Transfer device and transfer method

Abstract

The present invention is a transfer device for transferring an object provided on a starting substrate from the starting substrate to a destination substrate using a laser, the transfer device comprising: a laser light source configured to oscillate a laser; a first optical system; a second optical system having a different optical configuration from the optical configuration of the first optical system; and a switching mechanism configured to switch the optical path of the laser between the optical path to the first optical system and the optical path to the second optical system. The first optical system is configured to transfer the object to the destination substrate surface by sequentially irradiating the laser from the back side of the starting substrate, and the second optical system is configured to remove the object from the starting substrate or to transfer the object to the destination substrate surface by selectively irradiating the laser from the back side of the starting substrate. This makes is possible to provide a transfer device that can transfer the object with a minimal footprint and capital investment, and with high productivity.

Description

Transfer device and transfer method

[0001] The present invention relates to a transfer device and a transfer method.

[0002] With the commercialization of high-brightness blue light-emitting diodes, the three primary colors of light are now available, and light-emitting diodes (hereinafter referred to as LEDs) are now used in a wide variety of fields.Their applications are countless, from television and computer displays and monitors to large displays such as street-corner digital signage and large screens at live music venues, and even small displays such as those used in smartwatches.

[0003] In the mass production process of displays, a technique is used in which LED chips formed on a starting substrate are transferred to a circuit board. Figures 12 to 14 show a portion of an example of a manufacturing flow for an LED chip-mounted device, including the transfer step. However, the manufacturing flow to which the transfer device and transfer method of the present invention are applied is not limited to the manufacturing flow shown in Figures 12 to 14.

[0004] 12A, a starting substrate, for example, a sapphire substrate 110, is prepared. On the surface of the sapphire substrate 110, a plurality of LED chips 6, which are the objects to be transferred, are provided.

[0005] When the plurality of LED chips 6 includes a defective LED chip 6D, as shown in FIG. 12(b), a laser beam L transmitted through the sapphire substrate 110 is incident on the interface between the defective LED chip 6D and the sapphire substrate 110. ｔ The laser light source 3 irradiates the rear surface of the sapphire substrate 110 (the rear surface opposite to the surface on which the LED chips 6 are provided) to peel off and remove the defective LED chips 6 from the sapphire substrate 110. This process can be called, for example, a trimming process. Note that if there are no defective LED chips 6D, this trimming process can be omitted.

[0006] Next, a first intermediate substrate 210, which is a target substrate shown in Fig. 12(c), is prepared. The first intermediate substrate 210 has an adhesive layer 211 on its surface. This first intermediate substrate 210 and the sapphire substrate 110, which has been subjected to a trimming process as necessary, are placed face to face with the LED chip 6 and adhesive layer 211. In this state, a laser beam L is emitted from the laser light source 3 to the rear surface of the sapphire substrate 110. Ｌ The laser irradiation is performed while the laser light source 3, the sapphire substrate 110, and the first intermediate substrate 210 are moved relative to each other. This allows the plurality of LED chips 6 to be sequentially irradiated. As a result, the plurality of LED chips 6 are irradiated with the laser L from the sapphire substrate 110 to the first intermediate substrate 210. Ｌ This process can be called, for example, a laser lift-off process.

[0007] Ga may remain on the surface of each of the LED chips 6 transferred to the first intermediate substrate 210. Therefore, Ga cleaning is performed in a cleaning layer 60, as shown in FIG.

[0008] Next, a second intermediate substrate (release substrate) 120 is prepared, as shown in the lower right of FIG. 13( e). The second intermediate substrate 120 has an adhesive layer 121 on its surface. The first intermediate substrate 210 and the second intermediate substrate 120 are bonded together so that the LED chips 6 contact the adhesive layer 121 of the second intermediate substrate 120 to form a composite 300. This composite 300 is then pressed vertically using a transfer device 20 shown in the upper left of FIG. 13( e). Next, as shown in the lower right of FIG. 13( e), the first intermediate substrate 210 is peeled off while the second intermediate substrate 120 is held down by a holding device 30. This completes the transfer of the LED chips 6 from the first intermediate substrate 210 to the second intermediate substrate 120. This process can be referred to as a chip transfer process.

[0009] If there is a defective LED chip 6D among the LED chips 6 transferred onto the second intermediate substrate 120, the defective LED chip 6D is removed as shown in FIG. 13( f). This step can be performed in the same manner as the trimming step shown in FIG. 12( b). Therefore, this step can also be called a trimming step. Of course, if there is no defective LED chip 6D on the second intermediate substrate 120, this trimming step can be omitted.

[0010] Next, as shown in FIG. 13( g ), the LED chip 6 on the second intermediate substrate 120 as the starting substrate is bonded to the finished substrate 220 (having an adhesive layer 221 on the surface) as the destination substrate by laser L. Ｍ This step can also be called a transfer step.

[0011] The completed substrate 220 may be in the form of a wafer as shown in the lower left of Fig. 13(g) or in the form of a rectangle as shown in the lower right. In this transfer process, the multiple LED chips 6 can be transferred at various pitches.

[0012] If the completed substrate 220 obtained after the transfer process is missing an LED chip 6 (for example, a portion where the LED chip 6 removed in the trimming process was to be transferred), as shown in Fig. 13(h), a replacement chip 6R can be added from a repair substrate 130 having a normal replacement chip 6R as the starting substrate to the missing LED chip portion of the completed substrate 220 as the destination substrate. This process can also be called a repair process.

[0013] Next, as shown in FIG. 14( i ), a mounter 400 is used to transfer a plurality of LED chips 6 from the completed substrate 220 obtained as described above onto a circuit substrate 230 .

[0014] Then, as shown in FIG. 14( j ), the circuit board 230 is subjected to a reflow process in a reflow device 40 , whereby the electrodes of the circuit board 230 and the LED chips 6 can be bonded together.

[0015] In the trimming process, laser lift-off process, and repair process, a laser is irradiated onto a portion of the LED chip to ablate it, or a laser is irradiated onto the interface between the starting substrate and the LED chip to ablate the adhesive layer, thereby separating the starting substrate from the LED chip. For example, Patent Document 1 describes the use of a line beam when transferring multiple chips. Furthermore, Patent Document 2 discloses a technology in which a galvanometer scanner is used to irradiate a specific irradiation target with laser light in a retransfer method and a lift-off method.

[0016] JP 2021-61396 A Patent No. 7111916

[0017] Conventionally, the trimming process, laser lift-off process, transfer process, and repair process have required different laser devices to be performed, because the beam energy and beam shape of the irradiated laser, as well as the laser irradiation method, are different for each process.

[0018] Laser devices are generally large-scale and expensive, so conventional manufacturing of LED-equipped devices using the above flow requires a large footprint and a large capital investment for equipment for transferring LED chips.

[0019] Furthermore, if one workpiece is moved between a plurality of laser devices, it becomes necessary to remove and mount the substrate and adjust the alignment of the optical system each time the workpiece is moved, which reduces productivity.

[0020] The present invention has been made to solve the above problems, and an object of the present invention is to provide a transfer device and a transfer method that can transfer objects with a minimum footprint and equipment investment, and with high productivity.

[0021] In order to solve the above problems, the present invention provides, as a first aspect, a transfer device for transferring an object provided on a starting substrate from the starting substrate to a destination substrate using a laser, comprising: a laser light source configured to oscillate the laser; a first optical system; a second optical system having an optical configuration different from the optical configuration of the first optical system; and a switching mechanism configured to switch the optical path of the laser between an optical path to the first optical system and an optical path to the second optical system, wherein the first optical system is configured to transfer the object to the destination substrate surface by sequentially irradiating the laser from the back side of the starting substrate, and the second optical system is configured to remove the object from the starting substrate or transfer the object to the destination substrate surface by selectively irradiating the laser from the back side of the starting substrate.

[0022] With this type of transfer device, all or part of the trimming process, laser lift-off process, transfer process, and repair process can be performed in one device. Therefore, if the laser processing process is performed on the same starting substrate, removing and mounting the starting substrate and adjusting the alignment, i.e., changeover, is not required, and the object can be transferred with high productivity. Furthermore, because this single transfer device can perform all or part of the trimming process, laser lift-off process, transfer process, and repair process, both the footprint and capital investment can be reduced.

[0023] In addition, the present invention provides, as a second aspect, a transfer device for transferring objects provided on a starting substrate from the starting substrate to a destination substrate using a laser, comprising: a laser light source configured to oscillate the laser; a first optical system; a second optical system having an optical configuration different from the optical configuration of the first optical system; and a switching mechanism configured to switch the optical path of the laser between an optical path to the first optical system and an optical path to the second optical system, wherein the first optical system is configured to simultaneously transfer the multiple objects to the destination substrate surface by simultaneously irradiating the laser onto the multiple objects from the back side of the starting substrate, and the second optical system is configured to remove the single object from the starting substrate or transfer the single object to the destination substrate surface by irradiating the laser onto one object from the back side of the starting substrate.

[0024] This type of transfer device can also perform all or part of the trimming process, laser lift-off process, transfer process, and repair process in a single device. This reduces both the footprint and capital investment. Furthermore, if the laser processing process is performed on the same starting substrate, there is no need to change the substrate setup, allowing for highly productive transfer of the target object.

[0025] For example, the switching mechanism may include a mirror.

[0026] In either of the first and second aspects, the switching mechanism may include, for example, a mirror.

[0027] The switching mechanism may also include: a first stage configured to hold at least the starting substrate; and a moving mechanism configured to move the first stage between the first optical system and the second optical system in accordance with the change in the optical path of the laser.

[0028] With such a switching mechanism, the laser transfer process using the same starting substrate for the first optical system and the second optical system can be carried out without removing and attaching the substrate, thereby further increasing productivity.

[0029] Alternatively, the system may further include a first stage configured to hold the starting substrate, a second stage configured to hold a destination substrate facing the first stage, and a projection lens configured to image the laser, wherein the switching mechanism includes a moving mechanism configured to move the first stage, the second stage, and the projection lens between the first optical system and the second optical system in accordance with the change in the optical path of the laser.

[0030] Even in this modified example, the transfer process using the same starting substrate in the first optical system and the second optical system can be performed without changing the starting substrate setup, thereby further improving productivity.

[0031] The laser may further include a mask having a pattern for forming the laser irradiation shape into a line beam so as to irradiate a plurality of the objects, and a pattern for shaping the laser irradiation shape so as to irradiate a single object.

[0032] With such an apparatus, for example, the laser lift-off and transport steps can be performed using a line beam in a first optical system, and the trimming and repair steps can be performed by irradiating a laser onto one object in a second optical system.

[0033] For example, the second optical system may include a galvanometer scanner as a means for selectively irradiating the laser onto the starting substrate or the object supported on the starting substrate, or for selectively irradiating the laser onto the starting substrate or the object from the back side of the starting substrate.

[0034] The second optical system may include, for example, a galvanometer scanner.

[0035] Alternatively, the first optical system may further include a mask having a pattern for shaping the laser irradiation shape into a line-shaped beam so as to irradiate multiple objects simultaneously, and the second optical system may further include a mask having a pattern for shaping the laser irradiation shape so as to irradiate each object with a shape that individually corresponds to each object.

[0036] Thus, the first optical system and the second optical system may each include a mask.

[0037] The present invention also provides a transfer method for transferring a plurality of objects from a starting substrate to a destination substrate using a laser, comprising: a starting substrate preparation step of preparing a starting substrate having the plurality of objects; a destination substrate preparation step of preparing a destination substrate to which the plurality of objects are to be transferred; an apparatus preparation step of preparing a transfer device having a laser light source configured to oscillate the laser, a first optical system, and a second optical system; a trimming step of determining in advance whether the plurality of objects on the starting substrate include any defective objects, and if any defective objects are included, selectively removing the defective objects by the laser passing through the second optical system; and a transfer step of transferring the plurality of objects from the starting substrate to the destination substrate by the laser passing through the first optical system, wherein the steps from the trimming step to the transfer step are performed in a single operation without changing the starting substrate.

[0038] This transfer method allows the trimming process and transfer process to be performed in a single transfer device. Therefore, if the laser transfer process is performed on the same starting substrate, there is no need to remove and install the substrate, allowing for highly productive transfer of the target object. Furthermore, because this transfer method can be performed using a single device, it is possible to reduce both the footprint and capital investment.

[0039] The transfer method of the present invention can further include, for example, a step of determining in advance whether the destination substrate contains any missing portions of the objects, and if any missing portions of the objects are present, a repair step of selectively irradiating the laser onto the objects on the starting substrate through the second optical system to transfer the objects to the missing portions of the objects after the transfer step of transferring the plurality of objects from the starting substrate to the destination substrate using the laser through the first optical system, and the steps from the transfer step to the repair step can be performed in a single operation without changing the starting substrate.

[0040] In this way, the transfer method of the present invention can further include a repair step, and even if the repair step is included, it can be performed using a single device.

[0041] For example, the transfer step may include: a laser lift-off step of transferring the object from the starting substrate to a first intermediate substrate placed on a second stage as the destination substrate by irradiating the laser onto the object through a base material of a chip supply substrate on the surface of which the object is formed, the chip supply substrate being placed on a first stage as the starting substrate, thereby decomposing a portion of the object; and a transfer step of transferring the object from the second intermediate substrate placed on the first stage as the starting substrate to a completed substrate placed on the second stage as the destination substrate by irradiating the laser onto an adhesive layer formed between the second intermediate substrate and the object through the second intermediate substrate, thereby ablating the adhesive layer, wherein the second intermediate substrate includes the adhesive layer. The transfer method of the present invention may further include a step of transferring the object from the first intermediate substrate to the second intermediate substrate between the laser lift-off step and the transfer step.

[0042] In the transfer method of the present invention, the transfer step can further include the transfer step and the handing over step.

[0043] As described above, with the transfer device of the present invention, whether in the first or second aspect, all or some of the trimming process, laser lift-off process, transfer process, and repair process can be performed in one unit, resulting in high productivity in transferring objects. Furthermore, because all or some of the trimming process, laser lift-off process, transfer process, and repair process can be performed in one unit of the transfer device of the present invention, both the footprint and capital investment can be reduced.

[0044] Furthermore, with the transfer method of the present invention, the trimming process and the transfer process can be performed in a single transfer device. Therefore, with the transfer method of the present invention, the object can be transferred with high productivity. Furthermore, since the processes can be performed with a single device, both the footprint and capital investment can be reduced.

[0045] FIG. 1 is a schematic diagram showing an example of a transfer device of the present invention. FIG. 1 is a diagram explaining an example of a first optical system in a first embodiment of the transfer device of the present invention. FIG. 1 is a diagram explaining an example of a first optical system in a second embodiment of the transfer device of the present invention. FIG. 2 is a diagram explaining another example of the first optical system in the second embodiment of the transfer device of the present invention. FIG. 3 is a diagram explaining an example of a second optical system in the first embodiment of the transfer device of the present invention. FIG. 4 is another diagram explaining an example of the second optical system in the first embodiment of the transfer device of the present invention. FIG. 5 is a schematic diagram showing another example of the transfer device of the present invention. FIG. 6 is a diagram explaining alignment in a gap laser lift-off process, a transfer process, and a repair process that can be performed by the transfer device of the present invention. FIG. 7 is a diagram explaining alignment in a trimming process that can be performed by the transfer device of the present invention. FIG. 8 is a diagram explaining alignment in a contact laser lift-off process that can be performed by the transfer device of the present invention. FIG. 9 is a part of a manufacturing flow diagram of an example of an LED chip-mounted device, continuing from FIG. 12 . FIG. 11 is a part of a manufacturing flow diagram of an example of an LED chip-mounted device, continuing from FIG. 13 .

[0046] As described above, there has been a need to develop a transfer device and a transfer method that can transfer objects with a minimal footprint and capital investment, and with high productivity.

[0047] As a result of extensive research into the above-mentioned problems, the inventors discovered that if the laser lift-off process and the transfer process are performed using the same first optical system, and the trimming process and the repair process are performed using the same second optical system, and if a transfer device is provided that is equipped with the first optical system, the second optical system, and a switching mechanism configured to switch the optical path of the laser from the laser light source between the optical path to the first optical system and the optical path to the second optical system, it is possible to transfer objects with a minimum footprint and capital investment, and with high productivity, and thus completed the present invention.

[0048] That is, the present invention is a transfer device for transferring an object provided on a starting substrate from the starting substrate to a destination substrate using a laser, the transfer device comprising: a laser light source configured to oscillate the laser; a first optical system; a second optical system having an optical configuration different from the optical configuration of the first optical system; and a switching mechanism configured to switch the optical path of the laser between an optical path to the first optical system and an optical path to the second optical system, wherein the first optical system is configured to transfer the object to the destination substrate surface by sequentially irradiating the laser from the back surface side of the starting substrate, and the second optical system is configured to remove the object from the starting substrate or transfer the object to the destination substrate surface by selectively irradiating the laser from the back surface side of the starting substrate.

[0049] The present invention also provides a transfer device for transferring objects provided on a starting substrate from the starting substrate to a destination substrate using a laser, the transfer device comprising: a laser light source configured to oscillate the laser; a first optical system; a second optical system having an optical configuration different from the optical configuration of the first optical system; and a switching mechanism configured to switch the optical path of the laser between an optical path to the first optical system and an optical path to the second optical system, wherein the first optical system is configured to simultaneously transfer the multiple objects to the destination substrate surface by simultaneously irradiating the laser onto the multiple objects from the back surface side of the starting substrate, and the second optical system is configured to remove the single object from the starting substrate or transfer the single object to the destination substrate surface by irradiating the laser onto one object from the back surface side of the starting substrate.

[0050] The present invention also provides a transfer method for transferring a plurality of objects from a starting substrate to a destination substrate using a laser, comprising: a starting substrate preparation step of preparing a starting substrate having the plurality of objects; a destination substrate preparation step of preparing a destination substrate to which the plurality of objects are to be transferred; an apparatus preparation step of preparing a transfer device having a laser light source configured to oscillate the laser, a first optical system, and a second optical system; a trimming step of determining in advance whether the plurality of objects on the starting substrate include any defective objects, and if any defective objects are included, selectively removing the defective objects with the laser passed through the second optical system; and a transfer step of transferring the plurality of objects from the starting substrate to the destination substrate with the laser passed through the first optical system, wherein the steps from the trimming step to the transfer step are performed in a single operation without changing the starting substrate.

[0051] The present invention will be described in detail below, but the present invention is not limited thereto.

[0052] [Transfer Apparatus] An example of a transfer apparatus of the present invention is shown schematically in Fig. 1. The transfer apparatus 10 shown in Fig. 1 is a transfer apparatus for transferring an object provided on a starting substrate from the starting substrate to a destination substrate using a laser.

[0053] The transfer device 10 includes a laser light source 3 , a first optical system 1 , a second optical system 2 , and a switching mechanism 4 .

[0054] The laser light source 3 is configured to emit a laser. The type of the laser light source 3 is not particularly limited, but may be, for example, an excimer laser.

[0055] In the first embodiment, the first optical system 1 includes a laser L Ｌ The first optical system 1A is configured to sequentially irradiate the starting substrate 100 from the rear side thereof with laser beams L , ... Ｌ The laser beam L is guided to the target 6 formed on the starting substrate 100. Ｌ This can be done by moving (scanning) the starting substrate 100 so that the light is sequentially irradiated. At this time, as shown in Fig. 2, the starting substrate 100 and the target substrate 200 can also be moved relative to the movement of the optical path. Also, as shown in Fig. 2, by making the moving speed of the starting substrate 100 and the moving speed of the target substrate 200 different, it is possible to arrange the objects 6 on the target substrate 200 at a pitch that differs from the pitch of the objects 6 provided on the starting substrate 100.

[0056] In a second embodiment, the first optical system 1 includes a laser L Ｌ The first optical system 1A' is configured to simultaneously irradiate a plurality of objects 6 from the rear side of the starting substrate 100 with a laser beam L having a line-shaped irradiation shape, thereby simultaneously transferring a plurality of objects 6 to the surface of the destination substrate 200. Ｌ 4 is an example in which a laser beam L having a rectangular irradiation shape is irradiated onto a plurality of objects 6 (1×m (m>2)) arranged in a line. ＬIn this example, the light is irradiated onto a plurality of objects 6 (n×m (n>2, m>2)) arranged in a plurality of columns and a plurality of rows. The irradiation shape can be appropriately changed, for example, by using a mask, which will be described later.

[0057] In both the first and second embodiments, the first optical system 1 can perform both the laser lift-off process and the transfer process described above.

[0058] The second optical system 2 shown in FIG. 1 has a different optical configuration from the first optical system.

[0059] In the first embodiment, the second optical system 2 includes a laser L Ｔ or L Ｒ The second optical system 2B is configured to selectively irradiate the light from the back side of the starting substrate 100, thereby removing an object (defective object) 6D from the starting substrate 100 (i.e., performing a trimming process) or transferring an object (replenishment chip) 6R to the surface of the destination substrate 200 (i.e., performing a repair process), as shown in FIG. 5 .

[0060] In a second embodiment, which is another aspect, a laser L Ｔ or L Ｒ The second optical system 2B' is configured to irradiate one object 6D or 6R from the back side of the starting substrate 100 with light, thereby removing one object (defective object) 6D from the starting substrate 100 (i.e., performing a trimming process) or transferring one object (supplement chip) 6R to the surface of the destination substrate 200.

[0061] The switching mechanism 4 shown in FIG. 1 is configured to switch the optical path L of the laser between an optical path L1 to the first optical system 1 and an optical path L2 to the second optical system 2.

[0062] 1 , the switching mechanism 4 includes a controller 41 and a mirror 42 electrically connected to the controller 41. The controller 41 is configured to move the mirror 42 to switch the optical path L of the laser between an optical path L1 to the first optical system 1 and an optical path L2 to the second optical system 2.

[0063] 1 further includes an optional homogenizer 5. The homogenizer 5 is configured to homogenize the intensity distribution of the laser emitted from the laser light source 3.

[0064] 1 further includes a mirror M in addition to a plurality of mirrors, for example, the mirror 42 of the switching mechanism 4. The plurality of mirrors 42 and M play a role in aligning the optical path of the laser.

[0065] With the transfer device 10 of the present invention described above, the laser lift-off process and the transfer process can be performed using the same first optical system 1, and the trimming process and the repair process can be performed using the same second optical system 2. Furthermore, the transfer device 10 is equipped with a switching mechanism 4 configured to switch the optical path L of the laser from the laser light source 3 between the optical path L1 to the first optical system 1 and the optical path L2 to the second optical system 2, so that the trimming process, laser lift-off process, transfer process, and repair process can be performed using a single transfer device 10.

[0066] Furthermore, in conventional systems for each individual function, for example, after a trimming process, the starting substrate is temporarily removed, moved to a laser lift-off device, and loaded there, where the laser lift-off process is performed. The same applies to the transfer process and the trimming process that precedes it. In this case, the starting substrate is temporarily removed from the trimming process, loaded into the laser lift-off device or transfer device, and alignment is performed to determine the laser irradiation target, before the laser lift-off or transfer process is performed. This series of operations not only reduces productivity, but can also cause variations between processes depending on the accuracy of the alignment adjustment.

[0067] By using the transfer device 10 of the present invention, the laser lift-off process and the preceding trimming process, which use the same starting substrate 100, can be performed in a single operation by simply switching the optical path, without changing the setup of the starting substrate. Similarly, because the same starting substrate 100 is used in the transfer process and the preceding trimming process, they can be performed in a single operation by simply switching the optical path, without changing the setup of the starting substrate 100. Therefore, at least between the laser lift-off process and the preceding trimming process, and between the transfer process and the preceding trimming process, there is no need to remove, move, or mount or align the starting substrate 100. As a result, it is possible to suppress a decrease in productivity and prevent variations between processes due to alignment accuracy.

[0068] The transfer device 10 of the present invention can perform, in one device, the functions previously performed by four devices with different laser beam energy densities, beam energies, beam shapes, and irradiation methods, and further eliminates the need for multiple devices to each have their own laser light source, enabling efficient use of laser energy, thereby minimizing footprint and capital investment.

[0069] That is, the transfer device 10 of the present invention can transfer the object 100 with a minimal footprint and capital investment, and with high productivity.

[0070] Furthermore, maintenance costs can be reduced compared to when four devices are used.

[0071] The transfer device 10 of the present invention is not obtained by simply combining four conventional devices, but is configured as a first optical system 1 capable of performing two processes, namely, a laser lift-off process and a transfer process, and a second optical system 2 capable of performing two processes, namely, a trimming process and a repair process, and is further equipped with a switching mechanism 4 that switches the optical path between these optical systems. This was only possible based on the inventors' discovery that by doing so, it is no longer necessary to perform setup changes such as removing and moving the starting substrate 100, or mounting and aligning the starting substrate 100, between the laser lift-off process and the preceding trimming process, and between the transfer process and the preceding trimming process.

[0072] The transfer device 10 of the present invention can have various configurations and can include additional components, such as a mask, a first stage for holding at least the starting substrate 100, a second stage for the destination substrate 200, a projection lens, and a movement mechanism.

[0073] FIG. 7 shows one embodiment of a transfer device 10 of the present invention.

[0074] In the transfer device 10 shown in Fig. 7, the first optical system 1 includes an optical path 11 and a mask 12. The mask 12 is Ｌ The irradiation shape of the light beam is, for example, a linear beam as shown in FIG. 3, and the pattern is formed so that the light beam can be irradiated onto a plurality of objects 6 simultaneously.

[0075] 7, the second optical system 2 includes an optical path 21, an AP 22, a galvanometer scanner (scanner) 23, and a mask 24. The AP 22 is an aperture for forming a laser beam of a size that allows the scanner 23 to operate properly. The galvanometer scanner 23 is a laser L Ｔ or L Ｒ or a laser L Ｔ or L ＲThe mask 24 is a means for selectively irradiating the laser L onto the starting substrate 100 or the object 6D or 6R from the rear side of the starting substrate 100. Ｔ or L Ｒ The irradiation pattern has a shape that is shaped so that the irradiation shape of the target object 6D or 6R is irradiated in a shape that corresponds to the target object 6D or 6R, respectively.

[0076] The transfer device 10 shown in FIG. 7 further includes a stage 7 , a projection lens 8 and a moving mechanism 43 .

[0077] The stage 7 comprises a first stage configured to hold at least the starting substrate 100, which will be described in detail later, and a second stage configured to hold the target substrate 200 opposite the first stage.

[0078] The projection lens 8 is configured to focus the laser on the irradiation target of the starting substrate 100 on the stage 7 .

[0079] The moving mechanism 43 is part of the switching mechanism 4 and is configured to move the stage 7 (e.g., the first stage and the second stage) and the projection lens 8 between the first optical system 1 and the second optical system 2 in accordance with changes in the optical path of the laser.

[0080] The projection lens 8 may be provided in each of the first optical system 1 and the second optical system 2. The movement mechanism 43 may not move the second stage for the target substrate 200. In such a case, the switching mechanism 4 includes the first stage, and the movement mechanism 43 can be said to be configured to move the first stage between the first optical system 1 and the second optical system 2 in accordance with the change in the optical path of the laser.

[0081] When the moving mechanism 43 is configured to move the second stage, the second stage is also part of the switching mechanism 4 .

[0082] The moving mechanism 43 can move the first stage, or the first and second stages, as needed within the same plane. Therefore, by providing such a moving mechanism 43, the arrangement of the multiple objects within the same plane after transfer can be changed as desired.

[0083] Fig. 8 shows another embodiment of the transfer device 10 of the present invention. The transfer device 10 shown in Fig. 8 differs from the transfer device 10 shown in Fig. 7 in that the first optical system 1 and the second optical system 2 share the mask 9.

[0084] The mask 9 is Ｌ 3, for example, a line beam as shown in FIG. 3, and a pattern in which the laser beam is shaped so as to be irradiated simultaneously onto a plurality of objects 6; Ｔ or L Ｒ and a pattern for shaping the irradiation shape of the light beam so as to irradiate the target object 6D or 6R in a shape corresponding thereto, respectively.

[0085] The switching mechanism 4 is not limited to the above-described example. For example, it may be configured to switch between the first optical system 1 and the second optical system 2 and insert it between the optical path L from the laser light source 3, the stage 7, and the projection lens 8 while the optical path L from the laser light source 3, the stage 7, and the projection lens 8 are fixed linearly.

[0086] [Alignment of Optical System] Next, alignment of the optical system in each of the laser lift-off process, trimming process, transfer process, and repair process will be described.

[0087] Laser lift-off is broadly classified into contact laser lift-off (Contact LLO), which is performed in a state where the starting substrate 100 and the target substrate 200 are in contact with each other with the object 6 sandwiched therebetween, and gap laser lift-off (Gap LLO), which is performed in a state where the starting substrate 100 and the target substrate 200 are opposed to each other with a space therebetween.

[0088] FIG. 9 shows an example of alignment used in the gap laser lift-off process, transfer process, and repair process.

[0089] In the gap laser lift-off process (see the previous description of FIG. 12( c ) for details), a starting substrate 100, for example a sapphire substrate 110, is held on a first stage 71. A first intermediate substrate 210, for example a target substrate 200, is held on a second stage 72. A space is provided between the sapphire substrate 110 and the first intermediate substrate 210.

[0090] The first stage 71 is a laser L Ｌ The sapphire substrate 110 has an opening so that the light can be irradiated onto the rear surface of the sapphire substrate 110 .

[0091] The projection lens 8 is disposed above the first stage 71 .

[0092] In the case of the transfer process (see the previous explanation for Figure 13 (g) for details), the alignment is the same as that for the gap laser lift-off process, except that the first stage 71 holds the second intermediate substrate 120 as the starting substrate 100, and the second stage 72 holds the finished substrate 220 as the target substrate 200.

[0093] The repair process (see the previous explanation for Figure 14(h) for details) is similar to the alignment for the gap laser lift-off process, except that the first stage 71 holds the repair substrate 130 as the starting substrate 100, and the second stage 72 holds the finished substrate 220 as the target substrate 200.

[0094] After the transfer step, the untransferred objects 6 remain on the starting substrate 100 (second intermediate substrate 120), as shown on the right side of each of Figures 3 and 4. This starting substrate 100 having the untransferred remaining objects 6 (excess objects) can also be used as a repair substrate 130 in the repair step.

[0095] The transfer process (which can also be called a mass transfer process) is a process that is relatively close to the final step in the transfer process (chip alignment process), but if a defective target object (LED) 6D is removed in the laser lift-off process or the trimming process before the transfer process, a chip defect will occur in the completed substrate 300 obtained after the transfer process. The repair process fills this defect with a single chip 6R.

[0096] At this time, the replenishment chips 6R are replenished from the repair substrate, but because the transfer device and the repair device have different optical systems, they have conventionally been configured as separate devices. In this case, the object 6 supplied in the transfer process and the replenishment chips 6R replenished in the repair process are supplied from different substrates. In such a case, the object 6 supplied in the transfer process and the replenishment chips 6R replenished in the repair process are from different chip production lots, which can cause unevenness such as partial light emission.

[0097] On the other hand, in the repair process, the chip utilization efficiency is high by replenishing the surplus objects 6R remaining after the transfer process, and since the objects 6 transferred in the transfer process and the replenishing chips 6R replenishing in the repair process are from the same lot, and these optical systems use lasers from the same light source, it is possible to form uniformly aligned chips across the entire surface.

[0098] FIG. 10 shows an example of alignment used in the trimming step before the laser lift-off step and the trimming step before the transfer step.

[0099] In the trimming step (see the description of FIG. 12B for details) before the laser lift-off step, a sapphire substrate 110 , for example, is held on the first stage 71 as the starting substrate 100 .

[0100] In the trimming step (see the description of FIG. 13( f ) for details) before the transfer step, the first stage 71 holds the second intermediate substrate 120 as the starting substrate 100 .

[0101] In addition to the above, the alignment is the same as that shown in FIG. 9, except that the second stage is not used.

[0102] FIG. 11 is an example of alignment used in a contact laser lift-off process.

[0103] The alignment shown in Figure 11 is similar to the alignment for the gap laser lift-off process shown in Figure 9, except that the starting substrate 100 and the target substrate 200 are in contact with each other with the object 6 sandwiched between them, and that a first stage 71 supports the starting substrate 100 and the target substrate 200, and there is no second stage.

[0104] 9 to 11, the alignment for the laser lift-off step and the alignment for the preceding trimming step use the same sapphire substrate 110 as the starting substrate 100. Therefore, by using the transfer device 10 of the present invention, the trimming step prior to the laser lift-off step and the laser lift-off step can be performed in a single operation without changing the starting substrate 100.

[0105] Furthermore, the same second intermediate substrate 120 is used as the starting substrate 100 for the alignment in the transfer process and the alignment in the preceding trimming process. Therefore, by using the transfer device 10 of the present invention, the trimming process before the transfer process and the transfer process can be performed in a single operation without changing the setup of the starting substrate 100. Furthermore, by using the second intermediate substrate 120 used in the transfer process as the repair substrate 130, which is the starting substrate 100, in the repair process, the trimming process before the transfer process, the transfer process, and the repair process can be performed in a single operation without changing the setup of the starting substrate 100.

[0106] [Transfer Method] Next, the transfer method of the present invention will be described. Note that the transfer method of the present invention can be applied to the manufacturing flow of the LED-equipped device described with reference to Figures 12 to 14, and therefore will be described with reference again to parts of Figures 12 to 14. However, the transfer method of the present invention can also be applied to manufacturing flows other than the example manufacturing flow shown in Figures 12 to 14.

[0107] The transfer method of the present invention is a transfer method that uses a laser to transfer multiple objects 6 from a starting substrate (e.g., a sapphire substrate 110 shown in FIG. 12(a) or a second intermediate substrate 120 shown in FIG. 12(g)) to a destination substrate (e.g., a first intermediate substrate 210 shown in FIG. 12(c) or a finished substrate 220 shown in FIG. 13(g)).

[0108] First, a starting substrate (for example, the sapphire substrate 110 shown in FIG. 12(a) or the second intermediate substrate 120 shown in FIG. 12(c)) having a plurality of objects 6 thereon is prepared (starting substrate preparation step).

[0109] Meanwhile, a destination substrate (for example, the first intermediate substrate 210 shown in FIG. 12(c) or the finished substrate 220 shown in FIG. 13(g)) onto which the plurality of objects 6 are to be transferred is prepared (destination substrate preparation step).

[0110] Also, a transfer device 10 shown in FIG. 1 is prepared, which includes a laser light source 3 configured to oscillate a laser, a first optical system 1, and a second optical system 2 (device preparation step).

[0111] Next, as shown in FIG. 12(b) or FIG. 13(f), it is determined in advance whether or not a defective object 6D is included among the plurality of objects 6 on the starting substrate (for example, the sapphire substrate 110 or the second intermediate substrate 120), and if a defective object 6D is included, the laser L Ｔ In this way, defective objects 6 are selectively removed (trimming step).

[0112] Then, as shown in FIG. 12(c) or FIG. 13(g), the plurality of objects 6 are irradiated with a laser beam L through the first optical system 1 from the starting substrate (for example, the sapphire substrate 110 or the second intermediate substrate 120) to the destination substrate (for example, the first intermediate substrate 210 or the finished substrate 220). Ｌ or L Ｍ (transfer step (laser lift-off step or transfer step)).

[0113] In the transfer method of the present invention, the steps from the trimming step to the transfer step are performed in a single operation without changing the setup of the starting substrate. Specifically, the laser lift-off step and the preceding trimming step are performed in a single operation without changing the setup of the starting substrate, sapphire substrate 110. Furthermore, the transfer step and the preceding trimming step are performed in a single operation without changing the setup of the starting substrate, sapphire substrate 110, or second intermediate substrate 120.

[0114] In the transfer method of the present invention, at least between the laser lift-off process and the preceding trimming process, and between the transfer process and the preceding trimming process, it is possible to suppress a decrease in productivity due to the changeover of the starting substrate, and to prevent variations between processes due to alignment accuracy.

[0115] The transfer method of the present invention allows one device to perform the functions that previously required four devices, and furthermore, it eliminates the need for multiple devices to each have their own laser light source, enabling efficient use of laser energy, thereby minimizing the footprint and capital investment.

[0116] In the transfer method of the present invention, it is determined in advance whether or not there is a missing portion of the object 6 on the destination substrate (for example, the finished substrate 220), and if there is a missing portion of the object 6, the plurality of objects 6 are transferred from the starting substrate (for example, the second intermediate substrate) to the destination substrate (for example, the finished substrate 220) by using a laser L through the first optical system 1. Ｍ After the transfer step (FIG. 13(g)) of transferring the target 6R of the starting substrate (for example, the repair substrate 130 shown in FIG. 14(h)), the laser L is selectively applied to the target 6R of the starting substrate (for example, the repair substrate 130 shown in FIG. 14(h)) through the second optical system 2. Ｒ The method may further include a repair step (FIG. 14(h)) of irradiating the target 6 with light and transferring the target (replenishment tip 6R) to the damaged portion of the target 6. Furthermore, by using the second intermediate substrate 120 after the transfer step as the repair substrate 130, it is possible to perform the transfer step of FIG. 13(g) to the repair step of FIG. 14(h) in a single operation without changing the setup of the starting substrate (second intermediate substrate 120).

[0117] More specifically, the transfer step involves the alignment described with reference to FIG. Ｌ 12(c) is a laser lift-off process in which the object 6 is transferred from the starting substrate to the first intermediate substrate 210 placed on the second stage 72 as a destination substrate by irradiating the laser beam onto the object 6 through the base material of the chip supply substrate (sapphire substrate 110) on the surface of which the object 6 is formed and which is placed on the first stage 71 as a starting substrate, thereby decomposing a part of the object 6. Ｍ The method may include a transfer process (FIG. 13(g)) in which the target object 6 is transferred from the second intermediate substrate 120 to a completed substrate 220 placed on the second stage 72 as a destination substrate by irradiating the laser beam onto an adhesive layer 121 formed between the second intermediate substrate 120 and the target object 6 through the second intermediate substrate 120 placed on the first stage 71 as a starting substrate, thereby ablating the adhesive layer 121.

[0118] Furthermore, the transfer method of the present invention can further include a step of transferring the object 6 from the first intermediate substrate 210 to the second intermediate substrate 120, as shown in Figure 13 (e), between the laser lift-off step and the transfer step.

[0119] The present invention is not limited to the above-described embodiments, which are merely examples, and anything that has substantially the same configuration as the technical idea described in the claims of the present invention and that provides similar effects is included within the technical scope of the present invention.

Claims

1. A transfer device for transferring an object provided on a starting substrate from the starting substrate to a destination substrate using a laser, comprising: a laser light source configured to oscillate the laser; a first optical system; and a second optical system having an optical configuration different from that of the first optical system; a switching mechanism configured to switch the optical path of the laser between an optical path to the first optical system and an optical path to the second optical system; Equipped with the first optical system is configured to transfer the object to the destination substrate surface by sequentially irradiating the laser from the back surface side of the starting substrate, A transfer device wherein the second optical system is configured to selectively irradiate the laser from the back side of the starting substrate to remove the object from the starting substrate or transfer the object to the destination substrate surface.

2. A transfer device for transferring an object provided on a starting substrate from the starting substrate to a destination substrate using a laser, comprising: a laser light source configured to oscillate the laser; a first optical system; and a second optical system having an optical configuration different from that of the first optical system; a switching mechanism configured to switch the optical path of the laser between an optical path to the first optical system and an optical path to the second optical system; Equipped with the first optical system is configured to simultaneously irradiate the laser onto a plurality of objects from a rear surface side of the starting substrate, thereby simultaneously transferring the plurality of objects to the destination substrate surface; A transfer device wherein the second optical system is configured to remove a single object from the starting substrate or transfer the single object to the surface of the destination substrate by irradiating the laser onto the single object from the back side of the starting substrate.

3. 3. The transfer device according to claim 1, wherein the switching mechanism comprises a mirror.

4. The switching mechanism is a first stage configured to hold at least the starting substrate; a movement mechanism configured to move the first stage between the first optical system and the second optical system in accordance with the change in the optical path of the laser; 3. The transfer device according to claim 1 or 2, comprising:

5. a first stage configured to hold the starting substrate; a second stage configured to hold a target substrate opposite the first stage; a projection lens configured to image the laser; and Further comprising:

3. The transfer device according to claim 1 or 2, wherein the switching mechanism comprises a moving mechanism configured to move the first stage, the second stage, and the projection lens between the first optical system and the second optical system in accordance with the change in the optical path of the laser.

6. a pattern for shaping the laser irradiation shape into a line beam so as to irradiate a plurality of the objects; a pattern for shaping the laser irradiation shape so as to irradiate one of the objects; 3. The transfer device of claim 1 or 2, further comprising a mask having:

7. 3. The transfer device according to claim 1, wherein the second optical system includes a galvanometer scanner as a means for selectively irradiating the laser onto the starting substrate or the object supported on the starting substrate, or for selectively irradiating the laser onto the starting substrate or the object from the back side of the starting substrate.

8. the first optical system further includes a mask having a pattern for shaping the laser irradiation shape into a line-shaped beam so as to irradiate a plurality of the objects simultaneously; 3. The transfer device according to claim 1, wherein the second optical system further comprises a mask having a pattern for shaping the irradiation shape of the laser so as to irradiate the object with a shape corresponding to each individual object.

9. 1. A method for transferring a plurality of objects from a starting substrate to a destination substrate using a laser, comprising: a starting substrate preparation step of preparing a starting substrate having the plurality of objects; a destination substrate preparation step of preparing a destination substrate onto which the plurality of objects are to be transferred; an apparatus preparation step of preparing a transfer apparatus including a laser light source configured to oscillate the laser, a first optical system, and a second optical system; a trimming step of determining in advance whether or not the plurality of objects on the starting substrate include any defective objects, and selectively removing the defective objects by using the laser through the second optical system if any defective objects are included; transferring the plurality of objects from the starting substrate to the destination substrate by the laser through the first optical system; Including, A transfer method in which the steps from the trimming step to the transfer step are performed in a series of operations without changing the setup of the starting substrate.

10. a repair step of selectively irradiating the laser beam onto the object on the starting substrate through the second optical system to transfer the object to the defective portion of the object after the transfer step of transferring the plurality of objects from the starting substrate to the destination substrate by the laser through the first optical system, the method further comprising: determining in advance whether or not the destination substrate includes a portion where the object is missing; and, if the portion where the object is missing is included, The transfer method according to claim 9 , wherein the steps from the transfer step to the repair step are performed in a series of operations without changing the setup of the starting substrate.

11. The transferring step includes: a laser lift-off process in which the laser is irradiated onto the object through a base material of a chip supply substrate on which the object is formed on a surface of a substrate placed on a first stage as the starting substrate, thereby decomposing a part of the object, thereby transferring the object from the starting substrate to a first intermediate substrate placed on a second stage as the destination substrate; and a transfer process in which the laser is irradiated onto an adhesive layer formed between the second intermediate substrate and the object through the second intermediate substrate placed on the first stage as the starting substrate, thereby ablating the adhesive layer, thereby transferring the object from the second intermediate substrate to a completed substrate placed on the second stage as the destination substrate. Including, the second intermediate substrate includes the adhesive layer; 11. The transfer method according to claim 9, further comprising the step of transferring the object from the first intermediate substrate to the second intermediate substrate between the laser lift-off step and the transferring step.