Electrochemical deposition process

Claims

1. A process for preparing a substrate; a base layer forming step of forming a base layer on a surface of the base material, the base layer including a material that exhibits electrical conductivity when subjected to either an oxidation action or a reduction action; an electrochemical process in which, while the underlayer and an electrical contact are immersed in an electrolyte, a current is supplied to the underlayer via the electrical contact, and a film is grown along a surface of the underlayer starting from the electrical contact; having The underlayer formation process is an electrochemical film formation process characterized in that a coating liquid in which fine particles of the material or a precursor of the material is dispersed or dissolved in a solvent is applied to the surface of the substrate, and then the solvent is removed to form the underlayer, thereby forming the underlayer without using a binder made of an insulating organic material.

2. The electrochemical deposition process according to claim 1, An electrochemical deposition process, characterized in that the material exhibits electrical conductivity upon electrolysis.

3. The electrochemical deposition process of claim 1, comprising: An electrochemical deposition process, wherein the material exhibits electrical conductivity in response to an oxidizing agent or a reducing agent.

4. The electrochemical deposition process of claim 1, comprising: An electrochemical deposition process, wherein the material exhibits electrical conductivity upon reduction with hydrogen.

5. The electrochemical deposition process of claim 1, comprising: An electrochemical deposition process, wherein the material exhibits electrical conductivity when exposed to light energy.

6. The electrochemical deposition process of claim 2, comprising: the material exhibits electrical conductivity upon electrolysis in the electrolyte in the electrochemical process; In the electrochemical step, a negative potential is applied to the electrical contact with respect to a counter electrode in contact with the electrolyte to perform electrolysis; the electrolytic solution is a plating solution containing H + ions, The electrochemical film formation process, wherein the film is a plating film.

7. The electrochemical deposition process of claim 6, comprising: The electrochemical film formation process, wherein in the electrochemical step, the material exhibits electrical conductivity by being doped with H + ions during electrolysis in the electrolyte.

8. The electrochemical deposition process according to claim 6 or 7, The electrochemical deposition process, wherein the material contains a metal element having two or more oxidation numbers.

9. The electrochemical deposition process of claim 8, comprising: The electrochemical film formation process, characterized in that the metal element is at least one transition element selected from the group consisting of tungsten, molybdenum, vanadium, niobium, indium, titanium, tantalum, iridium, rhodium, tin, chromium, manganese, iron, cobalt, nickel, copper, and cerium.

10. The electrochemical deposition process of claim 9, comprising: The electrochemical deposition process, wherein the material is a compound including at least one of a tungsten compound and a molybdenum compound.

11. The electrochemical deposition process according to claim 6 or 7, The electrochemical film formation process is characterized in that, in the electrochemical process, when the plating film is grown along the surface of the base layer, the relative position of the substrate with respect to the liquid surface of the plating solution is changed so that the plating solution does not come into contact with areas where the plating film has already been formed.