CMP (chemical mechanical planarization) retaining ring

USD1103949SActive Publication Date: 2025-12-02SAMSUNG ELECTRONICS CO LTD

Patent Information

Application Number
US29/901128
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Priority Date
2023-07-17
Filing Date
2023-08-29
Publication Date
2025-12-02
Estimated Expiration
2040-12-02

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Description

[0001] FIG. 1 is a front perspective view of a CMP (chemical mechanical planarization) retaining ring showing our new design;

[0002] FIG. 2 is a front view thereof;

[0003] FIG. 3 is a rear view thereof;

[0004] FIG. 4 is a left-side view thereof;

[0005] FIG. 5 is a right-side view thereof;

[0006] FIG. 6 is a top plan view thereof;

[0007] FIG. 7 is a bottom plan view thereof;

[0008] FIG. 8 is a bottom rear perspective view thereof;

[0009] FIG. 9 is an enlarged view of the delineated portion 9 in FIG. 1;

[0010] FIG. 10 is an enlarged view of the delineated portion 10 in FIG. 2;

[0011] FIG. 11 is an enlarged view of the delineated portion 11 in FIG. 8;

[0012] FIG. 12 is a cross sectional view taken through the line 12-12 of FIG. 6; and,

[0013] FIG. 13 is an enlarged view of the delineated portion 13 in FIG. 12.

[0014] The evenly dashed broken lines in the figures depict portions of the CMP (chemical mechanical planarization) retaining ring that form no part of the claimed design. The dot-dash broken lines delineating portions of the claimed design that are illustrated in enlargements form no part of the claimed design.

Claims

The ornamental design for a CMP (chemical mechanical planarization) retaining ring as shown and described.

Citation Information

Patent Citations

  • Substrate holding ring

    JP1494712S

  • Substrate Retaining Ring

    JP1645741S

  • Retainer ring for chemical mechanical polishing equipment

    KR300492589S

  • Substrate retaining ring for semiconductor wafers

    KR300524148S

  • Retainer ring for chemical mechanical polishing equipment

    KR300667864S

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