Test socket contact pin and test socket including the same

Abstract

To provide a contact pin for a test socket capable of forming a plurality of contact pins at a smaller pitch and preventing interference or collision between the contact pins when automatically inserting the plurality of contact pins, and to provide a test socket including the same.SOLUTION: Provided is a contact pin for a test socket which is a contact pin 300 provided in a test socket for testing electrical characteristics of a semiconductor device, where the contact pin comprises: an elastic portion 310 elastically deformable in a longitudinal direction of the contact pin; a first contact portion 330 including a first support portion 331 extending from one end of the elastic portion and a first contact tip 332 connected to an end of the first support portion; and a second contact part 320 including a second support portion 321 extending from the other end of the elastic portion and a second contact tip 322 connected to an end of the second support portion, where the elastic portion and the second contact portion are bent in at least one direction with respect to the first contact portion.SELECTED DRAWING: Figure 17

Description

[Technical Field]

[0001] The present invention relates to a test socket for testing the electrical characteristics of semiconductor devices and to contact pins provided in the test socket. [Background technology]

[0002] Generally, semiconductor devices are manufactured by integrating electronic circuits densely on a circuit board. After the semiconductor devices are manufactured, they undergo a testing process to check whether they are operating properly before being assembled into a product.

[0003] This type of testing is performed by inserting the semiconductor device into a test socket, which is provided with multiple contact pins. When the terminals of the semiconductor device are brought into contact with the contact pins, electricity is passed through the socket, and the semiconductor device is tested using a test device.

[0004] Conventional semiconductor devices are dominated by relatively wide pitches, such as 1.0 mm or 0.8 mm, which is the distance between terminals. However, in recent years, as semiconductor devices have become increasingly smaller and thinner, the pitch of semiconductor devices has become narrower (narrower pitch).

[0005] The contact pin is bent in the center so as to be elastically deformable in the longitudinal direction.

[0006] Multiple contact pins are automatically inserted into through holes formed in the housing of the test socket, but if the pitch of the semiconductor device is less than a certain dimension (if the bent state of the contact pins is wider than the pitch), the contact pins may interfere with or collide with adjacent contact pins when inserted into the housing of the test socket, which can result in contact pin defects or make automated insertion impossible.

[0007] Therefore, when the pitch is below a certain dimension (e.g., 0.8 mm), an automatic insertion device cannot be used, and the user has to insert the contact pins into the housing of the test socket one by one by hand, accepting some or a certain degree of collision, which is inconvenient. Summary of the Invention [Problem to be solved by the invention]

[0008] An object of the present invention is to provide a contact pin for a test socket, which can form multiple contact pins at a smaller pitch and can prevent interference or collision between the contact pins during automatic insertion of the multiple contact pins, and a test socket including the same.

[0009] The technical problems to be solved by the present invention are not limited to the above-mentioned technical problems, and other technical problems not mentioned will be clearly understood by those having ordinary skill in the art to which the present invention pertains from the following description. [Means for solving the problem]

[0010] In order to achieve the above-mentioned object, the present invention provides a contact pin for a test socket, which is provided in a test socket for testing the electrical characteristics of semiconductor devices, and includes: an elastic portion that is elastically deformable in the longitudinal direction of the contact pin; a first contact portion including a first support portion extending from one end of the elastic portion and a first contact tip connected to the end of the first support portion; and a second contact portion including a second support portion extending from the other end of the elastic portion and a second contact tip connected to the end of the second support portion, wherein the elastic portion and the second contact portion are bent in at least one direction relative to the first contact portion.

[0011] Here, the elastic portion and the second contact portion may be bent in a first direction perpendicular to the longitudinal direction and a second direction perpendicular to the first direction, respectively.

[0012] Furthermore, the first contact portion and the second contact portion may be located on different planes.

[0013] Also, the first contact tip and the second contact tip may be located on different lines.

[0014] The contact pin may also form a stopper for restraining the contact pin in the test socket.

[0015] The present invention also provides a test socket for testing the electrical characteristics of semiconductor devices, comprising: a housing having a plurality of first through holes formed therein; a cover having a plurality of second through holes formed therein; and a plurality of contact pins inserted into the first and second through holes, wherein the plurality of contact pins include an elastic portion elastically deformable in the longitudinal direction of the contact pin, a first support portion extending from one end of the elastic portion and a first contact tip connected to the end of the first support portion, and a first contact portion inserted into the plurality of first through holes; a second support portion extending from the other end of the elastic portion and a second contact tip connected to the end of the second support portion, and a second contact portion inserted into the plurality of second through holes, wherein the elastic portion and the second contact portion are bent in at least one direction relative to the first contact portion before the plurality of contact pins are inserted into the second through holes.

[0016] Here, the elastic portion and the second contact portion are bent in a first direction perpendicular to the longitudinal direction and a second direction perpendicular to the first direction, respectively, before the plurality of contact pins are inserted into the second through holes.

[0017] The first contact portion and the second contact portion may be located on the same plane.

[0018] Also, the first contact tip and the second contact tip may be collinear.

[0019] The contact pin may also form a stopper for restraining the contact pin in the test socket.

[0020] The first and second through holes may be formed in a diagonal line such that the first and second contact tips are positioned on the second direction axis.

[0021] In addition, the first contact portion may be inserted into the plurality of first through holes at a certain angle so that the first and second contact tips are positioned on the second direction axis.

[0022] The cover may also move the second contact portion in a first direction while the second contact portion is inserted into the second through hole, thereby positioning the first and second contact tips on the first direction axis. [Effects of the Invention]

[0023] According to the present invention, it is possible to form a plurality of contact pins at a smaller pitch, and there is an effect that interference or collision between the contact pins can be prevented when the plurality of contact pins are automatically inserted.

[0024] In addition, according to the present invention, since the upper and lower contact tips of the contact pins are located on different lines, multiple contact pins can be inserted more densely than if they were located on the same line, and the pitch between the contact pins can be further reduced.

[0025] The effects obtained by the present invention are not limited to those described above, and other effects not mentioned will be clearly understood by those having ordinary skill in the art to which the present invention pertains from the following description. [Brief explanation of the drawings]

[0026] [Figure 1] 1A and 1B are diagrams showing test sockets according to a first embodiment and a second embodiment of the present invention, which serve as reference examples for aiding understanding of the present invention.

[0027] [Figure 2] 1 is a perspective view of a contact pin according to a first embodiment, which serves as a reference example for aiding understanding of the present invention. FIG.

[0028] [Figure 3] 1 is a side view of a contact pin according to a first embodiment, which serves as a reference example for aiding understanding of the present invention. FIG.

[0029] [Figure 4] FIG. 3 is another side view of the contact pin according to the first embodiment, which serves as a reference example for aiding understanding of the present invention.

[0030] [Figure 5] 1 is a plan view of a contact pin according to a first embodiment, seen from above, which serves as a reference example for aiding understanding of the present invention.

[0031] [Figure 6] 1A and 1B are diagrams illustrating interference between contact pins when the contact pins according to the first embodiment, which serves as a reference example for aiding understanding of the present invention, are automatically inserted into a test socket. [Figure 7] 1A and 1B are diagrams illustrating interference between contact pins when the contact pins according to the first embodiment, which serves as a reference example for aiding understanding of the present invention, are automatically inserted into a test socket.

[0032] [Figure 8] FIG. 10 is a perspective view of a contact pin according to a second embodiment of the present invention.

[0033] [Figure 9] FIG. 10 is a side view of a contact pin according to a second embodiment of the present invention.

[0034] [Figure 10] FIG. 10 is another side view of the contact pin according to the second embodiment of the present invention.

[0035] [Figure 11] FIG. 10 is a plan view of a contact pin according to a second embodiment of the present invention, as viewed from above.

[0036] [Figure 12] FIG. 10 is a side cross-sectional view of a test socket according to a second embodiment of the present invention.

[0037] [Figure 13] FIG. 10 is another side view of the contact pin according to the second embodiment of the present invention, showing how the contact pin is inserted into the test socket.

[0038] [Figure 14] FIG. 10 is a plan view of a test socket into which contact pins are inserted according to a second embodiment of the present invention, as viewed from above.

[0039] [Figure 15] FIG. 10 is an overall perspective view of a test socket according to a third embodiment of the present invention.

[0040] [Figure 16] FIG. 10 is an exploded perspective view of a test socket according to a third embodiment of the present invention.

[0041] [Figure 17] FIG. 10 is a perspective view of a contact pin according to a third embodiment of the present invention.

[0042] [Figure 18] FIG. 10 is a side view of a contact pin according to a third embodiment of the present invention.

[0043] [Figure 19] FIG. 10 is another side view of the contact pin according to the third embodiment of the present invention.

[0044] [Figure 20] FIG. 10 is a plan view of a contact pin according to a third embodiment of the present invention, as viewed from above.

[0045] [Figure 21] FIG. 10 is a diagram showing a state before insertion of a contact pin according to a third embodiment of the present invention.

[0046] [Figure 22]FIG. 10 is a view showing a state in which a contact pin according to a third embodiment of the present invention is inserted into a housing.

[0047] [Figure 23] 10A to 10C are diagrams illustrating a method for assembling a test socket according to a third embodiment of the present invention. [Figure 24] 10A to 10C are diagrams illustrating a method for assembling a test socket according to a third embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0048] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Regardless of the drawing numbers, the same or similar components are designated by the same reference numerals, and redundant descriptions thereof will be omitted.

[0049] In the description of the present invention, if it is determined that a detailed description of related publicly known techniques may obscure the gist of the present invention, the detailed description will be omitted. It should be noted that the accompanying drawings are provided to facilitate understanding of the concept of the present invention, and should not be construed as limiting the concept of the present invention.

[0050] FIG. 1 is a diagram showing a test socket according to a first embodiment and a second embodiment of the present invention, which serve as reference examples for aiding understanding of the present invention.

[0051] Referring to FIG. 1, a test socket 10 according to a first embodiment and a second embodiment of the present invention, which are reference examples for aiding in understanding the present invention, may include a housing 11, a cover 12, and a plurality of contact pins 100, 200. Here, a plurality of through holes are formed in the housing 11 and the cover 12, and a plurality of contact pins 100, 200 are provided between the housing 11 and the cover 12.

[0052] A plurality of through holes are formed in a plurality of rows and columns in the housing 11 and the cover 12, and the lower ends of the plurality of contact pins 100, 200 are inserted upright into the through holes formed in the housing 11, and in this state the upper ends of the plurality of contact pins 100, 200 can be inserted into the through holes formed in the cover 12.

[0053] In electrical testing of semiconductor equipment (not shown) such as semiconductor integrated circuit devices such as packaged ICs and MCMs, and wafers on which integrated circuits are formed, the test socket 10 is placed between the semiconductor equipment and a test device to electrically connect the connection terminals (e.g., conductive balls) of the semiconductor equipment to be tested to the connection terminals (e.g., contact pads) of the test device.

[0054] The contact pins 100 and 200 electrically connect the connection terminals of the semiconductor device with the connection terminals of the test equipment, and perform electrical testing between the semiconductor device and the test equipment.

[0055] The contact pins 100 and 200 are processed (cut and bent) using a precision die-based press process, thereby improving price competitiveness and productivity.

[0056] The plurality of contact pins 100, 200 are assembled by being automatically inserted into the plurality of through holes 12 formed in the housing 11 by an automatic insertion device (not shown).

[0057] Figure 2 is an oblique view of a contact pin according to the first embodiment, which serves as a reference example to aid in understanding the present invention; Figure 3 is a side view of one side of a contact pin according to the first embodiment, which serves as a reference example to aid in understanding the present invention; Figure 4 is another side view of a contact pin according to the first embodiment, which serves as a reference example to aid in understanding the present invention; and Figure 5 is a plan view of a contact pin according to the first embodiment, which serves as a reference example to aid in understanding the present invention, viewed from above.

[0058] 2 to 5, the contact pin 100 may include a resilient portion 110, a first contact portion 130, and a second contact portion 120. As shown in FIG.

[0059] The elastic portion 110 is elastically deformable in the longitudinal direction (z direction) of the contact pin 100 and may be formed in a curved shape, but is not limited thereto.

[0060] The first contact portion 130 may include a first support portion 131 extending from one end of the elastic portion 110 and a first contact tip 132 connected to an end of the first support portion 131 .

[0061] The second contact portion 120 may include a second support portion 121 extending from the other end of the elastic portion 110 and a second contact tip 122 connected to an end of the second support portion 121 .

[0062] The elastic portion 110 and the second contact portion 120 are bent relative to the first contact portion 130 in a first direction (x direction) perpendicular to the longitudinal direction of the contact pin 100.

[0063] The elastic part 110 contracts in the longitudinal direction of the contact pin 100 when the second contact tip 122 is brought into contact with a conductive ball of a semiconductor device and is pressurized, and returns to its original state when the pressure is released.

[0064] When the first contact tip 132 contacts a contact pad of the test equipment and the second contact tip 122 contacts a conductive ball of the semiconductor device, the contact pin 100 forms an electrical signal path between the test equipment and the semiconductor device. This allows the test equipment to check the electrical characteristics of the semiconductor device.

[0065] Referring to FIG. 3, the elastic portion 110 may be located on the same plane (xz plane) as the first contact portion 130 and the second contact portion 120.

[0066] In addition, the first contact portion 130 and the second contact portion 120 may be formed in a linear shape and may be positioned on different lines.

[0067] The first support portion 131 or the second support portion 121 may have a stopper 140 formed on one or both of them for restraining the contact pin 100 in the housing 11 of the test socket 10 .

[0068] Here, the contact pin 100 can move up and down due to the elastic force of the elastic part 110, and at this time, the contact pin 100 can be restrained by the stopper 140 being caught in the through-hole of the housing 11.

[0069] 6 and 7 are diagrams for explaining interference between contact pins when the contact pins according to the first embodiment, which serve as a reference example for aiding understanding of the present invention, are automatically inserted into a test socket.

[0070] 6 and 7, the contact pin 100 is inserted into a through-hole formed in the housing 11 with the first contact tip 132 standing upright. At this time, the elastic portion 110 has a curved shape, and the first contact portion 130 and the second contact portion 120 have a straight shape, so when the contact pin 100 is inserted, the distance between the elastic portion 110 and the first contact portion 130 or the second contact portion 120 of the adjacent contact pin 100 that was inserted earlier becomes the narrowest. Therefore, there is a high possibility that this portion will collide or interfere when the contact pin 100 is inserted.

[0071] As shown in Figure 6, the contact pins 100 are bent in a first direction (x direction), so when inserting a contact pin 100, the spacing between multiple contact pins 100 must be greater than or equal to the first pitch P1 to prevent collision or interference with adjacent contact pins 100 that were inserted earlier.

[0072] That is, as shown in FIG. 7, if the spacing between multiple contact pins 100 is formed at a second pitch P2 that is smaller than the first pitch P1, when a contact pin 100 is inserted, it will collide with or interfere with an adjacent contact pin 100 that was inserted earlier, resulting in deformation of the contact pin 100 and making automatic insertion impossible.

[0073] FIG. 8 is an oblique view of a contact pin according to a second embodiment of the present invention, FIG. 9 is a side view of one side of the contact pin according to the second embodiment of the present invention, FIG. 10 is a side view of the other side of the contact pin according to the second embodiment of the present invention, and FIG. 11 is a plan view of the contact pin according to the second embodiment of the present invention viewed from above.

[0074] 8 to 11, the contact pin 200 may include an elastic portion 210, a first contact portion 230, and a second contact portion 220. As shown in FIG.

[0075] The elastic portion 210 is elastically deformable in the longitudinal direction (z direction) of the contact pin 200 and may be formed in a curved shape, but is not limited thereto.

[0076] The first contact portion 230 may include a first support portion 231 extending from one end of the elastic portion 210 and a first contact tip 232 connected to an end of the first support portion 231 .

[0077] Here, the first contact tip 232 can contact the contact pad of the test device, and its end can be formed in the shape of a needle. That is, the first contact tip 232 is the part that connects with the contact pad of the test device, and since the contact pad is generally planar, it can be formed so that the diameter decreases toward the end to ensure a strong connection and prevent separation.

[0078] The second contact portion 220 may include a second support portion 221 extending from the other end of the elastic portion 210 and a second contact tip 222 connected to an end of the second support portion 221 .

[0079] Here, the second contact tip 222 can be in contact with the conductive ball of the semiconductor device, and the end portion can be formed in a concave shape corresponding to the shape of the conductive ball of the semiconductor device. Therefore, the contact characteristics and stability with the conductive balls of the semiconductor device can be enhanced.

[0080] Unlike the contact pin 100 of the first embodiment, which is a reference example to aid in understanding the present invention, the elastic portion 210 and the second contact portion 220 can be bent in a first direction (x direction) relative to the first contact portion 230 (see Figure 9), and then bent again in a second direction (y direction) relative to the first contact portion 230 (see Figure 10). At this time, the elastic part 210 may be bent and twisted into a three-dimensional shape.

[0081] When the second contact tip 222 is brought into contact with a conductive ball of a semiconductor device and pressure is applied to the elastic part 210, the elastic part 210 contracts in the longitudinal direction of the contact pin 200, and when the pressure is released, the elastic part 210 can return to its original state.

[0082] When the first contact tip 232 contacts a contact pad of the test equipment and the second contact tip 222 contacts a conductive ball of the semiconductor device, the contact pin 200 forms an electrical signal path between the test equipment and the semiconductor device. This allows the test equipment to check the electrical characteristics of the semiconductor device.

[0083] Referring to FIG. 11, since the elastic portion 210 is bent in the first direction (x direction) and the second direction (y direction) of the contact pin 200, the elastic portion 210 may be positioned on a plane different from the first contact portion 230 and the second contact portion 220.

[0084] Also, referring to FIG. 11, the first contact portion 230 and the second contact portion 220 may be formed in a linear shape and may be positioned on different lines.

[0085] The first support portion 231 or the second support portion 221 may have a stopper 240 formed on one or both of them for restraining the contact pin 200 to the housing 11 of the test socket 10 .

[0086] Here, the contact pin 200 can move up and down by the elastic force of the elastic portion 210, and at this time, the contact pin 200 is restrained by the stopper 240 being caught in a through hole formed in the housing 11.

[0087] Figure 12 is a side cross-sectional view of a test socket according to a second embodiment of the present invention, Figure 13 is another side view of a contact pin according to the second embodiment of the present invention, showing how the contact pin is inserted into the test socket, and Figure 14 is a plan view of the test socket into which the contact pin according to the second embodiment of the present invention has been inserted, as viewed from above.

[0088] 12 to 14, the contact pins 200 are inserted into the through holes formed in the housing 11 with their first contact tips 232 extending upright. At this time, the elastic portion 210 has a curved shape, and the first contact portion 230 and the second contact portion 220 have a straight shape, so when the contact pin 200 is inserted, the distance between the elastic portion 210 and the first contact portion 230 or the second contact portion 220 of the adjacent contact pin 200 that is inserted first becomes the narrowest. Therefore, there is a high possibility that this portion will collide or interfere when the contact pin 200 is inserted.

[0089] The elastic portion 210 and the second contact portion 220 are bent in a first direction (x direction) and a second direction (y direction) relative to the first contact portion 230, so that when the contact pin 200 is inserted into the area bent in the second direction (y direction) of the adjacent contact pin 200, sufficient insertion space can be secured compared to the contact pin 100 of the first embodiment.

[0090] That is, the elastic portion 210 of the adjacent contact pin 200 inserted first is bent in the second direction (y direction), so that when another contact pin 200 is inserted into that area, even if the spacing between the contact pins 200 is formed at a third pitch P3 that is smaller than the first pitch P1 and the second pitch P2, impact or interference with the adjacent contact pin 200 inserted first can be prevented.

[0091] Therefore, the test socket according to the second embodiment of the present invention can form the plurality of contact pins 200 at a smaller pitch, and can prevent interference or collision between the contact pins 200 during automatic insertion of the plurality of contact pins 200.

[0092] In addition, since the first contact tip 232 and the second contact tip 222 are positioned on different lines, multiple contact pins 200 can be inserted more densely than if they were positioned on the same line, and the pitch between the contact pins 200 can be further reduced.

[0093] FIG. 15 is an overall perspective view of a test socket according to a third embodiment of the present invention, and FIG. 16 is an exploded perspective view of the test socket according to the third embodiment of the present invention.

[0094] 15 and 16, a test socket 30 according to a third embodiment of the present invention may include a housing 31, a cover 32, a fixing bar 33, and a plurality of contact pins 300. Here, the housing 31 has a plurality of first through holes 31 a formed therein, the cover 32 has a plurality of second through holes 32 a formed therein, and the plurality of contact pins 300 are provided between the housing 31 and the cover 32 .

[0095] The plurality of first through holes 31a may be formed in the housing 31 in a plurality of rows and columns, and the plurality of second through holes 32a may be formed in the cover 12 in a plurality of rows and columns.

[0096] The lower ends of the multiple contact pins 300 are inserted upright into first through holes 31a formed in the housing 31, and in this state, the upper ends of the multiple contact pins 300 can be inserted into second through holes 32a formed in the cover 32.

[0097] In electrical testing of semiconductor equipment (not shown) such as semiconductor integrated circuit devices such as packaged ICs and MCMs, and wafers on which integrated circuits are formed, the test socket 30 is placed between the semiconductor equipment and a test device to electrically connect the connection terminals (e.g., conductive balls) of the semiconductor equipment to be tested and the connection terminals (e.g., contact pads) of the test device to each other.

[0098] The contact pins 300 electrically connect the connection terminals of the semiconductor device to the connection terminals of the test equipment, and perform electrical testing between the semiconductor device and the test equipment.

[0099] The contact pin 300 is processed (cut and bent) using a precision die-based press process, thereby improving price competitiveness and productivity.

[0100] The plurality of contact pins 300 are assembled by being automatically inserted into the plurality of first through holes 31a formed in the housing 31 by an automatic insertion device (not shown).

[0101] When the assembly of the plurality of contact pins 300 between the housing 31 and the cover 32 is completed, the fixing bar 33 can fix the housing 31 and the cover 32 so that they do not separate.

[0102] FIG. 17 is an oblique view of a contact pin according to a third embodiment of the present invention, FIG. 18 is a side view of one side of the contact pin according to the third embodiment of the present invention, FIG. 19 is a side view of the other side of the contact pin according to the third embodiment of the present invention, and FIG. 20 is a plan view of the contact pin according to the third embodiment of the present invention viewed from above.

[0103] 17 to 20, the contact pin 300 may include an elastic portion 310, a first contact portion 330, and a second contact portion 320. As shown in FIG.

[0104] The elastic portion 310 is elastically deformable in the longitudinal direction (z direction) of the contact pin 300 and may be formed in a curved shape, but is not limited thereto.

[0105] The first contact portion 330 may include a first support portion 331 extending from one end of the elastic portion 310 and a first contact tip 332 connected to an end of the first support portion 331. Here, the first contact tip 332 may contact a contact pad of a test device.

[0106] The second contact portion 320 may include a second support portion 321 extending from the other end of the elastic portion 310 and a second contact tip 322 connected to an end of the second support portion 321 . Here, the second contact tip 322 can contact the conductive ball of the semiconductor device.

[0107] The elastic part 310 contracts in the longitudinal direction of the contact pin 300 when the second contact tip 322 is in contact with a conductive ball of a semiconductor device and is pressed, and returns to its original state when the pressure is released.

[0108] Unlike the contact pin 100 of the first embodiment, the elastic portion 310 and the second contact portion 320 can be bent in a first direction (x direction) relative to the first contact portion 330 (see FIG. 19) and then bent again in a second direction (y direction) relative to the first contact portion 330 (see FIG. 18). At this time, the elastic portion 310 may be bent and twisted into a three-dimensional shape.

[0109] When the first contact tip 332 contacts a contact pad of the test equipment and the second contact tip 322 contacts a conductive ball of the semiconductor device, the contact pin 300 forms an electrical signal path between the test equipment and the semiconductor device. This allows the test equipment to check the electrical characteristics of the semiconductor device.

[0110] 18 to 20, since the elastic portion 310 is bent in the first direction (x direction) and the second direction (y direction) of the contact pin 300, the elastic portion 310 may be positioned on a plane different from the first contact portion 330 and the second contact portion 320.

[0111] In addition, the first contact portion 330 and the second contact portion 320 may be formed in a linear shape and may be positioned on different lines.

[0112] As a result, the contact pin 300 may have an offset Ox in the first direction (x direction) and an offset Oy in the second direction (y direction) between the first contact tip 332 and the second contact tip 322.

[0113] One or both of the first support portion 331 and the second support portion 321 may form a first stopper 340 and a second stopper 350 for restraining the contact pin 300 to the housing 31 and the cover 32 of the test socket 30 .

[0114] Here, the contact pin 300 can move up and down due to the elastic force of the elastic portion 310, and at this time, the contact pin 300 is restrained by the first and second stoppers 340, 350 being caught in the first and second through holes 31a, 32a.

[0115] FIG. 21 is a diagram showing a state before a contact pin according to a third embodiment of the present invention is inserted, and FIG. 22 is a diagram showing a state after the contact pin according to the third embodiment of the present invention is inserted into a housing.

[0116] 21 and 22, the contact pins 300 are inserted into the first through holes 31a formed in the housing 11 with their first contact tips 332 extending upright.

[0117] Specifically, the contact pins 300 are inserted into the first through holes 31a at a certain angle so that the first contact tip 332 and the second contact tip 322 are positioned on the second direction (y direction) axis. For example, when the first direction (x direction) offset Ox and the second direction (y direction) offset Oy between the first contact tip 332 and the second contact tip 322 are the same, the multiple contact pins 300 are inserted into the multiple first through holes 31a at an angle of 45 degrees.

[0118] Here, the plurality of first through holes 31a and second through holes 32a are formed in an oblique line shape so that the first contact tip 332 and the second contact tip 322 are positioned on the second direction (y direction) axis. For example, when the first direction (x direction) offset Ox and the second direction (y direction) offset Oy between the first contact tip 332 and the second contact tip 322 are the same, the multiple first through holes 31a and second through holes 32a can be formed in an oblique line shape inclined at an angle of 45 degrees.

[0119] This makes it possible to remove the offset Oy in the second direction (y direction) between the first contact tip 332 and the second contact tip 322.

[0120] At this time, since the elastic portion 310 has a curved shape and the first contact portion 330 and the second contact portion 320 have a straight shape, when the contact pin 300 is inserted, the distance between the elastic portion 310 and the first contact portion 330 or the second contact portion 320 of the adjacent contact pin 300 that was inserted first becomes the narrowest. Therefore, there is a high possibility that this portion will collide or interfere when the contact pin 300 is inserted.

[0121] The elastic portion 310 and the first contact portion 330 are bent in a first direction (x direction) and a second direction (y direction) relative to the second contact portion 320, and the multiple contact pins 300 are inserted into the multiple first through holes 31a at a certain angle so that the first contact tip 332 and the second contact tip 322 are positioned on the second direction (y direction) axis, thereby ensuring more sufficient insertion space than the contact pin 200 of the second embodiment.

[0122] This makes it possible to prevent impact or interference with adjacent contact pins 300 that have been inserted earlier, even if the interval between the contact pins 300 is formed at a pitch smaller than the third pitch P3.

[0123] Therefore, the test socket 30 according to the third embodiment of the present invention can form the contact pins 300 at a smaller pitch than that of the second embodiment, thereby preventing interference or collision between the contact pins 300 during automatic insertion of the contact pins 300.

[0124] Furthermore, since the first contact tip 332 and the second contact tip 322 are positioned on different lines, the plurality of contact pins 300 can be inserted more densely than if they were positioned on the same line.

[0125] 23 and 24 are diagrams for explaining a method of assembling a test socket according to the third embodiment of the present invention.

[0126] Referring to FIG. 23, with the first contact portions 330 of the plurality of contact pins 300 inserted into the first through holes 31a, the second contact portions 320 are inserted into the plurality of second through holes 32a formed in the cover 32. At this time, there is an offset Ox in the first direction (x direction) between the first contact tip 332 and the second contact tip 322.

[0127] Then, the cover 32 moves the second contact portion 320 in the first direction (x direction) while the second contact portion 320 is inserted into the second through hole 32a, thereby positioning the first contact tip 332 and the second contact tip 322 on the first direction (x direction) axis.

[0128] At this time, even if the second contact portion 320 is moved in the first direction (x direction), no interference or collision occurs between the contact pins 300.

[0129] This makes it possible to remove the offset Ox in the first direction (x direction) between the first contact tip 332 and the second contact tip 322. That is, the first contact tip 332 and the second contact tip 322 are positioned on the same line, which allows the pitch between the contact pins 300 to be further reduced.

[0130] When the assembly of the plurality of contact pins 300 between the housing 31 and the cover 32 is completed, the fixing bar 33 fixes the housing 31 and the cover 32 so that they do not separate.

[0131] The embodiments described in this specification and the accompanying drawings are merely illustrative of some of the technical ideas included in the present invention. Therefore, it is obvious that the embodiments disclosed in this specification are intended to explain rather than limit the technical idea of ​​the present invention, and therefore such embodiments do not limit the scope of the technical idea of ​​the present invention. All modifications and specific embodiments that can be easily inferred by a person of ordinary skill in the art within the scope of the technical ideas contained in the specification and drawings of the present invention should be construed as being included within the scope of the rights of the present invention. [Explanation of symbols]

[0132] 10: Test socket 110: Elastic part 120:Second contact part 130: 1st contact part

Claims

1. A test socket for testing the electrical characteristics of semiconductor devices, The device includes a housing having a plurality of first through holes formed therein, a cover having a plurality of second through holes formed therein, and a plurality of contact pins inserted into the plurality of first through holes and the second through holes, the plurality of contact pins include: an elastic portion that is elastically deformable in a longitudinal direction by bending the contact pin; a first contact portion that includes a first support portion extending from one end of the elastic portion and a first contact tip connected to an end of the first support portion and is inserted into the plurality of first through holes; and a second contact portion that includes a second support portion extending from the other end of the elastic portion and a second contact tip connected to an end of the second support portion and is inserted into the plurality of second through holes, A test socket, wherein the elastic portion is divided into a first portion that contacts the first contact portion and a second portion that contacts the second contact portion, and before the plurality of contact pins are inserted into the second through hole, the first portion is configured to bend in a first direction perpendicular to the longitudinal direction of the contact pins, and the second portion is configured to bend in a third direction between the first direction and a second direction perpendicular to both the longitudinal direction of the contact pins and the first direction.

2. 2. The test socket according to claim 1, wherein stoppers are formed on the contact pins to restrain the contact pins in the test socket.

3. The test socket of claim 1 , wherein the first and second through holes are spaced apart from one another.

4. 2. The test socket of claim 1, wherein the cover is configured to move the second contact portion in the first direction when the second contact portion is inserted into the second through hole to position the first contact tip and the second contact tip on the first directional axis.

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