Modeling system, processing system, modeling method, and processing method

Abstract

This modeling system comprises a modeling device that is capable of modeling a modeled article using an irradiation optical system with which the surface of an object can be irradiated with a modeling beam, a measurement device that is capable of measuring an emitted beam including at least one of the modeling beam and a guide beam, a movement device that causes the irradiation optical system and the measurement device to move relatively along a direction intersecting the optical axis of the irradiation optical system within a modeling period, and a control device that is capable of controlling the modeling device on the basis of the result of measurement of the emitted beam by the measurement device. The irradiation optical system includes a movement member that causes the emitted beam to move along a direction intersecting the optical axis of the irradiation optical system within the modeling period. The measurement device measures the emitted beam within a measurement period. The control device controls the movement member within the modeling period on the basis of the result of measuring the emitted beam within the measurement period.

Description

Forming system, processing system, forming method and processing method

[0001] The present invention relates to the technical fields of, for example, a modeling system and modeling method capable of modeling a model on an object, and a processing system and processing method capable of processing an object.

[0002] An example of a processing system capable of processing an object is described in Patent Document 1. In particular, Patent Document 1 describes, as an example of a processing system, a molding system capable of molding a shaped object on an object. One of the technical challenges of such a processing system is to appropriately process the object.

[0003] US Patent Application Publication No. 2016 / 0311059

[0004] According to a first aspect, there is provided a modeling apparatus including an irradiation optical system capable of irradiating a modeling beam onto a surface of an object, and capable of forming a model on the object by supplying a modeling material to a molten pool formed on the object by the modeling beam; a measurement device capable of measuring an injection beam including at least one of the modeling beam and a guide beam emitted from the irradiation optical system; a movement device that relatively moves the irradiation optical system and the measurement device along a direction intersecting an optical axis of the irradiation optical system during at least a part of a modeling period in which the modeling apparatus forms the model; and a control device capable of controlling the modeling apparatus based on a measurement result of the injection beam by the measurement device. and a measuring device, wherein the irradiation optical system includes a moving member that moves the emission beam emitted from the irradiation optical system along a direction intersecting the optical axis of the irradiation optical system during at least a portion of the modeling period, the measuring device measures the emission beam during at least a portion of the measurement period during which the moving member moves the irradiation position of the emission beam on the measuring device and the moving device moves at least one of the irradiation optical system and the measuring device, and the control device controls the moving member during at least a portion of the modeling period based on the measurement result of the emission beam during the measurement period.

[0005] According to a second aspect, there is provided a modeling device including a first irradiation optical system capable of irradiating a surface of an object with a first modeling beam, and a second irradiation optical system capable of irradiating a surface of the object with a second modeling beam, and capable of modeling a model on the object by supplying a modeling material to at least one molten pool formed by at least one of the first and second modeling beams; a measurement device capable of measuring each of a first injection beam including at least one of the first modeling beam and a first guide beam emitted from the first irradiation optical system, and a second injection beam including at least one of the second modeling beam and a second guide beam emitted from the second irradiation optical system; and a control device for controlling the modeling device based on a measurement result of at least one of the first and second injection beams by the measurement device. and a control device capable of controlling the first and second deflection members, wherein the first irradiation optical system includes a first deflecting member that deflects the first emission beam so that the irradiation position of the first emission beam moves on the object or on the measurement device along a direction intersecting the optical axis of the first irradiation optical system, and the second irradiation optical system includes a second deflecting member that deflects the second emission beam so that the irradiation position of the second emission beam moves on the object or on the measurement device along a direction intersecting the optical axis of the second irradiation optical system, and the control device controls at least one of the first deflecting member and the second deflecting member based on at least one of a measurement result of the first emission beam by the measurement device and a measurement result of the second emission beam by the measurement device.

[0006] According to a third aspect, a manufacturing system is provided which includes: a manufacturing device including an irradiation optical system capable of irradiating a manufacturing beam onto the surface of an object, and capable of manufacturing a model on the object by supplying a manufacturing material to a molten pool formed on the object by the manufacturing beam; a mounting member on which the object is placed and which is rotatable around a rotation axis that intersects the optical axis of the irradiation optical system; a measuring device disposed on the mounting member, rotatable around the rotation axis, and capable of measuring an injection beam including at least one of the manufacturing beam and a guide beam emitted from the irradiation optical system; and a control device capable of controlling the manufacturing device based on the measurement results of the injection beam by the measuring device.

[0007] According to a fourth aspect, there is provided a processing system comprising: a processing device including an irradiation optical system capable of irradiating a processing beam onto a surface of an object and capable of processing the object with the processing beam; a measurement device capable of measuring an emission beam including the processing beam and at least one of a guide beam emitted from the irradiation optical system; and a control device capable of controlling the processing device based on the measurement results of the emission beam by the measurement device, wherein the irradiation optical system includes a moving member that moves the emission beam emitted from the irradiation optical system along a direction intersecting the optical axis of the irradiation optical system, and the measurement device measures the emission beam during at least a portion of a measurement period during which the moving member moves the irradiation position of the emission beam on the measurement device. A processing system is provided, comprising: a processing device including a first irradiation optical system capable of irradiating a surface of an object with a first processing beam; and a second irradiation optical system capable of irradiating a surface of the object with a second processing beam, and capable of processing the object with at least one of the first and second processing beams; a measurement device capable of measuring each of a first emission beam including at least one of the first processing beam and a first guide beam emitted from the first irradiation optical system, and a second emission beam including at least one of the second processing beam and a second guide beam emitted from the second irradiation optical system; and a control device capable of controlling the processing device based on measurement results of at least one of the first and second emission beams by the measurement device, wherein the first irradiation optical system includes a first deflecting member that deflects the first emission beam so that the irradiation position of the first emission beam moves along a direction intersecting the optical axis of the first irradiation optical system, and the second irradiation optical system includes a second deflecting member that deflects the second emission beam so that the irradiation position of the second emission beam moves along a direction intersecting the optical axis of the second irradiation optical system.

[0008] According to a sixth aspect, there is provided a processing system comprising: a processing device including an irradiation optical system capable of irradiating a processing beam onto a surface of an object and capable of processing the object with the processing beam; a mounting member on which the object is placed and which is rotatable around a rotation axis intersecting the optical axis of the irradiation optical system; a measuring device disposed on the mounting member, rotatable around the rotation axis, and capable of measuring an emission beam including at least one of the processing beam and a guide beam emitted from the irradiation optical system; and a control device capable of controlling the processing device based on the measurement results of the emission beam by the measuring device.

[0009] According to a seventh aspect, a modeling apparatus including an irradiation optical system capable of irradiating a surface of an object with a modeling beam supplies a modeling material to a molten pool formed on the object by the modeling beam, and a measuring device measures an injection beam including at least one of the modeling beam and a guide beam emitted from the irradiation optical system, and the irradiation optical system and the measuring device are moved relatively along a direction intersecting an optical axis of the irradiation optical system during at least a part of a modeling period during which the modeling apparatus forms the model, and a moving member included in the irradiation optical system is used to measure the injection beam. a measuring unit for measuring the irradiation position of the irradiation beam on the measurement device using the movable member and measuring the irradiation beam during at least a portion of a measurement period during which at least one of the irradiation optical system and the measurement device is moved; and a modeling method is provided in which the measuring unit includes controlling the movable member during at least a portion of the modeling period based on the measurement result of the irradiation beam during the measurement period.

[0010] According to an eighth aspect, a method for manufacturing a shaped object using a manufacturing device including a first irradiation optical system capable of irradiating a surface of an object with a first manufacturing beam and a second irradiation optical system capable of irradiating a surface of the object with a second manufacturing beam is provided, wherein a manufacturing material is supplied to at least one molten pool formed by at least one of the first and second manufacturing beams, thereby manufacturing a shaped object on the object; a measuring device is used to measure a first injection beam including at least one of the first manufacturing beam and a first guide beam emitted from the first irradiation optical system, and a second injection beam including at least one of the second manufacturing beam and a second guide beam emitted from the second irradiation optical system; and a first deflection member provided in the first irradiation optical system and capable of deflecting the first injection beam is used to measure the first injection beam on the object. a second deflecting member provided in the second irradiation optical system and capable of deflecting the second emission beam, to move the irradiation position of the second emission beam on the object or on the measurement device along a direction intersecting the optical axis of the second irradiation optical system; and controlling the modeling device based on measurement results of at least one of the first and second emission beams, wherein controlling the modeling device includes controlling at least one of the first deflecting member and the second deflecting member based on at least one of the measurement results of the first emission beam and the measurement result of the second emission beam by the measurement device.

[0011] According to a ninth aspect, there is provided a manufacturing method including: using a manufacturing device including an irradiation optical system capable of irradiating a manufacturing beam onto the surface of an object placed on a mounting member, manufacturing a model on the object by supplying a manufacturing material to a molten pool formed on the object by the manufacturing beam; using a measurement device arranged on the mounting member to measure an injection beam including at least one of the manufacturing beam and a guide beam emitted from the irradiation optical system; rotating the mounting member around a rotation axis intersecting the optical axis of the irradiation optical system, rotating the measurement device around the rotation axis; and controlling the manufacturing device based on the measurement results of the injection beam.

[0012] According to a tenth aspect, there is provided a processing method including: processing an object using a processing device including an irradiation optical system capable of irradiating a processing beam onto a surface of the object; measuring, using a measurement device, an emission beam including at least one of the processing beam and a guide beam emitted from the irradiation optical system; using a moving member included in the irradiation optical system to move the emission beam emitted from the irradiation optical system along a direction intersecting an optical axis of the irradiation optical system; and controlling the processing device based on a measurement result of the emission beam, wherein measuring the emission beam includes measuring the emission beam during at least a portion of a measurement period during which the irradiation position of the emission beam is moved on the measurement device using the moving member.

[0013] According to an eleventh aspect, there is provided a processing method including: processing an object using a processing device including a first irradiation optical system capable of irradiating a surface of the object with a first processing beam; and a second irradiation optical system capable of irradiating a surface of the object with a second processing beam; measuring a first emission beam including at least one of the first processing beam and a first guide beam emitted from the first irradiation optical system, and a second emission beam including at least one of the second processing beam and a second guide beam emitted from the second irradiation optical system; moving an irradiation position of the first emission beam along a direction intersecting with an optical axis of the first irradiation optical system by using a first deflection member included in the first irradiation optical system and capable of deflecting the first emission beam; moving an irradiation position of the second emission beam along a direction intersecting with the optical axis of the second irradiation optical system by using a second deflection member included in the second irradiation optical system and capable of deflecting the second emission beam; and controlling the processing device based on a measurement result of at least one of the first and second emission beams.

[0014] According to a twelfth aspect, there is provided a processing method including: processing an object placed on a mounting member using a processing device including an irradiation optical system capable of irradiating a processing beam onto the surface of the object; measuring an emission beam including at least one of the processing beam and the guide beam emitted from the irradiation optical system using a measurement device arranged on the mounting member; rotating the mounting member around a rotation axis intersecting the optical axis of the irradiation optical system, and rotating the measurement device around the rotation axis; and controlling the processing device based on the measurement result of the emission beam.

[0015] The functions and other advantages of the present invention will become apparent from the following detailed description of the preferred embodiments.

[0016] FIG. 1 is a cross-sectional view showing the appearance of a processing system according to this embodiment. FIG. 2 is a cross-sectional view showing the configuration of the processing system according to this embodiment. FIG. 3 is a block diagram showing the configuration of the processing system according to this embodiment. FIG. 4 is a cross-sectional view showing the configuration of an irradiation optical system. FIG. 5(a) is a plan view showing the movement trajectory of a target irradiation area within a processing unit area, and FIG. 5(b) is a plan view showing the movement trajectory of a target irradiation area on a printing surface. FIGS. 6(a) and 6(b) are plan views showing the movement trajectory of a target irradiation area within a processing unit area, and FIG. 6(c) is a plan view showing the movement trajectory of a target irradiation area on a printing surface. FIG. 7(a) is a top view showing the configuration of a calibration unit, and FIGS. 7(b) and 7(c) are cross-sectional views (A-A' cross-sectional views of FIG. 7(a)) showing the configuration of the calibration unit. FIG. 8 is a cross-sectional view showing a calibration unit positioned at a non-measurement position. FIG. 9(a) is a cross-sectional view showing a calibration unit positioned at a non-measurement position, and FIG. 9(b) is a cross-sectional view showing a calibration unit positioned at a measurement position. FIGS. 10( a) to 10(d) are plan views showing an example of a mark formed on the calibration unit. FIGS. 11(a) to 11(e) are cross-sectional views showing a state in which a processing light is irradiated onto a certain area on a workpiece and a modeling material is supplied. FIG. 12(a) is a plan view showing a target movement trajectory of a processing unit area, and FIG. 12(b) is a plan view showing a linear object to be formed on a modeling surface when the processing unit area moves along the target movement trajectory shown in FIG. 12(a). FIGS. 13(a) to 13(c) are cross-sectional views showing a process of forming a three-dimensional structure. FIG. 14 is a cross-sectional view showing an example of a position measurement device. FIG. 15 is a cross-sectional view showing a probe in contact with a reference surface of the calibration unit. FIG. 16 is a cross-sectional view showing another example of a position measurement device. FIG. 17 is a plan view showing an example of a target movement trajectory of the processing light on a search mark. FIG. 18 is a waveform diagram showing the result of receiving the processing light via the search mark. Fig. 19 is a plan view showing an example of a target movement locus of the processing light on a search mark, Fig. 20 is a plan view showing the processing light crossing a slit mark, and Fig. 21 is a waveform diagram showing the result of receiving the processing light via the slit mark.FIG. 22 is a graph showing the spot diameter of the processing light. FIG. 23 is a plan view showing the processing light irradiated onto a pinhole mark. FIG. 24 is a waveform diagram showing the result of receiving the processing light through the pinhole mark. FIG. 25 is a plan view showing the amount of deviation in the irradiation position of the processing light. FIG. 26 is a plan view showing the processing light irradiated onto a slit mark. FIG. 27 is a plan view showing the processing light irradiated onto a slit mark. FIGS. 28(a) and 28(b) are waveform diagrams showing the result of receiving the processing light through the slit mark. FIG. 29 is a cross-sectional view showing the processing light irradiated onto the first calibration unit. FIGS. 30(a) and 30(b) conceptually show the flow of the abnormality determination operation. FIG. 31 is a cross-sectional view showing the configuration of the irradiation optical system in the first modified example. FIG. 32(a) is a top view showing the configuration of the calibration unit in the first modified example, and FIG. 32(b) is a cross-sectional view showing the configuration of the calibration unit in the first modified example. Figures 33(a) and 33(b) are cross-sectional views showing the arrangement position of the calibration unit in a second modified example, and Figures 34(a) and 34(b) are cross-sectional views showing the arrangement position of the calibration unit in a third modified example.

[0017] Hereinafter, with reference to the drawings, embodiments of a modeling system, a processing system, a modeling method, and a processing method will be described. Hereinafter, embodiments of a modeling system, a processing system, a modeling method, and a processing method will be described using a processing system SYS capable of processing a workpiece W, which is an example of an object. In particular, below, embodiments of a modeling system, a processing system, a modeling method, and a processing method will be described using a processing system SYS that performs additive processing based on laser metal deposition (LMD). Additive processing based on laser metal deposition is additive processing that melts a modeling material M supplied to the workpiece W with processing light EL (i.e., an energy beam in the form of light) to form a model that is integrated with the workpiece W or that can be separated from the workpiece W. In this case, if the processing system SYS is capable of forming a model, the processing system SYS may also be referred to as a modeling system.

[0018] In the following description, the positional relationships of the various components constituting the machining system SYS will be described using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes. For convenience of explanation, the X-axis and Y-axis directions are assumed to be horizontal (i.e., predetermined directions within a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-down direction). The rotational directions (in other words, tilt directions) around the X-axis, Y-axis, and Z-axis are referred to as the θX direction, the θY direction, and the θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. The XY plane may also be referred to as the horizontal direction. The positional relationship may be a concept that includes not only a positional relationship regarding at least one of the X-axis, Y-axis, and Z-axis directions, but also a positional relationship (posture relationship) regarding at least one of the θx direction, the θY direction, and the θZ direction.

[0019] (1) Configuration of the machining system SYS (1-1) Overall configuration of the machining system SYS First, the configuration of the machining system SYS of this embodiment will be described with reference to Fig. 1 to Fig. 3. Fig. 1 is a perspective view that schematically shows the appearance of the machining system SYS of this embodiment. Fig. 2 is a cross-sectional view that schematically shows the configuration of the machining system SYS of this embodiment. Fig. 3 is a system configuration diagram that shows the system configuration of the machining system SYS of this embodiment.

[0020] The machining system SYS is capable of performing additive processing on the workpiece W. By performing additive processing on the workpiece W, the machining system SYS is capable of forming a shaped object that is integrated with (or separable from) the workpiece W. In this case, the additional processing performed on the workpiece W corresponds to processing that adds, to the workpiece W, a shaped object that is integrated with (or separable from) the workpiece W. Note that the shaped object in this embodiment may refer to any object that the machining system SYS forms. For example, the machining system SYS is capable of forming a three-dimensional structure ST (that is, a three-dimensional structure that has a size in all three-dimensional directions, a solid object, in other words, a structure that has a size in the X-axis direction, Y-axis direction, and Z-axis direction) as an example of a shaped object.

[0021] When the workpiece W is a stage 31 described below, the processing system SYS is capable of performing additional processing on the stage 31. When the workpiece W is a mounted object, which is an object placed on the stage 31, the processing system SYS is capable of performing additional processing on the mounted object. The mounted object placed on the stage 31 may be another three-dimensional structure ST (i.e., an existing structure) formed by the processing system SYS. Note that FIGS. 1 and 2 show an example in which the workpiece W is an existing structure placed on the stage 31. Also, the following description will be given using an example in which the workpiece W is an existing structure placed on the stage 31.

[0022] The workpiece W may be a product that has a missing portion and needs to be repaired. In this case, the machining system SYS may perform repair processing to repair the product that needs to be repaired by performing additional processing to form a shaped object to fill the missing portion. In other words, the additional processing performed by the machining system SYS may include additional processing to add a shaped object to the workpiece W to fill the missing portion.

[0023] As described above, the processing system SYS is capable of performing additive processing based on the laser buildup welding method. In other words, the processing system SYS can also be said to be a 3D printer that processes an object using additive manufacturing technology. Note that additive manufacturing technology may also be referred to as rapid prototyping, rapid manufacturing, or additive manufacturing. Note that the laser buildup welding method (LMD) may also be referred to as directed energy deposition (DED).

[0024] A processing system SYS using additive manufacturing technology sequentially forms multiple structural layers SL (see FIG. 13 , described later) to form a three-dimensional structure ST in which multiple structural layers SL are stacked. In this case, the processing system SYS first sets the surface of the workpiece W as a printing surface MS on which the object is actually printed, and prints the first structural layer SL on the printing surface MS. The processing system SYS then sets the surface of the first structural layer SL as a new printing surface MS, and prints the second structural layer SL on the new printing surface MS. Thereafter, the processing system SYS repeats the same operations to form a three-dimensional structure ST in which multiple structural layers SL are stacked.

[0025] The processing system SYS performs additive processing by processing the modeling material M using processing light EL, which is an energy beam. The modeling material M is a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. For example, at least one of a metallic material and a resinous material can be used as the modeling material M. Examples of metallic materials include at least one of a material containing copper, a material containing tungsten, and a material containing stainless steel. However, materials other than metallic materials and resinous materials may also be used as the modeling material M. The modeling material M is a powdered material. In other words, the modeling material M is a powder. However, the modeling material M does not have to be a powder. For example, at least one of a wire-shaped modeling material and a gaseous modeling material may be used as the modeling material M.

[0026] Like the forming material M, the workpiece W may also be an object containing a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. The material of the workpiece W may be the same as or different from the forming material M. For example, at least one of a metallic material and a resinous material can be used as the material of the workpiece W. Examples of metallic materials include at least one of a material containing copper, a material containing tungsten, and a material containing stainless steel. However, materials other than metallic materials and resinous materials may also be used as the material of the workpiece W.

[0027] 1 to 3 , the processing system SYS includes a material supply source 1, a processing unit 2, a stage unit 3, a light source 4, a gas supply source 5, a control unit 7, and a calibration unit 8. The processing unit 2 and the stage unit 3 may be housed in a chamber space 63IN inside a housing 6. In this case, the processing system SYS may perform additional processing in the chamber space 63IN. Note that the processing system SYS does not necessarily have to include at least one of the stage unit 3 and the housing 6.

[0028] The material supply source 1 supplies the processing unit 2 with the modeling material M. The material supply source 1 supplies a desired amount of modeling material M according to the required amount so that the amount of modeling material M required per unit time for performing additive processing is supplied to the processing unit 2.

[0029] The processing unit 2 processes the modeling material M supplied from the material supply source 1 to form a model. In order to form the model, the processing unit 2 includes a processing head 21 and a head drive system 22. Furthermore, the processing head 21 includes an irradiation optical system 211 and a plurality of material nozzles 212. However, the processing head 21 may include a plurality of irradiation optical systems 211. The processing head 21 may also include a single material nozzle 212. The processing head 21 may also be referred to as a processing device or a modeling device.

[0030] The irradiation optical system 211 is an optical system for emitting the processing light EL. Specifically, the irradiation optical system 211 is optically connected to the light source 4 that emits (generates) the processing light EL via a light transmission member 41. An example of the light transmission member 41 is at least one of an optical fiber and a light pipe.

[0031] In the example shown in Figures 1 to 3, the processing system SYS includes two light sources 4 (specifically, light sources 4#1 and 4#2), and the irradiation optical system 211 is optically connected to the light sources 4#1 and 4#2 via optical transmission members 41#1 and 41#2, respectively. The irradiation optical system 211 emits both the processed light EL propagating from the light source 4#1 via the optical transmission member 41#1 and the processed light EL propagating from the light source 4#2 via the optical transmission member 41#2. In the following description, when it is necessary to distinguish between the two processed light EL emitted by the irradiation optical system 211, the processed light EL generated by the light source 4#1 will be referred to as "processed light EL#1" and the processed light EL generated by the light source 4#2 will be referred to as "processed light EL#2." On the other hand, unless otherwise specified, "processed light EL" refers to at least one of the processed light EL#1 and EL#2.

[0032] However, the processing system SYS may include a single light source 4 instead of the multiple light sources 4. The irradiation optical system 211 may emit a single processing light EL instead of emitting multiple processing light EL.

[0033] The irradiation optical system 211 emits the processing light EL downward (i.e., toward the -Z side). A stage 31 is disposed below the irradiation optical system 211. When a workpiece W is placed on the stage 31, the irradiation optical system 211 irradiates the emitted processing light EL onto the printing surface MS. Specifically, the irradiation optical system 211 can irradiate the processing light EL onto a target irradiation area (target irradiation position) EA that is set on the printing surface MS as an area to be irradiated (typically, focused) with the processing light EL. In the following description, when it is necessary to distinguish between two target irradiation areas EA onto which the irradiation optical system 211 respectively irradiates two processing light beams EL, the target irradiation area EA onto which the irradiation optical system 211 irradiates processing light EL#1 will be referred to as the "target irradiation area EA#1," and the target irradiation area EA onto which the irradiation optical system 211 irradiates processing light EL#2 will be referred to as the "target irradiation area EA#2." Furthermore, the state of the irradiation optical system 211 can be switched between a state in which the processing light EL is irradiated onto the target irradiation area EA and a state in which the processing light EL is not irradiated onto the target irradiation area EA under the control of the control unit 7. The direction of the processing light EL emitted from the irradiation optical system 211 is not limited to being directly downward (i.e., coinciding with the -Z-axis direction) and may be, for example, a direction tilted by a predetermined angle with respect to the Z-axis. In other words, the third optical system 216 (or the fθ lens 2162) described later is not limited to being an optical system telecentric on the object side and may be an optical system non-telecentric on the object side.

[0034] The irradiation optical system 211 may form a molten pool MP on the printing surface MS by irradiating the printing surface MS with a processing light EL. For example, the irradiation optical system 211 may form a molten pool MP#1 on the printing surface MS by irradiating the printing surface MS with a processing light EL#1. For example, the irradiation optical system 211 may form a molten pool MP#2 on the printing surface MS by irradiating the printing surface MS with a processing light EL#2. The molten pool MP#1 and the molten pool MP#2 may be integrated. If the molten pool MP#1 and the molten pool MP#2 are integrated, it may be considered that a single molten pool MP is formed on the printing surface MS by irradiating the processing lights EL#1 and EL#2. Alternatively, the molten pool MP#1 and the molten pool MP#2 may be separated from each other. However, the molten pool MP#1 does not necessarily have to be formed on the printing surface MS by irradiating the processing light EL#1. The molten pool MP#2 does not necessarily have to be formed on the printing surface MS by irradiating the processing light EL#2.

[0035] The material nozzle 212 supplies (e.g., injects, jets, spouts, or sprays) the modeling material M. The material nozzle 212 is physically connected to the material supply source 1, which is a supply source of the modeling material M, via the supply pipe 11 and the mixer 12. The material nozzle 212 supplies the modeling material M supplied from the material supply source 1 via the supply pipe 11 and the mixer 12. The material nozzle 212 may pressure-feed the modeling material M supplied from the material supply source 1 via the supply pipe 11. That is, the modeling material M from the material supply source 1 and a conveying gas (i.e., a pressure-feed gas, for example, an inert gas such as nitrogen or argon) may be mixed in the mixer 12 and then pressure-feed to the material nozzle 212 via the supply pipe 11. As a result, the material nozzle 212 supplies the modeling material M together with the conveying gas. For example, a purge gas supplied from the gas supply source 5 is used as the conveying gas. However, the gas supplied from a gas supply source other than the gas supply source 5 may be used as the conveying gas. Although the material nozzle 212 is depicted as a tube in FIG. 2 , the shape of the material nozzle 212 is not limited to this. The material nozzle 212 supplies the modeling material M downward (i.e., toward the −Z side). The stage 31 is disposed below the material nozzle 212. When a workpiece W is mounted on the stage 31, the material nozzle 212 supplies the modeling material M toward the modeling surface MS. The direction of travel of the modeling material M supplied from the material nozzle 212 is inclined at a predetermined angle (for example, an acute angle) with respect to the Z-axis direction, but may also be toward the −Z side (i.e., directly downward).

[0036] In this embodiment, the material nozzle 212 supplies the building material M to a position where at least one of the processing lights EL#1 and EL#2 is irradiated (i.e., at least one of the target irradiation areas EA#1 and EA#2). For this reason, the material nozzle 212 and the irradiation optical systems 211#1 and 211#2 are aligned so that a target supply area MA, which is set on the building surface MS as an area where the material nozzle 212 supplies the building material M, at least partially overlaps with at least one of the target irradiation areas EA#1 and EA#2. The size of the target supply area MA may be larger, smaller, or the same as the size of at least one of the target irradiation areas EA#1 and EA#2.

[0037] The material nozzle 212 may supply the building material M to the molten pool MP. Specifically, the material nozzle 212 may supply the building material M to at least one of the molten pool MP#1 and the molten pool MP#2. However, the material nozzle 212 does not have to supply the building material M to the molten pool MP. For example, the processing system SYS may melt the building material M from the material nozzle 212 using processing light EL emitted from the irradiation optical system 211 before the building material M reaches the workpiece W, and then adhere the molten building material M to the workpiece W.

[0038] The irradiation optical system 211 and the material nozzle 212 may be housed in a head housing 213 provided in the processing head 21. The head housing 213 is a housing having an internal storage space for storing the irradiation optical system 211 and the material nozzle 212. In this case, the irradiation optical system 211 and the material nozzle 212 may be housed in the internal storage space of the head housing 213.

[0039] The head drive system 22 moves the machining head 21 under the control of the control unit 7. That is, the head drive system 22 moves the irradiation optical system 211 and the material nozzle 212 under the control of the control unit 7. The head drive system 22 moves the machining head 21, for example, along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction. Note that the operation of moving the machining head 21 along at least one of the θX direction, θY direction, and θZ direction may be considered equivalent to the operation of rotating the machining head 21 around at least one of the rotation axis along the X-axis, the rotation axis along the Y-axis, and the rotation axis along the Z-axis.

[0040] 1 , the head drive system 22 moves the machining head 21 along each of the X-axis and Z-axis directions. In this case, the head drive system 22 may include, for example, a column 221 which is a wall-like member extending upward along the Z-axis direction from the bed 30 which is the base of the stage unit 3, an X guide member 222 attached to (or formed on) the column 221 and extending along the X-axis direction, an X block member 223 attached to (or movable along) the X guide member 222, a servo motor 224 which generates a driving force for moving the X block member 223, a Z guide member 225 attached to (or formed on) the X block member 223 and extending along the Z-axis direction, a Z block member 226 attached to (or movable along) the Z guide member 225, and a servo motor 227 which generates a driving force for moving the Z block member 226.

[0041] The machining head 21 may be attached to the Z-block member 226. Specifically, the head housing 213 of the machining head 21 may be attached to the Z-block member 226. As a result, the machining head 21 moves in the X-axis direction in accordance with the movement of the X-block member 223, and moves in the Z-axis direction in accordance with the movement of the Z-block member 226. In other words, the position of the machining head 21 in the X-axis direction changes as the position of the X-block member 223 changes in the X-axis direction, and the position of the machining head 21 in the Z-axis direction changes as the position of the Z-block member 226 changes in the Z-axis direction.

[0042] When the head drive system 22 moves the machining head 21, the relative positional relationship between the machining head 21 and the stage 31 and the workpiece W placed on the stage 31 changes. As a result, the relative positional relationship between the stage 31, the workpiece W, and the irradiation optical system 211 provided in the machining head 21 changes. For this reason, the head drive system 22 may be considered to function as a position changing device that can change the relative positional relationship between the stage 31, the workpiece W, and the irradiation optical system 211. The head drive system 22 may be considered to function as a moving device that can move the irradiation optical system 211 relative to the stage 31 and the workpiece W. The head drive system 22 may be considered to function as a moving device that can move the irradiation optical system 211 relative to the stage 31 and the workpiece W. Furthermore, when the relative positional relationship between the stage 31, the workpiece W, and the machining head 21 changes, the relative positional relationship between the target irradiation areas EA#1 and EA#2 and the target supply area MA and the workpiece W also changes. That is, each of the target irradiation areas EA#1 and EA#2 and the target supply area MA moves along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction on the surface of the workpiece W (more specifically, the build surface MS on which additional processing is performed). In this case, it may be considered that the head drive system 22 moves the processing head 21 so that each of the target irradiation areas EA#1 and EA#2 and the target supply area MA moves on the build surface MS.

[0043] The stage unit 3 includes a bed 30 , a stage 31 , and a stage drive system 32 .

[0044] The workpiece W is placed on the stage 31. Specifically, the workpiece W is placed on a workpiece placement surface 311, which is one surface of the stage 31 (e.g., the upper surface facing the +Z side). For this reason, the stage 31 may be referred to as a placement member. The stage 31 is capable of supporting the workpiece W placed on the stage 31. The stage 31 may be capable of holding the workpiece W placed on the stage 31. In this case, the stage 31 may be equipped with at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, or the like to hold the workpiece W. Alternatively, the stage 31 may not be capable of holding the workpiece W placed on the stage 31. In this case, the workpiece W may be placed on the stage 31 in a clampless manner. Furthermore, the workpiece W may be attached to a holder, or the holder to which the workpiece W is attached may be placed on the stage 31. The above-mentioned irradiation optical system 211 emits each of the processing lights EL#1 and EL#2 during at least a portion of the period during which the workpiece W is placed on the stage 31. Furthermore, the material nozzle 212 described above supplies the modeling material M for at least a portion of the period during which the workpiece W is placed on the stage 31 .

[0045] The stage drive system 32 moves the stage 31. The stage drive system 32 moves the stage 31, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. Note that the operation of moving the stage 31 along at least one of the θX direction, θY direction, and θZ direction may be considered equivalent to the operation of rotating the stage 31 around at least one of a rotation axis along the X-axis (i.e., A-axis), a rotation axis along the Y-axis (i.e., B-axis), and a rotation axis along the Z-axis (i.e., C-axis).

[0046] In this embodiment, the stage drive system 32 may rotate the stage 31 at least around a desired rotation axis. In particular, the stage drive system 32 may rotate the stage 31 around a rotation axis that intersects with the optical axis EX of the irradiation optical system 211. In the example shown in FIGS. 1 to 3 , the optical axis EX of the irradiation optical system 211 is an axis along the Z axis. Therefore, the stage drive system 32 may rotate the stage 31 around at least one of the A axis and the B axis.

[0047] 1 , the stage drive system 32 moves the stage 31 along the Y-axis direction and rotates the stage 31 around the respective rotation axes of the A-axis and C-axis. In this case, the stage drive system 32 may include, for example, a Y guide member 321 attached to (or formed on) the bed 30 and extending along the Y-axis direction, a trunnion (Y block member) 322 attached to the Y guide member 321 and movable along the Y guide member 321, a servo motor 323 that generates a driving force for moving the trunnion 322, a cradle 324 attached to the trunnion 322 and rotatable about the A-axis relative to the trunnion 322, and a servo motor (not shown) that generates a driving force for rotating the cradle 324. The stage 31 may be attached to the cradle 324 so as to be rotatable about the C-axis relative to the cradle 324 using the driving force generated by the servo motor (not shown). As a result, the stage 31 moves in the Y-axis direction in accordance with the movement of the trunnion 322, rotates around the A-axis in accordance with the rotation of the cradle 324, and rotates around the C-axis.

[0048] The workpiece W may be considered to be placed on the stage drive system 32 that moves the stage 31 via the stage 31. For example, the workpiece W may be considered to be placed on a cradle 324 to which the stage 31 is attached via the stage 31. For this reason, components of the stage drive system 32 (for example, the cradle 324) may also be referred to as a mounting member, similar to the stage 31.

[0049] When the stage drive system 32 moves the stage 31, the relative positional relationships between the machining head 21 and each of the stage 31 and workpiece W change. As a result, the relative positional relationships between the stage 31, workpiece W, and the irradiation optical system 211 provided in the machining head 21 change. For this reason, the stage drive system 32, like the head drive system 22, may be considered to function as a position changing device that can change the relative positional relationships between the stage 31, workpiece W, and the irradiation optical system 211. The stage drive system 32 may be considered to function as a moving device that can move the stage 31, workpiece W, and the irradiation optical system 211 relative to each other. The stage drive system 32 may be considered to function as a moving device that can move the stage 31 and workpiece W relative to the irradiation optical system 211. Furthermore, when the relative positional relationships between the stage 31, workpiece W, and the machining head 21 change, the relative positional relationships between the target irradiation areas EA#1 and EA#2 and the target supply area MA, and the workpiece W, also change. That is, each of the target irradiation areas EA#1 and EA#2 and the target supply area MA moves along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction on the surface (more specifically, the build surface MS) of the workpiece W. In this case, it may be considered that the stage drive system 32 moves the stage 31 so that each of the target irradiation areas EA#1 and EA#2 and the target supply area MA moves on the build surface MS.

[0050] The light source 4 emits, for example, at least one of infrared light, visible light, and ultraviolet light as the processing light EL. However, other types of light may be used as the processing light EL. The processing light EL may include a plurality of pulsed lights (i.e., a plurality of pulse beams). The processing light EL may be laser light. In this case, the light source 4 may include a laser light source (e.g., a semiconductor laser such as a laser diode (LD)). Examples of laser light sources include fiber lasers, CO ２At least one of a laser, a YAG laser, an excimer laser, etc. may be used. However, the processing light EL does not have to be laser light. The light source 4 may include any light source (for example, at least one of an LED (Light Emitting Diode), a discharge lamp, etc.).

[0051] As described above, the processing system SYS includes multiple light sources 4 (specifically, light sources 4#1 and 4#2). In this case, the characteristics of the processing light EL#1 emitted by light source 4#1 and the characteristics of the processing light EL#2 emitted by light source 4#2 may be the same. For example, the wavelength of the processing light EL#1 (typically, the peak wavelength, which is the wavelength at which the intensity is maximum in the wavelength band of the processing light EL#1) and the wavelength of the processing light EL#2 (typically, the peak wavelength) may be the same. For example, the wavelength band of the processing light EL#1 (typically, the range of wavelengths at which the intensity is equal to or greater than a certain value) and the wavelength band of the processing light EL#2 may be the same. For example, the intensity of the processing light EL#1 and the intensity of the processing light EL#2 may be the same. For example, the absorptivity of the workpiece W for the processing light EL#1 (or the object whose surface MS is the surface; the same applies below) may be the same as the absorptivity of the workpiece W for the processing light EL#2. In particular, the absorptivity of the workpiece W for the peak wavelength of processing light EL#1 and the absorptivity of the workpiece W for the peak wavelength of processing light EL#2 may be the same. Alternatively, the characteristics of processing light EL#1 emitted by light source 4#1 and the characteristics of processing light EL#2 emitted by light source 4#2 may be different. For example, the wavelength (typically, peak wavelength) of processing light EL#1 and the wavelength (typically, peak wavelength) of processing light EL#2 may be different. For example, the wavelength band of processing light EL#1 and the wavelength band of processing light EL#2 may be different. For example, the intensity of processing light EL#1 and the intensity of processing light EL#2 may be different. For example, the absorptivity of the workpiece W for processing light EL#1 and the absorptivity of the workpiece W for processing light EL#2 may be different. In particular, the absorptivity of the workpiece W for the peak wavelength of processing light EL#1 and the absorptivity of the workpiece W for the peak wavelength of processing light EL#2 may be different.

[0052] In this embodiment, an example is described in which the processing system SYS includes multiple light sources 4. However, the processing system SYS does not necessarily have to include multiple light sources 4. The processing system SYS does not necessarily have to include a single light source 4. As an example, the processing system may include a light source that emits (supplies) light in a wide wavelength band or multiple wavelengths as the single light source 4. In this case, the processing system SYS may generate processing light EL#1 and processing light EL#2 having different wavelengths by wavelength-dividing the light emitted from this light source.

[0053] The gas supply source 5 is a supply source of purge gas for purging the chamber space 63IN inside the housing 6. The purge gas includes an inert gas. Examples of the inert gas include nitrogen gas and argon gas. The gas supply source 5 is connected to the chamber space 63IN via a supply port 62 formed in a partition member 61 of the housing 6 and a supply pipe 51 connecting the gas supply source 5 and the supply port 62. The gas supply source 5 supplies purge gas to the chamber space 63IN via the supply pipe 51 and the supply port 62. As a result, the chamber space 63IN becomes a space purged with the purge gas. The purge gas supplied to the chamber space 63IN may be discharged from an exhaust port (not shown) formed in the partition member 61. The gas supply source 5 may be a cylinder containing an inert gas. When the inert gas is nitrogen gas, the gas supply source 5 may be a nitrogen gas generator that generates nitrogen gas using atmospheric air as a raw material.

[0054] When the processing system SYS performs additional processing in an open space rather than in an enclosed space (chamber space 63IN), the gas supply source 5 may supply purge gas to the space between the irradiation optical system 211 and the workpiece W in order to locally purge this space. Note that even when the processing system SYS performs additional processing in the chamber space 63IN, the gas supply source 5 may supply purge gas to the space between the irradiation optical system 211 and the workpiece W in order to locally purge this space.

[0055] As described above, when the material nozzle 212 supplies the modeling material M together with a purge gas, the gas supply source 5 may supply the purge gas to the mixer 12 to which the modeling material M is supplied from the material supply source 1. Specifically, the gas supply source 5 may be connected to the mixer 12 via a supply pipe 52 connecting the gas supply source 5 and the mixer 12. As a result, the gas supply source 5 supplies the purge gas to the mixer 12 via the supply pipe 52. In this case, the modeling material M from the material supply source 1 may be supplied (specifically, pressure-fed) through the supply pipe 11 toward the material nozzle 212 by the purge gas supplied from the gas supply source 5 via the supply pipe 52. In other words, the gas supply source 5 may be connected to the material nozzle 212 via the supply pipe 52, the mixer 12, and the supply pipe 11. In this case, the material nozzle 212 supplies the modeling material M together with the purge gas for pressure-fed the modeling material M.

[0056] The control unit 7 controls the operation of the processing system SYS. For example, the control unit 7 may control the processing unit 2 (e.g., at least one of the processing head 21 and the head drive system 22) provided in the processing system SYS so as to perform additional processing on the workpiece W. For example, the control unit 7 may control the stage unit 3 (e.g., the stage drive system 32) provided in the processing system SYS so as to perform additional processing on the workpiece W. For example, the control unit 7 may control the material supply source 1 provided in the processing system SYS so as to perform additional processing on the workpiece W. For example, the control unit 7 may control the light source 4 provided in the processing system SYS so as to perform additional processing on the workpiece W. For example, the control unit 7 may control the gas supply source 5 provided in the processing system SYS so as to perform additional processing on the workpiece W. The control unit 7 may also be referred to as a control device.

[0057] The control unit 7 may include, for example, an arithmetic device and a storage device. The arithmetic device may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The storage device may include, for example, a memory. The control unit 7 functions as a device that controls the operation of the machining system SYS when the arithmetic device executes a computer program. This computer program is a computer program that causes the arithmetic device to perform (i.e., execute) the operations to be performed by the control unit 7, which will be described later. In other words, this computer program is a computer program that causes the control unit 7 to function so as to cause the machining system SYS to perform the operations to be described later. The computer program executed by the arithmetic device may be recorded in a storage device (i.e., a recording medium) included in the control unit 7, or may be recorded in any storage medium (e.g., a hard disk or a semiconductor memory) that is built into the control unit 7 or that can be externally attached to the control unit 7. Alternatively, the computing device may download the computer program to be executed from a device external to the control unit 7 via a network interface.

[0058] The control unit 7 may control the irradiation mode of the processing light EL by the irradiation optical system 211. The irradiation mode may include, for example, at least one of the intensity of the processing light EL, the irradiation position of the processing light EL, and the irradiation timing of the processing light EL. If the processing light EL includes multiple pulsed lights, the irradiation mode may include, for example, at least one of the emission time of the pulsed light, the emission cycle of the pulsed light, and the ratio between the emission time of the pulsed light and the emission cycle of the pulsed light (so-called duty ratio). Furthermore, the control unit 7 may control the movement mode of the processing head 21 by the head drive system 22. The control unit 7 may control the movement mode of the stage 31 by the stage drive system 32. The movement mode may include, for example, at least one of the movement amount, movement speed, movement direction, and movement timing (movement time). Furthermore, the control unit 7 may control the supply mode of the modeling material M by the material nozzle 212. The supply mode may include, for example, at least one of the supply amount (particularly, the supply amount per unit time) and the supply timing (supply time).

[0059] The control unit 7 does not have to be provided inside the machining system SYS. For example, the control unit 7 may be provided outside the machining system SYS as a server or the like. In this case, the control unit 7 and the machining system SYS may be connected via a wired and / or wireless network (or a data bus and / or communication line). The wired network may be a network using a serial bus interface, such as at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB. The wired network may be a network using a parallel bus interface. The wired network may be a network using an interface compliant with Ethernet (registered trademark), such as at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T. The wireless network may be a network using radio waves. An example of a network using radio waves is a network compliant with IEEE 802.1x (for example, at least one of a wireless LAN and Bluetooth (registered trademark)). A network using infrared rays may be used as the wireless network. A network using optical communication may be used as the wireless network. In this case, the control unit 7 and the machining system SYS may be configured to be able to send and receive various information via the network. The control unit 7 may also be able to send information such as commands and control parameters to the machining system SYS via the network. The machining system SYS may include a receiving device that receives information such as commands and control parameters from the control unit 7 via the network. The machining system SYS may also include a transmitting device (i.e., an output device that outputs information to the control unit 7) that transmits information such as commands and control parameters to the control unit 7 via the network.Alternatively, a first control device that performs part of the processing performed by the control unit 7 may be provided inside the processing system SYS, while a second control device that performs another part of the processing performed by the control unit 7 may be provided outside the processing system SYS.

[0060] A computational model that can be constructed by machine learning may be implemented in the control unit 7 by the computation device executing a computer program. An example of a computational model that can be constructed by machine learning is a computational model including a neural network (so-called artificial intelligence (AI)). In this case, learning of the computational model may include learning of parameters of the neural network (e.g., at least one of a weight and a bias). The control unit 7 may control the operation of the machining system SYS using the computational model. In other words, the operation of controlling the operation of the machining system SYS may include the operation of controlling the operation of the machining system SYS using the computational model. Note that a computational model that has been constructed by offline machine learning using training data may be implemented in the control unit 7. Furthermore, the computational model implemented in the control unit 7 may be updated on the control unit 7 by online machine learning. Alternatively, the control unit 7 may control the operation of the machining system SYS using a calculation model implemented in a device external to the control unit 7 (that is, a device provided outside the machining system SYS) in addition to or instead of the calculation model implemented in the control unit 7.

[0061] The recording medium for recording the computer program executed by the control unit 7 may be at least one of the following: a CD-ROM, CD-R, CD-RW, a flexible disk, an MO, a DVD-ROM, a DVD-RAM, a DVD-R, a DVD+R, a DVD-RW, a DVD+RW, and an optical disk such as Blu-ray (registered trademark), a magnetic medium such as a magnetic tape, a magneto-optical disk, a semiconductor memory such as a USB memory, and any other medium capable of storing a program. The recording medium may also include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in an executable state in at least one of the forms of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized in the control unit 7 when the control unit 7 (i.e., the computer) executes the computer program, or may be realized by hardware such as a predetermined gate array (FPGA (Field Programmable Gate Array) or ASIC (Application Specific Integrated Circuit)) included in the control unit 7, or may be realized in a form in which the logical processing block and a partial hardware module that realizes some elements of the hardware are mixed.

[0062] The calibration unit 8 is capable of measuring at least one of the processing lights EL#1 and EL#2. Therefore, the calibration unit 8 may be referred to as a measurement device. Specifically, during at least a portion of the measurement period in which the calibration unit 8 measures at least one of the processing lights EL#1 and EL#2, the processing head 21 irradiates the calibration unit 8 with at least one of the processing lights EL#1 and EL#2. As a result, the calibration unit 8 can measure at least one of the processing lights EL#1 and EL#2 emitted from the processing head 21. Details of the configuration of the calibration unit 8 will be described later with reference to FIG. 7 and the like.

[0063] The calibration unit 8 may simultaneously measure the processing light EL#1 and the processing light EL#2. In this case, the processing head 21 may simultaneously irradiate the calibration unit 8 with the processing light EL#1 and the processing light EL#2. The calibration unit 8 may also measure the processing light EL#1 and the processing light EL#2 separately. That is, the calibration unit 8 may measure one of the processing light EL#1 and the processing light EL#2, and then measure the other of the processing light EL#1 and the processing light EL#2. In this case, the processing head 21 may irradiate the calibration unit 8 with one of the processing light EL#1 and the processing light EL#2, and then irradiate the calibration unit 8 with the other of the processing light EL#1 and the processing light EL#2. Alternatively, the calibration unit 8 may alternately repeat the operation of measuring the processing light EL#1 and the operation of measuring the processing light EL#2. That is, the calibration unit 8 may measure the processing light EL#1 and the processing light EL#2 in a time-division manner. In this case, the processing head 21 may alternately repeat the operation of irradiating the calibration unit 8 with either the processing light EL#1 or EL#2 and the operation of irradiating the calibration unit 8 with the other of the processing light EL#1 or EL#2.

[0064] Measurement information indicating the measurement result of at least one of the processing lights EL# 1 and EL# 2 by the calibration unit 8 is output from the calibration unit 8 to the control unit 7 .

[0065] The control unit 7 may control the machining system SYS based on the measurement information. Specifically, the control unit 7 may calculate a measurement value of at least one of the processing light EL #1 and EL #2 based on the measurement information and control the machining system SYS based on the calculated measurement value. Examples of the measurement value include at least one of the rotation amount θz, offset amount ΔOffx, offset amount ΔOffy, irradiation position deviation amount ΔIPx, irradiation position deviation amount ΔIPx, stroke width STx, and stroke width STy, as described in detail below. In this case, the above-mentioned measurement period may or may not include at least a portion of the period during which the control unit 7 calculates the measurement value of at least one of the processing light EL #1 and EL #2.

[0066] The calibration unit 8 may be arranged to be rotatable around a desired rotation axis. In particular, the calibration unit 8 may be arranged to be rotatable around a rotation axis intersecting the optical axis EX of the irradiation optical system 211. In the examples shown in FIGS. 1 to 3 , the optical axis EX of the irradiation optical system 211 is an axis along the Z axis. Therefore, the calibration unit 8 may be arranged to be rotatable around at least one of the A axis and the B axis. In the example shown in FIG. 1 , the calibration unit 8 is arranged on the cradle 324 of the stage drive system 32. In this case, the calibration unit 8 can rotate around the A axis in accordance with the rotation of the cradle 324. Alternatively, the calibration unit 8 may be arranged on the stage 31. In this case, the calibration unit 8 can rotate around the A axis in accordance with the rotation of the stage 31 around the A axis.

[0067] The calibration unit 8 may be arranged to be movable along a desired movement axis. In particular, the calibration unit 8 may be arranged to be movable along a movement axis intersecting the optical axis EX of the irradiation optical system 211. In the examples shown in FIGS. 1 to 3 , the optical axis EX of the irradiation optical system 211 is an axis along the Z axis. Therefore, the calibration unit 8 may be arranged to be movable along at least one of the X axis direction and the Y axis direction. In the example shown in FIG. 1 , the calibration unit 8 is arranged on the cradle 324 of the stage drive system 32. In this case, the calibration unit 8 is movable along the Y axis direction in accordance with the movement of the trunnion 322 to which the cradle 324 is attached. Alternatively, the calibration unit 8 may be arranged on the stage 31. In this case, the calibration unit 8 is movable along the Y axis direction in accordance with the movement of the stage 31 along the Y axis direction.

[0068] For convenience of explanation, the following description will be given using an example in which the calibration unit 8 is disposed on the cradle 324. That is, the description will be given using an example in which the calibration unit 8 is rotatable around the A-axis that intersects with the optical axis EX of the irradiation optical system 211 and is movable along the Y-axis direction that intersects with the optical axis EX of the irradiation optical system 211.

[0069] When the calibration unit 8 is disposed on the cradle 324, the stage drive system 32 moves the calibration unit 8 in addition to the stage 31. In other words, the operation of moving the stage 31 may be considered equivalent to the operation of moving the calibration unit 8. In this case, when the stage drive system 32 moves the calibration unit 8, the relative positional relationship between the processing head 21 and the calibration unit 8 changes. As a result, the relative positional relationship between the calibration unit 8 and the irradiation optical system 211 provided in the processing head 21 changes. Therefore, the stage drive system 32 may be considered to function as a position changing device that can change the relative positional relationship between the calibration unit 8 and the irradiation optical system 211. The stage drive system 32 may be considered to function as a moving device that can move the calibration unit 8 and the irradiation optical system 211 relatively. The stage drive system 32 may be considered to function as a moving device that can move the calibration unit 8 with respect to the irradiation optical system 211.

[0070] Furthermore, when the head drive system 22 moves the processing head 21 while the calibration unit 8 is placed on the cradle 324, the relative positional relationship between the processing head 21 and the calibration unit 8 changes. Therefore, the head drive system 22, like the stage drive system 32, may be considered to function as a position changing device that can change the relative positional relationship between the calibration unit 8 and the irradiation optical system 211. The head drive system 22, like the stage drive system 32, may be considered to function as a moving device that can move the calibration unit 8 and the irradiation optical system 211 relative to each other. The head drive system 22 may be considered to function as a moving device that can move the irradiation optical system 211 with respect to the calibration unit 8.

[0071] When the calibration unit 8 is disposed on the cradle 324, the stage drive system 32 may remove any deposits adhering to the calibration unit 8 by rotating the cradle 324. The deposits may include spatters generated by the scattering of molten material in the molten pool MP. The deposits may include fumes generated by the evaporation of molten material in the molten pool MP. The deposits may include the forming material M that has been melted by the processing light EL but has not reached the molten pool MP. The deposits may include the forming material M that has not been melted by the processing light EL and has not reached the molten pool MP. As a result, the calibration unit 8 can properly measure the processing light EL without being affected by any deposits.

[0072] However, the position where the calibration unit 8 is arranged (hereinafter referred to as the arrangement position) is not limited to the above-mentioned arrangement position. As long as the calibration unit 8 can measure at least one of the processing lights EL#1 and EL#2, the calibration unit 8 may be arranged at any arrangement position.

[0073] (1-2) Configuration of Irradiation Optical System 211 Next, the configuration of the irradiation optical system 211 will be described with reference to Fig. 4. Fig. 4 is a cross-sectional view showing the configuration of the irradiation optical system 211.

[0074] As shown in FIG. 4 , the irradiation optical system 211 includes a first optical system 214, a second optical system 215, and a third optical system 216. The first optical system 214 is an optical system into which the processing light EL#1 emitted from the light source 4#1 is incident. The first optical system 214 is an optical system that outputs the processing light EL#1 emitted from the light source 4#1 toward the third optical system 216. The second optical system 215 is an optical system into which the processing light EL#2 emitted from the light source 4#2 is incident. The second optical system 215 is an optical system that outputs the processing light EL#2 emitted from the light source 4#2 toward the third optical system 216. The third optical system 216 is an optical system into which the processing light EL#1 emitted from the first optical system 214 and the processing light EL#2 emitted from the second optical system 215 are incident. The third optical system 216 is an optical system that emits the processing light EL#1 emitted from the first optical system 214 and the processing light EL#2 emitted from the second optical system 215 toward the printing surface MS. Below, the first optical system 214, the second optical system 215, and the third optical system 216 will be described in order.

[0075] The first optical system 214 includes a collimator lens 2141, a parallel plate 2142, a power meter 2143, and a galvanometer scanner 2144. The galvanometer scanner 2144 includes a focus control optical system 2145 and a galvanometer mirror 2146. However, the first optical system 214 does not necessarily have to include at least one of the collimator lens 2141, the parallel plate 2142, the power meter 2143, and the galvanometer scanner 2144. The galvanometer scanner 2144 does not necessarily have to include at least one of the focus control optical system 2145 and the galvanometer mirror 2146.

[0076] The processing light EL#1 emitted from the light source 4#1 is incident on the collimator lens 2141. The collimator lens 2141 converts the processing light EL#1 incident on the collimator lens 2141 into parallel light. Note that if the processing light EL#1 emitted from the light source 4#1 is parallel light (i.e., if the processing light EL#1, which is parallel light, enters the first optical system 214), the first optical system 214 does not need to be equipped with the collimator lens 2141. The processing light EL#1 converted into parallel light by the collimator lens 2141 is incident on the parallel plate 2142. A portion of the processing light EL#1 incident on the parallel plate 2142 passes through the parallel plate 2142. The other portion of the processing light EL#1 incident on the parallel plate 2142 is reflected by the parallel plate 2142.

[0077] The processing light EL#1 that has passed through the parallel plate 2142 is incident on the galvanometer scanner 2144. Specifically, the processing light EL#1 that has passed through the parallel plate 2142 is incident on the focus control optical system 2145 of the galvanometer scanner 2144.

[0078] The focus control optical system 2145 is an optical element that can change the focusing position CP of the processing light EL#1 (hereinafter referred to as the "focus position CP#1"). Specifically, the focus control optical system 2145 can change the focusing position CP#1 of the processing light EL#1 along the irradiation direction of the processing light EL#1 that is irradiated onto the printing surface MS. In the example shown in FIG. 4, the irradiation direction of the processing light EL#1 that is irradiated onto the printing surface MS is a direction in which the Z-axis direction is the main component. In this case, the focus control optical system 2145 can change the focusing position CP#1 of the processing light EL#1 along the Z-axis direction. Furthermore, because the irradiation optical system 211 irradiates the printing surface MS with the processing light EL from above the workpiece W, the irradiation direction of the processing light EL#1 is a direction that intersects with the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). For this reason, the focus control optical system 2145 may be considered to be able to change the focusing position CP#1 of the processing light EL#1 along a direction intersecting the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). The focus control optical system 2145 may be considered to be able to change the focusing position CP#1 of the processing light EL#1 along the direction of the optical axis EX of the irradiation optical system 211 (typically, the third optical system 216).

[0079] The irradiation direction of the processing light EL#1 may refer to the irradiation direction of the processing light EL#1 emitted from the third optical system 216. In this case, the irradiation direction of the processing light EL#1 may be the same as the direction along the optical axis of the third optical system 216. The irradiation direction of the processing light EL#1 may be the same as the direction along the optical axis of the final optical element that is arranged closest to the printing surface MS among the optical elements constituting the third optical system 216. The final optical element may be the fθ lens 2162 described below. Furthermore, if the fθ lens 2162 described below is composed of multiple optical elements, the final optical element may be the optical element that is arranged closest to the printing surface MS among the multiple optical elements constituting the fθ lens 2162.

[0080] The focus control optical system 2145 may include, for example, a plurality of lenses arranged along the irradiation direction of the processing light EL#1. In this case, the focus control optical system 2145 may change the focusing position CP#1 of the processing light EL#1 by moving at least one of the plurality of lenses along its optical axis direction.

[0081] When the focus control optical system 2145 changes the condensing position CP#1 of the processing light EL#1, the positional relationship between the condensing position CP#1 of the processing light EL#1 and the printing surface MS changes. In particular, the positional relationship between the condensing position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1 changes. For this reason, it can be considered that the focus control optical system 2145 changes the positional relationship between the condensing position CP#1 of the processing light EL#1 and the printing surface MS by changing the condensing position CP#1 of the processing light EL#1.

[0082] As described above, the galvanometer scanner 2144 does not necessarily have to include the focus control optical system 2145. Even in this case, if the positional relationship between the irradiation optical system 211 and the printing surface MS in the irradiation direction of the processing light EL#1 changes, the positional relationship between the condensing position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1 changes. Therefore, even if the galvanometer scanner 2144 does not include the focus control optical system 2145, the processing system SYS can change the positional relationship between the condensing position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1. For example, the processing system SYS may change the positional relationship between the condensing position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1 by using the head drive system 22 to move the processing head 21 along the irradiation direction of the processing light EL#1. For example, the processing system SYS may use the stage drive system 32 to move the stage 31 along the irradiation direction of the processing light EL#1, thereby changing the positional relationship between the focusing position CP#1 of the processing light EL#1 in the irradiation direction of the processing light EL#1 and the manufacturing surface MS.

[0083] The processing light EL#1 emitted from the focus control optical system 2145 is incident on the galvanometer mirror 2146. The galvanometer mirror 2146 deflects the processing light EL#1, thereby changing the emission direction of the processing light EL#1 emitted from the galvanometer mirror 2146. For this reason, the galvanometer mirror 2146 may also be referred to as a deflection member. When the emission direction of the processing light EL#1 emitted from the galvanometer mirror 2146 is changed, the position from which the processing light EL#1 is emitted from the processing head 21 is changed. When the position from which the processing light EL#1 is emitted from the processing head 21 is changed during the printing period in which the processing head 21 prints a model, the target irradiation area EA#1 onto which the processing light EL#1 is irradiated moves on the printing surface MS. Alternatively, if the position from which processing light EL#1 is emitted from processing head 21 is changed during the measurement period in which calibration unit 8 measures processing light EL#1, the target irradiation area EA#1 onto which processing light EL#1 is irradiated moves on calibration unit 8. In other words, the irradiation position onto which processing light EL#1 is irradiated on the printing surface MS or calibration unit 8 moves.

[0084] The modeling period during which the processing head 21 forms the object may refer to the period from when the processing head 21 starts to form the object to when the door of the housing 6 is opened (and the completed object is removed from the chamber space 63IN). The modeling period may refer to the period from when the processing head 21 starts to irradiate the processing light EL to form the object to when the object is completed and the processing head 21 stops irradiating the processing light EL. If the processing head 21 temporarily stops irradiating the processing light EL between when the processing head 21 starts to irradiate the processing light EL to form the object and when the object is completed, the modeling period may refer to the period from when the processing head 21 starts to irradiate the processing light EL to form the object to when the processing head 21 temporarily stops irradiating the processing light EL. If the type of modeling material M supplied by the material nozzle 212 is switched between the time when the processing head 21 starts irradiating the processing light EL to form a model and the time when the model is completed, the modeling period may mean the period from the time when the material nozzle 212 starts supplying one type of modeling material M to the time when the material nozzle 212 stops supplying one type of modeling material M in order to switch the type of modeling material M.

[0085] The galvanometer mirror 2146 includes, for example, an X-scan mirror 2146MX, an X-scan motor 2146AX, a Y-scan mirror 2146MY, and a Y-scan motor 2146AY. The processing light EL#1 emitted from the focus control optical system 2145 is incident on the X-scan mirror 2146MX. The X-scan mirror 2146MX reflects the processing light EL#1 incident on the X-scan mirror 2146MX toward the Y-scan mirror 2146MY. The Y-scan mirror 2146MY reflects the processing light EL#1 incident on the Y-scan mirror 2146MY toward the third optical system 216. Note that each of the X-scan mirror 2146MX and the Y-scan mirror 2146MY may be referred to as a galvanometer mirror.

[0086] The X-scan motor 2146AX swings or rotates the X-scan mirror 2146MX around a rotation axis along the Y-axis. As a result, the angle of the X-scan mirror 2146MX relative to the optical path of the processing light EL#1 incident on the X-scan mirror 2146MX is changed. In this case, the swing or rotation of the X-scan mirror 2146MX causes the processing light EL#1 to move along the X-axis direction, which intersects with the optical axis EX of the irradiation optical system 211. As a result, the processing light EL#1 scans the printing surface MS or the calibration unit 8 along the X-axis direction. In other words, the irradiation position of the processing light EL#1 on the printing surface MS or the calibration unit 8 changes in the X-axis direction. In other words, the target irradiation area EA#1 (i.e., the irradiation position of the processing light EL#1) moves along the X-axis direction on the printing surface MS or the calibration unit 8.

[0087] The Y-scan motor 2146AY swings or rotates the Y-scan mirror 2146MY around a rotation axis along the X-axis. As a result, the angle of the Y-scan mirror 2146MY relative to the optical path of the processing light EL#1 incident on the Y-scan mirror 2146MY is changed. In this case, the swing or rotation of the Y-scan mirror 2146MY causes the processing light EL#1 to move along the Y-axis direction, which intersects with the optical axis EX of the irradiation optical system 211. As a result, the processing light EL#1 scans the printing surface MS or the calibration unit 8 along the Y-axis direction. In other words, the irradiation position of the processing light EL#1 on the printing surface MS or the calibration unit 8 changes in the Y-axis direction. In other words, the target irradiation area EA#1 (i.e., the irradiation position of the processing light EL#1) moves along the Y-axis direction on the printing surface MS or the calibration unit 8.

[0088] Furthermore, since the galvanometer mirror 2146 can move the processing light EL#1 and the target irradiation area EA#1, the galvanometer mirror 2146 may also be referred to as a moving member.

[0089] In this embodiment, the virtual area on the printing surface MS through which the galvanometer mirror 2146 moves the target irradiation area EA#1 is referred to as the machining unit area BSA (particularly, the machining unit area BSA#1). In this case, the target irradiation area EA#1 may be considered to move on a surface of the printing surface MS that overlaps with the machining unit area BSA#1. Specifically, the virtual area on the printing surface MS through which the galvanometer mirror 2146 moves the target irradiation area EA#1 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed (i.e., without changing) is referred to as the machining unit area BSA (particularly, the machining unit area BSA#1). The machining unit area BSA#1 indicates the virtual area (in other words, the range) through which the machining head 21 actually performs additional machining using the machining light EL#1 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area BSA#1 indicates a virtual area (in other words, a range) that the processing head 21 actually scans with the processing light EL#1 when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area BSA#1 indicates a region (in other words, a range) through which the target irradiation area EA#1 actually moves when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. Therefore, the processing unit area BSA#1 may be considered to be a virtual region determined based on the processing head 21 (particularly, the irradiation optical system 211). In other words, the processing unit area BSA#1 may be considered to be a virtual region located at a position on the printing surface MS that is determined based on the processing head 21 (particularly, the irradiation optical system 211). Note that the maximum region over which the galvanometer mirror 2146 can move the target irradiation area EA#1 on the printing surface MS when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed may also be referred to as the processing unit area BSA#1. In addition, the processing unit area BSA#1 may be considered to be a virtual area (typically a two-dimensional area) set in the direction of travel of the processing light EL1 emitted from the irradiation optical system 211, based on the processing head 21 (particularly, the irradiation optical system 211).

[0090] In this case, the machining system SYS can use the galvanometer mirror 2146 to move the target irradiation area EA#1 within the machining unit area BSA#1. Therefore, the operation of deflecting the machining light EL#1 using the galvanometer mirror 2146 may be considered equivalent to the operation of moving the target irradiation area EA#1 within the machining unit area BSA#1. Furthermore, as described above, the molten pool MP#1 is formed by irradiating the target irradiation area EA#1 with the machining light EL#1. In this case, the machining system SYS may be considered to move the molten pool MP#1 within the machining unit area BSA#1 using the galvanometer mirror 2146. Therefore, the operation of deflecting the machining light EL#1 using the galvanometer mirror 2146 may be considered equivalent to the operation of moving the molten pool MP#1 within the machining unit area BSA#1. In other words, the operation of moving the target irradiation area EA#1 within the machining unit area BSA#1 may be considered equivalent to the operation of moving the molten pool MP#1 within the machining unit area BSA#1.

[0091] As described above, even if at least one of the machining head 21 and the stage 31 moves, the target irradiation area EA#1 moves on the printing surface MS. However, when at least one of the machining head 21 and the stage 31 moves, the relative positional relationship between the galvanometer mirror 2146 and the printing surface MS changes. As a result, the machining unit area BSA#1 determined based on the machining head 21 (i.e., the machining unit area BSA#1 to which the galvanometer mirror 2146 moves the target irradiation area EA#1 on the printing surface MS) moves on the printing surface MS. For this reason, in this embodiment, the operation of moving at least one of the machining head 21 and the stage 31 may be considered equivalent to the operation of moving the machining unit area BSA#1 relative to the printing surface MS.

[0092] As an example of an operation for moving the target irradiation area EA#1 within the processing unit area BSA#1, as shown in FIG. 5A, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves within the processing unit area BSA#1 along a single scanning direction along the printing surface MS, assuming that the processing unit area BSA#1 is stationary (i.e., not moving) on ​​the printing surface MS. In other words, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves along a single scanning direction within a coordinate system defined based on the processing unit area BSA#1. In particular, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 periodically moves back and forth within the processing unit area BSA#1 along the single scanning direction. In other words, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 periodically moves back and forth on an axis along a single scanning direction within the processing unit area BSA#1. In this case, the shape of the processing unit area BSA#1 along which the target irradiation area EA#1 moves may be a rectangle whose longitudinal direction is the movement direction of the target irradiation area EA#1.

[0093] As another example of the operation of moving the molten pool MP#1 within the machining unit area BSA#1, as shown in Figures 6(a) and 6(b), the galvanometer mirror 2146 may deflect the machining light EL#1 so that the target irradiation area EA#1 moves along multiple scanning directions along the machining surface MS within the machining unit area BSA#1, assuming that the machining unit area BSA#1 is stationary (i.e., not moving) on ​​the machining surface MS. In other words, the galvanometer mirror 2146 may deflect the machining light EL#1 so that the target irradiation area EA#1 moves along multiple scanning directions within a coordinate system defined based on the machining unit area BSA#1. In particular, the galvanometer mirror 2146 may deflect the machining light EL#1 so that the target irradiation area EA#1 periodically moves back and forth along each of the multiple scanning directions within the machining unit area BSA#1. That is, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 periodically moves back and forth on axes along each of the multiple scanning directions within the processing unit area BSA#1. Figure 6(a) shows an example in which the target irradiation area EA#1 moves back and forth along each of the X-axis and Y-axis directions within the processing unit area BSA#1 so that the movement trajectory of the target irradiation area EA#1 within the processing unit area BSA#1 is circular. In this case, the shape of the processing unit area BSA#1 through which the target irradiation area EA#1 moves may be circular. Figure 6(b) shows an example in which the target irradiation area EA#1 moves back and forth along each of the X-axis and Y-axis directions within the processing unit area BSA#1 so that the movement trajectory of the target irradiation area EA#1 within the processing unit area BSA#1 is mesh-shaped. In this case, the shape of the processing unit area BSA#1 through which the target irradiation area EA#1 moves may be rectangular.

[0094] 5A, 6A, and 6B, the operation of periodically moving the target irradiation area EA#1 on the printing surface MS may be referred to as a wobbling operation. In other words, the operation of periodically moving (or deflecting) the processing light EL#1 so that the target irradiation area EA#1 periodically moves on the printing surface MS may be referred to as a wobbling operation.

[0095] The control unit 7 may move at least one of the machining head 21 and the stage 31 so that the machining unit area BSA#1 moves on the manufacturing surface MS during a period in which the target irradiation area EA#1 is moved within the machining unit area BSA#1 using the galvanometer mirror 2146. In other words, the control unit 7 may control at least one of the head drive system 22 and the stage drive system 32 so that the machining unit area BSA#1 moves on the manufacturing surface MS during a period in which the target irradiation area EA#1 is moved within the machining unit area BSA#1 using the galvanometer mirror 2146.

[0096] For example, in the example shown in FIG. 5A, the control unit 7 may control at least one of the head drive system 22 and the stage drive system 32 so that the processing unit area BSA#1 moves along a target movement trajectory MT0 that intersects (or, in some cases, is perpendicular to) the movement direction (i.e., the scanning direction) of the target irradiation area EA#1 within the processing unit area BSA#1. Conversely, the control unit 7 may control the galvanometer mirror 2146 so that the target irradiation area EA#1 periodically moves along a scanning direction that intersects (or, in some cases, is perpendicular to) the target movement trajectory MT0 of the processing unit area BSA#1 on the printing surface MS. As a result, on the printing surface MS, the target irradiation area EA#1 may move along the movement trajectory MT#1 shown in FIG. 5B. Specifically, the target irradiation area EA#1 may move along the target movement trajectory MT0 of the processing unit area BSA#1 while also moving along a scanning direction that intersects with the target movement trajectory MT0. That is, the target irradiation area EA#1 may move along a wave-shaped (for example, sinusoidal) movement locus MT#1 that oscillates around the target movement locus MT0.

[0097] 6(a) or 6(b), the control unit 7 may control at least one of the head drive system 22 and the stage drive system 32 so that the processing unit area BSA#1 moves along a target movement trajectory MT0 extending along at least one of a direction along the movement direction (i.e., the scanning direction) of the target irradiation area EA#1 within the processing unit area BSA#1 and a direction intersecting (or, in some cases, perpendicular to) the movement direction of the target irradiation area EA#1 within the processing unit area BSA#1. Conversely, the control unit 7 may control the galvanometer mirror 2146 so that the target irradiation area EA#1 periodically moves along each of a scanning direction along the target movement trajectory MT0 of the processing unit area BSA#1 on the printing surface MS and a scanning direction intersecting (or, in some cases, perpendicular to) the target movement trajectory MT0. Note that Figure 6(c) shows the movement trajectory MT#1 of the target irradiation area EA#1 on the printing surface MS when the processing unit area BSA#1 shown in Figure 6(a) moves along the target movement trajectory MT0 on the printing surface MS.

[0098] When the processing beam EL#1 is irradiated onto the printing surface MS so that the target irradiation area EA#1 moves within the processing unit area BSA#1, a molten pool MP#1 is formed in at least a part of the processing unit area BSA#1. As a result, a molded object is formed within the processing unit area BSA#1. As described above, the processing unit area BSA#1 is an area having a width in a direction intersecting the movement direction of the processing unit area BSA#1 on the printing surface MS (specifically, the direction in which the target movement trajectory MT0 extends). In this case, a molded object having a width in a direction intersecting the target movement trajectory MT0 of the processing unit area BSA#1 is molded on the printing surface MS along the target movement trajectory MT0. For example, in the example shown in FIGS. 5( a) and 5(b), a molded object having a width along the X-axis direction and extending along the Y-axis direction is molded. For example, in the example shown in FIGS. 6(a) and 6(c), a molded object having a width along the X-axis direction and extending along the Y-axis direction is molded. For example, when the modeling system unit area BSA shown in FIG. 6B moves along the Y-axis direction, a model that has a width along the X-axis direction and extends along the Y-axis direction is modeled.

[0099] When the processing light EL#1 is irradiated onto the printing surface MS so that the target irradiation area EA#1 moves within the processing unit area BSA#1, the processing unit area BSA#1 is scanned with the processing light EL#1 by the galvanometer mirror 2146. Therefore, compared to when the processing light EL#1 is irradiated onto the printing surface MS without using the galvanometer mirror 2146, the amount of energy transmitted from the processing light EL#1 to the processing unit area BSA#1 is less likely to vary within the processing unit area BSA#1. In other words, the distribution of the amount of energy transmitted from the processing light EL#1 to the processing unit area BSA#1 can be made uniform. As a result, the processing system SYS can form a shaped object on the printing surface MS with relatively high printing accuracy.

[0100] However, the machining system SYS does not have to irradiate the manufacturing surface MS with the processing light EL#1 so that the target irradiation area EA#1 moves within the machining unit area BSA#1. The machining system SYS may irradiate the manufacturing surface MS with the processing light EL#1 without using the galvanometer mirror 2146. In this case, the target irradiation area EA#1 may move on the manufacturing surface MS in accordance with the movement of at least one of the machining head 21 and the stage 31.

[0101] Referring again to FIG. 4 , the processing light EL#1 reflected by the parallel plate 2142 is incident on the power meter 2143. The power meter 2143 can detect the intensity of the processing light EL#1 incident on the power meter 2143. Therefore, the power meter 2143 may be referred to as a detection device. For example, the power meter 2143 may include a light-receiving element that detects the processing light EL#1 as light. Alternatively, the higher the intensity of the processing light EL#1, the greater the amount of energy generated by the processing light EL#1. As a result, the amount of heat generated by the processing light EL#1 increases. Therefore, the power meter 2143 may detect the intensity of the processing light EL#1 by detecting the processing light EL#1 as heat. In this case, the power meter 2143 may include a heat detection element that detects the heat of the processing light EL#1.

[0102] As described above, the processing light EL#1 reflected by the parallel plate 2142 is incident on the power meter 2143. Therefore, the power meter 2143 detects the intensity of the processing light EL#1 reflected by the parallel plate 2142. Because the parallel plate 2142 is disposed on the optical path of the processing light EL#1 between the light source 4#1 and the galvanometer mirror 2146, the power meter 2143 may be considered to detect the intensity of the processing light EL#1 traveling along the optical path between the light source 4#1 and the galvanometer mirror 2146. In this case, the power meter 2143 can stably detect the intensity of the processing light EL#1 without being affected by the deflection of the processing light EL#1 by the galvanometer mirror 2146. However, the location of the power meter 2143 is not limited to the example shown in FIG. 4 . For example, the power meter 2143 may detect the intensity of the processing light EL#1 traveling along the optical path between the galvanometer mirror 2146 and the printing surface MS. The power meter 2143 may detect the intensity of the processing light EL#1 traveling along the optical path within the galvanometer mirror 2146.

[0103] The detection result of the power meter 2143 is output to the control unit 7. The control unit 7 may control (in other words, change) the intensity of the processing light EL#1 based on the detection result of the power meter 2143 (i.e., the detection result of the intensity of the processing light EL#1). For example, the control unit 7 may control the intensity of the processing light EL#1 so that the intensity of the processing light EL#1 on the printing surface MS becomes a desired intensity. To control the intensity of the processing light EL#1, for example, the control unit 7 may control the light source 4#1 to change the intensity of the processing light EL#1 emitted from the light source 4#1 based on the detection result of the power meter 2143. As a result, the processing system SYS can appropriately print a model on the printing surface MS by irradiating the printing surface MS with processing light EL#1 having an appropriate intensity.

[0104] As described above, the processing light EL#1 has an intensity capable of melting the shaping material M. Therefore, the processing light EL#1 incident on the power meter 2143 may have an intensity capable of melting the shaping material M. However, if the processing light EL#1 having an intensity capable of melting the shaping material M is incident on the power meter 2143, the power meter 2143 may be damaged by the processing light EL#1. Therefore, the processing light EL#1 may be incident on the power meter 2143 with an intensity not high enough to damage the power meter 2143. In other words, the first optical system 214 may weaken the intensity of the processing light EL#1 incident on the power meter 2143 so that the processing light EL#1 having an intensity not high enough to damage the power meter 2143 is incident on the power meter 2143.

[0105] For example, in order to weaken the intensity of the processing light EL#1 incident on the power meter 2143, the reflectivity of the parallel plate 2142 for the processing light EL#1 may be set to an appropriate value. Specifically, the lower the reflectivity of the parallel plate 2142 for the processing light EL#1, the lower the intensity of the processing light EL#1 incident on the power meter 2143. Therefore, the reflectivity of the parallel plate 2142 may be set to a value low enough to realize a state in which the processing light EL#1, having an intensity not high enough to damage the power meter 2143, is incident on the power meter 2143. For example, the reflectivity of the parallel plate 2142 may be less than 10%. For example, the reflectivity of the parallel plate 2142 may be less than a few percent. Plain glass may be used as the parallel plate 2142 with such low reflectivity.

[0106] For example, in order to weaken the intensity of the processing light EL#1 incident on the power meter 2143, the first optical system 214 may cause the processing light EL#1 to be incident on the power meter 2143 via multiple parallel plates 2142. Specifically, the processing light EL#1 may be reflected multiple times by each of the multiple parallel plates 2142 and incident on the power meter 2143. In this case, the intensity of the processing light EL#1 reflected multiple times by each of the multiple parallel plates 2142 is weaker than the intensity of the processing light EL#1 reflected once by a single parallel plate 2142. Therefore, there is a high possibility that the processing light EL#1 having an intensity not high enough to damage the power meter 2143 will be incident on the power meter 2143.

[0107] A desired coating treatment may be applied to the surface of the parallel plate 2142 (particularly, at least one of the incident surface onto which the processing light EL#1 is incident and the reflecting surface onto which the processing light EL#1 is reflected). For example, the surface of the parallel plate 2142 may be subjected to anti-reflection coating (AR).

[0108] The second optical system 215 includes a collimator lens 2151, a parallel plate 2152, a power meter 2153, and a galvanometer scanner 2154. The galvanometer scanner 2154 includes a focus control optical system 2155 and a galvanometer mirror 2156. However, the second optical system 215 does not necessarily have to include at least one of the collimator lens 2151, the parallel plate 2152, the power meter 2153, and the galvanometer scanner 2154. The galvanometer scanner 2154 does not necessarily have to include at least one of the focus control optical system 2155 and the galvanometer mirror 2156.

[0109] The processing light EL#2 emitted from the light source 4#2 is incident on the collimator lens 2151. The collimator lens 2151 converts the processing light EL#2 incident on the collimator lens 2151 into parallel light. Note that if the processing light EL#2 emitted from the light source 4#2 is parallel light (i.e., if the processing light EL#2, which is parallel light, enters the second optical system 215), the second optical system 215 does not need to include the collimator lens 2151. The processing light EL#2 converted into parallel light by the collimator lens 2151 is incident on the parallel plate 2152. A portion of the processing light EL#2 incident on the parallel plate 2152 passes through the parallel plate 2152. The other portion of the processing light EL#2 incident on the parallel plate 2152 is reflected by the parallel plate 2152.

[0110] Processing light EL#2 that has passed through the parallel plate 2152 is incident on a galvanometer scanner 2154. Specifically, processing light EL#2 that has passed through the parallel plate 2152 is incident on a focus control optical system 2155 of the galvanometer scanner 2154.

[0111] The focus control optical system 2155 is an optical element that can change the focusing position CP of the processing light EL#2 (hereinafter referred to as the "focus position CP#2"). Specifically, the focus control optical system 2155 can change the focusing position CP#2 of the processing light EL#2 along the irradiation direction of the processing light EL#2 that is irradiated onto the printing surface MS. In the example shown in FIG. 4, the irradiation direction of the processing light EL#2 that is irradiated onto the printing surface MS is a direction in which the Z-axis direction is the main component. In this case, the focus control optical system 2155 can change the focusing position CP#2 of the processing light EL#2 along the Z-axis direction. Furthermore, because the irradiation optical system 211 irradiates the printing surface MS with the processing light EL from above the workpiece W, the irradiation direction of the processing light EL#2 is a direction that intersects with the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). For this reason, the focus control optical system 2155 may be considered to be able to change the focusing position CP#2 of the processing light EL#2 along a direction intersecting the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). The focus control optical system 2155 may be considered to be able to change the focusing position CP#2 of the processing light EL#2 along the direction of the optical axis EX of the irradiation optical system 211 (typically, the third optical system 216).

[0112] The irradiation direction of the processing light EL#2 may refer to the irradiation direction of the processing light EL#2 emitted from the third optical system 216. In this case, the irradiation direction of the processing light EL#2 may be the same as the direction along the optical axis of the third optical system 216. The irradiation direction of the processing light EL#2 may be the same as the direction along the optical axis of the final optical element that is arranged closest to the printing surface MS among the optical elements constituting the third optical system 216. The final optical element may be the fθ lens 2162 described below. Furthermore, if the fθ lens 2162 described below is composed of multiple optical elements, the final optical element may be the optical element that is arranged closest to the printing surface MS among the multiple optical elements constituting the fθ lens 2162.

[0113] The focus control optical system 2155 may include, for example, a plurality of lenses arranged along the irradiation direction of the processing light EL#2. In this case, the focus control optical system 2155 may change the focusing position CP of the processing light EL#2 by moving at least one of the plurality of lenses along its optical axis direction.

[0114] When the focus control optical system 2155 changes the condensing position CP#2 of the processing light EL#2, the positional relationship between the condensing position CP#2 of the processing light EL#2 and the printing surface MS changes. In particular, the positional relationship between the condensing position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2 changes. For this reason, it can be considered that the focus control optical system 2155 changes the positional relationship between the condensing position CP#2 of the processing light EL#2 and the printing surface MS by changing the condensing position CP#2 of the processing light EL#2.

[0115] The change of the focusing position CP#1 of the shaping light EL#1 along the Z-axis direction by the focus control optical system 2145 of the galvanometer scanner 2144 of the first optical system 214 and the change of the focusing position CP#2 of the shaping light EL#2 along the Z-axis direction by the focus control optical system 2155 of the galvanometer scanner 2154 of the second optical system 215 may be linked to each other. For example, the focusing positions CP#1 and CP#2 may be changed along the Z-axis direction so that the position of the focusing position CP#1 of the shaping light EL#1 in the Z-axis direction and the position of the focusing position CP#2 of the shaping light EL#2 in the Z-axis direction coincide with each other. For example, the focusing positions CP#1 and CP#2 may be changed along the Z-axis direction so that the position of the focusing position CP#1 of the shaping light EL#1 in the Z-axis direction and the position of the focusing position CP#2 of the shaping light EL#2 in the Z-axis direction are maintained apart by a predetermined distance in the Z-axis direction. However, the change in the focusing position CP#1 of the shaping light EL#1 along the Z-axis direction by the focus control optical system 2145 of the galvanometer scanner 2144 of the first optical system 214 and the change in the focusing position CP#2 of the shaping light EL#2 along the Z-axis direction by the focus control optical system 2155 may be performed independently of each other.

[0116] As described above, the galvanometer scanner 2154 does not necessarily have to include the focus control optical system 2155. Even in this case, if the positional relationship between the irradiation optical system 211 and the printing surface MS in the irradiation direction of the processing light EL#2 changes, the positional relationship between the condensing position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2 changes. Therefore, even if the galvanometer scanner 2154 does not include the focus control optical system 2155, the processing system SYS can change the positional relationship between the condensing position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2. For example, the processing system SYS may change the positional relationship between the condensing position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2 by using the head drive system 22 to move the processing head 21 along the irradiation direction of the processing light EL#2. For example, the processing system SYS may use the stage drive system 32 to move the stage 31 along the irradiation direction of the processing light EL#2, thereby changing the positional relationship between the focusing position CP#2 of the processing light EL#2 in the irradiation direction of the processing light EL#2 and the manufacturing surface MS.

[0117] The processing light EL#2 emitted from the focus control optical system 2155 is incident on the galvanometer mirror 2156. The galvanometer mirror 2156 deflects the processing light EL#2, thereby changing the emission direction of the processing light EL#2 emitted from the galvanometer mirror 2156. For this reason, the galvanometer mirror 2156 may also be referred to as a deflection member. When the emission direction of the processing light EL#2 emitted from the galvanometer mirror 2156 is changed, the position from which the processing light EL#2 is emitted from the processing head 21 is changed. When the position from which the processing light EL#2 is emitted from the processing head 21 is changed during the printing period in which the processing head 21 prints a model, the target irradiation area EA#2 onto which the processing light EL#2 is irradiated moves on the printing surface MS. Alternatively, if the position from which processing light EL#2 is emitted from processing head 21 is changed during the measurement period in which calibration unit 8 measures processing light EL#2, the target irradiation area EA#2 onto which processing light EL#2 is irradiated moves on calibration unit 8. In other words, the irradiation position onto which processing light EL#2 is irradiated on the printing surface MS or calibration unit 8 moves.

[0118] The galvanometer mirror 2156 includes, for example, an X-scan mirror 2156MX, an X-scan motor 2156AX, a Y-scan mirror 2156MY, and a Y-scan motor 2156AY. Processing light EL#2 emitted from the focus control optical system 2155 is incident on the X-scan mirror 2156MX. The X-scan mirror 2156MX reflects the processing light EL#2 incident on the X-scan mirror 2156MX toward the Y-scan mirror 2156MY. The Y-scan mirror 2156MY reflects the processing light EL#2 incident on the Y-scan mirror 2156MY toward the third optical system 216. Note that each of the X-scan mirror 2156MX and the Y-scan mirror 2156MY may be referred to as a galvanometer mirror.

[0119] The X-scan motor 2156AX swings or rotates the X-scan mirror 2156MX around a rotation axis along the Y-axis. As a result, the angle of the X-scan mirror 2156MX relative to the optical path of the processing light EL#2 incident on the X-scan mirror 2156MX is changed. In this case, the swing or rotation of the X-scan mirror 2156MX causes the processing light EL#2 to move along the X-axis direction, which intersects with the optical axis EX of the irradiation optical system 211. As a result, the processing light EL#2 scans the printing surface MS or the calibration unit 8 along the X-axis direction. In other words, the irradiation position of the processing light EL#2 on the printing surface MS changes in the X-axis direction. In other words, the target irradiation area EA#2 (i.e., the irradiation position of the processing light EL#2) moves along the X-axis direction on the printing surface MS or the calibration unit 8.

[0120] The Y-scan motor 2156AY swings or rotates the Y-scan mirror 2156MY around a rotation axis along the X-axis. As a result, the angle of the Y-scan mirror 2156MY relative to the optical path of the processing light EL#2 incident on the Y-scan mirror 2156MY is changed. In this case, the swing or rotation of the Y-scan mirror 2156MY causes the processing light EL#2 to move along the Y-axis direction, which intersects with the optical axis EX of the irradiation optical system 211. As a result, the processing light EL#2 scans the printing surface MS or the calibration unit 8 along the Y-axis direction. In other words, the irradiation position of the processing light EL#2 on the printing surface MS changes in the Y-axis direction. In other words, the target irradiation area EA#2 (i.e., the irradiation position of the processing light EL#2) moves along the Y-axis direction on the printing surface MS or the calibration unit 8.

[0121] Furthermore, since the galvanometer mirror 2156 can move the processing light EL#2 and the target irradiation area EA#2, the galvanometer mirror 2156 may also be referred to as a moving member.

[0122] In this embodiment, the virtual area on the printing surface MS through which the galvanometer mirror 2156 moves the target irradiation area EA#2 is referred to as the machining unit area BSA (particularly, the machining unit area BSA#2). In this case, the target irradiation area EA#2 may be considered to move on a surface of the printing surface MS that overlaps with the machining unit area BSA#2. Specifically, the virtual area on the printing surface MS through which the galvanometer mirror 2156 moves the target irradiation area EA#2 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed (i.e., without change) is referred to as the machining unit area BSA (particularly, the machining unit area BSA#2). The machining unit area BSA#2 indicates the virtual area (in other words, the range) through which the machining head 21 actually performs additional machining using the machining light EL#2 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area BSA#2 indicates a virtual area (in other words, a range) that the processing head 21 actually scans with the processing light EL#2 when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area BSA#2 indicates a region (in other words, a range) through which the target irradiation area EA#2 actually moves when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. Therefore, the processing unit area BSA#2 may be considered to be a virtual area determined based on the processing head 21 (particularly, the irradiation optical system 211). In other words, the processing unit area BSA#2 may be considered to be a virtual area located at a position on the printing surface MS that is determined based on the processing head 21 (particularly, the irradiation optical system 211). Note that the maximum region over which the galvanometer mirror 2146 can move the target irradiation area EA#2 on the printing surface MS when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed may also be referred to as the processing unit area BSA#2. Furthermore, the processing unit area BSA#2 may be considered to be a virtual area (typically a two-dimensional area) set in the direction of travel of the processing light EL1 emitted from the irradiation optical system 211, based on the processing head 21 (particularly, the irradiation optical system 211).

[0123] In this case, the machining system SYS can use the galvanometer mirror 2156 to move the target irradiation area EA#2 within the machining unit area BSA#2. Therefore, the operation of deflecting the machining light EL#2 using the galvanometer mirror 2156 may be considered equivalent to the operation of moving the target irradiation area EA#2 within the machining unit area BSA#2. Furthermore, as described above, the molten pool MP#2 is formed by irradiating the target irradiation area EA#2 with the machining light EL#2. In this case, the machining system SYS may be considered to use the galvanometer mirror 2156 to move the molten pool MP#2 within the machining unit area BSA#2. Therefore, the operation of deflecting the machining light EL#2 using the galvanometer mirror 2156 may be considered equivalent to the operation of moving the molten pool MP#2 within the machining unit area BSA#2. In other words, the operation of moving the target irradiation area EA#2 within the machining unit area BSA#2 may be considered equivalent to the operation of moving the molten pool MP#2 within the machining unit area BSA#2.

[0124] As described above, when at least one of the machining head 21 and the stage 31 moves, the target irradiation area EA#2 moves on the printing surface MS. However, when at least one of the machining head 21 and the stage 31 moves, the relative positional relationship between the galvanometer mirror 2146 and the printing surface MS changes. As a result, the machining unit area BSA#2 determined based on the machining head 21 (i.e., the machining unit area BSA#2 to which the galvanometer mirror 2156 moves the target irradiation area EA#2 on the printing surface MS) moves on the printing surface MS. For this reason, in this embodiment, the operation of moving at least one of the machining head 21 and the stage 31 may be considered equivalent to the operation of moving the machining unit area BSA#2 relative to the printing surface MS.

[0125] The characteristics of the processing unit area BSA#2 (e.g., shape, movement pattern, etc.) may be the same as the characteristics of the processing unit area BSA#1 described above. The movement pattern of the target irradiation area EA#2 within the processing unit area BSA#2 (e.g., movement trajectory, etc.) may be the same as the movement pattern of the target irradiation area EA#1 within the processing unit area BSA#1 described above. For this reason, detailed description of the characteristics of the processing unit area BSA#2 and the movement pattern of the target irradiation area EA#2 within the processing unit area BSA#2 (e.g., movement trajectory, etc.) will be omitted, but an example will be briefly described below. As shown in FIG. 5( a), under the assumption that the processing unit area BSA#2 is stationary (i.e., not moving) on ​​the printing surface MS, the galvanometer mirror 2156 may deflect the processing light EL#2 within the processing unit area BSA#2 so that the target irradiation area EA#2 moves along a single scanning direction along the printing surface MS. As shown in Fig. 5(a), the processing unit area BSA#2 moves along the target movement trajectory MT0 on the printing surface MS, so that the target irradiation area EA#2 moves along the movement trajectory MT#2 (e.g., a wave-shaped movement trajectory MT#2 oscillating around the target movement trajectory MT0) on the printing surface MS. As shown in Fig. 6(a) and Fig. 6(b), the galvanometer mirror 2156 may deflect the processing light EL#2 so that the target irradiation area EA#2 moves along multiple scanning directions within the processing unit area BSA#2 under the assumption that the processing unit area BSA#2 is stationary (i.e., not moving) on ​​the printing surface MS.

[0126] 5A, 6A, and 6B, the operation of periodically moving the target irradiation area EA#2 on the printing surface MS may be referred to as a wobbling operation. In other words, the operation of periodically moving (or deflecting) the processing light EL#2 so as to periodically move the target irradiation area EA#2 on the printing surface MS may be referred to as a wobbling operation.

[0127] Typically, the processing unit area BSA#1 and the processing unit area BSA#2 coincide. In other words, the processing unit area BSA#1 is identical to the processing unit area BSA#2. Therefore, the galvanometer mirror 2156 may be considered to deflect the processing light EL#2 so that the target irradiation area EA#2 moves within the processing unit area BSA#1. The galvanometer mirror 2146 may be considered to deflect the processing light EL#1 so that the target irradiation area EA#1 moves within the processing unit area BSA#2. However, the processing unit area BSA#1 and the processing unit area BSA#2 may be partially different. For example, a portion of the processing unit area BSA#1 and a portion of the processing unit area BSA#2 may overlap each other. Alternatively, the processing unit area BSA#1 and the processing unit area BSA#2 may not overlap each other. For example, the processing unit area BSA#1 and the processing unit area BSA#2 may be adjacent to each other.

[0128] When the processing light EL#2 is irradiated onto the printing surface MS so that the target irradiation area EA#2 moves within the processing unit area BSA#2, a molten pool MP#2 is formed in at least a part of the processing unit area BSA#2. As a result, an object is printed within the processing unit area BSA#2. As described above, the processing unit area BSA#2 is an area having a width in a direction intersecting the movement direction of the processing unit area BSA#2 on the printing surface MS (specifically, the direction in which the target movement trajectory MT0 extends). In this case, an object having a width in a direction intersecting the target movement trajectory MT0 of the processing unit area BSA#2 is printed on the printing surface MS along the target movement trajectory MT0. For example, in the example shown in FIGS. 5( a) and 5(b), an object having a width along the X-axis direction and extending along the Y-axis direction is printed. For example, in the example shown in FIGS. 6(a) and 6(c), an object having a width along the X-axis direction and extending along the Y-axis direction is printed. For example, when the modeling system unit area BSA shown in FIG. 6B moves along the Y-axis direction, a model that has a width along the X-axis direction and extends along the Y-axis direction is modeled.

[0129] When the processing light EL#2 is irradiated onto the printing surface MS so that the target irradiation area EA#2 moves within the processing unit area BSA#2, the processing unit area BSA#2 is scanned with the processing light EL#2 by the galvanometer mirror 2156. Therefore, compared to when the processing light EL#2 is irradiated onto the printing surface MS without using the galvanometer mirror 2156, the amount of energy transmitted from the processing light EL#2 to the processing unit area BSA#2 is less likely to vary within the processing unit area BSA#2. In other words, the distribution of the amount of energy transmitted from the processing light EL#2 to the processing unit area BSA#2 can be made uniform. As a result, the processing system SYS can print a model on the printing surface MS with relatively high printing accuracy.

[0130] However, the machining system SYS does not have to irradiate the manufacturing surface MS with the processing light EL#2 so that the target irradiation area EA#2 moves within the machining unit area BSA#2. The machining system SYS may irradiate the manufacturing surface MS with the processing light EL#2 without using the galvanometer mirror 2156. In this case, the target irradiation area EA#2 may move on the manufacturing surface MS in accordance with the movement of at least one of the machining head 21 and the stage 31.

[0131] Referring again to FIG. 4 , the processing light EL#2 reflected by the parallel plate 2152 is incident on the power meter 2153. The power meter 2153 is a specific example of an electrical component used to control the processing light EL#2. Specifically, the power meter 2153 can detect the intensity of the processing light EL#2 incident on the power meter 2153. For example, the power meter 2153 may include a light-receiving element that detects the processing light EL#2 as light. Alternatively, the higher the intensity of the processing light EL#2, the greater the amount of energy generated by the processing light EL#2. As a result, the amount of heat generated by the processing light EL#2 increases. Therefore, the power meter 2153 may detect the intensity of the processing light EL#2 by detecting the processing light EL#2 as heat. In this case, the power meter 2153 may include a heat-detecting element that detects the heat of the processing light EL#2.

[0132] As described above, the processing light EL#2 reflected by the parallel plate 2152 is incident on the power meter 2153. Therefore, the power meter 2153 detects the intensity of the processing light EL#2 reflected by the parallel plate 2152. Because the parallel plate 2152 is disposed on the optical path of the processing light EL#2 between the light source 4#2 and the galvanometer mirror 2156, the power meter 2153 may be considered to detect the intensity of the processing light EL#2 traveling along the optical path between the light source 4#2 and the galvanometer mirror 2156. In this case, the power meter 2153 can stably detect the intensity of the processing light EL#2 without being affected by the deflection of the processing light EL#2 by the galvanometer mirror 2156. However, the location of the power meter 2153 is not limited to the example shown in FIG. 3 . For example, the power meter 2153 may detect the intensity of the processing light EL#2 traveling along the optical path between the galvanometer mirror 2156 and the printing surface MS. The power meter 2153 may detect the intensity of the processing light EL#2 traveling along the optical path within the galvanometer mirror 2156.

[0133] The detection result of the power meter 2153 is output to the control unit 7. The control unit 7 may control (in other words, change) the intensity of the processing light EL#2 based on the detection result of the power meter 2153 (i.e., the detection result of the intensity of the processing light EL#2). For example, the control unit 7 may control the intensity of the processing light EL#2 so that the intensity of the processing light EL#2 on the printing surface MS becomes a desired intensity. To control the intensity of the processing light EL#2, for example, the control unit 7 may control the light source 4#2 based on the detection result of the power meter 2153 to change the intensity of the processing light EL#2 emitted from the light source 4#2. As a result, the processing system SYS can appropriately print a model on the printing surface MS by irradiating the printing surface MS with processing light EL#2 having an appropriate intensity.

[0134] As described above, the processing light EL#2 has an intensity capable of melting the shaping material M. Therefore, the processing light EL#2 incident on the power meter 2153 may have an intensity capable of melting the shaping material M. However, if the processing light EL#2 having an intensity capable of melting the shaping material M is incident on the power meter 2153, the power meter 2153 may be damaged by the processing light EL#2. Therefore, the processing light EL#2 may be incident on the power meter 2153 with an intensity not high enough to damage the power meter 2153. In other words, the second optical system 215 may weaken the intensity of the processing light EL#2 incident on the power meter 2153 so that the processing light EL#2 having an intensity not high enough to damage the power meter 2153 is incident on the power meter 2153.

[0135] For example, in order to weaken the intensity of the processing light EL#2 incident on the power meter 2153, the reflectivity of the parallel plate 2152 for the processing light EL#2 may be set to an appropriate value. Specifically, the lower the reflectivity of the parallel plate 2152 for the processing light EL#2, the lower the intensity of the processing light EL#2 incident on the power meter 2153. Therefore, the reflectivity of the parallel plate 2152 may be set to a value low enough to realize a state in which the processing light EL#2, having an intensity not high enough to damage the power meter 2153, is incident on the power meter 2153. For example, the reflectivity of the parallel plate 2152 may be less than 10%. For example, the reflectivity of the parallel plate 2152 may be less than a few percent. Plain glass may be used as the parallel plate 2152 with such low reflectivity.

[0136] For example, in order to weaken the intensity of the processing light EL#2 incident on the power meter 2153, the second optical system 215 may cause the processing light EL#2 to be incident on the power meter 2153 via multiple parallel plates 2152. Specifically, the processing light EL#2 reflected multiple times by each of the multiple parallel plates 2152 may be incident on the power meter 2153. In this case, the intensity of the processing light EL#2 reflected multiple times by each of the multiple parallel plates 2152 is weaker than the intensity of the processing light EL#2 reflected once by a single parallel plate 2152. Therefore, there is a high possibility that the processing light EL#2 having an intensity not high enough to damage the power meter 2153 will be incident on the power meter 2153.

[0137] A desired coating treatment may be applied to the surface of the parallel plate 2152 (particularly, at least one of the incident surface onto which the processing light EL#2 is incident and the reflecting surface onto which the processing light EL#2 is reflected). For example, the surface of the parallel plate 2152 may be subjected to anti-reflection coating (AR).

[0138] The third optical system 216 includes a prism mirror 2161 and an fθ lens 2162 .

[0139] Processing light EL#1 emitted from the first optical system 214 and processing light EL#2 emitted from the second optical system 215 are each incident on a prism mirror 2161. The prism mirror 2161 reflects each of processing light EL#1 and EL#2 toward an fθ lens 2162. The prism mirror 2161 reflects processing light EL#1 and EL#2, which are incident on the prism mirror 2161 from different directions, in the same direction (specifically, toward the fθ lens 2162).

[0140] Furthermore, if the processing light EL#1 emitted from the first optical system 214 and the processing light EL#2 emitted from the second optical system 215 can each be directly incident on the fθ lens 2162, the third optical system 216 does not need to be equipped with a prism mirror 2161.

[0141] The fθ lens 2162 is an optical system for emitting each of the processing lights EL#1 and EL#2 reflected by the prism mirror 2161 toward the printing surface MS. In other words, the fθ lens 2162 is an optical system for irradiating each of the processing lights EL#1 and EL#2 reflected by the prism mirror 2161 onto the printing surface MS. As a result, the processing lights EL#1 and EL#2 that have passed through the fθ lens 2162 are irradiated onto the printing surface MS.

[0142] The fθ lens 2162 may be an optical element capable of focusing each of the processing beams EL#1 and EL#2 on a focusing surface. In this case, the fθ lens 2162 may be referred to as a focusing optical system. The focusing surface of the fθ lens 2162 may be set, for example, on the printing surface MS. In this case, the third optical system 216 may be considered to have a focusing optical system whose projection characteristic is fθ. However, the third optical system 216 may also have a focusing optical system whose projection characteristic is different from fθ. For example, the third optical system 216 may have a focusing optical system whose projection characteristic is f tan θ. For example, the third optical system 216 may have a focusing optical system whose projection characteristic is f sin θ.

[0143] In this embodiment, the optical axis of the fθ lens 2162 is used as the optical axis EX of the irradiation optical system 211. As described above, since the optical axis EX of the irradiation optical system 211 is an axis along the Z axis, the optical axis of the fθ lens 2162 is also an axis along the Z axis. Therefore, the fθ lens 2162 emits each of the processing light EL#1 and EL#2 along the Z axis direction. In this case, the irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may be the same direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may both be the Z axis direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may both be directions along the optical axis EX of the fθ lens 2162. However, the irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 do not have to be the same direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may be mutually different directions.

[0144] (1-3) Configuration of Calibration Unit 8 Next, the configuration of the calibration unit 8 will be described with reference to Figures 7(a) to 7(c). Figure 7(a) is a top view showing the configuration of the calibration unit 8, and Figures 7(b) and 7(c) are cross-sectional views (cross-sectional views taken along A-A' in Figure 7(a)) showing the configuration of the calibration unit 8. As shown in Figures 7(a) to 7(c), the calibration unit 8 includes a first calibration unit 81 and a second calibration unit 82. However, the calibration unit 8 does not necessarily have to include at least one of the first calibration unit 81 and the second calibration unit 82.

[0145] The first calibration unit 81 and the second calibration unit 82 may each be disposed on a base member 80 of the calibration unit 8. The first calibration unit 81 and the second calibration unit 82 may each be attached to the base member 80 of the calibration unit 8. In the following description, an example will be given in which the first calibration unit 81 and the second calibration unit 82 are each disposed on a calibration surface 801, which is one surface of the base member 80, as shown in FIGS. 7( a) to 7(c).

[0146] Each of the first calibration unit 81 and the second calibration unit 82 is a measurement device capable of measuring at least one of the processing light EL#1 and EL#2. In the following description, for the sake of simplicity, at least one of the processing light EL#1 and EL#2 will be collectively referred to as the "processing light EL," as described above.

[0147] During at least a portion of the measurement period in which at least one of the first calibration unit 81 and the second calibration unit 82 measures the processing light EL, the processing head 21 irradiates at least one of the first calibration unit 81 and the second calibration unit 82 with the processing light EL. For example, as shown in FIG. 7B, during at least a portion of the measurement period, the processing head 21 may irradiate the first calibration unit 81 with the processing light EL. As a result, the first calibration unit 81 can measure the processing light EL. For example, as shown in FIG. 7C, during at least a portion of the measurement period, the processing head 21 may irradiate the second calibration unit 82 with the processing light EL. As a result, the second calibration unit 82 can measure the processing light EL.

[0148] As shown in Figures 7(b) and 7(c), during at least a portion of the measurement period, the calibration unit 8 is positioned at a measurement position Pos2 that enables the processing head 21 to irradiate processing light EL onto at least one of the first calibration unit 81 and the second calibration unit 82.

[0149] The measurement position Pos2 may include a position that satisfies the following condition. For example, as shown in FIGS. 7B and 7C, the measurement position Pos2 may include a position that satisfies the condition that, when the calibration unit 8 is located at the measurement position Pos2, at least one of the first calibration unit 81 and the second calibration unit 82 faces the machining head 21 (particularly, the irradiation optical system 211). For example, as shown in FIGS. 7B and 7C, the measurement position Pos2 may include a position that satisfies the condition that, when the calibration unit 8 is located at the measurement position Pos2, at least one of the first calibration unit 81 and the second calibration unit 82 faces the direction in which the machining head 21 (particularly, the irradiation optical system 211) is located. For example, as shown in FIGS. 7B and 7C, the measurement position Pos2 may include a position that satisfies the condition that, when the calibration unit 8 is located at the measurement position Pos2, at least one of the first calibration unit 81 and the second calibration unit 82 faces the +Z side. This is because, as described above, the machining head 21 emits the machining light EL traveling along the Z-axis direction toward the −Z side. For example, as shown in FIGS. 7( b) and 7(c), the measurement position Pos2 may include a position that satisfies the condition that, when the calibration unit 8 is located at the measurement position Pos2, the calibration surface 801 on which the first calibration unit 81 and the second calibration unit 82 are arranged faces the +Z side. For example, as shown in FIGS. 7( b) and 7(c), the measurement position Pos2 may include a position that satisfies the condition that, when the calibration unit 8 is located at the measurement position Pos2, the calibration surface 801 intersects the Z-axis. For example, as shown in FIGS. 7( b) and 7(c), the measurement position Pos2 may include a position that satisfies the condition that, when the calibration unit 8 is located at the measurement position Pos2, the calibration surface 801 intersects the optical axis EX of the irradiation optical system 211.7(b) and 7(c), the measurement position Pos2 may include a position that satisfies the condition that, when the calibration unit 8 is located at the measurement position Pos2, at least one of the first calibration unit 81 and the second calibration unit 82 is located on the optical path of the processing light EL. For example, as shown in FIG. 7(b) and 7(c), the measurement position Pos2 may include a position that satisfies the condition that, when the calibration unit 8 is located at the measurement position Pos2, at least one of the first calibration unit 81 and the second calibration unit 82 is located on the optical axis EX of the irradiation optical system 211. In this case, the measurement position Pos2 can also be said to be a position on the optical axis EX of the irradiation optical system 211.

[0150] As a result, during at least a portion of the measurement period, the processing head 21 can appropriately irradiate the processing light EL to at least one of the first calibration unit 81 and the second calibration unit 82. Therefore, during at least a portion of the measurement period, at least one of the first calibration unit 81 and the second calibration unit 82 can appropriately measure the processing light EL.

[0151] On the other hand, as described above, the machining unit 2 (particularly the machining head 21) forms a model on the workpiece W by irradiating the workpiece W with the machining light EL. Therefore, if the calibration unit 8 is located at the measurement position Pos2 during a modeling period in which the machining head 21 forms a model, the machining head 21 may not be able to appropriately irradiate the workpiece W with the machining light EL. For this reason, the calibration unit 8 may be located at a non-measurement position Pos1, which is different from the measurement position Pos2, during at least a part of the modeling period.

[0152] The non-measurement position Pos1 may include a position that satisfies the following conditions. For example, as shown in FIG. 8 , which illustrates the calibration unit 8 positioned at the non-measurement position Pos1, the non-measurement position Pos1 may include a position that satisfies the condition that, when the calibration unit 8 is positioned at the non-measurement position Pos1, the machining head 21 (particularly, the irradiation optical system 211) cannot irradiate the calibration unit 8 with the machining light EL. For example, as shown in FIG. 8 , the non-measurement position Pos1 may include a position that satisfies the condition that, when the calibration unit 8 is positioned at the non-measurement position Pos1, the calibration unit 8 does not face the machining head 21. For example, as shown in FIG. 8 , the non-measurement position Pos1 may include a position that satisfies the condition that, when the calibration unit 8 is positioned at the non-measurement position Pos1, the calibration unit 8 (particularly, the first calibration unit 81 and the second calibration unit 82) faces a direction different from the direction in which the machining head 21 (particularly, the irradiation optical system 211) is present. 8, the non-measurement position Pos1 may include a position that satisfies the condition that, when the calibration unit 8 is located at the non-measurement position Pos1, the calibration unit 8 is not located on the optical path of the processing light EL. For example, as shown in FIG. 8, the non-measurement position Pos1 may include a position that satisfies the condition that, when the calibration unit 8 is located at the non-measurement position Pos1, the calibration unit 8 is located at a position that is separated from the optical path of the processing light EL along a direction that intersects with the optical axis EX of the irradiation optical system 211. In this case, the non-measurement position Pos1 can also be said to be a position that is separated from the optical axis EX of the irradiation optical system 211.

[0153] As a result, during at least a part of the modeling period, the calibration unit 8 does not interfere with the irradiation of the processing light EL onto the workpiece W. Therefore, the processing head 21 can appropriately irradiate the processing light EL onto the workpiece W. Therefore, during at least a part of the modeling period, the processing head 21 can appropriately form a model on the workpiece W.

[0154] However, even if the calibration unit 8 is positioned at the measurement position Pos2, the calibration unit 8 may be positioned at the measurement position Pos2 for at least part of the manufacturing period, as long as the processing head 21 can properly irradiate the processing light EL onto the workpiece W.

[0155] The processing system SYS may move the calibration unit 8 between the non-measurement position Pos1 and the measurement position Pos2. Specifically, the processing system SYS may move the calibration unit 8 so that the calibration unit 8 is located at the non-measurement position Pos1 for at least a part of the modeling period. On the other hand, the processing system SYS may move the calibration unit 8 so that the calibration unit 8 is located at the measurement position Pos2 for at least a part of the measurement period.

[0156] As described above, in this embodiment, the stage drive system 32 moves the calibration unit 8. Therefore, under the control of the control unit 7, the stage drive system 32 may move the calibration unit 8 so that the calibration unit 8 is located at the non-measurement position Pos1 for at least a part of the modeling period. On the other hand, under the control of the control unit 7, the stage drive system 32 may move the calibration unit 8 so that the calibration unit 8 is located at the measurement position Pos2 for at least a part of the measurement period.

[0157] In this embodiment, as described above, the calibration unit 8 is disposed on the cradle 324 that is rotatable around a rotation axis along the X axis (i.e., the A axis). In this case, as shown in Figures 9(a) and 9(b) which show the calibration unit 8 disposed on the cradle 324, the calibration unit 8 may be disposed on an arrangement surface 3241 which is a side surface of the cradle 324. The arrangement surface 3241 of the cradle 324 may be a surface different from the stage mounting surface 3242 of the cradle 324 on which the stage 31 is mounted.

[0158] When the calibration unit 8 is placed on a placement surface 3241 that is different from the stage mounting surface 3242, the calibration unit 8 can move between a non-measurement position Pos1 ( FIG. 9A ) and a measurement position Pos2 ( FIG. 9B ) by rotating the cradle 324 around the A axis. In other words, the stage drive system 32 may move the calibration unit 8 between the non-measurement position Pos1 and the measurement position Pos2 by rotating the cradle 324 around the A axis.

[0159] 9A , the stage drive system 32 may rotate the cradle 324 during at least a part of the modeling period so that the stage mounting surface 3242 and the workpiece mounting surface 311 face a direction (e.g., the Z-axis direction) in which the machining head 21 (particularly, the irradiation optical system 211) is present. The stage drive system 32 may rotate the cradle 324 during at least a part of the modeling period so that the stage mounting surface 3242 and the workpiece mounting surface 311 face a direction (e.g., the Z-axis direction) along the optical axis EX of the irradiation optical system 211. On the other hand, the stage drive system 32 may rotate the cradle 324 during at least a part of the modeling period so that the placement surface 3241 faces a direction (e.g., a direction along the XY plane) different from the direction in which the machining head 21 (particularly, the irradiation optical system 211) is present. The stage drive system 32 may rotate the cradle 324 so that, during at least a part of the modeling period, the placement surface 3241 faces a direction (e.g., a direction along the XY plane) intersecting the optical axis EX of the irradiation optical system 211. As a result, during at least a part of the modeling period, the machining head 21 can appropriately irradiate the workpiece W placed on the workpiece placement surface 311 of the stage 31 with the machining light EL.

[0160] 9B, for example, the stage drive system 32 may rotate the cradle 324 so that the placement surface 3241 faces the direction (e.g., the Z-axis direction) in which the machining head 21 (particularly, the irradiation optical system 211) is located, during at least a portion of the measurement period. The stage drive system 32 may rotate the cradle 324 so that the placement surface 3241 faces the direction (e.g., the Z-axis direction) along the optical axis EX of the irradiation optical system 211, during at least a portion of the measurement period. On the other hand, the stage drive system 32 may rotate the cradle 324 so that the stage mounting surface 3242 and the workpiece mounting surface 311 face a direction (e.g., a direction along the XY plane) different from the direction in which the machining head 21 (particularly, the irradiation optical system 211) is located, during at least a portion of the measurement period. The stage drive system 32 may rotate the cradle 324 so that, during at least a portion of the measurement period, the stage mounting surface 3242 and the workpiece mounting surface 311 face in a direction intersecting the optical axis EX of the irradiation optical system 211 (for example, a direction along the XY plane). As a result, during at least a portion of the measurement period, the machining head 21 can properly irradiate the calibration unit 8 with the machining light EL. Therefore, at least one of the first calibration unit 81 and the second calibration unit 82 can properly measure the machining light EL.

[0161] 9( a) and 9(b), the placement surface 3241 is a surface that intersects with the stage mounting surface 3242 at an angle of 90 degrees. In this case, the stage drive system 32 may move the calibration unit 8 between the non-measurement position Pos1 and the measurement position Pos2 by rotating the cradle 324 by 90 degrees. For example, the stage drive system 32 may move the calibration unit 8 from the non-measurement position Pos1 shown in FIG. 9(a) to the measurement position Pos2 shown in FIG. 9(b) by rotating the cradle 324 by 90 degrees clockwise around the A axis while the calibration unit 8 is located at the non-measurement position Pos1. For example, the stage drive system 32 may move the calibration unit 8 from the measurement position Pos2 shown in Figure 9(b) to the non-measurement position Pos1 shown in Figure 9(a) by rotating the cradle 324 90 degrees counterclockwise around the A axis while the calibration unit 8 is positioned at the measurement position Pos2.

[0162] The placement surface 3241 is not limited to a surface that intersects with the stage mounting surface 3242 at an angle of 90 degrees. The placement surface 3241 may be a surface that intersects with the stage mounting surface 3242 at an angle other than 90 degrees.

[0163] When the calibration unit 8 is placed on the cradle 324, the stage drive system 32 may be considered to move the calibration unit 8 between the non-measurement position Pos1 and the measurement position Pos2 by rotating the cradle 324 to change the attitude of the cradle 324. Specifically, the stage drive system 32 may be considered to change the attitude of the calibration unit 8 between a reference attitude ( FIG. 9A ) that can realize a state in which the calibration unit 8 is located at the non-measurement position Pos1, and a non-reference attitude ( FIG. 9B ) that can realize a state in which the calibration unit 8 is located at the measurement position Pos2.

[0164] The reference position of the cradle 324 may be a position that can realize a state in which the stage mounting surface 3242 of the cradle 324 is a surface along the XY plane (i.e., a horizontal plane). The reference position of the cradle 324 may be a position that can realize a state in which the stage mounting surface 3242 of the cradle 324 intersects with the Z axis (orthogonal in some cases). The reference position of the cradle 324 may be a position that can realize a state in which the workpiece mounting surface 311 of the stage 31 is a surface along the XY plane (i.e., a horizontal plane). The reference position of the cradle 324 may be a position that can realize a state in which the workpiece mounting surface 311 of the stage 31 intersects with the Z axis (orthogonal in some cases). The reference position of the cradle 324 may be the initial position of the cradle 324. The reference position of the cradle 324 may be the initial position of the cradle 324 when the power to the stage drive system 32 is turned off. The reference position of the cradle 324 may be the initial position of the cradle 324 that can realize a state in which the height of the workpiece placement surface 311 of the stage 31 does not change even when the stage 31 rotates around the C axis.

[0165] It can be said that when the calibration unit 8 rotates around the rotation axis, the posture of the calibration unit 8 changes. In this case, the machining system SYS may be considered to change the posture of the calibration unit 8 between a first posture, which is the posture of the calibration unit 8 positioned at the non-measurement position Pos1, and a second posture, which is the posture of the calibration unit 8 positioned at the measurement position Pos2.

[0166] 7 , in this embodiment, the first calibration unit 81 is a measurement device that can measure the processing light EL by receiving the processing light EL. To this end, the first calibration unit 81 includes a light receiving device 811. The light receiving device 811 may be disposed on the base member 80 of the calibration unit 8. Specifically, the light receiving device 811 may be disposed on the calibration surface 801 of the base member 80.

[0167] In this embodiment, the light receiving device 811 may be used primarily to measure the intensity of the processed light EL. In this case, the light receiving device 811 may function as a power meter capable of measuring the intensity of the processed light EL. For example, the light receiving device 811 may include a light receiving element that detects the processed light EL as light. Alternatively, the higher the intensity of the processed light EL, the greater the amount of energy generated by the processed light EL. As a result, the amount of heat generated by the processed light EL increases. Therefore, the light receiving device 811 may detect the intensity of the processed light EL by detecting the processed light EL as heat. In this case, the light receiving device 811 may include a heat detecting element that detects the heat of the processed light EL. Note that since the first calibration unit 81 includes the light receiving device 811 that measures the intensity of the processed light EL, the first calibration unit may also be referred to as a processed light measuring device that measures the intensity or energy amount of the processed light EL.

[0168] Like the first calibration unit 81, the second calibration unit 82 is also a measurement device capable of measuring the processing light EL by receiving the processing light EL. For this reason, the second calibration unit 82 includes a light receiving device 821. However, the second calibration unit 82 differs from the first calibration unit 81, in that the light receiving device 821 receives the processing light EL through an aperture member 822, in that the light receiving device 821 receives the processing light EL through the aperture member 822. For this reason, the second calibration unit 82 includes the aperture member 822 in addition to the light receiving device 821. Because the second calibration unit 82 includes the aperture member 822 that serves as a reference for position measurement and rotation measurement, the second calibration unit 82 may also be referred to as a reference member. Furthermore, because the second calibration unit 82 measures the irradiation position of the processing light EL relative to the aperture member 822, the second calibration unit 82 may also be referred to as a processing light position measurement device.

[0169] The light receiving device 821 and the aperture member 822 may be disposed on the base member 80 of the calibration unit 8. Specifically, the light receiving device 821 and the aperture member 822 may be disposed on the calibration surface 801 of the base member 80. In the example shown in Figures 7(a) and 7(b), the light receiving device 821 and the aperture member 822 are disposed inside a depression 810 (i.e., a recess) formed in the base member 80.

[0170] The aperture member 822 is a member in which an opening 823 is formed, through which the processing light EL can pass. The opening 823 can function as a through-hole that penetrates the aperture member 822. In this case, the light receiving device 821 receives the processing light EL that has passed through the opening 823. The aperture member 822 may also be referred to as a mask.

[0171] Because the light receiving device 821 receives the processing light EL that has passed through the opening 823, as shown in FIG. 7B , the opening 823 and the light receiving device 821 may be aligned along the traveling direction of the processing light EL during at least a portion of the measurement period. The opening 823 and the light receiving device 821 may be aligned along the optical axis EX of the irradiation optical system 211 during at least a portion of the measurement period. Therefore, the measurement position Pos2 described above may include a position that satisfies the condition that, when the calibration unit 8 is positioned at the measurement position Pos2, the opening 823 and the light receiving device 821 are aligned along at least one of the traveling direction of the processing light EL and the optical axis EX of the irradiation optical system 211. A deflecting member that deflects the processing light EL may be disposed between the opening 823 and the light receiving device 821.

[0172] On the other hand, during at least a part of the modeling period, the opening 823 and the light receiving device 821 do not have to be aligned along at least one of the traveling direction of the processing light EL and the optical axis EX of the irradiation optical system 211. Therefore, the above-described non-measurement position Pos1 may include a position that satisfies the condition that, when the calibration unit 8 is located at the non-measurement position Pos1, the opening 823 and the light receiving device 821 are not aligned along at least one of the traveling direction of the processing light EL and the optical axis EX of the irradiation optical system 211. In particular, when the calibration unit 8 is rotatable around a rotation axis (e.g., axis A), the opening 823 and the light receiving device 821 may be aligned along a direction that intersects at least one of the traveling direction of the processing light EL and the optical axis EX of the irradiation optical system 211. Therefore, the above-mentioned non-measurement position Pos1 may include a position that satisfies the condition that when the calibration unit 8 is positioned at the non-measurement position Pos1, the opening 823 and the light receiving device 821 are aligned along a direction that intersects with at least one of the traveling direction of the processing light EL and the optical axis EX of the irradiation optical system 211.

[0173] The opening 823 may have a predetermined shape in a plane along the surface of the opening member 822 (the XY plane in the example shown in FIGS. 7( a) and 7(b)). In this case, the opening 823 may form a mark (i.e., a pattern) 824 having a predetermined shape corresponding to the shape of the opening 823 in a plane along the surface of the opening member 822. In other words, the opening member 822 may have a mark (i.e., a pattern) 824 having a predetermined shape formed by the opening 823 of the predetermined shape.

[0174] Fig. 7 shows an example in which four different types of marks 824 are formed on the aperture member 822. Specifically, Fig. 7 shows an example in which a search mark 8241 which is an example of the mark 824, a pinhole mark 8242 which is an example of the mark 824, a slit mark 8243 which is an example of the mark 824, and a slit mark 8244 which is an example of the mark 824 are formed on the aperture member 822.

[0175] An example of the search mark 8241 is shown in FIG. 10( a). As shown in FIG. 10( a), the search mark 8241 may be formed from two slit-shaped openings 8231-1, two slit-shaped openings 8231-2, and one slit-shaped opening 8231-3, each of which is an opening 823. Each of the two openings 8231-1 extends in a first direction (e.g., the Y-axis direction) along the calibration surface 801. The two openings 8231-1 are spaced apart from each other in a second direction (e.g., the X-axis direction) that is along the calibration surface 801 and intersects the first direction. Each of the two openings 8231-2 extends in the second direction (e.g., the X-axis direction). The two openings 8231-2 are spaced apart from each other in the first direction (e.g., the Y-axis direction). The opening 8231-3 is located between the two openings 8231-1. The opening 8231-3 is located between the two openings 8231-2. The opening 8231-3 extends along a third direction that is inclined (i.e., diagonally intersecting) with respect to both the first direction in which the opening 8231-1 extends and the second direction in which the opening 8231-2 extends.

[0176] 10( a), a single search mark 8241 is formed on the aperture member 822. However, a plurality of search marks 8241 may be formed on the aperture member 822. When a plurality of search marks 8241 are formed on the aperture member 822, one of the plurality of search marks 8241 may be disposed at a position different from the position on the line connecting the other two of the plurality of search marks 8241. For example, when three or more search marks 8241 are formed on the aperture member 822, one of the three or more search marks 8241 may be disposed at a position different from the position on the line connecting the other two of the three or more search marks 8241.

[0177] An example of a pinhole mark 8242 is shown in FIG. 10( b). As shown in FIG. 10( b), the pinhole mark 8242 may be formed by an opening 8232, which is an opening 823 that can function as a pinhole. In the example shown in FIG. 10( b), the cross-sectional shape of the opening 8232 in the direction along the surface of the opening member 822 is circular. However, the cross-sectional shape of the opening 8232 in the direction along the surface of the opening member 822 may be a shape other than circular. For example, the cross-sectional shape of the opening 8232 in the direction along the surface of the opening member 822 may be elliptical or rectangular.

[0178] In the example shown in FIG. 10( b), a plurality of pinhole marks 8242 are formed on the aperture member 822. Specifically, a plurality of pinhole marks 8242 are formed on the aperture member 822 and are distributed in a matrix on the surface of the aperture member 822. However, a single pinhole mark 8242 may be formed on the aperture member 822. FIG. 10( b) shows an example in which a plurality of pinhole marks 8242 are arranged in a two-dimensional matrix pattern. However, the plurality of pinhole marks 8242 may be arranged in a pattern different from the pattern shown in FIG. 10( b). For example, the plurality of pinhole marks 8242 may be arranged in a pattern in which the plurality of pinhole marks 8242 are lined up along a circle having a predetermined radius. For example, the plurality of pinhole marks 8242 may be arranged in a pattern in which at least two pinhole marks 8242 are arranged along each of a plurality of concentric circles having different radii from the center.

[0179] An example of the slit mark 8243 is shown in Fig. 10(c) . As shown in Fig. 10(c) , the slit mark 8243 may be formed by an opening 8233 that is a slit-shaped opening 823 extending in a third direction (e.g., the Y-axis direction) along the calibration surface 801. That is, the slit mark 8243 may be formed by a slit-shaped opening 8233 whose longitudinal direction is the third direction (e.g., the Y-axis direction) along the calibration surface 801. The slit mark 8243 may be formed by a slit-shaped opening 8233 that extends in a longitudinal direction that intersects with the optical axis EX of the irradiation optical system 211.

[0180] 10( c), a single slit mark 8243 is formed in the aperture member 822. However, a plurality of slit marks 8243 may be formed in the aperture member 822. The slit mark 8243 of the aperture member 822 may be a mark formed by arranging a plurality of slit-shaped openings 823 extending in a third direction (e.g., the Y-axis direction) along the calibration surface 801 along a fourth direction (e.g., the X-axis direction) that is along the calibration surface 801 and intersects with the third direction.

[0181] An example of the slit mark 8244 is shown in FIG. 10( d ). As shown in FIG. 10( d ), the slit mark 8244 may be formed by an opening 8234, which is a slit-shaped opening 823, extending along the calibration surface 801 and in a fourth direction (e.g., the X-axis direction) intersecting the third direction. That is, the slit mark 8244 may be formed by a slit-shaped opening 8234 extending in a direction intersecting (or, in some cases, perpendicular to) the direction in which the slit mark 8243 extends. The slit mark 8244 may be formed by a slit-shaped opening 8234 whose longitudinal direction is the fourth direction (e.g., the X-axis direction) along the calibration surface 801. The slit mark 8244 may be formed by a slit-shaped opening 8234 extending in a longitudinal direction intersecting the optical axis EX of the irradiation optical system 211.

[0182] 10(d), a single slit mark 8244 is formed in the aperture member 822. However, a plurality of slit marks 8244 may be formed in the aperture member 822. The slit mark 8244 of the aperture member 822 may be a mark formed by arranging a plurality of slit-shaped openings 823 extending along the fourth direction (for example, the X-axis direction) along the third direction (for example, the Y-axis direction).

[0183] As described below, the mark 824 may be irradiated with the processing light EL. In this case, the above-described measurement position Pos2 may include a position that satisfies the condition that, when the calibration unit 8 is located at the measurement position Pos2, the processing light EL deflected by the galvanometer mirror 2146 or 2156 can be irradiated onto the mark 824. The measurement position Pos2 may include a position that satisfies the condition that, when the calibration unit 8 is located at the measurement position Pos2, the mark 824 is located within the scanning range of the processing light EL by the galvanometer mirror 2146 or 2156. If multiple marks 824 are formed, the measurement position Pos2 may include a position that satisfies the condition that, when the calibration unit 8 is located at the measurement position Pos2, at least two of the multiple marks 824 are located within the scanning range of the processing light EL by the galvanometer mirror 2146 or 2156.

[0184] 7( a) and 7(b), the light receiving device 821 can receive the processing light EL that has passed through the opening 823 of the aperture member 822. The light receiving device 821 may include a light receiving element that can receive the processing light EL. Examples of the light receiving element include at least one of a photodetector, a CCD (Charge Coupled Device) sensor, a CMOS (Complementary Metal Oxide Semiconductor) sensor, and a sensor using an InGaAs (Indium Gallium Arsenide) element. The light receiving element may also be referred to as a light receiving sensor.

[0185] The light receiving element may have only one light receiving portion capable of receiving the processed light EL. That is, a single light receiving portion may be formed on the light receiving surface of the light receiving element. Alternatively, the light receiving element may have multiple light receiving portions capable of receiving the processed light EL. That is, multiple light receiving portions may be formed on the light receiving surface of the light receiving element.

[0186] The light receiving device 821 may include a single light receiving element. In this case, the light receiving device 821 may include a single light receiving element with a single light receiving portion. Alternatively, the light receiving device 821 may include a single light receiving element with multiple light receiving portions. Alternatively, the light receiving device 821 may include multiple light receiving elements. In this case, the light receiving device 821 may include multiple light receiving elements, each with a single light receiving portion. The light receiving device 821 may include multiple light receiving elements, including a light receiving element with a single light receiving portion. The light receiving device 821 may include multiple light receiving elements, each with multiple light receiving portions. The light receiving device 821 may include multiple light receiving elements, including a light receiving element with multiple light receiving portions.

[0187] The light receiving device 821 may receive the processed light EL through a color filter. For example, the light receiving device 821 may receive the processed light EL through a first color filter that blocks light components with green and blue wavelengths and allows light components with red wavelengths to pass. For example, the light receiving device 821 may receive the processed light EL through a second color filter that blocks light components with red and blue wavelengths and allows light components with green wavelengths to pass. For example, the light receiving device 821 may receive the processed light EL through a third color filter that blocks light components with red and green wavelengths and allows light components with blue wavelengths to pass.

[0188] When the light receiving device 821 receives the processed light EL through a color filter, the control unit 7 may identify the wavelength of the processed light EL based on the light receiving result of the light receiving device 821. For example, the control unit 7 may determine whether the wavelength of the processed light EL is a red light wavelength based on the light receiving result of the light receiving device 821. For example, the control unit 7 may determine whether the wavelength of the processed light EL is a green light wavelength based on the light receiving result of the light receiving device 821. For example, the control unit 7 may determine whether the wavelength of the processed light EL is a blue light wavelength based on the light receiving result of the light receiving device 821. In this case, the control unit 7 may determine whether the calibration unit 8 is measuring the processed light EL#1 generated by the light source 4#1 based on the wavelength identification result of the processed light EL. The control unit 7 may determine whether the calibration unit 8 is measuring the processed light EL#2 generated by the light source 4#2 based on the wavelength identification result of the processed light EL.

[0189] As described above, the processing light EL has an intensity sufficient to melt the shaping material M. Therefore, the processing light EL incident on the light receiving device 821 may have an intensity sufficient to melt the shaping material M. However, if processing light EL having an intensity sufficient to melt the shaping material M is incident on the light receiving device 821, the light receiving device 821 may be damaged by the processing light EL. Therefore, processing light EL having an intensity not high enough to damage the light receiving device 821 may be incident on the light receiving device 821. In other words, the second calibration unit 82 may weaken the intensity of the processing light EL incident on the light receiving device 821 so that processing light EL having an intensity not high enough to damage the light receiving device 821 is incident on the light receiving device 821.

[0190] For example, the second calibration unit 82 may include an attenuation filter 825 capable of attenuating the intensity of the processing light EL. An example of the attenuation filter 825 is a neutral density filter (ND: Neutral Density filter). In this case, the light receiving device 821 may receive the processing light EL that has passed through the attenuation filter 825. Furthermore, the aperture member 822 may be irradiated with the processing light EL that has passed through the attenuation filter 825. As a result, in addition to damage to the light receiving device 821, damage to the aperture member 822 can also be prevented.

[0191] Furthermore, in order to prevent damage to the aperture member 822, the aperture member 822 may be formed using a material that is less susceptible to the heat transmitted from the processing light EL. For example, the aperture member 822 may be formed using a metal material such as copper. In this case, the attenuation filter 825 may be installed between the aperture member 822 and the light receiving device 821.

[0192] Alternatively, for example, the control unit 7 may control the light source 4 to control the intensity of the processing light EL emitted from the light source 4 so that the intensity of the processing light EL during at least a portion of the measurement period is weaker than the intensity of the processing light EL during at least a portion of the modeling period. In particular, the control unit 7 may control the light source 4 to control the intensity of the processing light EL emitted from the light source 4 so that the intensity of the processing light EL during at least a portion of the measurement period is weak enough not to damage the light receiving device 821 and the aperture member 822. Even in this case, damage to the light receiving device 821 and the aperture member 822 by the processing light EL can be prevented.

[0193] Light reception information indicating the result of reception of the processed light EL by the light receiving device 821 is output from the calibration unit 8 to the control unit 7 as at least part of measurement information indicating the result of measurement of the processed light EL by the calibration unit 8. For example, light reception information indicating the result of reception of the processed light EL#1 by the light receiving device 821 is output from the calibration unit 8 to the control unit 7 as at least part of measurement information indicating the result of measurement of the processed light EL#1 by the calibration unit 8. For example, light reception information indicating the result of reception of the processed light EL#2 by the light receiving device 821 is output from the calibration unit 8 to the control unit 7 as at least part of measurement information indicating the result of measurement of the processed light EL#2 by the calibration unit 8.

[0194] The control unit 7 may control the machining system SYS based on the measurement information output from the calibration unit 8. In particular, the control unit 7 may control the machining system SYS based on the measurement information acquired during at least a part of the measurement period described above, during at least a part of the modeling period in which the machining head 21 forms a model. For example, the control unit 7 may control the machining unit 2 (e.g., at least one of the machining head 21 and the head drive system 22) included in the machining system SYS based on the measurement information. In particular, as described in detail later, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 included in the machining head 21 based on the measurement information. For example, the control unit 7 may control the stage unit 3 (e.g., the stage drive system 32) included in the machining system SYS based on the measurement information. For example, the control unit 7 may control the light source 4 included in the machining system SYS based on the measurement information.

[0195] As an example, as described above, the measurement information indicates the measurement results of the processing light EL#1. In this case, the control unit 7 may control the irradiation mode of the processing light EL#1 based on the measurement information indicating the measurement results of the processing light EL#1. In other words, the control unit 7 may control an irradiation mode change device capable of changing the irradiation mode of the processing light EL#1 based on the measurement information indicating the measurement results of the processing light EL#1. For example, as described above, examples of the irradiation mode of the processing light EL#1 include at least one of the intensity of the processing light EL#1, the irradiation position of the processing light EL#1, and the irradiation timing of the processing light EL#1. In this case, an example of an irradiation mode change device capable of changing the irradiation mode of the processing light EL#1 is the light source 4#1 capable of changing the intensity of the processing light EL#1. Other examples of an irradiation mode change device capable of changing the irradiation mode of the processing light EL#1 include the galvanometer mirror 2146, the head drive system 22, and the stage drive system 32, which are capable of changing the irradiation position of the processing light EL#1 (specifically, the position of the target irradiation area EA#1 on the printing surface MS).

[0196] As another example, as described above, the measurement information indicates the measurement results of the processing light EL#2. In this case, the control unit 7 may control the irradiation mode of the processing light EL#2 based on the measurement information indicating the measurement results of the processing light EL#2. In other words, the control unit 7 may control an irradiation mode change device capable of changing the irradiation mode of the processing light EL#2 based on the measurement information indicating the measurement results of the processing light EL#2. For example, as described above, examples of the irradiation mode of the processing light EL#2 include at least one of the intensity of the processing light EL#2, the irradiation position of the processing light EL#2, and the irradiation timing of the processing light EL#2. In this case, an example of an irradiation mode change device capable of changing the irradiation mode of the processing light EL#2 is a light source 4#2 capable of changing the intensity of the processing light EL#2. Another example of an irradiation mode changing device that can change the irradiation mode of processing light EL#2 is a galvanometer mirror 2156, a head drive system 22, and a stage drive system 32 that can change the irradiation position of processing light EL#2 (specifically, the position of the target irradiation area EA#2 on the forming surface MS).

[0197] However, the control unit 7 may control the irradiation mode of processing light EL#2 based on measurement information indicating the measurement results of processing light EL#1. In other words, the control unit 7 may control an irradiation mode changing device that can change the irradiation mode of processing light EL#2 based on measurement information indicating the measurement results of processing light EL#1. The control unit 7 may control the irradiation mode of processing light EL#1 based on measurement information indicating the measurement results of processing light EL#2. In other words, the control unit 7 may control an irradiation mode changing device that can change the irradiation mode of processing light EL#1 based on measurement information indicating the measurement results of processing light EL#2.

[0198] Alternatively, the control unit 7 may control the irradiation mode of the processing light EL#1 based on measurement information indicating both the measurement results of the processing light EL#1 and the measurement results of the processing light EL#2. The control unit 7 may control the irradiation mode of the processing light EL#2 based on measurement information indicating both the measurement results of the processing light EL#1 and the measurement results of the processing light EL#2.

[0199] (2) Operation of the Machining System SYS Next, the operation of the machining system SYS will be described.

[0200] (2-1) Additional Processing Operation Performed by the Processing System SYS First, the additional processing (additional processing operation) performed by the processing system SYS on the workpiece W will be described. The additional processing performed on the workpiece W corresponds to an operation of forming a structure by adding a structure that is integrated with (or separable from) the workpiece W to the workpiece W. For convenience of explanation, the following describes the additional processing of forming a three-dimensional structure ST, which is a structure having a desired shape. As described above, the processing system SYS forms the three-dimensional structure ST by performing additional processing based on the laser build-up welding method. For this reason, the processing system SYS may form the three-dimensional structure ST by performing existing additional processing that complies with the laser build-up welding method. Below, an example of the operation of forming the three-dimensional structure ST using the laser build-up welding method will be briefly described.

[0201] The processing system SYS forms a three-dimensional structure ST on a workpiece W based on three-dimensional model data (in other words, three-dimensional model information) of the three-dimensional structure ST to be formed. Measurement data of a three-dimensional object measured by at least one of a measuring device installed within the processing system SYS and a three-dimensional shape measuring device installed separately from the processing system SYS may be used as the three-dimensional model data. To form the three-dimensional structure ST, the processing system SYS sequentially forms, for example, multiple layered substructures (hereinafter referred to as "structural layers") SL arranged along the Z-axis direction. For example, the processing system SYS sequentially forms multiple structural layers SL layer by layer based on data of multiple layers obtained by slicing a three-dimensional model of the three-dimensional structure ST along the Z-axis direction. As a result, a three-dimensional structure ST is formed, which is a layered structure in which multiple structural layers SL are stacked. The structural layers SL do not necessarily have to be layered structures. The flow of operations for forming a three-dimensional structure ST by sequentially forming a plurality of structural layers SL one by one will be described below.

[0202] First, the operation of forming each structure layer SL will be described with reference to FIGS. 11A to 11E. Under the control of the control unit 7, the processing system SYS moves at least one of the processing head 21 and the stage 31 so that processing unit areas BSA#1 and BSA#2 are set in desired areas on the printing surface MS corresponding to the surface of the workpiece W or the surface of the printed structure layer SL. Then, the irradiation optical system 211 irradiates the processing unit areas BSA#1 and BSA#2 with processing beams EL#1 and EL#2, respectively. At this time, the focusing positions CP#1 and CP#2 at which the processing beams EL#1 and EL#2 are focused in the Z-axis direction may coincide with the printing surface MS. Alternatively, the focusing positions CP#1 and CP#2 at which the processing beams EL#1 and EL#2 are focused in the Z-axis direction may be offset from the printing surface MS. As a result, as shown in Figure 11(a), molten pools MP#1 and MP#2 are formed on the building surface MS irradiated with the processing beams EL#1 and EL#2, respectively. Furthermore, as shown in Figure 11(b), the processing system SYS supplies the building material M from the material nozzle 212 under the control of the control unit 7. As a result, the building material M is supplied to each of the molten pools MP#1 and MP#2. The building material M supplied to the molten pool MP#1 is melted by the processing beam EL#1 irradiated onto the molten pool MP#1. Similarly, the building material M supplied to the molten pool MP#2 is melted by the processing beam EL#2 irradiated onto the molten pool MP#2.

[0203] Furthermore, the irradiation optical system 211 uses the galvanometer mirrors 2146 and 2156 to move the target irradiation areas EA#1 and EA#2 within the machining unit areas BSA#1 and BSA#2, respectively. That is, the irradiation optical system 211 uses the galvanometer mirrors 2146 and 2156 to scan the machining unit areas BSA#1 and BSA#2 with the machining beams EL#1 and EL#2, respectively. When the target irradiation area EA#1 moves and the machining beam EL#1 is no longer irradiated onto the molten pool MP#1, the molten build material M in the molten pool MP#1 cools and solidifies (i.e., solidifies). Similarly, when the target irradiation area EA#2 moves and the machining beam EL#2 is no longer irradiated onto the molten pool MP#2, the molten build material M in the molten pool MP#2 cools and solidifies (i.e., solidifies). Furthermore, as the target irradiation areas EA#1 and EA#2 move, the molten pools MP#1 and MP#2 also move. As a result, as shown in Figure 11(c) , within the processing unit areas BSA#1 and BSA#2 through which the molten pools MP#1 and MP#2 move, a molded object made of the solidified mold material M is deposited on the mold surface MS.

[0204] 11(c), for ease of explanation, the object made of the solidified building material M in the processing unit area BSA#1 and the object made of the solidified building material M in the processing unit area BSA#2 are physically separated. However, the object made of the solidified building material M in the processing unit area BSA#1 and the object made of the solidified building material M in the processing unit area BSA#2 may be integrated. In particular, when the processing unit areas BSA#1 and BSA#2 coincide (or partially overlap), the object made of the solidified building material M in the processing unit area BSA#1 and the object made of the solidified building material M in the processing unit area BSA#2 may be integrated.

[0205] During a period in which the target irradiation areas EA#1 and EA#2 are moving within the machining unit areas BSA#1 and BSA#2, respectively, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that the machining unit areas BSA#1 and BSA#2 move on the build surface MS. The machining system SYS may relatively move the irradiation optical system 211 of the machining head 21 and the workpiece W so that the machining unit areas BSA#1 and BSA#2 move on the build surface MS. In other words, the machining system SYS may move the target irradiation areas EA#1 and EA#2 within the machining unit areas BSA#1 and BSA#2, respectively, and move the machining unit areas BSA#1 and BSA#2 on the build surface MS in parallel.

[0206] Alternatively, during the period when the target irradiation areas EA#1 and EA#2 are moving within the machining unit areas BSA#1 and BSA#2, respectively, the machining system SYS does not have to move the machining head 21 and the stage 31 so that the machining unit areas BSA#1 and BSA#2 do not move on the printing surface MS. In this case, after the additional machining (i.e., printing) within the machining unit areas BSA#1 and BSA#2 is completed, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that the machining unit areas BSA#1 and BSA#2 are set in another area on the printing surface MS. In other words, after the additional machining (i.e., printing) within the machining unit areas BSA#1 and BSA#2 is completed, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that the machining unit areas BSA#1 and BSA#2 move on the printing surface MS. In this case, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that the area on the printing surface MS where the machining unit areas BSA#1 and BSA#2 have already been set (i.e., the area where additional machining has already been performed) and the area on the printing surface MS where the machining unit areas BSA#1 and BSA#2 have newly been set (i.e., the area where additional machining will now be performed) are adjacent to each other. In particular, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that the area on the printing surface MS where the machining unit areas BSA#1 and BSA#2 have already been set do not overlap with the area on the printing surface MS where the machining unit areas BSA#1 and BSA#2 have newly been set. However, the processing system SYS may move at least one of the processing head 21 and the stage 31 so that the area on the printing surface MS where processing unit areas BSA#1 and BSA#2 have already been set partially overlaps with the area on the printing surface MS where processing unit areas BSA#1 and BSA#2 have newly been set.

[0207] The machining system SYS repeats a series of manufacturing processes, including forming a molten pool MP#1 by irradiating the machining unit area BSA#1 with the machining light EL#1, forming a molten pool MP#2 by irradiating the machining unit area BSA#2 with the machining light EL#2, supplying the manufacturing material M to the molten pools MP#1 and MP#2, melting the supplied manufacturing material M, and solidifying the molten manufacturing material M, while moving the machining unit areas BSA#1 and BSA#2 on the manufacturing surface MS along the target movement trajectory MTO, as shown in FIG. 11( d ). In this case, as the machining unit areas BSA#1 and BSA#2 move, a manufactured object having a width in a direction intersecting the target movement trajectory MTO is manufactured on the manufacturing surface MS. For example, when the machining unit areas BSA#1 and BSA#2 move as shown in FIGS. 5( a ) and 5 ( b ), a manufactured object having a width in the X-axis direction and extending in the Y-axis direction is manufactured. For example, when the processing unit areas BSA#1 and BSA#2 move as shown in Figures 6(a) and 6(c), respectively, a structure having a width along the X-axis direction and extending along the Y-axis direction is formed.

[0208] 11( e), a structure layer SL corresponding to a structured object, which is an aggregate of the melted and then solidified building material M, is formed on the building surface MS. That is, a structure layer SL corresponding to an aggregate of objects formed on the building surface MS in a pattern corresponding to the target movement trajectories MT0 of the processing unit areas BSA#1 and BSA#2 is formed. That is, a structure layer SL having a shape corresponding to the target movement trajectories MT0 of the processing unit areas BSA#1 and BSA#2 in plan view is formed.

[0209] Note that when the target irradiation area EA#1 is set in an area where it is not desired to form an object, the processing system SYS does not have to irradiate the target irradiation area EA#1 with the processing light EL#1. Alternatively, the processing system SYS may irradiate the target irradiation area EA#1 with the processing light EL#1 and stop the supply of the building material M. Alternatively, the processing system SYS may supply the building material M to the target irradiation area EA#1 and irradiate the target irradiation area EA#1 with the processing light EL#1 at an intensity that does not cause the formation of a molten pool MP. The same applies when the target irradiation area EA#2 is set in an area where it is not desired to form an object.

[0210] The target movement trajectories MT0 of the machining unit areas BSA#1 and BSA#2 may be referred to as machining paths (in other words, tool paths). In this case, the control unit 7 may move at least one of the machining head 21 and the stage 31 based on path information indicating the target movement trajectories MT0 (i.e., path information indicating the machining paths) so that each of the machining unit areas BSA#1 and BSA#2 moves along the target movement trajectories MT0 on the printing surface MS.

[0211] In addition to indicating the target movement trajectory MTO, the path information may also include information regarding a target value for the width of the object (hereinafter referred to as the "target width"). The target width may also be referred to as a line width or a bead width. Specifically, as described above, as the processing unit areas BSA#1 and BSA#2 move along the target movement trajectory MTO, an object having a width along a direction intersecting the target movement trajectory MTO is formed on the printing surface MS. For example, as shown in FIG. 12( a), when the processing unit areas BSA#1 and BSA#2 move along the Y-axis direction, a linear object having a width along the X-axis direction and extending along the Y-axis direction is formed on the printing surface MS, as shown in FIG. 12( b). The structure layer SL described above corresponds to a collection of linear objects shown in FIG. 12( b). In this case, the pass information may include information on the target value of the width D of the linear object (i.e., the target width), as shown in Fig. 12(b). In other words, the pass information may include information on the width of the linear object (i.e., the line) to be formed on the formation surface MS. Note that the information on the target width of the linear object (i.e., the information on the width of the line to be formed) may be referred to as line width information.

[0212] In this case, the control unit 7 may control the galvanometer mirrors 2146 and 2156, respectively, based on the line width information so that the target irradiation areas EA#1 and EA#2 move within the processing unit areas BSA#1 and BSA#2, respectively. For example, the control unit 7 may control the galvanometer mirrors 2146 and 2156, respectively, so that the target irradiation areas EA#1 and EA#2 move periodically within the line width indicated by the line width information. In other words, the control unit 7 may control the galvanometer mirrors 2146 and 2156, respectively, so that the target irradiation areas EA#1 and EA#2 do not deviate outside the line width indicated by the line width information. In other words, the control unit 7 may control the galvanometer mirrors 2146 and 2156, respectively, so that the target irradiation areas EA#1 and EA#2 move periodically within the target width of the object indicated by the line width information. That is, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the target irradiation areas EA#1 and EA#2 do not deviate outside the target width of the object indicated by the line width information.

[0213] As a result, the molten pools MP#1 and MP#2 also move periodically inside the line width indicated by the line width information. In other words, the molten pools MP#1 and MP#2 do not deviate outside the line width indicated by the line width information. In other words, the molten pools MP#1 and MP#2 move periodically inside the target width of the object indicated by the line width information. In other words, the molten pools MP#1 and MP#2 do not deviate outside the target width of the object indicated by the line width information. This allows the machining system SYS to appropriately form a linear object having the target width indicated by the line width information.

[0214] The target movement trajectory MT0 (machining path or tool path) of each of the machining unit areas BSA#1 and BSA#2 may be a trajectory in the XY plane as shown in Fig. 12. The silent movement trajectory MT0 may be a trajectory in the XYZ space (a trajectory in which the position in the Z direction also changes when the position in the X direction and / or Y direction changes).

[0215] The machining system SYS repeatedly performs operations for forming such a structure layer SL based on the three-dimensional model data under the control of the control unit 7. Specifically, before performing operations for forming the structure layer SL, the control unit 7 first slices the three-dimensional model data at the layer pitch to create slice data. The machining system SYS performs operations for forming the first structure layer SL#1 on the build surface MS corresponding to the surface of the workpiece W based on the slice data corresponding to the structure layer SL#1. Specifically, the control unit 7 acquires path information for forming the first structure layer SL#1, which is generated based on the slice data corresponding to the structure layer SL#1. Note that the control unit 7 may generate the path information after or before the machining system SYS starts additional processing. Thereafter, the control unit 7 controls the machining unit 2 and the stage unit 3 based on the path information to form the first structure layer SL#1. As a result, the structure layer SL#1 is formed on the build surface MS as shown in FIG. 13( a). Thereafter, the machining system SYS sets the surface (i.e., the upper surface) of the structural layer SL#1 as a new printing surface MS, and then prints a second structural layer SL#2 on the new printing surface MS. To print the structural layer SL#2, the control unit 7 first controls at least one of the head drive system 22 and the stage drive system 32 so that the machining head 21 moves along the Z axis relative to the stage 31. Specifically, the control unit 7 controls at least one of the head drive system 22 and the stage drive system 32 to move the machining head 21 toward the +Z side and / or move the stage 31 toward the −Z side so that the machining unit areas BSA#1 and BSA#2 are set on the surface of the structural layer SL#1 (i.e., the new printing surface MS). Thereafter, under the control of the control unit 7, the machining system SYS prints the structural layer SL#2 on the structural layer SL#1 based on the slice data corresponding to the structural layer SL#2, using operations similar to those used to print the structural layer SL#1. As a result, a structural layer SL#2 is formed as shown in Fig. 13(b) . Thereafter, the same operation is repeated until all structural layers SL that constitute the three-dimensional structure ST to be formed on the workpiece W are formed.As a result, as shown in FIG. 13( c ), a three-dimensional structure ST is formed by a layered structure in which a plurality of structural layers SL are stacked.

[0216] (2-2) Calibration Operation Next, the calibration operation performed by the processing system SYS will be described. The calibration operation is an operation for calibrating the processing system SYS. In particular, the calibration operation is an operation for calibrating the processing system SYS using the calibration unit 8. Below, as an example of the calibration operation, an operation for calibrating the irradiation mode of the processing light EL using the calibration unit 8 will be described.

[0217] The processing system SYS may perform a calibration operation before the processing unit 2 starts to form an object. The processing system SYS may perform a calibration operation after the processing unit 2 finishes forming an object. The processing system SYS may perform a calibration operation after the processing unit 2 starts to form an object and before the processing unit 2 finishes forming the object. In this case, the processing system SYS may temporarily stop forming the object, as necessary, and then perform the calibration operation.

[0218] The irradiation mode of the processing light EL may vary depending on the elapsed time since the processing system SYS started operating. In this case, the processing system SYS may perform a calibration operation when a certain time has elapsed since the processing system SYS started operating. The processing system SYS may perform a calibration operation every time a certain time has elapsed since the processing system SYS started operating.

[0219] The irradiation mode of the processing light EL may vary depending on the temperature of the chamber space 63IN where the processing light EL is irradiated onto the workpiece W. In this case, the processing system SYS may perform a calibration operation when the temperature of the chamber space 63IN varies by a predetermined first temperature or more. The processing system SYS may perform a calibration operation when the temperature of the chamber space 63IN exceeds a predetermined first allowable upper limit value. The processing system SYS may perform a calibration operation when the temperature of the chamber space 63IN falls below a predetermined first allowable lower limit value.

[0220] In this case, a first temperature measuring device for measuring the temperature of the chamber space 63IN may be arranged in the chamber space 63IN. For example, a single first temperature measuring device may be arranged in the chamber space 63IN. For example, multiple first temperature measuring devices may be arranged at multiple locations in the chamber space 63IN. The first temperature measuring device may be connected to the control unit 7. The measurement results of the first temperature measuring device may be output to the control unit 7.

[0221] The irradiation mode of the processing light EL may vary depending on the temperature of at least one of the galvanometer mirrors 2146 and 2156, which can change the irradiation position of the processing light EL, and which is an example of the irradiation mode of the processing light EL. In this case, the processing system SYS may perform a calibration operation when the temperature of at least one of the galvanometer mirrors 2146 and 2156 varies by more than a predetermined second temperature. The processing system SYS may perform a calibration operation when the temperature of at least one of the galvanometer mirrors 2146 and 2156 exceeds a predetermined second allowable upper limit. The processing system SYS may perform a calibration operation when the temperature of at least one of the galvanometer mirrors 2146 and 2156 falls below a predetermined second allowable lower limit.

[0222] In this case, a second temperature measurement device for measuring the temperature of at least one of the galvanometer mirrors 2146 and 2156 may be disposed within the irradiation optical system 211. For example, a single second temperature measurement device may be disposed within the irradiation optical system 211. For example, multiple second temperature measurement devices may be disposed at multiple locations within the irradiation optical system 211. As an example, a second temperature measurement device for measuring the temperature of the galvanometer mirror 2146 may be disposed within the first optical system 214, and a second temperature measurement device for measuring the temperature of the galvanometer mirror 2156 may be disposed within the second optical system 215. Alternatively, if the temperature fluctuations of the galvanometer mirror 2146 and the galvanometer mirror 2156 are expected to be comparable, the second temperature measurement device may be disposed within either the first optical system 214 or the second optical system 215. Furthermore, the second temperature measurement device disposed in the first optical system 214 may measure the temperature of at least one of the X scan motor 2146AX and the Y scan motor 2146AY of the galvanometer mirror 2146. When it is assumed that the temperature fluctuations of the X scan motor 2146AX and the Y scan motor 2146AY are comparable, the second temperature measurement device disposed in the first optical system 214 may measure the temperature of either the X scan motor 2146AX or the Y scan motor 2146AY. Similarly, the temperature measurement device disposed in the second optical system 215 may measure the temperature of at least one of the X scan motor 2156AX and the Y scan motor 2156AY of the galvanometer mirror 2156. When it is assumed that the temperature fluctuations of the X scan motor 2156AX and the Y scan motor 2156AY are comparable, the second temperature measuring device disposed in the second optical system 215 may measure the temperature of either the X scan motor 2156AX or the Y scan motor 2156AY. The second temperature measuring device may be connected to the control unit 7. The measurement result of the second temperature measuring device may be output to the control unit 7.

[0223] (2-2-1) Position Measurement Operation The machining system SYS may perform a position measurement operation as at least a part of the calibration operation. The position measurement operation is an operation for measuring the position of the calibration unit 8. In particular, the position measurement operation is an operation for measuring the positions of the first calibration unit 81 and the second calibration unit 82.

[0224] In order to perform the position measurement operation, a position measurement device 23 may be attached to the machining head 21. The position measurement device 23 may be attached to the machining head 21 so as to be detachable from the machining head 21. In this case, the position measurement device 23 may be attached to the machining head 21 for at least a part of the period during which the position measurement operation is being performed, and the position measurement device 23 may be detached from the machining head 21 during the period during which the position measurement operation is not being performed. Alternatively, the position measurement device 23 may be attached to the machining head 21 at all times. The position measurement device 23 may be movable relative to the machining head 21.

[0225] An example of the position measuring device 23 is shown in Fig. 14. As shown in Fig. 14, a position measuring device 23a including a probe 231 may be used as the position measuring device 23. In this case, the position measuring device 23a may measure the position of the calibration unit 8 by bringing the probe 231 into contact with the calibration unit 8. In particular, the position measuring device 23a may measure the position of the calibration unit 8 by bringing the tip P of the probe 231 into contact with the calibration unit 8.

[0226] The position measurement device 23 is attached to the processing head 21 so that information regarding the relative positional relationship between the tip P of the probe 231 and the processing position of the processing head 21 is known to the control unit 7. The processing position of the processing head 21 may be, for example, an intersection position where at least one of the processing lights EL#1 and EL#2 emitted from the irradiation optical system 211 intersects with the modeling material M supplied from the material nozzle 212. The processing position of the processing head 21 may also be an offset position that has a known positional relationship with respect to the intersection position.

[0227] In order to measure the position of the calibration unit 8 using the position measurement device 23a including the probe 231, the head drive system 22 may, under the control of the control unit 7, move the machining head 21 to which the position measurement device 23a is attached so that the probe 231 comes into contact with the calibration unit 8. For example, as shown in Fig. 15 , the head drive system 22 may move the machining head 21 so that the probe 231 comes into contact with a reference surface 800 of the calibration unit 8. In particular, as shown in Fig. 15 , the head drive system 22 may move the machining head 21 so that the probe 231 comes into contact with each of the multiple reference surfaces 800 in turn.

[0228] The reference surface 800 is a surface that satisfies the condition that information regarding the positional relationship between the reference surface 800 and each of the first calibration unit 81 and the second calibration unit 82 is known to the control unit 7. In the example shown in Fig. 15, a calibration surface 801 of the base member 80 on which the first calibration unit 81 and the second calibration unit 82 are arranged, and a side surface 802 of the base member 80 that is different from the calibration surface 801 are each used as the reference surface 800.

[0229] In addition to or instead of the head drive system 22 moving the processing head 21, the stage drive system 32 may move the calibration unit 8 under the control of the control unit 7 so that the probe 231 comes into contact with the calibration unit 8.

[0230] When the probe 231 comes into contact with the reference surface 800, a head position measuring device (not shown) provided in the machining unit 2 may measure the position of the machining head 21 in a head coordinate system. The head position measuring device may measure the position of the machining head 21 using, for example, at least one of a laser interferometer and an encoder. The head coordinate system is a three-dimensional coordinate system used to control the position of the machining head 21.

[0231] Furthermore, when the probe 231 comes into contact with the reference surface 800, a stage position measurement device (not shown) provided in the processing unit 2 may measure the position of the stage 31 in a stage coordinate system. The stage position measurement device may measure the position of the stage 31 using, for example, at least one of a laser interferometer and an encoder. The stage coordinate system is a three-dimensional coordinate system used to control the position of the stage 31.

[0232] Thereafter, the control unit 7 may calculate the position of the calibration unit 8 in the head coordinate system based on the measurement result of the position of the machining head 21. Specifically, as described above, information regarding the relative positional relationship between the machining position of the machining head 21 and the tip P of the probe 231 is known to the control unit 7, and therefore the control unit 7 can calculate the position of the probe 231 in the head coordinate system at the time when the probe 231 comes into contact with the reference surface 800 based on the measurement result of the position of the machining head 21. Because the probe 231 is in contact with the reference surface 800, the position of the probe 231 in the head coordinate system at the time when the probe 231 comes into contact with the reference surface 800 is substantially equivalent to the position of the reference surface 800 in the head coordinate system at the time when the probe 231 comes into contact with the reference surface 800. Furthermore, as described above, since information regarding the positional relationship between each of the first calibration unit 81 and the second calibration unit 82 and the reference surface 800 is known to the control unit 7, the control unit 7 can calculate the respective positions of the first calibration unit 81 and the second calibration unit 82 in the head coordinate system based on the calculation results of the position of the reference surface 800.

[0233] Furthermore, the control unit 7 may calculate the position of the calibration unit 8 in the stage coordinate system based on the measurement results of the position of the stage 31. Specifically, it is assumed that information regarding the attachment position of the calibration unit 8 is known to the control unit 7. In other words, information regarding the relative positional relationship between the stage 31 and the calibration unit 8 is known to the control unit 7. In this case, the control unit 7 can calculate the position of the calibration unit 8 in the stage coordinate system at the time when the probe 231 comes into contact with the reference surface 800 based on the measurement results of the position of the stage 31.

[0234] In this way, the control unit 7 can calculate the position of the calibration unit 8 in each of the head coordinate system and the stage coordinate system at the time when the probe 231 comes into contact with the reference surface 800. Thereafter, the processing system SYS may perform a calibration operation, which will be described later, based on the position of the calibration unit 8 measured (calculated) by the position measurement operation.

[0235] 16 , which shows another example of the position measurement device 23, the machining system SYS may use, in addition to or instead of the position measurement device 23a including the probe 231, a position measurement device 23b including a plurality of irradiation devices 232 each capable of irradiating the calibration unit 8 with a measurement light ML and an imaging device 233 capable of imaging a plurality of beam spots formed on the calibration unit 8 by the plurality of measurement light ML. Here, the position measurement device 23b may be referred to as a non-contact position measurement device 23b or an optical position measurement device 23b. The plurality of measurement light ML intersect with each other at a predetermined intersection position below the machining head 21. Therefore, when the reference surface 800 of the calibration unit 8 is positioned at the intersection position, the plurality of measurement light ML intersect on the reference surface 800. As a result, the plurality of measurement light ML form a single beam spot on the reference surface 800. On the other hand, when the reference surface 800 is not located at the intersection position, the multiple measurement light beams ML do not intersect on the reference surface 800. As a result, the multiple measurement light beams ML each form multiple beam spots on the reference surface 800. Therefore, when the multiple measurement light beams ML form a single beam spot on the reference surface 800, the reference surface 800 is located at the intersection position determined based on the machining head 21. In other words, the position of the reference surface 800 can be identified. Therefore, the control unit 7 can measure the position of the calibration unit 8 using such a position measurement device 23b.

[0236] The position measurement device 23b is not limited to a device that uses the above-described method to measure the position of the calibration unit 8. For example, the position measurement device 23b may be a measurement device that can measure the position of the calibration unit 8 using at least one of a pattern projection method, a light section method, a time-of-flight method, an interference measurement method, a stereo method, an astigmatism method, and the like.

[0237] (2-2-2) Rotation Calibration Operation The machining system SYS may perform a rotation calibration operation as at least a part of the calibration operation.

[0238] The rotation calibration operation may include a first rotation calibration operation that calculates a rotation amount of the actual movement trajectory AMT of the processing light EL#1 relative to the target movement trajectory TMT of the processing light EL#1. In particular, the rotation calibration operation may include a first rotation calibration operation that calculates a rotation amount θz of the actual movement trajectory AMT of the processing light EL#1 relative to the target movement trajectory TMT of the processing light EL#1 around a rotation axis (e.g., a rotation axis along the Z axis) along the traveling direction of the processing light EL#1. The target movement trajectory TMT indicates an ideal (in other words, a designed) movement trajectory along which the galvanometer mirror 2146 should move the processing light EL#1 (specifically, the irradiation position of the processing light EL#1, i.e., the target irradiation area EA#1) on the printing surface MS. The actual movement trajectory indicates a movement trajectory along which the galvanometer mirror 2146 actually moves the processing light EL#1 (specifically, the irradiation position of the processing light EL#1, i.e., the target irradiation area EA#1) on the printing surface MS. In particular, the actual movement trajectory AMT indicates the actual movement trajectory of the processing light EL#1 when the galvanometer mirror 2146 actually moves the processing light EL#1 based on a galvanometer control signal for controlling the galvanometer mirror 2146 to move the processing light EL#1 along the target movement trajectory TMT on the printing surface MS.

[0239] The rotation calibration operation may include a second rotation calibration operation that calculates the amount of rotation of the actual movement trajectory AMT of the processing light EL#2 relative to the target movement trajectory TMT of the processing light EL#2. The target movement trajectory TMT indicates an ideal (in other words, designed) movement trajectory along which the galvanometer mirror 2156 should move the processing light EL#2 (specifically, the irradiation position of the processing light EL#2, the target irradiation area EA#2) on the printing surface MS. The actual movement trajectory indicates a movement trajectory along which the galvanometer mirror 2156 actually moves the processing light EL#2 (specifically, the irradiation position of the processing light EL#2, the target irradiation area EA#2) on the printing surface MS. In particular, the actual movement trajectory AMT indicates the actual movement trajectory of the processing light EL#2 when the galvanometer mirror 2156 actually moves the processing light EL#2 based on a galvanometer control signal for controlling the galvanometer mirror 2156 to move the processing light EL#2 along the target movement trajectory TMT on the printing surface MS.

[0240] The first rotation calibration operation will be specifically described below. However, the machining system SYS may perform the second rotation calibration operation by performing an operation similar to the first rotation calibration operation. Specifically, the following description of the first rotation calibration operation can be used as a description of the second rotation calibration operation by replacing the terms "first," "galvanometer mirror 2146," and "#1" with the terms "second," "galvanometer mirror 2156," and "#2," respectively.

[0241] The machining system SYS performs the first rotation calibration operation using the second calibration unit 82 included in the calibration unit 8. In particular, the machining system SYS performs the first rotation calibration operation using the search mark 8241 formed on the opening member 822 of the second calibration unit 82.

[0242] Specifically, the control unit 7 controls the machining head 21 to irradiate the search mark 8241 with the machining light EL#1. To irradiate the search mark 8241 with the machining light EL#1, the control unit 7 first generates a galvanometer control signal for moving the machining light EL#1 on the aperture member 822 along a target movement trajectory TMT that crosses the search mark 8241. An example of the target movement trajectory TMT used in the first rotation calibration operation is shown in FIG. 17 . As shown in FIG. 17 , the target movement trajectory TMT may be a linear movement trajectory along the X-axis direction along which the two slit-shaped openings 8231-1 and one slit-shaped opening 8231-3 that make up the search mark 8241 are aligned. In particular, the target movement trajectory TMT may be perpendicular to each of the two slit-shaped openings 8231-1.

[0243] However, the target movement trajectory TMT may be a linear movement trajectory along the Y-axis direction along which the two slit-shaped openings 8231-2 and one slit-shaped opening 8231-3 that make up the search mark 8241 are aligned. In particular, the target movement trajectory TMT may be perpendicular to each of the two slit-shaped openings 8231-2. Note that, in the following explanation, for the sake of simplicity, an example will be given in which the target movement trajectory TMT is a linear movement trajectory along the X-axis direction along which the two slit-shaped openings 8231-1 and one slit-shaped opening 8231-3 that make up the search mark 8241 are aligned.

[0244] Thereafter, the control unit 7 controls the galvanometer mirror 2146 based on the generated galvanometer control signal. As a result, the galvanometer mirror 2146 moves the processing light EL#1 on the aperture member 822. That is, as shown in FIG. 17 , the galvanometer mirror 2146 moves the processing light EL#1 so as to cross the search mark 8241 formed on the aperture member 822.

[0245] As a result, the light receiving device 821 receives the processing light EL#1 that has passed through the search mark 8241. That is, the light receiving device 821 receives the processing light EL#1 that has passed through each of the two slit-shaped openings 8231-1 and one slit-shaped opening 8231-3 that form the search mark 8241. Specifically, the light receiving device 821 receives the processing light EL#1 that has passed through one of the two slit-shaped openings 8231-1, then receives the processing light EL#1 that has passed through the slit-shaped opening 8231-3, and then receives the processing light EL#1 that has passed through the other of the two slit-shaped openings 8231-1. 18, which is a graph showing the light receiving result of the processing light EL#1 by the light receiving device 821, the light receiving device 821 outputs, as at least a part of the measurement information, light receiving information indicating a light receiving signal including a pulse signal in which a pulse waveform P1 corresponding to the processing light EL#1 that passed through one of the two slit-shaped openings 8231-1, a pulse waveform P2 corresponding to the processing light EL#1 that passed through the slit-shaped opening 8231-3, and a pulse waveform P3 corresponding to the processing light EL#1 that passed through the other of the two slit-shaped openings 8231-1 appear in sequence. Note that, as shown in FIG. 18, the time at which the pulse waveforms P1 to P3 appear is substantially equivalent to the position in the X-axis direction of the processing light EL#1 irradiated on the search mark 8241.

[0246] Then, the control unit 7 calculates the rotation amount θz of the actual movement trajectory AMT relative to the target movement trajectory TMT based on the light reception information. In this embodiment, the control unit 7 calculates θz=cos －１ The rotation amount θz may be calculated using the formula (L / (L1+L2)).

[0247] After the rotation amount θz is calculated, the control unit 7 may calibrate (in other words, control, adjust, or change) the irradiation mode of the processing light EL#1 based on the calculated rotation amount θz. For example, when controlling the galvanometer mirror 2146 to move the processing light EL#1, the control unit 7 may control the galvanometer mirror 2146 so that the calculated rotation amount θz becomes zero. That is, the control unit 7 may generate a galvanometer control signal that controls the galvanometer mirror 2146 so that the calculated rotation amount θz becomes zero. For example, the control unit 7 may control the galvanometer mirror 2146 so that the rotation amount θz becomes zero during at least a portion of the modeling period. For example, the control unit 7 may control the galvanometer mirror 2146 so that the rotation amount θz becomes zero during at least a portion of the measurement period. As a result, even if the rotation amount θz calculated by the rotation calibration operation is not zero, the control unit 7 can control the galvanometer mirror 2146 so that the processing light EL moves in the same way as when the rotation amount θz is zero. That is, the galvanometer mirror 2146 can move the processing light EL#1 while canceling out the influence of the rotation amount θz. Therefore, compared to when the rotation calibration operation is not performed, the galvanometer mirror 2146 can move the processing light EL#1 with high precision without being influenced by the rotation amount θz.

[0248] (2-2-3) Offset Calibration Operation The machining system SYS may perform an offset calibration operation as at least a part of the calibration operation. The offset calibration operation may include a first offset calibration operation that calculates an offset amount (in other words, a parallel movement amount) of the actual movement trajectory AMT of the machining light EL#1 relative to the target movement trajectory TMT of the machining light EL#1. The offset calibration operation may include a second offset calibration operation that calculates an offset amount of the actual movement trajectory AMT of the machining light EL#2 relative to the target movement trajectory TMT of the machining light EL#2.

[0249] The first offset calibration operation will be specifically described below. However, the machining system SYS may perform the second offset calibration operation by performing an operation similar to the first offset calibration operation. Specifically, the following description of the first offset calibration operation can be used as a description of the second offset calibration operation by replacing the terms "first," "galvanometer mirror 2146," and "#1" with the terms "second," "galvanometer mirror 2156," and "#2," respectively.

[0250] The machining system SYS performs the first offset calibration operation using the second calibration unit 82 included in the calibration unit 8. In particular, the machining system SYS performs the first offset calibration operation using the search mark 8241 formed on the opening member 822 of the second calibration unit 82.

[0251] Specifically, the control unit 7 controls the machining head 21 to irradiate the search mark 8241 with the machining light EL#1. To irradiate the search mark 8241 with the machining light EL#1, the control unit 7 first generates a galvanometer control signal for moving the machining light EL#1 on the aperture member 822 along a target movement trajectory TMT that crosses the search mark 8241. An example of the target movement trajectory TMT used in the first offset calibration operation is shown in FIG. 19 . As shown in FIG. 19 , the target movement trajectory TMT may be a linear movement trajectory along the X-axis direction along which the two slit-shaped openings 8231-1 and one slit-shaped opening 8231-3 that make up the search mark 8241 are aligned. In particular, the target movement trajectory TMT may be perpendicular to each of the two slit-shaped openings 8231-1. Furthermore, the target movement trajectory TMT may pass through the midpoints of each of the two slit-shaped openings 8231-1 in the Y-axis direction. Furthermore, the distance in the X-axis direction between the starting point SP of the target movement trajectory TMT and one of the two slit-shaped openings 8231-1 may be the same as the distance in the X-axis direction between the end point EP of the target movement trajectory TMT and the other of the two slit-shaped openings 8231-1.

[0252] However, the target movement trajectory TMT may be a linear movement trajectory along the Y-axis direction along which the two slit-shaped openings 8231-2 and one slit-shaped opening 8231-3 that make up the search mark 8241 are aligned. In particular, the target movement trajectory TMT may be perpendicular to each of the two slit-shaped openings 8231-2. Furthermore, the target movement trajectory TMT may pass through the midpoints of each of the two slit-shaped openings 8231-2 in the X-axis direction. Furthermore, the distance in the Y-axis direction between the start point SP of the target movement trajectory TMT and one of the two slit-shaped openings 8231-2 may be the same as the distance in the Y-axis direction between the end point EP of the target movement trajectory TMT and the other of the two slit-shaped openings 8231-2. In the following explanation, for the sake of simplicity, the target movement trajectory TMT will be explained using an example in which the target movement trajectory TMT is a linear movement trajectory along the X-axis direction along which two slit-shaped openings 8231-1 and one slit-shaped opening 8231-3 that make up the search mark 8241 are aligned.

[0253] Thereafter, the control unit 7 controls the galvanometer mirror 2146 based on the generated galvanometer control signal. As a result, the galvanometer mirror 2146 moves the processing light EL#1 on the aperture member 822. That is, as shown in FIG. 19 , the galvanometer mirror 2146 moves the processing light EL#1 so as to cross the search mark 8241 formed on the aperture member 822.

[0254] At this time, the control unit 7 may control the galvanometer mirror 2146 in a state in which the irradiation mode of the processing light EL#1 has been calibrated based on the above-described rotation amount θz. That is, the control unit 7 may generate a galvanometer control signal so that the above-described rotation amount θz becomes zero, and control the galvanometer mirror 2146 based on the generated galvanometer control signal. For this reason, the processing system SYS may perform an offset calibration operation after performing a rotation calibration operation.

[0255] As a result, the light receiving device 821 receives the processing light EL#1 that has passed through the search mark 8241. That is, as shown in Fig. 18 , the light receiving device 821 outputs, as at least a part of the measurement information, light receiving information indicating, as a light receiving result, a light receiving signal including a pulse signal in which a pulse waveform P1 corresponding to the processing light EL#1 that has passed through one of the two slit-shaped openings 8231-1, a pulse waveform P2 corresponding to the processing light EL#1 that has passed through the slit-shaped opening 8231-3, and a pulse waveform P3 corresponding to the processing light EL#1 that has passed through the other of the two slit-shaped openings 8231-1 appear in that order.

[0256] Thereafter, the control unit 7 calculates an offset amount of the actual movement trajectory AMT relative to the target movement trajectory TMT based on the light reception information. For example, the control unit 7 may calculate an offset amount ΔOffx of the actual movement trajectory AMT in the X-axis direction relative to the target movement trajectory TMT, as shown in Fig. 19. For example, the control unit 7 may calculate an offset amount ΔOffy of the actual movement trajectory AMT in the Y-axis direction relative to the target movement trajectory TMT, as shown in Fig. 19. In this embodiment, the control unit 7 may calculate the offset amount ΔOffx using the formula ΔOffx = tan φ × (L2 - L1) / 2, where L0 is the distance obtained by multiplying the time from when the galvanometer mirror 2146 starts moving the processing light EL#1 until the pulse waveform P1 appears by the movement speed of the processing light EL#1, L3 is the distance obtained by multiplying the time from when the pulse waveform P3 appears until the galvanometer mirror 2146 finishes moving the processing light EL#1 by the movement speed of the processing light EL#1, and φ is the angle at which the slit-shaped opening 8231-2 intersects with the slit-shaped opening 8231-3 (i.e., the angle at which the opening 8231-2 intersects with the X-axis). The control unit 7 may calculate the offset amount ΔOffy using the formula ΔOffx = (L3 - L0) / 2.

[0257] After the offset amount is calculated, the control unit 7 may calibrate (in other words, control, adjust, or change) the irradiation mode of the processing light EL#1 based on the calculated offset amount. For example, when controlling the galvanometer mirror 2146 to move the processing light EL#1, the control unit 7 may control the galvanometer mirror 2146 so that at least one of the offset amounts ΔOffx and ΔOffy becomes zero. That is, the control unit 7 may generate a galvanometer control signal that controls the galvanometer mirror 2146 so that at least one of the offset amounts ΔOffx and ΔOffy becomes zero. For example, the control unit 7 may control the galvanometer mirror 2146 so that at least one of the offset amounts ΔOffx and ΔOffy becomes zero during at least a portion of the modeling period. For example, the control unit 7 may control the galvanometer mirror 2146 so that at least one of the offset amounts ΔOffx and ΔOffy becomes zero during at least a portion of the measurement period. As a result, even if at least one of the offset amounts ΔOffx and ΔOffy calculated by the offset calibration operation is not zero, the control unit 7 can control the galvanometer mirror 2146 so that the processing light EL moves in the same way as when at least one of the offset amounts ΔOffx and ΔOffy is zero. In other words, the galvanometer mirror 2146 can move the processing light EL#1 while offsetting the influence of at least one of the offset amounts ΔOffx and ΔOffy. Therefore, compared to when the offset calibration operation is not performed, the galvanometer mirror 2146 can move the processing light EL#1 with high precision without being influenced by at least one of the offset amounts ΔOffx and ΔOffy.

[0258] The machining system SYS may perform the offset calibration operation simultaneously with the rotation calibration operation. For example, the machining system SYS may calculate the offset amounts ΔOffx and ΔOffy to be calculated by the offset calibration operation and the rotation amount θz to be calculated by the rotation calibration operation based on the reception result of the processing light EL by the calibration unit 8. In this case, the machining system SYS does not need to separately perform the operation of irradiating the processing light EL onto the search mark 8241 to perform the offset calibration operation and the operation of irradiating the processing light EL onto the search mark 8241 to perform the rotation calibration operation.

[0259] (2-2-4) Focus Calibration Operation The processing system SYS may perform a focus calibration operation as at least a part of the calibration operation.

[0260] The processing system SYS may perform the focus calibration operation after performing the above-described rotation calibration operation and offset calibration operation. That is, the processing system SYS may perform the focus calibration operation in a state in which the irradiation modes of the processing lights EL#1 and EL#2 are calibrated based on the rotation amount and the offset amount. However, the processing system SYS may perform the focus calibration operation before performing at least one of the above-described rotation calibration operation and offset calibration operation.

[0261] The focus calibration operation may include a first focus calibration operation for calculating a best focus position of the processing light EL#1. The best focus position of the processing light EL#1 may refer to a position where the defocus amount of the processing light EL#1 is minimum. The best focus position of the processing light EL#1 may refer to a position where the processing light EL#1 is most convergent along the traveling direction of the processing light EL#1.

[0262] The focus calibration operation may include a second focus calibration operation for calculating a best focus position of the processing light EL#2. The best focus position of the processing light EL#2 may refer to a position where the defocus amount of the processing light EL#2 is minimum. The best focus position of the processing light EL#2 may refer to a position where the processing light EL#2 is most convergent along the traveling direction of the processing light EL#1.

[0263] The first focus calibration operation will be described below. However, the processing system SYS may perform the second focus calibration operation by performing an operation similar to the first focus calibration operation. Specifically, the following description of the first focus calibration operation can be used as a description of the second focus calibration operation by replacing the terms "first," "galvanometer mirror 2146," and "#1" with the terms "second," "galvanometer mirror 2156," and "#2," respectively.

[0264] The processing system SYS performs the first focus calibration operation using the second calibration unit 82 included in the calibration unit 8. In particular, the processing system SYS performs the first focus calibration operation using the slit mark 8243 or 8244 formed on the aperture member 822 of the second calibration unit 82.

[0265] Specifically, the processing system SYS irradiates the slit mark 8243 or 8244 with the processing light EL#1. In this case, the processing system SYS may move the processing light EL#1 relative to the slit mark 8243 or 8244 so that the processing light EL#1 crosses the slit mark 8243 or 8244. In particular, the processing system SYS may move the processing light EL#1 relative to the slit mark 8243 or 8244 so that the processing light EL#1 crosses the slit mark 8243 or 8244 along a direction intersecting the longitudinal direction of the slit mark 8243 or 8244. For example, as shown in FIG. 20 showing the processing light EL#1 irradiated to the slit mark 8243, the processing system SYS may move the processing light EL#1 relative to the slit mark 8243 so that the processing light EL#1 crosses the slit mark 8243 along the X-axis direction intersecting the slit mark 8243, whose longitudinal direction is the Y-axis direction. Alternatively, the processing system SYS may move the processing light EL#1 relative to the slit mark 8244 so that the processing light EL#1 crosses the slit mark 8244 along the Y-axis direction, which intersects with the slit mark 8244, whose longitudinal direction is the X-axis direction.

[0266] The processing system SYS may move the stage 31 using the stage drive system 32 to move the processing light EL#1 relative to the slit mark 8243 or 8244. The processing system SYS may move the processing light EL#1 relative to the slit mark 8243 or 8244 by moving the processing head 21 using the head drive system 22. The processing system SYS may move the processing light EL#1 relative to the slit mark 8243 or 8244 by deflecting the processing light EL#1 using the galvanometer mirror 2146.

[0267] As a result, the light receiving device 821 receives the processing light EL#1 that has passed through the slit mark 8243 or 8244. Therefore, as shown in Fig. 21 which is a graph showing the light receiving result of the processing light EL#1 by the light receiving device 821, the light receiving device 821 outputs, as at least part of the measurement information, light receiving information indicating, as a light receiving result, a light receiving signal indicating that the intensity of the processing light EL during a period when at least a part of the processing light EL is irradiated onto the opening 8233 or 8234 that constitutes the slit mark 8243 or 8244 is greater than the intensity of the processing light EL#1 during a period when the processing light EL#1 is not irradiated onto the opening 8233 or 8234.

[0268] 21 is substantially equivalent to the movement amount of processing light EL#1 relative to slit mark 8243 or 8244. When processing light EL#1 is moved relative to slit mark 8243 or 8244 by moving stage 31, the movement amount of processing light EL#1 relative to slit mark 8243 or 8244 may be considered equivalent to the movement amount of stage 31. When processing light EL#1 is moved relative to slit mark 8243 or 8244 by moving processing head 21, the movement amount of processing light EL#1 relative to slit mark 8243 or 8244 may be considered equivalent to the movement amount of processing head 21. When processing light EL#1 is deflected to move the processing light EL#1 relative to slit mark 8243 or 8244, the amount of movement of processing light EL#1 relative to slit mark 8243 or 8244 may be considered to be equivalent to the amount of deflection of processing light EL#1 (i.e., the amount of rotation of galvanometer mirror 2146).

[0269] Thereafter, the control unit 7 calculates, based on the light reception information, a spot diameter, which is the size of the beam spot formed by the processing light EL#1 on the aperture member 822. Specifically, based on the light reception information, the control unit 7 may calculate the time during which the intensity of the processing light EL#1 is greater than a predetermined intensity. That is, based on the light reception information, the control unit 7 may calculate the time during which at least a portion of the processing light EL#1 is irradiated onto the aperture 8233 or 8234 that forms the slit mark 8243 or 8244. The predetermined intensity may be set based on the peak intensity in the intensity distribution of the processing light EL. For example, the predetermined intensity may be set to an intensity obtained by multiplying the peak intensity by K (note that K is a variable indicating a real number greater than 0 and less than 1). As an example of the variable K, when the processing light EL#1 is a Gaussian beam, 1 / e ２ (Note that e means Napier's constant). Another example of the variable K is 0.135 when the processing light EL#1 is a Gaussian beam. The control unit 7 may then calculate the spot diameter of the processing light EL#1 based on the calculated time and the moving speed of the processing light EL#1 relative to the slit mark 8243 or 8244. For example, the control unit 7 may calculate the spot diameter of the processing light EL#1 by multiplying the calculated time by the moving speed of the processing light EL#1 relative to the slit mark 8243 or 8244.

[0270] The processing system SYS repeats the operation of irradiating the slit mark 8243 or 8244 with the processing light EL#1 and calculating the spot diameter of the processing light EL#1 while changing the distance between the processing head 21 (particularly, the irradiation optical system 211) and the calibration unit 8 in the traveling direction of the processing light EL#1 (e.g., the Z-axis direction). That is, the processing system SYS repeats the operation of irradiating the slit mark 8243 or 8244 with the processing light EL#1 and calculating the spot diameter of the processing light EL#1 while changing the position (Z position) of the processing head 21 (particularly, the irradiation optical system 211) relative to the calibration unit 8 in the traveling direction of the processing light EL#1 (e.g., the Z-axis direction). As a result, the control unit 7 calculates a plurality of spot diameters, each corresponding to a different Z position of the processing head 21, as shown in FIG. 22 .

[0271] The control unit 7 then calculates the best focus position of the processing light EL#1 based on the multiple spot diameters. For example, the control unit 7 may identify the smallest spot diameter among the multiple spot diameters and identify the Z position of the processing head 21 corresponding to the identified smallest spot diameter. Alternatively, for example, the control unit 7 may calculate an interpolation curve that interpolates the multiple spot diameters, calculate the smallest spot diameter based on the interpolation curve, and identify the Z position of the processing head 21 corresponding to the calculated smallest spot diameter based on the interpolation curve. The control unit 7 may then calculate the best focus position based on the identified Z position. Specifically, the control unit 7 may calculate the position of the calibration unit 8 (particularly, the slit mark 8243 or 8244) when the processing head 21 is located at the identified Z position as the best focus position where the defocus amount of the processing light EL#1 is minimized.

[0272] After the best focus position is calculated, the control unit 7 may calibrate (in other words, control, adjust, or change) the irradiation mode of the processing light EL#1 based on the calculated best focus position. For example, the control unit 7 may control the movement of at least one of the processing head 21 and the stage 31 based on the best focus position. For example, the control unit 7 may move at least one of the processing head 21 and the stage 31 during at least a portion of the printing period so that the best focus position is set on or near the printing surface MS. For example, the control unit 7 may move at least one of the processing head 21 and the stage 31 during at least a portion of the measurement period so that the best focus position is set on or near the calibration surface 801. As a result, the control unit 7 can irradiate the printing surface MS and the calibration unit 8 with processing light EL#1 having an appropriate defocus amount compared to when the focus calibration operation is not performed.

[0273] (2-2-5) Distortion Calibration Operation The machining system SYS may perform a distortion calibration operation as at least a part of the calibration operation.

[0274] The processing system SYS may perform the distortion calibration operation after performing the above-described rotation calibration operation, offset calibration operation, and focus calibration operation. That is, the processing system SYS may perform the distortion calibration operation in a state in which the irradiation modes of the processing lights EL#1 and EL#2 have been calibrated based on the rotation amount, offset amount, and best focus position. However, the processing system SYS may perform the distortion calibration operation before performing at least one of the above-described rotation calibration operation, offset calibration operation, and focus calibration operation.

[0275] The distortion calibration operation may include a first distortion calibration operation that calculates a deviation amount between the designed irradiation position of the processing light EL#1 indicated by the galvanometer control signal and the actual irradiation position of the processing light EL#1 deflected by the galvanometer mirror 2146 based on the galvanometer control signal. In particular, the first distortion calibration operation may include an operation that calculates a deviation amount between the designed irradiation position of the processing light EL#1 and the actual irradiation position of the processing light EL#1 at each position within a shot area (e.g., processing unit area BSA#1) to which the galvanometer mirror 2146 can irradiate the processing light EL#1 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed.

[0276] The distortion calibration operation may include a second distortion calibration operation that calculates a deviation amount between the designed irradiation position of the processing light EL#2 indicated by the galvanometer control signal and the actual irradiation position of the processing light EL#2 deflected by the galvanometer mirror 2156 based on the galvanometer control signal. In particular, the second distortion calibration operation may include an operation that calculates a deviation amount between the designed irradiation position of the processing light EL#2 and the actual irradiation position of the processing light EL#2 at each position within a shot area (e.g., processing unit area BSA#2) to which the galvanometer mirror 2156 can irradiate the processing light EL#2 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed.

[0277] The first distortion calibration operation will be described in detail below. However, the machining system SYS may perform the second distortion calibration operation by performing an operation similar to the first distortion calibration operation. Specifically, the following description of the first distortion calibration operation can be used as a description of the second distortion calibration operation by replacing the terms "first," "galvanometer mirror 2146," and "#1" with the terms "second," "galvanometer mirror 2156," and "#2," respectively.

[0278] In the following description, where necessary, the deviation amount between the designed irradiation position of processing light EL#1 and the actual irradiation position of processing light EL#1 will be referred to as the irradiation position deviation amount of processing light EL#1.

[0279] The machining system SYS performs a first rotation calibration operation using the second calibration unit 82 included in the calibration unit 8. In particular, the machining system SYS performs a first distortion calibration operation using a plurality of pinhole marks 8242 formed in the opening member 822 of the second calibration unit 82.

[0280] Specifically, the control unit 7 controls the machining head 21 to sequentially irradiate the multiple pinhole marks 8242 with the machining light EL#1. At this time, the machining head 21 (irradiation optical system 211) and the second calibration unit 82 may remain stationary. To sequentially irradiate the multiple pinhole marks 8242 with the machining light EL#1, the control unit 7 first generates a galvanometer control signal for controlling the galvanometer mirror 2146 to sequentially irradiate the multiple pinhole marks 8242 with the machining light EL#1. In particular, the control unit 7 may generate a galvanometer control signal for controlling the galvanometer mirror 2146 so that the machining light EL#1 scans each pinhole mark 8242, as shown in FIG. 23 , which shows the machining light EL#1 irradiated onto the pinhole marks 8242. In other words, the control unit 7 may generate a galvanometer control signal for controlling the galvanometer mirror 2146 to repeatedly move the processing light EL#1 in one direction (e.g., the Y-axis direction) at the position where each pinhole mark 8242 is formed while changing the irradiation position of the processing light EL#1 in another direction (e.g., the X-axis direction) that intersects with the one direction. The control unit 7 may generate a galvanometer control signal for controlling the galvanometer mirror 2146 to repeatedly move the target irradiation area EA#1 in one direction (e.g., the Y-axis direction) at the position where each pinhole mark 8242 is formed while changing the position of the target irradiation area EA#1 in the other direction that intersects with the one direction.

[0281] As described above, the first distortion calibration operation may include an operation of calculating the amount of deviation in the irradiation position of the processing light EL#1 at each position within the shot area (e.g., the processing unit area BSA#1). In this case, the multiple pinhole marks 8242 may be formed in the aperture member 822 so that the multiple pinhole marks 8242 are included in the shot area. As a result, the processing system SYS can sequentially irradiate the multiple pinhole marks 8242 with the processing light EL#1 by deflecting the processing light EL#1 using the galvanometer mirror 2146 while fixing the positional relationship between the irradiation optical system 211 and the calibration unit 8. In other words, the processing system SYS can sequentially irradiate the multiple pinhole marks 8242 formed at multiple different positions within the shot area with the processing light EL#1.

[0282] Thereafter, the control unit 7 controls the galvanometer mirror 2146 based on the generated galvanometer control signal. As a result, the galvanometer mirror 2146 moves the processing light EL#1 on the aperture member 822 so that the processing light EL#1 sequentially irradiates the multiple pinhole marks 8242. That is, as shown in FIG. 23 , the galvanometer mirror 2146 repeats the operation of moving the processing light EL#1 to scan each pinhole mark 8242 so that the multiple pinhole marks 8242 are sequentially scanned by the processing light EL#1.

[0283] As a result, the light receiving device 821 receives the processing light EL#1 that has passed through each pinhole mark 8242. As shown in Fig. 24, which is a graph showing the light receiving result of the processing light EL#1 by the light receiving device 821, the light receiving device 821 outputs, as at least part of the measurement information, light receiving information indicating, as a light receiving result, a light receiving signal indicating that the intensity of the processing light EL#1 during a period when at least a portion of the processing light EL is irradiated onto the aperture 8232 is greater than the intensity of the processing light EL#1 during a period when the processing light EL#1 is not irradiated onto the aperture 8232 that constitutes each pinhole mark 8242.

[0284] Then, the control unit 7 calculates the deviation amount of the irradiation position of the processing light EL#1 based on the light reception information. Specifically, because the processing light EL#1 scans each pinhole mark 8242, the time (light reception timing) on ​​the horizontal axis of FIG. 24 indirectly indicates the actual irradiation position of the processing light EL#1 irradiated on each pinhole mark 8242. Therefore, the light reception information includes information regarding the actual irradiation position of the processing light EL#1. In other words, as shown in FIG. 24, the actual light reception result of the processing light EL#1 indicated by the light reception information indicates the actual irradiation position of the processing light EL#1. Furthermore, as described above, at the position where each pinhole mark 8242 is formed, the operation of moving the processing light EL#1 in one direction (e.g., the Y-axis direction) is repeated while changing the irradiation position of the processing light EL#1 in another direction (e.g., the X-axis direction) intersecting the one direction. In this case, the light reception information includes information regarding the actual irradiation position of the processing light EL#1 in each of the X-axis and Y-axis directions. That is, as shown in FIG. 24 , the actual light reception results of the processing light EL#1 indicated by the light reception information indicate the actual irradiation positions of the processing light EL#1 in the X-axis and Y-axis directions. Therefore, the control unit 7 can calculate the actual irradiation positions of the processing light EL#1 in the X-axis and Y-axis directions based on the light reception information. Meanwhile, the design irradiation positions of the processing light EL#1 in the X-axis and Y-axis directions are known to the control unit 7 because the control unit 7 generates a galvanometer control signal for controlling the galvanometer mirror 2146 so that the processing light EL#1 is irradiated at the design irradiation positions. As a result, the control unit 7 can calculate the deviation between the actual irradiation position of the processing light EL#1 calculated based on the light reception information and the design irradiation position of the processing light EL#1 used to generate the galvanometer control signal. That is, the control unit 7 can calculate the deviation amount of the irradiation position of the processing light EL#1 based on the light reception information. For example, as shown in FIG. 24 , the control unit 7 may calculate the deviation amount ΔIPx of the irradiation position of the processing light EL#1 in the X-axis direction. For example, as shown in FIG. 24, the control unit 7 may calculate the amount of deviation ΔIPy of the irradiation position of processing light EL#1 in the Y-axis direction.

[0285] 25 , the control unit 7 may calculate the amount of deviation of the irradiation position of the processing light EL#1 at the position where each of the multiple pinhole marks 8242 is formed. In particular, when the pinhole mark 8242 is included in the shot area as described above, the control unit 7 may calculate the amount of deviation of the irradiation position of the processing light EL#1 at each of multiple different positions within the shot area.

[0286] After the amount of deviation in the irradiation position of processing light EL#1 is calculated, the control unit 7 may calibrate (in other words, control, adjust, or change) the irradiation mode of processing light EL#1 based on the calculated amount of deviation in the irradiation position. For example, the control unit 7 may control the galvanometer mirror 2146 based on the calculated amount of deviation in the irradiation position. For example, the control unit 7 may generate a galvanometer control signal to control the galvanometer mirror 2146 so that the amount of deviation in the irradiation position of processing light EL#1 becomes zero. In other words, the control unit 7 may generate a galvanometer control signal to control the galvanometer mirror 2146 so that the processing light EL#1 is irradiated at the designed irradiation position. For example, the control unit 7 may generate a galvanometer control signal to control the galvanometer mirror 2146 so that the amount of deviation in the irradiation position of processing light EL#1 becomes zero for at least a portion of the modeling period. For example, the control unit 7 may generate a galvanometer control signal to control the galvanometer mirror 2146 so that the amount of deviation in the irradiation position of processing light EL#1 becomes zero for at least a portion of the measurement period. For example, the control unit 7 may generate a galvanometer control signal to control the galvanometer mirror 2146 so that the irradiation position deviation amount ΔIPx of the processing light EL#1 in the X-axis direction becomes zero. For example, the control unit 7 may generate a galvanometer control signal to control the galvanometer mirror 2146 so that the irradiation position deviation amount ΔIPx of the processing light EL#1 in the X-axis direction becomes zero at each of multiple positions within the shot area. For example, the control unit 7 may generate a galvanometer control signal to control the galvanometer mirror 2146 so that the irradiation position deviation amount ΔIPy of the processing light EL#1 in the Y-axis direction becomes zero. For example, the control unit 7 may generate a galvanometer control signal to control the galvanometer mirror 2146 so that the irradiation position deviation amount ΔIPy of the processing light EL#1 in the Y-axis direction becomes zero at each of multiple positions within the shot area. As a result, even if the amount of irradiation position deviation of the processing light EL#1 calculated by the distortion calibration operation is not zero, the control unit 7 can control the galvanometer mirror 2146 so that the processing light EL is irradiated at the same position as the position where the processing light EL#1 would be irradiated if the amount of irradiation position deviation was zero.That is, the galvanometer mirror 2146 can deflect the processing light EL#1 while canceling out the influence of the amount of deviation in the irradiation position. Therefore, compared to when the distortion calibration operation is not performed, the galvanometer mirror 2146 can deflect the processing light EL#1 with high precision without being influenced by the amount of deviation in the irradiation position.

[0287] When both the first distortion calibration operation and the second distortion calibration operation are performed, the control unit 7 can calculate both the actual irradiation position of the processing light EL#1 and the actual irradiation position of the processing light EL#2. In particular, the control unit 7 can calculate both the actual irradiation position of the processing light EL#1 and the actual irradiation position of the processing light EL#2 at each of multiple positions within the shot area. In this case, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 so that the actual irradiation position of the processing light EL#1 is set to a position corresponding to the actual irradiation position of the processing light EL#2. For example, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 so that the actual irradiation position of the processing light EL#1 at a first position within the shot area is set to a position corresponding to the actual irradiation position of the processing light EL#2 at the first position within the shot area. For example, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 so that the actual irradiation position of processing light EL#1 at a second position different from the first position within the shot area is set to a position corresponding to the actual irradiation position of processing light EL#2 at the second position within the shot area. Alternatively, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 so that the actual irradiation position of processing light EL#2 is set to a position corresponding to the actual irradiation position of processing light EL#1. For example, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 so that the actual irradiation position of processing light EL#2 at a first position within the shot area is set to a position corresponding to the actual irradiation position of processing light EL#1 at the first position within the shot area. For example, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 so that the actual irradiation position of the processing light EL#2 at the second position within the shot area is set to a position corresponding to the actual irradiation position of the processing light EL#1 at the second position within the shot area.

[0288] The control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 so that the actual irradiation position of the processing light EL#2 overlaps with the actual irradiation position of the processing light EL#1. For example, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 so that the actual irradiation position of the processing light EL#2 at a first position within the shot area overlaps with the actual irradiation position of the processing light EL#1 at the first position within the shot area. For example, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 so that the actual irradiation position of the processing light EL#2 at a second position within the shot area overlaps with the actual irradiation position of the processing light EL#1 at the second position within the shot area. As a result, the processing system SYS can irradiate both the processing light EL#1 and the processing light EL#2 at the same position.

[0289] The machining system SYS may calculate the response delay of the galvanometer mirror 2146 in a state in which the irradiation pattern of the processing light EL#1 is calibrated based on the amount of deviation in the irradiation position of the processing light EL#1. The state in which the irradiation pattern of the processing light EL#1 is calibrated based on the amount of deviation in the irradiation position of the processing light EL#1 may refer to a state in which the processing light EL#1 is actually irradiated at the first position via the galvanometer mirror 2146 when a galvanometer control signal for controlling the galvanometer mirror 2146 to irradiate the first position is input to the galvanometer mirror 2146. Furthermore, the response delay of the galvanometer mirror 2146 may refer to the time required from when a galvanometer control signal for controlling the galvanometer mirror 2146 to irradiate the first position with the processing light EL#1 is input to the galvanometer mirror 2146 until the first position is actually irradiated with the processing light EL#1. In this case, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that one pinhole mark 8242 is positioned at one position, and irradiate the one pinhole mark 8242 with the machining light EL#1. Then, based on the light reception information indicating the light reception result of the machining light EL#1, the control unit 7 may calculate the time when the pinhole mark 8242 is irradiated with the machining light EL#1 as the time when the one position is actually irradiated with the machining light EL#1. Then, based on the light reception information indicating the light reception result of the machining light EL#1, the control unit 7 may calculate the response delay of the galvanometer mirror 2146 based on the time when the pinhole mark 8242 is irradiated with the machining light EL#1. After calculating the response delay of the galvanometer mirror 2146, the control unit 7 may control the galvanometer mirror 2146 so that the response delay becomes zero (or a desired value).

[0290] Similarly, the processing system SYS may calculate the response delay of the galvanometer mirror 2156 in a state in which the irradiation mode of the processing light EL#2 is calibrated based on the amount of deviation in the irradiation position of the processing light EL#2, by performing an operation similar to the operation of calculating the response delay of the galvanometer mirror 2146. After the response delay of the galvanometer mirror 2156 is calculated, the control unit 7 may control the galvanometer mirror 2156 so that the response delay becomes zero (or a desired value).

[0291] (2-2-6) Stroke Calibration Operation The machining system SYS may perform a stroke calibration operation as at least a part of the calibration operation.

[0292] The processing system SYS may perform the stroke calibration operation after performing the above-described rotation calibration operation, offset calibration operation, focus calibration operation, and distortion calibration operation. That is, the processing system SYS may perform the stroke calibration operation in a state in which the irradiation modes of the processing lights EL#1 and EL#2 have been calibrated based on the rotation amount, offset amount, best focus position, and irradiation position deviation amount. However, the processing system SYS may perform the stroke calibration operation before performing at least one of the above-described rotation calibration operation, offset calibration operation, focus calibration operation, and distortion calibration operation.

[0293] The stroke calibration operation may include a first stroke calibration operation for calculating the stroke width (i.e., stroke amount) of the movement of the processing light EL#1 by the galvanometer mirror 2146 on the printing surface MS. In particular, the stroke width of the movement of the processing light EL#1 may refer to the amplitude of the reciprocating movement of the processing light EL#1. Note that the stroke width of the movement of the processing light EL#1 may be considered equivalent to the stroke width of the movement of the target irradiation area EA#1 onto which the processing light EL#1 is irradiated. The stroke width of the movement of the processing light EL#1 may be considered equivalent to the stroke width of the movement of the irradiation position of the processing light EL#1.

[0294] The stroke calibration operation may include a second stroke calibration operation for calculating the stroke width (i.e., stroke amount) of the movement of the processing light EL#2 on the printing surface MS by the galvanometer mirror 2156. The stroke width of the movement of the processing light EL#2 may refer to the amplitude of the reciprocating movement of the processing light EL#2. Note that the stroke width of the movement of the processing light EL#2 may be considered equivalent to the stroke width of the movement of the target irradiation area EA#2 onto which the processing light EL#2 is irradiated. The stroke width of the movement of the processing light EL#2 may be considered equivalent to the stroke width of the movement of the irradiation position of the processing light EL#2.

[0295] The first stroke calibration operation will be specifically described below. However, the machining system SYS may perform the second stroke calibration operation by performing an operation similar to the first stroke calibration operation. Specifically, the following description of the first stroke calibration operation can be used as a description of the second stroke calibration operation by replacing the terms "first," "galvanometer mirror 2146," and "#1" with the terms "second," "galvanometer mirror 2156," and "#2," respectively.

[0296] The machining system SYS performs a first stroke calibration operation using the second calibration unit 82 included in the calibration unit 8. In particular, the machining system SYS performs the first stroke calibration operation using at least one of the slit marks 8243 and 8244 formed on the aperture member 822 of the second calibration unit 82. For ease of explanation, the following description will be given of an example in which the machining system SYS performs the first stroke calibration operation using both the slit marks 8243 and 8244. In this case, the machining system SYS performs the first stroke calibration operation by irradiating each of the slit marks 8243 and 8244 with the processing light EL#1. The machining system SYS may perform the first stroke calibration operation by irradiating one of the slit marks 8243 and 8244 with the processing light EL#1 during a first period of the measurement period, and then irradiating the other of the slit marks 8243 and 8244 with the processing light EL#1 during a second period of the measurement period. However, the processing system SYS may perform the first stroke calibration operation by irradiating the processing light EL#1 onto one of the slit marks 8243 and 8244, while not irradiating the processing light EL#1 onto the other of the slit marks 8243 and 8244.

[0297] When irradiating each of the slit marks 8243 and 8244 with the processing light EL#1, the control unit 7 controls the galvanometer mirror 2146 so that the irradiation position of the processing light EL#1 (i.e., the target irradiation area EA#1) moves on the surface of the aperture member 822, as shown in FIGS. 26 and 27 , which show the processing light EL#1 irradiated on each of the slit marks 8243 and 8244. In particular, the control unit 7 controls the galvanometer mirror 2146 so that the processing light EL#1 moves back and forth on the surface of the aperture member 822. For example, the control unit 7 may control the galvanometer mirror 2146 so that the processing light EL#1 moves back and forth within the range of the target stroke width on the surface of the aperture member 822. In this case, the processing light EL#1 is actually irradiated on each of the slit marks 8243 and 8244 for at least a portion of the period during which the processing light EL#1 moves on the surface of the aperture member 822.

[0298] When irradiating the slit marks 8243 and 8244 with the processing light EL#1, the control unit 7 further controls at least one of the head drive system 22 and the stage drive system 32 so as to move at least one of the processing head 21 (particularly, the irradiation optical system 211) and the calibration unit 8, as shown in FIGS. 26 and 27 . In particular, the control unit 7 controls at least one of the head drive system 22 and the stage drive system 32 so as to move either the processing head 21 (particularly, the irradiation optical system 211) or the calibration unit 8 relative to the other of the processing head 21 (particularly, the irradiation optical system 211) or the calibration unit 8. For example, the control unit 7 may control the head drive system 22 so as to move the processing head 21 (particularly, the irradiation optical system 211) relative to the calibration unit 8. The control unit 7 may also control the stage drive system 32 so as to move the calibration unit 8 relative to the processing head 21 (particularly, the irradiation optical system 211). The control unit 7 may control the head drive system 21 and the stage drive system 32 so that both the processing head 21 and the calibration unit 8 move.

[0299] The control unit 7 may control the galvanometer mirror 2146 and at least one of the head drive system 22 and the stage drive system 32 so that the processing light EL#1 reciprocating on the aperture member 822 by the galvanometer mirror 2146 crosses each of the slit marks 8243 and 8244. In other words, the control unit 7 may control the galvanometer mirror 2146 and at least one of the head drive system 22 and the stage drive system 32 so that the processing light EL#1 crosses each of the openings 8233 and 8234 that form the slit marks 8243 and 8244, respectively.

[0300] In particular, the control unit 7 may control the galvanometer mirror 2146 and at least one of the head drive system 22 and the stage drive system 32 so that the processing light EL#1 crosses the slit mark 8243 along a direction intersecting the longitudinal direction of the slit mark 8243 (i.e., the longitudinal direction of the opening 8233). In the example shown in Figure 26, the longitudinal direction of the slit mark 8243 is the X-axis direction. Therefore, as shown in Figure 26, the control unit 7 may control the galvanometer mirror 2146 and at least one of the head drive system 22 and the stage drive system 32 so that the processing light EL#1 crosses the slit mark 8243 along the Y-axis direction.

[0301] 26 , the direction of movement of the irradiation position of the processing light EL#1 by the galvanometer mirror 2146 may be a direction intersecting the longitudinal direction of the slit mark 8243. That is, the galvanometer mirror 2146 may move the irradiation position of the processing light EL#1 along a direction intersecting the longitudinal direction of the slit mark 8243 (e.g., the Y-axis direction). Furthermore, the direction of movement of at least one of the processing head 21 (particularly the irradiation optical system 211) and the calibration unit 8 by at least one of the head drive system 22 and the stage drive system 32 may be the same as the direction of movement of the irradiation position of the processing light EL#1 by the galvanometer mirror 2146. That is, at least one of the head drive system 22 and the stage drive system 32 may move at least one of the processing head 21 and the calibration unit 8 along a direction intersecting the longitudinal direction of the slit mark 8243 (typically a direction perpendicular to the longitudinal direction, e.g., the Y-axis direction). In this embodiment, since the stage drive system 32 can move the calibration unit 8 in the Y-axis direction, the stage drive system 32 may move the calibration unit 8 along a direction intersecting (typically a direction perpendicular to, for example, the Y-axis direction) the longitudinal direction of the slit mark 8243. In this case, as shown in FIG. 26 , the control unit 7 can calculate the stroke width STy of the movement of the processing light EL#1 in the Y-axis direction.

[0302] Similarly, the control unit 7 may control the galvanometer mirror 2146 and at least one of the head drive system 22 and the stage drive system 32 so that the processing light EL#1 crosses the slit mark 8244 along a direction intersecting the longitudinal direction of the slit mark 8244 (i.e., the longitudinal direction of the opening 8234). In the example shown in Figure 27, the longitudinal direction of the slit mark 8244 is the Y-axis direction. Therefore, as shown in Figure 27, the control unit 7 may control the galvanometer mirror 2146 and at least one of the head drive system 22 and the stage drive system 32 so that the processing light EL#1 crosses the slit mark 8244 along the X-axis direction.

[0303] 27 , the direction of movement of the irradiation position of processing light EL#1 by the galvanometer mirror 2146 may be a direction intersecting the longitudinal direction of the slit mark 8244. That is, the galvanometer mirror 2146 may move the irradiation position of processing light EL#1 along a direction intersecting the longitudinal direction of the slit mark 8244 (typically a direction perpendicular to the longitudinal direction, e.g., the X-axis direction). Furthermore, the direction of movement of at least one of the processing head 21 (particularly the irradiation optical system 211) and the calibration unit 8 by at least one of the head drive system 22 and the stage drive system 32 may be the same as the direction of movement of the irradiation position of processing light EL#1 by the galvanometer mirror 2146. That is, at least one of the head drive system 22 and the stage drive system 32 may move at least one of the processing head 21 and the calibration unit 8 along a direction intersecting the longitudinal direction of the slit mark 8244 (typically a direction perpendicular to the longitudinal direction, e.g., the X-axis direction). In this embodiment, since the head drive system 22 can move the processing head 21 in the X-axis direction, the head drive system 22 may move the processing head 21 along a direction (e.g., the X-axis direction) intersecting the longitudinal direction of the slit mark 8244. In this case, as shown in Fig. 27 , the control unit 7 can calculate the stroke width STx of the movement of the processing light EL#1 in the X-axis direction.

[0304] The movement speed of the irradiation position of processing light EL#1 by the galvanometer mirror 2146 may be different from the movement speed of at least one of the processing head 21 (particularly, the irradiation optical system 211) and the calibration unit 8 by at least one of the head drive system 22 and the stage drive system 32. Typically, the movement speed of the irradiation position of processing light EL#1 may be faster than the movement speed of at least one of the processing head 21 (particularly, the irradiation optical system 211) and the calibration unit 8. For example, the movement speed of the irradiation position of processing light EL#1 may be several times to several tens of times the movement speed of at least one of the processing head 21 (particularly, the irradiation optical system 211) and the calibration unit 8. As a result, the processing light EL#1 is irradiated onto the slit mark 8243 (i.e., the opening 8233) at each position in the region where the processing light EL#1 reciprocates, making it possible to appropriately calculate the stroke width.

[0305] As a result, the light receiving device 821 receives the processing light EL#1 that has passed through each of the slit marks 8243 and 8244 that move relative to the irradiation optical system 211. As shown in Fig. 28(a), which is a graph showing the light receiving result of the processing light EL#1 that has passed through the slit mark 8243 by the light receiving device 821, the light receiving device 821 outputs, as at least part of the measurement information, light receiving information that indicates, as a light receiving result, a light receiving signal indicating that the intensity of the processing light EL#1 during a period in which at least a part of the processing light EL is irradiated onto the opening 8233 that constitutes the slit mark 8243 is greater than the intensity of the processing light EL#1 during a period in which the processing light EL#1 is not irradiated onto the opening 8233 that constitutes the slit mark 8243. Furthermore, as shown in Figure 28 (b), which is a graph showing the light receiving result of the processing light EL#1 that passed through the slit mark 8244 by the light receiving device 821, the light receiving device 821 outputs, as at least part of the measurement information, light receiving information that indicates as a light receiving result a light receiving signal indicating that the intensity of the processing light EL#1 during the period when at least a portion of the processing light EL is irradiated to the opening 8234 that constitutes the slit mark 8244 is greater than the intensity of the processing light EL#1 during the period when the processing light EL#1 is not irradiated to the opening 8234 that constitutes the slit mark 8244.

[0306] 28(a), the horizontal axis (light-receiving timing) is substantially equivalent to the movement amount of the calibration unit 8 in the Y-axis direction. The horizontal axis (light-receiving timing) in FIG. 28(b) is substantially equivalent to the movement amount of the processing head 21 in the X-axis direction (i.e., the movement amount of the irradiation optical system 211).

[0307] Thereafter, the control unit 7 calculates the stroke amount of the movement of the processing light EL#1 based on the light reception information.

[0308] For example, as shown in FIG. 28( a), the control unit 7 may calculate the stroke amount STy of the movement of the processing light EL#1 in the Y-axis direction based on light reception information indicating the reception result of the processing light EL#1 passing through the slit mark 8243. Specifically, the control unit 7 may calculate the time during which the intensity of the processing light EL#1 is greater than a predetermined intensity based on the light reception information. In particular, as shown in FIG. 28( a), the control unit 7 may calculate the time during which the intensity of the processing light EL#1 is maintained at its peak intensity based on the light reception information. Then, the control unit 7 may calculate the stroke width STy of the movement of the processing light EL#1 based on the calculated time and the movement speed of the calibration unit 8 in the Y-axis direction. For example, the control unit 7 may calculate the stroke width STy by multiplying the calculated time by the movement speed of the calibration unit 8.

[0309] For example, as shown in FIG. 28( b), the control unit 7 may calculate the stroke amount STx of the movement of the processing light EL#1 in the X-axis direction based on light reception information indicating the reception result of the processing light EL#1 passing through the slit mark 8244. Specifically, the control unit 7 may calculate the time during which the intensity of the processing light EL#1 is greater than a predetermined intensity based on the light reception information. In particular, as shown in FIG. 28( b), the control unit 7 may calculate the time during which the intensity of the processing light EL#1 is maintained at its peak intensity based on the light reception information. Then, the control unit 7 may calculate the stroke width STx of the movement of the processing light EL#1 based on the calculated time and the movement speed of the processing head 21 in the X-axis direction. For example, the control unit 7 may calculate the stroke width STx by multiplying the calculated time by the movement speed of the processing head 21.

[0310] After the stroke width is calculated, the control unit 7 may calibrate (in other words, control, adjust, or change) the irradiation mode of the processing light EL#1 based on the calculated stroke width. For example, the control unit 7 may control the movement of at least one of the processing head 21 and the stage 31 based on the stroke widths STx and STy. For example, the control unit 7 may control the galvanometer mirror 2146 so that the stroke width STx becomes a desired first width during at least a part of the modeling period. For example, the control unit 7 may control the galvanometer mirror 2146 so that the stroke width STy becomes a desired second width during at least a part of the modeling period. For example, the control unit 7 may control the galvanometer mirror 2146 so that the stroke width STx becomes a desired third width during at least a part of the measurement period. For example, the control unit 7 may control the galvanometer mirror 2146 so that the stroke width STy becomes a desired fourth width during at least a part of the measurement period.

[0311] (2-2-7) Intensity Calibration Operation The processing system SYS may perform an intensity calibration operation as at least a part of the calibration operation. The intensity calibration operation may include a first intensity calibration operation that calculates the intensity of processing light EL#1. The intensity calibration operation may include a second intensity calibration operation that calculates the intensity of processing light EL#2.

[0312] The first intensity calibration operation will be specifically described below. However, the machining system SYS may perform the second intensity calibration operation by performing an operation similar to the first intensity calibration operation. Specifically, the following description of the first intensity calibration operation can be used as a description of the second intensity calibration operation by replacing the terms "first" and "#1" with "second" and "#2," respectively.

[0313] The machining system SYS performs a first intensity calibration operation using a first calibration unit 81 included in the calibration unit 8. Specifically, as shown in Fig. 29 showing the first calibration unit 81, the machining system SYS irradiates the processing light EL#1 to a light receiving device 811 of the first calibration unit 81. Light receiving information indicating the light receiving result of the processing light EL#1 by the light receiving device 811 is output to the control unit 7 as at least a part of the measurement information.

[0314] The control unit 7 then calculates the intensity of the processing light EL#1 based on the received light information. The control unit 7 may then calibrate (in other words, control, adjust, or change) the intensity of the processing light EL#1 based on the calculated intensity. For example, the control unit 7 may calibrate the intensity of the processing light EL#1 so that the intensity of the processing light EL#1 on the printing surface MS is a desired intensity. To control the intensity of the processing light EL#1, for example, the control unit 7 may control the light source 4#1 to change the intensity of the processing light EL#1 emitted from the light source 4#1 based on the calculated intensity. As a result, the processing system SYS can appropriately print a model on the printing surface MS by irradiating the printing surface MS with processing light EL#1 having an appropriate intensity.

[0315] As described above, the processing light EL#1 has an intensity sufficient to melt the shaping material M. Therefore, the processing light EL#1 incident on the light-receiving device 811 may have an intensity sufficient to melt the shaping material M. However, if the processing light EL#1 having an intensity sufficient to melt the shaping material M is incident on the light-receiving device 811, the light-receiving device 811 may be damaged by the processing light EL#1. Therefore, the processing system SYS may irradiate the light-receiving device 811 with the processing light EL#1 in a defocused state. In this case, the processing system SYS can appropriately prevent damage to the light-receiving device 811 because the intensity of the processing light EL#1 per unit area decreases as the defocus amount of the processing light EL#1 increases. On the other hand, even if the light-receiving device 811 is irradiated with the processing light EL#1 in a defocused state, the total amount of light of the processing light EL#1 irradiated on the light-receiving device 811 does not change. Therefore, even if the processing light EL#1 in a defocused state is irradiated onto the light receiving device 811, the control unit 7 can appropriately calculate the intensity of the processing light EL#1 based on the light receiving information.

[0316] The machining system SYS may perform the first intensity calibration operation and the second intensity calibration operation simultaneously.

[0317] (2-3) Other operations using the calibration unit 8 (2-3-1) Power meter calibration operation The processing system SYS may use the calibration unit 8 to perform a power meter calibration operation to calibrate at least one of the power meters 2143 and 2153 provided in the irradiation optical system 211.

[0318] Specifically, the control unit 7 may control the processing system SYS to irradiate the light receiving device 811 of the first calibration unit 81 with the processing light EL#1. The control unit 7 may then calculate the intensity of the processing light EL#1 based on the light receiving information. In parallel, the control unit 7 may calculate the intensity of the processing light EL#1 based on the detection result of the power meter 2143. The control unit 7 may then repeat the same operation while changing the intensity of the processing light EL#1.

[0319] Thereafter, the control unit 7 may determine whether the change trend of the intensity of the processing light EL#1 calculated based on the detection results of the power meter 2143 is the same as the change trend of the intensity of the processing light EL#1 calculated based on the light receiving results of the light receiving device 811. If the change trend of the intensity of the processing light EL#1 calculated based on the detection results of the power meter 2143 is the same as the change trend of the intensity of the processing light EL#1 calculated based on the light receiving results of the light receiving device 811, the power meter 2143 may be considered to be properly detecting the intensity of the processing light EL#1. In this case, the control unit 7 may not need to calibrate the power meter 2143. On the other hand, if the change trend of the intensity of the processing light EL#1 calculated based on the detection results of the power meter 2143 is not the same as the change trend of the intensity of the processing light EL#1 calculated based on the light receiving results of the light receiving device 811, it may be considered that a detection error may have occurred in the power meter 2143. In this case, the control unit 7 may calibrate the power meter 2143 so that the change trend of the intensity of the processing light EL#1 calculated based on the detection results of the power meter 2143 is the same as the change trend of the intensity of the processing light EL#1 calculated based on the light reception results of the light receiving device 811. For example, the control unit 7 may calculate a correction value for correcting the intensity of the processing light EL#1 calculated based on the detection results of the power meter 2143 and calibrate the power meter 2143 by adding the calculated correction value to the calculated intensity. As a result, the control unit 7 can more accurately calculate the intensity of the processing light EL#1 based on the detection results of the power meter 2143 compared to when the power meter calibration operation is not performed.

[0320] Similarly, the control unit 7 may control the processing system SYS to irradiate the light receiving device 811 of the first calibration unit 81 with the processing light EL#2. The control unit 7 may then calculate the intensity of the processing light EL#2 based on the light receiving information. In parallel, the control unit 7 may calculate the intensity of the processing light EL#2 based on the detection result of the power meter 2153. The control unit 7 may then repeat the same operation while changing the intensity of the processing light EL#2.

[0321] Thereafter, the control unit 7 may determine whether the change trend of the intensity of the processing light EL#2 calculated based on the detection results of the power meter 2153 is the same as the change trend of the intensity of the processing light EL#2 calculated based on the light receiving results of the light receiving device 811. If the change trend of the intensity of the processing light EL#2 calculated based on the detection results of the power meter 2153 is the same as the change trend of the intensity of the processing light EL#2 calculated based on the light receiving results of the light receiving device 811, the power meter 2153 may be considered to be properly detecting the intensity of the processing light EL#2. In this case, the control unit 7 may not need to calibrate the power meter 2153. On the other hand, if the change trend of the intensity of the processing light EL#2 calculated based on the detection results of the power meter 2153 is not the same as the change trend of the intensity of the processing light EL#2 calculated based on the light receiving results of the light receiving device 811, it may be considered that a detection error may have occurred in the power meter 2153. In this case, the control unit 7 may calibrate the power meter 2153 so that the change trend of the intensity of the processing light EL#2 calculated based on the detection results of the power meter 2153 is the same as the change trend of the intensity of the processing light EL#2 calculated based on the light reception results of the light receiving device 811. For example, the control unit 7 may calculate a correction value for correcting the intensity of the processing light EL#2 calculated based on the detection results of the power meter 2153 and calibrate the power meter 2153 by adding the calculated correction value to the calculated intensity. As a result, the control unit 7 can more accurately calculate the intensity of the processing light EL#2 based on the detection results of the power meter 2153 compared to when the power meter calibration operation is not performed.

[0322] (2-3-2) Abnormality Determination Operation The machining system SYS may perform an abnormality determination operation to determine whether or not an abnormality has occurred in the machining system SYS, by using the calibration unit 8. Below, as an example of the abnormality determination operation, an operation t...

Claims

1. a modeling device including an irradiation optical system capable of irradiating a modeling beam onto a surface of an object, and capable of modeling a model on the object by supplying a modeling material to a molten pool formed on the object by the modeling beam; a measuring device capable of measuring an emission beam including at least one of the shaping beam and the guide beam emitted from the irradiation optical system; a moving device that moves the irradiation optical system and the measurement device relatively along a direction intersecting an optical axis of the irradiation optical system during at least a part of a modeling period in which the modeling device models the object; and a control device capable of controlling the modeling apparatus based on a measurement result of the emission beam by the measurement device; Equipped with the irradiation optical system includes a moving member that moves the emission beam emitted from the irradiation optical system along a direction intersecting an optical axis of the irradiation optical system during at least a part of the modeling period, the measurement device measures the emission beam during at least a portion of a measurement period during which the moving member moves an irradiation position of the emission beam on the measurement device and the moving device moves at least one of the irradiation optical system and the measurement device; The control device controls the moving member during at least a part of the modeling period based on a measurement result of the emission beam during the measurement period. Molding system.

2. The measuring device is capable of measuring a width by which the moving member moves the irradiation position of the emitted beam. The molding system of claim 1 .

3. The control device controls the moving device during at least a part of the modeling period based on a measurement result of the emission beam during the measurement period. The molding system according to claim 1 or 2.

4. The moving device moves the irradiation optical system relative to the measurement device. The molding system according to claim 1 or 2.

5. The moving device moves the measurement device relative to the irradiation optical system. The molding system according to claim 1 or 2.

6. The moving device moves the measurement device and the irradiation optical system. The molding system according to claim 1 or 2.

7. The moving member includes a deflecting member that deflects the emitted beam so that the emitted beam moves along a direction intersecting an optical axis of the irradiation optical system. The molding system according to claim 1 or 2.

8. The moving member includes at least one of a galvanometer mirror and a parallel plate. The molding system according to claim 1 or 2.

9. During at least a portion of the measurement period, a moving speed of the irradiation position of the emission beam is different from a moving speed of at least one of the irradiation optical system and the measurement device. The molding system according to claim 1 or 2.

10. During at least a portion of the measurement period, a moving speed of the irradiation position of the emission beam is faster than a moving speed of at least one of the irradiation optical system and the measurement device. The molding system of claim 9 .

11. During at least a part of the measurement period, a moving direction of the irradiation position of the emission beam is the same as a moving direction of at least one of the irradiation optical system and the measurement device. The molding system according to claim 1 or 2.

12. the measurement device includes an aperture member having an opening formed therein, the opening extending along a longitudinal direction intersecting an optical axis of the irradiation optical system; During at least a portion of the measurement period, the moving member moves an irradiation position of the emission beam along a direction intersecting the longitudinal direction so that the emission beam crosses the opening along the direction intersecting the longitudinal direction, and the moving device moves at least one of the irradiation optical system and the measurement device along the direction intersecting the longitudinal direction. The molding system according to claim 1 or 2.

13. the measurement device includes a light receiving device that receives the emitted beam through the opening, The measurement result of the emitted beam by the measuring device includes a reception result of the emitted beam by the light receiving device. The molding system of claim 12.

14. during a first period of the measurement period, the moving member moves an irradiation position of the emission beam along a first direction intersecting an optical axis of the irradiation optical system, and the moving device moves at least one of the irradiation optical system and the measurement device along the first direction; In a second period of the measurement period, the moving member moves an irradiation position of the emission beam along a second direction that intersects an optical axis of the irradiation optical system and intersects the first direction, and the moving device moves at least one of the irradiation optical system and the measurement device along the second direction. The molding system according to claim 1 or 2.

15. the measurement device includes an aperture member in which a first opening is formed, the first opening extending along a third direction intersecting each of the optical axis of the irradiation optical system and the first direction, and a second opening is formed along a fourth direction intersecting each of the optical axis of the irradiation optical system and the second direction, In the first period, the moving member moves an irradiation position of the emitted beam along the first direction such that the emitted beam crosses the first opening along the first direction; In the second period, the moving member moves an irradiation position of the emitted beam along the second direction so that the emitted beam crosses the second opening along the second direction. The molding system of claim 14.

16. the measurement device includes a light receiving device that receives the emitted beam through the first opening during the first period and receives the emitted beam through the second opening during the second period; The measurement result of the emitted beam by the measuring device includes a reception result of the emitted beam by the light receiving device. The molding system of claim 15.

17. During at least a portion of the measurement period, the moving member reciprocates the irradiation position of the emission beam on the measurement device. The molding system according to claim 1 or 2.

18. The control device calculates a stroke width along which an irradiation position of the emission beam reciprocates on the measurement device based on a measurement result of the emission beam during the measurement period, and controls the moving member based on the calculated stroke width during at least a part of the modeling period. The molding system of claim 17.

19. During at least a part of the modeling period, the movable member reciprocates an irradiation position of the emission beam on the object; The control device controls the moving member so that a stroke width along which the irradiation position of the emission beam reciprocates on the object becomes a desired width based on the calculated stroke width during at least a part of the modeling period.

20. The molding system of claim 18.

20. a modeling device including a first irradiation optical system capable of irradiating a surface of an object with a first modeling beam and a second irradiation optical system capable of irradiating a surface of the object with a second modeling beam, and capable of modeling a model on the object by supplying a modeling material to at least one molten pool formed by at least one of the first and second modeling beams; a measurement device capable of measuring each of a first emission beam including at least one of the first shaping beam and a first guide beam emitted from the first irradiation optical system, and a second emission beam including at least one of the second shaping beam and a second guide beam emitted from the second irradiation optical system; a control device capable of controlling the modeling apparatus based on a measurement result of at least one of the first and second emission beams by the measurement device; Equipped with the first irradiation optical system includes a first deflection member that deflects the first emission beam such that an irradiation position of the first emission beam moves along a direction intersecting an optical axis of the first irradiation optical system on the object or on the measurement device; the second irradiation optical system includes a second deflection member that deflects the second emission beam such that an irradiation position of the second emission beam moves along a direction intersecting an optical axis of the second irradiation optical system on the object or on the measurement device; The control device controls at least one of the first deflection member and the second deflection member based on at least one of a measurement result of the first emitted beam by the measurement device and a measurement result of the second emitted beam by the measurement device. Molding system.

21. The measuring device includes a light receiving sensor having a light receiving portion. The molding system of claim 20.

22. The measuring device includes a light receiving sensor having a plurality of light receiving portions. The molding system of claim 20.

23. The modeling apparatus further includes a moving device that relatively moves at least one of the first irradiation optical system and the second irradiation optical system and the measurement device along a direction intersecting an optical axis of the first irradiation optical system and at least one of the second irradiation optical system, during at least a part of a modeling period in which the modeling apparatus models the modeled object.

23. The molding system of any one of claims 20 to 22.

24. The control device controls the moving device based on at least one of a measurement result of the first emitted beam by the measurement device and a measurement result of the second emitted beam by the measurement device. The molding system of claim 23.

25. the control device controls the movement device so that a structure is formed on the object along a target trajectory based on path information; and The path information includes line width information, The control device controls at least one of the first deflection member and the second deflection member so that at least one of the irradiation position of the first emitted beam and the irradiation position of the second emitted beam periodically moves within a width of a line formed based on the line width information. The molding system of claim 23.

26. The molding apparatus is capable of forming a first molten pool by the first injection beam, and is capable of forming a second molten pool different from the first molten pool by the second injection beam.

23. The molding system of any one of claims 20 to 22.

27. The molding apparatus is capable of forming one molten pool by the first injection beam and the second injection beam.

23. The molding system of any one of claims 20 to 22.

28. The measurement result includes information regarding the irradiation position of the first emitted beam and the irradiation position of the second emitted beam.

23. The molding system of any one of claims 20 to 22.

29. The control device controls the first and second deflection members so as to set the irradiation position of the first shaping beam on the object to a position determined according to the irradiation position of the second shaping beam on the object, based on a measurement result of the first and second emitted beams by the measurement device.

23. The molding system of any one of claims 20 to 22.

30. The control device controls the first and second deflection members based on measurement results of the first and second emission beams by the measurement device so that an irradiation position of the first shaping beam on the object overlaps with an irradiation position of the second shaping beam on the object.

23. The molding system of any one of claims 20 to 22.

31. the first irradiation optical system includes a first detection device capable of detecting an intensity of the first emitted beam; the second irradiation optical system includes a second detection device capable of detecting an intensity of the second emitted beam; The control device is capable of determining whether or not an abnormality has occurred in at least one of the first and second detection devices based on a measurement result of the first and second emitted beams by the measurement device.

23. The molding system of any one of claims 20 to 22.

32. the control device determines that an abnormality has occurred in the first detection device when a measurement result of the first emitted beam by the measurement device is normal while a measurement result of the first emitted beam by the first detection device is abnormal, The control device determines that an abnormality has occurred in the second detection device when a measurement result of the second emitted beam by the measurement device is normal while a measurement result of the second emitted beam by the second detection device is abnormal.

32. The molding system of claim 31.

33. the modeling system includes a first light source capable of generating the first emission beam and a second light source capable of generating the second emission beam; The control device is capable of determining whether or not an abnormality occurs in either one of the first and second light sources based on a measurement result of the first and second emitted beams by the measurement device.

32. The molding system of claim 31.

34. the control device determines that an abnormality has occurred in the first light source when both a measurement result of the first emitted beam by the measurement device and a measurement result of the first emitted beam by the first detection device are abnormal; The control device determines that an abnormality has occurred in the second light source when both a measurement result of the second emitted beam by the measurement device and a measurement result of the second emitted beam by the second detection device are abnormal.

34. The molding system of claim 33.

35. the measurement device includes an aperture member having an aperture formed therein, and a light receiving device that receives at least one of the first and second emitted beams through the aperture, a measurement result of the first emitted beam by the measurement device includes a reception result of the first emitted beam by the light receiving device, The measurement result of the second emitted beam by the measuring device includes a reception result of the second emitted beam by the light receiving device.

23. The molding system of any one of claims 20 to 22.

36. The wavelength of the first shaping beam is different from the wavelength of the second shaping beam.

23. The molding system of any one of claims 20 to 22.

37. a modeling device including an irradiation optical system capable of irradiating a modeling beam onto a surface of an object, and capable of modeling a model on the object by supplying a modeling material to a molten pool formed on the object by the modeling beam; a mounting member on which the object is mounted and which is rotatable about a rotation axis intersecting an optical axis of the irradiation optical system; a measuring device that is disposed on the mounting member, is rotatable around the rotation axis, and is capable of measuring an emission beam including at least one of the shaping beam and a guide beam emitted from the irradiation optical system; a control device capable of controlling the modeling apparatus based on a measurement result of the emission beam by the measurement device; A molding system comprising:

38. the control device is capable of changing a position of the measurement device from a first position to a second position by rotating the mounting member; the modeling apparatus is capable of modeling an object on the object when a position of the measurement apparatus is at the first position, The measurement device is capable of measuring the emitted beam when the measurement device is in the second position.

38. The molding system of claim 37.

39. the control device is capable of controlling the mounting member to be in a reference position and a position different from the reference position, the modeling apparatus is capable of irradiating the object placed on the placement member in the reference posture with the modeling beam, The measurement device disposed on the mounting member in a position different from the reference position is capable of measuring the emitted beam.

39. The molding system of claim 37 or 38.

40. The measuring device is disposed on the placement surface of the placement member, The arrangement surface faces a direction different from a direction in which the irradiation optical system exists during at least a part of a modeling period in which the modeling apparatus models the object.

39. The molding system of claim 37 or 38.

41. The measuring device is disposed on the placement surface of the placement member, The arrangement surface faces a direction intersecting the optical axis during at least a part of a modeling period in which the modeling apparatus models the object.

39. The molding system of claim 37 or 38.

42. The measuring device is disposed on the placement surface of the placement member, The arrangement surface faces a direction in which the irradiation optical system is present during at least a portion of a measurement period in which the measurement device measures the emitted beam.

39. The molding system of claim 37 or 38.

43. The measuring device is disposed on the placement surface of the placement member, The arrangement surface is oriented in a direction along the optical axis during at least a portion of a measurement period during which the measurement device measures the emitted beam.

39. The molding system of claim 37 or 38.

44. the measurement device includes an aperture member having an aperture formed therein, and a light receiving device that receives at least one of the emitted beams through the aperture, the opening and the light receiving device are aligned in a direction intersecting the optical axis during at least a part of a modeling period in which the modeling device models the object, During at least a portion of a measurement period during which the measurement device measures the emitted beam, the aperture and the light receiving device are aligned along the optical axis.

39. The molding system of claim 37 or 38.

45. The measurement device moves between a first position where the irradiation optical system can irradiate the emission beam and a second position where the irradiation optical system cannot irradiate the emission beam by rotating the mounting member.

39. The molding system of claim 37 or 38.

46. The measuring device moves between a first position on the optical axis and a second position away from the optical axis by rotation of the mounting member.

39. The molding system of claim 37 or 38.

47. the measurement device is located at the second position during at least a part of a modeling period during which the modeling apparatus models the object, The measurement device is positioned at the first position during at least a portion of a measurement period during which the measurement device measures the emitted beam.

46. ​​The molding system of claim 45.

48. The molding system removes the deposit adhering to the measuring device by rotating the placement member.

39. The molding system of claim 37 or 38.

49. a processing device including an irradiation optical system capable of irradiating a processing beam onto a surface of an object and capable of processing the object with the processing beam; a measuring device capable of measuring an emission beam including at least one of the processing beam and the guide beam emitted from the irradiation optical system; a control device capable of controlling the processing device based on a measurement result of the emission beam by the measurement device; Equipped with the irradiation optical system includes a moving member that moves the emission beam emitted from the irradiation optical system along a direction intersecting an optical axis of the irradiation optical system, The measurement device measures the emitted beam during at least a portion of a measurement period during which the moving member moves the irradiation position of the emitted beam on the measurement device. Processing system.

50. a processing device including a first irradiation optical system capable of irradiating a first processing beam onto a surface of an object, and a second irradiation optical system capable of irradiating a second processing beam onto the surface of the object, and capable of processing the object with at least one of the first and second processing beams; a measuring device capable of measuring each of a first exit beam including at least one of the first processing beam and a first guide beam exited from the first irradiation optical system, and a second exit beam including at least one of the second processing beam and a second guide beam exited from the second irradiation optical system; a control device capable of controlling the processing device based on at least one measurement result of the first and second emission beams by the measurement device; Equipped with the first irradiation optical system includes a first deflection member that deflects the first emission beam such that an irradiation position of the first emission beam moves along a direction intersecting an optical axis of the first irradiation optical system, The second irradiation optical system includes a second deflection member that deflects the second emission beam such that an irradiation position of the second emission beam moves along a direction intersecting an optical axis of the second irradiation optical system. Processing system.

51. a processing device including an irradiation optical system capable of irradiating a processing beam onto a surface of an object and capable of processing the object with the processing beam; a mounting member on which the object is mounted and which is rotatable about a rotation axis intersecting an optical axis of the irradiation optical system; a measuring device that is disposed on the mounting member, is rotatable around the rotation axis, and is capable of measuring an emission beam including at least one of the processing beam and a guide beam emitted from the irradiation optical system; a control device capable of controlling the processing device based on a measurement result of the emission beam by the measurement device; A processing system comprising:

52. forming a model on an object by supplying a modeling material to a molten pool formed on the object by the modeling beam using a modeling device including an irradiation optical system capable of irradiating a surface of the object with a modeling beam; measuring an emission beam including at least one of the shaping beam and the guide beam emitted from the irradiation optical system using a measurement device; moving the irradiation optical system and the measurement device relatively along a direction intersecting an optical axis of the irradiation optical system during at least a part of a modeling period in which the modeling object is modeled by the modeling apparatus; using a moving member included in the irradiation optical system, moving the emission beam emitted from the irradiation optical system along a direction intersecting an optical axis of the irradiation optical system during at least a part of the modeling period; Controlling the modeling apparatus based on a measurement result of the emission beam; Including, measuring the emission beam includes measuring the emission beam during at least a part of a measurement period during which an irradiation position of the emission beam is moved on the measurement device using the moving member and at least one of the irradiation optical system and the measurement device is moved; Controlling the modeling apparatus includes controlling the moving member during at least a part of the modeling period based on a measurement result of the emission beam during the measurement period. Modeling method.

53. Using a modeling device including a first irradiation optical system capable of irradiating a first modeling beam onto a surface of an object, and a second irradiation optical system capable of irradiating a second modeling beam onto a surface of the object, a modeling material is supplied to at least one molten pool formed by at least one of the first and second modeling beams, thereby modeling a model on the object; using a measurement device, measuring each of a first emission beam including at least one of the first shaping beam and a first guide beam emitted from the first irradiation optical system, and a second emission beam including at least one of the second shaping beam and a second guide beam emitted from the second irradiation optical system; moving an irradiation position of the first emission beam on the object or on the measurement device along a direction intersecting an optical axis of the first illumination optical system, using a first deflection member that is included in the first illumination optical system and that is capable of deflecting the first emission beam; moving an irradiation position of the second emission beam on the object or on the measurement device along a direction intersecting an optical axis of the second illumination optical system by using a second deflection member that is included in the second illumination optical system and is capable of deflecting the second emission beam; controlling the modeling apparatus based on a measurement result of at least one of the first and second emitted beams; Including, Controlling the modeling apparatus includes controlling at least one of the first deflection member and the second deflection member based on at least one of a measurement result of the first emitted beam and a measurement result of the second emitted beam by the measurement device. Modeling method.

54. forming a model on an object by supplying a modeling material to a molten pool formed on the object by the modeling beam using a modeling device including an irradiation optical system capable of irradiating a modeling beam onto a surface of the object placed on a mounting member; Measuring an emission beam including at least one of the shaping beam and the guide beam emitted from the irradiation optical system using a measurement device disposed on the mounting member; rotating the mounting member about a rotation axis intersecting an optical axis of the irradiation optical system, and rotating the measurement device about the rotation axis; Controlling the modeling apparatus based on a measurement result of the emission beam; A molding method comprising:

55. Processing an object using a processing device including an irradiation optical system capable of irradiating a processing beam onto a surface of the object; measuring an exit beam including at least one of the processing beam and the guide beam exiting from the irradiation optical system using a measurement device; using a moving member included in the irradiation optical system to move the emission beam emitted from the irradiation optical system along a direction intersecting an optical axis of the irradiation optical system; Controlling the processing device based on a measurement result of the emitted beam. Including, Measuring the emitted beam includes measuring the emitted beam during at least a portion of a measurement period during which the irradiation position of the emitted beam is moved on the measurement device using the moving member. Processing method.

56. Processing the object using a processing device including a first irradiation optical system capable of irradiating a first processing beam onto a surface of the object and a second irradiation optical system capable of irradiating a second processing beam onto the surface of the object; Measuring each of a first exit beam including at least one of the first processing beam and a first guide beam exiting from the first irradiation optical system, and a second exit beam including at least one of the second processing beam and a second guide beam exiting from the second irradiation optical system; moving an irradiation position of the first emission beam along a direction intersecting an optical axis of the first irradiation optical system by using a first deflection member that is included in the first irradiation optical system and is capable of deflecting the first emission beam; moving an irradiation position of the second emission beam along a direction intersecting an optical axis of the second irradiation optical system by using a second deflection member that is included in the second irradiation optical system and is capable of deflecting the second emission beam; controlling the processing device based on a measurement result of at least one of the first and second emitted beams; A processing method comprising the steps of:

57. Processing the object by using a processing device including an irradiation optical system capable of irradiating a processing beam onto a surface of the object placed on a placement member; measuring an emission beam including at least one of the processing beam and the guide beam emitted from the irradiation optical system using a measurement device disposed on the mounting member; rotating the mounting member about a rotation axis intersecting an optical axis of the irradiation optical system, and rotating the measurement device about the rotation axis; Controlling the processing device based on a measurement result of the emitted beam. A processing method comprising the steps of: