Substrate Processing Equipment

Abstract

To provide a substrate treating apparatus in which a posture turning unit turns a posture of substrates which the posture turning unit itself moves to receive, and in which a horizontal substrate transport mechanism is accessible to the posture turning unit from a vertical holder side, holding the substrates in a vertical posture, after the posture of the substrates is turned to horizontal.SOLUTION: A posture turning unit 63 of a substrate treating apparatus 1 includes: two horizontal holders configured to place a plurality of substrates when the substrates are in a horizontal posture; two vertical holders provided below the horizontal holders and configured to hold the substrates in a vertical posture when the substrates are in the vertical posture; an opening and closing portion configured to move the two vertical holders between a holding position and a passing position, a supporting portion configured to support the two horizontal holders and the two vertical holders; a longitudinal rotator configured to rotate the supporting portion around a horizontal axis so as to direct the two vertical holders to the horizontal substrate transport mechanism; and a moving unit configured to move the supporting portion and the longitudinal rotator. When a posture of the substrates is turned to horizontal, the opening and closing portion moves the two vertical holders to into the passing position.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus for processing substrates. Examples of the substrate include semiconductor substrates, FPD (Flat Panel Display) substrates, photomask glass substrates, optical disk substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of the FPD include liquid crystal display devices and organic EL (electroluminescence) display devices. [Background technology]

[0002] Conventional substrate processing apparatuses include hybrid substrate processing apparatuses that include a batch processing module (batch processing section) that processes multiple substrates at once, and a single-wafer processing module (single-wafer processing section) that processes the substrates processed in the batch processing module one by one (see, for example, Patent Documents 1 and 2).

[0003] The batch processing module processes multiple substrates in a vertical position. In contrast, the single-wafer processing module processes substrates in a horizontal position. Therefore, a rotation mechanism (position conversion mechanism) converts the position of each substrate from vertical to horizontal.

[0004] The substrate processing apparatus of Patent Document 3 includes a posture changing mechanism (a posture changing unit or a rotation mechanism). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Special Publication No. 2016-502275 [Patent Document 2] Patent Publication No. 2021-064652 [Patent Document 3] Japanese Patent Application Publication No. 2018-056341 Summary of the Invention [Problem to be solved by the invention]

[0006] The apparatus of Patent Document 1 includes a bath, a robot, and a rotation mechanism. The robot removes two substrates from the bath and places them on the rotation mechanism. The rotation mechanism then changes the orientation of the two substrates to a horizontal orientation. In other words, the rotation mechanism changes the orientation of the substrates transported by the robot. In this regard, the rotation mechanism (orientation change unit) may want to move itself to change the orientation of the substrates it receives.

[0007] Furthermore, for example, the position conversion unit may include a vertical holding unit that holds the substrate in a vertical position, and the substrate processing apparatus may include a horizontal substrate transport mechanism that transports the substrate in a horizontal position. In this case, after converting the substrate to a horizontal position, the position conversion unit may want to face the vertical holding unit, i.e., the underside of the vertical holding unit, toward the horizontal substrate transport mechanism. This is because the horizontal substrate transport mechanism accesses the position conversion unit from the vertical holding unit side.

[0008] The present invention has been made in consideration of the above circumstances, and aims to provide a substrate processing apparatus in which an attitude conversion section moves by itself to convert the attitude of a substrate it receives, and after the substrate has been converted to a horizontal attitude, a horizontal substrate transport mechanism can access it from the vertical holding section side that was holding the substrate in a vertical attitude. [Means for solving the problem]

[0009] In order to achieve the above object, the present invention has the following configuration: That is, a substrate processing apparatus according to the present invention is a substrate processing apparatus that successively performs batch processing for processing a plurality of substrates collectively and single wafer processing for processing substrates one by one, and includes a batch processing tank for processing a plurality of substrates collectively, a batch substrate transport mechanism for transporting the plurality of substrates collectively in a vertical orientation relative to the batch processing tank, a single wafer processing chamber for processing substrates one by one, a horizontal substrate transport mechanism for transporting substrates in a horizontal orientation one by one relative to the single wafer processing chamber, and a posture change mechanism for converting the plurality of batch-processed substrates from a vertical orientation to a horizontal orientation. and a position change mechanism, wherein the position change mechanism comprises a substrate holding section that holds the plurality of substrates in a vertical position that are transported by the batch substrate transport mechanism and arranged at a predetermined interval, and a position change section that receives the plurality of substrates from the substrate holding section and changes the plurality of substrates from the vertical position to a horizontal position, wherein the position change section comprises two horizontal holding sections that accommodate two radially opposing side sections of each substrate included in the plurality of substrates, and when the plurality of substrates are in a horizontal position, the two horizontal holding sections place the plurality of substrates at a predetermined interval. a horizontal holding unit, two vertical holding units that accommodate two side portions of each of the plurality of substrates, the two vertical holding units being provided below the horizontal holding unit and holding the plurality of substrates in a vertical position when the plurality of substrates are in a vertical position; an opening / closing unit that moves the two vertical holding units between a holding position where the spacing between the two vertical holding units is narrowed to hold the plurality of substrates using the two vertical holding units, and a passing position where the spacing between the two vertical holding units is widened to allow each substrate to pass between the two vertical holding units; a support section that supports the two horizontal holding sections and the two vertical holding sections; a vertical rotation section that rotates the support section about a horizontal axis so that the two vertical holding sections face the horizontal substrate transport mechanism in order to convert the substrates from a vertical position to a horizontal position; and a moving section that moves the support section and the vertical rotation section between a substrate waiting area in which the substrate holding sections are arranged and a position change execution area for converting the substrates from a vertical position to a horizontal position, wherein when the substrates in a vertical position are held by the substrate holding sections, the moving section:The support unit and the vertical rotation unit are moved to the substrate waiting area, the two vertical holding units are moved to the holding position by the opening / closing unit to hold the plurality of substrates in a vertical position held by the substrate holding units, and the two horizontal holding units receive the plurality of substrates held by the two vertical holding units, the moving unit moves the support unit and the vertical rotation unit to the position change execution area with the plurality of substrates held by the two vertical holding units, the vertical rotation unit converts the plurality of substrates from a vertical position to a horizontal position by rotating the support unit about the horizontal axis, the opening / closing unit moves the two vertical holding units to the passing position when the plurality of substrates have been converted to a horizontal position, and the horizontal substrate transport mechanism removes substrates one by one from the plurality of horizontally oriented substrates while passing between the two vertical holding units moved to the passing position, and transports the removed substrates to the single wafer processing chamber.

[0010] In the substrate processing apparatus according to the present invention, the position change mechanism includes a substrate holding unit and a position change unit. The movement unit of the position change unit can move a support unit that supports two horizontal holding units and two vertical holding units. The vertical rotation unit of the position change unit rotates the support units around a horizontal axis. As a result, the position change unit can change the position of the substrate it receives by moving itself. The vertical rotation unit also rotates the support units around the horizontal axis so that the two vertical holding units face the horizontal substrate transport mechanism in order to change the substrate from a vertical position to a horizontal position. The opening / closing unit then moves the two vertical holding units to a passing position. This allows the horizontal substrate transport mechanism to transport the substrate from the vertical holding units side.

[0011] In the substrate processing apparatus described above, it is preferable that the orientation conversion unit further includes a horizontal rotation unit that rotates the support unit around a rotation axis that extends in a direction perpendicular to the alignment direction of the plurality of substrates and perpendicular to the horizontal axis, and the moving unit moves the support unit, the horizontal rotation unit, and the vertical rotation unit. The orientation of the substrate can be changed at any timing after the orientation conversion unit receives the substrate from the substrate holder.

[0012] In the substrate processing apparatus described above, the attitude changing mechanism preferably includes a second horizontal rotation unit that rotates the substrate holder about a vertical axis. Since the orientation of the substrate can be changed on the substrate holder side, the configuration of the attitude changing unit can be simplified.

[0013] In the substrate processing apparatus described above, the two vertical holding units preferably include multiple pairs of holding grooves, each of which holds a single substrate, and multiple pairs of passing grooves through which a single substrate passes, the multiple pairs of holding grooves and the multiple pairs of passing grooves being arranged alternately, and the two vertical holding units preferably are moved to the holding position by the opening / closing unit to hold, in the multiple pairs of holding grooves, first divided substrate groups, each of which is aligned with every other substrate among the multiple substrates in the vertical orientation held by the substrate holding units, and the two horizontal holding units preferably accommodate the first divided substrate groups. Because the two vertical holding units hold the first divided substrate groups, each of which is aligned with every other substrate among the multiple substrates, the spacing between two adjacent substrates can be increased. This allows the horizontal substrate transport mechanism to easily remove substrates from the orientation conversion unit.

[0014] In the above-described substrate processing apparatus, the posture conversion mechanism preferably further includes a standby tank for storing the liquid so that the plurality of substrates held by the substrate holders can be immersed in the liquid. If the substrates dry before being dried in the single-wafer processing chamber, pattern collapse on the substrates occurs. However, the present invention can prevent the substrates held by the substrate holders from drying out.

[0015] In the substrate processing apparatus described above, it is preferable that the position change mechanism further includes a position change nozzle that supplies a liquid in the form of a shower or mist to the plurality of substrates held by the two vertical holders of the position change unit. If the substrates dry before the drying process in the single wafer processing chamber, pattern collapse on the substrate occurs. However, the present invention can prevent the substrates held by the two vertical holders of the position change unit from drying.

[0016] In the substrate processing apparatus described above, it is preferable that the moving unit be located at a higher position than the plurality of substrates in a vertical position held by the two vertical holders. This can prevent droplets from falling from wet substrates from contaminating the driving parts of the position conversion unit, including the moving unit. For example, this can prevent the driving parts from breaking down due to contamination.

[0017] In the above-described substrate processing apparatus, it is preferable that the horizontal axis is provided at a position higher than the plurality of substrates in a vertical position held by the two vertical holders, and the support unit supports the two horizontal holders and the two vertical holders from the opposite side of the two vertical holders via the two horizontal holders. This allows the substrates held by the two vertical holders to be brought closer to the horizontal substrate transport mechanism when the vertical rotation unit rotates the support unit around the horizontal axis. [Effects of the Invention]

[0018] According to the substrate processing apparatus of the present invention, the posture change unit moves by itself to change the posture of the substrate it receives, and after converting it to a horizontal posture, the horizontal substrate transport mechanism can access it from the vertical holding unit side that was holding the substrate in a vertical posture. [Brief explanation of the drawings]

[0019] [Figure 1] 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to a first embodiment. [Figure 2] FIG. 2 is a side view showing the substrate handling mechanism. [Figure 3] 10(a) to 10(f) are side views illustrating a first position changing mechanism (position changing unit and pusher mechanism) of the transfer block. [Figure 4] FIG. 2(a) is a plan view showing the second position change mechanism, and FIG. 2(b) is a front view showing the second position change mechanism. [Figure 5] FIG. 10 is a front view for explaining two chucks (a horizontal holding part and a vertical holding part) of the attitude changing part. [Figure 6]10 is a flowchart illustrating an operation of the substrate processing apparatus. [Figure 7] 10 is a flowchart illustrating the operation of the second attitude change mechanism. [Figure 8] 10(a) to 10(c) are front views illustrating the first half of the operation of the second attitude changing mechanism. [Figure 9] 10(a) to 10(c) are plan views illustrating the first half of the operation of the second attitude changing mechanism. [Figure 10] 10(a) to 10(c) are front views illustrating the second half of the operation of the second attitude changing mechanism. [Figure 11] 10(a) to 10(c) are plan views illustrating the latter half of the operation of the second attitude changing mechanism. [Figure 12] FIG. 10(a) is a plan view showing a second position change mechanism according to a second embodiment, and FIG. 10(b) is a front view showing the second position change mechanism according to the second embodiment. [Figure 13] 10(a) is a vertical cross-sectional view showing a lifter of a second position change mechanism according to a third embodiment, and FIG. 10(b) is a side view showing a position change unit of the second position change mechanism according to the third embodiment. [Figure 14] FIG. 10 is a plan view showing a schematic configuration of a substrate processing apparatus according to a modified example. Example 1

[0020] A first embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a plan view showing a schematic configuration of a substrate processing apparatus 1 according to the first embodiment. Fig. 2 is a side view showing a substrate handling mechanism HTR.

[0021] <1. Overall structure> 1, the substrate processing apparatus 1 includes a stocker block 3, a transfer block 5, and a processing block 7. The stocker block 3, the transfer block 5, and the processing block 7 are arranged in this order in a single horizontal row.

[0022] The substrate processing apparatus 1 performs, for example, chemical processing, cleaning processing, drying processing, etc. on the substrates W. The substrate processing apparatus 1 successively performs batch processing and single wafer processing on the substrates W. That is, the substrate processing apparatus 1 performs batch processing and then single wafer processing on the substrates W. Batch processing is a processing method in which multiple substrates W are processed at once. Single wafer processing is a processing method in which substrates W are processed one by one.

[0023] For convenience, in this specification, the direction in which the stocker block 3, transfer block 5, and processing block 7 are lined up is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, the direction from the transfer block 5 toward the stocker block 3 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the width direction Y is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." For example, in Figure 1, for reference, front, back, right, left, top, and bottom are indicated as appropriate.

[0024] <2. Stocker block> The stocker block 3 accommodates at least one carrier C. The stocker block 3 is provided with one or more (for example, two) load ports 9. The stocker block 3 is equipped with a carrier transport mechanism (robot) 11 and shelves 13.

[0025] The carrier transport mechanism 11 transports the carrier C between the load port 9 and the shelf 13. The carrier transport mechanism 11 is equipped with a gripping portion that grips a protrusion on the top surface of the carrier C, or a hand that supports the carrier C while contacting the bottom surface of the carrier C. The shelf 13 is divided into a shelf 13A for removing and storing the substrates W, and a shelf 13B for storage.

[0026] The shelf 13A is arranged adjacent to the transfer block 5. The shelf 13A may be provided with a mechanism for attaching and detaching the lid of the carrier C. At least one shelf 13A is provided. The carrier C is placed on the shelf 13A. The carrier C stores a plurality of substrates W (e.g., 25 substrates) in a horizontal position in the vertical direction Z at predetermined intervals (e.g., 10 mm intervals). The substrates W are aligned in the thickness direction of the substrates W. For example, a FOUP (Front Opening Unify Pod) is used as the carrier C. A FOUP is a sealed container. The carrier C may also be an open container, and any type of container is acceptable.

[0027] <3. Transfer block> The transfer block 5 is disposed adjacent to the rear X of the stocker block 3. The transfer block 5 includes a substrate handling mechanism (robot) HTR and a first attitude conversion mechanism 15.

[0028] The substrate handling mechanism HTR is provided on the right Y side within the transfer block 5. The substrate handling mechanism HTR can transport multiple (e.g., 25) substrates W in a horizontal position all at once between the carrier C placed on the shelf 13A, the first position changing mechanism 15, and the buffer unit 27 (described later).

[0029] Please refer to Figure 2. The substrate handling mechanism HTR has a plurality of (e.g., 25) hands 17. For convenience of illustration, in Figure 2, the substrate handling mechanism HTR is shown to have three hands 17. Each hand 17 holds one substrate W.

[0030] The substrate handling mechanism HTR also includes a hand support unit 19, an advancing / retreating unit 20, and an elevation rotation unit 21. The hand support unit 19 supports a plurality of hands 17. This allows the plurality of hands 17 to move as a unit. The advancing / retreating unit 20 moves the plurality of hands 17 forward and backward via the hand support unit 19. The elevation rotation unit 21 rotates the advancing / retreating unit 20 about the vertical axis AX1, thereby rotating the plurality of hands 17, etc. about the vertical axis AX1. The elevation rotation unit 21 also raises and lowers the advancing / retreating unit 20, thereby raising and lowering the plurality of hands 17, etc. The elevation rotation unit 21 is fixed to the floor surface. In other words, the elevation rotation unit 21 does not move horizontally. The advancing / retreating unit 20 and the elevation rotation unit 21 each include an electric motor. The substrate handling mechanism HTR may include a hand (not shown) for transporting one substrate W, in addition to the hand 17 and the hand support part 19.

[0031] Please refer to Figure 1. The first position change mechanism 15 changes the position of multiple substrates W taken out from the carrier C from a horizontal position to a vertical position. The first position change mechanism 15 includes a position change unit 23 and a pusher mechanism 25. In Figure 1, the substrate handling mechanism HTR, the position change unit 23 and the pusher mechanism 25 are arranged in this order on the left side Y. Figures 3(a) to 3(f) are side views for explaining the first position change mechanism 15 (the position change unit 23 and the pusher mechanism 25) of the transfer block 5.

[0032] As shown in FIGS. 1 and 3(a), the posture conversion unit 23 includes a support base 23A, a pair of horizontal holding units 23B, a pair of vertical holding units 23C, and a rotation drive unit 23D. The pair of horizontal holding units 23B and the pair of vertical holding units 23C are provided on the support base 23A. The horizontal holding units 23B and the vertical holding units 23C receive multiple substrates W transported by the substrate handling mechanism HTR. When the substrates W are in a horizontal posture, the pair of horizontal holding units 23B contact the underside of each substrate W and support the substrates W from below. When the substrates W are in a vertical posture, the pair of vertical holding units 23C hold the substrates W.

[0033] The rotation drive unit 23D supports the support table 23A so that the support table 23A can rotate about the horizontal axis AX2. Furthermore, the rotation drive unit 23D rotates the support table 23A about the horizontal axis AX2, thereby converting the orientation of the plurality of substrates W held by the holders 23B and 23C from horizontal to vertical.

[0034] 1 and 3(f), the pusher mechanism 25 includes a pusher 25A, an elevation rotation unit 25B, a horizontal movement unit 25C, and a rail 25D. The pusher 25A supports the lower portion of each of a plurality of (e.g., 50) vertically oriented substrates W. For convenience of illustration, in FIGS. 3(a) to 3(f), the pusher 25A is configured to be able to support six substrates W.

[0035] The lifting and rotating unit 25B is connected to the underside of the pusher 25A. The lifting and rotating unit 25B moves the pusher 25A up and down by extending and retracting. The lifting and rotating unit 25B also rotates the pusher 25A around the vertical axis AX3. The horizontal moving unit 25C supports the lifting and rotating unit 25B. The horizontal moving unit 25C moves the pusher 25A and the lifting and rotating unit 25B horizontally along the rail 25D. The rail 25D is formed to extend in the width direction Y. The rotation driving unit 23D, the lifting and rotating unit 25B, and the horizontal moving unit 25C each include an electric motor.

[0036] The operation of the first position change mechanism 15 will now be described. The batch processing baths BT1 to BT6 in the processing block 7, which will be described later, process, for example, 50 substrates W in two carriers C at once. The first position change mechanism 15 changes the position of the 50 substrates W in groups of 25. The first position change mechanism 15 also arranges the substrates W face-to-face at a predetermined interval (half pitch). The half pitch is, for example, 5 mm. The pusher mechanism 25 transports these 50 substrates W to the transport mechanism WTR.

[0037] The 25 substrates W in the first carrier C will be described as substrates W1 of the first substrate group. The 25 substrates W in the second carrier C will be described as substrates W2 of the second substrate group. For convenience of illustration, in Figures 3(a) to 3(f), the first substrate group will be described as having three substrates W1, and the second substrate group will be described as having three substrates W2. When there is no particular distinction between substrates W1 and substrates W2, substrates W1 and W2 will be referred to as "substrates W."

[0038] See Figure 3(a). The attitude conversion unit 23 receives the 25 substrates W1 of the first substrate group transported by the substrate handling mechanism HTR with the holders 23B and 23C. At this time, the 25 substrates W1 are in a horizontal position with their device surfaces facing upward. The 25 substrates W1 are arranged at a predetermined interval (full pitch). The full pitch is, for example, 10 mm. The full pitch is also called the normal pitch.

[0039] The half pitch is half the distance of the full pitch. The device surface of the substrate W (W1, W2) is the surface on which the electronic circuit is formed and is called the "front surface." The back surface of the substrate W is the surface on which the electronic circuit is not formed. The surface opposite the device surface is called the back surface.

[0040] See Figure 3(b). The attitude conversion unit 23 rotates the holders 23B and 23C by 90 degrees around the horizontal axis AX2 to convert the attitude of the 25 substrates W1 from horizontal to vertical. See Figure 3(c). The pusher mechanism 25 raises the pusher 25A to a position higher than the holders 23B and 23C of the attitude conversion unit 23. As a result, the pusher 25A receives the 25 substrates W from the holders 23B and 23C. The 25 substrates W1 held by the pusher 25A face leftward Y. Note that in Figures 3(a) to 3(f), the arrows AR attached to the substrates W indicate the orientation of the device surfaces of the substrates W.

[0041] See FIG. 3(d). The pusher mechanism 25 rotates the 25 substrates W in a vertical orientation by 180 degrees around the vertical axis AX3. As a result, the 25 substrates W1 are inverted and face rightward Y. The inverted 25 substrates W1 then move half a pitch (e.g., 5 mm) leftward Y from their pre-rotation positions. The holders 23B and 23C of the orientation conversion unit 23 are rotated -90 degrees around the horizontal axis AX2 to prepare for receiving the next substrate W2. The orientation conversion unit 23 then receives the 25 substrates W2 of the second substrate group transported by the substrate handling mechanism HTR with the holders 23B and 23C. At this time, the 25 substrates W2 are in a horizontal orientation, with their device surfaces facing upward. The orientation conversion unit 23 and the pusher mechanism 25 are operated so as not to interfere with each other.

[0042] See Figure 3(e). The pusher mechanism 25 lowers the pusher 25A holding the 25 substrates W1 of the first substrate group to the retracted position. Thereafter, the attitude changing unit 23 changes the attitude of the 25 substrates W2 from horizontal to vertical. After the attitude change, the 25 substrates W2 face leftward Y. See Figure 3(f). Thereafter, the pusher mechanism 25 raises the pusher 25A holding the 25 substrates W2 of the second substrate group. This causes the pusher mechanism 25 to receive another 25 substrates W2 from the attitude changing unit 23.

[0043] As a result, the pusher 25A holds 50 substrates W (W1, W2) of the first substrate group and the second substrate group. The 50 substrates W are arranged alternately, with 25 substrates W1 and 25 substrates W2 arranged one by one. The 50 substrates W are arranged at a half pitch (e.g., 5 mm intervals). Furthermore, the 25 substrates W1 face in the opposite direction to the 25 substrates W2. Therefore, the 50 substrates W are arranged face-to-face. That is, two adjacent substrates W1 and W2 have their two device surfaces (or two back surfaces) facing each other.

[0044] Thereafter, the pusher mechanism 25 moves the pusher 25A holding the 50 substrates W along the rails 25D to the substrate transfer position PP below the pair of chucks 29, 30 of the transport mechanism WTR.

[0045] <4. Processing Block 7> The processing block 7 is adjacent to the transfer block 5. The processing block 7 is arranged behind the transfer block 5, at the X side. The processing block 7 includes a batch processing area R1, a batch substrate transport area R2, a posture changing area R3, a single substrate transport area R4, and a single substrate processing area R5. The substrate processing apparatus 1 also includes a buffer unit 27 on which substrates W are placed.

[0046] <4-1. Batch processing area R1> The batch processing area R1 is adjacent to the batch substrate transfer area R2, the attitude changing area R3, and the single wafer processing area R5, and extends in a direction away from the transfer block 5 (rearward X).

[0047] In the batch processing region R1, for example, six batch processing vessels BT1 to BT6 are provided. The six batch processing vessels BT1 to BT6 are aligned in a row in the front-rear direction X in which the batch processing region R1 extends. Note that the number of batch processing vessels is not limited to six, and may be any plural number.

[0048] Each of the six batch processing tanks BT1 to BT6 immerses a plurality of vertically oriented substrates W in a single process. For example, the six batch processing tanks BT1 to BT6 are composed of four chemical processing tanks BT1 to BT4 and two water rinsing processing tanks BT5 and BT6. Specifically, two chemical processing tanks BT1 and BT2 and a water rinsing processing tank BT5 form one set, and two chemical processing tanks BT3 and BT4 and a water rinsing processing tank BT6 form another set.

[0049] Each of the four chemical treatment tanks BT1 to BT4 performs etching treatment using a chemical solution. For example, phosphoric acid is used as the chemical solution. The chemical treatment tank BT1 stores the chemical solution supplied from a chemical solution jetting pipe (not shown). The chemical solution jetting pipe is provided on the inner wall of the chemical treatment tank BT1. Each of the three chemical treatment tanks BT2 to BT4 has the same configuration as the chemical treatment tank BT1.

[0050] Each of the two water-rinsing processing tanks BT5, BT6 performs a pure water cleaning process in which chemicals adhering to a plurality of substrates W are washed away with pure water. Deionized water (DIW), for example, is used as the pure water. Each of the two water-rinsing processing tanks BT5, BT6 stores pure water supplied from a cleaning liquid jetting pipe (not shown). The cleaning liquid jetting pipe is provided on the inner wall of each of the water-rinsing processing tanks BT5, BT6.

[0051] Six lifters LF1 to LF6 are provided for the six batch processing tanks BT1 to BT6, respectively. For example, the lifter LF1 holds multiple substrates W in a vertical position arranged at a predetermined interval (half pitch). The lifter LF1 also raises and lowers the multiple substrates W between a processing position inside the batch processing tank (chemical processing tank) BT1 and a transfer position above the batch processing tank BT1. The other five lifters LF2 to LF6 are configured similarly to the lifter LF1.

[0052] <4-2. Batch substrate transport area R2> The batch substrate transport region R2 is adjacent to the transfer block 5, the batch processing region R1, and the attitude change region R3. The batch substrate transport region R2 is provided along the batch processing region R1. One end of the batch substrate transport region R2 extends to the transfer block 5, and the other end extends in a direction away from the transfer block 5 (rearward X). The batch substrate transport region R2 extends parallel to the batch processing region R1.

[0053] The batch substrate transport region R2 has a transport mechanism (robot) WTR. That is, the transport mechanism WTR is provided in the batch substrate transport region R2. The transport mechanism WTR transports multiple (e.g., 50) substrates W in a vertical position collectively between a substrate transfer position PP defined in the transfer block 5, for example, six batch processing tanks BT1 to BT6, and a second position change mechanism 35 (lifter LF9). When the transport mechanism WTR passes through the second position change mechanism 35, it moves above a horizontal movement unit 95 of the position change unit 63, which will be described later.

[0054] The transport mechanism WTR includes a pair of chucks 29, 30 and a guide rail 33. Each of the chucks 29, 30 includes, for example, 50 holding grooves for holding 50 substrates W. The two chucks 29, 30 each extend parallel to the Y direction (FIG. 1) in a plan view. The transport mechanism WTR opens and closes the two chucks 29, 30. The transport mechanism WTR moves the pair of chucks 29, 30 along the guide rail 33. The transport mechanism WTR is driven by an electric motor. The transport mechanism WTR corresponds to the batch substrate transport mechanism of the present invention.

[0055] <4-3. Posture transformation area R3> The attitude changing region R3 is provided between the transfer block 5 and the batch processing region R1. The attitude changing region R3 is also disposed between the batch substrate transport region R2, the single substrate transport region R4, and the single substrate processing region R5. Therefore, the attitude changing region R3 is adjacent to the transfer block 5, the batch processing region R1, the batch substrate transport region R2, the single substrate transport region R4, and the single substrate processing region R5.

[0056] A second position changing mechanism 35 is provided in the position changing region R3. The second position changing mechanism 35 changes the position of the batch-processed substrates W from a vertical position to a horizontal position. The second position changing mechanism 35 will be described in detail later. The second position changing mechanism 35 corresponds to the position changing mechanism of the present invention.

[0057] <4-4. Single-substrate transport area R4> The single substrate transport area R4 is adjacent to the transfer block 5, the attitude changing area R3, and the single substrate processing area R5. The single substrate transport area R4 is provided on the opposite side of the attitude changing area R3 from the batch substrate transport area R2.

[0058] A center robot CR is provided in the single substrate transport region R4. The center robot CR can transport substrates W in a horizontal position one by one between the second position conversion mechanism 35, the single substrate processing chambers SW1 and SW2 (described later), and the buffer unit 27. In addition, the transfer block 5, the second position conversion mechanism 35, and the single substrate processing chambers SW1 and SW2 can be arranged around the center robot CR. This shortens the transport distance of the substrates W by the center robot CR, allowing the substrates W to be transported efficiently. The center robot CR corresponds to the horizontal substrate transport mechanism of the present invention.

[0059] The center robot CR is equipped with two hands 37A and 37B, two articulated arms 39A and 39B, and a lifting platform 41. Each of the two hands 37A and 37B holds one substrate W in a horizontal position. Each of the two hands 37A and 37B is capable of horizontal movement. Each of the two articulated arms 39A and 39B is configured, for example, as a SCARA type. The tip of the articulated arm 39A supports the hand 37A, and the tip of the articulated arm 39B supports the hand 37B. The articulated arm 39A moves the hand 37A in the horizontal direction (front-back direction X and width direction Y), and the articulated arm 39B moves the hand 37B in the horizontal direction.

[0060] The lifting platform 41 supports the base ends of the two articulated arms 39A and 39B. The lifting platform 41 is configured to be extendable and retractable in the vertical direction. Therefore, the lifting platform 41 raises and lowers the two hands 37A and 37B and the two articulated arms 39A and 39B. The horizontal position of the lifting platform 41 is fixed and does not move. This makes it possible, for example, to shorten the transport distance of the substrate W caused by the horizontal movement of the lifting platform 41. Furthermore, movement of the lifting platform 41 can be omitted.

[0061] The buffer unit 27 is disposed across the transfer block 5 and the single substrate transport area R4. That is, it is provided at the boundary between the transfer block 5 and the single substrate transport area R4. The buffer unit 27 may also be provided only in the transfer block 5 or the single substrate transport area R4. Therefore, the buffer unit 27 only needs to be fixedly provided at the boundary between the transfer block 5 and the single substrate transport area R4, or at the transfer block 5 or the single substrate transport area R4. Note that while the center robot CR has two sets of hands 37A, 37B and articulated arms 39A, 39B in the above description, the center robot CR may have one or three or more sets of hands and articulated arms.

[0062] The buffer unit 27 is equipped with a plurality of loading shelves. Each of the plurality of loading shelves is in a horizontal position. Each of the plurality of loading shelves can load one substrate W. The buffer unit 27 loads the plurality of substrates W in a horizontal position at a predetermined interval (full pitch) in the vertical direction Z. That is, the plurality of loading shelves are arranged at a predetermined interval (full pitch) in the vertical direction Z. The buffer unit 27 is configured to be able to load at least, for example, 25 substrates W that can be transported by the substrate handling mechanism HTR. The buffer unit 27 is configured to be able to load, for example, 50 substrates W. If necessary, the number of loading shelves in the buffer unit 27 may be 2 or more and 24 or less.

[0063] <4-5. Single wafer processing area R5> The single substrate processing area R5 is adjacent to the batch processing area R1, the attitude changing area R3, and the single substrate transport area R4, and is provided on the opposite side of the transfer block 5 across the single substrate transport area R4.

[0064] The single wafer processing region R5 is provided with a plurality of (for example, two) single wafer processing chambers SW1 and SW2. The two single wafer processing chambers SW1 and SW2 are arranged along a width direction Y that is perpendicular to the front-rear direction X along which the batch processing region R1 extends. Each single wafer processing chamber SW1 and SW2 processes a single substrate W in a horizontal position. The first single wafer processing chamber SW1 is arranged to the right X of the position change region R3. The second single wafer processing chamber SW2 is arranged to the right X of the first single wafer processing chamber SW1.

[0065] The single wafer processing chambers SW1, SW2 may be configured in multiple stages. For example, the six single wafer processing chambers SW1, SW2 may be arranged with two in the width direction Y (horizontal direction) and three in the vertical direction Z. The number of single wafer processing chambers is not limited to two or six.

[0066] For example, the first single-wafer processing chamber SW1 includes a rotation processing unit 45 and a nozzle 47. The rotation processing unit 45 includes a spin chuck that holds one substrate W in a horizontal position, and an electric motor that rotates the spin chuck around a vertical axis that passes through the center of the substrate W. The spin chuck may hold the lower surface of the substrate W by vacuum suction. The spin chuck may also include three or more chuck pins that grip the outer edge of the substrate W.

[0067] The nozzle 47 supplies a processing liquid to the substrate W held in the rotary processing unit 45. The nozzle 47 is moved between a standby position away from the rotary processing unit 45 and a supply position above the rotary processing unit 45. For example, deionized water (DIW) and IPA (isopropyl alcohol) are used as the processing liquid. The single wafer processing chamber SW1 may, for example, perform a cleaning process on the substrate W with deionized water and then form a liquid film of IPA on the upper surface of the substrate W.

[0068] The single wafer processing chamber SW2 performs a drying process using, for example, a supercritical fluid. Carbon dioxide, for example, is used as the fluid. The single wafer processing chamber SW2 includes a chamber main body (container) 48, a support tray, and a lid. The chamber main body 48 includes an internal processing space, an opening for inserting the substrate W into the processing space, a supply port, and an exhaust port. The substrate W is accommodated in the processing space while being supported by the support tray. The lid closes the opening of the chamber main body 48. For example, each single wafer processing chamber SW2 brings a fluid to a supercritical state and supplies the supercritical fluid to the processing space in the chamber main body 48 from the supply port. At this time, the processing space in the chamber main body 48 is exhausted from the exhaust port. The supercritical fluid supplied to the processing space performs a drying process on the substrate W.

[0069] The supercritical state is achieved by adjusting the fluid to its specific critical temperature and critical pressure. Specifically, when the fluid is carbon dioxide, the critical temperature is 31°C and the critical pressure is 7.38 MPa. By performing a drying process on the substrate W with a supercritical fluid, it is possible to prevent the pattern formed on the substrate W from collapsing.

[0070] <5. Control Unit> The substrate processing apparatus 1 includes a control unit 59 and a storage unit (not shown). The control unit 59 controls each component of the substrate processing apparatus 1. The control unit 59 includes one or more processors, such as a central processing unit (CPU). The storage unit includes at least one of a read-only memory (ROM), a random-access memory (RAM), and a hard disk. The storage unit stores computer programs required to control each component of the substrate processing apparatus 1.

[0071] <6. Second attitude conversion mechanism> Fig. 4(a) is a plan view of the second position changing mechanism 35. Fig. 4(b) is a front view of the second position changing mechanism 35. Fig. 5 is a front view for explaining two chucks (a horizontal holding part and a vertical holding part) of the position changing part.

[0072] The second position change mechanism 35 includes a substrate waiting area R31 and a position change execution area R32. The substrate waiting area R31 and the position change execution area R32 are arranged along the front-rear direction X in which the batch processing area R1 or the six batch processing tanks BT1 to BT6 extend.

[0073] The second position change mechanism 35 includes a lifter LF9 and a position change unit 63. The lifter LF9 is provided in the substrate waiting area R31. On the other hand, the position change execution area R32 is provided with the position change unit 63. Next, the lifter LF9 and the position change unit 63 will be described in detail.

[0074] <6-1. Lifter LF9> The lifter LF9 holds a plurality of (e.g., 50) substrates W transported by the transport mechanism WTR in a vertical position. The lifter LF9 includes a substrate holding part 65 and an elevating part 67 that raises and lowers the substrate holding part 65 in the vertical direction Z. The substrate holding part 65 corresponds to the substrate holding part of the present invention.

[0075] The substrate holding unit 65 holds, from below, for example, 50 substrates W arranged at a predetermined interval (for example, half pitch). The substrate holding unit 65 has, for example, three holding members 68 each extending in the Y direction. Each of the three holding members 68 has the same number of holding grooves 68A (50) as the number of substrates W to hold the 50 substrates W. The back of each holding groove 68A is formed in a V shape. The lifting unit 67 raises and lowers the substrate holding unit 65. The lifting unit 67 has, for example, an electric motor or an air cylinder.

[0076] The lifter LF9 (substrate holder 65) and the six batch processing tanks BT1 to BT6 are arranged linearly in the front-rear direction X so that the transport mechanism WTR can transport 50 substrates W in a linear manner.

[0077] <6-2. Posture conversion unit> The attitude changing unit 63 receives the substrates W from the substrate holding unit 65 and changes the attitude of the substrates W from vertical to horizontal. The attitude changing unit 63 includes two chucks 71, 72, two arms 75, 76, and an arm support unit 78. The arm support unit 78 corresponds to the support unit of the present invention.

[0078] The attitude changing unit 63 receives a plurality of substrates W (for example, 25 substrates) from the substrate holding unit 65 using the two chucks 71, 72 in the substrate waiting area R31, and changes the attitude of the plurality of substrates W from vertical to horizontal using the vertical rotation unit 94 in the attitude change execution area R32. A specific description will be given below.

[0079] The two chucks 71, 72 hold a plurality of (e.g., 25) substrates W. The first chuck 71 has a first horizontal holding portion 79 and a first vertical holding portion 80. The second chuck 72 has a second horizontal holding portion 81 and a second vertical holding portion 82. The two horizontal holding portions 79, 81 and the two vertical holding portions 80, 82 are each formed to extend in a direction in which the plurality of substrates W are aligned.

[0080] The two horizontal holding units 79, 81 accommodate two radially opposing side portions of each substrate W included in the plurality of substrates W. When the plurality of substrates W are in a horizontal position, the two horizontal holding units 79, 81 mount the plurality of substrates W at a predetermined interval (e.g., a half pitch). The two vertical holding units 80, 82 accommodate two side portions of each substrate W included in the plurality of substrates W. When the plurality of substrates W are in a vertical position, the two vertical holding units 80, 82 are provided below the horizontal holding units. When the plurality of substrates W are in a vertical position, the two vertical holding units 80, 82 hold the plurality of substrates W in a vertical position. When the plurality of substrates W held by the two vertical holding units 80, 82 are in a vertical position, the two horizontal holding units 79, 81 are arranged in the horizontal direction XY while sandwiching the plurality of substrates W. Similarly, when the substrates W are in a vertical position, the two vertical holders 80, 82 are arranged in the horizontal direction XY while sandwiching a plurality of substrates W therebetween.

[0081] See Figure 5. The two horizontal holders 79, 81 are provided with multiple pairs (e.g., 50 pairs) of horizontal placement guide grooves 85, 86. 50 first horizontal placement guide grooves 85 are provided in the horizontal holder 79. 50 second horizontal placement guide grooves 86 are provided in the horizontal holder 81. For example, the two horizontal placement guide grooves 85A, 86A are arranged opposite each other. When multiple substrates W are in a vertical position, each of the multiple pairs of horizontal placement guide grooves 85, 86 has the same function as the passage grooves 91, 92 described below.

[0082] Furthermore, the two horizontal holding portions 79, 81 may have, for example, 25 pairs of horizontal placement guide grooves 85, 86. Furthermore, the number of pairs of horizontal placement guide grooves 85, 86 is not limited to 50 pairs or 25 pairs. The number of pairs of holding grooves 89, 90 and passing grooves 91, 92, which will be described later, is also not limited to 25 pairs.

[0083] The two vertical holding units 80, 82 have multiple pairs (e.g., 25 pairs) of holding grooves 89, 90 and multiple pairs (25 pairs) of passing grooves 91, 92. Each of the multiple pairs of holding grooves 89, 90 holds one substrate W. Each of the multiple pairs of passing grooves 91, 92 allows one substrate W to pass through, and the multiple pairs of holding grooves 89, 90 and the multiple pairs of passing grooves 91, 92 are arranged alternately, one pair at a time. The two holding grooves 89A, 90A are arranged opposite each other.

[0084] Twenty-five holding grooves 89 and 25 passing grooves 91 are provided in the first vertical holding part 80. The 25 holding grooves 89 and the 25 passing grooves 91 are arranged alternately one by one. Twenty-five holding grooves 90 and 25 passing grooves 92 are provided in the second vertical holding part 82. The 25 holding grooves 90 and the 25 passing grooves 92 are arranged alternately one by one. The inner part of each of the holding grooves 89, 90 is formed with a V-shaped cross section. Therefore, each of the holding grooves 89, 90 can hold one substrate W in a vertical position. This prevents one substrate W from tipping over onto an adjacent substrate W.

[0085] As shown in Fig. 4(b), the first arm 75 supports a first horizontal holding portion 79 and a first vertical holding portion 80. The second arm 76 supports a second horizontal holding portion 81 and a second vertical holding portion 82. The arm support portion 78 supports the upper end portion (base end portion) of each of the two arms 75, 76. The arm support portion 78 and the two arms 75, 76 are formed in a C-shape or a U-shape.

[0086] The arm support portion 78 is disposed on the opposite side of the two vertical holding portions 80, 82 via the two horizontal holding portions 79, 81. Therefore, the arm support portion 78 etc. supports the two horizontal holding portions 79, 81 and the two vertical holding portions 80, 82 from the opposite side of the two vertical holding portions 80, 82 via the two horizontal holding portions 79, 81.

[0087] 5, the two horizontal holders 79, 81 are configured to open and close in the horizontal direction. That is, the attitude conversion unit 63 includes an opening / closing unit 87 (see FIG. 4). The opening / closing unit 87 includes, for example, an electric motor or an air cylinder. The opening / closing unit 87 moves the two vertical holders 80, 82 linearly between a holding position PP2 where the spacing between the two vertical holders 80, 82 is narrowed to hold the substrate W with the two vertical holders 80, 82, and a passing position PP3 where the spacing between the two vertical holders 80, 82 is widened to allow each substrate W to pass between the two vertical holders 80, 82.

[0088] When the two vertical holders 80, 82 are in the holding position PP2, they are in a closed state. For example, when multiple substrates W are in a vertical position, the distance between the two vertical holders 80, 82 is narrowed. When the two vertical holders 80, 82 are moved to the holding position PP2 by the opening / closing unit 87, they hold multiple substrates W in a vertical position held by the substrate holder 65, and the two horizontal holders 79, 81 accommodate the multiple substrates W held by the two vertical holders 80, 82. When the two vertical holders 80, 82 are in the passing position PP3, they are in an open state. For example, when the vertical rotation unit 94, described later, rotates the orientation of the substrates W from vertical to horizontal, the opening / closing unit 87 moves the two vertical holders 80, 82 to the passing position PP3. That is, when multiple substrates W are in a horizontal position, the distance between the two vertical holders 80, 82 is widened.

[0089] The attitude conversion unit 63 also includes a horizontal rotation unit 93, a vertical rotation unit 94, a horizontal movement unit 95, a rotation shaft 97, and a vertical arm 98. The horizontal rotation unit 93 rotatably supports the arm support unit 78. When the two vertical holders 80, 82 hold the substrate W in a vertical attitude, the horizontal rotation unit 93 rotates the two chucks 71, 72, the arm support unit 78, etc. around a rotation axis (vertical axis) AX4 that is perpendicular to the direction in which the substrate W is aligned. The horizontal rotation unit 93 and the vertical rotation unit 94 each include, for example, an electric motor.

[0090] The tip end of the rotating shaft 97 is connected to the horizontal rotation unit 93. The base end of the rotating shaft 97 is rotatably coupled to the vertical rotation unit 94. The rotating shaft 97 extends horizontally (in the front-to-rear direction X). Therefore, the central axis of the rotating shaft 97 is the horizontal axis AX5. The horizontal axis (central axis) AX5 is located at a position higher than the substrate W in a vertical position held by the two vertical holding units 80, 82. The vertical rotation unit 94 rotates the two chucks 71, 72, the arm support unit 78, etc. around the horizontal axis AX5 to rotate the position of the substrate W from vertical to horizontal. The vertical rotation unit 94 is supported by the lower end of the vertical arm 98.

[0091] The horizontal movement unit 95 horizontally moves the two chucks 71, 72, the arm support unit 78, the opening / closing unit 87, the horizontal rotation unit 93, and the vertical rotation unit 94. The horizontal movement unit 95 also moves the arm support unit 78 and the vertical rotation unit 94 horizontally across a substrate waiting area R31 in which the substrate holding unit 65 is arranged, and a posture change execution area R32 for changing a plurality of substrates W from a vertical posture to a horizontal posture.

[0092] The horizontal moving unit 95 is provided at a position higher than each of the vertically oriented substrates W held by the two vertical holding units 80, 82. This causes the two chucks 71, 72 to be suspended. This prevents droplets adhering to the substrates W from falling and contaminating the moving unit and the rotating unit. This prevents the moving unit and the rotating unit from breaking down due to contamination by droplets.

[0093] The horizontal moving unit 95 includes an X-direction moving unit 101 and a Y-direction moving unit 102. The X-direction moving unit 101 moves the two chucks 71, 72, the arm support unit 78, etc. along the front-rear direction X. The Y-direction moving unit 102 moves the two chucks 71, 72, the arm support unit 78, etc. along the width direction Y. Each of the two moving units 101, 102 includes a linear actuator having an electric motor. In FIG. 4( a), the upper end of the vertical arm 98 is movably connected to the Y-direction moving unit 102. The Y-direction moving unit 102 moves the vertical arm 98 along the width direction Y. The horizontal moving unit corresponds to the moving unit of the present invention.

[0094] <6. Operational Description> Next, the operation of the substrate processing apparatus 1 will be described with reference to the flowcharts of Figures 6 and 7. See Figure 1. An external transfer robot (not shown) transfers two carriers C to the load port 9 in turn.

[0095] [Step S01] Transferring substrates from carriers The carrier transport mechanism 11 in the stocker block 3 transports the first carrier C from the load port 9 to the shelf 13A. The substrate handling mechanism HTR in the transfer block 5 takes out 25 substrates W1 in a horizontal position from the first carrier C placed on the shelf 13A and transports them to the attitude conversion unit 23. The carrier transport mechanism 11 then transports the empty first carrier C to the shelf 13B. The carrier transport mechanism 11 then transports the second carrier C from the load port 9 to the shelf 13A. The substrate handling mechanism HTR takes out 25 substrates W2 in a horizontal position from the second carrier C placed on the shelf 13A and transports them to the attitude conversion unit 23.

[0096] [Step S02] Transformation to vertical posture Fifty substrates W (W1, W2) on two carriers C are transported to the attitude conversion unit 23. As shown in Figures 3(a) to 3(f), the attitude conversion unit 23 and pusher mechanism 25 align the 50 substrates W face-to-face at a half pitch (5 mm) and convert the attitude of the 50 substrates W from a horizontal attitude to a vertical attitude. The pusher mechanism 25 transports the 50 substrates W in a vertical attitude to a substrate transfer position PP defined in the transfer block 5.

[0097] [Step S03] Chemical treatment (batch treatment) The transport mechanism WTR receives 50 substrates W in a vertical position from the pusher mechanism 25 at the substrate transfer position PP, and transports the 50 substrates W to any of the four lifters LF1 to LF4 of the four chemical solution processing tanks BT1 to BT4. When the transport mechanism WTR passes through the position change region R3, the transport mechanism WTR passes, for example, above the second position change mechanism 35 so as not to interfere with the second position change mechanism 35.

[0098] For example, the transport mechanism WTR transports 50 substrates W to the lifter LF1 of the chemical liquid treatment tank BT1. The lifter LF1 receives the 50 substrates W at a position above the chemical liquid treatment tank BT1. The lifter LF1 immerses the 50 substrates W in phosphoric acid, which serves as the treatment liquid in the chemical liquid treatment tank BT1. This allows the 50 substrates W to be etched. After the etching process, the lifter LF1 lifts the 50 substrates W out of the phosphoric acid in the chemical liquid treatment tank BT1. Note that when the 50 substrates W are transported to the lifters LF2 to LF4 of the other chemical liquid treatment tanks BT2 to BT4, the same treatment as in the chemical liquid treatment tank BT1 is performed.

[0099] [Step S04] Pure water cleaning process (batch processing) The transport mechanism WTR receives 50 substrates W in a vertical position from, for example, the lifter LF1 (or lifter LF2), and transports the 50 substrates W to the lifter LF5 in the water-rinsing processing tank BT5. The lifter LF5 receives the 50 substrates W at a position above the water-rinsing processing tank BT5. The lifter LF5 immerses the 50 substrates W in the pure water in the water-rinsing processing tank BT5. This causes the 50 substrates W to undergo a cleaning process.

[0100] When the transport mechanism WTR receives 50 vertically oriented substrates W from one of the lifters LF3 and LF4, the transport mechanism WTR transports the 50 substrates W to the lifter LF6 in the water-rinsing processing tank BT6. The lifter LF6 receives the 50 substrates W at a position above the water-rinsing processing tank BT6. The lifter LF6 immerses the 50 substrates W in the pure water in the water-rinsing processing tank BT6.

[0101] [Step S05] Transform to horizontal position The second attitude change mechanism 35 changes the attitude of the substrates W that have been cleaned from vertical to horizontal. However, there is the following problem: If the attitudes of 50 substrates W arranged at half pitch (5 mm intervals) are changed all at once, there is a possibility that each hand 37A, 37B of the center robot CR may not be able to properly enter the gap between two adjacent substrates W among the 50 substrates W.

[0102] Furthermore, when the substrates W are aligned face-to-face, some of the substrates W converted to a horizontal position have their device surfaces facing upward, while others have their device surfaces facing downward. For example, it is undesirable for the hands 37A, 37B of the center robot CR to come into contact with the device surfaces of the substrates W. It is also undesirable for substrates W with device surfaces facing different directions to be transported to the single-wafer processing chambers SW1, SW2.

[0103] Therefore, in this embodiment, the distance between two adjacent substrates W is widened and the device surfaces of 50 substrates W are aligned with one another. This will be specifically described with reference to the flowchart in Fig. 7, Fig. 1, and Figs. 8(a) to 11(c).

[0104] 8(a) to 8(c) and 10(a) to 10(c) are front views of the second position change mechanism 35. FIGS. 9(a) to 9(c) and 11(a) to 11(c) are plan views of the second position change mechanism 35. For example, FIG. 9(a) corresponds to FIG. 8(a). Also, FIG. 11(b) corresponds to FIG. 10(b).

[0105] [Step S11] Transferring the substrate to the lifter LF9 See Figure 1. The transport mechanism WTR transports 50 substrates W from one of the lifters LF5 and LF6 to the substrate holders 65 of the lifter LF9 of the second position change mechanism 35. The substrate holders 65 of the lifter LF9 hold the 50 substrates W in a vertical position arranged at a half pitch and in a face-to-face manner. The 50 substrates W are aligned along the width direction Y.

[0106] [Step S12] Move the posture change unit to the substrate waiting area 8(a) and 9(a). When 50 substrates W in a vertical position are held by the substrate holding unit 65, the horizontal movement unit 95 (mainly the X-direction movement unit 101) of the position change unit 63 moves the two chucks 71, 72, the arm support unit 78, etc. from the position change execution region R32 to above the substrate holding unit 65 in the substrate waiting region R31. In addition, the Y-direction movement unit 102 of the horizontal movement unit 95 moves the two chucks 71, 72, the arm support unit 78, etc. to a first substrate holding position. The first substrate holding position is a position where the 25 pairs of holding grooves 89, 90 can hold the 25 substrates W1 of the first substrate group.

[0107] Furthermore, the opening / closing section 87 of the attitude change section 63 moves the two vertical holding sections 80, 82 horizontally in directions away from each other to open them (see passage position PP3 in FIG. 5).

[0108] [Step S13] Receipt of the first group of substrates by the attitude change unit When the two vertical holding parts 80, 82 are moved to holding position PP2 by the opening / closing part 87, they hold a first group of divided substrates (25 substrates W1) arranged in a row out of every other one of the 50 substrates W in a vertical position held by the substrate holding part 65 in the 25 pairs of holding grooves 89, 90, and the two horizontal holding parts 79, 81 accommodate the first group of divided substrates (25 substrates W1).

[0109] The substrate holding part 65 is in a state where it holds 50 substrates W (W1, W2) in a vertical position. The lifting part 67 of the lifter LF9 raises the substrate holding part 65 to an upper position where the substrates W can be delivered. At this time, the 50 substrates W pass between the two vertical holding parts 80, 82 and fit into the 50 pairs of horizontal placement guide grooves 85, 86 of the two horizontal holding parts 79, 81, respectively.

[0110] Thereafter, the opening / closing unit 87 moves the two vertical holding units 80, 82 horizontally in a direction that brings them closer to each other, thereby closing them (see holding position PP2 in FIG. 5). As a result, the 50 substrates W held in a vertical position by the substrate holding unit 65 are accommodated in 25 pairs of holding grooves 89, 90 and 25 pairs of passing grooves 91, 92, which are arranged alternately, as shown in the two frames at the bottom of FIG. 5.

[0111] Thereafter, the lifting section 67 of the lifter LF9 lowers the substrate holding section 65 to the lower standby position. As a result, the 25 substrates W1 of the first substrate group are transferred to the attitude changing section 63, while the 25 substrates W2 of the second substrate group are left on the substrate holding section 65. That is, the attitude changing section 63 holds and removes the 25 substrates W1 of the first substrate group, which are aligned every other one of the 50 substrates W, from the substrate holding section 65 by using the 25 pairs of holding grooves 89, 90. The multiple substrates W1 of the first substrate group correspond to the first divided substrate group of the present invention. The multiple substrates W2 of the second substrate group are referred to as the second divided substrate group.

[0112] The 25 substrates W1 that have been removed every other substrate are aligned at full pitch. The 25 substrates W2 left in the substrate holding unit 65 are also arranged at full pitch. The 25 substrates W2 left in the substrate holding unit 65 are in a standby state.

[0113] [Step S14] Move to the posture change execution area 8(b) and 9(b), the horizontal movement unit 95 (X-direction movement unit 101 and Y-direction movement unit 102) moves the two chucks 71, 72, the arm support unit 78, etc. from above the substrate holding unit 65 in the substrate waiting area R31 to predetermined positions in the attitude change execution area R32, with the 25 substrates W1 held by the two vertical holding units 80, 82. That is, the attitude change unit 63 transports the 25 substrates W1 of the first substrate group in a vertical attitude to the attitude change execution area R32.

[0114] [Step S15] Horizontal posture change of the first substrate group by the posture change unit 8(c) and 9(c). Then, in the posture change execution region R32, the posture change unit 63 changes the postures of the extracted 25 substrates W1 to horizontal postures. Specifically, the vertical rotation unit 94 of the posture change unit 63 rotates the substrates W1, the two chucks 71, 72, and the arm support unit 78 by 90 degrees around the horizontal axis AX5 so that the two vertical holding units 80, 82 face the center robot CR (see FIG. 1).

[0115] In this state, the center robot CR cannot remove the substrate W1 from the posture conversion unit 63. Therefore, the opening / closing unit 87 of the posture conversion unit 63 horizontally moves the two vertical holders 80, 82 away from each other to open them. That is, when the 25 substrates W converted to a horizontal posture are placed on the two horizontal holders 79, 81, the opening / closing unit 87 moves the two vertical holders 80, 82 to the passing position PP3. This allows the substrate W1 to pass between the two vertical holders 80, 82. The 25 substrates W1 are also placed in the 25 horizontal placement guide grooves 85, 86, respectively. Because the 25 substrates W1 are aligned at full pitch, the center robot CR can easily remove the substrates W.

[0116] Thereafter, the center robot CR uses two hands 37A, 37B to pass between the two vertical holding parts 80, 82 that have been moved to the passing position PP3, and picks up the substrates W1 one by one from the 25 substrates W1 in the horizontal position, and transports the picked-up substrates W1 to the single-wafer processing chamber SW1.

[0117] [Step S16] Move the posture change unit to the substrate waiting area 10(a) and 11(a). After all 25 substrates W1 have been transported from the attitude changing unit 63, the horizontal moving unit 95 (mainly the X-direction moving unit 101) moves the two chucks 71, 72, the arm support unit 78, etc. from the attitude changing execution region R32 to above the substrate holding unit 65 in the substrate waiting region R31. In addition, the Y-direction moving unit 102 of the horizontal moving unit 95 moves the two chucks 71, 72, the arm support unit 78, etc. to a second substrate holding position. The second substrate holding position is a position where the 25 pairs of holding grooves 89, 90 can hold the 25 substrates W2 of the second substrate group.

[0118] Furthermore, the opening / closing section 87 of the attitude change section 63 moves the two vertical holding sections 80, 82 horizontally in directions away from each other to open them (see passage position PP3 in FIG. 5).

[0119] [Step S17] Receipt of the second group of substrates by the attitude change unit The substrate holding part 65 is in a state where it holds the 25 substrates W2 of the second substrate group in a vertical position. The lifting part 67 of the lifter LF9 raises the substrate holding part 65 to an upper position where the substrates W2 can be handed over. At this time, the 25 substrates W2 pass between the two vertical holding parts 80, 82 and fit into 25 pairs of horizontal placement guide grooves 85, 86 out of the 50 pairs of horizontal placement guide grooves 85, 86.

[0120] Thereafter, the opening / closing unit 87 moves the two vertical holding units 80, 82 horizontally in a direction that brings them closer to each other, bringing them into a closed state (see holding position PP2 in FIG. 5). As a result, the 25 substrates W2 held in a vertical position by the substrate holding unit 65 are accommodated in the 25 pairs of holding grooves 89, 90.

[0121] Thereafter, the lifting section 67 of the lifter LF9 lowers the substrate holding section 65 to the lower standby position. As a result, the 25 substrates W2 of the second substrate group are handed over to the attitude changing section 63. That is, the attitude changing section 63 receives the 25 substrates W2 of the second substrate group from the substrate holding section 65 by holding them in the 25 pairs of holding grooves 89, 90.

[0122] [Step S18] Move to the posture change execution area 10(b) and 11(b), the horizontal movement unit 95 (X-direction movement unit 101 and Y-direction movement unit 102) moves the two chucks 71, 72, the arm support unit 78, etc. from above the substrate holding unit 65 in the substrate waiting area R31 to predetermined positions in the attitude change execution area R32, with the 25 substrates W2 held by the two vertical holding units 80, 82. In other words, the attitude change unit 63 transports the 25 substrates W2 in vertical attitudes to the attitude change execution area R32.

[0123] [Step S19] Rotate the second substrate group 180 degrees by the horizontal rotation unit Furthermore, in the attitude change execution region R32, the horizontal rotation unit 93 of the attitude change unit 63 rotates the vertically oriented substrate W2, arm support unit 78, etc. by 180 degrees around the rotation axis AX4. As a result, the orientation of the device surface indicated by the arrow AR is rotated 180 degrees from left Y to right Y. Therefore, when the attitude is changed to horizontal, the device surface of each substrate W2 can be oriented upward.

[0124] [Step S20] Horizontal posture change of the second substrate group by the posture change unit 10(c) and 11(c). Then, the attitude conversion unit 63 converts the attitudes of the 25 substrates W2 it holds into a horizontal attitude. Specifically, the vertical rotation unit 94 of the attitude conversion unit 63 rotates the substrates W2, the two chucks 71, 72, and the arm support unit 78 by 90 degrees around the horizontal axis AX5 so that the two vertical holding units 80, 82 face the center robot CR (see FIG. 1).

[0125] Thereafter, the opening / closing unit 87 of the attitude conversion unit 63 horizontally moves the two vertical holding units 80, 82 away from each other to open them (see passage position PP3 in FIG. 5). This allows the substrates W2 to pass between the two vertical holding units 80, 82. The 25 substrates W2 are placed in the 25 horizontal guide grooves 85, 86, respectively.

[0126] Thereafter, the center robot CR uses two hands 37A, 37B to pass between the two vertical holding parts 80, 82 that have been moved to the passing position PP3, and removes the substrates W2 one by one from the 25 substrates W2 in the horizontal position, and transports the removed substrates W2 to the single-wafer processing chamber SW1.

[0127] [Step S06] First single wafer processing Returning to the explanation of the flowchart in Fig. 6, for example, the center robot CR transports the substrates W (W1, W2) one by one from the attitude conversion unit 63 to the first single-wafer processing chamber SW1. The first single-wafer processing chamber SW1 supplies pure water to the device surface from the nozzle 47 while rotating the substrate W with the device surface facing upward by, for example, the rotation processing unit 45. Thereafter, the first single-wafer processing chamber SW1 supplies IPA from the nozzle 47 to the device surface (upper surface) of the substrate W to replace the pure water on the substrate W with IPA.

[0128] [Step S07] Second Single-Wafer Processing (Drying Processing) Thereafter, the center robot CR removes the substrate W wetted with IPA from the first single-wafer processing chamber SW1 and transfers the substrate W to the second single-wafer processing chamber SW2. The second single-wafer processing chamber SW2 performs a drying process on the substrate W using carbon dioxide in a supercritical state (supercritical fluid). The drying process using the supercritical fluid prevents pattern collapse on the pattern surface (device surface) of the substrate W.

[0129] [Step S08] Transferring substrates from the buffer unit to the carrier The center robot CR transports the dried substrates W from the second single-wafer processing chamber SW2 to one of the loading shelves in the buffer unit 27. When one lot (25 substrates) of substrates W1 have been transported to the buffer unit 27, the substrate handling mechanism HTR transports all 25 substrates W1 from the buffer unit 27 into an empty first carrier C placed on the shelf 13A. Thereafter, the carrier transport mechanism 11 in the stocker block 3 transports the first carrier C to the load port 9.

[0130] Furthermore, when one lot of substrates W2 is placed in the buffer section 27, the substrate handling mechanism HTR transports all 25 substrates W2 from the buffer section 27 into an empty second carrier C placed on the shelf 13A. Thereafter, the carrier transport mechanism 11 in the stocker block 3 transports the second carrier C to the load port 9. An external transport robot (not shown) transports the two carriers C in turn to their next destinations.

[0131] According to this embodiment, the second position changing mechanism 35 includes a substrate holding unit 65 and a position changing unit 63. The horizontal movement unit 95 of the position changing unit 63 can move the arm support unit 78 that supports the two horizontal holding units 79, 81 and the two vertical holding units 80, 82. Furthermore, the vertical rotation unit 94 of the position changing unit 63 rotates the arm support unit 78 about the horizontal axis AX5. Therefore, the position changing unit 63 can move itself to change the position of the substrate W that it receives.

[0132] Furthermore, in order to convert the substrate W from a vertical position to a horizontal position, the vertical rotation unit 94 rotates the arm support unit 78 about the horizontal axis AX5 so that the two vertical holding units 80, 82 face the center robot CR. Thereafter, the opening / closing unit 87 moves the two vertical holding units 80, 82 to the passing position PP3. This allows the center robot CR to transport the substrate W from the side of the two vertical holding units 80, 82.

[0133] The attitude changing unit 63 also includes a horizontal rotation unit 93 that rotates the arm support unit 78 around a rotation axis AX4 that extends in a direction perpendicular to the alignment direction of the multiple substrates W (for example, the width direction Y) and perpendicular to the horizontal axis AX5. The horizontal movement unit 95 moves the arm support unit 78, the horizontal rotation unit 93, the vertical rotation unit 94, etc. in the horizontal direction. The orientation of the substrate W can be changed at any timing after the attitude changing unit 63 receives the substrate W from the substrate holding unit 65.

[0134] The two vertical holding units 80, 82 also have multiple pairs of holding grooves 89, 90 that each hold one substrate W, and multiple pairs of passing grooves 91, 92 that each allow one substrate W to pass through. The multiple pairs of holding grooves 89, 90 and the multiple pairs of passing grooves 91, 92 are arranged alternately. When the two vertical holding units 80, 82 are moved to holding position PP2 by the opening / closing unit 87, the 25 pairs of holding grooves 89, 90 hold the first divided substrate group (25 substrates W1) that is aligned every other substrate out of the 50 substrates W in a vertical position held by the substrate holding unit 65, and the two horizontal holding units 79, 81 accommodate the first divided substrate group (25 substrates W1). The two vertical holding units 80, 82 hold the first group of divided substrates (25 substrates W1) in which every other substrate out of the 50 substrates W is aligned, thereby widening the gap between two adjacent substrates W. This allows the center robot CR to easily remove the substrates W from the posture conversion unit 63.

[0135] Furthermore, the horizontal movement unit 95 is provided at a position higher than the 25 substrates W1 (W2) in a vertical position held by the two vertical holding units 80, 82. This prevents droplets from falling from the wet substrates W1 (W2) from contaminating the driving parts of the position conversion unit 63, including the horizontal movement unit 95. For example, this prevents the driving parts from breaking down due to contamination.

[0136] Furthermore, the horizontal axis AX5 is provided at a position higher than the 25 substrates W1 (W2) in a vertical position held by the two vertical holding parts 80, 82, and the arm support part 78 supports the two horizontal holding parts 79, 81 and the two vertical holding parts 80, 82 from the opposite side of the two vertical holding parts 80, 82 via the two horizontal holding parts 79, 81. This allows the substrates W held by the two vertical holding parts 80, 82, etc. to be brought closer to the center robot CR when the vertical rotation part 94 rotates the arm support part 78 around the horizontal axis AX5.

[0137] The orientation change region R3 (including the second orientation change mechanism 35) is provided between the transfer block 5 and the batch processing region R1. The single substrate transfer region R4 is adjacent to the transfer block 5 and the orientation change region R3. The single substrate processing region R5 (including multiple single substrate processing chambers SW1 and SW2) is adjacent to the single substrate transfer region R4. The horizontal XY position of the lifting platform 41 of the center robot CR provided in the single substrate transfer region R4 is fixed. Therefore, the transfer block 5, the second orientation change mechanism 35, and multiple single substrate processing chambers SW1 and SW2 can be arranged around the center robot CR. This, for example, shortens the transport distance of substrates W by the center robot CR, allowing for efficient substrate transport. The transport mechanism WTR can transport multiple substrates W collectively between the substrate transfer position PP in the transfer block 5, the six batch processing tanks BT1 to BT6, and the second orientation change mechanism 35. As a result, throughput can be improved. Example 2

[0138] Next, a second embodiment of the present invention will be described with reference to the drawings. Note that descriptions that overlap with those of the first embodiment will be omitted. Fig. 12(a) is a plan view showing a second attitude changing mechanism 35 according to the second embodiment. Fig. 12(b) is a front view of Fig. 12(a).

[0139] In the first embodiment, the second position change mechanism 35 includes the lifter LF9 and the position change unit 63 having the horizontal rotation unit 93. In contrast, the second position change mechanism 35 of the second embodiment includes a pusher mechanism 105 and the position change unit 63 without the horizontal rotation unit 93.

[0140] The pusher mechanism 105 holds a plurality of substrates W (e.g., 50 substrates) transported by the transport mechanism WTR in a vertical position. The pusher mechanism 105 includes a pusher 107 and an elevation rotation unit 109. The pusher 107 corresponds to the substrate holding unit of the present invention. The elevation rotation unit 109 corresponds to the second horizontal rotation unit of the present invention.

[0141] The pusher 107 holds, from below, for example, 50 substrates W arranged at a predetermined interval (for example, a half pitch). In order to hold the 50 substrates W, the pusher 107 has holding grooves (not shown) the same number as the number of substrates W (50). The back of each holding groove of the pusher 107 is formed in a V shape. The lifting and rotating unit 109 lifts and lowers the pusher 107 and rotates the pusher 107 around a vertical axis AX6. The lifting and rotating unit 109 has, for example, one or more electric motors.

[0142] 12(b), the attitude conversion unit 63 of the second embodiment does not include the horizontal rotation unit 93 shown in FIG. 4(b). Therefore, the tip of the rotation shaft 97 is fixed to the arm support unit 78.

[0143] Next, the operation of the second position change mechanism 35 of the second embodiment will be described with reference to the flowchart of Fig. 7. The operation of the second position change mechanism 35 is basically performed as shown in the flowchart of Fig. 7. However, because the second position change mechanism 35 of the second embodiment does not include a horizontal rotation unit 93, step S19 shown in Fig. 7 is not performed. Instead, the pusher mechanism 105 rotates the 25 substrates W2 of the second substrate group around the vertical axis AX6.

[0144] In step S13 of Figure 7, the posture conversion unit 63 removes 25 substrates W1, which are aligned every other one of the 50 substrates W, from the substrate holding unit 65 by holding them with two vertical holding units 80, 82 (25 pairs of holding grooves 89, 90).

[0145] Then, the lifting and rotating unit 109 of the pusher mechanism 105 rotates the 25 substrates W2 held by the pusher 107 by 180 degrees around the vertical axis AX6. This allows the device surfaces of the substrates W2 in the second substrate group to face upward, similar to the substrates W1 in the first substrate group, when the orientation of the substrates W2 is changed. Furthermore, the vertical axis AX6 is set at the center of the 50 substrates W held by the pusher 107 in a plan view. Therefore, the 180-degree rotation shifts the position of the substrate W2 by a half pitch in the alignment direction of the substrates W. Therefore, the two vertical holding units 80 and 82 can hold the substrates W1 in the second substrate group at the same position as the first substrate holding position where the 25 pairs of holding grooves 89 and 90 can hold the substrates W1 in the first substrate group. The horizontal moving unit 95 may also move the two vertical holding units 80 and 82 to each of the first substrate holding position and the second substrate holding position.

[0146] Thereafter, in step S17 of Fig. 7, the attitude changing part 63 holds and transports the 25 substrates W2 that have been rotated by 180 degrees. Note that in Example 2, step S19 of Fig. 7 is not performed.

[0147] According to this embodiment, the lifting and rotating unit 109 of the pusher mechanism 105 rotates the pusher 107 around the vertical axis AX6. Therefore, the attitude changing unit 63 does not need to be equipped with the horizontal rotating unit 93 of the first embodiment, and the orientation of the substrate W can be changed on the pusher 107 side, so the configuration of the attitude changing unit 63 can be simplified. Example 3

[0148] Next, a third embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first and second embodiments will be omitted. Fig. 13(a) is a vertical cross-sectional view showing a lifter LF9 of a second position change mechanism 35 according to the third embodiment. Fig. 13(b) is a side view showing a position change unit 63 of the second position change mechanism 35 according to the third embodiment.

[0149] 13(a). The lifter LF9 of the second position change mechanism 35 of the third embodiment includes a standby tank 112 for storing liquid, and two ejection pipes 114 for supplying the liquid, such as deionized water (DIW), to the standby tank 112, so that the substrates W held by the substrate holders 65 are immersed in the liquid when the substrate holders 65 are lowered. The ejection pipes 114 are formed to extend linearly in the front-rear direction X or the width direction Y. The ejection pipes 114 include a plurality of ejection ports 114A (holder nozzles) in the direction in which the ejection pipes 114 extend. Each of the plurality of ejection ports 114A ejects deionized water. The standby tank 112 stores the deionized water ejected by the ejection pipes 114.

[0150] For example, as shown in FIG. 8(c), when the posture change section 63 is changing the posture of the substrate W1, the waiting substrate W2 can be immersed in pure water in the waiting tank 112, thereby preventing the substrate W2 from drying out.

[0151] The standby tank 112 does not have to store pure water. In this case, the nozzle 114A of the jet pipe 114 may supply pure water in the form of a shower or mist to the substrate W held by the substrate holder 65. The nozzle 114A (jet pipe 114) may be positioned higher than the substrate W, as shown by the dashed line in Figure 13(a). When pure water is supplied to the substrate W in the form of a shower or mist, the standby tank 112 may or may not be provided.

[0152] 13(b), the second position changing mechanism 35 includes a nozzle 116. The nozzle 116 supplies liquid, such as deionized water (DIW), in the form of a shower or mist onto the substrate W held by the vertical holders 80, 82 of the position changing unit 63. The nozzle 116 is provided at a position higher than the substrate W. The nozzle 116 may be configured to be movable so as not to interfere with the position changing unit 63.

[0153] For example, the vertical rotation unit 94 sets the orientation of the substrate W held by the vertical holding units 80, 82 to one of a vertical orientation and an oblique orientation. In this state, the nozzle 116 supplies pure water in the form of a shower or mist to the substrate W held by the vertical holding units 80, 82. The oblique orientation is an orientation in which the device surface of the substrate faces upward.

[0154] For example, when the center robot CR suspends the transport of the substrate W, the substrate W held by the attitude changing unit 63 can be prevented from drying out. Also, if the attitude of the substrate W is horizontal during supply, the shower or mist of pure water is unlikely to reach the entire device surface. However, by changing the attitude of the substrate W to either a vertical attitude or an oblique attitude with the device surface facing upward, the shower or mist of pure water can more easily reach the entire device surface.

[0155] The substrate processing apparatus 1 may employ both the configuration shown in Fig. 13(a) and the configuration shown in Fig. 13(b). Also, the substrate processing apparatus 1 may employ only one of the configuration shown in Fig. 13(a) and the configuration shown in Fig. 13(b). The nozzle 116 corresponds to the nozzle for the attitude changing unit of the present invention.

[0156] If the substrate W dries before the drying process in the single wafer processing chamber SW2, the pattern on the substrate W will collapse. However, according to this embodiment, the substrate W held by the pusher 107 can be prevented from drying. Furthermore, the substrate W held by the two vertical holders 80, 82 of the attitude changing unit 63 can be prevented from drying.

[0157] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0158] (1) In the above-described embodiments, for example, in FIG. 1, the substrate waiting area R31 of the second position change mechanism 35 is adjacent to the batch processing area R1, and the position change execution area R32 is adjacent to the transfer block 5. That is, the substrate waiting area R31 and the position change execution area R32 of the second position change mechanism 35 are arranged in the front-rear direction X. However, as shown in FIG. 14, the substrate waiting area R31 and the position change execution area R32 may be arranged in the width direction Y.

[0159] In this case, the attitude change execution area R32 is located to the left Y of the single substrate transport area R4. The substrate waiting area R31 is located to the left Y of the attitude change execution area R32.

[0160] (2) In the above-described embodiments and modifications, each batch processing vessel BT1 to BT6 processed 50 substrates W arranged face-to-face at a half pitch. However, each batch processing vessel BT1 to BT6 may also process substrates W arranged face-to-back, in which the device surfaces of all substrates W face the same direction. Each batch processing vessel BT1 to BT6 may also process 25 substrates W, corresponding to one carrier C arranged at a full pitch. When 50 substrates W are arranged face-to-back in FIG. 11(b), the Y-direction moving unit 102 moves the two chucks 71 and 72 in the forward / backward direction X in which the substrates W are aligned. That is, the Y-direction moving unit 102 moves the two chucks 71 and 72 between the first substrate holding position and the second substrate holding position. This allows the attitude changing unit 63 to extract 25 substrates W1 or 25 substrates W2.

[0161] (3) In the above-described embodiments and modifications, the single wafer processing chamber SW2 uses a supercritical fluid to dry the substrate W. In this regard, the single wafer processing chamber SW2 may include a rotation processing unit 45 and a nozzle 47, similar to the single wafer processing chamber SW1. In this case, each of the single wafer processing chambers SW1 and SW2 supplies, for example, pure water and IPA to the substrate W in this order, and then performs a drying process (spin drying) on ​​the substrate W.

[0162] (4) In the above-described embodiments and modifications, for example, in step S13, when the attitude changing unit 63 receives the substrate W from the substrate holding unit 65, the lifting unit 67, which serves as a relative lifting unit, lifts and lowers the substrate holding unit 65. In this regard, the attitude changing unit 63 may be provided with a lifting unit and lift and lower the two chucks 71, 72, the arm support unit 78, etc., to receive the substrate W from the substrate holding unit 65. Note that when the attitude changing unit 63 receives the substrate W from the substrate holding unit 65, both the lifting unit of the attitude changing unit 63 and the lifting unit 67 may be lifted and lowered.

[0163] (5) In the above-described embodiments and modifications, the opening / closing unit 87 moves the two vertical holding units 80, 82 linearly in the horizontal direction. However, the opening / closing unit 87 may also swing the two vertical holding units 80, 82. [Explanation of symbols]

[0164] 1... Substrate processing equipment 5...Transfer block 7 ... Processing block 13A … Shelf BT1~BT6 ... Batch processing tanks WTR: Transport mechanism 35... Second attitude conversion mechanism CR... Center robot 59 ... Control section LF9 ... Lifter 63 ... Posture conversion unit 65 … Board holding part 78 ... Arm support 79,81 … Horizontal holding part 80,82 … Vertical holding section 87 … Opening and closing section 93 ... Horizontal rotation section 94 … Vertical rotation part 95…Horizontal moving part AX5…Horizontal axis 107 ... Pusher 109 ... Lifting and rotating part 112 … Standby tank 116 ... nozzle

Claims

1. A substrate processing apparatus that continuously performs batch processing, in which a plurality of substrates are processed at once, and single-substrate processing, in which substrates are processed one by one, a batch processing tank for processing multiple substrates at once; a batch substrate transport mechanism that transports the plurality of substrates in a vertical orientation collectively to the batch processing tank; a single wafer processing chamber for processing substrates one by one; a horizontal substrate transfer mechanism that transfers substrates in a horizontal position one by one to the single wafer processing chamber; a posture changing mechanism for changing the posture of the plurality of batch-processed substrates from a vertical posture to a horizontal posture, The attitude conversion mechanism includes: a substrate holding unit that holds the plurality of substrates that are transported by the batch substrate transport mechanism and are arranged at predetermined intervals in a vertical position; a posture changing unit that receives the plurality of substrates from the substrate holding unit and changes the posture of the plurality of substrates from a vertical posture to a horizontal posture, The posture conversion unit is two horizontal holding units that accommodate two radially opposing side portions of each of the substrates included in the plurality of substrates, and on which the plurality of substrates are placed at a predetermined interval when the plurality of substrates are in a horizontal position; two vertical holding parts that accommodate two side parts of each of the plurality of substrates, the two vertical holding parts being provided below the horizontal holding part and holding the plurality of substrates in a vertical position when the plurality of substrates are in a vertical position; an opening / closing unit that moves the two vertical holding units between a holding position where the spacing between the two vertical holding units is narrowed to hold the plurality of substrates using the two vertical holding units, and a passing position where the spacing between the two vertical holding units is widened to allow each substrate to pass between the two vertical holding units; a support portion that supports the two horizontal holding portions and the two vertical holding portions; a vertical rotation unit that rotates the support unit around a horizontal axis so that the two vertical holding units face the horizontal substrate transport mechanism in order to convert the plurality of substrates from a vertical position to a horizontal position; a moving unit that moves the support unit and the vertical rotation unit between a substrate waiting area in which the substrate holding unit is arranged and a posture change execution area for changing the posture of the plurality of substrates from a vertical posture to a horizontal posture, the moving unit moves the support unit and the vertical rotation unit to the substrate waiting area when the plurality of substrates in a vertical position are held by the substrate holding unit, the two vertical holding units are moved to the holding positions by the opening / closing unit to hold the plurality of substrates in a vertical position held by the substrate holding units, and the two horizontal holding units accommodate the plurality of substrates held by the two vertical holding units; the moving unit moves the support unit and the vertical rotation unit to the posture change execution area while the two vertical holding units hold the plurality of substrates; the vertical rotation unit rotates the support unit around the horizontal axis to convert the substrates from a vertical position to a horizontal position; the opening / closing unit moves the two vertical holding units to the passing position when the plurality of substrates are converted into a horizontal position; The horizontal substrate transport mechanism removes one substrate at a time from the plurality of horizontally positioned substrates while passing them between the two vertical holding parts that have been moved to the passing position, and transports the removed substrate to the single-wafer processing chamber.

2. 2. The substrate processing apparatus according to claim 1, the attitude conversion unit further includes a horizontal rotation unit that rotates the support unit around a rotation axis that extends in a direction perpendicular to the alignment direction of the plurality of substrates and perpendicular to the horizontal axis, The substrate processing apparatus, wherein the moving unit moves the support unit, the horizontal rotation unit, and the vertical rotation unit.

3. 2. The substrate processing apparatus according to claim 1, The substrate processing apparatus according to claim 1, wherein the attitude changing mechanism includes a second horizontal rotation unit that rotates the substrate holder about a vertical axis.

4. 3. The substrate processing apparatus according to claim 1, the two vertical holding units each include a plurality of pairs of holding grooves for holding one substrate each, and a plurality of pairs of passing grooves for passing one substrate each; the plurality of pairs of holding grooves and the plurality of pairs of passing grooves are arranged alternately, A substrate processing apparatus characterized in that the two vertical holding units are moved to the holding position by the opening / closing unit, thereby holding a first group of divided substrates, in which every other one of the multiple substrates in a vertical position held by the substrate holding units is aligned, in the multiple pairs of holding grooves, and the two horizontal holding units accommodate the first group of divided substrates.

5. 3. The substrate processing apparatus according to claim 1, 2. The substrate processing apparatus according to claim 1, wherein the posture changing mechanism further comprises a standby tank for storing the liquid so that the plurality of substrates held by the substrate holding unit are immersed in the liquid.

6. 3. The substrate processing apparatus according to claim 1, A substrate processing apparatus characterized in that the posture change mechanism further includes a posture change unit nozzle that supplies liquid in a shower or mist form to the multiple substrates held by the two vertical holding units of the posture change unit.

7. 3. The substrate processing apparatus according to claim 1, The substrate processing apparatus is characterized in that the moving unit is provided at a position higher than the plurality of substrates in a vertical position held by the two vertical holding units.

8. 3. The substrate processing apparatus according to claim 1, the horizontal axis is provided at a position higher than the plurality of substrates in a vertical position held by the two vertical holding portions, The substrate processing apparatus is characterized in that the support portion supports the two horizontal holding portions and the two vertical holding portions from the opposite side of the two vertical holding portions via the two horizontal holding portions.

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