Gas cushion apparatus and technique for substrate coating

Abstract

To provide a gas cushion apparatus and technique for substrate coating.SOLUTION: Coating can be provided on a substrate. Fabrication of the coating can include forming a solid layer in a specified region of the substrate while supporting the substrate in a coating system by using a gas cushion. For example, liquid coating can be printed over the specified region while the substrate is supported by the gas cushion. The substrate can be held for a specified duration after printing patterned liquid. The substrate can be conveyed to a treatment zone while supported by using the gas cushion. The liquid coating can be treated to provide the solid layer while continuing to support the substrate by using the gas cushion.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] (Claim of Priority) This application claims the benefit of priority of each of (1) U.S. Provisional Patent Application No. 61 / 986,868, filed Apr. 30, 2014, entitled "Systems and Methods for the Fabrication of Inkjet Printed Encapsulation Layers", and (2) U.S. Provisional Patent Application No. 62 / 002,384, filed Mar. 23, 2014, entitled "DISPLAY DEVICE FABRICATION SYSTEMS AND TECHNIQUES USING INERT ENVIRONMENT", each of the above applications being hereby incorporated by reference in its entirety.

Background Art

[0002] A material layer can be formed on a substrate to provide one or more functional or non-functional layers of an electronic device, etc. In one approach, a film layer on such a device can be fabricated, in part, via the vacuum deposition of a series of thin films onto the substrate using any of several techniques including, but not limited to, chemical vapor deposition, plasma enhanced chemical vapor deposition, sputtering, electron beam evaporation, and thermal evaporation. However, such vacuum processing is relatively (1) complex and generally involves large vacuum chambers and pump subsystems to maintain such a vacuum; (2) much of the material within such a system is generally deposited on the inner walls and fixtures of the deposition chamber and wasted more than is deposited onto the substrate, so the raw materials being deposited are wasted; and, (3) difficult to maintain, such as involving frequently stopping the operation of the vacuum deposition tool to open the walls and fixtures to sweep away the accumulated wasted material. These problems pose further challenges in the case of substrates having a larger surface area than generally available silicon wafers.

[0003] In some applications, it may be desirable to deposit a film in a specific pattern. Another approach is that blanket coating can be deposited over a substrate, and photolithography can be considered to achieve the desired patterning. However, in various applications, such photolithography processes can damage existing deposited film layers. To directly pattern the deposited layer when using vacuum deposition techniques, so-called shadow masks can be used. In such cases, the shadow mask comprises a physical stencil with cutouts for the deposition area, which can be manufactured, for example, from a metal sheet. The shadow mask is generally aligned on the substrate prior to deposition, placed in close proximity to or in contact with it, kept in place during deposition, and then removed after deposition.

[0004] Such direct patterning using shadow masks adds substantial complexity to vacuum-based deposition techniques, generally involving additional mechanisms and fixation for precisely handling and positioning the mask relative to the substrate, further increasing material waste (due to waste from material deposited on the shadow mask), and further increasing the need for maintenance to continuously wipe and replace the shadow mask. Such thin masks are mechanically unstable over large areas and can limit the maximum size of substrate that can be processed; therefore, in this case again, these problems are particularly difficult for substrates with a larger surface area than generally available silicon wafers. [Overview of the project] [Means for solving the problem]

[0005] Embodiments of the enclosed coating system described herein may be useful for coating substrates in the manufacture of various devices and equipment within a wide range of technical fields, but are not limited to, for example, organic light-emitting diode (OLED) displays, OLED lighting, organic photovoltaics, perovskite solar cells, printed circuit boards, and organic and inorganic semiconductor devices or circuits.

[0006] The inventors recognize that a solid layer can be formed on a substrate at or near ambient pressure at atmospheric pressure, for example, by using a printing technique to cover a specific area of ​​the substrate and deposit liquid ink, and treating the liquid ink to solidify it and provide a solid layer (including supporting the substrate at least partially with a gas cushion during such printing and continuing to support the substrate at least partially with a gas cushion during the liquid ink treatment). The inventors also recognize that in this way, several handling steps can be reduced, for example, to shorten delays, reduce mechanical damage to the substrate during handler engagement, or to improve the uniformity of the solid layer provided by the various embodiments of the coating system taught herein. Various processes that can be performed in embodiments of the coating system taught herein may include holding the substrate for a specific duration after such printing and before liquid ink treatment (including continuing to support the substrate at least partially with a gas cushion during the various processes performed).

[0007] In a broad sense, printing operations can include one or more liquid coating processes such as inkjet printing, nozzle printing, slot die coating (patterned or unpatterned), or screen printing, and liquid inks can include one or more organic materials (e.g., monomers or polymers) or inorganic materials and can include a carrier fluid. Treatment of liquid inks can include one or more of exposure (e.g., one or more of ultraviolet, infrared, or visible light), heating or cooling, or pressure higher than ambient or vacuum. Such treatments can result in the solidification of liquid inks to provide a solid layer through one or more of the following: removal of the carrier fluid (e.g., one or more of drying or vacuum baking, including vacuum drying or vacuum baking), chemical reactions (e.g., crosslinking, or chemical conversion from one compound to another), or densification (e.g., baking, including vacuum baking). The printed layer can cover and pattern or blanket a substrate and can cover or be included as part of a light-emitting device (e.g., a display or lighting panel), a light-absorbing device (e.g., a photodetector or solar cell), a printed circuit assembly, or other electronic device or circuit.

[0008] The inventors recognize that printing techniques and other processing operations can be performed using a system having an enclosure configured to provide a controlled environment (such as an atmosphere containing a gas that is minimally reactive or non-reactive to one or more species, having a specific purity level, which is deposited on or on the substrate being processed, or which comprises the substrate being processed). Such a specific purity level may also include a controlled maximum impurity concentration of species that react with various materials and components of devices manufactured using embodiments of the coating system of this teaching, such as, but not limited to, oxygen, ozone, and water vapor, as well as various organic solvent vapors. Controlling various reactive species to a specific purity level can prevent or reduce the incorporation of impurities into materials and devices manufactured on the substrate during manufacturing, or prevent or suppress defects, which may prevent degradation of materials and devices manufactured on the substrate during manufacturing, or cause, accelerate, or promote degradation of such materials or devices after manufacturing. Particulate matter control can also be provided, for example, to maintain a specific particulate matter level in a controlled environment.

[0009] An array of enclosures may include each module having its own individually maintained and controlled environment, or one or more modules may share a controlled environment with other modules. Equipment such as gas purification, temperature control, solvent removal, or particulate matter control may be shared between modules or provided in a dedicated manner. Various embodiments of gas purification according to this teaching may include maintaining levels of various reactive species, including various reactive atmospheric gases such as water vapor, oxygen, ozone, and organic solvent vapors, at 1000 ppm or lower, for example, 100 ppm or lower, 10 ppm or lower, 1.0 ppm or lower, or 0.1 ppm or lower.

[0010] Various devices, such as electronic or optoelectronic devices, can be manufactured using organic materials, including the use of processing techniques that provide one or more film layers. Organic optoelectronic devices offer enhanced power efficiency and enhanced visual performance compared to other display technologies, and their relatively thin planar structure allows them to be compact in volume. Unlike competing technologies, such devices can be mechanically flexible (e.g., foldable or bendable) or optically transparent. Applications of organic optoelectronic devices can include, for example, general lighting, use as a backlight source, or use as a pixel light source or other element in an electron-emitting display. One type of organic optoelectronic device includes organic light-emitting diode (OLED) devices, which can generate light using electron-emitting organic materials such as small molecules, polymers, fluorescent or phosphorescent materials.

[0011] In the embodiments, the printing operation may include inkjet printing of a liquid ink containing an organic material, and the treatment of the liquid ink may include exposing the liquid ink to light such as ultraviolet (UV) light to cure the liquid ink and provide a solid layer. A curing process, such as UV irradiation, induces a crosslinking reaction, thereby forming a patterned solid layer. For example, the patterned solid layer can cover at least a portion of a light-emitting device or other device fabricated on a substrate. The solid layer can encapsulate a specific region on the substrate, such as being included in a stack of layers that form an encapsulation structure.

[0012] The systems and techniques described herein can be used to assist in processing a variety of different substrate configurations. For example, flat panel display devices can be fabricated, at least in part, using the systems or techniques described herein. Such flat panel display devices may include organic light-emitting diode (OLED) flat panel displays. Some OLED flat panel displays can be processed on a substrate. The use of the words “substrate” or “fabricated substrate” generally refers to an assembly in the process that may contain an OLED device. The embodiments herein are not limited to specific panel geometric shapes or sizes. For example, such systems and techniques can be used to assist in the fabrication of display devices on a substrate having a second-generation ("Gen 2") size, such as having a rectangular geometric shape with dimensions of about 37 cm × about 47 cm. The systems described herein can also be used to slightly larger substrate geometric shapes, such as to assist in the fabrication of display devices on a substrate having a third-generation ("Gen 3.5") substrate size, such as having a rectangular geometric shape with dimensions of about 61 cm × about 72 cm. The systems described herein can also be used for larger substrate geometries, such as to assist in the fabrication of display devices on substrates, with substrate sizes corresponding to "Gen 5.5" substrates having dimensions of approximately 130 cm × 150 cm, or "Gen 7" or "Gen 7.5" substrates having dimensions of approximately 195 cm × 225 cm. For example, a Gen 7 or Gen 7.5 substrate can be singulated (e.g., cut or otherwise separated) into eight 42-inch (diagonal) or six 47-inch (diagonal) flat panel displays. A "Gen 8" substrate may include dimensions of approximately 216 × 246 cm. A "Gen 8.5" substrate may include dimensions of approximately 220 cm × 250 cm and can be singulated to provide six 55-inch or eight 46-inch flat panels per substrate.

[0013] Using the systems and techniques described herein, dimensions exceeding Gen 8.5 can be supported. For example, using at least partially the systems and techniques described herein, a "Gen 10" substrate having dimensions of approximately 285 cm × 305 cm or larger can be fabricated. The panel sizes described herein are generally applicable to glass substrates, but can be applied to substrates of any material suitable for use in OLED display fabrication, which may include forming one or more layers using printing techniques. For example, various glass substrate materials, as well as various polymer substrate materials, such as polyimide, can be used. For example, this application provides the following items. (Item 1) A method for providing a coating on a substrate, wherein the method is The process involves transferring a substrate to a coating system, wherein the coating system is configured to provide a solid layer within a specific region on a first side of the substrate, and the solid layer covers at least a portion of the substrate. The substrate is supported within the coating system by using a gas cushion provided on the second side of the substrate opposite to the specific region, The process involves using a printing system to print a liquid coating over a specific area of ​​the substrate while the substrate is supported by the gas cushion, wherein the substrate is located within the printing zone. The substrate is transported to the treatment zone while the substrate is continuously supported using the gas cushion, By treating the liquid coating within the coating system while continuing to support the substrate using the gas cushion, the solid layer is provided on the substrate within the specific region. Methods that include... (Item 2) The solid layer comprises at least a portion of the encapsulation structure, The method according to item 1, wherein the substrate comprises an electronic device, and the encapsulation structure is established to encapsulate at least a portion of the electronic device on the substrate. (Item 3) The method according to item 1, wherein treating the liquid coating includes polymerizing the liquid coating. (Item 4) The method according to item 1, comprising printing the liquid coating and then holding the substrate for a specific duration while continuing to support the substrate using the gas cushion. (Item 5) To hold the substrate over the specified duration, the substrate is moved into the holding zone. The method described in item 4, including transporting. (Item 6) The method according to item 5, comprising using a retaining zone configured to hold and support a plurality of substrates using the gas cushion. (Item 7) The method according to item 1, wherein treating the liquid coating includes irradiating the liquid coating with light. (Item 8) The method described in item 7, wherein the light includes ultraviolet (UV) light. (Item 9) The method according to item 7, wherein irradiating the liquid coating with light includes baking the liquid coating by radiation. (Item 10) The method according to item 7, wherein irradiating the liquid coating with light is performed to dry the liquid coating by radiation. (Item 11) The method according to item 1, wherein treating the liquid coating includes exposing the substrate to infrared radiation or to a temperature-controlled gas flow, one or more of the above. (Item 12) The specific region on the first side of the substrate overlaps with the active region of the substrate provided with an electronic device, and the gas cushion is provided on the second side of the substrate opposite to the active region, according to the method of item 1. (Item 13) Transporting the substrate includes engaging or gripping the substrate using physical contact with the substrate, according to the method of item 1. (Item 14) The gas cushion is established by pushing gas through the porous ceramic material so as to support the second side of the substrate above the porous ceramic material, according to the method of item 1. (Item 15) The gas cushion within the printing zone is established using a combination of a pressurized gas region and at least a partial vacuum, according to the method of item 1. (Item 16) At least one of the pressurized gas or exhaust gas used to establish the gas cushion is recovered and recycled, according to the method of item 15. (Item 17) A method of providing a coating on a substrate, the method comprising: Transferring the substrate to an enclosed coating system, the enclosed coating system being configured to provide a solid layer within a specific region on the first side of the substrate, the solid layer covering at least a portion of an electronic device fabricated on the substrate; Using a gas cushion provided on the second side of the substrate opposite to the specific region to support the substrate within the enclosed coating system; Printing a liquid coating covering the specific region of the substrate while the substrate is supported by the gas cushion, the substrate being located within a printing zone including a printing system; Transporting the substrate to a treatment zone while continuing to support the substrate using the gas cushion; While continuing to support the substrate using the gas cushion, treating the liquid coating within the treatment zone to provide the solid layer on the substrate within the specific region and a method comprising. (Item 18) The method according to item 17, wherein treating the liquid coating includes one or more of baking or drying the liquid coating to provide the solid layer. (Item 19) The method according to item 18, wherein treating the liquid coating includes one or more of exposing the substrate to infrared radiation or exposing the substrate to a temperature-controlled gas flow. (Item 20) The method according to item 17, wherein treating the liquid coating includes coagulating the liquid coating by one or more of inducing a chemical reaction or removing a carrier fluid contained in the liquid coating. (Item 21) The method according to item 17, wherein the solid layer comprises at least a part of a encapsulation structure established to encapsulate at least a part of the electronic device on the substrate. (Item 22) The method according to item 17, comprising transporting the substrate to a holding zone and holding the substrate for a specific duration while continuing to support the substrate using the gas cushion. (Item 23) A coating system for providing a solid layer on a substrate, the system comprising a platform configured to support the substrate using a gas cushion, the platform being configured to transport the substrate along the platform, and A printing system configured to deposit a liquid coating in a specific area on the first side while the substrate is supported by the gas cushion on the second side of the substrate opposite to the first side of the substrate, when the substrate is located within the printing zone of the platform, When the substrate is located within the treatment zone of the platform, the treatment system is configured to provide a solid layer on the substrate within a specific region by treating the deposited liquid while the substrate is supported by the gas cushion. Equipped with, A coating system wherein the platform is configured to continuously support the substrate during printing operations in the printing zone and during treatment operations in the treatment zone. (Item 24) The solid layer comprises at least a portion of the encapsulation structure, The coating system according to item 23, wherein the substrate comprises an electronic device, and the encapsulation structure is established to encapsulate at least a portion of the electronic device on the substrate. (Item 25) The coating system according to item 23, wherein the treatment system includes a light source, the source is configured to irradiate the liquid coating to provide the solid layer. (Item 26) The coating system according to item 25, wherein the source comprises an ultraviolet (UV) source. (Item 27) The coating system according to item 25, wherein the source comprises an infrared source. (Item 28) The coating system according to item 23, wherein the treatment system is configured to provide the solid layer by baking or drying the liquid coating. (Item 29) The coating system according to item 28, wherein the treatment system is configured to solidify the liquid coating by inducing a chemical reaction or by removing a carrier fluid contained in the liquid coating. (Item 30) The coating system according to item 23, wherein the platform is configured to hold the substrate for a specific duration while continuing to support the substrate using the gas cushion after the printing operation and before the treatment operation. (Item 31) The coating system according to item 30, wherein the platform includes a holding zone separated from the printing zone and the treatment zone, the holding zone being configured to hold the substrate for a specific duration while continuing to support the substrate using the gas cushion. (Item 32) The coating system according to item 23, comprising an enclosure housing the printing system, the treatment system, and the platform, wherein the enclosure is established to remain below specific limits for particulate matter contamination levels, water vapor content, oxygen content, and ozone content in a controlled treatment environment at or near atmospheric pressure. (Item 33) The coating system according to item 23, wherein the particular region on the first side of the substrate overlaps with an active region of the substrate having an electronic device, and the platform is configured to supply gas to the second side of the substrate opposite to the active region. (Item 34) The coating system according to item 23, wherein the platform is configured to transport the substrate by engaging or grasping the substrate using physical contact with the substrate. (Item 35) The coating system according to item 23, wherein the gas cushion is established by pushing gas through the porous ceramic material so as to support the second side of the substrate above the porous ceramic material. [Brief explanation of the drawing]

[0014] [Figure 1] Figure 1 illustrates, in general terms, an embodiment of a plan view of at least a part of the coating system. [Figure 2] Figure 2 illustrates an embodiment of a plan view of at least a part of a coating system that can generally include two or more printing and treatment zones. [Figure 3A] Figures 3A-3D illustrate further embodiments of plan views of at least a portion of the coating system in general. [Figure 3B] Figures 3A-3D illustrate further embodiments of plan views of at least a portion of the coating system in general. [Figure 3C] Figures 3A-3D illustrate further embodiments of plan views of at least a portion of the coating system in general. [Figure 3D] Figures 3A-3D illustrate further embodiments of plan views of at least a portion of the coating system in general. [Figure 4A] Figure 4A illustrates techniques, such as methods, that may include forming a patterned solid layer on a substrate, which may generally include using the systems shown in the embodiments of Figures 1, 2, or 3A-3D. [Figure 4B] Figure 4B illustrates techniques, such as methods, that may include forming an organic encapsulation layer (OEL), which may generally include using the systems shown in the embodiments of Figures 1, 2, or 3A-3D. [Figure 5] Figure 5 illustrates an embodiment that generally depicts various regions of the substrate. [Figure 6]Figure 6 illustrates a schematic diagram of a gas purification system that can be used in relation to some or all of the other embodiments described herein, for example, to establish or maintain a controlled environment within an enclosure. [Figure 7] Figure 7 illustrates at least a partial embodiment of a system for integrating and controlling one or more gas or air sources, such as to establish a buoyancy control zone that is generally included as part of a buoyancy transport system. [Figure 8A] Figures 8A and 8B include illustrative examples of chuck configurations that can establish a pressurized gas cushion supporting a substrate during one or more processes such as deposition (e.g., printing), holding, or treatment, and the corresponding uniformity in the treated substrate resulting in Figure 8C. [Figure 8B] Figures 8A and 8B include illustrative examples of chuck configurations that can establish a pressurized gas cushion supporting a substrate during one or more processes such as deposition (e.g., printing), holding, or treatment, and the corresponding uniformity in the treated substrate resulting in Figure 8C. [Figure 8C] Figures 8A and 8B include illustrative examples of chuck configurations that can establish a pressurized gas cushion supporting a substrate during one or more processes such as deposition (e.g., printing), holding, or treatment, and the corresponding uniformity in the treated substrate resulting in Figure 8C. [Figure 9] Figure 9 illustrates a schematic embodiment of a treatment system that can be configured to expose a substrate to light (e.g., ultraviolet light), which can generally be used when treating a coating on a substrate. [Figure 10A] Figures 10A and 10B illustrate at least some embodiments of a treatment system that can generally be used when treating a coating on a substrate, and which may include a linear configuration of light sources. [Figure 10B]Figures 10A and 10B illustrate at least some embodiments of a treatment system that can generally be used when treating a coating on a substrate, and which may include a linear configuration of light sources. [Figure 11A] Figures 11A and 11B illustrate a part of a system that may be included as part of a coating system or may be used to manipulate a substrate before or after processing by the coating system, such as a transfer module. [Figure 11B] Figures 11A and 11B illustrate a part of a system that may be included as part of a coating system or may be used to manipulate a substrate before or after processing by the coating system, such as a transfer module. [Figure 12] Figure 12 illustrates a part of the system, including further embodiments of a transfer module that can generally be included as part of the coating system or used to manipulate the substrate before or after processing by the coating system. [Figure 13A] Figures 13A and 13B illustrate some parts of a system that may include a laminated configuration of substrate processing areas, which can generally be used when processing substrates. [Figure 13B] Figures 13A and 13B illustrate some parts of a system that may include a laminated configuration of substrate processing areas, which can generally be used when processing substrates. [Modes for carrying out the invention]

[0015] Figure 1 illustrates an embodiment of a plan view of at least a portion of the coating system 2600 in general. The system 2600 can be configured to provide a solid layer within a specific area of ​​a substrate, such as on a first side of an upward-facing substrate. The solid layer can cover at least a portion of the substrate, such as being formed in a specific pattern. The system 2600 may include an array of zones, each configured to support the substrate using at least partially a gas cushion array that uses pressurized gas supplied to a second side of the substrate opposite the first side. For example, the solid layer can cover and pattern or blanket-coat the substrate and can cover or be included as part of a light-emitting device (e.g., a display or lighting panel), a light-absorbing device (e.g., a photodetector or solar cell), a printed circuit assembly, or other electronic device or circuit.

[0016] The coating system 2600 may include a printing system 2000 which may include an inkjet printhead configured to deposit a liquid coating on a specific area of ​​a substrate (e.g., providing a blanket or patterned liquid coating). For example, the printing system 2000 may include equipment for ensuring the placement of ink droplets on a specific location on the substrate. Such equipment may include one or more of the following: a printhead assembly 2501, an ink delivery system, substrate support equipment such as a platform for providing pressurized gas (e.g., a levitating "table"), loading and unloading equipment, and equipment for managing the printhead.

[0017] In the illustrative embodiment of Figure 1, the printing system 2000 may include a bridge 2130 that is mounted on a riser. The bridge may support a first carriage assembly 2301 and a second carriage assembly 2302, such carriages being movable along at least one axis (e.g., the "X-axis") along the bridge 2130. The first carriage assembly may control the movement of the printhead assembly 2501 across the bridge 2130, for example, by using a linear air bearing motion system that may be inherently low particle generation. In the embodiment, one or more of the first or second carriage assemblies 2301 or 2302 may have a vertical (e.g., "Z-axis") moving plate mounted on it. In the embodiment, each of the first and second carriage assemblies 2301 and 2302 may transport a printhead assembly. In another embodiment, as shown in Figure 1, the first carriage assembly 2301 can transport the print head assembly 2501, and the second carriage assembly 2302 can transport one or more cameras, such as a camera 2303 for monitoring or inspecting the substrate coating operation.

[0018] Each printhead assembly, such as printhead assembly 2501, may have multiple printheads mounted within at least one printhead device. The printhead device may, for example, include, but is not limited to, fluid or electronic connections to at least one printhead, and each printhead may have multiple nozzles or orifices capable of releasing ink at a controlled rate, speed, and size. For example, printhead assembly 2501 may include about 1 to about 60 printhead devices, and each printhead device may contain about 1 to about 30 printheads within each printhead device. A printhead, such as an industrial inkjet head, may, according to an illustrative embodiment, have about 16 to about 2048 nozzles capable of releasing droplet volumes of about 0.1 picoliters (pL) to about 200 pL.

[0019] As described above, the printing operation may include one or more liquid coating processes such as inkjet printing, nozzle printing, slot die coating (patterned or unpatterned), or screen printing, and the liquid ink may include one or more organic materials (e.g., monomers or polymers) or inorganic materials and may include a carrier fluid. Treatment of the liquid ink may include one or more of exposure (e.g., one or more of ultraviolet, infrared, or visible light), heating or cooling, higher than ambient pressure, or vacuum. Such treatment may result in the solidification of the liquid ink to provide a solid layer through one or more of the following: removal of the carrier fluid (e.g., one or more of drying or vacuum baking, including vacuum drying or vacuum baking), chemical reactions (e.g., crosslinking, or chemical conversion from one compound to another), or densification (e.g., baking, including vacuum baking). Alternatively, the solid phase material may be thermally evaporated for deposition on a substrate through spraying. In yet another approach, the material can be dissolved in a carrier liquid or otherwise suspended, and the layer containing the material can be formed by dispensing a continuous flow of the fluid from a nozzle onto a substrate to form lines (so-called "nozzle printing" or "nozzle jetting"), and by subsequent evaporation of the carrier to provide a linear patterned layer.

[0020] Region 2100 can be accessed by a handler (e.g., a transfer robot) to allow the placement of a substrate into region 2100 of the first zone Z1 before printing the liquid coating (e.g., as indicated by an arrow pointing to region 2100). The substrate can then be supported, at least partially, by pressurized gas in region 2100 of the first zone Z1. The printing system may have a second region 2200 that provides a combination of pressurized gas and vacuum for more precise control of the substrate's levitation "flight altitude" in the first zone Z1, during or after the printing operation. Further discussion of using pressure alone or a combination of pressure and vacuum is provided with respect to the illustrative embodiment in Figure 7 below.

[0021] Referring again to Figure 1, the substrate can be transported, at least partially, using a levitation table located within the first zone Z1. Such transport can be enhanced or otherwise facilitated by mechanical engagement of the substrate, including the use of one or more rollers or grippers (e.g., vacuum grippers), as will be further discussed in the following embodiments. One or more of the first, second, or third zones Z1, Z2, or Z3 can be configured to continuously support the substrate, at least partially using a gas cushion. For example, after a printing operation, the substrate can be transported to a third zone Z3, which is included as part of the treatment system 3000, via the second zone Z2, etc., along a path indicated by a curve including an arrow. Such transport can include continuing to support the substrate with a gas cushion, at least partially during transport and throughout the treatment. The treatment system 3000 can treat a liquid coating (e.g., printed liquid ink) to provide a solid layer on the substrate.

[0022] As described above, treatment of liquid inks may include exposure (e.g., one or more of ultraviolet, infrared, or visible light), heating or cooling, and one or more of higher pressure or vacuum than ambient pressure. Such treatments may result in the solidification of the liquid ink to provide a solid layer through one or more of the following: removal of the carrier fluid (e.g., one or more of drying or vacuum baking, including vacuum drying or vacuum baking), chemical reactions (e.g., crosslinking or chemical conversion from one compound to another), or densification (e.g., baking, including vacuum baking). The printed layer may cover and pattern or blanket-coated a substrate and may cover or be included as part of a light-emitting device (e.g., a display or lighting panel), a light-absorbing device (e.g., a photodetector or solar cell), a printed circuit assembly, or other electronic device or circuit.

[0023] For example, the treatment system 3000 may include one or more light sources (e.g., one or more visible light, infrared, or ultraviolet sources such as source 910). Source 910 may include a linear array of “bar” sources, which may include an array of ultraviolet light-emitting diodes, as discussed in relation to other embodiments herein. One or more of the substrate or sources 910 may be translated or scanned to achieve a desired controlled duration or dose of exposure to a particular area of ​​the substrate, for example. Such exposure may be used to heat the substrate (e.g., using infrared or visible light) or to induce a chemical reaction (e.g., crosslinking or chemical transformation). The treatment does not necessarily have to involve the use of light. For example, the treatment system 3000 may be configured to heat or cool the substrate, or to provide an environment for the substrate to develop from one state to another.

[0024] For example, the procedure may include baking or drying the substrate using heating. Such heating may be one or more of the following: convection-driven (e.g., using a gas cushion or establishing other gas flows) or radiation-driven (e.g., using one or more sources such as lamps that provide infrared radiation). The temperature of the substrate during treatment may be controlled within the treatment zone 3000 or elsewhere, for example, by using one or more controlled applications of temperature-controlled gas flows across the substrate surface, such as laminar flow, which can be provided to flow across the surface of the substrate, or by using temperature-controlled flow provided as part of a gas cushion used to support the substrate. Such convection techniques may be used to treat the substrate to bake or dry a liquid coating in order to solidify the liquid coating and provide a solid layer. Such convection techniques may be combined with radiation treatments, such as using an infrared lamp to perform one or more of the baking or drying of the liquid coating. The procedure may include providing an environment that densifies one or more layers on the substrate, such as including a baking operation. In another embodiment, a partial vacuum environment may be used during the procedure, which may also include a radiation treatment of the substrate.

[0025] In the embodiments, the substrate may be held for a specific duration (or until certain criteria are met) after a printing operation but before a treatment operation, for example, to allow the substrate to develop from one state to another. When the substrate is held for the purpose of development, for example, the substrate may be held to allow the printed liquid layer to settle or flow. In the embodiments described above, the temperature of the substrate during such development may be controlled through the controlled application of a temperature-controlled gas flow across the substrate surface, such as a laminar flow, which can be provided to flow across the surface of the substrate.

[0026] Retention can be performed using a substrate located within either region 2100 or 2200 of the first zone Z1. For example, the first substrate can be held stationary within the printing zone Z1 after a printing operation for a specific retention duration. However, throughput can be increased by transporting the substrate to the second zone Z2 and using at least a portion of the second zone Z2 as a retention zone or for one or more other operations. For example, another substrate can be delivered to the first zone Z1 of the system 2600 for a printing operation, and the first substrate can be transported to the second zone Z2 to clear the area where printing will occur. If the second zone is elongated, a series of substrates can be held or transported sequentially through zone Z2. The second zone Z2 can also be used to line up or buffer a series of substrates awaiting treatment or other processing (for example, substrates do not need to be held in zone Z2 only for a specific duration or for development from one state to another), or processing that may include one or more of baking or drying the substrates can be performed in the second zone Z2. Other configurations, such as those shown in the embodiments of Figure 2, 3A, 3B, 3C, or 3D, can also be used. In addition, or instead, the third zone Z3 can be used to hold substrates for a specific duration after printing but before treatment.

[0027] The coating system 2600 may be located within the enclosure 1010, for example, to provide a controlled processing environment at or near atmospheric pressure. Such a controlled processing environment can be established to remain below specific limits for one or more of the following: particulate matter contamination levels, water vapor content, oxygen content, ozone content, and organic vapor content. For example, the controlled processing environment may include nitrogen, or another gas or mixture of gases, specified for minimal reactivity or no reactivity with the species deposited on the substrate being processed using the system 2600. As described in other embodiments below, such a controlled processing environment can be established at least partially using gas purification systems contained within or connected to various parts of the system 2600. Particulate matter levels in the controlled environment can also be controlled, for example, using devices connected to or located within the system 2600. In embodiments, the enclosure 1010 may include an environment established without a pressurized inert gas recirculation system, maintained at an internal pressure slightly positive with respect to the external pressure, and may include an enclosure 1010 that protects against external gas or air entering the interior, which would develop any leaks within the enclosure 1010. According to various illustrative embodiments, in the enclosure 1010 and system 2600 of this teaching, the interior of the enclosure 1010 may be maintained at a pressure of, for example, at least 2 mbarg, for example, at least 4 mbarg, at least 6 mbarg, at least 8 mbarg, or higher, relative to the ambient atmosphere outside the enclosure 1010.

[0028] Figure 2 illustrates an embodiment of a plan view of at least a portion of a coating system 2700 that can generally include two or more printing and treatment zones. Figure 2 can include two or more coating systems 2600A or 2600B, each having a configuration identical or similar to that of system 2600 discussed above in relation to Figure 1. In Figure 2, a substrate 4000 can be transported into zone Z1A of the first coating system 2600A and supported during the printing process using at least partially gas cushions provided by a levitation table within the printing zone Z1A. A handler 2732 including an end effector 1420 can be used to manipulate the substrate 4000, for example, to position the substrate 4000 in a fixed position for a printing or treatment operation within zone Z1A, or to retrieve the substrate after such an operation, such as from zone Z3A. In the illustrative embodiment of Figure 2, the handler 2732 can traverse a track 2734, in addition to having other degrees of freedom.

[0029] The substrate 4000 can be transported within the coating system 2600A using a levitation stage transport system, such as through the second zone Z2A, using various transport techniques. Such techniques may include using one or more of the following: linear air bearings or mechanical bearing systems, gripper assemblies for holding the substrate, rollers, etc. As previously discussed herein, the substrate 4000 can be held in a holding zone for a specific holding duration, or for a duration determined by delays of other processing activities, such as after the completion of the printing process and before processing operations. During such holding operations, the substrate 4000 can remain supported, at least partially using a gas cushion.

[0030] The substrate 4000 can be transported to a treatment zone Z3A, such as being included as part of the treatment system 3000A. As discussed elsewhere in this specification, the substrate 4000 can be treated using various techniques, such as to form a solid layer by solidifying a liquid layer. Such treatments can result in the solidification of the liquid ink to provide a solid layer through one or more of the following: removal of a carrier fluid (e.g., one or more of drying or vacuum baking, such as vacuum drying or vacuum baking), chemical reactions (e.g., crosslinking, or chemical conversion from one compound to another), or densification (e.g., baking, such as vacuum baking). During processing in the coating system 2600A, the substrate 4000 can be supported at least partially using a gas cushion throughout the entire sequence of processing operations, including one or more of printing, holding, and treatment.

[0031] The inventors recognize that, in particular, several handling steps, including those involving a robot (e.g., handler 2732), can be reduced in this manner, for one or more reasons such as shortening delays, for example, reducing mechanical damage to the substrate during engagement by handler 2713, or increasing the uniformity of the solid layer (e.g., film layer) provided by the coating system 2600A. The various transport techniques described above can be used to transport the substrate through the coating system 2600A, for example, by making contact with the substrate within a specific area other than the display area or area of ​​the substrate containing the fabricated electronic device, or by supporting the substrate at least partially using a gas cushion on the opposite side of such area.

[0032] System 2700 may include a second coating system 2600B, configured similarly to the first coating system 2600A, such that it includes first, second, and third zones Z1B, Z2B, and Z3B, together with the printing system 2000B and the treatment system 3000B. The second coating system 2600B may be configured similarly to the first coating system 2600B to print a liquid layer and then treat the liquid layer to provide a solid layer. In this way, the second coating system 2600B can provide one or more of the redundancy or increased throughput compared to a topology having only a single printing system 2000 or a single coating system 2600A or 2600B. In embodiments, the solid layer provided by the second coating system 2600B may differ from the layer provided by the first coating system block 2600A (e.g., in composition or location on the substrate where it is coated).

[0033] System 2700 may include various enclosures, such as a first enclosure 1010A for a first coating system block 2600A and an enclosure 1010B for a second coating system block 2600B. Each enclosure may have a controlled environment, as discussed in relation to other embodiments of this specification. Handler 2732 may be located within a transfer module 1400B, which also has a controlled environment. The internal environment of transfer module 1400B may be maintained in common with one or more of the first or second coating system blocks 2600A or 2600B, or separately. For example, one or more gate valves or gas curtain arrays may be used in the area where handler 2732 places or retrieves substrates from the first or second coating system block 2600A or 2600B.

[0034] System 2700 may include one or more other modules, such as a first or second module 1100A or 1100B, which may include one or more pass-through or load-lock arrays. For example, module 1100B (e.g., the “Output” module) may include a load-lock array configured to at least partially transfer substrate 4000 from a first environment in transfer module 1400B to another environment different from the environment of transfer module 1400B (e.g., from atmospheric pressure or near pressure to a vacuum environment / from a vacuum environment to atmospheric pressure or near pressure, or from / to an atmospheric environment having different controlled properties such as one or more of gas, moisture, particulate matter, or other compositions). Similarly, module 1100A (e.g., the “Input Module”) may include a load-lock array or a pass-through array. Another transfer module 1400A may include a handler 1410 for, for example, placing substrate 4000 into module 1100A or retrieving substrate 4000 from module 1100A. Other modules may be included, such as a first processing or holding module 1200A or a second processing or holding module 1200B. Such processing or holding modules 1200A or 1200B may include a stacked array of locations for the substrate 4000, as illustrated in the embodiment of Figure 13A or Figure 13B. Such a stacked array may be used to hold the substrate before or after processing, or for other purposes. In addition to simply holding the substrate for substrate flow control purposes, such as holding the substrate for a period of time until another module is ready to receive it, or providing a location to hold a defective or damaged substrate until the substrate can be removed, the processing or holding modules may also be used to hold the substrate for a period of time as part of a functional process flow.

[0035] The first module 1100A or the second module 1100B can be connected to a vacuum source or a purge source, or both, and can be configured to independently seal interface ports to system 2700 and interface ports to a previous or next environment (which may be the ambient environment or a controlled environment associated with another enclosed processing module). In this way, the first or second module 1100A or 1100B can seal its internal environment internally and transition it between being incompatible with other parts of system 2700 and being compatible (for example, a controlled environment at or above atmospheric pressure that, when exposed to system 2700 via the interface ports, would substantially maintain the quality of the controlled environment within system 2700B). Similarly, the first module 1100A or the second module 1100B can be used to transfer the substrate to an environment suitable for other processing (e.g., a second environment at or near atmospheric pressure but with a different composition from the controlled environment, or a vacuum environment). In this way, the first or second module 1100A or 1100B can provide a transfer conduit between the controlled environment of system 2700 and other equipment. The first module 1100A or the other module may include a permanently mounted configuration or a cart or other transportable configuration.

[0036] In the embodiment, a module (e.g., a first module 1100A or a second loading module 2700) may then be “filled” with a purified gas stream, such as by being provided with a non-reactive atmosphere or otherwise involving one or more purging operations, in order to prepare the internal area of ​​the loading module (e.g., the first module 1100A or the second module 1100B) for exposure to the inside of the enclosed system 2700. For example, the internal area of ​​one or more of the modules may be at least partially discharged or purged to avoid contamination in a manner that exceeds certain limits of particulate matter contamination levels, water vapor content, oxygen content, ozone content, and organic vapor content in the controlled processing environment within the enclosed area defined by the other parts of the system 2700.

[0037] Similarly, after processing by system 2700, the substrate being processed can be placed in a first or second module 1100A or 1100B. For example, a module (e.g., first module 1100A or second module 1100B) can be isolated from the non-reactive gas environment elsewhere in system 2700 and connected to a vacuum source to be discharged for subsequent processing under vacuum conditions, or otherwise for transporting the substrate being processed to other equipment or processing under vacuum conditions, ambient conditions, or some other static controlled environment. For further example, one of the first or second modules 1100A or 1100B can be configured to provide the substrate to a controlled processing environment within system 2700 without increasing the concentration of reactive species within the enclosed area, for example, by more than 1,000 parts per million, or similarly without increasing the ambient particle level by more than a certain amount, or without depositing more than a certain number of particles of a certain size per square meter of substrate area on the substrate.

[0038] In the embodiment, the first module 1100A can be connected to other modules by a port (including, for example, a physical gate having a substantially gas-impermeable seal) or a gas curtain. When the port is open, the interior of the first module 1100A can be accessed by a handler located in the first transport module 1400A. The handler 1410 may include a robotic assembly with various degrees of freedom, such as for manipulating a substrate using an end effector. Such an end effector may include, for example, a fork, tray, or frame configured to support the substrate by gravity, or the end effector may firmly grip, clamp, or otherwise hold the substrate, such as for changing the orientation of the substrate from an upward or downward configuration to one or more other configurations. Other end effector configurations may be used, such as those including pneumatic or vacuum-operated features, for either operating a portion of the end effector or otherwise holding the substrate. Further illustrative embodiments of the transport module including the handler are described below.

[0039] Other coating system configurations can be used that have aspects similar to the embodiments in Figure 1 or Figure 2, but have different line configurations or “topologies.” For example, Figures 3A–3D illustrate further embodiments of plan views of at least some parts of the coating system. Figure 3A illustrates a coating system 2800A which can be referred to as a “U” configuration, for example, to provide a liquid layer and to treat the liquid layer to provide a solid layer. System 2800A may include a printing system 2000 having a first zone Z1, which includes a levitation table device configured to support the substrate 4000 using at least partially gas cushions, as in other embodiments. Second zones Z2A–Z2N can be used as holding or processing areas 5000A–5000N for example, to hold a series of substrates before or after a printing operation, including continuing to support the substrates using at least partially gas cushions. A processing system 3000 having a third zone Z3 can be provided.

[0040] In a linear configuration, the substrate 4000 can be introduced into the system 2800A, for example, through a first module 1100A. The substrate can be operated by a handler 2732, such as located in a transport module 1400B, and placed on a levitating table in zone Z1 for printing operations. The substrate 4000 can be transported along zone Z1 to zones Z2A-Z2N and then to zone Z3 for processing operations. During traverses or movements within zones Z1, Z2A-Z2N, and Z3, the substrate 4000 can be supported at least partially using gas cushions, such as being continuously supported. As described above, other transport techniques can be used in addition to gas cushion arrays. Upon completion of at least one sequence of printing and processing operations, the substrate can be retrieved by a handler 2734 and placed in a second module 1100B for further processing, for example. If a second printing system is included, the topology of Figure 28A can be extended to form an "M" configuration. It is illustrative to include one or two printing systems (e.g., printing system 2000), and additional printing systems may be included to increase throughput, increase redundancy, or provide additional processing operations, for example.

[0041] Figure 3B illustrates a system 2800B that may include a “partially rotary conveyor” configuration, such as a rotating section 3001 (e.g., a platform, chamber, or other configuration) that can rotate to allow transport of substrates to various parts of the system 2800B. As in other embodiments, the substrate 4000 may be introduced into a first module 1100A, etc., where a handler 1410 retrieves the substrate 4000 and places it in zone Z1 for printing operations. The substrate 4000 may then be transported to one of zones Z2A or Z2B for holding operations or other processing, such as holding operations within holding or processing areas 5000A or 5000B, which includes at least partially using a gas cushion to continue supporting the substrate 4000. The substrate 4000 may then be transported back to zone Z1, and then, after rotation of the rotating section 3001, the substrate 4000 may be transported to zone Z3 for processing operations, etc. In one embodiment, the substrate 4000 can be transported directly from zone Z1 to zone Z3 without requiring holding or other processing within zone Z2A or Z2B. For example, if zone Z2A or Z2B is occupied, holding or other processing can occur within the printing zone Z1 or processing zone Z3. After printing and processing, the substrate can be transported back to a location along zone Z1 for collection by the handler 1410, etc. The substrate can be returned to module 1100A or placed in another module 1100B for further processing, etc. In another embodiment, another levitation table transport structure may extend radially in directions other than toward zone Z1.

[0042] Figure 3C illustrates an "arc" topology in which the transport module 1400C can be included, generally connecting to various parts of the system 2800C at points radially located around the transport module 1400C. For example, the substrate 4000 can be introduced into the system 2800C via the first module 1100A, etc. The handler 1410 can retrieve the substrate 4000 from the first module 1100A for a printing operation using the printing system 2000, etc., and place it in zone Z1. The substrate 4000 can then be transported to area 5000A in zone Z2A, where it remains stationary for a specific duration, or traverses zones Z2A-Z2N, including area 5000A-5000N, for a specific duration. The substrate 4000 is processed in the processing area 3000 and can then be retrieved by the handler 1410 for purposes such as returning it to module 1100A or an output module such as module 1100B.

[0043] Figure 3D illustrates further embodiments of at least some parts of the System 2800D, which can generally be used in providing a solid coating on a substrate 4000. System 2800D may include a laminated configuration for at least some parts of the system. The embodiments of Figures 3A, 3B, and 3C generally illustrate a single substrate elevation (e.g., the substrate is transported laterally from operation to operation substantially within the plane of the substrate itself), but such embodiments may be combined with other embodiments described herein, such as including one or more parts having a laminated configuration. System 2800D may include modules 1100A, such as an input module, which is coupled to a transport module 1400B. The transport module 1400B may include a handler 2732 that can traverse a track 2734 to access other parts of System 2800D. The transfer module 1400B can be connected to other parts of the system 2800, such as module 1100B (for example, an output module), or to one or more other modules, such as the holding or processing module 1200A or the holding or processing module 1200B.

[0044] The handler 2732 can provide the substrate 4000 to a first zone Z1 near the printing system 2000 for purposes such as depositing a liquid ink layer onto the substrate 4000 (e.g., printing). The substrate 4000 can then be transported via the levitation stage transport system 2630 to a specified one of a stacked array of zones Z2A-Z2N in region 5000. Such zones Z2A-Z2N can be lowered or raised, for example, so that a specified one of the stacked arrays is aligned laterally within substantially the same plane as the printing zone Z1 for transporting the substrate. After being held for a certain duration, or after undergoing other processing in region 5000, or until a zone Z3, such as one included as part of the treatment system 3000, becomes available, a specified one of zones Z2A-Z2N can be aligned with zone Z3, and the substrate can be transported to zone Z3 via levitation. In the embodiment of Figure 3D, zone Z3 is shown as having approximately the same elevation as Z1, but it does not have to be so. For example, treatment zone Z3 may be at a different altitude than zones Z2A-Z2N or printing zone Z1.

[0045] As in the other embodiments described above, during operations such as printing or processing within the system 2800D, the substrate 4000 is supported at least partially using a gas cushion throughout the entire process sequence, thereby reducing one or more handling steps or mechanical contact between the substrate 4000 and the processing apparatus. While not constrained by theory, it is conceivable that such reduction of handling steps involving the handler 2732 or reduction of mechanical contact can enhance the uniformity of the coating layer, for example, by helping to suppress the formation or circulation of particulate contaminants or by helping to suppress non-uniformity across the substrate due to thermal or electrostatic non-uniformity.

[0046] Figure 4A illustrates techniques 6001, such as methods, that may include forming a coating on a substrate, which may generally include using the systems shown in the embodiments of Figures 1, 2, or 3A-3D. During some operation, such as printing, holding, or one or more of the treatments, the substrate may be supported by a levitation device using a pressurized gas or a combination of pressurized gas and vacuum. In 6101, the substrate may be transferred to the coating system. For example, the substrate may have one or more layers that have been processed elsewhere and fabricated on the substrate. As described above, the substrate may include layers that cover and pattern or blanket-coat the substrate, and such layers may cover or be included as part of a light-emitting device (e.g., a display or lighting panel), a light-absorbing device (e.g., a photodetector or solar cell), a printed circuit assembly, or other electronic device or circuit.

[0047] In 6201, the substrate may be supported within the coating system, for example, by using at least partially a gas cushion provided on the side of the substrate opposite to the area where the patterned solid layer is to be formed, including continuing to support the substrate using at least partially a gas cushion. In 6301, the liquid coating may be deposited on the substrate, for example, by using a printing technique. In a broad sense, the printing operation may include one or more liquid coating processes such as inkjet printing, nozzle printing, slot die coating (patterned or unpatterned), or screen printing, and the liquid ink may include one or more organic materials (e.g., monomers or polymers) or inorganic materials, and may include a carrier fluid.

[0048] Optionally, in 6401, the substrate may be held within an area or zone arranged for such holding (e.g., a zone located along or included as part of a levitation table arrangement). Such holding may occur over a specific fixed duration or may be specified to include a duration sufficient to allow the substrate to transition or develop from one state to another different state. Such holding may also be established, at least in part, by the delay or availability of other processing areas, such as a treatment area. During the holding operation, the substrate may remain supported, at least in part, by a gas cushion. In 6501, the substrate may be transported to a treatment zone, which includes continuing to support the substrate using a gas cushion, at least in part. In an embodiment, transport in 6501 may occur before the optional holding described in 6401. In another embodiment, the optional holding described in 6401 may occur while the substrate is still located within the printing zone.

[0049] In 6601, the liquid coating provided in 6301 can be treated. Treatment of the liquid ink can include exposure (e.g., one or more of ultraviolet, infrared, or visible light), heating or cooling, and one or more of higher pressure or vacuum than ambient pressure. Such treatment can result in the solidification of the liquid ink to provide a solid layer through one or more of the following: removal of the carrier fluid (e.g., one or more of drying or vacuum baking, including vacuum drying or vacuum baking), chemical reaction (e.g., crosslinking or chemical conversion from one compound to another), or densification (e.g., baking, including vacuum baking). In the embodiment of Figure 4B, such treatment includes exposure to ultraviolet light, for example, to provide a patterned solid layer corresponding to one or more areas on which the liquid ink has been deposited.

[0050] A portion of an electronic device, such as a light-emitting or light-absorbing device, can be encapsulated using one or more film layers deposited on the device fabricated on a substrate. In embodiments, such film layers may include stacks or other configurations of layers containing inorganic and organic materials. Figure 4B illustrates techniques such as methods that may include forming an organic encapsulation layer (OEL), which may generally include using one or more aspects of the coating systems shown in embodiments of Figures 1, 2, or 3A-3D. Such an OEL may be included as part of the encapsulation structure.

[0051] In 6102, the substrate can be transported to an enclosed organic thin-film encapsulation system configured to deposit a layer (e.g., a patterned organic layer) within a specific area on a first side of the substrate, the organic layer covering at least a portion of the device to be fabricated on the substrate. In 6202, the substrate can be supported within the enclosed thin-film encapsulation system using at least partially a gas cushion provided on a second side of the substrate opposite to the specific area. In 6302, while the substrate is at least partially supported by the gas cushion, a liquid ink, which may in some embodiments be an organic monomer-based ink, can be printed (e.g., inkjet printing) over a specific area of ​​the substrate using a printing system, with the substrate located within a printing zone. In 6402, the substrate can be transported to a holding zone and held for a specific duration, including continuing to support the substrate using at least partially a gas cushion. In 6502, the substrate can be transported to a processing zone, including continuing to support the substrate using at least partially a gas cushion. As described in relation to other embodiments, transport of the substrate to the treatment zone can occur before or after holding, and the holding operation does not need to be performed within the holding zone. For example, such holding can be performed in place of, or in addition to, one or more of the printing zone or treatment zones.

[0052] In 6602, the substrate may be treated with a liquid ink, which in examples may be an organic monomer-based ink, to provide a polymerized organic layer on the substrate within a specific region, the treatment taking place while the substrate remains supported at least partially using a gas cushion. The patterned organic layer may include part of an encapsulation structure, which is established to encapsulate at least part of a light-emitting device on the substrate.

[0053] Figure 5 illustrates embodiments depicting various regions of the substrate 4000 that can be supported, in general, by at least partially using a combination of pressurized gas ports or pressurized gas regions, or a combination of such pressurized gases with a vacuum port or vacuum region. The substrate 4000 may include glass material or one or more other materials. In the illustrative embodiment of a flat panel display, the substrate 4000 may include either a single large display or two or more smaller displays that can be singulated from the substrate 4000. In the illustrative embodiment of Figure 5, four display regions 4002A, 4002B, 4002C, and 4002D are shown. These may be referred to, for example, “active regions” or “emitting regions.” The use of the term “active” in this embodiment does not imply that such regions are actually optically radiant during processing, but rather refer to regions that may include devices configured to emit light, or regions that otherwise form a different radiant or transparent portion of a display that is visible to the end user. Generally, visible defects in regions 4002A-4002D are considered unacceptable by the end user, and therefore, various techniques can be used to enhance the visible uniformity of regions 4002A-4002D, etc. Other modifications to the panel configuration of the substrate 4000 are possible. For example, the substrate 4000 may include a single display or array of OLED devices. In other embodiments, the substrate 4000 may be divided into two, four, or eight regions, establishing corresponding peripheries for support or having corresponding dispersed porous media regions as described in other embodiments herein. For other manufacturing embodiments where other devices such as optical, electrical, or optoelectronic devices are on the substrate and coated, such as by being coated with an organic encapsulation layer, the definition of “active” can be adjusted to suitably include regions corresponding to these devices. Examples of such devices may include electronic circuits, solar cells, printed circuit boards, and flat panel displays.

[0054] In the embodiment, support can be provided during processing, for example, by using a pressurized gas cushion established on the surface beneath the substrate of the display areas 4002A-4002D. A region 4004 extending around the substrate 4000 and into the internal space between each of the display areas 4002A-4002D can be engaged by physical contact between the substrate and a fixture which may include one or more of the following: grippers, rollers, lift pins, or other fixtures. Such a region 4004 may be referred to as a “no-entry” region, indicating that the light-emitting or active elements of the display (or other elements as described above with respect to other types of devices other than displays) may be kept away from such an engaged region (and vice versa). For example, one or more “lift pins” may be located in regions as illustrated in Figure 5, for example, in a first region 2124A, a second region 2124B (e.g., in the location between display areas 4002A and 4002B), and an “Nth” region 2124N. Such lift pins can provide an increased gap between the substrate 4000 and one or more ports or dispersed pressurized gas sources, so that they can be used to support the substrate in regions 4002A, 4002B, 4002C, or 4002D.

[0055] A levitation platform or chuck may include a continuous array or continuous porous plate of small pressure openings, on which a pressurized gas can levitate a substrate. This provides flow. For example, holes such as 2124A and 2124B can still be provided within the chuck surface for lift pins (located below the chuck surface when retracted), but since the substrate floats above the chuck surface, the presence of unevenness or non-uniformity in the coating covering such holes can be reduced or eliminated. In this way, even the internal region between regions 4002A-4002D can be utilized as an active region, improving productivity and enabling the manufacture of larger continuous active devices. Furthermore, as in other embodiments, combinations of pressurized gas ports and vacuum ports can be used, as shown and described elsewhere. For example, the substrate 4000 can be held by one or more vacuum ports (e.g., circular ports, or e.g., slots) in regions 2124A-2124N, as shown in region 4004.

[0056] As described above, such region 4004 can again include the periphery of the substrate 4000. In illustrative embodiments, physical contact between the substrate 4000 and any fixture can generally be limited to such periphery region 4004 during other processing operations such as deposition (e.g., printing of material on the substrate 4000), holding, treatment, or one or more of the other processing. Such region 4004 can extend inward from the edge of the substrate by, for example, only 100 or 200 millimeters. Elsewhere, the substrate can be supported at least partially in region 4002 using one or more pressurized gas ports. Since the substrate can be physically supported in the periphery region 4004 and at least partially supported by pressurized gas in the central region 4002, such combination of vacuum ports and pressurized gas ports can avoid putting excessive stress on the large substrate 4000. Thus, it does not matter whether the substrate 4000 contains a single large display being fabricated or several smaller displays. Therefore, since contact can be limited to the peripheral region 4004 of the substrate 4000 while the substrate 4000 is supported using pressurized gas (for example, at the center), a typical conveyor or levitation table configuration can be used for various different display configurations.

[0057] In processes where the substrate 4000 can be supported solely by a gas cushion, a combination of positive gas pressure and vacuum can be applied through a port or array of dispersion regions. Such zones, having both pressure and vacuum control, can effectively provide a fluid spring between the levitating table or platform and the substrate 4000. The combination of positive pressure and vacuum control can provide a fluid spring with bidirectional rigidity. The gap between the substrate (e.g., substrate 4000) and the surface can be referred to as the "flight altitude," which can be controlled or otherwise established by controlling the positive pressure and vacuum port conditions. In this way, the orientation of the substrate can be carefully controlled for printing, holding, processing, or one or more of other processes, etc.

[0058] In other locations, such as where precise control of flight altitude is not required, a pressure-only levitation zone may be provided along a conveyor or elsewhere. A "transition" zone may be provided along a conveyor or table, or where the ratio of pressure nozzles or area to vacuum nozzles or area gradually increases or decreases. In illustrative embodiments, there may be essentially uniform altitudes between the pressure / vacuum zone, the transition zone, and the pressure-only zone, so that within tolerances the three zones can be located essentially in a single plane. In other locations, the flight altitude of the substrate 4000 over the pressure-only zone may be greater than the flight altitude of the substrate 4000 over the pressure / vacuum zone, for example, to allow sufficient altitude so that the substrate does not collide with the levitation table in the pressure-only zone.

[0059] In the illustrative embodiment, the substrate is positioned approximately 150 micrometers (μ) above the pressure zone. The flight altitude can be approximately 300 μm, followed by approximately 10 μm to 50 μm above the pressure / vacuum zone. In illustrative embodiments, one or more parts of the levitation platform or table may include “air bearing” assemblies provided by NewWay® Air Bearings (Aston, Pennsylvania, United States of America) or Coreflow (Israel). Embodiments of gas-pressurized support of substrates are discussed with respect to Figure 5, and such techniques may be used in addition to or instead of other transport or support approaches.

[0060] Figure 6 illustrates a schematic diagram of a gas purification system that can generally be used in relation to some or all of the other embodiments described herein, for example, to establish or maintain a controlled environment within an enclosure. For example, a gas enclosure system 502 may include a gas enclosure assembly 100 (e.g., an enclosure having a controlled environment), a gas purification loop 130 in fluid communication with the gas enclosure assembly 100, and a thermal control system 140 (for example, which may be referred to as a temperature controller in other embodiments herein).

[0061] System 502 may include a pressurized gas recirculation system 300 that can supply gas for operating various devices such as substrate levitation tables or other pressurized gas devices, for various coating system embodiments described herein. The pressurized gas recirculation system 300 may include or be used a compressor, a blower, or both. In addition, the gas enclosure system 502 may have a circulation and filtration system inside the gas enclosure system 502 (for example, one or more fan filter units (FFUs) as described in other embodiments herein).

[0062] One or more ducts or baffles can separate the non-reactive gas circulated through the gas purification loop 130 from the non-reactive gas that is filtered and circulated internally for various embodiments of the gas enclosure assembly. For example, the gas purification loop 130 may include an outlet line 131 from the gas enclosure assembly 100. A solvent removal component 132 may be provided for solvent removal, and the purified gas can be sent from the solvent removal component 132 to the gas purification system 134. The purified gas, after removing the solvent and other reactive gas species such as one or more of ozone, oxygen, and water vapor, can be circulated back to the gas enclosure assembly 100, for example, through an inlet line 133.

[0063] The gas purification loop 130 may include appropriate conduits and connections for purposes such as interacting with monitoring or control devices. For example, ozone, oxygen, water vapor, or solvent vapor sensors may be included. A gas circulation unit, such as a fan, blower, or other array, may be provided separately or incorporated into the gas purification system 134, for example, to circulate gas through the gas purification loop 130. In the explanatory diagram of Figure 6, the solvent removal component 132 and the gas purification system 134 are shown as separate units. However, the solvent removal component 132 and the gas purification system 134 can be housed together as a single unit.

[0064] The gas purification loop 130 in Figure 6 may have a solvent removal component 132 positioned upstream of the gas purification system 134 so that the gas circulating from the gas enclosure assembly 100 can pass through the solvent removal component 132 via the outlet line 131, etc. In some embodiments, the solvent removal component 132 may include a solvent trap system based on absorbing solvent vapors from the gas passing through the solvent removal component 132. For example, a bed of one or more adsorbents such as activated carbon or molecular sieves can effectively remove a wide variety of organic solvent vapors. In another embodiment, a cooling trap technique may be used to remove solvent vapors as part of the solvent removal component 132. Sensors such as ozone, oxygen, water vapor, and solvent vapor sensors may be used to monitor the removal of such species from the gas circulating continuously through a gas enclosure system such as the gas enclosure system 502. For example, information obtained from such sensors or other devices can indicate, for instance, when an adsorbent such as activated carbon or molecular sieve has reached its capacity or otherwise become less effective, so that, for example, one or more adsorbent beds can be regenerated or replaced.

[0065] The regeneration of molecular sieves can involve heating the molecular sieves, contacting them with a forming gas, or a combination thereof. For example, molecular sieves configured to trap various species including ozone, oxygen, water vapor, or solvents can be regenerated by heating and exposure to a forming gas. In illustrative examples, such a forming gas may contain hydrogen; for example, the forming gas may contain about 96% nitrogen and about 4% hydrogen, the proportions being by volume or weight. The physical regeneration of activated carbon can be carried out using a heating procedure in a controlled environment.

[0066] A portion of the gas purification system 134 in the gas purification loop 130 may include a system available from, for example, MBRAUN Inc. (Statham, New Hampshire) or Innovative Technology (Amesbury, Massachusetts). The gas purification system 134 can be used to remove and purify one or more gases within the gas enclosure system 502, for example, to remove and purify the entire gas atmosphere within the gas enclosure assembly. As described above, to circulate the gas through the gas purification loop 130, the gas purification system 134 may have a gas circulation unit, for example, a fan or blower. The gas purification system can be selected or configured according to the volume of the enclosure, which can define the volumetric flow rate for moving the unreactive gas through the gas purification system. In an illustrative embodiment, a gas purification system can be used in which the gas enclosure system having a gas enclosure assembly may contain a volume of about 4 cubic meters and can move about 84 cubic meters per hour. In another illustrative embodiment, a gas enclosure system having a gas enclosure assembly may contain a volume of about 10 cubic meters, and a gas purification system capable of moving about 155 cubic meters per hour may be used. In yet another illustrative embodiment, a gas enclosure assembly having a volume of about 52 to about 114 cubic meters, and one or more gas purification systems may be used.

[0067] Gas filters, dryers, or other purification devices may be included in the gas purification system 134. For example, the gas purification system 134 may include two or more purification devices, either in parallel or otherwise arranged, such that one of the devices can be removed from the line for maintenance and one or more of the other devices can be used to continue system operation without interruption. For example, the gas purification system 134 may have at least one or more molecular sieves, such as a first and a second molecular sieve, so that the system can switch to other molecular sieves while regenerating saturated or inefficient molecular sieves when one of the molecular sieves is saturated with impurities or otherwise deemed not to be operating sufficiently efficiently. Control units may be provided for determining the operational efficiency of each molecular sieve, for switching the operation of different molecular sieves, for regenerating one or more sub-sieves, or for combinations thereof. As mentioned above, molecular sieves can be regenerated and reused.

[0068] The thermal control system 140 in Figure 6 circulates a coolant into the gas enclosure assembly. The system may include at least one cooling device 142 having a fluid outlet line 141 for discharging fluid and a fluid inlet line 143 for returning the coolant to the cooling device. At least one fluid cooling device 142 may be provided to cool the gas atmosphere within the gas enclosure system 502. For example, the fluid cooling device 142 may deliver the cooled fluid to a heat exchanger within the enclosure, and the gas may be passed through a filtration system inside the enclosure. At least one fluid cooling device may also be provided to the gas enclosure system 502 to cool the heat generated from a device enclosed within the gas enclosure system 502. In an illustrative embodiment, the fluid cooling device may also be provided for the gas enclosure system 502 to cool the heat generated from a coating system. The thermal conditioning system 140 may include a heat exchanger or a Peltier device and may have a range of cooling capacities. For example, the cooling device may provide a cooling capacity of about 2 kilowatts (kW) to about 20 kW. According to various embodiments, the gas enclosure system 502 may have multiple fluid cooling devices capable of cooling one or more fluids. The fluid cooling devices may use various fluids as heat transfer media, such as water, antifreeze, refrigerant, or combinations thereof. Leak-free locking connections may be used in the connections of related conduits and system components.

[0069] While the above embodiments describe cooling capacity and applications, they may also be applied to applications involving buffering of substrates in a controlled environment, or to applications where it is possible to maintain a circulating gas at a temperature similar to the rest of the system, for example, to avoid unwanted heat transfer from the fabricated substrate or to avoid interference with temperature uniformity across or between substrates.

[0070] Figure 7 illustrates at least some embodiments of a system 505 for integrating and controlling one or more gas or air sources, such as to establish a levitation control zone that is included as part of a support or transport system for a levitation base. Such a system 505 may include a table 2250 having various regions configured to support a substrate by establishing a gas cushion. In this illustrative embodiment, regions 2100, 2200, and 2300 may be referred to as input, print, and output for illustrative purposes only. Such regions may be used for transporting or supporting a substrate, such as during one or more of the following treatments, such as transporting, holding, drying, baking, or other procedures, or for other processing steps, such as other processing of the substrate according to other embodiments. In the explanatory diagram of Figure 7, a first blower 3284A is configured to provide pressurized gas into one or more of the input or output regions 2100 or 2300 of the levitation table device. Such pressurized gas may be temperature-controlled, such as using a first cooling device 142A connected to a first heat exchanger 1502A. Such pressurized gas can be filtered using the first filter 1503A. A temperature monitor 8701A can be connected to the first cooling device 142 (or other temperature controller).

[0071] Similarly, a second blower 3284B may be connected to the printing area 2200 of the levitation table. A separate cooling device 142B may be connected to a loop including a second heat exchanger 1502B and a second filter 1503B. A second temperature monitor 8701B may be used to provide independent adjustment of the temperature of the pressurized gas supplied by the second blower 3284B. In this exemplary embodiment, the input and output areas 2100 and 2300 are supplied with positive pressure, but the printing area 2200 may include the use of a combination of positive pressure and vacuum control to provide precise control over the substrate position. For example, using such a combination of positive pressure and vacuum control, the substrate can be controlled exclusively using a levitation gas cushion provided by the system 504 within a zone defined by the printing area 2200. A vacuum can be established by a third blower 3290, which also provides at least a portion of the makeup gas for the first and second blowers 3284A or 3284B within the blower housing 3282.

[0072] Figures 8A and 8B include illustrative embodiments of chuck or table configurations that can establish a pressurized gas cushion supporting the substrate during one or more of the deposition (e.g., printing), holding, or processing processes, and the corresponding uniformity in the processed substrate 4006C resulting in Figure 8C. Figure 8A illustrates an embodiment of a chuck 2420B configuration that generally includes ports configured to establish a pressurized gas cushion supporting the substrate 4006B during one or more of the deposition, holding, material dispersion, or flowing processes. In this approach, the substrate 4006B is not required to come into contact with the thermally non-uniform features of the chuck 2420B during the various processes, so the substrate 4006B can avoid large and highly visible unevenness. Different port configurations can be used, such as having a first port density in region 2406A and a second port density in region 2406B.

[0073] As described in other embodiments herein, a flight altitude "h" can be established, for example, by using a combination of vacuum and pressurized gas ports in an array of regions 2406A and 2406B. For example, in each row of ports, ports can alternately be assigned as either vacuum ports or pressurized gas ports. In this way, precise control of altitude h can be established, and the substrate 4006B can be established in the z-dimensional plane relative to the chuck surface. A combination of mechanical mooring and pressurized gas can also be used, as in other embodiments herein. For example, lateral movement of the substrate 4006B can be restricted (e.g., in a direction parallel to the chuck surface) by using one or more lateral restraints or bumpers, and transport of the substrate 4006B can be facilitated by using one or more rollers or grippers that engage with the substrate around its periphery.

[0074] Figure 8B illustrates an embodiment of a chuck configuration that includes a porous medium 1906 to establish dispersion pressure during one or more of the following processes, such as depositing, holding, processing, or other treatments, such as providing uniformity in the resulting substrate 4006C as shown in Figure 8C. As described in relation to other embodiments herein, a porous medium 1906 "plate" connected to or included as part of a chuck 2420C or a buoyancy platform can provide a "dispersed" pressurized gas cushion to support the substrate 4006C, such as providing the substrate 4006C shown in Figure 8C, with reduced or minimized formation of unevenness or other visible defects, without using large openings as shown in Figure 8A. As described in relation to other embodiments herein, a porous medium 1906 "plate" connected to or included as part of a chuck 2420C can provide "dispersed" pressure to uniformly levitate the substrate 4006C during processing, such as without using individual openings as shown in Figure 8A.

[0075] Porous media 1906, or similar dispersion pressure or vacuum areas as described elsewhere herein, having physical dimensions specified to occupy the entire substrate 4006C, or a specific area of ​​the substrate such as the display area or an area outside the display area, can be obtained from Nano TEM Co., Ltd. (Niigata, Japan), etc. Such porous media may include pore sizes specified to provide lift over a specific area while reducing or eliminating unevenness or other visible defects during holding, handling, or other processing, etc. Although not constrained by theory, it is conceivable that the use of porous media can enhance the uniformity of the coating or film layer on the substrate 4006C, for example, by reducing or eliminating unevenness or other visible defects associated with non-uniform thermal or electrostatic field profiles across the substrate surface or on the surface opposite the coating or film layer. The porous medium can be connected to an air supply source to provide a gas cushion, or various porous medium regions can be connected to an air supply source and a vacuum supply source, respectively, to provide a gas cushion having a controlled "flight altitude" within one or more specific zones, as described above with respect to Figure 7. When such a porous medium is used to provide a distributed pressure supply source to levitate the substrate above the chuck surface, the presence of holes for lift pins (e.g., for retracted lift pins) does not need to cause visible defects in the resulting coating generated while the substrate is supported by the gas cushion, and thus makes a larger portion of the substrate area available for the active area.

[0076] Figure 9 illustrates a schematic embodiment illustrating a treatment system that can be configured to expose a substrate to light, which can generally be used when treating a coating on a substrate. The treatment system may be included as part of other systems or techniques described herein, such as for use in a curing process or for performing operations including one or more of baking or drying a liquid ink layer to solidify the liquid ink layer and provide a solid layer. The treatment system may include a light source assembly 912 configured to couple energy to the surface of the substrate 4000. The source assembly may include a source configured to emit one or more of ultraviolet (UV), infrared (IR), or visible light. As in other embodiments, the treatment system 8314 may include a controlled environment, such as one or more provided by a gas purification loop and coupled to one or more fan filter units (FFUs), for example, to provide an environment with a specific maximum level of particulate matter or reactive contaminants.

[0077] The substrate 4000 can be transported to the treatment system 8314, for example, using a levitation table transport array as described in relation to other embodiments described herein. The table 920 can be used to support the substrate 4000, for example, using a gas cushion array as described in other embodiments. One or more lift pins can be used to further raise the substrate 4000, for example, so that the substrate 4000 can be manipulated by the end effector of the handler after treatment (e.g., after the formation of a patterned solid layer on the substrate 4000).

[0078] In illustrative embodiments involving ultraviolet treatment, an array of sources such as sources 910A-910N can provide ultraviolet energy including wavelengths selected from the range of about 350 nanometers to about 400 nanometers. For example, wavelengths of about 385 nanometers or about 395 nanometers can be used. The sources can include various configurations, such as using a relatively small number of high-power sources or an array of relatively low-power sources. The sources can include commonly available ultraviolet emitters such as ultraviolet light-emitting diodes (UV LEDs), or one or more mercury-based devices such as one or more mercury arc sources. In another embodiment, sources 910A-910N can include lamps or other sources that can emit one or more of visible light or infrared radiation. For example, a substrate can be thermally treated using an array of infrared radiation sources.

[0079] In the embodiment, the substrate or housing 918 of the source assembly 912 can be cooled by liquid or air. For example, a plenum 914 can be provided having one or more blowers, such as a blower 915, to push air across or through a portion of the source assembly 912. Such a cooling loop can be isolated from the controlled environment within the treatment system 8314. The environment surrounding the sources 910A-910N may include the controlled environment of the treatment system 8314, or the environment surrounding the sources 910A-910N may form a separate enclosure having a window 916 that allows energy to pass from the source enclosure to the treatment system 8314. In this way, maintenance of the source enclosure does not need to interfere with the controlled environment within the treatment system 8314.

[0080] The window 916 does not need to be uniformly transparent. For example, the window may include or be coupled to optical elements that focus, diverge, or parallelize energy. In another embodiment, the window 916 may include transmission properties that vary in a particular manner across the area of ​​the window, for example, to reverse or otherwise compensate for a non-uniform power density of energy delivered in the plane of the substrate 4000 within a particular region of the substrate. In the embodiment of Figure 9, the window and sources 910A-910N are shown as being arranged in a planar configuration, but other configurations such as cylindrical, parabolic, or spherical configurations are possible. In the embodiment, sources 910A-910N may be used to treat one or more layers of organic material to encapsulate a device fabricated as part of the substrate 4000. Embodiments of such devices may include electronic circuits, solar cells, printed circuit boards, and flat panel displays. Such treatment may include providing a specific dose of ultraviolet energy within a particular range of wavelengths and having a particular uniformity across a particular area of ​​the substrate 4000.

[0081] The treatment process can generally be established in relation to the desired dose or dose range of ultraviolet exposure, such as being specified in terms of energy per unit area (e.g., joules per square centimeter). The dose can be calculated, for example, by multiplying the incident power density by the exposure duration. A trade-off may exist between intensity (e.g., incident power) and exposure duration. For example, the desired dose can be achieved by using a relatively high-power source and a relatively short exposure duration, which beneficially reduces the processing time. However, there may be limits on the power density supplied to the substrate by the ultraviolet source, for example, to avoid damage or degradation, since high-power UV irradiation may damage or degrade other parts of the display assembly.

[0082] To avoid variations in the coating layer characteristics across the surface of the substrate 4000, the uniformity of the delivered ultraviolet energy can also be controlled. Uniformity can be specified with respect to incident power or delivered dose, such as having a variation of 20% or less from the highest to the lowest incident power or dose across a specific curing area of ​​the substrate 4000, or a variation of 50% or less from the highest to the lowest incident power or dose across a specific curing area of ​​the substrate 4000, or a variation of 10% or less from the highest to the lowest incident power or dose across a specific curing area of ​​the substrate 4000.

[0083] Various source configurations can be used for sources 910A-910N. For example, linear array or “bar” sources can be used, as shown in configuration 8315 in Figure 10A. Such bar configurations may include precision reflectors to focus or parallelize energy toward the substrate 4000, for example. In another embodiment, such a bar configuration may include one or more diffusers or transmissive filters, or a two-dimensional array configuration can be used. One or more of these source configurations can be mechanically fixed or scanned across the surface of the substrate. In such embodiments, either or both of the substrate 4000 or sources 910A-910N can be scanned. For example, sources 910A-910N can be fixed, and the substrate 4000 can be moved to generate relative motion between the substrate 4000 and sources 910A-910N to achieve scanning, for example.

[0084] Figures 10A and 10B show at least a portion of the treatment system 8315, which can include a linear configuration of light sources that can be used for treating coatings on a substrate. An embodiment is illustrated. In the embodiment, the treatment system 8315 may include a source linear array configuration 910. The linear array 910 can be scanned in at least one axis to sweep a radiation beam 922 (e.g., ultraviolet radiation) across a specific area of ​​the substrate 4000. In the illustrative embodiment, such an area may include an area on which a liquid ink, which may in the embodiment be an organic monomer-based ink, is deposited and to be cured or otherwise treated with ultraviolet light. Such scanning can be achieved through the movement of one or both of the substrate 4000 or the linear array 910 during treatment, etc. A window 916 may be used, for example, if the linear array 910 is located in an enclosure separate from the chamber 8314 housing the substrate 4000. Such a window 916 may include or be coupled to one or more optical units or filters.

[0085] A linear array 910 can offer the advantage of fewer sources (e.g., about 5 to 10 UV LED sources in the illustrative embodiment). However, such a linear area 910 can introduce additional system complexity when mechanical scanning is used to provide exposure to an entire specific area of ​​the substrate 4000. Mechanical scanning can be simplified in part by specifying that the linear array 910 is at least as wide or long as one axis of the substrate. In this way, the entire width or length of the substrate 4000 can be treated with light emission while scanning the linear array 910 "gantry" along only a single axis. The linear array 910 can include a precision reflector configuration as described above. In an illustrative embodiment, a high-power UV LED light bar supplying light at or near a wavelength of 395 nm is available from Phoseon Technology (Hillsboro, Oregon, USA), which includes a reflector configuration that enhances the uniformity of the area illuminated by the linear array 910. In addition to, or instead of, such precision reflectors, one or more filters or diffusers may be used, either statically configured near the window 916 or included as part of the window 916. In another embodiment, one or more filters or diffusers may be included as part of a linear array 910 assembly, such that they are mechanically scanned as part of the linear array 910. In this embodiment, the power density supplied by the linear UV source is 20 mW / cm² to 400 mW / cm².

[0086] In Figure 10B, the linear array 910 source altitude from the upward portion of the substrate 4000 can be represented by "H", and the relative velocity between the optical energy emitted by the array 910 and the substrate can be represented by "V". The velocity can be established by moving the array 910 relative to the substrate 4000 (e.g., mechanically scanning the array), either by levitating the substrate on a gas cushion or by moving the chuck 920 supporting the substrate, or by moving the substrate 4000 relative to the array. The irradiated width can be represented by "W", such a width increases as H increases and decreases as H decreases. For dose modeling, the width of the array 910 can be multiplied by the irradiated width W to estimate the area of ​​the substrate 4000 irradiated by the array 910.

[0087] In general, throughput is a consideration when considering large substrates 4000 to which the embodiments described herein can be applied. Therefore, one objective may be to provide a light dose in a manner in which an appropriate dose is delivered in a short or minimum time, which can also reduce the possibility of damaging other parts of the substrate 4000, either by reducing or minimizing exposure to energy from the source, or simply by shortening or minimizing the time the substrate is being processed. However, trade-offs may exist between the various processing parameters, and the rate, energy dose, and source altitude H are generally not determined arbitrarily.

[0088] The above embodiments describe various techniques for treating substrates using light, such as to provide a solid coating layer by treating a printed liquid ink layer. Other treatment techniques can be used, including one or more of the following: heating or cooling the substrate, radiating or drying the substrate, using a gas flow at a higher pressure than other parts of the coating system, using a vacuum (or partial vacuum), and combinations thereof. Such treatments can result in the solidification of the liquid ink to provide a solid layer through one or more of the following: removal of a carrier fluid (e.g., one or more of drying or vacuum baking, such as vacuum drying or vacuum baking), chemical reactions (e.g., crosslinking, or chemical conversion from one compound to another), or densification (e.g., baking, such as vacuum baking). Temperature control can be achieved by using a controlled temperature with pressurized gas supporting the substrate, as described with respect to other embodiments herein, or by using one or more of the following: gas flows (e.g., laminar flow) established across the surface of the substrate, as illustrated with respect to Figure 13B.

[0089] Figures 11A and 11B illustrate a part of a system, such as a transfer module, which may be included as part of a coating system or used to manipulate a substrate before or after processing by the coating system. The controlled environment within the various enclosures of the system may include a controlled particulate matter level. Particulate matter can be reduced or minimized, for example, by using air circulation units and filters, which may be referred to as fan filter units (FFUs). An array of FFUs may be positioned along a path traversed by the substrate during processing. The FFUs do not need to provide a downward flow direction for the airflow. For example, FFUs or piping may be positioned to provide substantially laminar flow laterally across the surface of the substrate. Such laminar flow laterally can enhance or otherwise provide particulate matter control.

[0090] In the embodiment shown in Figure 11A or Figure 11B, one or more fan filter units (FFUs), such as FFUs 1500A, 1500B, 1500C-1500F, may be used to help maintain an environment with controlled levels of particulate matter or contaminants within the transfer module 1400A. Ducts, such as first and second ducts 5201A or 5201B, may be used to provide a return air path, as shown in the downstream embodiment of Figure 11A. A controlled temperature can be maintained using at least partially a temperature controller 8700, such as one or more heat exchangers 1502. One or more temperature monitors, such as temperature monitor 8701, may be placed in specific locations (e.g., on or near the substrate or end effector) to provide feedback to help maintain the substrate or an area near the substrate within a specific range of temperature. In embodiments, as discussed below, the temperature monitors may be non-contact sensors, such as infrared temperature monitors, configured to provide information indicating the surface temperature sampled by the sensor. Other configurations are possible, including placing the heat exchanger in or near the return air duct in the lower part of the chamber, as illustrated in Figure 13B.

[0091] Figure 12 illustrates a part of the system, including further embodiments of a transfer module, which can generally be included as part of a coating system or used to manipulate a substrate before or after processing by the coating system. As in the embodiment of Figure 11A, the transfer module 1400B may include one or more fan filter units (FFUs) (e.g., 14 FFUs), such as 1500A-1500N. In contrast to the handler 1410A of the transfer module 1400A in Figure 11A, the transfer module The handler within module 1400B may include a track configuration, for example, to provide linear translation of the handler along an axis. A wide range of other chambers or modules can be connected to the transport module 1400B in a clustered configuration, etc., without requiring each other module or chamber to be connected in a manner that radiates outward from a single point. One or more ducts may be located within a portion of the transport module 1400B in an area outside the range of the handler's movement. For example, such a location could be used to provide a return duct that carries gas (e.g., nitrogen) upward from the lower portion of the transport module 1400B to the plenum above the FFU array.

[0092] Figures 13A and 13B illustrate at least a portion of the system which may generally include a stacked configuration of areas of substrate 4000 that can be used for processing or holding substrates. Ports of processing module 1200 may include one or more doors or hatches, such as door 3301. For example, such doors may be mechanically or electrically interlocked so that a door providing access to the outside of the fabrication system cannot be opened unless a corresponding door on or elsewhere within the system is closed. For example, door 3301 may be used for maintenance, while processing module 1200 is separately isolated from an inert environment or a controlled environment from particulate matter or contaminants in other enclosed parts of the fabrication system.

[0093] As described above, a controlled environment for particulate matter or contaminants can be maintained using at least one or more FFUs 1500, in part. In the embodiment of Figure 13B, a cross-flow configuration is used, for example, to maintain a substantially laminar flow of gas (e.g., non-reactive gas) across each of one or more cells 3350 that can contain substrates. A heat exchanger 1502 may or may not be located near the FFU 1500, or as part of it. For example, the heat exchanger 1502 may be located below the substrate handling area, for example, within or as part of the return duct 5201. The temperature can be controlled by a temperature controller 8700, such as being connected to a temperature sensor 8701. The curved shape of a portion of the duct 5201 can be determined, at least in part, using computational hydrodynamic techniques, for example, to maintain specific flow characteristics (e.g., laminar flow) within the processing module 1200.

[0094] In addition to queuing such substrates (or instead of queuing them), such as until another part of the system is ready to receive them, the processing module 1200 can functionally participate in the substrate fabrication process by, for example, providing a drying function, or by holding the substrate for a specific duration (or until certain criteria are met) to allow the substrate to develop from one state to another. When holding a substrate for the purpose of developing it, for example, the substrate may be held to allow a liquid to settle or flow. The temperature of such a developing substrate can be controlled through the controlled application of a temperature-controlled gas flow across the substrate surface, such as a laminar flow, which can be provided to flow across the surface of the substrate, as shown in Figure 13B.

[0095] In general, the temperature of the holding module does not need to be the same as the temperature of the other parts of the system or the surrounding environment. In another embodiment, the substrate may be placed on a temperature-controlled gas cushion (as in other embodiments described herein, such as when the substrate is supported using a gas levitation cushion for one or more operations such as printing, holding, or other operations, including one or more of the following: exposure of the substrate to light for radiant baking or drying, convection baking or drying, or to induce a chemical reaction, etc., and one or more of these combinations).

[0096] When drying a substrate within the processing module 1200, the controlled environment can provide continuous removal of evaporated vapor by a vapor trap or gas recirculation and purification system, and the drying process can be further controlled through the controlled application of a gas flow across the substrate surface, such as a laminar flow, which can be provided to flow across the surface of the substrate, as shown in Figure 13B.

[0097] (Examples) (Various annotations and examples) Example 1 includes or can include a subject (such as a device-readable medium, which, when performed by an apparatus, method, means, or device for performing an act, includes instructions that cause the device to perform an act), which includes a method for providing a coating on a substrate, the method comprising: transporting a substrate to a coating system configured to provide a solid layer in a specific area on a first side of the substrate, the solid layer covering at least a portion of the substrate; supporting the substrate in the coating system using a gas cushion provided on a second side of the substrate opposite to the specific area; printing a liquid coating covering a specific area of ​​the substrate with the substrate located in a printing zone, using a printing system while the substrate is supported by the gas cushion; transporting the substrate to a treatment zone while continuing to support the substrate using the gas cushion; and treating the liquid coating in the coating system to provide a solid layer on the substrate in a specific area, while continuing to support the substrate using the gas cushion.

[0098] Example 2 may optionally include the subject matter of Example 1, or may optionally be combined with it, such that the solid layer comprises at least a portion of the encapsulation structure, the substrate comprises an electronic device, and the encapsulation structure is established on the substrate to encapsulate at least a portion of the electronic device.

[0099] Example 3 may optionally include the subject of one or any combination of Examples 1 or 2, or may optionally be combined therewith, such that treating the liquid coating includes polymerizing the liquid coating.

[0100] Example 4 may optionally include the subject of one or any combination of Examples 1 to 3, or may optionally be combined therewith, to include holding the substrate for a specific duration after printing a liquid coating while continuing to support the substrate using a gas cushion.

[0101] Example 5 may optionally include, or may optionally combine with, the subject of Example 4, such as transporting a substrate to a holding zone for holding the substrate for a specific duration.

[0102] Example 6 may optionally include the subject matter of Example 5, or may optionally be combined with it, such as including the use of a holding zone configured to hold and support multiple substrates using a gas cushion.

[0103] Example 7 may optionally include, or optionally combine, the subject of one or any combination of Examples 1 to 6, such that treating the liquid coating includes irradiating the liquid coating with light.

[0104] Example 8 may optionally include the subject of Example 7, or may optionally be combined with it, such that the light includes ultraviolet (UV) light.

[0105] Example 9 may optionally include the subject matter of Example 7, or may optionally be combined with it, such that irradiating the liquid coating with light includes baking the liquid coating by radiation.

[0106] Example 10 may optionally include the subject matter of Example 7, or may optionally be combined with it, such that irradiating the liquid coating with light includes drying the liquid coating by radiation.

[0107] Example 11 may optionally include, or optionally combine, the subject of one or any combination of Examples 1 to 10, such that the liquid coating treatment includes one or more of exposing the substrate to infrared radiation or to a temperature-controlled gas flow.

[0108] Example 12 may optionally include, or optionally combine, the subject matter of one or any combination of Examples 1 to 11, such that a specific area on a first side of the substrate overlaps with an active area of ​​the substrate comprising an electronic device, and a gas cushion is provided on a second side of the substrate opposite to the active area.

[0109] Example 13 may optionally include, or be optionally combined with, the subject of one or any combination of Examples 1 to 12, such that transporting the substrate includes engaging or grasping the substrate using physical contact with the substrate.

[0110] Example 14 may optionally include the subject of one or any combination of Examples 1 to 13, or may optionally be combined therewith, such that the gas cushion is established by pushing gas through the porous ceramic material so that it supports a second side of the substrate above the porous ceramic material.

[0111] Example 15 may optionally include themes from one or any combination of Examples 1 to 14, or may optionally be combined therewith, such that a gas cushion within the printing zone is established using a combination of a pressurized gas area and at least a partial vacuum.

[0112] Example 16 may optionally include, or optionally combine with, the subject matter of Example 15, such that at least one of the pressurized gas or exhaust gas used to establish the gas cushion is recovered and recycled.

[0113] Example 17 may include one or any combination of subjects from Examples 1 to 16, or optionally combined thereof, such as a subject (a machine-readable medium, etc., which, when performed by an apparatus, method, means, or machine for performing an act, includes instructions that can cause a machine to perform an act), and the method includes: transporting a substrate to an enclosed coating system, the enclosed coating system being configured to provide a solid layer within a specific area on a first side of the substrate, the solid layer covering at least a portion of an electronic device fabricated on the substrate; supporting the substrate within the enclosed coating system using a gas cushion provided on a second side of the substrate opposite to the specific area; printing a liquid coating covering a specific area of ​​the substrate with the substrate located in a printing zone including a printing system while the substrate is supported by the gas cushion; transporting the substrate to a treatment zone while continuing to support the substrate using the gas cushion; and treating the liquid coating in the treatment zone to provide a solid layer on the substrate within a specific area while continuing to support the substrate using the gas cushion.

[0114] Example 18 may optionally include the subject matter of Example 17, or may optionally be combined therewith, such that treating the liquid coating includes one or more of baking or drying the liquid coating to provide a solid layer.

[0115] Example 19 may optionally include, or optionally combine with, the subject matter of Example 18, such that treating the liquid coating includes one or more of exposing the substrate to infrared radiation or to a temperature-controlled gas flow.

[0116] Example 20 may optionally include, or optionally combine, the subject of one or any combination of Examples 17 to 19, such that treating the liquid coating includes solidifying the liquid coating by inducing a chemical reaction or removing a carrier fluid contained in the liquid coating.

[0117] Example 21 may optionally include the subject of one or any combination of Examples 17 to 20, or may optionally be combined therewith, such that the solid layer comprises at least a portion of an encapsulation structure established to encapsulate at least a portion of an electronic device on the substrate.

[0118] Example 22 may optionally include, or optionally combine, the subject of one or any combination of Examples 17 to 21, to include transporting a substrate to a holding zone and holding the substrate for a specified duration, while continuing to support the substrate using a gas cushion.

[0119] Example 23 may include, or optionally combine, one or any combination of, the subjects from Examples 1 to 22, such as a subject (a machine-readable medium, etc., including an instruction that, when performed by an apparatus, method, means, or machine, can cause a machine to perform an act), which may include a coating system for providing a solid layer on a substrate, wherein the system comprises a platform configured to support a substrate using a gas cushion and to transport the substrate along the platform; a printing system configured to deposit a liquid coating in a specific area on the first side while the substrate is supported by the gas cushion on a first side and a second side of the substrate opposite to the first side, when the substrate is located within the printing zone of the platform; and a treatment system configured to provide a solid layer on the substrate in a specific area by treating the deposited liquid while the substrate is supported by the gas cushion, when the substrate is located within the treatment zone of the platform, wherein the platform is configured to continuously support the substrate during printing operations in the printing zone and during treatment operations in the treatment zone.

[0120] Example 24 may optionally include the subject matter of Example 23, or may optionally be combined with it, such that the solid layer comprises at least a portion of the encapsulation structure, the substrate comprises an electronic device, and the encapsulation structure is established on the substrate to encapsulate at least a portion of the electronic device.

[0121] Example 25 may optionally include, or optionally combine, the subject of one or any combination of, the subject of Example 23 or 24, such that the treatment system includes a light source, the source being configured to irradiate a liquid coating to provide a solid layer.

[0122] Example 26 may optionally include the subject matter of Example 25, or may optionally be combined with it, such that the source includes an ultraviolet (UV) source.

[0123] Example 27 may optionally include the subject matter of Example 25, or may optionally be combined with it, such that the source comprises an infrared source.

[0124] Example 28 may optionally include, or optionally combine, the subject of one or any combination of, of Examples 23 to 25, such that the treatment system is configured to provide a solid layer by performing one or more of the following: baking or drying a liquid coating.

[0125] Example 29 may optionally include, or optionally combine, the subject of one or any combination of, of Examples 23 to 28, such that the treatment system is configured to solidify the liquid coating by inducing a chemical reaction or removing a carrier fluid contained in the liquid coating.

[0126] Example 30 may optionally include, or optionally combine, the themes of one or any combination of Examples 23 to 29, including the platform being configured to hold the substrate for a specific duration after a printing operation and before a treatment operation, including the platform continuing to support the substrate using a gas cushion.

[0127] Example 31 may optionally include, or optionally combine with, the subject matter of Example 30, including a holding zone which is a holding zone separate from the printing and processing zones and includes using a gas cushion to continue supporting the substrate and is configured to hold the substrate for a specific duration.

[0128] Example 32 may optionally include themes from one or any combination of Examples 23 to 30, or may optionally be combined therewith, to include an enclosure housing a printing system, a treatment system, and a platform, which includes a controlled processing environment at or near atmospheric pressure and is established to remain below specific limits for particulate matter contamination levels, water vapor content, oxygen content, and ozone content.

[0129] Example 33 may optionally include, or optionally combine, the subject matter of one or any combination of Examples 23 to 32, such that a specific area on a first side of the substrate overlaps with an active area of ​​the substrate having an electronic device, and the platform is configured to supply gas to a second side of the substrate opposite to the active area.

[0130] Example 34 optionally includes the configuration such that the platform is configured to transport the substrate, including engaging or grasping the substrate using physical contact with the substrate. The subject may include one or any combination of the subjects from Examples 23 to 33, or may be combined with them as desired.

[0131] Example 35 may optionally include the subject of one or any combination of Examples 23 to 34, or may optionally be combined therewith, such that a gas cushion is established by pushing gas through a porous ceramic material so that a second side of the substrate is supported above the porous ceramic material.

[0132] Each of the non-limiting embodiments described herein can stand alone or be combined in various permutations or combinations with one or more of the other embodiments.

[0133] The embodiments for carrying out the invention described herein include references to accompanying drawings that form part of the embodiments for carrying out the invention. The drawings illustrate specific embodiments in which the invention can be put into practice. These embodiments are also referred to herein as “Examples.” Such examples may include elements in addition to those shown or described. However, the inventors also consider examples in which only these elements shown or described are provided. Furthermore, the inventors also consider examples that use any combination or permutation of these elements shown or described, either with respect to a particular embodiment (or one or more aspects thereof) or with respect to other embodiments (or one or more aspects thereof) shown or described herein. In the event of any inconsistent use between this text and any document so as to be incorporated by reference, the use herein shall prevail.

[0134] In this text, the term “one (a or an)” is used as is common in patent documents to include one or more, independent of any other instances or uses of “at least one” or “one or more.” In this text, the term “or” is used to refer to non-exclusive “or,” such that “A or B” includes “A but not B,” “B but not A,” and “A and B.” In this text, the terms “including” and “in which” are used as plain English equivalents of the terms “comprising” and “wherein.” Furthermore, in the following claims, the terms “including” and “comprising” are non-restrictive; that is, a system, device, component, composition, formulation, or process that includes elements in addition to those described after such terms in the claim is still considered to fall within the scope of that claim. Furthermore, in the following claims, terms such as "first," "second," and "third" are used merely as identifiers and are not intended to impose numerical requirements on them.

[0135] Embodiments of the methods described herein can be implemented, at least in part, mechanically or computer-readably. Some embodiments may include computer-readable or machine-readable media encoded with instructions that are operable to configure an electronic device to perform the methods described in the embodiments above. Such implementations of the methods may include code such as microcode, assembly language code, or higher-order language code. Such code may include computer-readable instructions for performing various methods. The code may form part of a computer program product. Furthermore, in embodiments, the code may be explicitly stored on one or more volatile, non-transient, or non-volatile tangible computer-readable media during execution or at other times. Embodiments of these tangible computer-readable media may include, but are not limited to, hard disks, removable magnetic disks, removable optical disks (e.g., compact discs and digital video discs), magnetic cassettes, memory cards or sticks, random-access memory (RAM), read-only memory (ROM), and the like.

[0136] The above description is intended to be illustrative, not restrictive. For example, the above embodiments (or one or more aspects thereof) may be used in combination with one another. Other embodiments may be used by those skilled in the art, etc., by reconsidering the above description. The abstract is provided in accordance with 37 CFR §1.72(b) to enable the reader to quickly confirm the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Also, in the forms for carrying out the above invention, various features may be grouped together to streamline the disclosure. This should not be interpreted as meaning that any disclosed feature not claimed is essential to any claim. Rather, the subject matter of the invention may lie in features that are not all of a particular disclosed embodiment. Accordingly, the following claims are incorporated into the forms for carrying out the invention as embodiments or examples, and each claim stands alone as a separate embodiment, and it is taken into consideration that such embodiments may be combined with one another in various combinations or permutations. The scope of the invention should be determined by reference to the appended claims, along with the full range of equivalents that such claims may enjoy.

Claims

1. A coating system, wherein the coating system is Enclosure and, The printing zone within the enclosure, wherein the printing zone includes a printing zone equipped with an inkjet system, The treatment zone within the enclosure, wherein the treatment zone includes a treatment system, A rotatable platform within the enclosure for transporting the substrate from the printing zone to the processing zone, The system includes a movable substrate handler for placing the substrate in the printing zone and for removing the substrate from the printing zone, The rotatable platform is a coating system comprising a gas cushion substrate support.

2. The coating system according to claim 1, further comprising a processing zone within the enclosure, wherein the rotatable platform transports a substrate between the printing zone, the treatment zone, and the processing zone.

3. The coating system according to claim 1, wherein the printing zone comprises a gas cushion substrate support.

4. The coating system according to claim 1, further comprising an input module, wherein the substrate handler is movable for removing the substrate from the input module.

5. The coating system according to claim 1, wherein the printing zone includes a gripper for holding the substrate during printing.

6. The coating system according to claim 5, wherein the substrate handler is located outside the enclosure.

7. The coating system according to claim 1, wherein at least one of the printing zone, the treatment zone, and the rotatable platform has a gas cushion support for supporting the substrate when the substrate is transported from the printing zone to the treatment zone.

8. The coating system according to claim 3, wherein the gas cushion substrate support in the printing zone provides a combination of pressurized gas and vacuum to control the levitation of the substrate.

9. A coating system, wherein the coating system is Enclosure and, The printing zone within the enclosure comprises an inkjet system having a gas cushion substrate support, The treatment zone within the enclosure comprises a treatment system having a gas cushion substrate support, A rotatable platform within the enclosure for transporting the substrate from the printing zone to the processing zone, A movable substrate handler is provided for placing the substrate in the printing zone and for removing the substrate from the printing zone. The rotatable platform is a coating system comprising a gas cushion substrate support.

10. The coating system according to claim 9, wherein the gas cushion substrate support in each or both of the printing zone and the treatment zone is provided with a temperature-controlled gas flow.

11. The coating system according to claim 9, wherein the substrate handler is located outside the enclosure.

12. The coating system according to claim 9, further comprising a processing zone within the enclosure, wherein the rotatable platform transports a substrate between the printing zone, the treatment zone, and the processing zone.

13. The coating system according to claim 12, wherein the gas cushion substrate support in the printing zone provides a combination of pressurized gas and vacuum to control the levitation of the substrate.

14. The enclosure is the first enclosure, the printing zone is the first printing zone, the treatment zone is the first treatment zone, the rotatable platform is the first rotatable platform, and the enclosure, the printing zone, the treatment zone, and the rotatable platform are part of the first coating unit, and further, The coating system according to claim 9, comprising a second coating unit having a second enclosure, a second printing zone within the second enclosure, a second treatment zone within the second enclosure, and a second rotatable platform within the second enclosure, wherein the substrate handler is movable for positioning a substrate in the second printing zone and removing the substrate from the second printing zone.

15. A coating system, wherein the coating system is Coating unit and Enclosure and, The printing zone within the enclosure comprises an inkjet system having a gas cushion substrate support and a substrate gripper, The treatment zone within the enclosure comprises a treatment system having a gas cushion substrate support and an ultraviolet light source, A rotatable platform within the enclosure for transporting the substrate from the printing zone to the processing zone, The system includes a movable substrate handler for placing the substrate in the printing zone and for removing the substrate from the printing zone, The rotatable platform is a coating system comprising a gas cushion substrate support.

16. The coating system according to claim 15, further comprising an input module, wherein the substrate handler is movable for removing the substrate from the input module.

17. The coating system according to claim 15, wherein the substrate handler is housed in a transfer module located outside the enclosure.

18. The coating system according to claim 15, wherein the coating unit further comprises a processing zone within the enclosure, and the rotatable platform transports a substrate between the printing zone, the treatment zone, and the processing zone.

Images