Semiconductor device manufacturing system

Abstract

The object of the present invention is to provide a technology capable of handling large volumes of data and capable of handling data output from equipment with high security risks, such as equipment groups including semiconductor manufacturing equipment.One of the semiconductor device manufacturing systems of the present invention is a semiconductor device manufacturing system having a platform connected to semiconductor manufacturing equipment via a network, further comprising a database server in which equipment IDs assigned to each of the semiconductor manufacturing equipment and extensions of data output from each of the semiconductor manufacturing equipment are stored as equipment masters, a conversion connection device for acquiring the data by accessing the equipment master based on authentication information of the network or authentication information of the platform, and a route setting device for blocking spontaneous data output from the semiconductor manufacturing equipment.

Description

[Technical field]

[0001] The present invention relates to a semiconductor device manufacturing system. [Background technology]

[0002] Since equipment groups, including semiconductor manufacturing equipment, are in an environment where OS updates cannot be made via external networks, security processing before data is received is often not possible. In addition, there is a high security risk because it is not known what data will be sent from other equipment. Therefore, providers of semiconductor manufacturing equipment must provide systems on the assumption that the OS of the semiconductor manufacturing equipment will not be updated.

[0003] As shown in Patent Document 1, a conventional technology includes a communication terminal and an integrated circuit that can guarantee the security of data from a sender in the environment of a receiver by having a data analysis unit that extracts identification information of a receiver terminal and determines a verification operation corresponding to the extracted identification information, and a data verification unit that executes the verification operation. Patent Document 1 discloses the following: "A communication terminal, a secure device, and an integrated circuit are provided that can guarantee the security of data by performing security processing in the environment of a receiver terminal that may use data before the data is transmitted from a transmitting communication terminal against threats such as computer viruses that perform unauthorized operations compatible with various platforms. When a mobile phone 101 transmits data, a data analysis unit 113 extracts identification information of a receiver terminal 103 written in the transmission data, refers to a permission information database 114, selects a predetermined verification operation corresponding to the environment of the receiver terminal 103, performs the security processing selected by a data verification unit 116, and notifies the receiver terminal 103 of the transmission data together with the security processing information." [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2006-318292 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, the technology disclosed in Patent Document 1 is a technology that handles known data in a transmission source terminal, and therefore Patent Document 1 does not consider handling data output from a group of devices with high security risks, including semiconductor manufacturing equipment, whose operating systems have not been updated. In addition, data related to semiconductor manufacturing includes images measured using electron beams, and is often large in volume, posing the issue of the time it takes to upload and download the data.

[0006] Therefore, an object of the present invention is to provide a technology capable of handling large volumes of data that can handle data output from equipment that poses a high security risk, such as equipment groups including semiconductor manufacturing equipment. [Means for solving the problem]

[0007] In order to solve the above problems, one of the semiconductor device manufacturing systems of the present invention is characterized in that, in a semiconductor device manufacturing system having a platform connected to semiconductor manufacturing equipment via a network, the system further comprises a database server in which an equipment ID assigned to each of the semiconductor manufacturing equipment and an extension of data output from each of the semiconductor manufacturing equipment are stored as an equipment master, a conversion connection device in which the data is acquired by accessing the equipment master based on network authentication information or authentication information of the platform, and a route setting device in which spontaneous data output from the semiconductor manufacturing equipment is blocked. Effect of the Invention

[0008] According to the present invention, it is possible to handle data output from equipment that poses a high security risk, such as equipment groups including semiconductor manufacturing equipment, and to handle large volumes of data. Problems, configurations and effects other than those described above will become apparent from the description of the following embodiments. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram showing the configuration of a semiconductor device manufacturing system using a group of devices including semiconductor manufacturing devices and a platform. [Diagram 2] FIG. 2 is a diagram showing a modification of the system of the first embodiment. [Diagram 3] FIG. 3 is a diagram showing a GUI (Graphical User Interface) presented to a user when operating the device master MA. [Figure 4] FIG. 4 is a diagram showing an example of a process for uploading data from a gateway PC to a database server. [Diagram 5] FIG. 5 is a diagram showing an example of a flow from data generation to data analysis in a case where an etching process is performed by a plurality of users. [Figure 6] FIG. 6 is a flowchart showing the schematic diagram of FIG. [Figure 7] FIG. 7 is a diagram showing the GUI of a web application that performs data linking. [Figure 8] FIG. 8 is a diagram illustrating the process of abnormality or failure detection. [Figure 9] FIG. 9 is a diagram showing the GUI of a web application for setting an alarm. [Figure 10] FIG. 10 is a diagram showing the configuration of a semiconductor device manufacturing system using a group of devices including semiconductor manufacturing devices and a platform. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Note that the present invention is not limited to the embodiment. In addition, in the description of the drawings, the same parts are denoted by the same reference numerals. When there are multiple components having the same or similar functions, they may be described by using the same reference numerals with different subscripts, or when there is no need to distinguish between these multiple components, the subscripts may be omitted.

[0011] In this disclosure, a "recipe" refers to a processing program that defines the processing procedure and control parameters of processing to be performed in an apparatus.

[0012] [Example 1] (System Configuration) The following are examples of the present invention. 1 The above will be described with reference to Fig. 1. Fig. 1 shows a semiconductor device manufacturing system using a group of devices including semiconductor manufacturing devices and a platform 117. 1 FIG. The semiconductor device manufacturing system 1 is a semiconductor device manufacturing system having a platform connected to semiconductor manufacturing equipment via a network, and further includes a database server in which equipment IDs assigned to each of the semiconductor manufacturing equipment and extensions of data output from each of the semiconductor manufacturing equipment are stored as equipment masters, a conversion connection device in which data is acquired by accessing the equipment master based on authentication information of the network or authentication information of the platform, and a route setting device in which spontaneous output of data from the semiconductor manufacturing equipment is blocked. The database server is disposed on the platform and connected to the conversion connection device via the Internet. In addition, the semiconductor device manufacturing system 1 accumulates data related to important equipment in the manufacture of semiconductor devices, and enables analysis of data for evaluating the processes in semiconductor manufacturing and maintaining and managing the semiconductor manufacturing equipment. In Fig. 1, the environment to which the platform 117 is applied is classified into three areas: an equipment area network, an internal network, and an external network.

[0013] The equipment area network is a network that connects a control device for semiconductor manufacturing equipment (hereinafter referred to as the "PC for semiconductor manufacturing equipment") 101, a control device for semiconductor inspection equipment (hereinafter referred to as the "PC for semiconductor inspection equipment") 102, a control device for semiconductor analysis equipment (hereinafter referred to as the "PC for semiconductor analysis equipment") 103, a control device for semiconductor analysis equipment (hereinafter referred to as the "PC for semiconductor analysis equipment") 104, and a relay device (hereinafter referred to as the "relay PC") 105. The semiconductor manufacturing equipment PC 101, the semiconductor inspection equipment PC 102, the semiconductor analysis equipment PC 103, and the semiconductor analysis equipment PC 104 are also simply referred to as "equipment PCs 101 to 104." The semiconductor devices controlled by the equipment PCs are also simply referred to as an "equipment group."

[0014] The internal network is a network that connects a conversion and connection device (hereinafter referred to as a “gateway PC”) 108, a user's personal computer 114, a user's portable terminal computer 115, and a route setting device (hereinafter referred to as a “route design PC”) 118.

[0015] The external network is a network that connects the database server 106, the application server 109, the WEB server 110, the GPU server 111, and the remote monitor PC 116. The internal network and the external network are connected via the Internet 113. The database server 106, the application server 109, the WEB server 110, and the GPU server 111 are also simply referred to as the "server group 106 and 109 to 111."

[0016] The platform 117 includes an application server 109, a GPU server 111, and a WEB server 110, and the application server 109 or the GPU server 111 is connected to the WEB server 110 via a communication means. The platform 117 enables remote access to the equipment PCs 101 to 104 in the equipment area network from a user's personal computer 114 and a user's portable terminal personal computer 115 in the internal network or a remote monitor personal computer 116 in the external network. The platform 117 includes a relay PC 105 that performs security checks with equipment groups including semiconductor manufacturing equipment, a gateway PC 108 having a data acquisition program, a data path setting PC 118, and networks with various databases. The configuration of the platform 117 is merely an example, and is not limited to this configuration. For example, the platform includes an application server 109 and a GPU server 111. As described later, the application server 109 or the GPU server 111 may be used. 1 It is also possible to configure the system so that data output from each of the semiconductor manufacturing devices is downloaded.

[0017] (Classification by security measures) The equipment area network, the internal network, and the external network have different security measures in each area. An equipment area network is a network to which at least semiconductor manufacturing equipment is connected. For example, an equipment area network is a network configured by manufacturing equipment that configures a production line in a semiconductor manufacturing factory. The equipment area network may include, for example, a network of equipment that automatically transports parts and finished products and equipment that automatically stores and retrieves parts. The internal network is a network to which, for example, a server that performs production management is connected. In addition to managing production plans, servers for monitoring production status and acquiring equipment information are connected to the internal network. Servers that place orders for parts and collect information for formulating production plans may also be connected. The internal network may include, for example, the management department of the head office. The external network is a network connected to the equipment area network and the internal network via the Internet. The external network is a network that is not managed by the semiconductor factory or the head office, and is connected, for example, by an equipment vendor for remote maintenance.

[0018] The following explains the security measures. Security measures are set for each of the three areas, such as preventing intrusion into the communication network, preventing unauthorized intrusion into the area, managing accounts, monitoring communication logs and operation logs, and monitoring alerts for PCs and terminals. For example, the equipment area network includes a network made up of equipment in a semiconductor manufacturing factory, and security measures include preventing unauthorized intrusion into the premises and restricting users of terminal devices such as PCs. Here, in this disclosure, of the security measures, we focus on software updates (particularly OS updates). OS updates are expected to eliminate vulnerabilities and prevent unauthorized access from the outside. While OS updates are performed in the internal network and the external network, there are cases where devices and equipment in the device area network have not been updated for their OS.

[0019] (Composition by area) In the first embodiment, an apparatus relating to an etching process among semiconductor manufacturing apparatuses will be described as an example.

[0020] (Equipment Area Network) The PC 101 for semiconductor manufacturing equipment is a device that manages the control of, for example, a wet etching device and a plasma etching device. The PC 102 for semiconductor inspection equipment is a device that controls, for example, an appearance inspection device such as a camera or a microscope, and an electrical inspection device using a probe. The PC 103 for semiconductor analysis equipment is a device that controls an analysis device such as a transmission electron microscope or a nuclear power microscope. For example, the PC 104 for semiconductor analysis equipment is a device that controls an analysis device that performs, for example, TCT gas chromatograph / mass spectrometry and time-of-flight secondary ion mass spectrometry. Note that the control devices are classified according to the functions of inspection, analysis, and analysis, but the classification is not limited to this. A single control device may perform multiple functions, and may be appropriately set based on the manufacturing process performed by the semiconductor manufacturing equipment to which the platform 117 is applied.

[0021] When a process recipe for performing an etching process is input to the PC 101 for semiconductor manufacturing equipment, the PC 101 for semiconductor manufacturing equipment executes the process recipe. The PC 101 for semiconductor manufacturing equipment transmits instruction values ​​according to the contents of the process recipe to each device in the etching equipment, and the etching process is performed in the etching equipment. The executed process recipe is stored in the PC 101 for semiconductor manufacturing equipment.

[0022] The etched wafer is transported to one of a semiconductor inspection device, a semiconductor analysis device, and a semiconductor analysis device. When the semiconductor inspection device PC 102 receives the measurement recipe for inspection, it controls the semiconductor inspection device according to the measurement recipe. The measurement results are stored in the semiconductor inspection device PC 102. Similarly, the semiconductor analysis device PC 103 receives the measurement recipe for analysis, and controls the semiconductor analysis device according to the measurement recipe. The measurement results are stored in the semiconductor analysis device PC 103. The semiconductor analysis device PC 104 receives the measurement recipe for analysis, and controls the semiconductor analysis device according to the measurement recipe. The measurement results are stored in the semiconductor analysis device PC 104.

[0023] (Data communication between areas) Again, an embodiment of the present invention 1 Return to FIG. 1 for the explanation. An equipment group including semiconductor manufacturing equipment such as the etching equipment is arranged in an equipment area network, and a relay PC 105 connected to each of the equipment groups through a network is arranged in the equipment area network. The relay PC 105 has a means for bidirectionally communicating data between the control device of each equipment in the equipment group and the relay PC 105, and has a program for security checking data and a storage unit for storing data that has passed the security check. Specifically, the relay PC 105 has a communication means so that the relay PC 105 can collect data obtained from the equipment group or the equipment PCs 101 to 104. The relay PC 105 has a storage unit that stores data indicating results received from the equipment group and master data, which will be described later, and whose access rights are limited to only the relay PC 105. For example, a folder in which the results of each of the equipment groups are stored is created as a shared folder 105a using SMB (Server Message Block) communication, which is a communication protocol, and access rights are granted to the relay PC 105. This allows the relay PC 105 to collect output data output from each equipment in the equipment group. The relay PC 105 can also transfer (send) data to the equipment group. For example, relay PC The gateway PC 105 receives recipes from the gateway PC 108 and inputs them to each device in the device group. Although the shared folder 105a is shown as an example, the form of the storage unit is not limited to this. A storage device inside the relay PC 105 may be used, or an external storage device such as a hard disk that is separate from the relay PC 105 and can be connected to the relay PC 105 may be used.

[0024] The relay PC 105 is capable of performing OS updates via an external network. The relay PC 105 also has a built-in program that performs security checks on data, such as virus software, and is capable of executing the program, so that the latest virus definitions are always reflected. The shared folder 105a is set as the target for constant security monitoring within the virus software, and the data stored in the shared folder is always security checked. Only this shared folder can be accessed from the internal network and the external network, and is also used as a storage location for data such as recipes to be transferred to the equipment group.

[0025] The shared folder 105a manages a device master MA that includes at least a device ID assigned to each device in the device group and an extension of output data that is data output from each device in the device group. The device master MA is also stored in a database server 106 in an external network, and the extensions indicate text formats such as txt, csv, and tsv, and image formats such as jpg, png, and gif.

[0026] Although an example in which one shared folder is used has been shown, there may be a plurality of shared folders. For example, a folder in which data to be extracted to an external network and utilized in the devices PC101-104 is stored may be created as a shared folder between the relay PC105 and each of the devices PC101-104 using, for example, the SMB protocol. As 2 is a diagram showing a modified example of the system of the first embodiment. Here, shared folders 105-1 to 105-4 are created in the relay PC 105. The semiconductor manufacturing equipment PC 101 and the relay PC 105 Information transmitted and received between the semiconductor inspection equipment PC 102 and relay PC 105 is recorded in shared folder 105-1. Information transmitted and received between the semiconductor inspection equipment PC 102 and relay PC 105 is recorded in shared folder 105-2. Information transmitted and received between the semiconductor analysis equipment PC 103 and relay PC 105 is recorded in shared folder 105-3. Information transmitted and received between the semiconductor analysis equipment PC 104 and relay PC 105 is recorded in shared folder 105-4. Furthermore, although the device master MA is stored in the database server 106, it may be stored in another server included in the external network.

[0027] (Internal Network) An internal network is formed on the outside of the relay PC 105. A gateway PC 108 is disposed in the internal network. The gateway PC 108 has a built-in program and executes it to access the device master MA based on authentication information of the external network or authentication information of the platform, and to obtain output data permitted by the device master MA from a storage unit. Specifically, the gateway PC 108 is capable of accessing the shared folder 105a via the relay PC 105, and can access the device master MA by referring to the device master MA. Master It is possible to collect output data of a group of devices based on MA.

[0028] data The routing setting PC 118 has a built-in program that allows the gateway PC 108 to access the memory unit and transfer the acquired output data to the internal network, or the output data stored in the memory unit to the device group, and blocks spontaneous data leakage from each device in the device group. This allows the gateway PC 108 to access the storage unit of the relay PC 105, but prohibits the gateway PC 108 from transferring data from the device area network side to the internal network.

[0029] Furthermore, user's personal computer 114 and user's portable terminal computer 115 are operated by a user who uses platform 117. Semiconductor device manufacturing system 1 is connected to platform 117, user's personal computer 114, and user's portable terminal computer 115 via communication means.

[0030] (External Network) The database server 106 stores authentication information of the equipment master MA and users. The database server 106 also stores data output from each of the semiconductor manufacturing equipment. The database server 106 stores output data output from each equipment of the equipment group (e.g., data showing results obtained by the equipment group and manufacturing data output from each equipment of the equipment group).

[0031] The application server 109 receives user data transferred from the WEB server 110, executes an application program, and responds to the WEB server 110. When data retrieval or updating is required, the application server 109 makes a request to the database server 106, processes the data, and then responds to the WEB server 110 with dynamic content. In response to a user request, the WEB server 110 responds with static Web content (HTML pages, files, images, videos, etc.), and when dynamic processing is required, it requests the application server 109 to perform the processing and receives the same dynamic content response from the application server 109. The database server 106 performs processing according to a request from the application server 109 and transfers the results to the application server 109 . The GPU server 111 generates content on behalf of the application server 109 when a user request involves a heavy load.

[0032] The server groups 106 and 109 to 111 will now be described. At least one of the application server 109 and the GPU server 111 has a communication means between the WEB server and the server. At least one of the application server 109 and the GPU server 111 can download output data output from the device group.

[0033] (How to operate) A user registers authentication information to log in to the platform 117 from the user's personal computer 114 or the user's portable terminal computer 115. The user's authentication information is stored in the database server 106. When a user ID and password are input from the user's personal computer 114 or the user's portable terminal computer 115, the user is authenticated in the database server 106. When logging in to the platform 117, the authentication information is applied by the database server 106, the application server 109, the WEB server 110, and the GPU server 111.

[0034] (Adding and deleting master data in the Equipment Master MA) The user logs into the platform 117 based on the authentication information, P The device master MA is registered in the platform 117. An example of registering in the device master MA after logging in to the platform 117 will be described with reference to Fig. 3. Fig. 3 is a diagram showing a GUI (Graphical User Interface) shown to a user when operating the device master MA. The GUI 20 is generated by the application server 109 or the WEB server 110, and is displayed on the user's personal computer 114 or the user's mobile terminal personal computer 115.

[0035] First, the user inputs the name of the device from which data is to be imported in the blank 21 of "Enter Device Name" in GUI 20, and inputs the extension of the data to be imported in the blank 22 of "Enter Data Extension". For example, if the file extension is ".txt" for a text file, input "txt". Alternatively, by pressing the "Import Sample Data" button 23 to import sample data obtained from an actual device, the database server 106 will recognize the extension. The location where the data specified by the device name and data extension is stored is displayed in the "File Path" field 24. Press the "Add Master" button to register the device ID and data extension of the device from which data is to be acquired in the device master MA. The registered master data can be searched for by entering the device name in the blank 26 of "Search Device Name" and pressing the "Search Master Data" button 27 in the figure. The search results are displayed in the "Select Master Data" field 25. to 8 The list will be displayed, so check the selection box 29 for any master data you do not need from the displayed master data, and then press the "Delete Master" button 30 to delete it.

[0036] The master data is registered in the equipment master MA by such GUI operations. However, there are other registration methods. For example, the master data may be directly registered in the database server 106. stomach The registration method of the device master MA can be appropriately selected from various methods. Rua The above is an example of the GUI of the device master MA, but the displayed items and operation method of the GUI are not limited to those described here. To Registration may be omitted without going through the platform 117 app.

[0037] (How data is obtained) The gateway PC 108 performs HTTP communication with the WEB server 110 and requests access to the device master MA. The WEB server 110 obtains the device ID, file path, and data extension recorded in the device master MA from the database server 106, and transfers them to the gateway PC 108. The gateway PC 108 accesses the shared folder 105a in the relay PC 105 according to the obtained file path information, and obtains the device ID and data The data specified by the extension is acquired. The acquired data is temporarily stored in the gateway PC 108, and is then stored in the database server 106 by executing a program in the WEB server 110. After uploading, the temporarily stored data is deleted so that no data remains in the gateway PC 108. The above explanation is HTTP Although communication has been taken as an example, the communication method is not limited to this.

[0038] The data path setting PC 118 has a built-in program that blocks spontaneous data outflow from the device group and executes it. In other words, when the gateway PC 108 acquires data from the device group, the data path setting PC 118 enables data communication from the device group or the relay PC 105 to the gateway PC 108. On the other hand, if data communication of a report is made from the device group or the relay PC 105 to the internal network, the data path setting PC 118 blocks the data communication.

[0039] This allows users to handle data on semiconductor manufacturing equipment and semiconductor inspection and measurement equipment in the equipment group via an external network.In addition, only data extensions registered in the equipment master MA are handled, so that the specified data of each equipment group can be handled without security risks.

[0040] (Modification of Gateway PC 108) A modified example of the above-mentioned gateway PC 108 will be described. If a transfer error occurs when uploading data from the gateway PC 108 to the database server 106, a program is built into the gateway PC 108 to retransfer only the specific data chunk in which the error occurred. This makes it possible to avoid transfer errors.

[0041] In addition, since it is expected that data files may become large and may not be able to be transferred all at once depending on the specifications of the gateway PC 108, a program that divides data into multiple data chunks for transfer is built into the gateway PC 108. This makes it possible to transfer large volumes of data.

[0042] Furthermore, if a file is divided into multiple data chunks when it is transferred, they must be integrated before being stored in the database server 106, and the gateway PC 108 is equipped with an integration program and a program that compares the data before and after integration to determine whether there is any data loss. This makes it possible to avoid data loss by checking data consistency. Also, a program that limits the data transfer volume per unit time and uses a batch processing data transfer method is equipped. This makes it possible to distribute the load when transferring large volumes of data.

[0043] FIG. 4 is a diagram showing an example of a process for uploading data from the gateway PC 108 to the database server 106. As shown in FIG. First, in step S1, gateway PC 108 determines whether the size of the data to be uploaded to database server 106 is equal to or larger than a predetermined value a. The predetermined value a is a value determined according to the amount of data communication. If the data size is less than a (No in step S1), the data can be uploaded all at once. Therefore, gateway PC 108 uploads the data without dividing and transmitting the data (step S2).

[0044] In step S3, the gateway PC 108 determines the number of data chunks, which are the units of data to be uploaded. The data output from each of the semiconductor manufacturing devices is divided into multiple data chunks. The gateway PC 108 divides the data into multiple data chunks according to the determined number.

[0045] In step S4, the gateway PC 108 uploads the data chunk ( Steps If uploading is to be performed, the gateway PC 108 creates a temporary file in the storage of the gateway PC 108 (step S5). After the upload is completed, the temporary file is deleted.

[0046] When the data chunk is successfully uploaded (step S6), the upload of the n divided data chunks is repeated (step S8). The database server 106 integrates the data chunks into one data file, compares the data file being sent with the data file after the transmission is completed, and verifies the data file being sent with the data file after the transmission is completed. Specifically, when all the data chunks are uploaded (step S7), the database server 106 merges all the data chunks (step S9). As a data chunk merging process, the checksum and data file upload information are stored in the database server 106, and the temporary file in the database server 106 is deleted. Each of the divided data chunks is transferred in parallel. Here, the data chunks are transferred individually, but it is also possible to transfer the data chunks in parallel and simultaneously.

[0047] On the other hand, if the data chunk upload is not successful (No in step S6), the upload is retried (step S11). Here, the retry count is set to less than 3. If the file upload fails even after two retries (step S12), the data chunk is discarded (step S13), and the uploaded data chunks are merged (step S9).

[0048] If an error occurs in the data chunk merging process (Yes in step S14), the merging process is performed again (step S9). If the merging process is successful (No in step S14), information including the uploaded data is stored in the database server 106 (step S15).

[0049] Although an example has been given here in which a data chunk in which a transfer error has occurred is discarded, it is also possible to retransfer a specific data chunk in which a transfer error has occurred.

[0050] (Variation of Platform 117) A modified example of the platform 117 will be described. The platform 117 has a built-in program that monitors the data folder transferred from the gateway PC 108, detects addition or modification of a data file in the data folder, and transfers the added or modified data file to the database server 106 without transferring the data file that has already been transferred. This enables real-time transfer and avoids duplicate transfer.

[0051] The user transfers the data stored in the database server 106 to the application server 109 or the GPU server 11. 1 To HTTP The data is downloaded via communication and analyzed by various applications, and the data is optimized for etching recipes. In order to utilize the data as a web application to improve user convenience, the application server 109 or the GPU server 111 and HTTP A communicable WEB server 110 is installed, and a program that a user can use as a WEB application via a WEB browser is built into the WEB server 110.

[0052] (Operation flow) The data flow will be described in more detail with reference to Figs. 5 and 6. Fig. 5 is a diagram showing a schematic example of a flow from data generation to data analysis when an etching process is performed by multiple users. Fig. 6 is a diagram showing the schematic diagram of Fig. 5 in the form of a flow chart. Members A121 and B122 are in locations where they can operate the group of equipment and equipment PCs 101-104 in the equipment area network. Member C133 operates user personal computer 114 or user portable terminal personal computer 115 and uses the internal network.

[0053] Member C 133 plans to obtain information about an etching recipe from a remote location. Therefore, member C 133 sends the recipe through platform 117 and specifies the equipment for obtaining measurement results (step S51). Specifically, member C 133 sends etching recipe 124 to etching equipment 127, and sends measurement recipe 126 to measuring equipment 128. Member C 133 also specifies the etching equipment 127 and the data extension of the etching equipment 127, and the measuring equipment 128 and the data extension of the measuring equipment 128.

[0054] The member A 121 performs etching processing on the wafer 123 by the etching device 127 to which the etching recipe 124 has been input (step S52). After the wafer processing is performed, the used processing recipe 125 that has actually been used for processing is stored in a shared folder of the relay PC 105. The used processing recipe 125 is transferred from the relay PC 105 to the database server 106 by the gateway PC 108 (step S53).

[0055] Meanwhile, the processed wafer 123 is delivered to member B 122 to measure the post-processing characteristics (step S54). Member B 122 measures the wafer 123 using a measuring device 128 to which a measurement recipe 126 has been input (step S55). Measurement results 129, which are data after the measurement, are stored in a shared folder in relay PC 105 and then transferred to database server 106 by gateway PC 108 (step S56). Since wafer 123 was used for examination, the measured wafer may be discarded (step S57).

[0056] The processing recipe 125 and the measurement results 129 transferred to the database server 106 are retrieved as set data 130, which is a set of data, from the application server 109 or the GPU server 111. After the processing recipe 125 and the measurement results 129 are linked in the application server 109 or the GPU server 111, the WEB server 110 acquires them as linked data 131 (step S58). The linking will be described later.

[0057] The WEB server 110 acquires the processing recipe 125 and the measurement result 129 (step S59) and creates link data 132, which is machine-readable data. member Present to C133. member The C133 analyzes the link data 132 (step S60) and determines whether the measurement result achieves the target value (step S61). 6 1) Yes, member The C133 ends the process (step S62). If the target value has not been achieved (No in step S61), member C133 generates a revised etching recipe and causes the etcher 127 to execute it.

[0058] (Operation flow on the web app) The flow of operations on the web application for data linking will be described in more detail with reference to Fig. 7. Fig. 7 is a diagram showing the GUI of the web application for data linking. GUI 30 is generated by application server 109 or web server 110, and is displayed on user's personal computer 114 or user's mobile terminal personal computer 115.

[0059] First, to search for an etching equipment, press the "Equipment Search" button 31 and select "Etcher" and "Chamber." In this example, select Etcher 1 and Chamber 2. Next, press the "Search for recipe" button 32 to select an etching recipe. In this example, recipe 1 is selected. Next, to search for the measurement results, press the "Search Measurement Results" button 33. In this example, Measurement 2 is selected. Finally, to clarify the linked data, the linked data is named. Press the "Search for linked data" button 34 and select a combination of recipe and measurement result. In this example, recipe 1 and measurement 2 are selected. To enter a name for the selected data, enter a name. In this example, it is named Link 1. The graphic design, search method, and input method are not limited to this method.

[0060] In addition, although the search and selection are performed manually here, it is also possible to automatically read barcodes attached to wafers and wafer cassettes, or to automatically search and select samples by sample ID, etc. Recipe The recipe ID and lot ID may be automatically read instead. The results observed in the observed semiconductor manufacturing equipment are integrated with the recipe ID, sample ID, or lot ID. Here, the recipe ID is used as the key because the recipe and the results are linked, but the lot ID or sample ID may be used instead of the recipe ID and merged with the data showing the results of the equipment.

[0061] (Remote monitoring) Remote monitoring will be described again with reference to Fig. 1. Remote monitor computer 116 monitors data of each device in the group of devices and logs and alarms of semiconductor device manufacturing system 1 including platform 117, and detects abnormalities in the system and failures in devices.

[0062] The detection process will be explained with reference to Fig. 8 as well. Fig. 8 is a diagram showing the process of abnormality or failure detection. Remote monitor PC 116 collects logs indicating the operation of each device in the device group and alarms generated by the devices. The logs and alarms are stored in a shared folder in relay PC 105, and are stored in database server 106 by gateway PC 108. Remote monitor PC 116 collects logs and alarms from gateway PC 108 directly or via WEB server 110.

[0063] Specifically, each device in the device group generates log data (step S80). The log data is stored in a shared folder in the relay PC 105, and is stored in the database server 106 by the gateway PC 108. The log data is uploaded to the platform 117 (step S81). Next, remote monitor computer 116 functions as a remote center. Specifically, remote monitor computer 116 acquires log data (step S82). Remote monitor computer 116 executes an analysis program, for example, compares the log data with a reference range during normal operation, and monitors whether there is any deviation in the behavior of the device (step S83). Remote monitor computer 116 also performs data analysis to grasp, for example, the relationship between the log data and product quality or yield (step S84). If no abnormality is detected as a result of the monitoring and data analysis (step S 8 If an abnormality is detected (Yes in step S85), remote monitor computer 116 acquires the log data again and performs monitoring and data analysis. On the other hand, if an abnormality is detected (Yes in step S85), remote monitor computer 116 issues an alarm (step S86). The user accesses the semiconductor device manufacturing system 1 via the platform 117 (step S87). The user checks the alarm (step S88) and takes appropriate action (step S89). For example, if an alarm for replacing a part of the equipment is confirmed, the part in question is replaced. Note that in response to the issuance of an alarm, the group of equipment may automatically take action to address the abnormality. Also, although it is assumed here that the alarm is notified to the user or the equipment, it may also be a robot using AI, and there is no limit to the means.

[0064] The display of the alarm on platform 117 will be described in more detail with reference to Fig. 9. Fig. 9 is a diagram showing the GUI of a WEB application for setting an alarm. GUI 40 is generated by application server 109 or WEB server 110, and is displayed on user's personal computer 114 or user's mobile terminal personal computer 115.

[0065] First, to select the data to be set as the alarm target, press the data search button 41 and select the data to be set as the alarm target. Here, data 1 is selected. To set the threshold value for this data 1 in advance, enter it into the threshold input form 42, select whether to issue an alarm when the value is greater than the threshold value or less than the threshold value, and enter the alarm display settings. Here, it is set to issue a "power abnormality" alarm, as shown in the alarm display setting field 43, when the value is greater than 300W.

[0066] In addition, by setting the response to be taken when an alarm occurs, the user or the device can immediately respond when an alarm occurs. In the alarm response setting window 44, select the alarm content and set the response content and reason for the response. Here, press the alarm content search button 45 to search for the alarm content and select "power abnormality."

[0067] Next, the method of response in the event of a "power abnormality" alarm is entered in response form 46, and the reason for the response in reason for response form 47. In the case of a "power abnormality", the response stated is "Since the device is being used in an excessive power mode, urge the user to select an appropriate power mode". Also, the reason for the response stated is "Since the device is being used at the maximum rated power, power consumption can be reduced by using the device at a power appropriate for the application". The method of response and the reason for the response are displayed on user's computer 114 or user's portable terminal computer 115 at the same time as the alarm.

[0068] In this way, the built-in program of the remote monitor computer 116 can remotely generate a response method and a reason for the response to the alarm content, and here, it is possible to recommend a response to the customer to reduce power consumption. Note that, although the response method is presented to the user here, it is also possible to set a program corresponding to the response method for each of the devices. In the case of a robot using AI, the response method to an alarm can be set in advance, and the response method can be determined according to the alarm.

[0069] In step S81, the gateway PC 108 uploads the data stored in the shared folder of the relay PC 105, but this is not limited to this method. A batch processing method may be applied to the transfer method of the data output from each of the semiconductor manufacturing devices. Also, the transfer volume per unit time of the data output from each of the semiconductor manufacturing devices may be limited. Also, for example, the relay PC 105 may have a data folder for temporarily storing the output data, and the gateway PC 108 may not transfer the transferred data output from each of the semiconductor manufacturing devices, but may transfer the added or changed data output from each of the semiconductor manufacturing devices via the Internet. In this way, only the updated part of the output data can be transferred to the external network, so that efficient continuous monitoring can be performed while suppressing the data volume at the time of uploading.

[0070] (Action and effect) Users can handle data of semiconductor manufacturing equipment and semiconductor inspection and measurement equipment via external or internal networks. The data extension is Device Master MA By handling only data registered in the database and preventing unknown data leakage from equipment groups including semiconductor manufacturing equipment, it becomes possible to handle specific data from each equipment group without security risks. As described above, according to the present disclosure, it is possible to handle data output from equipment with high security risks, such as equipment groups including semiconductor manufacturing equipment, and to handle large volumes of data.

[0071] [Example 2] A second embodiment of the present invention will be described with reference to Fig. 10. Fig. 10 is a diagram showing a configuration of a semiconductor device manufacturing system using a group of devices including semiconductor manufacturing devices and a platform 117a. The difference from the first embodiment is that the platform 117a is installed in an internal network. The database server 106 is placed on the platform 117a and is connected to a gateway PC 108 via a network different from the Internet 113.

[0072] For example, in the first embodiment, the server groups 106 and 109 to 111 are configured by cloud services, and in the second embodiment, the server groups 106 and 109 to 111 are configured on-premise. By configuring the server groups 106 and 109 to 111 on-premise, the risk of data relating to semiconductor manufacturing leaking to the outside can be further reduced. By providing the database server 106 in the internal network, data of the equipment master MA and the equipment group is not transferred to the external network, so that the risk of data leaking to the external network can be further reduced.

[0073] In the above embodiment, the device PCs 101 to 104 and the Continuation P C 105Although the term "PC" has been used in the above explanation, "PC" is not limited to a PC terminal. The "PC" in this disclosure may be a virtual area, a server, or a mobile terminal, not necessarily a PC terminal. Also, a "personal computer" is an example of an information and communication device. Sumo However, the present disclosure is not limited to this. In addition, the communication method may be SMB communication and HTTP Although the above description uses communication, the communication method is not limited to these. The present disclosure can also be applied to FTP communication, NFS communication, and the like in addition to these communication methods.

[0074] Furthermore, in the above embodiments, an etching apparatus has been described as an example of semiconductor manufacturing apparatus, but the present disclosure can also be applied to other manufacturing apparatuses, such as a plasma CVD apparatus, an ashing apparatus, and a surface modification apparatus.

[0075] [Other aspects] The present disclosure also includes the following aspects. (Aspect 1) A semiconductor device manufacturing system including a platform connected to a semiconductor manufacturing device via a network, a database server in which an equipment ID assigned to each of the semiconductor manufacturing devices and an extension of data output from each of the semiconductor manufacturing devices are stored as an equipment master; a conversion and connection device that acquires the data by accessing the device master based on authentication information of a network or authentication information of the platform; and a path setting device for blocking spontaneous output of data from the semiconductor manufacturing equipment. (Aspect 2) In the semiconductor device manufacturing system according to the first aspect, The database server is disposed on the platform and is connected to the conversion and connection device via the Internet. (Aspect 3) In the semiconductor device manufacturing system according to the first or second aspect, The database server is disposed on the platform and is connected to the conversion and connection device via a network different from the Internet. (Aspect 4) In the semiconductor device manufacturing system according to any one of aspects 1 to 3, The semiconductor device manufacturing system according to claim 1, wherein data output from each of said semiconductor manufacturing devices is stored in said database server. (Aspect 5) In the semiconductor device manufacturing system according to any one of aspects 1 to 4, The platform includes an application server and a GPU server; A semiconductor device manufacturing system, characterized in that data output from each of the semiconductor manufacturing devices is downloaded by the application server or the GPU server. (Aspect 6) From aspect 1 5 13. The semiconductor device manufacturing system according to claim 12, The platform includes an application server, a GPU server, and a WEB server; A semiconductor device manufacturing system, wherein the application server or the GPU server is connected to the WEB server via a communication means. (Aspect 7) In the semiconductor device manufacturing system according to any one of aspects 1 to 6, The semiconductor device manufacturing system is characterized in that the platform is connected to a user's personal computer and a user's portable terminal personal computer via a communication means. (Aspect 8) In the semiconductor device manufacturing system according to any one of aspects 1 to 7, The data output from each of the semiconductor manufacturing devices is divided into a plurality of data chunks; A semiconductor device manufacturing system, wherein each of the divided data chunks is transferred in parallel. (Aspect 9) In the semiconductor device manufacturing system according to any one of aspects 1 to 8, A semiconductor device manufacturing system, comprising: a data chunk in which a transfer error has occurred, the data chunk being retransferred. (Aspect 10) In the semiconductor device manufacturing system according to any one of aspects 1 to 9, The data chunks are combined into one data file; A semiconductor device manufacturing system comprising: a data file being transmitted and a data file after transmission is completed, the data file being transmitted and the data file after transmission are verified. (Aspect 11) In the semiconductor device manufacturing system according to any one of aspects 1 to 10, The conversion and connection device The transferred data output from each of the semiconductor manufacturing devices is not forwarded, A semiconductor device manufacturing system, wherein added or changed data output from each of said semiconductor manufacturing devices is transferred via the Internet. (Aspect 12) In the semiconductor device manufacturing system according to any one of aspects 1 to 11, A semiconductor device manufacturing system comprising: a semiconductor manufacturing device manufacturing system that integrates the results of observation performed by the semiconductor manufacturing device with a recipe ID, a sample ID, or a lot ID. (Aspect 13) In the semiconductor device manufacturing system according to any one of aspects 1 to 12, A semiconductor device manufacturing system, characterized in that a transfer capacity per unit time of data output from each of said semiconductor manufacturing devices is limited. (Aspect 14) In the semiconductor device manufacturing system according to any one of aspects 1 to 13, 2. A semiconductor device manufacturing system, comprising: a batch processing system for transferring data output from each of said semiconductor manufacturing devices. [Explanation of symbols]

[0076] 1...Semiconductor device manufacturing system, 101...PC for semiconductor manufacturing device, 102...PC for semiconductor inspection device, 103...PC for semiconductor analysis device, 104...PC for semiconductor analysis device, 105...Relay PC, 106...Database server, 108...Gateway PC, 109...Application server, 110...WEB server, 111...GPU server, 113...Internet, 114...User's PC, 115...User's mobile terminal PC, 116...Remote monitor PC, 117, 17a Platform, 118 Data routing PC, 120 Local program server, 121 Member A, 122 Member B, 123 Wafer, 124 Etching recipe, 125 Processing recipe, 126 Measurement recipe, 127 Etching equipment, 128 Measurement equipment, 129 Measurement result, 130 Set data, 131 Linking data, 132 Link data between recipe and result, 133 Member C, 134 Reviewed etching recipe

Claims

1. A semiconductor device manufacturing system including a platform connected to a semiconductor manufacturing device via a network, a database server in which an equipment ID assigned to each of the semiconductor manufacturing devices and an extension of data output from each of the semiconductor manufacturing devices are stored as an equipment master; a conversion and connection device that acquires the data by accessing the device master based on authentication information of a network or authentication information of the platform; and a path setting device for blocking spontaneous output of data from the semiconductor manufacturing equipment.

2. 2. The semiconductor device manufacturing system according to claim 1, The database server is disposed on the platform and is connected to the conversion and connection device via the Internet.

3. 2. The semiconductor device manufacturing system according to claim 1, The database server is disposed on the platform and is connected to the conversion and connection device via a network different from the Internet.

4. 2. The semiconductor device manufacturing system according to claim 1, The semiconductor device manufacturing system according to claim 1, wherein data output from each of said semiconductor manufacturing devices is stored in said database server.

5. 2. The semiconductor device manufacturing system according to claim 1, The platform includes an application server and a GPU server; A semiconductor device manufacturing system, wherein data output from each of the semiconductor manufacturing devices is downloaded by the application server or the GPU server.

6. 2. The semiconductor device manufacturing system according to claim 1, The platform includes an application server, a GPU server, and a WEB server; The semiconductor device manufacturing system is characterized in that the application server or the GPU server is connected to the WEB server via a communication means.

7. 2. The semiconductor device manufacturing system according to claim 1, The semiconductor device manufacturing system is characterized in that the platform is connected to a user's personal computer and a user's portable terminal personal computer via a communication means.

8. 2. The semiconductor device manufacturing system according to claim 1, The data output from each of the semiconductor manufacturing devices is divided into a plurality of data chunks; A semiconductor device manufacturing system, wherein each of the divided data chunks is transferred in parallel.

9. 9. The semiconductor device manufacturing system according to claim 8, A semiconductor device manufacturing system, comprising: a data chunk in which a transfer error has occurred, the data chunk being retransferred.

10. 9. The semiconductor device manufacturing system according to claim 8, The data chunks are combined into one data file; A semiconductor device manufacturing system comprising: a data file being transmitted and a data file after transmission is completed, the data file being transmitted and the data file after transmission are verified.

11. 2. The semiconductor device manufacturing system according to claim 1, The conversion and connection device The transferred data output from each of the semiconductor manufacturing devices is not forwarded, A semiconductor device manufacturing system, wherein added or changed data output from each of said semiconductor manufacturing devices is transferred via the Internet.

12. 2. The semiconductor device manufacturing system according to claim 1, A semiconductor device manufacturing system comprising: a semiconductor manufacturing apparatus that integrates a result of observation performed by the semiconductor manufacturing apparatus with a recipe ID, a sample ID, or a lot ID.

13. 2. The semiconductor device manufacturing system according to claim 1, A semiconductor device manufacturing system, characterized in that a transfer capacity per unit time of data output from each of said semiconductor manufacturing devices is limited.

14. 2. The semiconductor device manufacturing system according to claim 1, 2. A semiconductor device manufacturing system, comprising: a batch processing system for transferring data output from each of said semiconductor manufacturing devices.

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