Flexible circuit board and electronic device

Abstract

Embodiments of the present application relate to the technical field of display, and provide a flexible circuit board and an electronic device, which can reduce interference between signal lines. The flexible circuit board comprises: a display chip connecting part extending in a first direction; a wiring part arranged on one side of the display chip connecting part in the first direction; and a capacitor device region arranged between the display chip connecting part and the wiring part in the first direction, wherein the capacitor device region comprises a capacitor device, and the wiring part is electrically connected to the display chip connecting part by means of the capacitor device in the capacitor device region.

Description

Flexible circuit boards and electronic devices

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on June 16, 2023, with application number 202310721778.0 and application name “Flexible Circuit Board and Electronic Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of display technology, and in particular to a flexible circuit board and an electronic device. Background Art

[0003] With the advancement of display technology, an increasing number of electronic devices are using organic light-emitting diode (OLED) display panels. Electronic devices with touch display functionality include an OLED display panel, a flexible printed circuit board (FPC), and a touch chip. The OLED display panel consists of a stacked display layer and a touch layer, with signal lines on the FPC used to transmit touch signals between the touch layer and the touch chip. However, current FPCs suffer from interference between signal lines.

[0004] Summary of the Invention

[0005] The technical solution of the present application provides a flexible circuit board and an electronic device, which can reduce interference between signal lines.

[0006] In a first aspect, a flexible circuit board is provided, comprising: a display chip connection portion extending along a first direction; a wiring portion arranged on one side of the display chip connection portion along the first direction; and a capacitor device area arranged between the display chip connection portion and the wiring portion along the first direction, the capacitor device area including a capacitor device, and the wiring portion being electrically connected to the display chip connection portion via the capacitor device in the capacitor device area.

[0007] In one possible embodiment, on the same side of the display chip connection portion, the wiring portion includes a touch chip connection portion and a mainboard connection portion, the mainboard connection portion and the touch chip connection portion are arranged along a second direction, the mainboard connection portion is electrically connected to the display chip connection portion through a capacitor device in the capacitor device area, and the second direction is perpendicular to the first direction.

[0008] In one possible embodiment, the display chip connection portion includes multiple touch sensing signal terminals and multiple power signal terminals, and the multiple touch sensing signal terminals and the multiple power signal terminals are arranged along a first direction; the touch chip connection portion is electrically connected to the multiple touch sensing signal terminals through multiple touch sensing signal lines; the mainboard connection portion is electrically connected to the multiple power signal terminals through multiple power signal lines, and at least part of the multiple power signal lines is electrically connected to the capacitor device in the capacitor device area.

[0009] In a possible implementation, the capacitor device area is located between the plurality of touch sensing signal lines and the mainboard connection portion.

[0010] In a possible embodiment, the multiple touch sensing signal terminals include multiple first touch sensing signal terminals and multiple second touch sensing signal terminals, the display chip connection part includes multiple non-touch signal terminals, the multiple non-touch signal terminals are located between the multiple first touch sensing signal terminals and the multiple second touch sensing signal terminals, and the multiple non-touch signal terminals include multiple power signal terminals; the touch chip connection part includes multiple third touch sensing signal terminals and multiple fourth touch sensing signal terminals, the multiple touch sensing signal lines include multiple first touch sensing signal lines and multiple second touch sensing signal lines, the multiple third touch sensing signal terminals are respectively connected to the multiple first touch sensing signal terminals through the multiple first touch sensing signal lines, and the multiple fourth touch sensing signal terminals are respectively connected to the multiple second touch sensing signal terminals through the multiple second touch sensing signal lines.

[0011] In a possible implementation, the flexible circuit board has a first wiring layer and a second wiring layer stacked in a thickness direction, and the plurality of first touch sensing signal lines and the plurality of second touch sensing signal lines are located in the first wiring layer and the second wiring layer.

[0012] In a possible embodiment, the touch chip connecting portion includes a first touch chip connecting portion and a second touch chip connecting portion, and the first touch chip connecting portion and the second touch chip connecting portion are used to respectively connect different touch chips; the multiple third touch sensing signal terminals include multiple first terminals belonging to the first touch chip connecting portion, and the multiple fourth touch sensing signal terminals include multiple second terminals belonging to the first touch chip connecting portion; the multiple first touch sensing signal lines include multiple first signal lines respectively connected to the multiple first terminals; the multiple second touch sensing signal lines include multiple second signal lines respectively connected to the multiple second terminals; in the second direction, the distance between the second touch chip connecting portion and the display chip connecting portion is smaller than the distance between the first touch chip connecting portion and the display chip connecting portion.

[0013] In one possible embodiment, the flexible circuit board has an interleaved wiring area, in which the multiple first touch sensing signal lines and the multiple second touch sensing signal lines include multiple first-layer signal lines located in the first wiring layer and multiple second-layer signal lines located in the second wiring layer; in the interleaved wiring area, in a direction perpendicular to the plane of the flexible circuit board, there is a second-layer signal line between any two adjacent first-layer signal lines, and there is a first-layer signal line between any two adjacent second-layer signal lines.

[0014] In one possible embodiment, the staggered wiring area includes a first staggered wiring area, in which a plurality of first signal lines are located in a first wiring layer, and a plurality of second signal lines are located in a second wiring layer; in the first staggered wiring area, in a direction perpendicular to the plane of the flexible circuit board, there is a second signal line between any two adjacent first signal lines, and there is a first signal line between any two adjacent second signal lines.

[0015] In one possible embodiment, the multiple third touch sensing signal terminals include multiple third terminals belonging to the second touch chip connection part; the multiple first touch sensing signal lines include multiple third signal lines respectively connected to the multiple third terminals; the staggered wiring area includes a second staggered wiring area, in which the multiple first signal lines are located in the first wiring layer, and the multiple third signal lines are located in the second wiring layer; in the second staggered wiring area, in a direction perpendicular to the plane where the flexible circuit board is located, there is a third signal line between any two adjacent first signal lines, and there is a first signal line between any two adjacent third signal lines.

[0016] In a possible implementation, the plurality of fourth touch sensing signal terminals include a plurality of fourth terminals belonging to the second touch chip connection portion; and the plurality of second touch sensing signal lines include a plurality of fourth signal lines respectively connected to the plurality of fourth terminals.

[0017] In one possible embodiment, the multiple third touch sensing signal terminals include multiple third terminals belonging to the second touch chip connection part; the multiple first touch sensing signal lines include multiple third signal lines respectively connected to the multiple third terminals; the multiple fourth touch sensing signal terminals include multiple fourth terminals belonging to the second touch chip connection part; and the multiple second touch sensing signal lines include multiple fourth signal lines respectively connected to the multiple fourth terminals.

[0018] In a possible implementation, in the second direction, the capacitor device region is located on a side of the fourth signal lines away from the second signal lines; in the first direction, the capacitor device region is located on a side of the fourth signal lines away from the third signal lines.

[0019] In one possible embodiment, the flexible circuit board has a cross-wiring area, in which at least a portion of the multiple touch sensing signal lines and the multiple power signal lines are vertically crossed, and the multiple touch sensing signal lines include at least a portion of the multiple first touch sensing signal lines and the multiple second touch sensing signal lines.

[0020] In one possible embodiment, the mainboard connection portion includes multiple display signal terminals, which are respectively connected to multiple display signal lines; the multiple display signal lines include cross-line portions extending along the second direction, and the cross-line portions perpendicularly cross the multiple fourth signal lines.

[0021] In one possible embodiment, the plurality of first touch sensing signal lines include a first portion extending along a first direction, the plurality of display signal lines include a second portion extending along the first direction, and the second portion is located between the display chip connection portion and the first portion; the plurality of non-touch signal terminals include a plurality of display terminals, and the plurality of display terminals are respectively electrically connected to the plurality of non-touch signal lines.

[0022] In a possible implementation, the plurality of display signal lines are mobile industry processor interface MIPI signal lines.

[0023] In one possible embodiment, the display chip connection portion includes a plurality of first touch drive signal terminals and a plurality of second touch drive signal terminals located on a side of the plurality of non-touch signal terminals away from the plurality of second touch sensing signal terminals; the display chip connection portion includes a plurality of third touch drive signal terminals and a plurality of fourth touch drive signal terminals located on a side of the plurality of non-touch signal terminals away from the plurality of first touch sensing signal terminals; the plurality of first touch drive signal terminals are connected to the first touch chip connection portion through a plurality of first touch drive signal lines; the plurality of second touch drive signal terminals are connected to the second touch chip connection portion through a plurality of second touch drive signal lines; the plurality of third touch drive signal terminals are connected to the first touch chip connection portion through a plurality of third touch drive signal lines; and the plurality of fourth touch drive signal terminals are connected to the second touch chip connection portion through a plurality of fourth touch drive signal lines; in the second direction, the second portion is located between the plurality of first touch drive signal lines and the plurality of second touch drive signal lines.

[0024] In a second aspect, an electronic device is provided, comprising: the above-mentioned flexible circuit board; a display chip, the display chip being connected to the display chip connection portion of the flexible circuit board; a display panel, the display panel being connected to the display chip; and a touch chip, the touch chip being connected to the touch chip connection portion of the flexible circuit board.

[0025] In the flexible circuit board and electronic device in the embodiments of the present application, since the capacitor device area is located between the display chip connection part and the wiring part in the first direction, the signal line on the wiring part can be directly extended to the display chip connection part, and after connecting to the capacitor of the capacitor device area during the extension process, it is connected to the display chip connection part. This structure does not require the signal line to extend outward and then inward, thereby saving the space occupied by the signal line. Moreover, since the extension direction of the signal lines is consistent, the probability of signal interference caused by overlap between different signal lines is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] FIG1 is a schematic structural diagram of an electronic device in the related art;

[0027] FIG2 is a schematic structural diagram of another electronic device in the related art;

[0028] FIG3 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0029] FIG4 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present application;

[0030] FIG5 is a diagrammatic illustration of the structure in FIG4 ;

[0031] FIG6 is a partial enlarged schematic diagram of the A1 area in FIG5 ;

[0032] FIG7 is a partial enlarged schematic diagram of the A2 area in FIG5 ;

[0033] FIG8 is a partial enlarged schematic diagram of the A3 area in FIG5 ;

[0034] FIG9 is a partial enlarged schematic diagram of the first staggered wiring area in FIG8 ;

[0035] FIG10 is a partial enlarged schematic diagram of the second staggered wiring area in FIG8;

[0036] FIG11 is a schematic cross-sectional view of the structure taken along the BB′ line in FIG8 ;

[0037] FIG12 is a schematic cross-sectional view of the CC' direction in FIG8;

[0038] FIG13 is a partial enlarged schematic diagram of the cross wiring area in FIG5;

[0039] FIG14 is another annotated schematic diagram of the structure in FIG4 ;

[0040] FIG15 is a schematic structural diagram of another flexible circuit board according to an embodiment of the present application;

[0041] FIG. 16 is a diagrammatic illustration of a structure in FIG. 15 . DETAILED DESCRIPTION

[0042] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application.

[0043] Before introducing the embodiments of the present application, the relevant technologies and their technical problems are first explained.

[0044] Electronic devices in the related art include OLED display panels, display chips, FPCs, touch chips, and motherboards. The OLED display panel includes a stacked display layer and a touch layer. The touch layer includes multiple drive electrodes and multiple sensing electrodes. The drive electrodes and sensing electrodes are insulated and cross-linked. The original principle of touch control is to apply touch signals to the drive electrodes in sequence and detect signal changes on the sensing electrodes at the same time. If a corresponding signal change can be detected on the sensing electrode corresponding to the touch position, since the sensing electrodes are arranged in one direction, the touch coordinates in this direction can be determined by the position of the sensing electrode to which the signal change belongs. Since the signal on the drive electrode corresponds to time, and the drive electrodes are arranged in another direction, the time of the signal change can be used to determine which drive electrode applied the signal that caused the signal change, thereby determining the touch coordinates in the other direction. The intersection of the drive electrode and the sensing electrode corresponds to the touch point location. The display chip is mainly used to implement functions related to reality. In addition, the display chip is also used to transmit the touch signal in the touch layer to the touch signal line on the FPC. The touch signal line includes a sensing signal line and a driving signal line. The sensing signal line is used to transmit the sensing signal of the corresponding sensing electrode, and the driving signal line is used to transmit the driving signal of the corresponding driving electrode. In addition, in addition to the touch signal line, the FPC also includes other signal lines. Other signal lines include power signal lines and display signal lines. The display signal line refers to the signal line related to the content displayed by the OLED display panel. The display signal line on the FPC is used to transmit the display signal provided by the motherboard to the display chip. The display chip drives the OLED display panel to display the corresponding picture based on the display signal. For the touch signal line and other signal lines, if there is an overlap between the two, parasitic capacitance will be generated between the overlapping signal lines. The coupling effect of the parasitic capacitance will cause the signal change of one of them to cause the other to be interfered with. For conventional electronic devices such as straight-bar mobile phones, there are relatively few touch reporting points and the number of touch signal lines is small. Therefore, the touch sensing signal line on the FPC is not easy to cross with other signal lines, that is, the touch sensing signal line is not easily interfered with. However, for electronic devices with a large number of touch signal lines, the touch sensing signal lines on the FPC are easily interfered with by other signal lines. For both drive and sensing signals, the sensing signal is more susceptible to interference from other signals, which can lead to reduced touch accuracy. For example, electronic devices with high touch accuracy requirements require more touch point locations, which in turn requires more touch signal lines. Another example is a foldable phone, where the folding structure doubles the number of touch electrodes, requiring even more touch signal lines.Based on this, for electronic devices with a large number of touch signal lines, a three-layer or four-layer FPC design can be used. In this way, a shielding layer can be set between the sensing signal line and other signal lines at the part where they cross each other, and the shielding layer can be used to reduce the interference between the two. However, this requires more layers of FPC, resulting in higher costs and increased thickness.

[0045] As shown in Figure 1, in a related technology, the touch layer includes multiple drive electrodes TX and multiple sensing electrodes RX. Each drive electrode TX extends along a second direction h2. Multiple drive electrodes TX are arranged along a first direction h1. Each sensing electrode RX extends along the first direction h1. Multiple sensing electrodes RX are arranged along a second direction h2. The drive electrodes TX and the sensing electrodes RX are insulated and cross-linked. The second direction h2 can be perpendicular to the first direction h1. During a touch operation, drive signals can be supplied to the drive electrodes TX in a time-sharing manner, and sensing signals can be received from each sensing electrode RX. In locations where no user touches, the drive signals from the drive electrodes TX will generate a fixed coupling effect on the sensing electrodes RX at the intersection. In locations where a user touches, the user's touch will generate a coupling effect on the sensing electrodes RX at the intersection of the drive electrodes TX and the sensing electrodes RX. In this way, the sensing signal received by the sensing electrode RX at the location of the user's touch can be identified. On the one hand, the position of the sensing electrode RX in the second direction, which identifies the touch signal, can determine the coordinates of the touch position in that direction. On the other hand, the position of the driving electrode TX can be determined by the time the touch signal is identified, that is, the coordinates of the touch position in the first direction can be determined. Thus, the touch position can be determined using coordinates in two dimensions. The touch layer is connected to the touch chip through the display chip and the FPC. In the structure shown in Figure 1, the driving electrode TX only has a drive signal line TXL extending from one side. The drive signal line TXL is connected to the display chip and extends from the lower left side of the display chip to the FPC, where it is routed to the touch chip. The sensing electrode RX also only has a sense signal line RXL extending from one side. The sense signal line RXL is connected to the display chip and extends from the lower right side of the display chip to the FPC, where it is routed to the touch chip. The structure shown in Figure 1 is called a 1T1R structure because both the driving electrode TX and the sensing electrode RX have signal lines extending from only one side. Compared to drive signals, sensing signals are more susceptible to interference from other signals. Therefore, in the structure shown in Figure 1, the sensing signal line RXL is connected to the touch chip via a shorter path from the right side of the display chip. This reduces the probability of the sensing signal line RXL crossing other signal lines such as the power signal line PL, thereby reducing signal interference. Due to the simple wiring, the structure shown in Figure 1 can be implemented using a double-layer FPC.

[0046] However, with the emergence of electronic devices with high touch requirements such as foldable mobile phones, the requirements for touch position are even higher, and the corresponding routing structure can be 2T1R or even 2T2R. 2T1R means that the driving electrode TX leads out signal lines on both opposite sides, and the sensing electrode RX leads out signal lines only on one side. 2T2R means that the driving electrode TX leads out signal lines on both opposite sides, and the sensing electrode RX also leads out signal lines on both opposite sides. For example, in the structure shown in Figure 2, the sensing signal line RXL and the driving signal line TXL both need to be led out to the FPC on both sides of the display chip, so both types of signal lines need to cross the entire FPC. In addition, the FPC is also provided with a motherboard connection part and a device area. The motherboard connection part is used to connect to the motherboard, and the device area is provided with devices such as capacitors. At least part of the power signal line PL led out from the motherboard connection part first extends to the device area to facilitate connection with the required devices in the device area, such as capacitor devices, and then extends to the right and connects to the display chip. The touch chip is closer to the display chip than to the device area and the motherboard connection. This results in the sensing signal line RXL and the power signal line PL crossing at more locations, increasing the probability of interference with the sensing signal line. Therefore, to solve this problem, the FPC structure shown in Figure 2 usually adopts a three-layer or four-layer structure. In this way, a shielding layer can be installed between the sensing signal line RXL and the power signal line PL at the intersection to reduce the probability of the sensing signal line being interfered with by other signals. However, this increases the number of layers in the FPC, which increases the cost.

[0047] In order to solve the above-mentioned problems, a technical solution of an embodiment of the present application is provided, and the technical solution of an embodiment of the present application is described below.

[0048] As shown in Figure 3, an embodiment of the present application provides an electronic device, including: a flexible circuit board 100; a display chip 200, the display chip 200 is connected to the display chip connection part 1 of the flexible circuit board 100; a display panel 300, the display panel 300 is connected to the display chip 200; and a touch chip 400, the touch chip 400 is connected to the touch chip connection part of the flexible circuit board 100, and the display panel 300 includes a display layer and a touch layer that are stacked.

[0049] As shown in Figures 4 to 7, embodiments of the present application further provide a flexible circuit board 100, comprising: a display chip connection portion 1 extending along a first direction h1, the display chip connection portion 1 being used to connect to a display chip 200; a wiring portion 20 disposed on one side of the display chip connection portion 1 along the first direction h1; and a capacitor device region 61 disposed along the first direction h1 between the display chip connection portion 1 and the wiring portion 20. The capacitor device region 61 includes a capacitor device C, and the wiring portion 20 is electrically connected to the display chip connection portion 1 via the capacitor device C in the capacitor device region 61. The wiring portion 20 is used to connect to external devices, such as a touch chip 400 and a motherboard.

[0050] In the related technology shown in Figure 2, since the device area is located outside the wiring part, the signal line of the motherboard connection part needs to first extend outward to the device area and connect to the capacitor in the device area, and then extend to the display chip, which makes it easier to cause interference with other signal lines during the routing process.

[0051] In the flexible circuit board and electronic device in the embodiments of the present application, since the capacitor device area is located between the display chip connection part and the wiring part in the first direction, the signal line on the wiring part can be directly extended to the display chip connection part, and after connecting to the capacitor of the capacitor device area during the extension process, it is connected to the display chip connection part. This structure does not require the signal line to extend outward and then inward, thereby saving the space occupied by the signal line. Moreover, since the extension direction of the signal lines is consistent, the probability of signal interference caused by overlapping between different signal lines is reduced.

[0052] In one possible embodiment, as shown in Figures 4 and 5, on the same side of the display chip connection portion 1, the wiring portion 20 includes a touch chip connection portion 2 and a motherboard connection portion 3. The motherboard connection portion 3 and the touch chip connection portion 2 are arranged along a second direction h2. The motherboard connection portion 3 is electrically connected to the display chip connection portion 1 via the capacitor device C in the capacitor device area 61. The second direction h2 is perpendicular to the first direction h1. The motherboard connection portion 3 can be located on the side of the display chip connection portion 1, that is, the display chip connection portion 1 and the motherboard connection portion 3 are arranged along the first direction h1. In this structure, the signal line of the motherboard connection portion 3 can extend directly to the left and connect to the capacitor device C in the capacitor device area 61, and then continue to extend to the left and connect to the display chip connection portion 1. The touch chip connection portion 2 does not need to be connected to the capacitor device C, so it can directly bypass the capacitor device area 61 and then connect to the display chip connection portion 1. This reduces the probability of overlap between the signal line of the touch chip connection portion 2 and the signal line of the motherboard connection portion 3, thereby reducing the interference of the signal line corresponding to the motherboard connection portion 3 on the signal line of the touch chip connection portion 2.

[0053] In one possible embodiment, as shown in Figure 5, the display chip connection portion includes multiple touch sensing signal terminals and multiple power signal terminals PP, the multiple touch sensing signal terminals include multiple first touch sensing signal terminals RXP1 and multiple second touch sensing signal terminals RXP2, and the multiple touch sensing signal terminals and the multiple power signal terminals PP are arranged along a first direction h1; the touch chip connection portion 2 is electrically connected to the multiple touch sensing signal terminals through multiple touch sensing signal lines; the mainboard connection portion 3 is electrically connected to the multiple power signal terminals PP through multiple power signal lines 4, and at least part of the multiple power signal lines 4 is electrically connected to the capacitor device C in the capacitor device area 61.

[0054] Specifically, the motherboard connection portion 3 is used to connect to the motherboard, which is typically equipped with devices such as a processor and memory to realize the functions of the electronic device. The length direction of the display chip connection portion 1 is the first direction h1, and the width direction of the display chip connection portion 1 is the second direction h2. The multiple terminals on the display chip connection portion 1 are arranged along the first direction h1. The display chip connection portion 1 is located at the upper end of the FPC. The signal lines led from the multiple terminals of the display chip connection portion 1 extend downward along the second direction h2 to the FPC for wiring. In other words, whether it is the touch sensing signal line led from the touch sensing signal terminal or the power signal line led from the power signal terminal PP, they are all signal lines led downward from the display chip connection portion 1. The power signal line 4 needs to be connected to the motherboard connection portion 3, and at least part of the power signal line 4 needs to be connected to the capacitor device C in the capacitor device area 61; the touch sensing signal line needs to be connected to the touch chip connection portion 2 located below the motherboard connection portion 3. In this embodiment of the present application, the terminal is a pin used to connect a signal line. One terminal is used to lead out one signal line, but the signal line can be branched into multiple lines as needed.

[0055] In the embodiment of the present application, since the motherboard connection portion is located to the side of the display chip connection portion, the touch chip connection portion is located below the motherboard connection portion, and the capacitor device area is located closer to the display chip connection portion relative to both the motherboard connection portion and the touch chip connection portion in the first direction, the power signal line leading from the display chip connection portion can be directly connected to the capacitor device in the capacitor device area first, and then directly connected to the motherboard connection portion to the right. The touch sensing signal line leading from the display chip connection portion does not need to pass through the capacitor device area to connect to the touch chip connection portion. This structure is conducive to reducing the crossover between the power signal line and the touch sensing signal line, thereby reducing the interference of the power signal line on the touch sensing signal.

[0056] In one possible implementation, as shown in Figures 4 and 5 , a capacitor device area 61 is located between any touch sensing signal line and the motherboard connection portion 3. In other words, the touch sensing signal line extending from the display chip connection portion 1 to the touch chip connection portion 2 bypasses the capacitor device area 61. Since at least part of the power signal line needs to pass through the capacitor device area 61, this structure can minimize the crossover between the touch sensing signal line and the power signal line.

[0057] In one possible embodiment, as shown in FIG5 , the plurality of touch sensing signal terminals include a plurality of first touch sensing signal terminals RXP1 and a plurality of second touch sensing signal terminals RXP2, the display chip connection portion 1 includes a plurality of non-touch signal terminals P, the plurality of non-touch signal terminals P include the plurality of power signal terminals PP described above, and the plurality of non-touch signal terminals P are located between the plurality of first touch sensing signal terminals RXP1 and the plurality of second touch sensing signal terminals RXP2. For example, in the structures shown in FIG4 and FIG5 , the display chip connection portion 1 is located on the upper side of the FPC. A plurality of first touch sensing signal terminals RXP1 are located on the left side, and a plurality of second touch sensing signal terminals RXP2 are located on the right side. The display chip connection part 1 is used to connect the display chip, and the display chip is used to connect the display panel. The display chip and the display panel are not shown in Figures 4 and 5. The touch chip connection part 2 can be located on the right side of the FPC, for example. The touch chip connection part 2 is used to connect the touch chip (not shown in Figures 4 and 5). The touch chip connection part 2 is connected to the display chip connection part 1 through the wiring on the FPC to realize the transmission of the touch signal. In the structure shown in Figures 4 and 5, there are two touch chip connection parts 2. The two touch chip connection parts 2 can be connected to two touch chips respectively, but the embodiments of the present application are not limited to this. For example, in other embodiments, there can also be only one touch chip connection part 2 to connect to one touch chip. As shown in Figures 6 and 7 , the touch chip connection portion 2 includes a plurality of third touch sensing signal terminals RXP3 and a plurality of fourth touch sensing signal terminals RXP4. The plurality of touch sensing signal lines include a plurality of first touch sensing signal lines and a plurality of second touch sensing signal lines. The plurality of third touch sensing signal terminals RXP3 are respectively connected to the plurality of first touch sensing signal terminals RXP1 via the plurality of first touch sensing signal lines, and the plurality of fourth touch sensing signal terminals RXP4 are respectively connected to the plurality of second touch sensing signal terminals RXP2 via the plurality of second touch sensing signal lines. As shown in Figures 5 to 12 , the plurality of first touch sensing signal lines include a plurality of first signal lines L1 and a plurality of third signal lines L3, and the plurality of second touch sensing signal lines include a plurality of second signal lines L2 and a plurality of fourth signal lines L4.The FPC also includes a plurality of non-touch signal lines connected to the plurality of non-touch signal terminals P, at least portions of which extend along the second direction h2. The plurality of first touch sensing signal lines include a first portion 31 extending along the first direction h1, with portions of the plurality of non-touch signal lines extending in the second direction h2 located between the first portion 31 and the display chip connection portion 1. In other words, to reduce interference from the non-touch signal lines with the first touch sensing signal lines, the first touch sensing signal lines are routed along the outermost side, i.e., the lower side, of the FPC. This allows the first touch sensing signal lines to be kept as far away as possible from a dense routing area, i.e., where the plurality of non-touch signal lines extend in the second direction h2. The flexible circuit board includes a first wiring layer and a second wiring layer stacked in a thickness direction, with the plurality of first touch sensing signal lines, the plurality of second touch sensing signal lines, and the plurality of non-touch signal lines located in the first wiring layer and the second wiring layer. It should be noted that the structures shown in Figures 4 and 5 are identical, except that, for clarity, Figure 5 illustrates portions of the structure in Figure 4 with white fill patterns.

[0058] In the flexible circuit board of the present application embodiment, the touch sensing signal terminals are respectively arranged at both ends of the display chip connection portion. In other words, the touch sensing signal line extending from one end can be connected to the touch chip at a relatively close distance to reduce interference with other signal lines. The touch sensing signal line extending from the other end is arranged outside the non-touch signal lines through a winding method to reduce interference with non-touch signal lines. Therefore, the present application embodiment only needs two layers of PFC to realize the arrangement of signal routing. That is, while reducing interference with other signal lines on the touch sensing signal line, it also reduces the cost and thickness of the flexible circuit board and the entire device.

[0059] In one possible embodiment, as shown in Figures 8 to 12, a flexible printed circuit board (FPC) has a staggered wiring region, comprising a first staggered wiring region 11 and a second staggered wiring region 12. Within the staggered wiring region, the plurality of first touch sensing signal lines and the plurality of second touch sensing signal lines include a plurality of first-layer signal lines M1 located on a first wiring layer and a plurality of second-layer signal lines M2 located on a second wiring layer. Within the staggered wiring region, in a direction perpendicular to the plane of the FPC, a second-layer signal line M2 is located between any two adjacent first-layer signal lines M1, and a first-layer signal line M1 is located between any two adjacent second-layer signal lines M2. This eliminates overlap between signal lines on different layers in a direction perpendicular to the plane of the FPC, reducing signal interference caused by mutual coupling. Furthermore, to maximize space efficiency within the FPC, staggered arrangement of signal lines on different layers facilitates fabrication and saves space. A two-layer FPC refers to an FPC with two wiring layers arranged in a stacked manner. As described in Figures 11 and 12, the first-layer signal line M1 and the second-layer signal line M2 belong to two wiring layers respectively, and there is an intermediate dielectric layer 71 between the two wiring layers. A first insulating protective layer 72 is provided on the side of the first-layer signal line M1 away from the intermediate dielectric layer 71, and a second insulating protective layer 73 is provided on the side of the second-layer signal line M2 away from the intermediate dielectric layer 71. Among them, any one of the intermediate dielectric layer 71, the first insulating protective layer 72 and the second insulating protective layer 73 can be a single-layer or multi-layer dielectric, and any one of the first-layer signal line M1 and the second-layer signal line M2 can be a single-layer metal material layer, a stack of multiple metal material layers, or a composite metal material layer.

[0060] In a possible embodiment, as shown in Figures 5 to 7, the touch chip connection part 2 includes a first touch chip connection part T1 and a second touch chip connection part T2, and the first touch chip connection part T1 and the second touch chip connection part T2 are used to connect different touch chips respectively; the plurality of third touch sensing signal terminals RXP3 include a plurality of first terminals belonging to the first touch chip connection part T1, and the plurality of fourth touch sensing signal terminals RXP4 include a plurality of second terminals belonging to the first touch chip connection part T1; the plurality of first touch sensing signal lines include a plurality of first signal lines L1 respectively connected to the plurality of first terminals; the plurality of second touch sensing signal lines include a plurality of second signal lines L2 respectively connected to the plurality of second terminals, that is, the plurality of first touch sensing signal lines L1 and the plurality of second touch sensing signal lines L2 are ... The third touch sensing signal terminal RXP3 in T1 is connected to the first signal line L1, the second signal line L2 is connected to the fourth touch sensing signal terminal RXP4 in the first touch chip connection part T1, the third signal line L3 is connected to the third touch sensing signal terminal RXP3 in the second touch chip connection part T2, and the fourth signal line L4 is connected to the fourth touch sensing signal terminal RXP3 in the second touch chip connection part T2; in the second direction h2, the distance between the second touch chip connection part T2 and the display chip connection part 1 is smaller than the distance between the first touch chip connection part T1 and the display chip connection part 1, that is, in the second direction h2, the second touch chip connection part T2 is located between the display chip connection part 1 and the first touch chip connection part T1. As shown in Figures 8 to 12, the staggered wiring area includes a first staggered wiring area 11. In the first staggered wiring area 11, multiple first signal lines L1 are located in the first wiring layer, and multiple second signal lines L2 are located in the second wiring layer. In the first staggered wiring area 11, in a direction perpendicular to the plane where the flexible circuit board is located, there is a second signal line L2 between any two adjacent first signal lines L1, and there is a first signal line L1 between any two adjacent second signal lines L2. That is, in the first staggered wiring area 11, the first signal line L1 is the first layer signal line M1, and the second signal line L2 is the second layer signal line M2. That is to say, a portion of the touch sensing signal lines led out from the first touch chip connection portion T1 corresponding to the same touch chip is used to connect to the first signal line L1 on the left side of the display chip connection portion 1, and the other portion is used to connect to the second signal line L2 on the right side of the display chip connection portion 1. Both first extend to the left in the first staggered wiring area 11, and then the second signal line L2 extends upward and is connected to a portion of the second touch sensing signal terminal RXP2 on the right side of the display chip connection portion 1. The first signal line L1 continues to extend to the left and, after reaching the left side of the FPC, extends upward and is connected to a portion of the first touch sensing signal terminal RXP1 on the left side of the display chip connection portion 1.

[0061] It should be noted that the multiple first touch sensing signal terminals RXP1 and the multiple second touch sensing signal terminals RXP2 can be terminals that transmit the same signal or terminals that transmit different signals. In the examples shown in Figures 4 and 5, both terminals transmit the same signal. For example, these terminals are used to transmit signals from the touch sensing electrodes in the display panel. Assume there are 40 touch sensing electrodes, and these 40 touch sensing electrodes have 40 signal lines extending from the left and right sides, respectively. The 40 signal lines on the left side pass through the display chip and connect to the 40 first touch sensing signal terminals RXP1 on the left, while the 40 signal lines on the right side pass through the display chip and connect to the 40 second touch sensing signal terminals RXP2. When the FPC is used in an electronic device with a foldable screen, the touch function of only part of the screen may be used when the screen is folded, while the touch function of the other part of the screen may not be used. Assume that the touch sensing electrodes corresponding to part of the screen have signal lines 1 to 20, and the touch sensing electrodes corresponding to the other part of the screen have signal lines 21 to 40. Then, signal lines 1 to 20 corresponding to the first touch sensing signal terminal RXP1 on the left are connected to the first touch chip connection portion T1, signal lines 21 to 40 corresponding to the first touch sensing signal terminal RXP1 on the left are connected to the second touch chip connection portion T2, signal lines 1 to 20 corresponding to the second touch sensing signal terminal RXP2 on the right are connected to the first touch chip connection portion T1, and signal lines 21 to 40 corresponding to the second touch sensing signal terminal RXP2 on the left are connected to the second touch chip connection portion T2. ​​When the screen is folded, the touch chip connected to the first touch chip connection portion T1 is in operation, while the other touch chip connected to the second touch chip connection portion T2 is inoperative. That is, the touch sensing electrodes connected to signal lines 1 to 20 are in operation, while the touch sensing electrodes connected to signal lines 21 to 20 are inoperative.

[0062] It should also be noted that the terminals of the touch chip connection portion 2 can be located on the same metal layer, and can be switched to the corresponding metal layer after the signal lines are led out. For example, as shown in Figure 7, the first signal line L1 and the second signal line L2 led out of the first touch chip connection portion T1 are initially located on the same metal layer. Afterwards, the second signal line L2 is switched to another metal layer at a corresponding position. After the layer switch, the second signal line L2 and the first signal line L1 are located on different layers and can be staggered, that is, extended to the first staggered wiring area 11.

[0063] In one possible embodiment, as shown in Figures 6 and 7, the multiple third touch sensing signal terminals RXP3 include multiple third terminals belonging to the second touch chip connection portion T2; the multiple first touch sensing signal lines include multiple third signal lines L3 respectively connected to the multiple third terminals; as shown in Figures 8, 10 and 12, the staggered wiring area includes a second staggered wiring area 12, in which the multiple first signal lines L1 are located in the first wiring layer, and the multiple third signal lines L3 are located in the second wiring layer; in the second staggered wiring area 12, in a direction perpendicular to the plane of the flexible circuit board, there is a third signal line L3 between any two adjacent first signal lines L1, and there is a first signal line L1 between any two adjacent third signal lines L3. Specifically, as shown in Figure 5 , a portion of the touch sensing signal lines extending from the second touch chip connection portion T2 is used to connect to the third signal line L3 on the left side of the display chip connection portion 1. This portion of the third signal line L3 extends leftward, passing over the second signal line L2, then extends downward to the location of the multiple first signal lines L1. It then merges with the multiple first signal lines L1 and extends leftward together. The portion of the multiple third signal lines L3 and the multiple first signal lines L1 that extend leftward together after merging is the aforementioned first portion 31. In this first portion 31, the first signal lines L1 are first-layer signal lines M1, and the third signal lines L3 are second-layer signal lines M2. After extending to the left side of the FPC and bypassing the densely packed non-touch signal lines, the multiple first signal lines L1 and the multiple third signal lines L3 extend upward and connect to the multiple first touch sensing signal terminals RXP1 on the left side of the display chip connection portion 1.

[0064] In one possible embodiment, as shown in Figures 6 and 7 , the plurality of fourth touch sensing signal terminals RXP4 include a plurality of fourth terminals belonging to the second touch chip connection portion T2, and the plurality of second touch sensing signal lines include a plurality of fourth signal lines L4 respectively connected to the plurality of fourth terminals. That is, as shown in Figure 5 , another portion of the touch sensing signal lines extending from the second touch chip connection portion T2 is used to connect to the fourth signal line L4 on the right side of the display chip connection portion 1. The plurality of third signal lines L3 and the plurality of fourth signal lines L4 extending from the second touch chip connection portion T2 first extend leftward, then the plurality of fourth signal lines L4 extend upward and connect to a portion of the second touch sensing signal terminals RXP2 on the right side of the display chip connection portion 1. The plurality of third signal lines L3 extend past the second signal lines L2 and merge with the plurality of first signal lines L1 to form a first portion 31.

[0065] In one possible embodiment, as shown in Figures 4 and 5, in the second direction h2, the capacitor device area 61 is located on the side of the plurality of fourth signal lines L4 away from the plurality of second signal lines L2; ​​in the first direction h1, the capacitor device area 61 is located on the side of the plurality of fourth signal lines L4 away from the plurality of third signal lines L3. That is, in the second direction h2, the plurality of capacitor devices C are located above all touch signal lines, and in the first direction h1, the plurality of capacitor devices C are located to the right of all touch signal lines. The power signal line 4 is used to supply power to the display panel and other devices through the motherboard. On the FPC, at least some of the power signal lines 4 need to be connected to the capacitor device C. The capacitor device C is easily interfered with by coupling with other signal lines. Therefore, the capacitor device C is set outside each touch sensing signal line. The touch sensing signal line will bypass the capacitor device C during routing, thereby reducing the interference of the capacitor device C on the sensing signal.

[0066] In one possible embodiment, as shown in Figures 4 and 5 , a portion of the power signal lines 4 extending from the motherboard connection portion 3 extends directly to the left to the capacitor device area 61, connects to the capacitor device C, and continues to extend to the left. Another portion of the power signal lines 4 extending from the motherboard connection portion 3 extends downward. The flexible printed circuit board has a cross wiring area 13. As shown in Figure 13 , in the cross wiring area 13, at least a portion of the plurality of touch sensing signal lines and the plurality of power signal lines 4 are arranged perpendicularly to each other. The plurality of touch sensing signal lines include at least a portion of the plurality of first touch sensing signal lines and the plurality of second touch sensing signal lines. Some of the power signal lines 4 may need to first extend downward and connect to the protective device, which will inevitably cause the power signal lines 4 to overlap with the touch sensing signal lines. Therefore, to reduce the coupling interference caused by the power signal lines 4 on the touch sensing signal lines when the power signal lines overlap, the two are arranged to extend perpendicularly. This arrangement reduces the parasitic capacitance area between the two, that is, reduces the parasitic capacitance between the two, thereby reducing the coupling interference between the two. In addition, since the voltage value on the power signal line 4 remains unchanged, the interference on the touch sensing signal line is the same. Therefore, the interference of the power signal line 4 on the touch sensing signal line can be filtered out by an algorithm.

[0067] In one possible embodiment, the motherboard connection portion 3 includes multiple display signal terminals, each of which is connected to a plurality of display signal lines 5. As shown in Figures 5 and 13, the plurality of display signal lines 5 include crossover portions extending along the second direction h2, which perpendicularly intersect the plurality of fourth signal lines L4. The display signal lines 5 are used to transmit display data between the display panel and the motherboard. On the FPC, the display signal lines 5 cross the fourth signal lines L4 and the third signal lines L3 in the crossover wiring area 13. Therefore, in this area, the display signal lines 5 are perpendicular to the fourth signal lines L4 and the third signal lines L3. This minimizes coupling interference between the display signal lines 5 and the touch sensing signal lines.

[0068] In a possible implementation, as shown in FIG. 5 , the plurality of display signal lines 5 include a second portion 32 extending along the first direction h1 , and the second portion 32 is located between the display chip connecting portion 1 and the first portion 31 .

[0069] In a possible implementation, the plurality of display signal lines 5 are Mobile Industry Processor Interface (MIPI) signal lines.

[0070] In a possible embodiment, as shown in FIG14 , the display chip connection portion 1 includes a plurality of first touch drive signal terminals TXP1 and a plurality of second touch drive signal terminals TXP2 located on a side of the plurality of non-touch signal terminals P away from the plurality of second touch sensing signal terminals RXP2; the display chip connection portion 1 includes a plurality of third touch drive signal terminals TXP3 and a plurality of fourth touch drive signal terminals TXP4 located on a side of the plurality of non-touch signal terminals P away from the plurality of first touch sensing signal terminals RXP1; the plurality of first touch drive signal terminals TXP1 are connected via a plurality of first touch drive signal lines TXL1. Connected to the first touch chip connection portion T1; multiple second touch drive signal terminals TXP2 are connected to the second touch chip connection portion T2 via multiple second touch drive signal lines TXL2; multiple third touch drive signal terminals TXP3 are connected to the first touch chip connection portion T1 via multiple third touch drive signal lines TXL3; multiple fourth touch drive signal terminals TXP4 are connected to the second touch chip connection portion T2 via multiple fourth touch drive signal lines TXL4; in the second direction h2, the second portion 32 is located between the multiple first touch drive signal lines TXL1 and the multiple second touch drive signal lines TXL2. Touch drive signal lines are less susceptible to interference than touch sensing signal lines. Therefore, on the bottom side of the FPC, the touch drive signal lines can be routed above the touch sensing signal lines. However, the touch drive signal lines should still be routed around other signal lines as much as possible to reduce interference.

[0071] In one possible embodiment, as shown in FIG4 , the multiple non-touch signal terminals P include, for example, multiple external input power terminals P1, multiple internally generated power and control signal terminals P2, and multiple display signal terminals P3. The display signal terminals P3 are used to connect to multiple display signal lines 5. The multiple power signal terminals PP described above may be at least a portion of the multiple external input power terminals P1. When the FPC is installed in an electronic device, the capacitor device area 61 shown in FIG4 may be located within the projection of the battery in the electronic device. Therefore, the height restrictions on devices in this area are relatively large. The capacitor device area 61 is provided with capacitors and protective devices corresponding to the external power supply. The protective devices may be, for example, transient voltage suppression diodes (TVS) or series resistors. The external power supply may include, for example, the anode voltage ELVDD, cathode voltage ELVSS, analog voltage AVDD, and data voltage DVDD of the OLED devices in the display panel. In addition, the capacitor device area 61 may also be provided with protective devices for the touch external supply signal. The peripheral device area 62 is located outside the projection of the battery in the electronic device. Therefore, there are no strict requirements for the height of the devices here. In an electronic device, a touch control chip, peripheral capacitors, protective devices, crystal devices, etc. are provided in the peripheral device area 62. In addition, an external power supply protective device can also be provided in the peripheral device area 62. As shown in Figures 4 and 5, a portion of the power signal line 4 extending from the motherboard connection portion 3 extends leftward to the capacitor device area 61, where it connects to the corresponding capacitor device C and protective device. These power signal lines 4 then continue to extend leftward. Multiple non-touch signal terminals P, including power terminals corresponding to the portion of the power signal lines 4, are connected to the corresponding power signal lines 4 at corresponding positions. Another portion of the power signal line 4 extending from the motherboard connection portion 3 first extends downward, connects to the corresponding protective device in the peripheral device area 62, then returns to the capacitor device area 61 and extends leftward (because the protective device connected to this portion of the power signal line 4 is height-restricted and can only be placed in the peripheral device area 62). Since the capacitor device area 61, that is, the position of multiple capacitor devices C is outside the second signal line L2, the third signal line L3 and the fourth signal line L4, and is far away from the fan-out position of the touch signal terminal, on the one hand, the fan-out routing pressure of the touch signal line can be alleviated; on the other hand, the routing length of the power signal line 4 can be minimized, thereby reducing the power supply impedance. This is because the power signal line 4 does not need to be wound to connect to the capacitor device C. After being led out from the motherboard connection part 3, it can be connected to the capacitor device C at a relatively close distance. On the other hand, the number of crossings between the power signal line 4 and the touch signal line can be reduced, thereby reducing interference between the two.

[0072] In addition, the structures shown in Figures 15 and 16 also include a capacitor device area 61. The flexible printed circuit board also includes multiple power signal lines respectively connected to multiple power signal terminals. The multiple power signal lines are connected to multiple capacitor devices in the capacitor device area 61. In the second direction h2, the multiple capacitor devices are located on the side of the multiple fourth signal lines L4 away from the multiple second signal lines L2; ​​in the first direction h1, the multiple capacitor devices are located on the side of the multiple fourth signal lines L4 away from the multiple third signal lines L3. In other words, in the second direction h2, the multiple capacitor devices are located above all touch signal lines, and in the first direction h1, the multiple capacitor devices are located to the right of all touch signal lines. Therefore, placing the capacitor devices outside the touch sensing signal lines also has the beneficial effects of alleviating fan-out routing pressure on the touch signal lines, reducing the routing length of the power signal lines and lowering the power supply impedance, and reducing the number of crossings between the power signal lines and the touch signal lines, thereby reducing interference between the two. However, in the structures shown in Figures 15 and 16, all power signal lines extend directly to the left to the capacitor device area 61. During the connection between the protective device and the capacitor, there is no longer a need to set a portion of the power signal line to first extend downward and then to the left. The reason is that in this structure, the height of the protective device is no longer a limitation and can be set in the capacitor device area 61.

[0073] In other possible implementations, the routing method may be different. For example, compared with the structure shown in Figures 4 and 5, the first signal line L1 and the third signal line L3 are not arranged alternately under the FPC in the structure shown in Figures 15 and 16. Other structures are similar and will not be repeated.

[0074] It should be noted that the embodiment of the present application does not limit whether the touch wiring method is 2T1R or 2T2R, and the technical solutions of the embodiments of the present application can be applied to both. In addition, the embodiments of the present application are only described by taking two touch chips set on the FPC as an example, but the embodiments of the present application do not limit the number of touch chips set on the FPC. For example, in a possible embodiment, only one touch chip can be set on the FPC, then there is only one touch chip connection part 2 on the FPC. However, one touch chip connection part 2 is still at the position of two touch chip connection parts 2 on the FPC, and the corresponding signal lines also need to be led out. Therefore, the technical solutions of the embodiments of the present application can still be applied.

[0075] As shown in Figure 3, the electronic device may further include a motherboard, which may be provided with a processor. The processor and motherboard are connected to a flexible circuit board 100. The specific structure and principle of the flexible circuit board 100 are the same as those in the above embodiment and will not be repeated here. The electronic device can be any electronic device with a display function, such as a mobile phone, tablet computer, in-vehicle device, AR device, VR device, etc.

[0076] It is understood that the structures illustrated in the embodiments of the present invention do not constitute specific limitations on the electronic device. In other embodiments of the present application, the electronic device may include more or fewer components than shown, or may combine or separate certain components, or arrange the components differently. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0077] A processor may include one or more processing units, for example, an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural-network processing unit (NPU). The different processing units may be independent devices or integrated into one or more processors.

[0078] The controller can generate operation control signals according to the instruction operation code and timing signal to complete the control of instruction fetching and execution.

[0079] The processor may also include a memory for storing instructions and data.

[0080] The electronic device implements display functions through a GPU, display chip 200, display panel 300, and an application processor. The GPU is a microprocessor for image processing that connects the display panel 300 and the application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. The processor may include one or more GPUs, which execute program instructions to generate or modify display information.

[0081] The display panel 300 is used to display images, videos, etc. The display panel can be an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (AMOLED), etc. In some embodiments, the electronic device can include one or N display panels 300, where N is a positive integer greater than 1.

[0082] In the embodiment of the present application, "at least one" refers to one or more, and "more" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or the second signal line can represent the existence of A alone, the existence of A and the second signal line at the same time, and the existence of the second signal line alone. Among them, A, the second signal line can be singular or plural. The character " / " generally indicates that the previous and next associated objects are in an "or" relationship. "At least one of the following" and similar expressions refer to any combination of these items, including any combination of single or plural items. For example, a, at least one of the second signal line and the third signal line can represent: a, the second signal line, the third signal line, a-the second signal line, a-the third signal line, the second signal line-the third signal line, or a-the second signal line-the third signal line, wherein a, the second signal line, the third signal line can be single or multiple.

[0083] The above are merely preferred embodiments of the present application and are not intended to limit the present application. Those skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A flexible circuit board, characterized in that: include: A display chip connecting portion extending along a first direction; A wiring portion, arranged on one side of the display chip connecting portion along the first direction; as well as A capacitor device region is provided between the display chip connection portion and the wiring portion along the first direction. The capacitor device region includes a capacitor device. The wiring portion is electrically connected to the display chip connection portion through the capacitor device in the capacitor device region.

2. The flexible circuit board according to claim 1, characterized in that: On the same side of the display chip connection part, the wiring part includes a touch chip connection part and a mainboard connection part, the mainboard connection part and the touch chip connection part are arranged along a second direction, the mainboard connection part is electrically connected to the display chip connection part through the capacitor device in the capacitor device area, and the second direction is perpendicular to the first direction.

3. The flexible circuit board according to claim 2, characterized in that: The display chip connection portion includes a plurality of touch sensing signal terminals and a plurality of power signal terminals, and the plurality of touch sensing signal terminals and the plurality of power signal terminals are arranged along the first direction; The touch chip connection portion is electrically connected to the plurality of touch sensing signal terminals through a plurality of touch sensing signal lines; The mainboard connection portion is electrically connected to the plurality of power signal terminals through a plurality of power signal lines, and at least a portion of the plurality of power signal lines is electrically connected to the capacitive device in the capacitive device area.

4. The flexible circuit board according to claim 3, characterized in that: The capacitor device area is located between the plurality of touch sensing signal lines and the mainboard connecting portion.

5. The flexible circuit board according to claim 3, characterized in that: The plurality of touch sensing signal terminals include a plurality of first touch sensing signal terminals and a plurality of second touch sensing signal terminals, the display chip connection portion includes a plurality of non-touch signal terminals, the plurality of non-touch signal terminals are located between the plurality of first touch sensing signal terminals and the plurality of second touch sensing signal terminals, and the plurality of non-touch signal terminals include the plurality of power signal terminals; The touch chip connection part includes a plurality of third touch sensing signal terminals and a plurality of fourth touch sensing signal terminals, the plurality of touch sensing signal lines include a plurality of first touch sensing signal lines and a plurality of second touch sensing signal lines, the plurality of third touch sensing signal terminals are respectively connected to the plurality of first touch sensing signal terminals through the plurality of first touch sensing signal lines, and the plurality of fourth touch sensing signal terminals are respectively connected to the plurality of second touch sensing signal terminals through the plurality of second touch sensing signal lines.

6. The flexible circuit board according to claim 5, characterized in that: The flexible circuit board has a first wiring layer and a second wiring layer stacked in a thickness direction, and the plurality of first touch sensing signal lines and the plurality of second touch sensing signal lines are located in the first wiring layer and the second wiring layer.

7. The flexible circuit board according to claim 6, characterized in that: The touch chip connection portion includes a first touch chip connection portion and a second touch chip connection portion, wherein the first touch chip connection portion and the second touch chip connection portion are used to respectively connect different touch chips; The plurality of third touch sensing signal terminals include a plurality of first terminals belonging to the first touch chip connection portion, and the plurality of fourth touch sensing signal terminals include a plurality of second terminals belonging to the first touch chip connection portion; The plurality of first touch sensing signal lines include a plurality of first signal lines respectively connected to the plurality of first terminals; The plurality of second touch sensing signal lines include a plurality of second signal lines respectively connected to the plurality of second terminals; In the second direction, a distance between the second touch chip connection portion and the display chip connection portion is smaller than a distance between the first touch chip connection portion and the display chip connection portion.

8. The flexible circuit board according to claim 7, characterized in that: The flexible circuit board has a staggered wiring area, in which the plurality of first touch sensing signal lines and the plurality of second touch sensing signal lines include a plurality of first layer signal lines located in the first wiring layer and a plurality of second layer signal lines located in the second wiring layer; In the staggered wiring area, in a direction perpendicular to the plane of the flexible circuit board, there is a second-layer signal line between any two adjacent first-layer signal lines, and there is a first-layer signal line between any two adjacent second-layer signal lines.

9. The flexible circuit board according to claim 8, characterized in that: The staggered wiring area includes a first staggered wiring area, in which the plurality of first signal lines are located in the first wiring layer, and the plurality of second signal lines are located in the second wiring layer; In the first interlaced wiring area, in a direction perpendicular to the plane where the flexible circuit board is located, any two adjacent first signal There is one second signal line between any two adjacent second signal lines, and there is one first signal line between any two adjacent second signal lines.

10. The flexible circuit board according to claim 9, characterized in that: The plurality of third touch sensing signal terminals include a plurality of third terminals belonging to the second touch chip connection portion; The plurality of first touch sensing signal lines include a plurality of third signal lines respectively connected to the plurality of third terminals; The staggered wiring area includes a second staggered wiring area, in which the plurality of first signal lines are located in the first wiring layer, and the plurality of third signal lines are located in the second wiring layer; In the second staggered wiring area, in a direction perpendicular to the plane where the flexible circuit board is located, there is one third signal line between any two adjacent first signal lines, and there is one first signal line between any two adjacent third signal lines.

11. The flexible circuit board according to claim 10, characterized in that: The plurality of fourth touch sensing signal terminals include a plurality of fourth terminals belonging to the second touch chip connection portion; The plurality of second touch sensing signal lines include a plurality of fourth signal lines respectively connected to the plurality of fourth terminals.

12. The flexible circuit board according to claim 9, characterized in that: The plurality of third touch sensing signal terminals include a plurality of third terminals belonging to the second touch chip connection portion; The plurality of first touch sensing signal lines include a plurality of third signal lines respectively connected to the plurality of third terminals; The plurality of fourth touch sensing signal terminals include a plurality of fourth terminals belonging to the second touch chip connection portion; The plurality of second touch sensing signal lines include a plurality of fourth signal lines respectively connected to the plurality of fourth terminals.

13. The flexible circuit board according to claim 12, characterized in that: In the second direction, the capacitor device region is located on a side of the plurality of fourth signal lines away from the plurality of second signal lines; In the first direction, the capacitive device region is located on a side of the plurality of fourth signal lines away from the plurality of third signal lines.

14. The flexible circuit board according to claim 12, characterized in that: The flexible circuit board has a cross wiring area, in which a plurality of touch sensing signal lines and at least part of the plurality of power signal lines are vertically cross-arranged, and the plurality of touch sensing signal lines include at least part of the plurality of first touch sensing signal lines and the plurality of second touch sensing signal lines.

15. The flexible circuit board according to claim 12, characterized in that: The mainboard connection portion includes a plurality of display signal terminals, and the plurality of display signal terminals are respectively connected to a plurality of display signal lines; The plurality of display signal lines include a line-crossing portion extending along the second direction, and the line-crossing portion perpendicularly crosses the plurality of fourth signal lines.

16. The flexible circuit board according to claim 15, characterized in that: The plurality of first touch sensing signal lines include a first portion extending along the first direction, and the plurality of display signal lines include a second portion extending along the first direction, wherein the second portion is located between the display chip connecting portion and the first portion; The plurality of non-touch signal terminals include a plurality of display terminals, and the plurality of display terminals are electrically connected to a plurality of non-touch signal lines respectively.

17. The flexible circuit board according to claim 15 or 16, characterized in that: The plurality of display signal lines are mobile industry processor interface MIPI signal lines.

18. The flexible circuit board according to claim 16, characterized in that: The display chip connection portion includes a plurality of first touch driving signal terminals and a plurality of second touch driving signal terminals located on a side of the plurality of non-touch signal terminals away from the plurality of second touch sensing signal terminals; The display chip connection portion includes a plurality of third touch driving signal terminals and a plurality of fourth touch driving signal terminals located on a side of the plurality of non-touch signal terminals away from the plurality of first touch sensing signal terminals; The plurality of first touch driving signal terminals are connected to the first touch chip connecting portion through a plurality of first touch driving signal lines; The plurality of second touch driving signal terminals are connected to the second touch chip connecting portion through a plurality of second touch driving signal lines; The plurality of third touch driving signal terminals are connected to the first touch chip connecting portion through a plurality of third touch driving signal lines; The plurality of fourth touch driving signal terminals are connected to the second touch chip connecting portion through a plurality of fourth touch driving signal lines; In the second direction, the second portion is located between the plurality of first touch driving signal lines and the plurality of second touch driving signal lines.

19. An electronic device, characterized in that: include: The flexible circuit board according to any one of claims 1 to 18; A display chip, wherein the display chip is connected to a display chip connection portion of the flexible circuit board; A display panel, wherein the display panel is connected to the display chip; A touch chip is connected to the touch chip connecting portion of the flexible circuit board.

Images