Cartridge module and multi-wafer test apparatus using the same

Abstract

To provide a cartridge module and a multi wafer test device utilizing the same.SOLUTION: A multi wafer test device is provided, comprising: at least two chambers to which a tester is connected, each of two chambers having a test head that electrically connects a probe card and the tester; a cartridge module comprising a first body provided with the probe card, and a second body provided with a wafer chuck on which a wafer is seated, thereby the first body and the second body being detachably assembled with each other; a wafer loading unit for unclamping the first body and the second body to perform attaching / detaching operation of the first body and the second body and thereby loading the wafer on the second body to assemble the first body and the second body by clamping operation; and a transfer unit configured to transfer and deliver the cartridge module between the wafer loading unit and the chambers.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a cartridge module capable of modularizing a probe card and a wafer and holding its own position, and a multi-wafer test apparatus capable of inspecting a large number of wafers in a single test using the same.

Background Art

[0002] Generally, semiconductor elements are formed by repeatedly performing a series of processing steps on a wafer. For example, a vapor deposition step of forming a film on the wafer, an etching step of forming a pattern having electrical characteristics on the wafer on which vapor deposition has been performed, an ion implantation step or a diffusion step of implanting or diffusing impurities into the pattern, and a cleaning and rinsing step of removing impurities from the wafer on which the pattern has been formed are repeatedly performed, whereby semiconductor elements are formed on the wafer.

[0003] For semiconductor elements manufactured by such a series of steps, an inspection step of the wafer for inspecting electrical characteristics is performed. The inspection step is performed by a probe station including a probe card having a large number of probes and a tester connected to the probe card to provide an electrical signal.

[0004] Generally, a probe station includes an inspection chamber, a chuck disposed in the inspection chamber for supporting a wafer, a chuck transfer device for driving the chuck, a probe card having a large number of probes configured to contact semiconductor elements formed on the wafer, and a tester connected to the probe card for performing a test.

[0005] In such a conventional technique, the chuck transfer device transports the chuck holding the wafer into the inspection chamber, grasps the positions of the contact electrodes on the wafer and the probes of the probe card using a vision sensor such as a CCD camera, and controls the chuck transfer device based on the grasped position information to bring the contact electrodes of the wafer into contact with the probes, thereby making an electrical connection.

[0006] Generally, such wafer testing is a single-probe test that inspects only one wafer at a time. The present invention develops a cartridge module that can efficiently inspect a large number of wafers by moving beyond the wafer inspection process of such conventional single-probe tests, and a multi-wafer testing apparatus that utilizes this cartridge module, and files a patent application for this invention. [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Korean Published Patent Gazette No. 10-2010-0130540 (Publication Date: December 13, 2010) [Overview of the project] [Problems that the invention aims to solve]

[0008] The present invention aims to provide a cartridge module that integrates a probe card and a wafer into a single module for wafer inspection, and that can maintain the self-position of the probe card and wafer, as well as a multi-wafer testing apparatus using the same. [Means for solving the problem]

[0009] A multi-wafer test apparatus according to an embodiment of the present invention for achieving the above objective includes: at least two chambers to which a tester is connected and which are provided with a test head that electrically connects a probe card to the tester; a cartridge module including a first body portion provided with a probe card and a second body portion provided with a wafer chuck on which a wafer is seated and which is detachably assembled with the first body portion; a wafer loading unit that unclams the first body portion and the second body portion to attach and detach them, loads a wafer into the second body portion, and assembles the first body portion and the second body portion by clamping operation; and a transfer unit that transports and transmits the cartridge module between the wafer loading unit and the chambers.

[0010] Preferably, the chamber includes a guide rail on which the cartridge module is positioned, a temperature control device provided at the lower end of the cartridge module seated on the guide rail for adjusting the temperature, a lifting unit for raising and lowering the temperature control device, and a drive source supply unit for supplying a drive source to the cartridge module seated on the guide rail.

[0011] Preferably, the system further includes a cartridge module stacking platform capable of accommodating at least two of the cartridge modules.

[0012] Preferably, the cartridge module includes a weight ring assembled to the second body portion at the upper part of the first body portion, wherein a magnet holder is provided in the second body portion corresponding to a guide hole drilled in the first body portion, and a magnet chuck is provided which can be inserted into the guide hole and fixed to the magnet holder by magnetic force; and a clamp portion provided between the first body portion and the weight ring for fixing the distance between the first body portion and the weight ring.

[0013] Next, an embodiment of the present invention is a cartridge module equipped with a probe card for inspecting a wafer, and capable of transporting a wafer and a probe card as a module, comprising: a first body portion equipped with a probe card and having a vertically formed through-hole; a second body portion equipped with a wafer chuck on which a wafer is seated and equipped with a magnet holder corresponding to the guide hole, thereby detachably assembled with the first body portion so as to electrically connect the probe card and the wafer; a weight ring assembled with the second body portion on the upper part of the first body portion, equipped with a magnet chuck that is inserted into the guide hole and can be fixed to the magnet holder by magnetic force; and a clamp portion for clamping / unclamping the first body portion and the second body portion to fix / attach / detach the first body portion and the second body portion.

[0014] Preferably, the magnetic chuck further includes a friction pad provided between the contact surface with the magnetic holder.

[0015] Preferably, the clamp portion includes a shaft, one end of which is fixed to either the weight ring or the first body portion, and a pneumatic drive unit, which is fixed to the other of the weight ring or the first body portion and is fixed to the shaft by a pneumatic signal.

[0016] More preferably, the pneumatic drive unit is of the normally closed type.

[0017] Preferably, the second body portion includes a saddle body made of a thermal conductor that contacts the wafer chuck, and the saddle body includes an inner saddle body partitioned by a heat insulating member and in direct contact with the wafer chuck, and an outer saddle body that forms the periphery of the inner saddle body.

[0018] More preferably, the inner saddle body further includes a plurality of heat conductive members formed vertically through it and having a thermal conductivity even greater than that of the saddle body.

[0019] Preferably, at least two of the magnetic chucks are provided at the bottom of the weight ring, and more preferably, at least two of the clamping portions are provided between the first body portion and the weight ring.

[0020] More preferably, at least one clamp portion is provided between adjacent magnetic chucks.

[0021] Preferably, the system further includes a guide member interposed between the first body portion and the weight ring to guide the assembly position of the first body portion and the weight ring. [Effects of the Invention]

[0022] The multi-wafer test apparatus of the present invention includes at least two chambers, a cartridge module including a first body part equipped with a probe card and a second body part equipped with a wafer chuck on which a wafer is seated and which is detachably assembled with the first body part, a wafer loading unit that unclams the first body part and the second body part to attach and detach them, loads a wafer into the second body part, and assembles the first body part and the second body part by clamping, and a transfer unit that transports and transmits the cartridge module between the wafer loading unit and the chambers. This has the effect of maximizing test efficiency by allowing a large number of wafers to be tested in a single test.

[0023] In addition, the cartridge module of the present invention is provided with a probe card for inspecting a wafer, and is a cartridge module in which the wafer and the probe card are modularized and can be transported. By providing the probe card, it includes a first body portion having a guide hole formed vertically therethrough, a wafer chuck on which the wafer is seated, a magnet holder provided corresponding to the guide hole, and a second body portion that is detachably assembled with the first body portion so that the probe card and the wafer are electrically connected. A magnet chuck that can be inserted into the guide hole and fixed to the magnet holder by magnetic force, a weight ring assembled to the second body portion above the first body portion, and a clamp member that clamps / unclamps the first body portion and the second body portion to fix / detach the first body portion and the second body portion. By modularizing and integrally configuring the wafer and the probe card, there is an effect that the precise self-position of the probe card and the wafer can be maintained during the transfer process of the cartridge module.

Brief Description of the Drawings

[0024] [Figure 1] It is a plan layout configuration diagram of a multi-wafer test device according to an embodiment of the present invention. [Figure 2] It is a perspective configuration diagram of a cartridge module according to an embodiment of the present invention. [Figure 3] It is a perspective configuration diagram showing the attached / detached state of a cartridge module according to an embodiment of the present invention. [Figure 4] It is an exploded perspective configuration diagram of a cartridge module according to an embodiment of the present invention. [Figure 5] It is a plan configuration diagram of a cartridge module according to an embodiment of the present invention. [Figure 6] (a) and (b) are respectively a front configuration diagram and a side configuration diagram of a cartridge module according to an embodiment of the present invention. [Figure 7] It is a cross-sectional configuration diagram taken along the line A-A of FIG. 2. [Figure 8]This is a cross-sectional diagram along line BB in Figure 5. [Figure 9] (a) and (b) are cross-sectional diagrams showing other embodiments of the cartridge module according to the embodiment of the present invention, and a cross-sectional diagram along the CC line. [Figure 10] This is a cross-sectional view showing another modified example of the second body portion in a cartridge module according to an embodiment of the present invention. [Figure 11] This is a front view of the multi-chamber configuration in a multi-wafer test apparatus according to an embodiment of the present invention. [Figure 12] This is a front view showing an enlarged portion of the multi-chamber configuration in a multi-wafer test apparatus according to an embodiment of the present invention. [Figure 13] This is a diagram showing the configuration of a cartridge module stacking platform in a multi-wafer test apparatus according to an embodiment of the present invention. [Modes for carrying out the invention]

[0025] The specific structural or functional descriptions presented in the embodiments of the present invention are merely illustrative for the purpose of illustrating embodiments of the concept of the present invention, and embodiments of the concept of the present invention can be implemented in various forms. Furthermore, the embodiments described herein should not be construed as being limited to those described herein, but rather should be understood to encompass all modifications, equivalents, or substitutes that fall within the spirit and technical scope of the present invention.

[0026] The present invention will be described in detail below with reference to the attached drawings.

[0027] Figure 1 is a plan view of a multi-wafer test apparatus according to an embodiment of the present invention, Figure 2 is a perspective view of a cartridge module 200 according to an embodiment of the present invention, and Figure 3 is a perspective view showing the attachment and detachment state of the cartridge module 200 according to an embodiment of the present invention.

[0028] Referring to Figures 1 to 3, the multi-wafer test apparatus according to an embodiment of the present invention includes a tester 110, a chamber 120, a wafer loading unit 130, an aligner 140, a transfer unit 150, and a cartridge module 200.

[0029] The cartridge module 200 includes a first body portion 210 equipped with a probe card 211, and a second body portion 220 equipped with a wafer chuck 221, which is detachably assembled to the first body portion 210. A clamping member is provided between the first body portion 210 and the second body portion 220, and the clamping / unclamping of the clamping member clamps or unclams the first body portion 210 and the second body portion 220 to fix or detach them from each other. In this embodiment, the clamping member can be provided by a clamping mechanism in which the clamping operation is performed by a pneumatic signal in addition to magnetic force. In such a cartridge module 200, the first body portion 210 and the second body portion 220 are mechanically assembled to be detachably assembled, and the clamping member enables precise self-positioning between the probe card 211 and the wafer 10, so that a large number of wafers can be inspected at once. Specific embodiments of such a cartridge module will be described again in the relevant drawings.

[0030] The chamber 120 is a multi-chamber consisting of at least two chambers, providing a test space for wafers 10 and may be equipped with ancillary equipment for generating conditions such as test temperature. Each chamber 120 is equipped with a test head 121 electrically connected to a tester 110, which is coupled to a probe card 211 of a cartridge module 200, and tests are performed on wafers 10 loaded into the cartridge module 200. The tester 110 generates a test signal, which is transmitted to the wafers 10 via the test head 121 and probe card 211.

[0031] The wafer loading unit 130 is loaded with wafers 10 to be inspected, and the wafers 10 are loaded into the cartridge module 200. More specifically, the wafers 10 to be inspected are loaded into the second body unit 220, which is separated from the cartridge module 200.

[0032] The aligner 140 is where the cartridge module 200 is positioned. First, the first body section 210 and the second body section 220 of the cartridge module 200 are unclamped, and the first body section 210 and the second body section 220 are attached to and detached from each other. The second body section 220 is then transmitted to the wafer loading section 130. Once transmitted to the wafer loading section 130, the wafer 10 to be inspected is loaded onto the wafer chuck 221 of the second body section 220. The second body section 220 with the wafer 10 loaded is then transported to the aligner 140. Once transported to the aligner 140, the second body section 220 is assembled with the first body section 210 with the wafer 10 seated on it. The first body section 210 and the second body section 220 are assembled by clamping operations of the clamping members. The assembled cartridge module 200 is then transmitted to the chamber 120 by the transfer section 150 for testing. On the other hand, although not shown in the diagram, the system may further include a loader on which inspected wafers are loaded.

[0033] On the other hand, although the wafer loading process of the cartridge module 200 has been described in this embodiment as being divided into a wafer loading section 130 and an aligner 140, the two steps may not be separate and divided steps but rather a single continuous step. To do this, ancillary equipment such as a well-known robotic arm, aligner, vision inspection device, or transport device for attaching, detaching, or assembling the first body section 210 and the second body section 220 of the cartridge module 200 may be included.

[0034] Preferably, the cartridge module 200 is provided with a utility supply unit 215 for supplying a drive source (power / air) for clamping / unclamping, and the cartridge module 200 seated in the wafer loading unit 130 and aligner 140 can be operated by having a drive source supplied from the outside via the utility supply unit to perform clamping / unclamping operations.

[0035] Preferably, the system further includes a cartridge module tray 160 capable of accommodating multiple cartridge modules 200, the cartridge module tray 160 for accommodating probe cards 211 or cartridge modules 200 that need to be replaced, or for accommodating extra cartridge modules such as new (repaired) probe cards or cartridge modules for replacement.

[0036] The following will provide a detailed explanation of each of the above-mentioned configurations, with reference to the relevant drawings.

[0037] Figure 4 is an exploded perspective view of the cartridge module 200 according to an embodiment of the present invention, Figure 5 is a plan view of the cartridge module 200 according to an embodiment of the present invention, Figures 6(a) and 6(b) are a front view and a side view of the cartridge module 200 according to an embodiment of the present invention, respectively, and Figure 7 is a cross-sectional view along line AA in Figure 2.

[0038] Referring to Figures 4 to 7, the cartridge module 200 according to an embodiment of the present invention includes a first body portion 210, a second body portion 220, a weight ring 230, and a clamp portion 240.

[0039] The first body portion 210 has a probe card 211 located in the center and guide holes 212 formed perpendicularly through the periphery of the probe card 211. In this embodiment, the first body portion 210 is a rectangular member having approximately four sides, and the guide holes 212 are located at each of the four corners of the first body portion 210, however, the shape of the first body portion 210 and the number and position of the guide holes 212 can be varied in various ways. Preferably, the first body portion 210 has at least two guide holes 212.

[0040] The first body section 210 may be provided with a plurality of rollers 213 at both ends that are freely rotatable for transport. Such rollers 213 can be provided by cam followers with a low coefficient of friction and excellent rotational performance, but are not limited to this.

[0041] The first body section 210 further includes a utility supply section 215 for receiving an external power source for the clamping / unclamping operation of the cartridge module 200, and in this embodiment, the utility supply section 215 comprises a powered brush 215a and an auto coupler 215a supplied with clean dry air (CDA).

[0042] The second body portion 220 is provided with a wafer chuck 221 in the center on which the wafer 10 is seated, and a magnet holder 222 corresponding to the guide hole 212 of the first body portion 210. The magnet holder 222 can be made of a well-known material (e.g., a ferromagnetic material) that can exert an attractive force through magnetic force with the magnet chuck 231 provided on the weight ring 230. In this embodiment, it is shown that four magnet holders 222 are provided at positions corresponding to the guide hole 212. The wafer chuck 221 may be provided with an air fitting 221a for vacuum-suctioning and fixing the seated wafer 10.

[0043] The weight ring 230 is a square annular ring, and is equipped with a magnetic chuck 231 at its lower end. The same number of such magnetic chucks 231 are provided as the number of magnetic holders 222 on the second body portion 220. The magnetic chucks 231 can be provided by permanent magnets or electromagnets, preferably by permanent magnets.

[0044] Preferably, the magnetic chuck 231 further includes a friction pad 233 capable of providing a frictional force between its contact surface with the magnetic holder 222. As illustrated in Figure 7, the magnetic chuck 231 and the magnetic holder 222 are fixed by magnetic force and strongly fixed in the vertical direction (z-axis direction), while the fixing in the horizontal direction (xy-plane) may be relatively weaker. The friction pad 233 is compressed between the magnetic chuck 231 and the magnetic holder 222 to provide a horizontal frictional force, thereby enabling the cartridge module 200 to maintain a precise self-position even against horizontal external forces during its movement. Such a friction pad 233 can be provided by a material with a high coefficient of friction, such as a silicon pad, but is not limited thereto.

[0045] Preferably, a plurality of guide pins 232 can be provided on the lower part of the weight ring 230, and holes 214 can be provided on the upper surface of the first body portion 210 corresponding to each guide pin 232, so that the assembly positions of the weight ring 230 and the first body portion 210 can be aligned by inserting each guide pin 232 into the holes 214 during the assembly process of the weight ring 230 and the first body portion 210. On the other hand, although the illustration shows that the guide pins 232 are provided on the weight ring 230, a plurality of guide pins 232 can be provided on the first body portion 210, and a plurality of holes can be provided on the weight ring 230 corresponding to each guide pin 232, thereby providing a guide member for guiding the assembly position of the first body portion 210 and the weight ring 230.

[0046] The clamp portion 240 is provided between the first body portion 210 and the weight ring 230, and is for fixing the distance between the first body portion 210 and the weight ring 230. Preferably, a plurality of clamp portions 240 are provided between the first body portion 210 and the weight ring 230.

[0047] Such a clamping section 240 includes a shaft 241 whose upper end is fixed to the lower part of the weight ring 230, and a pneumatic drive unit 242 fixed to the first body section 210, which fixes the shaft 241 by an external pneumatic signal. Reference numeral 243 denotes an air fitting for supplying pneumatic pressure to the clamping section 240.

[0048] Figure 8 is a cross-sectional diagram along line BB in Figure 5, showing the cross-sectional configuration of the clamp section 240. For the sake of understanding, only the first body section 210, the weight ring 230, and the clamp section 240 are shown, and the size and proportions of the components are exaggerated.

[0049] Referring to Figure 8, the clamp section 240 includes a shaft 241 whose upper end is fixed by a weight ring 230 and a first bolt 244, and a pneumatic drive section 242 whose lower end is fixed by a first body section 210 and a second bolt 245, and which is capable of fixing the shaft 241. Depending on the pneumatic signal applied to the pneumatic drive section 242, the shaft 241 moves up and down within the pneumatic drive section 242 or its position (height) is fixed.

[0050] Preferably, the pneumatic drive unit 242 is a clamping mechanism driven by an NC (Normal close) type pneumatic signal, and while air pressure is applied to the pneumatic drive unit 242, the shaft 241 can move up and down by the pneumatic drive unit 242. Conversely, if no air pressure is applied to the pneumatic drive unit 242, the shaft 241 is clamped and fixed by the pneumatic drive unit 242, and the distance between the first body portion 210 and the weight ring 230 is fixed.

[0051] Such a clamping section 240 can be provided by the clamping mechanism of the RBPS series, which is sold by Zimmer as a "clamping and braking element," but is not limited to this.

[0052] In the cartridge module 200 configured in this way, the wafer 10 is seated on the wafer chuck 221, the first body section 210 and the weight ring 230 are stacked on top of the second body section 220 and assembled, and the first body section 210, the second body section 220 and the weight ring 230 are fixed to each other by magnetic force through the magnetic chuck 231 and the magnetic holder 222. Meanwhile, during the assembly process of the first body section 210, the second body section 220 and the weight ring 230, pneumatic pressure is applied to the clamp section 240, allowing the shaft 241 to move up and down with the pneumatic drive section 242. Thereafter, when the pneumatic pressure supplied to the clamp section 240 is finally cut off, the gap between the first body section 210 and the weight ring 230 is fixed by the clamp section 240, thereby fixing the self-position of the wafer 10 and the probe card 211.

[0053] In this way, the probe card 211 and wafer 10 can be transported with their positions precisely maintained by the cartridge 200, and are transferred to the chamber 120 for inspection.

[0054] Figure 5 illustrates the spacings H1 to H4 at each position between the first body portion 210, which is fixed by four clamp portions 240, and the weight ring 230, indicated by arrows. For the sake of understanding, the spacings H1 to H4 at each position are exaggerated. The present invention has confirmed that by employing a magnetic chuck 231 and clamp portions 240 using pneumatic signals, it is possible to maintain self-position within a precise range of less than 10 μm, not only in a horizontal state but also when there is a slope.

[0055] On the other hand, in the embodiment of the present invention, a magnet holder 222 to which four magnet chucks 231 and four clamping portions 240 are applied was described as an example, but the arrangement and number of magnet chucks 231 and clamping portions 240 may change depending on the size of the wafer.

[0056] Figures 9(a) and 9(b) show cross-sectional configurations of other embodiments of the cartridge module of the present invention and a cross-sectional configuration along the CC line. Duplication of explanations regarding the same configuration as the previous embodiment will be omitted, and the differences will be explained in detail.

[0057] Referring to Figure 9, in this embodiment, the second body portion 320 includes a wafer chuck 321 on which the wafer 10 is seated, and saddle bodies 322 and 323 that are in contact with the wafer chuck 321 and transfer heat generated from the temperature control device 400. Preferably, the saddle bodies 322 and 323 include an inner saddle body 322 and an outer saddle body 323 separated by a heat insulating member 324. The saddle bodies 322 and 323 are provided by a heat conductor such as aluminum (A1) that transfers heat generated from the temperature control device 400 to the wafer chuck 321. In particular, by separating the area in direct contact with the wafer chuck 321 with the heat insulating member 324 and performing heat conduction via the inner saddle body 322, the temperature of the wafer can be controlled more quickly.

[0058] Preferably, the inner saddle body 322 further includes a plurality of vertically penetrating heat conductive members 322a, the heat conductive members 322a of which can be made of a material with a higher thermal conductivity than the inner saddle body 322. For example, such heat conductive members may be silver (Ag), copper (Cu), or an alloy.

[0059] Thus, in this embodiment, the second body portion 320 includes an inner saddle body 322 that is in direct contact with the wafer chuck 321, with the saddle bodies 322 and 323 separated by a heat insulating member 324, and the inner saddle body 322 is provided with a plurality of heat conductive members 322a formed through it, so that conductive heat for temperature control of the wafer 10 can be transferred more quickly compared to saddle bodies 322 and 323 made of a single material. Furthermore, with this configuration, heat is rapidly released through the outer saddle body 323, preventing thermal energy from concentrating on the wafer 10 and maintaining a uniform temperature distribution of the wafer 10.

[0060] Figure 10 is a cross-sectional view showing another modified example of the second body portion in a cartridge module according to an embodiment of the present invention.

[0061] The second body portion 420 of this embodiment includes a wafer chuck (thin chuck) 421 on which the wafer 10 is seated, and saddle bodies 422 and 423 that are in contact with the wafer chuck 421 and transfer heat generated from the temperature control device 400.

[0062] In particular, the saddle bodies 422 and 423 include an inner saddle body 422 and an outer saddle body 423 separated by a heat insulating member 424, and the inner saddle body 422, which is in direct contact with the wafer chuck 421, includes a plurality of vertically penetrating heat conductive members 422a, and such heat conductive members 422a are made of a material with even greater thermal conductivity than the inner saddle body 422, thereby enabling rapid temperature control and uniform temperature distribution of the wafer 10 as described above.

[0063] Figure 11 is a front view of the multi-chamber configuration in a multi-wafer test apparatus according to an embodiment of the present invention, and Figure 12 is an enlarged front view showing a part of the multi-chamber configuration in a multi-wafer test apparatus according to an embodiment of the present invention.

[0064] Referring to Figure 11, the chamber 120 in this embodiment is provided by a multi-chamber consisting of at least two units, the cartridge module 200 can be seated in the chamber 120 by the transfer unit 150 and automatically connected to the tester 110, and the utility supply unit 215 of the cartridge module 200 can be connected to the power source supply unit in the chamber 120 to supply power and air.

[0065] Figure 12 shows the cartridge module 200 seated in the chamber 120. Referring to Figure 12, the rollers 213 of the cartridge module 200 are positioned along the guide rail 122, and a temperature control device consisting of a heating block 123 and a cooling block 124 is provided at the lower end of the second body portion 220. The heating block 123 and cooling block 124 heat or cool the wafer 10 to the target temperature. Drawing reference numeral 124a indicates a cooling manifold to which a refrigerant for cooling is supplied, and drawing reference numeral 126 indicates an air manifold (CDA manifold) for supplying compressed air to the cartridge module 200. A lifting unit 216 for height adjustment may be provided at the lower end of the cooling block 124, the cartridge module 200 is seated in the chamber, the heating / cooling blocks 123 and 124 come into contact with the second body section 220 by the lifting unit 216, and the temperature of the wafer to be inspected is controlled by conduction.

[0066] Figure 13 is a diagram showing the configuration of a cartridge module loading platform 160 in a multi-wafer test apparatus according to an embodiment of the present invention.

[0067] Referring to Figure 13, the cartridge module mounting platform 160 is capable of accommodating at least two cartridge modules 200 and can be positioned adjacent to the chamber.

[0068] The cartridge module mounting tray 160 houses the probe card 211 or cartridge module 200 that needs replacing, and is used for replacing it with a new (repaired) probe card or cartridge module.

[0069] For example, a faulty probe card or cartridge module 200A is moved by the transfer unit 150 to the cartridge module loading platform 160 to await external transport for repair, and a repaired probe card or cartridge module 200B is stored on the cartridge module loading platform 160 by the transfer trolley 170.

[0070] Such a cartridge module loading platform 160 can store a working probe card and cartridge module that can be used when replacement is needed. Drawing reference numeral "200C" indicates a working cartridge module, and drawing reference numeral "200D" indicates an assembly of the first body part 210 and the second body part 220, which are equipped with a probe card, excluding the second body part 220, which is equipped with a wafer chuck in a working cartridge module.

[0071] The present invention described above is not limited to the embodiments and accompanying drawings described above, and it will be obvious to those with ordinary skill in the art to which the present invention pertains that various substitutions, modifications, and changes are possible without departing from the technical spirit of the present invention. [Explanation of symbols]

[0072] 110 Tester 120 chambers 130 Wafer Loading Section 140 aligners 150 Transfer section 160 Cartridge Module Stacking Platform 200 cartridge modules 210 First Body Section 211 Probe Card 212 Guide holes 220, 320, 420 Second Body Section 221 Wafer Chuck 222 Magnetic Holder 230 Weight Ring 240 Clamp section 231 Magnetic Chuck 233 Friction Pads

Claims

1. The system includes at least two chambers to which a tester is connected and a test head is provided to electrically connect the probe card and the tester, A cartridge module including a first body part equipped with a probe card and a second body part equipped with a wafer chuck on which a wafer is seated and which is detachably assembled with the first body part, A wafer loading unit that unclams the first body portion and the second body portion to attach and detach the first body portion and the second body portion, loads a wafer into the second body portion, and assembles the first body portion and the second body portion by clamping, The system includes a transfer unit that transports and transmits the cartridge module between the wafer loading unit and the chamber, The aforementioned chamber The guide rail on which the cartridge module is located, A temperature control device is provided at the lower end of the cartridge module seated on the guide rail, and is used to adjust the temperature. A lifting unit for raising and lowering the temperature control device, A multi-wafer test apparatus including a drive source supply unit for supplying a drive source to the cartridge module seated on the guide rail.

2. The multi-wafer test apparatus according to claim 1, further comprising a cartridge module stacking platform capable of accommodating at least two of the aforementioned cartridge modules.

3. At least two chambers, each provided with a test head to which a tester is connected and which electrically connects a probe card and the tester, A cartridge module including a first body part equipped with a probe card and a second body part equipped with a wafer chuck on which a wafer is seated and which is detachably assembled with the first body part, A wafer loading unit that unclams the first body portion and the second body portion to attach and detach the first body portion and the second body portion, loads a wafer into the second body portion, and assembles the first body portion and the second body portion by clamping, The system includes a transfer unit that transports and transmits the cartridge module between the wafer loading unit and the chamber, The aforementioned cartridge module is A magnet holder is provided in the second body portion corresponding to a guide hole drilled in the first body portion. A magnetic chuck is provided which is inserted into the guide hole and fixed to the magnet holder by magnetic force, and a weight ring is assembled to the second body at the upper part of the first body, A multi-wafer testing apparatus comprising a clamp portion provided between the first body portion and the weight ring, which fixes the distance between the first body portion and the weight ring.

4. The multi-wafer testing apparatus according to claim 3, wherein the magnetic chuck further includes a friction pad provided between the contact surfaces with the magnetic holder.

5. The multi-wafer testing apparatus according to claim 3, characterized in that at least two of the magnetic chucks are provided at the lower part of the weight ring.

6. The multi-wafer testing apparatus according to claim 5, characterized in that at least two clamping portions are provided between the first body portion and the weight ring.

7. The multi-wafer testing apparatus according to claim 6, characterized in that at least one clamp portion is provided between adjacent magnetic chucks.

8. The clamp portion is A shaft, one end of which is fixed to either the weight ring or the first body portion, The multi-wafer test apparatus according to claim 3, comprising the weight ring and a pneumatic drive unit fixed to the other of the first body portion and fixed to the shaft by a pneumatic signal.

9. The multi-wafer test apparatus according to claim 8, characterized in that the pneumatic drive unit is of a normally closed type.

10. The multi-wafer test apparatus according to claim 3, further comprising a guide member interposed between the first body portion and the weight ring for guiding the assembly position of the first body portion and the weight ring.

11. A cartridge module equipped with a probe card for inspecting wafers, which allows for the modularization and transport of the wafer and probe card, A probe card is provided, and a first body portion has a guide hole formed vertically through it, A wafer chuck is provided on which the wafer is seated, and a magnet holder is provided corresponding to the guide hole, so that the probe card and the wafer are electrically connected, and a second body part is detachably assembled with the first body part, A magnetic chuck is provided which is inserted into the guide hole and fixed to the magnet holder by magnetic force, and a weight ring is assembled to the second body at the upper part of the first body, A cartridge module including a clamping section for clamping / unclamping the first body section and the second body section to fix / attach the first body section and the second body section.

12. The cartridge module according to claim 11, wherein the magnetic chuck further includes a friction pad provided between the contact surfaces with the magnetic holder.

13. The clamp portion is A shaft, one end of which is fixed to either the weight ring or the first body portion, The cartridge module according to claim 11, comprising a weight ring and a pneumatic drive unit fixed to the other of the first body portion and fixed to the shaft by a pneumatic signal.

14. The cartridge module according to claim 13, characterized in that the pneumatic drive unit is of a normally closed type.

15. The second body section is, It includes a saddle body made of a heat conductor that is in contact with the wafer chuck, The cartridge module according to claim 11, wherein the saddle body includes an inner saddle body partitioned by a heat insulating member and in direct contact with the wafer chuck, and an outer saddle body that constitutes the periphery of the inner saddle body.

16. The cartridge module according to claim 15, wherein the inner saddle body further includes a plurality of heat conductive members formed vertically through it and having a thermal conductivity even greater than that of the saddle body.

Images