Substrate support device and method for manufacturing a substrate using the same

Abstract

To provide a substrate support device that can reduce drooping of a substrate in a substrate manufacturing process, and to provide a method for manufacturing a substrate using the same.SOLUTION: A substrate support device includes: a plurality of positioning tools 110 arranged in parallel with one another so as to be separated from one another on the basis of a first direction; and a plurality of support parts 120 connected to the positioning tools 110 and supporting a substrate. The support parts 120 are arranged so as to be separated from one another under a substrate and configured to support a substrate. The support parts 120 may be configured to move upward with the positioning tools 110.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] This specification relates to a substrate support device for supporting a substrate used in a display device and a substrate manufacturing method using the same.

Background Art

[0002] As the information society develops, the requirements for display devices for displaying images are increasing in various forms. As a result, in recent years, various display devices such as liquid crystal display devices (LCDs), plasma display devices (PDPs), organic light-emitting display devices (OLEDs), and quantum dot light-emitting display devices (QLEDs) have been utilized.

[0003] An organic light-emitting display device can be manufactured using a substrate equipped with OLEDs (Organic Light Emitting Diodes), and the substrate can be manufactured via an OLED evaporation device.

[0004] The OLED evaporation device is configured to evaporate organic substances from a source with a substrate inserted inside the chamber so that the evaporated organic substances are deposited on the substrate.

[0005] On the other hand, the substrate inserted inside the chamber is supported at its ends by a substrate holder inside the chamber, and a chucking plate arranged above the chamber descends to fix (or chuck) it to the chucking plate. After fixing (or chucking) the entire surface of the substrate to the chucking plate, organic substances are deposited on the side of the substrate opposite to the chucked side.

[0006] In recent years, as display devices have become larger, the size of circuit boards has also increased. As circuit boards become larger, the weight of the board itself causes the center of the board to sag downwards, leading to a problem where the circuit board cannot be fixed (or chucking) into the chucking plate. [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] This specification aims to provide a substrate support device and a substrate manufacturing method using the same that can minimize substrate sagging during the substrate manufacturing process.

[0008] This specification aims to provide a substrate support device and a substrate manufacturing method using the same, which can minimize substrate sagging during the substrate manufacturing process and reduce the defect rate of the substrate.

[0009] This specification aims to provide a substrate support device and a substrate manufacturing method using the same that can reduce production energy.

[0010] The problems that the examples in this specification aim to solve are not limited to those mentioned above, and other problems not mentioned can be clearly understood by a person with ordinary skill in the art to which the technical concept of this specification belongs from the following description. [Means for solving the problem]

[0011] Substrate support devices according to some examples herein include a plurality of position adjusters arranged parallel to each other and spaced apart from each other based on a first direction, and a plurality of support units connected to the plurality of position adjusters for supporting a substrate, wherein the plurality of support units are arranged spaced apart from each other below the substrate and configured to support the substrate, and the plurality of support units may be configured to be raised by the plurality of position adjusters.

[0012] A substrate manufacturing method according to some examples of this specification includes the steps of: positioning a plurality of support members in a standby position so as not to overlap with a substrate whose edges are supported by a substrate holder in a chamber; positioning the plurality of support members in a support position and lowering a chucking plate placed on the substrate; raising the plurality of support members to support the substrate and applying a voltage to the chucking plate to chucking the substrate to the chucking plate; lowering the plurality of support members to move them to a standby position; lowering the chucking plate to attach a mask having an opening to the substrate and evaporating an organic substance from a source to deposit it onto the substrate; raising the plurality of support members after moving them to a support position to support the substrate on which the organic substance has been deposited; turning off the voltage applied to the chucking plate; and lowering the plurality of support members to support the edges of the substrate on which the organic substance has been deposited in the substrate holder.

[0013] A substrate manufacturing method according to some examples of this specification includes the steps of: positioning a plurality of pin assemblies in a standby position so as not to overlap with a substrate whose edges are supported by a substrate holder in a chamber; rotating the plurality of pin assemblies to a support position and lowering a chucking plate located on the substrate; raising the plurality of pin assemblies to support the substrate and applying a voltage to the chucking plate to chucking the substrate to the chucking plate; lowering the plurality of pin assemblies and then rotating them to a standby position; lowering the chucking plate to attach a mask having an opening to the substrate and evaporating an organic substance from a source to deposit it onto the substrate; rotating the plurality of pin assemblies to a support position and then raising them to support the substrate on which the organic substance has been deposited; turning off the voltage applied to the chucking plate; and lowering the plurality of pin assemblies to support the edges of the substrate on which the organic substance has been deposited in the substrate holder.

[0014] Specific details, other than the solutions to the problems mentioned above, are included in the following descriptions and drawings. [Effects of the Invention]

[0015] According to some examples of this specification, a substrate support device and a substrate manufacturing method using the same can be provided, which include a support portion for supporting the central part of the substrate, thereby minimizing or reducing the sagging of the substrate.

[0016] As illustrated by some examples in this specification, a substrate support device and a substrate manufacturing method using the same can be provided, which can reduce the defect rate of a substrate by minimizing or reducing substrate sagging.

[0017] As illustrated by some examples in this specification, it is possible to provide a substrate support apparatus and a substrate manufacturing method using the same that can reduce production energy as the defect rate of the substrate decreases.

[0018] The effects described herein are not limited to those mentioned above, and any other effects not mentioned here will be clearly understood by a person with ordinary skill in the art to which this specification pertains from the following description. [Brief explanation of the drawing]

[0019] [Figure 1] This is a perspective view showing a substrate support device according to one embodiment of this specification. [Figure 2] This is a schematic plan view of Figure 1. [Figure 3] This is a schematic side view of Figure 1. [Figure 4] Figure 2 shows a cross-sectional view along the line I-I'. [Figure 5] This is a schematic enlarged view of section A in Figure 1. [Figure 6] Figure 5 is a schematic side view of the figure as seen from the X-axis direction. [Figure 7A] This is a schematic process diagram showing a substrate manufacturing process using a substrate support device according to one embodiment of this specification. [Figure 7B] This is a schematic process diagram showing a substrate manufacturing process using a substrate support device according to one embodiment of this specification. [Figure 8A]It is a schematic process diagram showing a substrate manufacturing process using a substrate support device according to an embodiment of the present specification. [Figure 8B] It is a schematic process diagram showing a substrate manufacturing process using a substrate support device according to an embodiment of the present specification. [Figure 9A] It is a schematic process diagram showing a substrate manufacturing process using a substrate support device according to an embodiment of the present specification. [Figure 9B] It is a schematic process diagram showing a substrate manufacturing process using a substrate support device according to an embodiment of the present specification. [Figure 10A] It is a schematic process diagram showing a substrate manufacturing process using a substrate support device according to an embodiment of the present specification. [Figure 10B] It is a schematic process diagram showing a substrate manufacturing process using a substrate support device according to an embodiment of the present specification. [Figure 11A] It is a schematic process diagram showing a substrate manufacturing process using a substrate support device according to an embodiment of the present specification. [Figure 11B] It is a schematic process diagram showing a substrate manufacturing process using a substrate support device according to an embodiment of the present specification. [Figure 12A] It is a schematic process diagram showing a substrate manufacturing process using a substrate support device according to an embodiment of the present specification. [Figure 12B] It is a schematic process diagram showing a substrate manufacturing process using a substrate support device according to an embodiment of the present specification. [Figure 13] It is a perspective view showing a substrate support device according to another embodiment of the present specification. [Figure 14] It is a schematic plan view of FIG. 13. [Figure 15] It is a schematic side view of FIG. 13. [Figure 16] It is a cross-sectional view of line II-II' shown in FIG. 15. [Figure 17] It is a schematic operation state diagram showing a substrate support device according to another embodiment of the present specification supporting a substrate. [Figure 18] It is a schematic operation state diagram showing a substrate support device according to another embodiment of the present specification supporting a substrate. [Modes for carrying out the invention]

[0020] The advantages and features of this specification, as well as the methods for achieving them, will become apparent by referring to the examples described below in detail with accompanying figures. However, this specification is not limited to the examples disclosed below, but can be embodied in a variety of different forms, and these examples are provided merely to complete the disclosure of this specification and to fully inform those who have ordinary skill in the art to which this specification belongs of the scope of the invention, and this specification is defined only by the claims.

[0021] The shapes, sizes, proportions, angles, numbers, etc., disclosed in the figures illustrating the embodiments herein are illustrative, and this specification is not limited to those shown in the figures. Throughout the specification, the same reference numeral may refer to the same component. In this specification, if a specific description of the relevant prior art is deemed to unnecessarily obscure the gist of this specification, such detailed description will be omitted.

[0022] Wherever "contains," "has," "consists of," etc., as used herein, other parts may be added unless "only" is used. This includes cases where a singular component includes multiple components unless otherwise explicitly stated.

[0023] In interpreting the constituent elements, even without further explicit mention, they shall be interpreted as including a margin of error.

[0024] When describing the positional relationship between two parts, for example, using phrases like "on top," "above," "below," or "next to," one or more other parts can be located between the two parts, unless the expressions "immediately" or "directly" are used.

[0025] When describing temporal relationships, for example, when a temporal sequence is described using phrases like "after," "following," "next," or "before," it can include non-continuous events unless expressions like "immediately" or "directly" are used.

[0026] The terms "first," "second," etc., are used to describe various components, but these components are not limited by these terms. These terms are simply used to distinguish one component from another. Therefore, the first component referred to below may also be the second component within the technical ideas of this specification.

[0027] The terms "X-axis direction," "Y-axis direction," and "Z-axis direction" should not be interpreted solely as geometric relationships where the relationship between them is perpendicular, but rather can mean that there are broader directions within the scope in which the configuration specified herein can function.

[0028] The term "at least one" must be understood to include all possible combinations of one or more related items. For example, "at least one of item 1, item 2, and item 3" can mean not just each of item 1, item 2, or item 3 individually, but all possible combinations of items that can be presented from two or more of item 1, item 2, and item 3.

[0029] Each feature of some of the embodiments described herein can be combined or combined with one another, either partially or as a whole, and various technical interdependencies and drives are possible. Each embodiment can be implemented independently of one another or together in a related manner.

[0030] In the following, preferred examples of display devices and multi-screen display devices including the same according to this specification will be described in detail with reference to the accompanying figures. When assigning reference numerals to the components in each figure, the same component may, as far as possible, have the same reference numeral even if it is shown in different figures. Furthermore, the scale of the components shown in the accompanying figures is different from the actual scale for the sake of explanation and is not limited to the scale shown in the figures.

[0031] Figure 1 is a perspective view showing a substrate support device according to one embodiment of this specification, Figure 2 is a schematic plan view of Figure 1, Figure 3 is a schematic side view of Figure 1, and Figure 4 is a cross-sectional view taken along the line I-I' shown in Figure 2.

[0032] Referring to Figures 1 to 4, a substrate support device 100 according to one embodiment of this specification may include a plurality of position adjustment units (or position adjusters) 110 arranged parallel to the first axial direction (X), and a plurality of support units (or supports) 120 connected to the plurality of position adjustment units 110 for supporting a substrate (S, shown in Figure 7A).

[0033] An example of a substrate support device 100 may include eight position adjustment units 110, as shown in Figure 1. The eight position adjustment units 110 can be arranged in groups of four along the first axis direction (X), and the four position adjustment units 110 can be arranged facing each other in the second axis direction (Y). Therefore, as shown in Figure 1, a space can be formed between the eight position adjustment units 110 into which a substrate (S) can be inserted. The multiple position adjustment units 110 in this example can raise or lower the multiple support units 120. That is, the multiple position adjustment units 110 in this example can raise and lower the multiple support units 120.

[0034] In one example, the multiple support parts 120 can be arranged below the substrate (S) so as to be spaced apart from each other in a support mode that supports the substrate (S). In this state, the multiple support parts 120 can be raised by the multiple position adjustment parts 110 to evenly support the lower surface (or the central portion of the substrate (S)) of the substrate (S).

[0035] Therefore, even if the substrate (S) has a large surface area, the substrate support device 100 according to one embodiment of this specification can evenly support the lower surface (or central portion) of the substrate (S) with multiple support parts 120, thereby minimizing, preventing, or at least reducing the downward sagging of the central portion of the substrate (S) due to the load of the substrate (S) itself. Here, the central portion of the substrate (S) can mean the area excluding the edges of the substrate (S).

[0036] On the other hand, the multiple support units 120 can be lowered by the multiple position adjustment units 110 in a standby mode before supporting the substrate (S) (or a standby mode without supporting the substrate), and positioned so as not to overlap the substrate (S).

[0037] A substrate support device 100 according to one embodiment of this specification may further include a pair of guide portions (or a pair of guides) 130.

[0038] A pair of guide sections 130 in one example is for guiding the movement of the plurality of support sections 120. The pair of guide sections 130 can be connected to each of the plurality of position adjustment sections 110 and the plurality of support sections 120. As shown in Figure 1, the pair of guide sections 130 can be arranged to be elongated in the first axis direction (X) and spaced apart from each other in the second axis direction (Y). Therefore, the plurality of support sections 120 can move in the first axis direction (X) along the pair of guide sections 130. The plurality of support sections 120 can move in the first axis direction (X) by receiving driving force from the plurality of rotational drive sections.

[0039] As shown in Figure 2, the pair of guide sections 130 may include a plurality of standby positions (SBPs) where the plurality of support sections 120 are located before (or when the substrate is not supported) and a support position (SUP) where the plurality of support sections 120 support the substrate. For example, a support position (SUP) may be located between the plurality of standby positions (SBPs). For example, the plurality of standby positions (SBPs) may include a first standby position (SBP1) located at one side end (or first end) of each of the pair of guide sections 130, and a second standby position (SBP2) located at the other side end (or second end) of each of the pair of guide sections 130. The support position (SUP) may be located between the first standby position (SBP1) and the second standby position (SBP2).

[0040] Therefore, the first axial direction (X) may be a direction that includes a support position (SUP) in which the plurality of support parts 120 support the substrate, and a standby position (SBP) in which the substrate is not supported. However, it is not limited to this, and the second axial direction (Y) may be a direction that includes the support position (SUP) and the standby position (SBP).

[0041] As shown in Figures 1 and 2, a plurality of support parts 120 according to one example can be arranged in a second axis direction (Y) that intersects with the first axis direction (X). One side of each of the plurality of support parts 120 can be movably connected to one of a pair of guide parts 130, and the other side of each of the plurality of support parts 120 can be movably connected to the other guide part of the pair of guide parts 130.

[0042] Therefore, the multiple position adjustment units 110 can raise and lower the multiple support units 120 connected to the pair of guide units 130 by raising and lowering the pair of guide units 130. As shown in Figures 1 and 2, the multiple position adjustment units 110 according to one example can be arranged spaced apart from each other along the pair of guide units 130.

[0043] A substrate support device 100 according to one embodiment of this specification may further include a plurality of rotary drive units (or rotary drivers) 140.

[0044] In one example, a plurality of rotary drive units 140 can be arranged on each of the pair of guide units 130 and provide a driving force for moving a plurality of support units 120 in the first axial direction (X). For example, as shown in Figure 2, each of the plurality of rotary drive units 140 may include a ball screw 141 arranged on each of the pair of guide units 130 and a rotary motor 142 coupled to one side of the ball screw 141 to rotate the ball screw 141. In one example, the rotary motor 142 can move a plurality of support units 120 connected to the ball screw 141 from a standby position (SBP) to a support position (SUP) by rotating the ball screw 141 clockwise. In another example, the rotary motor 142 can move a plurality of support units 120 connected to the ball screw 141 from a support position (SUP) to a standby position (SBP) by rotating the ball screw 141 counterclockwise. In another example, the rotary motor 142 can move a plurality of support parts 120 connected to the ball screw 141 from a support position (SUP) to a standby position (SBP) by rotating the ball screw 141 clockwise, and can move a plurality of support parts 120 connected to the ball screw 141 from a standby position (SBP) to a support position (SUP) by rotating the ball screw 141 counterclockwise.

[0045] On the other hand, the rotational speed of the ball screw 141 can be determined by the driving force provided by the rotary motor 142, and the travel distance of each of the multiple support parts 120 can be changed by the rotational speed of the ball screw. For example, the higher the rotational speed of the ball screw 141, the longer the travel distance of each of the multiple support parts 120 may become. Therefore, as shown in Figure 2, the positions of each of the multiple support parts 120 within the support position (SUP) may differ from one another. As a result, each of the multiple support parts 120 can be moved by each of the multiple rotary drive units 140 and arranged to move away from one another.

[0046] Therefore, as shown in Figure 2, the substrate support device 100 according to one embodiment of this specification has multiple support parts 120 arranged to be spaced apart from each other within the support position (SUP), so that the lower surface of the substrate (S) can be uniformly supported, thereby minimizing, preventing, or at least reducing sagging of the substrate (or large-area substrate).

[0047] Minimizing, preventing, or reducing the sagging of the substrate (or large-area substrate) allows for a reduction in the separation distance between the substrate (or large-area substrate) and the chucking plate (CHP). This enables the entire surface of the large-area substrate to be fixed (or chucking) to the chucking plate by the electrostatic charge of the chucking plate. As a result, in subsequent processes, organic material evaporated by the source can be uniformly deposited onto the substrate (or large-area substrate) which is fixed flat to the chucking plate, thereby reducing the substrate defect rate. Furthermore, the reduction in the substrate defect rate can reduce overall production energy.

[0048] In the following, with reference to Figures 2 and 3, the plurality of position adjustment units 110, plurality of support units 120, pair of guide units 130, and plurality of rotational drive units 140 of the substrate support device 100 according to one embodiment of this specification will be specifically described.

[0049] Each of the multiple position adjustment units 110 in one example may include a lifting shaft 111, a bellows 112, and a cylinder pump 113. A pair of guide units 130 in one example may include a first guide unit 131 and a second guide unit 132 arranged parallel to each other along the first axial direction (X), as shown in Figure 2.

[0050] The lifting shaft 111 can be connected to each of the pair of guide sections 130. In one example, the lifting shaft 111 may be in the form of a circular pipe, and one end can be connected to each of the pair of guide sections 130 via a fastening member such as a bolt. Therefore, the lifting shaft 111 can be raised and lowered in the third axial direction (Z) by the cylinder pump 113, thereby raising and lowering the pair of guide sections 130.

[0051] On the other hand, the lifting shafts 111 of each of the multiple position adjustment sections 110 can be coupled to the outside of the first guide section 131 and the outside of the second guide section 132 so as to be spaced apart from each other, as shown in Figure 2. For example, four lifting shafts 111 can be coupled to the outside (or outer surface) of the first guide section 131 so as to be spaced apart from each other. And four lifting shafts 111 can be coupled to the outside (or outer surface) of the second guide section 132 so as to be spaced apart from each other. The outside of the first guide section 131 can mean the outer surface opposite to the inside of the first guide section 131 where the multiple support sections 120 are arranged. The outside of the second guide section 132 can mean the outer surface opposite to the inside of the second guide section 132 where the multiple support sections 120 are arranged. Therefore, the lifting shafts 111 of each of the multiple position adjustment units 110 are arranged outside the pair of guide units 130, as shown in Figure 2, so as not to interfere with the multiple support units 120 that move in the first axial direction (X). At least a portion of the lifting shafts 111 of each of the multiple position adjustment units 110 can be placed inside a vacuum chamber (CB, shown in Figure 7A). In addition, the multiple support units 120, the pair of guide units 130, and the multiple rotary drive units 140 can be placed inside the chamber (CB).

[0052] The bellows 112 can be coupled to the lifting shaft 111 so as to partially enclose it. The bellows 112 is for maintaining a pressure difference between the vacuum chamber (CB, shown in Figure 7A) and the atmospheric pressure outside the chamber. In one example, the bellows 112 can be located outside the chamber (CB). For example, the bellows 112 can be located on a base plate (BP) coupled to the upper side of the chamber (CB). As described above, since the lifting shaft 111 is raised and lowered by the cylinder pump 113, if the portion of the chamber (CB) to which the lifting shaft 111 is movably connected is in communication with the outside, the inside of the chamber (CB) cannot be maintained in a vacuum state. Therefore, the bellows 112 can be provided so as to seal the portion where the base plate (BP) and the lifting shaft 111 are connected. For example, the bellows 112 can be provided in the form of a wrinkled circular accordion.

[0053] The cylinder pump 113 is positioned on the bellows 112 and can raise and lower (or move up and down) the lifting shaft 111. In one example, the cylinder pump 113 can be coupled to a cylinder housing in the shape of a "┓" and can provide a driving force that can raise and lower the lifting shaft 111. For example, the driving force provided by the cylinder pump 113 can rotate a ball screw connected to the cylinder pump, thereby raising and lowering a cylinder rod connected to the ball screw. As the cylinder rod is raised and lowered, the lifting shaft 111 connected to the cylinder rod can be raised and lowered.

[0054] Therefore, in the substrate support device 100 according to an example of this specification, each of the multiple position adjustment units 110 can raise and lower a pair of guide units 130 in the third axis direction (Z).

[0055] Referring again to Figures 1 to 4, each of the multiple support sections 120 can include a support frame 121 and a support member 122.

[0056] The support frame 121 can be movably coupled to each of the pair of guide portions 130. An example of the support frame 121 may include a first support frame 121a positioned at one end (or first end) of the pair of guide portions 130, a second support frame 121b positioned closer to the other end (or second end) of the pair of guide portions 130 than the first support frame 121a, a third support frame 121c positioned closer to the other end of the pair of guide portions 130 than the second support frame 121b, and a fourth support frame 121d positioned closer to the other end of the pair of guide portions 130 than the third support frame 121c. One end of the pair of guide portions 130 may mean the lower end portion in the first axial direction (X) with reference to Figure 2. The other end of the pair of guide portions 130 may mean the upper end portion in the first axial direction (X) with reference to Figure 2.

[0057] As shown by the dotted line in Figure 2, the first support frame 121a, the second support frame 121b, the third support frame 121c, and the fourth support frame 121d can be arranged at a support position (SUP) spaced apart from each other when in support mode for supporting a substrate (S). As a result, the substrate support device 100 according to one embodiment of this specification can uniformly support the entire lower surface (or central portion of the substrate) of the substrate (S) with the first to fourth support frames 121a, 121b, 121c, and 121d, even if the substrate (S) has a large area, so that the entire surface of the substrate (or large area substrate) can be attached to or fixed to the chucking plate (CHP). Therefore, the substrate support device 100 according to one embodiment of this specification can fix the entire surface of the substrate (or large area substrate) flat to the chucking plate (CHP), so that organic material can be uniformly deposited onto the substrate (or large area substrate) in subsequent processes, and the quality of the manufactured substrate (or large area substrate) can be improved.

[0058] On the other hand, the first support frame 121a, the second support frame 121b, the third support frame 121c, and the fourth support frame 121d can be arranged adjacent to each other in the standby position (SBP) when the substrate (S) is not being supported. For example, the first support frame 121a and the second support frame 121b can be positioned in the first standby position (SBP1) before the substrate (S) is supported (or when the substrate is not being supported), and the third support frame 121c and the fourth support frame 121d can be positioned in the second standby position (SBP2) before the substrate (S) is supported (or when the substrate is not being supported). Therefore, in the substrate support apparatus 100 according to one embodiment of this specification, the first to fourth support frames 121a, 121b, 121c, and 121d do not interfere with each other during the process of depositing an organic substance onto the substrate (S), so the defect rate of the substrate (S) can be reduced, prevented, or reduced.

[0059] Each of the first to fourth support frames 121a, 121b, 121c, and 121d can be moved to a standby position (SBP) and a support position (SUP) by the driving force provided by a plurality of rotary drive units 140. For example, the rotary drive unit 140 may include a ball screw 141 and a rotary motor 142.

[0060] On the other hand, the first to fourth support frames 121a, 121b, 121c, and 121d are movably connected to a pair of guide sections 130, so that when the pair of guide sections 130 are raised and lowered by the multiple position adjustment sections 110, they can be raised and lowered together with the pair of guide sections 130.

[0061] The support member 122 can be connected to the support frame 121. In one example, the support member 122 can be connected to the upper side of the support frame 121. For example, as shown in Figure 4, the support member 122 can be connected to the upper surface of the support frame 121 in the third axial direction (Z) with fasteners such as bolts.

[0062] In one example, the support member 122 can be positioned along the longitudinal direction of the support frame 121. For example, as shown in Figure 2, the support member 122 can be coupled to the upper surface of the support frame 121 along the support frame 121 positioned in the second axial direction (Y). The support member 122 can be shorter than the support frame 121. For example, the support member 122 can be shorter than the first length (L1) of the support frame 121 (L2). If the length of the support member 122 is longer than the length of the support frame 121, the support member 122 may come into contact with the pair of guide portions 130, thereby restricting the movement of the support frame 121. Therefore, in one embodiment of the substrate support device 100 according to this specification, since the support member 122 is shorter than the support frame 121, the support member 122 can not interfere with the movement of the support frame 121 moving along the first axial direction (X). In support mode, the support member 122 can directly support the lower surface of the substrate (S) at the support position (SUP). Since the support member 122 is arranged in each of the multiple support frames 121, multiple support members 122 can be provided. More specifically, each of the multiple support members 122 can be arranged in each of the first support frame 121a, the second support frame 121b, the third support frame 121c, and the fourth support frame 121d. Therefore, in support mode, each of the multiple support members 122 can be arranged to be spaced apart from each other at the support position (SUP), so that the entire lower surface of the substrate (S) can be supported evenly.

[0063] An example of a support member 122 may include a housing 122a, a stopper 122b, a guide shaft 122c, an elastic member 122d, and a support bar 122e.

[0064] The housing 122a is located at the lowest part of the support member 122 and can be connected to the support frame 121 via a fastening member. The housing 122a can support the stopper 122b, which is connected to the support frame 121 and connected to the upper side, and the support bar 122e.

[0065] The stopper 122b can be connected to the upper side of the housing 122a via fastening members such as bolts and adhesives. One example of a stopper 122b is configured to prevent the guide shaft 122c, elastic member 122d, and support bar 122e, which are located inside, from detaching to the outside of the stopper 122b. The stopper 122b may include a through hole 122ba. The through hole 122ba may be a hole formed through the central portion of the stopper 122b. By inserting the support bar 122e into the through hole 122ba, the support bar 122e can be made to partially protrude to the outside of the stopper 122b. Such a through hole 122ba may be smaller than one side of the support bar 122e that is connected to the guide shaft 122c. Therefore, the stopper 122b can prevent the support bar 122e inserted into the through hole 122ba from completely detaching to the outside.

[0066] The guide shaft 122c can be movably coupled to the stopper 122b and the housing 122a. For example, the stopper 122b and the housing 122a may each be provided with a cylindrical hole that allows the guide shaft 122c to move in the third axis direction (Z), and the guide shaft 122c can be inserted into the cylindrical hole and moved up and down. A support bar 122e can be coupled to one side of the guide shaft 122c, and when a substrate (S) is supported by the support bar 122e, the load of the substrate (S) allows the guide shaft 122c to move downward. That is, the guide shaft 122c can move downward as the support bar 122e supports the substrate (S) in support mode. When the substrate (S) is not supported by the support bar 122e, the guide shaft 122c can move upward. That is, the guide shaft 122c can move downward as the support bar 122e does not support the substrate (S) in standby mode. One side of the guide shaft 122c to which the support bar 122e is connected can be made thicker than the main body. Specifically, one side of the guide shaft 122c can be made larger than the size of the through hole 122ba. This prevents the guide shaft 122c from being blocked by the stopper 122b and from detaching from the outside of the stopper 122b.

[0067] The elastic member 122d can enclose the guide shaft 122c and be supported by one side of the guide shaft 122c and the housing 122a. In one example, the elastic member 122d can enclose the main body of the guide shaft 122c and be supported by one side of the guide shaft 122c and the housing 122a. Therefore, when the support bar 122e supports the substrate (S), the load of the substrate (S) can move the guide shaft 122c downward, thereby contracting the elastic member 122d. Conversely, when the support bar 122e does not support the substrate (S), the elastic member 122d can extend due to the elastic restoring force, thereby moving the guide shaft 122c upward.

[0068] The support bar 122e can be coupled to one side of the guide shaft 122c so as to face the elastic member 122d. In one example, as shown in Figure 4, the support bar 122e increases in size from top to bottom, and the size of the lower portion coupled to one side of the guide shaft 122c can be larger than the size of one side of the guide shaft 122c. Therefore, only the lower portion of the support bar 122e can be placed inside the stopper 122b, and the remaining portion of the support bar 122e, excluding the lower portion, can be made to protrude to the outside through the through hole 122ba. Since the lower portion of the support bar 122e is larger than the size of one side of the guide shaft 122c (or the size of the through hole 122ba), even if the support bar 122e moves upward due to the extension of the elastic member 122d, the support bar 122e can not detach from the stopper 122b.

[0069] On the other hand, as shown in Figure 4, the support bar 122e is supported by the elastic member 122d, so it can move downward when supporting the substrate (S). Therefore, in the substrate support device 100 according to one embodiment of this specification, the impact generated when the support member 122 supports the substrate (S) can be absorbed by the elastic member 122d. Therefore, the substrate support device 100 according to one embodiment of this specification can minimize, prevent or reduce damage such as scratches to the substrate (S) compared to a device without an elastic member that cannot absorb impact.

[0070] The plurality of rotational drive units 140 may include a ball screw 141 and a rotary motor 142 that provides rotational driving force to the ball screw 141.

[0071] Referring to Figure 3, the ball screw 141 is one of a pair of guide sections 130. For example, it may include a first ball screw 141a, a second ball screw 141b, a third ball screw 141c, and a fourth ball screw 141d, which are spaced apart from each other on the first guide section 131. The first ball screw 141a is positioned above the second ball screw 141b and can be aligned with the third ball screw 141c in the first axial direction (X). The second ball screw 141b is positioned diagonally from the third ball screw 141c and can be aligned with the fourth ball screw 141d in the first axial direction (X).

[0072] The rotary motor 142 may include a first rotary motor 142a coupled to the first ball screw 141a to provide rotational driving force, a second rotary motor 142b coupled to the second ball screw 141b to provide rotational driving force, a third rotary motor 142c coupled to the third ball screw 141c to provide rotational driving force, and a fourth rotary motor 142d coupled to the fourth ball screw 141d to provide rotational driving force. As shown in Figure 3, the first rotary motor 142a and the second rotary motor 142b are arranged vertically on one side of the guide portion 130 and can provide driving force to the first ball screw 141a and the second ball screw 141b, respectively. The third rotary motor 142c and the fourth rotary motor 142d are arranged vertically on the other side of the guide portion 130 and can provide driving force to the third ball screw 141c and the fourth ball screw 141d, respectively. Therefore, the first ball screw 141a, the second ball screw 141b, the third ball screw 141c, and the fourth ball screw 141d can each be driven independently, and as a result, the first support frame 121a connected to the first ball screw 141a, the second support frame 121b connected to the second ball screw 141b, the third support frame 121c connected to the third ball screw 141c, and the fourth support frame 121d connected to the fourth ball screw 141d can also move independently at different distances from each other, as shown in Figure 2.

[0073] The above describes the multiple rotary drive units 140 arranged in the first guide unit 131. However, since the second guide unit 132 has the same structure as the first guide unit 131, the description of the second guide unit 132 will be replaced by the description of the first guide unit 131.

[0074] Figure 5 is a schematic enlarged view of part A of Figure 1, and Figure 6 is a schematic side view of Figure 5 as seen from the X-axis direction.

[0075] Referring to Figures 5 and 6, each of the pair of guide sections 130 may include a guide housing, an LM guide, and an LM block. For example, the first guide section 131 may include a guide housing 131a, an LM guide 131b, and an LM block 131c.

[0076] The guide housing 131a may be configured to prevent or reduce the scattering of foreign matter such as dust generated by friction between the support frame 121, which moves by the threads of the ball screw 141, and the ball screw 141 when the plurality of rotary drive units 140 arranged inside the first guide unit 131 are driven, and the ball screw 141, and the foreign matter to scatter to the substrate (S). In one example, the guide housing 131a may be provided in the form of a hollow rod. By arranging the plurality of rotary drive units 140 inside the guide housing 131a, the guide housing 131a can block or reduce the scattering of foreign matter generated by friction onto the substrate (S).

[0077] The LM guide 131b can be coupled to the guide housing 131a. Specifically, the LM guide 131b can be coupled to the upper surface of a connecting member (CP) to which the guide housing 131a is coupled. As shown in Figure 6, a lifting shaft 111 can be coupled to the upper surface of the connecting member (CP) at a position spaced apart from the LM guide 131b. Such a lifting shaft 111 can be coupled to the upper surface of the connecting member (CP) by a fastening member (FM). The LM guide 131b can be positioned below the ball screw 141 of the rotary drive unit 140, along the longitudinal direction of the ball screw 141. Alternatively, the LM guide 131b can be positioned inside the guide housing 131a, along the direction in which the guide housing 131a is positioned. For example, the LM guide 131b can be positioned in the form of a long rail along the first axial direction (X).

[0078] The LM block 131c can be movably coupled to the LM guide 131b and the ball screw 141. As shown in Figure 6, the LM block 131c can be positioned on the upper surface of the LM guide 131b and can be provided to partially cover both sides of the LM guide 131b. Although not shown in the figure, the LM block 131c can include an LM hole to which the ball screw 141 can be coupled. Thus, the LM block 131c can move along the LM guide 131b by the rotation of the ball screw 141. For example, the LM block 131c can move along the first axial direction (X) to a support position (SUP) and a standby position (SBP) depending on the direction in which the ball screw 141 is rotated by the rotary motor 142.

[0079] On the other hand, each of the pair of guide portions 130 may further include a guide hole 131d into which one or the other side of the support frame 121 is inserted. The guide hole 131d guides the movement of the support frame 121 and is a hole for connecting the support frame 121 to the LM block 131c. In one example, the guide hole 131d can be formed through the side of the guide housing 131a, as shown in Figure 5. For example, the guide hole 131d can be formed on the other side 131ab of the guide housing 131a opposite to the side 131aa of the guide housing 131a where the support member 122 is located. That is, the guide hole 131d can be formed facing outward in the direction in which the plurality of position adjustment portions 110 are arranged. Therefore, the substrate support device 100 according to one embodiment of this specification can maximize, or at least increase, the prevention of contamination of the substrate (S) by preventing foreign matter such as dust generated when the support member 122 moves from scattering to the outside of the guide portion 130.

[0080] Referring to Figure 6, each of the multiple support sections 120 may further include a detachment prevention member 123 that connects to one or the other side of a support frame 121 inserted into a guide hole 131d. In one example, the detachment prevention member 123 can be located inside the guide housing 131a. As shown in Figure 6, the detachment prevention member 123 can be connected to both the support frame 121 and the LM block 131c. Therefore, the movement of the LM block 131c can move both the detachment prevention member 123 and the support frame 121.

[0081] Referring again to Figure 6, the width (W1) of the detachment prevention member 123 can be made larger than the width (W2) of the guide hole 131d. Therefore, even if the support frame 121 moves in the second axial direction (Y), the detachment prevention member 123 can restrict the movement in the second axial direction (Y). As a result, the support member 122 coupled to the support frame 121 can also be restricted from moving in the second axial direction (Y), thereby minimizing, preventing, or at least reducing damage such as scratches to the substrate (S). Consequently, by using the substrate support device 100 according to one embodiment of this specification during the manufacturing of the substrate (S), sagging of the substrate (S) can be prevented or at least reduced, and damage to the substrate (S) can be prevented, thereby improving the quality of the completed substrate (S).

[0082] The following will specifically describe the substrate manufacturing process according to one embodiment of this specification with reference to Figures 7A to 12B. The substrate manufacturing process according to one embodiment of this specification can be carried out using the substrate support apparatus 100 according to one embodiment of this specification.

[0083] Figures 7A to 12B are schematic process diagrams showing a substrate manufacturing process using a substrate support apparatus according to one embodiment of this specification.

[0084] Figures 7A and 7B show the process of inserting the substrate (S) into the chamber (CB), supporting the edges of the substrate (S) with multiple substrate holders (SH), and then positioning the multiple support parts 120 in a standby position (SBP) so as not to overlap with the substrate (S). Figure 7A is a schematic side view seen from the first axis direction (X), and Figure 7B is a schematic plan view seen from the third axis direction (Z).

[0085] As shown in Figure 7A, the chamber (CB) can contain multiple substrate holders (SH), a chucking plate (CHP), multiple support parts 120, a mask (MSK) with an opening (OA), a mask stage (MS), a source (SC), and a source fixing part (SCF). The upper surface of the base plate (BP) coupled to the upper side of the chamber (CB) can contain multiple position adjustment parts 110 (or bellows 112 and cylinder pump 113) connected to the multiple support parts 120. The upper surface of the base plate (BP) can also contain a first position control unit (PC1) connected to the substrate holder (SH) and a second position control unit (PC2) connected to the chucking plate (CHP). The first position control unit (PC1) is for adjusting the position of the substrate holder (SH). For example, the first position control unit (PC1) can raise and lower the substrate holder (SH) in the third axis direction (Z). The second position control unit (PC2) is for adjusting the position of the chucking plate (CHP). For example, the second position control unit (PC2) can raise and lower the chucking plate (CHP) in the third axis direction (Z).

[0086] The mask stage (MS) is for supporting the edge of the mask (MSK) and can be positioned between the source (SC) and the support section 120 (or support frame 121).

[0087] The source (SC) is for evaporating organic matter and can be positioned beneath the mask (MSK) so as to overlap the substrate (S) and the mask (MSK). The source fixing section (SCF) can fix the source (SC) inside the chamber (CB) by coupling it to both sides of the source (SC) and the bottom surface of the chamber (CB).

[0088] As shown in Figure 7A, a substrate (S) is inserted into the chamber (CB) using a transfer means such as a robot (not shown), and the edges of the substrate (S) are supported by a plurality of substrate holders (SH) arranged inside the chamber (CB). As described above, the larger the surface area of ​​the substrate (S), the more likely the central part of the substrate (S) is to sag downward due to its own weight. Therefore, as shown in Figure 7A, the substrate (S) can be arranged in a concave shape with its edges supported by the substrate holders (SH).

[0089] Referring to Figure 7B, the multiple support parts 120 are positioned in the standby position (SBP) in the same state as in Figure 7A, so as not to overlap with the substrate (S) in the third axial direction (Z). This can be achieved by multiple rotary drive units 140 moving the multiple support parts 120 to the standby position (SBP) along a pair of guide parts 130. As a result, the first support frame 121a and the second support frame 121b can be positioned in the first standby position (SBP1), and the third support frame 121c and the fourth support frame 121d can be positioned in the second standby position (SBP2). Therefore, the substrate (S) inserted into the chamber (CB) can be stably attached to the substrate holder (SH) without interfering with the first to fourth support frames 121a, 121b, 121c, and 121d. As shown in Figure 7B, the substrate (S) can be positioned within the support position (SUP).

[0090] On the other hand, the chucking plate (CHP) is provided in a size larger than the substrate (S) and can be positioned above the substrate (S). This is because the chucking plate (CHP) holds the substrate (S) flat by electrostatic discharge while the organic material is deposited. As described above, the larger the surface area of ​​the substrate (S), the greater the sagging of the substrate (S), which may prevent the substrate (S) from being fixed or attached to the chucking plate (CHP). In this case, the organic material deposition process may not be able to proceed, or even if the organic material deposition process proceeds, the defect rate of the completed substrate may increase. However, the substrate support device 100 according to one embodiment of this specification can support the central portion of the substrate (S) before it is fixed or attached to the chucking plate (CHP), thereby allowing the entire surface of the substrate (S) to be fixed or attached to the chucking plate (CHP). Therefore, the substrate support device 100 according to one embodiment of this specification can reduce the defect rate of the completed substrate (S), and consequently reduce production energy.

[0091] Figures 8A and 8B illustrate the process of lowering a chucking plate (CHP) located on a substrate (S) by positioning multiple support parts 120 in support positions (SUP) below the substrate (S). Figure 8A is a schematic side view seen from the first axis direction (X), and Figure 8B is a schematic plan view seen from the third axis direction (Z).

[0092] As shown in Figure 8A, the chucking plate (CHP) can be lowered toward the substrate (S) by a plurality of second position control units (PC2). In this case, the chucking plate (CHP) can be positioned as close as possible to the edge of the substrate (S) so as to prevent or at least reduce damage to the concave edge of the substrate (S). As shown in Figure 8A, since only the edge of the substrate (S) is supported by the substrate holder (SH), the central portion of the substrate (S) can sag downward due to its own weight. Therefore, the first distance between the edge of the substrate (S) and the chucking plate (CHP) and the second distance between the central portion of the substrate (S) and the chucking plate (CHP) may differ from each other. For example, the second distance may be greater than the first distance. Therefore, when the same voltage (or electrostatic charge) is applied to the entire chucking plate (CHP), the edge of the substrate (S) may adhere stably to the chucking plate (CHP), while the central portion of the substrate (S) may not adhere to the chucking plate (CHP). In one embodiment of this specification, the substrate support device 100 has multiple support parts 120 that support the sagging portion (or central portion) of the substrate (S) before a voltage (or electrostatic discharge) is applied to the chucking plate (CHP), thereby positioning the substrate (S) close to the chucking plate (CHP). This allows the entire surface of the substrate (S) to be evenly attached to or fixed to the chucking plate (CHP) in subsequent processes.

[0093] Referring to Figure 8B, in the same state as in Figure 8A, the multiple support parts 120 are positioned in the support position (SUP) such that they are spaced apart from each other under the substrate (S). This process can be accomplished by having multiple rotary drive units 140 position the multiple support parts 120 at different positions within the support position (SUP) along a pair of guide parts 130. As a result, the first support frame 121a, the second support frame 121b, the third support frame 121c, and the fourth support frame 121d can be arranged to be spaced apart from each other in the support position (SUP). In this case, the first support frame 121a, the second support frame 121b, the third support frame 121c, and the fourth support frame 121d can be arranged at equal intervals (D) from each other within the support position (SUP). However, it is not necessarily limited to this. On the other hand, in the above-described case, each of the first support frame 121a, second support frame 121b, third support frame 121c, and fourth support frame 121d can be positioned between multiple substrate holders (SH). This ensures that even if the first to fourth support frames 121a, 121b, 121c, and 121d are raised in the third axis direction (Z) by the multiple position adjustment units 110, they will not interfere with the substrate holders (SH).

[0094] Figures 9A and 9B illustrate the process of raising multiple support parts 120 to support the substrate (S), applying a voltage to the chucking plate (CHP), and chucking (or fixing) the substrate (S) to the chucking plate (CHP). Figure 9A is a schematic side view seen from the first axis direction (X), and Figure 9B is a schematic plan view seen from the third axis direction (Z).

[0095] As shown in Figure 9A, the multiple support parts 120 can be raised toward the chucking plate (CHP) by the multiple position adjustment parts 110. This allows the support member 122 of each of the multiple support parts 120 to come into contact with the lower surface (or central portion of the substrate (S)) of the substrate (S), and further, as they rise upward, the lower surface (or central portion of the substrate (S)) can be moved upward. Therefore, the first distance between the edge of the substrate (S) and the chucking plate (CHP) may be similar to or the same as the second distance between the central portion of the substrate (S) and the chucking plate (CHP). In this state, when a voltage (or electrostatic charge) is applied to the chucking plate (CHP), the central portion and edge of the substrate (S) can be chucking (or fixed) to the chucking plate (CHP).

[0096] Figure 9B is a plan view showing how multiple position adjustment units 110 raise multiple support units 120 toward the chucking plate (CHP) to chucking (or fix) them to the chucking plate (CHP). Therefore, the planar features may be the same as those of Figure 8B. Accordingly, the explanation for this can be replaced by the explanation for Figure 8B.

[0097] Figures 10A and 10B illustrate the process of lowering multiple support units 120 and moving them to the standby position (SBP). Figure 10A is a schematic side view from the first axis direction (X), and Figure 10B is a schematic plan view from the third axis direction (Z).

[0098] As shown in Figure 10A, the multiple position adjustment units 110 can lower the multiple support units 120 in the direction toward the mask (MSK). In this case, the substrate (S) may be fixed to the chucking plate (CHP) by electrostatics. Therefore, as shown in Figure 10A, the substrate (S) can be positioned flat. On the other hand, the multiple support units 120 can be positioned between the substrate holder (SH) and the mask (MSK) in the third axis direction (Z).

[0099] Referring to Figure 10B, in a state similar to Figure 10A, the multiple support parts 120 are moved along the pair of guide parts 130 to the standby position (SBP). This can be done by having multiple rotary drive parts 140 provide driving force to move the multiple support parts 120 from the support position (SUP) to the standby position (SBP) along the pair of guide parts 130. As a result, the first support frame 121a and the second support frame 121b can be moved from the support position (SUP) to the first standby position (SBP1), and the third support frame 121c and the fourth support frame 121d can be moved from the support position (SUP) to the second standby position (SBP2). In this case, each of the first support frame 121a, the second support frame 121b, the third support frame 121c, and the fourth support frame 121d can not overlap with the substrate (S) and / or the multiple substrate holders (SH). As a result, the first to fourth support frames 121a, 121b, 121c, and 121d can avoid interference between the source (SC) and the substrate (S) in the subsequent organic material deposition process. Therefore, the organic material can be uniformly deposited over the entire surface of the substrate (S), thereby improving the quality of the substrate (S) after the manufacturing process is complete.

[0100] Although not shown in the diagram, in a later step, the second position control unit (PC2) lowers the chucking plate (CHP) to attach a mask (MSK) with an opening (OA) to the underside of the substrate (S). Then, the source (SC) evaporates the organic material and deposits it onto the substrate (S) exposed to the opening (OA). In this way, the organic material can be deposited onto the underside of the substrate (S) depending on the shape of the opening (OA) of the mask (MSK).

[0101] Figures 11A and 11B show the process of moving multiple support parts 120 to support positions (SUP) and then raising them to support a substrate (S) on which organic material has been deposited. Figure 11A is a schematic side view seen from the first axis direction (X), and Figure 11B is a schematic plan view seen from the third axis direction (Z).

[0102] Referring to Figure 11B, the multiple support sections 120 can move along a pair of guide sections 130 from a standby position (SBP) to a support position (SUP) by the driving force provided by the multiple rotary drive sections 140. In this case, the multiple support sections 120 can be positioned spaced apart from each other below the substrate (S). For example, the first support frame 121a, the second support frame 121b, the third support frame 121c, and the fourth support frame 121d can be positioned at the same distance from each other in the support position (SUP). However, it is not limited to this. In this case, each of the first support frame 121a, the second support frame 121b, the third support frame 121c, and the fourth support frame 121d can be positioned between multiple substrate holders (SH). This allows the first to fourth support frames 121a, 121b, 121c, and 121d to avoid interfering with the substrate holders (SH) even when raised in the third axis direction (Z) by the multiple position adjustment sections 110.

[0103] Referring to Figure 11A, in the same state as in Figure 11B, the multiple position adjustment units 110 raise the multiple support units 120 toward the chucking plate (CHP). As a result, the support members 122 of each of the multiple support units 120 can contact the lower surface (or central portion of the substrate (S)) and support the lower surface (or central portion of the substrate (S)). Subsequently, when the voltage (or static electricity) applied to the chucking plate (CHP) is turned off, the substrate (S) on which the organic material has been deposited can be supported only by the support members 122.

[0104] Figures 12A and 12B illustrate the process of lowering multiple support parts 120 to support the edge of the substrate (S) on which organic material has been deposited in the substrate holder (SH). Figure 12A is a schematic side view seen from the first axis direction (X), and Figure 12B is a schematic plan view seen from the third axis direction (Z).

[0105] As shown in Figure 12A, the multiple support parts 120 can be lowered toward the mask (MSK) by the multiple position adjustment parts 110. In this case, the multiple support parts 120 can be lowered below the multiple substrate holders (SH). This allows the end of the substrate (S) supported by the support member 122 to be supported by the substrate holder (SH), and the substrate (S) to be separated from the support member 122. Therefore, as shown in Figure 12A, the substrate (S) can have its ends supported by the multiple substrate holders (SH), and the central part of the substrate (S) may sag under load. However, since the substrate (S) already has organic material deposited on it, the quality of the substrate (S) can be maintained even if the central part of the substrate (S) sags. On the other hand, as shown in Figure 12A, the multiple support parts 120 can be positioned between the substrate holder (SH) and the mask (MSK) in the third axis direction (Z).

[0106] Referring to Figure 12B, the multiple support sections 120 are moved to the standby position (SBP) in the same state as in Figure 12A. This can be done by having multiple rotary drive units 140 provide driving force to move the multiple support sections 120 from the support position (SUP) to the standby position (SBP) along a pair of guide sections 130. As a result, the first support frame 121a and the second support frame 121b can be moved from the support position (SUP) to the first standby position (SBP1), and the third support frame 121c and the fourth support frame 121d can be moved from the support position (SUP) to the second standby position (SBP2). In this case, each of the first support frame 121a, the second support frame 121b, the third support frame 121c, and the fourth support frame 121d can not overlap with the substrate (S) and / or multiple substrate holders (SH). As a result, the substrate (S) on which the organic material has been deposited can be easily removed from the chamber (CB) by a transfer means such as a robot.

[0107] Since the substrate manufacturing method according to one embodiment of this specification is performed using the substrate support apparatus 100 according to one embodiment of this specification, the substrate (S) (or large-area substrate (S)) can be easily (or flatly) fixed (or chucking) to the chucking plate (CHP) before the organic material deposition process, so that the organic material can be uniformly deposited on the substrate (S). Therefore, the substrate manufacturing method according to one embodiment of this specification can reduce the defect rate of the substrate by minimizing, preventing, or at least reducing substrate sagging, and further reduce production energy.

[0108] Figure 13 is a perspective view showing a substrate support device according to another embodiment of this specification, Figure 14 is a schematic plan view of Figure 13, Figure 15 is a schematic side view of Figure 13, and Figure 16 is a cross-sectional view along line II-II' shown in Figure 15.

[0109] Referring to Figures 13 to 16, the substrate support devices according to other embodiments of this specification are similar to the substrate support device shown in Figure 1 described above, except that the configuration of the multiple position adjustment units 110 and the multiple support units 120 is changed, and a pair of guide units 130 and multiple rotation drive units 140 are omitted. Therefore, the same reference numerals are used for the same components, and only the different components will be described below.

[0110] In the substrate support device shown in Figure 1, a plurality of position adjustment units 110 raise and lower a pair of guide units 130, and a plurality of rotational drive units 140 are connected to the pair of guide units 130 to move a plurality of support units 120 in the first axis direction (X). That is, the substrate support device according to Figure 1 has a structure in which a plurality of position adjustment units 110 are indirectly connected to a plurality of support units 120 via a pair of guide units 130. Therefore, in the substrate support device according to Figure 1, the plurality of support units 120 can be moved in the first axis direction (X) and the third axis direction (Z) by the plurality of position adjustment units 110 and the plurality of rotational drive units 140, thereby supporting the lower surface (or the central part of the substrate (S)) of the substrate (S) in support mode. Therefore, the substrate support device according to Figure 1 can minimize or reduce the sagging of the substrate (S), and can reduce the defect rate of the substrate (S) after the manufacturing process is completed.

[0111] On the other hand, in the case of the substrate support device shown in Figure 13, the multiple position adjustment units 110' are directly connected to the multiple support units 120'. Therefore, in the case of the substrate support device shown in Figure 13, the multiple support units 120' are rotated and raised by the multiple position adjustment units 110, so that in support mode the lower surface (or the central part of the substrate (S)) of the substrate (S) can be supported at the support position (SUP'). Then, the multiple support units 120' are lowered and rotated by the multiple position adjustment units 110, so that they can be positioned at a standby position (SBP') that does not overlap with the substrate (S) in standby mode.

[0112] Specifically, in the substrate support device shown in Figure 13, each of the multiple position adjustment units 110' may include a lifting shaft 111', a bellows 112', a drive motor 113', and a lifting motor 114'. Furthermore, each of the multiple support units 120' may include an arm frame 121' and a pin assembly 122'.

[0113] Each of the multiple position adjustment units 110' has a lifting shaft 111' which can be coupled to each of the multiple support units 120'. In one example, the lifting shaft 111' can be coupled to one side of the arm frame 121'. The lifting shaft 111' can be raised and lowered by the driving force provided by the lifting motor 114'. As the lifting shaft 111' moves up and down, the arm frame 121' can be raised and lowered together with it.

[0114] The bellows 112' can be coupled to the lifting shaft 111' so as to partially enclose it. The bellows 112 is for maintaining a pressure difference between the vacuum chamber (CB, shown in Figure 7A) and the atmospheric pressure outside the chamber. In one example, the bellows 112' can be located outside the chamber (CB). For example, the bellows 112' can be located on a base plate (BP) coupled to the upper side of the chamber (CB). As described above, since the lifting shaft 111' is raised and lowered by the lifting motor 114', if the portion of the chamber (CB) to which the lifting shaft 111' is movably coupled is in communication with the outside, it is not possible to maintain a vacuum inside the chamber (CB). Therefore, the bellows 112' can be provided so as to seal the portion where the base plate (BP) and the lifting shaft 111' are connected. For example, the bellows 112' can be provided in the form of a wrinkled circular accordion.

[0115] The drive motor 113' is for rotating the lifting shaft 111'. In one example, the drive motor 113' can be positioned on the bellows 112', as shown in Figure 15. The drive motor 113' can be coupled to the other side of the lifting shaft 111'. An arm frame 121' can be coupled to one side of the lifting shaft 111'. The drive motor 113' can rotate the lifting shaft 111' by providing a driving force so that the lifting shaft 111' rotates clockwise or counterclockwise.

[0116] The lifting motor 114' is positioned on the drive motor 113' and can raise and lower the drive motor 113'. In one example, the lifting motor 114' is coupled to a motor housing in the shape of a "┓" and can provide a driving force that can raise and lower the drive motor 113'. For example, the driving force provided by the lifting motor 114' can rotate a ball screw connected to the lifting motor, thereby raising and lowering a cylinder rod connected to the ball screw. As the cylinder rod is raised and lowered, the drive motor 113' connected to the cylinder rod can be raised and lowered, and as a result, the lifting shaft 111' can be raised and lowered.

[0117] Therefore, in the substrate support device 100 according to an example of this specification, each of the multiple position adjustment units 110 can raise and lower the multiple support units 120' in the third axis direction (Z), and rotate the arm frame 121' (or pin assembly 122') so that it is positioned in the standby position (SBP') and the support position (SUP'), respectively.

[0118] Referring to Figure 15, each of the multiple support sections 120' can include an arm frame 121' and a pin assembly 122'.

[0119] The arm frame 121' can be coupled to the tip (or one side) of the lifting shaft 111'. The arm frame 121' can rotate as the lifting shaft 111' rotates by the drive motor 113'. For example, as shown in Figure 14, in support mode, the two arm frames 121' on the left side of the first standby position (SBP1') can be rotated clockwise to switch to the support position (SUP'). The pin assembly 122' at the tip of each arm frame 121' can be positioned on one quarter plane (S1) of the substrate (S). The two arm frames 121' on the right side of the first standby position (SBP1') can be rotated counterclockwise to switch to the support position (SUP'), and the pin assembly 122' at the end of each arm frame 121' can be positioned on the second quarter plane (S2) of the substrate (S). Then, the two arm frames 121' on the left side of the second standby position (SBP2') can be rotated counterclockwise to the support position (SUP'), and the pin assemblies 122' at the ends of each arm frame 121' can be positioned on the third quarter plane (S3) of the substrate (S). The two arm frames 121' on the right side of the second standby position (SBP1') can be rotated clockwise to the support position (SUP'), and the pin assemblies 122' at the ends of each arm frame 121' can be positioned on the fourth quarter plane (S4) of the substrate (S). Thus, the pin assemblies 122' at the ends of each of the eight arm frames 121' can be positioned spaced apart from each other under the substrate (S).

[0120] On the other hand, in the substrate support device 100 according to other embodiments of this specification, the pin assemblies 122' included in each of the plurality of support parts 120' can be rotated sequentially or simultaneously by the drive motor 113'. As shown in Figure 14, since the arm frames 121' of each of the plurality of support parts 120' have a predetermined range of rotation, if two adjacent arm frames 121' rotate in different directions from each other, they may interfere with each other and be damaged. Therefore, the substrate support device 100 according to other embodiments of this specification is configured so that two adjacent arm frames 121' rotate sequentially or simultaneously in the same direction with respect to the boundary portions of each of the 1-quarter plane (S1) to 4-quarter plane (S4), so that two adjacent arm frames 121' outside one quarter plane can easily switch between the support position (SUP') and the standby position (SBP') without interfering with each other.

[0121] As shown in Figure 14, the arm frames 121' and pin assemblies 122' of each of the plurality of support parts 120' are located inside the chamber (CB) and can be rotated and raised by a plurality of position adjustment parts 110'.

[0122] The pin assembly 122' can be coupled to the arm frame 121' so as to be spaced away from the lifting shaft 111'. In one example, the pin assembly 122' can be coupled to the other end of the arm frame 121'. However, it is not limited to this, and depending on the size of the substrate (S), the pin assembly 122' may not be coupled to the other end of the arm frame 121', but rather to a position spaced away from the other end in the direction toward one side. The pin assembly 122' can rotate together with the arm frame 121' as it rotates due to the drive motor 113'. The pin assembly 122' may include a bottom flange 122a', a pin housing 122b', a pin guide shaft 122c', a pin elastic member 122d', and a support pin 122e'.

[0123] Referring to Figures 15 and 16, the bottom flange 122a' can be connected to the other end of the arm frame 121' via fastening members such as bolts. In this case, the fastening members can also be fastened to the pin housing 122b' located above the bottom flange 122a'. Therefore, the bottom flange 122a' and the pin housing 122b' can be connected to the arm frame 121' by fastening members.

[0124] The pin housing 122b' can be formed in a cylindrical shape with a partially hollow interior. The pin housing 122b' can be coupled to the bottom flange 122a' and may include a pin through-hole 122ba'. In one example, the pin housing 122b' can be coupled to the upper surface of the bottom flange 122' via a fastening member. The pin through-hole 122ba' can be formed through the upper central portion of the pin housing 122b'. The pin guide shaft 122c' can partially protrude through the pin through-hole 122ba'. By making the pin through-hole 122ba' smaller than the size of the head portion of the pin guide shaft 122c', it is possible to prevent the entire pin guide shaft 122c' from detaching from the pin housing 122b'. The portion of the pin guide shaft 122c' that partially protrudes through the through-hole 122ba' may be the portion located above the head portion.

[0125] The pin guide shaft 122c' can be movably coupled to the bottom flange 122a' and the pin housing 122b'. As described above, the pin guide shaft 122c' may include a head portion, which may be located inside the pin housing 122b'. In one example, the pin guide shaft 122c' can be formed to be longer than the combined length of the bottom flange 122a' and the pin housing 122b' in the third axial direction (Z). This allows the upper end of the pin guide shaft 122c' to protrude upward from the pin housing 122b' and the lower end of the pin guide shaft 122c' to protrude downward from the bottom flange 122a'.

[0126] The pin elastic member 122d' can partially enclose the pin guide shaft 122c' and be supported on one side of the pin guide shaft 122c' and on the pin housing 122b'. In one example, the pin elastic member 122d' can enclose the body below the head portion of the pin guide shaft 122c' and be supported on one side (or head portion) of the pin guide shaft 122c' and on the pin housing 122b'. Therefore, when the support pin 122e' supports the substrate (S), the load of the substrate (S) can cause the pin guide shaft 122c' to move downward, thereby causing the pin elastic member 122d' to contract. Conversely, when the support pin 122e' does not support the substrate (S), the elastic restoring force can cause the pin elastic member 122d' to extend, thereby causing the pin guide shaft 122c' to move upward.

[0127] The support pin 122e' can be coupled to one end of the pin guide shaft 122c' so as to face the pin elastic member 122d'. The one end of the pin guide shaft 122c' can mean a portion that protrudes to the outside of the pin housing 122b' through the pin through hole 122ba'. In one example, as shown in Figure 16, the support pin 122e' may be larger from top to bottom, and the size of the lower portion coupled to one end of the pin guide shaft 122c' may be smaller than the size of one end of the pin guide shaft 122c'. Thus, the lower portion of the support pin 122e' can be inserted into an insertion groove formed on one end of the pin guide shaft 122c'. Consequently, as shown in Figure 16, the support pin 122e' can be positioned outside the pin housing 122b', thereby supporting the lower surface of the substrate (S) in support mode.

[0128] On the other hand, by having the head portion of the pin guide shaft 122c' be larger than the size of the pin through hole 122ba', the pin guide shaft 122c' can be prevented from detaching from the pin housing 122b' even if the pin guide shaft 122c' moves upward due to the extension of the pin elastic member 122d'.

[0129] As shown in Figure 16, the pin guide shaft 122c' to which the support pin 122e' is connected is supported by the pin elastic member 122d', so that it can move downward when supporting a substrate (S). Therefore, the substrate support device 100 according to one embodiment of this specification can absorb the impact generated when the support pin 122e' supports the substrate (S) with the pin elastic member 122d'. Therefore, the substrate support device 100 according to one embodiment of this specification can minimize, prevent, or at least reduce damage such as scratches to the substrate (S) compared to a case where the pin elastic member is not provided and impact cannot be absorbed.

[0130] As a result, the substrate support device 100 according to other embodiments of this specification can support the lower surface (or the central portion of the substrate (S)) of the substrate (S) in support mode by having a support portion 120' directly coupled to the position adjustment portion 110' rotate and rise by the position adjustment portion 110'. Therefore, the substrate support device 100 according to other embodiments of this specification can minimize sagging of the substrate (S) and reduce the defect rate of the substrate (S) after the manufacturing process is completed.

[0131] Figures 17 and 18 are schematic operational diagrams showing how a substrate support device according to another embodiment of this specification supports a substrate.

[0132] Figure 17 shows the operating state before the pin assembly 122' supports the substrate (S) in support mode. As shown in Figure 17, by supporting the edge of the substrate (S) with the substrate holder (SH), the central portion of the substrate (S) can sag downward due to the load. However, the substrate support device 100 according to other embodiments of this specification can support and move the sagging central portion of the substrate (S) upward via a plurality of position adjustment parts 110' and a plurality of support parts 120'.

[0133] Figure 18 shows the operating state in which the pin assembly 122' supports the substrate (S) in support mode. As shown in Figure 18, each of the multiple pin assemblies 122' is raised in the third axis direction (Z) by each of the multiple position adjustment units 110', thereby supporting the central portion of the substrate (S) and moving it upward. This minimizes, prevents, or at least reduces sagging of the substrate (S), so that the entire surface of the substrate (S) can be chucking (or fixed) to the chucking plate (CHP). Therefore, the substrate support device 100 according to other embodiments of this specification can allow organic material to be uniformly deposited on the substrate (S), thereby reducing the defect rate of the substrate (S), and further reducing production energy by reducing the defect rate of the substrate (S).

[0134] A substrate manufacturing method using the substrate support device 100 according to other embodiments of this specification can be carried out as follows.

[0135] First, a substrate (S) is inserted into the chamber (CB) using a transfer means such as a robot (not shown), and the ends of the substrate (S) are supported by a plurality of substrate holders (SH) positioned inside the chamber (CB). In this case, the pin assemblies 122' of the plurality of support parts 120 can be positioned in standby positions (SBP') by a plurality of position adjustment parts 110' so as not to overlap with the substrate (S). For example, four of the eight pin assemblies 122' can be positioned in a first standby position (SBP1') by the plurality of position adjustment parts 110', and the remaining four pin assemblies 122' can be positioned in a second standby position (SBP2') by the plurality of position adjustment parts 110'. Therefore, the substrate (S) inserted into the chamber (CB) can be stably attached to the substrate holders (SH) without interfering with the eight pin assemblies 122'.

[0136] Next, the multiple pin assemblies 122' are positioned in a support position (SUP'). This process can be accomplished by having multiple position adjustment units 110' rotate the arm frame 121'. Thus, the multiple pin assemblies 122' can be positioned spaced apart from each other in the support position (SUP') below the substrate (S). For example, eight pin assemblies 122' can be positioned spaced apart from each other in the support position (SUP'). In this case, each of the eight arm frames 121' to which each of the eight pin assemblies 122' is coupled can be positioned between multiple substrate holders (SH). This prevents the eight arm frames 121' from interfering with the substrate holders (SH) even when raised in the third axis direction (Z) by the multiple position adjustment units 110'.

[0137] In this state, the second position control unit (PC2) lowers the chucking plate (CHP), which is positioned on the substrate (S), toward the substrate (S). In this case, the chucking plate (CHP) can be positioned as close as possible to the edge of the substrate (S) so as to prevent or reduce the possibility of damage to the edge (or border portion) of the recessed substrate (S).

[0138] Next, the multiple pin assemblies 122' are raised to support the substrate (S), and a voltage is applied to the chucking plate (CHP) to chucking (or fix) the substrate (S) to the chucking plate (CHP). This process can be performed by multiple position adjustment units 110' raising the multiple pin assemblies 122' toward the chucking plate (CHP), and a voltage supply unit (not shown) connected to the chucking plate (CHP) applying a voltage to the chucking plate. As a result, the multiple pin assemblies 122' can contact the underside (or the central portion of the substrate (S)) and can be further raised upward by the multiple position adjustment units 110' to improve or reduce the sagging of the substrate (S). In this state, when a voltage (or electrostatic charge) is applied to the chucking plate (CHP), the central portion and edges of the substrate (S) can be chucking (or fixed) to the chucking plate (CHP).

[0139] Next, the multiple pin assemblies 122' are lowered and then rotated to the standby position (SBP). This process can be accomplished by using multiple position adjustment units 110' to lower the multiple pin assemblies 122' toward the mask (MSK) and rotate the arm frame 121'. In this case, the substrate (S) may be fixed to the chucking plate (CHP) by electrostatics. Therefore, the substrate (S) can be positioned flat. The multiple pin assemblies 122' are lowered by the multiple position adjustment units 110' and can be positioned between the substrate holder (SH) and the mask (MSK) in the third axis direction (Z). In this state, the multiple pin assemblies 122' can be moved to the standby position (SBP) by the rotation of the arm frame 121' driven by the drive motor 113'.

[0140] Next, the second position control unit (PC2) lowers the chucking plate (CHP) to attach the mask (MSK) with an opening (OA) to the underside of the substrate (S). Then, the source (SC) evaporates the organic material and deposits it onto the substrate (S) exposed to the opening (OA). In this way, the organic material can be deposited onto the underside of the substrate (S) depending on the shape of the opening (OA) of the mask (MSK).

[0141] Next, the multiple pin assemblies 122' are rotated to a support position (SUP') and then raised to support the substrate (S) on which the organic material has been deposited. This process can be accomplished by using a drive motor 113' to rotate the arm frame 121' and a lifting motor 114' to raise the lifting shaft 111'. This allows the multiple pin assemblies 122' to be positioned below the substrate (S) at a distance from each other. In this case, each of the multiple arm frames 121' to which each of the multiple pin assemblies 122' is coupled can be positioned between the multiple substrate holders (SH). Therefore, even if the multiple arm frames 121' are raised in the third axis direction (Z) by the multiple position adjustment units 110', they can not interfere with the substrate holders (SH). In this state, the multiple pin assemblies 122' can be raised toward the chucking plate (CHP) by the multiple position adjustment units 110'. This allows the multiple pin assemblies 122' to contact and support the underside (or central portion) of the substrate (S). Subsequently, when the voltage (or static electricity) applied to the chucking plate (CHP) is turned off, the substrate (S) on which the organic material has been deposited can be supported only by the multiple pin assemblies 122'.

[0142] Next, the multiple fin assemblies 122' are lowered to support the edge of the substrate (S) on which the organic material has been deposited in the substrate holder (SH). This process can be accomplished by using a lifting motor 114' to provide the driving force and lower the multiple pin assemblies 122' toward the mask (MSK). In this case, the multiple pin assemblies 122' can be lowered below the multiple substrate holders (SH). This allows the edge of the substrate (S) to be supported by the substrate holders (SH) and separates the substrate (S) from the multiple pin assemblies 122'. The multiple pin assemblies 122' can be positioned between the substrate holders (SH) and the mask (MSK) in the third axis direction (Z). In this state, the multiple pin assemblies 122' can be moved to a standby position (SBP') by rotating the arm frame 121' with a drive motor 113'. For example, four of the eight pin assemblies 122' can be moved from a support position (SUP') to a first standby position (SBP1'), and the remaining four pin assemblies 122' can be moved from a support position (SUP') to a second standby position (SBP2'). In this case, each of the eight pin assemblies 122' can not be superimposed on the substrate (S) and / or multiple substrate holders (SH). This allows the substrate (S) on which the organic material has been deposited to be easily removed from the chamber (CB) by a transfer means such as a robot.

[0143] The substrate manufacturing method according to other embodiments of this specification, when performed using the substrate support apparatus 100 according to other embodiments of this specification, allows the substrate (S) (or large-area substrate (S)) to be easily (or flatly) fixed (or chucking) to the chucking plate (CHP) before the organic material deposition process, thereby enabling uniform deposition of the organic material onto the substrate (S). Therefore, the substrate manufacturing method according to other embodiments of this specification can reduce the defect rate of the substrate by minimizing, preventing, or at least reducing substrate sagging, and further reduce production energy.

[0144] Although embodiments of this specification have been described in more detail above with reference to the attached figures, this specification is not necessarily limited to such embodiments, and can be implemented in various modified ways without departing from the technical concept of this specification. Therefore, the embodiments disclosed herein are for illustrative purposes only, not to limit the technical concept of this specification, and such embodiments do not limit the scope of the technical concept of this specification. Accordingly, the embodiments described above should be understood in all respects to be illustrative and not limiting. All technical concepts within the scope of protection of this specification should be interpreted as being included within the scope of rights of this specification. [Explanation of Symbols]

[0145] 100: Substrate support device 110:Position adjustment section 111: Lifting axis 112: Bellows 113: Cylinder pump 120: Support part 121: Support frame 122: Support member 123: Detachment prevention member 130: Guide Section 131: First Guide Section 132: Second Guide Section 140: Rotary drive unit 141: Ball screw 142: Rotary motor SBP: Standby position SUP: Support position

Claims

1. A substrate support device, comprising: a plurality of position adjusters arranged at intervals in a first direction on two parallel straight lines, and a plurality of linear support portions connected to the bottom of each of the plurality of position adjusters and configured to support a substrate, wherein the plurality of linear support portions are arranged to be separated from each other under the substrate and are configured to support the substrate, wherein the plurality of linear support portions are configured to be raised by the plurality of position adjusters, wherein the substrate support device further includes a pair of linear guide portions arranged along the first direction on the two parallel straight lines, and the pair of linear guide portions are connected to each of the plurality of position adjusters and each of the plurality of linear support portions, wherein the plurality of position adjusters are configured to raise and lower the pair of linear guide portions, wherein the plurality of linear support portions are arranged along a second direction perpendicular to the first direction and are movably coupled to the pair of linear guide portions, a substrate support device.

2. The substrate support device according to claim 1, further comprising a plurality of rotary drive portions arranged on each of the pair of linear guide portions and configured to move the plurality of linear support portions in the first direction.

3. The substrate support device according to claim 1, wherein the plurality of position adjusters are separated from each other along the pair of linear guide portions.

4. The substrate support device according to claim 2, wherein each of the plurality of linear support portions is moved by each of the plurality of rotary drive portions, and the plurality of linear support portions maintain a state of being separated from each other.

5. Each of the pair of linear guide portions includes a plurality of standby positions where the plurality of linear support portions are located when the substrate is not supported, and a support position where the plurality of linear support portions are configured to support the substrate, and each of the support positions is between each of the plurality of standby positions. The substrate support device according to claim 1.

6. Each of the plurality of linear support portions includes a support frame movably coupled to each of the pair of linear guide portions, and a support member coupled to the support frame, wherein the support member has a length shorter than that of the support frame and is arranged along the length direction of the support frame. The substrate support device according to claim 2.

7. The support member is Housing connected to the aforementioned support frame, A stopper coupled to the housing and having a through hole, A guide shaft movably coupled to the stopper and the housing, An elastic member enclosing the guide shaft and supported by one side of the guide shaft and the housing, The substrate support device according to claim 6, comprising a support bar coupled to one side of the guide shaft so as to be opposite to the elastic member, and partially protruding outside the stopper through the through hole.

8. The pair of linear guide portions have a first end and a second end in the first direction, The aforementioned plurality of linear support parts, A first support frame positioned at the first end of the pair of linear guide sections, A second support frame positioned closer to the second end of the pair of linear guide sections than the first support frame, A third support frame positioned closer to the second end of the pair of linear guide sections than the second support frame, and It includes a fourth support frame positioned closer to the second end of the pair of linear guide sections than the third support frame, The substrate support device according to claim 5, wherein the first support frame, the second support frame, the third support frame, and the fourth support frame are configured to be spaced apart from each other at the support position to support the substrate.

9. The plurality of standby positions include a first standby position located at the first end of the pair of linear guide sections, and a second standby position located at the second end of the pair of linear guide sections. The first support frame and the second support frame are configured to be positioned in the first standby position when the substrate is not being supported. The substrate support device according to claim 8, wherein the third support frame and the fourth support frame are configured to be positioned in the second standby position when the substrate is not being supported.

10. Each of the aforementioned plurality of position adjusters, Lifting shafts connected to each of the pair of linear guide sections, A bellows that partially encloses the aforementioned lifting shaft and is coupled to the aforementioned lifting shaft, and The substrate support device according to claim 1, comprising a cylinder pump disposed on the bellows for raising and lowering the lifting shaft.

11. The substrate support device according to claim 6, wherein each of the plurality of rotational drive units includes a ball screw positioned in each of the pair of linear guide units, and a rotary motor configured to rotate the ball screw.

12. Each of the pair of linear guide sections is Guide housing, An LM guide coupled to the guide housing and positioned below the ball screw along the longitudinal direction of the ball screw, and The substrate support device according to claim 11, further comprising an LM block movably coupled to the LM guide and the ball screw, and moving along the LM guide by the rotation of the ball screw.

13. Each of the pair of linear guide portions further includes a guide hole into which one or the other side of the support frame is inserted. The substrate support device according to claim 12, wherein the guide hole is located on the other side of the guide housing opposite to the one side of the guide housing on which the support member is arranged.

14. Each of the plurality of linear support portions further includes a detachment prevention member coupled to one side of the support frame inserted into the guide hole, The substrate support device according to claim 13, wherein the width of the detachment prevention member is greater than the width of the guide hole.

15. Each of the aforementioned plurality of position adjusters, A lifting shaft connected to each of the aforementioned plurality of linear support parts, A bellows that partially encloses the aforementioned lifting shaft and is connected to the aforementioned lifting shaft, A drive motor is positioned on the bellows and rotates the lifting shaft, and The substrate support device according to claim 1, further comprising a lifting motor disposed on the drive motor and used to raise and lower the drive motor.

16. Each of the aforementioned plurality of linear support portions is An arm frame connected to one end of the lifting shaft and configured to rotate by the rotation of the lifting shaft, Includes a pin assembly coupled to the arm frame, which is spaced apart from the lifting shaft, The substrate support device according to claim 15, wherein the pin assembly is configured to rotate by the rotation of the arm frame.

17. The aforementioned pin assembly The bottom flange connected to the aforementioned arm frame, A pin housing, which is coupled to the bottom flange and includes a pin through hole, A pin guide shaft is movably coupled to the bottom flange and the pin housing, and partially protrudes outside the pin housing through the pin through hole. A pin elastic member that partially encloses the pin guide shaft and is supported by one side of the pin guide shaft and the pin housing, and The substrate support device according to claim 16, further comprising a support pin coupled to one side of the pin guide shaft so as to face the pin elastic member.

18. The substrate support device according to claim 16, wherein the pin assemblies included in each of the plurality of linear support portions are configured to rotate sequentially or simultaneously.

19. A step of positioning multiple pin assemblies in standby positions so that their edges do not overlap with the substrate supported by the substrate holder in the chamber. The process of rotating the plurality of pin assemblies to position them in a support position and lowering the chucking plate on the substrate, A step of supporting the substrate by raising the plurality of pin assemblies, and chucking the substrate to the chucking plate by applying a voltage to the chucking plate, After lowering the plurality of pin assemblies, rotate them to position them in the standby position. A step of lowering the chucking plate to attach a mask having an opening to the substrate, and evaporating an organic substance from the source and depositing it onto the substrate, A step of supporting the substrate on which the organic material has been deposited by moving the plurality of pin assemblies to the support position and then raising them, A step of turning off the voltage applied to the chucking plate, and A method for manufacturing a substrate, comprising the step of lowering the plurality of pin assemblies so that the edges of the substrate on which the organic material has been deposited are supported by the substrate holder.

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