Circuit architecture for multi-antenna radio units, base stations and satellite communications

Abstract

To provide a circuit architecture related to a radio unit, a base station, and satellite communication in a radio communication system which is especially suitable for the base station of a large multi-input multi-output antenna, can reduce transmission power, and has green technical effect of energy saving and carbon reduction.SOLUTION: A circuit structure 400 for radio units is composed of a plurality of printed circuit boards 410 to 430, where allocated to the plurality of printed circuit boards are: a radio unit including an antenna module and an RF front-end module; an active antenna required for a base station and a satellite communication system; a digital circuit including a fronthaul interface module, a communication digital signal processing module, a beam forming module, and a baseband digital circuit module; and a power supply module. By appropriately arranging the respective modules on the plurality of printed circuit boards, it is possible to achieve necessary functions in cooperation and optimize the overall performance.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to circuit architectures for radio units, base stations and satellite communications in wireless communication systems. [Background technology]

[0002] Wireless communication systems with multiple antennas can be divided into two types based on their antenna architecture: active antennas and passive antennas. Conventional 4th generation (4G) mobile communication base stations (BSs) primarily use passive antennas, characterized by separating the radio frequency (RF) components from the antenna. The RF components are located inside the remote radio head (RRH), and the antenna is located outside the RRH and connected to the RRH via a cable. Unlike passive antenna architectures, active antennas integrate the RF components with the antenna, avoiding or reducing cable loss and making them more suitable for wireless communication systems with a large number of antennas. Due to the advantages of active antennas and the increased number of antennas, 5th generation (5G) mobile communication base stations often use active antennas, for example, by integrating the RF components and antennas into the base station's radio unit (RU).

[0003] In active antenna systems, the prior art has used a single printed circuit board (PCB) as the mainstream architecture, integrating antennas, radio frequency components, and baseband digital circuits onto the PCB using a single multilayer PCB architecture. For example, U.S. Patent Publication Nos. US9391370B2, US10201073B2, and US10290920B2 all use similar multilayer PCB architectures, integrating antennas, radio frequency components, and baseband digital circuits onto a single PCB. However, while the use of a single multilayer PCB is the mainstream of prior art in active antenna system applications with a large number of antennas, such as wireless units, base stations, and satellite communications, it has the following drawbacks. First, the antenna, radio frequency components, and digital circuits are all integrated onto a single PCB, and the heat dissipation area is limited to the area of ​​the single PCB, resulting in low heat dissipation efficiency and difficulty in heat dissipation. Second, because the antenna, high-frequency components, and digital circuits are integrated onto a single printed circuit board, the components are closely spaced, making them susceptible to noise and interference issues such as electromagnetic interference (EMI) and electromagnetic compatibility (EMC). Furthermore, because a single printed circuit board is used, aging or damage to the printed circuit board or its internal components can easily cause the entire system to stop working, resulting in a short service life and low stability. Furthermore, the high level of integration makes it difficult to maintain, replace, or update damaged components. Furthermore, because multi-layer printed circuit boards use a three-dimensional structure to arrange components, their fabrication is complex, significantly increasing production costs. Furthermore, the complex fabrication process also results in a low yield rate in mass production.

[0004] Based on the above, the prior art still has drawbacks such as poor heat dissipation, high noise and interference, short lifespan, low stability, poor maintenance, high cost, and low yield rate in mass production, and there is still room for improvement. Summary of the Invention [Problem to be solved by the invention]

[0005] In order to solve the above-mentioned shortcomings of the conventional technology, the present disclosure uses a multiple printed circuit board architecture instead of a single printed circuit board, and allocates, for example, active antennas required for wireless units, base stations, and satellite communication systems, such as antennas and high-frequency components, digital circuits such as fronthaul interface modules, communication digital signal processing modules, beamforming modules, and baseband digital circuit modules, and power modules to multiple printed circuit boards, and by appropriately arranging each module on the multiple printed circuit boards, they can work together to achieve the required functions and optimize the overall performance. [Means for solving the problem]

[0006] One aspect of the present disclosure provides a circuit architecture for a wireless unit including a plurality of printed circuit boards capable of transmitting data and / or signals between each other via any digital interface and / or analog interface, at least one of the printed circuit boards including an antenna module and at least another printed circuit board including a fronthaul interface module. RF A front-end module (FEM) may be included. In addition to the fronthaul interface module, the printed circuit board including the fronthaul interface module may also include: RFThe antenna module may include a communication digital signal processing module, a beamforming module, etc. In addition to the printed circuit board including the antenna module and the printed circuit board including the fronthaul interface module, another printed circuit board including a power supply module may also be included.

[0007] A further aspect of the present disclosure provides a circuit architecture for a wireless unit including a plurality of printed circuit boards capable of transmitting data and / or signals between each other via any digital and / or analog interface, at least one of the printed circuit boards including an antenna module and at least another printed circuit board including a fronthaul interface module. RF Front-end modules and RF The printed circuit board including the fronthaul interface module may include a communication digital signal processing module and a beamforming module in addition to the fronthaul interface module. In addition to the printed circuit board including the antenna module and the printed circuit board including the fronthaul interface module, another printed circuit board including a power supply module may be included.

[0008] A further aspect of the present disclosure provides a circuit architecture for a wireless unit including a plurality of printed circuit boards capable of transmitting data and / or signals between each other via any digital and / or analog interface, at least one of the printed circuit boards including an antenna module and at least another printed circuit board including a power supply module. RF Front-end module, RF A communication module, a digital signal processing module, and a beamforming module may be included.

[0009] A further aspect of the present disclosure provides a circuit architecture for base stations and satellite communications, comprising a plurality of printed circuit boards capable of transmitting data and / or signals between each other via any digital interface and / or analog interface, at least one of the printed circuit boards including an antenna module and at least another printed circuit board including a baseband digital circuit module. RF The printed circuit board including the baseband digital circuit module may also include a front-end module. RF In addition to the printed circuit board including the antenna module and the printed circuit board including the baseband digital circuit module, another printed circuit board including a power supply module may be included.

[0010] A further aspect of the present disclosure provides a circuit architecture for base stations and satellite communications, comprising a plurality of printed circuit boards capable of transmitting data and / or signals between each other via any digital interface and / or analog interface, at least one of the printed circuit boards including an antenna module and at least another printed circuit board including a baseband digital circuit module. RF Front-end modules and RF The printed circuit board including the baseband digital circuit module may include a beamforming module in addition to the baseband digital circuit module. In addition to the printed circuit board including the antenna module and the printed circuit board including the baseband digital circuit module, another printed circuit board including a power supply module may be included.

[0011] A further aspect of the present disclosure provides a circuit architecture for base station and satellite communications, comprising a plurality of printed circuit boards capable of transmitting data and / or signals between each other via any digital and / or analog interface, at least one of the printed circuit boards including an antenna module and at least another of the printed circuit boards including a power supply module. RF Front-end module, RF The module may include a beamforming module, a baseband digital circuit module, and a baseband digital circuit module. [Effects of the Invention]

[0012] Based on the above, the circuit architecture of the wireless unit, base station, and satellite communication disclosed herein employs multiple printed circuit boards and arranges each module on multiple printed circuit boards. This not only achieves the functionality required by existing systems, but also optimizes overall system performance and provides the following new advantages: First, the use of multiple printed circuit boards provides a larger heat dissipation area and better heat dissipation than a single printed circuit board. Second, circuit components can be arranged on multiple printed circuit boards, allowing components that are prone to electromagnetic interference and electromagnetic compatibility issues to be arranged on different printed circuit boards, increasing their spacing and reducing noise and interference. Furthermore, the use of a multiple printed circuit board architecture provides greater stability and lifespan than a single printed circuit board architecture. For example, in the application of a wireless unit with multiple antennas, especially when there are many antennas, damage to the printed circuit boards or their internal components of some antenna branches may result in performance defects, but the overall system may still operate normally, thereby extending its lifespan. Furthermore, damage to internal components of some printed circuit boards can be replaced simply by replacing the damaged printed circuit board and its components rather than having to replace the entire system, making maintenance easier. Furthermore, the fabrication complexity of the multi-printed circuit board architecture is relatively low, which reduces the overall circuit cost and improves the yield rate in mass production. Furthermore, the circuit architecture disclosed herein is particularly suited to wireless communication systems with a large number of antennas, such as massive multiple-input multiple-output (Massive MIMO) base stations.Under the condition of the same data transmission speed, a large-scale multi-input multi-output antenna base station can effectively reduce the transmit power of user equipment (UE) such as cell phones and base stations as the number of antennas increases. The reduced transmit power is proportional to the number of antennas, meaning that the more antennas there are, the greater the transmit power reduction. This reduces the power consumption of cell phones and base stations, achieving the green technology effects of energy saving and carbon reduction.

[0013] As a result, the circuit architecture disclosed herein can achieve the desired functionality while optimizing overall performance and providing additional benefits such as better heat dissipation efficiency, reduced noise and interference, a long service life, easy maintenance and upgrades, suitability for mass production, low circuit costs, and energy-saving and carbon-reducing effects. Among these, the good heat dissipation effect makes it more suitable for base stations and satellite communication systems with high heat dissipation requirements. The reduced noise and interference improves the stability and performance of base stations and satellite communication systems. The long service life and easy maintenance and upgrades make it more suitable for base station and satellite communication system applications. In particular, for base station applications, where communication operators typically require base stations to have a long lifespan of 10 years or more, updates to international communication standards may require modifications or upgrades to the internal circuits. Furthermore, the suitability for mass production, low circuit costs, and energy-saving and carbon-reducing effects are beneficial for the mass construction and layout of fifth-generation (5G) and even future sixth-generation (6G) mobile communication base stations. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 illustrates a schematic diagram of a wireless communication base station having radio units. [Figure 2] FIG. 2 illustrates a schematic diagram of a wireless communication base station. [Figure 3] FIG. 3 illustrates a schematic diagram of a satellite communications ground station. [Figure 4]FIG. 4 is a schematic diagram illustrating the circuit architecture of a wireless unit according to one embodiment of the present disclosure. [Figure 5] FIG. 5 is a schematic diagram of the circuit architecture of a wireless unit according to another embodiment of the present disclosure. [Figure 6] FIG. 6 is a schematic diagram of the circuit architecture of a wireless unit according to another embodiment of the present disclosure. [Figure 7] FIG. 7 is a schematic diagram of the circuit architecture of a wireless unit according to another embodiment of the present disclosure. [Figure 8] FIG. 8 is a schematic diagram of a circuit architecture for a base station and satellite communication according to another embodiment of the present disclosure. [Figure 9] FIG. 9 is a schematic diagram of a circuit architecture for a base station and satellite communication according to another embodiment of the present disclosure. [Figure 10] FIG. 10 is a schematic diagram of a circuit architecture of a base station and satellite communication according to one embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, the embodiments will be described in detail with reference to the drawings, but the described embodiments are not used to limit the scope of this specification. Any structure obtained by combining components in a new manner and any device having the same effect as the combination of components are included within the scope of this specification. Note that the drawings are for illustrative purposes only and are not drawn to scale.

[0016] The terms "first," "second," etc. used in this specification do not refer to any particular order or ranking, but are merely used to distinguish between different objects being described and do not limit the present invention.

[0017] As used herein, "multiple printed circuit boards" refers to one or more printed circuit boards, and refers to at least two or more printed circuit boards, and each printed circuit board may be a single-sided (also called a single layer), double-sided (also called a double layer), or multilayer printed circuit board, or any combination of these three types.

[0018] As used herein, "bidirectional transmission" means that when A transmits signals or data to B bidirectionally, A can transmit signals or data to B and / or B can transmit signals or data to A.

[0019] As used herein, the term "Radio Unit (RU)" refers to an antenna, RF A radio unit as used herein refers to a system having analog circuits and digital circuits, and may be a multi-antenna radio unit. For example, an open radio unit (O-RU) configured by an open radio access network (O-RAN) is included in the radio unit defined in this specification. Other combinations, such as a combination system of an open radio unit (O-RU) and an open distributed unit (O-DU), are also included in the radio unit defined in this specification.

[0020] As used herein, the term "Distributed Unit (DU)" refers to a system connected to a radio unit via one or more interfaces and including digital circuits for physical layer (PHY)-related operations. For example, an Open Distributed Unit (O-DU) formed by an Open Radio Access Network (O-RAN) is included in the distributed unit definition herein. Other combinations, such as a combination system of an Open Distributed Unit and an Open Central Unit (O-CU), are also included in the distributed unit definition herein.

[0021] The term "fronthaul interface" as used herein refers to an interface connecting a radio unit and a distributed unit. For example, a fronthaul interface formed by an open radio access network employs the evolved Common Public Radio Interface (eCPRI) protocol and includes a control plane (C-Plane), a user plane (U-Plane), a synchronization plane (S-Plane), and a management plane (M-Plane), and is included in the fronthaul interface defined herein.

[0022] Referring to FIG. 1, FIG. 1 illustrates a schematic diagram of a wireless communication base station 10 having radio units. The radio units (RUs) 100a to 100c include antennas, RFThe wireless communication base station 10 having the radio units can be used in fifth-generation (5G) mobile communication base stations. The wireless communication base station 10 has radio units 100a to 100c integrated with antennas, making it suitable for active antenna architectures with a large number of antennas, such as massive multiple-input multiple-output (MIMO) base stations. As shown in FIG. 1, the wireless communication base station 10 having the radio units includes radio units 100a to 100c, a support frame 120, a distributed unit (DU) 130, and fronthaul interfaces 11a to 11c.

[0023] The support frame 120 mainly serves as a support, and the antenna, RF The radio units 100a to 100c, each including an analog circuit and a digital circuit, are attached. The antenna transmits and receives radio signals. RF Analog circuits are RF Front-end module (FEM) and RF Modules and mainly RF The radio units 100a-100c perform analog signal processing, while the digital circuit portion mainly performs digital signal processing operations related to the low physical layer (Low-PHY) and includes a beamforming module, a communication digital signal processing module, and a fronthaul interface module. The circuit architecture of the radio units is the core of this disclosure, and details can be found in the descriptions of the embodiments in Figures 4-7. The radio units 100a-100c transmit digital data bidirectionally via the fronthaul interfaces 11a-11c to the distributed unit 130, which performs functions necessary for the radio communication base station 10 of the radio units, including the high physical layer (High-PHY), media access control (MAC), and radio link control (RLC).

[0024] 2, which illustrates a schematic diagram of a wireless communication base station 20. Unlike the illustration in FIG. 1, in the wireless communication base station 10 having radio units, the radio units 100a-100c can be separated from the distributed unit 130. The base station (BS) circuits 200a-200c of the wireless communication base station 20 include the internal modules of the radio units (RUs) 100a-100c, and can also integrate the internal modules of the distributed unit (DU) 130 and the central unit (CU) into an integrated base station. The distributed unit (DU) 130 can include baseband digital circuits having functions such as a high-physical layer (High-PHY), a medium access control (MAC), and a radio link control (RLC). Meanwhile, the central unit (CU) herein refers to a system of baseband digital circuits including functions such as a packet data convergence protocol (PDCP) and radio resource control (RRC). For example, an Open Central Unit (O-CU) formed by an Open Radio Access Network (O-RAN) belongs to the central unit defined in this specification.

[0025] 2, the wireless communication base station 20 includes base station (BS) circuits 200a to 200c and a support frame 220. The support frame 220 mainly plays a supporting role, and has an antenna, RF Base station circuits 200a-200c are installed, including analog circuits and digital circuits. The circuit architecture of the base station is the core of this disclosure, and details can be found in the description of the embodiments in Figures 8-10.

[0026] Referring to Figure 3, Figure 3 illustrates a schematic diagram of a satellite communication ground station 30. As shown in Figure 3, the satellite communication ground station 30 includes a ground station (GS) circuit 300 and a support frame 320. The support frame 320 mainly plays a supporting role, and has an antenna, RF The satellite communication ground station is equipped with a ground station circuit 300 including analog and digital circuits. The circuit architecture of the satellite communication ground station is the core of this disclosure, and details can be found in the description of the embodiments in Figures 8 to 10.

[0027] 4, which is a schematic diagram of a circuit architecture 400 of a wireless unit according to one embodiment of the present disclosure. As shown in FIG. 4, the circuit architecture 400 of the wireless unit includes a first printed circuit board 410, a second printed circuit board 420, a third printed circuit board 430, a unidirectional analog interface 41, a bidirectional analog interface 42, a bidirectional analog interface 43, and a fronthaul interface 44.

[0028] The first printed circuit board 410 includes an antenna module 411 and RF The antenna module 411 includes a front-end module (FEM) 412. The antenna module 411 includes a transmitting and receiving antenna for transmitting and receiving radio signals. The number of antennas may be a single antenna or multiple antennas, and is particularly suitable for antenna arrays with a large number of antennas, such as 32 antennas, 64 antennas, 128 antennas, or more for massive multiple-input multiple-output (Massive MIMO) antennas. RF The front-end module (FEM) 412 includes one or more transmit / receive (T / R) switches, power amplifiers (PA), and low-noise amplifiers (LNA). The transmit / receive switch is used to switch between a transmit circuit and a receive circuit. The power amplifier in the transmit circuit is mainly connected to the second printed circuit board 420 via a unidirectional analog interface 41. RFGenerated by module 421 RF A signal is input, amplified, and then output to the antenna module 411. The low-noise amplifier in the receiving circuit amplifies the signal received by the antenna module 411, and then outputs the amplified signal to the second printed circuit board 420 via the one-way analog interface 41. RF Output to module 421.

[0029] The second printed circuit board 420 includes: RF It includes a module 421, a communication digital signal processing module 422, a beamforming module 423, and a fronthaul interface module 424.

[0030] RF The module 421 includes one or more up / down converters, filters, amplifiers, and / or attenuators. Its main functions are: RF These are the up / down of the frequency of the analog signal, filtering, and signal amplification and attenuation. In the transmission circuit, first, the analog signal generated by the D / A converter (Digital to Analog Converter, DAC) in the communication digital signal processing module 422 is filtered by a filter, the gain is adjusted by an amplifier or attenuator, and the signal frequency is increased to the carrier frequency of the transmission signal via an up converter, and then the signal is transmitted to the first printed circuit board 410 via the unidirectional analog interface 41. RF The signal is output to the front-end module 412. In the receiving circuit, first, RFThe received signal supplied from the front-end module 412 is input to a down converter and a filter via the one-way analog interface 41, where it is subjected to frequency down-converting and filtering, the gain is adjusted by an amplifier or an attenuator, and the signal is output to an A / D converter (Analog to Digital Converter, ADC) in the communication digital signal processing module 422.

[0031] The communication digital signal processing module 422 includes two parts, a transmitting circuit and a receiving circuit, and the transmitting circuit includes an inverse fast Fourier transform (IFFT), a cyclic prefix addition (CP addition), a peak suppression (Crest Factor Reduction (CFR)), a digital pre-distortion (DPD), a digital up-converter (DUC), and a digital-to-analog converter (DAC). First, a frequency domain signal undergoes an orthogonal frequency division multiplexing (OFDM) modulation operation through an inverse fast Fourier transform and a cyclic prefix addition, and the frequency domain signal is converted into a time domain signal. Then, the signal amplitude is limited within a set dynamic range by peak suppression (CFR), and then the frequency domain signal is converted into a time domain signal. RF The nonlinear distortion caused by the power amplifier (PA) in the front-end module 412 is compensated by the digital predistortion (DPD). Finally, the signal sampling frequency and / or frequency shift is increased by the digital up-converter 4 (DUC), and the digital signal is converted to an analog signal by the D / A converter (DAC). RF It is output to module 421.

[0032] The communication digital signal processing module 422 includes an A / D converter (ADC), a digital down converter (DDC), a cyclic prefix removal (CP removal), and a fast Fourier transform (FFT) in its receiving section. RF The analog signal output from module 421 is converted to a digital signal by an A / D converter (ADC), and then further processed by a digital downconverter (DDC) to reduce the signal sampling frequency and / or frequency shift it. Finally, orthogonal frequency division multiplexing (OFDM) demodulation operations are performed by cyclic prefix removal (CP removal) and fast Fourier transform (FFT), and the time domain signal is converted to a frequency domain signal.

[0033] The communications digital signal processing module 422 may also include modules for physical random access channel (PRACH) processing, automatic gain control (AGC), OFDM phase compensation, antenna calibration, and in-phase and quadrature (I / Q) signal compression and decompression. Among these, the PRACH processing mainly performs filtering related to the PRACH, the automatic gain control is used to achieve automatic gain adjustment, the OFDM phase compensation provides calculations for compensating for the phase of OFDM, the antenna calibration can match the gain of the antennas and high-frequency circuits on the transmitting and receiving sides, and the in-phase and quadrature signal compression and decompression are used to reduce the amount of data transmitted and received via the fronthaul interface 44.

[0034] The beamforming module 423 mainly performs beamforming calculations for uplink and downlink, where in the uplink, the beamforming calculation mainly converts digital signals received by each antenna into data streams for each corresponding user, and in the downlink, the beamforming calculation mainly converts data streams to be transmitted to each user into digital signals corresponding to each antenna.

[0035] The fronthaul interface module 424 is a transceiver of the fronthaul interface 44, and can transmit data from the wireless units 100a to 100c to the distributed unit 130 via the fronthaul interface 44, and can also receive data transmitted from the distributed unit 130 to the wireless units 100a to 100c via the fronthaul interface 44.

[0036] As shown in FIG. 4, data can be transmitted bidirectionally between the first printed circuit board 410 and the second printed circuit board 420 through one or more unidirectional analog interfaces 41, where the unidirectional analog interface 41 is an interface for analog signals; RF Front-end module (FEM) 412 and RF It can be a bidirectional transmission interface between the module 421 and the oscilloscope.

[0037] The third printed circuit board 430 includes a power supply module 431 which is a power supply circuit and can supply power to the internal modules of the second printed circuit board 420 and the first printed circuit board 410 via one or more bidirectional analog interfaces 42 and 43, respectively, where the bidirectional analog interfaces 42 and 43 may be any powerable analog interfaces, such as a power cable or a power outlet.

[0038] The components or circuits of each module according to the present disclosure may be combined in any manner, and all combinations fall within the scope of the present disclosure. RF Module 421 is RF It is an integrated circuit (RF Integrated Circuit, RFIC), and some digital circuits in the communication digital signal processing module 422 can be integrated, such as digital predistortion (DPD), peak suppression (CFR), automatic gain control (AGC), D / A converter (DAC), A / D converter (ADC), digital up-converter (DUC), and digital down-converter (DDC).

[0039] 5, which is a schematic diagram of a circuit architecture 500 of a wireless unit according to one embodiment of the present disclosure. As shown in FIG. 5, the circuit architecture 500 of the wireless unit includes a first printed circuit board 510, a second printed circuit board 520, a third printed circuit board 530, a digital interface 51, a bidirectional analog interface 52, a bidirectional analog interface 53, and a fronthaul interface 54.

[0040] The first printed circuit board 510 includes an antenna module 511, RF Front-End Module (FEM) 512, and RF The antenna module 511 includes a transmitting / receiving antenna for transmitting and receiving radio signals. The number of antennas may be a single antenna or multiple antennas, and is particularly suitable for antenna arrays with a large number of antennas, such as 32 antennas, 64 antennas, 128 antennas, or more for massive multiple-input multiple-output (Massive MIMO) antennas. RFThe front-end module (FEM) 512 includes one or more transmit / receive switches (T / R switches), power amplifiers (PAs), and low-noise amplifiers (LNAs). The transmit / receive switches are used to switch between a transmit circuit and a receive circuit. The power amplifiers in the transmit circuit are mainly used to RF Input from module 513 RF The low noise amplifier in the receiving circuit amplifies the signal received by the antenna module 511 and outputs it to the antenna module 511. RF Output to module 513.

[0041] In this embodiment, RF Module 513 (RFIC) consists of multiple up / down converters, filters, amplifiers and / or attenuators. RF In addition to analog circuits, it integrates some digital circuits, including digital pre-distortion (DPD), peak suppression (CFR), automatic gain control (AGC), digital-to-analog converter (DAC), analog-to-digital converter (ADC), digital up-converter (DUC), and digital down-converter (DDC).

[0042] The second printed circuit board 520 includes a communication digital signal processing module 521, a beamforming module 522, and a fronthaul interface module 523.

[0043] The communication digital signal processing module 521 includes a transmit section including an inverse fast Fourier transform (IFFT) and a cyclic prefix addition (CP addition), while a receive section including a fast Fourier transform (FFT) and a cyclic prefix removal (CP removal). Other digital circuits, such as a digital predistortion (DPD), a peak suppression (CFR), an automatic gain control (AGC), a digital-to-analog converter (DAC), an analog-to-digital converter (ADC), a digital up-converter (DUC), and a digital down-converter (DDC), are included. RF Module 513 RF The communication digital signal processing module 521 may also include modules for processing physical random access channels, phase compensation for orthogonal frequency division multiplexing, antenna correction, and compression and decompression of in-phase and quadrature signals. The communication digital signal processing module 521 may also include modules for processing physical random access channels, phase compensation for orthogonal frequency division multiplexing, antenna correction, and compression and decompression of in-phase and quadrature signals via one or more digital interfaces 51. RF Digital data is transmitted bidirectionally to the digital circuitry in module 513 .

[0044] The beamforming module 522 mainly performs uplink and downlink beamforming operations, where in the uplink part, the beamforming operation mainly converts the digital signals received by each antenna into corresponding data streams for each user, and in the downlink part, the beamforming operation mainly converts the data streams to be transmitted to each user into corresponding digital signals for each antenna.

[0045] The fronthaul interface module 523 is a transceiver of the fronthaul interface 54, and can transmit data from the wireless units 100a to 100c to the distributed unit 130 via the fronthaul interface 54, and can also receive data transmitted from the distributed unit 130 to the wireless units 100a to 100c via the fronthaul interface 54.

[0046] As shown in FIG. 5, data is transmitted bidirectionally between a first printed circuit board 510 and a second printed circuit board 520 via one or more digital interfaces 51, where the digital interfaces 51 can be implemented by interfaces such as JESD204 (A / B / C), Low-Voltage Differential Signaling (LVDS), PCIe (Peripheral Component Interconnect Express), or any other type of interface.

[0047] The third printed circuit board 530 includes a power supply module 531 which is a power supply circuit and can supply power to the internal modules of the second printed circuit board 520 and the first printed circuit board 510 via one or more bidirectional analog interfaces 52 and 53, respectively, where the bidirectional analog interfaces 52 and 53 may be any powerable analog interfaces, such as a power cable or a power outlet.

[0048] 6, which is a schematic diagram of a circuit architecture 600 of a wireless unit according to one embodiment of the present disclosure. As shown in FIG. 6, the circuit architecture 600 of the wireless unit includes a first printed circuit board 610, a second printed circuit board 620, a digital interface 61, a bidirectional analog interface 62, and a fronthaul interface 63.

[0049] The first printed circuit board 610 includes an antenna module 611, RF Front-End Module (FEM) 612, and RFThe antenna module 611 includes a transmitting / receiving antenna for transmitting and receiving radio signals, which may be a single antenna or multiple antennas, and is particularly suitable for antenna arrays with a large number of antennas, such as 32 antennas, 64 antennas, 128 antennas, or more for massive multiple-input multiple-output (Massive MIMO) applications. RF The front-end module (FEM) 612 includes one or more transmit / receive switches (T / R switches), power amplifiers (PAs), and low-noise amplifiers (LNAs). The transmit / receive switches are used to switch between a transmit circuit and a receive circuit. The power amplifiers in the transmit circuit are mainly used to RF Input from module 613 RF The low noise amplifier in the receiving circuit amplifies the signal received by the antenna module 611 and outputs it to the antenna module 611. RF Output to module 613.

[0050] In this embodiment, RF Module 613 (RFIC) is one or more up / down converters, filters, amplifiers and / or attenuators RF In addition to analog circuits, it integrates some digital circuits, including digital pre-distortion (DPD), peak suppression (CFR), automatic gain control (AGC), digital-to-analog converter (DAC), analog-to-digital converter (ADC), digital up-converter (DUC), and digital down-converter (DDC).

[0051] The second printed circuit board 620 includes a communication digital signal processing module 621, a beamforming module 622, a fronthaul interface module 623, and a power supply module 624.

[0052] The communication digital signal processing module 621 includes a transmission section including an inverse fast Fourier transform (IFFT) and a cyclic prefix addition (CP addition), while a reception section including a fast Fourier transform (FFT) and a cyclic prefix removal (CP removal). Other digital circuits, such as a digital predistortion (DPD), a peak suppression (CFR), an automatic gain control (AGC), a digital-to-analog converter (DAC), an analog-to-digital converter (ADC), a digital up-converter (DUC), and a digital down-converter (DDC), are included. RF Module 613 RF The communication digital signal processing module 621 may also include modules for processing a physical random access channel, phase compensation for orthogonal frequency division multiplexing, antenna correction, and compression and decompression of in-phase and quadrature signals. Furthermore, the communication digital signal processing module 621 may also include modules for processing a physical random access channel, phase compensation for orthogonal frequency division multiplexing, antenna correction, and compression and decompression of in-phase and quadrature signals. RF Data can be transmitted to and from module 613 .

[0053] The beamforming module 622 mainly performs uplink and downlink beamforming operations, where in the uplink part, the beamforming operation mainly converts the digital signals received by each antenna into corresponding data streams for each user, and in the downlink part, the beamforming operation mainly converts the data streams to be transmitted to each user into corresponding digital signals for each antenna.

[0054] The fronthaul interface module 623 is a transceiver of the fronthaul interface 63, and can transmit data from the wireless units 100a to 100c to the distributed unit 130 via the fronthaul interface 63, and can also receive data transmitted from the distributed unit 130 to the wireless units 100a to 100c via the fronthaul interface 63.

[0055] The power supply module 624 is a power supply circuit and can supply power to each of the internal modules of the first printed circuit board 610 via one or more bidirectional analog interfaces 62, which may be any power-supplyable analog interface, such as a power cable or a power outlet.

[0056] As shown in FIG. 6, data is transmitted bidirectionally between the first printed circuit board 610 and the second printed circuit board 620 via one or more digital interfaces 61, where the digital interface 51 can be realized by an interface such as JESD204 (A / B / C), low voltage differential signaling, PCIe, or any other type of interface.

[0057] 7, which is a schematic diagram of a circuit architecture 700 of a wireless unit according to one embodiment of the present disclosure. As shown in FIG. 7, the circuit architecture 700 of the wireless unit includes a first printed circuit board 710, a second printed circuit board 720, a bidirectional analog interface 71, and a fronthaul interface 72.

[0058] The first printed circuit board 710 includes an antenna module 711, RF Front-end module (FEM) 712, RF module 713, a communications digital signal processing module 714, a beamforming module 715, and a fronthaul interface module 716.

[0059] The antenna module 711 includes a transmit / receive antenna for transmitting and receiving radio signals, which may be a single antenna or multiple antennas, and is particularly suitable for antenna arrays with a large number of antennas, such as 32 antennas, 64 antennas, 128 antennas, or more for massive multiple-input multiple-output (Massive MIMO) applications. RFThe front-end module (FEM) 712 includes one or more transmit / receive switches (T / R switches), power amplifiers (PAs), and low-noise amplifiers (LNAs). The transmit / receive switches are used to switch between a transmit circuit and a receive circuit. The power amplifiers in the transmit circuit are mainly used to RF Input from module 713 RF The low noise amplifier in the receiving circuit amplifies the signal received by the antenna module 711 and outputs it to the antenna module 711. RF Output to module 713.

[0060] In this embodiment, RF Module 713 (RFIC) is one or more up / down converters, filters, amplifiers, and / or attenuators. RF In addition to analog circuits, it integrates some digital circuits, including digital pre-distortion (DPD), peak suppression (CFR), automatic gain control (AGC), digital-to-analog converter (DAC), analog-to-digital converter (ADC), digital up-converter (DUC), and digital down-converter (DDC).

[0061] The communication digital signal processing module 714 includes a transmit section including an inverse fast Fourier transform (IFFT) and a cyclic prefix addition (CP addition), while a receive section includes a fast Fourier transform (FFT) and a cyclic prefix removal (CP removal). Other digital circuits, such as a digital predistortion (DPD), a peak suppression (CFR), an automatic gain control (AGC), a digital-to-analog converter (DAC), an analog-to-digital converter (ADC), a digital up-converter (DUC), and a digital down-converter (DDC), are included. RF Module 713 RFThe communications digital signal processing module 714 may also include modules for processing physical random access channels, phase compensation for orthogonal frequency division multiplexing, antenna correction, and compression and decompression of in-phase and quadrature signals.

[0062] The beamforming module 715 mainly performs uplink and downlink beamforming operations, where in the uplink part, the beamforming operation mainly converts the digital signals received by each antenna into corresponding data streams for each user, and in the downlink part, the beamforming operation mainly converts the data streams to be transmitted to each user into corresponding digital signals for each antenna.

[0063] The fronthaul interface module 716 is a transceiver of the fronthaul interface 72, and can transmit data from the wireless units 100a to 100c to the distributed unit 130 via the fronthaul interface 72, and can also receive data transmitted from the distributed unit 130 to the wireless units 100a to 100c via the fronthaul interface 72.

[0064] The second printed circuit board 720 includes a power supply module 721 which is a power supply circuit and can supply power to the internal modules of the first printed circuit board 710 via one or more bidirectional analog interfaces 71, each of which may be any powerable analog interface, such as a power cable or a power outlet.

[0065] 8, which is a schematic diagram of a base station and satellite communication circuit architecture 800 according to one embodiment of the present disclosure. As shown in FIG. 8, the base station and satellite communication circuit architecture 800 includes a first printed circuit board 810, a second printed circuit board 820, a third printed circuit board 830, a unidirectional analog interface 81, a bidirectional analog interface 82, a bidirectional analog interface 83, and a fronthaul interface 84.

[0066] The first printed circuit board 810 includes an antenna module 811 and RF The antenna module 811 includes a front-end module (FEM) 812. The antenna module 811 includes a transmitting and receiving antenna for transmitting and receiving radio signals. The number of antennas may be a single antenna or multiple antennas, and is particularly suitable for antenna arrays with a large number of antennas, such as 32 antennas, 64 antennas, 128 antennas, or more for massive multiple-input multiple-output (Massive MIMO) antennas. RF The front-end module (FEM) 812 includes one or more transmit / receive switches (T / R switches), a power amplifier (PA), and a low-noise amplifier (LNA). The transmit / receive switch is used to switch between a transmit circuit and a receive circuit. The power amplifier in the transmit circuit is mainly connected to the second printed circuit board 820 via the unidirectional analog interface 81. RF Generated by module 821 RF A signal is input, amplified, and then output to the antenna module 811. The low noise amplifier in the receiving circuit amplifies the signal received by the antenna module 811, and then outputs the amplified signal to the second printed circuit board 820 via the one-way analog interface 81. RF Output to module 821.

[0067] The second printed circuit board 820 is RF module 821, a beamforming module 822, and a baseband digital circuit module 823.

[0068] RF The module 821 includes one or more up / down converters, filters, amplifiers, and / or attenuators. Its main functions are: RF These include frequency up / down of analog signals, filtering, and signal amplification and attenuation.

[0069] The beamforming module 822 mainly performs uplink and downlink beamforming operations, where in the uplink part, the beamforming operation mainly converts the digital signals received by each antenna into corresponding data streams for each user, and in the downlink part, the beamforming operation mainly converts the data streams to be transmitted to each user into corresponding digital signals for each antenna.

[0070] In this embodiment, the baseband digital circuit module 823 refers to a digital circuit related to communication baseband calculation. For example, in a base station application, the baseband digital circuit module 823 may include a digital circuit of a communication digital signal processing module in the radio units (RUs) 100a to 100c, or may include a baseband digital circuit of the distributed unit (DU) 130 and / or the central unit (CU). In a satellite communication application, the baseband digital circuit module 823 is a communication baseband calculation digital circuit related to satellite communication, and may include, for example, a digital circuit for calculation such as modulation and demodulation. Specifically, the baseband digital circuit module 823 includes not only basic modules such as modulation and demodulation, D / A converter, A / D converter, digital downconverter, and / or digital upconverter, but also at least one or a combination of a fast inverse Fourier transform (IFFT), cyclic prefix addition (CP addition), crest factor reduction (CFR), digital predistortion (DPD), cyclic prefix removal (CP removal), fast Fourier transform (FFT), physical random access channel (PRACH) processing, automatic gain control (AGC), orthogonal frequency division multiplexing (OFDM) phase compensation, antenna calibration, in-phase and quadrature-phase (I / Q) signal compression and decompression, high-physical layer (High-PHY), media access control (MAC), radio link control (RLC), packet data convergence protocol (PDCP), and radio resource control (RRC).

[0071] As shown in Figure 8, data is transmitted bidirectionally between a first printed circuit board 810 and a second printed circuit board 820 via one or more unidirectional analog interfaces 81. Here, the unidirectional analog interface 81 is an interface for analog signals, RF Front-end module (FEM) 812 and RF It can be a bidirectional transmission interface between the module 821 and the oscilloscope.

[0072] The third printed circuit board 830 includes a power supply module 831 which is a power supply circuit and can supply power to the internal modules of the second printed circuit board 820 and the first printed circuit board 810 via one or more bidirectional analog interfaces 82 and 83, respectively, where the bidirectional analog interfaces 82 and 83 may be any powerable analog interfaces, such as a power cable or a power outlet.

[0073] 9, which is a schematic diagram of a circuit architecture 900 for a base station and satellite communication according to one embodiment of the present disclosure. As shown in FIG. 9, the circuit architecture 900 for a base station and satellite communication includes a first printed circuit board 910, a second printed circuit board 920, a third printed circuit board 930, a digital interface 91, a bidirectional analog interface 92, and a bidirectional analog interface 93.

[0074] The first printed circuit board 910 includes an antenna module 911, RF Front-End Module (FEM) 912, and RF The antenna module 911 includes a transmitting / receiving antenna for transmitting and receiving radio signals. The number of antennas may be a single antenna or multiple antennas, and is particularly suitable for antenna arrays with a large number of antennas, such as 32 antennas, 64 antennas, 128 antennas, or more for massive multiple-input multiple-output (Massive MIMO) antennas. RFThe front-end module (FEM) 912 includes one or more transmit / receive switches (T / R switches), power amplifiers (PAs), and low-noise amplifiers (LNAs). The transmit / receive switches are used to switch between a transmit circuit and a receive circuit. The power amplifiers in the transmit circuit are mainly used to RF Entered into module 913 RF The low noise amplifier in the receiving circuit amplifies the signal received by the antenna module 911 and outputs it to the antenna module 911. RF Output to module 913.

[0075] In this embodiment, RF The module 913 may include one or more up / down converters, filters, amplifiers, and / or attenuators. RF Besides the analog circuits, some digital circuits can be integrated, including digital pre-distortion (DPD), peak suppression (CFR), automatic gain control (AGC), digital-to-analog converter (DAC), analog-to-digital converter (ADC), digital up-converter (DUC), and digital down-converter (DDC).

[0076] The second printed circuit board 920 includes a beamforming module 921 and a baseband digital circuit module 922 .

[0077] The beamforming module 921 mainly performs uplink and downlink beamforming operations, where in the uplink part, the beamforming operation mainly converts the digital signals received by each antenna into corresponding data streams for each user, and in the downlink part, the beamforming operation mainly converts the data streams to be transmitted to each user into corresponding digital signals for each antenna.

[0078] In this embodiment, the baseband digital circuit module 922 refers to a digital circuit related to communication baseband calculations. For example, in a base station application, the baseband digital circuit module 922 may include a digital circuit of a communication digital signal processing module in the radio units (RUs) 100a to 100c, or may include a baseband digital circuit of the distributed unit (DU) 130 and / or the central unit (CU). In a satellite communication application, the baseband digital circuit module 922 is a communication baseband calculation digital circuit related to satellite communication, and may include, for example, a digital circuit for calculations such as modulation and demodulation. Specifically, the baseband digital circuit module 923 includes not only basic modules such as modulation and demodulation, D / A converter, A / D converter, digital downconverter, and / or digital upconverter, but also at least one or a combination of a fast inverse Fourier transform (IFFT), cyclic prefix addition (CP addition), crest factor reduction (CFR), digital predistortion (DPD), cyclic prefix removal (CP removal), fast Fourier transform (FFT), physical random access channel (PRACH) processing, automatic gain control (AGC), orthogonal frequency division multiplexing (OFDM) phase compensation, antenna calibration, in-phase and quadrature-phase (I / Q) signal compression and decompression, high-physical layer (High-PHY), media access control (MAC), radio link control (RLC), packet data convergence protocol (PDCP), and radio resource control (RRC).

[0079] As shown in FIG. 9, one or more digital interfaces are provided between the first printed circuit board 910 and the second printed circuit board 920. 91 Data is transmitted bidirectionally through the digital interface 91 can be realized by an interface such as JESD204 (A / B / C), low voltage differential signaling, PCIe, or any other type of interface.

[0080] The third printed circuit board 930 includes a power supply module 931 which is a power supply circuit and can supply power to the internal modules of the second printed circuit board 920 and the first printed circuit board 910 via one or more bidirectional analog interfaces 92 and 93, respectively, where the bidirectional analog interfaces 92 and 93 may be any powerable analog interfaces, such as a power cable or a power outlet.

[0081] 10, which is a schematic diagram of a circuit architecture of a base station and satellite communication according to one embodiment of the present disclosure. As shown in FIG. 10, the circuit architecture 1000 of the base station and satellite communication includes a first printed circuit board 1010, a second printed circuit board 1020, and a bidirectional analog interface 101.

[0082] The first printed circuit board 1010 includes an antenna module 1011, RF Front-end module (FEM) 1012, RF module 1013, a beamforming module 1014, and a baseband digital circuit module 1015.

[0083] The antenna module 1011 includes a transmit / receive antenna for transmitting and receiving radio signals, which may be a single antenna or multiple antennas, and is particularly suitable for antenna arrays with a large number of antennas, such as 32 antennas, 64 antennas, 128 antennas, or more for massive multiple-input multiple-output (Massive MIMO) antennas. RF The front-end module (FEM) 1012 includes one or more transmit / receive switches (T / R switches), power amplifiers (PAs), and low-noise amplifiers (LNAs). The transmit / receive switches are used to switch between a transmit circuit and a receive circuit. The power amplifiers in the transmit circuit are mainly used to RF Entered into module 1013 RF The low noise amplifier in the receiving circuit amplifies the signal received by the antenna module 1011 and outputs it to the antenna module 1011. RF Output to module 1013.

[0084] In this embodiment, RF Module 1013 (RFIC)is one or more up / down converters, filters, amplifiers, and / or attenuators. RF Besides the analog circuits, some digital circuits can be integrated, including digital pre-distortion (DPD), peak suppression (CFR), automatic gain control (AGC), digital-to-analog converter (DAC), analog-to-digital converter (ADC), digital up-converter (DUC), and digital down-converter (DDC).

[0085] The beamforming module 1014 mainly performs uplink and downlink beamforming operations, where in the uplink part, the beamforming operation mainly converts the digital signals received by each antenna into corresponding data streams for each user, and in the downlink part, the beamforming operation mainly converts the data streams to be transmitted to each user into digital signals corresponding to each antenna.

[0086] The baseband digital circuit module 1015 in this specification and the present embodiment refers to a digital circuit related to communication baseband operations. For example, in a base station application, the baseband digital circuit module 1015 may include a digital circuit of a communication digital signal processing module in the radio units (RUs) 100a to 100c, or may include a baseband digital circuit of a distributed unit (DU) 130 and / or a central unit (CU). In a satellite communication application, the baseband digital circuit module 1015 is a communication baseband operation digital circuit related to satellite communication, and may include, for example, a digital circuit for operations such as modulation and demodulation. Specifically, the baseband digital circuit module 1015 includes not only basic modules such as modulation and demodulation, D / A converter, A / D converter, digital downconverter, and / or digital upconverter, but also at least one or a combination of a fast inverse Fourier transform (IFFT), cyclic prefix addition (CP addition), crest factor reduction (CFR), digital predistortion (DPD), cyclic prefix removal (CP removal), fast Fourier transform (FFT), physical random access channel (PRACH) processing, automatic gain control (AGC), orthogonal frequency division multiplexing (OFDM) phase compensation, antenna calibration, in-phase and quadrature-phase (I / Q) signal compression and decompression, high-physical layer (High-PHY), media access control (MAC), radio link control (RLC), packet data convergence protocol (PDCP), and radio resource control (RRC).

[0087] The second printed circuit board 1020 includes a power supply module 1021 which is a power supply circuit and can supply power to the internal modules of the first printed circuit board 1010 via one or more bidirectional analog interfaces 101, each of which may be any powerable analog interface, such as a power cable or a power outlet. [Explanation of symbols]

[0088] 10: Wireless communication base station having a wireless unit 11a-11c, 44, 54, 63, 72: Fronthaul interfaces 100a to 100c: Wireless unit 120, 220, 320: Support frame 130: Distributed Unit 20: Wireless communication base station 200a~200c: Base station circuit 30: Satellite communications ground station 300: Ground station circuit 41, 81: Bidirectional analog interface 42, 43, 52, 53, 62, 71, 82, 83, 92, 93, 101: Unidirectional analog interfaces 400, 500, 600, 700: Circuit architecture of radio units 410, 420, 430, 510, 520, 530, 610, 620, 710, 720, 810, 820, 830, 910, 920, 930, 1010, 1020: Printed circuit boards 411, 511, 611, 711, 811, 911, 1011: Antenna modules 412, 512, 612, 712, 812, 912, 1012: FR front-end module 421, 513, 613, 713, 821, 913, 1013: FR modules 422, 521, 621, 714: Communications digital signal processing modules 423, 522, 622, 715, 822, 921, 1014: Beamforming modules 424, 523, 623, 716: Fronthaul interface modules 431, 531, 624, 721, 831, 931, 1021: Power supply modules 51, 61, 91: Two-way digital interface 800, 900, 1000: Circuit architecture for base stations and satellite communications

Claims

1. a plurality of printed circuit boards capable of transmitting data and / or signals between each other via any type and any quantity of unidirectional or bidirectional digital and / or analog interfaces, at least one of said printed circuit boards including an antenna module and at least one other printed circuit board including a fronthaul interface module; At least one of the two or other printed circuit boards has a communication digital signal processing module; The communication digital signal processing module includes: D / A converter (DAC), Analog-to-digital converters (ADCs), Digital Down Converter (DDC), Digital up-converter (DUC), Inverse Fast Fourier Transform (IFFT), Cyclic prefix addition (CP addition), Peak suppression (CFR), Digital Pre-Distortion (DPD), Cyclic prefix removal (CP removal), Fast Fourier Transform (FFT), and Antenna Correction Module apart from, Physical Random Access Channel (PRACH) processing; Automatic Gain Control (AGC), OFDM (Orthogonal Frequency Division Multiplexing) phase compensation, and Compression and decompression of in-phase and quadrature (I / Q) signals 2. A circuit architecture for a radio unit comprising at least one of the above modules or a combination thereof.

2. The at least one printed circuit board including the antenna module further includes an RF (radio frequency) front-end module (FEM); the at least one more printed circuit board including the fronthaul interface module further includes an RF (radio frequency) module, a communication digital signal processing module, and a beamforming module; 2. The circuit architecture for a radio unit according to claim 1, wherein the RF front-end module (FEM) includes one or more transmit / receive switches (T / R switches), a power amplifier (PA), and a low noise amplifier (LNA).

3. The at least one printed circuit board including the antenna module further includes an RF front-end module (FEM) and an RF module; the at least one more printed circuit board including the fronthaul interface module further includes a communications digital signal processing module and a beamforming module; The RF front-end module (FEM) includes one or more transmit / receive switches (T / R switches), a power amplifier (PA), and a low-noise amplifier (LNA); 2. The circuit architecture for a radio unit according to claim 1, wherein the RF module includes one or more up-converters (UC), down-converters (DC), filters, and amplifiers and / or attenuators.

4. 2. The circuit architecture for a wireless unit according to claim 1, wherein at least one other printed circuit board of said plurality of printed circuit boards includes a power supply module.

5. a plurality of printed circuit boards capable of transmitting data and / or signals between each other via any type and any number of unidirectional or bidirectional digital and / or analog interfaces, at least one of said printed circuit boards including an antenna module and at least one other printed circuit board including a power supply module; At least one of the two or other printed circuit boards includes a communication digital signal processing module; The communication digital signal processing module includes: D / A converter (DAC), Analog-to-digital converters (ADCs), Digital Down Converter (DDC), Digital up-converter (DUC), Inverse Fast Fourier Transform (IFFT), Cyclic prefix addition (CP addition), Peak suppression (CFR), Digital Pre-Distortion (DPD), Cyclic prefix removal (CP removal), Fast Fourier Transform (FFT), and Antenna Correction Module apart from, Physical Random Access Channel (PRACH) processing; Automatic Gain Control (AGC), OFDM phase compensation, and Compression and decompression of in-phase and quadrature (I / Q) signals 2. A circuit architecture for a radio unit comprising at least one of the above modules or a combination thereof.

6. A circuit architecture for a radio unit as described in claim 5, wherein the at least one printed circuit board including the antenna module further includes an RF front-end module (FEM), an RF module, a communication digital signal processing module, and a beamforming module, the RF front-end module (FEM) including one or more transmit / receive switches (T / R switches), a power amplifier (PA), and a low-noise amplifier (LNA), and the RF module including one or more upconverters (UC) and downconverters (DC), filters, amplifiers and / or attenuators.

7. a plurality of printed circuit boards capable of transmitting data and / or signals between each other via any type and any number of unidirectional or bidirectional digital and / or analog interfaces, at least one of the printed circuit boards including an antenna module and at least one of the printed circuit boards including a baseband digital circuit module; The baseband digital circuit module includes: modulation and demodulation, D / A converter (DAC), Analog-to-digital converters (ADCs), Digital Down Converter (DDC), a digital up-converter (DUC), and Antenna Correction Module apart from, Inverse Fast Fourier Transform (IFFT), Cyclic prefix addition (CP addition), Crest Factor Reduction (CFR), Digital Pre-Distortion (DPD), Cyclic prefix removal (CP removal), Fast Fourier Transform (FFT), Physical Random Access Channel (PRACH) processing; Automatic Gain Control (AGC), OFDM phase compensation, Compression and decompression of in-phase and quadrature (I / Q) signals; High physical layer (High-PHY), Media Access Control (MAC), Radio Link Control (RLC), Packet Data Convergence Protocol (PDCP), and Radio Resource Control (RRC) 1. A circuit architecture for base stations and satellite communications, comprising at least one module of the above or a combination thereof.

8. A circuit architecture for base stations and satellite communications as described in claim 7, wherein the at least one printed circuit board including the antenna module further includes an RF front-end module (FEM), and the at least another printed circuit board including the baseband digital circuit module further includes an RF module and a beamforming module, the RF front-end module (FEM) includes one or more transmit / receive switches (T / R switches), power amplifiers (PA), and low-noise amplifiers (LNA), and the RF module includes one or more upconverters (UC), downconverters (DC), filters, and amplifiers and / or attenuators.

9. A circuit architecture for base stations and satellite communications as described in claim 7, wherein the at least one printed circuit board including the antenna module further includes an RF front-end module (FEM) and an RF module, the at least another printed circuit board including the baseband digital circuit module further includes a beamforming module, the RF front-end module (FEM) includes one or more transmit / receive switches (T / R switches), power amplifiers (PA), and low-noise amplifiers (LNA), and the RF module includes one or more upconverters (UC), downconverters (DC), filters, and amplifiers and / or attenuators.

10. 8. The circuit architecture for base stations and satellite communications according to claim 7, wherein at least one more of said plurality of printed circuit boards includes a power supply module.

11. a plurality of printed circuit boards capable of transmitting data and / or signals between each other via any type and any quantity of unidirectional or bidirectional digital and / or analog interfaces, at least one of the printed circuit boards including an antenna module and at least one of the printed circuit boards including a power supply module; At least one of the two printed circuit boards or other boards includes a baseband digital circuit module; The baseband digital circuit module includes: modulation and demodulation, D / A converter (DAC), Analog-to-digital converters (ADCs), Digital Down Converter (DDC), a digital up-converter (DUC), and Antenna Correction Module apart from, Inverse Fast Fourier Transform (IFFT), Cyclic prefix addition (CP addition), Crest Factor Reduction (CFR), Digital Pre-Distortion (DPD), Cyclic prefix removal (CP removal), Fast Fourier Transform (FFT), Physical Random Access Channel (PRACH) processing; Automatic Gain Control (AGC), OFDM (Orthogonal Frequency Division Multiplexing) phase compensation, Compression and decompression of in-phase and quadrature (I / Q) signals; High physical layer (High-PHY), Media Access Control (MAC), Radio Link Control (RLC), Packet Data Convergence Protocol (PDCP), and Radio Resource Control (RRC) 1. A circuit architecture for base stations and satellite communications, comprising at least one module of the above or a combination thereof.

12. A circuit architecture for base stations and satellite communications as described in claim 11, wherein the at least one printed circuit board including the antenna module further includes an RF front-end module (FEM), an RF module, a beamforming module and a baseband digital circuit module, the RF front-end module (FEM) including one or more transmit / receive switches (T / R switches), power amplifiers (PA), and low-noise amplifiers (LNA), and the RF module including one or more upconverters (UC), downconverters (DC), filters, and amplifiers and / or attenuators.

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