Integrated encapsulating sheet, light-emitting electronic component, and method for manufacturing light-emitting electronic component

Abstract

To provide an integrated sealing sheet that not only fills the space between multiple light-emitting elements with light-diffusion-preventive resin but also completes the sealing process with a single crimp, and that does not prevent light from the light-emitting elements from reaching the viewer's side, a light-emitting electronic component using this integrated sealing sheet, and a method for manufacturing light-emitting electronic components.SOLUTION: The integrated sealing sheet 1 is an integrated sealing sheet 1 that is crimped onto the surface of a substrate 10 with a plurality of light emitting elements arranged on the substrate 11, and has a black curable resin layer 2, a transparent curable resin layer 3, a coating curable layer 4, and a hard coat layer 5, which are sequentially laminated from the side that is placed in contact with the substrate 10 with elements during the crimping.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an integrated encapsulant sheet, a light-emitting electronic component, and a method for manufacturing a light-emitting electronic component. [Background technology]

[0002] In recent years, display technologies called mini-LED and micro-LED, which use extremely small light-emitting diodes, have been attracting attention. Mini LEDs and micro LEDs can be used in two ways: One is a technology that allows for localized control of the brightness of an LCD backlight by configuring a large number of LEDs arranged on a substrate. The other system uses LEDs of the respective colors to emit the R (red), G (green), and B (blue) that make up a pixel, and the highly pure colors emitted by the LEDs of each color reach the eye as they are.

[0003] Mini LEDs and micro LEDs use electronic components with multiple light-emitting elements arranged on a substrate. Such electronic components use a dry film to fill the spaces between the multiple light-emitting elements with a resin that prevents light diffusion (Patent Document 1). A dry film is a resin film obtained by applying a curable resin composition onto a protective film and drying it. This is then pressed onto the surface of the substrate on which the light-emitting elements are arranged, filling the spaces between the light-emitting elements, and then curing.

[0004] When the dry film is pressure-bonded to the surface of the substrate on which the light emitting elements are arranged, a resin layer having light diffusion preventing properties is inevitably formed not only between the light emitting elements but also on the light emitting elements. If the light diffusion preventing resin layer formed on the light emitting elements is left as it is, not only will light be diffused between the light emitting elements, but light that should be emitted toward the viewer will also be blocked. Therefore, Patent Document 1 describes that after the dry film is pressed, the resin on the light-emitting element is removed by etching such as plasma treatment, and the exposed light-emitting element is covered with a light-transmitting sealant. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2022-22562 Summary of the Invention [Problem to be solved by the invention]

[0006] However, etching such as plasma treatment takes a long time, which increases manufacturing costs. In addition, it is difficult to completely remove the resin on the light-emitting element by etching, making it difficult to completely prevent the light that should be emitted toward the viewer from diffusing.

[0007] Furthermore, in order to provide a sealing material layer on the outermost surface, it is necessary to further laminate a dry film of sealing material. In view of the above circumstances, the present invention aims to provide an integrated encapsulating sheet that not only fills spaces between multiple light-emitting elements with a light-diffusion preventing resin but also completes the sealing process with a single pressing operation, and does not prevent light from the light-emitting elements from reaching the viewer, as well as a light-emitting electronic component and a method for manufacturing a light-emitting electronic component using this integrated encapsulating sheet. [Means for solving the problem]

[0008] As a result of earnest research into achieving the above-mentioned object, the present inventors have found that the above-mentioned object can be achieved by providing an integrated encapsulating sheet including a black curable resin layer, a transparent curable resin layer, a coating cured layer, and a hard coat layer, which are sequentially laminated, and have thus completed the present invention.

[0009] The present invention includes the following aspects. [1] An integrated encapsulating sheet that is pressure-bonded to a surface of an element-mounted substrate on which a plurality of light-emitting elements are arranged, the surface comprising: An integrated encapsulating sheet comprising a black curable resin layer, a transparent curable resin layer, a coating cured layer, and a hard coat layer, which are laminated in this order from the side that will be in contact with the element-mounted substrate during the pressure bonding.

[0010] [2] The integrated encapsulating sheet according to [1], wherein the black curable resin layer and the transparent curable resin layer are in an uncured state. [3] The integrated encapsulating sheet according to [1] or [2], wherein the storage modulus of the transparent curable resin layer in an uncured state at 100°C is greater than the storage modulus of the black curable resin layer in an uncured state.

[0011] [4] At 100°C, the black curable resin layer has a storage modulus of 1.0 × 10 in an uncured state. 2 Pa or more, 1.0×10 5 The integrated encapsulating sheet according to any one of [1] to [3], wherein the tensile strength is 100 Pa or less. [5] At 100°C, the storage modulus of the transparent curable resin layer in an uncured state is 1.0 × 10 4 Pa or more, 1.0×10 7 The integrated encapsulating sheet according to any one of [1] to [4], wherein the tensile strength is 100 Pa or less. [6] At 100°C, the storage modulus of the cured coating layer is 1.0 × 10 5 Pa or more, 1.0×10 10 The integrated encapsulating sheet according to any one of [1] to [5], wherein the tensile strength is 100 Pa or less.

[0012] [7] The integrated encapsulating sheet according to any one of [1] to [6], wherein the black curable resin layer has Lab values ​​in a cured state of L: 3 to 15, a: -3 to 5, and b: -3 to 10. [8] The integrated encapsulating sheet according to any one of [1] to [7], wherein the black curable resin layer contains a black pigment or a black dye. [9] The integrated encapsulating sheet according to any one of [1] to [8], wherein the transparent curable resin layer has a total light transmittance of 30 to 99% in a cured state.

[0013]

[10] The integrated encapsulating sheet according to any one of [1] to [9], wherein at least one of the black curable resin layer and the transparent curable resin layer contains at least one resin selected from an epoxy resin, an acrylic resin, a polyester resin, and a polyurethane resin, and a curing agent.

[11] The integrated encapsulating sheet according to any one of [1] to

[10] , wherein the black curable resin layer contains at least one resin selected from an epoxy resin, an acrylic resin, a polyester resin, and a polyurethane resin, and a curing agent.

[12] The integrated encapsulating sheet according to any one of [1] to

[11] , wherein the transparent curable resin layer contains at least one resin selected from an epoxy resin, an acrylic resin, a polyester resin, and a polyurethane resin, and a curing agent.

[0014]

[13] The integrated encapsulating sheet according to any one of [1] to

[12] , wherein the cured coating layer has a total light transmittance of 30 to 99%.

[14] The integrated encapsulating sheet according to any one of [1] to

[13] , wherein the cured coating layer contains at least one resin selected from an epoxy resin, an acrylic resin, a polyester resin, and a polyurethane resin.

[15] The integrated sealing sheet according to any one of [1] to

[14] , wherein the thickness of the cured coating layer is 10 to 250 μm.

[0015]

[16] The integrated encapsulating sheet according to any one of [1] to

[15] , wherein the hard coat layer contains one or more resins selected from an acrylic resin, a urethane resin, a silicone resin, and a melamine resin.

[17] The all-in-one encapsulating sheet according to any one of [1] to

[16] , wherein the hard coat layer has a total light transmittance of 30 to 99%.

[0016]

[18] The all-in-one encapsulating sheet according to any one of [1] to

[17] , wherein the pencil hardness of the surface of the hard coat layer is H or more.

[19] The all-in-one encapsulating sheet according to any one of [1] to

[18] , wherein the surface roughness Ra of the surface of the hard coat layer is 0.1 to 1 μm.

[20] The all-in-one encapsulating sheet according to any one of [1] to

[19] , wherein the reflectance of the hard coat layer side is 10 to 50%.

[0017]

[21] The integrated encapsulating sheet according to any one of [1] to

[20] , wherein the total light transmittance of the three layers, namely the transparent curable resin layer, the cured coating layer, and the hard coat layer, as a whole is 30 to 95%.

[22] The all-in-one sealing sheet according to any one of [1] to

[21] , which has a protective film on one or both surfaces of the curable resin layer and the hard coat layer.

[0018]

[23] A substrate with elements on which a plurality of light-emitting elements are arranged, and the integrated encapsulating sheet according to any one of [1] to

[22] , which is pressure-bonded to a surface of the substrate with elements on which the plurality of light-emitting elements are arranged, the black curable resin layer and the transparent curable resin layer are cured, A light-emitting electronic component, characterized in that the black curable resin layer and a part of the transparent curable resin layer are filled between the plurality of light-emitting elements.

[0019]

[24] An element-mounted substrate having a plurality of light-emitting elements arranged on a substrate is provided with the integrated encapsulating sheet according to any one of [1] to

[23] arranged on a surface on which the plurality of light-emitting elements are arranged so that the black curable resin layer is in contact with the surface; The black curable resin layer and a part of the transparent curable resin layer are filled between the plurality of light-emitting elements by pressing, The method for producing a light-emitting electronic component includes curing the black curable resin layer and the transparent curable resin layer by heating.

[0020]

[25] The method for producing a light-emitting electronic component according to

[24] , wherein the thickness of the black curable resin layer before the pressure bonding is 10 to 95% of the height of the light-emitting element.

[26] The method for producing a light-emitting electronic component according to

[24] or

[25] , wherein the thickness of the transparent curable resin layer before the pressure bonding is 10 to 500% of the height of the light-emitting element.

[27] The method for producing a light-emitting electronic component according to any one of

[24] to

[26] , wherein the total thickness of the black cured resin layer and the transparent cured resin layer before the pressure-bonding is 110 to 550% of the height of the light-emitting element. [Effects of the Invention]

[0021] According to the integrated encapsulating sheet of the present invention, not only can the light diffusion preventing resin be filled between a plurality of light emitting elements by a single compression bonding, but also the sealing process can be completed without preventing light from the light emitting elements from reaching the viewer side. Furthermore, according to the light emitting electronic component and the method for manufacturing the light emitting electronic component using this integrated encapsulating sheet, a light emitting electronic component with sufficient brightness can be easily obtained. [Brief explanation of the drawings]

[0022] [Figure 1] FIG. 1 is a schematic cross-sectional view of an integrated encapsulating sheet according to one embodiment of the present invention. [Figure 2] 1A to 1C are schematic explanatory diagrams illustrating a method for manufacturing a light-emitting electronic component according to an embodiment of the present invention. [Figure 3] 1A to 1C are schematic explanatory diagrams illustrating a method for manufacturing a light-emitting electronic component according to an embodiment of the present invention. [Figure 4] 1A to 1C are schematic explanatory diagrams illustrating a method for manufacturing a light-emitting electronic component according to an embodiment of the present invention. [Figure 5] 1A to 1C are schematic explanatory diagrams illustrating a method for manufacturing a light-emitting electronic component according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0023] In this specification and claims, the term "major component" refers to a component that accounts for 50% by mass or more of the total nonvolatile content of the entire composition. A numerical range expressed by "to" refers to a numerical range in which the numbers before and after "to" are the lower and upper limits.

[0024] <Integrated sealing sheet> An all-in-one encapsulating sheet 1 according to one embodiment of the present invention will be described with reference to Figures 1 and 2. As shown in Figure 1, the all-in-one encapsulating sheet 1 is basically configured by laminating a black cured resin layer 2, a transparent cured resin layer 3, a coating cured layer 4, and a hard coat layer 5.

[0025] The one-piece encapsulating sheet 1 of the present embodiment may further have a protective film on the surface of either or both of the black curable resin layer 2 and the hard coat layer 5 for ease of handling. 1 shows an example in which protective films are provided on the surfaces of both the black curable resin layer 2 and the hard coat layer 5. Specifically, the black curable resin layer 2, the transparent curable resin layer 3, the coating cured layer 4, the hard coat layer 5, and the second protective film 7 are sequentially laminated on the first protective film 6.

[0026] 2, the integrated encapsulating sheet 1 is used to fill spaces between a plurality of light-emitting elements of a substrate 10 with elements arranged on a substrate 11. The substrate 10 with elements will be described in detail later. The integrated encapsulating sheet 1 is used in such a manner that the black curable resin layer 2 comes into contact with the element-mounted substrate 10 during pressure bonding, as shown in FIG.

[0027] The black curable resin layer 2 and the transparent curable resin layer 3 of the integrated encapsulating sheet 1 are in an uncured state until pressure bonding to the element-mounted substrate 10 is completed. A specific method for obtaining a light-emitting electronic component by pressure-bonding the integrated encapsulating sheet 1 to the element-mounted substrate 10 will be described later.

[0028] <Black curable resin layer> The black curable resin layer 2 is a layer that prevents light diffusion between light emitting elements and improves the contrast of the display. Furthermore, this layer is used to sufficiently fill the spaces between multiple light-emitting elements arranged on the element-mounted substrate 10 during the thermocompression bonding process, preventing poor appearance due to expansion of unfilled voids during the thermal curing process and damage to the light-emitting elements due to external factors in subsequent processes.

[0029] [Lab value] The black curable resin layer 2 preferably has Lab values ​​of L: 3 to 15, a: -3 to 5, and b: -3 to 10 in a cured state, and more preferably L: 3 to 10, a: -2 to 4, and b: -2 to 5. When the Lab value in the cured state is within the preferred range, light diffusion between light-emitting elements can be further prevented, and the contrast of the display can be improved.

[0030] [Total light transmittance] The black curable resin layer 2 has a low total light transmittance in its cured state. Specifically, it is prepared so that the total light transmittance in its cured state is 0 to 50%. The black curable resin layer 2 is preferably prepared so that the total light transmittance in its cured state is 0 to 40%, and more preferably 0 to 30%. When the total light transmittance of the black curable resin layer 2 in a cured state is equal to or less than the upper limit, light diffusion between the light emitting elements can be prevented.

[0031] The total light transmittance in this specification can be measured by a haze meter. The total light transmittance in the cured state can be adjusted mainly by the presence or absence of carbon black and the amount of carbon black added, as well as by the thickness of the resin layer and the type of resin.

[0032] [Storage modulus] The storage modulus of the black curable resin layer 2 in an uncured state is preferably smaller than the storage modulus of the transparent curable resin layer 3 in an uncured state. The storage modulus of the black curable resin layer 2 in an uncured state at 100°C is 1.0 × 10 5 Pa or less, and 1.0 × 10 2 Pa or more, 1.0×10 5 Pa or less, and 1.0 × 10 3 Pa or more, 5.0×10 4 It is more preferable that the viscosity is 0.05 Pa or less.

[0033] When the storage modulus of the black curable resin layer 2 at 100°C in an uncured state is equal to or less than the preferred upper limit, sufficient fluidity is obtained when the layer is pressed onto the element-mounted substrate 10, and the layer can conform to the unevenness of the element-mounted substrate 10 caused by the multiple light-emitting elements and sufficiently fill the spaces between the multiple light-emitting elements. When the storage modulus of the black curable resin layer 2 at 100°C in an uncured state is equal to or greater than the preferred lower limit, uneven pressure during thermocompression bonding can be prevented, maintaining a uniform appearance. In addition, outflow of the resin outside the range can be prevented, ensuring a film thickness after compression bonding.

[0034] [Curable resin composition] The black curable resin layer 2 is composed of a curable resin composition. Examples of the curable resin composition include a curable resin composition containing at least one resin selected from an epoxy resin, an acrylic resin, a polyester resin, and a polyurethane resin, and a curing agent.

[0035] Among these, epoxy resin compositions are preferred because they can be cured at low temperatures and have excellent heat resistance and reliability. In this specification, the epoxy resin composition refers to a composition containing an epoxy resin as a main component, or a composition containing an epoxy resin and a curing agent as main components.

[0036] (epoxy resin) In this specification and claims, an epoxy resin is a compound having an epoxy group in its molecule. The epoxy resin used in the present invention is preferably one having two or more epoxy groups in one molecule. This is because a crosslinked structure is formed by reaction with a modified resin having a functional group reactive with the epoxy group, and the cured product can exhibit high heat resistance. Furthermore, when an epoxy resin having two or more epoxy groups is used, the degree of crosslinking with a curing agent having a functional group reactive with the epoxy group is sufficient, and sufficient heat resistance can be obtained in the cured product.

[0037] (epoxy resin) Examples of epoxy resins include bifunctional epoxy resins having two epoxy groups in the molecule, multifunctional epoxy resins having three or more epoxy groups in the molecule, and high-molecular-weight epoxy resins having a weight-average molecular weight of 10,000 or more. Epoxy resins obtained by hydrogenating these resins may also be used. In this specification and claims, high molecular weight epoxy resins are not classified as difunctional epoxy resins or polyfunctional epoxy resins, but as phenoxy-type epoxy resins, regardless of the number of epoxy groups in the molecule. The weight-average molecular weight of the epoxy resin is the molecular weight measured by gel permeation chromatography in terms of polystyrene.

[0038] Examples of epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, phenoxy type epoxy resins obtained by polymerizing these resins, and hydrogenated versions of these resins; glycidyl ester epoxy resins such as phthalic acid diglycidyl ester, isophthalic acid diglycidyl ester, terephthalic acid diglycidyl ester, p-hydroxybenzoic acid glycidyl ester, tetrahydrophthalic acid diglycidyl ester, succinic acid diglycidyl ester, adipic acid diglycidyl ester, sebacic acid diglycidyl ester, and trimellitic acid triglycidyl ester; ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, Examples of epoxy resins that can be used include, but are not limited to, glycidyl ether-based epoxy resins such as 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane triglycidyl ether, pentaerythritol tetraglycidyl ether, tetraphenylglycidyl ether ethane, triphenylglycidyl ether ethane, sorbitol polyglycidyl ether, and polyglycerol polyglycidyl ether; glycidylamine-based epoxy resins such as triglycidyl isocyanurate and tetraglycidyldiaminodiphenylmethane; and linear aliphatic epoxy resins such as epoxidized polybutadiene and epoxidized soybean oil. Additionally, novolac-type epoxy resins such as xylene structure-containing novolac epoxy resins, naphthol novolac epoxy resins, phenol novolac epoxy resins, o-cresol novolac epoxy resins, and bisphenol A novolac epoxy resins can also be used.

[0039] Further, examples of epoxy resins that can be used include brominated bisphenol A type epoxy resins, phosphorus-containing epoxy resins, fluorine-containing epoxy resins, dicyclopentadiene skeleton-containing epoxy resins, naphthalene skeleton-containing epoxy resins, anthracene type epoxy resins, tertiary butyl catechol type epoxy resins, triphenylmethane type epoxy resins, tetraphenylethane type epoxy resins, biphenyl type epoxy resins, and bisphenol S type epoxy resins.

[0040] Examples of high molecular weight epoxy resins that can be used include phenoxy type epoxy resins, epoxy-modified polybutadiene, copolymers of glycidyl methacrylate and methyl methacrylate, and modified polymers obtained by epoxy-modifying other resins. These epoxy resins may be used alone or in combination of two or more.

[0041] Among the above epoxy resins, the epoxy resin used in the black curable resin layer 2 is preferably a multifunctional epoxy resin from the viewpoint of increasing the crosslink density after curing. Among the polyfunctional epoxy resins, novolac-type epoxy resins are particularly preferred because they are epoxy resins into which a moderately flexible skeleton can be introduced and whose flexibility and softening point can be adjusted, making the cured product less susceptible to brittle fracture, improving the stability of performance over long-term use of the cured product of the epoxy resin composition, increasing the crosslink density, and improving heat resistance.

[0042] Specific examples of novolac-type epoxy resins include "YX7700" manufactured by Mitsubishi Chemical Corporation, "NC7000L", "XD1000", and "EOCN-1020" manufactured by Nippon Kayaku Co., Ltd., "ESN485" manufactured by Nippon Steel Chemical & Material Co., Ltd., and "N-690", "N-695", and "HP-7200H" manufactured by DIC Corporation.

[0043] The blending amount of the polyfunctional epoxy resin in the black curing resin layer 2 is preferably 10 to 99 mass%, more preferably 40 to 95 mass%, and even more preferably 60 to 90 mass%, relative to 100 mass% of the total resin non-volatile content of the black curing resin layer 2. When the blending amount is equal to or greater than the lower limit, the crosslinking density can be increased, thereby imparting chemical resistance and heat resistance. When the blending amount is equal to or less than the upper limit, the storage modulus during thermocompression bonding can be adjusted, thereby ensuring the fluidity of the black curing resin layer 2.

[0044] The black curable resin layer 2 preferably does not contain a high-molecular-weight epoxy resin, or if it does contain one, it preferably contains a smaller amount of the high-molecular-weight epoxy resin than the transparent curable resin layer 3. This makes it easier to ensure sufficient fluidity during thermocompression bonding. The amount of the high-molecular-weight epoxy resin in the black curable resin layer 2 is preferably less than 50% by mass, more preferably less than 30% by mass, and even more preferably less than 10% by mass, relative to 100% by mass of the total resin non-volatile content of the black curable resin layer 2.

[0045] From the viewpoint of ensuring sufficient fluidity during thermocompression bonding, the black curable resin layer 2 preferably contains an epoxy resin having a softening point or melting point of 100° C. or less. From the viewpoint of handleability and heat resistance of the cured product, it is more preferable that the black curable resin layer 2 contains an epoxy resin having a softening point or melting point of 50 to 95° C. By containing an epoxy resin having a softening point or melting point within the above range, it becomes possible to control the storage modulus.

[0046] The total amount of epoxy resin in the black curable resin layer 2 is preferably 10 to 100% by mass, more preferably 20 to 99% by mass, and even more preferably 35 to 95% by mass, relative to 100% by mass of the total resin non-volatile content of the black curable resin layer 2. Within this range, the storage modulus can be controlled and appropriate fluidity during thermocompression bonding can be ensured. Furthermore, if the amount is equal to or greater than the lower limit, heat resistance after curing can be improved.

[0047] (Elastomer) The black curable resin layer 2 preferably contains an elastomer in addition to a resin such as an epoxy resin, etc. By containing an elastomer, it becomes easier to control the storage modulus, that is, the fluidity.

[0048] As the elastomer, a thermosetting elastomer, commonly called "rubber," is preferred because it provides excellent heat resistance. Examples of thermosetting elastomers include acrylonitrile butadiene rubber (NBR), which is a random copolymer of butadiene and acrylonitrile, acrylic rubber, styrene butadiene rubber, vinyl acetate resin, and silicone resin. Among these, NBR is preferred because it has good compatibility with epoxy resins, allows control of the fluidity of the black curable resin layer 2 at around 100°C, and provides good adhesion to the transparent curable resin layer 3 and the element-mounted substrate 10.

[0049] The weight-average molecular weight of the elastomer is preferably 100,000 to 1,000,000, more preferably 120,000 to 500,000, and even more preferably 150,000 to 300,000. When the weight-average molecular weight of the elastomer is within the above range, the storage modulus of the black curable resin layer 2 can be controlled and fluidity during thermocompression bonding can be ensured. When the weight-average molecular weight of the elastomer is equal to or less than the above upper limit, compatibility with the epoxy resin is improved and fluidity during thermal curing can be more effectively controlled.

[0050] In particular, when the black curable resin layer 2 is composed of an epoxy resin composition, it preferably contains a modified elastomer having a functional group reactive with an epoxy group. A modified elastomer having a functional group reactive with an epoxy group also functions as a curing agent for the epoxy resin. Furthermore, because it can react and bond with the epoxy resin, it improves heat resistance and reliability against thermal shock. Furthermore, the difference in polarity between the functional group reactive with the epoxy resin and the resin backbone favorably affects dispersibility, resulting in good dispersibility when carbon black is incorporated into the black curable resin layer 2.

[0051] Examples of functional groups capable of reacting with epoxy groups include acid groups such as a carboxy group, a sulfo group, a nitro group, and a phosphate group, as well as acid anhydride groups thereof, a hydroxyl group, and an amino group. Of these, acid groups and acid anhydride groups are preferred, and carboxy groups and carboxylic anhydride groups are particularly preferred, as they allow curing at low temperatures and ensure a long usable time.

[0052] That is, when the black curable resin layer 2 is composed of an epoxy resin composition, it preferably contains an acid-modified elastomer having an acid group or an acid anhydride group, more preferably an acid-modified elastomer having a carboxy group, and particularly preferably a modified NBR having a carboxy group.

[0053] The modified NBR having a carboxy group is preferably a carboxylated acrylonitrile rubber into which acrylic acid, methacrylic acid, maleic anhydride, etc. are introduced. Commercially available carboxylated acrylonitrile rubbers include Nipol (registered trademark) NX775 and Nipol 1072CGJ manufactured by Zeon Corporation. Two or more types of modified elastomers having a functional group capable of reacting with an epoxy group may be used in combination.

[0054] The amount of elastomer blended in the black curable resin layer 2 is preferably greater than the amount of elastomer blended in the transparent curable resin layer 3. This allows the storage modulus of the black curable resin layer 2 during thermocompression bonding to be adjusted to an appropriate range lower than that of the transparent curable resin layer 3, and also allows flow during thermal curing to be suppressed, when the black curable resin layer 2 contains a large amount of low-molecular-weight components such as polyfunctional epoxy. As a result, the black curable resin layer 2 can have sufficient fluidity during thermocompression bonding and can be prevented from flowing out during thermal curing.

[0055] The amount of elastomer in the black curable resin layer 2 is preferably 0.01 to 90% by mass, more preferably 1 to 80% by mass, and even more preferably 5 to 65% by mass, relative to 100% by mass of the total resin non-volatile content of the black curable resin layer 2. Within this range, the storage modulus can be controlled, and appropriate fluidity during thermocompression bonding can be ensured. Furthermore, when the amount is equal to or greater than the lower limit, the dispersibility of carbon black is improved. Furthermore, film-forming properties are improved, and the film thickness distribution can be narrowed when the epoxy resin composition is applied to form a film.

[0056] (hardening agent) When the black curable resin layer 2 is made of an epoxy resin composition, it may contain a curing agent for epoxy resins other than the modified elastomer having a functional group reactive with an epoxy group. Examples of other curing agents include known curing agents such as phenol-based curing agents, acid anhydride-based curing agents, and amine-based curing agents. Two or more of the other curing agents may be used in combination.

[0057] (curing catalyst) When the black curable resin layer 2 is made of an epoxy resin composition, it may contain a curing catalyst that accelerates the curing reaction of the epoxy resin. Examples of the curing catalyst include imidazole-based, tertiary amine-based, and phosphorus compound-based catalysts. Among these, imidazole-based catalysts are preferred because they have good compatibility with epoxy resins and are less likely to cause yellowing. Among imidazole-based curing catalysts, those having a cyanoethyl group are particularly preferred because they are easily soluble in epoxy resins.

[0058] The blending amount of the curing catalyst is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 4 parts by mass, and even more preferably 0.1 to 3 parts by mass, relative to 100 parts by mass of the total resin non-volatile content of the black curing resin layer 2. When the blending amount is within the above range, curing can be sufficiently promoted and the usable life of the integrated encapsulating sheet 1 can be ensured. Two or more curing catalysts may be used in combination.

[0059] (black pigment or black dye) The black curable resin layer 2 is colored black. For coloring, it preferably contains a black pigment or a black dye, more preferably contains a black pigment, and even more preferably contains carbon black. By being colored black, it is possible to prevent light diffusion between the multiple light-emitting elements of the element-mounted substrate 10.

[0060] The particle size of the carbon black is preferably 10 to 500 nm, more preferably 10 to 300 nm, and particularly preferably 10 to 100 nm. The particle size refers to the average particle size and can be determined using a measuring device based on dynamic light scattering. An example of a measuring device based on dynamic light scattering is the NanotracWave II UT151 manufactured by Microtrack Bell.

[0061] As the carbon black, one or more types of known carbon black such as gas black, channel black, furnace black, thermal black, and lamp black can be used. Resin-coated carbon black may also be used. Furthermore, carbon nanofibers and carbon nanotubes may also be used.

[0062] Among these, gas black is preferred because it has a large amount of surface functional groups, high dispersibility, and exhibits sufficient light diffusion prevention function even with a small amount added. Furthermore, when the black curable resin layer 2 contains a modified elastomer having functional groups reactive with epoxy resins, the dispersibility is further improved due to the interaction between the surface functional groups of the gas black and the functional groups of the modified elastomer having functional groups reactive with epoxy resins, thereby ensuring good light diffusion prevention properties and coating liquid stability.

[0063] The amount of carbon black is preferably 0.1 to 15 mass %, and more preferably 1.0 to 10 mass %, based on the total amount of nonvolatile matter in the black curable resin layer 2. When the amount of carbon black is equal to or greater than the above-mentioned lower limit, sufficient light-blocking properties are obtained. When the amount of carbon black is greater than the above-mentioned upper limit, the thixotropy of the black curable resin layer 2 increases, the fluidity during thermocompression bonding decreases, and the gaps between the multiple light-emitting elements of the element-mounted substrate 10 cannot be sufficiently filled.

[0064] (Other ingredients) The black curable resin layer 2 may contain an inorganic filler to improve flame retardancy and heat resistance and to adjust the refractive index. The black curable resin layer 2 may further contain, as needed, resins other than epoxy resins and elastomers, thickeners, antifoaming agents and / or leveling agents, adhesion promoters such as coupling agents, and flame retardants.

[0065] <Transparent curable resin layer> The transparent curable resin layer 3 is a layer for sufficiently pressing the black curable resin layer 2 into spaces between the plurality of light emitting elements arranged on the element-mounted substrate 10 in the thermocompression bonding step.

[0066] [Total light transmittance] The transparent curable resin layer 3 is preferably prepared so that the total light transmittance in its cured state is 30 to 99%, more preferably 35 to 95%, and even more preferably 40 to 90%.

[0067] When the total light transmittance of the transparent curable resin layer 3 in a cured state is equal to or greater than the lower limit, even if the transparent curable resin layer 3 in a cured state remains on the light-emitting element, the light is not prevented from reaching the viewer.

[0068] [Storage modulus] The storage modulus of the transparent curable resin layer 3 in an uncured state is preferably greater than the storage modulus of the black curable resin layer 2 in an uncured state. At 100° C., the storage modulus of the transparent curable resin layer 3 in an uncured state is preferably greater than the storage modulus of the black curable resin layer 2 in an uncured state. Moreover, at 150° C., the storage modulus of the transparent curable resin layer 3 in an uncured state is preferably greater than the storage modulus of the black curable resin layer 2 in an uncured state.

[0069] The storage modulus of the transparent curable resin layer 3 in an uncured state is preferably greater than the storage modulus of the black curable resin layer 2 at temperatures between 100°C and 150°C. When the storage modulus of the transparent curable resin layer 3 in an uncured state is greater than the storage modulus of the black curable resin layer 2 in an uncured state at 100°C and 150°C, the storage modulus of the transparent curable resin layer 3 in an uncured state is generally greater than the storage modulus of the black curable resin layer 2 in an uncured state over the entire range of 100°C to 150°C.

[0070] The storage modulus of the transparent curable resin layer 3 in an uncured state is preferably greater than the storage modulus of the black curable resin layer 2 in an uncured state. The storage modulus of the transparent curable resin layer 3 in an uncured state is 1.0×10 5 Pa or less, and 1.0 × 10 4 Pa or more, 1.0×10 7 Pa or less, and 4 Pa or more, 5.0×10 6 It is more preferable that the viscosity is 0.05 Pa or less.

[0071] When the storage modulus of the transparent curable resin layer 3 at 100°C in an uncured state is equal to or less than the preferred upper limit, sufficient fluidity is obtained that does not hinder the flow of the black curable resin layer 2 when it is pressed onto the element-mounted substrate 10, and the black curable resin layer 2 can follow the unevenness of the element-mounted substrate 10 caused by the multiple light-emitting elements and sufficiently fill the spaces between the multiple light-emitting elements.

[0072] If the storage modulus of the transparent curable resin layer 3 at 100°C exceeds the preferred upper limit, the fluidity of the transparent curable resin layer 3 will be insufficient, making it impossible to sufficiently press the black curable resin layer 2 between the multiple light-emitting elements. In addition, cracks will occur in the transparent curable resin layer 3 during thermocompression bonding, making it more likely that crack-like defects will occur.

[0073] When the storage modulus of the transparent curable resin layer 3 at 100°C in an uncured state is equal to or greater than the preferred lower limit, it is easy to avoid the problem of the transparent curable resin layer 3 having such high fluidity that the surface of the transparent curable resin layer 3 becomes uneven to match the light emitting element after thermocompression bonding, resulting in poor appearance, and the problem of poor appearance such as repelling during thermal curing.

[0074] In an uncured state, the storage modulus of the transparent curable resin layer 3 at 150°C is 1.0 × 10 4 Pa or more, and 1.0 × 10 4 ~5.0×10 7 Pa, and preferably 1.0×10 5 ~5.0×10 6 Pa is more preferred. If the storage modulus of the transparent curable resin layer 3 at 150°C in an uncured state exceeds the preferred upper limit, cracks are likely to occur due to cure shrinkage during thermal curing. If the storage modulus of the transparent curable resin layer 3 at 150°C in an uncured state is equal to or greater than the preferred lower limit, flow during thermal curing can be suppressed, post-curing appearance defects such as repelling can be suppressed, and further, problems are less likely to occur when etching is performed in a subsequent process.

[0075] The storage modulus of the transparent curable resin layer 3 in an uncured state at 100°C is preferably 10 to 1,000 times, and more preferably 30 to 500 times, the storage modulus of the black curable resin layer 2. The storage modulus of the transparent curable resin layer 3 in an uncured state at 150°C is preferably 5 to 10,000 times, and more preferably 10 to 1,000 times, the storage modulus of the black curable resin layer 2. When the storage modulus of the transparent curable resin layer 3 is higher than that of the black curable resin layer 2 at 100°C and 150°C, the storage modulus of the transparent curable resin layer 3 is usually higher than that of the black curable resin layer 2 over the entire range of 100°C to 150°C.

[0076] [Curable resin composition] The transparent curable resin layer 3 is composed of a curable resin composition. As with the black curable resin layer 2, the curable resin composition may be a curable resin composition containing at least one resin selected from epoxy resin, acrylic resin, polyester resin, and polyurethane resin, and a curing agent. Among these, an epoxy resin composition is preferred because it can be cured at low temperatures and has excellent heat resistance and reliability.

[0077] (epoxy resin) Examples of epoxy resins used in the transparent curable resin layer 3 include the same types as those used in the black curable resin layer 2. The transparent curable resin layer 3 preferably contains a high-molecular-weight epoxy resin having a weight-average molecular weight of 10,000 to 100,000, from the viewpoint of being able to impart an appropriate viscosity during compression bonding to the transparent curable resin layer 3. It is more preferable that the transparent curable resin layer 3 contains a high-molecular-weight epoxy resin having a weight-average molecular weight of 10,000 to 35,000, from the viewpoint of having good compatibility with other resin components and being able to dissolve without mixing with a high-boiling-point solvent that may remain in the dry film even after drying.

[0078] By including a high molecular weight epoxy resin with a weight average molecular weight of 10,000 to 100,000 as the epoxy resin used in the transparent curable resin layer 3, the transparent curable resin layer 3 has an appropriate viscosity when heated, and therefore the storage modulus of the transparent curable resin layer 3 can be adjusted to a preferred range within the range of 100°C to 150°C. The high molecular weight epoxy resin used in the transparent curable resin layer 3 is preferably a phenoxy type epoxy resin because it has good compatibility with other epoxy resins.

[0079] Phenoxy-type epoxy resins have a relatively large molecular weight among epoxy resins and have an appropriate viscosity when heated, making it possible to adjust the storage modulus of the transparent curable resin layer 3 within a preferred range at temperatures between 100°C and 150°C. Furthermore, unlike other thermoplastic resins such as polyester, phenoxy-type epoxy resins can be cured as epoxy resins, which allows for an increase in crosslink density and does not impair the heat resistance of the cured product or the reliability of its performance over long-term use. From the viewpoint of ensuring a storage modulus sufficient to compress the black curable resin layer 2 during thermocompression bonding, the glass transition temperature of the phenoxy type epoxy resin used in the transparent curable resin layer 3 is preferably 100° C. or higher.

[0080] Specific examples of phenoxy-type epoxy resins include "1256," "YX7200," "YX8100," and "YX7180" manufactured by Mitsubishi Chemical Corporation, "YP-50," "YP-50S," and "YP-70" manufactured by Nippon Steel Chemical & Material Co., Ltd., "N-690" manufactured by DIC Corporation, and "H-157" and "EXA-192" manufactured by DIC Corporation.

[0081] The amount of the high molecular weight epoxy resin in the transparent curable resin layer 3 is preferably 30 to 80 mass %, more preferably 40 to 70 mass %, and even more preferably 45 to 60 mass %, relative to 100 mass % of the total resin non-volatile content of the transparent curable resin layer 3. The preferred blending amount of the phenoxy type epoxy resin in the transparent curable resin layer 3 is also the same.

[0082] Within the above range, the storage modulus can be controlled, and a storage modulus sufficient to compress the transparent curable resin layer 3 during thermocompression bonding can be ensured. Furthermore, flow during thermosetting can be suppressed, and post-curing appearance defects such as repelling can be suppressed. Furthermore, problems are less likely to occur when etching is performed in a subsequent process. Furthermore, toughness is improved, making it less likely that crack-like defects will occur during thermocompression bonding. Furthermore, when the content is equal to or less than the upper limit, the crosslink density of the transparent curable resin layer 3 in a cured state can be increased, and the heat resistance and chemical resistance can be improved.

[0083] Furthermore, it is preferable that the epoxy resin used in the transparent curable resin layer 3 contains a polyfunctional epoxy resin. The polyfunctional epoxy resin increases the crosslink density, thereby further improving the stability of the performance of the cured product of the epoxy resin composition over long-term use and also improving heat resistance. In addition, since the viscosity in the range of 100°C to 150°C is lower than that of phenoxy-type epoxy resin, the storage modulus of the transparent curable resin layer 3 can be adjusted by combining it with a phenoxy-type epoxy resin.

[0084] Specific examples of polyfunctional epoxy resins include "YX7700," "157S70," and "1032S60" manufactured by Mitsubishi Chemical Corporation, "NC7000L," "XD1000," and "EOCN-1020" manufactured by Nippon Kayaku Co., Ltd., "ESN485" manufactured by Nippon Steel Chemical & Material Co., Ltd., and "N-690," "N-695," and "HP-7200H" manufactured by DIC Corporation.

[0085] The blending amount of the polyfunctional epoxy resin in the transparent curable resin layer 3 is preferably 90% by mass or less, more preferably 10 to 80% by mass, and even more preferably 35 to 70% by mass, relative to 100% by mass of the total resin non-volatile content of the transparent curable resin layer 3. Within the above range, the storage modulus of the transparent curable resin layer 3 during thermocompression bonding can be controlled, and heat resistance and chemical resistance can be imparted in the cured state.

[0086] From the viewpoint of ensuring sufficient fluidity during thermocompression bonding, the transparent curable resin layer 3 preferably contains an epoxy resin having a softening point or melting point of 120°C or less. From the viewpoint of handleability and heat resistance of the cured product, it is more preferable that the transparent curable resin layer 3 contains an epoxy resin having a softening point or melting point of 50 to 105°C. By containing an epoxy resin having a softening point or melting point within the above range, it becomes possible to control the storage modulus.

[0087] The total amount of epoxy resin in the transparent curable resin layer 3 is preferably 10 to 100% by mass, more preferably 30 to 99% by mass, and even more preferably 50 to 95% by mass, relative to 100% by mass of the total resin non-volatile content of the transparent curable resin layer 3. Within this range, the storage modulus can be controlled, and a storage modulus sufficient to compress the black curable resin layer 2 during thermocompression bonding can be ensured. Furthermore, flow during thermal curing can be suppressed, and post-curing appearance defects such as repelling can be suppressed, and further, problems are less likely to occur when etching is performed in a subsequent process. Furthermore, when the amount is equal to or greater than the above lower limit, heat resistance in the cured state is improved.

[0088] (Elastomer) The transparent curable resin layer 3 preferably contains an elastomer in addition to a resin such as an epoxy resin, etc. By containing an elastomer, it becomes easier to control the storage modulus. Examples of the elastomer include the same types as those for the black curable resin layer 2. Among them, NBR is preferred because it has good compatibility with epoxy resins, can increase the storage modulus of the transparent curable resin layer 3 at around 150°C, and has good adhesion to the black curable resin layer 2. The preferred weight-average molecular weight of the elastomer is also the same as that for the black curable resin layer 2.

[0089] In particular, when the transparent curable resin layer 3 is composed of an epoxy resin composition, it is preferable to include a modified elastomer having a functional group reactive with an epoxy group. A modified elastomer having a functional group reactive with an epoxy group also functions as a curing agent for the epoxy resin. Furthermore, because it can react and bond with the epoxy resin, it improves heat resistance and reliability against thermal shock. Furthermore, the difference in polarity between the functional group reactive with the epoxy resin and the resin skeleton favorably affects dispersibility, resulting in good dispersibility when carbon black is incorporated into the transparent curable resin layer 3.

[0090] Examples of functional groups capable of reacting with an epoxy group include the same types as those of the black curable resin layer 2. Among them, an acid group or an acid anhydride group is preferred, and a carboxy group or a carboxylic acid anhydride group is particularly preferred, since they can be cured at low temperatures and ensure a long usable time.

[0091] When the transparent curable resin layer 3 is made of an epoxy resin composition, it is particularly preferable that it contains modified NBR having a carboxy group. The modified NBR having a carboxy group may be of the same type as that of the black curable resin layer 2. Two or more types of modified elastomers having a functional group capable of reacting with an epoxy group may be used in combination.

[0092] The blending amount of the elastomer in the transparent curable resin layer 3 is preferably 0 to 50% by mass, more preferably 1 to 70% by mass, and even more preferably 5 to 50% by mass, relative to 100% by mass of the total resin non-volatile content of the transparent curable resin layer 3. Within this range, the storage modulus can be controlled. Furthermore, when the blending amount is equal to or less than the upper limit, a storage modulus sufficient to compress the black curable resin layer during thermocompression bonding can be ensured. Furthermore, flow during thermal curing can be suppressed, and post-curing appearance defects such as repelling can be suppressed. Furthermore, problems are less likely to occur when etching is performed in a subsequent process. Furthermore, when the blending amount is equal to or greater than the lower limit, the dispersibility of carbon black is improved. Furthermore, film-formability is improved, and the film thickness distribution can be narrowed when the epoxy resin composition is applied to form a film.

[0093] (hardening agent) When the transparent curable resin layer 3 is composed of an epoxy resin composition, it may contain a curing agent for epoxy resins other than the modified elastomer having a functional group reactive with an epoxy group. Examples of the other curing agent include the same curing agents as those used in the black curable resin layer 2. Two or more types of the other curing agents may be used in combination.

[0094] (curing catalyst) When the transparent curable resin layer 3 is made of an epoxy resin composition, it may contain a curing catalyst that accelerates the curing reaction of the epoxy resin. As the curing catalyst, the same curing catalysts as those for the transparent curable resin layer 3 can be used, and the preferred embodiments are also the same.

[0095] The blending amount of the curing catalyst is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 4 parts by mass, and even more preferably 0.1 to 3 parts by mass, relative to 100 parts by mass of the total resin non-volatile content of the transparent curable resin layer 3. When the blending amount is within the above range, curing can be sufficiently promoted and the usable life of the integrated encapsulating sheet 1 can be ensured. Two or more curing catalysts may be used in combination.

[0096] (Other ingredients) The transparent curable resin layer 3 may contain a black pigment or black dye to suppress uneven light emission and uneven color.

[0097] From the viewpoint of increasing the total light transmittance, when the transparent curable resin layer 3 contains carbon black, the blending amount thereof is preferably less than 5 parts by mass, more preferably 1 part by mass or less, and even more preferably 0.1 parts by mass or less, relative to 100 parts by mass of the total resin nonvolatile content. The transparent curable resin layer 3 may further contain, as necessary, resins other than the epoxy resin and elastomer, thickeners, antifoaming agents and / or leveling agents, adhesion promoters such as coupling agents, and flame retardants.

[0098] <Cured coating layer> The cured coating layer 4 is a layer for protecting the light emitting element from external physical impacts, humidity, moisture, and the like.

[0099] [Total light transmittance] The cured coating layer 4 is preferably prepared so that the total light transmittance is 30 to 99%, more preferably 35 to 95%, and even more preferably 40 to 95%. When the total light transmittance of the cured coating layer 4 is equal to or greater than the lower limit, light is not prevented from reaching the viewer's side.

[0100] [Storage modulus] The storage modulus of the cured coating layer 4 is 1.0 × 10 5 Pa or more, 1.0×10 10 Pa or less, and 5 Pa or higher, 9.0×10 9 Pa or less, and 5 Pa or higher, 8.0×10 9 It is more preferable that the viscosity is 0.05 Pa or less.

[0101] When the storage modulus of the coating cured layer 4 at 100°C is equal to or less than the preferred upper limit, the coating cured layer 4 has an appropriate flexibility that does not hinder the flow of the black cured resin layer 2 when it is pressed onto the element-mounted substrate 10, and can conform to the unevenness of the element-mounted substrate 10 caused by the plurality of light-emitting elements and sufficiently fill the spaces between the plurality of light-emitting elements. When the storage modulus of the coating cured layer 4 at 100°C is equal to or greater than the preferred lower limit, pressure can be reliably transmitted to the curable resin layer without deformation when pressure-bonded to the element-mounted substrate 10, and defects such as cracks and deformation do not occur in the hard coat layer.

[0102] [resin] The coating cured layer 4 is composed of a cured product of a curable resin composition. As with the black curable resin layer 2 and the transparent curable resin layer 3, the curable resin composition may be a curable resin composition containing at least one resin selected from epoxy resin, acrylic resin, polyester resin, and polyurethane resin, a curing agent, a photopolymerization initiator, etc. Among these, an epoxy resin composition is preferred because of its excellent heat resistance and reliability, and a photocurable resin composition is preferred because it is easy to cure even when the thickness is large. By including these resins, deformation during compression bonding can be prevented. The cured coating layer 4 may contain a black pigment or black dye to suppress uneven light emission and uneven color.

[0103] [Film thickness] The thickness of the cured coating layer 4 is preferably 10 to 250 μm, more preferably 20 to 200 μm, and even more preferably 25 to 150 μm. When the thickness of the cured coating layer 4 is equal to or greater than the preferred lower limit, the layer has sufficient strength to protect the element. When the thickness of the cured coating layer 4 is equal to or less than the preferred upper limit, the layer has improved visibility and reduced costs.

[0104] <Hard coat layer> [hardness] The hard coat layer 5 is a layer for protecting the light-emitting electronic component from scratches. The pencil hardness of the surface of the hard coat layer 5 is preferably H or higher, more preferably 2H or higher, and even more preferably 3H or higher.

[0105] [Surface roughness] The surface roughness Ra of the hard coat layer 5 is preferably 0.1 to 1 μm, more preferably 0.2 to 1 μm, and even more preferably 0.3 to 1 μm. When the surface roughness of the hard coat layer 5 is at least the preferred lower limit, it is possible to reduce the reflectance of the surface of the hard coat layer 5. When the surface roughness of the hard coat layer 5 is at most the preferred upper limit, production becomes easier.

[0106] [Total light transmittance] The hard coat layer 5 is preferably prepared so that the total light transmittance is 30 to 99%, more preferably 50 to 99%, and even more preferably 60 to 99%. When the total light transmittance of the hard coat layer 5 is equal to or greater than the lower limit, light is not prevented from reaching the viewer side.

[0107] [Thermosetting resin] The hard coat layer 5 is preferably made of a thermosetting resin. Examples of the thermosetting resin constituting the hard coat layer 5 include acrylic resin, urethane resin, silicone resin, and melamine resin, and the hard coat layer 5 may contain one or more of these.

[0108] [Fine particles] The hard coat layer 5 preferably contains fine particles. As the fine particles, one or both of inorganic fine particles and organic fine particles can be used. Examples of inorganic fine particles include silica fine particles and titanium fine particles, and examples of organic fine particles include polymethyl methacrylate resin (PMMA resin) and urethane resin. Among these, silica fine particles are preferred. By including the fine particles, it is possible to adjust the surface roughness and improve the surface hardness.

[0109] [Film thickness] The thickness of the hard coat layer 5 is preferably 1 to 20 μm, more preferably 2 to 10 μm, and even more preferably 3 to 8 μm. When the thickness of the hard coat layer 5 is equal to or greater than the preferred lower limit, sufficient hardness can be ensured. When the thickness of the hard coat layer 5 is equal to or less than the preferred upper limit, problems such as curling do not occur.

[0110] <Optical properties of the three layers> [Total light transmittance] The total light transmittance of the three layers, transparent curable resin layer 3, cured coating layer 4, and hard coat layer 5, as a whole is preferably 30 to 95%, more preferably 35 to 95%, and even more preferably 40 to 95%. When the total light transmittance of the three layers is equal to or greater than the lower limit, light is not prevented from reaching the viewer's side.

[0111] [Reflectance] The reflectance of the hard coat layer 5 side measured by a gloss meter (JIS-Z-8741) is preferably 1 to 50%, more preferably 3 to 30%, and even more preferably 5 to 25%. When the reflectance on the hard coat layer 5 side is equal to or greater than the lower limit, production is easy. When the reflectance of the hard coat layer 5 is equal to or less than the preferred upper limit, the visibility of the display is improved.

[0112] <First protective film> The first protective film 6 has a role of protecting the integrated encapsulating sheet 1, and is a film onto which a coating liquid of a curable resin composition for the black curable resin layer 2 is applied when the integrated encapsulating sheet 1 is formed.

[0113] Examples of the first protective film 6 that can be used include polyester films such as polyethylene terephthalate and polyethylene naphthalate, films made of thermoplastic resins such as polyimide films, polyamideimide films, polyethylene films, polytetrafluoroethylene films, polypropylene films, and polystyrene films, as well as surface-treated paper.

[0114] Among these, polyester films are preferred from the viewpoints of heat resistance, mechanical strength, ease of handling, etc. The thickness of the first protective film 6 is not particularly limited, but is selected appropriately from the range of approximately 10 to 150 μm depending on the application. The surface of the first protective film 6 on which the resin layer is to be provided may be subjected to a release treatment.

[0115] <Second protective film> The second protective film 7 has a role of protecting the integrated encapsulating sheet 1, and is a film onto which a coating liquid for a hard coat layer is applied when the integrated encapsulating sheet 1 is formed.

[0116] As the second protective film 7, the same film as the first protective film 6 can be used.

[0117] Among these, polyester film can be preferably used for the same reasons as for the first protective film 6. The thickness of the second protective film 7 is not particularly limited, but is selected appropriately depending on the application within the range of approximately 10 to 150 μm. The surface of the second protective film 7 on which the resin layer is to be provided may be subjected to a release treatment.

[0118] [Surface roughness] The surface roughness Ra of the surface of the second protective film 7 is preferably 0.1 to 1 μm, more preferably 0.2 to 1 μm, and even more preferably 0.3 to 1 μm. When the surface roughness of the second protective film 7 is equal to or greater than the preferred lower limit, it is possible to reduce the reflectance of the surface of the hard coat layer 5. When the surface roughness of the second protective film 7 is equal to or less than the preferred upper limit, it becomes easy to procure the second protective film 7.

[0119] [Reflectance] The reflectance of the second protective film 7 measured with a gloss meter (JIS-Z-8741) is preferably 1 to 50%, more preferably 3 to 30%, and even more preferably 5 to 25%. If the reflectance of the second protective film 7 is equal to or greater than the lower limit, it is easy to procure the second protective film 7. If the reflectance of the second protective film 7 is equal to or less than the preferred upper limit, the glossiness of the surface of the transferred hard coat layer 5 decreases, improving the visibility of the display.

[0120] <Manufacturing method of integrated encapsulating sheet> To obtain the integrated encapsulating sheet 1, first, a coating liquid of a curable resin composition for the black curable resin layer 2 is applied to a first protective film 6 and then dried, and a hard coat layer 5 is formed on a second protective film 7, and a coating cured layer 4 is then formed on this hard coat layer 5. Furthermore, a coating cured layer 4 is applied to the coating cured layer 4 and then dried to prepare a sheet.

[0121] These are then stacked and laminated so that the transparent curable resin layer 3 and the black curable resin layer 2 are in contact with each other, thereby obtaining a laminate in which the first protective film 6, the black curable resin layer 2, the transparent curable resin layer 3, the coating cured layer 4, the hard coat layer 5, and the second protective film 7 are stacked in this order.

[0122] The second protective film 7 having the hard coat layer 5 formed thereon can be obtained by applying a coating agent for the hard coat layer to the surface of the second protective film 7 that has been subjected to a release treatment, and then curing the coating agent. Examples of methods for applying the coating agent for the hard coat layer include various coaters such as a die coater, gravure coater, roll coater, curtain flow coater, spin coater, bar coater, reverse coater, kiss coater, fountain coater, rod coater, air doctor coater, knife coater, blade coater, cast coater, and screen coater. The coating agent for the hard coat layer can be cured by heat curing, ultraviolet curing, electron beam curing, or the like.

[0123] The coating liquid of the curable resin composition preferably contains an organic solvent in an amount that gives a viscosity that allows coating to be carried out without any problems. The organic solvent is not particularly limited, and examples thereof include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, petroleum-based solvents, etc. Specific examples include ketones such as methyl ethyl ketone, cyclohexanone, methyl butyl ketone, and methyl isobutyl ketone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and triethylene glycol monoethyl ether; ethyl acetate, butyl acetate, isobutyl acetate, ethylene glycol monomethyl ether, dipropylene glycol diethyl ether, and triethylene glycol monoethyl ether; Examples of suitable solvents include esters such as propylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, and propylene glycol butyl ether acetate; alcohols such as ethanol, propanol, 2-methoxypropanol, n-butanol, isobutyl alcohol, isopentyl alcohol, ethylene glycol, and propylene glycol; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha, as well as N,N-dimethylformamide (DMF), tetrachloroethylene, and turpentine. When carbon black is blended into the coating liquid, carbon black powder or a carbon black dispersion may be added.

[0124] Examples of methods for applying the curable resin composition include various coaters such as a die coater, a gravure coater, a roll coater, a curtain flow coater, a spin coater, a bar coater, a reverse coater, a kiss coater, a fountain coater, a rod coater, an air doctor coater, a knife coater, a blade coater, a cast coater, and a screen coater. The drying temperature is preferably 60 to 160°C, more preferably 80 to 130°C, and even more preferably 90 to 120°C.

[0125] The temperature during lamination is preferably 20 to 120° C., more preferably 30 to 100° C., and even more preferably 40 to 80° C. By setting the temperature during lamination to a preferred lower limit or higher, it is possible to ensure sufficient adhesion between the black curable resin layer 2 and the transparent curable resin layer 3, allowing handling even in uncured state. Furthermore, by setting the temperature during lamination to a preferred upper limit or lower, it is possible to prevent the formation of air bubbles and wrinkles. The lamination can be carried out using a roll laminator, a press, a vacuum press, or the like.

[0126] <Substrate with element> As shown in Fig. 2, the element-mounted substrate 10 has a plurality of light-emitting elements arranged on a substrate 11. Fig. 2 and other figures schematically show a portion where three light-emitting elements (light-emitting element 12, light-emitting element 13, and light-emitting element 14) are arranged.

[0127] There is no limitation on the material of the substrate 11, but a known printed circuit board can be suitably used, such as a glass epoxy board, a fluororesin board, or a ceramic board.

[0128] The light emitting element is typically a light emitting diode, and the present invention is particularly suitable for use in cases where the light emitting element is extremely small. For example, a light emitting diode having a height of 1000 nm to 200 μm and a side length of 0.001 to 0.5 mm can be used. The element-mounted substrate 10 for obtaining mini LEDs or micro LEDs can use light-emitting diodes of three colors (R, G, and B) as the light-emitting elements, or a blue light-emitting diode as the light-emitting element.

[0129] <Method of manufacturing light-emitting electronic components> The method for producing a light-emitting electronic component of the present invention is a method in which the integrated encapsulating sheet 1 of the present invention is placed on a surface of an element-mounted substrate on which a plurality of light-emitting elements are arranged, with the black curable resin layer 2 being in contact with the surface, and the sheet is press-bonded to fill parts of the black curable resin layer 2 and the transparent curable resin layer 3 between the plurality of light-emitting elements, and the sheet is heated to cure the black curable resin layer 2 and the transparent curable resin layer 3. Hereinafter, a method for manufacturing a light-emitting electronic component according to one embodiment of the present invention will be described with reference to FIGS.

[0130] In the manufacturing method of this embodiment, first, as shown in FIG. 2, the integrated encapsulating sheet 1, from which the first protective film 6 has been peeled off to expose the black curable resin layer 2, is placed on the surface of the element-mounted substrate 10 on which the light-emitting elements 12, 13, and 14 are arranged, so that the black curable resin layer 2 is in contact with the surface.

[0131] At this time, i.e., before pressure bonding, the thickness of the black curable resin layer 2 is preferably 10 to 95% of the height of the light emitting device. The lower limit is more preferably 15% or more, and even more preferably 30% or more. The upper limit is more preferably 85% or less, even more preferably 65% ​​or less, and particularly preferably 55% or less.

[0132] When the thickness of the black curable resin layer 2 is 10% or more of the height of the light-emitting element, the function of preventing light diffusion between the light-emitting elements is sufficient. Furthermore, when the black curable resin layer 2 has a relatively low storage modulus and ensures fluidity, the resin can be sufficiently filled between the light-emitting elements. When the thickness of the black curable resin layer 2 is less than 15% of the height of the light-emitting element, crack-like defects may occur on the surface if the fluidity of the transparent curable resin layer 3 is relatively low. When the thickness of the black curable resin layer 2 is 30% or more of the height of the light-emitting element, the black curable resin layer 2, which has the function of preventing light diffusion, can be appropriately filled between the light-emitting elements.

[0133] If the thickness of the black curable resin layer 2 is 95% or less of the height of the light-emitting element, leakage of the black curable resin layer to the outside during thermocompression bonding can be prevented, and light from the light-emitting element is not prevented from reaching the viewer. If the thickness of the black curable resin layer 2 exceeds 85% of the height of the light-emitting element, variations in the thickness of the black curable resin layer 2 that flows after pressing may cause variations in the shade of black. If the thickness of the black curable resin layer 2 is 55% or less of the height of the light-emitting element, the black curable resin layer 2, which has a light diffusion prevention function, can be appropriately filled between the light-emitting elements.

[0134] The thickness of the transparent curable resin layer 3 before compression bonding is preferably 10 to 500% of the height of the light emitting device. The lower limit is more preferably 40% or more, and even more preferably 50% or more. The upper limit is more preferably 200% or less, and even more preferably 150% or less.

[0135] When the thickness of the transparent curable resin layer 3 is 10% or more of the height of the light-emitting element, it easily functions as a sealing layer covering the light-emitting element. Furthermore, when the transparent curable resin layer 3 has a relatively high storage modulus and suppressed fluidity, it is suppressed from flowing together with the black curable resin layer 2 during thermal curing, and poor appearance is less likely to occur on the surface. When the thickness of the transparent curable resin layer 3 is less than 40% of the height of the light-emitting element, the range in which the transparent curable resin layer 3 can flow is insufficient, and crack-like defects may occur on the surface. When the thickness of the transparent curable resin layer 3 is 50% or more of the height of the light-emitting element, it easily functions as a sealing layer covering the light-emitting element. Furthermore, when the transparent curable resin layer 3 has a relatively high storage modulus and suppressed fluidity, it can sufficiently press the black curable resin layer 2 into place.

[0136] The total thickness of the black curable resin layer 2 and the transparent curable resin layer 3 before compression bonding is preferably 110 to 550%, more preferably 120 to 400%, and even more preferably 150 to 300% of the height of the light emitting element. When the total thickness of the black curable resin layer 2 and the transparent curable resin layer 3 is equal to or greater than the lower limit value relative to the height of the light emitting element, the integrated encapsulating sheet 1 can be sufficiently embedded between the light emitting elements. If the total thickness of the black curable resin layer 2 and the transparent curable resin layer 3 is equal to or less than the upper limit of the height of the light emitting element, thickness unevenness is unlikely to occur during pressure bonding, and poor appearance is unlikely to occur on the surface.

[0137] The ratio of the thickness of the black curable resin layer 2 before compression bonding to the total thickness of the transparent curable resin layer 3 and the black curable resin layer 2 before compression bonding is preferably 10 to 90%, more preferably 15 to 70%, and even more preferably 20 to 50%. When the ratio of the thickness of the black curable resin layer 2 before compression to the total thickness of the transparent curable resin layer 3 and the black curable resin layer 2 is equal to or greater than the above lower limit, the degree of blackness can be increased and the contrast of the display can be sufficiently improved. When the ratio is equal to or less than the above upper limit, the black curable resin layer 2 is less likely to remain on the light-emitting element during compression, and the brightness can be sufficiently improved.

[0138] 2, the integrated encapsulating sheet 1 is thermocompressed to embed a part of the black curable resin layer 2 and the transparent curable resin layer 3 between the light emitting elements as shown in FIG. In this case, it is preferable that the black curable resin layer 2 has a relatively low storage modulus and ensures fluidity, since it can easily follow the unevenness of the light-emitting elements, fill in between the light-emitting elements, and is less likely to remain on the light-emitting elements.

[0139] The temperature in the thermocompression bonding is preferably 80 to 120°C, and more preferably 90 to 110°C. By setting the temperature in the thermocompression bonding to 80°C or higher, the fluidity of the integrated encapsulating sheet 1 can be easily ensured. Furthermore, by setting the temperature in the thermocompression bonding to 120°C or lower, the light emitting element is less likely to be damaged. By setting the temperature in the thermocompression bonding to 90 to 110°C, the fluidity can be controlled more precisely, and the occurrence of unevenness and crack-like defects can be suppressed.

[0140] The pressure in thermocompression bonding is preferably 0.05 to 1.0 MPa, more preferably 0.1 to 0.5 MPa. By setting the pressure in thermocompression bonding to the preferred lower limit or more, the black curable resin layer 2 does not remain on the light emitting element, and light from the light emitting element is not prevented from reaching the viewer. By setting the pressure to the preferred upper limit or less, damage to the light emitting element is unlikely to occur. The thermocompression bonding is preferably carried out using a vacuum press that can perform molding in a vacuum state, which makes it easier to avoid defects caused by air being mixed into the resulting light-emitting electronic component.

[0141] After the pressure bonding, the second protective film 7 is peeled off as shown in Fig. 4, and then the resulting sheet is thermally cured, so that the black curable resin layer 2 of the integrated encapsulating sheet 1 becomes a black curable resin cured product 22 (black curable resin layer 2 in a cured state), and the transparent curable resin layer 3 becomes a transparent curable resin cured product 23 (transparent curable resin layer 3 in a cured state), as shown in Fig. 5. In this way, a light-emitting electronic component 30 is obtained.

[0142] The curing temperature is 100 to 160°C, and preferably 120 to 150°C. By setting the curing temperature to 100°C or higher, the integrated encapsulating sheet 1 can be cured. By setting the curing temperature to 120°C or higher, the curing time of the integrated encapsulating sheet 1 can be shortened. In addition, by setting the curing temperature to the above upper limit temperature or lower, the light emitting element is less likely to be damaged.

[0143] The curing time varies depending on the curing temperature, but is preferably 30 to 360 minutes, more preferably 45 to 180 minutes. It is preferable that the transparent curable resin layer 3 has a relatively high storage modulus and reduced fluidity at the curing temperature, since this reduces the occurrence of poor appearance after curing.

[0144] As a result, a light-emitting electronic component 30 is obtained in which the integrated encapsulating sheet 1 is pressure-bonded to the surface of the element-mounted substrate 10 on which the light-emitting elements are arranged, the surface having the light-emitting elements arranged on the substrate 11. In the obtained light-emitting electronic component 30, the black curable resin layer 2 and the transparent curable resin layer 3 are cured, and parts of the black curable resin layer 2 and the transparent curable resin layer 3 fill spaces between a plurality of light-emitting elements. [Example]

[0145] The present invention will be specifically explained below by showing examples, but the present invention is not limited to the descriptions of these examples.

[0146] <Raw materials> Details of the raw materials used in each example and comparative example are as follows. [Epoxy resin] jER 1032H60: Mitsubishi Chemical Corporation, high-purity multifunctional epoxy resin (solid), softening point 62°C, epoxy equivalent 168g / eq. HP-7200H: DIC Corporation, cyclopentadiene novolac multifunctional epoxy resin (solid), softening point 82°C, epoxy equivalent 227g / eq. jER YX7200B35: Mitsubishi Chemical Corporation, phenoxy-type epoxy resin (MEK solution, non-volatile content 35% by mass), glass transition temperature 150°C, epoxy equivalent 8781 g / eq., weight-average molecular weight 35,000. jER 828EL: Mitsubishi Chemical Corporation, bisphenol A type bifunctional epoxy resin (liquid), epoxy equivalent 186g / eq. NC-3000H: Nippon Kayaku Co., Ltd., bisphenyl novolac multifunctional epoxy resin (solid), softening point 71°C, epoxy equivalent 290g / eq. 8ME-8016E: Taisei Fine Chemical Co., Ltd., alicyclic epoxy-incorporated acrylic polymer, epoxy equivalent 414g / eq.

[0147] [Elastomer] NX775: Zeon Corporation, carboxy-modified nitrile rubber, weight average molecular weight 208,000. Teisan Resin SG-80H: Nagase ChemteX Corporation, acrylic ester copolymer resin (functional groups: epoxy groups, amide groups), MEK-removed product, non-volatile content 18% by mass, weight-average molecular weight 850,000.

[0148] [resin] HF-1M: HF-1M manufactured by Meiwa Kasei Co., Ltd., a phenolic novolac resin.

[0149] [Curing catalyst] 2PZ-CN: 1-cyanoethyl-2-phenylimidazole, manufactured by Shikoku Chemicals Co., Ltd. 2E4MZ: 2-ethyl-4-methylimidazole, manufactured by Shikoku Chemicals Co., Ltd.

[0150] [Photopolymerization initiator] · Irgacure TPO H: BASF, photoradical generator. WPI170: Photocationic polymerization initiator manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. Ommirad127: Photoradical generator manufactured by IGM Resins BV.

[0151] [Carbon black] Special Black4: Gas black, manufactured by ORION ENGINEERED CARBONS.

[0152] [Additives] KBM-403: Epoxy silane coupling agent manufactured by Shin-Etsu Silicones.

[0153] [solvent] MEK: Methyl ethyl ketone, manufactured by Junsei Chemical Co., Ltd. PGM: Propylene glycol monomethyl ether, manufactured by Junsei Chemical Co., Ltd.

[0154] [Second protective film] ND-1: Release PET ND-1 manufactured by our company, thickness 50 μm, surface roughness Ra=0.61 μm, Rz=3.9 μm, RSm=0.03 mm. [First protective film] 1-TRE: 1-TRE manufactured by NIPPA, thickness 50 μm.

[0155] [Resin for hard coat layer] 8KX-078: Taisei Fine Chemical Co., Ltd., Acrylit 8KX-078 (non-volatile content 40%).

[0156] [Fine particles] Silica microparticles: Silica microparticles manufactured by Tosoh Silica, product name "Nipsil SS50B", average particle size 2000nm (2μm). ·Organic fine particles: Sekisui Plastics Co., Ltd., spherical PMMA fine particles [average particle size 4.5 μm, refractive index 1.49].

[0157] Example 1 [Preparation of film with hard coat layer] A coating agent for the hard coat layer, which was a uniform mixture of 250 parts by mass of 8KX-078, 1 part by mass of Irgacure TPO H, and 1 part by mass of Ommirad127, was applied to one side of the ND-1 to a thickness of 10 μm, and 2000 mJ / cm 2 The hard coat layer was cured by irradiating it with ultraviolet light, to obtain a film 1 with a hard coat layer.

[0158] [Formation of hardened coating layer] Raw materials 1 were mixed according to the composition shown in Table 1 to prepare coating liquid 1 having a nonvolatile content of 100% by mass.

[0159] The obtained coating liquid 1 was applied onto the hard coat layer of the hard coat layer-attached film 1 using a bar coater so as to give a film thickness of 50 μm, and the applied voltage was 2000 mJ / cm 2 The coated film was cured by irradiating it with ultraviolet light of 1000 W at 90° C., and then cured at 90° C. for 12 hours to obtain a laminated sheet 1 in which a cured coating layer was laminated on the film 1 with a hard coat layer.

[0160] [Formation of transparent curable resin layer] Raw material 11 having the composition shown in Table 2 was mixed with a solvent of MEK / PGM=80 / 20 to prepare coating liquid 2 having a nonvolatile content of 25 mass %. That is, the total amount of raw material 11 having the composition shown in Table 2 (in terms of nonvolatile content) was 25 mass % with respect to the entire coating liquid obtained.

[0161] The obtained coating liquid 2 was applied onto the cured coating layer of the laminate sheet 1 using a bar coater so that the dry film thickness was 40 μm, and then dried at 120°C for 5 minutes to obtain a laminate sheet 1 in which a transparent curable resin layer was laminated on the cured coating layer.

[0162] [Formation of black curable resin layer] Raw material 12 having the composition shown in Table 2 was mixed with a solvent of MEK / PGM=80 / 20 to prepare coating liquid 3 having a non-volatile content of 25 mass %. That is, the total amount of raw material 12 having the composition shown in Table 2 (in terms of non-volatile content) was 25 mass % with respect to the entire coating liquid obtained.

[0163] The obtained coating liquid 3 was applied to the release surface of 1-TRE using a bar coater so that the dry film thickness was 40 μm, and then dried at 120°C for 5 minutes to obtain a laminated sheet 2 in which a black curable resin layer was supported by a first protective film.

[0164] [Preparation of integrated encapsulating sheet] The laminate sheet 1 and the laminate sheet 2 were stacked so that the transparent curable resin layer and the black curable resin layer were in contact with each other, and laminated with a roll laminator at 60°C to produce an integrated encapsulating sheet 1 in which the first protective film, the black curable resin layer, the transparent curable resin layer, the coating cured layer, the hard coat layer, and the second protective film were stacked in that order.

[0165] [Manufacturing of light-emitting electronic components] The obtained integrated encapsulating sheet 1 was placed on a substrate having a light-emitting element (height 50 μm, length 100 μm, width 200 μm) mounted on the substrate, so that the black curable resin layer from which the first protective film had been peeled off was in contact with the substrate. In this state, lamination was performed using a vacuum laminator MVLP-500 (manufactured by Meiki Seisakusho) at a temperature of 80 to 110°C and a pressure of 0.3 MPa. Next, the second protective film was peeled off, and the curable resin layer was cured in a hot air circulation drying oven at 150°C for 60 minutes to obtain a light-emitting electronic component.

[0166] <Example 2> [Formation of hardened coating layer] Raw materials 2 were mixed according to the composition shown in Table 1 to prepare coating liquid 4 having a nonvolatile content of 100 mass %.

[0167] The obtained coating liquid 4 was applied onto the hard coat layer of the hard coat layer-attached film 1 using a bar coater so as to give a film thickness of 50 μm, and the applied voltage was 2000 mJ / cm 2 The hard coat layer was cured by irradiating it with ultraviolet light, and then cured at 90° C. for 12 hours to obtain a laminated sheet 3 in which a cured coating layer was laminated on the film 1 with a hard coat layer.

[0168] [Formation of transparent curable resin layer] Raw material 13 having the composition shown in Table 2 was mixed with a solvent of MEK / PGM=80 / 20 to prepare coating liquid 5 having a non-volatile content of 25 mass %. That is, the total amount of raw material 13 having the composition shown in Table 2 (in terms of non-volatile content) was 25 mass % with respect to the entire coating liquid obtained.

[0169] The obtained coating liquid 5 was applied onto the cured coating layer of the laminate sheet 3 using a bar coater so that the dry film thickness was 40 μm, and then dried at 120°C for 5 minutes to obtain a laminate sheet 3 in which a transparent curable resin layer was laminated on the cured coating layer.

[0170] [Formation of black curable resin layer] Raw material 14 having the composition shown in Table 2 was mixed with a solvent of MEK / PGM=80 / 20 to prepare coating liquid 6 having a non-volatile content of 25 mass %. That is, the total amount of raw material 14 having the composition shown in Table 2 (in terms of non-volatile content) was 25 mass % with respect to the entire coating liquid obtained.

[0171] The obtained coating liquid 6 was applied to the release surface of 1-TRE using a bar coater so that the dry film thickness was 40 μm, and then dried at 120°C for 5 minutes to obtain a laminated sheet 4 in which a black curable resin layer was supported by a first protective film.

[0172] [Preparation of integrated encapsulating sheet] The laminate sheet 3 and the laminate sheet 4 were stacked so that the transparent curable resin layer and the black curable resin layer were in contact with each other, and laminated with a roll laminator at 60°C to produce an integrated encapsulating sheet 2 in which the first protective film, the black curable resin layer, the transparent curable resin layer, the coating cured layer, the hard coat layer, and the second protective film were stacked in that order.

[0173] [Manufacturing of light-emitting electronic components] A light-emitting electronic component was obtained in the same manner as in Example 1, except that the obtained integrated encapsulating sheet 2 was used.

[0174] Example 3 [Formation of hardened coating layer] In the same manner as in Example 1, Coating Liquid 1 was applied onto the hard coat layer of Film 1 with a hard coat layer, to obtain Laminate Sheet 1 in which a cured coating layer was laminated on Film 1 with a hard coat layer.

[0175] [Formation of transparent curable resin layer] In the same manner as in Example 1, the coating liquid 2 was applied onto the cured coating layer of the laminate sheet 1 to obtain a laminate sheet 1 in which a transparent curable resin layer was laminated on the cured coating layer.

[0176] [Formation of black curable resin layer] The coating liquid 3 was applied to the release surface of the protective film in the same manner as in Example 1, except that the amount of coating liquid 3 applied was adjusted so that the dry film thickness was 50 μm, and a laminate sheet 5 in which a black curable resin layer was supported by a first protective film was obtained.

[0177] [Preparation of integrated encapsulating sheet] The laminate sheet 1 and the laminate sheet 5 were stacked so that the transparent curable resin layer and the black curable resin layer were in contact with each other, and laminated with a roll laminator at 60°C to produce an integrated encapsulating sheet 3 in which the first protective film, the black curable resin layer, the transparent curable resin layer, the coating cured layer, the hard coat layer, and the second protective film were stacked in that order.

[0178] [Manufacturing of light-emitting electronic components] A light-emitting electronic component was obtained in the same manner as in Example 1, except that the obtained integrated encapsulating sheet 3 was used.

[0179] Example 4 [Formation of hardened coating layer] In the same manner as in Example 1, Coating Liquid 1 was applied onto the hard coat layer of Film 1 with a hard coat layer, to obtain Laminate Sheet 1 in which a cured coating layer was laminated on Film 1 with a hard coat layer.

[0180] [Formation of transparent curable resin layer] In the same manner as in Example 1, the coating liquid 2 was applied onto the cured coating layer of the laminate sheet 1 to obtain a laminate sheet 1 in which a transparent curable resin layer was laminated on the cured coating layer.

[0181] [Formation of black curable resin layer] The coating liquid 3 was applied to the release surface of the protective film in the same manner as in Example 1, except that the amount of coating liquid 3 applied was adjusted so that the dry film thickness was 60 μm, and a laminated sheet 6 in which a black curable resin layer was supported by a first protective film was obtained.

[0182] [Preparation of integrated encapsulating sheet] The laminate sheet 1 and the laminate sheet 6 were stacked so that the transparent curable resin layer and the black curable resin layer were in contact with each other, and laminated with a roll laminator at 60°C to produce an integrated encapsulating sheet 4 in which the first protective film, the black curable resin layer, the transparent curable resin layer, the coating cured layer, the hard coat layer, and the second protective film were stacked in that order.

[0183] [Manufacturing of light-emitting electronic components] A light-emitting electronic component was obtained in the same manner as in Example 1, except that the obtained integrated encapsulating sheet 4 was used.

[0184] [Table 1]

[0185] [Table 2]

[0186] <Evaluation> [Total light transmittance] The total light transmittance of each of the obtained layers was measured in accordance with JIS K 7136 using a haze meter (NDH5000) manufactured by Nippon Denshoku Industries Co., Ltd. The results are shown in Table 3.

[0187] [Lab] The Lab of the black curable resin layer in its cured state was measured using a spectrophotometer after the black curable resin layer supported on the protective film was cured by heating at 150° C. for 1 hour.

[0188] [Storage modulus] The storage modulus of the coating films of laminate sheets 1 to 4 at 100°C before curing was measured using a viscoelasticity measuring device (RSA-G2 manufactured by TA Instruments) at a measurement frequency of 1 Hz and a heating rate of 5°C / min according to JIS K7244. The results are shown in Table 3.

[0189] [Reflectance] The reflectance of the hard coat layer surface was measured using a gloss meter (VG8000, JIS-Z-8741, manufactured by Nippon Denshoku Industries Co., Ltd.) The results are shown in Table 3.

[0190] [Pencil hardness] The pencil hardness of the surface of the hard coat layer was measured using a pencil hardness tester (JIS-K5600-5-4), and the results are shown in Table 3.

[0191] [Surface roughness] The surface roughness of the hard coat layer was measured using a laser microscope (Olympus Corporation, LEXT OLS4000, JIS-B-0601). The results are shown in Table 3.

[0192] [Black curable resin layer residue on element] The cured surface was observed and evaluated according to the following criteria. The results are shown in Table 3. ⊚: No residue of the black curable resin layer was observed on the light emitting element. ◯: A small amount of residue of the black curable resin layer was visible on the light-emitting element, but almost none remained. ×: Residue of the black curable resin layer is observed on the light emitting element.

[0193] [Table 3]

[0194] The above example confirmed that a single press-bonding operation not only fills the spaces between multiple light-emitting elements with a resin that prevents light diffusion, but also completes the sealing process, thereby producing a light-emitting electronic component that does not prevent light from the light-emitting elements from reaching the viewer and has sufficient surface hardness. It was also confirmed that the thickness of the black curable resin layer is preferably smaller than the height of the light emitting element. [Explanation of symbols]

[0195] 1. Integrated sealing sheet 2 Black curable resin layer 3 Transparent curable resin layer 4. Hardened coating layer 5 Hard coat layer 6 First protective film 7 Second protective film 10 Substrate with element 11 Circuit Board 12 Light-emitting element 13 Light-emitting element 14 Light-emitting element 22 Black curable resin cured product 23 Transparent curable resin cured product 30 Light-emitting electronic components

Claims

1. An integrated encapsulating sheet that is pressure-bonded to a surface of an element-mounted substrate on which a plurality of light-emitting elements are arranged, the surface comprising: a black curable resin layer, a transparent curable resin layer, a coating cured layer, and a hard coat layer, which are laminated in this order from the side that will be in contact with the element-mounted substrate during the pressure bonding; each of the black curable resin layer and the transparent curable resin layer is a layer made of a thermosetting resin composition; The integrated encapsulating sheet, wherein the coating cured layer is a layer composed of a cured product of a curable resin composition.

2. The integrated encapsulating sheet according to claim 1 , wherein the black curable resin layer and the transparent curable resin layer are in an uncured state.

3. 3. The integrated encapsulating sheet according to claim 1, wherein the transparent curable resin layer has a storage modulus in an uncured state greater than the storage modulus in an uncured state of the black curable resin layer at 100°C.

4. At 100°C, the black curable resin layer has a storage modulus of 1.0 x 10 in an uncured state. ２ Pa or more, 1.0×10 ５ The integrated sealing sheet according to claim 1 or 2, wherein the elastic modulus is 0.05 Pa or less.

5. At 100°C, the storage modulus of the transparent curable resin layer in an uncured state is 1.0 × 10 ４ Pa or more, 1.0×10 ７ The integrated sealing sheet according to claim 1 or 2, wherein the elastic modulus is 0.05 Pa or less.

6. The storage modulus of the cured coating layer at 100°C is 1.0 x 10 ５ Pa or more, 1.0×10 １０ The integrated sealing sheet according to claim 1 or 2, wherein the elastic modulus is 0.05 Pa or less.

7. The integrated encapsulating sheet according to claim 1 or 2, wherein the cured coating layer has a total light transmittance of 30 to 99%.

8. a substrate with elements on which a plurality of light-emitting elements are arranged; and a pressure-bonded body in which the integrated encapsulating sheet according to claim 1 or 2 is pressure-bonded to a surface of the substrate with elements on which the plurality of light-emitting elements are arranged, the pressure-bonded body includes a black cured resin product obtained by thermally curing the black cured resin layer, and a transparent cured resin product obtained by thermally curing the transparent cured resin layer, A light-emitting electronic component, characterized in that the black cured resin and a portion of the transparent cured resin are filled between the plurality of light-emitting elements.

9. the integrated encapsulating sheet according to claim 1 or 2 is disposed on a surface of an element-mounted substrate on which a plurality of light-emitting elements are arranged, so that the black curable resin layer is in contact with the surface; The black curable resin layer and a part of the transparent curable resin layer are filled between the plurality of light-emitting elements by pressing, The method for producing a light-emitting electronic component includes curing the black curable resin layer and the transparent curable resin layer by heating.

10. the thickness of the black curable resin layer before the compression bonding is 10 to 95% of the height of the light emitting element; 10. The method for producing a light-emitting electronic component according to claim 9, wherein the total thickness of the black cured resin layer and the transparent cured resin layer before the pressure bonding is 110 to 550% of the height of the light-emitting element.

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