrate. If these contacts are made during the manufacture of the mother substrate, they can be positioned with a regular offset from one part of the electrode mesh to the next. This allows for an almost infinite number of sizes for the final modulator.

[0148] Additional vias connecting each of the mesh electrodes can be created between the mesh electrodes and the other side of the substrate. Thus, it is possible to cut the substrate / product regardless of location and still interconnect it. The density of the vias dictates the smallest cutting step possible.

[0149] FIG. 11a is a schematic diagram illustrating an example embodiment of a substrate 202. The substrate 202, such as a glass or plastic substrate, is provided with a first mesh electrode 281 and a second mesh electrode 282. In this case, the main lines of the mesh electrodes 281 and 282 are provided on the same side of the substrate. The two mesh electrodes are interdigitated. Interconnection lines are provided between the main lines on the same substrate. One of the interconnection lines is provided with the reference number interconnection line 286. Where the main lines and the interconnection lines cross each other, a dielectric 283 is disposed between them. The dielectric 283 can be replaced with a different type of current-controlling component as described herein. Although two mesh electrodes are shown, there may be more mesh electrodes. The surfaces to which the main lines are applied will then be in fluid contact when the substrate is integrated into an optical modulator. For example, two substrates such as those shown in FIG. 11a can be positioned opposite each other, with their mesh electrodes facing each other. In this example, all of the mesh electrodes, including the interconnect lines, are applied to the same side of the substrate; however, this is not required, for example, some or all of the interconnect lines may extend through the backside as well.

[0150] Each of the mesh electrodes in Figure 11a is provided with multiple vias connecting the mesh electrode to the other side of the substrate. If the substrate 202 is cut, a controller can be connected to the vias of each of the mesh electrodes. This approach has the advantage that it can connect even portions of the substrate that are cut out in the middle and that may not share some of the edges of the substrate 202. In the example shown, some vias connect to interconnect lines and some do not.

[0151] For example, suppose substrate 202 is cut along cut line 287. In this case, substrate 202 is cut into a left portion and a right portion. The left portion can also be connected through the side facing the mesh electrodes, for example, at via 284.1 for the first mesh electrode and to via 285.1 for the second mesh electrode. The right portion can be connected on the side facing the mesh electrodes, for example, at via 284.2 for the first mesh electrode and to via 285.2 for the second mesh electrode.

[0152] In embodiments, the vias extend across the substrate in a random, regular, and / or predetermined pattern. For example, the density of the vias in each mesh electrode exceeds a minimum threshold. The density of the vias indicates the smallest possible cutting step. For example, if there is an average via every cm along the main line, a very small pane of approximately 1 cm + twice the cutting loss can be cut from the substrate. Alternatively, the vias can be placed at a determined location, for example, depending on which pane is to be cut from the substrate. This has the advantage of requiring very few vias, but may require more precision from the cut.

[0153] 11a is a diagram illustrating the distance 288 between consecutive vias in a mesh electrode 281. The maximum distance between consecutive vias in a mesh electrode is related to the size of smaller substrates that may be cut from a mother substrate, e.g., substrate 202. In an embodiment, the vias are placed on a major line, and the maximum distance is the maximum distance measured along the major line. For example, this maximum distance may be at most 10 cm, at most 1 cm, at most 1 mm, etc.

[0154] Vias can be created, for example, by drilling holes in the substrate and filling the holes with conductive material. The substrate can also be made of conductive material lines separated by a dielectric, so that the electrode lines of the mesh electrode are as thick as the substrate. Another approach is to sprinkle conductive particles in the polymer. Contact can be made, for example, with ACF bonding by applying pressure to the substrate / doped polymer to ensure connection from one side of the substrate to the patterned electrode mesh on the other side. For example, the connection can be made by laser welding. For example, laser welding can be used to create a track from the via termination on the back of the substrate to the edge of the substrate.

[0155] Substrates with multiple vias can be combined with foil connections at the edge of the substrate, as in Figures 10a-10d; however, this is not required.

[0156] For example, in embodiments, the mother substrate may be significantly larger than the panes used in the final product. For example, the mother substrate may have dimensions of, for example, 6 m x 6 m, or even larger, for example, 6 m x 30 m. The panes cut from the mother substrate may be very small, for example, 30 cm x 30 cm, depending on the application. In this manufacturing method, some panes may not share an edge with the mother substrate. Beneficially, the mesh electrodes in the cut portion of the substrate are connected from two points that are close to each other, for example, on the same point on the same edge of the cut pane. In embodiments, the vias may be spaced as finely as one via per mm. The vias may be arranged in a wide array, but they can also be placed precisely where they are needed.

[0157] Figures 11b and 11c are schematic 3D renderings of example embodiments of a substrate. The substrate shown in Figures 11b and 11c is of the type shown in Figure 11a. In Figure 11c, the mesh electrode is on the top surface of the substrate. In Figure 11b, the mesh electrode is on the bottom surface of the substrate. In an optical modulator, an optically active layer can be inserted between the two layers. Particles in the fluid of this optical element can be controlled by applying a voltage to the mesh substrate, which is connected through the side of the substrate that is not in fluid contact.

[0158] FIG. 11d is a schematic diagram of an example embodiment of substrate 203. FIG. 11d shows an exemplary substrate having multiple mesh electrodes. In this example, three mesh electrodes are used: mesh electrodes 291, 292, and 293. These mesh electrodes may have multiple main lines and multiple interconnect lines. One main line of each mesh electrode is shown. The interconnect lines are shown schematically at 296. As in FIGS. 11a-11c, the mesh electrodes are provided with vias that connect the mesh electrodes from the side of the substrate to which they are applied to the other side. Connections between mesh electrodes can be made through one of these vias. The vias are indicated by small, solid circles.

[0159] The vias are arranged in groups of vias across the substrate. Each of the mesh electrodes is connected to one of the vias in each group. Two such groups are separated by a dashed line in FIG. 11d. Within a group, the distance between two vias is less than the closer spacing distance 294. The groups themselves are separated by at least the larger spacing distance 295. In an embodiment, the distance is measured along a projection in the direction of the main line. In an embodiment, Euclidean distance on the substrate is used.

[0160] There may be additional vias on the substrate for other purposes.

[0161] Figure 11e is a schematic diagram of an example embodiment of substrate 204. Shown in Figure 11e is the back side of the substrate opposite the side with the mesh electrodes. Shown are groups 297. Each group has a via for each of the mesh electrodes. Within a group, the vias are close to each other. The distance between groups is very large. For example, the groups can be regularly spaced across the substrate. In Figure 11e, a regular hexagonal spacing is used, but other regular spacings are possible.

[0162] For example, the lower spacing limit may be 1 mm. Connections can be made to all substrates within a distance of 1 mm. This is convenient for connections where the vias used are close to each other. For example, a single connector can be used. On the other hand, larger spacing between groups means that fewer vias are needed in total. This reduces the optical impact of the spacers and reduces manufacturing complexity.

[0163] The distance between one group 297 and the next group may be at least the upper limit, while the distance between two vias within a group 297 may be at most the lower limit. The lower spacing limit is less than the upper spacing limit. For example, the upper spacing limit may be at least 10 times the lower spacing limit.

[0164] The number of mesh electrodes in Figures 11d and 11e may be more or less than three, for example there may be two mesh electrodes with via pairs distributed across the substrate.

[0165] FIG. 11f is a schematic diagram illustrating an example embodiment of substrate 205. Shown in FIG. 11f is the backside of the substrate, opposite the side with the mesh electrodes and facing a second substrate. Shown are groups of connecting vias. In FIG. 11f, the vias indicated by small black circles connect to mesh electrodes on the substrate shown. In this case, there are three mesh electrodes on substrate 205, although two may be present. In FIG. 11f, the vias indicated by small black crosses connect to mesh electrodes on a substrate opposite the substrate shown, for example, through a connecting substrate as discussed herein. In this case, there are three mesh electrodes on the substrate opposite substrate 205, although two may be present. In this optical modulator, there are two substrates, although more may be present.

[0166] Each group has a via for each mesh electrode in the optical modulator. Within a group, the vias are close to each other. The distance between groups is very large. For example, the groups can be regularly spaced across the substrate. In Figure 11f, a square spacing is used, but other regular spacings are possible.

[0167] Vias within a group, such as those shown in Figures 11d, 11e, and 11f, form connection areas on the substrate. Connections via such connection areas equalize the distance to the power source, thus minimizing the potential difference between two opposing points on two consecutive main lines of two mesh electrodes. The distance between the vias may be small, e.g., within 10 cm, 5 cm, 1 cm, or even smaller. As a result, the resistances of the opposing points are approximately equal, e.g., within 10%, 5%, 1%, and smaller, minimizing the potential difference between two opposing points on the two main lines. When connection areas are present on multiple substrates, they are preferably opposite each other. A mesh electrode may be powered by multiple connection areas. Again, the connection areas are preferably small and aligned with the connection areas on the opposing substrates. One way to align the connection areas is to use connection spacers.

[0168] FIG. 12a shows a schematic diagram of an embodiment of a light modulator 10 that can be applied in dynamic glazing.

[0169] Reference is made to patent application PCT / EP2020 / 052379, which is incorporated herein by reference, which includes useful designs for optical modulators, which may be further improved by including mesh electrodes, for example as described herein.

[0170] The light modulator 10 can be electronically switched between a transparent state and a non-transparent state, and vice versa, or between a reflective state and a non-reflective state, and vice versa. The light modulator 10 comprises a first substrate 11 and a second substrate 12, which are arranged opposite each other. On the inner side of the first substrate 11, at least two electrodes are applied: electrodes 14a, 14b are shown. These at least two electrodes are collectively referred to as electrodes 13. On the inner side of the second substrate 12, at least two electrodes are applied: electrodes 15a, 15b are shown. These at least two electrodes are collectively referred to as electrodes 14.

[0171] Beneficially, electrodes 14a, 14b and electrodes 15a, 15b are mesh electrodes according to an embodiment. In Figure 12a, two interconnects are shown, although in practice there may be more.

[0172] A fluid 15 is provided between the substrates. The fluid contains particles 30, e.g., nanoparticles and / or microparticles, which are charged or chargeable. For example, the particles may inherently carry a charge on their surface. For example, the particles may be surrounded by charged molecules.

[0173] The electrodes are configured to drive the particles 30, causing them to move towards or away from the electrodes in response to an applied electric field. The optical properties, in particular the transparency or reflectivity of the light modulator, depend on the position of the particles 30 in the fluid. For example, connections can be made to apply an electromagnetic field to the electrodes.

[0174] The controller 16 is configured to apply an electric potential to the mesh electrodes 13a, 13b, 14a, and 14b to obtain an electromagnetic field between the mesh electrodes. This results in electrophoresis of particles toward or away from one of the mesh electrodes, which in turn causes modulation of the optical properties of the light modulator. The controller may include, for example, a microprocessor or state machine and may be configured to generate a waveform for application to the mesh electrodes. For example, the controller may include an amplifier connectable to or connected to a power source to amplify the waveform. The controller may be implemented as a single integrated device, such as a microchip, or may be distributed across multiple subcontrollers, implemented as multiple microchips. The multiple subcontrollers may communicate with each other, for example, using wired or wireless communication. For example, a subcontroller may be configured to control one of the substrates, one of the meshes, or a segment in the light modulator.

[0175] The controller 16 may be located in various places. For example, the controller 16 and / or sub-controllers, if present, may be located external to the light modulator. For example, the controller may be connected to the mesh electrodes through wiring, such as a cable. The controller 16 may also be fully or partially integrated within the light modulator. For example, the controller may be located between two substrates, on glass, or as a printed circuit, etc. For example, each of the substrates may include a controller for controlling the mesh electrodes on the substrate. The sub-controllers may optionally be connected to a master controller external to the light modulator.

[0176] In one example, substrate 11 and substrate 12 may be optically transparent outside the electrodes, typically >95% transparent, e.g., >99% transparent, at the relevant wavelengths. When the electrodes are taken into account, the transparency may be much lower, e.g., 70%. The term "optical" may relate to wavelengths visible to the human eye (approximately 380 nm-approximately 750 nm), where applicable, and to a broader range of wavelengths including infrared (approximately 750 nm-1 μm) and ultraviolet (approximately 10 nm-380 nm), and subselections thereof, where applicable. In an exemplary embodiment of the optical modulator, the substrate material is selected from glass and polymer.

[0177] In another example, one substrate, such as the bottom substrate 12, may be reflective or partially reflective, while the top substrate 11 is transparent. The optical properties, and in particular the reflectivity of the light modulator, depend on the location of the particles 30 in the fluid. When the panel is in the open state (vertical actuation), the particles are mostly located between the opposing electrodes of the two substrates so that incident light can pass relatively unimpeded through the transparent top substrate and optical layer and be reflected or partially reflected on the bottom substrate.

[0178] The distance between the first substrate and the second substrate is typically less than 30 μm, such as 15 μm. In exemplary embodiments of the optical modulator, the distance between the first substrate and the second substrate is less than 500 μm, preferably less than 200 μm, preferably less than 100 μm, and more preferably less than 50 μm, such as less than 30 μm.

[0179] In one example, the modulator may be provided in a flexible polymer, and the rest of the device may be provided in glass. The glass may be rigid glass or flexible glass. If necessary, a protective layer may be provided on the substrate. If more than one color is provided, more than one layer of flexible polymer may be provided. The polymer may be polyethylene naphthalate (PEN), polyethylene terephthalate (PET) (optionally with a SiN layer), polyethylene (PE), etc. In a further example, the device may be provided in at least one flexible polymer. Thus, the modulator may be attached to any surface, such as using an adhesive.

[0180] The particles 30 may be adapted to absorb light, thereby preventing certain wavelengths from passing through. The particles 30 may also reflect light; for example, this reflection may be specular, diffuse, or something in between. The particles may absorb some wavelengths and reflect others. The particles may also or alternatively emit light, for example, using phosphorescence, fluorescence, or the like. Fluids may also emit light, but their emissivity is modulated by changing the location of the particles.

[0181] In exemplary embodiments of the light modulator, the nanoparticles have a size of 20-1000 nm, preferably 20-300 nm, and more preferably less than 200 nm. In exemplary embodiments of the light modulator, the nanoparticles / microparticles may include a coating on a dye, and preferably include a core. In exemplary embodiments of the light modulator, the particle coating is made from a material selected from conductive and semiconductive materials.

[0182] In exemplary embodiments of the light modulator, the particles are adapted to absorb light having wavelengths between 10 nm and 1 mm, such as 400-800 nm, 700 nm-1 μm, and 10-400 nm, and / or are adapted to absorb portions of light having wavelength ranges within 10 nm-1 mm (filters), and combinations thereof.

[0183] In an exemplary embodiment of the light modulator, the particles are charged or chargeable. For example, the charge on the particles is between 0.1e and 10e (5*10) per particle. -7 -0.1C / m2).

[0184] In an exemplary embodiment of the light modulator, the fluid is present in an amount of 1-1000 g / m, preferably 2-75 g / m, more preferably 20-50 g / m, such as 30-40 g / m. A major advantage of using this layout is that very little fluid and therefore very few particles can be used.

[0185] In an exemplary embodiment of the light modulator, the particles are present in an amount of 0.02-10 g / m 2 , such as 0.01-70 g / m 2 , preferably 0.1-3 g / m 2 .

[0186] In an exemplary embodiment of the light modulator, the particles have a color selected from cyan, magenta, and yellow, and from black and white, and combinations thereof.

[0187] In an exemplary embodiment of the light modulator, the fluid includes one or more of a surfactant, an emulsifier, a polar compound, and a compound capable of forming hydrogen bonds.

[0188] Fluid 15 may be a non-polar fluid having a dielectric constant less than 15. For example, the dielectric constant may be measured at a certain frequency. For example, the dielectric constant is less than 15 at a frequency of 1 kHz. Alternatively, the dielectric constant may be measured at a different frequency, for example, 60 Hz or higher. Note that water has a dielectric constant of 80 for all frequencies below 10 GHz. The advantage of a lower dielectric constant, such as less than 15, is that it increases the liquid's ability to retain high electric fields without breakdown while decreasing the liquid's conductivity at low frequencies, particularly those at which optical modulators may be operated.

[0189] In an exemplary embodiment of the light modulator, the fluid has a relative dielectric constant εr of less than 100, preferably less than 10, such as less than 5. In an exemplary embodiment of the light modulator, the fluid 15 has a kinematic viscosity greater than 10 mPa.s.

[0190] Electrodes 14a, 14b and electrodes 15a, 15b are in fluid contact with a fluid. The fluid may be in direct or indirect contact with the electrodes; for example, the fluid may contact the second medium using the electrodes, such as through a porous layer. In embodiments, the electrodes cover approximately 1-30% of the substrate surface. In embodiments, the electrodes comprise a conductive material with a resistivity of less than 100 nΩm (at 273 K; for comparison, typically used ITO has a resistivity of 105 nΩm), which has a conductivity >1*10 at 20°C. 7 Similar to S / m. In embodiments of the optical modulator, the electrodes include copper, silver, gold, aluminum, graphene, titanium, indium, and combinations thereof, preferably copper. The electrodes may be in the form of microwires embedded in a polymer-based substrate; for example, they may be in the form of copper microwires.

[0191] In a connection for applying an electromagnetic field to the electrodes, the electromagnetic field applied to the electrodes causes the nanoparticles and microparticles to move from the first electrode to the second electrode, and vice versa. A connection for applying an electromagnetic field to the electrodes may be provided. For example, in an exemplary embodiment of the light modulator, the current is between -100 and +100 μA, preferably between -30 and +30 μA, and more preferably between -25 and +25 μA. For example, a power provider may be electrically connected to at least two electrodes. The power provider may be adapted to provide waveform power. At least one of the amplitude, frequency, and phase may be adaptable to provide different states in the light modulator. For example, the power aspect may be adapted by a controller.

[0192] The light modulator 10 may include one or more segments, where a segment is a single optically switchable entity that may be variable in size. A substrate at least partially surrounds a volume that may be a segment.

[0193] The device may include a driving circuit for changing the appearance of the (individual) segments by applying an electromagnetic field. Thus, the appearance of the light modulator, or one or more portions thereof, may also be changed. For example, the segments may be at least 1 mm 2 The design allows for stacking to allow for more colors; for example, for a full-color application, a stack of two or three modulators could each provide most or all of the colors.

[0194] Having one or more segments allows the light modulator to be locally controllable, which can be beneficial in some applications but is not required. For dynamic glazing, light modulators can be used with or without segments. For example, in dynamic glazing applications, transparency or reflectivity can be locally controlled, e.g., to block sun patches without reducing transparency or reflectivity across the entire window. The segments can be relatively large, e.g., having a diameter of at least 1 mm, or at least 1 cm.

[0195] In an exemplary embodiment of the light modulator, the substrates (11, 12) are aligned and / or the electrodes (13, 14) are aligned. For example, electrodes 14a, 14b and electrodes 15a, 15b may be aligned to face each other. With aligned substrates, the electrodes on different substrates are behind each other when viewed perpendicular to the substrates. When the light modulator is disassembled and both substrates are positioned with the electrodes facing up, the electrode patterns are mirror images of each other.

[0196] While aligning the substrates can increase the maximum transparency or reflectivity of the light modulator, if the light modulator is selected for criteria other than transparency or reflectivity, it may be advantageous not to align the two substrates, or to align them completely. Light modulators can be stacked. For example, two stacked light modulators can be made from three substrates, with the middle substrate having electrodes on both sides. In light modulator embodiments, optionally, at least one substrate 11, 12 of a first light modulator is identical to the substrate 11, 12 of at least one second light modulator. In the case of stacked modulators, alignment can also increase the maximum transparency or reflectivity, but may be detrimental to other considerations, such as diffraction.

[0197] FIG. 12b is a schematic diagram illustrating an example embodiment of an optical modulator 40. Optical modulator 40 is similar to optical modulator 10, except that it includes multiple optical layers, as shown in the example with two optical layers. There may be more than two optical layers. Each optical layer is disposed between two substrates. Optical modulator 40 may be considered a stack of two-substrate optical modulators, as in FIG. 12a. As shown, optical modulator 40 includes three substrates: a first substrate 41, a second substrate 42, and a third substrate 43. An optical layer is located between substrates 41 and 42, and an optical layer is located between substrates 42 and 43. These optical layers may be similar to those in optical modulator 10. Controller 46 may be similar to controller 16. For example, controller 46 may be configured to control the potential and / or current on the electrodes of the substrates. For example, in FIG. 12b, controller 46 may be electrically connected to at least 4×2=8 electrodes. Like controller 16, controller 46 may also be embodied on multiple sub-controllers.

[0198] Interestingly, the particles in multiple optical layers can be different, allowing multiple layers to be used to control more of the optical properties of the light modulator. For example, particles in different optical layers can absorb or reflect different wavelengths, e.g., different colors. This can be used by the controller 46 to create different colors and / or different color intensities on the panel. For example, a four-substrate panel could have three optical layers with different color particles, e.g., cyan, yellow, and magenta, respectively. By controlling the transparency or reflectivity of the different colors, a wide color spectrum can be created.

[0199] The surface of a substrate facing another substrate may be provided with two or more patterns, for example in an embodiment, where the outer substrates 41 and 43 may receive electrodes only on the inside, while the inner substrates, for example substrate 42, may have electrodes on both sides.

[0200] Substrates 41 and 42 may both be considered embodiments of an optical modulator. Similarly, substrates 42 and 43 may both be considered embodiments of an optical modulator.

[0201] FIG. 12c is a schematic diagram illustrating an example embodiment of a vehicle 20 having dynamic glazing for the window 21. This is a particularly beneficial embodiment because incident light levels can change frequently and rapidly during driving. Using dynamic glazing in a vehicle has the advantage that adjusting the transparency of the vehicle window allows light levels to be maintained at a constant level. Furthermore, reducing diffraction effects reduces driver distraction, thereby improving safety. The vehicle 20 may include a controller configured to control the transparency or reflectivity of the window 21.

[0202] Dynamic glazing can also be used in other applications of glazing, especially where the amount of incident light is variable, such as in buildings, offices, homes, greenhouses, skylights, etc. Skylights are windows placed in the ceiling to allow sunlight to enter a room.

[0203] 13a-13b show schematic side views of an embodiment of a light modulator in use. Applying an electric field to electrodes on a substrate induces an electric force on the particles. Using this effect, the particles can move around, thus inducing different transparency or reflectivity states in the light modulator. A controller can control the electric field, such as its amplitude, frequency, and phase. In an embodiment, the controller is connected to at least four electrodes: two electrodes per substrate. However, more electrodes may be used and connected to the controller; for example, more than two electrodes per substrate may be used to better fine-tune the gray scale and drive to non-transparent or non-reflective states. Multiple electrodes may also be used to support multiple segments on a substrate.

[0204] Figure 13a shows a light modulator with no electric field applied, in which no electric force is yet applied to particles 30 suspended in fluid 15.

[0205] In the configuration shown in Figure 13a, the conductive electrode pattern disposed on the upper substrate is perfectly aligned or nearly aligned with the conductive electrode pattern on the lower substrate. The conductive electrode pattern may be deposited on a transparent or (partially) reflective glass substrate, or may be embedded in a plastic substrate, etc.

[0206] Alignment between the upper and lower electrode patterns contributes to a wider range of achievable levels of transparency or reflectivity, although alignment is not required, as a similar effect can be achieved without alignment, resulting in a similar range of transparency or reflectivity.

[0207] It should be noted that in these examples, references to upper and lower substrates are made to refer to the substrates higher or lower on the page. In glazing applications, the substrates may be aligned vertically rather than horizontally, so the same substrates may also be referred to as, for example, a front substrate and a back substrate.

[0208] FIG. 13b shows a light modulator in which, for example, in instance P1, a potential +V1 is applied to each microwire electrode on the upper substrate, while a negative voltage, e.g., −V1, is applied to each microwire electrode on the lower substrate. This is indicated in FIG. 13b by a first “+” or first “−” mark on the electrodes. In this case, the same positive potential is applied to all electrodes 13, and the same negative potential is applied to electrode 14. This potential difference causes negatively charged particles to flow near the electrode on the upper substrate, where they approximately align with the upper electrode. As a result, if both the upper and lower substrates are transparent, the transparency of the light modulator 10 increases. Similarly, if, for example, the upper substrate is transparent and the lower substrate is reflective, the reflectivity of the light modulator 10 increases. If the solution contains positively charged particles, the positively charged particles will flow near the electrode on the lower substrate, where they approximately align with the lower electrode.

[0209] In a second instance of the ON state, P2, in contrast to instance P1, similar transparency or reflectivity can be achieved when the voltages on the upper and lower electrodes are reversed. In instance P2, the voltages on each electrode on the upper substrate are then supplied with a negative potential −V1, and the voltages on the aligned electrodes on the lower substrate are supplied with a positive potential. This is illustrated in FIG. 13b by the second “+” or second “−” marks on the electrodes. This state is similar to the state shown in FIG. 13b, but the upper and lower substrates are reversed. This configuration also results in high transparency or reflectivity for the optical modulator 10.

[0210] Interestingly, by switching between a positive potential on the electrode of the upper substrate, e.g., shown as electrode 13 in FIG. 13b (and a negative potential on electrode 14), and a positive potential on the electrode of the lower substrate, e.g., shown as electrode 14 in FIG. 13b, transparency or reflectivity can be maintained while reducing corrosion damage to the electrodes. This AC electric field can be achieved by applying an AC potential to the upper and lower electrodes. This AC electric field is illustrated in FIG. 12 by the "+ / -" or "- / +" symbols on the electrodes, showing how the potential on the electrodes alternates between different voltages. The AC potential on the electrodes can be obtained, for example, from an alternating current (AC).

[0211] Applying a waveform is optional but effective in reducing corrosion and thereby extending the life of optical modulators. Corrosion can occur, for example, when using copper electrodes because copper ions dissolve in the ionic fluid of one substrate and flow to and deposit on the electrode on the opposing substrate. By applying a waveform, the copper ion transport direction is frequently reversed, thus reducing corrosion damage. When the corrosion current between the two substrates is balanced, or nearly so, e.g., >95%, between two instances, P1 and P2, and the corrosion rate of the electrode on the upper plate occurs, for example, there is a balanced deposition of copper on the lower electrode during each time instance, P1, and vice versa during instance P2. Thus, particles are continuously transferred or shifted between the upper and lower electrodes, keeping the optical modulator or smart window constantly ON, while the dynamic electrolytic current between the upper and lower electrodes is constant, resulting in no or negligible residual loss of electrode material on the upper and lower substrates.

[0212] FIG. 13c illustrates how a state of reduced transparency or reflectivity can be achieved. On the same substrate, an alternating voltage is applied. For example, in an embodiment, as shown in FIG. 13c, a potential +V2 is applied to a first electrode, and the next closest electrode has an opposite potential −V2, and so on. This is indicated in FIG. 13c by a first “+” or a first “−” on the electrode. This can be achieved by applying a potential +V2 to electrode 14a and an opposite potential −V2 to electrode 14b. On an opposing substrate, a potential +V2 may be applied to electrode 15a and an opposite potential −V2 may be applied to electrode 15b. For example, the electrodes may be arranged so that the electrodes on the substrate are aligned; an electrode on the top substrate has an opposing electrode on the bottom substrate, and vice versa. In a second instance, similar transparency or reflectivity can be achieved when the voltages on the top and bottom electrodes are reversed. This is indicated in FIG. 13c by a second “+” or a second “−” on the electrode. In FIG. 2c, the potential on the electrodes may alternate between positive and negative as indicated by the "+ / -" and "- / +" shown on the electrodes.

[0213] Opposing electrodes may receive the same potential while adjacent electrodes receive opposite potentials, e.g., to reduce transparency or reflectivity. An embodiment is shown in Figure 13c, in which four electrodes are designated by reference numerals 14a, 14b, 15a, and 15b, with the rest of the electrodes alternating in series.

[0214] By using this AC driving cycle between the top and bottom substrates, diagonal and lateral electric fields are generated between the two substrates, which causes the particles to spontaneously diffuse, thereby creating the closed state of the light modulator. As a result of this configuration, the particles migrate diagonally and laterally between the top and bottom substrates, and the diffusion of the particles into the visible aperture of the light modulator contributes to the closed, opaque state of the light modulator.

[0215] For the transparent state shown in Figure 13b, a waveform can be applied to the electrodes such that, for example, the electrodes shown in Figure 13b with a positive potential become negative, and vice versa. Applying a waveform between, for example, electrodes 14a and 14b and between electrodes 15a and 15b, as in Figure 13b, reduces corrosion damage to the electrodes.

[0216] An AC driving cycle can be implemented by using interdigitated line configurations that combine the top and bottom electrode configurations shown in plan views such as Figures 5, 6a-6d.

[0217] The degree to which the transparency or reflectivity in Figures 13b and 13c increases or decreases depends on the voltage and frequency difference. Varying the voltage difference controls the amount by which the transparency or reflectivity increases or decreases, respectively. For example, a curve representing light transmission versus voltage may be determined, e.g., measured. To obtain a particular level of light transmission, e.g., a particular transparency, e.g., a particular grayscale level, a corresponding voltage, e.g., an AC voltage, may be applied. By interpolating the signals for the transparent or non-transparent state, levels between transparent and non-transparent may be obtained. Similarly, a curve representing light reflection versus voltage may be determined, e.g., measured. To obtain a particular level of reflectivity, a corresponding voltage, e.g., an AC voltage, may be applied. By interpolating the signals for the reflective or non-reflective state, levels between reflective and non-reflective may be obtained.

[0218] 14a is a diagram illustrating a schematic example of an embodiment of a method 1310 for manufacturing a substrate for use in a light modulator, such as for use in dynamic glazing. - providing a substrate (1311); - applying (1312) a first mesh electrode of a plurality of mesh electrodes on a substrate; - applying (1313) a second mesh electrode of the plurality of mesh electrodes interlaced with the first mesh electrode; - creating a plurality of intersection points (1314) distributed across the substrate where first and second mesh electrodes of the plurality of mesh electrodes intersect on the substrate; Includes.

[0219] The plurality of interlaced mesh electrodes extend in a two-dimensional pattern across the substrate. Multiple intersections can be created during application of the mesh electrodes. At the intersections, a dielectric or other current-controlling component can be applied to control the current flowing between the first and second mesh electrodes.

[0220] In some embodiments, however, the mesh electrode is applied without interruption. The mesh electrode need not be applied all at once; the mesh electrode may be applied in portions. For example, the mesh electrode may be constructed from multiple main lines and interconnections. For example, FIG. 14b illustrates an embodiment in which the mesh electrode is constructed from main lines and interconnection lines. Method 1320 includes: - applying (1321) a plurality of main lines of a plurality of mesh electrodes to a substrate, the main lines of the plurality of electrodes being arranged alternately with respect to each other on the substrate; - applying a plurality of interconnection lines on the substrate (1322) electrically connecting a plurality of main lines, wherein an electrode of the plurality of electrodes comprises a plurality of interconnections electrically connecting main lines of the mesh electrode together, and the main lines of the electrode are connected to other main lines through the plurality of interconnections (1322). Includes.

[0221] Applying the mesh electrodes, and / or main lines, and / or interconnect lines, and / or current-controlling components can be done by patterning. Direct printing can also be used, especially for interconnect lines and current-controlling components such as dielectrics.

[0222] According to an embodiment, the light modulator may be fabricated from two or more substrates. For example, Figure 14c illustrates an embodiment in which the light modulator is constructed from substrates, according to an embodiment. Method 1330 includes: - providing (1331) a first substrate and a second substrate facing each other, wherein a plurality of interlaced mesh electrodes extend in a two-dimensional pattern across the first substrate and across the second substrate, and two mesh electrodes of the plurality of mesh electrodes on a substrate intersect at a plurality of intersection points distributed across the substrate; - disposing an optical layer between a first substrate and a second substrate (1332), the optical layer including a fluid containing particles, the particles being charged or chargeable (1332); - cutting shapes from the assembled first substrate, second substrate and optical layer (1333); - Closing the edges of the cut shapes (1334) Includes.

[0223] Cutting the shape is optional. For example, the light modulator can be directly manufactured in the desired shape. However, cutting allows the light modulator to be constructed according to a default configuration, after which the shape can be modified. After or during cutting of the light modulator, its edges can be closed to keep the fluid in the optical layer.

[0224] Light modulators using substrates according to embodiments may be beneficially used for dynamic glazing. For example, Figure 14d illustrates an embodiment in which dynamic glazing is operated to create dynamic optical properties. Method 1340 comprises: - providing an optical modulator according to an embodiment (1341); - selecting an alternating current or voltage and applying the alternating current or voltage to the electrodes to obtain an electromagnetic field between the electrodes, resulting in electrophoresis of particles towards or away from the electrodes, causing modulation of the optical properties of the light modulator (1342).

[0225] For example, a controller can be connected to multiple mesh electrodes on a substrate. The controller can be configured to select an AC current or an AC voltage based on user input, e.g., an input indicating a desired optical property, e.g., a desired transparency, a program indicating a desired optical property, e.g., over a period of time, a sensor input, e.g., a sensor at the light modulator, e.g., a sensor for incident light, ambient light, e.g., incident sunlight, ambient room lighting, etc., a sensor for current on the mesh electrode, etc. For example, a software program executed by the controller can select, e.g., look up or calculate, an appropriate drive signal to drive the light modulator toward a new state and / or maintain a current state. The selected drive signal can be applied by a current controller, a voltage controller, etc.

[0226] Those skilled in the art will appreciate that many different ways of performing the method are possible. For example, while the order of steps may be performed in the order shown, the order of steps may be changed or some steps may be performed in parallel. Furthermore, other steps of the method may be inserted between steps. The inserted steps may represent improvements to the method as described herein or may be unrelated to the method. For example, some steps may be performed at least partially in parallel. Furthermore, a given step may not be completely completed before the next step is initiated.

[0227] Driving the electrodes may be with a signal having a selected maximum amplitude corresponding to one of multiple levels of transparency or reflectivity in the light modulator, which signal may be an AC current or an AC voltage.

[0228] Embodiments of the present method may be implemented using software, including instructions for causing a processor system to perform a driving method, such as method 1340. The software may include only those steps performed by a particular sub-entity of the system. The software may be stored on a suitable storage medium, such as a hard disk, floppy, memory, optical disk, etc. The software may be transmitted as a signal along wires, wirelessly, or using a data network, e.g., the Internet. The software may be available for download and / or for remote use on a server. Embodiments of the present method may be implemented using a bitstream configured to configure programmable logic, e.g., a field programmable gate array (FPGA), to perform the method.

[0229] It will be understood that the subject matter of this disclosure also extends to computer programs, particularly computer programs on or in a carrier configured to put the subject matter of this disclosure into practice. The program may be in the form of object code, such as source code, object code, code intermediate source, partially compiled form, or any other form suitable for use in implementing embodiments of the present methods. Embodiments relating to computer program products include computer-executable instructions corresponding to each of the processing steps of at least one of the described methods. These instructions may be subdivided into subroutines and / or stored in one or more files that may be statically or dynamically linked. Other embodiments relating to computer program products include computer-executable instructions corresponding to each of the devices, units, and / or parts of at least one of the described systems and / or products.

[0230] FIG. 15a illustrates computer-readable media 1000 and 1001 having a writable portion 1010 containing a computer program 1020, which includes instructions for causing a processor system to perform a light modulator method, according to an embodiment. For example, the processor system may be connected to a light modulator. The computer program 1020 may be embodied on the computer-readable medium 1000 as a physical mark or by magnetization of the computer-readable medium 1000. However, any other suitable embodiment is also contemplated. Furthermore, while the computer-readable medium 1000 is illustrated here as an optical disk, it will be understood that the computer-readable medium 1000 may be any suitable computer-readable medium, such as a hard disk, solid-state memory, flash memory, or the like, and may be non-recordable or recordable. For example, the computer-readable medium may be electronic memory, such as an electronic memory device, e.g., an electronic memory card as shown at 1001. The computer program 1020 includes instructions for causing a processor system to perform the light modulator method.

[0231] FIG. 15b is a schematic diagram of a processor system 1140 according to an embodiment of a controller for an optical modulator. The processor system includes one or more integrated circuits 1110. The architecture of the one or more integrated circuits 1110 is shown schematically in FIG. 15b. The circuit 1110 includes a processing unit 1120, such as a CPU, for performing a method according to an embodiment and / or for running computer program components that implement a module or unit. The circuit 1110 includes a memory 1122 for storing programming code, data, etc. A portion of the memory 1122 may be read-only. The circuit 1110 may include a communication element 1126, such as an antenna, a connector, or both. The circuit 1110 may include a dedicated integrated circuit 1124 for performing some or all of the processing defined in the method. The processor 1120, the memory 1122, the dedicated IC 1124, and the communication element 1126 may be connected to each other via an interconnect 1130, such as a bus. The processor system 1110 may be configured for contact and / or contactless communication using an antenna and / or connector, respectively.

[0232] For example, in an embodiment, the processor system 1140, e.g., the device, may include a processor circuit and a memory circuit, where the processor is configured to execute software stored in the memory circuit. For example, the processor circuit may be an Intel Core i7 processor, an ARM Cortex-R8, or the like. In an embodiment, the processor circuit may be an ARM Cortex M0. The memory circuit may be a ROM circuit or a non-volatile memory, e.g., flash memory. The memory circuit may be a volatile memory, e.g., SRAM memory. In the latter case, the device may include a non-volatile software interface, e.g., a hard drive, a network interface, or the like, configured to provide the software.

[0233] A controller for the light modulator, for example controlling the voltages applied to the electrodes, may comprise a processor circuit, but may also or alternatively comprise a state machine.

[0234] The following numbered clauses include contemplated, non-limiting examples:

[0235] Article 1. A dynamic glazing comprising a light modulator, the light modulator comprising: - a first substrate and a second substrate facing each other, wherein a plurality of interlaced mesh electrodes extend in a two-dimensional pattern across the first substrate and across the second substrate, and two mesh electrodes of the plurality of mesh electrodes on a substrate intersect at a plurality of crossing points distributed across the substrates; an optical layer between the first and second substrates, the optical layer comprising a fluid containing particles, the particles being charged or chargeable; a controller configured to apply an electric potential to the plurality of mesh electrodes to obtain an electromagnetic field between the plurality of mesh electrodes that causes modulation of an optical property of the optical modulator and results in electrophoresis of particles toward or from one of the plurality of mesh electrodes; Dynamic glazing.

[0236] Article 2. 10. The dynamic glazing of claim 1, wherein the controller is electrically connected to the plurality of mesh electrodes on the one or more substrates from a connection area on the substrate to minimize a potential difference between the plurality of mesh electrodes.

[0237] Article 3. At least two mesh electrodes on the substrate each include a plurality of main lines extending across the substrate in a first direction, the plurality of main lines of the at least two mesh electrodes being alternately arranged with respect to one another on the substrate, and each of the at least two mesh electrodes includes: - a plurality of interconnection lines electrically connecting main lines of the mesh electrode together, the plurality of main lines of the mesh electrode being connected to other main lines of the mesh electrode through a plurality of interconnections, the interconnection lines crossing another mesh electrode to form an intersection point.

[0238] Article 4. - a number of the main lines in the electrode have at least two interconnecting lines, said number being at least 2, at least 10, at least half of the number of main lines, at least 90% of the main lines, or substantially all of the main lines; and / or - the main line is connected to at least 2, at least 4, at least 8 or at least 16 interconnecting lines; and / or - the main line is connected to the interconnect within a distance of the edge of the board, the distance being less than 10% of the length of the main line; Dynamic glazing as described in clause 3.

[0239] Article 5. 5. The dynamic glazing of any one of clauses 1 to 4, wherein the plurality of intersection points are randomly distributed across the substrate.

[0240] Article 6. 6. The dynamic glazing of any one of clauses 3 to 5, wherein one or more of the main lines and / or interconnecting lines are straight or wavy.

[0241] Article 7. 7. The dynamic glazing of any one of clauses 1 to 6, wherein the two-dimensional pattern of mesh electrodes across the substrate comprises any one of equilateral triangular tiling, square tiling, or hexagonal tiling.

[0242] Article 8. 8. The dynamic glazing of any one of clauses 1 to 7, wherein the substrate is cut into a non-rectangular shape.

[0243] Article 9. the substrate includes current control components at the cross points; - the current control component comprises a dielectric at the crossover point, electrically isolating two intersecting mesh electrodes on the substrate from each other at the crossover point; or - a current control component configured to pass current for high thresholds of positive and negative voltages between the first and second mesh electrodes on the substrate at the crossover points, and to block current between the first and second mesh electrodes for other thresholds; 9. Dynamic glazing according to any one of clauses 1 to 8.

[0244] Article 10. 10. The dynamic glazing of any one of clauses 1 to 9, comprising a current control component between a first mesh electrode on the first substrate and a second mesh electrode on the second substrate, the current control component controlling the current between the first mesh electrode and the second mesh electrode.

[0245] Article 11. The current control component - a spacer that separates the first substrate and the second substrate from each other; and / or - Located at the top of the intersection, Dynamic glazing as described in clause 10.

[0246] Article 12. - at least three mesh electrodes are applied to at least one of the first substrate and the second substrate; or - Dynamic glazing according to any one of clauses 1 to 11, wherein at least three mesh electrodes are applied to both the first substrate and the second substrate.

[0247] Article 13. A dynamic glazing described in any one of clauses 1 to 12, wherein the mesh electrode on the first substrate and / or the second substrate is arranged on a first side of the substrate and has a plurality of vias connecting the mesh electrode to a second side of the substrate, the vias being connectable to a controller.

[0248] Article 14. 14. The dynamic glazing of clause 13, wherein the vias are arranged in a plurality of groups of vias across the substrate, and each of the mesh electrodes on the substrate is connected to a via in a group of vias, and the vias in a group of vias are at a distance of at most the lower spacing limit and the group of vias are at a distance of at least the upper spacing limit.

[0249] Article 15. 15. A dynamic glazing according to any one of clauses 1 to 14, wherein one or more mesh electrodes on the first substrate are connected to connection points on the second substrate through conductive spacers and from the connection points to a controller.

[0250] Article 16. 1. A dynamic glazing having a transparent state and a non-transparent state, or a reflective state and a non-reflective state, the dynamic glazing comprising: - switching to a non-transparent or non-reflective state by creating an AC voltage on at least one of the first and second substrates and applying an AC current between at least the first and second mesh electrodes on the first substrate and / or the first and second mesh electrodes on the second substrate; - switching to a transparent state or a reflective state by creating an AC voltage between the first substrate and the second substrate and applying an AC current between a first mesh electrode on the first substrate and a first mesh electrode on the second substrate and / or a second mesh electrode on the first substrate and a second mesh electrode on the second substrate. 16. The dynamic glazing of any one of clauses 1 to 15, configured so that

[0251] Article 17. An optical modulator, - a first substrate and a second substrate facing each other, wherein a plurality of interlaced mesh electrodes extend in a two-dimensional pattern across the first substrate and across the second substrate, and two mesh electrodes of the plurality of mesh electrodes on a substrate intersect at a plurality of crossing points distributed across the substrates; - an optical layer between a first substrate and a second substrate, the optical layer comprising a fluid containing particles, the particles being charged or chargeable; - a controller configured to apply an electric potential to the plurality of mesh electrodes to obtain an electromagnetic field between the plurality of mesh electrodes that causes modulation of an optical property of the optical modulator, the electromagnetic field resulting in electrophoresis of particles toward or from one of the plurality of mesh electrodes.

[0252] Article 18. A substrate for use in an optical modulator, the substrate having a plurality of interlaced mesh electrodes extending in a two-dimensional pattern across the substrate, two of the plurality of mesh electrodes on the substrate intersecting at a plurality of intersection points distributed across the substrate, the plurality of mesh electrodes configured such that, due to an electric potential applied to the plurality of mesh electrodes, an electromagnetic field is obtained between the plurality of mesh electrodes, resulting in electrophoresis of particles.

[0253] Article 19. 1. A method of manufacturing a substrate for use in an optical modulator, comprising: - a method of manufacturing a substrate, comprising providing a substrate and applying a plurality of interlaced mesh electrodes on the substrate, the plurality of interlaced mesh electrodes extending in a two-dimensional pattern across the substrate, and two mesh electrodes of the plurality of mesh electrodes on the substrate intersecting at a plurality of intersections distributed across the substrate.

[0254] Article 20. - the plurality of mesh electrodes each comprising a plurality of main lines, the method comprising applying the main lines of the plurality of mesh electrodes to a substrate, the main lines of the plurality of electrodes being arranged alternately with respect to one another on the substrate; - applying a plurality of interconnection lines on the substrate electrically connecting a plurality of main lines, wherein a mesh electrode of the plurality of electrodes includes a plurality of interconnections electrically connecting the main lines of the mesh electrode together, and the main lines of the electrode are connected to other main lines through the plurality of interconnections; 20. A method of manufacturing a substrate according to clause 19, comprising:

[0255] Article 21. - patterning a plurality of conductive interconnects on a substrate and coating the substrate with a dielectric prior to applying a plurality of main lines; - connecting the plurality of conductive main wires of the mesh electrode to a conductive interconnect; 21. A method of manufacturing a substrate according to clause 20, comprising:

[0256] Article 22. - applying a current control component on a plurality of conductive main lines; - applying a plurality of interconnection lines on top of the current control component to connect the plurality of conductive main lines into the plurality of interlaced mesh electrodes on the substrate; 21. A method of manufacturing a substrate according to clause 20, comprising:

[0257] Article 23. - applying a first mesh electrode onto a substrate; - applying a current control component onto a first mesh electrode; - applying a second mesh electrode onto the substrate, the second mesh electrode being insulated from the first mesh electrode through a current component; 20. A method of manufacturing a substrate according to clause 19, comprising:

[0258] Article 24. - coating a substrate with a first conductive layer and patterning the first conductive layer to form interconnects; - coating the substrate with a dielectric deposit and patterning it to form an insulating patch on top of the interconnect; - coating the substrate with a second conductive layer; - patterning the first and second conductive layers to form a plurality of mesh electrodes; 20. A method of manufacturing a substrate according to clause 19, comprising:

[0259] Article 25. - Cutting shapes from a substrate 20. A method of manufacturing a substrate for use in an optical modulator according to clause 19, comprising:

[0260] Article 26. - a first substrate and a second substrate facing each other, wherein a plurality of interlaced mesh electrodes extend in a two-dimensional pattern across the first substrate and across the second substrate, and two mesh electrodes of the plurality of mesh electrodes on a substrate intersect at a plurality of crossing points distributed across the substrates; an optical layer between a first substrate and a second substrate, the optical layer comprising a fluid containing particles, the particles being charged or chargeable; - To provide - cutting shapes from the assembled first substrate, second substrate and optical layer; - Closing the edges of the cut shapes and A method for manufacturing an optical modulator, comprising:

[0261] Article 27. - providing electrical connectors for both mesh electrodes on the substrate at the connection area; 27. A method of manufacturing an optical modulator according to any one of clauses 19 to 26.

[0262] Article 28. 27. A method of manufacturing a light modulator according to clause 25 or 26, wherein cutting a shape comprises cutting a hole in the assembly.

[0263] Article 29. - providing an optical modulator, the optical modulator comprising: - a first substrate and a second substrate facing each other, wherein a plurality of interlaced mesh electrodes extend in a two-dimensional pattern across the first substrate and across the second substrate, and two mesh electrodes of the plurality of mesh electrodes on a substrate intersect at a plurality of crossing points distributed across the substrates; - an optical layer between a first substrate and a second substrate, the optical layer comprising a fluid containing particles, the particles being charged or chargeable; a controller configured to apply an electric potential to the plurality of mesh electrodes to obtain an electromagnetic field between the plurality of mesh electrodes, resulting in electrophoresis of particles toward or from one of the plurality of mesh electrodes, causing modulation of an optical property of the optical modulator; To be equipped with - Selecting an alternating current or voltage and applying the alternating current or voltage to the electrodes to obtain an electromagnetic field between the electrodes that causes modulation of the optical properties of the light modulator, resulting in electrophoresis of particles towards or away from the electrodes. A dynamic glazing method comprising:

[0264] Article 30. A transitory or non-transitory computer readable medium containing data representing instructions that, when executed by a processor system, cause the processor system to perform the method of clause 29.

[0265] It should be noted that the above-described embodiments illustrate rather than limit the subject matter of this disclosure, and that those skilled in the art will also be able to design many alternative embodiments.

[0266] In the claims, reference signs placed between parentheses shall not be construed as limiting the claim. Use of the verb "comprise" and its conjugations does not exclude the presence of elements or steps other than those stated in a claim. The article "a" or "an" before an element does not exclude the presence of a plurality of such elements. Phrases such as "at least one of," when preceding a list of elements, denote selection of all or any subset of the elements from that list. For example, the phrase "at least one of A, B, and C" should be understood as including A only, B only, C only, both A and B, both A and C, both B and C, or all of A, B, and C. The subject matter of the present disclosure may be implemented by hardware comprising several distinct elements and by a suitably programmed computer. In device claims reciting several parts, several of those parts may be embodied by one and the same item of hardware. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.

[0267] In the claims, reference signs in parentheses refer to the reference signs in the drawings of the illustrated embodiments or formulas of the embodiments, thus making the claims easier to understand. These references should not be construed as limiting the scope of the claims.

Claims

1. A substrate (200) for use in an electrophoretic light modulator, comprising: - a plurality of interlaced mesh electrodes (210, 230) extending in a two-dimensional pattern across a substrate, at least two of the plurality of mesh electrodes on the substrate intersecting at a plurality of intersection points (251) distributed across the substrate, each of the at least two mesh electrodes on the substrate comprising a plurality of main lines extending in a first direction across the substrate, the plurality of main lines of the at least two mesh electrodes being alternately arranged with respect to each other on the substrate, each of the at least two mesh electrodes comprising: a substrate comprising a plurality of interconnecting lines (221-223) electrically connecting together a plurality of main lines of the mesh electrode, the main lines of the mesh electrode being connected through the plurality of interconnecting lines, the plurality of interconnecting lines of the mesh electrode intersecting with another mesh electrode on the substrate to form a plurality of intersections, the plurality of mesh electrodes being configured such that, due to potentials applied to the plurality of mesh electrodes, an electric field is obtained between the plurality of mesh electrodes to result in electrophoretic movement of particles.

2. 1. An electrophoretic light modulator comprising: a first substrate and a second substrate facing each other, said first substrate and said second substrate both being a substrate according to claim 1; an optical layer between the first substrate and the second substrate, the optical layer comprising a fluid containing particles, the particles being charged or chargeable; a controller configured to apply an electric potential to the plurality of mesh electrodes to obtain an electric field between the plurality of mesh electrodes, resulting in electrophoretic movement of particles toward or from one of the plurality of mesh electrodes, causing modulation of an optical property of the light modulator; and An optical modulator comprising:

3. at least two of the plurality of main lines are provided with at least two of the plurality of interconnecting lines; and / or one of the main lines is connected to at least two interconnection lines; 3. The optical modulator according to claim 2.

4. The optical modulator of claim 2 , wherein the plurality of crossover points are randomly distributed across the first and / or second substrate.

5. The optical modulator of claim 2 , wherein one or more of the plurality of main lines and / or the plurality of interconnecting lines are straight or wavy.

6. 3. The optical modulator of claim 2, wherein the two-dimensional pattern of mesh electrodes across the first and / or second substrates comprises equilateral triangular tiling, square tiling, or hexagonal tiling.

7. The optical modulator of claim 2 wherein the first and second substrates are cut into non-rectangular shapes.

8. the first and / or second substrates include current control components at intersections of the plurality of intersections; the current control component comprises a dielectric at its cross-point, electrically insulating at least two mesh electrodes on each substrate from each other at the cross-point; or a current control component configured to pass current for high thresholds of positive and negative voltages between at least two mesh electrodes on each substrate at their crossing points, and to block current between the at least two mesh electrodes at other times; 3. The optical modulator according to claim 2.

9. 3. The optical modulator of claim 2, further comprising a current control component between a first mesh electrode of the at least two mesh electrodes on the first substrate and a second mesh electrode of the at least two electrodes on the second substrate, the current control component controlling the current between the first mesh electrode and the second mesh electrode.

10. The current control component - a spacer that separates the first and second substrates from each other; and / or - Located at the top of one of several intersections, 10. The optical modulator according to claim 9.

11. at least three mesh electrodes are applied to at least one of the first and second substrates, or - at least three mesh electrodes are applied to both the first and second substrates; 3. The optical modulator according to claim 2.

12. 3. The optical modulator of claim 2, wherein at least two mesh electrodes on the first substrate and / or the second substrate are disposed on a first side of the respective substrates, and the optical modulator comprises a plurality of vias connecting the at least two mesh electrodes to a second side of the respective substrates, the vias being connectable to a controller.

13. 13. The optical modulator of claim 12, wherein a plurality of vias are arranged in a plurality of groups of vias on each substrate, each group of vias including a plurality of vias, each of at least two mesh electrodes on each substrate is connected to a via in a group of vias, vias in the same group of vias are spaced apart from each other at a distance of at most a lower spacing limit, and groups of vias are spaced apart from each other at a distance of at least a higher spacing limit.

14. 3. The optical modulator of claim 2, wherein one or more of the at least two mesh electrodes on the first substrate connect to connection points on the second substrate through conductive spacers and from the connection points to the controller.

15. having transparent and non-transparent states, or reflective and non-reflective states; - switching to a non-transparent or non-reflective state by creating an AC voltage on at least one of the first and second substrates and applying an AC current between at least a first and a second mesh electrode of the plurality of mesh electrodes on the first substrate and / or between a first and a second mesh electrode of the plurality of mesh electrodes on the second substrate; - switching to a transparent or reflective state by creating an AC voltage between the first and second substrates and applying an AC current between a first mesh electrode of the plurality of mesh electrodes on the first substrate and a first mesh electrode of the plurality of mesh electrodes on the second substrate and / or between a second mesh electrode of the plurality of mesh electrodes on the first substrate and a second mesh electrode of the plurality of mesh electrodes on the second substrate. The optical modulator according to claim 2 , configured as follows:

16. Dynamic glazing comprising a light modulator according to any one of claims 2 to 15.

17. A method for manufacturing a substrate (200) for use in an electrophoretic light modulator, the method comprising: providing a substrate and applying a plurality of interlaced mesh electrodes (210, 230) on the substrate, the plurality of interlaced mesh electrodes extending in a two-dimensional pattern across the substrate, at least two of the plurality of mesh electrodes on the substrate intersecting at a plurality of intersection points (251) distributed across the substrate, each of the at least two mesh electrodes on the substrate comprising a plurality of main lines extending in a first direction across the substrate, the plurality of main lines of the at least two mesh electrodes being alternately arranged with respect to each other on the substrate, each of the at least two mesh electrodes comprising: - a plurality of interconnecting lines (221-223) electrically connecting together a plurality of main lines of the mesh electrode, the main lines of the mesh electrode being connected through the plurality of interconnecting lines, the plurality of interconnecting lines of the mesh electrode intersecting with another mesh electrode on the substrate to form a plurality of intersections, the plurality of mesh electrodes being configured such that, due to potentials applied to the plurality of mesh electrodes, an electric field is obtained between the plurality of mesh electrodes, resulting in electrophoretic movement of the particles; A method for manufacturing a substrate.

18. - patterning a plurality of conductive interconnect lines on a substrate and coating the substrate with a dielectric before applying a plurality of main lines; - connecting a plurality of conductive main lines of the mesh electrode to a conductive interconnection line; The method for manufacturing a substrate according to claim 17, comprising:

19. - applying a current control component on a plurality of main conductive lines; - applying a plurality of interconnection lines on top of the current control component to connect the plurality of conductive main lines into the plurality of interlaced mesh electrodes on the substrate; The method for manufacturing a substrate according to claim 17, comprising:

20. - applying a first mesh electrode onto the substrate; - applying a current control component onto a first mesh electrode; applying a second mesh electrode onto the substrate, the second mesh electrode being insulated from the first mesh electrode through a current component; The method for manufacturing a substrate according to claim 17, comprising:

21. - coating a substrate with a first conductive layer and patterning the first conductive layer to form a plurality of interconnect lines; - coating the substrate with a dielectric deposit and patterning it to form insulating patches on top of the plurality of interconnect lines; - coating the substrate with a second conductive layer; patterning the first and second conductive layers to form a plurality of mesh electrodes; The method for manufacturing a substrate according to claim 17, comprising:

22. - Cutting shapes from a substrate 20. A method for manufacturing a substrate used in the optical modulator of claim 17, comprising:

23. 1. A method of manufacturing an electrophoretic light modulator, comprising: a first substrate and a second substrate, both of which are substrates according to claim 2, facing each other; an optical layer between a first substrate and a second substrate, the optical layer comprising a fluid containing particles, the particles being charged or chargeable; - To establish A method for manufacturing an optical modulator, comprising:

24. - providing electrical connectors to both mesh electrodes on the substrate in the connection area; 24. A method for manufacturing the optical modulator of claim 23.

25. the first substrate, the second substrate, and the optical layer form an assembly; The method comprises: - cutting a shape from said assembly, wherein cutting a shape optionally comprises cutting a hole in said assembly; - Closing the edges of the cut shapes; 24. A method of manufacturing the optical modulator of claim 23, comprising:

26. - providing an optical modulator according to any one of claims 2 to 15, - selecting an alternating current or voltage and applying the alternating current or voltage to the plurality of mesh electrodes to obtain an electric field between the plurality of mesh electrodes, resulting in electrophoretic movement of particles towards or away from the electrodes, causing modulation of the optical properties of the light modulator; A dynamic glazing method comprising:

27. 27. A transitory or non-transitory computer readable medium containing data representing instructions that, when executed by a processor system, cause the processor system to perform the method of claim 26.

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