Dry film, integrated sealing sheet, light-emitting electronic component, and method for manufacturing a light-emitting electronic component

Abstract

To provide a dry film which allows sufficiently filling light elements with a low elastic black curable resin layer, can be cured at a normal curing temperature in a normal curing time, and prevents poor appearance after curing and generation of a spot caused by partially lowering brightness, and an integrated type sealing sheet, a light-emitting type electronic component and a method for manufacturing a light-emitting type electronic component using the dry film.SOLUTION: A dry film includes a low elastic black curable resin layer 1, a low elastic transparent curable resin layer 2 and a high elastic transparent curable resin layer 3, wherein the total light transmittance of the low elastic black curable resin layer 1 is 0 to 30%, the total light transmittance of the sum of the low elastic transparent curable resin layer 2 and the high elastic transparent curable resin layer 3 is 70 to 99%, and the storage elastic modulus of the high elastic transparent curable resin layer 3 is larger than the storage elastic moduli of the low elastic black curable resin layer 1 and the low elastic transparent curable resin layer 2, at 100°C and 150°C.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a dry film, an integrated sealing sheet, a light-emitting electronic component, and a method for manufacturing a light-emitting electronic component. [Background technology]

[0002] In recent years, display technologies using extremely small light-emitting diodes, known as mini-LEDs or micro-LEDs, have been attracting attention. Mini LEDs and micro LEDs have two applications. One is a technology that enables localized control of the brightness of a liquid crystal display by configuring the backlight with a large number of LEDs arranged on a substrate. The other method involves using LEDs of each color to emit light for the red (R), green (G), and blue (B) components that make up the pixels, and the high-purity colors emitted by each color LED are directly delivered to the eye.

[0003] Mini-LEDs and micro-LEDs use electronic components in which multiple light-emitting elements are arranged on a substrate. In such electronic components, a dry film is used to fill the spaces between the multiple light-emitting elements with a light-diffusion-preventing resin (Patent Document 1). The dry film is a resin film obtained by coating a curable resin composition onto a protective film and drying it. This film is then pressed onto the surface of the substrate on which the light-emitting elements are arranged, filling the spaces between the light-emitting elements, and then cured.

[0004] In Patent Document 1, a light-diffusion-preventing resin is used as a dry film to prevent light diffusion between multiple light-emitting elements. When a dry film made of a light-diffusion-blocking resin is pressed onto the surface of a substrate on which light-emitting elements are arranged, a light-diffusion-blocking resin layer is inevitably formed not only between the light-emitting elements but also on the light-emitting elements themselves.

[0005] If the light-diffusion-preventing resin layer formed on the light-emitting element is left as is, not only will light diffusion between the light-emitting elements be blocked, but light that should be emitted towards the viewer will also be blocked. Therefore, Patent Document 1 describes a method in which, after pressing a dry film, the resin on the light-emitting element is removed by etching such as plasma treatment, and the exposed light-emitting element is covered with a light-transmitting encapsulant.

[0006] Therefore, Patent Document 2 states that by using a dry film with a two-layer structure consisting of a black adhesive layer with a height less than or equal to the height of the light-emitting element and a transparent adhesive layer with a higher melting point than the black adhesive layer, the black adhesive layer on the light-emitting element can be washed away by the transparent adhesive layer that is melted later, and pressed against the bottom of the substrate between the light-emitting elements, so that no black adhesive layer remains on the light-emitting element. [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 2022-22562 [Patent Document 2] Chinese Patent Application Publication No. 115084320 Specification [Overview of the project] [Problems that the invention aims to solve]

[0008] However, etching methods such as plasma treatment, as described in Patent Document 1, are time-consuming and contribute to increased manufacturing costs. Furthermore, it is difficult to completely remove the resin from the light-emitting element through etching, which may result in partial brightness reduction and unevenness. Furthermore, in order to create a sealing layer on the outermost surface, it is also necessary to further laminate the dry film of the sealing material.

[0009] In Patent Document 2, it is stated that the black adhesive layer on the light-emitting element can be washed away by a transparent adhesive layer, pressed against the bottom of the substrate between the light-emitting elements, and the black adhesive layer can be prevented from remaining on the light-emitting element. However, when mounting the light-emitting element with solder, differences in the inclination and height of the light-emitting element occur for each light-emitting element, so the transparent adhesive layer cannot wash away the black adhesive layer uniformly, and the black adhesive layer remains on some of the light-emitting elements, resulting in a decrease in luminance.

[0010] In view of the above circumstances, an object of the present invention is to provide a dry film capable of omitting an etching process such as plasma treatment that takes a long time, and suppressing a decrease in luminance even when there are differences in the inclination and height of the light-emitting elements for each light-emitting element, an integrated sealing sheet using this dry film, a light-emitting electronic component, and a method for manufacturing a light-emitting electronic component.

Means for Solving the Problems

[0011] In order to achieve the above object, the present invention adopts the following configuration. [1] A dry film that is pressure-bonded to the surface of a substrate with a plurality of light-emitting elements where the plurality of light-emitting elements are arranged, A dry film comprising a low-elasticity black curable resin layer, a low-elasticity transparent curable resin layer, and a high-elasticity transparent curable resin layer, which are sequentially laminated from the side arranged in direct contact with the substrate with elements during the pressure bonding. [2] The dry film according to [1], wherein at 100 °C, the storage elastic modulus of the high-elasticity transparent curable resin layer is greater than the storage elastic moduli of the low-elasticity transparent curable resin layer and the low-elasticity black curable resin layer. [3] The dry film according to [1] or [2], wherein at 100 °C, the storage elastic modulus of the low-elasticity transparent curable resin layer is greater than the storage elastic modulus of the low-elasticity black curable resin layer. [4] The storage elastic modulus of the high-elasticity transparent curable resin layer is 1.0 × 10 7 Pa or less at 100 °C, and the dry film according to any one of [1] to [3]. [5] The storage elastic modulus of the low-elasticity black curable resin layer is 1.0 × 10 5A dry film described in any of [1] to [4], having a Pa of or less. [6] The storage modulus of the low-elasticity transparent curable resin layer is 1.0 × 10 at 100°C. 5 A dry film described in any of [1] to [5], having a Pa value of or less. [7] The storage modulus of the high-elasticity transparent curable resin layer is 1.0 × 10 at 150°C. 5 A dry film with a Pa of 1 or higher, as described in any of [1] to [6]. [8] The dry film according to any one of [1] to [7], wherein the total light transmittance of the low-elasticity black curable resin layer is 0 to 30%. [9] A dry film according to any one of [1] to [8], wherein the total light transmittance of the low-elasticity transparent curable resin layer is 50% or more.

[10] A dry film according to any one of [1] to [9], wherein the total light transmittance of the highly elastic transparent curable resin layer is 50% or more.

[11] The dry film according to any one of [1] to

[10] , wherein the highly elastic transparent curable resin layer comprises a high molecular weight epoxy resin.

[12] The dry film according to

[11] , wherein the weight-average molecular weight of the high molecular weight epoxy resin is 10,000 to 100,000.

[13] The dry film according to

[11] or

[12] , wherein the highly elastic transparent curable resin layer comprises a phenoxy-type epoxy resin as the high molecular weight epoxy resin.

[14] A dry film according to any one of

[11] to

[13] , wherein the amount of the high molecular weight epoxy resin blended with 100% by mass of the total resin solids content of the high elastic transparent curable resin layer is 30 to 80% by mass.

[15] A dry film according to any one of [1] to

[14] , wherein the low-elasticity black curable resin layer comprises an elastomer.

[16] The dry film according to

[15] , wherein the elastomer is a modified elastomer.

[17] The dry film according to

[16] , wherein the modified elastomer is acid-modified acrylonitrile butadiene rubber.

[18] A dry film according to any one of [1] to

[17] , wherein the low-elasticity black curable resin layer contains carbon black. An integrated sealing sheet comprising a dry film as described in any of

[19] [1] to

[18] , and a sealing film layer provided on the opposite side of the low-elasticity transparent curable resin layer of the high-elasticity transparent curable resin layer.

[20] The integral sealing sheet according to

[19] , wherein the sealing film layer comprises a support film layer and a hard coat layer provided on the side of the support film layer opposite to the high-elasticity transparent curable resin layer.

[21] A substrate with elements on which a plurality of light-emitting elements are arranged, and a dry film according to any one of [1] to

[18] is pressed onto the surface of the substrate with elements on which the plurality of light-emitting elements are arranged. The low-elasticity black curable resin layer, the low-elasticity transparent curable resin layer, and a portion of the high-elasticity transparent curable resin layer are filled between the plurality of light-emitting elements. The low-elasticity black curable resin layer, the low-elasticity transparent curable resin layer, and the high-elasticity transparent curable resin layer are cured light-emitting electronic components.

[22] A substrate with elements on which a plurality of light-emitting elements are arranged, and an integrated sealing sheet according to

[19] or

[20] pressed onto the surface of the substrate with elements on which the plurality of light-emitting elements are arranged, The low-elasticity black curable resin layer, the low-elasticity transparent curable resin layer, and a portion of the high-elasticity transparent curable resin layer are filled between the plurality of light-emitting elements. The low-elasticity black curable resin layer, the low-elasticity transparent curable resin layer, and the high-elasticity transparent curable resin layer are cured light-emitting electronic components.

[23] A dry film according to any of [1] to

[18] is placed on the surface of the element-equipped substrate on which the plurality of light-emitting elements are arranged such that the low-elasticity black curable resin layer is in contact with it, and then heat-pressed. A method for manufacturing a light-emitting electronic component, comprising curing the low-elasticity black curable resin layer, the low-elasticity transparent curable resin layer, and the high-elasticity transparent curable resin layer by heating.

[24] The method for manufacturing a light-emitting electronic component according to

[23] , wherein the temperature during thermocompression bonding is 80 to 120°C and the curing is performed by heating at 100 to 160°C.

[25] The integrated sealing sheet described in

[19] or

[20] is placed on the surface of the element-equipped substrate on which the plurality of light-emitting elements are arranged such that the low-elasticity black curable resin layer is in contact with it, and then heat-pressed. A method for manufacturing a light-emitting electronic component, comprising curing the low-elasticity black curable resin layer, the low-elasticity transparent curable resin layer, and the high-elasticity transparent curable resin layer by heating.

[26] The method for manufacturing a light-emitting electronic component according to

[25] , wherein the temperature during thermocompression bonding is 80 to 120°C and the curing is performed by heating at 100 to 160°C. [Effects of the Invention]

[0012] According to the dry film or integrated sealing sheet of the present invention, even if there are differences in the tilt and height of each light-emitting element, a decrease in brightness can be suppressed without performing etching such as plasma treatment, which takes a considerable amount of time. Furthermore, according to the present invention, light-emitting electronic components and methods for manufacturing light-emitting electronic components can be obtained without increasing production costs or energy consumption, and can have sufficient brightness and blackness. [Brief explanation of the drawing]

[0013] [Figure 1] This is a schematic cross-sectional view of a dry film according to the first embodiment of the present invention. [Figure 2] This is a schematic diagram illustrating a method for manufacturing a light-emitting electronic component according to the first embodiment of the present invention. [Figure 3] This is a schematic diagram illustrating a method for manufacturing a light-emitting electronic component according to the first embodiment of the present invention. [Figure 4] This is a schematic diagram illustrating a method for manufacturing a light-emitting electronic component according to the first embodiment of the present invention. [Figure 5] This is a schematic diagram illustrating a method for manufacturing a light-emitting electronic component according to the first embodiment of the present invention. [Figure 6]This is a schematic diagram illustrating a method for manufacturing a light-emitting electronic component according to the first embodiment of the present invention. [Figure 7] This is a schematic cross-sectional view of an integrated sealing sheet according to a second embodiment of the present invention. [Figure 8] This is a schematic diagram illustrating a method for manufacturing a light-emitting electronic component according to a second embodiment of the present invention. [Figure 9] This is a schematic diagram illustrating a method for manufacturing a light-emitting electronic component according to a second embodiment of the present invention. [Figure 10] This is a schematic diagram illustrating a method for manufacturing a light-emitting electronic component according to a second embodiment of the present invention. [Figure 11] This is a schematic diagram illustrating a method for manufacturing a light-emitting electronic component according to a second embodiment of the present invention. [Modes for carrying out the invention]

[0014] In this specification and in the claims, "main component" means a component that accounts for 50% or more by mass of the total solid content of the entire composition. A numerical range represented by "~" means a numerical range with the numbers before and after the "~" as the lower and upper limits, respectively.

[0015] 《First Embodiment》 <Dry film> The dry film 100 according to the first embodiment will be described with reference to Figures 1 and 2. As shown in Figure 1, the dry film 100 is basically composed of a low-elasticity black curable resin layer 1, a low-elasticity transparent curable resin layer 2, and a high-elasticity transparent curable resin layer 3 laminated together. The dry film 100 of this embodiment may further have a protective film on either or both of the surfaces of the low-elasticity black curable resin layer 1 and the high-elasticity transparent curable resin layer 3 for ease of handling.

[0016] Figure 1 shows an example in which protective films are present on both the low-elasticity black curable resin layer 1 and the high-elasticity transparent curable resin layer 3. Specifically, the low-elasticity black curable resin layer 1, the low-elasticity transparent curable resin layer 2, the high-elasticity transparent curable resin layer 3, and the second protective film 7 are sequentially laminated onto the first protective film 6.

[0017] As shown in Figure 2, the dry film 100 is used to fill the spaces between multiple light-emitting elements (light-emitting elements 12, 13, and 14) in the element-equipped substrate 10, which has multiple light-emitting elements arranged on the substrate 11. Details of the element-equipped substrate 10 will be described later. When the dry film 100 is pressed, it is used such that the low-elasticity black curable resin layer 1 is in direct contact with the element-equipped substrate 10, as shown in Figure 2. A specific method for obtaining a light-emitting electronic component by pressing the dry film 100 onto the element-equipped substrate 10 will be described later.

[0018] <Low elasticity black curable resin layer> The low-elasticity black curable resin layer 1 is a layer that prevents light diffusion between light-emitting elements and improves the contrast of the display. Furthermore, in the thermocompression bonding process, this layer sufficiently fills the spaces between multiple light-emitting elements arranged on the element-equipped substrate 10, preventing appearance defects due to expansion of unfilled voids during the heat curing process and damage to the light-emitting elements due to external factors in subsequent processes.

[0019] [Total light transmittance] The low-elasticity black curable resin layer 1 has a low total light transmittance. The total light transmittance of the low-elasticity black curable resin layer 1 is measured in the cured state. The low-elasticity black curable resin layer 1 is prepared so that the total light transmittance in the cured state is 0 to 30%. Preferably, the low-elasticity black curable resin layer 1 is prepared so that the total light transmittance in the cured state is 0 to 20%, and more preferably 0 to 10%. By ensuring that the total light transmittance of the low-elasticity black curable resin layer 1 in its cured state is below the upper limit, light diffusion between light-emitting elements can be prevented.

[0020] The total light transmittance in this specification can be measured by a haze meter. The total light transmittance in the cured state can be mainly adjusted by the presence or absence of pigments and dyes such as carbon black, or the blending amount. It can also be adjusted by the thickness and resin type of the resin layer.

[0021] [Storage Elastic Modulus] The low-elasticity black curable resin layer 1 before being pressure-bonded and cured to the substrate 10 with elements is in an uncured state or a semi-cured state. The storage elastic modulus of the low-elasticity black curable resin layer 1 before curing is smaller than the storage elastic modulus of the high-elasticity transparent curable resin layer 3 before curing at 100°C. Also, it is preferably smaller than the storage elastic modulus of the low-elasticity transparent curable resin layer 2 before curing at 100°C.

[0022] The storage elastic modulus of the low-elasticity black curable resin layer 1 before curing is preferably 1.0×10 5 Pa or less at 100°C, and preferably 1.0×10 2 Pa or more and 1.0×10 5 Pa or less, and more preferably 1.0×10 3 Pa or more and 5.0×10 4 Pa or less.

[0023] When the storage elastic modulus of the low-elasticity black curable resin layer 1 before curing at 100°C is below the preferable upper limit value, sufficient fluidity can be obtained during pressure-bonding to the substrate 10 with elements, and it can follow the unevenness of the substrate 10 with elements by a plurality of light-emitting elements and can sufficiently fill the space between the plurality of light-emitting elements. When the storage elastic modulus of the low-elasticity black curable resin layer 1 before curing at 100°C is above the preferable lower limit value, uneven pressure during thermocompression bonding can be prevented, and a uniform appearance can be maintained. Also, the outflow of the resin outside the range can be prevented, and the film thickness after pressure-bonding can be ensured. <*

[0024] [Curable Resin Composition] The low-elasticity black curable resin layer 1 is composed of a curable resin composition. Examples of curable resin compositions include thermosetting resin compositions comprising at least one resin selected from epoxy resins, acrylic resins, polyester resins, and polyurethane resins, and a curing agent.

[0025] In particular, epoxy resin compositions are preferred because they can achieve curing at low temperatures and have excellent heat resistance and reliability. In this specification, an epoxy resin composition is a composition mainly comprising an epoxy resin, or a composition mainly comprising an epoxy resin and a curing agent.

[0026] (Epoxy resin) In this specification and in the claims, epoxy resin is a compound having an epoxy group in its molecule. In the present invention, epoxy resins having two or more epoxy groups in a single molecule are preferred. This is because a crosslinked structure can be formed by the reaction of epoxy groups with a modified resin having functional groups that can react with epoxy groups, resulting in a cured product with high heat resistance. Furthermore, when an epoxy resin with two or more epoxy groups is used, the degree of crosslinking with the curing agent having functional groups that can react with epoxy groups is sufficient, and sufficient heat resistance can be obtained in the cured product.

[0027] Examples of epoxy resins having two or more epoxy groups in a single molecule include bifunctional epoxy resins having two epoxy groups in a molecule, polyfunctional epoxy resins having three or more epoxy groups in a molecule, and high molecular weight epoxy resins with a weight-average molecular weight of 10,000 or more. These may also be hydrogenated epoxy resins.

[0028] In this specification and in the claims, high molecular weight epoxy resins are classified as phenoxy-type epoxy resins, regardless of the number of epoxy groups in the molecule, and are not classified as bifunctional or polyfunctional epoxy resins. The weight-average molecular weight of epoxy resin is the molecular weight in polystyrene terms, measured by gel permeation chromatography.

[0029] Examples of epoxy resins include bisphenol-based epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, or phenoxy-type epoxy resins which are high molecular weight versions thereof, and hydrogenated versions thereof; novolac-type epoxy resins such as phenol novolac epoxy resin, o-cresol novolac epoxy resin, bisphenol A novolac epoxy resin, xylene structure-containing novolac epoxy resin, naphthol novolac-type epoxy resin; glycidyl ester epoxy resins such as diglycidyl phthalate, diglycidyl isophthalate, diglycidyl terephthalate, p-hydroxybenzoate glycidyl ester, diglycidyl tetrahydrophthalate, diglycidyl succinate, diglycidyl adipic acid, diglycidyl sebacate, and triglycidyl trimellitic acid; ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, and 1,6-hexanediol Examples of epoxy resins include, but are not limited to, glycidyl ether-based epoxy resins such as glycidyl ether, trimethylolpropane triglycidyl ether, pentaerythritol tetraglycidyl ether, tetraphenyl glycidyl ether ethane, triphenyl glycidyl ether ethane, sorbitol polyglycidyl ether, and polyglycerol polyglycidyl ether; glycidylamine-based epoxy resins such as triglycidyl isocyanurate and tetraglycidyldiaminodiphenylmethane; linear aliphatic epoxy resins such as epoxidized polybutadiene and epoxidized soybean oil; and special skeleton epoxy resins such as brominated bisphenol A type epoxy resin, phosphorus-containing epoxy resin, fluorine-containing epoxy resin, dicyclopentadiene skeleton-containing epoxy resin, naphthalene skeleton-containing epoxy resin, anthracene type epoxy resin, tert-butylcatechol type epoxy resin, triphenylmethane type epoxy resin, tetraphenylethane type epoxy resin, biphenyl type epoxy resin, and bisphenol S type epoxy resin.

[0030] As high molecular weight epoxy resins, phenoxy epoxy resins, epoxy-modified polybutadiene, copolymers of glycidyl methacrylate and methyl methacrylate, and modified polymers obtained by epoxy modification of other resins can be used. These epoxy resins may be used individually or in combination of two or more.

[0031] Among the epoxy resins mentioned above, a polyfunctional epoxy resin is preferred as the epoxy resin used in the low-elasticity black curable resin layer 1, from the viewpoint of increasing the crosslinking density after curing. Among polyfunctional epoxy resins, novolac-type epoxy resins are particularly preferable because they allow for the introduction of a moderately flexible skeleton, enabling adjustment of flexibility and softening point. This makes the cured product less susceptible to brittle fracture, improving the stability of the performance of the cured epoxy resin composition over long-term use, increasing the crosslinking density, and improving heat resistance.

[0032] Specific examples of novolac-type epoxy resins include, for example, "YX7700" from Mitsubishi Chemical Corporation, "NC7000L," "XD1000," and "EOCN-1020" from Nippon Kayaku Co., Ltd., "ESN485" from Nippon Steel Chemical & Material Co., Ltd., and "N-690," "N-695," "HP-7200H," and "HP-7200L" from DIC Corporation.

[0033] The amount of polyfunctional epoxy resin blended in the low-elasticity black curable resin layer 1 is preferably 10 to 99% by mass, more preferably 40 to 95% by mass, and even more preferably 60 to 90% by mass, based on 100% by mass of the total resin solids content of the low-elasticity black curable resin layer 1. If the amount is above the lower limit, the crosslinking density can be increased to impart chemical resistance and heat resistance. If the amount is below the upper limit, the storage modulus during thermocompression bonding can be adjusted, and the fluidity of the low-elasticity black curable resin layer 1 can be ensured.

[0034] The low-elasticity black curable resin layer 1 preferably does not contain high molecular weight epoxy resin, or if it does, it contains it in a smaller amount than the high-elasticity transparent curable resin layer 3. This makes it easier to ensure sufficient fluidity during heat bonding.

[0035] In the low-elasticity black curable resin layer 1, the amount of high molecular weight epoxy resin blended is preferably less than 50% by mass, more preferably less than 30% by mass, and even more preferably less than 10% by mass, based on 100% by mass of the total resin solids content of the low-elasticity black curable resin layer 1.

[0036] From the viewpoint of ensuring sufficient fluidity during thermocompression bonding, it is preferable that the low-elasticity black curable resin layer 1 contains an epoxy resin with a softening point or melting point of 100°C or lower. From the viewpoint of handling properties and heat resistance of the cured product, it is more preferable that it contains an epoxy resin with a softening point or melting point of 50 to 95°C. By including an epoxy resin having a softening point or melting point within the above range, it becomes possible to control the storage modulus.

[0037] The total amount of epoxy resin in the low-elasticity black curable resin layer 1 is preferably 10 to 100% by mass, more preferably 20 to 99% by mass, and even more preferably 35 to 95% by mass, based on 100% by mass of the total resin solids content of the low-elasticity black curable resin layer 1. Within this range, it is possible to control the storage modulus and ensure appropriate fluidity during heat bonding. Furthermore, if it is above the lower limit, the heat resistance after curing can be improved.

[0038] (Elastomer) The low-elasticity black curable resin layer 1 preferably contains an elastomer in addition to a resin such as epoxy resin. Including an elastomer makes it easier to control the storage modulus, i.e., control the fluidity.

[0039] As for the elastomer, a thermosetting elastomer, generally called "rubber," is preferred because it provides excellent heat resistance. Examples of thermosetting elastomers include acrylonitrile butadiene rubber (NBR), which is a random copolymer of butadiene and acrylonitrile, acrylic rubber, styrene butadiene rubber, vinyl acetate resin, and silicone resin. Among these, NBR is preferred because it has good compatibility with epoxy resin, allows control of the fluidity of the low-elasticity black curable resin layer 1 around 100°C, and has good adhesion to the low-elasticity transparent curable resin layer 2 and the element-equipped substrate 10.

[0040] The weight-average molecular weight of the elastomer is preferably 100,000 to 1,000,000, more preferably 120,000 to 500,000, and even more preferably 150,000 to 300,000. If the weight-average molecular weight of the elastomer is within the above range, the storage modulus of the low-elasticity black curable resin layer 1 can be controlled, and fluidity during thermal bonding can be ensured. If the weight-average molecular weight of the elastomer is below the above upper limit, the compatibility with the epoxy resin is improved, and the flow during thermal curing can be controlled more effectively.

[0041] In particular, when the low-elasticity black curable resin layer 1 is composed of an epoxy resin composition, it is preferable to include a modified elastomer having functional groups that can react with epoxy groups. If a modified elastomer has functional groups that can react with epoxy groups, it also acts as a curing agent for the epoxy resin. Furthermore, because it can react and bond with the epoxy resin, its heat resistance and reliability against thermal shock are improved. In addition, the difference in polarity between the functional groups that can react with the epoxy resin and the resin skeleton has a good effect on dispersibility, and good dispersibility can be obtained when carbon black is included in the low-elasticity black curable resin layer 1.

[0042] Functional groups that can react with epoxy groups include acidic groups such as carboxyl groups, sulfo groups, nitro groups, and phosphoric acid groups, as well as their acid anhydride groups, hydroxyl groups, and amino groups. Among these, acidic groups or acid anhydride groups are preferred because they allow curing at low temperatures and ensure a long pot life, and carboxyl groups or carboxylic acid anhydride groups are particularly preferred.

[0043] In other words, when the low-elasticity black curable resin layer 1 is composed of an epoxy resin composition, it is preferable to contain an acid-modified elastomer having acid groups or acid anhydride groups, and more preferably an acid-modified elastomer having carboxyl groups. It is particularly preferable to contain acid-modified acrylonitrile butadiene rubber (acid-modified NBR) having carboxyl groups.

[0044] As acid-modified NBR having a carboxyl group, carboxylated acrylonitrile rubber into which acrylic acid, methacrylic acid, maleic anhydride, etc. have been introduced is preferred. Examples of commercially available carboxylated acrylonitrile rubber include Nipol® NX775 and Nipol 1072CGJ manufactured by Nippon Zeon Co., Ltd. Two or more modified elastomers having functional groups that can react with epoxy groups may be used in combination.

[0045] The amount of elastomer in the low-elasticity black curable resin layer 1 is preferably greater than the amount of elastomer in the high-elasticity transparent curable resin layer 3. This allows the storage modulus of the low-elasticity black curable resin layer 1 during thermocompression bonding to be adjusted to a suitable range lower than that of the high-elasticity transparent curable resin layer 3, especially in formulations of the low-elasticity black curable resin layer 1 that contain a large amount of low molecular weight components such as polyfunctional epoxy, and also suppresses flow during thermosetting. As a result, the low-elasticity black curable resin layer 1 can have sufficient fluidity during thermocompression bonding and suppress flow during thermosetting.

[0046] The amount of elastomer in the low-elasticity black curable resin layer 1 is preferably 0.01 to 90% by mass, more preferably 1 to 80% by mass, and even more preferably 5 to 65% by mass, based on 100% by mass of the total resin solids content of the low-elasticity black curable resin layer 1. Within this range, it is possible to control the storage modulus and ensure appropriate fluidity during thermocompression bonding. Furthermore, above the lower limit, the dispersibility of carbon black improves. In addition, film formation is improved, and the film thickness distribution can be narrowed when coating and forming a film with the epoxy resin composition.

[0047] (Hardening agent) When the low-elasticity black curable resin layer 1 is composed of an epoxy resin composition, it may contain other curing agents for epoxy resins other than modified elastomers having functional groups that can react with epoxy groups. Examples of other curing agents include known curing agents such as phenolic curing agents, acid anhydride curing agents, and amine curing agents. Other hardening agents may be used in combination of two or more types.

[0048] (curing catalyst) If the low-elasticity black curable resin layer 1 is composed of an epoxy resin composition, it may also contain a curing catalyst that promotes the curing reaction of the epoxy resin. Examples of curing catalysts include imidazole-based, tertiary amine-based, and phosphorus compound-based catalysts. Among these, imidazole-based catalysts are preferred because they have good compatibility with epoxy resins and are less likely to cause yellowing. Among imidazole-based curing catalysts, those having a cyanoethyl group are particularly preferred because they dissolve easily in epoxy resins.

[0049] The amount of curing catalyst added is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 4 parts by mass, and even more preferably 0.1 to 3 parts by mass, per 100 parts by mass of the total resin solids of the low-elastic black curable resin layer 1. Within this range, curing can proceed sufficiently, and the pot life of the dry film 100 can be ensured. Two or more curing catalysts may be used in combination.

[0050] (Black pigment or black dye) The low-elasticity black curable resin layer 1 is colored black. For coloring, it is preferable to contain a black pigment or black dye, more preferably a black pigment, and even more preferably carbon black. The black coloring provides light diffusion prevention between the multiple light-emitting elements of the element-equipped substrate 10.

[0051] The particle size of the carbon black is preferably 10 to 500 nm, more preferably 10 to 300 nm, and particularly preferably 10 to 100 nm. Note that the particle size refers to the average particle size and can be determined using a dynamic light scattering measurement device. An example of a dynamic light scattering measurement device is the NanotracWave II UT151 manufactured by Microtrac-Bell.

[0052] The pH of carbon black according to ISO 787-9 is preferably 5 or less, more preferably 1 to 4.5, and even more preferably 2 to 4. When the pH of the carbon black is below a preferred upper limit, good dispersibility is obtained, and the blackness can be improved. When the pH of the carbon black is above a preferred lower limit, the dispersion stability in the coating liquid of the low-elasticity black curable resin layer is improved, and the stability of sedimentation and blackness is enhanced.

[0053] As the carbon black, one or more known types of carbon black, such as gas black, channel black, furnace black, thermal black, and lamp black, can be used. Resin-coated carbon black may also be used. Furthermore, carbon nanofibers and carbon nanotubes may be used.

[0054] Among these, gas black, which is an acidic carbon, is preferred because it has a large amount of surface functional groups, high dispersibility, and exhibits sufficient light diffusion prevention function with only a small amount added. Furthermore, when the low-elasticity black curable resin layer 1 contains a modified elastomer having functional groups that can react with epoxy resin, the interaction between the surface functional groups of gas black and the functional groups of the modified elastomer having functional groups that can react with epoxy resin further enhances dispersibility, ensuring good light diffusion prevention and coating stability.

[0055] The amount of carbon black added is preferably 0.1 to 15% by mass, and more preferably 1.0 to 10% by mass, based on the total solid content of the low-elasticity black curable resin layer 1. Sufficient light shielding can be obtained if the amount of carbon black added is equal to or greater than the lower limit. If the amount of carbon black added exceeds the upper limit, the thixotropy of the low-elasticity black curable resin layer 1 increases, reducing its fluidity during thermocompression bonding, and making it impossible to adequately fill the spaces between the multiple light-emitting elements of the substrate 10 with the elements.

[0056] (Other ingredients) The low-elasticity black curable resin layer 1 may contain inorganic fillers to improve flame retardancy and heat resistance, and to adjust the refractive index. The low-elasticity black curable resin layer 1 may further contain, if necessary, resins other than epoxy resin and elastomer, thickeners, defoamers and / or adhesion-enhancing agents such as leveling agents and coupling agents, and flame retardants.

[0057] <Transparent curable resin layer> The dry film 100 of this embodiment comprises two transparent curable resin layers: a low-elasticity transparent curable resin layer 2 and a high-elasticity transparent curable resin layer 3. These two layers have high total light transmittance. The total light transmittance of the low-elasticity transparent curable resin layer 2 and the high-elasticity transparent curable resin layer 3 are measured in the cured state.

[0058] <Low elasticity transparent curable resin layer 2> The low-elasticity transparent curable resin layer 2 is a layer that, during the thermocompression bonding process, is pressed between the multiple light-emitting elements arranged on the element-equipped substrate 10, and at least a portion of it is also filled between the multiple light-emitting elements.

[0059] [Total light transmittance] The low-elasticity transparent curable resin layer 2 is preferably prepared so that the total light transmittance in the cured state is 50% or more, more preferably 50-95%, and even more preferably 80-90%. Because the total light transmittance of the low-elasticity transparent curable resin layer 2 in its cured state is above the lower limit, even if the low-elasticity transparent curable resin layer 2 remains on top of the light-emitting element in its cured state, the reach of light to the viewer is not obstructed.

[0060] [Storage modulus] The low-elasticity transparent curable resin layer 2 is in an uncured or semi-cured state before being pressed onto the element-equipped substrate 10 and cured. The storage modulus of the low-elasticity transparent curable resin layer 2 before curing is smaller than that of the high-elasticity transparent curable resin layer 3 before curing at 100°C. It is also preferable that the storage modulus of the low-elasticity black curable resin layer 1 before curing is the same as or greater than that of the low-elasticity black curable resin layer 1 at 100°C.

[0061] The storage modulus of the low-elasticity transparent curable resin layer 2 before curing is 1.0 × 10⁻⁶ at 100°C. 5 It is preferable that it is Pa or less, and 1.0 × 10 3 ~1.0×10 5 It is preferable that it be Pa, 5.0 × 10 3 ~1.0×10 5 It is more preferable that it be Pa.

[0062] The storage modulus of the low-elasticity transparent curable resin layer 2 at 100°C is below a preferred upper limit, which allows for sufficient fluidity when pressed onto the element-equipped substrate 10. This enables the layer to follow the irregularities of the element-equipped substrate 10 caused by the multiple light-emitting elements and, together with the low-elasticity black curable resin layer 1, adequately fill the spaces between the multiple light-emitting elements.

[0063] If the storage modulus of the low-elasticity transparent curable resin layer 2 at 100°C exceeds a preferred upper limit, the fluidity of the low-elasticity transparent curable resin layer 2 becomes insufficient, making it difficult to adequately fill the spaces between multiple light-emitting elements, and also making it difficult to adequately press the low-elasticity black curable resin layer 1 into the spaces between multiple light-emitting elements. The storage modulus of the low-elasticity transparent curable resin layer 2 at 100°C before curing is preferably 0.8 to 1000 times, and more preferably 1 to 100 times, compared to the storage modulus of the low-elasticity black curable resin layer 1 before curing.

[0064] [Curable resin composition] The low-elasticity transparent curable resin layer 2 is composed of a curable resin composition. Similar to the low-elasticity black curable resin layer 1, the curable resin composition may include a thermosetting resin composition containing at least one resin selected from epoxy resin, acrylic resin, polyester resin, and polyurethane resin, and a curing agent. Among these, an epoxy resin composition is preferred because it enables curing at low temperatures and exhibits excellent heat resistance and reliability.

[0065] (Epoxy resin) Examples of epoxy resins used in the low-elasticity transparent curable resin layer 2 include those of the same type as those used in the low-elasticity black curable resin layer 1. Among the epoxy resins mentioned above, polyfunctional epoxy resins are preferred as the epoxy resin used in the low-elasticity transparent curable resin layer 2 because they allow for a high crosslink density after curing and have an appropriate molecular weight, making it easy to adjust the elastic modulus.

[0066] When the low-elasticity transparent curable resin layer 2 contains a high molecular weight epoxy resin, the amount of the epoxy resin added is preferably 50% by mass or less, more preferably 35% by mass or less, and even more preferably 10 to 35% by mass, based on 100% by mass of the total resin solids content of the low-elasticity transparent curable resin layer 2. If the amount of high molecular weight epoxy resin in the low-elasticity transparent curable resin layer 2 is above the preferred lower limit, it becomes easier to obtain a storage modulus that sufficiently presses the low-elasticity black curable resin layer 1 between multiple light-emitting elements. If it is below the preferred upper limit, the low-elasticity transparent curable resin layer 2 is more likely to fill the spaces between multiple light-emitting elements.

[0067] In the low-elasticity transparent curable resin layer 2, the total amount of epoxy resin blended is preferably 10 to 100% by mass, more preferably 20 to 99% by mass, and even more preferably 35 to 95% by mass, based on 100% by mass of the total resin solids content of the low-elasticity transparent curable resin layer 2. If the total amount of epoxy resin in the low-elasticity transparent curable resin layer 2 is within the above range, it is possible to control the storage modulus and ensure appropriate fluidity during thermal bonding. Furthermore, if it is above the lower limit, the heat resistance after curing can be improved.

[0068] (Elastomer) The low-elasticity transparent curable resin layer 2 preferably contains an elastomer in addition to a resin such as epoxy resin. Including an elastomer makes it easier to control the storage modulus.

[0069] Examples of elastomers include those similar to those used for the low-elasticity black curable resin layer 1. Among these, NBR is preferred because it has good compatibility with epoxy resin, can increase the storage modulus of the low-elasticity transparent curable resin layer 2 at around 150°C, and has good adhesion to the low-elasticity black curable resin layer 1. The preferred weight-average molecular weight of the elastomer is also the same as that of the low-elasticity black curable resin layer 1.

[0070] In particular, when the low-elasticity transparent curable resin layer 2 is composed of an epoxy resin composition, it is preferable to include a modified elastomer having functional groups that can react with epoxy groups. If a modified elastomer has functional groups that can react with epoxy groups, it also acts as a curing agent for the epoxy resin. Furthermore, because it can react and bond with the epoxy resin, its heat resistance and reliability against thermal shock are improved.

[0071] Functional groups that can react with epoxy groups include those similar to those in the low-elasticity black curable resin layer 1. Among these, acid groups or acid anhydride groups are preferred, and carboxyl groups or carboxylic acid anhydride groups are particularly preferred, as they allow curing at low temperatures and ensure a long pot life.

[0072] When the low-elasticity transparent curable resin layer 2 is composed of an epoxy resin composition, it is particularly preferable that it contains acid-modified NBR having a carboxyl group. Examples of acid-modified NBR having a carboxyl group include those similar to the low-elasticity black curable resin layer 1. Two or more modified elastomers having functional groups that can react with epoxy groups may be used in combination.

[0073] The amount of elastomer in the low-elasticity transparent curable resin layer 2 is preferably 90% by mass or less, more preferably 1 to 80% by mass, and even more preferably 5 to 65% by mass, based on 100% by mass of the total resin solids content of the low-elasticity transparent curable resin layer 2. If the amount of elastomer in the low-elasticity transparent curable resin layer 2 is above the preferred lower limit, film formation is improved, and the distribution of film thickness during film formation can be narrowed. If it is below the preferred upper limit, the low-elasticity transparent curable resin layer 2 is more likely to fill the spaces between multiple light-emitting elements.

[0074] (Hardening agent) When the low-elasticity transparent curable resin layer 2 is composed of an epoxy resin composition, it may contain other curing agents for epoxy resins other than modified elastomers having functional groups that can react with epoxy groups. Examples of other curing agents include those similar to those used for the low-elasticity black curable resin layer 1. Two or more of these other curing agents may be used in combination.

[0075] (curing catalyst) If the low-elasticity transparent curable resin layer 2 is composed of an epoxy resin composition, it may also contain a curing catalyst to promote the curing reaction of the epoxy resin. Examples of curing catalysts include those similar to those used in the low-elasticity black curable resin layer 1, and preferred embodiments are also similar.

[0076] The amount of curing catalyst added is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 4 parts by mass, and even more preferably 0.1 to 3 parts by mass, per 100 parts by mass of the total resin solids of the low-elasticity transparent curable resin layer 2. Within this range, curing can proceed sufficiently, and the pot life of the dry film 100 can be ensured. Two or more curing catalysts may be used in combination.

[0077] (Other ingredients) The low-elasticity transparent curable resin layer 2 may contain a black pigment or black dye to suppress uneven luminescence and color unevenness.

[0078] From the viewpoint of increasing the total light transmittance, if the low-elasticity transparent curable resin layer 2 contains carbon black, the amount of carbon black added is preferably less than 5 parts by mass, more preferably 1 part by mass or less, and even more preferably 0.1 parts by mass or less, per 100 parts by mass of total resin solids. The low-elasticity transparent curable resin layer 2 may further contain, if necessary, resins other than epoxy resin and elastomer, thickeners, defoamers and / or adhesion-enhancing agents such as leveling agents and coupling agents, and flame retardants.

[0079] <High-elasticity transparent curable resin layer 3> The highly elastic transparent curable resin layer 3 is a layer used in the thermocompression bonding process to sufficiently press the low-elastic black curable resin layer 1 and the low-elastic transparent curable resin layer 2 between the multiple light-emitting elements arranged on the element-equipped substrate 10, and to remove the low-elastic black curable resin layer 1 from the light-emitting elements.

[0080] [Total light transmittance] The highly elastic transparent curable resin layer 3 is preferably prepared so that the total light transmittance in the cured state is 50% or more, more preferably 75-99.5%, and even more preferably 80-99.5%. Because the total light transmittance of the highly elastic transparent curable resin layer 3 in its cured state is above the lower limit, the reach of light to the viewer is not obstructed.

[0081] [Storage modulus] The highly elastic transparent curable resin layer 3 is in an uncured or semi-cured state before being pressed onto the element-equipped substrate 10 and cured. The storage modulus of the highly elastic transparent curable resin layer 3 before curing is greater than that of the uncured low-elastic black curable resin layer 1 and the uncured low-elastic transparent curable resin layer 2 at 100°C. Preferably, the storage modulus of the high-elasticity transparent curable resin layer 3 before curing is greater than the storage modulus of the low-elasticity black curable resin layer 1 and the low-elasticity transparent curable resin layer 2 before curing, at temperatures between 100°C and 150°C.

[0082] Furthermore, if the storage modulus of the high-elasticity transparent curable resin layer 3 before curing is greater than the storage modulus of the low-elasticity black curable resin layer 1 and the low-elasticity transparent curable resin layer 2 before curing at 100°C and 150°C, then typically, the storage modulus of the high-elasticity transparent curable resin layer 3 before curing is greater than the storage modulus of the low-elasticity black curable resin layer 1 and the low-elasticity transparent curable resin layer 2 before curing across the entire range from 100°C to 150°C.

[0083] The storage modulus of the highly elastic transparent curable resin layer 3 before curing is 1.0 × 10⁻⁶ at 100°C. 7 It is preferable that it is Pa or less, and 1.0 × 10 4 Pa or more, 1.0×10 7 It is preferable that it is less than or equal to Pa, 5.0 × 10 4 Pa or more, 5.0×10 6 It is more preferable that the value be Pa or less.

[0084] The storage modulus of the high-elasticity transparent curable resin layer 3 at 100°C is within a preferred range. This allows for the transmission of stress to the low-elasticity black curable resin layer 1 and the low-elasticity transparent curable resin layer 2 during bonding to the element-equipped substrate 10. This achieves both elasticity, sufficient removal of the low-elasticity black curable resin layer 1 from the light-emitting elements, and flexibility, allowing deformation to follow the irregularities of multiple light-emitting elements. As a result, the low-elasticity black curable resin layer 1 and the low-elasticity transparent curable resin layer 2 can adequately fill the spaces between multiple light-emitting elements.

[0085] If the storage modulus of the high-elasticity transparent curable resin layer 3 at 100°C exceeds a preferred upper limit before curing, the fluidity of the high-elasticity transparent curable resin layer 3 becomes insufficient, making it difficult to deform to follow the irregularities of multiple light-emitting elements. As a result, the low-elasticity black curable resin layer 1 cannot be sufficiently removed only from the upper parts of the lower-height light-emitting elements, leading to a decrease in brightness. Furthermore, it becomes difficult to sufficiently press the low-elasticity black curable resin layer 1 between the multiple light-emitting elements, making it easier for defects such as air bubbles from remaining voids to occur. In addition, cracks may occur in the high-elasticity transparent curable resin layer 3 during thermocompression bonding, making it easier for crack-like defects to occur.

[0086] If the storage modulus of the high-elasticity transparent curable resin layer 3 at 100°C falls below a preferred lower limit, it becomes difficult to adequately remove the low-elasticity black curable resin layer 1 on the light-emitting element. Furthermore, if the fluidity of the high-elasticity transparent curable resin layer 3 is too high, the surface of the high-elasticity transparent curable resin layer 3 becomes uneven after thermal bonding, resulting in a poor appearance.

[0087] The storage modulus of the high-elasticity transparent curable resin layer 3 before curing is 1.0 × 10⁻⁶ at 150°C. 4 Preferably Pa or higher, 1.0 × 10 4 ~5.0×10 7 It is preferably Pa, 1.0 × 10 5 ~1.0×10 7 It is more preferable that it be Pa.

[0088] If the storage modulus of the high-elasticity transparent curable resin layer 3 at 150°C before curing exceeds a preferred upper limit, cracks are more likely to occur due to curing shrinkage during thermal curing. By keeping the storage modulus of the high-elasticity transparent curable resin layer 3 at 150°C above a preferred lower limit, flow during thermal curing can be suppressed, post-curing appearance defects such as repellency can be reduced, and furthermore, problems are less likely to occur when etching is performed in a subsequent process.

[0089] The storage modulus of the high-elasticity transparent curable resin layer 3 at 100°C before curing is preferably 10 to 1000 times, and more preferably 30 to 500 times, the storage modulus of the low-elasticity black curable resin layer 1 and the low-elasticity transparent curable resin layer 2 before curing. The storage modulus of the high-elasticity transparent curable resin layer 3 at 150°C before curing is preferably 5 to 10000 times, and more preferably 10 to 1000 times, the storage modulus of the low-elasticity black curable resin layer 1 and the low-elasticity transparent curable resin layer 2 before curing.

[0090] [Curable resin composition] The highly elastic transparent curable resin layer 3 is composed of a curable resin composition. Similar to the low-elastic black curable resin layer 1, the curable resin composition may include a thermosetting resin composition containing at least one resin selected from epoxy resin, acrylic resin, polyester resin, and polyurethane resin, and a curing agent. Among these, an epoxy resin composition is preferred because it enables curing at low temperatures and exhibits excellent heat resistance and reliability.

[0091] (Epoxy resin) Examples of epoxy resins used in the highly elastic transparent curable resin layer 3 include those of the same type as those used in the low-elastic black curable resin layer 1.

[0092] From the viewpoint of imparting an appropriate viscosity during compression to the highly elastic transparent curable resin layer 3, it is preferable that the highly elastic transparent curable resin layer 3 contains a high molecular weight epoxy resin with a weight-average molecular weight of 10,000 to 100,000. From the viewpoint of good compatibility with other resin components and the ability to dissolve without mixing in solvents with high boiling points that may remain in the dry film after drying, it is even more preferable that the high molecular weight epoxy resin contains a weight-average molecular weight of 10,000 to 35,000.

[0093] The epoxy resin used in the highly elastic transparent curable resin layer 3 includes a high molecular weight epoxy resin with a weight-average molecular weight of 10,000 to 100,000. Because it has an appropriate viscosity when heated, the storage modulus of the highly elastic transparent curable resin layer 3 in the range of 100°C to 150°C can be adjusted to a desirable range. The high molecular weight epoxy resin used in the highly elastic transparent curable resin layer 3 is preferably a phenoxy-type epoxy resin because of its good compatibility with other epoxy resins.

[0094] Phenoxy epoxy resins have a relatively large molecular weight compared to other epoxy resins and possess a suitable viscosity when heated, allowing the storage modulus of the highly elastic transparent curable resin layer 3 in the 100°C to 150°C range to be adjusted to a desirable range. Furthermore, unlike other thermoplastic resins such as polyester, phenoxy epoxy resins can be cured as epoxy resins, allowing for increased crosslinking density without compromising the heat resistance or reliability of the cured product's performance over long-term use.

[0095] From the viewpoint of ensuring a storage modulus that allows the low-elasticity black curable resin layer 1 to be pressed in during thermocompression bonding, it is preferable that the glass transition temperature of the phenoxy-type epoxy resin used in the high-elasticity transparent curable resin layer 3 be 100°C or higher.

[0096] Specific examples of phenoxy epoxy resins include, for example, "1256," "YX7200," "YX8100," and "YX7180" from Mitsubishi Chemical Corporation, "YP-50," "YP-50S," and "YP-70" from Nippon Steel Chemical & Material Corporation, and "N-690," "H-157," and "EXA-192" from DIC Corporation.

[0097] The amount of high molecular weight epoxy resin blended in the highly elastic transparent curable resin layer 3 is preferably 30 to 80% by mass, more preferably 40 to 75% by mass, and even more preferably 45 to 70% by mass, based on 100% by mass of the total resin solids content of the highly elastic transparent curable resin layer 3. The preferred amount of phenoxy-type epoxy resin in the highly elastic transparent curable resin layer 3 is similar.

[0098] Within the above range, the storage modulus can be controlled, ensuring sufficient storage modulus to press the low-elasticity black curable resin layer 1 and the high-elasticity transparent curable resin layer 3 together during thermocompression bonding, and allowing for adequate removal of the low-elasticity black curable resin layer 1 from the light-emitting element. Furthermore, flow during thermocuring can be suppressed, preventing post-curing appearance defects such as repellency, and minimizing problems when etching is performed in subsequent processes. In addition, toughness is improved, making it less likely for crack-like defects to occur during thermocompression bonding. Furthermore, if the value is below the above upper limit, the crosslinking density of the highly elastic transparent curable resin layer 3 in the cured state can be increased, improving heat resistance and chemical resistance.

[0099] Furthermore, it is preferable that the epoxy resin used in the highly elastic transparent curable resin layer 3 includes a polyfunctional epoxy resin. By increasing the crosslinking density of the polyfunctional epoxy resin, the stability of the performance of the cured epoxy resin composition for long-term use is further improved, and the heat resistance is also improved. In addition, because it has a lower viscosity in the range of 100°C to 150°C than phenoxy-type epoxy resin, the storage modulus of the highly elastic transparent curable resin layer 3 can be adjusted by combining it with a phenoxy-type epoxy resin.

[0100] Specific examples of polyfunctional epoxy resins include, for example, "YX7700," "157S70," and "1032S60" from Mitsubishi Chemical Corporation, "NC7000L," "XD1000," and "EOCN-1020" from Nippon Kayaku Co., Ltd., "ESN485" from Nippon Steel Chemical & Material Co., Ltd., and "N-690," "N-695," and "HP-7200H" from DIC Corporation.

[0101] The amount of polyfunctional epoxy resin blended in the highly elastic transparent curable resin layer 3 is preferably 90% by mass or less, more preferably 10 to 80% by mass, and even more preferably 20 to 70% by mass, based on 100% by mass of the total resin solids content of the highly elastic transparent curable resin layer 3. Within this range, the storage modulus of the highly elastic transparent curable resin layer 3 during thermocompression bonding can be controlled, and heat resistance and chemical resistance can be imparted in the cured state.

[0102] From the viewpoint of ensuring sufficient fluidity during thermocompression bonding, it is preferable that the highly elastic transparent curable resin layer 3 contains an epoxy resin with a softening point or melting point of 120°C or lower. From the viewpoint of handling properties and heat resistance of the cured product, it is more preferable that it contains an epoxy resin with a softening point or melting point of 50 to 105°C. By including an epoxy resin having a softening point or melting point within the above range, it becomes possible to control the storage modulus.

[0103] In the highly elastic transparent curable resin layer 3, the total amount of epoxy resin is preferably 10 to 100% by mass, more preferably 30 to 99% by mass, and even more preferably 50 to 95% by mass, based on 100% by mass of the total resin solids content of the highly elastic transparent curable resin layer 3. Within this range, it is possible to control the storage modulus and ensure that the storage modulus is sufficient to press the low-elastic black curable resin layer 1 during thermal bonding. Furthermore, it is possible to suppress flow during thermal curing, which suppresses defects in the appearance after curing, such as repulsion, and also reduces the likelihood of problems occurring when etching is performed in a subsequent process. Moreover, if the value is above the lower limit, the heat resistance in the cured state is improved.

[0104] (Elastomer) The highly elastic transparent curable resin layer 3 preferably contains an elastomer in addition to a resin such as epoxy resin. Including an elastomer makes it easier to control the storage modulus.

[0105] Examples of elastomers include those similar to those used for the low-elasticity black curable resin layer 1. Among these, NBR is preferred because it has good compatibility with epoxy resin, can increase the storage modulus of the high-elasticity transparent curable resin layer 3 at around 150°C, and has good adhesion to the low-elasticity transparent curable resin layer 2. The preferred weight-average molecular weight of the elastomer is also the same as that of the low-elasticity black curable resin layer 1.

[0106] In particular, when the highly elastic transparent curable resin layer 3 is composed of an epoxy resin composition, it is preferable to include a modified elastomer having functional groups that can react with epoxy groups. If a modified elastomer having functional groups that can react with epoxy groups is present, it also acts as a curing agent for the epoxy resin. Furthermore, because it can react and bond with the epoxy resin, its heat resistance and reliability against thermal shock are improved. In addition, the difference in polarity between the functional groups that can react with the epoxy resin and the resin skeleton has a good effect on dispersibility, and good dispersibility can be obtained when carbon black is included in the highly elastic transparent curable resin layer 3.

[0107] Functional groups that can react with epoxy groups include those similar to those in the low-elasticity black curable resin layer 1. Among these, acid groups or acid anhydride groups are preferred, and carboxyl groups or carboxylic acid anhydride groups are particularly preferred, as they allow curing at low temperatures and ensure a long pot life.

[0108] When the highly elastic transparent curable resin layer 3 is composed of an epoxy resin composition, it is particularly preferable that it contains acid-modified NBR having a carboxyl group. Examples of acid-modified NBR having a carboxyl group include those similar to the low-elasticity black curable resin layer 1. Two or more modified elastomers having functional groups that can react with epoxy groups may be used in combination.

[0109] The amount of elastomer in the highly elastic transparent curable resin layer 3 is preferably 0 to 50% by mass, more preferably 1 to 70% by mass, and even more preferably 5 to 50% by mass, based on 100% by mass of the total resin solids content of the highly elastic transparent curable resin layer 3. Within this range, the storage modulus can be controlled. If it is below the upper limit, the storage modulus that can press the low-elastic black curable resin layer during thermal bonding can be ensured. Furthermore, flow during thermal curing can be suppressed, post-curing appearance defects such as repulsion can be suppressed, and problems are less likely to occur when etching is performed in a subsequent process. Furthermore, if it is above the lower limit, the dispersibility of carbon black is improved. In addition, film formation is improved, and the film thickness distribution when coating and forming an epoxy resin composition can be narrowed.

[0110] (Hardening agent) When the highly elastic transparent curable resin layer 3 is composed of an epoxy resin composition, it may contain other curing agents for epoxy resins other than modified elastomers having functional groups that can react with epoxy groups. Examples of other curing agents include those similar to those used for the low-elastic black curable resin layer 1 and the low-elastic transparent curable resin layer 2. Two or more of these other curing agents may be used in combination.

[0111] (curing catalyst) When the highly elastic transparent curable resin layer 3 is composed of an epoxy resin composition, it may also contain a curing catalyst that promotes the curing reaction of the epoxy resin. Examples of curing catalysts include those similar to those used in the low-elasticity black curable resin layer 1 and the low-elasticity transparent curable resin layer 2, and preferred embodiments are also similar.

[0112] The amount of curing catalyst added is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 4 parts by mass, and even more preferably 0.1 to 3 parts by mass, per 100 parts by mass of the total resin solids of the highly elastic transparent curable resin layer 3. Within this range, curing can proceed sufficiently, and the pot life of the dry film 100 can be ensured. Two or more curing catalysts may be used in combination.

[0113] (Other ingredients) The highly elastic, transparent, curable resin layer 3 may contain a black pigment or black dye to suppress uneven luminescence and color. From the viewpoint of increasing the total light transmittance, if the highly elastic transparent curable resin layer 3 contains carbon black, the amount of carbon black added is preferably less than 5 parts by mass, more preferably 1 part by mass or less, and even more preferably 0.1 parts by mass or less, per 100 parts by mass of total resin solids. The highly elastic transparent curable resin layer 3 may further contain, if necessary, resins other than epoxy resin and elastomer, thickeners, defoamers and / or adhesion-enhancing agents such as leveling agents and coupling agents, and flame retardants.

[0114] <Protective film> The first protective film 6 and the second protective film 7 (hereinafter, the first protective film 6 and the second protective film 7 may be collectively referred to simply as "protective film") serve to protect the low-elasticity black curable resin layer 1, the low-elasticity transparent curable resin layer 2, and the high-elasticity transparent curable resin layer 3. When forming these curable resin layers, they can also be used as films to which the coating liquid of the curable resin composition is applied.

[0115] As protective films, for example, films made of thermoplastic resins such as polyester films like polyethylene terephthalate and polyethylene naphthalate, polyimide films, polyamide-imide films, polyethylene films, polytetrafluoroethylene films, polypropylene films, and polystyrene films, as well as surface-treated paper, can be used.

[0116] Among these, polyester film is suitably used from the viewpoint of heat resistance, mechanical strength, and ease of handling. The thickness of the protective film is not particularly limited, but is generally selected appropriately in the range of 10 to 150 μm depending on the application. The surface on which the resin layer of the protective film is provided may be treated with a release agent.

[0117] <Method for manufacturing dry film> To obtain the dry film 100, first, a coating solution of the curable resin composition for the high-elasticity transparent curable resin layer 3 is applied to the second protective film 7 and dried, and a coating solution of the curable resin composition for the low-elasticity transparent curable resin layer 2 is applied to the release film and dried. These are then stacked so that the high-elasticity transparent curable resin layer 3 and the low-elasticity transparent curable resin layer 2 are in contact, laminated, and the release film is peeled off to obtain a laminate in which the low-elasticity transparent curable resin layer 2, the high-elasticity transparent curable resin layer 3, and the second protective film 7 are sequentially laminated. Next, a first protective film 6 is prepared by applying a coating solution of a curable resin composition for the low-elasticity black curable resin layer 1 and drying it.

[0118] Subsequently, these are stacked so that the low-elasticity transparent curable resin layer 2 and the low-elasticity black curable resin layer 1 are in contact with each other, and laminated to obtain a laminate in which the low-elasticity black curable resin layer 1, the low-elasticity transparent curable resin layer 2, the high-elasticity transparent curable resin layer 3, and the second protective film 7 are sequentially laminated on the first protective film 6.

[0119] It is preferable that the coating liquid of the curable resin composition for the low-elasticity black curable resin layer 1, the coating liquid of the curable resin composition for the low-elasticity transparent curable resin layer 2, and the coating liquid of the curable resin composition for the high-elasticity transparent curable resin layer 3 contain an amount of organic solvent that results in a viscosity that allows for application without hindrance. There are no particular restrictions on organic solvents, but examples include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, and petroleum-based solvents. Specifically, these include ketones such as methyl ethyl ketone, cyclohexanone, methyl butyl ketone, and methyl isobutyl ketone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and triethylene glycol monoethyl ether; and ethyl acetate, butyl acetate, isobutyl acetate, and ethyl acetate. Esters such as propylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, and propylene glycol butyl ether acetate; alcohols such as ethanol, propanol, 2-methoxypropanol, n-butanol, isobutyl alcohol, isopentyl alcohol, ethylene glycol, and propylene glycol; aliphatic hydrocarbons such as octane and decane; petroleum-based solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha; and other substances such as N,N-dimethylformamide (DMF), tetrachloroethylene, and turpentine oil.

[0120] When incorporating carbon black into the coating solution, either carbon black powder or carbon black dispersion may be added.

[0121] Examples of coating methods for the curable resin composition for the low-elasticity black curable resin layer 1, the curable resin composition for the low-elasticity transparent curable resin layer 2, and the curable resin composition for the high-elasticity transparent curable resin layer 3 include various coaters such as die coaters, gravure coaters, roll coaters, curtain flow coaters, spin coaters, bar coaters, reverse coaters, kiss coaters, fountain coaters, rod coaters, air doctor coaters, knife coaters, blade coaters, cast coaters, and screen coaters. The drying temperature is preferably 60 to 160°C, preferably 80 to 130°C, and more preferably 90 to 120°C.

[0122] The lamination temperature is preferably 20 to 120°C, more preferably 30 to 100°C, and even more preferably 40 to 80°C. By setting the lamination temperature above the preferred lower limit, sufficient adhesion can be ensured between the low-elasticity black curable resin layer 1 and the low-elasticity transparent curable resin layer 2, allowing for handling even in an uncured or semi-cured state. Furthermore, by setting the lamination temperature below the preferred upper limit, the formation of air bubbles and the occurrence of wrinkles can be prevented. Lamination can be performed using a roll laminator, press, vacuum press, etc.

[0123] <Substrate with this component> As shown in Figure 2, the element-equipped substrate 10 has multiple light-emitting elements arranged on the substrate 11. In Figure 2, etc., a schematic representation is shown of the portion where three light-emitting elements (light-emitting element 12, light-emitting element 13, and light-emitting element 14) are arranged.

[0124] There are no limitations on the material of the substrate 11, but known printed circuit boards can be suitably used. Examples of known printed circuit boards include glass epoxy substrates, fluororesin substrates, and ceramic substrates. The light-emitting element is typically a light-emitting diode. The present invention is particularly suitable for cases where the light-emitting element is extremely small.

[0125] For example, light-emitting diodes with a height of 1000 nm to 200 μm and a side length of 0.001 to 0.5 mm can be used. For the substrate 10 with elements to obtain mini LEDs or micro LEDs, three colored light-emitting diodes (R, G, and B) can be used as light-emitting elements, or a blue light-emitting diode can be used as a light-emitting element.

[0126] <Manufacturing method for light-emitting electronic components> The present invention provides a method for manufacturing a light-emitting electronic component, which involves placing the dry film 100 of the present invention on the surface of a substrate equipped with multiple light-emitting elements, such that its low-elasticity black curable resin layer 1 is in contact with the multiple light-emitting elements, heat-pressing the film to fill the spaces between the multiple light-emitting elements with the low-elasticity black curable resin layer 1, the low-elasticity transparent curable resin layer 2, and a portion of the high-elasticity transparent curable resin layer 3, and then heating the film to cure the low-elasticity black curable resin layer 1, the low-elasticity transparent curable resin layer 2, and the high-elasticity transparent curable resin layer 3. The following describes a method for manufacturing a light-emitting electronic component according to one embodiment of the present invention, with reference to Figures 2 to 6.

[0127] In the manufacturing method of this embodiment, first, as shown in Figure 2, a dry film 100, in which the first protective film 6 has been peeled off to expose the low-elasticity black curable resin layer 1, is placed on the surface of the element-equipped substrate 10 on which the light-emitting elements 12, 13, and 14 are arranged, so that the low-elasticity black curable resin layer 1 is in contact with the dry film 100.

[0128] At this time, that is, before compression, the thickness of the low-elasticity black curable resin layer 1 is preferably 10 to 80% of the height of the light-emitting element. The lower limit is more preferably 15% or more, and even more preferably 30% or more. The upper limit is more preferably 70% or less, even more preferably 65% ​​or less, and particularly preferably 55% or less.

[0129] If the thickness of the low-elasticity black curable resin layer 1 is 10% or more of the height of the light-emitting element, it provides sufficient protection against light diffusion between the light-emitting elements. If the thickness of the low-elasticity black curable resin layer 1 is 15% or more of the height of the light-emitting element, the resin can be sufficiently filled between the light-emitting elements. If the thickness of the low-elasticity black curable resin layer 1 is 30% or more of the height of the light-emitting element, the rate of change in the film thickness of the low-elasticity black curable resin layer 1 after curing is small, and uniform blackness can be achieved throughout the entire light-emitting electronic component.

[0130] If the thickness of the low-elasticity black curable resin layer 1 is 80% or less of the height of the light-emitting element, a decrease in brightness can be prevented even if there are differences in the tilt or height of the light-emitting element, and the light from the light-emitting element will not be prevented from reaching the viewer. If the thickness of the low-elasticity black curable resin layer 1 is 70% or less of the height of the light-emitting element, leakage of the low-elasticity black curable resin layer to the outside during thermocompression bonding can be prevented. If the thickness of the low-elasticity black curable resin layer 1 is 55% or less of the height of the light-emitting element, the low-elasticity black curable resin layer 1, which has a light diffusion prevention function, can be appropriately filled between the light-emitting elements.

[0131] The thickness of the low-elasticity transparent curable resin layer 2 before compression is preferably 10 to 80% of the height of the light-emitting element. The lower limit is more preferably 15% or more, and even more preferably 20% or more. The upper limit is more preferably 70% or less, and even more preferably 60% or less.

[0132] If the thickness of the low-elasticity transparent curable resin layer 2 is 10% or more of the height of the light-emitting element, the low-elasticity transparent curable resin layer 2 can sufficiently press the low-elasticity black curable resin layer 1 between multiple light-emitting elements. If the thickness of the low-elasticity transparent curable resin layer 2 is 15% or more of the height of the light-emitting element, the low-elasticity black curable resin layer 1 can be uniformly pressed during thermocompression bonding, preventing variations in the thickness of the flowing low-elasticity black curable resin layer 1 from causing uneven black coloration. If the thickness of the low-elasticity transparent curable resin layer 2 is 20% or more of the height of the light-emitting element, the low-elasticity black curable resin layer 1 can be made thinner, further reducing the amount of the low-elasticity black curable resin layer 1 remaining on the light-emitting element.

[0133] If the thickness of the low-elasticity transparent curable resin layer 2 is 80% or less of the height of the light-emitting element, a decrease in brightness can be prevented even if there are differences in the tilt or height of the light-emitting element. If the thickness of the low-elasticity transparent curable resin layer 2 is 70% or less of the height of the light-emitting element, leakage of the low-elasticity transparent curable resin layer 2 to the outside during thermocompression bonding can be prevented.

[0134] The thickness of the highly elastic transparent curable resin layer 3 before compression is preferably 10 to 500% of the height of the light-emitting element. The lower limit is more preferably 15% or more, and even more preferably 20% or more. The upper limit is more preferably 200% or less, and even more preferably 150% or less.

[0135] If the thickness of the highly elastic transparent curable resin layer 3 is 10% or more of the height of the light-emitting element, the highly elastic transparent curable resin layer 3 can remove the low-elastic black curable resin layer 1 on the light-emitting element, and by not leaving the shielding low-elastic black curable resin layer 1 on the light-emitting element, it does not prevent light from the light-emitting element from reaching the viewer. If the thickness of the highly elastic transparent curable resin layer 3 is 15% or more of the height of the light-emitting element, the low-elastic black curable resin layer 1 and the low-elastic transparent curable resin layer 2 can be uniformly pressed during thermocompression bonding, preventing the occurrence of uneven blackness due to variations in the film thickness of the flowing low-elastic black curable resin layer 1. If the thickness of the highly elastic transparent curable resin layer 3 is 20% or more of the height of the light-emitting element, the low-elastic black curable resin layer 1 and the low-elastic transparent curable resin layer 2 are less susceptible to deformation during thermocuring, making appearance defects less likely.

[0136] If the thickness of the highly elastic transparent curable resin layer 3 is 500% or less of the height of the light-emitting element, a uniform film can be formed without differences in residual solvent concentration or unevenness in thermal history in the thickness direction. If the thickness of the highly elastic transparent curable resin layer 3 is 200% or less of the height of the light-emitting element, the fluidity of the highly elastic transparent curable resin layer 3 near the top surface of the light-emitting element can be increased during thermal bonding, allowing the low-elasticity black curable resin layer 1 to be removed from the light-emitting element more efficiently. If the thickness of the highly elastic transparent curable resin layer 3 is 150% or less of the height of the light-emitting element, the total light transmittance of the highly elastic transparent curable resin layer 3 can be increased.

[0137] The total thickness of the low-elasticity black curable resin layer 1, the low-elasticity transparent curable resin layer 2, and the high-elasticity transparent curable resin layer 3 before bonding is preferably 100-550%, more preferably 110-400%, and more preferably 120-300% of the height of the light-emitting element.

[0138] If the total thickness of the low-elasticity black curable resin layer 1, the low-elasticity transparent curable resin layer 2, and the high-elasticity transparent curable resin layer 3 is equal to or greater than the lower limit value mentioned above relative to the height of the light-emitting element, then sufficient curable resin can be embedded between the light-emitting elements. If the total thickness of the low-elasticity black curable resin layer 1, the low-elasticity transparent curable resin layer 2, and the high-elasticity transparent curable resin layer 3 is less than or equal to the above upper limit relative to the height of the light-emitting element, thickness unevenness is less likely to occur during bonding, and surface defects are less likely to occur.

[0139] The ratio of the thickness of the low-elastic black curable resin layer 1 before compression to the total thickness of the low-elastic black curable resin layer 1, the low-elastic transparent curable resin layer 2, and the high-elastic transparent curable resin layer 3 before compression is preferably 3 to 70%, more preferably 5 to 60%, and even more preferably 10 to 50%. If the ratio of the thickness of the low-elasticity black curable resin layer 1 before bonding to the total thickness of the low-elasticity black curable resin layer 1, the low-elasticity transparent curable resin layer 2, and the high-elasticity transparent curable resin layer 3 is greater than or equal to the lower limit above, the blackness can be increased and the contrast of the display can be sufficiently improved. If it is less than or equal to the upper limit above, less of the low-elasticity black curable resin layer 1 will remain on the light-emitting element during bonding, and the brightness can be sufficiently improved.

[0140] The ratio of the thickness of the low-elasticity transparent curable resin layer 2 before compression to the total thickness of the low-elasticity transparent curable resin layer 2 and the high-elasticity transparent curable resin layer 3 before compression is preferably 3 to 70%, more preferably 5 to 60%, and even more preferably 10 to 50%. If the ratio of the thickness of the low-elasticity transparent curable resin layer 2 before compression to the total thickness of the low-elasticity transparent curable resin layer 2 and the high-elasticity transparent curable resin layer 3 before compression is equal to or greater than the lower limit, the low-elasticity transparent curable resin layer 2 can sufficiently press the low-elasticity black curable resin layer 1 between multiple light-emitting elements. If it is equal to or less than the upper limit, a decrease in brightness can be prevented even if there are differences in the tilt or height of the light-emitting elements.

[0141] In the state shown in Figure 2, the film is heat-pressed to embed a portion of the low-elasticity black curable resin layer 1, the low-elasticity transparent curable resin layer 2, and the high-elasticity transparent curable resin layer 3 of the dry film 100 between the light-emitting elements, as shown in Figure 3. In this case, the low-elasticity black curable resin layer 1 is preferable because it has a low storage modulus and ensures fluidity, making it easy to fill between light-emitting elements, and it is easily removed from the light-emitting elements by the high-elasticity transparent curable resin layer 3 and the low-elasticity transparent curable resin layer 2. Furthermore, since the low-elasticity transparent curable resin layer 2 also has a relatively low storage modulus and ensures fluidity, it is easily filled between the light-emitting elements while uniformly pressing in the low-elasticity black curable resin layer 1. Furthermore, since the highly elastic transparent curable resin layer 3 has a relatively high storage modulus and is within a deformable range, the low-elastic black curable resin layer 1 can be easily removed from the light-emitting element even if there are differences in the tilt or height of the light-emitting element.

[0142] The temperature for thermocompression bonding is preferably 80 to 120°C, and more preferably 90 to 110°C. Setting the temperature to 80°C or higher makes it easier to ensure the fluidity of the low-elasticity black curable resin layer 1 and the low-elasticity transparent curable resin layer 2, as well as the flexibility of the high-elasticity transparent curable resin layer 3. Setting the temperature to 120°C or lower makes it less likely to damage the light-emitting element. Setting the temperature to 90 to 110°C allows for more precise control of fluidity, suppressing the occurrence of unevenness and crack-like defects.

[0143] The pressure used in thermocompression bonding is preferably 0.05 to 1.0 MPa, and more preferably 0.1 to 0.5 MPa. By setting the pressure in thermocompression bonding above the preferred lower limit, the low-elasticity black curable resin layer 1 does not remain on the light-emitting element, and the light from the light-emitting element does not obstruct the viewer. By setting the pressure below the preferred upper limit, damage to the light-emitting element is minimized.

[0144] Thermocompression bonding is preferably performed using a vacuum press capable of forming under vacuum. This makes it easier to avoid defects caused by air being incorporated into the resulting light-emitting electronic component.

[0145] After pressing, as shown in Figure 4, the second protective film 7 is peeled off and then heat-cured, so that as shown in Figure 5, the low-elasticity black curable resin layer 1 becomes the black cured material layer 21 (cured low-elasticity black curable resin layer 1), the low-elasticity transparent curable resin layer 2 becomes the first transparent cured material layer 22 (cured low-elasticity transparent curable resin layer 2), and the high-elasticity transparent curable resin layer 3 becomes the second transparent cured material layer 23 (cured high-elasticity transparent curable resin layer 3). Subsequently, as shown in Figure 6, the component is sealed with a sealing material 25. This yields the light-emitting electronic component 31.

[0146] The curing temperature is preferably 100 to 160°C, and more preferably 120 to 150°C. By setting the curing temperature to 100°C or higher, the low-elasticity black curable resin layer 1, the low-elasticity transparent curable resin layer 2, and the high-elasticity transparent curable resin layer 3 can be cured. By setting the curing temperature to 120°C or higher, the curing time for the low-elasticity black curable resin layer 1, the low-elasticity transparent curable resin layer 2, and the high-elasticity transparent curable resin layer 3 can be shortened. Furthermore, by setting the curing temperature below the above upper limit, damage to the light-emitting element is less likely to occur.

[0147] The curing time depends on the curing temperature, but is preferably 30 to 360 minutes, and more preferably 45 to 180 minutes. At the curing temperature, the storage modulus of the highly elastic transparent curable resin layer 3 is relatively high, and its fluidity is suppressed, thus preventing defects in appearance after curing. This results in a light-emitting electronic component 31 in which a dry film 100 is pressed onto the surface of an element-equipped substrate 10, on which multiple light-emitting elements are arranged, with multiple light-emitting elements arranged on the substrate 11.

[0148] In the obtained light-emitting electronic component 31, the low-elasticity black curable resin layer 1, the low-elasticity transparent curable resin layer 2, and the high-elasticity transparent curable resin layer 3 are cured to form a black cured layer 21, a first transparent cured layer 22, and a second transparent cured layer 23, respectively. The black cured layer 21, the first transparent cured layer 22, and a portion of the second transparent cured layer 23 are filled between multiple light-emitting elements. In Figure 6, an example is shown where the black cured layer 21 and the first transparent cured layer 22 are entirely filled between multiple light-emitting elements, and a portion of the second transparent cured layer 23 is filled between multiple light-emitting elements.

[0149] 《Second Embodiment》 <Integrated sealing sheet> The integrated sealing sheet 200 according to the second embodiment will be described below. In the description of the second embodiment, components similar to those in the first embodiment are denoted by the same reference numerals and their detailed descriptions are omitted.

[0150] As shown in Figure 7, the integrated sealing sheet 200 is basically constructed by laminating a low-elasticity black curable resin layer 1, a low-elasticity transparent curable resin layer 2, a high-elasticity transparent curable resin layer 3, and a sealing film layer 9.

[0151] The integrated sealing sheet 200 of this embodiment may further have a protective film on either or both surfaces of the low-elasticity black curable resin layer 1 and the sealing film layer 9 for ease of handling. Figure 7 shows an example where protective films are present on both surfaces. Specifically, a first protective film 6 is laminated with a low-elasticity black curable resin layer 1, a low-elasticity transparent curable resin layer 2, a high-elasticity transparent curable resin layer 3, a sealing film layer 9, and a second protective film 7 in sequence. Furthermore, if the surface hardness of the sealing film layer 9 is sufficient, the second protective film 7 can be omitted.

[0152] The integrated sealing sheet 200 is used such that, during compression, the low-elasticity black curable resin layer 1 is in direct contact with the element-equipped substrate 10, as shown in Figure 8. A specific method for obtaining a light-emitting electronic component by pressing the integrated sealing sheet 200 onto the element-equipped substrate 10 will be described later. The element-equipped substrate 10 is the same as the element-equipped substrate 10 in the first embodiment.

[0153] <Curable resin layer> The low-elasticity black curable resin layer 1, the low-elasticity transparent curable resin layer 2, and the high-elasticity transparent curable resin layer 3 in this embodiment are the same as those in the dry film 100 of the first embodiment, and the preferred embodiments are also the same.

[0154] <Sealing film layer> The sealing film layer 9 is a layer that protects the light-emitting element from external physical impacts, humidity, moisture, etc. In this embodiment, the sealing film layer 9 is composed of a support film layer 4 and a hard coat layer 5 provided on the side of the support film layer 4 opposite to the highly elastic transparent curable resin layer 3.

[0155] [Total light transmittance] The sealing film layer 9 preferably has an overall total light transmittance of 20-80% (in this embodiment, the support film layer 4 and the hard coat layer 5 combined), more preferably 30-80%, and even more preferably 40-75%. If the total light transmittance of the sealing film layer 9 is above the lower limit, light will not be obstructed from reaching the viewer. If the total light transmittance of the sealing film layer 9 is below the upper limit, it will be easier to ensure a higher degree of blackness. Within the above range, contrast will be further improved.

[0156] [Storage modulus] The sealing film layer 9, as a whole (in this embodiment, the support film layer 4 and the hard coat layer 5 combined), has a storage modulus of 1.0 × 10⁻⁶ at 100°C. 8 Pa or more, 1.0×10 10 It is preferable that it is Pa or less, and 1.0 × 10 9 Pa or higher, 9.0×10 9 It is preferable that it is less than or equal to Pa, 3.0 × 10 9 Pa or higher, 8.0×10 9 It is more preferable that the value be Pa or less.

[0157] By ensuring that the storage modulus of the sealing film layer 9 at 100°C is below a preferred upper limit, a moderate flexibility is obtained that does not hinder the flow of the low-elasticity black curable resin layer 1, etc., when it is pressed onto the substrate 10 with the element attached, improving workability and preventing cracks caused by pressure.

[0158] The storage modulus of the sealing film layer 9 at 100°C is above a preferred lower limit, which makes it less prone to deformation when pressed onto the element-equipped substrate 10, allowing pressure to be reliably transmitted to the low-elasticity black curable resin layer 1, etc., and preventing defects such as cracking or deformation in the hard coat layer 5.

[0159] <Support film layer> The support film layer 4 in the sealing film layer 9 is a layer that protects the light-emitting element from external physical impacts, humidity, moisture, etc.

[0160] [Total light transmittance] The total light transmittance of the support film layer 4 alone is preferably 30-99%, more preferably 50-95%, and even more preferably 70-95%. Since the total light transmittance of the support film layer 4 alone is equal to or greater than the above lower limit, inexpensive commercially available films can be used.

[0161] [resin] The support film layer 4 may be composed of a thermoplastic resin or a thermosetting resin. Examples of resins constituting the support film layer 4 include polyethylene terephthalate resin, polyethylene 2,6-naphthalate resin, polycarbonate resin, triacetylcellulose resin, polymethylpentene resin, phenoxy resin, syndiotactic polystyrene resin, and polyimide resin. It is preferable to include at least one resin selected from polyethylene terephthalate resin, polyethylene 2,6-naphthalate resin, and polycarbonate resin, considering factors such as heat resistance, weather resistance, availability, and cost. The inclusion of these resins prevents deformation during compression.

[0162] [film thickness] The thickness of the support film layer 4 is preferably 10 to 250 μm, more preferably 20 to 200 μm, and even more preferably 25 to 150 μm. If the thickness of the support film layer 4 is above a preferred lower limit, it has sufficient strength to protect the element. If the thickness of the support film layer 4 is below a preferred upper limit, visibility is improved and costs can be reduced.

[0163] <Hard coat layer> [hardness] The hard coat layer 5 is a layer that protects the light-emitting electronic component from scratches. The pencil hardness of the surface of the hard coat layer 5 is preferably H or higher, more preferably 2H or higher, and even more preferably 3H or higher.

[0164] [Surface roughness] The surface roughness Ra of the hard coat layer 5 surface is preferably 0.1 to 1 μm, more preferably 0.2 to 1 μm, and even more preferably 0.3 to 1 μm. By ensuring the surface roughness of the hard coat layer 5 is above a preferred lower limit, the reflectivity of the hard coat layer 5 surface can be reduced. By ensuring the surface roughness of the hard coat layer 5 is below a preferred upper limit, manufacturing becomes easier.

[0165] [Total light transmittance] The hard coat layer 5 is preferably prepared to have a total light transmittance of 30-99%, more preferably 50-99%, and even more preferably 60-99%. Because the total light transmittance of the hard coat layer 5 is above the lower limit, the reach of light to the viewer is not obstructed.

[0166] [Curable resin composition] The hard coat layer 5 is composed of a curable resin composition. Examples of curable resin compositions constituting the hard coat layer 5 include thermosetting resin compositions, ultraviolet curable resin compositions, and electron beam curable resin compositions. Among these, ultraviolet curable resin compositions are preferred. Examples of UV-curable resin compositions include acrylic resins, urethane resins, silicone resins, and may contain one or more of these. Examples of thermosetting resin compositions include acrylic resins, urethane resins, silicone resins, melamine resins, and may contain one or more of these.

[0167] [Fine particles] The hard coat layer 5 preferably contains fine particles. Inorganic fine particles and / or organic fine particles can be used as the fine particles. Examples of inorganic microparticles include silica microparticles and titanium microparticles. Examples of organic microparticles include polymethyl methacrylate resin (PMMA resin) and urethane resin. Among these, silica fine particles are preferred. By including fine particles, it is possible to adjust the surface roughness and improve the surface hardness.

[0168] [film thickness] The thickness of the hard coat layer 5 is preferably 0.5 to 20 μm, more preferably 1 to 10 μm, and even more preferably 1.5 to 8 μm. If the thickness of the hard coat layer 5 is above a preferred lower limit, sufficient hardness can be ensured. If the thickness of the hard coat layer 5 is below a preferred upper limit, problems such as curling will not occur. The hard coat layer 5 may contain a black pigment or black dye to suppress uneven luminescence and color unevenness.

[0169] [Glossiness] The gloss level measured by a gloss meter (JIS-Z-8741) on the hard coat layer 5 side is preferably 1 to 50, more preferably 3 to 30, and even more preferably 5 to 25. Manufacturing is easier if the gloss level of the hard coat layer 5 is above the lower limit. The visibility of the display is improved when the gloss level of the hard coat layer 5 is below a desirable upper limit.

[0170] <Semi-transparent resin layer> The sealing film layer 9 may have a translucent resin layer on one or both sides of the support film layer 4. By providing a translucent resin layer, the blackness of the display can be increased and the contrast can be improved. Furthermore, if a translucent resin layer is provided on the viewer side of the support film layer 4, the diffuse reflection of ambient light by the support film layer 4 can be made less visible.

[0171] [Total light transmittance] The translucent resin layer preferably has a total light transmittance of 20-80%, more preferably 30-80%, and even more preferably 40-75%. If the total light transmittance of the translucent resin layer is above the lower limit, light will not be obstructed from reaching the viewer. If the total light transmittance of the translucent resin layer is below the upper limit, the blackness will be increased, and the contrast enhancement effect will be further improved.

[0172] [Overall Haze] The translucent resin layer preferably has an overall haze of 7% or more, more preferably 10-70%, and even more preferably 15-65%, according to JIS K 7136. When the overall haze of the translucent resin layer is above a preferred lower limit, the concealment of diffuse reflection of external light by the support film layer 4 is improved. When the overall haze of the translucent resin layer is below a preferred upper limit, the blackness can be increased. The overall haze of the translucent resin layer can be adjusted by the compatibility of the carbon black, fillers, and resin contained in the translucent resin composition.

[0173] [Storage modulus] The storage modulus of the translucent resin layer at 100°C is 1.0 × 10⁻⁶. 6 Preferably Pa or higher, 1.0 × 10 6 Pa or more, 1.0×10 10 It is more preferable that it be less than or equal to Pa, and 1.0 × 10 7 Pa or more, 5.0×10 9 It is even more preferable that it be less than or equal to Pa, 1.0 × 10 8 Pa or more, 5.0×10 9 It is particularly preferable that the value be Pa or less.

[0174] If the thickness of the translucent resin layer varies, the blackness may become uneven in the planar direction, potentially causing mottling. By ensuring that the storage modulus of the translucent resin layer at 100°C is above a preferred lower limit, deformation during bonding to the element-mounted substrate 10 becomes less likely, and variations in thickness are further reduced. Therefore, uneven light emission and color unevenness can be suppressed.

[0175] The storage modulus of the translucent resin layer at 100°C is below a preferred upper limit, which helps prevent crack formation during bonding to the element-equipped substrate 10. Furthermore, it facilitates ensuring good adhesion between the translucent resin layer and the support film layer 4 or hard coat layer 5.

[0176] [Translucent resin composition] The translucent resin layer can consist of a coating film of a translucent resin composition containing carbon black or the like, or a cured product thereof. The translucent resin composition is a thermoplastic resin composition or a curable resin composition, and a curable resin composition is preferred from the viewpoint of being less prone to deformation during durability tests under thermal shock or high humidity.

[0177] Examples of resins included in the translucent resin composition include epoxy resins, acrylic resins, polyester resins, polyurethane resins, polycarbonate resins, polyimide resins, acrylonitrile butadiene copolymers, styrene butadiene copolymers, vinyl acetate resins, and silicone resins. If the translucent resin composition is a curable resin composition, it is preferable that it be a cured film from the viewpoint of being less prone to deformation and having stable coloration. In other words, it is preferable that it is cured before being pressed onto the substrate 10 with the element attached.

[0178] <Protective film> The first protective film 6 and the second protective film 7 can be the same as the protective films in the first embodiment, and the preferred embodiments are also the same.

[0179] <Method for manufacturing an integrated sealing sheet> To obtain the integrated sealing sheet 200, a release sheet is prepared by coating it with a curable resin composition for the low-elasticity transparent curable resin layer 2 and drying it, and a sealing film layer 9 is prepared by coating it with a curable resin composition for the high-elasticity transparent curable resin layer 3 and drying it.

[0180] Subsequently, these are stacked so that the low-elasticity transparent curable resin layer 2 and the high-elasticity transparent curable resin layer 3 are in contact with each other, and laminated to obtain a laminate (1) in which the high-elasticity transparent curable resin layer 3 and the low-elasticity transparent curable resin layer 2 are sequentially laminated on the sealing film layer 9. The second protective film 7 is laminated onto the surface of the sealing film layer 9, if necessary.

[0181] Furthermore, by preparing a first protective film 6 coated with a coating solution of a curable resin composition for the low-elasticity black curable resin layer 1 and drying it, and then overlapping it with the laminate (1) with the release sheet removed so that the low-elasticity black curable resin layer and the low-elasticity transparent curable resin layer 2 are in contact, and laminating it, an integrated sealing sheet 200 can be obtained.

[0182] The sealing film layer 9, which has a hard coat layer 5 formed on a support film layer 4, is obtained by applying a coating agent for the hard coat layer to the surface of the support film layer 4, drying it, and then curing it. When the sealing film layer 9 is formed by sequentially forming a translucent resin layer and a hard coat layer 5 on the support film layer 4, it is obtained by applying and drying a coating liquid of a translucent resin composition for the translucent resin layer on the surface of the support film layer 4, then applying and drying a coating agent for the hard coat layer, and then curing it.

[0183] Furthermore, if the sealing film layer 9 is formed by forming a translucent resin layer on one side of the support film layer 4 and a hard coat layer 5 on the other side, it is obtained by applying and drying a coating liquid of a translucent resin composition for the translucent resin layer to one side of the support film layer 4, then applying and drying a coating agent for the hard coat layer to the other side, and then curing it. The hard coat layer coating agent may be applied after the translucent resin composition has been cured.

[0184] <Manufacturing method for light-emitting electronic components> The present invention provides a method for manufacturing light-emitting electronic components, which involves placing the integrated sealing sheet 200 of the present invention on the surface of a substrate with multiple light-emitting elements arranged on it, such that its low-elasticity black curable resin layer 1 is in contact with the multiple light-emitting elements, and then heat-pressing it to fill the spaces between the multiple light-emitting elements with the low-elasticity black curable resin layer 1, the low-elasticity transparent curable resin layer 2, and a portion of the high-elasticity transparent curable resin layer 3, and then heating to cure these curable resin layers. The following describes a method for manufacturing a light-emitting electronic component according to one embodiment of the present invention, with reference to Figures 8 to 11.

[0185] In the manufacturing method of this embodiment, first, as shown in Figure 8, an integrated sealing sheet 200, on which the first protective film 6 has been peeled off to expose the low-elasticity black curable resin layer 1, is placed on the surface of the element-equipped substrate 10 on which the light-emitting elements 12, 13, and 14 are arranged, so that the low-elasticity black curable resin layer 1 is in contact with the sheet.

[0186] At this time, that is, before pressing, preferred embodiments such as the thickness of the low-elasticity black curable resin layer 1, the total thickness of the low-elasticity transparent curable resin layer 2 and the high-elasticity transparent curable resin layer 3, the total thickness of the low-elasticity black curable resin layer 1, the low-elasticity transparent curable resin layer 2, and the high-elasticity transparent curable resin layer 3, and the ratio of the thicknesses of each layer are the same as those described for the case where the dry film 100 of the first embodiment is used.

[0187] In the state shown in Figure 8, the film is heat-pressed to embed a portion of the low-elasticity black curable resin layer 1, the low-elasticity transparent curable resin layer 2, and the high-elasticity transparent curable resin layer 3 of the dry film 100 between the light-emitting elements, as shown in Figure 9. In this case, the low-elasticity black curable resin layer 1 is preferable because it has a relatively low storage modulus and ensures fluidity, allowing it to easily follow the irregularities caused by the light-emitting elements, fill the spaces between them, and not remain on the light-emitting elements. Furthermore, since the low-elasticity transparent curable resin layer 2 also has a relatively low storage modulus and ensures fluidity, it easily follows the irregularities caused by the light-emitting elements and fills the spaces between the light-emitting elements together with the low-elasticity black curable resin layer 1.

[0188] The preferred conditions for heat bonding, such as temperature and pressure, are the same as those described for the case using the dry film 100 in the first embodiment. Furthermore, similar to the first embodiment, it is preferable to use a vacuum press capable of molding under vacuum conditions.

[0189] After pressing, as shown in Figure 10, the second protective film 7 is peeled off and then heat-cured, so that as shown in Figure 11, the low-elasticity black curable resin layer 1 becomes the black cured layer 21 (cured low-elasticity black curable resin layer 1), the low-elasticity transparent curable resin layer 2 becomes the first transparent cured layer 22 (cured low-elasticity transparent curable resin layer 2), and the high-elasticity transparent curable resin layer 3 becomes the second transparent cured layer 23 (cured high-elasticity transparent curable resin layer 3). This gives rise to the light-emitting electronic component 32.

[0190] In the resulting light-emitting electronic component 32, the low-elasticity black curable resin layer 1, the low-elasticity transparent curable resin layer 2, and the high-elasticity transparent curable resin layer 3 are cured to form a black cured layer 21, a first transparent cured layer 22, and a second transparent cured layer 23, respectively. The black cured layer 21, the first transparent cured layer 22, and a portion of the second transparent cured layer 23 are filled between multiple light-emitting elements. In Figure 11, an example is shown where the black cured layer 21 and the first transparent cured layer 22 are entirely filled between multiple light-emitting elements, and a portion of the second transparent cured layer 23 is filled between multiple light-emitting elements.

[0191] Effects and Benefits According to the dry film or integrated sealing sheet of the present invention, when pressed, the low-elasticity black curable resin layer and the low-elasticity transparent curable resin layer become soft and fluid, while the high-elasticity transparent curable resin layer remains hard. As a result, the stress of pressing is sufficiently transmitted to the low-elasticity black curable resin layer and the low-elasticity transparent curable resin layer, allowing the low-elasticity black curable resin layer and the low-elasticity transparent curable resin layer to be sufficiently filled between the optical elements. Furthermore, because the highly elastic transparent curable resin layer has sufficient hardness, the black curable resin layer on the light-emitting elements can be removed even in areas where the height of the light-emitting elements, which have different inclinations and heights, is low and stress is not easily applied. Therefore, even if there are differences in the inclination and height of each light-emitting element, a decrease in brightness can be suppressed without performing etching such as plasma treatment, which takes a considerable amount of time.

[0192] According to the present invention's light-emitting electronic component and method for manufacturing the light-emitting electronic component, the highly elastic transparent curable resin layer on the surface side of the dry film is the hardest, thus suppressing defects in appearance after curing. Since the integrated sealing sheet has a laminated sealing film layer, the sealing process can be completed in a single pressing operation, and moreover, the black curable resin layer on the light-emitting element can be removed even if the height and inclination of the light-emitting element differ. Therefore, light-emitting electronic components with sufficient brightness and blackness can be obtained without increasing production costs or energy consumption. [Examples]

[0193] The present invention will be described in detail below with reference to examples, but the present invention is not limited to the descriptions in these examples. Note that all formulation amounts in the following description are on a solid content basis.

[0194] <Raw materials> The details of the raw materials used in each example and comparative example are as follows. [Epoxy resin] EOCN(registered trademark)-1020-55: Manufactured by Nippon Kayaku Co., Ltd., cresol novolac type polyfunctional epoxy resin (solid), softening point 55.7℃, epoxy equivalent 195g / eq. • EPICLON® HP-7200H: Manufactured by DIC Corporation, cyclopentadiene novolac type polyfunctional epoxy resin (solid), softening point 82°C, epoxy equivalent 227 g / eq. jER(registered trademark) YX7200B35: A phenoxy-type epoxy resin manufactured by Mitsubishi Chemical Corporation (MEK solution, solid content 35% by mass), with a glass transition temperature of 150°C, epoxy equivalent of 8750 g / eq., and a weight-average molecular weight of 27,218. [Elastomer] Nipol NX775: Manufactured by Zeon Corporation, this is a carboxy-modified nitrile rubber elastomer with a weight-average molecular weight of 208,000.

[0195] [Curing catalyst] • Curezol (registered trademark) 2PZ-CN: Manufactured by Shikoku Chemicals Co., Ltd., 1-cyanoethyl-2-phenylimidazole. • Curezol 2E4MZ: Manufactured by Shikoku Chemicals Co., Ltd., 2-ethyl-4-methylimidazole.

[0196] [Carbon Black] • Special Black 4: Manufactured by ORION ENGINEERED CARBONS, gas black, pH 3, average particle size 25 nm.

[0197] [solvent] • MEK: Methyl ethyl ketone, manufactured by Junsei Chemicals. PGM: Propylene glycol monomethyl ether, manufactured by Junsei Chemicals.

[0198] [Support film layer] CosmoShine (registered trademark) A4300: Manufactured by Toyobo Co., Ltd., PET film, 75μm thick. [Removable PET] • 1-E: Manufactured by Nipper Co., Ltd., 50 μm thick. • 1-TRE: Manufactured by Nipper Co., Ltd., 50 μm thick.

[0199] [Resin for hard coat layer] ACRIT(registered trademark) 8KX-078: Manufactured by Taisei Fine Chemical Co., Ltd., solid content concentration 40% by mass, UV-curable acrylic polymer, weight-average molecular weight 40.000.

[0200] [Fine particles] • Chemisnow (registered trademark) MX-500L: Manufactured by Soken Chemical Co., Ltd., cross-linked acrylic monodisperse particles, average particle size 5 μm. [Photoradical polymerization initiator] • Omnirad (registered trademark) TPO H: Manufactured by IGM Resins BV.

[0201] <Preparation of coating liquid>

[0202] [Coating liquid for transparent hardening resin layer] The raw materials with the formulations shown in Table 1 were mixed in a solvent of MEK / PGM = 80 / 20 (volume ratio) to prepare a coating liquid for a transparent hardening resin layer (Raw materials 3-1 to 3-3) with a solid content concentration of 35% by mass. That is, the total blended amount (in terms of solid content) of the raw materials with the formulations shown in Table 1 was made 35% by mass based on the entire coating liquid obtained.

[0203]

Table 1

[0204] [Coating liquid for low-elastic black hardening resin layer] 70 parts by mass of epoxy resin EPICLON HP-7200H (manufactured by DIC Corporation), 30 parts by mass of elastomer Nipol NX775 (manufactured by Nippon Zeon Co., Ltd.), 3 parts by mass of curing catalyst Curezol 2PZ-CN (manufactured by Shikoku Kasei Co., Ltd.), and 4 parts by mass of carbon black Special Black 4 (manufactured by ORION ENGINEERED CARBONS) were mixed in a solvent of MEK / PGM = 80 / 20 (volume ratio) to prepare a coating liquid for a low-elastic black hardening resin layer (Raw material 4) with a solid content concentration of 35% by mass.

[0205] [Coating liquid for translucent resin composition] 80 parts by mass of epoxy resin EOCN-1020-55 (manufactured by Nippon Kayaku Co., Ltd.), 20 parts by mass of elastomer Nipol NX775 (manufactured by Nippon Zeon Co., Ltd.), 3 parts by mass of curing catalyst Curezol 2E4MZ (manufactured by Shikoku Kasei Co., Ltd.), and 0.5 parts by mass of carbon black Special Black 4 (manufactured by ORION ENGINEERED CARBONS) were mixed in a solvent of MEK / PGM = 80 / 20 (volume ratio) to prepare a translucent resin composition (Raw material 1) with a solid content concentration of 25% by mass.

[0206] [Coating agent for hard coat layer] A hard coat layer coating agent (raw material 2) with a solid content of 25% by mass was prepared by mixing 100 parts by mass of hard coat layer resin 8KX-078 (manufactured by Taisei Fine Chemical Co., Ltd.), 4.5 parts by mass of fine particle Chemisnow MX-500L (manufactured by Soken Chemical Co., Ltd.), and 0.6 parts by mass of photoradical polymerization initiator Omnirad TPO H (manufactured by IGM Resins BV) with a solvent of MEK / PGM = 80 / 20 (volume ratio).

[0207] <Total light transmittance of each single layer> The total light transmittance of Cosmo Shine A4300 (manufactured by Toyobo Co., Ltd.) was measured using a haze meter NDH5000 manufactured by Nippon Denshoku Industries Co., Ltd., in accordance with JIS K 7361.

[0208] On CosmoShine A4300 (manufactured by Toyobo Co., Ltd.), a coating liquid for a low-elasticity transparent curable resin layer and a coating liquid for a high-elasticity transparent curable resin layer were applied using an applicator to a dry film thickness of 25 μm (50 μm in Comparative Examples 1 and 2). After drying at 120°C for 5 minutes, the coating liquid for the low-elasticity transparent curable resin layer or the coating liquid for the high-elasticity transparent curable resin layer was cured by heating in a hot air circulating oven at 150°C for 1 hour, thereby obtaining cured films with each transparent curable resin layer. The total light transmittance of the obtained cured transparent curable resin-coated film was measured using a haze meter NDH5000 manufactured by Nippon Denshoku Industries Co., Ltd., in accordance with JIS K 7361, with the transmitted light of Cosmoshine A4300 set to 100%. The measurement results for the total light transmittance of each transparent curable resin layer are shown in Tables 2 and 3.

[0209] A low-elasticity black curable resin coating solution was applied to Cosmoshine A4300 (manufactured by Toyobo Co., Ltd.) using an applicator to achieve a dry film thickness of 30 μm. After drying at 120°C for 5 minutes, the coating solution was cured by heating in a hot air circulating oven at 150°C for 1 hour, resulting in a cured film with a low-elasticity black curable resin layer. The total light transmittance of the obtained cured low-elasticity black curable resin-coated film was measured using a haze meter NDH5000 manufactured by Nippon Denshoku Industries Co., Ltd., in accordance with JIS K 7361, with the transmitted light of Cosmoshine A4300 set to 100%. The measurement results for the total light transmittance of the low-elasticity black curable resin layer are shown in Tables 2 and 3.

[0210] <Storage modulus of each single layer> On the release surface of release PET 1-E (manufactured by Nippa Co., Ltd., 50 μm), a coating liquid for a low-elasticity transparent curable resin layer, a coating liquid for a high-elasticity transparent curable resin layer, and a coating liquid for a low-elasticity black curable resin layer were applied using an applicator to achieve a dry film thickness of 40 μm each. After drying at 120°C for 5 minutes, the release PET 1-E was peeled off to obtain single-layer sheets of the low-elasticity transparent curable resin layer, the high-elasticity transparent curable resin layer, and the low-elasticity black curable resin layer, respectively.

[0211] The storage modulus of each obtained single-layer sheet at 100°C was measured using a viscoelasticity measuring device (RSA-G2, TA Instruments) under conditions of a measurement frequency of 1 Hz and a heating rate of 5°C / min, in accordance with JIS K7244. The results are shown in Tables 2 and 3.

[0212] Furthermore, the storage modulus of the obtained highly elastic transparent curable resin layer at 150°C was measured using a viscoelasticity measuring device (RSA-G2, TA Instruments) under conditions of a measurement frequency of 1 Hz and a heating rate of 5°C / min, in accordance with JIS K7244. The results are shown in Table 2.

[0213] <Evaluation component-equipped substrate> A substrate with multiple LED light-emitting elements, each measuring 0.1 × 0.2 mm and 65 μm in height, arranged on an epoxy glass substrate was used as the evaluation element substrate.

[0214] <Dry film> [Examples 1 and 2] On the release surface of release PET 1-TRE (manufactured by Nipper Co., Ltd., 50 μm), using an applicator, the coating liquid (raw material 3-2 or raw material 3-3) of the highly elastic transparent curable resin layer shown in Table 2 was applied so that the dry film thickness became 25 μm, and dried at 120°C for 5 minutes to obtain a first sheet in which the highly elastic transparent curable resin layer was supported by the release PET.

[0215] On the release surface of release PET 1-E (manufactured by Nipper Co., Ltd., 50 μm), using an applicator, the coating liquid (raw material 3-1) of the low elastic transparent curable resin layer was applied so that the dry film thickness became 25 μm, and dried at 120°C for 5 minutes to obtain a second sheet in which the low elastic transparent curable resin layer was supported by the release PET.

[0216] The obtained first sheet and second sheet were overlapped so that the low elastic transparent curable resin layer and the highly elastic transparent curable resin layer were in contact with each other, and laminated with a roll laminator at 60°C. The release PET 1-E used for the second sheet was peeled off to obtain a third sheet.

[0217] Also, on the release surface of release PET 1-E (manufactured by Nipper Co., Ltd., 50 μm), using an applicator, the coating liquid (raw material 4) of the low elastic black curable resin layer was applied so that the dry film thickness became 30 μm, and dried at 120°C for 5 minutes to obtain a fourth sheet in which the low elastic black curable resin layer was supported by the release PET.

[0218] The obtained third sheet and fourth sheet were overlapped so that the low elastic transparent curable resin layer and the low elastic black curable resin layer were in contact with each other, and laminated with a roll laminator at 60°C to obtain the dry film of each example.

[0219] [Comparative Example 1]

[0220] On the release surface of release PET 1-TRE (manufactured by Nipper Co., Ltd., 50 μm), using an applicator, the coating liquid (raw material 3-3) of the highly elastic transparent curable resin layer was applied so that the dry film thickness became 50 μm, and dried at 120°C for 5 minutes to obtain a fifth sheet in which the highly elastic transparent curable resin layer was supported by the release PET.

[0221] Furthermore, a coating solution (raw material 4) for a low-elasticity black curable resin layer was applied to the release surface of release PET 1-E (manufactured by Nippa Co., Ltd., 50 μm) using an applicator to achieve a dry film thickness of 30 μm, and dried at 120°C for 5 minutes to obtain a sixth sheet in which the low-elasticity black curable resin layer was supported on the release PET.

[0222] The obtained fifth and sixth sheets were stacked so that the highly elastic transparent curable resin layer and the low elastic black curable resin layer were in contact with each other, and laminated in a roll laminator at 60°C to obtain the dry film of Comparative Example 1.

[0223] [Implementation of dry film] The release PET 1-E on the low-elasticity black curable resin layer side of the dry film in each example was peeled off, and the low-elasticity black curable resin layer was positioned so that it was in contact with the LED light-emitting element of the substrate with the evaluation element. Subsequently, using a vacuum press, dry film 1 was filled between the light-emitting elements under the conditions of a vacuum of 100 hPa, 100°C, 0.36 MPa, and 3 minutes. After peeling off the release PET 1-TRE in contact with the highly elastic transparent curable resin layer, the components were heat-cured by heating in a 150°C oven for 1 hour, yielding 10 light-emitting electronic components for each example.

[0224] [Brightness after implementation / Brightness before implementation] For each of the 10 light-emitting electronic components in each example, the luminance of the components was measured using a Konica Minolta CA-410 luminance meter before and after mounting the dry film. The ratio of post-mount luminance to pre-mount luminance was calculated by dividing the post-mount luminance by the pre-mount luminance. The average values ​​for the 10 light-emitting electronic components are shown in Table 2.

[0225] [Table 2]

[0226] As shown in Table 2, it was confirmed that the dry film according to the present invention can suppress the overall loss of brightness.

[0227] <Sealing film layer> A translucent resin composition was applied to the first surface of a support film layer (Cosmoshine A4300: manufactured by Toyobo Co., Ltd.) using a bar coater to a dry film thickness of 7 μm. After drying at 120°C for 5 minutes, the translucent resin composition was cured by heating in a hot air circulating oven at 80°C for 72 hours. Next, corona treatment was performed on the surface of the translucent resin layer opposite the film layer, and a hard coat layer coating agent was applied using a bar coater to a dry film thickness of 3 μm. After drying at 120°C for 5 minutes, 400 mJ / cm² was applied. 2 The coating agent for the hard coat layer was cured by irradiation with ultraviolet light. This resulted in a sealing film layer in which a translucent resin layer and a hard coat layer were supported by a support film layer.

[0228] <Total light transmittance of the sealing film layer> The total light transmittance of the obtained sealing film layer was measured using a haze meter NDH5000 manufactured by Nippon Denshoku Industries Co., Ltd., in accordance with JIS K 7361. The results are shown in Table 3.

[0229] <Storage modulus of the sealing film layer> The storage modulus of the obtained sealing film layer at 100°C was measured using a viscoelasticity measuring device (RSA-G2, TA Instruments) under conditions of a measurement frequency of 1 Hz and a heating rate of 5°C / min, in accordance with JIS K7244. The results are shown in Table 3.

[0230] <Integrated sealing sheet> [Examples 3 and 4] Using an applicator, the coating solution for the highly elastic transparent curable resin layer shown in Table 3 (raw material 3-2 or raw material 3-3) was applied to the second surface (the surface opposite to the first surface) of the support film layer in the sealing film layer to a dry film thickness of 25 μm. After drying at 120°C for 5 minutes, a seventh sheet was obtained in which the seventh transparent curable resin layer was supported on the release PET.

[0231] A low-elasticity transparent curable resin coating solution (raw material 3-1) was applied to the release surface of a release PET 1-E (manufactured by Nippa Co., Ltd., 50 μm) using an applicator to achieve a dry film thickness of 25 μm. The sheet was then dried at 120°C for 5 minutes to obtain an eighth sheet in which the low-elasticity transparent curable resin layer was supported on the release PET layer.

[0232] The obtained seventh and eighth sheets were stacked so that the highly elastic transparent curable resin layer and the third low elastic transparent curable resin layer were in contact with each other, and laminated in a roll laminator at 60°C. The release PET used on the eighth sheet was peeled off to obtain the ninth sheet.

[0233] Furthermore, a coating solution (raw material 4) for a low-elasticity black curable resin layer was applied to the release surface of release PET 1-E (manufactured by Nippa Co., Ltd., 50 μm) using an applicator to achieve a dry film thickness of 30 μm, and dried at 120°C for 5 minutes to obtain a 10th sheet in which the low-elasticity black curable resin layer was supported on the release PET.

[0234] The obtained ninth and tenth sheets were stacked so that the low-elasticity transparent curable resin layer and the low-elasticity black curable resin layer were in contact with each other, and laminated in a roll laminator at 60°C to obtain the integrated sealing sheets of each embodiment.

[0235] [Comparative Example 2] Using an applicator, a coating solution (raw material 3-3) for a highly elastic transparent curable resin layer was applied to the second surface (the surface opposite to the first surface) of the support film layer in the sealing film layer to a dry film thickness of 50 μm. Then, it was dried at 120°C for 5 minutes to obtain an eleventh sheet in which the highly elastic transparent curable resin layer was supported on the sealing film layer.

[0236] Furthermore, a coating solution (raw material 4) for a low-elasticity black curable resin layer was applied to the release surface of release PET 1-E (manufactured by Nippa Co., Ltd., 50 μm) using an applicator to achieve a dry film thickness of 30 μm, and dried at 120°C for 5 minutes to obtain a 12th sheet in which the low-elasticity black curable resin layer was supported on the release PET.

[0237] The obtained 11th and 12th sheets were stacked so that the high-elasticity transparent curable resin layer and the low-elasticity black curable resin layer were in contact with each other, and laminated in a roll laminator at 60°C to obtain the integrated sealing sheet of Comparative Example 2.

[0238] [Implementation of integrated sealing sheet] The release PET 1-E from the integrated encapsulation sheet of each example was peeled off, and the low-elasticity black curable resin layer was positioned so that it was in contact with the LED light-emitting element of the substrate with the evaluation element. Subsequently, using a vacuum press, a low-elasticity black curable resin layer and a low-elasticity transparent curable resin layer were filled between the light-emitting elements under the conditions of a vacuum of 100 hPa, 100°C, 0.36 MPa, and for 3 minutes. The components were then heat-cured by heating in a 150°C oven for 1 hour, yielding 10 light-emitting electronic components of each example.

[0239] [Lab] For each example, the Lab values ​​of the hard coat layer side of 10 light-emitting electronic components were measured using a Konica Minolta CM-5 spectrophotometer in accordance with JIS K 8722. Table 3 shows the average Lab values ​​of the 10 light-emitting electronic components for each example.

[0240] [Brightness after implementation / Brightness before implementation] For each of the 10 light-emitting electronic components in each example, the brightness of the components was measured using a Konica Minolta CA-410 luminance meter before and after mounting the integrated encapsulation sheet. The ratio of post-mounted brightness to pre-mounted brightness was calculated by dividing the post-mounted brightness by the pre-mounted brightness. The average values ​​of the results for the 10 light-emitting electronic components are shown in Table 3.

[0241] [Table 3]

[0242] As shown in Table 3, it was confirmed that the dry film according to the present invention can suppress the overall loss of brightness. [Explanation of symbols]

[0243] 1 Low elasticity black curable resin layer 2 Low elasticity transparent curable resin layer 3. High-elasticity transparent curable resin layer 4. Support film layer 5. Hard court layer 6. First protective film 7. Second protective film 9. Sealing film layer 10-element circuit board 11 circuit boards 12 Light-emitting elements 13 Light-emitting element 14 Light-emitting elements 21 Black cured material layer 22 First transparent hardened layer 23. Second transparent hardened layer 25. Sealing material 31 Light-emitting electronic components 32 Light-emitting electronic components 100 Dry Film 200 Integrated Sealing Sheets

Claims

1. A dry film that is pressed onto the surface of an element-equipped substrate on which a plurality of light-emitting elements are arranged, A dry film comprising a low-elasticity black curable resin layer, a low-elasticity transparent curable resin layer, and a high-elasticity transparent curable resin layer, which are sequentially laminated from the side that is in direct contact with the substrate with the element when pressed together.

2. The dry film according to claim 1, wherein at 100°C, the storage modulus of the high-elasticity transparent curable resin layer is greater than the storage modulus of the low-elasticity transparent curable resin layer and the low-elasticity black curable resin layer.

3. The dry film according to claim 1 or 2, wherein at 100°C, the storage modulus of the low-elasticity transparent curable resin layer is greater than the storage modulus of the low-elasticity black curable resin layer.

4. The storage modulus of the aforementioned highly elastic transparent curable resin layer is 1.0 × 10 at 100°C. ７ A dry film according to claim 1 or 2, wherein the pressure is Pa or less.

5. The storage modulus of the low-elasticity black curable resin layer is 1.0 × 10 at 100°C. ５ A dry film according to claim 1 or 2, wherein the pressure is Pa or less.

6. The storage modulus of the low-elasticity transparent curable resin layer is 1.0 × 10 at 100°C. ５ A dry film according to claim 1 or 2, wherein the pressure is Pa or less.

7. The storage modulus of the aforementioned highly elastic transparent curable resin layer is 1.0 × 10 at 150°C. ５ A dry film according to claim 1 or 2, wherein the pressure is Pa or higher.

8. The dry film according to claim 1 or 2, wherein the total light transmittance of the low-elasticity black curable resin layer is 0 to 30%.

9. The dry film according to claim 1 or 2, wherein the total light transmittance of the low-elasticity transparent curable resin layer is 50% or more.

10. The dry film according to claim 1 or 2, wherein the total light transmittance of the high-elasticity transparent curable resin layer is 50% or more.

11. The dry film according to claim 1 or 2, wherein the highly elastic transparent curable resin layer comprises a high molecular weight epoxy resin.

12. The dry film according to claim 11, wherein the weight-average molecular weight of the high molecular weight epoxy resin is 10,000 to 100,000.

13. The dry film according to claim 11, wherein the highly elastic transparent curable resin layer comprises a phenoxy-type epoxy resin as the high molecular weight epoxy resin.

14. The dry film according to claim 11, wherein the amount of the high molecular weight epoxy resin blended with 100% by mass of the total resin solids content of the high elastic transparent curable resin layer is 30 to 80% by mass.

15. The dry film according to claim 1 or 2, wherein the low-elasticity black curable resin layer includes an elastomer.

16. The dry film according to claim 15, wherein the elastomer is a modified elastomer.

17. The dry film according to claim 16, wherein the modified elastomer is acid-modified acrylonitrile butadiene rubber.

18. The dry film according to claim 1 or 2, wherein the low-elasticity black curable resin layer contains carbon black.

19. An integrated sealing sheet comprising a dry film according to claim 1 or 2, and a sealing film layer provided on the opposite side of the low-elasticity transparent curable resin layer of the high-elasticity transparent curable resin layer.

20. The integral sealing sheet according to claim 19, wherein the sealing film layer comprises a support film layer and a hard coat layer provided on the side of the support film layer opposite to the highly elastic transparent curable resin layer.

21. The system comprises an element-equipped substrate on which a plurality of light-emitting elements are arranged, and a dry film according to claim 1 or 2 which is pressed onto the surface of the element-equipped substrate on which the plurality of light-emitting elements are arranged. The low-elasticity black curable resin layer, the low-elasticity transparent curable resin layer, and a portion of the high-elasticity transparent curable resin layer are filled between the plurality of light-emitting elements. The low-elasticity black curable resin layer, the low-elasticity transparent curable resin layer, and the high-elasticity transparent curable resin layer are cured light-emitting electronic components.

22. The device comprises an element-equipped substrate on which a plurality of light-emitting elements are arranged, and an integrated sealing sheet according to claim 19 which is pressed onto the surface of the element-equipped substrate on which the plurality of light-emitting elements are arranged. The low-elasticity black curable resin layer, the low-elasticity transparent curable resin layer, and a portion of the high-elasticity transparent curable resin layer are filled between the plurality of light-emitting elements. The low-elasticity black curable resin layer, the low-elasticity transparent curable resin layer, and the high-elasticity transparent curable resin layer are cured light-emitting electronic components.

23. A dry film according to claim 1 or 2 is placed on the surface of an element-equipped substrate on which a plurality of light-emitting elements are arranged, such that the low-elasticity black curable resin layer is in contact with it, and then heat-pressed onto it. A method for manufacturing a light-emitting electronic component, comprising curing the low-elasticity black curable resin layer, the low-elasticity transparent curable resin layer, and the high-elasticity transparent curable resin layer by heating.

24. The method for manufacturing a light-emitting electronic component according to claim 23, wherein the temperature during the heat-compression bonding is 80 to 120°C, and the curing is performed by heating at 100 to 160°C.

25. The integrated sealing sheet described in claim 19 is placed on the surface of the element-equipped substrate on which the plurality of light-emitting elements are arranged, such that the low-elasticity black curable resin layer is in contact with it, and then heat-pressed. A method for manufacturing a light-emitting electronic component, comprising curing the low-elasticity black curable resin layer, the low-elasticity transparent curable resin layer, and the high-elasticity transparent curable resin layer by heating.

26. The method for manufacturing a light-emitting electronic component according to claim 25, wherein the temperature during the heat-compression bonding is 80 to 120°C, and the curing is performed by heating at 100 to 160°C.

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