Manufacturing method of structures

Abstract

To provide a method of manufacturing a structure using a mold and having excellent transfer accuracy.SOLUTION: A method of manufacturing a structure includes: a step of providing a transfer material; a step of shaping the transfer material on a substrate by using a mold for structure shaping, which has a first member that has two main surfaces and a through-hole penetrating through the main surfaces and a second member that blocks the through-hole, and in which the first member and the second member are combined such that a wall surface A, which is a part of a surface of the first member, and a wall surface B, which is a part of a surface of the second member, are made continuous to form a mold wall; a step of exposing a part of the structure on which the transfer material is shaped, or a part of the structure on which the transfer material is shaped and a part of the substrate by removing the second member from the mold; and a step of separating the first member and the structure from each other by pressing at least a part of the exposed part of the structure or the exposed part of the substrate.SELECTED DRAWING: Figure 1A

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a structure.

Background Art

[0002] Techniques for forming fine structures using a mold have been variously studied. For example, Patent Document 1 describes a method for manufacturing a glass molded body, in which a first fitting portion including a surface constituting a part of a receiving surface for receiving molten glass is fitted to an outer peripheral portion including a surface constituting the other part of the receiving surface to form the receiving surface, molten glass is supplied to the receiving surface, a molten glass mass is formed on the receiving surface, the first fitting portion is removed from the outer peripheral portion, the molten glass mass on the outer peripheral portion is placed on a molding surface different from the receiving surface, and the molten glass mass is molded into a glass molded body on the molding surface. It is described that the glass molded body obtained by this manufacturing method is used as an optical lens or the like provided in an optical element.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When manufacturing a structure by shaping a transfer material using a mold on a substrate, it may be difficult to release and separate the structure from the mold. In particular, in the manufacture of fine structures with a large aspect ratio, it is difficult to separate the structure from the mold without damaging it, and there is a high tendency that good transfer accuracy cannot be obtained.

[0005] The present disclosure has been made in view of the above circumstances. One embodiment of this disclosure aims to provide a method for manufacturing a structure using a mold and with excellent transfer accuracy. [Means for solving the problem]

[0006] This disclosure includes the following aspects: [1] The process of preparing the transfer material, A step of forming the transfer material onto a substrate using a mold for forming a structure, which has a first member having two main surfaces and through holes penetrating the main surfaces, and a second member that closes the through holes, and which combines the first member and the second member such that a wall surface A, which is part of the surface of the first member, and a wall surface B, which is part of the surface of the second member, continuously form a mold wall; A step of removing the above-mentioned second member from the above-mentioned mold to expose a part of the structure formed from the above-mentioned transfer material, or a part of the structure formed from the above-mentioned transfer material and a part of the above-mentioned substrate, A step of separating the first member from the structure by pressing on at least a portion of the exposed part of the structure or the exposed part of the substrate, A method for manufacturing a structure having [the specified characteristics]. [2] The method for manufacturing a structure according to [1], wherein in the step of separating the first member and the structure, at least one selected from the group consisting of a pressing member that can be inserted into a through hole in the first member, a gas, and a liquid is used to press at least a part of the exposed portion of the structure or at least a part of the exposed portion of the substrate. [3] The method for manufacturing a structure according to [1] or [2], wherein in the step of separating the first member and the structure, pressing is applied once to all of the exposed portion of the structure or all of the exposed portion of the substrate. [4] The method for manufacturing a structure according to [1] or [2], wherein in the step of forming the transfer material, a plurality of structures are formed, and in the step of separating the first member and the structures, pressing on the exposed portion of the structure or the exposed portion of the substrate is performed in multiple stages. [5] The method for manufacturing a structure according to any one of [1] to [4], wherein the pressing is performed using the pressing member described above. [6] The method for manufacturing the structure according to [5], wherein the pressing member is a pressing pin. [7] The mold for shaping the structure is a mold for shaping a structure, wherein the wall surface A is the surface of the through hole, and the wall surface A and the wall surface B are combined to form a mold wall, and the length of the pressing member along the pressing direction is longer than the through length of the through hole of the first member along the pressing direction. The method for manufacturing a structure according to [5] or [6]. [8] A mold for shaping a structure, wherein the wall surface A is the surface of the through hole, and the wall surface A and the wall surface B are combined to form a mold wall, and the through hole in the first member includes a through hole with an aspect ratio of 2 to 20, where the through length is the opening width. A method for manufacturing a structure according to any one of [5] to [7]. [Effects of the Invention]

[0007] According to one embodiment of the present disclosure, it is possible to provide a method for manufacturing a structure using a mold and with excellent transfer accuracy. [Brief explanation of the drawing]

[0008] [Figure 1A] Figure 1A is a diagram illustrating an example of a manufacturing method for the structure according to this disclosure. [Figure 1B] Figure 1B is a diagram illustrating an example of a method for manufacturing a structure according to this disclosure. [Figure 2A] Figure 2A is a schematic cross-sectional view showing an example of a mold used in the manufacturing method of a structure according to this disclosure. [Figure 2B] Figure 2B is a top view showing an example of the first member. [Figure 2C] Figure 2C is a schematic cross-sectional view of the first member shown in Figure 2B, taken along line 1-1. [Figure 2D] Figure 2D is a top view showing an example of the second member. [Figure 2E]FIG. 2E is a schematic cross-sectional view taken along line 2-2 of the second member shown in FIG. 2D. [Figure 3A] FIG. 3A is a top view showing an example of a first member having two or more through holes. [Figure 3B] FIG. 3B is a schematic cross-sectional view taken along line 3-3 of the first member shown in FIG. 3A. [Figure 4] FIG. 4 is a schematic cross-sectional view showing another example of the mold in the present disclosure. [Figure 5] FIG. 5 is a schematic cross-sectional view showing an example of single-stage pressing in the separation process. [Figure 6] FIG. 6 is a schematic cross-sectional view showing an example of multi-stage pressing in the separation process. [Figure 7A] FIG. 7A is a schematic cross-sectional view showing another example of the mold in the present disclosure. [Figure 7B] FIG. 7B is a schematic cross-sectional view showing an example of a mold in which a space separate from the space defined by the mold wall is formed. [Figure 8] FIG. 8 is a schematic cross-sectional view showing an example of a mold having an alignment portion.

MODE FOR CARRYING OUT THE INVENTION

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. The present disclosure is not limited to the following embodiments, and can be implemented with appropriate modifications within the scope of the object of the present disclosure. Components denoted by the same reference numerals in each drawing mean the same components. Regarding the overlapping components and reference numerals in each drawing, the description may be omitted. The ratio of dimensions in the drawings does not necessarily represent the ratio of actual dimensions.

[0010] In the present disclosure, a numerical range represented by “~” means a range including the numerical values described before and after “~” as the lower limit value and the upper limit value. In the numerical ranges described step by step in the present disclosure, the upper limit value or the lower limit value described in a certain numerical range may be replaced with the upper limit value or the lower limit value of the numerical range described in other step-by-step descriptions. Further, in the numerical ranges described in the present disclosure, the upper limit value or the lower limit value described in a certain numerical range may be replaced with the value shown in the examples.

[0011] <Method for manufacturing a structure> The method for manufacturing a structure according to the present disclosure is a step of preparing a transfer material (also referred to as “transfer material preparation step”), and a step of shaping the transfer material on a substrate using a mold for shaping a structure (also referred to as “specific mold”) that has a first member having two main surfaces and a through hole penetrating the main surfaces, and a second member closing the through hole, and in which a wall surface A that is a part of the surface of the first member and a wall surface B that is a part of the surface of the second member are continuously formed into a mold wall by combining the first member and the second member (hereinafter, also referred to as “shaping step”), a step of removing the second member from the mold and exposing a part of the structure shaped with the transfer material, or a part of the structure shaped with the transfer material and a part of the substrate (also referred to as “exposure step”), a step of pressing at least a part of the exposed part of the structure or the exposed part of the substrate to separate the first member from the structure (also referred to as “separation step”), and includes a method for manufacturing a structure.

[0012] The method for manufacturing a structure according to the present disclosure is a method for manufacturing a structure by shaping a transfer material using a mold. By passing through the above-described transfer material preparation step, shaping step, exposure step, and separation step using a specific mold, a structure with excellent transfer accuracy can be manufactured.

[0013] The method for manufacturing the structure according to this disclosure may include steps other than the transfer material preparation step, shaping step, exposure step, and separation step. Examples of other steps include a surface treatment step, a cleaning step, and so on.

[0014] The method for manufacturing a structure according to this disclosure can be suitably used for manufacturing microstructures. Herein, in this disclosure, "microstructure" means a structure processed to a size of the nano-order or micron-order. Examples of structures manufactured by the manufacturing method of the structure according to this disclosure include structures with a maximum length of 100 nm to 1000 μm, with structures of 5 μm to 200 μm being preferred. Examples of structures include microfluidics, cell culture vessels, microlens arrays, and micromirrors.

[0015] As previously mentioned, when manufacturing structures by forming transfer material onto a substrate using a mold, it can be difficult to release and separate the structure from the mold. In particular, when manufacturing structures with elongated shapes and large aspect ratios, it is difficult to separate the structure from the mold without damaging it, and good transfer accuracy tends to be poor. Therefore, the inventors focused on the configuration of the mold for forming the structure and the process of releasing and separating the structure from the mold. Specifically, the method for manufacturing a structure according to this disclosure involves forming a transfer material on a substrate using a specific mold having a first member and a second member, then removing the second member to expose a part of the structure (i.e., the molded body), or a part of the structure and a part of the substrate, through an opening in the first member, and then separating the first member from the structure while pressing the exposed structure or substrate, thereby improving the release properties of the structure from the mold. As a result, damage to the structure when separating it from the mold can be suppressed, and a structure (for example, a structure with a long, slender shape and a large aspect ratio) can be manufactured with high transfer accuracy using the mold. Patent Document 1 does not focus on the specific mold used in the manufacturing method according to this disclosure, nor on the processes corresponding to each of the above-mentioned steps.

[0016] The embodiments of this disclosure will be described below. Figures 1A (Figures 1A(A) to 1A(G)) and 1B (Figures 1B(A) to 1B(G)) are diagrams showing examples of methods for manufacturing structures according to this disclosure. In the following, each step of the method for manufacturing structures according to this disclosure will be described with appropriate reference to Figures 1A and 1B, but the method for manufacturing structures according to this disclosure is not limited to the items shown exemplified in Figures 1A and 1B.

[0017] (Preparation process for transfer materials) In the transfer material preparation process, the transfer materials to be used in the manufacture of the structure are prepared. The transfer materials may be manufactured from raw materials, or commercially available products may be used.

[0018] Examples of transfer materials include radiation-curable compositions, photocurable compositions, thermosetting compositions, and thermoplastic resins, with photocurable compositions being preferred. Among photocurable compositions, ultraviolet (UV) curable compositions are preferred. Examples of UV curable compositions include PAK-01 and PAK-02 manufactured by Toyo Gosei Kogyo Co., Ltd.

[0019] (Formation process) In the forming process, a mold for forming structures (specific mold) is used to form a transfer material onto a substrate. This mold consists of a first member having two main surfaces and through holes penetrating the main surfaces, and a second member that closes the through holes. The first member and the second member are combined such that a wall surface A, which is part of the surface of the first member, and a wall surface B, which is part of the surface of the second member, continuously form a mold wall.

[0020] In this disclosure, "mold wall" means the surface of the mold that comes into contact with the transfer material and contributes to the shaping of the transfer material. In this disclosure, wall surface A means the surface of the first member that is in contact with the transfer material, and wall surface B means the surface of the second member that is in contact with the transfer material. Furthermore, in this disclosure, "wall surface A and wall surface B continuously form a molded wall" means that wall surface A and wall surface B are in contact with each other to form a single surface and thus form a molded wall. Specifically, in the manufacturing process of the structure, it is sufficient that wall surface A and wall surface B are in contact to such an extent that the transfer material shaped by the mold does not leak out from the contact area between wall surface A and wall surface B.

[0021] This document describes the mold (specific mold) used in the manufacturing method of the structure related to this disclosure.

[0022] One embodiment of the specific mold is one in which wall surface A is the surface of a through-hole in the first member, and the first member and the second member are combined such that wall surface A and wall surface B continuously form a mold wall. (Hereinafter, the mold according to this embodiment will also be referred to as "Mold A" as appropriate.)

[0023] Another embodiment of the specific mold is a configuration in which the first and second members are combined such that the second member penetrates and blocks the through-hole of the first member, and has a projection whose length in a cross-sectional view in the thickness direction is greater than the length of the through-hole, and wall surface B includes the surface of the projection, and wall surface A and wall surface B continuously form a mold wall. (Hereinafter, the mold according to this embodiment will also be referred to as "Mold B" as appropriate.)

[0024] In the following explanation, when the terms "mold" or "specific mold" are used, they shall include both mold A and mold B.

[0025] One embodiment shown in Figure 1A is an example using mold A, and uses mold 100 which is a combination of the first member 11 and the second member 12. One embodiment shown in Figure 1B is an example using mold B, and uses mold 200 which combines a first member 11 and a second member 12A having a projection 15.

[0026] Figure 2A is a schematic cross-sectional view showing mold 100 according to one embodiment of a specific mold (mold A). Figure 2B is a top view of the first member 11 of mold 100, and Figure 2C is a schematic cross-sectional view of the first member 11 shown in Figure 2B along line 1-1. Figure 2D is a top view of the second member 12 of mold 100, and Figure 2E is a schematic cross-sectional view of the second member 12 shown in Figure 2D along line 2-2.

[0027] As shown in Figure 2A, the mold 100 is constructed by combining a first member 11 and a second member 12. The first member 11 is a member having two main surfaces and a through hole 14 that penetrates the two main surfaces. In the mold 100, the wall surface A of the through hole 14 in the first member 11 and the wall surface B, which is part of the surface of the second member 12, continuously form a mold wall. The mold wall formed by wall surface A and wall surface B in the mold 100 restricts the transfer material (not shown) filled in the through hole 14, thereby shaping the structure.

[0028] As shown in Figures 2B and 2C, the first member 11 is a member having two main surfaces, and the two main surfaces of the first member, which have through holes 14 penetrating the two main surfaces, refer to two planes that are opposite each other in the thickness direction of the first member.

[0029] The first member 11 has only a through hole 14, but in addition to the through hole 14, it may have one or more recesses (non-through holes) that do not penetrate one of the two main surfaces. By having non-through holes in the first member, a structure that undergoes surface treatment and a structure that does not undergo surface treatment can be formed using a single mold.

[0030] In mold 100, the entire surface of the through-hole 14 of the first member 11 constitutes wall surface A, and the surface of the second member 12A that closes the through-hole 14 constitutes wall surface B. In mold 100, the region including the mold wall formed by the continuous formation of wall surface A and wall surface B constitutes a pattern section 18, as shown in Figure 2A. The pattern section 18 defines the shape and size of the structure formed using mold 100. In the first member 11, the through-hole 14 is formed in a rectangular prism shape, but the shape of the through-hole 14 is not limited to this, and can be any desired shape such as a cylindrical shape, a barrel shape, a polygonal prism shape other than a rectangular prism, or a linear pattern.

[0031] The second member 12 is a member that closes the through hole 14 of the first member 11, and in the mold 100, it forms one end of the structure (i.e., the ceiling portion of the structure) formed by filling the through hole 14 with a transfer material (not shown).

[0032] As shown in Figures 2D and 2E, the second member 12 is a flat plate-shaped member. When the second member 12 is combined with the first member 11, the area on one main surface of the second member 12 corresponding to the opening of the through hole 14 in the first member 11 (i.e., the area between the two virtual dashed lines in Figure 2E) constitutes the wall surface B.

[0033] The penetration length of the through-hole in the first member 11 can be appropriately determined according to the target structure. From the viewpoint of mold release properties of the structure, the penetration length can be, for example, 100 nm to 1000 μm, and is preferably 5 μm to 200 μm.

[0034] The aspect ratio, which is the through-hole length relative to the opening width, can be appropriately determined according to the target structure. From the viewpoint of the release properties of the resulting structure, the first member may include through-holes with an aspect ratio of, for example, 0.5 to 50, preferably with an aspect ratio of 1 to 20, and more preferably with an aspect ratio of 2 to 20.

[0035] In the manufacturing method of the structure according to this disclosure, damage to the structure is effectively suppressed when separating the first member and the structure in the separation step described later, so that structures with a large aspect ratio can be manufactured with good transfer accuracy.

[0036] The first member 11 has one through hole 14, but in a particular mold, the first member may have only one through hole or two or more.

[0037] An example of a first member having two or more through holes is shown in Figures 3A and 3B. Figure 3A is a top view of the first member 11A, and Figure 3B is a schematic cross-sectional view of the first member 11A shown in Figure 3A along line 3-3. The first member 11A shown in Figures 3A and 3B is a modified example configured similarly to the first member 10, except that the first member 10 of the mold 100 is modified to include two or more through holes 14 (total number of through holes: 12).

[0038] In the first member 11A, the through holes 14 are all formed in a rectangular prism shape, but the shape of the through holes 14 is not limited to this, and can be any desired shape such as a cylindrical shape, a barrel shape, a polygonal prism shape other than a rectangular prism, or a linear pattern.

[0039] When the first member has two or more through holes, the manner in which the through holes are arranged is not particularly limited. The first member may have two or more through holes over its entire surface (for example, the form of the first member 11A), or it may have two or more through holes in a part of the first member.

[0040] Figure 4 is a schematic cross-sectional view showing mold 200 according to one embodiment of mold B. As shown in Figure 4, mold 200 is constructed as a single mold by combining the first member 11 and the second member 12A.

[0041] The first member 11 of mold 200 is the same member as the first member 11 that constitutes mold 100. Note that in Figure 4, the reference numeral for the through hole in the first member 11 is omitted. The second member 12A has a projection 15 whose length in a cross-sectional view in the thickness direction is larger than the length of the through hole in the first member 11, and the projection 15 penetrates and blocks the through hole in the first member 11. That is, a portion including the tip of the projection 15 that blocks the through hole in the first member 11 protrudes from the main surface of the first member 11 on the side opposite to the second member 12A.

[0042] In the mold 200, the main surface of the first member 11 opposite to the second member 12A constitutes wall surface A, and wall surface A and wall surface B, which is part of the surface of the projection 15 of the second member 12A, continuously form a mold wall. In the mold 200, the region including the mold wall formed by the continuous formation of wall surface A, which is part of the main surface opposite to the second member 12A, and wall surface B, which is part of the surface of the projection 15, constitutes the pattern portion 18.

[0043] The mold 200 can be used to shape a structure by placing a transfer material (not shown) on the side of the first member 11 opposite to the second member 12A, and restricting the transfer material with the formed mold wall. By using the mold 200, a structure having recesses (e.g., grooves) can be obtained.

[0044] Furthermore, the mold relating to this disclosure may have only the configuration of mold A or only the configuration of mold B, or it may have the configuration of both mold A and mold B.

[0045] The mold may be designed to be used only once and then discarded, or it may be designed to be reused repeatedly.

[0046] In the forming process, first, a substrate is prepared. In one embodiment shown in Figures 1A and 1B, a substrate 10 is prepared as shown in Figures 1A(A) and 1B(A).

[0047] Next, as shown in Figures 1A(B) and 1B(B), the transfer material T is applied to the substrate 10. The substrate material is not particularly limited as long as it is a substrate that can be used in the manufacture of structures using transfer materials. Examples include glass substrates, metal substrates, resin substrates, and silicon (Si) substrates. The substrate may be a light-transmitting substrate or a non-light-transmitting substrate (i.e., an opaque substrate).

[0048] In the shaping process, one method of shaping the transfer material onto the substrate is to press the transfer material applied to the substrate using a mold.

[0049] Examples of means for applying transfer material include inkjet heads, spin coaters, and gravure coaters.

[0050] In the embodiment shown in Figure 1A, as shown in Figure 1A(B), the transfer material T is applied to the substrate 10, and then the transfer material T is pressed using mold 100, which is mold A, to form the configuration shown in Figure 1A(C). As a result, the shape of the pattern portion of mold 100 is transferred to the transfer material T.

[0051] In the embodiment shown in Figure 1B, as shown in Figure 1B(B), the transfer material T is applied to the substrate 10, and then the transfer material T is pressed using mold 200, which is mold B, so that it is configured as shown in Figure 1B(C). As a result, the shape of the pattern portion of mold 200 is transferred to the transfer material T.

[0052] Another method for forming the transfer material onto the substrate in the forming process involves filling a mold with the transfer material and then placing the mold onto the substrate. In this method, the forming process is carried out using mold A.

[0053] Specifically, instead of applying the transfer material T onto the substrate 10 (Figure 1A(B)), the transfer material T can be directly filled into the mold 100, and the mold 100 filled with the transfer material T can be placed on the substrate 10 in the configuration shown in Figure 1A(C). After placing the mold 100 filled with the transfer material T on the substrate 10, it may be pressed further. This transfers the shape of the pattern portion of the mold 100 onto the transfer material T.

[0054] In the forming process, another method for forming the transfer material onto the substrate includes filling a first member placed on the substrate with the transfer material, placing a second member on the first member filled with the transfer material to form a mold, and pressing the formed mold. The forming process in this method is performed using mold A. In this embodiment, examples of means for applying the transfer material include inkjet heads, squeegees, and other such means.

[0055] Specifically, instead of applying the transfer material T to the substrate 10 (Figure 1A(B)), for example, the first member 11 is placed on the substrate 10, the transfer material T is filled into the pattern portion having through holes in the first member 11, and then the second member 12 is placed on top of the first member 11 to assemble the mold 100 as shown in Figure 1A(C), and then the mold 100 is pressed. As a result, the shape of the pattern portion of the mold 100 is transferred to the transfer material T.

[0056] In the shaping process, when placing the first member on the substrate, it is also preferable to fix the first member and the substrate together using magnetic force. As a method for fixing the first component and the substrate using magnetic force, if mold A is used, the magnet can be placed on the side of the substrate 10 opposite to the first component 11, as shown in Figure 1A(C). If mold B is used, the magnet can be placed on the side of the second component 12A opposite to the first component 11, as shown in Figure 1B(C).

[0057] In the shaping step, it is preferable to cure the transfer material. The curing method preferably includes at least one selected from the group consisting of curing with a curing temperature of -65°C to 300°C and photocuring, and more preferably includes photocuring.

[0058] For photocuring, a photocurable composition (preferably a UV-curable composition) is used as the transfer material T, and after bringing the transfer material T into contact with the mold, exposure is performed with light at a wavelength of 200 to 400 nm. The exposure conditions and exposure means can be appropriately selected depending on the photocurable composition used. Examples of photocurable compositions include PAK-01 and PAK-02 manufactured by Toyo Gosei Kogyo Co., Ltd.

[0059] When applying photocuring to cure the transfer material, exposure may be performed from the substrate side or from the mold side. When using mold B, exposure from the substrate side is preferable. When exposure is performed from the substrate side, the substrate should be a light-transmitting substrate. When using mold A and exposure is performed from the mold side, at least the second component should be made using a light-transmitting material. When using mold B and exposure is performed from the mold side, both the first and second components should be made using a light-transmitting material.

[0060] In the curing process during the shaping step, it is also preferable that the curing temperature be between -65°C and 300°C. The transfer material T used in this embodiment may include a thermoplastic resin or a thermosetting resin.

[0061] When using a transfer material T containing a thermosetting resin, the transfer material T (thermosetting resin or thermosetting resin composition) is brought into contact with the mold, and then the transfer material T is heated and cured. The heating conditions and heating method can be appropriately selected depending on the transfer material T used. Examples of thermosetting resins include polydimethylsiloxane (PDMS) or epoxy resin.

[0062] If a transfer material T containing a thermoplastic resin (i.e., a thermoplastic resin or thermoplastic resin composition) is used, injection molding can be used in the shaping process. In this case, the transfer material T containing a thermoplastic resin such as polycarbonate or cycloolefin polymer (COP) can be melted, injected into a mold with a mold set in place, and then cooled and solidified to cure the transfer material T.

[0063] (Exposure process) In the exposure process, after the shaping process, the second component is removed from the specific mold to expose a part of the structure shaped from the transfer material, or a part of the structure shaped from the transfer material and a part of the substrate.

[0064] If mold A is used, for example, as shown in Figure 1A(D), the first member 11 and the second member 12 are separated and the second member 12 is removed, thereby exposing a portion of the surface of the structure S formed from the transfer material T after the forming process through the through-hole in the first member 11.

[0065] If mold B is used, as shown in Figure 1B(D), the first member 11 and the second member 12A are separated, and the second member 12A is removed, exposing a portion of the surface of the structure S formed from the transfer material T after the forming process and the substrate 10 below the through-hole of the first member 11.

[0066] The means for separating the first member 11 from the second member 12 and removing the second member 12 are not particularly limited and include, for example, peeling and removal using a manual or device, dissolution and removal using a solvent, etc. The means for separating the first member 11 from the second member 12A and removing the second member 12A are similar.

[0067] (separation process) In the separation process, the first member and the structure are separated by pressing on at least a portion of the exposed part of the structure or the exposed part of the substrate that was exposed in the exposure process.

[0068] The non-exposed portions of a structure after the exposure process tend to be firmly attached to the first member, and attempting to separate the entire structure from the first member at once may result in damage to the structure. This tendency is particularly pronounced when the structure is a microstructure with a large aspect ratio. In the separation process, by pressing on at least a portion of the exposed part of the structure or the exposed part of the substrate that was exposed in the exposure process, a peel is created between the non-exposed part of the structure and the first member that acts as a so-called "wedge" that triggers mold release. This allows the structure and the first member to be separated while suppressing damage to the structure.

[0069] The separation process may be performed after the exposure process, followed by optional surface treatment, and then after the surface treatment process. The surface treatment process will be described later.

[0070] The pressure applied during pressing is not particularly limited and can be appropriately set according to the shape, size, properties of the structure, and the means of pressing (pressing member, gas, liquid, etc.).

[0071] In the separation process, from the viewpoint of not damaging the structure, it is preferable to use at least one selected from the group consisting of a pressing member that can be inserted into a through hole in the first member, a gas, and a liquid to press at least a portion of the exposed part of the structure or at least a portion of the exposed part of the substrate, thereby separating the first member from the structure.

[0072] From the viewpoint of manufacturability, the pressing in the separation process is more preferably to include pressing using a pressing member that can be inserted into the through hole or pressing using gas, and even more preferably to include pressing using a pressing member.

[0073] From the viewpoint of simplicity, a pressing pin is preferred as the pressing member that can be inserted into the through hole. By using a pressing pin, damage during separation is well suppressed even in structures with a large aspect ratio. In this disclosure, "pressing pin" means a member that has hardness capable of pressing the shaped structure and has a length capable of penetrating the through hole of the first member of a specific mold.

[0074] In the embodiment using mold A, it is preferable that the length of the pressing member along the pressing direction is longer than the through length of the through hole in the first member along the pressing direction. By making the length of the pressing member along the pressing direction longer than the through length of the through hole in the first member along the pressing direction, structures present in the through hole can be reliably separated from the first member.

[0075] Here, the length of the pressing member along the pressing direction means the length of the portion of the first member that is inserted into the through-hole. The pressing member may have portions that are not inserted into the through-hole (for example, a gripping portion, a connecting portion of multiple pressing parts, etc.), but the length of the portions that are not inserted into the through-hole shall not be included in the length of the pressing member along the pressing direction.

[0076] One embodiment shown in Figure 1A and another shown in Figure 1B are examples in which a pressing member is used in the separation process.

[0077] In Figures 1A(E) and 1A(F), the projection (pressing pin) of the extrusion member 13A is inserted into the exposed portion of the structure S through the through hole in the first member 11, and pressed in the direction of arrow Y, thereby separating the structure S formed on the substrate 10 from the first member 11. Through the separation process, a structure S formed on the substrate 10 is obtained, as shown in Figure 1A(G).

[0078] Furthermore, in Figures 1B(E) and 1B(F), the projection (pressing pin) of the extrusion member 13B is inserted through the through hole in the first member 11 into the exposed portion of the substrate 10, and pressed in the direction of arrow Y, thereby separating the structure S formed on the substrate 10 from the first member 11. Through this separation process, the structure S formed on the substrate 10 is obtained, as shown in Figure 1B(G).

[0079] The gas used is not limited to any gas that will not damage the structure; it should be selected according to the structure being manufactured. If the structure has a surface treatment, the gas should be selected according to the properties of the surface treatment layer. Examples of gases include air, nitrogen gas, and argon gas, but air is preferred from a safety standpoint.

[0080] The liquid used is not limited to any liquid that does not damage the structure and should be selected according to the structure being manufactured. If the structure has a surface treatment, the gas should be selected according to the properties of the surface treatment layer. Examples of liquids include water and solvents such as ethanol, but water is preferred from a safety standpoint.

[0081] In an embodiment that includes a separation process, it is preferable to apply pressure to all of the exposed portion of the structure or all of the exposed portion of the substrate in a single step. By performing the pressing in a single step, the separation of the structure and the first member can be performed efficiently. From the viewpoint of suppressing damage to the structure, it is preferable to apply uniform pressure to all of the exposed portion through the through-hole in which the structure or substrate is exposed.

[0082] Figure 5 is a schematic cross-sectional view showing an example of a method in which the entire exposed portion of a structure is pressed once and separated in a single operation. Figure 5 shows the state after the second substrate has been removed in the exposure process and before the separation process. As shown in Figure 5, a structure S is formed in the through hole of the first member 11A placed on the substrate 20, and a part of the structure S is exposed on the surface of the first member 11A opposite to the substrate 20. The first member 11A is the same member as the first member 11A shown in Figures 3A and 3B.

[0083] The pressing member 13C has the same number of protrusions as the number of through holes in the first member 11A (i.e., the number of formed structures S). The length of the pressing member 13C along the pressing direction is longer than the through length of the through holes in the first member 11A along the pressing direction.

[0084] In this embodiment, the entire exposed portion of the structure S is pressed in a single step in the direction of arrow Y using the pressing member 13C, thereby separating the structure S and the first member 11A in a single operation.

[0085] In embodiments that include a separation process, it is preferable to apply pressure to the exposed portion of the structure or the exposed portion of the substrate in multiple stages. Applying pressure in multiple stages can more effectively suppress damage to the structure. Furthermore, applying pressure in multiple stages is preferable when multiple structures with different characteristics (e.g., shape, properties, etc.) are provided, as it allows for applying pressure according to the characteristics of each structure.

[0086] From the viewpoint of suppressing damage to the structure, it is preferable to apply uniform pressure to the exposed portion to be pressed from a through-hole in which the structure or substrate is exposed.

[0087] The method of pressing in multiple stages is not particularly limited; two or more regions containing the exposed area to be pressed can be defined, and pressing can be performed according to the number of defined regions. For example, the entire region containing the exposed area to be pressed can be divided into a central part and a peripheral part, the central part can be pressed first, and then the peripheral part can be pressed.

[0088] The multi-stage pressure used for pressing may be the same at every stage, or different pressures may be combined for each stage.

[0089] Even when pressing is performed in multiple stages, from the viewpoint of suppressing damage to the structure, it is preferable to apply uniform pressure to the exposed portion to be pressed from through holes where the structure or substrate is exposed.

[0090] Figure 6 is a schematic cross-sectional view showing an example of a multi-stage pressing method for the exposed portion of a structure. In this example, pressing is performed in two stages.

[0091] Figure 6 shows the state after the second substrate has been removed in the exposure process and before the separation process. As shown in Figure 6(A), a structure S is formed in a through hole of the first member 11A placed on the substrate 20, and a part of the structure S is exposed on the surface of the first member 11A opposite to the substrate 20. The first member 11A is the same member as the first member 11A shown in Figures 3A and 3B.

[0092] The pressing member 13D is a pressing member used for the first stage of pressing, and has the same number of protrusions as the number of through holes located in the central part of the through holes in the first member 11A. The length of the pressing member D along the pressing direction is longer than the through length of the through holes in the first member 11A along the pressing direction.

[0093] The pressing member 13E is a pressing member used for the second stage of pressing, and has the same number of protrusions as the number of through holes located on the peripheral edges other than the central part of the first member 11A. The length of the pressing member E along the pressing direction is longer than the through length of the through holes in the first member 11A along the pressing direction.

[0094] In this embodiment, the pressing first involves using a pressing member 13D to press the exposed portion of the central structure S in the direction of arrow Y, as shown in Figure 6(A), thereby separating the central structure S from the first member 11A. Next, as shown in Figure 6(B), the pressing member 13E is used to press the exposed portion of the peripheral structure S in the direction of arrow Y, thereby separating the peripheral structure S from the first member 11A, and separating all of the multiple structures S formed on the substrate 20 from the first member 11A.

[0095] (Other processes) The method for manufacturing the structure according to this disclosure may optionally include other steps besides the transfer material preparation step, shaping step, exposure step, and separation step. Examples of other steps include surface treatment steps, cleaning steps, and steps for processing the structure after the separation step. Other steps are not limited to these examples.

[0096] <Surface treatment process> In the method for manufacturing a structure according to this disclosure, a surface treatment may be performed on the surface of the exposed structure after the exposure step and before the separation step.

[0097] The surface treatment is preferably performed without separating the first member and the structure, and more preferably by using the first member as a mask and treating the exposed surface of the structure. Through the surface treatment process, a surface treatment layer is locally formed on a part of the surface of the shaped structure, or on a part of the surface of the structure and the substrate.

[0098] Examples of surface treatments include vacuum deposition, coating, ion irradiation, etching, or blasting. Vacuum deposition processes include vacuum evaporation, sputtering, chemical vapor deposition (CVD), and atomic layer deposition (ALD). Coating processes include inkjet printing and spray coating. Ion irradiation treatments include atmospheric pressure plasma treatment, oxygen plasma ashing, and UV ozone treatment. Etching processes include dry etching using gas and wet etching using chemical solutions. Blasting processes include sandblasting. The processing conditions and apparatus for each of the above processes should be appropriately selected according to the desired properties of the surface-treated layer.

[0099] <Washing process> The method for manufacturing a structure according to this disclosure may further include a step of cleaning the surface of the first member or the second member after the separation step. In particular, when the first member is to be reused, surface treatment residue accumulates on the side of the first member facing the second member, so including a step of cleaning the side of the first member facing the second member is especially preferable in such cases. The cleaning method is selected appropriately depending on the surface treatment method and the materials to be attached, but examples include wet cleaning using acids, alkalis, organic solvents, etc.; dry ice cleaning; laser cleaning; sandblasting cleaning; plasma cleaning such as atmospheric pressure plasma and dry etching; etc.

[0100] <Process for fabricating structures after the separation process> Examples of processes for processing the structure after the separation process include sealing the structure (e.g., a microchannel) with another component, and assembling and bonding the structure to another component. The structure may undergo the above-mentioned surface treatment process after the exposure process and before the separation process.

[0101] <Other matters concerning specific molds> The specific mold used in the manufacturing method of the structure related to this disclosure will be further described below.

[0102] ~Other variations of a specific mold~ The mold 300A shown in Figure 7A is one embodiment of mold A, and is a modified version configured similarly to mold 100, except that the second member 12C has an insertion portion 16A that fits into the through hole 14 of the first member 11, and the wall surface B includes the surface of the insertion portion 16A. In mold 300, the region including the mold wall formed by the continuous formation of wall surface A and wall surface B constitutes the pattern portion 18.

[0103] As shown in Figure 7A, the second member 12C has a fitting portion 16A, which gives rise to a structure with an inclined surface. After separating and removing the second member 12 from the first member 11, the first member 11 can be used as a mask to perform localized, highly accurate surface treatment on the inclined surface.

[0104] In mold 300A, the fitting portion 16A is fitted into the through hole 14 such that a part of the surface of the fitting portion 16A is in contact with a part of the inner surface of the through hole 14. However, the fitting portion may be fitted into the through hole in a manner in which the surface of the fitting portion is not in contact with the inner surface of the through hole.

[0105] In mold 300A, the through-hole in the first member and the fitting portion in the second member may further form a space separate from the space defined by the mold wall. The formation of a space separate from the space defined by the mold wall facilitates the separation of the first member and the second member during the exposure process. A specific mold of this embodiment is shown in Figure 7B.

[0106] As shown in Figure 7B, the mold 300B is composed of a first member 11A having a through hole 14 and a second member 12D having a fitting portion 16B. A space 19 is formed separately from the space defined by the mold wall formed from the wall surface A of the through hole 14 and the wall surface B, which is part of the surface of the fitting portion 16B. In the mold 300B, the region including the mold wall formed by the continuous formation of wall surface A and wall surface B constitutes a pattern portion 18.

[0107] ~Forming materials and manufacturing methods for specific molds~ The materials used to form the first and second components of a particular mold are not particularly limited, as long as they are suitable for forming the mold, and may be inorganic or organic materials.

[0108] Examples of inorganic materials include metallic materials, glass materials, and ceramic materials. Examples of metallic materials include nickel, copper, and alloys containing two or more of these metals. Examples of glass materials include quartz, and examples of ceramic materials include SiC (silicon carbide).

[0109] Examples of organic materials include organic materials containing resins. Examples of resins include silicone, polydimethylsiloxane (PDMS), polycarbonate, and cycloolefin polymer (COP).

[0110] The first and second members can be manufactured, for example, by lithography such as cutting or laser exposure; dry etching or wet etching; electroforming; molding using organic materials including resin; and the like.

[0111] Furthermore, the first and second members may be manufactured separately and then combined to form a mold, or the second member may be formed on top of the first member to form a mold. An example of forming the second member on top of the first member is to form the second member on top of a pre-manufactured first member using a coating method or the like.

[0112] The thicknesses of the first and second members can be set as appropriate depending on the purpose. For example, they can be independently set to 10 μm to 10 mm, or 100 μm to 600 μm.

[0113] The materials forming the first and second members may be the same or different. From the standpoint of manufacturability and cost, it is preferable that the first and second components are made of the same material.

[0114] The first and second members may be formed using materials with different elastic moduli. By using materials with different elastic moduli, the degree of deflection in response to the external force applied when separating the first and second members will differ, making separation easier. Examples of materials with different elastic moduli include one being an inorganic material containing a metal and the other being an organic material containing a resin.

[0115] In an embodiment in which a mold is formed using materials with different elastic moduli, the elastic moduli of the material constituting the first member may be greater than that of the material constituting the second member, or the elastic moduli of the material constituting the first member may be less than that of the material constituting the second member.

[0116] The first member and the second member may each contain a magnetic material, or both the first member and the second member may each contain a magnetic material. Examples of magnetic materials include metals such as nickel, cobalt, and iron, as well as alloys containing two or more of these metals. By including a magnetic material in at least one of the first and second members, the fixing of the first and second members to each other, or between the substrate on which the transfer material is placed and the mold, can be improved using an external magnetic force.

[0117] In one embodiment, the mold according to this disclosure may be a mold in which the first member and the second member are fixed using magnetic force. The magnetic force may be generated from a magnet placed outside the mold. As the magnet, for example, a permanent magnet such as a neodymium magnet and an electromagnet can be used. The magnet may be placed on either the first member side or the second member side of the mold.

[0118] ~Release layer~ The first and second members may each have a release layer on at least a portion of their surface. Having a release layer is preferable because it facilitates the separation of the first and second members, or the separation of the first member from the structure or substrate onto which the transfer material has been formed.

[0119] Examples of embodiments in which the first member and the second member have a release layer include the embodiments shown in (1) or (2) below, and both embodiments shown in (1) and (2) may also be present. Only one of the first member and the second member may have a release layer, or both the first member and the second member may have a release layer.

[0120] Embodiment (1): An embodiment in which a release layer is provided on at least a portion of the surfaces of the first member and the second member that are in contact with each other. According to Embodiment (1), the release properties at the interface between the first member and the second member during the exposure process are improved, and the separation of the first member and the second member becomes easier.

[0121] Embodiment (2): An embodiment having a release layer in at least a portion of the surface on which the first member and the second member are not in contact. According to Embodiment (2), the release properties between the first member and / or the second member and the structure formed from the transfer material in the exposure process, or between the first member and the substrate in the separation process, are improved, making it easier to separate the first member and / or the second member from the structure, or between the first member and the substrate.

[0122] The release layer can be formed using a fluorine-containing release agent, such as perfluoropolyether (PFPE) or polytetrafluoroethylene (PTFE). Alternatively, a release layer formed using diamond-like carbon (DLC) is also preferred.

[0123] ~Light-transmitting region in the second component~ When a photocurable transfer material is used as the transfer material, the second member may include a region that transmits light of at least some wavelengths in the range of 200 to 400 nm. That is, the second member can be made using, for example, a material that transmits light of at least some wavelengths in the range of 200 to 400 nm (hereinafter also referred to as a light-transmitting material).

[0124] The region that transmits light of at least some wavelengths in the range of 200 to 400 nm only needs to be a region that corresponds to the location where the photocurable transfer material is placed during the manufacturing process of the structure. The second member may be made of at least a portion of a light-transmitting material, or it may be made entirely of a light-transmitting material.

[0125] Fabricating the second component using a light-transmitting material is advantageous because, when an opaque substrate is used as the base material for the structure, it can be exposed from the mold side.

[0126] Examples of light-transmitting materials include light-transmitting resin materials (e.g., polydimethylsiloxane (PDMS), cycloolefin polymer (COP), quartz glass, etc.).

[0127] ~Alignment Department~ In a particular mold, it is preferable that at least one of the first and second members has an alignment section for positioning relative to each other. Having an alignment section allows for accurate positioning of the first and second members. The particular mold can have an alignment section regardless of whether it is mold A or mold B.

[0128] The alignment portion is preferably configured such that the first member and the second member fit together, and from the viewpoint of alignment accuracy, it is preferable that one of the first member and the second member has a convex portion and the other has a concave portion.

[0129] The alignment section may be one location, but from the viewpoint of improving the accuracy of the alignment, it is preferable to have two or more locations.

[0130] The alignment portion may be configured such that, for example, one of the first and second members has a convex portion and the other has a concave portion or a through portion.

[0131] In one embodiment of mold A, from the viewpoint of improving alignment accuracy and not damaging the pattern portion, it is preferable that the second member has a fitting portion that fits into the through hole of the first member, and that the alignment portion, in a cross-sectional view in the thickness direction, has a convex portion of the first member that is longer than the length of the fitting portion of the second member, and a concave portion of the second member.

[0132] Figure 8 is a schematic cross-sectional view showing an example of a specific mold (mold A) having an alignment portion. In the example shown in Figure 8, the mold 400 has two alignment portions 43, each consisting of a protrusion on the first member 41 and a through-hole on the second member 42 as a recess, with the length a of the protrusion being greater than the length b of the fitting portion 44. [Industrial applicability]

[0133] The method for manufacturing molds and structures according to this disclosure allows for the formation of fine structures and enables surface treatment of a portion of the surface of the structure. Therefore, the method for manufacturing molds and structures according to this disclosure can be usefully applied to medical and bio-use applications such as microfluidics and cell culture vessels; optical applications such as microlenses and micromirrors; and the like. [Explanation of Symbols]

[0134] 100, 200, 300A, 300B, 400 molds 10, 20 circuit boards 11, 11A, 41 First member 12, 12A, 12C, 12D, 42 Second member 13A, 13B, 13C, 13D, 13E Pressing members 14. Through hole 15 Protrusion 16A, 16B, 44 Inset part 18 Pattern section 19 Space 43 Alignment Section a, b Length Wall A B Wall B S structure T Transfer material YY direction

Claims

1. The process of preparing the transfer material, A step of forming the transfer material onto a substrate using a mold for forming a structure, which has a first member having two main surfaces and through holes penetrating the main surfaces, and a second member that closes the through holes, and which combines the first member and the second member such that a wall surface A, which is part of the surface of the first member, and a wall surface B, which is part of the surface of the second member, continuously form a mold wall; A step of removing the second member from the mold to expose a part of the structure onto which the transfer material has been formed, or a part of the structure onto which the transfer material has been formed and a part of the substrate, A step of separating the first member from the structure by pressing on at least a portion of the exposed part of the structure or the exposed part of the substrate, A method for manufacturing a structure having [the specified characteristics].

2. The method for manufacturing a structure according to claim 1, wherein in the step of separating the first member and the structure, at least one selected from the group consisting of a pressing member that can be inserted into a through hole in the first member, a gas, and a liquid is used to press at least a part of the exposed portion of the structure or at least a part of the exposed portion of the substrate.

3. The method for manufacturing a structure according to claim 1 or claim 2, wherein in the step of separating the first member and the structure, pressing is applied to all of the exposed portion of the structure or all of the exposed portion of the substrate in a single step.

4. A method for manufacturing a structure according to claim 1 or claim 2, wherein in the step of forming the transfer material, a plurality of structures are formed, and in the step of separating the first member and the structures, pressing on the exposed portion of the structure or the exposed portion of the substrate is performed in multiple stages.

5. The method for manufacturing a structure according to claim 2, wherein the pressing includes pressing using the pressing member.

6. The method for manufacturing a structure according to claim 5, wherein the pressing member is a pressing pin.

7. The mold for shaping the structure is a mold for shaping a structure in which the first member and the second member are combined such that the wall surface A is the surface of the through hole, and the wall surface A and the wall surface B continuously form a mold wall. The method for manufacturing a structure according to claim 5 or claim 6, wherein the length of the pressing member along the pressing direction is longer than the through length of the through hole in the first member along the pressing direction.

8. The mold for shaping the structure is a mold for shaping a structure in which the first member and the second member are combined such that the wall surface A is the surface of the through hole, and the wall surface A and the wall surface B continuously form a mold wall. The method for manufacturing a structure according to claim 5 or claim 6, wherein the through-hole in the first member includes a through-hole having an aspect ratio of 2 to 20, where the through-length is the ratio of the opening width to the length of the opening.

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