Light-emitting module and method for manufacturing a light-emitting module

Abstract

To provide a light-emitting module that is improved in light guide-out efficiency, and a method of manufacturing the light-emitting module.SOLUTION: A light-emitting module comprises: a substrate which includes a support member having a first surface and a wiring layer arranged on the first surface; a light shield member which is arranged on the first surface, and has a plurality of hole parts in plan view; a plurality of light-emitting elements which are arranged on the first surface inside the plurality of hole parts respectively, and electrically connected to the wiring layer; a first translucent member which has a plurality of projection bodies arranged on light guide-out surfaces of the plurality of light-emitting elements respectively inside the plurality of holes parts; and a plurality of gaps which are arranged respectively in contact with the wiring layer between the plurality of light-emitting elements and inner peripheral surfaces of the plurality of hole parts.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The embodiments relate to a light-emitting module and a method for manufacturing a light-emitting module. [Background technology]

[0002] Light-emitting modules, which have multiple light-emitting elements arranged in a two-dimensional plane, are widely used as backlights for liquid crystal displays and various other planar light sources for displays.

[0003] By using an ultra-small bare chip as the light-emitting element, it becomes possible to miniaturize and thin the light-emitting module. Even with a miniaturized and thinned light-emitting module, further improving the light extraction efficiency offers significant advantages, such as expanding the range of applications and achieving even higher efficiency. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Special Publication No. 2016-525288 [Overview of the project] [Problems that the invention aims to solve]

[0005] The embodiment aims to provide a light-emitting module with improved light extraction efficiency and a method for manufacturing the light-emitting module. [Means for solving the problem]

[0006] The light-emitting module according to the embodiment includes a substrate including a support member having a first surface and a wiring layer disposed on the first surface; a light-shielding member disposed on the first surface and having a plurality of holes in a plan view; a plurality of light-emitting elements disposed inside the plurality of holes on the first surface and electrically connected to the wiring layer; a first light-transmitting member having a plurality of convex bodies disposed inside the plurality of holes and on the light-extraction surfaces of the plurality of light-emitting elements; and a plurality of gaps disposed between the plurality of light-emitting elements and the inner circumferential surfaces of the plurality of holes, in contact with the wiring layer.

[0007] The light-emitting module according to the embodiment includes a substrate including a support member having a first surface and a wiring layer disposed on the first surface; a light-shielding member disposed on the first surface and having a hole in a plan view; a light-emitting element disposed inside the hole on the first surface and electrically connected to the wiring layer; a first light-transmitting member having a convex body disposed inside the hole on the light-extracting surface of the light-emitting element; and a gap disposed between the light-emitting element and the inner circumferential surface of the hole, in contact with the wiring layer.

[0008] A method for manufacturing a light-emitting module according to an embodiment includes the steps of: preparing a first intermediate member including a substrate having a first surface and a wiring layer disposed on the first surface; a plurality of light-emitting elements disposed on the first surface at a distance from each other and connected to the wiring layer; and a light-shielding member having a plurality of holes, with the plurality of light-emitting elements each disposed inside the plurality of holes; and arranging a plurality of light-transmitting convex bodies on the upper surface of the plurality of light-emitting elements via the plurality of holes. In the step of arranging the plurality of convex bodies on the upper surface of the plurality of light-emitting elements, a plurality of gaps in contact with the wiring layer are arranged between the plurality of light-emitting elements and the inner circumferential surfaces of the plurality of holes. [Effects of the Invention]

[0009] According to this embodiment, it is possible to provide a light-emitting module with improved light extraction efficiency and a method for manufacturing the light-emitting module. [Brief explanation of the drawing]

[0010] [Figure 1] It is a schematic top view illustrating a light-emitting module according to the first embodiment. [Figure 2] It is an enlarged view of part II in FIG. 1. [Figure 3] It is a cross-sectional view taken along line III-III in FIG. 2, and is a schematic cross-sectional view illustrating a light-emitting module according to the first embodiment. [Figure 4] It is a schematic top view illustrating a light-emitting module according to a modification of the first embodiment. [Figure 5A] It is a schematic cross-sectional view illustrating a manufacturing method of a light-emitting module according to the first embodiment. [Figure 5B] It is a schematic cross-sectional view illustrating a manufacturing method of a light-emitting module according to the first embodiment. [Figure 6A] It is a schematic cross-sectional view illustrating a manufacturing method of a light-emitting module according to the first embodiment. [Figure 6B] It is a schematic cross-sectional view illustrating a manufacturing method of a light-emitting module according to the first embodiment. [Figure 7A] It is a schematic cross-sectional view illustrating a manufacturing method of a light-emitting module according to the first embodiment. [Figure 7B] It is a schematic cross-sectional view illustrating a manufacturing method of a light-emitting module according to the first embodiment. [Figure 8A] It is a schematic cross-sectional view illustrating a manufacturing method of a light-emitting module according to the first embodiment. [Figure 8B] It is a schematic cross-sectional view illustrating a manufacturing method of a light-emitting module according to the first embodiment. [Figure 9A] It is a schematic cross-sectional view illustrating a modification of the manufacturing method of a light-emitting module according to the first embodiment. [Figure 9B] It is a schematic cross-sectional view illustrating a modification of the manufacturing method of a light-emitting module according to the first embodiment. [Figure 10] It is a schematic cross-sectional view illustrating a modification of the manufacturing method of a light-emitting module according to the first embodiment. [Figure 11]This is a schematic cross-sectional view illustrating a light-emitting module according to the second embodiment. [Figure 12A] This is a schematic cross-sectional view illustrating a method for manufacturing a light-emitting module according to the second embodiment. [Figure 12B] This is a schematic cross-sectional view illustrating a method for manufacturing a light-emitting module according to the second embodiment. [Figure 13A] This is a schematic cross-sectional view illustrating a method for manufacturing a light-emitting module according to the second embodiment. [Figure 13B] This is a schematic cross-sectional view illustrating a method for manufacturing a light-emitting module according to the second embodiment. [Figure 14] This is a schematic cross-sectional view illustrating a light-emitting module according to a third embodiment. [Figure 15] This is a schematic cross-sectional view illustrating a light-emitting module according to the fourth embodiment. [Figure 16A] This is a schematic cross-sectional view illustrating a light-emitting module according to a modified example 1 of the fourth embodiment. [Figure 16B] This is a schematic cross-sectional view illustrating a light-emitting module according to a modified example 2 of the fourth embodiment. [Figure 16C] This is a schematic cross-sectional view illustrating a light-emitting module according to a modified example 3 of the fourth embodiment. [Figure 17] This is a schematic cross-sectional view illustrating a light-emitting module according to the fifth embodiment. [Modes for carrying out the invention]

[0011] Embodiments of the present invention will be described below with reference to the drawings. Please note that the drawings are schematic or conceptual, and the relationships between the thickness and width of each part, as well as the ratios of the sizes of the parts, are not necessarily identical to those of reality. Furthermore, even when representing the same part, the dimensions and ratios may differ between drawings. In this specification and in each figure, elements similar to those described above in previously mentioned figures are denoted by the same reference numerals, and detailed explanations are omitted as appropriate.

[0012] (First Embodiment) (Configuration of the light-emitting module 100) Figure 1 is a schematic top view illustrating a light-emitting module according to the first embodiment. Figure 2 is an enlarged view of part II of Figure 1. Figure 3 is a schematic cross-sectional view taken along the line III-III in Figure 2, illustrating a light-emitting module according to the first embodiment. As shown in Figures 1 to 3, the light-emitting module 100 according to this embodiment comprises a substrate 10, a plurality of light-emitting elements 30, a plurality of gaps 40, a light-shielding member 50, and a first light-transmitting member 60. The substrate 10 includes a support member 12 and a wiring layer 20. The support member 12 has a first surface 12a. The wiring layer 20 is arranged on the first surface 12a. A plurality of light-emitting elements 30 are arranged on the first surface 12a.

[0013] In all descriptions of embodiments and their variations, three-dimensional XYZ coordinates may be used. The XY plane is assumed to be a plane substantially parallel to the first surface 12a. The direction of the X axis is along the row direction of the matrix-arranged plurality of light-emitting elements 30. The direction of the Y axis is along the column direction of the matrix-arranged plurality of light-emitting elements 30. The Y axis is perpendicular to the X axis. The Z axis is perpendicular to the XY plane. The direction from the surface of the support member 12 opposite to the first surface 12a toward the first surface 12a is assumed to be the positive direction.

[0014] The positive direction of the Z-axis is sometimes referred to as "up," "upper part," or "above," while the negative direction of the Z-axis is sometimes referred to as "down," "lower part," or "below." However, the direction along the Z-axis is not necessarily the direction in which gravity acts. These terms are used to facilitate understanding of the explanation and are not limited to the actual meanings of "up," "upper part," "above," "down," "lower part," or "below." The length along the Z-axis is sometimes referred to as thickness.

[0015] As shown in Figures 1 and 2, in the light-emitting module 100, the multiple light-emitting elements 30 are arranged in an 8x8 matrix on a nearly square substrate 10 in an XY plane view. The number of rows and columns in which the multiple light-emitting elements 30 are arranged is not limited to this, and can be set to the required number of rows and columns according to the application. The arrangement of the multiple light-emitting elements 30 is not limited to the matrix arrangement shown in Figure 1, but can be set to any appropriate arrangement, such as a staggered arrangement or a hexagonal close-packed arrangement.

[0016] In the arrangement of multiple light-emitting elements 30 in the example shown in Figure 1, the spacing between adjacent light-emitting elements 30 is the same for all of them. However, the spacing between adjacent light-emitting elements 30 may vary depending on the position of the light-emitting elements 30 in the light-emitting module 100. For example, at the corners of the light-emitting module 100, the number of adjacent light-emitting elements decreases, resulting in less interference between light-emitting elements and thus lower brightness than in the center of the light-emitting module 100. Therefore, at the corners of the light-emitting module 100, the spacing between the light-emitting elements 30 may be narrower than at the center of the light-emitting module 100 to increase brightness. The shape of the substrate 10 is not limited to a square; it may be a rectangle, trapezoid, rhombus, or any other polygon, depending on the number and arrangement of the light-emitting elements 30.

[0017] In the light-emitting module 100, the light-shielding member 50 has a plurality of holes 55 arranged in a matrix in an XY plane view. A plurality of light-emitting elements 30 are each positioned inside the plurality of holes 55.

[0018] As shown in Figures 1 to 3, in the light-emitting module 100, the first light-transmitting member 60 is positioned on the upper surface 50T of the light-shielding member 50. The first light-transmitting member 60 is also positioned inside the hole 55 and on the light-emitting element 30. The first light-transmitting member 60 on the light-emitting element 30 covers the light-extraction surface 30S, which is the upper surface of the light-emitting element 30.

[0019] In an XY planar view, the inner circumferential surface 55W of the hole 55 is positioned outside the outer circumference of the light-emitting element 30. A gap 40 is located between the light-emitting element 30 and the inner circumferential surface 55W. Light emitted upward from the light-emitting element 30 is emitted from the light-emitting module 100 through the first light-transmitting member 60. Much of the light emitted to the side of the light-emitting element 30 is reflected back to the light-emitting element 30 by the gap 40, and at least a portion of the reflected light is emitted upward from the light-emitting element 30. Light that passes through the gap 40 is blocked by the inner circumferential surface 55W.

[0020] The light-emitting elements 30 are arranged on the wiring layer 20. Multiple light-emitting elements 30 are electrically connected to each other by the wiring layer 20. In Figure 2, the wiring constituting the wiring layer 20 is arranged along the row direction of the multiple light-emitting elements 30 arranged in a matrix. The arrangement of the wiring constituting the wiring layer 20 is determined by the circuit configuration of the light-emitting module 100 and is arranged along any direction. In this example as well, the wiring layer 20 also includes wiring arranged along the column direction. Depending on the circuit configuration of the light-emitting module 100, the light-emitting module 100 may include other wiring layers insulated from the wiring layer 20.

[0021] The gap 40 is located between the inner circumferential surface 55W of the hole 55 and the side surface 30L of the light-emitting element 30. Preferably, the gap 40 extends around the entire outer circumference of the side surface 30L of the light-emitting element 30 in an XY plane view. The gap 40 is a layer of air with a refractive index lower than that of the light-emitting element 30 in contact with the gap 40. Therefore, the gap 40 acts to totally reflect light for smaller angles of incidence into the gap 40. In other words, because the critical angle between the light-emitting element 30 and the gap 40 is small, the gap 40 can reflect light incident at angles greater than or equal to the critical angle.

[0022] A wiring layer 20 made of a metallic material such as copper (Cu) is arranged near the side surface 30L and the electrode-forming surface 30R below the light-emitting element 30. When light is irradiated onto such a wiring layer 20, it is absorbed by the metallic material forming the wiring layer 20. Therefore, when the light emitted by the light-emitting element 30 is irradiated onto the wiring layer 20, the light extraction efficiency of the light-emitting element 30 decreases.

[0023] In the light-emitting module 100 according to this embodiment, for example, light emitted from the side surface 30L of the light-emitting element 30 is reflected by the gap 40. At least a portion of the light reflected by the gap 40 becomes, for example, light directed upward inside the light-emitting element 30. Therefore, the light emitted from the light-emitting element 30 that irradiates the wiring layer 20 can be suppressed, and the light extraction efficiency of the light-emitting element 30 is improved. Thus, it becomes possible to improve the light extraction efficiency of the light-emitting module 100.

[0024] If the gap 40 surrounds the entire outer circumference of the light-emitting element 30 in an XY plane view, the light directed laterally from the light-emitting element 30 is reflected by the gap 40 and returned to the light-emitting element 30, and at least a portion of it becomes light directed upward, thereby improving the light extraction efficiency of the light-emitting element 30.

[0025] As shown in Figure 3, the first surface 12a has a plurality of recesses 12b. The support member 12 supports the plurality of light-emitting elements 30, each of which is positioned in one of the plurality of recesses 12b.

[0026] The support member 12 is preferably formed from a light-reflective resin. The light-reflective resin is, for example, a thermosetting resin with excellent heat resistance and light resistance. Suitable light-reflective resins include, for example, silicone resins and epoxy resins. For example, a light-reflective member can be made by mixing a light-reflective filler into a silicone resin. The light-reflective filler can be, for example, TiO2. The thickness of the support member 12 can be, for example, about 15 μm to 300 μm.

[0027] The substrate 10 may include a reinforcing substrate 14. The reinforcing substrate 14 is positioned on the side of the support member 12 opposite to the first surface 12a. The reinforcing substrate 14 is used to reinforce the mechanical strength of the support member 12. In order to achieve a thin light-emitting module 100, the support member 12 is formed to be sufficiently thin. If the support member 12 is thin, it may be prone to warping and wrinkling. In that case, it may be difficult to maintain the dimensional accuracy of the light-emitting module 100. By placing the reinforcing substrate 14, it is possible to suppress the occurrence of warping and wrinkling of the support member 12 and reinforce the mechanical strength of the support member 12. For example, the reinforcing substrate 14 can be a substrate using polyimide-impregnated glass cloth. The thickness of the reinforcing substrate 14 can be, for example, about 25 μm to 200 μm.

[0028] A buffer member 1101 is positioned below the reinforcing substrate 14. The buffer member 1101 is provided to mitigate thermal and mechanical stress applied to the light-emitting module 100 during the manufacturing process, etc. The buffer member 1101 may be removed after use in the manufacturing process.

[0029] The wiring layer 20 is located on the first surface 12a. The multiple wirings constituting the wiring layer 20 are arranged along the X-axis direction. These wirings are also located on multiple recesses 12b.

[0030] The light-emitting element 30 has a light extraction surface 30S and an electrode-forming surface 30R. The electrode-forming surface 30R is located on the opposite side of the light extraction surface 30S. A pair of electrodes 32a and 32b are arranged on the electrode-forming surface 30R. The light-emitting element 30 has a side surface 30L. The side surface 30L is located between the light extraction surface 30S and the electrode-forming surface 30R. The light extraction surface 30S is the upper surface of the light-emitting element 30, and the electrode-forming surface 30R is the lower surface of the light-emitting element 30. The wiring constituting the wiring layer 20 is connected to the electrodes 32a and 32b of the light-emitting element 30 in the recess 12b.

[0031] In this example, the light-emitting element 30 is rectangular in XY plane view. The shape of the light-emitting element 30 in XY plane view is not limited to a rectangle; it may be a polygon with three or more angles, or it may be circular or elliptical. In the case of a polygon, the corners may be chamfered or rounded. In this example, the light-emitting element 30 is a frustum of pyramids, with its diameter increasing from the electrode-forming surface 30R towards the light-extraction surface 30S. However, the shape of the light-emitting element 30 is not limited to this; it may be a frustum of pyramids, a frustum of cone, an elliptical pyramid, etc., with its diameter decreasing from the electrode-forming surface 30R towards the light-extraction surface 30S. The light-emitting element 30 may also be a columnar body having the same diameter from the electrode-forming surface 30R to the light-extraction surface 30S.

[0032] It is preferable that a light-reflecting film 34 is placed on the side surface 30L of the light-emitting element 30. The light-reflecting film 34 is, for example, a DBR (Distributed Bragg Reflector) film. By having a light-reflecting film 34 on the side surface 30L, the emission of light from the side surface 30L can be suppressed, thereby improving the light extraction efficiency of the light-emitting element 30.

[0033] In the light-emitting element 30, light is primarily emitted from the light extraction surface 30S. In this example, the light extraction surface 30S is roughened, and the light emitted from the light extraction surface 30S is diffused over a wider area. The light extraction surface 30S is not limited to this and may be a nearly flattened surface. Some light is also emitted from the side surface 30L and the electrode-forming surface 30R.

[0034] The light-emitting element 30 includes a semiconductor structure, and a pair of electrodes 32a and 32b are connected to a p-type semiconductor layer and an n-type semiconductor layer that constitute the semiconductor structure. In the semiconductor structure, for example, a light-emitting diode structure is realized by stacking a p-type semiconductor layer, a light-emitting layer and an n-type semiconductor layer.

[0035] The light-emitting layer may have a single active layer, such as a double heterostructure or a single quantum well (SQW), or it may have a group of active layers, such as a multiple quantum well (MQW). The light-emitting layer is capable of emitting visible light or ultraviolet light. For example, visible light can be defined as light ranging from at least blue to red. An example of a semiconductor structure containing such a light-emitting layer is In x Al y Ga 1-x-y It can include N(0≦x, 0≦y, x+y≦1).

[0036] The light-emitting element 30 may include two or more light-emitting layers in its semiconductor structure. For example, the semiconductor structure may have two or more light-emitting layers between an n-type semiconductor layer and a p-type semiconductor layer, or it may have a structure in which an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer are stacked in sequence, repeated two or more times. The two or more light-emitting layers may include, for example, light-emitting layers with different emission colors, or light-emitting layers with the same emission color. The same emission color means that they are within a range that can be considered the same emission color for practical use, and for example, there may be a variation of a few nanometers in the dominant wavelength of each emission color. The combination of emission colors can be selected as appropriate, and for example, when including two light-emitting layers, possible combinations include blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, blue light and green light, blue light and red light, or green light and red light.

[0037] The light-shielding member 50 is placed on the first surface 12a. More specifically, the light-shielding member 50 is placed on the first surface 12a and on the wiring layer 20.

[0038] The light-shielding member 50 is positioned between adjacent light-emitting elements 30. A wiring layer 20 is arranged around the light-emitting elements 30, and the light-shielding member 50 is positioned to cover the wiring layer 20, which is made of a metal material, in order to prevent light from irradiating the wiring layer 20. Furthermore, when the light-emitting module 100 is used as an image display device, the light-shielding member 50 is also provided to control the interference of light emitted by adjacent light-emitting elements 30. For this reason, the thickness of the light-shielding member 50 is set to increase the light extraction efficiency. For example, the thickness of the light-shielding member 50 is greater than the thickness of the light-emitting elements 30. The thickness of the light-shielding member 50 is the length along the Z-axis from the first surface 12a to the upper surface 50T of the light-shielding member 50. In other words, the position of the upper surface 50T in the Z-axis direction is higher than the maximum position of the light extraction surface 30S in the Z-axis direction.

[0039] The light emitted from the light-emitting element 30 can be combined with the light emitted from another light-emitting element 30 positioned across the light-shielding member 50. The thickness and material of the light-shielding member 50 are set so that the light combined by these multiple light-emitting elements 30 results in a planar light source with minimal brightness unevenness in the light-emitting module.

[0040] The light-shielding member 50 is made of a material that has light-shielding properties against light emitted from the light-emitting element 30. The light-shielding member 50 can be made of, for example, a light-reflective material. Alternatively, the light-shielding member 50 may be made of a light-absorbing material. Preferably, the light-shielding member 50 is made of a light-reflective resin. When the light-shielding member 50 is light-reflective, the light emitted from the light-emitting element 30 is reflected off the inner circumferential surface 55W and emitted to the outside, thereby improving the light extraction efficiency. The light-reflective resin is preferably a thermosetting resin with excellent heat resistance and light resistance. For example, silicone resin or epoxy resin can be suitably used.

[0041] The material forming the light-shielding member 50 is not limited to a light-reflective material, but may also be a light-absorbing material. A black resin can be used as the light-absorbing material. Even a black-colored resin can exhibit light-shielding performance.

[0042] The thickness of the light-shielding member 50 can be, for example, about 10 μm to 450 μm. When the light-shielding member 50 is made of a light-reflective resin, the light extraction efficiency is preferable when the thickness of the light-shielding member 50 is greater.

[0043] In the above description, each of the multiple light-emitting elements 30 is positioned in a hole 55 located in the light-shielding member 50, but this is not the only option. For example, multiple light-emitting elements 30 may be arranged as a set of light sources inside one hole 55. The number of light-emitting elements 30 arranged inside one hole 55 may be the same throughout the entire light-emitting module, or it may vary, for example, depending on the position of the light-emitting module 100 on the XY plane.

[0044] The first light-transmitting member 60 is positioned on the upper surface 50T of the light-shielding member 50. The first light-transmitting member 60 has a convex body 62. The convex body 62 is positioned on the light-emitting element 30 inside the hole 55. The lower end of the convex body 62 is in contact with the light-extracting surface 30S inside the hole 55. Preferably, the portion of the convex body 62 in contact with the light-extracting surface 30S covers the entire surface of the light-extracting surface 30S.

[0045] The convex body 62 has an outer surface 62W of any shape, which is a frustum with a diameter that increases in the positive direction of the Z axis. In this example, the shape of the outer surface 62W of the convex body 62 is square in the XY cross-section. That is, the side surface of the outer surface 62W of the convex body 62 in this example is trapezoidal. The shape of the outer surface 62W in the XY plane view may be a polygon such as a circle, ellipse, or square. Regardless of the shape of the outer surface 62W in the XY plane view, the corners of the polygon may be rounded, or the sides of the polygon, the circumference of the circle, or the circumference of the ellipse may have partially irregular indentations or bulges.

[0046] The gap 40 is located between the light-emitting element 30 and the inner circumferential surface 55W. More specifically, the gap 40 is located between the side surface 30L of the light-emitting element 30 and the inner circumferential surface 55W, which is positioned opposite the side surface 30L. Between the side surface 30L and the inner circumferential surface 55W, the gap 40 is located in contact with the wiring layer 20. Between the side surface 30L and the inner circumferential surface 55W, the gap 40 is located so as to cover at least the wiring layer 20. Preferably, the gap 40 is located along the entire outer circumference of the side surface 30L in an XY planar view. In this example, the gap 40 is also located between the inner circumferential surface 55W and the outer circumferential surface 62W of the convex body 62. A gap 40 is located for each light-emitting element 30, and therefore the light-emitting module 100 has multiple gaps 40.

[0047] The gap 40 is, for example, a layer of air. The material constituting the gap 40 only needs to have a refractive index lower than the refractive index of the materials of the other components constituting the light-emitting module 100. More specifically, the material constituting the gap 40 has a refractive index lower than the refractive index of the material constituting the light-emitting element 30, the refractive index of the material constituting the support member 12, and the refractive index of the material constituting the first light-transmitting member 60. The material constituting the gap 40 may include, for example, other gases having a refractive index close to that of a vacuum, such as helium (He) or carbon dioxide (CO2). It is not limited to these gases, but may also be a material with a low refractive index that can totally reflect back light radiation in directions other than upward from the light-emitting element 30 when light is emitted from the light-emitting element 30 towards the light-emitting element 30.

[0048] In the light-emitting module 100 according to this embodiment, a gap 40 is also located between the inner circumferential surface 55W and the outer circumferential surface 62W. Since the refractive index of the gap 40 is lower than that of the first light-transmitting member 60 and the convex body 62, some of the light emitted through the convex body 62 of the first light-transmitting member 60 that is directed to the side or downward is reflected when the angle of incidence to the gap 40 is large and returns to the convex body 62. Some of the light that has passed through the convex body 62 reaches the inner circumferential surface 55W of the hole 55. The light that reaches the inner circumferential surface 55W is shielded by the light-shielding member 50. If the light-shielding member 50 is made of a light-absorbing material, the light that reaches the inner circumferential surface 55W is absorbed by the light-shielding member 50. If the light-shielding member 50 is made of a light-reflective material, the light that reaches the inner circumferential surface 55W is reflected towards the gap 40, and because the refractive index of the gap 40 is smaller than that of the convex body 62, the reflected light passes through the interface with the gap 40 and is incident on the convex body 62. At least a portion of the light incident on the convex body 62 from the gap 40 is directed upward. The light incident on the gap 40 is then incident on the convex body 62 again, and at least a portion of that incident light is directed upward. In this way, the light extraction efficiency of the light-emitting element 30 of the convex body 62 is improved.

[0049] The first light-transmitting member 60 includes a wavelength conversion member 70. The wavelength conversion member 70 is, for example, particles of a wavelength conversion material. The wavelength conversion material converts the light emitted by the light-emitting element 30 into light of a different wavelength. Examples of wavelength conversion materials include phosphor materials.

[0050] The wavelength conversion member 70 may contain one or more different types of wavelength conversion materials. If it contains multiple wavelength conversion materials, for example, the wavelength conversion member 70 may include a β-sialon phosphor that emits green light and a fluoride-based phosphor such as a KSF phosphor that emits red light. By using a wavelength conversion member 70 containing multiple wavelength conversion materials, the color reproduction range of the light-emitting module 100 can be expanded.

[0051] As the wavelength conversion material, known phosphors can be used. Examples of phosphors include yttrium aluminum garnet phosphors (e.g., Y3(Al,Ga)5O12 :Ce), lutetium-aluminum-garnet-based phosphor (e.g., Lu3(Al,Ga)5O 12 :Ce), terbium-aluminum-garnet-based phosphor (e.g., Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphor (e.g., Ca 10 (PO4)6C l2 :Eu), SAE-based phosphor (e.g., Sr4Al 14 O 25 :Eu), chlorosilicate-based phosphor (e.g., Ca8MgSi4O 16 C l2 :Eu), oxynitride-based phosphor, nitride-based phosphor, fluoride-based phosphor, phosphor having a perovskite structure (e.g., CsPb(F,Cl,Br,I)3), or quantum dot phosphor (e.g., CdSe, InP, AgInS2 or AgInSe2), etc. can be used. Representative examples of oxynitride-based phosphors are β-sialon-based phosphors (e.g., (Si,Al)3(O,N)4:Eu) and α-sialon-based phosphors (e.g., Ca(Si,Al) 12 (O,N) 16 :Eu), etc. Representative examples of nitride-based phosphors are SLA-based phosphors (e.g., SrLiAl3N4:Eu), CASN-based phosphors (e.g., CaAlSiN3:Eu) and SCASN-based phosphors (e.g., (Sr,Ca)AlSiN3:Eu), etc. Representative examples of fluoride-based phosphors are KSF-based phosphors (e.g., K2SiF6:Mn), KSAF-based phosphors (e.g., K2Si 0.99 Al 0.01 F 5.99 :Mn) and MGF-based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), etc.

[0052] The first light-transmitting member 60 is a sheet-like resin component, and the resin material can be, for example, epoxy resin, silicone resin, a mixture thereof, or a light-transmitting material such as glass. From the viewpoint of light resistance and ease of molding, it is beneficial to select silicone resin as the base material for the first light-transmitting member 60. As such a resin component in which a wavelength-converting substance is dispersed, a phosphor sheet can be used.

[0053] Furthermore, optical members may be placed on the first light-transmitting member 60. In this case, the optical members can be either light-diffusing members or light-scattering members, or both, placed on top of each other. A light-diffusing member is, for example, a light-diffusing sheet. A light-scattering member is, for example, a prism sheet. By using such optical members, it becomes possible to further reduce the brightness unevenness of the light-emitting module 100.

[0054] (modified version) Figure 4 is a schematic top view illustrating a modified light-emitting module according to the first embodiment. In the first embodiment, the light-emitting module 100 includes a single light-shielding member 50. The light-shielding member 50 is not limited to a single member; multiple members may be provided. In this modified example, a light-shielding member 50 is provided for each light-emitting element 30.

[0055] As shown in Figure 4, the light-emitting module 100a comprises a plurality of light-emitting elements 30 and a plurality of light-shielding members 50. A light-shielding member 50 is arranged for each light-emitting element 30. The fact that the light-emitting elements 30 are arranged inside the holes 55 formed in the light-shielding members 50 is the same as in the first embodiment. Therefore, in this modified example, the components other than the light-shielding members 50 are the same as in the first embodiment, and detailed explanations are omitted as appropriate.

[0056] The first light-transmitting member 60 is positioned on the light-shielding member 50. The first light-transmitting member 60 is also positioned between adjacent light-shielding members 50. A light-shielding member 50 may be positioned for any multiple suitable light-emitting elements 30. As in the first embodiment, multiple light-emitting elements 30 may be positioned in a single hole 55.

[0057] (Operation of the light-emitting module 100) The light-emitting module 100 according to this embodiment includes a light-shielding member 50 having a plurality of holes 55 arranged in a planar manner. A plurality of light-emitting elements 30 are arranged inside each of the multiple holes 55. Therefore, the light distribution is controlled for each light-emitting element 30 by the holes 55 of the light-shielding member 50, and the light-emitting module 100 can function as a planar light source with little brightness unevenness. The light-emitting elements 30 emit light not only upwards but also to the sides and downwards. Light emitted to the sides is converted into light directed upwards from the light-emitting elements 30 by the gaps 40. Light directed downwards can be converted into light directed upwards by making the support member 12 on which the light-emitting elements 30 are arranged a light-reflective material.

[0058] Light emitted upward from the light-emitting element 30 is incident on the convex body 62 of the first light-transmitting member 60. The light incident on the convex body 62 is converted into light of a desired wavelength by the wavelength conversion member 70.

[0059] Light emitted upward from the convex body 62 is emitted from the light-emitting module 100 as light of a desired wavelength. Light emitted to the sides or downward from the convex body 62 reaches the inner circumferential surface 55W of the hole 55. The light that reaches the inner circumferential surface 55W is absorbed or reflected according to the characteristics of the light-shielding member 50. Some of the light reflected by the light-shielding member 50 is returned to the convex body 62 and becomes light directed upward. Therefore, in the light-emitting module 100, the light extraction efficiency for each light-emitting element 30 is improved, and light is emitted within a range controlled by the shape of the inner circumferential surface 55W in the XY plane view provided for each light-emitting element 30.

[0060] (Method for manufacturing the light-emitting module 100) Figures 5A to 8B are schematic cross-sectional views illustrating a method for manufacturing a light-emitting module according to the first embodiment. Figures 5A to 8B show schematic cross-sectional views of the area corresponding to the section viewed along the line III-III in Figure 2. The same applies to Figures 9A to 10, which show modified examples of the manufacturing method described later, and to Figures 12A to 13B, which show the manufacturing method of the light-emitting module according to the second embodiment.

[0061] As shown in Figure 5A, an intermediate member (second intermediate member) 1002 is prepared. The intermediate member 1002 includes a substrate 10 and a light-emitting element 30. The substrate 10 includes a support member 12 having a first surface 12a, and the light-emitting element 30 is placed on the first surface 12a. The light-emitting element 30 is connected to the wiring layer 20 on the first surface 12a via electrodes 32a and 32b. In the intermediate member 1002, the wiring layer 20 is formed by depositing a metal material containing Cu using a manufacturing technique such as sputtering. The wiring layer 20 may also be formed by printing fine particles of a metal material containing Cu using an inkjet method, instead of sputtering. Furthermore, a conductive bonding agent such as solder, Au balls, anisotropic conductive film (ACF), or anisotropic conductive paste (ACP) may be present between the light-emitting element 30 and the wiring layer 20. When a conductive bonding agent is used, the wiring layer 20 does not have to contain Cu, and materials other than Cu can be used.

[0062] The intermediate member 1002 is positioned on a support substrate 1102 via a buffer member 1101 to protect each component constituting the light-emitting module 100 from thermal and mechanical stress during transport of the intermediate member 1002 and in subsequent processes. The support substrate 1102 is made of a material appropriate to the various stresses during the process. The buffer member 1101 is positioned between the intermediate member 1002 and the support substrate 1102. The buffer member 1101 may consist of multiple layers, for example, a layer containing adhesive to fix the intermediate member 1002 to the support substrate 1102, or to absorb stress due to differences in the coefficient of thermal expansion between the substrate 10 and the support substrate 1102.

[0063] As shown in Figure 5B, a covering member 1040 is placed on the intermediate member 1002. A covering member 1040 is placed for each light-emitting element 30. The covering member 1040 placed for each light-emitting element 30 is positioned to cover the light extraction surface 30S, the side surface 30L, the first surface 12a, and the wiring layer 20. For example, a resist is used for the covering member 1040. An acrylic resin or the like is used as the material for the resist. In the process of placing the covering member 1040, the covering member 1040 is formed by applying an uncured resist material so as to embed the light-emitting elements 30 and then curing it.

[0064] As shown in Figure 6A, the light-shielding members 1050 are positioned to fill the gaps between the covering members 1040. The light-shielding members 1050 are also positioned on top of the covering members 1040. The light-shielding members 1050 are positioned to cover the entire intermediate member 1002. In the process of positioning the light-shielding members 1050, for example, a thermosetting resin is placed over the entire intermediate member 1002 and cured by heating to form the light-shielding members 1050.

[0065] As shown in Figure 6B, the light-shielding member 1050 is cut from the top side until the covering member 1040 is exposed from the light-shielding member 1050. By cutting the light-shielding member 1050, the top surface 50T of the light-shielding member 50 after cutting is flattened. In addition, in the process of forming the light-shielding member 1050 described in relation to Figure 6A, it is also possible to omit the placement of the light-shielding member 1050 on the covering member 1040. In that case, the step of cutting the light-shielding member 1050 can be omitted.

[0066] As shown in Figure 7A, the covering member 1040 is removed, and an intermediate member (first intermediate member) 1001 is formed. The intermediate member 1001 is a member on which a light-shielding member 50 having a hole 55 is arranged on the first surface 12a. In other words, the intermediate member 1001 includes the substrate 10, the wiring layer 20, the light-emitting element 30, and the light-shielding member 50.

[0067] Dry etching, for example, is used to remove the covering member 1040. By removing the covering member by dry etching, the inner circumferential surface 55W of the hole 55 can be made almost perpendicular to the first surface 12a, making it easier to form the gap 40. A hole 55 is formed where the covering member 1040 has been removed. Inside the hole 55, the light-emitting element 30, the first surface 12a, and the wiring layer 20 are exposed.

[0068] In the manufacturing of the light-emitting module 100, the intermediate component 1002 may be manufactured at a separate plant, for example, and the subsequent processes may be carried out as described above. Alternatively, the intermediate component 1001 may be manufactured at a separate plant, for example, and the subsequent processes may be carried out as described below. The intermediate components 1001 and 1002 may be purchased from a separate plant, and the purchased intermediate components 1001 and 1002 may be used in their respective subsequent processes.

[0069] As shown in Figure 7B, a first light-transmitting member 1060 is prepared by attaching it to a release member 1064, and the first light-transmitting member 1060 and the release member 1064 are placed on the upper surface 50T of the light-shielding member 50. The release member 1064 is a sheet-like resin member that functions as a support member for the first light-transmitting member 1060. For example, the first light-transmitting member 1060 is a phosphor sheet containing a wavelength conversion member 70.

[0070] The first translucent member 1060 is a thermosetting resin material. In its room temperature state, when attached to the release member 1064, the first translucent member 1060 is not hardened and can be deformed by external force. Furthermore, the first translucent member 1060 softens when heated at a temperature lower than a predetermined curing temperature and hardens when heated at a predetermined curing temperature for a predetermined time. In its softened state, it becomes easily deformed by external force. The release member 1064 has a layer of adhesive on the surface to which the first translucent member 1060 is placed, and the first translucent member 1060 is attached to it.

[0071] The first light-transmitting member 1060 and the release member 1064 are arranged so that the side of the first light-transmitting member 1060 is in contact with the upper surface 50T. For example, if an adhesive or the like is applied to the upper surface 50T in advance, the first light-transmitting member 1060 and the release member 1064 are arranged on the upper surface 50T so as to cover the hole 55.

[0072] As shown in Figure 8A, the release agent 1064 is removed. The adhesive force between the release agent 1064 and the first translucent member 1060 is set to be weaker than the adhesive force between the first translucent member 1060 and the upper surface 50T. Therefore, the release agent 1064 can be easily peeled off the first translucent member 1060.

[0073] As shown in Figure 8B, the intermediate member 1001 is placed in a chamber 2001 with internal temperature control. The temperature inside the chamber 2001 is controlled to reach a set temperature in a set time. The temperature inside the chamber 2001 is set to the temperature at which the first translucent member 1060 softens. The set temperature and the time to reach that temperature are appropriately set according to the material of the first translucent member 1060. The temperature set for softening the first translucent member 1060 is, for example, between approximately 60°C and 100°C. The temperature set for hardening the first translucent member 1060 is, for example, between approximately 120°C and 180°C.

[0074] In the softened first translucent member 1060, the portion located approximately in the center of the hole 55 hangs down towards the light-emitting element 30 due to its own weight. The portion of the first translucent member 1060 located approximately in the center of the hole 55 hangs down to the light-emitting element 30 and covers the light-extracting surface 30S. The temperature inside the chamber 2001 is raised to the curing temperature, and the first translucent member 1060 is cured with the first translucent member 1060 covering the light-extracting surface 30S to form the convex body 62. This forms the first translucent member 60 having the convex body 62.

[0075] In the process of softening and hardening the first translucent member 1060, the temperature and time inside the chamber 2001 are set so that the shape of the outer circumference of the hanging portion of the first translucent member becomes a frustum with a diameter increasing in the positive direction of the Z axis. In the process of softening and hardening the first translucent member 1060, the temperature and time inside the chamber 2001 are set so that a gap 40 is formed between the outer surface 62W of the convex body 62 and the inner surface 55W of the light-shielding member 50. The temperature and time for softening may be set in multiple stages between room temperature and the hardening temperature, or the temperature for softening may be continuously changed at a set temperature rise time.

[0076] From the viewpoint of controlling the overall temperature of the intermediate member 1001 on which the first translucent member 1060 is placed, it is preferable to carry out the process using the chamber 2001 as described above. More simply, the process of softening and hardening the first translucent member 1060 may be carried out by placing the intermediate member 1001 on a temperature-controllable stage and appropriately setting the temperature of the stage.

[0077] Figures 9A and 9B are schematic cross-sectional views illustrating modified examples of the manufacturing method of the light-emitting module according to the first embodiment. The method for forming the convex body 62 of the first translucent member 60 is not limited to the method described above, but may also be the method described below. In this modified manufacturing method, the same process is applied up to the manufacturing process described in relation to Figure 8A. That is, the process up to attaching the first translucent member 1060 to the intermediate member 1001 is the same, and the manufacturing process from Figure 9A onwards, described below, is performed after the process shown in Figure 8A.

[0078] As shown in Figure 9A, the intermediate member 1001 to which the first translucent member 1060 is attached is placed inside the chamber 2002. A pump 2003 is fluidly connected to the chamber 2002 via piping 2004. The air pressure inside the chamber 2002 can be reduced to a desired value and returned to atmospheric pressure by the pump 2003 and piping 2004.

[0079] After placing the intermediate member 1001, to which the first translucent member 1060 is attached, inside the chamber 2002, the air inside the chamber 2002 is exhausted by the pump 2003 and the piping 2004. The exhaust reduces the pressure inside the chamber 2002. In other words, the area around the intermediate member 1001 to which the first translucent member 1060 is attached is reduced in pressure. The inside of the hole 55, which is blocked by the first translucent member 1060, is also reduced in pressure to the same extent as inside the chamber 2002.

[0080] As shown in Figure 9B, after the air pressure inside the chamber 2002 reaches a predetermined value, air is reintroduced into the chamber 2002 to increase the air pressure P1 inside the chamber 2002. At this time, the air pressure P2 inside the hole 55 blocked by the first translucent member 1060 becomes lower than the air pressure P1 inside the chamber 2002. Therefore, the first translucent member 1060 is subjected to a pressure directed towards the inside of the hole 55, approximately equal to the difference between air pressures P1 and P2. As a result, the first translucent member 1060 is formed with a portion 1062 that is deformed in a convex shape toward the hole 55. In Figure 9B, the length of the arrow schematically represents the magnitude of air pressures P1 and P2.

[0081] As shown in Figure 10, the first translucent member 60 having a convex body 62 is formed by returning the air pressure in the chamber 2002 to atmospheric pressure over a predetermined period of time. The convex body 62 is positioned on the light extraction surface 30S inside the hole 55.

[0082] In the step of arranging the convex body 62 inside the hole 55, preferably, by controlling the temperature inside the chamber 2002 when returning the air pressure inside the chamber 2002 from a reduced pressure state to atmospheric pressure, the convex body 62 can be more reliably formed and placed on the light extraction surface 30S.

[0083] Specifically, as explained in relation to Figures 7A to 8B, the material of the first translucent member 1060 is made capable of being softened and hardened by temperature control, and the temperature inside the chamber 2002 is made controllable. Furthermore, by gradually or continuously changing the temperature inside the chamber 2002 before returning the air pressure inside the chamber 2002 from a reduced pressure state to atmospheric pressure, the formation of the portion 1062 that is drawn into the hole 55 can be facilitated. As a result, a convex body 62 having an appropriate outer surface 62W shape is formed. For temperature control of the first translucent member and the intermediate member 1001, instead of controlling the temperature inside the chamber 2002, a chamber equipped with a temperature-controllable stage may be used, and the first translucent member 1060 and the intermediate member 1001 may be placed on the stage.

[0084] The process for forming the convex body 62 of the first translucent member 60 is not limited to the above. For example, depending on the arrangement of the hole 55 and the light-emitting element, a member with the convex body 62 pre-formed on the surface of the first translucent member 60 may be prepared.

[0085] Subsequently, the support substrate 1102 is removed using a laser lift-off or the like. The buffer member 1101 may be removed after or simultaneously with the removal of the support substrate 1102.

[0086] The effects of the light-emitting module 100 according to this embodiment will be explained. In the light-emitting module 100, a gap 40 is positioned between the inner circumferential surface 55W of the hole 55 and the light-emitting element 30. The gap 40 covers at least the wiring layer 20. The gap 40 is, for example, a layer of air. The gap 40 has a refractive index lower than that of the other components constituting the light-emitting module 100. Even if the wiring layer 20 is made of a metal material that has a light-absorbing effect, light emitted from the light-emitting element 30, except for the upward direction, is less likely to enter the gap 40, which is a layer of air, and is totally reflected into the interior of the light-emitting element 30. Therefore, the totally reflected light becomes light emitted upward from the light-emitting element 30. Consequently, the light extraction efficiency for each light-emitting element 30 is improved, the brightness of the light-emitting module 100 is improved, and power consumption is reduced.

[0087] Preferably, the light-emitting element 30 has a light-reflective film 34 on its side surface 30L. Therefore, since the emission of light from the side surface 30L is suppressed in the light-emitting element 30, the light extraction efficiency for each light-emitting element 30 is further improved.

[0088] A technique is known to improve the light extraction efficiency of a light-emitting element by providing a pillar on the light-emitting element that guides the light emitted from the element, and a lens portion on the side of the pillar having a different refractive index than the pillar (see Patent Document 1). However, with this technique, it is difficult to reduce the refractive index of the lens portion to a value close to the refractive index of vacuum, and there are limitations to improving the light extraction efficiency. In contrast, in the light-emitting module 100 according to this embodiment, the refractive index of the gap 40 is sufficiently close to the refractive index of vacuum, so that most of the light emitted from the light-emitting element 30 can be converted into upward light.

[0089] In the light-emitting module 100 according to this embodiment, a gap 40 can be formed between the inner circumferential surface 55W of the hole 55 and the light-emitting element 30 by forming a convex body 62. As explained in relation to Figures 7A to 8B, the convex body 62 can be easily formed by utilizing the property of the base material constituting the first light-transmitting member 60 to soften with heat or its thermosetting properties. By appropriately selecting the material of the base material, it is also possible to utilize the plasticity of the base material constituting the first light-transmitting member 60 and apply pressure due to atmospheric pressure changes, as explained in relation to Figures 9A to 10. Since these processes do not require specialized equipment, the light-emitting module 100 according to this embodiment can be easily manufactured.

[0090] (Second embodiment) (Configuration of the light-emitting module 200) Figure 11 is a schematic cross-sectional view illustrating a light-emitting module according to the second embodiment. As shown in Figure 11, the light-emitting module 200 according to this embodiment comprises a substrate 10, a plurality of light-emitting elements 30, a plurality of gaps 40, a light-shielding member 50, a first light-transmitting member 60, and a second light-transmitting member 260. In this embodiment, the light-emitting module 200 differs from the first embodiment in that it includes a second light-transmitting member 260 between the first light-transmitting member 60 and the light-emitting element 30, and the convex bodies 62,262 are formed by the first light-transmitting member 60 and the second light-transmitting member 260, respectively. The configuration of the light-emitting module 200 according to this embodiment is otherwise the same as the configuration of the light-emitting module 100 according to the first embodiment, and the same reference numerals are used for the same components, and detailed descriptions are omitted as appropriate.

[0091] The second light-transmitting member 260 is positioned between the first light-transmitting member 60 and the light-emitting element 30. More specifically, the second light-transmitting member 260 is positioned between the first light-transmitting member 60 and the light-extracting surface 30S. The second light-transmitting member 260 is also positioned between the first light-transmitting member 60 and the gap 40. The second light-transmitting member 260 is also positioned between the first light-transmitting member 60 and the upper surface 50T of the light-shielding member 50.

[0092] The first light-transmitting member 60 has a convex body 62. The second light-transmitting member 260 has a convex body 262. The two convex bodies 62 and 262 are arranged on the light-emitting element 30 inside the hole 55. The convex body 262 is in contact with the light extraction surface 30S. The convex body 262 has an outer peripheral surface 262W inside the hole 55. The shape of the outer peripheral surface 262W is a frustum, where the diameter in the XY plane view decreases as it approaches the light extraction surface 30S. In this example, the shape of the frustum in the XY cross-sectional view is a square with rounded corners. The frustum formed by the outer peripheral surface 262W is the same as in the first embodiment and can have any shape such as a circle, ellipse, polygon, etc., and may have partially irregular indentations or bulges.

[0093] The second light-transmitting member 260 has a layer of adhesive on the side having the convex body 262. Therefore, the outer peripheral surface 262W of the convex body 262 is the layer of adhesive. The second light-transmitting member 260 also has a layer of adhesive on the side where the first light-transmitting member 60 is located. The first light-transmitting member 60 is fixed to the second light-transmitting member 260 via this layer of adhesive. In other words, the first light-transmitting member 60 is positioned and fixed on the light-extracting surface 30S via the second light-transmitting member 260, and is positioned and fixed on the upper surface 50T of the light-shielding member 50 via the second light-transmitting member 260.

[0094] The gap 40 is positioned between the light-emitting element 30 and the inner circumferential surface 55W of the hole 55, covering the wiring layer 20. More specifically, the gap 40 is positioned between the side surface 30L of the light-emitting element 30 and the inner circumferential surface 55W. The gap 40 is also positioned between the inner circumferential surface 55W and the outer circumferential surface 262W of the convex body 262. Preferably, in an XY plan view, the gap 40 is positioned around the outer circumference of the side surface 30L of the light-emitting element 30.

[0095] (Operation of the light-emitting module 200) In the light-emitting module 200 according to this embodiment, the function and operation of the gap 40 are the same as in the first embodiment, and therefore will not be described. In the light-emitting module 200 according to this embodiment, the second light-transmitting member 260 is positioned between the first light-transmitting member 60 and the light-emitting element 30. In other words, the second light-transmitting member 260 functions as an optical member that optically couples the light-emitting element 30 and the first light-transmitting member 60. Light emitted upward from the light-emitting element 30 is incident on the first light-transmitting member 60, which includes the wavelength conversion member 70, via the second light-transmitting member 260. The light emitted from the light-emitting element 30 and incident on the second light-transmitting member 260 is diffused by the second light-transmitting member 260 and converted into a light distribution with a wider angle. As a result, the brightness unevenness of the light is reduced for each light-emitting element 30, and a light-emitting module 200 with less brightness unevenness is realized.

[0096] (Manufacturing method for the light-emitting module 200) Figures 12A to 13B are schematic cross-sectional views illustrating a method for manufacturing a light-emitting module according to a second embodiment. In the manufacturing method of the light-emitting module 200 according to this embodiment, the process is the same up to the step of preparing the intermediate member 1001, which was described in relation to Figure 7A. The steps from Figure 12A onward, which will be described below, are performed following the steps shown in Figure 7A.

[0097] As shown in Figure 12A, the first translucent member 1060 is attached to the second translucent member 1260, and the first translucent member 1060 and the second translucent member 1260 are placed on the intermediate member 1001. The first translucent member 1060 is placed on the upper surface 50T of the light-shielding member 50 via the second translucent member 1260. The first translucent member 1060 and the second translucent member 1260 are placed on the intermediate member 1001 so as to cover the hole 55.

[0098] The intermediate member 1001, on which the first translucent member 1060 and the second translucent member 1260 are arranged, is placed inside the chamber 2002. The chamber 2002 is the same as that described in relation to Figures 9A to 10 and is fluidly connected to the pump 2003 via piping 2004.

[0099] As shown in Figure 12B, the air in the chamber 2002 is exhausted by the piping 2004 and the pump 2003. Due to the exhaust of air from the chamber 2002, the air pressure inside the hole 55, which is blocked by the first translucent member 1060 and the second translucent member 1260, is reduced along with the air pressure inside the chamber 2002.

[0100] As shown in Figure 13A, after the atmospheric pressure inside the chamber 2002 reaches a predetermined value, by reintroducing air into the chamber 2002, the atmospheric pressure P3 inside the chamber 2002 becomes higher than the atmospheric pressure P4 inside the hole 55, which is blocked by the first translucent member 1060b and the second translucent member 1260b. Therefore, the first translucent member 1060b and the second translucent member 1260b are pressed toward the inside of the hole 55 by a pressure based on the difference between atmospheric pressures P3 and P4. In Figure 13A, the length of the arrow schematically represents the magnitude of atmospheric pressures P3 and P4.

[0101] As shown in Figure 13B, the convex bodies 62 and 262 are formed by appropriately setting the atmospheric pressures P3 and P4. As in the first embodiment, the convex bodies 62 and 262 can be formed more reliably by making the first translucent member 60 and the second translucent member 260 from materials that soften and harden with temperature.

[0102] Instead of the step of forming the convex bodies 62,262 using the pressure-controllable chamber 2002 described above, the step of forming the convex bodies 62,262 may be performed using the temperature-controllable chamber 2001, as explained in relation to Figures 7A to 8B.

[0103] The effects of the light-emitting module 200 according to this embodiment will be explained. The light-emitting module 200 according to this embodiment has the same effects as the light-emitting module 100 according to the first embodiment. In addition, it has the following effects. The light-emitting module 200 according to this embodiment includes a second light-transmitting member 260 between the first light-transmitting member 60 and the light-emitting element 30. As described in the operation of the light-emitting module 200, the second light-transmitting member 260 optically couples the light-emitting element 30 to the first light-transmitting member 60, so that the light emitted from the light extraction surface 30S spreads out within the second light-transmitting member 260 before reaching the first light-transmitting member 60. This reduces the in-plane brightness unevenness in the XY plane view for each light-emitting element 30. Therefore, a light-emitting module 200 with less brightness unevenness can be realized.

[0104] The second light-transmitting member 260 may have a sheet-like base material with two sides and adhesive layers on both sides of the base material. Therefore, the first light-transmitting member 60 can be placed on one side and easily fixed. Alternatively, the first light-transmitting member 60 and the second light-transmitting member 260 can be placed on the upper surface 50T of the light-shielding member 50 and easily fixed to the upper surface 50T with the other side of the second light-transmitting member 260. Therefore, the process of applying adhesive to fix the first light-transmitting member 60 to the upper surface 50T can be omitted, and the manufacturing period for the light-emitting module 200 can be shortened.

[0105] In the light-emitting module 200 according to this embodiment, the convex bodies 62,262 can be formed using general-purpose equipment, as in the case of the first embodiment.

[0106] (Third embodiment) (Configuration of the light-emitting module 300) Figure 14 is a schematic cross-sectional view illustrating a light-emitting module according to the third embodiment. As shown in Figure 14, the light-emitting module 300 according to this embodiment comprises a substrate 10, a plurality of light-emitting elements 30, a plurality of gaps 40, a light-shielding member 50, a first light-transmitting member 60, and a second light-transmitting member 360. In this embodiment, the configuration of the second light-transmitting member 360 differs from that of the other embodiments described above. The other configurations are the same as in the other embodiments, and the same reference numerals are used for the same components, and detailed descriptions are omitted as appropriate.

[0107] The second light-transmitting member 360 has a support portion 361 and a plurality of convex bodies 362. The plurality of convex bodies 362 are each arranged inside a plurality of holes 55. The support portion 361 is arranged on the plurality of convex bodies 362. The support portion 361 is arranged on the upper surface 50T of the light-shielding member 50. The support portion 361 is also arranged on the holes 55.

[0108] The second translucent member 360 is formed of, for example, a translucent resin material. Examples of translucent resin materials include silicone resin and epoxy resin. The support portion 361 and the plurality of convex bodies 362 are formed of the same material as the second translucent member 360, and are formed, for example, as a single unit.

[0109] The convex body 362 is positioned on the light-emitting element 30 inside the hole 55, and the lower end of the convex body 362 is in contact with the light extraction surface 30S. The convex body 362 covers almost the entire light extraction surface 30S, except for the vicinity of the outer periphery in an XY plan view of the light extraction surface 30S. It is preferable that the convex body 362 covers the entire surface of the light extraction surface 30S.

[0110] The outer surface 362W of the convex body 362 is approximately square in XY plane view and has the shape of the side surface of a rectangular prism. The shape of the outer surface 362W in XY plane view is approximately the same along the Z axis. The shape of the outer surface 362W in XY plane view is not limited to a square, but may be other polygons including a square, or it may be a circle or an ellipse. The shape of the outer surface 362W in XY plane view is not limited to a square, but may be any other shape as long as a gap 40 is formed between the outer surface 362W and the inner surface 55W of the hole 55.

[0111] The gap 40 is positioned between the inner circumferential surface 55W of the hole 55 and the side surface 30L of the light-emitting element 30, covering the wiring layer 20. As with the other embodiments described above, it is preferable that the gap 40 is positioned along the outer circumference of the side surface 30L in an XY plan view. The gap 40 is also positioned between the inner circumferential surface 55W and the outer circumferential surface 362W of the convex body 362. The gap 40 has a refractive index lower than that of the other components other than the gap 40. The gap 40 is, for example, a layer of air.

[0112] (Operation of the light-emitting module 300) The light-emitting module 300 according to this embodiment operates in the same manner as the light-emitting modules 100 and 200 according to the other embodiments described above, so a detailed explanation is omitted.

[0113] (Manufacturing method for the light-emitting module 300) In the light-emitting module 300 according to this embodiment, the process is the same up to the step of preparing the intermediate member 1001, which was described in relation to Figure 7A. The steps described below are performed following the steps shown in Figure 7A. In the light-emitting module 300 according to this embodiment, a second light-transmitting member 360 is prepared. The second light-transmitting member 360 can be formed in advance using a encapsulated mold or the like, to have a plurality of convex bodies 362. The prepared second light-transmitting member 360 is placed on the intermediate member 1001. In the step of placing the second light-transmitting member 360, the second light-transmitting member 360 is fixed by placing the lower ends of the convex bodies 362 on the light extraction surface 30S, for example, using an adhesive, and is then fixed by placing it on the upper surface 50T of the light-shielding member 50.

[0114] Since the shape of the outer circumferential surface 362W of the convex body 362 is pre-formed to match the shape of the inner circumferential surface 55W of the hole 55, a gap 40 is reliably positioned between the inner circumferential surface 55W and the outer circumferential surface 362W.

[0115] The effects of the light-emitting module 300 according to this embodiment will be explained. The light-emitting module 300 according to this embodiment has the same effects as those of the other embodiments described above. In addition, the light-emitting module 300 according to this embodiment includes a second translucent member 360 which includes a convex body 362 having substantially the same diameter along the Z-axis. Therefore, the gap 40 between the inner circumferential surface 55W of the hole 55 and the outer circumferential surface 362W of the convex body 362 can be formed stably and reliably. This makes it possible to achieve a high yield and contribute to reducing the cost of the light-emitting module 300.

[0116] (Fourth embodiment) (Configuration of light-emitting module 400) Figure 15 is a schematic cross-sectional view illustrating a light-emitting module according to the fourth embodiment. As shown in Figure 15, the light-emitting module 400 according to this embodiment comprises a substrate 10, a plurality of light-emitting elements 30, a plurality of gaps 40, a light-shielding member 50, a first light-transmitting member 60, and a plurality of convex bodies 462. The light-emitting module 400 according to this embodiment differs from the other embodiments described above in that it comprises a plurality of convex bodies 462. In other respects, the light-emitting module 400 according to this embodiment is the same as the other embodiments described above, and the same reference numerals are used for the same components, and detailed descriptions are omitted as appropriate.

[0117] Multiple convex bodies 462 are each arranged inside multiple holes 55. Multiple convex bodies 462 are arranged on multiple light-emitting elements 30. The convex bodies 462 are arranged in contact with the light extraction surface 30S, and preferably cover most of the light extraction surface 30S.

[0118] The shape of the outer circumferential surface 462W of the convex body 462 is a flattened sphere that has been compressed vertically. Therefore, the shape of the outer circumferential surface 462W in an XY plane view has different diameters from the entrance of the hole 55 toward the light extraction surface 30S. The shape of the outer circumferential surface 462W in an XY plane view has a diameter that gradually increases toward the negative direction of the Z axis, and becomes smaller as it approaches the light extraction surface 30S. The outer circumferential surface 462W does not need to be a smooth sphere, as it only needs to be able to form a gap 40 with the inner circumferential surface 55W.

[0119] The convex body 462 is formed of a light-transmitting material. Therefore, light emitted from the light extraction surface 30S passes through the convex body 462. The convex body 462 is formed of, for example, a light-transmitting resin material, such as silicone resin.

[0120] The first light-transmitting member 60 is arranged on a plurality of convex bodies 462. The first light-transmitting member 60 is positioned to cover the hole 55 and is also positioned on the upper surface 50T of the light-shielding member 50.

[0121] The gap 40 is positioned between the inner circumferential surface 55W of the hole 55 and the outer circumferential surface 462W of the convex body 462, covering the wiring layer 20. The gap 40 is also positioned between the side surface 30L of the light-emitting element 30 and its outer circumferential surface 462W.

[0122] (modified version) Figures 16A to 16C are schematic cross-sectional views illustrating a modified light-emitting module according to the fourth embodiment. In the modified examples shown in Figures 16A to 16C, the convex body 462 of the light-emitting module 400 of the fourth embodiment is provided with a convex body of a different shape, which is different from the fourth embodiment. In other respects, it is the same as the fourth embodiment, and the same reference numerals are used for the same components, and detailed descriptions are omitted.

[0123] As shown in Figure 16A, the light-emitting module 400a includes a convex body 462a. The convex body 462a of the light-emitting module 400a in this modified example is a flattened sphere with a larger diameter in the XY plane view than the convex body 462 in the fourth embodiment. The convex body 462a is positioned between the first light-transmitting member 60 and the light-emitting element 30. The convex body 462a is positioned in contact with the light-extracting surface 30S of the light-emitting element 30 and covers the entire surface of the light-extracting surface 30S.

[0124] The convex body 462a also covers the side surface 30L of the light-emitting element 30. Therefore, the gap 40 is positioned to cover the wiring layer 20 between the inner circumferential surface 55W of the hole 55 and the outer circumferential surface 462aW of the convex body 462a.

[0125] The convex body 462a is translucent and is formed of the same material as in the fourth embodiment.

[0126] In this modified example, since the convex body 462a covers the light-emitting surface 30S and the side surface 30L of the light-emitting element 30, light emitted laterally from the light-emitting element 30 and light directed laterally from near the outer edge of the light-emitting surface 30S are totally reflected in the gap 40 and converted into light directed upward.

[0127] As shown in Figure 16B, the light-emitting module 400b includes a convex body 462b. In this modified example, the convex body 462b of the light-emitting module 400b is columnar. The shape of the outer peripheral surface 462bW of the convex body 462b in an XY plane view is substantially the same along the Z axis. In this modified example, the convex body 462b covers a portion of the central part of the light extraction surface 30S in an XY plane view. Therefore, the length of the gap 40 between the inner peripheral surface 55W of the hole 55 and the outer peripheral surface 462bW is longer than in the other embodiments and modified examples described above. In this case, light emitted from the portion of the light extraction surface 30S that is not covered by the convex body 462b is emitted into the gap 40. Because the gap 40 has a lower refractive index than the convex body 462b, some of the light incident on the gap 40 is more likely to be incident on the convex body 462b, and most of the light incident on the convex body 462b is extracted upwards.

[0128] As shown in Figure 16C, the light-emitting module 400c is equipped with a convex body 462c. The convex body 462c of the light-emitting module 400c in this modified example has a frustoconical shape. In an XY plan view, the diameter of the outer surface 462cW of the convex body 462c decreases as it approaches the light extraction surface 30S from the entrance of the hole 55.

[0129] In this example, the convex body 462c covers the entire surface of the light extraction surface 30S and also covers the side surface 30L. The gap 40 covers the wiring layer 20 between the inner circumferential surface 55W of the hole 55 and the outer circumferential surface 462cW of the convex body 462c. Therefore, of the light emitted from the light-emitting element 30, the light radiated to the sides is confined by the convex body 462c and converted into upward light inside the light-emitting element 30 before being radiated.

[0130] (Manufacturing method for light-emitting modules 400, 400a~400c) An intermediate member 1001, as described in relation to Figure 7A, is prepared. The convex body 462 is formed directly within the hole 55 of the intermediate member 1001, for example, using a technique for forming minute particles. Techniques for forming minute particles include, for example, printing, inkjet, or potting. The technique for forming minute particles is selected appropriately depending on the diameter of the hole 55 in the XY plane view, the thickness of the light-shielding member 50, or, as an example, the shape of the convex body described above.

[0131] In the intermediate member 1001 on which the convex body 462 is formed, the first light-transmitting member 60 is positioned and fixed on the upper surface 50T of the light-shielding member 50 and on the convex body 462.

[0132] The effects of the light-emitting module 400 according to this embodiment and its modified light-emitting modules 400a to 400c will be described below. The light-emitting module 400 according to this embodiment and its modified light-emitting modules 400a to 400c have the same effects as the light-emitting module 100 according to the first embodiment described above. In addition, the light-emitting module 400 according to this embodiment includes a convex body 462 which is a flattened sphere. The convex body 462 is translucent and provides a path for the light emitted from the light-emitting element 30. The light from the light-emitting element 30 is spread out at a wide angle by the convex body 462 and incident on the first translucent member 60, so that the brightness of each light-emitting element 30 is made more uniform.

[0133] By arranging convex bodies as shown in each modified example, depending on the structure of the light-emitting element 30, it becomes possible to achieve appropriate light distribution.

[0134] (Fifth embodiment) (Configuration of Light-Emitting Module 500) Figure 17 is a schematic cross-sectional view illustrating a light-emitting module according to the fifth embodiment. As shown in Figure 17, the light-emitting module 500 according to this embodiment comprises a substrate 10, a plurality of light-emitting elements 30, a plurality of gaps 40, a light-shielding member 50, a third light-transmitting member 563, a fourth light-transmitting member 564, and a plurality of convex bodies 462. The configuration of the light-emitting module 500 according to this embodiment differs from the configuration of the light-emitting module 400 according to the fourth embodiment in that it includes a third light-transmitting member 563. The fourth light-transmitting member 564 is the same as the first light-transmitting member 60 in the other embodiments described above. The convex bodies 462 are the same as the convex bodies 462 in the fourth embodiment. Other components can also be the same as in the other embodiments described above, and the same reference numerals are used for the same components, and detailed descriptions are omitted as appropriate.

[0135] The convex body 462 is positioned on the light-emitting element 30 inside the hole 55, as in the fourth embodiment. The shape of the outer circumferential surface 462W of the convex body 462 may be adapted to any of the modifications of the fourth embodiment. The convex body 462 is made of a translucent material and, together with the third translucent member 563, functions as a member that optically couples the light-emitting element 30 with the fourth translucent member 564 which includes the wavelength conversion member 70.

[0136] The third light-transmitting member 563 is positioned on the upper surface 50T of the light-shielding member 50 and on the convex body 462. More specifically, the third light-transmitting member 563 is positioned between the fourth light-transmitting member 564 and the upper surface 50T, and is positioned to cover the hole 55. The third light-transmitting member 563 is made of the same material and has the same structure as the second light-transmitting member 260 in the second embodiment. That is, the third light-transmitting member 563 has adhesive layers on both sides, and the fourth light-transmitting member 564 is positioned on one side via the adhesive layer. The third light-transmitting member 563 is positioned and fixed on the upper surface 50T of the light-shielding member 50 via the adhesive layer on the other side, and is positioned and fixed on the convex body 562.

[0137] The light-emitting module 500 according to this embodiment operates in the same manner as in the other embodiments described above.

[0138] The light-emitting module 500 according to this embodiment can be manufactured in the same manner as in the other embodiments described above. That is, the intermediate member 1001 shown in Figure 7A is prepared, and the convex body 462 is directly formed inside the hole 55. Then, as described in relation to Figure 12A, the third translucent member 563, to which the fourth translucent member 564 is attached, is placed on the intermediate member 1001 on which the convex body 462 is formed.

[0139] According to the embodiments described above, it is possible to realize a light-emitting module with improved light extraction efficiency and a method for manufacturing the light-emitting module.

[0140] Although several embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. Furthermore, the embodiments described above can be implemented in combination with each other. [Explanation of Symbols]

[0141] 10 Substrate, 12 Support member, 14 Reinforcement substrate, 20 Wiring layer, 30 Light-emitting element, 40 Gap, 50 Light-shielding member, 55 Hole, 55W Inner surface, 60 First light-transmitting member, 62, 262, 362, 462, 462a~462c Convex body, 62W, 262W, 362W, 462W, 462aW~462cW Outer surface, 70 Wavelength conversion member, 100, 100a, 200, 300, 400, 400a~400c, 500 Light-emitting module, 260, 360 Second light-transmitting member, 563 Third light-transmitting member, 564 Fourth light-transmitting member, 1001, 1002 Intermediate member, 1040 Covering member, 1050 Light-shielding member, 1060 First translucent member

Claims

1. A substrate comprising a support member having a first surface and a wiring layer disposed on the first surface, A light-shielding member disposed on the first surface and having a plurality of holes in a plan view, A plurality of light-emitting elements are arranged inside the plurality of holes on the first surface and electrically connected to the wiring layer, A first light-transmitting member having a plurality of convex bodies arranged inside the plurality of holes, each on the light extraction surface of the plurality of light-emitting elements, A plurality of gaps are arranged between the plurality of light-emitting elements and the inner circumferential surface of the plurality of holes, in contact with the wiring layer, Equipped with, The convex body is a light-emitting module in contact with the light extraction surface of the light-emitting element.

2. In plan view, The plurality of gaps each surround the outer circumference of the side surface of the plurality of light-emitting elements, The light-emitting module according to claim 1, wherein the inner circumferential surfaces of the plurality of holes surround the outer circumferential surfaces of the plurality of light-emitting elements through the plurality of gaps.

3. The light-emitting module according to claim 1 or 2, wherein the shape of each of the outer surfaces of the plurality of convex bodies is selected from a prism, cylinder, elliptical cylinder, sphere and ellipsoid, and a frustum of a pyramidal pyramid, a frustum of a cone and a frustum of an elliptical pyramid having a smaller diameter closer to the light extraction surface.

4. The light-emitting module according to any one of claims 1 to 3, wherein the first light-transmitting member includes a wavelength conversion member.

5. The light-emitting module according to claim 4, wherein the plurality of convex bodies include the wavelength conversion member.

6. The first light-transmitting member further includes a second light-transmitting member arranged on the plurality of convex bodies, The light-emitting module according to claim 4, wherein the second light-transmitting member includes the wavelength conversion member.

7. The first light-transmitting member includes a third light-transmitting member disposed on the convex body and a fourth light-transmitting member disposed on the third light-transmitting member. The light-emitting module according to claim 4, wherein the fourth light-transmitting member includes the wavelength conversion member.

8. The light-emitting module according to any one of claims 1 to 7, wherein each of the plurality of light-emitting elements includes a light-reflecting film disposed on the side surface located between the electrode forming surface located on the opposite side of the light extraction surface and the light extraction surface.

9. The light-emitting module according to any one of claims 1 to 8, wherein the convex body is arranged on the surface of the first light-transmitting member facing the light-emitting element, and a recess is provided on the surface of the first light-transmitting member opposite to the convex body.

10. The light-emitting module according to any one of claims 1 to 9, wherein the convex body and the portion of the first light-transmitting member excluding the convex body are formed continuously.

11. A substrate comprising a support member having a first surface and a wiring layer disposed on the first surface, A light-shielding member disposed on the first surface and having a hole in a plan view, A light-emitting element is disposed inside the hole on the first surface and electrically connected to the wiring layer, A first light-transmitting member having a convex body positioned on the light-extracting surface of the light-emitting element inside the hole, A gap is provided between the light-emitting element and the inner circumferential surface of the hole, in contact with the wiring layer. Equipped with, The convex body is a light-emitting module in contact with the light extraction surface of the light-emitting element.

12. The light-emitting module according to claim 11, wherein the convex body is arranged on the surface of the first light-transmitting member facing the light-emitting element, and a recess is provided on the surface of the first light-transmitting member opposite to the convex body.

13. The light-emitting module according to claim 11 or 12, wherein the convex body and the portion of the first light-transmitting member excluding the convex body are formed continuously.

14. A step of preparing a first intermediate member, which includes a substrate having a support member having a first surface and a wiring layer disposed on the first surface, a plurality of light-emitting elements disposed on the first surface spaced apart from each other and connected to the wiring layer, and a light-shielding member having a plurality of holes and each of the plurality of light-emitting elements disposed inside the plurality of holes, A step of arranging a plurality of translucent convex bodies on the upper surface of the plurality of light-emitting elements via the plurality of holes, Equipped with, A method for manufacturing a light-emitting module, wherein in the step of arranging the plurality of convex bodies on the upper surface of the plurality of light-emitting bodies, the convex bodies are brought into contact with the light extraction surface of the light-emitting bodies, and a plurality of gaps in contact with the wiring layer are arranged between the plurality of light-emitting bodies and the inner circumferential surfaces of the plurality of holes.

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