Film forming device

Abstract

To provide a film deposition apparatus capable of reducing a time necessary for exchanging a target.SOLUTION: A film deposition apparatus 1 according to an embodiment has: a chamber 2 of which internal space can be evacuated; a target 5a that faces the internal space of the chamber 2 through an opening 23 arranged in the chamber 2, is detachably arranged in the chamber 2, and is formed with a film deposition material that deposits on a work W by sputtering; a sealing body 32 for sealing the opening 23; and a transportation body 3 that switches a status of positioning the work W and a status of positioning the sealing body 32 at a position facing the target 5a while the internal space of the chamber 2 is kept vacuum.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a film forming apparatus. [Background technology]

[0002] Sputtering deposition equipment is widely used to deposit films on the surfaces of workpieces such as substrates. Sputtering is a technology that uses plasma generation of ions by converting gas introduced into a vacuum chamber into plasma, and the generated ions collide with the surface of a target, which is the film-forming material, causing the film-forming material to fly and adhere to the workpiece.

[0003] When sputtering is continued to form a film, the target is consumed, and therefore it is necessary to replace the target periodically. Furthermore, this consumption of the target may occur partially on the target surface, and such partial consumption (called erosion) requires replacement even if usable portions remain. Furthermore, partial consumption causes unevenness on the target surface. For uniform film formation, a flat target surface is preferable, so a target that has been used for a long period of time must be replaced even before all usable portions of the target are consumed. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 9-031642 DISCLOSURE OF THE INVENTION [Problem to be solved by the invention]

[0005] However, target replacement takes a long time. For example, it takes one hour to release the evacuated chamber to the atmosphere, 20 to 30 minutes to replace the target, and two to three hours to evacuate the chamber again after venting it to the atmosphere. In particular, evacuating the chamber after venting it to the atmosphere requires removing moisture from the chamber, which takes a long time. This means that target replacement, including preparation, takes at least four to five hours. Such long replacement times result in reduced productivity.

[0006] Furthermore, in the case of magnetron sputtering deposition equipment, which applies a magnetic field by placing a magnet behind the target, it is necessary to minimize the distance from the target surface to the magnet to reduce the impact of erosion on the deposition. This makes it difficult to make the target thicker in order to reduce replacement frequency. In particular, in the case of targets made of magnetic materials, the thickness can only be made 5 to 6 mm, so replacement frequency is about once every 8 hours. If replacement takes 4 to 5 hours after 8 hours of use, productivity will be further reduced.

[0007] The present invention has been proposed to solve the above-mentioned problems of the prior art, and its object is to provide a film forming apparatus that can reduce the time required for target replacement. [Means for solving the problem]

[0008] In order to achieve the above object, a film forming apparatus according to an embodiment includes a chamber capable of evacuating the interior thereof, a target formed by sputtering a film forming material and facing the interior of the chamber through an opening provided in a ceiling surface of the chamber and detachably provided in the chamber, and a sealed body on which the work is mounted; During maintenance, the vacuum chamber is positioned opposite the target to maintain the vacuum in the chamber. sealing the opening; Not used for sputtering Do not load the workpiece For maintenance an encapsulating body, an encapsulating body on which the workpiece is mounted, and an encapsulating body on which the workpiece is not mounted For maintenanceA state in which the sealing body is held and the vacuum in the chamber is maintained, and the sealing body with the workpiece mounted thereon is positioned at a position facing the target, and a state in which the sealing body with the workpiece not mounted thereon is positioned at a position facing the target, and a state in which the sealing body is held and the vacuum in the chamber is maintained, and a state in which the sealing body with the workpiece mounted thereon is positioned at a position facing the target, and a state in which the sealing body with the workpiece not mounted thereon is positioned at a position facing the target. For maintenance and a carrier that switches the state in which the sealing body is positioned. [Effects of the Invention]

[0009] According to the embodiment of the present invention, the time required for replacing the target can be reduced. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a simplified plan view illustrating an embodiment. [Figure 2] FIG. 2 is a cross-sectional view taken along line AA in FIG. [Figure 3] FIG. 2 is a plan view showing a conveying body and a sealing body according to the embodiment. [Figure 4] 2A is a cross-sectional view taken along the line BB in FIG. 1, showing a state in which a target is attached (A) and a state in which the target is removed (B). [Figure 5] FIG. 2 is a cross-sectional view taken along line AA showing a state in which the load lock chamber is sealed. [Figure 6] FIG. 2 is a cross-sectional view taken along line AA showing a state in which the vacuum in the load lock chamber has been broken. [Figure 7] FIG. 2 is a cross-sectional view taken along line AA showing the state in which the opening is opened. [Figure 8] 2 is a cross-sectional view taken along line AA showing a state in which a workpiece is positioned in the opening. FIG. [Figure 9] 10 is a cross-sectional view taken along line AA showing a state in which a workpiece is carried in through the opening and the load lock chamber is sealed with a holder. [Figure 10] FIG. 2 is a cross-sectional view taken along line AA showing a state in which the load lock chamber is evacuated. [Figure 11] FIG. 2 is a cross-sectional view taken along line AA showing a state in which the sealing body has been lowered. [Figure 12] FIG. 2 is a cross-sectional view taken along line AA showing a state in which a workpiece is carried into a film-forming chamber. [Figure 13]FIG. 2 is a cross-sectional view taken along line AA showing a state in which the transport plate is raised and rotated. [Figure 14] FIG. 2 is a cross-sectional view taken along line AA showing film formation by sputtering in a film formation chamber. [Figure 15] 10 is a cross-sectional view taken along the line AA showing a state in which a sealing body for maintenance has been transported to a position facing the opening. FIG. [Figure 16] FIG. 2 is a cross-sectional view taken along the line AA showing a state in which the periphery of the target is sealed with a sealing body. [Figure 17] FIG. 2 is a cross-sectional view taken along the line AA showing a state in which the vacuum in the shielded space has been broken. [Figure 18] 10 is a cross-sectional view taken along line AA showing a state in which the lid has been moved to open the opening. FIG. [Figure 19] FIG. 2 is a partial cross-sectional side view showing a target replacement device. [Figure 20] FIG. 10 is a partial cross-sectional side view showing a state in which the target is lifted by the target replacement device. [Figure 21] FIG. 10 is a partial cross-sectional side view showing an exchange device equipped with a spare vacuum chamber. [Figure 22] 10A is a plan view showing a modified example in which the number of sealing bodies in the chamber is eight, and FIG. 10B is a plan view showing a modified example in which the number of sealing bodies is six. [Figure 23] FIG. 1A is a side view showing a modified example in which the lid body is conical or triangular prism-shaped; FIG. 1B is a plan view showing a modified example in which the lid body is conical and has two targets; and FIG. 1C is a plan view showing a modified example in which the lid body is triangular prism-shaped and has two targets. [Figure 24] FIG. 1A is a plan view showing a modified example in which the lid body is conical and has three targets; FIG. 1B is a plan view showing a modified example in which the lid body is four targets; FIG. 1C is a plan view showing a modified example in which the lid body is square pyramidal and has four targets; and FIG. 1D is a plan view showing a modified example in which the lid body is triangular pyramidal and has three targets. [Figure 25] A longitudinal cross-sectional view (A) showing a modified example in which the target is arranged horizontally, a plan view (B) showing a lid body in a rectangular parallelepiped shape, a plan view (C) showing a lid body in a cylindrical shape, a longitudinal cross-sectional view (D) showing a modified example in which two targets are arranged horizontally, a plan view (E) showing a lid body in a rectangular parallelepiped shape, and a plan view (F) showing a lid body in a cylindrical shape. [Figure 26] A modified example in which three targets are arranged horizontally, where the lid body is rectangular parallelepiped-shaped (A), a modified example in which three targets are arranged horizontally, where the lid body is cylindrical (B), a modified example in which four targets are arranged horizontally, where the lid body is rectangular parallelepiped-shaped (C), and a modified example in which the lid body is cylindrical (D). [Figure 27] FIG. 10 is a side view showing a modified example of the exchange device. [Figure 28] FIG. 10 is a side view showing a modified example of the exchange device. [Figure 29] 10A is a plan view showing a modified example of the auxiliary vacuum chamber, and FIG. 10B is a plan view showing an example in which the horizontal arm is an indirectly attached robot arm. [Figure 30] FIG. 2 is a cross-sectional view taken along the line AA showing an example of sealing the periphery of a target during film formation. DETAILED DESCRIPTION OF THE INVENTION

[0011] An embodiment of the present invention (hereinafter referred to as the present embodiment) will be specifically described with reference to the drawings. In the drawings, the finest hatching indicates a vacuum state. Note that, for ease of understanding, some cross-sectional lines are omitted in some of the drawings. [overview] As shown in the plan view of FIG. 1 and FIG. 2 (cross-sectional view along line AA in FIG. 1), the film forming apparatus 1 of this embodiment is an apparatus that forms a film on each workpiece W using plasma. The film forming apparatus 1 has a chamber 2 that can be evacuated to a vacuum. Inside this chamber 2, as shown in the plan views of FIGS. 3(A) and 3(B), a transfer body 3 is arranged. The transfer body 3 transfers sealing bodies 31 and 32. A transfer plate 36 is mounted on the sealing body 31, and a susceptor S carrying a workpiece W is mounted on the transfer plate 36. The sealing body 32 is a member for maintenance use on which the workpiece W is not mounted.

[0012] The film forming apparatus 1 has a loading / unloading section 4 and a film forming section 5. The loading / unloading section 4 enables loading and unloading of the susceptor S while maintaining a vacuum inside the chamber 2. The film forming section 5 has a target 5a, as shown in FIG. 4 (a cross-sectional view taken along line BB in FIG. 1). In the film forming section 5, a film is formed by sputtering on a workpiece W facing the target 5a.

[0013] [Work] As shown in FIG. 1 , in this embodiment, a flat ceramic substrate is used as an example of the workpiece W on which a film is to be formed. The film formation apparatus 1 forms a circuit including semiconductors and wiring on the ceramic substrate by film formation. However, the type, shape, and material of the workpiece W are not limited to a specific one. Furthermore, the configuration and use of the film to be formed are also not limited to a specific one. For example, the workpiece W may be a curved substrate having a concave or convex portion in its center. Furthermore, the workpiece W may contain a conductive material such as metal or carbon, an insulator such as glass or rubber, or a semiconductor such as silicon. The film to be formed may also be a film used for various purposes, such as decoration or protection, an optical film for anti-reflection purposes, or a film for recording information.

[0014] [Susceptor] The susceptor S is a member that carries a workpiece W and is transported by the transport body 3 together with a transport plate 36, which will be described later. The susceptor S in this embodiment is a circular thin plate. The surface of the susceptor S is provided with recesses that allow multiple workpieces W to be mounted without overlapping. The number of workpieces W mounted on the susceptor S is the number of workpieces W that can be simultaneously deposited in the film deposition section 5. Therefore, the susceptor S is a member that can be changed according to the type of workpiece W, which differs in size, shape, etc. The number of workpieces W that can be mounted on the susceptor S is not limited to a specific number. In this embodiment, the workpieces W are mounted in a 3-row, 3-column arrangement, allowing a total of nine workpieces W to be simultaneously deposited.

[0015] The transport plate 36 is a circular plate on which a susceptor S, which is replaced depending on the type of workpiece W, is fixedly mounted. The transport plate 36 is a component that does not change depending on the type of workpiece W. The transport plate 36 is provided with a holding member (not shown) that is held by a holding mechanism 42a of the load / unload section 4, which will be described later, when the transport plate 36 is loaded into or unloaded from the chamber 2. The transport plate 36 with the susceptor S loaded thereon is held by the holding member by the holding mechanism 42a.

[0016] Furthermore, the susceptor S is adjusted so that the distance from the upper surface of the carrier 3 (described later) becomes a predetermined value depending on the workpiece W, and is fixed to the carrier plate 36. This allows the height position of the workpiece W to be kept constant when it is moved up and down by pushers 61 and 62 (described later).

[0017] A ring-shaped connecting leg 36a is provided on the bottom of the transport plate 36. Connecting portions 612a and 622a of pushers 61 and 62, which will be described later, are connected to this connecting leg 36a. A plurality of legs 36b are also provided on the bottom of the transport plate 36. These legs 36b allow the transport plate 36 to be placed on the sealing body 31, which will be described later. If the transport plate 36 were placed on the sealing body 31 with a relatively wide surface contact, there is a possibility that the plate would stick to the sealing body 31 and become unable to peel off when moving in a direction perpendicular to the surface. However, the legs 36b allow the plate 36 to be placed on the sealing body 31 with a relatively narrow surface, in other words, with point-like contact to form a gap, thereby preventing the plate 36 from becoming unable to peel off.

[0018] The bottom of the connecting leg 36a protrudes so that the difference in height between the bottom surface of the transport plate 36 and the bottom of the leg 36b is equal to the thickness of the bottom plate of the sealing body 31, thereby minimizing the stroke of the pushers 61, 62. If the bottom surface of the transport plate 36 were moved directly by the pushers 61, 62 without using the connecting leg 36a, the movement stroke of the pushers 61, 62 would need to be secured to cover the difference in height and the thickness of the bottom plate, which would increase the size of the pushers 61, 62. Furthermore, this would require more time for movement, which could result in reduced productivity.

[0019] As described above, the susceptor S is fixed to the transport plate 36 and is integrated with it, and the workpiece W is mounted on the susceptor S. In this embodiment, the workpiece W always moves together with the susceptor S and the transport plate 36. Therefore, hereinafter, even when it is described that the workpiece W, the susceptor S, and the transport plate 36 are respectively loaded, unloaded, transported, held, released, etc., it means that the workpiece W, the susceptor S, and the transport plate 36 are moving together.

[0020] [Chamber] 1 and 2, the chamber 2 is a rectangular parallelepiped container, and its installation surface side is supported by a box-shaped container 21. Openings 22 and 23 are provided on the top surface of the chamber 2 opposite the installation surface. The opening 22 is a hole that allows the loading / unloading unit 4 to load and unload the susceptor S into and from the chamber 2. The opening 23 is a hole that allows the film formation material from the target 5a to pass through and reach the inside of the chamber 2, and constitutes the film formation unit 5.

[0021] Furthermore, an air vent 24 is provided at the bottom of the film forming section 5 in the chamber 2 for exhausting the interior of the chamber 2 and opening it to the atmosphere. The air vent 24 functions as an exhaust port that exhausts the interior of the chamber 2 to create a vacuum, and as a vent port that opens the chamber 2 to the atmosphere to break the vacuum. A pipe 25 is connected to the air vent 24, and a pneumatic circuit including a pressure reducing pump, valves, etc. (not shown) enables switching between vacuuming and breaking the vacuum in the chamber 2.

[0022] [Transport body] The transfer body 3 switches between a state in which the workpiece W is positioned opposite the target 5a and a state in which the sealant 32 is positioned, while maintaining the vacuum inside the chamber 2. As shown in FIG. 3, it is a circular plate-like body. The transfer body 3 is rotated intermittently about a shaft 34 by a motor 33, which is a drive source provided outside the chamber 2. In this embodiment, the transfer body 3 is a rotary table that intermittently rotates at a predetermined angle in accordance with the operation pattern when performing sputtering operation with the workpiece W positioned opposite the target 5a, and when performing maintenance with the sealant 32 positioned opposite the target 5a.

[0023] The carrier 3 is provided with support holes 35. The support holes 35 are circular holes provided at four locations at equal intervals around the circumference of the carrier 3 (see FIG. 2). A recess is formed around the inner edge of the support hole 35, forming a stepped hole. Plugs 31 and 32 are alternately mounted in the four support holes 35. That is, the bottoms of the plugs 31 and 32 fit into the recesses (stepped portions) on the inner edges of the support holes 35, so that the plugs 31 and 32 are arranged as shown in FIG. 3.

[0024] The seals 31 and 32 are cylindrical members with a bottom. The seals 31 and 32 seal the openings 22 and 23. The seal 31 is used when a workpiece W is mounted and a sputtering process is performed. The seal 32 is used for maintenance, including replacement of the target 5a.

[0025] The seal 31 has an opening 31a in the center of its bottom, and a sealing member 31b such as an O-ring is provided on its upper edge (see FIG. 2). The seal 31 is provided so as to be able to approach and separate from the inner wall of the chamber 2 around the openings 22 and 23 via the sealing member 31b. A transport plate 36, to which a susceptor S with a workpiece W placed thereon is fixed, is placed inside the seal 31. Within the chamber 2, the transport plate 36 is positioned by the transport body 3 to face the opening 22, and is moved by the drive unit 6 together with the seal 31 in a direction toward and away from the opening 22 (see FIG. 6). Furthermore, the transport plate 36 is positioned to face the opening 23, and is moved by the drive unit 6 in a direction toward and away from the opening 23, independently of the seal 31 (see FIG. 13).

[0026] When the sealer 32 is positioned by the transfer body 3 at a position facing the opening 23 within the chamber 2, it closes the opening 23, thereby moving between a sealing position (see FIGS. 4(B) and 19 to 21) where it forms a shielded space SA that is shielded from the inside of the chamber 2, and an open position (see FIG. 4(A)) where it opens the periphery of the target 5a. As shown in FIG. 2, the sealer 32 is driven by a drive unit 6. Furthermore, the chamber 2 is provided with an air passage 2a for exhausting the inside of the shielded space SA and opening it to the atmosphere. The shielded space SA can be opened to the atmosphere while maintaining the vacuum within the chamber 2, allowing the target 5a to be replaced.

[0027] The bottom of the sealing body 32 is closed, and a sealing member 32a such as an O-ring is provided on the upper edge. The sealing body 32 is provided via the sealing member 32a so as to be able to approach and separate from the inner wall of the chamber 2 around the opening 23 (see FIGS. 4(A) and 4(B)). Nothing is placed inside the sealing body 32. Within the chamber 2, the sealing body 32 is positioned opposite the opening 22 by the transfer body 3, and is moved by the driving unit 6 in a direction toward and away from the opening 22. Furthermore, the sealing body 32 is positioned opposite the opening 23 and is moved by the driving unit 6 in a direction toward and away from the opening 23.

[0028] The transport body 3, which is arranged to be capable of intermittent rotation, holds the sealing body 31 and sealing body 32 transporting the workpiece W at positions that are out of phase with each other during the rotation of the transport body 3, and switches between a state in which the workpiece W (sealing body 31) is positioned opposite the target 5a and a state in which the sealing body 32 is positioned by intermittent rotation.

[0029] In this embodiment, as shown in FIG. 3 , the two seals 31 are arranged symmetrically with respect to the center of rotation of the transfer body 3. Similarly, the two seals 32 are also arranged symmetrically with respect to the center of rotation of the transfer body 3. As described above, the seal 31 is used for sputtering, and for this purpose, it is positioned alternately at the openings 22 and 23 by intermittent rotation of 180°. The seal 32 is used for maintenance, and for this purpose, it is positioned at the openings 22 and 23. As shown in FIG. 3 , because the seals 31 and 32 are arranged alternately, by rotating the transfer body 3 by 90°, it is possible to switch between two states: a state in which the two seals 31 are positioned at positions facing the openings 22 and 23, and a state in which the two seals 32 are positioned. In other words, in this embodiment, the positions of the seals 31 (workpieces W) and the seals 32 are out of phase with each other by 90° in the rotation of the transfer body 3. During sputtering operation, the two seals 31 are switched between opening 22 and opening 23 by rotating 180°. That is, they are swapped between the sputtering operation and the load lock chamber. Switching between seals 31 and 32 is also performed during maintenance, and at this time, the seal positioned opposite opening 23 can be switched from seal 31 to seal 32 by rotating the transfer body 3 90° from the state during sputtering operation.

[0030] [Drive unit] 2, the driving unit 6 has a pusher 61 and a pusher 62. The pusher 61 is provided corresponding to the carry-in / carry-out unit 4, and is used to move the sealed body 31 between the transport plate 36 and the drive unit 6. and The pusher 62 is a drive mechanism that moves the transport plate 36 of the encapsulant 31 in a direction toward and away from the opening 22. The pusher 62 is provided corresponding to the film forming unit 5 and is a drive mechanism that moves the transport plate 36 of the encapsulant 31 in a direction toward and away from the opening 23, independently of the encapsulant 31.

[0031] The pusher 61 has a body 611, a shaft 612, and a drive source 613. The body 611 is a cylindrical body airtightly connected to the bottom of the chamber 2. The shaft 612 is provided so as to be able to reciprocate in the axial direction within the body 611. The shaft 612 airtightly passes through the connection portion between the body 611 and the chamber 2.

[0032] A connecting portion 612a and a sealing plate 612b are provided at the tip of the shaft 612 inside the chamber 2. When the shaft 612 moves toward the opening 22, the connecting portion 612a connects to the connecting leg 36a of the transport plate 36 and moves the transport plate 36 closer to the opening 22. A sealing member such as an O-ring is provided on the upper surface of the sealing plate 612b, and when the shaft 612 moves toward the opening 22, the opening 31a of the seal 31 is sealed and the sealing member 31b of the seal 31 is pressed against the ceiling of the chamber 2 around the opening 22 to seal the opening 22.

[0033] The driving source 613 is provided at the end of the body 611 opposite to the chamber 2, and is connected to the shaft 612. The driving source 613 is, for example, an air cylinder that reciprocates the shaft 612 in the axial direction.

[0034] The pusher 62 has a body 621, a shaft 622, and a drive source 623. The body 621 is a cylindrical body airtightly connected to the bottom of the chamber 2. The shaft 622 is provided so as to be able to reciprocate in the axial direction within the body 621. The shaft 622 airtightly passes through the connection portion between the body 621 and the chamber 2.

[0035] A connection part 622a is provided at the tip of the shaft 622 inside the chamber 2. When the shaft 622 moves toward the opening 23, the connection part 622a is connected to the connection leg 36a of the transport plate 36, and the transport plate 36 moves closer to the opening 23.

[0036] The drive source 623 is provided at the end of the body 621 opposite the chamber 2 and is connected to the shaft 622. The drive source 623 is provided at the bottom of the body 621 and includes an air cylinder 623b that reciprocates the shaft 622 in the axial direction and a motor 623a that rotates the shaft 622 about its axis. The air cylinder 623b allows the workpiece W placed on the susceptor S on the transport plate 36 to approach the target 5a, and by rotating the shaft 622, the workpiece W can be rotated together with the transport plate 36. By rotating the workpiece W during film formation, uniform film formation can be performed on multiple workpieces W regardless of the position of the workpiece W on the susceptor S. This is because the distance and angle between each workpiece W and the target 5a are averaged by the rotation.

[0037] [Loading and unloading section] As shown in Figures 1 and 2, the loading / unloading section 4 loads an unprocessed workpiece W from the outside into the chamber 2 through the opening 22 while maintaining a vacuum inside the chamber 2, and unloads a processed workpiece W out of the chamber 2.

[0038] The loading / unloading unit 4 picks up an unprocessed workpiece W from a transport mechanism TR, such as a conveyor, that transports a susceptor S carrying the workpiece W from a previous process to a subsequent process, and loads it into the chamber 2. The loading / unloading unit 4 also receives a workpiece W that has been processed in the chamber 2 and passes it to the transport mechanism TR. The susceptor S is fixed to a transport plate 36. Therefore, as described above, loading and unloading the workpiece W involves loading and unloading the susceptor S and the transport plate 36.

[0039] The loading / unloading unit 4 has an arm 41 and a holder 42. The arm 41 is a rectangular parallelepiped member that is long in a direction parallel to the plane of the transfer body 3 and is located between the transfer mechanism TR and the chamber 2. The arm 41 is provided so as to be rotatable intermittently in 180° increments around an axis parallel to the rotation axis of the transfer body 3 by a motor 41a that serves as a drive source.

[0040] The holder 42 is a disk-shaped member that holds the workpiece W and is provided on each end of the arm 41. Therefore, in this embodiment, two holders 42 are provided. The holder 42 holds the workpiece W using a holding mechanism 42a, such as a mechanical chuck. More specifically, the holding mechanism 42a chucks a holder (not shown) provided on the transport plate 36, as described above, to hold the workpiece W. The holding mechanism 42a may also be a vacuum chuck or an electrostatic chuck. The holder 42 is configured to be reciprocated in a direction parallel to the axis of rotation of the arm 41 by a cylinder 42b, which serves as a drive source. The holder 42 also functions as a lid that opens and closes the opening 22. That is, the holder 42 has a larger diameter than the opening 22, and a sealing member, such as an O-ring, is provided around the opening 22 on the top surface of the chamber 2. The opening 22 can be sealed by pressing the holder 42 against the sealing member.

[0041] The space surrounded by the holder 42 and seal 31 that seal the opening 22, and the sealing plate 612b that seals the opening 31a of the seal 31 constitutes a load lock chamber L. The load lock chamber L enables the susceptor S carrying the workpiece W to be loaded and unloaded while maintaining the vacuum inside the chamber 2. Furthermore, the transfer body 3 transfers the seals 31, 32 between the load lock chamber L and a position facing the target 5a while maintaining the vacuum inside the chamber 2.

[0042] The chamber 2 is provided with an air passage 2b for exhausting the load lock chamber L and opening it to the atmosphere. The air passage 2b functions as an exhaust port for evacuating the load lock chamber L and a vent port for breaking the vacuum. A pipe 26 is connected to the air passage 2b, and a pneumatic circuit including a pressure reducing pump, valves, etc. (not shown) enables switching between evacuating the load lock chamber L and breaking the vacuum.

[0043] [Film forming section] The film forming unit 5 forms a film on the workpiece W by sputtering. As shown in FIGS. 1, 2, and 4, the film forming unit 5 has a lid 51, a target unit 52, and a shutter 53. The lid 51 is a conical member provided on the ceiling of the chamber 2 and covers the opening 23 via a sealing member such as an O-ring, thereby airtightly sealing it. A portion of the lid 51 is attached to the chamber 2 by a support mechanism 511 shown in FIG. 2. The support mechanism 511 has a rotating body 511a serving as a support member for rotation, a lifting cylinder 511b, and a rotation motor 511c, and supports the lid 51 so that it can rotate and move up and down. The lid 51 rotates when the motor 511c is driven to rotate the rotating body 511a, and the lid 51 moves up and down opposite the opening 23 when the cylinder 511b moves the lid 51 up and down relative to the opening 23, thereby opening and closing the opening 23.

[0044] That is, when opening 23 is to be opened (lid 51 is to be removed from chamber 2), cylinder 511b raises lid 51, and then motor 511c rotates rotating body 511a to open opening 23. When closing opening 23 (lid 51 is to be set in chamber 2), motor 511c rotates rotating body 511a, and then cylinder 511b lowers lid 51 to close opening 23.

[0045] The target unit 52 includes a target 5a serving as a sputtering source, and is detachably mounted on the lid 51. This allows the target 5a to be detachably mounted from outside the chamber 2. The target unit 52 is provided with a pair of targets 5a, with their sputtering surfaces (target surfaces) oriented along the inclined surface of the lid 51. This allows the targets 5a to face the interior of the chamber 2 via an opening 23 formed in the chamber 2. The target 5a is held so that the target surface is inclined relative to the installation surface, and faces the workpiece W at an angle. The target surface is a flat surface before being eroded by film formation, and is a plane perpendicular to the axis.

[0046] The target 5a is a disk-shaped member formed from a film-forming material that is deposited on the workpiece W by sputtering to form a film. The target 5a is connected to a power source via an electrode (not shown). Examples of the film-forming material include silicon, niobium, tantalum, titanium, and aluminum. However, various materials can be used as long as they can be used to form a film by sputtering.

[0047] The target unit 52 further includes a cooling plate 521, a magnet 522, and a motor 523. The cooling plate 521 supports the back surface of the target 5a and has a path through which cooling water flows, as indicated by the dotted line connected to the arrow in the figure. The magnet 522 is a permanent magnet that is disposed behind the target 5a via the cooling plate 521 and generates a rotating magnetic field. The motor 523 is a drive source that rotates the magnet 522.

[0048] The shutter 53 is a cone-shaped member that shields the target 5a and has a window that exposes the target 5a. The shutter 53 is rotatable about its axis by a motor 531. By rotating the shutter 53 and moving the position of the window, the shutter 53 can be positioned to shield the target 5a, allowing pre-sputtering to be performed to clean the surface of the target 5a. The shutter 53 is not shown in any illustrations except in FIG. 4.

[0049] The target 5a faces the inside of the chamber 2 through the opening 23. The area inside the chamber 2 facing the target 5a constitutes the film formation chamber F (see FIG. 5). While maintaining the vacuum inside the chamber 2, the transfer body 3 switches between a state in which the workpiece W is positioned at a position facing the target 5a and a state in which the sealing body 32 is positioned, by rotating the turntable.

[0050] Although not shown, chamber 2 is provided with a sputtering gas inlet that introduces sputtering gas into film formation chamber F. The sputtering gas inlet includes a gas supply circuit, and introduces sputtering gas from a gas supply source into film formation chamber F. As the sputtering gas, for example, an inert gas such as argon gas can be used.

[0051] The pressure in the film formation chamber F is reduced by exhausting the gas through the ventilation path 24. In the film formation chamber F, the sputtering gas introduced into the film formation chamber F is converted into plasma by applying electric power to the target 5a from the power supply, and the film formation material ejected from the target 5a can be deposited on the workpiece W.

[0052] 4(B), the space enclosed by the lid 51 that seals the opening 23 and the sealing body 32 constitutes the shielded space SA as described above. The ventilation path 2a that communicates with the shielded space SA functions as an exhaust port for evacuating the shielded space SA and as a vent port for breaking the vacuum. A pipe 27 is connected to the ventilation path 2b (see FIG. 2), and a pneumatic circuit including a pressure reducing pump, valves, etc. (not shown) enables switching between evacuating the shielded space SA and breaking the vacuum.

[0053] [Control device] The control device 70 is a device that controls each part of the film forming apparatus 1. The control device 70 can be configured, for example, by an electronic circuit or a computer that operates according to a predetermined program. The control contents of the control device 70 are programmed and executed by a processing device such as a PLC (Programmable Logic Controller) or a CPU (Central Processing Unit).

[0054] For example, the control device 70 controls, using the above-mentioned program, the evacuation of the chamber 2, the evacuation of the load lock chamber L, the rotation of the transport body 3, the loading and unloading of the work W by the loading and unloading section 4, the rotation of the transport body 3, the movement of the sealing bodies 31, 32 and the transport plate 36 by the drive section 6, the film formation by the film formation section 5, the evacuation of the shielded space SA, etc.

[0055] [Operation] The process of forming a film on a workpiece W using the film forming apparatus 1 according to the present embodiment as described above will be described with reference to the above drawings. Note that the following description will focus on a workpiece W placed on one susceptor S.

[0056] (film formation operation) First, we will explain the operation of loading the workpiece W to be subjected to film formation processing into the chamber 2 by the loading / unloading unit 4. As shown in Fig. 2, one holder 42 of the loading / unloading unit 4 seals the opening 22, and the inside of the chamber 2 is evacuated to a vacuum by exhaust processing of the pneumatic circuit.

[0057] On the other hand, as shown in Fig. 1, the other holder 42 of the loading / unloading section 4 is positioned on the transport mechanism TR. This holder 42 descends toward the transport mechanism TR, and the holding mechanism 42a holds the unprocessed workpiece W. When the holder 42 rises, the workpiece W is picked up from the transport mechanism TR. Fig. 2 shows the state in which the workpiece W is held by the other holder 42 in this manner.

[0058] The sealing body 31 mounted on the transfer body 3 is positioned at a position facing the opening 22. From this state, as shown in Fig. 5, the pusher 61 urges the sealing body 31 toward the opening 22 and makes contact with it so as to surround the periphery. As a result, the sealing body 31 seals the opening 22 from the inside of the chamber 2, and the opening 31a of the sealing body 31 is sealed by the sealing plate 612b, forming a sealed load lock chamber L.

[0059] Then, as shown in Fig. 6, the vacuum in the load lock chamber L is broken and atmospheric pressure is achieved by supplying vent gas via the air passage 2b using an air pressure circuit. Thereafter, as shown in Fig. 7, the holder 42 that had been sealing the opening 22 rises to open the opening 22. Next, as shown in Fig. 8, the arm 41 rotates to position the unprocessed workpiece W in a position facing the opening 22.

[0060] 9, the holder 42 holding the unprocessed workpiece W descends to seal the opening 22, and the workpiece W is placed on the connection portion 612a of the pusher 61. In this way, the load lock chamber L is sealed by the sealing body 31 and the holder 42. Then, as shown in FIG. 10, the load lock chamber L is returned to a vacuum by evacuating the air through the ventilation path 2b using the pneumatic circuit.

[0061] 11, the pusher 61 descends, causing the sealer 31 to move together with the workpiece W in a direction away from the opening 22. As a result, the connection portion 612a of the pusher 61 moves away from the connection leg 36a of the transport plate 36 of the workpiece W, and the seal plate 612b moves away from the opening 31a of the sealer 31. In this way, the unprocessed workpiece W is placed on the sealer 31 and supplied into the chamber 2.

[0062] 12, the transport body 3 rotates intermittently, and the sealing body 31 carrying the workpiece W moves to a position facing the opening 23 of the film forming unit 5. As shown in FIG. 13, the pusher 62 is raised, and the transport plate 36 carrying the susceptor S moves in a direction approaching the opening 23. In this way, the workpiece W on the susceptor S is brought closer to the target 5a, and the motor 623a is rotated. As a result, the workpiece W rotates relative to the target 5a.

[0063] In this state, as shown in Fig. 14, sputtering gas is introduced into the film formation chamber F, and power is applied to the target 5a by the power supply. Then, the sputtering gas is converted into plasma, and the ions generated collide with the target 5a, knocking out the film formation material that makes up the target 5a and depositing it on the workpiece W (this state is shown by a set of points near the opening 23 in Fig. 14).

[0064] After the time has passed during which the film formation material has accumulated on the workpiece W to a predetermined film thickness, the application of power to the target 5a is stopped and the plasma is extinguished. This completes the sputtering process on the workpiece W. Next, the rotation of the motor 623a is stopped, and the sputtering gas is discharged from the film formation chamber F. Then, the pusher 62 is moved in a direction away from the opening 23, thereby moving the workpiece W in a direction away from the target 5a. As a result, the workpiece W is placed on the sealing body 31, and the connecting portion 622a is separated from the connecting leg 36a of the transport plate 36.

[0065] Furthermore, by intermittently rotating the transport body 3, the processed workpiece W is moved to a position directly below the opening 22. The pusher 61 moves the sealing body 31 in a direction approaching the opening 22, and the sealing body 31 seals the opening 22, and the sealing plate 612b seals the opening 31a of the sealing body 31. This forms a sealed load lock chamber L that accommodates the processed workpiece W. The processed workpiece W is held by the holding mechanism 42a of the holder 42 that seals the opening 22 of the load lock chamber L. Then, the vacuum in the load lock chamber L is broken by supplying vent gas via the ventilation path 2b.

[0066] Thereafter, the holder 42 moves in a direction away from the opening 22, thereby opening the load lock chamber L. As shown in FIG. 1, the arm 41 rotates, so that the holder 42 holding the processed workpiece W is positioned opposite the transport mechanism TR, and the holder 42 moves in a direction approaching the transport mechanism TR, thereby releasing the holding mechanism 42a from holding the processed workpiece W. In this way, the processed workpiece W is delivered to the transport mechanism TR. The transport mechanism TR then transports the processed workpiece W to a subsequent process.

[0067] (maintenance) Next, the maintenance operation for replacing the target 5a will be described. First, with no workpiece W present in the chamber 2 and the chamber 2 maintained at a vacuum, the transfer body 3 is rotated intermittently by 90° to move the sealant 32 from the state shown in FIG. 3(A) to a position facing the film forming unit 5 as shown in FIG. 3(B). Then, as shown in FIG. 16, the pusher 62 moves the sealant 32 in a direction approaching the opening 23, thereby pressing the sealing member 32a against the periphery of the opening 23 to seal it, thereby forming a shielded space SA. At this time, the shielded space SA is in a vacuum state.

[0068] Then, as shown in Fig. 17, the vacuum in the shielded space SA is broken and atmospheric pressure is achieved by supplying vent gas via the ventilation path 2a using a pneumatic circuit. In this state, as shown in Fig. 4(B), the target unit 52 is pulled out and replaced with a target unit 52 having a new target 5a attached. Note that, as shown in Fig. 18, the target unit 52 may be replaced after opening the lid 51. Furthermore, the lid 51 can be opened to perform cleaning of the inside, etc.

[0069] [effect] (1) The film forming apparatus 1 of this embodiment includes a chamber 2 capable of evacuating the interior thereof, a target 5a formed containing a film forming material to be deposited on a workpiece W by sputtering, which is detachably attached to the chamber 2 and faces the interior of the chamber 2 through an opening 23 provided in the chamber 2, a sealing body 32 that seals the opening 23, and a transport body 3 that switches between a state in which the workpiece W is positioned opposite the target 5a and a state in which the sealing body 32 is positioned while maintaining the vacuum in the chamber 2.

[0070] In this embodiment, in order to replace the target 5a, a space (the shielded space SA) sealed from the inside of the chamber 2 is formed, and only this space can be opened to the atmosphere. Therefore, it is not necessary to open the entire chamber 2 to the atmosphere in order to replace the target 5a, and the time required for opening the entire chamber 2 to the atmosphere, removing moisture, and evacuating is not required. Instead, the time required for replacement can be significantly reduced by only partially opening the chamber 2 to the atmosphere, removing moisture, and evacuating it.

[0071] (2) The seal 32 is provided via the sealing member 32a so as to be able to come into contact with and separate from the inner wall of the chamber 2 around the opening 23. This makes it possible to minimize the area of ​​the chamber 2 that is exposed to the atmosphere.

[0072] (3) The transfer body 3 is provided to be capable of intermittent rotation, and holds the workpiece W and the sealant 32 at positions that are out of phase with each other in the rotation of the transfer body 3. The intermittent rotation switches between a state in which the workpiece W is positioned opposite the target 5a and a state in which the sealant 31 is positioned. Therefore, the transfer body 3 can immediately move the sealant 32 to a position opposite the target 5a without opening the chamber 2, making it easier to prepare for target replacement and reducing the time required.

[0073] (4) The target 5a is provided so as to be detachable from the outside of the chamber 2. That is, the target unit 52 including the target 5a is provided so as to be detachable from the lid 51. Therefore, after the surrounding space is opened to the atmosphere, the target 5a can be removed together with the target unit 52 from the outside of the chamber 2 and replaced, which makes the work easier.

[0074] [Variations] The present embodiment may also be modified as follows. (1) As shown in Fig. 19, an exchange device 8 for exchanging a target 5a may be provided. The exchange device 8 has a pair of holders 823 for holding a target 5a, one of which holds a spare target 5a and the other of which holds a target 5a attached to the chamber 2, and by interchanging the holders 823, the target 5a attached to the chamber 2 is exchanged for the spare target 5a. As described above, since the target 5a is provided in the target unit 52, holding and exchanging the target 5a are synonymous with holding and exchanging the target unit 52, and the target 5a attached to the chamber 2, the used target 5a, and the spare target 5a can be read as the target unit 52, respectively.

[0075] More specifically, the pair of holders 823 rotate around a common axis. This rotation swaps one holder 823 with the other holder 823, for example, with respect to a position corresponding to the chamber 2. In the film forming apparatus 1 of this embodiment, the target unit 52 including the target 5a can be attached or detached from the member to which the target unit 52 is attached by moving the target unit 52 in a direction perpendicular to the target surface. In the film forming apparatus 1, the target unit 52 is attached to the chamber 2. In addition, a spare unit is placed (mounted) on a mounting table 83, which will be described later. In the chamber 2, the target unit 52 is attached to the lid 51 with its target surface inclined relative to the installation surface. The target unit 52 is placed (mounted) on the mounting table 83 with its target surface parallel to the installation surface. Therefore, for example, in the exchange device 8 shown in Figure 19, a pair of holding parts 823 hold the target 5a attached to the chamber 2 so that the target surface is inclined relative to the installation surface, and hold the spare target 5a placed on the mounting table 83 so that the target surface is parallel to the installation surface, and hold the spare target 5a at a different angle from the target 5a attached to the chamber 2.

[0076] The exchange device 8 has a rotation mechanism 81 and an elevation mechanism 82. The rotation mechanism 81 rotates a pair of holders 823, which hold the targets 5a, around a common axis. The rotation mechanism 81 rotates a cylindrical rotor 81b using a motor 81a. The rotation mechanism 81 is disposed near the two target units 52 on the cover 51 above the chamber 2, with each axis tilted. The elevation mechanism 82 is provided on each of the pair of holders 823, and moves the target 5a attached to the chamber 2 in a direction perpendicular to the target surface and moves the spare target 5a in a direction perpendicular to the target surface. Each elevation mechanism 82 has a pair of cylinders 821 fixed to the rotor 81b of the corresponding rotation mechanism 81. The cylinder 821 has a holder 823 attached to the tip of a drive rod 822.

[0077] In such an exchange device 8, in order to exchange the target units 52 using a pair of holders 823 rotated about a common axis by the rotation mechanism 81, the rotation axis of the rotation mechanism 81 (the common axis α about which the pair of holders rotate) is inclined with respect to the mounting surface at an angle θ2 that is half the angle θ1 formed by an axis β passing through the center of the target 5a and perpendicular to the target surface of the target 5a attached to the chamber 2, and an axis γ passing through the center of the target 5a and perpendicular to the target surface of the target 5a placed on the mounting table 83. As a result, the postures of the target units 52 at their respective mounting positions remain the same even when they are exchanged, and therefore they can be attached to and detached from the chamber 2 or the mounting table 83. In other words, the target unit 52, which is mounted on the lid 51 of the chamber 2 with the target surface inclined relative to the installation surface, has a target surface parallel to the installation surface when facing the mounting table 83. Therefore, the target 5a can be replaced by rotating a pair of holding parts 823 holding the target 5a using the rotation mechanism 81 and moving the target 5a using the cylinder 821 in a direction perpendicular to the target surface.

[0078] Such an exchange device 8 can change the mounting attitude of the target 5a without providing a separate mechanism for changing the mounting attitude, even when the mounting attitude (angle) of the target 5a relative to the installation surface in the film formation apparatus 1 is different, so that the target 5a can be exchanged with a simple configuration. This makes it possible to prevent an increase in the cost of the film formation apparatus 1.

[0079] On the other hand, the two target units 52 in the lid 51 are provided with detachable plates 524 held by holders 823. The holders 823 have magnets, suction cups, mechanical chucks, or the like, and hold the detachable plates 524. Furthermore, a mounting table 83 on which a spare target unit 52 is placed is fixedly provided in the chamber 2. A recess 831 is formed in the mounting table 83, and the spare target unit 52 is placed with the target 5a of the spare target unit 52 facing this recess 831. Note that after the spare target 5a (target unit 52) ​​is replaced with the used target 5a (target unit 52) ​​attached to the chamber 2, the used target 5a (target unit 52) ​​is placed on the mounting table 83.

[0080] The replacement work of the target 5a by such an exchange device 8 is as follows: First, with only the shielded space SA open to the atmosphere, as shown in Fig. 19 , the holding parts 823 of the pair of cylinders 821 respectively hold the detachable plate 524 of the target unit 52 attached to the lid body 51 and the detachable plate 524 of the spare target unit 52 placed on the placing table 83.

[0081] 20, cylinder 821 rises to pull out target unit 52 attached to lid body 51 and lift up spare target unit 52 placed on mounting table 83. Then, motor 81a rotates, switching the positions of pulled-out target unit 52 and spare target unit 52. Furthermore, as shown in FIG. 21, cylinder 821 lowers spare target unit 52 to attach it to lid body 51 and lowers pulled-out target unit 52 to place it on mounting table 83.

[0082] As described above, the provision of the replacement device 8 for the target unit 52 can shorten the time required for the replacement work. Conventionally, in replacement work that required a long time because the chamber 2 was opened to the atmosphere, shortening the time required for replacing the target unit 52 had little effect on the overall time reduction. However, in the present embodiment, by opening only a portion of the chamber 2 to the atmosphere rather than the entire chamber 2, the time required for evacuation can be significantly reduced, and the reduction in the time required for replacing the target unit 52 can be even more effective. Furthermore, the weight of the target unit 52 including the magnet may be as much as 10 or so kilograms. Therefore, performing this work manually is difficult and dangerous. However, the provision of the replacement device 8 allows the target 5a to be replaced easily and safely.

[0083] Furthermore, moisture adsorbed to the target 5a of the spare target unit 52 can be reduced in advance. This shortens the time required to evacuate the shielded space SA after the spare target unit 52 is attached to the lid 51. For example, as shown in FIG. 21 , a spare vacuum chamber 84 is provided for evacuating the space surrounding the spare target 5a. The spare vacuum chamber 84 has an opening on the bottom surface facing the target 5a in the recess 831 on which the target unit 52 of the mounting table 83 is mounted, the opening airtightly sealing the space surrounding the target 5a, and the target 5a fitted in this opening faces the interior. The spare vacuum chamber 84 is connected to a pneumatic circuit (not shown) and is configured to be able to evacuate the interior by exhausting air.

[0084] The target 5a of the spare target unit 52 has moisture removed by evacuating the spare vacuum chamber 84 while the target 5a is placed on the mounting table 83. Therefore, after the spare target unit 52 is replaced with the target unit 52 attached to the lid body 51, the time required to remove moisture when evacuating the shielded space SA can be shortened, and the overall replacement time can be shortened.

[0085] It is sufficient that the moisture is removed from the target 5a of the spare target unit 52 while it is placed on the mounting table 83. For example, the moisture in the target 5a may be removed by heating the target 5a with a heater such as a lamp or a resistance heater. Although thermal expansion and the like must be taken into consideration when replacing the target unit 52, there is no need to form an airtight space capable of maintaining a vacuum, and therefore moisture can be easily removed.

[0086] (2) The number of sealers 31, 32 transported by the transport body 3 within the chamber 2 may be greater than in the above embodiment. For example, as shown in FIG. 22(A), three openings 23 are provided at 90° intervals relative to the opening 22, and a film forming unit 5 is provided for each of the three openings 23. Four sealers 31 (see FIG. 2, etc.) and four sealers 32 are provided symmetrically about the center of rotation of the transport body 3, each at 90° intervals. In other words, there are a total of eight sealers 31, 32. Therefore, when one sealer 31 is positioned opposite the opening 22, the other three sealers 31 are positioned opposite the three openings 23, respectively. Furthermore, when one sealer 32 is positioned opposite one of the openings 23, the other two sealers 32 are positioned opposite the other two openings 23, and one sealer 32 is positioned opposite the opening 22. By rotating the conveyance body 3 by 90°, the sealer 31 or sealer 32 moves between the opening 22 and each opening 23. In addition, the four sealers 31 and four sealers 32 are arranged alternately at 45° intervals. Therefore, by rotating the conveyance body 3 by 45°, two states can be switched: a state in which the four sealers 31 are positioned at positions facing the openings 22 and 23, and a state in which the four sealers 32 are positioned. In other words, in this embodiment, the position of the workpiece W and the positions of the sealers 31 and 32 are out of phase with each other by 45° during the rotation of the conveyance body 3. During sputtering operation, the sealer 31 is positioned facing the opening 22 and the three openings 23 by rotating the conveyance body 3 by 90°, and the opposing openings 22 and 23 are switched by rotating the conveyance body 3 by 45°. During maintenance, the sealer 32 is switched from the state during sputtering operation so that it is positioned at each opening 22 and 23 by rotating it by 45°.

[0087] 22(B), for example, two openings 23 are provided at 60° intervals relative to the opening 22, and a film forming unit 5 is provided in each of the two openings 23. Three sealing bodies 31 (not shown) and three sealing bodies 32 are provided at 120° intervals, respectively, and the sealing bodies 31 and 32 are alternately provided at 60° intervals. In other words, there are a total of six sealing bodies 31 and 32. As a result, by rotating the conveyance body 3 by 60°, it is possible to switch between two states: a state in which three sealing bodies 31 are positioned at positions facing the openings 22 and 23, and a state in which three sealing bodies 32 are positioned. In other words, in this embodiment, the positions of the workpiece W (sealing bodies 31) and the sealing bodies 32 are out of phase with each other by 60° in the rotation of the conveyance body 3. By rotating the conveying body 3, during sputtering operation, the sealing body 31 is positioned opposite the opening 22 and the two openings 23, and by rotating it by 120° the opposing openings 22 and 23 are switched, and during maintenance, by rotating it by 60° from the state during sputtering operation, the sealing body 32 is switched so as to be positioned at each opening.

[0088] Furthermore, the number of seals 32 does not have to be two, three, or four, and may be fewer. The number of seals 31 and 32 may not match, and may be fewer. For example, regardless of the number of seals 31, there may be only one seal 32. To transition from sputtering operation to maintenance, the transfer body 3 is simply rotated so that the seal 32 is positioned at the opening 23 where maintenance is to be performed. Even if there are multiple openings 23, maintenance can be performed sequentially at each opening 23. Furthermore, while the above examples show different numbers of openings 23, the number of openings 22 does not necessarily have to be one, and the seals 31 and 32 facing the openings 22 can be switched in the same way.

[0089] As described above, the phase shift position of the seals 31 and 32 in the rotation of the carrier 3 is as shown in Figures 3 and 22, for example. In the case of Figure 3, the rotation of the carrier 3 during normal operation is 180°, and the phase shift angle is 90°. In the case of Figure 22(A), the rotation of the carrier 3 during normal operation is 90°, and the phase shift angle is 45°. In the case of Figure 22(B), the rotation of the carrier 3 during normal operation is 120°, and the phase shift angle is 60°. However, as in these cases, it is not necessary to set the rotation angle during the transition to maintenance to half the rotation angle during normal operation, or to set the two rotation angles to any related angle. As long as the seals 31 and 32 do not interfere with each other, the phase shift angle between the seals 31 and 32 in the rotation of the carrier 3 can be any angle. By setting the rotation of the carrier 3 for the transition from normal operation to maintenance to any angle within the set phase shift, switching similar to the above-described mode can be achieved.

[0090] As described above, the required number of openings 22, openings 23 and sealers 32, as well as the angle at which sealers 31 and 32 are positioned at different phases in the rotation of the conveying body 3, can be appropriately determined, and by arranging sealers 31 and 32 at positions at which they are positioned at different phases in the rotation of the conveying body 3, sealer 32 can be used in place of sealer 31 by switching the phase.

[0091] In the above embodiment, the number of film formation units 5 can be increased, and by using targets 5a made of different types of materials for each film formation unit 5, different types of films can be formed in one chamber 2. Furthermore, the number of film formation units 5 and the number of load lock chambers formed by openings 22 can be appropriately determined depending on the takt time of the required sputtering process operation, making it possible to accommodate a variety of sputtering process operations.

[0092] (2) The shape of the lid 51 on which the targets 5a serving as sputtering sources are arranged and the number of targets 5a are not limited to the above-described embodiments. For example, as shown in FIGS. 23(A) and 23(B), a pair of targets 5a may be arranged at an angle on a conical lid 51, or as shown in FIGS. 23(A) and 23(C), a pair of targets 5a may be arranged at an angle on the side of a horizontal triangular prism-like lid 51. Furthermore, as shown in FIG. 24(A), three targets 5a may be arranged at an angle at regular intervals on a conical lid 51, or as shown in FIG. 24(B), four targets 5a may be arranged at an angle at regular intervals on a conical lid 51. Furthermore, as shown in FIG. 24(C), four targets 5a may be arranged at an angle on a quadrangular pyramidal lid 51, or as shown in FIG. 24(D), three targets 5a may be arranged at an angle on a triangular pyramidal lid 51. The shape, number, and arrangement of these targets may be determined appropriately.

[0093] (3) The target 5a serving as the sputtering source does not need to be inclined relative to the installation surface. For example, as shown in FIG. 25(A), a box-shaped lid 51 having a top surface parallel to the installation surface may be used, with the target surface of the target 5a being arranged parallel to the installation surface. The lid 51 may be rectangular as shown in FIG. 25(B) or cylindrical as shown in FIG. 25(C). Furthermore, as shown in FIGS. 25(D), (E), and (F), two targets 5a may be arranged parallel to the installation surface. Furthermore, as shown in FIGS. 26(A) and (B), three targets 5a may be arranged parallel to the installation surface, or as shown in FIGS. 26(C) and (D), four targets 5a may be arranged parallel to the installation surface. The number and arrangement of the targets may be determined appropriately.

[0094] (4) In order to accommodate the case where the target 5a is arranged parallel to the installation surface as described above, the exchange device 8 also needs to insert and remove the target 5a (target unit 52) ​​in a direction perpendicular to the installation surface. For this reason, as shown in Fig. 27, the rotation mechanism 81 of the exchange device 8 is configured to rotate and move a pair of lifting mechanisms 82 around an axis in the vertical direction. The lifting mechanism 82 also has a drive rod 822 that raises and lowers a holder 823 around an axis in the vertical direction.

[0095] The pair of lifting mechanisms 82 are provided at both ends of a horizontal arm 824. The horizontal arm 824 is provided on the rotation mechanism 81 so as to be horizontally rotatable and slidable. A rack 824a is provided on the horizontal arm 824 and meshes with a pinion 81c built into the rotation mechanism 81 and driven by a drive source such as a motor. As the pinion 81c rotates, the horizontal arm 824 moves horizontally, thereby allowing the holders 823 of the drive rods 822 at both ends to move horizontally. The holders 823 of the drive rods 822 can move horizontally to position the target unit 52 directly above the lid 51 and the auxiliary vacuum chamber 84 (mounting table 83). Even when there are multiple targets 5a arranged parallel to the installation surface, the holders 823 can be positioned relative to each target 5a by horizontally moving the drive rods 822, as shown in FIG. 28 . In this case, the positions of the pair of targets 5a are also switched by the rotation mechanism 81.

[0096] 29(A), a plurality of mounting tables 83 and auxiliary vacuum chambers 84 may also be provided. By horizontally moving the horizontal arm 824 and rotating the rotation mechanism 81, the holders 823 of the drive rods 822 at both ends of the horizontal arm 824 can be positioned relative to the mounting table 83 and auxiliary vacuum chamber 84. The horizontal arms 824 may also be individually extendable and retractable. For example, as shown in FIG. 29(B), a robot arm having joints may be used, allowing the lifting mechanism 82 (drive rods 822 and holders 823) to be positioned at various locations. Furthermore, the horizontal arm 824 may not require horizontal movement by making the distance from the rotation axis of the rotation mechanism 81 to the replacement position of the target 5a and the mounting table 83 equal.

[0097] (5) In the above embodiment, the opening 23 is not sealed by the seal 31 during film formation (sputtering process). However, the opening 23, i.e., the periphery of the target 5a, may be sealed during film formation. If the required film quality can be ensured, it is not necessary to seal the periphery of the target 5a during film formation. However, in cases where higher quality is required or where particular attention needs to be paid to the quality of the film formation, adding a sealing mechanism and sealing the target 5a allows for more precise control of the pressure during sputtering, resulting in a more stable plasma state and higher quality film formation. Furthermore, the sputtered target components can be prevented from diffusing into the chamber 2 and becoming particles. Furthermore, since surrounding particles can be prevented from entering the film formation region, the impact of particles on film quality can be reduced.

[0098] Thus, in the above-described embodiment, the sealing mechanism added to perform high-quality sputtering film formation must be one that enables rotation of the workpiece W during film formation to improve film thickness distribution. For example, as shown in FIG. 30 , a sealing plate 624 is provided on the shaft 622, sealing the opening 31 a of the sealing body 31 via a sealing member when the shaft 622 ascends. The sealing plate 624 is rotatably connected to the shaft 622 via a flange 625 through which the shaft 622 penetrates a bearing (not shown). When the shaft 622 ascends, the flange 625 and the sealing plate 624 also ascend, and the sealing plate 624 seals the opening 31 a and pushes up the sealing body 31. The sealing body 31 presses the sealing member 31 b against the periphery of the opening 23, forming a sealed space around the target 5 a. When the shaft 622 and the workpiece W rotate during film formation, the bearing of the flange 625 prevents the seal 31 and the seal plate 624 from rotating.

[0099] In this case, the opening 23 can also be sealed by the sealing body 31, so that when replacing the target 5a or performing maintenance, the sealing body 32 andSimilarly, the seal 31 can be used. However, since the seal 31 has been used in the sputtering process of the workpiece W, components of the sputtered target 5a adhere to the seal 31. If such a seal 31 is used in the sputtering process after being exposed to the atmosphere for a long period of time, the components of the target 5a adhered to the seal 31 will easily peel off, resulting in an increase in particles. Therefore, when replacing the target 5a or performing maintenance, it is optimal to use the seal 32 that is not used in the sputtering process, as in this embodiment.

[0100] When performing maintenance while the opening 23 is sealed with the sealer 32, the lid 51 can be opened to not only replace the target but also clean the inner surfaces of the lid 51, the opening 23, and the sealer 32 itself. Furthermore, during maintenance, the opening 22 does not necessarily need to be sealed with the sealer 32. However, after sealing the opening 22 with the sealer 32 and isolating the interior of the chamber 2, the holder 42 can open the opening 22, allowing the sealer 32 itself to be cleaned. Of course, by simultaneously sealing the openings 22 and 23 with two seals 32, the two seals 32 can be cleaned simultaneously, thereby shortening the maintenance time. Furthermore, by opening the opening 22 with the sealer 31 while the holder 42 is closing the opening 22, the sealer 31 itself can be cleaned. In this way, when performing various maintenance tasks, a sealed space can be formed from within chamber 2 and only this space can be opened to the atmosphere, eliminating the need to open the entire chamber 2 to the atmosphere. This eliminates the need to spend time opening the entire chamber 2 to the atmosphere, removing moisture, and evacuating it, and instead allows for partial opening to the atmosphere, removing moisture, and evacuating, significantly reducing the time required for maintenance.

[0101] [Other embodiments] Although the embodiments of the present invention and modifications of each part have been described above, these embodiments and modifications of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and modifications are included within the scope and spirit of the invention, and are also included in the invention described in the claims. [Explanation of symbols]

[0102] 1 Film deposition equipment 2 chambers 2a, 2b ventilation passages 3. Carrier 4 Loading and unloading area 5 Film forming section 5a Target 6 Drive unit 8 Exchange device 21 Containment Unit 22, 23 aperture 24 Air passage 25, 26, 27 Piping 31 Sealing body 31a aperture 31b, 32a Sealing member 32 Sealing body 33 Motor 34 Shaft 35 Support hole 36 Transport plate 36a Connecting leg 36b Legs 41 Arm 41a Motor 42 Holding body 42a Retention mechanism 42b cylinder 51 Lid 52 Target Unit 53 Shutter 61, 62 Pusher 70 Control device 81 Rotation mechanism 81a Motor 81b Rotating body 81c Pinion 82 Lifting mechanism 83 Mounting table 84 Spare Vacuum Chamber 6 11 Torso 511 Support mechanism 511a Rotating body 511b cylinder 521 Cooling Plate 522 Magnet 523, 531 motor 612, 622 shaft 612a Connection 612b Sealing plate 613 Power Source 621 Torso 622a Connection 623 Power Source 623a motor 623b Air Cylinder 624 Sealing plate 625 Tsuba 821 Cylinder 822 Drive rod 823 Holding part 824 horizontal arm 824a Rack 831 depression

Claims

1. a chamber capable of creating a vacuum inside; a target formed by sputtering and containing a film forming material to be deposited on a workpiece, the target being detachably provided in the chamber and facing the inside of the chamber through an opening provided in a ceiling surface of the chamber; an encapsulation body on which the work is mounted; a sealing body for maintenance that is positioned opposite the target during maintenance, seals the opening so as to maintain a vacuum in the chamber, is not used for sputtering processing, and does not have the workpiece mounted thereon; and a carrier that holds a sealing body on which the workpiece is mounted and a sealing body for maintenance on which the workpiece is not mounted, and switches between a state in which the sealing body on which the workpiece is mounted and a state in which the sealing body for maintenance on which the workpiece is not mounted are positioned at a position facing the target while maintaining a vacuum inside the chamber; A film forming apparatus comprising:

2. 2. The film deposition apparatus according to claim 1, wherein the sealing body for maintenance on which the workpiece is not mounted is provided so as to be removably attached to the inner wall of the chamber around the opening via a sealing member.

3. 3. The film forming apparatus according to claim 1, wherein the transport body is arranged to be capable of intermittent rotation, and the sealing body carrying the workpiece and the sealing body for maintenance not carrying the workpiece are held at positions in different phases in the rotation of the transport body, and the intermittent rotation switches between a state in which the sealing body carrying the workpiece is positioned opposite the target and a state in which the sealing body for maintenance not carrying the workpiece is positioned.

4. 4. The film forming apparatus according to claim 1, wherein the target is provided so as to be detachable from the outside of the chamber.

5. 5. The film forming apparatus according to claim 1, further comprising an exchange device that exchanges the target mounted in the chamber with the spare target by interchanging the one and the other of the holding parts, the film forming apparatus comprising a pair of holding parts that hold the target, one of the holding parts holding a spare target and the other holding part holding the target mounted in the chamber.

6. the pair of holders hold the target, which is attached to a lid provided on the chamber so that the target surface is inclined with respect to an installation surface, and hold the spare target at an angle different from that of the target attached to the chamber so that the spare target is inclined with respect to the installation surface; the pair of holders are each provided with an elevating mechanism that moves the target attached to the chamber in a direction perpendicular to a target surface and moves the spare target in a direction perpendicular to the target surface; 6. The film forming apparatus according to claim 5, wherein the exchange device rotates the pair of holders holding the target about a common axis.

7. 7. The film forming apparatus according to claim 5, further comprising at least one mounting stage on which a spare target is mounted and on which the used target is mounted after the spare target has been replaced with the used target.

8. 8. The film forming apparatus according to claim 5, further comprising a spare vacuum chamber for evacuating a space surrounding the spare target.

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