Processing system and processing method

Abstract

This processing system comprises: a processing device that melts a material supplied from a supply member by using a beam emitted from an irradiation device, thereby molding a molded article on an object; and a control device that is capable of controlling the processing device. The supply member supplies the material to a supply region in a plane intersecting the optical axis of the irradiation device in a space between the supply member and the object. The control of the processing device performed by the control device includes controlling the beam path of the beam from the radiation device on the basis of at least one of the shape or the size of the supply region.

Description

Processing system and processing method

[0001] The present invention relates to the technical field of a processing system and a processing method capable of processing an object, for example.

[0002] An example of a processing system for processing an object is described in Patent Document 1. One of the technical challenges of such a processing system is to process the object appropriately.

[0003] US Patent Application Publication No. 2016 / 0311059

[0004] According to a first aspect, a processing system is provided which includes a material supply member that supplies a modeling material and an irradiation device that emits an energy beam, and which performs additional processing to form a model on an object by melting the modeling material supplied from the material supply member with the energy beam emitted from the irradiation device, and a control device that can control the processing device, wherein the material supply member supplies the modeling material to a material supply area in a plane that intersects with the optical axis of the irradiation device in the space between the material supply member and the object, and the control of the processing device by the control device includes controlling the beam path of the energy beam from the irradiation device based on at least one of the shape and size of the material supply area. According to a second aspect, a processing system is provided which includes a material supply member that supplies a modeling material, an irradiation device that emits an energy beam, and a processing device that performs additional processing to form a model on an object by melting the modeling material supplied from the material supply member with the energy beam emitted from the irradiation device, and a control device that can control the processing device, wherein the material supply member supplies the modeling material to a material supply area within a plane that intersects with the optical axis of the irradiation device in the space between the material supply member and the object, and the control device controls the supply pattern of the modeling material from the material supply member based on the irradiation pattern of the energy beam. According to a third aspect, a processing system is provided which includes a material supply member that supplies a modeling material and an irradiation device that emits an energy beam, and which performs additional processing to form a modeled object on an object by melting the modeling material supplied from the material supply member with the energy beam emitted from the irradiation device, and a control device capable of controlling the processing device, wherein the control device controls the processing device so that the modeling material supplied into the space between the material supply member and the object is melted by irradiating the energy beam onto the modeling material, and the molten modeling material is supplied to the object to form the modeled object on the object, and the control device controls the energy beam irradiated onto the modeling material based on the supply mode of the modeling material supplied to the space.According to a fourth aspect, a processing system is provided which includes a material supply member which supplies a modeling material, an irradiation device which emits an energy beam, and which performs additional processing to form a model on an object by melting the modeling material supplied from the material supply member with the energy beam emitted from the irradiation device, and a control device which can control the processing device, wherein the material supply member supplies the modeling material to a material supply area in a plane which intersects with the optical axis of the irradiation device in the space between the material supply member and the object, and the control of the processing device by the control device includes control of the irradiation of the energy beam from the irradiation device based on at least one of the shape and size of the material supply area. According to a fifth aspect, a processing method is provided that includes supplying a modeling material from a material supply member, emitting an energy beam from an irradiation device, and performing additional processing to form a model on an object by melting the modeling material supplied from the material supply member with the energy beam emitted from the irradiation device, wherein supplying the modeling material includes supplying the modeling material to a material supply area in a plane that intersects with the optical axis of the irradiation device in the space between the material supply member and the object, and performing the additional processing includes setting the beam path of the energy beam from the irradiation device based on at least one of the shape and size of the material supply area. According to a sixth aspect, a processing method is provided which includes supplying a modeling material from a material supply member, emitting an energy beam from an irradiation device, and performing additional processing to form a model on an object by melting the modeling material supplied from the material supply member with the energy beam emitted from the irradiation device, wherein supplying the modeling material includes supplying the modeling material to a material supply area in a plane intersecting the optical axis of the irradiation device in the space between the material supply member and the object, and setting the supply mode of the modeling material from the material supply member based on the mode of the energy beam.According to a seventh aspect, a processing method is provided which includes supplying a modeling material from a material supply member, emitting an energy beam from an irradiation device, and performing additional processing to form a model on the object by melting the modeling material supplied from the material supply member in the space between the material supply member and the object with the energy beam emitted from the irradiation device, wherein performing the additional processing includes setting the energy beam to be irradiated to the modeling material based on the type of the modeling material supplied to the space. According to an eighth aspect, there is provided a processing method including: supplying a build material from a material supply member; emitting an energy beam from an irradiation device; and performing additional processing to form a structure on an object by melting the build material supplied from the material supply member with the energy beam emitted from the irradiation device, wherein supplying the build material includes supplying the build material to a material supply region within a plane intersecting an optical axis of the irradiation device in a space between the material supply member and the object, and performing the additional processing includes controlling irradiation of the energy beam from the irradiation device based on at least one of a shape and a size of the material supply region.

[0005] FIG. 1 is a cross-sectional view showing the configuration of a processing system of this embodiment. FIG. 2 is a block diagram showing the configuration of the processing system of this embodiment. FIG. 3 is a plan view showing the bottom surface of a material nozzle. FIGS. 4(a) to 4(c) are each a plan view showing an example of a material supply region in a material supply surface. FIG. 5 is a cross-sectional view showing the structure of an irradiation optical system. FIG. 6(a) is a plan view showing the movement trajectory of a target irradiation region within a processing unit area, and FIG. 6(b) is a plan view showing the movement trajectory of a target irradiation region on a printing surface. FIGS. 7(a) and 7(b) are each a plan view showing the movement trajectory of a target irradiation region within a processing unit area, and FIG. 7(c) is a plan view showing the movement trajectory of a target irradiation region on a printing surface. FIGS. 8(a) to 8(e) are each a cross-sectional view showing a process of printing a structure layer by the first printing operation. FIGS. 9(a) to 9(c) are each a cross-sectional view showing a process of printing a three-dimensional structure. FIGS. 10( a) to 10(d) are cross-sectional views showing a process of forming a structure layer by the second modeling operation. FIG. 11 shows processing light passing through a material irradiation surface. FIGS. 12( a), 12(c), and 12(d) are plan views showing a movement trajectory of a target irradiation area within a processing unit area, and FIGS. 12(b) and 12(e) are plan views showing a movement trajectory of a target irradiation area on a modeling surface. FIGS. 13( a) to 13(c) are plan views showing a relationship between a material supply area and an irradiation unit area. FIG. 14(a) is a cross-sectional view showing an example of a processing head performing the first modeling operation, and FIG. 14(b) is a cross-sectional view showing an example of a processing head performing the second modeling operation. FIG. 15 is a cross-sectional view showing an example of an operation to control a material control point. FIG. 16 is a cross-sectional view showing an example of an operation to control a material control point. Fig. 17(a) is a plan view showing a structure layer formed by performing both the first and second modeling operations, Fig. 17(b) is a plan view showing a part of the structure layer (exterior wall object) formed by performing the first modeling operation, Fig. 17(c) is a plan view showing another part of the structure layer (filled object) formed by performing the second modeling operation, Fig. 18(a) is a plan view showing a structure layer formed by performing both the first and second modeling operations, and Fig. 18(b) is a cross-sectional view showing a structure layer formed by performing both the first and second modeling operations.FIG. 19 is a cross-sectional view showing a processing light that is changed to form a structure layer by performing both the first and second modeling operations. FIG. 20 is a cross-sectional view showing a three-dimensional structure formed by performing both the first and second modeling operations. FIG. 21(a) conceptually shows a separation device that separates a three-dimensional structure from a workpiece, and FIG. 21(b) shows the three-dimensional structure separated from the workpiece. FIG. 22 is a cross-sectional view showing a processing light used in a first application and a processing light used in a second application. FIG. 23 is a cross-sectional view showing a processing light used in the first application and a processing light used in the second application. FIG. 24 is a cross-sectional view showing a processing light used in the first application and a processing light used in the second application. FIG. 25 is a cross-sectional view showing a workpiece to which a modeling material with a controlled temperature distribution has been supplied. FIGS. 26(a) and 26(b) each show the relationship between a material supply region where the modeling material is supplied and the movement trajectory of a beam passing region. FIGS. 27(a) and 27(b) show the relationship between a material supply area where the shaping material is supplied and the movement trajectory of the beam passage area. FIGS. 28(a) and 28(b) show the relationship between a material supply area where the shaping material is supplied and the movement trajectory of the beam passage area. FIGS. 29(a) and 29(b) show the actual movement trajectory of the beam passage area achieved by controlling the light source. FIGS. 30 show the relationship between the number of processing light beams, the size of the beam passage area, and the movement speed of the beam passage area. FIG. 31 shows the recoil force generated in the shaping material melted by irradiation with the processing light. FIG. 32 shows the distribution of the supply amount of shaping material on the shaping surface. FIG. 33(a) is a cross-sectional view showing the relationship between the material supply area and the irradiation unit area, and FIG. 33(b) is a plan view showing the relationship between the material supply area and the irradiation unit area. FIG. 34 is a cross-sectional view showing the relationship between the material supply area and the irradiation unit area. FIG. 35 is a cross-sectional view showing an example of an operation for controlling the size of the material supply area. Figures 36(a) and 36(b) are cross-sectional views showing a measuring device. Figure 37 is a cross-sectional view showing an example of an operation for controlling the size of a material supply area. Figure 38 is a cross-sectional view showing an imaging device provided in the processing system. Figure 39 is a cross-sectional view showing an imaging device provided in the processing system. Figure 40 is a flowchart showing the flow of a molten material feedback control operation based on a material image.FIG. 41 shows a molten material image. FIG. 42 shows an added image generated by adding (i.e., compositing) multiple molten material images. FIG. 43 is a timing chart showing the relationship between the size of a molten material region and a target size. FIG. 44 is a cross-sectional view showing an imaging device provided in the machining system. FIG. 45(a) is a timing chart showing the imaging timing of the imaging device, FIG. 45(b) is a timing chart showing the exposure time of the imaging device, and FIG. 45(c) is a timing chart showing the imaging period and imaging rate of the imaging device. FIG. 46 is a plan view showing a shaped object having a desired shape pattern to be formed within a machining unit area. FIGS. 47(a) and 47(b) are each plan views showing a shaped object having a desired shape pattern to be formed within a machining unit area. FIG. 48 is a plan view showing a shaped object formed by moving the machining unit area on the modeling surface while forming an object having a desired shape pattern within the machining unit area. Fig. 49 is a plan view showing an object formed by moving the processing unit areas on the printing surface while printing an object having a desired shape pattern within the processing unit areas. Fig. 50 is a plan view showing an object formed by moving the processing unit areas on the printing surface while printing an object having a desired shape pattern within the processing unit areas. Fig. 51 is a plan view showing the actual shape pattern of the object to be printed on the printing surface and a shape pattern obtained by compressing the actual shape pattern of the object to be printed on the printing surface along the movement direction of the processing unit areas. Fig. 52 is a plan view showing the actual shape pattern of the object to be printed on the printing surface and a shape pattern obtained by deforming the actual shape pattern of the object to be printed on the printing surface in a deformation manner capable of offsetting distortion occurring in the shape pattern of the object to be printed on the printing surface. Fig. 53(a) is a plan view showing a target movement trajectory of a processing unit area, Fig. 53(b) is a plan view showing a linear object to be formed on the forming surface when the processing unit area moves along the target movement trajectory shown in Fig. 53(a). Fig. 54(a) is a plan view showing a structure layer, and Fig. 54(b) is a plan view showing an operation of changing the width of the processing unit area so as to form the structure layer shown in Fig. 54(a).Fig. 55(a) is a plan view showing a structure layer, and Fig. 55(b) is a plan view showing an operation of changing the width of a processing unit area so as to form the structure layer shown in Fig. 55(a). Fig. 56(a) to Fig. 56(c) are side views showing examples of material nozzles.

[0006] Hereinafter, embodiments of a processing system and a processing method will be described with reference to the drawings. Hereinafter, embodiments of a processing device and a processing method will be described using a processing system SYS capable of processing a workpiece W, which is an example of an object. In particular, below, embodiments of a processing device and a processing method will be described using a processing system SYS that performs additive processing based on laser metal deposition (LMD). Additional processing based on laser metal deposition is additive processing that forms a shaped object that is integrated with the workpiece W or that can be separated from the workpiece W by melting a shaping material M supplied to the workpiece W with processing light EL (i.e., an energy beam in the form of light).

[0007] In the following description, the positional relationships of the various components constituting the machining system SYS will be explained using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes. For the sake of convenience, in the following description, it is assumed that the X-axis direction and the Y-axis direction are horizontal (i.e., predetermined directions within a horizontal plane), and the Z-axis direction is vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-and-down direction). Furthermore, the rotation directions around the X-axis, Y-axis, and Z-axis (in other words, tilt directions) are referred to as the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Furthermore, the XY plane may be the horizontal direction. (1) Configuration of the machining system SYS (1-1) Overall configuration of the machining system SYS

[0008] First, the configuration of the machining system SYS of this embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a cross-sectional view schematically showing the configuration of the machining system SYS of this embodiment. Fig. 2 is a block diagram showing the configuration of the machining system SYS of this embodiment.

[0009] The machining system SYS is capable of performing additive processing on the workpiece W. By performing additive processing on the workpiece W, the machining system SYS is capable of forming a shaped object that is integrated with (or separable from) the workpiece W. In this case, the additional processing performed on the workpiece W corresponds to processing that adds, to the workpiece W, a shaped object that is integrated with (or separable from) the workpiece W. Note that the shaped object in this embodiment may refer to any object that the machining system SYS forms. For example, the machining system SYS is capable of forming a three-dimensional structure ST (that is, a three-dimensional structure that has a size in all three-dimensional directions, a solid object, in other words, a structure that has a size in the X-axis direction, Y-axis direction, and Z-axis direction) as an example of a shaped object.

[0010] When the workpiece W is a stage 31 (described later), the processing system SYS can perform additional processing on the stage 31. When the workpiece W is a mounted object, which is an object placed on the stage 31, the processing system SYS can perform additional processing on the mounted object. The mounted object placed on the stage 31 may be another three-dimensional structure ST (i.e., an existing structure) formed by the processing system SYS. The workpiece W may also be held by a holder that can be placed on the stage 31. That is, a holder may hold the workpiece W, and the holder holding the workpiece W may be placed on the stage 31. The holder may also be called a jig, holder, holding member, mounting member, or clamp. Note that FIG. 1 shows an example in which the workpiece W is an existing structure placed on the stage 31. In the following description, the workpiece W is an existing structure placed on the stage 31 as an example.

[0011] The workpiece W may be a product that has a missing portion and needs to be repaired. In this case, the machining system SYS may perform repair processing to repair the product that needs to be repaired by performing additional processing to form a shaped object to fill the missing portion. In other words, the additional processing performed by the machining system SYS may include additional processing to add a shaped object to the workpiece W to fill the missing portion.

[0012] As described above, the processing system SYS is capable of performing additive processing based on the laser buildup welding method. In other words, the processing system SYS can also be said to be a 3D printer that processes an object using additive manufacturing technology. Note that additive manufacturing technology may also be referred to as rapid prototyping, rapid manufacturing, or additive manufacturing. Note that the laser buildup welding method (LMD) may also be referred to as directed energy deposition (DED).

[0013] A processing system SYS using additive manufacturing technology sequentially forms multiple structural layers SL (see FIG. 8 , described later) to form a three-dimensional structure ST in which multiple structural layers SL are stacked. In this case, the processing system SYS first sets the surface of the workpiece W as a printing surface MS on which the object is actually printed, and prints the first structural layer SL on the printing surface MS. The processing system SYS then sets the surface of the first structural layer SL as a new printing surface MS, and prints the second structural layer SL on the new printing surface MS. Thereafter, the processing system SYS repeats the same operations to form a three-dimensional structure ST in which multiple structural layers SL are stacked.

[0014] The processing system SYS performs additive processing by processing the modeling material M using processing light EL, which is an energy beam. The modeling material M is a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. For example, at least one of a metallic material and a resinous material can be used as the modeling material M. Examples of metallic materials include at least one of a material containing copper, a material containing tungsten, and a material containing stainless steel. However, materials other than metallic materials and resinous materials may also be used as the modeling material M. The modeling material M is a powdered material. In other words, the modeling material M is a powder. However, the modeling material M does not have to be a powder. For example, at least one of a wire-shaped modeling material and a gaseous modeling material may be used as the modeling material M.

[0015] Like the forming material M, the workpiece W may also be an object containing a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. The material of the workpiece W may be the same as or different from the forming material M. For example, at least one of a metallic material and a resinous material can be used as the material of the workpiece W. Examples of metallic materials include at least one of a material containing copper, a material containing tungsten, and a material containing stainless steel. However, materials other than metallic materials and resinous materials may also be used as the material of the workpiece W.

[0016] 1 and 2 , the processing system SYS includes a material supply source 1, a processing unit 2, a stage unit 3, a light source 4, a gas supply source 5, and a control unit 7. The processing unit 2 and the stage unit 3 may be housed in a chamber space 63IN inside the housing 6. In this case, the processing system SYS may perform additional processing in the chamber space 63IN. Note that at least one of the processing unit 2 and the stage unit 3 does not have to be housed in the chamber space 63IN inside the housing 6.

[0017] The processing unit 2 may be referred to as a processing device. An apparatus including the processing unit 2 and at least one of the material supply source 1, the stage unit 3, the light source 4, and the gas supply source 5 may be referred to as a processing device. The control unit 7 may be referred to as a control device.

[0018] The material supply source 1 supplies the processing unit 2 with the modeling material M. The material supply source 1 supplies a desired amount of modeling material M according to the required amount so that the amount of modeling material M required per unit time for performing additive processing is supplied to the processing unit 2.

[0019] The processing unit 2 processes the modeling material M supplied from the material supply source 1 to form a model. To form the model, the processing unit 2 includes a processing head 21, a head drive system 22, and a nozzle drive system 23. The processing head 21 further includes an irradiation device 210 and a material nozzle 212. The processing head 21 may also be referred to as a processing device.

[0020] The irradiation device 210 is a device for emitting the processing light EL. To emit the processing light EL, the irradiation device 210 is equipped with an irradiation optical system 211. The irradiation optical system 211 is an optical system for emitting the processing light EL. Specifically, the irradiation optical system 211 is optically connected to a light source 4 that emits (generates) the processing light EL via an optical transmission member 41. An example of the optical transmission member 41 is at least one of an optical fiber and a light pipe.

[0021] In the example shown in Figures 1 and 2, the processing system SYS includes two light sources 4 (specifically, light sources 4#1 and 4#2), and the irradiation optical system 211 is optically connected to the light sources 4#1 and 4#2 via optical transmission members 41#1 and 41#2, respectively. The irradiation optical system 211 emits both the processed light EL propagating from the light source 4#1 via the optical transmission member 41#1 and the processed light EL propagating from the light source 4#2 via the optical transmission member 41#2. In the following description, when it is necessary to distinguish between the two processed light EL emitted by the irradiation optical system 211, the processed light EL generated by the light source 4#1 will be referred to as "processed light EL#1" and the processed light EL generated by the light source 4#2 will be referred to as "processed light EL#2." On the other hand, when it is not necessary to distinguish between the two processed light EL, "processed light EL" may refer to at least one of the processed light EL#1 and EL#2.

[0022] However, the processing system SYS may include a single light source 4 instead of the multiple light sources 4. The irradiation optical system 211 may emit a single processing light EL instead of emitting multiple processing light EL.

[0023] The irradiation optical system 211 emits the processing light EL downward (i.e., toward the -Z side). In the example shown in FIG. 1 , the irradiation optical system 211 emits the processing light EL so that the processing light EL travels in an irradiation direction (in other words, a traveling direction) along the Z axis from the irradiation optical system 211. A stage 31 is disposed below the irradiation optical system 211. When a workpiece W is placed on the stage 31, the irradiation optical system 211 irradiates the emitted processing light EL onto the printing surface MS. Specifically, the irradiation optical system 211 may irradiate the processing light EL onto a target irradiation area (target irradiation position) EA that is set on the printing surface MS as an area to be irradiated (typically, focused) with the processing light EL. In the following description, when it is necessary to distinguish between the two target irradiation areas EA onto which the irradiation optical system 211 irradiates the two processing beams EL, the target irradiation area EA onto which the irradiation optical system 211 irradiates the processing beam EL#1 will be referred to as the “target irradiation area EA#1,” and the target irradiation area EA onto which the irradiation optical system 211 irradiates the processing beam EL#2 will be referred to as the “target irradiation area EA#2.” Furthermore, under the control of the control unit 7, the state of the irradiation optical system 211 can be switched between a state in which the processing beam EL is irradiated onto the target irradiation area EA and a state in which the processing beam EL is not irradiated onto the target irradiation area EA.

[0024] The irradiation optical system 211 may form a molten pool MP on the printing surface MS by irradiating the printing surface MS with processing light EL. For example, the irradiation optical system 211 may form a molten pool MP#1 on the printing surface MS by irradiating the printing surface MS with processing light EL#1. For example, the irradiation optical system 211 may form a molten pool MP#2 on the printing surface MS by irradiating the printing surface MS with processing light EL#2. The molten pool MP#1 and the molten pool MP#2 may be integrated. Alternatively, the molten pool MP#1 and the molten pool MP#2 may be separated from each other. However, the molten pool MP#1 does not necessarily have to be formed on the printing surface MS by irradiating the printing surface MS with processing light EL#1. The molten pool MP#2 does not necessarily have to be formed on the printing surface MS by irradiating the printing surface MS with processing light EL#2.

[0025] As will be described in detail later, the irradiation optical system 211 may irradiate the material irradiation surface ES with the processing light EL. The material irradiation surface ES is a virtual optical surface located between the irradiation optical system 211 and the modeling surface MS. The irradiation optical system 211 may melt the modeling material M passing through the material irradiation surface ES by irradiating the material irradiation surface ES with the processing light EL.

[0026] The material nozzle 212 supplies (e.g., injects, jets, spouts, or sprays) the modeling material M. For this reason, the material nozzle 212 may also be referred to as a material supply member. The material nozzle 212 is physically connected to the material supply source 1, which is a supply source of the modeling material M, via the supply pipe 11 and the mixer 12. The material nozzle 212 supplies the modeling material M supplied from the material supply source 1 via the supply pipe 11 and the mixer 12. The material nozzle 212 may pressure-feed the modeling material M supplied from the material supply source 1 via the supply pipe 11. That is, the modeling material M from the material supply source 1 and a conveying gas (i.e., a pressure-feed gas, for example, an inert gas such as nitrogen or argon) may be mixed in the mixer 12 and then pressure-feed to the material nozzle 212 via the supply pipe 11. As a result, the material nozzle 212 supplies the modeling material M together with the conveying gas. For example, a purge gas supplied from the gas supply source 5 is used as the conveying gas. However, a gas supplied from a gas supply source different from the gas supply source 5 may be used as the transport gas.

[0027] The material nozzle 212 supplies the modeling material M downward (i.e., toward the −Z side) from the material nozzle 212. The stage 31 is disposed below the material nozzle 212. When a workpiece W is mounted on the stage 31, the material nozzle 212 supplies the modeling material M toward the modeling surface MS.

[0028] A material supply port 2121 is formed on the lower surface of the material nozzle 212. For example, as shown in FIG. 3, which is a plan view showing the lower surface of the material nozzle 212, an annular material supply port 2121 is formed on the lower surface of the material nozzle 212. In the example shown in FIG. 3, the shape of the outer edge of the material supply port 2121 along a plane intersecting the Z axis is circular, but it may have a shape other than circular. For example, the shape of the outer edge of the material supply port 2121 along a plane intersecting the Z axis may be elliptical or polygonal. Also, in the example shown in FIG. 3, the material supply port 2121, which is a single, annular or ring-shaped opening, is formed on the lower surface of the material nozzle 212. However, multiple material supply ports 2121, which are arc-shaped, circular, elliptical, or rectangular openings, may be formed on the lower surface of the material nozzle 212. The material nozzle 212 supplies the modeling material M from the material supply port 2121. When the material supply port 2121 is formed in this manner, the material nozzle 212 may supply the modeling material M so that the shape of the material supply region MSA in a virtual material supply surface PL that intersects with the Z-axis between the material nozzle 212 and the modeling surface MS becomes a shape corresponding to the material supply port 2121. For example, as shown in FIG. 4( a), which is a plan view showing an example of the material supply region MSA in the material supply surface PL, the material nozzle 212 may supply the modeling material M so that the shape of the material supply region MSA in each of the material supply surfaces PL#1 and PL#2, which are examples of the material supply surface PL, becomes annular in shape corresponding to the annular material supply port 2121. For example, as shown in FIG. 4( b), which is a plan view showing an example of the material supply region MSA in the material supply surface PL, the material nozzle 212 may supply the modeling material M so that the shape of the material supply region MSA in each of the material supply surfaces PL#4 and PL#5, which are examples of the material supply surface PL, becomes annular in shape corresponding to the annular material supply port 2121. For example, as shown in Figure 4(c), which is a plan view showing an example of a material supply area MSA within the material supply surface PL, the material nozzle 212 may supply the molding material M so that the shape of the material supply area MSA within each of the material supply surfaces PL#6 and PL#7, which are examples of the material supply surface PL, becomes a ring-shaped shape corresponding to the ring-shaped material supply port 2121.

[0029] The material supply area MSA is a virtual area within a virtual material supply surface PL that intersects with the Z-axis between the material nozzle 212 and the printing surface MS, where the printing material M is supplied. In other words, the material supply area MSA is a virtual area within the material supply surface PL through which the printing material M supplied from the material nozzle 212 passes. In this case, the material nozzle 212 may be considered to be supplying the printing material M to the material supply area MSA. Because the printing material M passes through the material supply surface PL, the material supply surface PL may also be referred to as a material passing surface.

[0030] However, if the modeling material M is a powdered material, the amount (supply amount) of modeling material M supplied to each position on the material supply surface PL may vary over time. For example, while the modeling material M may be supplied to a position on the material supply surface PL at a first time, the modeling material M may not be supplied to the same position on the material supply surface PL at a second time different from the first time. In other words, if the modeling material M is a powdered material, the amount (passing amount) of modeling material M passing through each position on the material supply surface PL may vary over time. For example, while the modeling material M may pass through a position on the material supply surface PL at a first time, the modeling material M may not pass through the same position on the material supply surface PL at a second time different from the first time. This is because it is unlikely that the trajectory of the powdered modeling material M supplied from the material nozzle 212 will always be the same. For this reason, in this embodiment, the material supply area MSA may be a virtual area whose outer edge (in other words, boundary) is a line connecting multiple positions that satisfy the condition that "the integrated value of the supply amount (passing amount) of the building material M per unit time within the material supply surface PL coincides with a predetermined ratio of the maximum integrated value of the supply amount (passing amount) of the building material M per unit time within the material supply surface PL." An example of the predetermined ratio is 50% or a ratio greater than 50%. Another example of the predetermined ratio is 60% or a ratio greater than 60%. Another example of the predetermined ratio is 70% or a ratio greater than 70%. Another example of the predetermined ratio is 80% or a ratio greater than 80%. Another example of the predetermined ratio is 90% or a ratio greater than 90%.

[0031] 1, the material nozzle 212 may supply the modeling material M from the material supply port 2121 along a material supply direction inclined with respect to the Z axis. In this case, the material nozzle 212 may supply the modeling material M from multiple locations in the material supply port 2121 along different material supply directions. In other words, the material nozzle 212 may supply the modeling material M from multiple supply positions in the material supply port 2121 along different material supply directions. 3 and 4(a) to 4(c), the material nozzle 212 may supply the modeling material M so that the modeling material M is supplied from a first supply port portion 2122 of the material supply port 2121 along a first material supply direction inclined with respect to the Z axis, and the modeling material M is supplied from a second supply port portion 2123 of the material supply port 2121, which is different from the first supply port portion 2122, along a second material supply direction inclined with respect to the Z axis and different from the first material supply direction. In this case, as shown in FIGS. 4(a) to 4(c), the size (e.g., outer diameter) of the material supply area MSA within the material supply surface PL typically changes depending on the distance between the material supply surface PL and the material nozzle 212 (particularly the material supply port 2121) along the Z axis.

[0032] 4( a) to 4(c), the material nozzle 212 supplies the modeling material M so that the size of the material supply area MSA within the material supply area PL decreases as the distance between the material supply area PL and the material nozzle 212 (particularly the material supply port 2121) along the Z axis increases. In other words, the material nozzle 212 supplies the modeling material M so that the modeling material M supplied from the material nozzle 212 gradually converges. As an example, in the example shown in FIG. 4(a), the size (e.g., outer diameter) of the material supply area MSA on the material supply area PL#2 is smaller than the size (e.g., outer diameter) of the material supply area MSA on the material supply area PL#1 located between the material supply area PL#2 and the material nozzle 212 (i.e., closer to the material nozzle 212 than the material supply area PL#2).

[0033] When the modeling material M is supplied from multiple locations of the material supply port 2121 along different directions, the material nozzle 212 may supply the modeling material M so that multiple virtual material supply axes SX extending along multiple material supply directions intersect. For example, as shown in Figures 4(a) to 4(c), the material nozzle 212 may supply the modeling material M so that a virtual material supply axis SX#1 extending along the material supply direction of the modeling material M supplied from the first supply port portion 2122 of the material supply port 2121 intersects with a virtual material supply axis SX#2 extending along the material supply direction of the modeling material M supplied from the second supply port portion 2123 of the material supply port 2121.

[0034] 4A, the material nozzle 212 may supply the modeling material M such that multiple virtual material supply axes SX extending along multiple material supply directions intersect above the modeling surface MS. In other words, the material nozzle 212 may supply the modeling material M such that multiple virtual material supply axes SX extending along multiple material supply directions intersect in the space between the modeling surface MS and the material nozzle 212. In this case, the modeling material M supplied from multiple locations of the material supply port 2121 along different material supply directions may intersect above the modeling surface MS. In other words, the modeling material M supplied from multiple locations of the material supply port 2121 along different material supply directions may intersect in the space between the modeling surface MS and the material nozzle 212. In this case, as shown in Figure 4(a), within the material supply surface PL (in the example shown in Figure 4(a), material supply surface PL#3) located at the position where the modeling material M supplied from multiple locations of the material supply port 2121 along different material supply directions intersects, the shape of the material supply area MSA may be a shape other than an annular shape. For example, as shown in Figure 4(a), the shape of the material supply area MSA may be a circle or a shape that can be regarded as a circle.

[0035] As another example, as shown in FIG. 4( b), the material nozzle 212 may supply the modeling material M so that multiple virtual material supply axes SX extending along multiple material supply directions intersect below the modeling surface MS. In this case, the modeling material M supplied from multiple locations of the material supply port 2121 along different directions may not intersect. The modeling material M supplied from multiple locations of the material supply port 2121 along different directions may reach the modeling surface MS before intersecting with each other. In this case, as shown in FIG. 4( b), within the modeling surface MS that may be considered the material supply surface PL, the shape of the material supply area MSA may be annular. However, within the modeling surface MS that may be considered the material supply surface PL, the shape of the material supply area MSA may be different from annular. For example, within the modeling surface MS, the shape of the material supply area MSA may be circular or a shape that can be considered circular.

[0036] As another example, as shown in FIG. 4( c), the material nozzle 212 may supply the building material M so that multiple virtual material supply axes SX extending along multiple material supply directions intersect on the building surface MS. In this case, the building material M supplied from multiple locations of the material supply port 2121 along multiple different material supply directions may intersect on the building surface MS. In this case, as shown in FIG. 4( c), within the building surface MS that may be considered the material supply surface PL, the shape of the material supply area MSA may be different from an annular shape. For example, within the building surface MS, the shape of the material supply area MSA may be circular or a shape that can be considered circular.

[0037] In the following description, for convenience of explanation, the position (point) where multiple virtual material supply axes SX extending along multiple material supply directions intersect is referred to as the material control point MCP. Note that, if the modeling material M is a powder, the material control point MCP may also be referred to as a powder control point. In this case, in the example shown in FIG. 4( a), the material nozzle 212 can be said to supply the modeling material M with the material control point MCP located above the modeling surface MS. In the example shown in FIG. 4( a), the material nozzle 212 can be said to supply the modeling material M with the material control point MCP located in the space between the modeling surface MS and the material nozzle 212. On the other hand, in the example shown in FIG. 4( b), the material nozzle 212 can be said to supply the modeling material M with the material control point MCP located below the modeling surface MS. 4(b), the material nozzle 212 supplies the building material M in a state where the material control point MCP is located inside (inside) the workpiece W, below the workpiece W, inside (inside) the already-built structure layer SL, and / or below the already-built structure layer SL. On the other hand, in the example shown in FIG. 4(c), the material nozzle 212 supplies the building material M in a state where the material control point MCP is located on the building surface MS.

[0038] The material supply direction from the material nozzle 212 is typically a direction specific to the material nozzle 212. For this reason, the material control point MCP may be considered to be a point specific to the material nozzle 212. In other words, the material control point MCP may be considered to be a point determined based on the material nozzle 212. Note that, as long as the material control point MCP is a point determined based on the material nozzle 212, a position (point) different from the position (point) at which multiple virtual material supply axes SX intersect may be used as the material control point MCP. Note that, when the material control point MCP is a point determined based on the material nozzle 212, the positional relationship between the material control point MCP and the material nozzle 212 may be considered to be fixed.

[0039] Because multiple virtual material supply axes SX extending along multiple material supply directions intersect at the material control point MCP, when there is no object (e.g., a workpiece W having a printing surface MS on its surface; the same applies below) that blocks the printing material M, the printing material M supplied from the material nozzle 212 along multiple different material supply directions is supplied to the material control point MCP. Therefore, the material control point MCP may be considered to be a point to which the printing material M is supplied from the material nozzle 212 along multiple different material supply directions when there is no object that blocks the printing material M. The material control point MCP may be considered to be a point located in space where the printing material M can be supplied from the material nozzle 212 when there is no object that blocks the printing material M.

[0040] In reality, in a situation where an object (e.g., a printing surface MS) that blocks the printing material M is present, when the material control point MCP is located below the printing surface MS as described above, the material control point MCP may be located in the space occupied by the object (typically, the workpiece W) that blocks the printing material M. The material control point MCP may also be located inside the object (typically, the workpiece W) that blocks the printing material M.

[0041] Because multiple virtual material supply axes SX extending along multiple material supply directions intersect at the material control point MCP, when there is no object blocking the modeling material M, the modeling material M supplied from the material nozzle 212 along multiple different material supply directions intersects at the material control point MCP. Therefore, when there is no object blocking the modeling material M, the material control point MCP may be considered to be the point where the modeling material M supplied from the material nozzle 212 along multiple different material supply directions intersect.

[0042] Because multiple virtual material supply axes SX extending along multiple material supply directions intersect at the material control point MCP, when there is no object blocking the modeling material M, the modeling material M supplied from the material nozzle 212 along multiple different material supply directions converges at the material control point MCP. For this reason, the material control point MCP may be considered to be a point where the modeling material M supplied from the material nozzle 212 along multiple different material supply directions converges when there is no object blocking the modeling material M.

[0043] Because multiple virtual material supply axes SX extending along multiple material supply directions intersect at the material control point MCP, when there is no object blocking the modeling material M, the modeling material M supplied from the material nozzle 212 along multiple different material supply directions is concentrated at the material control point MCP. For this reason, the material control point MCP may be considered to be a point where the modeling material M supplied from the material nozzle 212 along multiple different material supply directions is concentrated when there is no object blocking the modeling material M.

[0044] Because the building material M supplied from the material nozzle 212 along multiple different material supply directions intersect (converge or concentrate) at the material control point MCP, the density of the building material M within the material supply plane PL located at the same position as the material control point MCP in the Z-axis direction is higher than the density of the building material M within the material supply plane PL located away from the material control point MCP along the Z-axis direction. Typically, the density of the building material M is highest within the material supply plane PL located at the same position as the material control point MCP in the Z-axis direction. For this reason, the material control point MCP may be considered to be a point located at the same position in the Z-axis direction as one material supply plane PL that satisfies the condition that "the density of the building material M within the material supply plane PL is highest."

[0045] Because multiple imaginary material supply axes SX extending along multiple material supply directions intersect at the material control point MCP, there is a relatively high possibility that the shape of the material supply area MSA will be circular or a shape that can be regarded as circular (i.e., a shape other than an annular shape) at the position of the material control point MCP, as explained with reference to Figures 4(a) to 4(c). In this case, the material control point MCP may be considered to be a point whose position in the Z-axis direction is the same as that of one material supply surface PL that satisfies the condition that "the shape of the material supply area MSA within the material supply surface PL is circular or a shape that can be regarded as circular (i.e., a shape other than an annular shape)."

[0046] The processing light EL emitted from the irradiation optical system 211 may travel through a space at least partially surrounded by the shaping material M supplied from the material nozzle 212. In this case, the processing light EL traveling through the space at least partially surrounded by the shaping material M supplied from the material nozzle 212 may be irradiated onto the shaping surface MS. For example, in the example shown in Figures 4(a) to 4(c), the processing light EL emitted from the irradiation optical system 211 may travel through a conical space whose outer edge is the shaping material M supplied from the material nozzle 212. For example, in the example shown in Figures 4(a) to 4(c), the processing light EL emitted from the irradiation optical system 211 may travel through a conical space whose outer edge is the shaping material M supplied from the material nozzle 212.

[0047] The processing light EL emitted from the irradiation optical system 211 may travel through a space sandwiched between the shaping materials M supplied from multiple locations on the material nozzle 212. In this case, the processing light EL traveling through the space sandwiched between the shaping materials M supplied from multiple locations on the material nozzle 212 may be irradiated onto the shaping surface MS. For example, in the example shown in FIGS. 4( a) to 4(c), the processing light EL emitted from the irradiation optical system 211 may travel through a space sandwiched between the shaping materials M supplied from the first supply port portion 2122, which is a part of the material supply port 2121, and the shaping materials M supplied from the second supply port portion 2123, which is another part of the material supply port 2121. In other words, the processing light EL emitted from the irradiation optical system 211 may travel through a cone-shaped or frustum-shaped space whose ridgelines are multiple material supply axes SX extending along multiple material supply directions.

[0048] 1 and 2 , the head drive system 22 moves the machining head 21 under the control of the control unit 7. That is, the head drive system 22 moves the irradiation optical system 211 and the material nozzle 212 under the control of the control unit 7. The head drive system 22 moves the machining head 21, for example, along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction. Note that the operation of moving the machining head 21 along at least one of the θX direction, θY direction, and θZ direction may be considered equivalent to the operation of rotating the machining head 21 around at least one of the rotation axes along the X-axis, Y-axis, and Z-axis.

[0049] When the head drive system 22 moves the machining head 21, the relative positional relationship between the machining head 21 and the stage 31 and the workpiece W placed on the stage 31 changes. As a result, the relative positional relationship between the stage 31, the workpiece W, and the irradiation optical system 211 provided in the machining head 21 changes. For this reason, the head drive system 22 may be considered to function as a position changing device that can change the relative positional relationship between the stage 31, the workpiece W, and the irradiation optical system 211. Furthermore, when the relative positional relationship between the stage 31, the workpiece W, and the machining head 21 changes, the relative positional relationship between the target irradiation areas EA#1 and EA#2 and the target supply area MA and the workpiece W also changes. In other words, the target irradiation areas EA#1 and EA#2 and the target supply area MA each move along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction on the surface of the workpiece W (more specifically, the build surface MS on which additional machining is performed). In this case, it may be considered that the head drive system 22 moves the processing head 21 so that the target irradiation areas EA#1 and EA#2 and the target supply area MA each move on the printing surface MS.

[0050] The nozzle drive system 23 moves the material nozzle 212. On the other hand, the nozzle drive system 23 does not move the irradiation optical system 211. In other words, the nozzle drive system 23 moves the material nozzle 212 relative to the irradiation optical system 211. The nozzle drive system 23 moves the material nozzle 212 separately from the irradiation optical system 211. The nozzle drive system 23 moves the material nozzle 212 independently of the irradiation optical system 211. For this reason, the nozzle drive system 23 differs from the head drive system 22, which moves the irradiation optical system 211 and the material nozzle 212 simultaneously, in that the nozzle drive system 23 can move the material nozzle 212 without moving the irradiation optical system 211.

[0051] The nozzle drive system 23 moves the material nozzle 212 along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction, for example. In this embodiment, the nozzle drive system 23 moves the material nozzle 212 along the Z-axis.

[0052] When the nozzle drive system 23 moves the material nozzle 212 along the Z axis, the material control point MCP, which is determined based on the material nozzle 212, moves. Therefore, it may be considered that the nozzle drive system 23 controls the material control point MCP, which is determined based on the material nozzle 212, by moving the material nozzle 212. It may be considered that the nozzle drive system 23 controls the position of the material control point MCP, which is determined based on the material nozzle 212, by moving the material nozzle 212.

[0053] As an example, when the nozzle drive system 23 moves the material nozzle 212 along the Z-axis, the positional relationship between the build surface MS and the material control points MCP in the Z-axis direction changes. Therefore, it may be considered that the nozzle drive system 23 changes the positional relationship (particularly the positional relationship in the Z-axis direction) between the build surface MS and the material control points MCP by moving the material nozzle 212. It may also be considered that the nozzle drive system 23 changes the distance (particularly the distance in the Z-axis direction) between the build surface MS and the material control points MCP by moving the material nozzle 212.

[0054] Furthermore, when the head drive system 22 moves the machining head 21, the relative positional relationship between the stage 31, the workpiece W placed on the stage 31, and the material control points MCP changes, even if the nozzle drive system 23 does not move the material nozzle 212. In other words, the positional relationship between the build surface MS and the material control points MCP changes. This is because the positional relationship between the material control points MCP and the material nozzles 212, which move as the machining head 21 moves, is fixed. For this reason, the head drive system 22 may be considered to be changing the positional relationship between the build surface MS and the material control points MCP. For example, when the head drive system 22 moves the machining head 21 along the Z-axis direction, the head drive system 22 may be considered to be changing the distance (particularly the distance in the Z-axis direction) between the build surface MS and the material control points MCP.

[0055] As another example, when the nozzle drive system 23 moves the material nozzle 212 along the Z axis, the positional relationship between the focus position CP (see FIG. 5 ) of the processing light EL and the material control point MCP in the Z axis direction changes. Therefore, by moving the material nozzle 212, the nozzle drive system 23 may be considered to be changing the positional relationship (particularly the positional relationship in the Z axis direction) between the focus position CP of the processing light EL and the material control point MCP. By moving the material nozzle 212, the nozzle drive system 23 may be considered to be changing the distance (particularly the distance in the Z axis direction) between the focus position CP of the processing light EL and the material control point MCP. The focus position CP of the processing light EL will be described in detail later with reference to FIG. 5 . The stage unit 3 includes a stage 31 and a stage drive system 32.

[0056] The workpiece W is placed on the stage 31. Specifically, the workpiece W is placed on a stage placement surface 311, which is one surface of the stage 31 (e.g., the upper surface facing the +Z side). The stage 31 is capable of supporting the workpiece W placed on the stage 31. The stage 31 may be capable of holding the workpiece W placed on the stage 31. In this case, the stage 31 may be equipped with at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, or the like to hold the workpiece W. Alternatively, the stage 31 may not be capable of holding the workpiece W placed on the stage 31. In this case, the workpiece W may be placed on the stage 31 in a clampless manner. Furthermore, the workpiece W may be attached to a holder, or the holder to which the workpiece W is attached may be placed on the stage 31. The above-mentioned irradiation optical system 211 emits each of the processing lights EL#1 and EL#2 during at least a portion of the period during which the workpiece W is placed on the stage 31. Furthermore, the material nozzle 212 described above supplies the modeling material M for at least a portion of the period during which the workpiece W is placed on the stage 31 .

[0057] The stage drive system 32 moves the stage 31. The stage drive system 32 moves the stage 31, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. Note that the operation of moving the stage 31 along at least one of the θX direction, θY direction, and θZ direction may be considered equivalent to the operation of rotating the stage 31 around at least one of a rotation axis along the X-axis (i.e., A-axis), a rotation axis along the Y-axis (i.e., B-axis), and a rotation axis along the Z-axis (i.e., C-axis).

[0058] When the stage drive system 32 moves the stage 31, the relative positional relationships between the machining head 21 and the stage 31 and between the workpiece W and the irradiation optical system 211 provided in the machining head 21 change. As a result, the relative positional relationships between the stage 31, the workpiece W, and the irradiation optical system 211 provided in the machining head 21 change. For this reason, the stage drive system 32, like the head drive system 22, may be considered to function as a position changing device that can change the relative positional relationships between the stage 31, the workpiece W, and the irradiation optical system 211. Furthermore, when the relative positional relationships between the stage 31, the workpiece W, and the machining head 21 change, the relative positional relationships between the target irradiation areas EA#1 and EA#2 and the target supply area MA and the workpiece W also change. In other words, the target irradiation areas EA#1 and EA#2 and the target supply area MA each move on the surface of the workpiece W (more specifically, the printing surface MS) along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction. In this case, it may be considered that the stage drive system 32 moves the stage 31 so that the target irradiation areas EA#1 and EA#2 and the target supply area MA each move on the printing surface MS.

[0059] Furthermore, when the stage drive system 32 moves the stage 31, the relative positional relationships between the material control points MCP and the stage 31 and between the workpiece W placed on the stage 31 change, even if the nozzle drive system 23 does not move the material nozzle 212. In other words, the positional relationship between the build surface MS and the material control points MCP changes. This is because the positional relationship between the material control points MCP and the material nozzle 212 is fixed. For this reason, the stage drive system 32 may be considered to be changing the positional relationship between the build surface MS and the material control points MCP. For example, when the stage drive system 32 moves the stage 31 along the Z-axis direction, the stage drive system 32 may be considered to be changing the distance between the build surface MS and the material control points MCP (particularly the distance in the Z-axis direction).

[0060] The light source 4 emits, for example, at least one of infrared light, visible light, and ultraviolet light as the processing light EL. However, other types of light may be used as the processing light EL. The processing light EL may include a plurality of pulsed lights (i.e., a plurality of pulse beams). The processing light EL may be laser light. In this case, the light source 4 may include a laser light source (for example, a semiconductor laser such as a laser diode (LD)). Examples of laser light sources include fiber lasers, CO ２ At least one of a laser, a YAG laser, an excimer laser, etc. may be used. However, the processing light EL does not have to be laser light. The light source 4 may include any light source (for example, at least one of an LED (Light Emitting Diode), a discharge lamp, etc.).

[0061] As described above, the processing system SYS includes multiple light sources 4 (specifically, light sources 4#1 and 4#2). In this case, the characteristics of the processing light EL#1 emitted by light source 4#1 and the characteristics of the processing light EL#2 emitted by light source 4#2 may be the same. For example, the wavelength of the processing light EL#1 (typically, the peak wavelength, which is the wavelength at which the intensity is maximum in the wavelength band of the processing light EL#1) and the wavelength of the processing light EL#2 (typically, the peak wavelength) may be the same. For example, the wavelength band of the processing light EL#1 (typically, the range of wavelengths at which the intensity is equal to or greater than a certain value) and the wavelength band of the processing light EL#2 may be the same. For example, the intensity of the processing light EL#1 and the intensity of the processing light EL#2 may be the same. For example, the absorptivity of the workpiece W for the processing light EL#1 (or the object whose surface MS is the surface; the same applies below) may be the same as the absorptivity of the workpiece W for the processing light EL#2. In particular, the absorptivity of the workpiece W for the peak wavelength of processing light EL#1 and the absorptivity of the workpiece W for the peak wavelength of processing light EL#2 may be the same. Alternatively, the characteristics of processing light EL#1 emitted by light source 4#1 and the characteristics of processing light EL#2 emitted by light source 4#2 may be different. For example, the wavelength (typically, peak wavelength) of processing light EL#1 and the wavelength (typically, peak wavelength) of processing light EL#2 may be different. For example, the wavelength band of processing light EL#1 and the wavelength band of processing light EL#2 may be different. For example, the intensity of processing light EL#1 and the intensity of processing light EL#2 may be different. For example, the absorptivity of the workpiece W for processing light EL#1 and the absorptivity of the workpiece W for processing light EL#2 may be different. In particular, the absorptivity of the workpiece W for the peak wavelength of processing light EL#1 and the absorptivity of the workpiece W for the peak wavelength of processing light EL#2 may be different.

[0062] In this embodiment, an example in which the processing system SYS includes multiple light sources 4 has been described. However, the processing system SYS does not necessarily have to include multiple light sources 4. The processing system SYS may include a single light source 4. As an example, the processing system SYS may include a light source that emits (supplies) light of a wide wavelength band or multiple wavelengths as the single light source 4. In this case, the processing system SYS may wavelength-divide the light emitted from this light source to generate processing light EL#1 and processing light EL#2 of different wavelengths. In this case, the processing system SYS may also amplitude-divide or polarization-divide the light emitted from this light source.

[0063] The gas supply source 5 is a supply source of purge gas for purging the chamber space 63IN inside the housing 6. The purge gas includes an inert gas. Examples of the inert gas include nitrogen gas and argon gas. The gas supply source 5 is connected to the chamber space 63IN via a supply port 62 formed in a partition member 61 of the housing 6 and a supply pipe 51 connecting the gas supply source 5 and the supply port 62. The gas supply source 5 supplies purge gas to the chamber space 63IN via the supply pipe 51 and the supply port 62. As a result, the chamber space 63IN becomes a space purged with the purge gas. The purge gas supplied to the chamber space 63IN may be discharged from an exhaust port (not shown) formed in the partition member 61. The gas supply source 5 may be a cylinder containing an inert gas. When the inert gas is nitrogen gas, the gas supply source 5 may be a nitrogen gas generator that generates nitrogen gas using atmospheric air as a raw material.

[0064] As described above, when the material nozzle 212 supplies the modeling material M together with a purge gas, the gas supply source 5 may supply the purge gas to the mixer 12 to which the modeling material M is supplied from the material supply source 1. Specifically, the gas supply source 5 may be connected to the mixer 12 via a supply pipe 52 connecting the gas supply source 5 and the mixer 12. As a result, the gas supply source 5 supplies the purge gas to the mixer 12 via the supply pipe 52. In this case, the modeling material M from the material supply source 1 may be supplied (specifically, pressure-fed) through the supply pipe 11 toward the material nozzle 212 by the purge gas supplied from the gas supply source 5 via the supply pipe 52. In other words, the gas supply source 5 may be connected to the material nozzle 212 via the supply pipe 52, the mixer 12, and the supply pipe 11. In this case, the material nozzle 212 supplies the modeling material M together with the purge gas for pressure-fed the modeling material M.

[0065] The control unit 7 controls the operation of the machining system SYS. For example, the control unit 7 may control the machining unit 2 (e.g., at least one of the machining head 21 and the head drive system 22) provided in the machining system SYS to perform additional machining on the workpiece W. For example, the control unit 7 may control the stage unit 3 (e.g., the stage drive system 32) provided in the machining system SYS to perform additional machining on the workpiece W. For example, the control unit 7 may control the material supply source 1 provided in the machining system SYS to perform additional machining on the workpiece W. For example, the control unit 7 may control the light source 4 provided in the machining system SYS to perform additional machining on the workpiece W. For example, the control unit 7 may control the gas supply source 5 provided in the machining system SYS to perform additional machining on the workpiece W.

[0066] The control unit 7 may include, for example, an arithmetic device 71 and a storage device 72. The arithmetic device 71 may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The storage device 72 may include, for example, a memory. The control unit 7 functions as a device that controls the operation of the machining system SYS when the arithmetic device 71 executes a computer program. This computer program is a computer program for causing the arithmetic device 71 to perform (i.e., execute) the operations to be performed by the control unit 7, which will be described later. In other words, this computer program is a computer program for causing the control unit 7 to function so as to cause the machining system SYS to perform the operations to be described later. The computer program executed by the arithmetic device 71 may be recorded in the storage device 72 (i.e., a recording medium) included in the control unit 7, or may be recorded in any storage medium (e.g., a hard disk or a semiconductor memory) built into the control unit 7 or externally attachable to the control unit 7. Alternatively, the computing device 71 may download the computer program to be executed from a device external to the control unit 7 via a network interface. The storage device 72 may also be called a recording device.

[0067] The control unit 7 may control the emission mode of the processing light EL by the irradiation optical system 211. The emission mode may include, for example, at least one of the intensity of the processing light EL and the emission timing of the processing light EL. When the processing light EL includes multiple pulsed lights, the emission mode may include, for example, at least one of the emission duration of the pulsed light, the emission cycle of the pulsed light, and the ratio between the emission duration of the pulsed light and the emission cycle of the pulsed light (so-called duty ratio). Furthermore, the control unit 7 may control the movement mode of the processing head 21 by the head drive system 22. The control unit 7 may control the movement mode of the stage 31 by the stage drive system 32. The movement mode may include, for example, at least one of the movement amount, movement speed, movement direction, and movement timing (movement time). Furthermore, the control unit 7 may control the supply mode of the modeling material M by the material nozzle 212. The supply mode may include, for example, at least one of the supply amount (particularly, the supply amount per unit time) and the supply timing (supply time).

[0068] The control unit 7 does not have to be provided inside the machining system SYS. For example, the control unit 7 may be provided outside the machining system SYS as a server or the like. In this case, the control unit 7 and the machining system SYS may be connected via a wired and / or wireless network (or a data bus and / or communication line). The wired network may be a network using a serial bus interface, such as at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB. The wired network may be a network using a parallel bus interface. The wired network may be a network using an interface compliant with Ethernet (registered trademark), such as at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T. The wireless network may be a network using radio waves. An example of a network using radio waves is a network compliant with IEEE 802.1x (for example, at least one of a wireless LAN and Bluetooth (registered trademark)). A network using infrared rays may be used as the wireless network. A network using optical communication may be used as the wireless network. In this case, the control unit 7 and the machining system SYS may be configured to be able to send and receive various information via the network. The control unit 7 may also be able to send information such as commands and control parameters to the machining system SYS via the network. The machining system SYS may include a receiving device that receives information such as commands and control parameters from the control unit 7 via the network. The machining system SYS may also include a transmitting device (i.e., an output device that outputs information to the control unit 7) that transmits information such as commands and control parameters to the control unit 7 via the network.Alternatively, a first control device that performs part of the processing performed by the control unit 7 may be provided inside the processing system SYS, while a second control device that performs another part of the processing performed by the control unit 7 may be provided outside the processing system SYS.

[0069] A computational model that can be constructed by machine learning may be implemented in the control unit 7 by the arithmetic device 71 executing a computer program. An example of a computational model that can be constructed by machine learning is a computational model including a neural network (so-called artificial intelligence (AI)). In this case, learning of the computational model may include learning of parameters of the neural network (e.g., at least one of a weight and a bias). The control unit 7 may use the computational model to control the operation of the machining system SYS. In other words, the operation of controlling the operation of the machining system SYS may include the operation of controlling the operation of the machining system SYS using the computational model. Note that a computational model that has been constructed by offline machine learning using training data may be implemented in the control unit 7. Furthermore, the computational model implemented in the control unit 7 may be updated on the control unit 7 by online machine learning. Alternatively, the control unit 7 may control the operation of the machining system SYS using a computational model implemented in a device external to the control unit 7 (i.e., a device provided outside the machining system SYS) in addition to or instead of the computational model implemented in the control unit 7.

[0070] The recording medium for recording the computer program executed by the control unit 7 may be at least one of the following: a CD-ROM, CD-R, CD-RW, a flexible disk, an MO, a DVD-ROM, a DVD-RAM, a DVD-R, a DVD+R, a DVD-RW, a DVD+RW, and an optical disk such as Blu-ray (registered trademark), a magnetic medium such as a magnetic tape, a magneto-optical disk, a semiconductor memory such as a USB memory, and any other medium capable of storing a program. The recording medium may also include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in an executable state in at least one of the forms of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized in the control unit 7 when the control unit 7 (i.e., the computer) executes the computer program, or may be realized by a predetermined gate array (hardware such as an FPGA (Field Programmable Gate Array) or an ASIC (Application Specific Integrated Circuit)) provided in the control unit 7, or may be realized in a form in which logical processing blocks and partial hardware modules that realize some elements of the hardware are mixed. (1-2) Structure of Irradiation Optical System 211 Next, the structure of the irradiation optical system 211 will be described with reference to FIG. 5. FIG. 5 is a cross-sectional view showing the structure of the irradiation optical system 211.

[0071] As shown in Fig. 5, the irradiation optical system 211 includes a first optical system 214, a second optical system 215, and a third optical system 216. The first optical system 214 is an optical system into which the processing light EL#1 emitted from the light source 4#1 is incident. The first optical system 214 is an optical system that outputs the processing light EL#1 emitted from the light source 4#1 toward the third optical system 216. The second optical system 215 is an optical system into which the processing light EL#2 emitted from the light source 4#2 is incident. The second optical system 215 is an optical system that outputs the processing light EL#2 emitted from the light source 4#2 toward the third optical system 216. The third optical system 216 is an optical system into which the processing light EL#1 emitted from the first optical system 214 and the processing light EL#2 emitted from the second optical system 215 are incident. The third optical system 216 is an optical system that emits the processing light EL#1 emitted from the first optical system 214 and the processing light EL#2 emitted from the second optical system 215 toward the printing surface MS. Below, the first optical system 214, the second optical system 215, and the third optical system 216 will be described in order.

[0072] The first optical system 214 includes a collimator lens 2141, a parallel plate 2142, a power meter 2143, and a galvanometer scanner 2144. The galvanometer scanner 2144 includes a focus control optical system 2145 and a galvanometer mirror 2146. However, the first optical system 214 does not necessarily have to include at least one of the collimator lens 2141, the parallel plate 2142, the power meter 2143, and the galvanometer scanner 2144. The galvanometer scanner 2144 does not necessarily have to include at least one of the focus control optical system 2145 and the galvanometer mirror 2146.

[0073] The processing light EL#1 emitted from the light source 4#1 is incident on the collimator lens 2141. The collimator lens 2141 converts the processing light EL#1 incident on the collimator lens 2141 into parallel light. Note that if the processing light EL#1 emitted from the light source 4#1 is parallel light (i.e., if the processing light EL#1, which is parallel light, enters the first optical system 214), the first optical system 214 does not need to include the collimator lens 2141. The processing light EL#1 converted into parallel light by the collimator lens 2141 is incident on the parallel plate 2142. The parallel plate 2142 is disposed obliquely with respect to the optical path of the processing light EL#1 incident on the parallel plate 2142. A portion of the processing light EL#1 incident on the parallel plate 2142 passes through the parallel plate 2142. Another portion of the processing light EL#1 incident on the parallel plate 2142 is reflected by the parallel plate 2142.

[0074] The processing light EL#1 that has passed through the parallel plate 2142 is incident on the galvanometer scanner 2144. Specifically, the processing light EL#1 that has passed through the parallel plate 2142 is incident on the focus control optical system 2145 of the galvanometer scanner 2144.

[0075] The focus control optical system 2145 is an optical element that can change the focus position CP of the processing light EL#1 (hereinafter referred to as the "focus position CP#1"). In this embodiment, the focus position CP#1 of the processing light EL#1 may refer to the focus position where the processing light EL#1 is focused. The focus position CP#1 of the processing light EL#1 may refer to the convergence position where the processing light EL#1 is most convergent in the irradiation direction (travel direction) of the processing light EL#1.

[0076] Specifically, the focus control optical system 2145 can change the focus position CP#1 of the processing light EL#1 along the irradiation direction of the processing light EL#1 emitted from the irradiation optical system 211. In the example shown in FIG. 5 , the irradiation direction of the processing light EL#1 emitted from the irradiation optical system 211 is a direction in which the Z-axis direction is the main component. In this case, the focus control optical system 2145 can change the focus position CP#1 of the processing light EL#1 along the Z-axis direction. Furthermore, because the irradiation optical system 211 irradiates the processing light EL onto the printing surface MS from above the workpiece W, the irradiation direction of the processing light EL#1 is a direction intersecting the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). Therefore, the focus control optical system 2145 can be considered to be able to change the focus position CP#1 of the processing light EL#1 along a direction intersecting the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). The focus control optical system 2145 may be considered to be capable of changing the focus position CP#1 of the processing light EL#1 along the direction of the optical axis AX of the irradiation optical system 211 (typically the third optical system 216).

[0077] The irradiation direction of the processing light EL#1 may refer to the irradiation direction of the processing light EL#1 emitted from the third optical system 216. In this case, the irradiation direction of the processing light EL#1 may be the same as the direction along the optical axis of the third optical system 216. The irradiation direction of the processing light EL#1 may be the same as the direction along the optical axis of the final optical element that is arranged closest to the printing surface MS among the optical elements constituting the third optical system 216. The final optical element may be the fθ lens 2162 described below. Furthermore, if the fθ lens 2162 described below is composed of multiple optical elements, the final optical element may be the optical element that is arranged closest to the printing surface MS among the multiple optical elements constituting the fθ lens 2162.

[0078] It should be noted that the irradiation optical system 211 does not necessarily have to include the third optical system 216. When the irradiation optical system 211 does not include the third optical system 216, the final optical member may be the optical member (Y-scanning mirror 2146MY) that is arranged closest to the printing surface MS among the multiple optical members that make up the first optical system 214. When the irradiation optical system 211 does not include the third optical system 216, the final optical member may be the optical member (Y-scanning mirror 2156MY) that is arranged closest to the printing surface MS among the multiple optical members that make up the second optical system 215.

[0079] The focus control optical system 2145 may include, for example, multiple optical elements (e.g., multiple lenses) aligned along the irradiation direction of the processing light EL#1. In this case, the focus control optical system 2145 may change the focus position CP#1 of the processing light EL#1 by moving at least one of the multiple optical elements along its optical axis direction.

[0080] When the focus control optical system 2145 changes the focus position CP#1 of the processing light EL#1, the positional relationship between the focus position CP#1 of the processing light EL#1 and the printing surface MS changes. In particular, the positional relationship between the focus position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1 (i.e., the Z-axis direction) changes. Therefore, by changing the focus position CP#1 of the processing light EL#1, the focus control optical system 2145 may be considered to be changing the positional relationship between the focus position CP#1 of the processing light EL#1 and the printing surface MS (in particular, the positional relationship in the Z-axis direction). By changing the focus position CP#1 of the processing light EL#1, the focus control optical system 2145 may be considered to be changing the distance between the focus position CP#1 of the processing light EL#1 and the printing surface MS (in particular, the distance in the Z-axis direction).

[0081] When the focus control optical system 2145 changes the focus position CP#1 of the processing light EL#1, the positional relationship between the focus position CP#1 of the processing light EL#1 and the material control point MCP changes. In particular, the positional relationship between the focus position CP#1 of the processing light EL#1 and the material control point MCP in the irradiation direction of the processing light EL#1 (i.e., the Z-axis direction) changes. Therefore, by changing the focus position CP#1 of the processing light EL#1, the focus control optical system 2145 may be considered to be changing the positional relationship (particularly, the positional relationship in the Z-axis direction) between the focus position CP#1 of the processing light EL#1 and the material control point MCP. By changing the focus position CP#1 of the processing light EL#1, the focus control optical system 2145 may be considered to be changing the distance (particularly, the distance in the Z-axis direction) between the focus position CP#1 of the processing light EL#1 and the material control point MCP. Note that Figure 5 shows an example in which the material control point MCP is located below the building surface MS, but as described above, the material control point MCP may be located above the building surface MS or on the building surface MS.

[0082] As described above, the galvanometer scanner 2144 does not necessarily have to include the focus control optical system 2145. Even in this case, if the positional relationship between the irradiation optical system 211 and the printing surface MS in the irradiation direction of the processing light EL#1 changes, the positional relationship between the focus position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1 changes. Therefore, even if the galvanometer scanner 2144 does not include the focus control optical system 2145, the processing system SYS can change the positional relationship between the focus position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1. For example, the processing system SYS may change the positional relationship between the focus position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1 by using the head drive system 22 to move the processing head 21 along the irradiation direction of the processing light EL#1. For example, the processing system SYS may change the positional relationship between the focus position CP#1 of the processing light EL#1 in the irradiation direction of the processing light EL#1 and the printing surface MS by moving the stage 31 along the irradiation direction of the processing light EL#1 using the stage drive system 32. Note that when the processing system SYS changes the positional relationship between the focus position CP#1 of the processing light EL#1 in the irradiation direction of the processing light EL#1 and the printing surface MS using at least one of the head drive system 22 and the stage drive system 32, the processing system SYS may also change the positional relationship between the material control point MCP and the printing surface MS and / or the positional relationship between the material control point MCP and the focus position CP#1 by moving the material nozzle 212 using the nozzle drive system 23.

[0083] The processing light EL#1 emitted from the focus control optical system 2145 is incident on the galvanometer mirror 2146. The galvanometer mirror 2146 deflects the processing light EL#1, thereby changing the emission direction of the processing light EL#1 emitted from the galvanometer mirror 2146. For this reason, the galvanometer mirror 2146 may also be referred to as a deflection optical system.

[0084] When the emission direction of the processing light EL#1 emitted from the galvanometer mirror 2146 is changed, the position at which the processing light EL#1 is emitted from the processing head 21 is changed. When the position at which the processing light EL#1 is emitted from the processing head 21 is changed, the target irradiation area EA#1 onto which the processing light EL#1 is irradiated on the printing surface MS moves. In other words, the irradiation position onto which the processing light EL#1 is irradiated on the printing surface MS moves. For this reason, the galvanometer mirror 2146 can be considered to function as an irradiation position moving device that can move the irradiation position of the processing light EL#1 on the printing surface MS.

[0085] Furthermore, when the position from which processing light EL#1 is emitted from processing head 21 is changed, a beam passing area PA#1 through which processing light EL#1 passes moves within a virtual material supply plane PL that intersects with the Z axis between material nozzle 212 and printing surface MS. In other words, the passing position through which processing light EL#1 passes within material supply plane PL moves. For this reason, galvanometer mirror 2146 may be considered to function as a passing position moving device that can move the passing position of processing light EL#1 within material supply plane PL.

[0086] The galvanometer mirror 2146 includes, for example, an X-scan mirror 2146MX, an X-scan motor 2146AX, a Y-scan mirror 2146MY, and a Y-scan motor 2146AY. The processing light EL#1 emitted from the focus control optical system 2145 is incident on the X-scan mirror 2146MX. The X-scan mirror 2146MX reflects the processing light EL#1 incident on the X-scan mirror 2146MX toward the Y-scan mirror 2146MY. The Y-scan mirror 2146MY reflects the processing light EL#1 incident on the Y-scan mirror 2146MY toward the third optical system 216. Note that each of the X-scan mirror 2146MX and the Y-scan mirror 2146MY may be referred to as a galvanometer mirror.

[0087] The X-scan motor 2146AX swings or rotates the X-scan mirror 2146MX around a rotation axis along the Y-axis. As a result, the angle of the X-scan mirror 2146MX relative to the optical path of the processing light EL#1 incident on the X-scan mirror 2146MX is changed. In this case, the swing or rotation of the X-scan mirror 2146MX causes the processing light EL#1 to scan the printing surface MS along the X-axis direction. In other words, the target irradiation area EA#1 (i.e., the irradiation position of the processing light EL#1) moves along the X-axis direction on the printing surface MS. Furthermore, the swing or rotation of the X-scan mirror 2146MX causes the processing light EL#1 to scan the material supply surface PL along the X-axis direction. In other words, the beam passage area PA#1 of the processing light EL#1 (i.e., the passage position of the processing light EL#1) moves along the X-axis direction within the material supply surface PL.

[0088] The Y-scan motor 2146AY swings or rotates the Y-scan mirror 2146MY around a rotation axis along the X-axis. As a result, the angle of the Y-scan mirror 2146MY relative to the optical path of the processing light EL#1 incident on the Y-scan mirror 2146MY is changed. In this case, the swing or rotation of the Y-scan mirror 2146MY causes the processing light EL#1 to scan the printing surface MS along the Y-axis direction. In other words, the target irradiation area EA#1 (i.e., the irradiation position of the processing light EL#1) moves along the Y-axis direction on the printing surface MS. Furthermore, the swing or rotation of the Y-scan mirror 2146MY causes the processing light EL#1 to scan the material supply surface PL along the Y-axis direction. In other words, the beam passage area PA#1 of the processing light EL#1 (i.e., the passage position of the processing light EL#1) moves along the Y-axis direction within the material supply surface PL.

[0089] In this embodiment, the virtual area on the printing surface MS through which the galvanometer mirror 2146 moves the target irradiation area EA#1 is referred to as the machining unit area PUA (particularly, the machining unit area PUA#1). In this case, the target irradiation area EA#1 may be considered to move on a surface of the printing surface MS that overlaps with the machining unit area PUA#1. Specifically, the virtual area on the printing surface MS through which the galvanometer mirror 2146 moves the target irradiation area EA#1 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed (i.e., without changing) is referred to as the machining unit area PUA (particularly, the machining unit area PUA#1). The machining unit area PUA#1 indicates the virtual area (in other words, the range) through which the machining head 21 actually performs additional machining using the machining light EL#1 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area PUA#1 indicates a virtual area (in other words, a range) that the processing head 21 actually scans with the processing light EL#1 when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area PUA#1 indicates a region (in other words, a range) through which the target irradiation area EA#1 actually moves when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. Therefore, the processing unit area PUA#1 may be considered to be a virtual region determined based on the processing head 21 (particularly, the irradiation optical system 211). In other words, the processing unit area PUA#1 may be considered to be a virtual region located at a position on the printing surface MS that is determined based on the processing head 21 (particularly, the irradiation optical system 211). Note that the maximum region over which the galvanometer mirror 2146 can move the target irradiation area EA#1 on the printing surface MS when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed may also be referred to as the processing unit area PUA#1.

[0090] In this case, the machining system SYS can use the galvanometer mirror 2146 to move the target irradiation area EA#1 within the machining unit area PUA#1. Therefore, the operation of deflecting the machining light EL#1 using the galvanometer mirror 2146 may be considered equivalent to the operation of moving the target irradiation area EA#1 within the machining unit area PUA#1. Furthermore, as described above, the molten pool MP#1 is formed by irradiating the target irradiation area EA#1 with the machining light EL#1. In this case, the machining system SYS may be considered to move the molten pool MP#1 within the machining unit area PUA#1 using the galvanometer mirror 2146. Therefore, the operation of deflecting the machining light EL#1 using the galvanometer mirror 2146 may be considered equivalent to the operation of moving the molten pool MP#1 within the machining unit area PUA#1. In other words, the operation of moving the target irradiation area EA#1 within the machining unit area PUA#1 may be considered equivalent to the operation of moving the molten pool MP#1 within the machining unit area PUA#1.

[0091] As described above, even if at least one of the machining head 21 and the stage 31 moves, the target irradiation area EA#1 moves on the printing surface MS. However, when at least one of the machining head 21 and the stage 31 moves, the relative positional relationship between the galvanometer mirror 2146 and the printing surface MS changes. As a result, the machining unit area PUA#1 determined based on the machining head 21 (i.e., the machining unit area PUA#1 to which the galvanometer mirror 2146 moves the target irradiation area EA#1 on the printing surface MS) moves on the printing surface MS. For this reason, in this embodiment, the operation of moving at least one of the machining head 21 and the stage 31 may be considered equivalent to the operation of moving the machining unit area PUA#1 relative to the printing surface MS.

[0092] As an example of an operation for moving the target irradiation area EA#1 within the processing unit area PUA#1, as shown in FIG. 6A, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves within the processing unit area PUA#1 along a single scanning direction along the printing surface MS, assuming that the processing unit area PUA#1 is stationary (i.e., not moving) on ​​the printing surface MS. In other words, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves along a single scanning direction within a coordinate system defined based on the processing unit area PUA#1. In particular, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 periodically moves back and forth within the processing unit area PUA#1 along the single scanning direction. In other words, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 periodically moves back and forth on an axis along a single scanning direction within the processing unit area PUA#1. In this case, the shape of the processing unit area PUA#1 along which the target irradiation area EA#1 moves may be a rectangle whose longitudinal direction is the movement direction of the target irradiation area EA#1.

[0093] As another example of the operation of moving the target irradiation area EA#1 within the processing unit area PUA#1, as shown in Figures 7(a) and 7(b), the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves along multiple scanning directions along the processing unit area MS within the processing unit area PUA#1, assuming that the processing unit area PUA#1 is stationary (i.e., not moving) on ​​the printing surface MS. In other words, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves along multiple scanning directions within a coordinate system defined based on the processing unit area PUA#1. In particular, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 periodically moves back and forth along each of the multiple scanning directions within the processing unit area PUA#1. That is, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 periodically moves back and forth on axes along each of the multiple scanning directions within the processing unit area PUA#1. Figure 7(a) shows an example in which the target irradiation area EA#1 moves back and forth along each of the X-axis and Y-axis directions within the processing unit area PUA#1 so that the movement trajectory of the target irradiation area EA#1 within the processing unit area PUA#1 is circular. In this case, the shape of the processing unit area PUA#1 through which the target irradiation area EA#1 moves may be circular. Figure 7(b) shows an example in which the target irradiation area EA#1 moves back and forth along each of the X-axis and Y-axis directions within the processing unit area PUA#1 so that the movement trajectory of the target irradiation area EA#1 within the processing unit area PUA#1 is mesh-shaped. In this case, the shape of the processing unit area PUA#1 through which the target irradiation area EA#1 moves may be rectangular.

[0094] 6(a), 7(a), and 7(b), the operation of periodically moving the target irradiation area EA#1 on the printing surface MS may be referred to as a wobbling operation. In other words, the operation of periodically moving (or deflecting) the processing light EL#1 so that the target irradiation area EA#1 moves periodically on the printing surface MS may be referred to as a wobbling operation.

[0095] The control unit 7 may move at least one of the machining head 21 and the stage 31 so that the machining unit area PUA#1 moves on the manufacturing surface MS during a period in which the target irradiation area EA#1 is moved within the machining unit area PUA#1 using the galvanometer mirror 2146. In other words, the control unit 7 may control at least one of the head drive system 22 and the stage drive system 32 so that the machining unit area PUA#1 moves on the manufacturing surface MS during a period in which the target irradiation area EA#1 is moved within the machining unit area PUA#1 using the galvanometer mirror 2146.

[0096] For example, in the example shown in FIG. 6A, the control unit 7 may control at least one of the head drive system 22 and the stage drive system 32 so that the processing unit area PUA#1 moves along a target movement trajectory MT0 that intersects (or, in some cases, is perpendicular to) the movement direction (i.e., the scanning direction) of the target irradiation area EA#1 within the processing unit area PUA#1. Conversely, the control unit 7 may control the galvanometer mirror 2146 so that the target irradiation area EA#1 periodically moves along a scanning direction that intersects (or, in some cases, is perpendicular to) the target movement trajectory MT0 of the processing unit area PUA#1 on the printing surface MS. As a result, on the printing surface MS, the target irradiation area EA#1 may move along the movement trajectory MT#1 shown in FIG. 6B. Specifically, the target irradiation area EA#1 may move along the target movement trajectory MT0 of the processing unit area PUA#1 while moving along a scanning direction that intersects with the target movement trajectory MT0. That is, the target irradiation area EA#1 may move along a wave-shaped (for example, sinusoidal) movement locus MT#1 that oscillates around the target movement locus MT0.

[0097] 7(a) or 7(b), the control unit 7 may control at least one of the head drive system 22 and the stage drive system 32 so that the processing unit area PUA#1 moves along a target movement trajectory MT0 extending along at least one of a direction along the movement direction (i.e., the scanning direction) of the target irradiation area EA#1 within the processing unit area PUA#1 and a direction intersecting (or, in some cases, perpendicular to) the movement direction of the target irradiation area EA#1 within the processing unit area PUA#1. Conversely, the control unit 7 may control the galvanometer mirror 2146 so that the target irradiation area EA#1 periodically moves along each of a scanning direction along the target movement trajectory MT0 of the processing unit area PUA#1 on the printing surface MS and a scanning direction intersecting (or, in some cases, perpendicular to) the target movement trajectory MT0. Note that Figure 7(c) shows the movement trajectory MT#1 of the target irradiation area EA#1 on the printing surface MS when the processing unit area PUA#1 shown in Figure 7(a) moves along the target movement trajectory MT0 on the printing surface MS.

[0098] When the machining light EL#1 is irradiated onto the build surface MS in units of machining unit areas PUA#1, a molten pool MP#1 is formed in at least a portion of the machining unit area PUA#1. As a result, a structure is built within the machining unit area PUA#1. As described above, the machining unit area PUA#1 is an area having a width in a direction intersecting the movement direction of the machining unit area PUA#1 on the build surface MS (specifically, the direction in which the target movement trajectory MT0 extends). In this case, a structure having a width in a direction intersecting the target movement trajectory MT0 of the machining unit area PUA#1 is built on the build surface MS. For example, in the example shown in FIGS. 6( a) and 6(b), a structure having a width along the X-axis direction and extending along the Y-axis direction is built. For example, in the example shown in FIGS. 7(a) and 7(c), a structure having a width along the X-axis direction and extending along the Y-axis direction is built.

[0099] When the processing light EL#1 is irradiated onto the printing surface MS in units of processing unit areas PUA#1, the processing unit areas PUA#1 are scanned with the processing light EL#1 by the galvanometer mirror 2146. Therefore, compared to when the processing light EL#1 is irradiated onto the printing surface MS without using the galvanometer mirror 2146, the amount of energy transmitted from the processing light EL#1 to the processing unit areas PUA#1 is less likely to vary within the processing unit areas PUA#1. In other words, the distribution of the amount of energy transmitted from the processing light EL#1 to the processing unit areas PUA#1 can be made uniform. As a result, the processing system SYS can form a shaped object on the printing surface MS with relatively high printing accuracy.

[0100] However, the processing system SYS does not have to irradiate the processing light EL#1 onto the printing surface MS in units of processing unit areas PUA#1. The processing system SYS may irradiate the printing surface MS with the processing light EL#1 without using the galvanometer mirror 2146. The processing system SYS does not necessarily have to perform a wobbling operation. In this case, the target irradiation area EA#1 may move on the printing surface MS in conjunction with the movement of at least one of the processing head 21 and the stage 31.

[0101] The processing system SYS may also aperiodically move the target irradiation area EA#1 on the printing surface MS. Note that an example of the operation of aperiodically moving the target irradiation area EA#1 on the printing surface MS is described in a first modified example of the processing system SYS (see FIGS. 46 to 52 ), which will be described later.

[0102] Referring again to FIG. 5 , the processing light EL#1 reflected by the parallel plate 2142 is incident on the power meter 2143. The power meter 2143 can detect the intensity of the processing light EL#1 incident on the power meter 2143. For example, the power meter 2143 may include a light-receiving element that detects the processing light EL#1 as light. Alternatively, the higher the intensity of the processing light EL#1, the greater the amount of energy generated by the processing light EL#1. As a result, the amount of heat generated by the processing light EL#1 increases. Therefore, the power meter 2143 may detect the intensity of the processing light EL#1 by detecting the processing light EL#1 as heat. In this case, the power meter 2143 may include a heat-detecting element that detects the heat of the processing light EL#1.

[0103] As described above, the processing light EL#1 reflected by the parallel plate 2142 is incident on the power meter 2143. Therefore, the power meter 2143 detects the intensity of the processing light EL#1 reflected by the parallel plate 2142. Because the parallel plate 2142 is disposed on the optical path of the processing light EL#1 between the light source 4#1 and the galvanometer mirror 2146, the power meter 2143 may be considered to detect the intensity of the processing light EL#1 traveling along the optical path between the light source 4#1 and the galvanometer mirror 2146. In this case, the power meter 2143 can stably detect the intensity of the processing light EL#1 without being affected by the deflection of the processing light EL#1 by the galvanometer mirror 2146. However, the location of the power meter 2143 is not limited to the example shown in FIG. 5 . For example, the power meter 2143 may detect the intensity of the processing light EL#1 traveling along the optical path between the galvanometer mirror 2146 and the printing surface MS. The power meter 2143 may detect the intensity of the processing light EL#1 traveling along the optical path within the galvanometer mirror 2146.

[0104] The detection result of the power meter 2143 is output to the control unit 7. The control unit 7 may control (in other words, change) the intensity of the processing light EL#1 based on the detection result of the power meter 2143 (i.e., the detection result of the intensity of the processing light EL#1). For example, the control unit 7 may control the intensity of the processing light EL#1 so that the intensity of the processing light EL#1 on the printing surface MS becomes a desired intensity. For example, the control unit 7 may control the intensity of the processing light EL#1 so that the intensity of the processing light EL#1 on a virtual material supply plane PL between the printing surface MS and the material nozzle 212 becomes a desired intensity. To control the intensity of the processing light EL#1, for example, the control unit 7 may control the light source 4#1 to change the intensity of the processing light EL#1 emitted from the light source 4#1 based on the detection result of the power meter 2143. As a result, the processing system SYS can appropriately print a model on the printing surface MS by irradiating the printing surface MS with processing light EL#1 having an appropriate intensity.

[0105] As described above, the processing light EL#1 has an intensity capable of melting the shaping material M. Therefore, the processing light EL#1 incident on the power meter 2143 may have an intensity capable of melting the shaping material M. However, if the processing light EL#1 having an intensity capable of melting the shaping material M is incident on the power meter 2143, the power meter 2143 may be damaged by the processing light EL#1. Therefore, the processing light EL#1 may be incident on the power meter 2143 with an intensity not high enough to damage the power meter 2143. In other words, the first optical system 214 may weaken the intensity of the processing light EL#1 incident on the power meter 2143 so that the processing light EL#1 having an intensity not high enough to damage the power meter 2143 is incident on the power meter 2143.

[0106] For example, in order to weaken the intensity of the processing light EL#1 incident on the power meter 2143, the reflectivity of the parallel plate 2142 for the processing light EL#1 may be set to an appropriate value. Specifically, the lower the reflectivity of the parallel plate 2142 for the processing light EL#1, the lower the intensity of the processing light EL#1 incident on the power meter 2143. Therefore, the reflectivity of the parallel plate 2142 may be set to a value low enough to realize a state in which the processing light EL#1, having an intensity not high enough to damage the power meter 2143, is incident on the power meter 2143. For example, the reflectivity of the parallel plate 2142 may be less than 10%. For example, the reflectivity of the parallel plate 2142 may be less than a few percent. Plain glass may be used as the parallel plate 2142 with such low reflectivity.

[0107] For example, in order to weaken the intensity of the processing light EL#1 incident on the power meter 2143, the first optical system 214 may cause the processing light EL#1 to be incident on the power meter 2143 via multiple parallel plates 2142. Specifically, the processing light EL#1 may be reflected multiple times by each of the multiple parallel plates 2142 and incident on the power meter 2143. In this case, the intensity of the processing light EL#1 reflected multiple times by each of the multiple parallel plates 2142 is weaker than the intensity of the processing light EL#1 reflected once by a single parallel plate 2142. Therefore, there is a high possibility that the processing light EL#1 having an intensity not high enough to damage the power meter 2143 will be incident on the power meter 2143.

[0108] A desired coating treatment may be applied to the surface of the parallel plate 2142 (particularly, at least one of the incident surface onto which the processing light EL#1 is incident and the reflecting surface onto which the processing light EL#1 is reflected). For example, the surface of the parallel plate 2142 may be subjected to anti-reflection coating (AR).

[0109] The second optical system 215 includes a collimator lens 2151, a parallel plate 2152, a power meter 2153, and a galvanometer scanner 2154. The galvanometer scanner 2154 includes a focus control optical system 2155 and a galvanometer mirror 2156. However, the second optical system 215 does not necessarily have to include at least one of the collimator lens 2151, the parallel plate 2152, the power meter 2153, and the galvanometer scanner 2154. The galvanometer scanner 2154 does not necessarily have to include at least one of the focus control optical system 2155 and the galvanometer mirror 2156.

[0110] The processing light EL#2 emitted from the light source 4#2 is incident on the collimator lens 2151. The collimator lens 2151 converts the processing light EL#2 incident on the collimator lens 2151 into parallel light. Note that if the processing light EL#2 emitted from the light source 4#2 is parallel light (i.e., if the processing light EL#2, which is parallel light, enters the second optical system 215), the second optical system 215 does not need to include the collimator lens 2151. The processing light EL#2 converted into parallel light by the collimator lens 2151 is incident on the parallel plate 2152. The parallel plate 2152 is disposed obliquely with respect to the optical path of the processing light EL#2 incident on the parallel plate 2152. A portion of the processing light EL#2 incident on the parallel plate 2152 passes through the parallel plate 2152. The other portion of the processing light EL#2 incident on the parallel plate 2152 is reflected by the parallel plate 2152.

[0111] Processing light EL#2 that has passed through the parallel plate 2152 is incident on a galvanometer scanner 2154. Specifically, processing light EL#2 that has passed through the parallel plate 2152 is incident on a focus control optical system 2155 of the galvanometer scanner 2154.

[0112] The focus control optical system 2155 is an optical element that can change the focus position CP of the processing light EL#2 (hereinafter referred to as the "focus position CP#2"). In this embodiment, the focus position CP#2 of the processing light EL#2 may refer to the focus position where the processing light EL#2 is focused. The focus position CP#2 of the processing light EL#2 may refer to the convergence position where the processing light EL#2 is most convergent in the irradiation direction (travel direction) of the processing light EL#2.

[0113] Specifically, the focus control optical system 2155 can change the focus position CP#2 of the processing light EL#2 along the irradiation direction of the processing light EL#2 emitted from the irradiation optical system 211. In the example shown in FIG. 5 , the irradiation direction of the processing light EL#2 emitted from the irradiation optical system 211 is a direction in which the Z-axis direction is the main component. In this case, the focus control optical system 2155 can change the focus position CP#2 of the processing light EL#2 along the Z-axis direction. Furthermore, because the irradiation optical system 211 irradiates the processing light EL onto the printing surface MS from above the workpiece W, the irradiation direction of the processing light EL#2 is a direction intersecting the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). Therefore, the focus control optical system 2155 can be considered to be able to change the focus position CP#2 of the processing light EL#2 along a direction intersecting the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). The focus control optical system 2155 may be considered to be capable of changing the focus position CP#2 of the processing light EL#2 along the direction of the optical axis AX of the irradiation optical system 211 (typically the third optical system 216).

[0114] The irradiation direction of the processing light EL#2 may refer to the irradiation direction of the processing light EL#2 emitted from the third optical system 216. In this case, the irradiation direction of the processing light EL#2 may be the same as the direction along the optical axis of the third optical system 216. The irradiation direction of the processing light EL#2 may be the same as the direction along the optical axis of the final optical element that is arranged closest to the printing surface MS among the optical elements constituting the third optical system 216. The final optical element may be the fθ lens 2162 described below. Furthermore, if the fθ lens 2162 described below is composed of multiple optical elements, the final optical element may be the optical element that is arranged closest to the printing surface MS among the multiple optical elements constituting the fθ lens 2162.

[0115] The irradiation optical system 211 does not necessarily have to include the third optical system 216. When the irradiation optical system 211 does not include the third optical system 216, the final optical member may be the optical member (Y-scanning mirror 2156MY) that is arranged closest to the printing surface MS among the multiple optical members that make up the second optical system 215.

[0116] The focus control optical system 2155 may include, for example, multiple optical elements (e.g., multiple lenses) aligned along the irradiation direction of the processing light EL#2. In this case, the focus control optical system 2155 may change the focus position CP#2 of the processing light EL#2 by moving at least one of the multiple optical elements along its optical axis direction.

[0117] When the focus control optical system 2155 changes the focus position CP#2 of the processing light EL#2, the positional relationship between the focus position CP#2 of the processing light EL#2 and the printing surface MS changes. In particular, the positional relationship between the focus position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2 (i.e., the Z-axis direction) changes. Therefore, by changing the focus position CP#2 of the processing light EL#2, the focus control optical system 2155 may be considered to be changing the positional relationship between the focus position CP#2 of the processing light EL#2 and the printing surface MS (in particular, the positional relationship in the Z-axis direction). By changing the focus position CP#2 of the processing light EL#2, the focus control optical system 2155 may be considered to be changing the distance between the focus position CP#2 of the processing light EL#2 and the printing surface MS (in particular, the distance in the Z-axis direction).

[0118] When the focus control optical system 2155 changes the focus position CP#2 of the processing light EL#2, the positional relationship between the focus position CP#2 of the processing light EL#2 and the material control point MCP changes. In particular, the positional relationship between the focus position CP#2 of the processing light EL#2 and the material control point MCP in the irradiation direction of the processing light EL#2 (i.e., the Z-axis direction) changes. Therefore, by changing the focus position CP#2 of the processing light EL#2, the focus control optical system 2155 may be considered to be changing the positional relationship (particularly, the positional relationship in the Z-axis direction) between the focus position CP#2 of the processing light EL#1 and the material control point MCP. By changing the focus position CP#2 of the processing light EL#2, the focus control optical system 2155 may be considered to be changing the distance (particularly, the distance in the Z-axis direction) between the focus position CP#2 of the processing light EL#1 and the material control point MCP. Note that Figure 5 shows an example in which the material control point MCP is located below the building surface MS, but as described above, the material control point MCP may be located above the building surface MS or on the building surface MS.

[0119] As described above, the galvanometer scanner 2154 does not necessarily have to include the focus control optical system 2155. Even in this case, if the positional relationship between the irradiation optical system 211 and the printing surface MS in the irradiation direction of the processing light EL#2 changes, the positional relationship between the focus position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2 changes. Therefore, even if the galvanometer scanner 2154 does not include the focus control optical system 2155, the processing system SYS can change the positional relationship between the focus position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2. For example, the processing system SYS may change the positional relationship between the focus position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2 by using the head drive system 22 to move the processing head 21 along the irradiation direction of the processing light EL#2. For example, the processing system SYS may change the positional relationship between the focus position CP#2 of the processing light EL#2 in the irradiation direction of the processing light EL#2 and the printing surface MS by moving the stage 31 along the irradiation direction of the processing light EL#2 using the stage drive system 32. Note that when the processing system SYS changes the positional relationship between the focus position CP#2 of the processing light EL#2 in the irradiation direction of the processing light EL#2 and the printing surface MS using at least one of the head drive system 22 and the stage drive system 32, the processing system SYS may also change the positional relationship between the material control point MCP and the printing surface MS and / or the positional relationship between the material control point MCP and the focus position CP#2 by moving the material nozzle 212 using the nozzle drive system 23.

[0120] The processing light EL#2 emitted from the focus control optical system 2155 is incident on the galvanometer mirror 2156. The galvanometer mirror 2156 deflects the processing light EL#2, thereby changing the emission direction of the processing light EL#2 emitted from the galvanometer mirror 2156. For this reason, the galvanometer mirror 2156 may be referred to as a deflection optical system. When the emission direction of the processing light EL#2 emitted from the galvanometer mirror 2156 is changed, the position from which the processing light EL#2 is emitted from the processing head 21 is changed.

[0121] When the position from which processing light EL#2 is emitted from processing head 21 is changed, the target irradiation area EA#2 onto which processing light EL#2 is irradiated moves on the printing surface MS. In other words, the irradiation position onto which processing light EL#2 is irradiated moves on the printing surface MS. For this reason, galvanometer mirror 2156 can be considered to function as an irradiation position moving device that can move the irradiation position onto the printing surface MS of processing light EL#2.

[0122] Furthermore, when the position from which processing light EL#2 is emitted from processing head 21 is changed, a beam passing area PA#2 through which processing light EL#2 passes moves within a virtual material supply plane PL that intersects with the Z axis between material nozzle 212 and printing surface MS. In other words, the passing position through which processing light EL#2 passes within material supply plane PL moves. For this reason, galvanometer mirror 2156 may be considered to function as a passing position moving device that can move the passing position of processing light EL#2 within material supply plane PL.

[0123] The galvanometer mirror 2156 includes, for example, an X-scan mirror 2156MX, an X-scan motor 2156AX, a Y-scan mirror 2156MY, and a Y-scan motor 2156AY. Processing light EL#2 emitted from the focus control optical system 2155 is incident on the X-scan mirror 2156MX. The X-scan mirror 2156MX reflects the processing light EL#2 incident on the X-scan mirror 2156MX toward the Y-scan mirror 2156MY. The Y-scan mirror 2156MY reflects the processing light EL#2 incident on the Y-scan mirror 2156MY toward the third optical system 216. Note that each of the X-scan mirror 2156MX and the Y-scan mirror 2156MY may be referred to as a galvanometer mirror.

[0124] The X-scan motor 2156AX swings or rotates the X-scan mirror 2156MX around a rotation axis along the Y-axis. As a result, the angle of the X-scan mirror 2156MX relative to the optical path of the processing light EL#2 incident on the X-scan mirror 2156MX is changed. In this case, the swing or rotation of the X-scan mirror 2156MX causes the processing light EL#2 to scan the printing surface MS along the X-axis direction. In other words, the target irradiation area EA#2 (i.e., the irradiation position of the processing light EL#2) moves along the X-axis direction on the printing surface MS. Furthermore, the swing or rotation of the X-scan mirror 2156MX causes the processing light EL#2 to scan the material supply surface PL along the X-axis direction. In other words, the beam passage area PA#2 of the processing light EL#2 (i.e., the passage position of the processing light EL#2) moves along the X-axis direction within the material supply surface PL.

[0125] The Y-scan motor 2156AY swings or rotates the Y-scan mirror 2156MY around a rotation axis along the X-axis. As a result, the angle of the Y-scan mirror 2156MY relative to the optical path of the processing light EL#2 incident on the Y-scan mirror 2156MY is changed. In this case, the swing or rotation of the Y-scan mirror 2156MY causes the processing light EL#2 to scan the printing surface MS along the Y-axis direction. In other words, the target irradiation area EA#2 (i.e., the irradiation position of the processing light EL#2) moves along the Y-axis direction on the printing surface MS. Furthermore, the swing or rotation of the Y-scan mirror 2156MY causes the processing light EL#2 to scan the material supply surface PL along the Y-axis direction. In other words, the beam passage area PA#2 of the processing light EL#2 (i.e., the passage position of the processing light EL#2) moves along the X-axis direction within the material supply surface PL.

[0126] In this embodiment, the virtual area on the printing surface MS through which the galvanometer mirror 2156 moves the target irradiation area EA#2 is referred to as the machining unit area PUA (particularly, the machining unit area PUA#2). In this case, the target irradiation area EA#2 may be considered to move on a surface (first surface) of the printing surface MS that overlaps with the machining unit area PUA#2. Specifically, the virtual area on the printing surface MS through which the galvanometer mirror 2156 moves the target irradiation area EA#2 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed (i.e., without changing) is referred to as the machining unit area PUA (particularly, the machining unit area PUA#2). The machining unit area PUA#2 indicates a virtual area (in other words, a range) in which the machining head 21 actually performs additional machining using the machining light EL#2 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area PUA#2 indicates a virtual area (in other words, a range) that the processing head 21 actually scans with the processing light EL#2 when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area PUA#2 indicates a region (in other words, a range) through which the target irradiation area EA#2 actually moves when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. Therefore, the processing unit area PUA#2 may be considered to be a virtual region determined based on the processing head 21 (particularly, the irradiation optical system 211). In other words, the processing unit area PUA#2 may be considered to be a virtual region located at a position on the printing surface MS that is determined based on the processing head 21 (particularly, the irradiation optical system 211). Note that the maximum region over which the galvanometer mirror 2146 can move the target irradiation area EA#2 on the printing surface MS when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed may also be referred to as the processing unit area PUA#2.

[0127] In this case, the machining system SYS can use the galvanometer mirror 2156 to move the target irradiation area EA#2 within the machining unit area PUA#2. Therefore, the operation of deflecting the machining light EL#2 using the galvanometer mirror 2156 may be considered equivalent to the operation of moving the target irradiation area EA#2 within the machining unit area PUA#2. Furthermore, as described above, the molten pool MP#2 is formed by irradiating the target irradiation area EA#2 with the machining light EL#2. In this case, the machining system SYS may be considered to use the galvanometer mirror 2156 to move the molten pool MP#2 within the machining unit area PUA#2. Therefore, the operation of deflecting the machining light EL#2 using the galvanometer mirror 2156 may be considered equivalent to the operation of moving the molten pool MP#2 within the machining unit area PUA#2. In other words, the operation of moving the target irradiation area EA#2 within the machining unit area PUA#2 may be considered equivalent to the operation of moving the molten pool MP#2 within the machining unit area PUA#2.

[0128] As described above, when at least one of the machining head 21 and the stage 31 moves, the target irradiation area EA#2 moves on the printing surface MS. However, when at least one of the machining head 21 and the stage 31 moves, the relative positional relationship between the galvanometer mirror 2146 and the printing surface MS changes. As a result, the machining unit area PUA#2 determined based on the machining head 21 (i.e., the machining unit area PUA#2 to which the galvanometer mirror 2156 moves the target irradiation area EA#2 on the printing surface MS) moves on the printing surface MS. For this reason, in this embodiment, the operation of moving at least one of the machining head 21 and the stage 31 may be considered equivalent to the operation of moving the machining unit area PUA#2 relative to the printing surface MS.

[0129] The characteristics of the processing unit area PUA#2 (e.g., shape, movement pattern, etc.) may be the same as the characteristics of the processing unit area PUA#1 described above. The movement pattern of the target irradiation area EA#2 within the processing unit area PUA#2 (e.g., movement trajectory, etc.) may be the same as the movement pattern of the target irradiation area EA#1 within the processing unit area PUA#1 described above. For this reason, detailed description of the characteristics of the processing unit area PUA#2 and the movement pattern of the target irradiation area EA#2 within the processing unit area PUA#2 (e.g., movement trajectory, etc.) will be omitted, but an example will be briefly described below. As shown in FIG. 6A, under the assumption that the processing unit area PUA#2 is stationary (i.e., not moving) on ​​the printing surface MS, the galvanometer mirror 2156 may deflect the processing light EL#2 within the processing unit area PUA#2 so that the target irradiation area EA#2 moves along a single scanning direction along the printing surface MS. 6A moves along the target movement trajectory MT0 on the printing surface MS, so that the target irradiation area EA#2 moves along the movement trajectory MT#2 (e.g., a wave-shaped movement trajectory MT#2 oscillating around the target movement trajectory MT0) shown in FIG. 6B. As shown in FIG. 7A and FIG. 7B, under the assumption that the processing unit area PUA#2 is stationary (i.e., not moving) on ​​the printing surface MS, the galvanometer mirror 2156 may deflect the processing light EL#2 so that the target irradiation area EA#2 moves along multiple scanning directions within the processing unit area PUA#2.

[0130] 6(a), 7(a), and 7(b), the operation of periodically moving the target irradiation area EA#2 on the printing surface MS may be referred to as a wobbling operation. In other words, the operation of periodically moving (or deflecting) the processing light EL#2 so as to periodically move the target irradiation area EA#2 on the printing surface MS may also be referred to as a wobbling operation. However, the processing system SYS does not necessarily have to periodically move the processing light EL#2 so as to periodically move the target irradiation area EA#2 on the printing surface MS. In other words, the processing system SYS does not necessarily have to perform a wobbling operation.

[0131] Typically, the processing unit area PUA#1 and the processing unit area PUA#2 coincide. In other words, the processing unit area PUA#1 is the same as the processing unit area PUA#2. Therefore, the galvanometer mirror 2156 may be considered to deflect the processing light EL#2 so that the target irradiation area EA#2 moves within the processing unit area PUA#1. The galvanometer mirror 2146 may be considered to deflect the processing light EL#1 so that the target irradiation area EA#1 moves within the processing unit area PUA#2. However, the processing unit area PUA#1 and the processing unit area PUA#2 may be partially different.

[0132] When the machining light EL#2 is irradiated onto the build surface MS in units of machining unit areas PUA#2, a molten pool MP#2 is formed in at least a portion of the machining unit area PUA#2. As a result, an object is built within the machining unit area PUA#2. As described above, the machining unit area PUA#2 is an area having a width in a direction intersecting the movement direction of the machining unit area PUA#2 on the build surface MS (specifically, the direction in which the target movement trajectory MT0 extends). In this case, an object having a width in a direction intersecting the target movement trajectory MT0 of the machining unit area PUA#2 is built on the build surface MS. For example, in the example shown in FIGS. 6( a) and 6(b), an object having a width along the X-axis direction and extending along the Y-axis direction is built. For example, in the example shown in FIGS. 7(a) and 7(c), an object having a width along the X-axis direction and extending along the Y-axis direction is built.

[0133] When the processing light EL#2 is irradiated onto the printing surface MS in units of processing unit areas PUA#2, the processing unit areas PUA#2 are scanned with the processing light EL#2 by the galvanometer mirror 2156. Therefore, compared to when the processing light EL#2 is irradiated onto the printing surface MS without using the galvanometer mirror 2156, the amount of energy transmitted from the processing light EL#2 to the processing unit areas PUA#2 is less likely to vary within the processing unit areas PUA#2. In other words, the amount of energy transmitted from the processing light EL#2 to the processing unit areas PUA#2 can be made uniform. As a result, the processing system SYS can print a model on the printing surface MS with relatively high printing accuracy.

[0134] However, the processing system SYS does not have to irradiate the processing light EL#2 onto the printing surface MS in units of processing unit areas PUA#2. The processing system SYS may irradiate the printing surface MS with the processing light EL#2 without using the galvanometer mirror 2156. The processing system SYS does not necessarily have to perform a wobbling operation. In this case, the target irradiation area EA#2 may move on the printing surface MS in conjunction with the movement of at least one of the processing head 21 and the stage 31.

[0135] The processing system SYS may also aperiodically move the target irradiation area EA#2 on the printing surface MS. Note that an example of the operation of aperiodically moving the target irradiation area EA#2 on the printing surface MS is described in a first modified example of the processing system SYS (see FIGS. 46 to 52 ), which will be described later.

[0136] Referring again to FIG. 5 , the processing light EL#2 reflected by the parallel plate 2152 is incident on the power meter 2153. The power meter 2153 is a specific example of an electrical component used to control the processing light EL#2. Specifically, the power meter 2153 can detect the intensity of the processing light EL#2 incident on the power meter 2153. For example, the power meter 2153 may include a light-receiving element that detects the processing light EL#2 as light. Alternatively, the higher the intensity of the processing light EL#2, the greater the amount of energy generated by the processing light EL#2. As a result, the amount of heat generated by the processing light EL#2 increases. Therefore, the power meter 2153 may detect the intensity of the processing light EL#2 by detecting the processing light EL#2 as heat. In this case, the power meter 2153 may include a heat-detecting element that detects the heat of the processing light EL#2.

[0137] As described above, the processing light EL#2 reflected by the parallel plate 2152 is incident on the power meter 2153. Therefore, the power meter 2153 detects the intensity of the processing light EL#2 reflected by the parallel plate 2152. Because the parallel plate 2152 is disposed on the optical path of the processing light EL#2 between the light source 4#2 and the galvanometer mirror 2156, the power meter 2153 may be considered to detect the intensity of the processing light EL#2 traveling along the optical path between the light source 4#2 and the galvanometer mirror 2156. In this case, the power meter 2153 can stably detect the intensity of the processing light EL#2 without being affected by the deflection of the processing light EL#2 by the galvanometer mirror 2156. However, the location of the power meter 2153 is not limited to the example shown in FIG. 5 . For example, the power meter 2153 may detect the intensity of the processing light EL#2 traveling along the optical path between the galvanometer mirror 2156 and the printing surface MS. The power meter 2153 may detect the intensity of the processing light EL#2 traveling along the optical path within the galvanometer mirror 2156.

[0138] The detection result of the power meter 2153 is output to the control unit 7. The control unit 7 may control (in other words, change) the intensity of the processing light EL#2 based on the detection result of the power meter 2153 (i.e., the detection result of the intensity of the processing light EL#2). For example, the control unit 7 may control the intensity of the processing light EL#2 so that the intensity of the processing light EL#2 on the printing surface MS becomes a desired intensity. For example, the control unit 7 may control the intensity of the processing light EL#2 so that the intensity of the processing light EL#2 on a virtual material supply plane PL between the printing surface MS and the material nozzle 212 becomes a desired intensity. To control the intensity of the processing light EL#2, for example, the control unit 7 may control the light source 4#2 to change the intensity of the processing light EL#2 emitted from the light source 4#2 based on the detection result of the power meter 2153. As a result, the processing system SYS can appropriately print a model on the printing surface MS by irradiating the printing surface MS with processing light EL#2 having an appropriate intensity.

[0139] As described above, the processing light EL#2 has an intensity capable of melting the shaping material M. Therefore, the processing light EL#2 incident on the power meter 2153 may have an intensity capable of melting the shaping material M. However, if the processing light EL#2 having an intensity capable of melting the shaping material M is incident on the power meter 2153, the power meter 2153 may be damaged by the processing light EL#2. Therefore, the processing light EL#2 may be incident on the power meter 2153 with an intensity not high enough to damage the power meter 2153. In other words, the second optical system 215 may weaken the intensity of the processing light EL#2 incident on the power meter 2153 so that the processing light EL#2 having an intensity not high enough to damage the power meter 2153 is incident on the power meter 2153.

[0140] For example, in order to weaken the intensity of the processing light EL#2 incident on the power meter 2153, the reflectivity of the parallel plate 2152 for the processing light EL#2 may be set to an appropriate value. Specifically, the lower the reflectivity of the parallel plate 2152 for the processing light EL#2, the lower the intensity of the processing light EL#2 incident on the power meter 2153. Therefore, the reflectivity of the parallel plate 2152 may be set to a value low enough to realize a state in which the processing light EL#2, having an intensity not high enough to damage the power meter 2153, is incident on the power meter 2153. For example, the reflectivity of the parallel plate 2152 may be less than 10%. For example, the reflectivity of the parallel plate 2152 may be less than a few percent. Plain glass may be used as the parallel plate 2152 with such low reflectivity.

[0141] For example, in order to weaken the intensity of the processing light EL#2 incident on the power meter 2153, the second optical system 215 may cause the processing light EL#2 to be incident on the power meter 2153 via multiple parallel plates 2152. Specifically, the processing light EL#2 reflected multiple times by each of the multiple parallel plates 2152 may be incident on the power meter 2153. In this case, the intensity of the processing light EL#2 reflected multiple times by each of the multiple parallel plates 2152 is weaker than the intensity of the processing light EL#2 reflected once by a single parallel plate 2152. Therefore, there is a high possibility that the processing light EL#2 having an intensity not high enough to damage the power meter 2153 will be incident on the power meter 2153.

[0142] The surface of the parallel plate 2152 (particularly, at least one of the incident surface onto which the processing light EL#2 is incident and the reflecting surface from which the processing light EL#2 is reflected) may be subjected to a desired coating treatment. For example, the surface of the parallel plate 2152 may be subjected to an anti-reflection coating (AR). The third optical system 216 includes a prism mirror 2161 and an fθ lens 2162.

[0143] Processing light EL#1 emitted from the first optical system 214 and processing light EL#2 emitted from the second optical system 215 are each incident on a prism mirror 2161. The prism mirror 2161 reflects each of processing light EL#1 and EL#2 toward an fθ lens 2162. The prism mirror 2161 reflects processing light EL#1 and EL#2, which are incident on the prism mirror 2161 from different directions, in approximately the same direction (specifically, toward the fθ lens 2162).

[0144] Furthermore, if the processing light EL#1 emitted from the first optical system 214 and the processing light EL#2 emitted from the second optical system 215 can each be directly incident on the fθ lens 2162, the third optical system 216 does not need to be equipped with a prism mirror 2161.

[0145] The fθ lens 2162 is an optical system for emitting each of the processing lights EL#1 and EL#2 reflected by the prism mirror 2161 toward the printing surface MS. In other words, the fθ lens 2162 is an optical system for irradiating each of the processing lights EL#1 and EL#2 reflected by the prism mirror 2161 onto the printing surface MS. As a result, the processing lights EL#1 and EL#2 that have passed through the fθ lens 2162 are irradiated onto the printing surface MS.

[0146] The fθ lens 2162 may be an optical element capable of focusing each of the processing beams EL#1 and EL#2 on a focusing surface. In this case, the fθ lens 2162 may be referred to as a focusing optical system. The focusing surface of the fθ lens 2162 may be set, for example, on the printing surface MS. In this case, the third optical system 216 may be considered to have a focusing optical system whose projection characteristic is fθ. However, the third optical system 216 may also have a focusing optical system whose projection characteristic is different from fθ. For example, the third optical system 216 may have a focusing optical system whose projection characteristic is f tan θ. For example, the third optical system 216 may have a focusing optical system whose projection characteristic is f sin θ.

[0147] The optical axis AX of the fθ lens 2162 is an axis along the Z-axis. Therefore, the fθ lens 2162 emits each of the processing lights EL#1 and EL#2 substantially along the Z-axis direction. In this case, the irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may be the same direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may both be in the Z-axis direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may both be along the optical axis AX of the fθ lens 2162. However, the irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 do not have to be the same direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may be mutually different directions. (2) Forming Operation Performed by the Processing System SYS Next, the forming operation (additional processing operation for performing additional processing on the workpiece W) performed by the processing system SYS will be described. (2-1) Overview of modeling operations

[0148] As described above, the processing system SYS performs additional processing based on the laser build-up welding method to form the three-dimensional structure ST. Therefore, the processing system SYS may perform a forming operation in accordance with the laser build-up welding method to form the three-dimensional structure ST.

[0149] The processing system SYS forms a three-dimensional structure ST on a workpiece W based on three-dimensional model data (in other words, three-dimensional model information) of the three-dimensional structure ST to be formed. Measurement data of a three-dimensional object measured by at least one of a measuring device installed within the processing system SYS and a three-dimensional shape measuring device installed separately from the processing system SYS may be used as the three-dimensional model data. To form the three-dimensional structure ST, the processing system SYS sequentially forms, for example, multiple layered substructures (hereinafter referred to as "structural layers") SL arranged along the Z-axis direction. For example, the processing system SYS sequentially forms multiple structural layers SL layer by layer based on data of multiple layers obtained by slicing a three-dimensional model of the three-dimensional structure ST along the Z-axis direction. As a result, a three-dimensional structure ST is formed, which is a layered structure in which multiple structural layers SL are stacked. The structural layers SL do not necessarily have to be layered structures.

[0150] Particularly in the present embodiment, the processing system SYS (mainly, the processing unit 2) may perform at least one of a first-modeling operation and a second-modeling operation as the modeling operation. The first-modeling operation and the second-modeling operation may differ from each other in that a method for modeling the three-dimensional structure ST by the first-modeling operation is different from a method for modeling the three-dimensional structure ST by the second-modeling operation. In particular, the first-modeling operation and the second-modeling operation may differ from each other in that a method for modeling each structural layer SL by the first-modeling operation is different from a method for modeling each structural layer SL by the second-modeling operation.

[0151] The processing system SYS may form the three-dimensional structure ST by performing the second-modeling operation without performing the first-modeling operation. The processing system SYS may form each structural layer SL by performing the second-modeling operation without performing the first-modeling operation. The processing system SYS may form the three-dimensional structure ST by performing the first-modeling operation without performing the second-modeling operation. The processing system SYS may form each structural layer SL by performing the first-modeling operation without performing the second-modeling operation. The processing system SYS may form the three-dimensional structure ST by performing both the first and second-modeling operations. The processing system SYS may form each structural layer SL by performing both the first and second-modeling operations. The first and second-modeling operations will be described below in order. (2-1) First-Modeling Operation

[0152] The first modeling operation is a modeling operation in which a molten pool MP is formed on the modeling surface MS by irradiating the modeling surface MS with the processing light EL, and a modeling material M is supplied to the formed molten pool MP, thereby forming a model on the modeling surface MS. In other words, the first modeling operation is a modeling operation in which a molten pool MP is formed on the modeling surface MS by irradiating the modeling surface MS with the processing light EL, and a modeling material M is supplied to the formed molten pool MP, in order to form a model on the modeling surface MS.

[0153] First, the operation of forming each structure layer SL by performing the first forming operation will be described with reference to FIGS. 8A to 8E. Under the control of the control unit 7, the processing system SYS moves at least one of the processing head 21 and the stage 31 so that the processing unit areas PUA#1 and PUA#2 are set in desired areas on the forming surface MS corresponding to the surface of the workpiece W or the surface of the formed structure layer SL. Then, the irradiation optical system 211 irradiates the processing unit areas PUA#1 and PUA#2 with the processing light beams EL#1 and EL#2, respectively. At this time, the focus position CP#1 of the processing light beam EL#1 and the focus position CP#2 of the processing light beam EL#2 in the Z-axis direction may coincide with the forming surface MS. Alternatively, the focus position CP#1 of the processing light beam EL#1 and the focus position CP#2 of the processing light beam EL#2 in the Z-axis direction may be spaced apart from the forming surface MS. As a result, as shown in Fig. 8(a), molten pools MP#1 and MP#2 are formed on the building surface MS irradiated with the processing beams EL#1 and EL#2, respectively. Furthermore, as shown in Fig. 8(b), the processing system SYS supplies the building material M from the material nozzle 212 under the control of the control unit 7. As a result, the building material M is supplied to each of the molten pools MP#1 and MP#2.

[0154] The shaping material M supplied to the molten pool MP#1 is melted by the processing light EL#1 irradiated onto the molten pool MP#1. Alternatively, the shaping material M supplied to the molten pool MP#1 is melted by the molten pool MP#1 formed by the processing light EL#1. Note that even when the shaping material M is melted by the molten pool MP#1, since the molten pool MP#1 is formed by the processing light EL#1, the shaping material M may be considered to be melted by the processing light EL#1 that formed the molten pool MP#1. In other words, the shaping material M may be considered to be indirectly melted by the processing light EL#1 via the molten pool MP#1 formed by the processing light EL#1.

[0155] Similarly, the shaping material M supplied to the molten pool MP#2 is melted by the processing light EL#2 irradiated onto the molten pool MP#2. Alternatively, the shaping material M supplied to the molten pool MP#2 is melted by the molten pool MP#2 formed by the processing light EL#2. Even when the shaping material M is melted by the molten pool MP#2, since the molten pool MP#2 is formed by the processing light EL#2, the shaping material M may be considered to be melted by the processing light EL#2 that formed the molten pool MP#2. In other words, the shaping material M may be considered to be indirectly melted by the processing light EL#2 via the molten pool MP#2 formed by the processing light EL#2.

[0156] Furthermore, the irradiation optical system 211 uses the galvanometer mirrors 2146 and 2156 to move the target irradiation areas EA#1 and EA#2 within the machining unit areas PUA#1 and PUA#2, respectively. That is, the irradiation optical system 211 uses the galvanometer mirrors 2146 and 2156 to scan the machining unit areas PUA#1 and PUA#2 with the machining beams EL#1 and EL#2, respectively. When the target irradiation area EA#1 moves and the machining beam EL#1 is no longer irradiated onto the molten pool MP#1, the molten build material M in the molten pool MP#1 cools and solidifies (i.e., solidifies). Similarly, when the target irradiation area EA#2 moves and the machining beam EL#2 is no longer irradiated onto the molten pool MP#2, the molten build material M in the molten pool MP#2 cools and solidifies (i.e., solidifies). Furthermore, as the target irradiation areas EA#1 and EA#2 move, the molten pools MP#1 and MP#2 also move. As a result, as shown in Figure 8(c), within the processing unit areas PUA#1 and PUA#2 through which the molten pools MP#1 and MP#2 move, a molded object made of the solidified mold material M is deposited on the molded surface MS.

[0157] 8(c), for convenience of explanation, the object made of the solidified shaping material M in the processing unit area PUA#1 is physically separated from the object made of the solidified shaping material M in the processing unit area PUA#2. However, the object made of the solidified shaping material M in the processing unit area PUA#1 may be integrated with the object made of the solidified shaping material M in the processing unit area PUA#2. In particular, when the processing unit areas PUA#1 and PUA#2 coincide (or partially overlap), the object made of the solidified shaping material M in the processing unit area PUA#1 may be integrated with the object made of the solidified shaping material M in the processing unit area PUA#2.

[0158] During the period when the target irradiation areas EA#1 and EA#2 are moving within the machining unit areas PUA#1 and PUA#2, respectively, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 move on the manufacturing surface MS. In other words, the machining system SYS may move the target irradiation areas EA#1 and EA#2 within the machining unit areas PUA#1 and PUA#2, respectively, and move the machining unit areas PUA#1 and PUA#2 on the manufacturing surface MS in parallel.

[0159] Alternatively, during the period when the target irradiation areas EA#1 and EA#2 are moving within the machining unit areas PUA#1 and PUA#2, respectively, the machining system SYS does not have to move the machining head 21 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 do not move on the printing surface MS. In other words, during the period when the target irradiation areas EA#1 and EA#2 are moving within the machining unit areas PUA#1 and PUA#2, respectively, the machining head 21 and the stage 31 may be stopped. In this case, after the additional machining (i.e., printing) within the machining unit areas PUA#1 and PUA#2 is completed, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 are set in another area on the printing surface MS. In other words, after the additional machining (i.e., molding) in the machining unit areas PUA#1 and PUA#2 is completed, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 move on the printing surface MS. In this case, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that the area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have already been set (i.e., the area where the additional machining has already been performed) and the area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have newly been set (i.e., the area where the additional machining is about to be performed) are adjacent to each other. In particular, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that an area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have already been set does not overlap with an area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have newly been set. However, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that an area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have already been set partially overlaps with an area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have newly been set.

[0160] The machining system SYS repeats a series of manufacturing processes, including forming a molten pool MP#1 by irradiating the machining unit area PUA#1 with the machining light EL#1, forming a molten pool MP#2 by irradiating the machining unit area PUA#2 with the machining light EL#2, supplying the manufacturing material M to the molten pools MP#1 and MP#2, melting the supplied manufacturing material M, and solidifying the molten manufacturing material M, while moving the machining unit areas PUA#1 and PUA#2 on the manufacturing surface MS along the target movement trajectory MTO, as shown in FIG. 8(d). In this case, as the machining unit areas PUA#1 and PUA#2 move, a manufactured object having a width in a direction intersecting the target movement trajectory MTO is manufactured on the manufacturing surface MS. For example, when the machining unit areas PUA#1 and PUA#2 move as shown in FIGS. 6(a) and 6(b), a manufactured object having a width in the X-axis direction and extending in the Y-axis direction is manufactured. For example, when the processing unit areas PUA#1 and PUA#2 move as shown in Figures 7(a) and 7(c), respectively, a structure having a width along the X-axis direction and extending along the Y-axis direction is formed.

[0161] 8( e), a structure layer SL corresponding to a structured object, which is an aggregate of the melted and then solidified building material M, is formed on the building surface MS. That is, a structure layer SL corresponding to an aggregate of objects formed on the building surface MS in a pattern corresponding to the target movement trajectories MT0 of the processing unit areas PUA#1 and PUA#2 is formed. That is, a structure layer SL having a shape corresponding to the target movement trajectories MT0 of the processing unit areas PUA#1 and PUA#2 in plan view is formed.

[0162] Note that when the target irradiation area EA#1 is set in an area where it is not desired to form an object, the processing system SYS does not have to irradiate the target irradiation area EA#1 with the processing light EL#1. Alternatively, the processing system SYS may irradiate the target irradiation area EA#1 with the processing light EL#1 and stop the supply of the building material M. Alternatively, the processing system SYS may supply the building material M to the target irradiation area EA#1 and irradiate the target irradiation area EA#1 with the processing light EL#1 at an intensity that does not cause the formation of a molten pool MP. The same applies when the target irradiation area EA#2 is set in an area where it is not desired to form an object.

[0163] The target movement trajectories MT0 of the machining unit areas PUA#1 and PUA#2 may be referred to as machining paths (in other words, tool paths). In this case, the control unit 7 may move at least one of the machining head 21 and the stage 31 based on path information indicating the target movement trajectories MT0 (i.e., path information indicating the machining paths) so that each of the machining unit areas PUA#1 and PUA#2 moves along the target movement trajectories MT0 on the build surface MS.

[0164] The machining system SYS repeatedly performs operations for forming such a structure layer SL based on the three-dimensional model data under the control of the control unit 7. Specifically, before performing operations for forming the structure layer SL, the control unit 7 first slices the three-dimensional model data at the layer pitch to create slice data. The machining system SYS performs operations for forming the first structure layer SL#1 on the build surface MS corresponding to the surface of the workpiece W based on the slice data corresponding to the structure layer SL#1. Specifically, the control unit 7 acquires path information for forming the first structure layer SL#1, which is generated based on the slice data corresponding to the structure layer SL#1. Then, the control unit 7 controls the machining unit 2 and the stage unit 3 based on the path information to form the first structure layer SL#1. As a result, the structure layer SL#1 is formed on the build surface MS as shown in FIG. 9A. Thereafter, the machining system SYS sets the surface (i.e., the upper surface) of the structural layer SL#1 as a new build surface MS, and then builds a second structural layer SL#2 on the new build surface MS. To build the structural layer SL#2, the control unit 7 first controls at least one of the head drive system 22 and the stage drive system 32 so that the machining head 21 moves along the Z axis relative to the stage 31. Specifically, the control unit 7 controls at least one of the head drive system 22 and the stage drive system 32 to move the machining head 21 toward the +Z side and / or move the stage 31 toward the −Z side so that the machining unit areas PUA#1 and PUA#2 are set on the surface of the structural layer SL#1 (i.e., the new build surface MS). Thereafter, under the control of the control unit 7, the processing system SYS forms a structural layer SL#2 on the structural layer SL#1 based on the slice data corresponding to the structural layer SL#2, in the same manner as the operation for forming the structural layer SL#1. As a result, the structural layer SL#2 is formed as shown in FIG. 9(b). Thereafter, the same operation is repeated until all structural layers SL constituting the three-dimensional structure ST to be formed on the workpiece W are formed. As a result, the three-dimensional structure ST is formed by a layered structure in which a plurality of structural layers SL are stacked, as shown in FIG. 9(c). (2-2) Second Forming Operation

[0165] In the first modeling operation described above, the processing system SYS forms a molten pool MP on the modeling surface MS by irradiating the modeling surface MS with the processing light EL. On the other hand, in the second modeling operation, the processing system SYS does not necessarily irradiate the modeling surface MS with the processing light EL in order to form a molten pool MP on the modeling surface MS. In the second modeling operation, the processing system SYS does not necessarily perform the operation of forming a molten pool MP by irradiating the modeling surface MS with the processing light EL. Furthermore, in the first modeling operation described above, the processing system SYS supplies the modeling material M to the molten pool MP formed on the modeling surface MS, thereby melting the modeling material M in the molten pool MP. In other words, in the first modeling operation described above, the processing system SYS melts the modeling material M on the modeling surface MS. On the other hand, in the second modeling operation, the processing system SYS does not necessarily melt the modeling material M on the modeling surface MS.

[0166] Specifically, in the second modeling operation, the processing system SYS melts the modeling material M in the space between the material nozzle 212 and the modeling surface MS before the modeling material M reaches the modeling surface MS. That is, in the second modeling operation, the processing system SYS melts the modeling material M in the space between the material nozzle 212 and the modeling surface MS by irradiating the modeling material M with processing light EL in the space between the material nozzle 212 and the modeling surface MS. The modeling material M melted in the space between the material nozzle 212 and the modeling surface MS is supplied to the modeling surface MS. Therefore, the processing system SYS supplies the modeling material M melted in the space between the material nozzle 212 and the modeling surface MS to the modeling surface MS. Therefore, to summarize the explanation of the second modeling operation described above, the second modeling operation may be an operation in which the modeling material M is melted by irradiating the processing light EL onto the modeling material M in the space between the material nozzle 212 and the modeling surface MS, and the molten modeling material M is supplied to the modeling surface MS to form a model on the modeling surface MS.

[0167] To form each structure layer SL by performing the second modeling operation, the processing system SYS, under the control of the control unit 7, moves at least one of the processing head 21 and the stage 31 so that the molten modeling material M is supplied to a desired area on the modeling surface MS corresponding to the surface of the workpiece W or the surface of the modeled structure layer SL. Thereafter, as shown in FIG. 10A, the processing system SYS, under the control of the control unit 7, emits processing light EL#1 and EL#2 from the irradiation optical system 211. Furthermore, as shown in FIG. 10A, the processing system SYS, under the control of the control unit 7, supplies the modeling material M from the material nozzle 212.

[0168] As a result, at least one of the processing lights EL#1 and EL#2 is irradiated onto the shaping material M in the space between the material nozzle 212 and the shaping surface MS. In the following description, for convenience of explanation, a virtual material supply surface PL located at a position in the space between the material nozzle 212 and the shaping surface MS where at least one of the processing lights EL#1 and EL#2 is irradiated onto the shaping material M is referred to as a material irradiation surface ES. In this case, as shown in FIG. 10A, the processing system SYS may be considered to irradiate the material irradiation surface ES with the processing lights EL#1 and EL#2 and to supply the shaping material M to the material irradiation surface ES. However, because the material irradiation surface ES is not a physical surface, the processing lights EL#1 and EL#2 irradiated onto the material irradiation surface ES pass through the material irradiation surface ES, and the shaping material M supplied to the material irradiation surface ES also passes through the material irradiation surface ES. Therefore, the processing system SYS can be considered to emit processing light EL#1 and EL#2 so that the processing light EL#1 and EL#2 pass through the material irradiation surface ES, and to supply the forming material M so that the forming material M passes through the material irradiation surface ES.

[0169] When at least one of the processing light EL#1 and EL#2 is irradiated onto the building material M at the material irradiation surface ES, the building material M melts at the material irradiation surface ES, as shown in FIG. 10A . The building material M melted at the material irradiation surface ES is supplied from the material irradiation surface ES to the building surface MS. As a result, the building material M melted at the material irradiation surface ES adheres to the building surface MS. In this case, it can be considered that a molten pool MP is formed on the building surface MS by the building material M melted at the material irradiation surface ES. However, in the second building operation, since the object (e.g., the workpiece W or the structure layer SL) having the building surface MS on its surface is rarely melted directly by the processing light EL, the molten pool MP rarely penetrates into the object (e.g., the workpiece W or the structure layer SL) having the building surface MS on its surface. Alternatively, the amount of penetration of the molten pool MP into the interior of the object (e.g., workpiece W or structural layer SL) having the printing surface MS on its surface is relatively small. On the other hand, in the first printing operation, because the object (e.g., workpiece W or structural layer SL) having the printing surface MS on its surface is melted by the processing light EL, there is a high possibility that the molten pool MP will penetrate into the interior of the object (e.g., workpiece W or structural layer SL) having the printing surface MS on its surface. Furthermore, the amount of penetration of the molten pool MP into the interior of the object (e.g., workpiece W or structural layer SL) having the printing surface MS on its surface is relatively large. For this reason, if it is considered that a molten pool MP is formed in the second printing operation, the depth of the formed molten pool MP will typically be shallower than the depth of the molten pool MP formed in the first printing operation.

[0170] Thereafter, the modeling material M supplied to the modeling surface MS is cooled and solidified (i.e., solidified). As a result, as shown in Fig. 10(b), a model made of the solidified modeling material M is deposited on the modeling surface MS.

[0171] The processing system SYS repeats a series of modeling processes, including melting the modeling material M on the material irradiation surface ES by irradiating it with the processing lights EL#1 and EL#2, supplying the molten modeling material M to the modeling surface MS, and solidifying the molten modeling material M on the modeling surface MS, while moving the processing head 21 relative to the modeling surface MS, as shown in FIG. 10( c). In particular, the processing system SYS repeats the series of modeling processes while moving the processing head 21 relative to the modeling surface MS along at least one of the X-axis direction and the Y-axis direction. In this case, as the processing head 21 moves, a modeled object having a width along a direction intersecting the movement direction of the processing head 21 is modeled on the modeling surface MS. As a result, as shown in FIG. 10( d), a structure layer SL corresponding to a modeled object that is an aggregate of the melted and then solidified modeling material M is modeled on the modeling surface MS in a pattern corresponding to the movement trajectory of the processing head 21. That is, a structure layer SL having a shape corresponding to the movement trajectory of the processing head 21 in a plan view is formed.

[0172] Thereafter, also in the case of performing the second modeling operation, similarly to the case of performing the first modeling operation, the processing system SYS repeatedly performs the operation for modeling such a structural layer SL based on the three-dimensional model data under the control of the control unit 7. As a result, a three-dimensional structure ST is formed by a layered structure in which a plurality of structural layers SL are stacked.

[0173] As described above, when such a second-modeling operation is performed, an object (e.g., a workpiece W or a structure layer SL) having a modeling surface MS on its surface is rarely directly melted by the processing light EL. Therefore, a relatively shallow molten pool MP is formed on the modeling surface MS by the modeling material M molten at the material irradiation surface ES. Therefore, the time required for the molten modeling material M to cool and solidify is shorter than when a relatively deep molten pool MP is formed. Therefore, when the second-modeling operation is performed, the time required to model the three-dimensional structure ST is shorter than when the first-modeling operation is performed. In other words, the modeling speed of the second-modeling operation is faster than the modeling speed of the first-modeling operation. In other words, when the second-modeling operation is performed, the processing system SYS can model the three-dimensional structure ST at a higher speed than when the first-modeling operation is performed.

[0174] Since the three-dimensional structure ST can be formed at high speed by the second-forming operation in this manner, the second-forming operation may be referred to as a forming operation conforming to the extreme high speed application (EHLA). The second-forming operation may also be considered to be a forming operation conforming to the extreme high speed application (EHLA).

[0175] When the second modeling operation is performed, as in the case of the first modeling operation, the processing system SYS may deflect the processing light EL#1 and EL#2 using the galvanometer mirrors 2146 and 2156, respectively. In this case, as shown in FIG. 11 , which shows the processing light EL#1 passing through the material irradiation surface ES, the processing system SYS may use the galvanometer mirror 2146 to deflect the processing light EL#1, thereby moving the beam passing area PA#1 through which the processing light EL#1 passes within the virtual material irradiation surface ES that intersects the Z-axis between the material nozzle 212 and the modeling surface MS. Similarly, as shown in FIG. 11 , which shows the processing light EL#2 passing through the material irradiation surface ES, the processing system SYS may use the galvanometer mirror 2156 to deflect the processing light EL#2, thereby moving the beam passing area PA#2 through which the processing light EL#2 passes within the virtual material irradiation surface ES that intersects the Z-axis between the material nozzle 212 and the modeling surface MS.

[0176] In this embodiment, for convenience of explanation, the virtual area through which the galvanometer mirror 2146 or 2156 moves the beam passing area PA#k (where k is a variable indicating 1 or 2) on the material irradiation surface ES is referred to as the irradiation unit area MUA (particularly, the irradiation unit area MUA#k). In this case, the beam passing area PA#k may be considered to move on a surface of the material irradiation surface ES that overlaps with the irradiation unit area MUA#k. Specifically, the virtual area through which the galvanometer mirror 2146 or 2156 moves the beam passing area PA#k on the material irradiation surface ES while the positional relationship between the irradiation optical system 211 and the material irradiation surface ES is fixed (i.e., without change) is referred to as the irradiation unit area MUA (particularly, the irradiation unit area MUA#k). The irradiation unit area MUA#k indicates a virtual area (in other words, a range) through which the processing light EL#k emitted from the processing head 21 actually passes when the positional relationship between the irradiation optical system 211 and the material irradiation surface ES is fixed. The irradiation unit area MUA#k indicates a region (in other words, a range) through which the beam passing area PA#k actually moves when the positional relationship between the irradiation optical system 211 and the material irradiation surface ES is fixed. Therefore, the irradiation unit area MUA#k may be considered to be a virtual area determined based on the processing head 21 (particularly, the irradiation optical system 211). In other words, the irradiation unit area MUA#k may be considered to be a virtual area located on the material irradiation surface ES at a position determined based on the processing head 21 (particularly, the irradiation optical system 211). Furthermore, the maximum area over which the galvanometer mirror 2146 or 2156 can move the beam passing area PA#k on the material irradiation surface ES while the positional relationship between the irradiation optical system 211 and the material irradiation surface ES is fixed may also be referred to as the irradiation unit area MUA#k.

[0177] In this case, the processing system SYS can move the beam passing area PA#k within the irradiation unit area MUA#k using the galvanometer mirror 2146 or 2156. Therefore, the operation of deflecting the processing light EL#k using the galvanometer mirror 2146 or 2156 may be considered equivalent to the operation of moving the beam passing area PA#k within the irradiation unit area MUA#k.

[0178] Note that even when at least one of the machining head 21 and the stage 31 moves, the beam passing area PA#k moves on the material irradiation surface ES. However, when at least one of the machining head 21 and the stage 31 moves, the relative positional relationship between the galvanometer mirrors 2146 and 2156 and the material irradiation surface ES changes. As a result, the irradiation unit area MUA#k determined based on the machining head 21 (i.e., the irradiation unit area MUA#k in which the galvanometer mirror 2146 or 2156 moves the beam passing area PA#k on the material irradiation surface ES) moves on the material irradiation surface ES. For this reason, in this embodiment, the operation of moving at least one of the machining head 21 and the stage 31 may be considered equivalent to the operation of moving the irradiation unit area MUA#k relative to the material irradiation surface ES.

[0179] The characteristics of the irradiation unit area MUA#k (e.g., shape, movement pattern, etc.) may be the same as the characteristics of the processing unit area PUA#k described above. The movement pattern (e.g., movement trajectory) of the beam passing area PA#k within the irradiation unit area MUA#k may be the same as the movement pattern of the target irradiation area EA#k within the processing unit area PUA#k described above. Therefore, a detailed description of the characteristics of the irradiation unit area MUA#k and the movement pattern (e.g., movement trajectory, etc.) of the beam passing area PA#k within the irradiation unit area MUA#k will be omitted, but an example will be briefly described below with reference to Figures 12(a) to 12(e). 12(a), under the assumption that the irradiation unit area MUA#k is stationary (i.e., not moving) on ​​the material irradiation surface ES, the galvanometer mirror 2146 or 2156 may deflect the processing light EL#k so that the beam passing area PA#k moves within the irradiation unit area MUA#k along a single scanning direction along the material irradiation surface ES. When the irradiation unit area MUA#k shown in FIG. 12(a) moves along the target movement trajectory MT0 on the material irradiation surface ES, the beam passing area PA#k may move along the movement trajectory MT#k shown in FIG. 12(b) (e.g., a waveform-shaped movement trajectory MT#k oscillating around the target movement trajectory MT0) on the material irradiation surface ES. 12(c) and 12(d), under the assumption that the irradiation unit area MUA#k is stationary (i.e., not moving) on ​​the material irradiation surface ES, the galvanometer mirror 2146 or 2156 may deflect the processing light EL#k so that the beam passing area PA#k moves along a plurality of scanning directions within the irradiation unit area MUA#k. When the irradiation unit area MUA#k shown in FIG. 12(c) moves along the target movement trajectory MT0 on the material irradiation surface ES, the beam passing area PA#k may move along the movement trajectory MT#k shown in FIG. 12(e).

[0180] The material nozzle 212 may supply the modeling material M to the irradiation unit area MUA. In this case, the material nozzle 212 may supply the modeling material M to the irradiation unit area MUA so that the entire material supply area MSA is included in the irradiation unit area MUA, as shown in FIG. 13( a), which is a plan view showing the relationship between the material supply area MSA to which the modeling material M is supplied within the irradiation unit area MUA and the irradiation unit area MUA. In other words, the material nozzle 212 may supply the modeling material M to the irradiation unit area MUA so that a part of the irradiation unit area MUA is included in the material supply area MSA, while another part of the irradiation unit area MUA is not included in the material supply area MSA. Alternatively, the material nozzle 212 may supply the modeling material M to the irradiation unit area MUA so that a part of the material supply area MSA is included in the irradiation unit area MUA, while another part of the material supply area MSA is not included in the irradiation unit area MUA, as shown in FIG. 13( b), which is a plan view showing the relationship between the material supply area MSA and the irradiation unit area MUA. In other words, the material nozzle 212 may supply the modeling material M to the irradiation unit area MUA so that a part of the irradiation unit area MUA is included in the material supply area MSA, while another part of the irradiation unit area MUA is not included in the material supply area MSA. Alternatively, the material nozzle 212 may supply the modeling material M to the irradiation unit area MUA so that the entire irradiation unit area MUA is included in the material supply area MSA, as shown in FIG. 13( c), which is a plan view showing the relationship between the material supply area MSA and the irradiation unit area MUA. In other words, the material nozzle 212 may supply the modeling material M to the irradiation unit area MUA so that a part of the material supply area MSA is included in the irradiation unit area MUA, while another part of the material supply area MSA is not included in the irradiation unit area MUA. (2-3) Switching the Processing Mode (Setting the Processing Mode)

[0181] The control unit 7 may switch the machining mode of the machining system SYS (mainly, the machining unit 2) between a first mode in which the machining unit 2 performs a first modeling operation and a second mode in which the machining unit 2 performs a second modeling operation. In other words, the control unit 7 may set the machining mode of the machining system SYS (mainly, the machining unit 2) to either the first mode or the second mode.

[0182] When the processing mode of the processing system SYS is set to the first mode, the processing unit 2 may perform a first-modeling operation. The processing unit 2 may form at least a part of the three-dimensional structure ST by performing the first-modeling operation. When the processing mode of the processing system SYS is set to the second mode, the processing unit 2 may perform a second-modeling operation. The processing unit 2 may form at least a part of the three-dimensional structure ST by performing the second-modeling operation.

[0183] To set the processing mode of the processing system SYS, the control unit 7 may control at least one of the position of the material control point MCP and the focus position CP of the processing light EL. For example, the control unit 7 may set the processing mode of the processing system SYS to the first mode by controlling the position of the material control point MCP so that the position of the material control point MCP is located at a first position suitable for performing a first modeling operation. For example, the control unit 7 may set the processing mode of the processing system SYS to the second mode by controlling the position of the material control point MCP so that the position of the material control point MCP is located at a second position suitable for performing a second modeling operation. For example, the control unit 7 may set the processing mode of the processing system SYS to the first mode by controlling the focus position CP so that the focus position CP is located at a third position suitable for performing the first modeling operation. For example, the control unit 7 may set the processing mode of the processing system SYS to the second mode by controlling the focus position CP so that the focus position CP is located at a fourth position suitable for performing a second modeling operation. The third position and the fourth position may be rephrased as the first focus position and the second focus position, respectively.

[0184] 14(a) and 14(b), a specific example of a mode setting operation for setting the processing mode of the processing system SYS by controlling at least one of the position of the material control point MCP and the focus position CP of the processing light EL will be described. FIG. 14(a) is a cross-sectional view showing an example of the processing head 21 performing the first model-forming operation, and FIG. 14(b) is a cross-sectional view showing an example of the processing head 21 performing the second model-forming operation. (2-3-1) First Mode Setting Operation

[0185] As shown in Figure 14(a), the control unit 7 may perform a first mode setting operation to set the processing mode of the processing system SYS to the first mode by controlling the focus position CP of the processing light EL so that the focus position CP of the processing light EL is located on or near the printing surface MS. Note that Figure 14(a) shows an example in which the focus position CP of the processing light EL is located on the printing surface MS, but the focus position CP of the processing light EL may also be located at a position away from the printing surface MS along the Z-axis direction. When the first mode setting operation is performed, the processing system SYS can appropriately form a molten pool MP on the printing surface MS by irradiating the printing surface MS with processing light EL of a relatively high intensity. (2-3-2) Second Mode Setting Operation

[0186] 14(b), the control unit 7 may perform a second mode setting operation to set the processing mode of the processing system SYS to the second mode by controlling the focus position CP of the processing light EL so that the focus position CP of the processing light EL is located in the space between the material nozzle 212 and the printing surface MS. In this case, the intensity of the processing light EL used to perform the second printing operation is likely to be maximum in the space between the material nozzle 212 and the printing surface MS. Therefore, the processing system SYS can appropriately melt the printing material M in the space between the material nozzle 212 and the printing surface MS by irradiating the printing material M with processing light EL of a relatively high intensity in the space between the material nozzle 212 and the printing surface MS. (2-3-3) Third Mode Setting Operation

[0187] The control unit 7 may perform a third mode setting operation to switch the processing mode of the processing system SYS by controlling the focus position CP of the processing light EL to control the distance D1 between the focus position CP of the processing light EL and the printing surface MS. In particular, the control unit 7 may perform a third mode setting operation to switch the processing mode of the processing system SYS by controlling the focus position CP of the processing light EL to control the distance D1 in the Z-axis direction between the focus position CP of the processing light EL and the printing surface MS.

[0188] 14( a) and 14(b), the control unit 7 may switch the processing mode of the processing system SYS by controlling the focus position CP of the processing light EL so as to satisfy a first distance condition that "the distance D1 between the focus position CP of the processing light EL and the printing surface MS when performing the first printing operation is different from the distance D1 between the focus position CP of the processing light EL and the printing surface MS when performing the second printing operation." Typically, the control unit 7 may switch the processing mode of the processing system SYS by controlling the focus position CP of the processing light EL so as to satisfy a first distance condition that "the distance D1 between the focus position CP of the processing light EL and the printing surface MS when performing the first printing operation is shorter than the distance D1 between the focus position CP of the processing light EL and the printing surface MS when performing the second printing operation." In the example shown in Figure 14(a), the focus position CP of the processing light EL is set on the printing surface MS, so the distance D1 is zero, but the distance D1 does not have to be zero.

[0189] In this case, the control unit 7 may set the processing mode of the processing system SYS to the first mode by controlling the focus position CP so that the distance D1 between the focus position CP of the processing light EL and the printing surface MS becomes a first distance D11 suitable for performing the first printing operation. On the other hand, the control unit 7 may set the processing mode of the processing system SYS to the second mode by controlling the focus position CP so that the distance D1 between the focus position CP of the processing light EL and the printing surface MS becomes a second distance D12 suitable for performing the second printing operation.

[0190] The second distance D12 is longer than the first distance D11. That is, the first distance D11 is shorter than the second distance D12. The first distance D11 may be zero or may be longer than zero. The second distance D12 may be longer than zero, but is preferably not zero.

[0191] Each of the first distance D11 and the second distance D12 may be set based on processing conditions (e.g., at least one of the characteristics of the processing system SYS, the characteristics of the build material M, and the characteristics of the workpiece W), etc. Alternatively, each of the first distance D11 and the second distance D12 may be set by a user of the processing system SYS.

[0192] When the first distance condition is satisfied, the intensity of the processing light EL used to perform the first modeling operation is more likely to be maximum at or near the modeling surface MS, compared to when the first distance condition is not satisfied. Therefore, the processing system SYS can appropriately form a molten pool MP on the modeling surface MS by irradiating the modeling surface MS with a relatively high-intensity processing light EL. On the other hand, when the first distance condition is satisfied, the intensity of the processing light EL used to perform the second modeling operation is more likely to be maximum at a position away from the modeling surface MS (typically, the space between the material nozzle 212 and the modeling surface MS), compared to when the first distance condition is not satisfied. Therefore, the processing system SYS can appropriately melt the modeling material M in the space between the material nozzle 212 and the modeling surface MS by irradiating the modeling material M with a relatively high-intensity processing light EL in the space between the material nozzle 212 and the modeling surface MS.

[0193] 14(b), the material irradiation surface ES on which the processing light EL is irradiated onto the modeling material M in the second modeling operation may be considered to be a virtual material supply surface PL set at the same position as the focus position CP of the processing light EL in the Z-axis direction or set near the focus position CP of the processing light EL in the Z-axis direction. In other words, a virtual material supply surface PL set at the same position as the focus position CP of the processing light EL in the Z-axis direction or set near the focus position CP of the processing light EL in the Z-axis direction may be used as the material irradiation surface ES. (2-3-4) Fourth Mode Setting Operation

[0194] As shown in FIG. 14A , the control unit 7 may perform a fourth mode setting operation to set the machining mode of the machining system SYS to the first mode by controlling the material control point MCP so that the material control point MCP is located below the build surface MS. An object (e.g., a workpiece W or a structural layer SL) having the build surface MS on its surface is likely to be located below the build surface MS. In this case, the fourth mode setting operation may be considered to be an operation to set the machining mode of the machining system SYS to the first mode by controlling the material control point MCP so that the material control point MCP is located inside (i.e., inside) the object (e.g., workpiece W or structural layer SL) having the build surface MS on its surface. The state in which the material control point MCP is located below the build surface MS may include a state in which the material control point MCP is located inside (i.e., inside) the object (e.g., workpiece W or structural layer SL) having the build surface MS on its surface.

[0195] In this case, compared to when the material control point MCP is located in the space between the material nozzle 212 and the build surface MS (i.e., above the build surface MS), as shown in Figure 14(a), the possibility of the build material M being irradiated with the processing light EL (and consequently melting the build material M) in the space between the material nozzle 212 and the build surface MS is lower. Therefore, by irradiating the build surface MS with the processing light EL, the processing system SYS can appropriately form a molten pool MP on the build surface MS and appropriately supply the build material M to the molten pool MP.

[0196] When the material control point MCP is located below the printing surface MS, the printing material M supplied from the material nozzle 212 reaches the printing surface MS before the printing material M supplied from the multiple different material supply directions intersect. Therefore, the operation of controlling the material control point MCP so that the material control point MCP is located below the printing surface MS may be considered equivalent to the operation of controlling the material control point MCP so that the printing material M supplied from the material nozzle 212 reaches the printing surface MS before the printing material M supplied from the multiple different material supply directions intersect.

[0197] However, even if the material control point MCP is located in the space between the material nozzle 212 and the build surface MS, as long as the machining system SYS can irradiate the build surface MS with the processing light EL, the machining system SYS can form a molten pool MP on the build surface MS. Therefore, even if the material control point MCP is located in the space between the material nozzle 212 and the build surface MS (i.e., located above the build surface MS), the machining system SYS may perform the first build operation. For the same reason, even if the material control point MCP is located on the build surface MS, the machining system SYS may perform the first build operation. (2-3-5) Fifth Mode Setting Operation

[0198] 14(b), the control unit 7 may perform a fifth mode setting operation to set the machining mode of the machining system SYS to the second mode by controlling the material control point MCP so that the material control point MCP is located in the space between the material nozzle 212 and the build surface MS. In other words, the control unit 7 may perform a fifth mode setting operation to set the machining mode of the machining system SYS to the second mode by controlling the material control point MCP so that the material control point MCP is located above the build surface MS.

[0199] In this case, compared to when the material control point MCP is located below the printing surface MS, as shown in Figure 14(b), there is a higher possibility that the printing material M will be irradiated with the processing light EL (and as a result, the printing material M will melt) in the space between the material nozzle 212 and the printing surface MS. Therefore, the processing system SYS can appropriately melt the printing material M in the space between the material nozzle 212 and the printing surface MS. (2-3-6) Sixth Mode Setting Operation

[0200] The control unit 7 may perform a sixth mode setting operation to switch the machining mode of the machining system SYS by controlling the position of the material control point MCP to control the distance D2 between the material control point MCP and the build surface MS. In particular, the control unit 7 may perform a sixth mode setting operation to switch the machining mode of the machining system SYS by controlling the position of the material control point MCP to control the distance D2 in the Z-axis direction between the material control point MCP and the build surface MS.

[0201] Specifically, as shown in Figures 14(a) and 14(b), the control unit 7 may switch the processing mode of the processing system SYS by controlling the position of the material control point MCP so as to satisfy the second distance condition that "the distance D2 between the material control point MCP and the printing surface MS when performing the first printing operation is different from the distance D2 between the material control point MCP and the printing surface MS when performing the second printing operation."

[0111] Typically, when the distance D2 between the material control point MCP and the printing surface MS is defined such that the distance between a position away from the printing surface MS on the +Z side and the printing surface MS is a positive distance and the distance between a position away from the printing surface MS on the -Z side and the printing surface MS is a negative distance, the control unit 7 may switch the printing mode of the printing system SYS by controlling the position of the material control point MCP so as to satisfy the second distance condition: "The distance D2 between the material control point MCP and the printing surface MS when performing the first printing operation is a negative distance, and the distance D2 between the material control point MCP and the printing surface MS when performing the second printing operation is a positive distance different from the negative distance." Note that in the example shown in Figure 14(b), the material control point MCP is located at the same position in the Z-axis direction as the focus position CP of the processing light EL, so the distance D2 between the material control point MCP and the printing surface MS is the same as the distance D1 between the focus position CP of the processing light EL and the printing surface MS; however, the distance D2 may be different from the distance D1.

[0202] When the second distance condition is satisfied in this manner, the material control point MCP is more likely to be located below the printing surface MS when the first printing operation is performed, compared to when the second distance condition is not satisfied. Therefore, as explained in the description of the fourth mode setting operation, the printing material M is less likely to be irradiated with the processing light EL onto the printing material M (and as a result, the printing material M will melt) in the space between the material nozzle 212 and the printing surface MS. Therefore, by irradiating the printing surface MS with the processing light EL, the processing system SYS can appropriately form a molten pool MP on the printing surface MS and appropriately supply the printing material M to the molten pool MP formed on the printing surface MS.

[0203] Furthermore, when the second distance condition is satisfied, the material control point MCP is more likely to be located in the space between the material nozzle 212 and the printing surface MS (i.e., located above the printing surface MS) when the second printing operation is performed, compared to when the second distance condition is not satisfied. Therefore, as explained in the explanation of the fifth mode setting operation, the printing material M is more likely to be irradiated with the processing light EL in the space between the material nozzle 212 and the printing surface MS (as a result, the printing material M is melted). Therefore, the processing system SYS can appropriately melt the printing material M in the space between the material nozzle 212 and the printing surface MS. (2-3-7) Seventh Mode Setting Operation

[0204] The control unit 7 may perform a seventh mode setting operation to switch the processing mode of the processing system SYS by controlling at least one of the focus position CP of the processing light EL and the position of the material control point MCP to control the distance D3 between the focus position CP of the processing light EL and the material control point MCP. In particular, the control unit 7 may perform a seventh mode setting operation to switch the processing mode of the processing system SYS by controlling at least one of the focus position CP of the processing light EL and the position of the material control point MCP to control the distance D3 in the Z-axis direction between the focus position CP of the processing light EL and the material control point MCP.

[0205] 14( a) and 14(b), the control unit 7 may switch the processing mode of the processing system SYS by controlling at least one of the positions of the focus position CP of the processing light EL and the material control point MCP so as to satisfy a third distance condition that “the distance D3 between the focus position CP of the processing light EL and the material control point MCP when performing the first modeling operation is different from the distance D3 between the focus position CP of the processing light EL and the material control point MCP when performing the second modeling operation.” Typically, the control unit 7 may switch the processing mode of the processing system SYS by controlling at least one of the positions of the focus position CP of the processing light EL and the material control point MCP so as to satisfy a third distance condition that “the distance D3 between the focus position CP of the processing light EL and the material control point MCP when performing the first modeling operation is longer than the distance D3 between the focus position CP of the processing light EL and the material control point MCP when performing the second modeling operation.” In the example shown in Figure 14 (b), the material control point MCP is located at the same position as the focus position CP of the processing light EL in the Z-axis direction, so the distance D3 is zero, but the distance D3 does not have to be zero.

[0206] In this case, the control unit 7 may set the processing mode of the processing system SYS to the first mode by controlling at least one of the positions of the focus position CP and the material control point MCP so that the distance D3 between the focus position CP of the processing light EL and the material control point MCP becomes a first distance D31 suitable for performing the first modeling operation. On the other hand, the control unit 7 may set the processing mode of the processing system SYS to the second mode by controlling at least one of the positions of the focus position CP and the material control point MCP so that the distance D3 between the focus position CP of the processing light EL and the material control point MCP becomes a second distance D32 suitable for performing the second modeling operation.

[0207] The second distance D32 is shorter than the first distance D31. That is, the first distance D31 is longer than the second distance D32. The second distance D32 may be zero or may be longer than zero. The first distance D31 may be longer than zero, but is preferably not zero.

[0208] Each of the first distance D31 and the second distance D32 may be set based on processing conditions (e.g., at least one of the characteristics of the processing system SYS, the characteristics of the modeling material M, and the characteristics of the workpiece W), or alternatively, each of the first distance D31 and the second distance D32 may be set by a user of the processing system SYS.

[0209] When the third distance condition is satisfied in this way, the material control point MCP is more likely to be located below the printing surface MS when the first printing operation is performed, compared to when the third distance condition is not satisfied. Therefore, as explained in the description of the fourth mode setting operation, the printing material M is less likely to be irradiated with the processing light EL onto the printing material M (and as a result, the printing material M will melt) in the space between the material nozzle 212 and the printing surface MS. Therefore, by irradiating the printing surface MS with the processing light EL, the processing system SYS can appropriately form a molten pool MP on the printing surface MS and appropriately supply the printing material M to the molten pool MP formed on the printing surface MS.

[0210] Furthermore, when the third distance condition is satisfied, the material control point MCP is more likely to be located in the space between the material nozzle 212 and the printing surface MS (i.e., located above the printing surface MS) when the second printing operation is performed, compared to when the third distance condition is not satisfied. Therefore, as explained in the description of the fifth mode setting operation, the printing material M is more likely to be irradiated with the processing light EL in the space between the material nozzle 212 and the printing surface MS (as a result, the printing material M is melted). Therefore, the processing system SYS can appropriately melt the printing material M in the space between the material nozzle 212 and the printing surface MS.

[0211] 14(b), the material irradiation surface ES on which the processing light EL is irradiated onto the modeling material M in the second modeling operation may be considered to be a virtual material supply surface PL set at the same position as the material control point MCP in the Z-axis direction or set near the material control point MCP in the Z-axis direction. In other words, the virtual material supply surface PL set at the same position as the material control point MCP in the Z-axis direction or set near the material control point MCP in the Z-axis direction may be used as the material irradiation surface ES. (2-3-8) Eighth Mode Setting Operation

[0212] When the material nozzle 212 supplies the modeling material M from each of a plurality of different material supply directions, the control unit 7 may perform an eighth mode setting operation to set the modeling mode of the machining system SYS to the second mode by controlling at least one of the focus position CP and the position of the material control point MCP of the processing light EL so that the modeling material M is melted by the processing light EL at a position where the modeling material M supplied from the plurality of different material supply directions intersect. That is, as shown in FIG. 14( b), the control unit 7 may perform an eighth mode setting operation to set the modeling mode of the machining system SYS to the second mode by controlling at least one of the focus position CP and the position of the material control point MCP of the processing light EL so that the modeling material M is irradiated with the processing light EL at a position where the modeling material M supplied from the plurality of different material supply directions intersect. For example, the control unit 7 may perform an eighth mode setting operation that sets the processing mode of the processing system SYS to the second mode by controlling at least one of the focus position CP of the processing light EL and the position of the material control point MCP so that the forming material M melts at the position where the forming material M supplied from the first supply port portion 2122 of the material supply port 2121 along the first material supply direction and the forming material M supplied from the second supply port portion 2123 of the material supply port 2121 along the second material supply direction intersect.

[0213] In this case, too, there is a high possibility that the processing light EL will be irradiated onto the modeling material M (and as a result, the modeling material M will melt) in the space between the material nozzle 212 and the modeling surface MS (i.e., above the modeling surface MS). Therefore, the processing system SYS can appropriately melt the modeling material M in the space between the material nozzle 212 and the modeling surface MS.

[0214] 14(b), in the case where the modeling material M is melted by the processing light EL at a position where the modeling material M supplied from a plurality of different material supply directions intersect, the material nozzle 212 may be considered to supply the modeling material M from a direction intersecting with the modeling surface MS toward the material supply position MSP on the modeling surface MS, and the irradiation optical system 211 may be considered to melt the modeling material M on the material irradiation surface ES using the processing light EL directed in a direction different from the material supply position MSP. Therefore, the eighth mode setting operation may be considered to be an operation of setting the machining mode of the machining system SYS to the second mode by controlling at least one of the focus position CP and the position of the material control point MCP of the processing light EL so that the material nozzle 212 supplies the modeling material M from a direction intersecting with the modeling surface MS toward the material supply position MSP on the modeling surface MS, and the irradiation optical system 211 melts the modeling material M on the material irradiation surface ES using the processing light EL directed in a direction different from the material supply position MSP.

[0215] Furthermore, when the building material M is melted at a position where the building material M supplied from a plurality of different material supply directions intersect, the material irradiation surface ES may be considered to be a virtual material supply surface PL set at or near the position where the building material M supplied from a plurality of different material supply directions intersect. In other words, the virtual material supply surface PL set at or near the position where the building material M supplied from a plurality of different material supply directions intersect may be used as the material irradiation surface ES.

[0216] As described above, the point where the shaping material M supplied from multiple different material supply directions intersect may be used as the material control point MCP. In this case, if the shaping material M is melted by the processing light EL at the position where the shaping material M supplied from multiple different material supply directions intersect, the position where the shaping material M supplied from multiple different material supply directions intersect is located on the optical path of the processing light EL. Therefore, the material control point MCP may also be a point located on the optical path of the processing light EL. The material control point MCP may be a point located on a virtual axis extending along the optical path of the processing light EL. The material control point MCP may be a point located on the optical axis AX of the irradiation optical system 211 that emits the processing light EL.

[0217] Furthermore, both the material control point MCP and the optical axis AX may be located within a region determined according to the distribution of the supply amount of the building material M within the material irradiation surface ES including the material control point MCP. For example, both the material control point MCP and the optical axis AX may be located within a region of the half-width at half maximum (or full-width at half maximum) of the distribution of the supply amount of the building material M within the material irradiation surface ES including the material control point MCP. In this case, the diameter of the third optical system 216 (particularly the fθ lens 2162) functioning as the objective optical system may be smaller than the half-width at half maximum (or full-width at half maximum) of the distribution of the supply amount of the building material M within the material irradiation surface ES including the material control point MCP. Note that when the fourth to eighth mode setting operations are performed to set the processing mode of the processing system SYS to the first mode or the second mode, the focus position CP of the processing light EL may be fixed. In other words, the focus position CP of the processing light EL when the processing mode of the processing system SYS is set to the first mode may be the same as the focus position CP of the processing light EL when the processing mode of the processing system SYS is set to the second mode. In this case, the processing system SYS may switch the processing mode of the processing system SYS by controlling the position of the material control point MCP. Also, the processing system SYS may switch the processing mode of the processing system SYS by controlling the position of the material control point MCP without controlling the focus position CP of the processing light EL. (2-3-9) Specific examples of methods for controlling the position of the material control point MCP and the focus position CP of the processing light EL

[0218] The control unit 7 may control the nozzle drive system 23 to control the position of the material control point MCP. Specifically, as shown in Fig. 15 , the control unit 7 may control (typically, change) the position of the material control point MCP that is determined based on the material nozzle 212 by controlling the nozzle drive system 23 to move the material nozzle 212 along the Z-axis direction. For example, as shown in Fig. 15 , in a situation where the machining system SYS is performing the first modeling operation (i.e., the machining mode of the machining system SYS is set to the first mode), the control unit 7 may switch the machining mode of the machining system SYS from the first mode to the second mode by moving the material nozzle 212 toward the +Z side along the Z-axis direction. For example, as shown in FIG. 15, when the processing system SYS is performing the second modeling operation (i.e., the processing mode of the processing system SYS is set to the second mode), the control unit 7 may switch the processing mode of the processing system SYS from the second mode to the first mode by moving the material nozzle 212 along the Z-axis direction toward the -Z side.

[0219] In order to control the position of the material control point MCP, the control unit 7 may control a gas nozzle 217 capable of supplying (typically, spraying) gas to a supply path of the modeling material M supplied from the material nozzle 212. Specifically, as shown in Fig. 16 , the control unit 7 may control (typically, change) the position of the material control point MCP corresponding to the point of intersection of the modeling material M by controlling ON / OFF of the gas supply from the gas nozzle 217 to change the material supply direction of the modeling material M from the material nozzle 212. For example, as shown in Fig. 16 , when the machining system SYS is performing the first modeling operation (i.e., the machining mode of the machining system SYS is set to the first mode), the control unit 7 may control the gas nozzle 217 to supply gas, thereby changing the material supply direction of the modeling material M so that the modeling material M intersects in the space between the material nozzle 212 and the modeling surface MS, and as a result, switch the machining mode of the machining system SYS from the first mode to the second mode. Alternatively, although not shown, for example, when the processing system SYS is performing the first modeling operation (i.e., the processing mode of the processing system SYS is set to the first mode), the control unit 7 may control the gas nozzle 217 to stop the supply of gas, thereby changing the material supply direction of the modeling material M so that the modeling material M intersects with the space between the material nozzle 212 and the modeling surface MS, and as a result, the processing mode of the processing system SYS may be switched from the first mode to the second mode. For example, as shown in Fig. 16, when the processing system SYS is performing the second modeling operation (i.e., the processing mode of the processing system SYS is set to the second mode), the control unit 7 may control the gas nozzle 217 to stop the supply of gas, thereby returning the material supply direction of the modeling material M to its original state, and as a result, the processing mode of the processing system SYS may be switched from the second mode to the first mode.Alternatively, although not shown, for example, when the processing system SYS is performing the second modeling operation (i.e., the processing mode of the processing system SYS is set to the second mode), the control unit 7 may control the gas nozzle 217 to supply gas, thereby returning the material supply direction of the modeling material M to its original state, and as a result, switching the processing mode of the processing system SYS from the second mode to the first mode.

[0220] Alternatively, although not shown, the control unit 7 may change the material supply direction of the modeling material M from the material nozzle 212 by controlling the supply direction of the gas from the gas nozzle 217, in addition to or instead of controlling the ON / OFF of the supply of gas from the gas nozzle 217. That is, in addition to or instead of controlling the ON / OFF of the supply of gas from the gas nozzle 217, the control unit 7 may control (typically change) the position of the material control point MCP, which corresponds to the point where the modeling material M intersects, by controlling the supply direction of the gas from the gas nozzle 217. For example, when the machining system SYS is performing the second modeling operation, the control unit 7 may change the material supply direction of the modeling material M by controlling the gas nozzle 217 to change the supply direction of the gas, and as a result, switch the machining mode of the machining system SYS from the second mode to the first mode. For example, when the processing system SYS is performing the first modeling operation, the control unit 7 may change the material supply direction of the modeling material M by controlling the gas nozzle 217 to change the gas supply direction, and as a result, the processing mode of the processing system SYS may be switched from the first mode to the second mode.

[0221] Alternatively, although not shown, the control unit 7 may change the material supply direction of the modeling material M from the material nozzle 212 by controlling the amount of gas supplied from the gas nozzle 217, in addition to or instead of controlling at least one of the ON / OFF of the gas supply from the gas nozzle 217 and the supply direction of the gas from the gas nozzle 217. That is, in addition to or instead of controlling at least one of the ON / OFF of the gas supply from the gas nozzle 217 and the supply direction of the gas from the gas nozzle 217, the control unit 7 may control (typically change) the position of the material control point MCP, which corresponds to the point where the modeling material M intersects, by controlling the amount of gas supplied from the gas nozzle 217. For example, when the machining system SYS is performing the second modeling operation, the control unit 7 may change the material supply direction of the modeling material M by controlling the gas nozzle 217 to change (e.g., increase or decrease) the amount of gas supplied, and as a result, switch the machining mode of the machining system SYS from the second mode to the first mode. For example, when the processing system SYS is performing the first modeling operation, the control unit 7 may change the material supply direction of the modeling material M by controlling the gas nozzle 217 to change the amount of gas supplied (e.g., increase or decrease), and as a result, switch the processing mode of the processing system SYS from the first mode to the second mode.

[0222] In order to control the focus position CP, the control unit 7 may control at least one of the focus control optical systems 2145 and 2156 included in the irradiation optical system 211. In particular, the control unit 7 may control the focus position CP in accordance with the control of the material control point MCP by controlling at least one of the focus control optical systems 2145 and 2156 in parallel with or before or after the control of the material control point MCP. (2-3-10) Utilization of position information related to the position of the material control point MCP, the focus position CP of the processing light EL, and the position of the manufacturing surface MS

[0223] As described above, the processing mode of the processing system SYS can be switched depending on at least one of the focus position CP of the processing light EL, the position of the material control point MCP, and the position of the printing surface MS. Therefore, the focus position CP of the processing light EL, the position of the material control point MCP, and the position of the printing surface MS may be considered to be index values ​​that affect the processing mode of the processing system SYS.

[0224] In this case, during the period in which the processing system SYS is forming the three-dimensional structure ST, the control unit 7 may collect, as log information, position information regarding at least one of the focus position CP of the processing light EL, the position of the material control point MCP, and the position of the printing surface MS. In order for the control unit 7 to collect the log information, the processing system SYS may be equipped with a sensor that detects position information regarding at least one of the focus position CP of the processing light EL, the position of the material control point MCP, and the position of the printing surface MS. The collected log information may be used to verify the operation of the processing system SYS after the fact. The collected log information may be used to verify the quality of the three-dimensional structure ST formed by the processing system SYS after the fact. (3) Formation of a three-dimensional structure ST using both the first and second printing operations

[0225] As described above, the processing system SYS may form the three-dimensional structure ST by performing both the first and second modeling operations. Specifically, the processing system SYS may form a part of the three-dimensional structure ST by performing the first modeling operation, and form another part of the three-dimensional structure ST by performing the second modeling operation. That is, the processing system SYS may form a first part of the three-dimensional structure ST by performing the first modeling operation, and form a second part of the three-dimensional structure ST that is different from the first part by performing the second modeling operation. In particular, the processing system SYS may form a part of the three-dimensional structure ST by performing the first modeling operation during a first period, and form the other part of the three-dimensional structure ST by performing the second modeling operation during a second period that is different from the first period. In other words, the processing system SYS may form a first part of the three-dimensional structure ST by performing a first forming operation during a first period, and form a second part of the three-dimensional structure ST by performing a second forming operation during a second period different from the first period.

[0226] In this case, the control unit 7 may switch the processing mode of the processing system SYS so that the processing unit 2 performing the first-modeling operation forms a part (first part) of the three-dimensional structure ST, and the processing unit 2 performing the second-modeling operation forms another part (second part) of the three-dimensional structure ST. Below, a specific example of an operation to form a three-dimensional structure ST by performing both the first and second-modeling operations will be described. (3-1) First specific example of an operation to form a three-dimensional structure ST using both the first and second-modeling operations

[0227] First, a first specific example of an operation for forming a three-dimensional structure ST by performing both the first and second formation operations will be described. In the first specific example, the processing system SYS may perform both the first and second formation operations to form each of the multiple structural layers SL that constitute the three-dimensional structure ST. Therefore, in the first specific example, the control unit 7 may switch the processing mode of the processing system SYS between the first mode and the second mode while the processing system SYS is forming each structural layer SL.

[0228] Specifically, in the first specific example, as shown in FIGS. 17( a) and 17(b), the processing system SYS may perform the first modeling operation to model an exterior wall object SL-1 corresponding to a part of the structural layer SL. The exterior wall object SL-1 may be a model having a surface that will be exposed to the outside when the three-dimensional structure ST is completed. The exterior wall object SL-1 may be a model having a surface that will become the outer surface of the three-dimensional structure ST. The exterior wall object SL-1 may be a model having a surface that faces in a direction intersecting the stacking direction of the structural layer SL (e.g., a direction intersecting the Z-axis). The exterior wall object SL-1 may include a model having a predetermined width along a direction intersecting the stacking direction of the structural layer SL. FIGS. 17(a) and 17(b) show an example in which the exterior wall object SL-1 is a frame-shaped object.

[0229] On the other hand, as shown in Figures 17(a) and 17(c), the processing system SYS may perform the second modeling operation to model a filled object SL-2 corresponding to a remaining portion of the structural layer SL. The filled object SL-2 may include an object that will not be exposed to the outside when the three-dimensional structure ST is completed. The filled object SL-2 may include an object that is at least partially surrounded by the outer wall object SL-1. The filled object SL-2 may include an object that is at least partially surrounded by the outer wall object SL-1 in a plane intersecting the stacking direction of the structural layer SL. The filled object SL-2 may include an object located inside the outer wall object SL-1. The filled object SL-2 may include an object located inside the outer wall object SL-1 in a plane intersecting the stacking direction of the structural layer SL. The filling object SL-2 may include an object that fills the gap G1 of the exterior wall object SL-1 (i.e., the space surrounded by the exterior wall object SL-1). In this case, the exterior wall object SL-1 may include an object that includes the gap G1 surrounded by the exterior wall object SL-1. Figures 17(a) and 17(c) show an example in which the filling object SL-2 is an object with a rectangular outer shape that fills the three-dimensional gap G1 with a rectangular cross section.

[0230] The processing system SYS may perform a first printing operation to print the exterior wall object SL-1, and then perform a second printing operation to print the filled object SL-2. The processing system SYS may perform a second printing operation to print the filled object SL-2, and then perform a first printing operation to print the exterior wall object SL-1. The processing system SYS may alternately repeat an operation to print a part of the exterior wall object SL-1 by performing the first printing operation and an operation to print a part of the filled object SL-2 by performing the second printing operation.

[0231] Here, the modeling accuracy of the first modeling operation is usually higher than that of the second modeling operation. The reason why the modeling accuracy of the first modeling operation is higher than that of the second modeling operation will be explained below. As described above, the first modeling operation is an operation in which a molten pool MP is formed on the modeling surface MS by irradiating the modeling surface MS with the processing light EL, and a modeling material M is supplied to the formed molten pool MP, thereby forming a model. In this case, the modeling accuracy of the first modeling operation depends on the accuracy of the position where the molten pool MP is formed. The accuracy of the position where the molten pool MP is formed depends on the accuracy of the irradiation position of the processing light EL on the modeling surface MS. Here, the irradiation position of the processing light EL on the modeling surface MS can be controlled with relatively high accuracy by the galvanometer mirror 2146 or 2156. On the other hand, the second modeling operation is an operation in which a molten pool MP is melted in the space between the material nozzle 212 and the modeling surface MS and supplied to the modeling surface MS, thereby forming a model. In this case, the modeling accuracy of the second modeling operation depends on the accuracy of the supply position of the molten modeling material M on the modeling surface MS. Here, the supply position of the molten modeling material M on the modeling surface MS cannot necessarily be controlled with high accuracy compared to the irradiation position of the processing light EL on the modeling surface MS, which affects the modeling accuracy of the first modeling operation described above. This is because the trajectory of the molten modeling material M falling through the space between the material nozzle 212 and the modeling surface MS cannot necessarily be controlled with high accuracy. For this reason, the modeling accuracy of the first modeling operation is usually higher than that of the second modeling operation.

[0232] As a result, when the exterior wall object SL-1 is formed by performing the first forming operation, the processing system SYS can form the exterior wall object SL-1, which forms the outer surface of the three-dimensional structure ST, with higher forming accuracy than when the exterior wall object SL-1 is formed by performing the second forming operation. Therefore, the processing system SYS can form the three-dimensional structure ST with relatively little dimensional error in its outer shape.

[0233] On the other hand, as already explained, the modeling speed of the second modeling operation is faster than the modeling speed of the first modeling operation. Therefore, when the filled object SL-2 is modeled by performing the second modeling operation, the time required to model the filled object SL-2 is shorter than when the filled object SL-2 is modeled by performing the first modeling operation. On the other hand, because the filled object SL-2 is not exposed to the outside of the three-dimensional structure ST, even when the filled object SL-2 is modeled by performing the second modeling operation, the dimensional accuracy of the outer shape of the three-dimensional structure ST is unlikely to deteriorate.

[0234] Therefore, in the first specific example, compared to the case where the three-dimensional structure ST is formed by performing only one of the first and second modeling operations, the processing system SYS can form a three-dimensional structure ST with a relatively small dimensional error in a relatively short time. In other words, the processing system SYS can achieve both the effect of improving modeling accuracy (for example, improving the dimensional error in the outer shape of the three-dimensional structure ST) and the effect of shortening the time required to form the three-dimensional structure ST (that is, improving throughput). (3-2) Second specific example of operation of forming a three-dimensional structure ST using both the first and second modeling operations

[0235] Next, a second specific example of an operation for forming a three-dimensional structure ST by performing both the first and second modeling operations will be described. In the second specific example, as in the first specific example, the processing system SYS may perform both the first and second modeling operations to form each of the multiple structural layers SL that constitute the three-dimensional structure ST. Therefore, in the second specific example, as in the first specific example, the control unit 7 may switch the processing mode of the processing system SYS between the first mode and the second mode during the period in which the processing system SYS forms the structural layer SL#1.

[0236] In particular, in the second specific example, the processing system SYS may perform both the first and second modeling operations to form a first structural layer SL#1 among the multiple structural layers SL that constitute the three-dimensional structure ST. However, the processing system SYS may also perform both the first and second modeling operations to form any structural layer SL that constitutes the three-dimensional structure ST. Below, an example will be described in which the processing system SYS performs both the first and second modeling operations to form the first structural layer SL#1. In this case, the processing system SYS performs the first modeling operation to form a first structural layer portion SL#1-1 that is a part of the structural layer SL#1, and performs the second modeling operation to form a second structural layer portion SL#1-1 that is another part of the structural layer SL#1. An example of the structural layer SL#1 to be formed in the second specific example is shown in FIGS. 18( a) and 18(b).

[0237] As shown in Figures 18(a) and 18(b), the machining system SYS may form a first structural layer portion SL#1-1 by performing a first forming operation. Here, as shown in Figure 18(b), the first structural layer portion SL#1-1 may be a formed object that is integrated with (i.e., bonded to) the workpiece W. Alternatively, the first structural layer portion SL#1-1 may be a formed object that is bonded to the workpiece W with a relatively strong bonding force. As described above, the machining system SYS performing the first forming operation irradiates the forming surface MS, which corresponds to the surface of the workpiece W, with the processing light EL. Therefore, the irradiation of the processing light EL melts a portion of the workpiece W. Therefore, the machining system SYS can appropriately form the first structural layer portion SL#1-1 that is integrated with the workpiece W or bonded to the workpiece W with a relatively strong bonding force by supplying the forming material M of the molten pool MP formed by melting a portion of the workpiece W.

[0238] On the other hand, as shown in FIGS. 18( a) and 18(b), the processing system SYS may perform the second modeling operation to model a second structural layer portion SL#1-2. Here, as shown in FIG. 18(b), the second structural layer portion SL#1-2 may be a modeled object that is not integrated with (i.e., not bonded to) the workpiece W. Alternatively, the second structural layer portion SL#1-2 may be a modeled object that is bonded to the workpiece W with a relatively weak bonding force. In other words, the bonding force between the second structural layer portion SL#1-2 and the workpiece W may be weaker than the bonding force between the first structural layer portion SL#1-1 and the workpiece W. As described above, the processing system SYS performing the second modeling operation supplies the molten modeling material M to the modeling surface MS, which corresponds to the surface of the workpiece W. Therefore, a portion of the workpiece W is rarely directly melted by the processing light EL. Therefore, by supplying molten building material M to the building surface MS, the processing system SYS can properly build a second structural layer portion SL#1-2 that is not integrated with the workpiece W or is bonded to the workpiece W with a relatively weak bonding force.

[0239] The machining system SYS may build a plurality of first structural layer portions SL#1-1. In particular, the machining system SYS may build a plurality of first structural layer portions SL#1-1 that are discretely distributed on the build surface MS. On the other hand, the machining system SYS may build a second structural layer portion SL#1-2 that connects the plurality of first structural layer portions SL#1-1. As a result, the machining system SYS may build a structural layer SL#1 in which the plurality of first structural layer portions SL#1-1 and the second structural layer portion SL#1-2 are integrated. In this case, because the structural layer SL#1 is fixed to the workpiece W via the plurality of first structural layer portions SL#1-1, the structure built on the workpiece W (e.g., at least one structural layer SL including the structural layer SL#1) is prevented from unintentionally moving during the build of the three-dimensional structure ST.

[0240] 19 , the control unit 7 may switch the processing mode of the processing system SYS between the first mode and the second mode while the processing light EL is being deflected using at least one of the galvanometer mirrors 2146 and 2156. For example, the control unit 7 may set the processing mode of the processing system SYS to the second mode and then control the processing unit 2 to print the second structural layer portion SL#1-2 while deflecting the processing light EL using at least one of the galvanometer mirrors 2146 and 2156. At a certain timing during the period when the processing light EL is being deflected using at least one of the galvanometer mirrors 2146 and 2156, the processing light EL is irradiated onto the position on the printing surface MS where the first structural layer SL#1-1 is to be printed. In this case, the control unit 7 may control the machining unit 2 at that timing to switch the machining mode of the machining system SYS from the second mode to the first mode and form the first structural layer portion SL#1-1.

[0241] As described above, while a portion of the workpiece W may be melted by the first forming operation, the intensity of the processing light EL used to perform the first forming operation may be different from the intensity of the processing light EL used to perform the second forming operation. Therefore, the control unit 7 may change the intensity of the processing light EL in accordance with switching of the processing mode of the processing system SYS.

[0242] Typically, the intensity of the processed light EL used to perform the first modeling operation may be higher than the intensity of the processed light EL used to perform the second modeling operation. In other words, the intensity of the processed light EL used to perform the second modeling operation may be lower than the intensity of the processed light EL used to perform the first modeling operation. For example, the intensity of the processed light EL used to perform the first modeling operation may be high enough to melt a portion of the workpiece W. For example, the intensity of the processed light EL used to perform the second modeling operation may not be so high that it cannot melt a portion of the workpiece W. However, it is preferable that the intensity of the processed light EL used to perform the second modeling operation be high enough to melt the modeling material M. As a result, the processing system SYS can perform a first forming operation to form a first structural layer portion SL#1-1 that is integrated with the workpiece W or is bonded to the workpiece W with a relatively strong bonding force, and can perform a second forming operation to form a second structural layer portion SL#1-2 that is not integrated with the workpiece W or is bonded to the workpiece W with a relatively weak bonding force.

[0243] Note that the processing light EL continues to move while it is deflected using at least one of the galvanometer mirrors 2146 and 2156. Therefore, the period during which the processing light EL is irradiated onto the position on the printing surface MS where the first structure layer SL#1-1 is to be printed may not be very long. Therefore, it may not be easy to control at least one of the focus position CP of the processing light EL and the position of the material control point MCP within a relatively short time period corresponding to the drive cycle of the galvanometer mirrors 2146 and 2156. In this case, in addition to or instead of performing the above-described mode setting operation, the control unit 7 may change the intensity of the processing light EL to essentially switch the processing mode of the processing system SYS between the first mode and the second mode. In other words, the control unit 7 may change the intensity of the processing light EL so that the intensity of the processing light EL used to perform the first printing operation and the intensity of the processing light EL used to perform the second printing operation are different, thereby switching the processing mode of the processing system SYS between the first mode and the second mode. Typically, the control unit 7 may switch the processing mode of the processing system SYS between the first mode and the second mode by changing the intensity of the processing light EL so that the intensity of the processing light EL used to perform the first modeling operation is higher than the intensity of the processing light EL used to perform the second modeling operation.

[0244] After the structural layer SL#1 has been formed, the processing system SYS may form the remaining structural layers SL by performing either the first or second forming operation. However, when forming the remaining structural layers SL, the processing system SYS may perform both the first and second forming operations, as in the case of forming the first structural layer SL#1. As a result, as shown in FIG. 20 , a three-dimensional structure ST including the structural layer SL#1 formed by performing both the first and second forming operations is formed. For example, a three-dimensional structure ST connected to the workpiece W via the first structural layer portion SL#1-1 is formed.

[0245] After the three-dimensional structure ST has been formed, the processing system SYS may use a separation device 81 included in the processing system SYS to perform a separation operation to separate the three-dimensional structure ST from the workpiece W. Alternatively, if a device other than the processing system SYS is provided with the separation device 81, the workpiece W on which the three-dimensional structure ST has been formed may be removed from the processing system SYS (particularly, the stage 31), and a device other than the processing system SYS may use the separation device 81 to perform a separation operation to separate the three-dimensional structure ST from the workpiece W. If a device other than the processing system SYS performs the separation operation, the processing system SYS does not need to be provided with the separation device 81.

[0246] The separation device 81 may separate the three-dimensional structure ST including the second structural layer portion SL#1-2 from the workpiece W by destroying the first structural layer portion SL#1-1 that is integrated with the workpiece W. For example, the separation device 81 may destroy the entire first structural layer portion SL#1-1. In this case, the three-dimensional structure ST separated from the workpiece W may not include the first structural layer portion SL#1-1. Alternatively, for example, the separation device 81 may destroy a portion of the first structural layer portion SL#1-1 while leaving the other portion of the first structural layer portion SL#1-1 undestroyed. In this case, the three-dimensional structure ST separated from the workpiece W may not include a portion of the first structural layer portion SL#1-1, but may include the other portion of the first structural layer portion SL#1-1.

[0247] An example of the separation device 81 is shown in FIG. 21( a). As shown in FIG. 21( a), the separation device 81 may include a vibration device that vibrates the workpiece W. In this case, the separation device 81 may separate the three-dimensional structure ST from the workpiece W by vibrating the workpiece W. Specifically, when the workpiece W vibrates, the vibration of the workpiece W is transmitted to the first structural layer portion SL#1-1. Here, because the first structural layer portion SL#1-1 is integrated with the workpiece W or is connected with it by a relatively strong bonding force, the vibration of the workpiece W is likely to be transmitted directly to the first structural portion SL#1-1. As a result, the first structural layer portion SL#1-1 is likely to be destroyed due to the vibration. On the other hand, because the second structural layer portion SL#1-2 is not integrated with the workpiece W or is connected with it by only a relatively weak bonding force, the vibration of the workpiece W is unlikely to be transmitted directly to the second structural portion SL#1-2. As a result, the first structural layer portion SL#1-1 is less likely to be destroyed by vibration. Therefore, as shown in FIG. 21( b), the separation device 81 can appropriately separate the three-dimensional structure ST including the second structural layer portion SL#1-2 from the workpiece W by selectively destroying the first structural layer portion SL#1-1.

[0248] The separation device 81 may separate the three-dimensional structure ST from the workpiece W by vibrating the workpiece W at the resonant frequency of the workpiece W. When the workpiece W vibrates at the resonant frequency of the workpiece W, the amplitude of the vibrating workpiece W is larger than when the workpiece W vibrates at a vibration frequency different from the resonant frequency of the workpiece W. As a result, the first structural layer portion SL#1-1, which is integrated with the workpiece W or bonded to it with a relatively strong bonding force, is more likely to be destroyed. On the other hand, because the second structural layer portion SL#1-2 is not integrated with the workpiece W or is bonded to it with only a relatively weak bonding force, even if the amplitude of the vibrating workpiece W increases, the second structural layer portion SL#1-2 is less likely to be destroyed due to the vibration of the workpiece W. Therefore, as shown in FIG. 21( b), the separation device 81 can appropriately separate the three-dimensional structure ST including the second structural layer portion SL#1-2 from the workpiece W by selectively destroying the first structural layer portion SL#1-1. In this way, in the second specific example, the machining system SYS can form a three-dimensional structure ST that can be separated from the workpiece W relatively easily.

[0249] In the above description, one structural layer SL includes a first structural layer portion SL#1-1 and a second structural layer portion SL#1-2. However, the processing system SYS may separately form a first structural layer SL that functions as the first structural layer portion SL#1-1 and a second structural layer SL that functions as the second structural layer portion SL#1-2. For example, the processing system SYS may form a first structural layer SL#1 that functions as the first structural layer portion SL#1-1 by performing a first forming operation, and then form a second structural layer SL#2 that functions as the second structural layer portion SL#1-2 on the first structural layer SL#1 by performing a second forming operation. (3-3) Parallel execution of the first forming operation and the second forming operation

[0250] In the above description, the processing system SYS forms a part (first portion) of the three-dimensional structure ST by performing a first-forming operation during a first period, and forms another part (second portion) of the three-dimensional structure ST by performing a second-forming operation during a second period different from the first period. However, the processing system SYS may form at least a part of the three-dimensional structure ST by performing the first-forming operation and the second-forming operation in parallel during the first period. In other words, the first period in which the first-forming operation is performed and the second period in which the second-forming operation is performed may at least partially overlap each other.

[0251] For example, even when the machining mode of the machining system SYS is set to the first mode, the machining system SYS may perform the second-modeling operation in parallel with the first-modeling operation. Specifically, even when the machining mode of the machining system SYS is set to the first mode, the machining system SYS may perform the first-modeling operation by irradiating the printing surface MS with the processing light EL to form a molten pool MP on the printing surface MS and supplying the first printing material M to the formed molten pool MP, while performing the second-modeling operation by irradiating the second printing material M with the processing light EL in the space between the material nozzle 212 and the printing surface MS to melt the second printing material M and supply the molten second printing material M to the printing surface MS.

[0252] For example, even when the machining mode of the machining system SYS is set to the second mode, the machining system SYS may perform the first-modeling operation in parallel with the second-modeling operation. Specifically, even when the machining mode of the machining system SYS is set to the second mode, the machining system SYS may perform the first-modeling operation in which the machining system SYS irradiates the first modeling material M with the processing light EL in the space between the material nozzle 212 and the modeling surface MS to melt the first modeling material M and supply the molten first modeling material M to the modeling surface MS, while performing the first-modeling operation in which the machining system SYS irradiates the modeling surface MS with the processing light EL to form a molten pool MP on the modeling surface MS and supplies the second modeling material M to the formed molten pool MP.

[0253] When the processing system SYS performs the first and second modeling operations in parallel, the second modeling operation is performed, and therefore the modeling material M supplied from the material nozzle 212 is irradiated with the processing light EL at a virtual material irradiation surface ES located in the space between the material nozzle 212 and the modeling surface MS. In this case, at the material irradiation surface ES, a portion of the modeling material M supplied from the material nozzle 212 may be melted by the processing light EL, while the remaining portion of the modeling material M supplied from the material nozzle 212 may not be melted by the processing light EL. In this case, the remaining portion of the modeling material M that is not melted at the material irradiation surface ES may melt at the modeling surface MS. For example, the remaining portion of the modeling material M that is not melted at the material irradiation surface ES may melt in a molten pool MP formed on the modeling surface MS.

[0254] The remaining portion of the modeling material M that is not melted on the material irradiation surface ES may be heated (e.g., preheated) by the processing light EL on the material irradiation surface ES. In this case, the crystal growth accuracy of the molten modeling material M when solidifying is improved compared to when the remaining portion of the modeling material M is not heated. In other words, during the solidification process of the molten modeling material M, the crystals of the modeling material M are more likely to grow in the expected growth pattern. Therefore, even when a second modeling operation with lower modeling accuracy than the first modeling operation is performed, the modeling accuracy of the processing system SYS is improved. As a result, the processing system SYS can achieve both the effect of improving modeling accuracy and the effect of shortening the time required to model a three-dimensional structure ST (i.e., improving throughput).

[0255] When the processing system SYS performs the first-modeling operation and the second-modeling operation in parallel, the control unit 7 may control the degree (proportion) to which the three-dimensional structure ST is formed by the first-modeling operation and the degree (proportion) to which the three-dimensional structure ST is formed by the second-modeling operation. For example, the control unit 7 may control the ratio between the degree to which the first-modeling operation contributes to the formation of the three-dimensional structure ST and the degree to which the second-modeling operation contributes to the formation of the three-dimensional structure ST. Specifically, the control unit 7 may set the degree to which the first-modeling operation contributes to the formation of the three-dimensional structure ST to a first value greater than or equal to 0% and less than or equal to 100%, and set the degree to which the second-modeling operation contributes to the formation of the three-dimensional structure ST to a second value calculated by subtracting the first value from 100%.

[0256] The control unit 7 may control the degree to which the three-dimensional structure ST is formed by the first modeling operation and the degree to which the three-dimensional structure ST is formed by the second modeling operation by controlling at least one of the focus position CP of the processing light EL and the position of the material control point MCP. For example, as the distance D1 between the focus position CP of the processing light EL and the modeling surface MS increases, the degree to which the three-dimensional structure ST is formed by the first modeling operation decreases, and the degree to which the three-dimensional structure ST is formed by the second modeling operation increases. For example, as the distance D3 between the focus position CP of the processing light EL and the material control point MCP decreases, the degree to which the three-dimensional structure ST is formed by the first modeling operation decreases, and the degree to which the three-dimensional structure ST is formed by the second modeling operation increases. Therefore, the control unit 7 may control the degree to which the three-dimensional structure ST is formed by the first modeling operation and the degree to which the three-dimensional structure ST is formed by the second modeling operation by controlling at least one of the focus position CP of the processing light EL and the position of the material control point MCP, and thereby controlling at least one of the distances D1 and D3.

[0257] The degree (proportion) to which the three-dimensional structure ST is formed by the first-modeling operation may be a parameter based on the amount of energy transferred from the processing light EL to the modeling surface MS by the first-modeling operation. Typically, the degree (proportion) to which the three-dimensional structure ST is formed by the first-modeling operation may be a parameter proportional to the amount of energy transferred from the processing light EL to the modeling surface MS by the first-modeling operation. Similarly, the degree (proportion) to which the three-dimensional structure ST is formed by the second-modeling operation may be a parameter based on the amount of energy transferred from the processing light EL to the material-irradiated surface ES (particularly, the modeling material M supplied to the material-irradiated surface ES) by the second-modeling operation. Typically, the degree (proportion) to which the three-dimensional structure ST is formed by the first-modeling operation may be a parameter proportional to the amount of energy transferred from the processing light EL to the material-irradiated surface ES (particularly, the modeling material M supplied to the material-irradiated surface ES) by the second-modeling operation. As an example, the degree (proportion) to which a three-dimensional structure ST is formed by the first printing operation may be the ratio of the amount of energy transferred from the processing light EL to the printing surface MS by the first printing operation to the sum of the amount of energy transferred from the processing light EL to the printing surface MS by the first printing operation and the amount of energy transferred from the processing light EL to the material irradiation surface ES by the second printing operation. Similarly, the degree (proportion) to which a three-dimensional structure ST is formed by the second printing operation may be the ratio of the amount of energy transferred from the processing light EL to the material irradiation surface ES by the second printing operation to the sum of the amount of energy transferred from the processing light EL to the printing surface MS by the first printing operation and the amount of energy transferred from the processing light EL to the material irradiation surface ES by the second printing operation.

[0258] In this case, the processing system SYS may form the three-dimensional structure ST in a state where one of the degree to which the three-dimensional structure ST is formed by the first printing operation and the degree to which the three-dimensional structure ST is formed by the second printing operation is greater than the other of the degree to which the three-dimensional structure ST is formed by the first printing operation and the degree to which the three-dimensional structure ST is formed by the second printing operation. In other words, the processing system SYS may form the three-dimensional structure ST in a state where one of the amount of energy transferred from the processing light EL to the printing surface MS by the first printing operation and the amount of energy transferred from the processing light EL to the material irradiation surface ES by the second printing operation is greater than the other of the amount of energy transferred from the processing light EL to the printing surface MS by the first printing operation and the amount of energy transferred from the processing light EL to the material irradiation surface ES by the second printing operation. As an example, the processing system SYS may form the three-dimensional structure ST in a state where the degree to which the three-dimensional structure ST is formed by the first-forming operation is 70% and the degree to which the three-dimensional structure ST is formed by the second-forming operation is 30%. As an example, the processing system SYS may form the three-dimensional structure ST in a state where the degree to which the three-dimensional structure ST is formed by the first-forming operation is 30% and the degree to which the three-dimensional structure ST is formed by the second-forming operation is 70%.

[0259] Note that the processing system SYS that forms the three-dimensional structure ST in a state in which the degree to which the three-dimensional structure ST is formed by the first-printing operation is greater than the degree to which the three-dimensional structure ST is formed by the second-printing operation may be considered to be forming the three-dimensional object ST in the first mode. In other words, the processing system SYS that forms the three-dimensional structure ST in a state in which the amount of energy transferred from the processing light EL to the printing surface MS by the first-printing operation is greater than the amount of energy transferred from the processing light EL to the material irradiation surface ES by the second-printing operation may be considered to be forming the three-dimensional object ST in the first mode. On the other hand, the processing system SYS that forms the three-dimensional structure ST in a state in which the degree to which the three-dimensional structure ST is formed by the second-printing operation is greater than the degree to which the three-dimensional structure ST is formed by the first-printing operation may be considered to be forming the three-dimensional object ST in the second mode. In other words, the processing system SYS that forms the three-dimensional structure ST in a state in which the amount of energy transferred from the processing light EL to the material irradiation surface ES by the second printing operation is greater than the amount of energy transferred from the processing light EL to the printing surface MS by the first printing operation may be considered to be printing the three-dimensional object ST in the second mode. (4) Modified Examples of the Second Printing Operation Next, modified examples of the second printing operation will be described. (4-1) First Modified Example of the Second Printing Operation

[0260] First, a first modified example of the second modeling operation will be described. In the above description, the processing system SYS performing the second modeling operation uses both the processing light EL#1 and the processing light EL#2 to melt the modeling material M on the material irradiation surface ES (i.e., in the space between the material nozzle 212 and the modeling surface MS). In other words, the purpose of the processing light EL#1 and the purpose of the processing light EL#2 are the same. On the other hand, in the first modified example, the processing system SYS performing the second modeling operation may use either one of the processing light EL#1 and the processing light EL#2 for a first purpose and either one of the processing light EL#1 and the processing light EL#2 for a second purpose different from the first purpose. In other words, the processing system SYS may use either the processing light EL#1 or the processing light EL#2 depending on the purpose.

[0261] 22, the processing system SYS may irradiate the shaping material M with processing light EL#1 at the material irradiation surface ES (i.e., in the space between the material nozzle 212 and the shaping surface MS; the same applies below). In this case, the processing system SYS may irradiate the shaping material M with processing light EL#1 at the material irradiation surface ES while deflecting the processing light EL#1 using the galvanometer mirror 2146. Alternatively, the processing system SYS may irradiate the shaping material M with processing light EL#1 at the material irradiation surface ES without deflecting the processing light EL#1 using the galvanometer mirror 2146.

[0262] The processing system SYS may melt the modeling material M at the material-irradiated surface ES by irradiating the modeling material M with the processing light EL#1 at the material-irradiated surface ES. Alternatively, the processing system SYS may not melt the modeling material M at the material-irradiated surface ES by irradiating the modeling material M at the material-irradiated surface ES with the processing light EL#1. In this case, the processing system SYS may heat (e.g., preheat) the modeling material M at the material-irradiated surface ES by irradiating the modeling material M at the material-irradiated surface ES with the processing light EL#1.

[0263] 22 , the processing system SYS may irradiate the printing surface MS with processing light EL#2. In this case, the processing system SYS may irradiate the printing surface MS with processing light EL#2 while deflecting the processing light EL#2 using the galvanometer mirror 2156. Alternatively, the processing system SYS may irradiate the printing surface MS with processing light EL#2 without deflecting the processing light EL#2 using the galvanometer mirror 2156.

[0264] The processing system SYS may form a molten pool MP on the printing surface MS by irradiating the printing surface MS with the processing light EL#2. Alternatively, the processing system SYS may not form a molten pool MP on the printing surface MS by irradiating the printing surface MS with the processing light EL#2. In this case, the processing system SYS may heat (e.g., preheat) the printing surface MS by irradiating the printing surface MS with the processing light EL#2. Alternatively, the processing system SYS may melt the printing material M supplied to the printing surface MS without melting it by irradiating the printing surface MS with the processing light EL#2.

[0265] When the second modified example of the second modeling operation is performed, as shown in FIG. 22 , the control unit 7 may control the focus position CP of the processing light EL so that the focus position CP#1 of the processing light EL#1 is located in the space between the material nozzle 212 and the modeling surface MS. Also, as shown in FIG. 22 , the control unit 7 may control the focus position CP of the processing light EL so that the focus position CP#2 of the processing light EL#2 is located on or near the modeling surface MS. In particular, as shown in FIG. 22 , the control unit 7 may control the focus position CP of the processing light EL so that the focus position CP#1 of the processing light EL#1 and the focus position CP#2 of the processing light EL#2 are different along the Z-axis direction. As a result, the processing system SYS can irradiate the modeling material M at the material irradiation surface ES with a relatively high intensity of the processing light EL#1, and can irradiate the modeling surface MS with a relatively high intensity of the processing light EL#2.

[0266] 22 , the control unit 7 may control the focus position CP of the processing light EL so that the distance D1 between the focus position CP#1 of the processing light EL#1 and the printing surface MS is longer than the distance D1 between the focus position CP#2 of the processing light EL#2 and the printing surface MS. As an example, the control unit 7 may control the focus position CP of the processing light EL so that the distance D1 between the focus position CP#1 of the processing light EL#1 and the printing surface MS is a first distance D13 that is longer than the second distance D14, and the distance D1 between the focus position CP#2 of the processing light EL#2 and the printing surface MS is a second distance D14 that is shorter than the first distance D13. 22 shows an example in which the focus position CP#2 of the processing light EL#2 is set on the printing surface MS, so that the distance D1 between the focus position CP#2 of the processing light EL#2 and the printing surface MS is zero, but the distance D1 between the focus position CP#2 of the processing light EL#2 and the printing surface MS does not have to be zero. As a result, the processing system SYS can irradiate the printing material M at the material irradiation surface ES with a relatively high intensity of the processing light EL#1, and can irradiate the printing surface MS with a relatively high intensity of the processing light EL#2.

[0267] 22 , the control unit 7 may control at least one of the focus position CP of the processing light EL and the position of the material control point MCP so that the distance D3 between the focus position CP#1 of the processing light EL#1 and the material control point MCP is shorter than the distance D3 between the focus position CP#2 of the processing light EL#2 and the material control point MCP. As an example, the control unit 7 may control at least one of the focus position CP of the processing light EL and the material control point MCP so that the distance D3 between the focus position CP#1 of the processing light EL#1 and the material control point MCP is a first distance D33 that is shorter than the second distance D34, and the distance D3 between the focus position CP#2 of the processing light EL#2 and the material control point MCP is a second distance D34 that is longer than the first distance D33. 22 shows an example in which the material control point MCP is located at the same position in the Z-axis direction as the focus position CP#1 of the processing light EL#1, and therefore the distance D3 between the focus position CP#1 of the processing light EL#1 and the material control point MCP is zero, but the distance D3 between the focus position CP#1 of the processing light EL#1 and the material control point MCP does not have to be zero. As a result, the processing system SYS can irradiate the forming material M at the material irradiation surface ES with a relatively high intensity processing light EL#1, and can irradiate the forming surface MS with a relatively high intensity processing light EL#2.

[0268] The shaping material M irradiated with the processing light EL#1 on the material-irradiated surface ES may be supplied to the shaping surface MS. For example, the shaping material M irradiated with the processing light EL#1 on the material-irradiated surface ES may be supplied to a desired region of the shaping surface MS irradiated with the processing light EL#2. If a molten pool MP is formed in the desired region, the shaping material M irradiated with the processing light EL#1 on the material-irradiated surface ES may be supplied to the molten pool MP formed in the desired region. In this case, the processing system SYS may supply the shaping material M irradiated with the processing light EL#1 on the material-irradiated surface ES to a desired region of the shaping surface MS irradiated with the processing light EL#2, thereby forming a shaped object in the desired region of the shaping surface MS irradiated with the processing light EL#2. Note that in the first modified example, the desired region of the shaping surface MS irradiated with the processing light EL#2 is referred to as the irradiated region MSL. Alternatively, for example, the shaping material M irradiated with the processing light EL#1 on the material irradiation surface ES may be supplied to a region of the shaping surface MS different from the irradiated region MSL (i.e., a region not irradiated with the processing light EL#2). In this case, the processing system SYS may supply the shaping material M irradiated with the processing light EL#1 on the material irradiation surface ES to a region of the shaping surface MS different from the irradiated region MSL, thereby forming a shaped object in the region different from the irradiated region MSL. Next, specific examples of how the processing lights EL#1 and EL#2 are used depending on the application will be further described. (4-1-1) First Specific Example of How the Processing Lights EL#1 and EL#2 are Used Depending on the Application

[0269] In the first specific example, as shown in FIG. 23 , the processing system SYS melts the printing material M on the material-irradiated surface ES by irradiating the printing material M with processing light EL#1 on the material-irradiated surface ES. Furthermore, in the first specific example, as shown in FIG. 23 , the processing system SYS may heat (e.g., preheat) the printing surface MS by irradiating the printing surface MS with processing light EL#2. That is, the processing system SYS may heat (e.g., preheat) the irradiated region MSL of the printing surface MS irradiated with processing light EL#2 by irradiating the printing surface MS with processing light EL#2. The processing system SYS does not necessarily have to form a molten pool MP on the printing surface MS by irradiating the printing surface MS with processing light EL#2.

[0270] 23 , the forming material M melted by the processing light EL#1 may be supplied to the irradiated region MSL heated by the processing light EL#2. That is, the processing system SYS may heat the irradiated region MSL with the processing light EL#2, and then supply the forming material M melted by the processing light EL#1 to the irradiated region MSL heated by the processing light EL#2. As a result, a formed object is formed on the forming surface MS (particularly, on the irradiated region MSL). In this way, in the first specific example, the processing system SYS may form a formed object on the forming surface MS by performing the second forming operation described above while heating the forming surface MS.

[0271] When the modeling material M is supplied to a pre-heated modeling surface MS in this manner, the crystal growth accuracy of the molten modeling material M when solidifying is improved compared to when the modeling material M is supplied to a modeling surface MS that is not pre-heated. In other words, the crystals of the modeling material M are more likely to grow in the expected growth pattern during the solidification process of the molten modeling material M. Therefore, when the modeling material M is supplied to a pre-heated modeling surface MS, the error between the actual size (e.g., at least one of width, length, and thickness) of the model to be formed and the target size is smaller compared to when the modeling material M is supplied to a modeling surface MS that is not pre-heated. This improves the modeling accuracy of the processing system SYS.

[0272] As described above, in the first specific example, the processing system SYS can selectively use the processing light EL#1, which is mainly used to melt the modeling material M, and the processing light EL#2, which is mainly used to improve the modeling accuracy. Therefore, the modeling accuracy of the processing system SYS is improved compared to when both the processing light EL#1 and the processing light EL#2 are mainly used to melt the modeling material M.

[0273] When the modeling material M is supplied to the preheated modeling surface MS, the size of the model to be formed (typically, the size in a direction intersecting the movement direction of the irradiation unit area MUA#2 corresponding to the processing unit area PUA#2, referred to as the bead width) depends on the size of the irradiated area MSL on the modeling surface MS that is heated by the processing light EL#2. This is because the modeling material M is supplied to the irradiated area MSL and then solidifies in the irradiated area MSL. Therefore, the irradiated area MSL may be considered to indicate the area where the model will be formed. Heating a portion of the modeling surface MS with the processing light EL#2 may be considered equivalent to marking the area where the model will be formed on the modeling surface MS. Furthermore, the size of the irradiated area MSL depends on the amount of deflection of the processing light EL#2 by the galvanometer mirror 2156. Therefore, the control unit 7 may control the amount of deflection of the processing light EL#2 by the galvanometer mirror 2156 so that the size of the object to be formed matches the target size.

[0274] Furthermore, when the molding material M is supplied to a preheated molding surface MS, the bonding force between the molten molding material M and the molding surface MS is stronger than when the molding material M is supplied to a non-heated molding surface MS. Therefore, when the molding material M is supplied to a preheated molding surface MS, the processing system SYS can form a molded object that is bonded relatively strongly to the molding surface MS, compared to when the molding material M is supplied to a non-heated molding surface MS.

[0275] In the first specific example, when the processing light EL#2 is deflected using the galvanometer mirror 2156, the area of ​​the irradiated region MSL on the printing surface MS that is heated by the processing light EL#2 becomes larger compared to when the processing light EL#2 is not deflected using the galvanometer mirror 2156. Therefore, the control unit 7 may determine whether to deflect the processing light EL#2 using the galvanometer mirror 2156 based on the size of the region on the printing surface MS that should be heated by the processing light EL#2 (i.e., the size of the expected irradiated region MSL). (4-1-2) Second specific example of using the processing lights EL#1 and EL#2 according to the purpose

[0276] In the second specific example, as shown in the upper part of FIG. 24 , the processing system SYS may heat (e.g., preheat) at least a portion of the build material M at the material-irradiated surface ES by irradiating the build material M with the processing light EL#1. Furthermore, in the second specific example, as shown in FIG. 24 , the processing system SYS may heat (e.g., preheat) the build surface MS by irradiating the build surface MS with the processing light EL#2. That is, the processing system SYS may heat (e.g., preheat) the irradiated region MSL of the build surface MS irradiated with the processing light EL#2 by irradiating the build surface MS with the processing light EL#2. The processing system SYS may or may not form a molten pool MP on the build surface MS by irradiating the build surface MS with the processing light EL#2.

[0277] In particular, in the second specific example, the processing system SYS controls the temperature distribution of the modeling material M by heating at least a portion of the modeling material M on the material irradiation surface ES under the control of the control unit 7. Specifically, the processing system SYS controls the temperature distribution of the modeling material M within the material irradiation surface ES by heating at least a portion of the modeling material M on the material irradiation surface ES under the control of the control unit 7.

[0278] To control the temperature distribution of the shaping material M within the material irradiation surface ES, the control unit 7 may control the distribution of the amount of heat applied to the shaping material M per unit time by irradiation with the processing light EL#1 within the material irradiation surface ES (hereinafter referred to as the heat input amount). Typically, the control unit 7 may vary the amount of heat input to the shaping material M by irradiation with the processing light EL#1 depending on the position (location) within the material irradiation surface ES. For example, as shown in the lower part of FIG. 24 , the control unit 7 may vary the amount of heat input to the shaping material M by irradiation with the processing light EL#1 so that the amount of heat input to the shaping material M in a first material passing zone ESP#1 within the material irradiation surface ES is different from the amount of heat input to the shaping material M in a second material passing zone ESP#2 within the material irradiation surface ES that is different from the first material passing zone ESP#2.

[0279] As described above, since the material irradiation surface ES is a virtual surface, the building material M supplied to the material irradiation surface ES passes through the material irradiation surface ES. In this case, the first material passing region ESP#1 and the second material passing region ESP#2 may each be considered to be a region within the material irradiation surface ES through which the building material M passes. Therefore, in the following description, the first material passing region ESP#1 and the second material passing region ESP#2 will be referred to as the first material passing region ESP#1 and the second material passing region ESP#2, respectively.

[0280] The control unit 7 may change the amount of heat input to the shaping material M by irradiation with the processing light EL#1 so that the farther a material passing region in the material irradiation surface ES is from the optical axis AX of the irradiation optical system 211, the greater the amount of heat input to the shaping material M in the material passing region. For example, in the example shown in the lower part of Figure 24, the distance between the first material passing region ESP#1 and the optical axis AX is longer than the distance between the second material passing region ESP#2 and the optical axis AX in the material irradiation surface ES. In other words, the first material passing region ESP#1 is located farther from the optical axis AX than the second material passing region ESP#2. In this case, the control unit 7 may change the amount of heat input to the forming material M by irradiation with the processing light EL#1 so that the amount of heat input to the forming material M in the first material passing area ESP#1 within the material irradiation surface ES is greater than the amount of heat input to the forming material M in the second material passing area ESP#2 within the material irradiation surface ES that is different from the first material passing area ESP#2.

[0281] If the amount of heat input to the shaping material M in one material passing region increases as the shaping material M in the material irradiation surface ES becomes farther from the optical axis AX of the irradiation optical system 211, the temperature of the shaping material M passing through the one material passing region increases as the shaping material M in the material irradiation surface ES becomes farther from the optical axis AX of the irradiation optical system 211. Therefore, the control unit 7 may change the amount of heat input to the shaping material M by irradiation with the processing light EL#1 so that the temperature of the shaping material M passing through the one material passing region increases as the shaping material M in the material irradiation surface ES becomes farther from the optical axis AX of the irradiation optical system 211. In this case, as shown in the lower part of FIG. 24 , the control unit 7 may change the amount of heat input to the shaping material M by irradiation with the processing light EL#1 so that the temperature of the shaping material M passing through the one material passing region increases continuously as the shaping material M in the material irradiation surface ES becomes farther from the optical axis AX of the irradiation optical system 211. 24, the control unit 7 may change the amount of heat input to the shaping material M by irradiation with the processing light EL#1 so that the temperature of the shaping material M passing through one material passing region in the material irradiation surface ES gradually increases as the material passing region in the material irradiation surface ES becomes farther from the optical axis AX of the irradiation optical system 211. As an example, the control unit 7 may change the amount of heat input to the shaping material M by irradiation with the processing light EL#1 so that the temperature of the shaping material M passing through a first material passing region ESP#1 in the material irradiation surface ES is higher than the temperature of the shaping material M passing through a second material passing region ESP#2 in the material irradiation surface ES that is different from the first material passing region ESP#2.

[0282] To realize a state in which the temperature of the shaping material M passing through one material passing region in the material irradiation surface ES increases as the material passing region in the material irradiation surface ES becomes farther from the optical axis AX of the irradiation optical system 211, the control unit 7 may change the intensity of the processing light EL#1 according to the position in the material irradiation surface ES. For example, the control unit 7 may change the amount of heat input to the shaping material M by irradiation with the processing light EL#1 so that the intensity of the processing light EL#1 irradiated onto the shaping material M passing through the first material passing region ESP#1 in the material irradiation surface ES is different from the intensity of the processing light EL#1 irradiated onto the shaping material M passing through the second material passing region ESP#2 in the material irradiation surface ES.

[0283] Specifically, the control unit 7 may change the intensity of the processing light EL#1 so that the intensity of the processing light EL#1 irradiated onto the shaping material M passing through one material passing region in the material irradiation surface ES increases as the material passing region in the material irradiation surface ES becomes farther from the optical axis AX of the irradiation optical system 211. For example, as shown in the lower part of Fig. 24, the control unit 7 may change the amount of heat input to the shaping material M by irradiation with the processing light EL#1 so that the intensity of the processing light EL#1 irradiated onto the shaping material M passing through the first material passing region ESP#1 in the material irradiation surface ES is higher than the intensity of the processing light EL#1 irradiated onto the shaping material M passing through the second material passing region ESP#2 in the material irradiation surface ES.

[0284] To change the intensity of the processing light EL#1 according to its position within the material irradiation surface ES, the control unit 7 may change the intensity of the processing light EL#1 while deflecting the processing light EL#1 using the galvanometer mirror 2146 so that the processing light EL#1 moves within the material irradiation surface ES (i.e., substantially scans the material irradiation surface ES). The control unit 7 may change the intensity of the processing light EL#1 in synchronization with the deflection of the processing light EL#1 using the galvanometer mirror 2146. As an example, the control unit 7 may deflect the processing light EL#1 using the galvanometer mirror 2146 and change the intensity of the processing light EL#1 to a relatively high intensity so that the processing light EL#1 is irradiated onto the forming material M passing through the first material passing region ESP#1 within the material irradiation surface ES. After that, or before that, the control unit 7 may deflect the processing light EL#1 using the galvanometer mirror 2146 so that the processing light EL#1 is irradiated onto the forming material M passing through the second material passing area ESP#2 within the material irradiation surface ES, and may also change the intensity of the processing light EL#1 to a relatively low intensity.

[0285] The modeling material M heated by the processing light EL#1 on the material irradiation surface ES (i.e., the modeling material M with a controlled temperature distribution) may be supplied to the modeling surface MS heated by the processing light EL#2. In other words, the processing system SYS may supply the modeling material M heated by the processing light EL#1 (i.e., with a controlled temperature distribution) to the modeling surface MS heated by the processing light EL#2.

[0286] Here, because the temperature distribution of the modeling material M within the material irradiation surface ES between the material nozzle 212 and the modeling surface MS is controlled, the modeling material M is supplied to the modeling surface MS with a controlled temperature distribution within the plane intersecting the Z-axis. In other words, as shown in Fig. 25, which is a cross-sectional view showing the modeling material M supplied to the modeling surface MS, the modeling material M supplied to the modeling surface MS satisfies the condition that the temperature of the modeling material M supplied to a modeling area within the modeling surface MS increases as the area becomes farther away from the optical axis AX of the irradiation optical system 211. In this case, the supplied modeling material M is cooled and solidified on the modeling surface MS.

[0287] Depending on the shape of the object (workpiece W in the example shown in FIG. 25 ) having the printing surface MS on its surface, the cooling mode of the printing material M in the first printing area BA#1 on the printing surface MS may differ from the cooling mode of the printing material M in the second printing area BA#2 on the printing surface MS that is different from the first printing area BA#1. For example, in the example shown in FIG. 25 , the first printing area BA#1 is located closer to the edge of the workpiece W than the second printing area BA#2, and the second printing area BA#2 is located closer to the center of the workpiece W than the first printing area BA#1.

[0288] In this case, the edges of the workpiece W may have more paths for dissipating the heat generated by the modeling material M than the center of the workpiece W. This is because, at the center of the workpiece W, the top surface of the workpiece W exists as a path for dissipating the heat generated by the modeling material M, while at the edges of the workpiece W, not only the top surface of the workpiece W but also the side surfaces of the workpiece W exist as paths for dissipating the heat generated by the modeling material M. Therefore, at the edges of the workpiece W, the modeling material M is easily cooled, but at the center of the workpiece W, the modeling material M is difficult to cool.

[0289] Furthermore, in this case, depending on the shape of the workpiece W and the preheating state of the workpiece W, the edges of the workpiece W may have fewer paths for releasing the heat generated by the molding material M than the center of the workpiece W. In this case, the paths for releasing heat at the center of the workpiece W may be downward or diagonally downward from the center of the workpiece W toward the inside of the workpiece W, while the paths for releasing heat at the edges of the workpiece W may be diagonally downward from the edge of the workpiece W, resulting in fewer paths.

[0290] Therefore, if the temperature distribution of the modeling material M supplied to the modeling surface MS is not controlled within the modeling surface MS (i.e., if the modeling material M supplied to the modeling surface MS has a uniform temperature distribution), the time required for the modeling material M to solidify in the first modeling area BA#1 on the modeling surface MS will be relatively long, and the time required for the modeling material M to solidify in the second modeling area BA#2 on the modeling surface MS will be relatively short. As a result, the thermal gradient of the workpiece W when the modeling material M is cooled will be relatively large. As a result, cracks may occur in the workpiece W.

[0291] However, in the second specific example, the temperature distribution of the shaping material M supplied to the shaping surface MS is controlled within the shaping surface MS. For example, a shaping material M with a relatively high temperature is supplied to the first shaping area BA#1 on the shaping surface MS, where the shaping material M is easily cooled, and a shaping material M with a relatively low temperature is supplied to the second shaping area BA#2 on the shaping surface MS, where the shaping material M is less easily cooled. This reduces the difference between the time required for the shaping material M to solidify in the first shaping area BA#1 on the shaping surface MS and the time required for the shaping material M to solidify in the second shaping area BA#2 on the shaping surface MS. This reduces the thermal gradient of the workpiece W when the shaping material M is cooled. As a result, the possibility of cracks occurring in the workpiece W is reduced. In this way, in the second specific example, when a new object is formed on the workpiece W (or the already-formed structure layer SL), the possibility of cracks occurring in the workpiece W (or the already-formed structure layer SL) is reduced. (4-2) Second Modification of the Second Forming Operation

[0292] Next, a second modified example of the second modeling operation will be described. As described with reference to FIGS. 4( a) to 4(c) and 13, the processing system SYS performing the second modeling operation supplies the modeling material M to a virtual material irradiation surface ES that intersects with the Z-axis between the material nozzle 212 and the modeling surface MS. Furthermore, as described with reference to FIGS. 11 to 13, the processing system SYS performing the second modeling operation uses the galvanometer mirrors 2146 and 2156 to move the beam passing area PA, through which the processing light EL passes, within the irradiation unit area MUA so that the processing light EL substantially scans the virtual irradiation unit area MUA on the material irradiation surface ES.

[0293] In this case, the higher the ratio of the amount of the modeling material M actually irradiated with the processing light EL on the material irradiation surface ES to the amount of the modeling material M supplied to the material irradiation surface ES, the higher the utilization efficiency of the modeling material M in the second modeling operation. This is because the modeling material M actually irradiated with the processing light EL on the material irradiation surface ES contributes greatly to the modeling of a model by the second modeling operation, while the modeling material M not irradiated with the processing light EL on the material irradiation surface ES ...

Claims

1. a processing device including a material supplying member that supplies a modeling material and an irradiation device that emits an energy beam, the processing device performing additional processing to form a model on an object by melting the modeling material supplied from the material supplying member with the energy beam emitted from the irradiation device; a control device capable of controlling the processing device; Equipped with the material supply member supplies the modeling material to a material supply region within a plane intersecting an optical axis of the irradiation device; The control of the processing device by the control device includes controlling a beam path of the energy beam from the irradiation device based on at least one of the shape and size of the material supply area. Processing system.

2. The material supply members supply the modeling material to the space from different directions, The irradiation device melts the modeling material at a position where the modeling materials supplied from different directions intersect. The processing system of claim 1 .

3. the material supply member supplies the building material to a material supply position on the surface from a direction intersecting the surface of the object; The irradiation device melts the building material in the space using an energy beam directed in a direction different from the material supply position. The processing system according to claim 1 or 2.

4. the irradiation device includes a deflection optical system capable of deflecting the energy beam so that a beam passing region through which the energy beam passes moves within the plane; The control device controls the processing device so that the energy beam is irradiated onto the building material in the space while deflecting the energy beam, thereby melting the building material. The processing system according to claim 1 or 2.

5. The control of the beam path by the control device includes controlling a movement locus of a beam passing region through which the energy beam passes within the plane. The processing system according to claim 4 .

6. The control device controls the movement trajectory of the beam passing region within the plane so that the movement trajectory includes at least a part of a Lissajous curve. The processing system according to claim 5 .

7. The control device controls the intensity of the energy beam while the beam passing region is moving within the plane. The processing system according to claim 4 .

8. Controlling the intensity of the energy beam includes varying the intensity of the energy beam during the period. The processing system according to claim 7 .

9. Controlling the beam path by the controller includes controlling at least one of a size and a shape of a spot of the energy beam in the plane. The processing system according to claim 2 .

10. The control of the beam path by the control device includes controlling a moving speed of a passing area of ​​the energy beam within the plane. The processing system according to claim 2 .

11. The control of the moving speed includes changing the moving speed of the passing area of ​​the energy beam during the period when the passing area of ​​the energy beam is moving within the plane. The processing system of claim 10.

12. The control of the beam path by the control device includes controlling the number of the energy beams irradiated onto the build material within the plane. The processing system according to claim 2 .

13. The control device controls the beam path so that a ratio of a beam irradiation area, which is a moving range of a passing area of ​​the energy beam within the plane, to the material supply area exceeds a first threshold value. The processing system according to claim 2 .

14. The control device controls the beam path so that a value obtained by multiplying a size of a passing region of the energy beam within the plane, a moving speed of the passing region of the energy beam within the plane, and a number of the energy beams irradiated onto the building material within the plane exceeds a second threshold value. The processing system according to claim 2 .

15. The second threshold is set based on the size of the material supply area. The processing system of claim 14.

16. an imaging device that images the building material in the space between the material supply member and the object; The processing system according to claim 1 or 2.

17. At least one of the shape and the size of the material supply area is determined from the imaging result of the imaging device. The processing system of claim 16.

18. an illumination device that illuminates the building material in the space between the material supply member and the object; The processing system of claim 16.

19. The material supply area is an area where the molding material supplied from the material supply member is concentrated. The processing system according to claim 1 or 2.

20. The material supply area is an area where the molding materials supplied from the different directions intersect.

20. The processing system of claim 19.

21. The material supply member has a material supply port for supplying the material to the surface of the object, and supplies the molding material so that the material supply area is located in a space above the surface of the object and below the material supply port. The processing system according to claim 2 .

22. The material is melted in the space.

22. The processing system of claim 21.

23. Supplying a building material from a material supply member; emitting an energy beam from an irradiation device; performing additional processing to form a model on an object by melting the modeling material supplied from the material supply member with the energy beam emitted from the irradiation device; Including, Supplying the build material includes supplying the build material to a material supply region in a plane intersecting an optical axis of the irradiation device in a space between the material supply member and the object, Performing the additive processing includes setting a beam path of the energy beam from the irradiation device based on at least one of a shape and a size of the material supply region. Processing method.