Optoelectronic module configured to operate simultaneously at high and low bitrates.

Abstract

To improve optoelectronic modules to allow the possibility to deal with both high-speed data rates and low-speed data rates without implementing two different modules, one dedicated to the high-speed data rates and the other to the low-speed ones.SOLUTION: The application relates to a unique optoelectronic module configured to operate simultaneously at high-speed bit rate and low-speed bit rate, thanks to a reconfigurable system-on-chip, i.e. a programmable unit on a chip. This reconfigurable system embeds electronic circuitry of low-speed channels, i.e. at least a driver when a link is a transmission channel or at least an amplifier when the link is a receiver channel.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an optoelectronic module that combines channels operating at different data rates.

[0002] The term "optical subassembly", i.e., OSA, is used to describe a subassembly that groups one or more optoelectronic components and an optical coupling system for the one or more optical fibers.

[0003] The present invention relates to an optoelectronic module that is particularly implemented in the fields of aeronautics, space, defense, surveillance, transportation or medicine, and further in the fields of telecommunications, data communication and industry.

Background Art

[0004] An optical link system is known to use an optoelectronic module and an optical link formed by one or more optical fibers. Each optoelectronic transmitter module, receiver module, or transceiver module consists of an electronically daisy-chained electronic substrate, optoelectronic components and their control electronics, and one or more optical fibers, and an optical coupling device between the optoelectronic components and the optical fibers.

[0005] Therefore, each module is fixed to an application board by soldering or adhesion, or by an electrical connector.

[0006] Thus, a functional optical link system comprises at least one transmitter module and at least one receiver optically coupled to the transmitter module via an optical fiber medium.

[0007] The product D-Lightsys (registered trademark) sold by the applicant RADIALL relates to a transceiver that integrates the functions of a transmitter, a receiver, or both a transmitter and a receiver.

[0008] Today, some optoelectronic modules are specialized to transmit and receive only high-speed data signals, typically at rates starting from 100 Mbps (megabytes per second). These modules contain special electronic components that are not configured to handle the DC (direct current) component of electrical signals.

[0009] On the other hand, some optoelectronic modules are specialized to transmit and receive only low-speed data signals, typically at rates of DC to 10 Mbps.

[0010] This means that if a given application needs to support both high-speed and low-speed data rates, two separate modules will be required, which imposes constraints in terms of cost, space, and energy consumption. [Prior art documents] [Patent Documents]

[0011] [Patent Document 1] U.S. Patent No. 7,309,169 [Overview of the project] [Problems that the invention aims to solve]

[0012] Therefore, the optoelectronic module needs to be further improved so that it can support both high and low data rates, without having to implement two separate modules, one for high data rates and one for low data rates.

[0013] The present invention aims to address some or all of these needs. [Means for solving the problem]

[0014] Therefore, the subject of the present invention is an optoelectronic module. - Host printed circuit board (PCB), - An electronic die configured to process data electronically at a high rate, - At least one optoelectronic subassembly (OSA) present on the host PCB, • At least one channel dedicated to high-rate data, • At least one channel dedicated to low-rate data, • At least one optical medium and alignment means configured to align each activated region of the photoelectron die with at least one optical transmission medium. OSA equipped with, - A reconfigurable system-on-a-chip (RSOC) residing on the host PCB, which incorporates the functionality for electronic processing of slow data and is configured to control the electronic processing of both fast and slow data. This is an optoelectronic module equipped with [a specific feature / ability].

[0015] In an advantageous embodiment, the OSA comprises a transmitter section (Tx) and a receiver section (Rx), one of which is configured to transmit data at a high data rate, and the other section is configured to receive low-speed signals.

[0016] Preferably, the optoelectronic module includes an optical fiber having an optical connector.

[0017] Preferably, the OSA also includes an optical fiber pigtail, one end of which is terminated by a ferrule housed and held in a support present on the host PCB.

[0018] In a favorable variant, the electronic die includes a driver for monitoring one of the data channels' optoelectronic elements, the optoelectronic element controlled by the driver being a vertical-cavity surface-emitting laser (VCSEL), and one of the data channels includes a photodiode as the optoelectronic element and an amplifier configured to amplify the output of the photodiode.

[0019] The low data rate is preferably DC to 10 Mbps, and the high data rate is preferably 100 Mbps to 10 Gbps.

[0020] According to a preferred variant, the RSOC includes a temperature compensation function.

[0021] Preferably, the RSOC is configured to monitor a data channel based on optical data received in one of the channels.

[0022] The RSOC can be remotely reconfigured by an optical path including a special key data message when received in one of the channels.

[0023] According to a preferred configuration, the host PCB is part of a unique package that includes a cover that protects all components present on the host PCB.

[0024] According to another preferred configuration, a single optical fiber is used for two channels for transmitting and receiving high-speed and low-speed data, whereby the module is configured as a bidirectional transceiver.

[0025] In other words, the present invention resides in a unique optoelectronic module having optical links for high and low data rates and a reconfigurable system-on-chip, i.e., a programmable unit on the chip. This reconfigurable system incorporates electronic circuitry for the low-speed channel that becomes at least a driver when the link is a transmit channel and at least an amplifier when the link is a receive channel. Also, the reconfigurable system controls these high-speed electronic components taking into account parameters such as temperature, laser, and / or optical parameters of the reception such as bias current.

[0026] In that sense, the optoelectronic module according to the present invention is asymmetric with respect to the speed data rate, i.e., there are two segments operating at different speed data rates, one being low speed and the other being high speed.

[0027] Only a transmitter link or only a receiver link can be incorporated into this optoelectronic module. Furthermore, since the reconfigurable system can control three or more channels, the present invention is not limited to two links and can be applied to VCSELs, photodiode arrays, or multiple optoelectronic dies.

[0028] According to a preferred embodiment, the optoelectronic module comprises at least one receiver for a low data rate, and this unique system is configured to extract information from the receiver data, process it internally, and control a high data rate segment.

[0029] Furthermore, this system can be internally reprogrammed based on a special trigger and the parameters of a new program subsequently transmitted via a slow data channel.

[0030] The main advantages of the asymmetric optoelectronic module according to the present invention are numerous, compared to a combination of a high-rate optoelectronic module and a low-rate optoelectronic device, or to a combination of both integrated into a single package, and can be listed below. - By integrating a low-speed electronic chain into a reconfigurable system-on-chip, while ensuring monitoring and control on the high-speed side, the total number of electronic components is reduced. - Only one reconfigurable system is required to use multiple channels, i.e., two or more channels, on one side. - PCB design is simplified, and the PCB structure is reduced to just one layer instead of multiple layers related to the multiple operating frequencies of the electronic components. As a main result, the footprint of the complete device according to the present invention is significantly reduced. For example, the footprint of a complete hybrid dual transceiver is approximately 10 × 13 × 3.5 mm. 3 It could become that.

[0031] The cost of optoelectronic devices is decreasing as a result of a reduction in the total number of electronic components and / or the use of reconfigurable system-on-chip components that are off-the-shelf standard parts.

[0032] Other direct results include reduced power consumption and heat dissipation.

[0033] Furthermore, using a reconfigurable system makes it possible to control the loop between the high-speed and low-speed sides without additional dies. When necessary, the system can internally process the low-speed data to monitor the high-speed side.

[0034] Other advantages and features of the present invention will become clearer by reading the detailed description of the exemplary implementations of the invention shown as non-limiting examples, while referring to the following figures. [Brief explanation of the drawing]

[0035] [Figure 1] This is a perspective view of an example of an optoelectronic (transceiver) module according to the present invention, which is equipped with two optical fiber pigtails. [Figure 2] This is a detailed view of Figure 1. [Figure 3] This is a functional diagram representing a first embodiment of the optoelectronic module according to the present invention. The receiver section (Rx) is dedicated to low-speed optical data, and the transmitter section (Tx) is dedicated to high-speed optical data. [Figure 4] This is a functional diagram showing a second embodiment of the optoelectronic module according to the present invention. In this embodiment, the receiver section (Rx) is dedicated to high-speed optical data, and the transmitter section (Tx) is dedicated to low-speed optical data. [Modes for carrying out the invention]

[0036] Figures 1 and 2 show the optoelectronic (transceiver) module 1 according to the present invention, which can preferably operate simultaneously at a high bitrate of 100 Mbps to 10 Gbps and a low bitrate of DC to 10 Mbps.

[0037] As shown, the transceiver module 1 comprises a unique package 10 that includes a host PCB 11 and a cover 12 that protects all components present on the host PCB 11.

[0038] The host PCB 11 also has a T-shaped support 13 that supports two retaining and crimping sleeves 14 and 15.

[0039] In the embodiment shown in Figure 1, the package 10 includes optical fiber pigtails (not shown), whose connectorized ends are connected to optical cable assemblies 20 and 30 by retaining tubes 14 and 15. The connectors 21 and 31 of the assembled cables may also be LC connectors.

[0040] In another embodiment, the package is pigtailed, i.e., a pigtail with a connector end protrudes directly from the package.

[0041] In another embodiment, the optical fiber is connectorized into a package.

[0042] Figure 3 shows a functional diagram of the optoelectronic module 1 representing the first embodiment.

[0043] In this first embodiment, the optoelectronic module 1 comprises an optical semi-assembly (OSA) 2 received on a host PCB 11. The OSA comprises a receiver section Rx configured to receive data at a low rate and a transmitter section Tx configured to transmit data at a high rate, and these optoelectronic components are arranged side by side within the OSA bonded to the host PCB.

[0044] The receiver section (Rx) includes the optoelectronic component 16, which is a photodiode.

[0045] The transmitter section (Tx) includes an optoelectronic component 17 which is a vertical-cavity surface-emitting laser (VCSEL).

[0046] According to the present invention, a reconfigurable system-on-chip (RSOC) 100 is present on the host PCB 11, which incorporates the function of electronically processing slow data and is configured to control the electronic processing of both high-speed and slow data.

[0047] Therefore, the photodiode 16 is electrically connected to the RSOC 100, which extracts (low-rate) data from the photodiode 16 via the built-in amplifier 18.

[0048] The electronic die is configured to process data electronically at a high rate. The die includes a laser driver 19.

[0049] According to the present invention, in addition to the function of receiving at low speed, RSOC 100 is interfaced with the high-speed data rate component of the laser driver 19 that monitors the VCSEL 17.

[0050] The interface is preferably provided by at least one management control loop 101 that electrically connects the RSOC 100 to the laser driver 19.

[0051] RSOC 100 can implement trigger flags and / or new programs through loop 102.

[0052] In the alternative embodiment shown in Figure 4, receiver segment Rx is configured to receive data at a high rate, and transmitter segment Tx is configured to transmit data at a low rate using the same electronic and optoelectronic components and RSOC 100 as described with reference to Figure 3.

[0053] In a preferred embodiment, RSOC 100 may internally process data from the receiver segment (Rx) to control data from the transmitter segment (TX) of the same module when the optical high-speed data-rate link relies on the optical low-speed data-rate link. This processing may be performed, for example, by UART code.

[0054] Furthermore, the unique RSOC 100, through its interconnection matrix, can interface with numerous high-speed data links, numerous optoelectronic dies, and their associated electronic chains. In this configuration, the number of dies on the PCB can be reduced, resulting in lower costs and footprint.

[0055] In advantageous variations, a single optical fiber may be used to transmit and receive high-speed and low-speed data, even at the same wavelength, using one of the geometric arrangements described in U.S. Patent No. 7,309,169, for a transceiver configuration, i.e., a dual transmitter / receiver configuration. This further reduces the overall module footprint, especially when multiple dual transmitters are incorporated into a single device. It also reduces the total number of fibers.

[0056] Advantageously, the RSOC 100 is configured to implement a temperature compensation function specifically for high-rate data for either the transmitter segment Tx or the receiver segment Rx. Thus, the high-rate segment Tx or Rx incorporates a temperature compensation mode in which the VCSEL 17 adjusts the optical output, modulation, and optical peak based on the temperature of module 1.

[0057] In the embodiment shown in Figure 3, where receiver segment Rx is dedicated to low-speed data, the signal may include a special key data message for initiating bootloader mode for RSOC 100.

[0058] Therefore, an RX signal with data to be reprogrammed allows the RSOC 100 to be reconfigured. This remote configuration of the RSOC 100 eliminates the need for the user to uninstall module 1, which is normally physically inaccessible, in order to modify the RSOC 100's software.

[0059] Other variations and extensions may be provided without departing from the framework of the present invention.

[0060] For example, transceiver module 1 is not limited to having one receive channel in section Rx and one transmit channel in section Tx. Therefore, for example, one Rx channel having multiple Tx channels in a single module is foreseeable.

[0061] As another example, the low data rate segment and the high data rate segment could be both receiver segments or both transmitter segments.

[0062] Many types of optical channels can be conceived. Thus, module 1 could also be a pigtail, meaning that the internal fiber could be aligned with an optical diode or VCSEL, or some optoelectronic die could be mounted outside the module at the connector end using individual connectors.

[0063] Furthermore, the transceiver module 1 is not limited to the LC connector shown, but can accommodate any type of optical fiber connection. Any known connector type, including SC, FC, ST, MU, MTRJ, and MTP, can be implemented.

[0064] Furthermore, the transceiver module 1 is compatible with any type of optical fiber having a core such as 50 microns or 62.5 microns. Within the framework of the present invention, OM type (OM1, OM2, OM3, OM4, OM5) optical fibers are preferable.

[0065] Unless otherwise specified, the expression "to prepare" should be understood as synonymous with "to prepare at least one." [Explanation of Symbols]

[0066] 1. Optoelectronic module, transceiver module 2 Optical subassembly (OSA) 10 packages 11 Host PCB 12 Covers 13 Support 14 sleeves, retaining tubes 15 sleeves, retaining tubes 16 Optoelectronic components, photodiodes 17 Optoelectronic components, VCSEL 18. Embedded Amplifier 19 Laser Driver 20 Optical Cable Assembly 21 Connectors for bundled cables 30 Optical Cable Assembly 31 Connectors for bundled cables 100 Reconfigurable System-on-a-Chip (RSOC) 101 Management and Control Loop 102 loops Rx Receiver Classification Tx transmitter classification

Claims

1. It is an optoelectronic module, Host printed circuit board (PCB) and, An electronic die configured to process data electronically at a high rate, At least one optoelectronic subassembly (OSA) present on the host PCB, At least one channel dedicated to the transmission of high-rate data signals, At least one channel dedicated to the transmission of low-rate data signals, and At least one optical medium, and alignment means configured to align each activated region of a photoelectron die with at least one optical transmission medium. OSA equipped with, A reconfigurable system-on-a-chip (RSOC) located on the host PCB incorporates the electronic processing function of the low-rate data signals and is configured to control the electronic processing of both the high-rate data signals and the low-rate data signals, An optoelectronic module characterized by comprising the following features.

2. The optoelectronic module according to claim 1, wherein the OSA comprises a transmitter section (Tx) and a receiver section (Rx), and one of the transmitter section (Tx) and the receiver section (Rx) is configured to transmit a data signal at the high rate, and the other section is configured to receive a data signal at the low rate.

3. The optoelectronic module according to claim 1, comprising an optical fiber having an optical connector.

4. The optoelectronic module according to claim 1, wherein the OSA includes an optical fiber pigtail, one end of which is terminated by a ferrule housed and held in a support present on the host PCB.

5. The optoelectronic module according to claim 1, wherein the electronic die comprises a driver for monitoring one of the optoelectronic elements among the channels.

6. The photoelectronic module according to claim 5, wherein the photoelectronic element controlled by the driver is a vertical cavity surface-emitting laser (VCSEL).

7. The photoelectronic module according to claim 1, wherein one of the channels includes a photodiode as a photoelectronic element and an amplifier configured to amplify the output of the photodiode.

8. The optoelectronic module according to claim 1, wherein the low-speed rate is DC to 10 Mbps and the high-speed rate is 100 Mbps to 10 Gbps.

9. The optoelectronic module according to claim 1, wherein the RSOC includes a temperature compensation function.

10. The optoelectronic module according to claim 1, wherein the RSOC is configured to monitor the channel based on optical data received in one of the channels.

11. The optoelectronic module according to claim 1, wherein the RSOC can be remotely reconfigured by an optical path containing a special key data message when it is received in one of the channels.

12. The optoelectronic module according to claim 1, wherein the host PCB is part of a unique package that includes a cover protecting all components present on the host PCB.

13. The optoelectronic module according to claim 1, wherein a single optical fiber is used for two channels that transmit and receive the high-rate data signal and the low-rate data signal, thereby configuring the optoelectronic module as a bidirectional transceiver.

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