Packaging assembly and assembling method therefor, and camera module

Abstract

Disclosed in the present invention are a packaging assembly and an assembling method therefor, and a camera module. The assembling method for the packaging assembly comprises the steps of a, providing a circuit board, wherein one side surface of the circuit board is provided with a plurality of circuit board pads, and implanting at least one solder ball into said circuit board pads; b, providing a chip, wherein the chip is provided with a plurality of chip pads, and implanting at least one gold ball into said chip pads; c, applying glue to the solder ball of the circuit board pads; and d, aligning the chip pads with the circuit board pads, and bonding and fixing the solder ball of the circuit board pads and the gold ball of the chip pads so as to connect the circuit board and the chip. By applying glue to fill a molten area formed by the gold ball and the solder ball, the packaging assembly is provided with the advantages of good conductivity, low overall weight, a small size, etc., so that the packaging assembly can be applied to camera module structures such as those with chip-based optical image stabilization, thereby effectively improving the adjustment precision of chip-based optical image stabilization.

Description

Packaging component, assembly method thereof, and camera module Technical Field

[0001] The present application relates to the technical field of camera modules, and further to a packaging component and an assembly method thereof, as well as a camera module assembled from the packaging component. Background Art

[0002] Camera modules are an indispensable component of smart electronic devices, including but not limited to smartphones, cameras, computers, and wearable devices. With the continuous development and popularization of various smart devices, the requirements for camera modules are also becoming increasingly higher.

[0003] In recent years, smart electronic devices have experienced rapid development, becoming increasingly thinner and lighter. To adapt to this trend, camera modules are increasingly required to be multifunctional, lightweight, and miniaturized. This allows electronic devices to be made thinner and meet the imaging requirements of camera modules. Therefore, camera module manufacturers are committed to designing and manufacturing camera modules that meet these requirements.

[0004] Taking smartphones as an example, as their bodies become increasingly thinner and lighter, the camera modules are also required to be gradually thinner and lighter. Camera modules primarily consist of an optical lens and a chip package. The height of the optical lens is currently difficult to optimize, so the thinness of the camera module depends primarily on the size of the chip package. Currently, to improve the imaging quality of camera modules, the size of the chip's imaging surface is rapidly increasing. However, to meet the trend of thinner and lighter smart devices, even with increased chip size, the overall camera module height is still limited. Furthermore, how to reduce the height and size of the chip package while increasing chip size is a key issue that needs to be addressed.

[0005] The camera module is an optical electronic device. Its chip packaging assembly must not only consider the stability of the chip circuit conductivity but also ensure its structural stability. After the chip and circuit board structure are connected, the stability of the connection between the chip and the circuit board must also be guaranteed. The chip and circuit board packaging assembly undergoes multiple reliability tests during the manufacturing process. Instability in the packaging assembly structure between the chip and the circuit board can cause the chip to fall off the circuit board during reliability testing, thereby undermining the stability of the packaging assembly structure. How to structurally ensure the stability of the connection between the chip and the circuit board is also a current issue that needs to be considered.

[0006] To sum up, when providing a chip and circuit board packaging structure that can achieve the miniaturization of its packaging component structure, it is also necessary to consider the stability of the packaging component structure and the chip conduction problem. It is necessary to consider the electrical, optical and structural aspects comprehensively, but these factors are obviously not taken into consideration in the existing technology.

[0007] Summary of the Invention

[0008] In response to the above problems, the present application provides a chip and circuit board packaging assembly structure, which can effectively solve some and / or most of the above problems while miniaturizing the overall structure of the packaging assembly.

[0009] One purpose of the present application is to provide a packaging component, an assembly method thereof, and a camera module, which has a simple structure and can ensure the miniaturization of the overall packaging component while assembling it in the camera module, thereby achieving a lightweight and thin camera module structure.

[0010] Another object of the present invention is to provide a packaging component, an assembly method thereof, and a camera module, which forms a conductive bonding area between the chip and the circuit board by bonding the gold ball fixed on the chip pad to the solder ball on the circuit board pad, thereby connecting the circuit board to the photosensitive chip.

[0011] Another object of the present application is to provide a packaging component, an assembly method thereof, and a camera module, which arranges a circuit board pad on the back of the circuit board, and arranges a solder ball on the circuit board pad using a steel screen printing process, so that the solder ball can be fixed on the circuit board pad to ensure stable conduction with the chip.

[0012] Another object of the present application is to provide a packaging component, an assembly method thereof, and a camera module, which coats glue on the circuit board pad so that the glue covers the solder ball to avoid oxidation of the solder ball and facilitates the melting of the solder ball and the gold ball.

[0013] Another object of the present application is to provide a packaging component, an assembly method thereof, and a camera module, which further extends the conductive circuit of the chip by setting a chip pad on the front of the chip and setting a gold ball on the chip pad so that the gold ball is connected to the chip pad, so as to facilitate connection with the circuit board.

[0014] Another object of the present application is to provide a packaging component, an assembly method thereof, and a camera module, which fills glue in the gap inside the conductive bonding area formed by the circuit board and the chip to make the connection between the chip and the circuit board more stable, prevent the chip from falling off the circuit board, and thus improve the reliability of the packaging component.

[0015] Another object of the present application is to provide a packaging component, an assembly method thereof, and a camera module, which opens a through-hole on a circuit board, wherein the chip is arranged on the circuit board and the effective area of ​​the chip corresponds to the through-hole of the circuit board. The surface of the effective area of ​​the chip is lower than the front surface of the circuit board, thereby effectively reducing the height of the packaging component.

[0016] Another object of the present application is to provide a packaging component, an assembly method thereof, and a camera module, which fixes the chip on the circuit board, mainly fixes the chip on the back of the circuit board, so that the effective area of ​​the chip is completely exposed in the through hole of the circuit board to ensure that the chip can receive most of the external light.

[0017] Another object of the present application is to provide a packaging component, an assembly method thereof, and a camera module, which can effectively prevent the electronic components from falling off by arranging electronic components on the circuit board, fixing the electronic components on the circuit board using a molding process, and molding the electronic components inside it.

[0018] Another object of the present application is to provide a packaging component, an assembly method thereof, and a camera module, which utilizes a molding process to form a molded portion on the circuit board. While covering the electronic component, the molded portion can form a color filter mounting position on its upper surface, thereby ensuring the accuracy of color filter installation.

[0019] Another object of the present application is to provide a packaging component, an assembly method thereof, and a camera module, which may also include a back molding portion formed on the back of the circuit board, with a gap between the back molding portion and the chip, and the back molding portion may further strengthen the structural strength of the packaging component.

[0020] Another object of the present application is to provide a packaging component, an assembly method thereof, and a camera module, which forms a chip anti-shake structure by setting the packaging component on a driving component, and combines the chip anti-shake structure with an optical lens to obtain a camera module structure with a large-stroke chip anti-shake.

[0021] In order to achieve the above objects, the technical solution adopted by the present invention is:

[0022] A packaging component includes a circuit board and a chip, wherein the circuit board has a through hole, and the chip is arranged corresponding to the circuit board through hole:

[0023] The circuit board has a plurality of circuit board pads, at least one solder ball is disposed on each of the circuit board pads, the chip has a plurality of chip pads, at least one gold ball is disposed on the chip pad, the chip pads correspond to the circuit board pads, and at least one gold ball is melted with at least one solder ball to form a conductive bonding area to conduct electricity between the circuit board and the chip;

[0024] There are gaps between the conductive bonding areas where the plurality of gold balls are melted with the solder balls, and the gaps are filled with glue.

[0025] In a specific embodiment, the gold ball and the solder ball are fixed by thermal compression bonding.

[0026] In a specific embodiment, the glue contains flux and covers the solder balls to slow down oxidation of the solder balls.

[0027] In a specific embodiment, the glue connects the circuit board and the chip and completely fills the gaps between the conductive bonding areas where the gold balls and the solder balls are melted.

[0028] In a specific embodiment, the glue is arranged around the through-hole of the circuit board and covers the solder pad of the circuit board, wherein the glue has a glue width, and the solder ball is arranged on the side of the midline of the glue width close to the through-hole of the circuit board, so that the glue can cover the solder ball inside it.

[0029] In a specific embodiment, the glue thickness is greater than the solder ball height, and the glue thickness is greater than or equal to 20 μm.

[0030] In a specific embodiment, an ink structure is provided on the circuit board, and the ink is respectively provided on both sides close to and away from the circuit board through-hole, wherein the ink is protrudingly provided on the circuit board pad and forms a groove, and the circuit board pad is at least partially accommodated in the groove.

[0031] In a specific embodiment, the solder ball is disposed on the circuit board pad, and the solder ball covers at least 80% of the area of ​​the circuit board pad, so that the solder ball is accommodated in the groove formed by the ink structure.

[0032] In a specific embodiment, the gold ball on the chip pad has a protrusion, wherein the protrusion extends into the interior of the solder ball on the circuit board pad to increase the contact area between the solder ball and the gold ball.

[0033] In a specific embodiment, the circuit board pads and the chip pads are arranged correspondingly, wherein the center distance between at least some adjacent circuit board pads is less than 150 μm.

[0034] In a specific embodiment, the package body further has a molding portion, which is integrally formed on the circuit board, wherein the molding portion includes a front molding portion and a back molding portion formed on the front and back sides of the circuit board.

[0035] In a specific embodiment, the back molding portion is disposed on the back side of the circuit board, and the back molding portion can be used to enhance the strength of the circuit board, wherein the lower surface of the back molding portion is lower than the back side of the chip.

[0036] In a specific embodiment, the front molding portion is arranged in a ring around the circuit board through hole, and the front surface of the circuit board where the circuit board pad is arranged is covered by the front molding portion.

[0037] In a specific embodiment, a camera module is further provided, characterized in that it includes:

[0038] lens motor; and

[0039] In the aforementioned packaging component, the lens motor is arranged on the upper surface of the packaging component so that external light can reach the interior of the packaging component through the lens motor.

[0040] A method for assembling a packaging component, comprising the steps of:

[0041] a: providing a circuit board, wherein a plurality of circuit board pads are provided on one surface of the circuit board, and implanting at least one solder ball into the circuit board pad;

[0042] b: providing a chip having a plurality of chip bonding pads, and implanting at least one gold ball into the chip bonding pads;

[0043] c. Applying glue to the solder balls on the solder pads of the circuit board;

[0044] d: Align the chip pads with the circuit board pads, and bond the solder balls on the circuit board pads to the gold balls on the chip pads to connect the circuit board and the chip.

[0045] In a specific embodiment, the glue in step c contains flux, and the glue is applied to the circuit board pad and covers the solder ball.

[0046] In a specific embodiment, step c specifically includes the steps of: applying the glue to the circuit board pad through a glue painting process, so that the solder ball is located on the side of the glue width midline close to the center of the circuit board, so that the glue covers the solder ball inside.

[0047] In a specific embodiment, the glue thickness is greater than the solder ball height.

[0048] In a specific embodiment, the step d specifically includes the steps of: fixing the solder balls of the circuit board pad and the gold balls of the chip pad by thermal compression bonding, so that at least one of the solder balls and at least one of the gold balls melt to form a conductive bonding area, and at the same time, the glue is filled in the gap of the conductive bonding area.

[0049] In a specific embodiment, the temperature of the hot-press bonding of the solder ball and the gold ball is controlled, and the bonding process is step-by-step heated with a first bonding temperature and a second bonding temperature, wherein the first bonding temperature is used for a relatively short time, and the second bonding temperature heating time is more than 5 times the first bonding temperature heating time, so that the glue fills the conductive bonding area between the chip and the circuit board.

[0050] In a specific embodiment, step d specifically includes: forming a protrusion on the gold ball of the chip pad, aligning it with the solder ball of the circuit board pad and extending the protrusion of the gold ball into the solder ball of the circuit board pad to increase the contact area between the solder ball and the gold ball.

[0051] In a specific embodiment, step a specifically includes the steps of depositing solder paste on the circuit board pad by screen printing, forming the solder paste into solder balls by reflow soldering and implanting them into the circuit board pad.

[0052] In a specific embodiment, step a specifically includes: protrudingly setting an ink structure on the circuit board and forming a groove, so that the circuit board pad is at least partially accommodated in the groove, and the solder ball covers at least 80% of the area of ​​the circuit board pad, so that the solder ball can be accommodated in the groove formed by the ink structure on the circuit board.

[0053] In a specific embodiment, step a also includes step a1: integrally forming a circuit board front molding portion on the front side of the circuit board, and integrally forming a circuit board back molding portion on the back side of the circuit board, so that the circuit board back molding portion is arranged on the outside of the circuit board pad.

[0054] In a specific embodiment, the step a further includes step a2: opening a through hole on the circuit board, the through hole passing through a central area of ​​the circuit board, and the front molding portion of the circuit board is annularly arranged around the through hole.

[0055] In a specific embodiment, it further includes step e: installing the color filter on the color filter installation position on the front molding portion of the circuit board to filter out stray light.

[0056] In a specific embodiment, a camera module is further provided, characterized in that it includes:

[0057] lens motor; and

[0058] The packaging assembly is manufactured by the packaging assembly assembly method described above, wherein the lens motor is arranged on the upper surface of the packaging assembly so that external light can reach the interior of the packaging assembly through the lens motor. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] The above and other purposes, features, and advantages of the present application will become more apparent through a more detailed description of the embodiments of the present application in conjunction with the accompanying drawings. The accompanying drawings are intended to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the drawings, the same reference numerals generally represent the same components or steps.

[0060] FIG1 is a schematic diagram of a common packaging component structure in the prior art of this application;

[0061] FIG2 is a schematic diagram of a specific embodiment of the packaging component structure provided by the present application;

[0062] FIG3 is a schematic diagram of another specific embodiment of the packaging component structure provided by the present application;

[0063] FIG4 is a partial schematic diagram of the conductive connection between the circuit board and the chip in the package assembly structure provided by the present application;

[0064] FIG5 is another partial schematic diagram of the conductive connection between the circuit board and the chip in the package assembly structure provided by the present application;

[0065] FIG6 is a schematic diagram of the structure of the stencil-printed solder ball process on the circuit board in this application;

[0066] FIG7 is a schematic diagram of the back structure of the circuit board in this application;

[0067] FIG8A is a partial schematic diagram of the assembly process of the packaging component in this application;

[0068] FIG8B is a partial schematic diagram of the packaging assembly process in the present application, wherein FIG8A and FIG8B show the complete steps of assembling the entire packaging assembly;

[0069] FIG9 is a partial schematic diagram of solder balls and glue on the back of the circuit board in this application;

[0070] FIG10 is a partial schematic diagram of the ink structure on the back of the circuit board in this application;

[0071] FIG11 is a schematic structural diagram of a camera module assembled using this packaging component structure in this application. DETAILED DESCRIPTION

[0072] The present invention will be further described below in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0073] Below, the present application is further described in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0074] In the description of this application, it should be noted that for directional words, such as the terms "center", "horizontal", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and so on, the directions and positional relationships indicated are based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific scope of protection of this application.

[0075] It should be noted that the terms "first", "second", etc. in the description and claims of this application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0076] The terms "comprises" and "having" and any variations thereof in the specification and claims of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus that includes a series of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, product or apparatus.

[0077] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections, contact connections, or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0078] As the most important electronic component in a camera module, the photosensitive chip converts external light signals into electrical signals, making it an indispensable element in the camera module. Typically, the chip is placed on the top surface of a circuit board, and a wire bonding process is used to connect the chip and the circuit board to ensure proper operation. However, as the requirements for camera module imaging quality increase, the chip size also increases accordingly, and the corresponding size of the circuit board on which the chip is mounted also increases. Furthermore, stacking the chip and circuit board vertically results in a larger height dimension, which is inconsistent with the current trend of thinner and lighter camera module structures.

[0079] The present application provides a chip packaging assembly 10. In order to improve the imaging quality of the camera module, the size of the chip is increased accordingly, and the size of the corresponding circuit board connected to the chip also needs to be increased. In order to reduce the size of the chip and the circuit board after packaging, the structure of the circuit board and the chip is also improved accordingly. Specifically, in the present application, the chip size is greater than / or equal to 1 / 1.7 inches. As shown in Figures 2 and 3, the chip 301 includes an active area 321 and an inactive area 322, wherein the active area 321 is located in the middle of the chip 301 and the inactive area 322 is located at the edge of the chip 301. The size of the circuit board 201 is larger than that of the chip 301. Furthermore, a corresponding through hole 213 is provided in the middle of the circuit board 201. The size of the circuit board through hole 213 is greater than or equal to the size of the effective area 321 of the chip 301, that is, the effective area 321 of the chip is exposed in the through hole 213 formed in the circuit board 201, and the inactive area 322 of the chip 301 is connected to the circuit board 201.

[0080] Specifically, the circuit board 201 and the chip 301 need to be connected to each other. The end surface of the circuit board 201 that contacts the chip 301 is defined as the circuit board back surface 212, and the end surface of the circuit board 201 that is away from the chip 301 is defined as the circuit board front surface 211. In the present application, the circuit board through hole 213 passes through the circuit board front surface 211 and the circuit board back surface 212, and the circuit board pad 221 is arranged on the circuit board back surface 212 around the circuit board through hole 213. The circuit board pad 221 can be arranged on at least one side of the through hole 213, or, depending on the need for connection, the circuit board pad 221 can be arranged on all four sides of the through hole 213. No specific limitation is made here. Furthermore, the end surface of the chip 301 in contact with the circuit board 201 is defined as the chip front side 311, and the end surface of the chip 301 away from the circuit board 201 is defined as the chip back side 312, wherein the chip pad 331 is arranged on the chip front side 311, and the chip pad 331 is arranged in the non-active area 322 of the chip.

[0081] When the chip 301 is placed in the through-hole 213 of the circuit board, the chip active area 321 is exposed in the circuit board through-hole 213. Furthermore, in the portion of the circuit board back surface 212 that contacts the chip inactive area 322, the circuit board pads 221 and the chip pads 331 are adapted to each other. That is, the circuit board pads 221 on the circuit board back surface 212 and the chip pads 331 on the chip front surface 311 are in a one-to-one correspondence, thereby enabling electrical connection between the circuit board 201 and the chip 301. Direct contact between the circuit board pads 221 and the chip pads 331 does not guarantee stable electrical connection between the two. To further ensure stable electrical connection between the chip 301 and the circuit board 201, other methods are needed to ensure stable electrical connection between the chip 301 and the circuit board 201.

[0082] The present application also provides a method for conducting electricity between the chip 301 and the circuit board 201. As shown in Figures 4 and 5, in a specific embodiment, when the chip 301 is placed in the through-hole 213 of the circuit board 201, the circuit board pad 221 on the back side 212 of the circuit board contacts the chip pad 331 on the front side 311 of the chip. To ensure efficient electricity conduction between the chip 301 and the circuit board 201, materials with good conductivity, such as copper and gold, are preferably selected. In the present application, gold balls 332 are preferably used to conduct electricity between the chip 301 and the circuit board 201. Specifically, the gold ball 332 is implanted on the chip pad 331 so that one end of the gold ball 332 contacts the chip 301 and the other end of the gold ball 332 contacts the circuit board pad 221. The gold ball 332 serves as an intermediate medium for the circuit board 201 and the chip 301 to be conductive, so that the chip 301 and the circuit board 201 are conductive.

[0083] Furthermore, although the gold ball 332 has good electrical conductivity, so that the chip 301 is conductive with the circuit board 201, the circuit board pad 221 is generally set to metal copper, and copper and gold are not fusible, so that the chip 301 is easy to fall off the circuit board 201. In order to ensure good conduction between the chip 301 and the circuit board 201 and a stable connection. In this application, a method for stably conducting the chip 301 and the circuit board 201 is provided. Specifically, a SN-AU (tin-gold) compound is used for conduction, a tin ball 222 is set on the circuit board pad 221, and the gold ball 332 is implanted on the chip pad 331, so that the tin ball 222 on the circuit board 201 is in contact with the gold ball 332 on the chip 301, so as to effectively ensure the circuit conduction between the circuit board 201 and the chip 301.

[0084] Specifically, the gold ball 332 on the chip 301 and the solder ball 222 on the circuit board 201 fuse together, forming a tin-gold compound layer 223 at the contact point between the gold ball 332 and the solder ball 222. The tin-gold compound layer 223 is a compound formed by gold and tin under thermal conditions, and is bonded to the solder ball 222 on the circuit board pad 221 and the gold ball 332 on the chip pad 331 to ensure the stability of the connection between the chip 301 and the circuit board 201. In a specific embodiment, after the solder ball 222 on the circuit board pad 221 and the gold ball 332 on the chip pad 331 fuse together, the chip 301 and the circuit board 201 are electrically connected to form a conductive bonding area. Multiple tin-gold compound layers 223 may be formed within the conductive bonding area. An intermediate material layer is formed at the connection between the solder ball 222 and the gold ball 332 to assist the solder ball 222 and the gold ball 332 in melting, thereby preventing the gold ball 332 and the solder ball 222 from being difficult to fuse due to different chemical properties, thereby preventing the chip 301 from falling off the circuit board 201.

[0085] Furthermore, to ensure a more stable connection between the chip 301 and the circuit board 201, it is necessary to further increase the contact area between the gold ball 332 on the chip 301 and the solder ball 222 on the circuit board 201. The chip pad 331 is typically made of gold, so that when the gold ball 332 is implanted on the chip pad 331, the gold ball 332 and the chip pad 331 are well fused. Specifically, the gold ball 332 has a protrusion that faces toward the circuit board pad 221. The protrusion of the gold ball 332 on the chip 301 extends into the solder ball 222 on the circuit board pad 221, thereby increasing the contact area between the solder ball 222 and the gold ball 332. In order to fuse the solder ball 222 on the circuit board with the gold ball 332 on the chip, a corresponding soldering flux is provided at the middle position where the two contact each other. Rosin can be selected as the soldering flux. Its main function is to prevent the solder ball from oxidizing when the tin powder melts into the solder ball, so that the solder ball 222 on the circuit board pad 221 and the gold ball 332 on the chip pad 331 can be better melted, and the stability of the electrical conduction between the circuit board 201 and the chip 301 can be ensured.

[0086] In the present application, as shown in FIG4 and FIG5, the gold ball 332 is implanted on the chip pad 331 so that it is melted with the solder ball 222 provided on the circuit board pad 221. However, the contact area between the solder ball 222 and the gold ball 332 is limited. In the subsequent reliability process, the chip 301 is easy to fall off from the circuit board 201, which does not meet the reliability requirements. To further enhance the stability of the connection between the circuit board 201 and the chip 301, glue 232 is used to fill the gaps between the solder balls 222 on the circuit board 201 and the gold balls 332 on the chip 301 at the connection between the circuit board 201 and the chip 301. The glue 232 connects the circuit board 201 and the chip 301. In some optional embodiments, the glue 232 completely fills the gaps between the conductive bonding areas where the gold balls 332 and the solder balls 222 fuse. This complete filling means that the glue fills at least 80% of the gaps in the conductive bonding areas. The height of the glue 232 is greater than the height of the solder balls 222, so that the solder balls 222 are covered within the glue 232, thereby preventing the solder balls 222 from contacting the outside air and preventing oxidation. The glue 232 contains flux to fully melt the solder balls 222 and the gold balls 332 . At the same time, the circuit board 201 and the chip 3012 are in full contact with the glue 232 . Due to the viscosity of the glue 232 itself, the stability of the connection between the circuit board 201 and the chip 301 is enhanced.

[0087] In a specific example, if only the solder balls 222 on the circuit board 201 are melted with the gold balls 332 on the chip 301, although the chip 301 can be effectively connected, the simulation model shows that the thrust that the bonding area between the chip 301 and the circuit board 201 can withstand is approximately 0.7 kg, which does not meet the reliability requirements. In this application, by adding glue 232 to the bonding area between the chip 301 and the circuit board 201, the adhesive force of the glue 232 is used to enhance the stability of the connection between the circuit board 201 and the chip 301, and the thrust that the bonding area between the chip 301 and the circuit board 201 can withstand is increased to 2.7 kg, meeting the reliability requirements of the camera module packaging assembly 10 design.

[0088] Furthermore, glue 232 is provided in the area where the chip 301 is bonded to the circuit board 201. The specific model of the glue 232 can be selected according to the actual design and is not subject to corresponding restrictions here. The setting method of the glue 232 in this application can adopt a glue drawing process. The glue 232 is provided around the circuit board through-hole 213 and covers the circuit board pad 221, wherein the glue 232 has a glue drawing width, and the solder ball 222 is provided on the side of the midline of the glue drawing width close to the circuit board through-hole 213, so that the glue 232 can cover the solder ball 222 inside it. The specific glue drawing width refers to the width area when the glue 232 is applied to the circuit board 201, generally referring to the glue width in the direction extending from the circuit board through-hole 213 to the outer edge of the circuit board. Specifically, due to the limited spatial position of the connection between the circuit board 201 and the chip 301, the needle diameter of the glue selected in this application is 0.01 mm, and the width of the glue is less than or equal to 20 μm. At the same time, during the process of fixing the glue 232, if the temperature is not controlled accordingly, the glue 232 will trap air during the sudden temperature rise, resulting in insufficient bonding area between the chip 301 and the circuit board 201. Therefore, it is also necessary to control the temperature to meet the bonding step temperature rise, control the temperature of the hot pressing bonding of the solder ball and the gold ball, and step-by-step heat rise the bonding process with the first bonding temperature and the second bonding temperature, wherein the first bonding temperature is a relatively low temperature, the temperature range is between 100℃-200℃, and the heating time is relatively short, so that the glue 232 reduces bubbles and increases the bonding area between the glue 232 and the circuit board 201 and the chip 301, thereby increasing the bonding force. The second bonding temperature range is between 200℃-300℃, and the heating time is more than 5 times the heating time of the first bonding temperature, so that the glue is filled in the conductive bonding area between the chip and the circuit board, so that the glue 232 can completely cover the bonding area between the chip and the circuit board.

[0089] Specifically, the chip 301 and the circuit board 201 each have pads, particularly the chip pad 331, which is relatively small (generally invisible to the naked eye but visible with the aid of a suitable instrument). Implanting the gold ball 332 onto the chip pad 331 requires the use of special processes, such as laser ball placement, laser ball placement, stencil printing + reflow soldering, or stencil printing. Furthermore, in this application, the stencil printing process can be used to implant the gold ball 332 onto the chip pad 331, thereby achieving electrical connection between the chip 301 and the circuit board 201 and ensuring the normal operation of the chip 301.

[0090] Furthermore, corresponding solder balls 222 need to be provided on the circuit board pads 221. The gold balls 332 on the chip fuse with the solder balls 222 on the circuit board 201, so that the circuit board 201 and the chip 301 are electrically connected. Since the size of the circuit board pads 221 is also relatively small, a special process is also required to implant the solder balls 222 on the circuit board 201. Specifically, in the present application, corresponding solder balls 222 need to be provided on the circuit board pads 221, and the solder balls 222 should contact the circuit board pads 221 as much as possible to ensure the stability of the connection of the solder balls 222 on the circuit board 201. Preferably, in order to ensure good contact of the solder balls 222 on the circuit board pads 221, the present application chooses to use the steel mesh printing process, that is, the printing direction of the steel mesh 90 is consistent with the arrangement direction of the circuit board pads 221, which can reduce the occurrence of bridging / insufficient soldering.

[0091] Specifically, the circuit board 201 is provided with an ink structure 231, which is respectively provided on both sides near and away from the circuit board through-hole 213. The ink is provided protrudingly on the circuit board pad 221 and forms a groove, and the circuit board pad 221 is at least partially accommodated in the groove. Furthermore, in this embodiment, the chip 301 is fixed to the back of the circuit board 201. In order to accurately identify the center of the circuit board 201 and ensure that the chip 301 is accurately installed on the circuit board 201, in another feasible embodiment, a corresponding ink layer is also provided on the back of the circuit board 212 to identify the center of the circuit board 201, so that the center of the chip 301 installed on the circuit board 201 is consistent with the center of the circuit board 201.

[0092] Specifically, to match the dimensions of the circuit board 201 in this application, as shown in FIG6 , the openings of the steel mesh 90 can be designed with a diameter of 70 μm and a thickness of 30 μm. In other embodiments, the design can be made according to the dimensions of the actual product, as long as it is ensured that the phenomenon of bridging tin or insufficient tin does not occur. In particular, in order to prevent the adhesion between the solder paste and the surface of the steel mesh 90 from forming resistance to the connection between the solder ball 222 and the circuit board 201 and affecting the transfer amount of solder paste, the design of the steel mesh 90 needs to meet certain requirements. For example, in this application, the pores of the steel mesh 90 can be a rectangular parallelepiped structure. The specific dimensional parameters of the steel mesh 90 can be determined according to the actual product structure and are not described here.

[0093] In the present application, the main material of the circuit board pad 221 is gold, and the main material of the tin ball 222 implanted on the circuit board is tin. Since tin and gold are two materials with different properties, the performance of these two materials will be unstable as the external environment changes. For example, the tin ball 222 is easily oxidized when exposed to the air for a long time. In order to improve this situation, in the present application, flux is added to the solder paste so that the tin ball 222 and the circuit board pad 221 can be better melted. Among them, the main component of the flux is rosin, which prevents the tin ball 222 from being oxidized when the tin powder is melted into the tin ball. The flux is directly added to the solder paste, and the reflow soldering process is used when the solder paste is melted into the tin ball 222. It is worth mentioning that the glue also contains flux. Applying the glue to the circuit board pad 221 and covering the tin ball 222 can also prevent the tin ball 222 from oxidizing.

[0094] Furthermore, as shown in FIG7 , during the connection process between the circuit board pads 221 and the chip 301, the circuit board 201 needs to be heated. Due to temperature fluctuations, the material of the circuit board 201 itself can deform, resulting in inaccurate centering of the circuit board 201 during the subsequent assembly process. This can cause deviations in the position of the chip 301 installed on the circuit board 201 and prevent alignment between the circuit board pads 221 and the chip pads 331, leading to unstable connection between the circuit board 201 and the chip 301. Increasing the amount of copper in the circuit board 201 reduces the deformation of the circuit board 201 during the connection process due to its relatively stable properties and minimal expansion and contraction under the influence of temperature, thereby improving the accuracy of the chip 301 installation on the circuit board 201. Furthermore, increasing the copper content of the circuit board 201 can also reduce the deformation of the circuit board through-holes 213.

[0095] In the present application, as shown in Figures 6 and 7, the tin balls 222 are mainly set on the circuit board pads 221 by using a steel screen printing process. Compared with the conventional solution (there is a solder mask between each pad, and the gap between the solder mask is greater than 150μm), in order to reduce the size occupied by the circuit board 201 part, the gap between the circuit board pads 221 in this solution is less than 40μm, so the use of a conventional printing process will cause problems such as bridging tin. In this solution, the tin balls 222 are set on the circuit board pads 221 by a steel screen printing process. In addition to limiting the size design of the steel mesh 90 (the specific size of the steel mesh 90 can be referred to the description above), it is also necessary to set a solder mask between the circuit board pads 221, wherein the width of the solder mask is greater than or equal to the width of the gap between two adjacent pads on the circuit board. Furthermore, the solder resist applied between the circuit board pads 221 is incompatible with the solder paste itself. Subsequent heating or other special processes can eliminate the solder resist between the circuit board pads 221, thereby preventing problems such as solder bridging between the circuit board pads 221. This solution effectively reduces the area of ​​the chip-to-circuit board bonding area and improves bonding accuracy, thereby meeting the miniaturization requirements of the package assembly 10.

[0096] In a specific example, the coverage area of ​​the solder ball 222 accounts for more than 80% of the area of ​​the circuit board pad 221, so as to increase the contact area between the solder ball 222 and the circuit board pad 221, and reduce the possibility of the solder ball 222 falling off the circuit board pad 221. It can be understood that the amount of tin set on the circuit board pad 221 and the transfer rate of the solder paste are limited by the size of the steel mesh 90. Based on this problem, the size of the circuit board pad 221 should also be restricted accordingly. Under the size of the chip 301 provided in this solution, the maximum length of the circuit board pad 221 is 75μm, and the preferred diameter of the solder ball 222 is greater than or equal to 60μm, so as to meet the requirement of melting the solder ball 222 and the circuit board pad 221. Through the above-mentioned steel screen printing process, the solder ball 222 is set on the circuit board pad 221, and the gold ball 332 is set on the chip pad 331. The gold ball 332 on the chip 301 is melted with the solder ball 222 on the circuit board 201, so as to achieve circuit conduction between the circuit board 201 and the chip 301.

[0097] The present application also provides a package assembly 10 structure after the chip 301 is electrically connected to the circuit board 201, as shown in Figures 3 and 4. The package assembly 10 further includes a molded portion 501, a color filter 601, and a plurality of electronic components 401. After the circuit board 201 is electrically connected to the chip 301, corresponding molded portions 501 are provided on the front surface 211 and the back surface 212 of the circuit board to enhance the strength of the circuit board 201. The electronic components 401 and the like can be provided on the front surface 211 and / or the back surface 212 of the circuit board. The electronic components 401 can be enclosed within the molded portion 501. The color filter 601 is provided directly above the chip 301, wherein the color filter 601 covers the chip active area 321 to filter out stray light. In a specific embodiment, the molding part 501 can form a color filter mounting position 531, and the color filter mounting position 531 is set on the upper end surface of the molding part 501, wherein when the color filter 601 is set on the color filter mounting position 531, the color filter 601 covers the chip effective area 321.

[0098] Furthermore, the circuit board 201 has a through-hole 213 extending through the middle thereof. The chip 301 is disposed on the circuit board 201, and the active area 321 of the chip 301 corresponds to the circuit board through-hole 213. The circuit board pads 221 are disposed on the back side 212 of the circuit board, surrounding the circuit board through-hole 213. The chip pads 331 are disposed on the chip's inactive area 322 and located on the front side 311 of the chip. When the chip 301 is disposed on the back side of the circuit board 201, the chip pads 331 correspond one-to-one with the circuit board pads 221, thereby establishing electrical connection between the chip 301 and the circuit board 201. The specific method of electrical connection between the chip 301 and the circuit board 201 has been described in detail above and will not be repeated here. In a specific embodiment, after the chip 301 is connected to the circuit board 201 , in order to ensure the stability of the overall structure, glue 232 is provided in the bonding area between the circuit board 201 and the chip 301 to prevent the chip 301 from falling off the circuit board 201 .

[0099] Specifically, except for the chip-to-circuit board bonding area, other areas of the circuit board backside 212 can be coated using a molding process to enhance the strength of the circuit board backside 212. The portion of the circuit board backside 212 formed using the molding process can be referred to as a circuit board backside molding portion 512. The circuit board backside molding portion 512 is disposed around the circuit board through-hole 213 and has certain size restrictions. Furthermore, the bottom surface of the circuit board backside molding portion 512 can be configured to be flush with the chip backside 312 to provide protection for the chip 301. In a specific example, a first mounting area 214 exists between the inner edge of the circuit board back molding 512 and the edge of the through-hole fixed to the circuit board back 212. A first gap 215 exists between the inner edge of the circuit board back molding 512 and the outer edge of the chip 301 fixed to the circuit board back 212, i.e., the distance between the circuit board back molding 512 and the edge of the chip 301. At least a portion of the circuit board front 211 corresponding to the first mounting area 214 is covered by the front molding 511 to provide a smooth mounting surface for bonding and conduction. At the same time, the first mounting area 214 is used for applying glue, and the first gap width is ≤0.4mm. The first gap 215 is mainly used for subsequently coating glue 232 on the bonding area between the circuit board 201 and the chip 301, so as to better accommodate the overflow of the glue 232 when the chip 301 is fixed on the circuit board 201 by a bonding method. At the same time, it can also reduce the collision or extrusion of the back molding part 512 and / or the circuit board 201 on the chip 301 during the subsequent baking or collision process of the packaging component 10.

[0100] In this application, the molded portion 501 disposed on the front surface 211 of the circuit board may be referred to as the circuit board front molded portion 511. The circuit board front molded portion 511 is disposed on the circuit board front surface 211, wherein the electronic components 401 are arranged on the circuit board front surface 211. In a specific embodiment, the electronic components 401 may be disposed around the periphery of the circuit board through-hole 213. Furthermore, the circuit board front molded portion 511 may enclose the electronic components 401 within itself to provide corresponding protection for the electronic components 401 while improving the flatness of the package assembly 10. The circuit board front molded portion 511 may form a color filter mounting position 531 around the circuit board through-hole 213. The color filter mounting position 531 is disposed around the circuit board through-hole 213, wherein the upper surface of the color filter mounting position 531 is lower than the upper surface of the circuit board front molded portion 511, i.e., a step is formed around the circuit board through-hole 213.

[0101] Furthermore, the step portion may include a first step portion 521 and a second step portion 522. The upper surface of the first step portion 521 may be used to support components such as a motor or an optical lens, and the second step portion 522 may serve as a color filter mounting position 531, which is mainly used to mount the color filter 601. Specifically, the surface of the first step portion 521 is higher than the surface of the second step portion 522. The first step portion 521 covers the electronic component 401, and the second step portion 522 may serve as the color filter mounting position 531. The height of the second step portion 522 may be 0.1 mm. When the color filter 601 is mounted on the color filter mounting position 531, the color filter 601 can be placed directly above the chip 301. The upper surface of the color filter 601 mounted on the color filter mounting position 531 is lower than the upper surface of the first step 521. In another embodiment, the upper surface of the color filter 601 mounted on the color filter mounting position 531 is flush with the upper surface of the first step 521. Preferably, in a specific embodiment, the upper surface of the color filter 601 can be lower than the upper surface of the first step 521. This arrangement can reduce the height of the packaging component 10 while also providing protection for the color filter.

[0102] The packaging component 10 structure formed in the present application, as shown in Figures 2 and 3, is formed by setting a through hole 213 in the middle of the circuit board 201, setting the circuit board pad 221 on the back side 212 of the circuit board, and setting the chip 301 on the back side 212 of the circuit board and conducting with the circuit board 201 to ensure the normal operation of the chip 301. Furthermore, in order to prevent the chip 301 from falling off from the back side 212 of the circuit board, glue 232 is set in the bonding area between the circuit board 201 and the chip 301 to increase the stability of the connection between the circuit board 201 and the chip 301. In order to enhance the strength of the overall structure after the circuit board 201 and the chip 301 are conducted, corresponding molding parts 501 are respectively set on the front side 211 and the back side 212 of the circuit board. The molding part 501 covers the electronic component 401 therein to form a protective effect on the electronic component 401. The electronic component 401 is disposed on the front surface 211 of the circuit board, and the circuit board front molded portion 511 encloses the electronic component 401 within its interior. The circuit board front molded portion 511 forms a color filter mounting position 531 around the circuit board through-hole 213, upon which the color filter 601 can be mounted. The orthographic projection of the color filter 601 overlaps with the active area 321 on the chip 301, thereby filtering the light reaching the chip 301. The package assembly 10 structure formed by the above method not only ensures the stability of the conductive connection between the chip 301 and the circuit board 201, but also achieves miniaturization of the overall package assembly 10 structure.

[0103] The present application also provides an assembly method of the packaging component 10, as shown in Figures 8A and 8B, including the following steps: a: providing a circuit board 201, wherein a plurality of circuit board pads 221 are provided on one side surface of the circuit board 201, and at least one tin ball 222 is implanted into the circuit board pad 221; b: providing a chip 301, wherein a plurality of chip pads 331 are provided on the chip 301, and at least one gold ball 332 is implanted into the chip pad 331; c: applying glue 232 to the tin ball 222 of the circuit board pad 221; d: aligning the chip pad 331 with the circuit board pad 221, and bonding and fixing the tin ball 222 of the circuit board pad 221 and the gold ball 332 of the chip pad 331 to conduct electricity between the circuit board 201 and the chip 301. Among them, step b and step c are not prioritized, that is, step b can be performed first and then step c, or step c can be performed first and then step c, or step b and step c can be performed simultaneously.

[0104] It is understood that in some embodiments, after a plurality of solder balls 222 are implanted into the circuit board pads 221, glue 232 is first applied to the solder balls 222, and then the gold balls 332 are implanted into the chip pads 331. The chip pads 331 are then aligned with the circuit board pads 221, and the solder balls 222 and the gold balls 332 are bonded and fixed to provide electrical connection between the circuit board 201 and the chip 301. In other embodiments, after a plurality of solder balls 222 are implanted into the circuit board pads 221, the gold balls 332 are first implanted into the chip pads 331, and then glue 232 is applied to the solder balls 222. The chip pads 331 are then aligned with the circuit board pads 221, and the solder balls 222 and the gold balls 332 are bonded and fixed to provide electrical connection between the circuit board 201 and the chip 301. In other embodiments, the gold ball 332 is implanted into the chip pad 331 and the glue 232 is applied to the solder ball 222 simultaneously, and / or the gold ball 332 is implanted into the chip pad 331 and the solder ball 222 is implanted into the circuit board pad 221 simultaneously, and then the chip pad 331 and the circuit board pad 221 are aligned, and the solder ball 222 and the gold ball 332 are bonded and fixed to conduct the circuit board 201 and the chip 301, thereby shortening the working time and improving the assembly efficiency.

[0105] In particular, in the embodiment of the present application, the glue 232 in step c contains flux, the glue 232 is applied to the circuit board pad 221 and covers the solder ball 222, the solder ball 222 is encapsulated in the glue 232, and the flux in the glue 232 can prevent the solder ball 222 from being oxidized by being exposed to the air for a long time, and is conducive to the melting of the solder ball 222 and the gold ball 332.

[0106] Furthermore, as shown in FIG9 , step c specifically includes the steps of: eccentrically applying the glue 232 to the pad 221 of the circuit board through a glue painting process, so that the solder ball 222 is located on the side of the center line of the glue painting width close to the center of the circuit board 201; when the circuit board 201 and the chip 301 are assembled, the glue 232 is squeezed and overflows; since the glue painting center line of the glue 232 is closer to the outside of the circuit board 201 than the solder ball 222, combined with the ink 231 arranged near the side of the through hole 213 of the circuit board, the risk of the glue 232 overflowing and contaminating the effective area 321 of the chip 301 is reduced, and the glue 232 is caused to overflow to the outside of the chip 301. It is worth mentioning that the thickness of the glue 232 is greater than the height of the solder ball 222, so that the glue 232 covers the solder ball 222 inside, thereby preventing the solder ball 222 from oxidizing, which is conducive to the solder ball 222 bonding with the gold ball 332 to form a tin-gold compound 223, thereby conducting the circuit board 201 and the chip 301.

[0107] Furthermore, step d specifically includes the steps of: fixing the solder balls 222 of the circuit board pads 221 and the gold balls 332 of the chip pads 331 by thermocompression bonding, so that at least one of the solder balls 222 and at least one of the gold balls 332 fuse to form a conductive bonding area, and simultaneously filling the gap in the conductive bonding area with the glue 232, thereby bonding the circuit board 201 and the chip 301, thereby increasing the ability of the package assembly 10 to withstand external forces, reducing the risk of the chip 301 falling off, and improving the reliability of the package assembly 10. It is understood that the flux in the glue 232 helps the solder balls 222 and the gold balls 332 fuse and prevents oxidation of the solder balls 222, thereby improving the conductivity between the circuit board 201 and the chip 301. It is worth noting that during the thermocompression bonding process, the glue 232 reduces the fluidity of the tin, helping to prevent the occurrence of bridging.

[0108] In particular, the temperature of the hot-press bonding between the solder ball 222 and the gold ball 332 is controlled, and the bonding process is stepped up using a first bonding temperature and a second bonding temperature. The first bonding temperature is maintained for a relatively short time, while the second bonding temperature is maintained for at least five times the time of the first bonding temperature. Specifically, the first bonding temperature is 100-200°C for a duration of no more than 1 second to reduce the generation of bubbles in the glue 232, increase the bonding area between the glue 232 and the circuit board 201 and the chip 301, and allow the glue 232 to fill the conductive bonding area between the chip 301 and the circuit board 201, thereby increasing the bonding strength. The second bonding temperature is 200-300°C for a duration of 5-30 seconds to enhance the curing of the glue 232, thereby reliably bonding the circuit board 201 and the chip 301 and improving the reliability of the package assembly 10.

[0109] Furthermore, step d specifically includes: forming a protrusion on the gold ball 332 of the chip pad 331, aligning it with the solder ball 222 of the circuit board pad 221, and extending the protrusion of the gold ball 332 into the solder ball 222 of the circuit board pad 221 to increase the contact area between the solder ball 222 and the gold ball 332, thereby improving the reaction rate of the solder ball 222, so that the solder ball 222 and the gold ball 332 are reliably bonded, thereby improving the conductivity between the circuit board 201 and the chip 301.

[0110] Specifically, step a includes depositing solder paste on the circuit board pads 221 by stencil printing, i.e., aligning the printing direction of the stencil 90 with the arrangement direction of the circuit board pads 221 to reduce the occurrence of bridging or insufficient soldering. Reflowing the solder paste into solder balls 222 and implanting them into the circuit board pads 221 prevents oxidation of the solder balls 222 and reduces bending and deformation of the circuit board 201.

[0111] Specifically, as shown in FIG10 , step a includes protruding an ink structure 231 on the circuit board 201 and forming a groove, such that the circuit board pad 221 is at least partially accommodated within the groove, and the solder ball 222 covers at least 80% of the area of ​​the circuit board pad, so that the solder ball 222 is accommodated within the groove formed by the ink structure 231 on the circuit board 201. The ink structure 231 is disposed on both sides of the circuit board pad 221, near the circuit board through-hole 213 and away from the circuit board through-hole 213. It is understood that the stencil 90 is disposed on the circuit board 201, and the ink structure 231 is located between the stencil 90 and the circuit board 201, so that a gap exists between the stencil 90 and the circuit board 201. The thickness of the ink structure 231 is less than 15 μm, thereby preventing the solder balls 222 from overflowing from the gap between the stencil 90 and the circuit board 201, thereby preventing solder bridging.

[0112] Furthermore, step a also includes step a1: integrally forming a circuit board front molding portion 511 on the front of the circuit board 201, the circuit board front molding portion 511 covering the electronic components 401 disposed on the circuit board front 211, thereby improving the flatness of the package assembly 10; and integrally forming a circuit board back molding portion 512 on the back of the circuit board 201, such that the circuit board back molding portion 512 is disposed outside the circuit board pad 221, thereby providing a central position on the back of the circuit board 212 for mounting the chip 301. It is worth mentioning that, compared to molding the circuit board front molding portion 511 and the circuit board back molding portion 512 at the same time, molding the circuit board front molding portion 511 and the circuit board back molding portion 512 separately is conducive to reducing the difficulty of molding, avoiding defects such as under-injection in the molding runner cavity, and improving the flatness of the package assembly 10.

[0113] The step a also includes a step a2: opening a through hole 213 on the circuit board 201, wherein the through hole 213 passes through the central area of ​​the circuit board 201, and the front molding portion 511 of the circuit board is arranged in an annular manner around the through hole. It is understood that the size of the through hole 213 is larger than the size of the active area 321 of the chip 301, so that the active area 321 is completely exposed in the through hole 213. The farther the inner edge of the through hole 213 is from the active area 321 of the chip 301, the more conducive it is to reducing the risk of stray light and improving the imaging quality. Preferably, the through hole 213 is opened on the circuit board 201 by laser cutting, and ultrasonic cleaning is performed before bonding to reduce the cutting dust remaining in the through hole 213.

[0114] Furthermore, the assembly method of the package assembly 10 further includes step e: installing the color filter 601 on the color filter installation position 531 on the front molding portion 511 of the circuit board to filter out stray light and improve imaging quality.

[0115] The present application also provides an anti-shake camera module 1 assembled using the packaging component 10 structure, as shown in FIG11 . Specifically, the anti-shake camera module 1 includes a packaging component 10, a chip driver, an optical lens 80, etc. Specifically, the chip driver is disposed on the packaging component 10, and the optical lens 80 is disposed directly above the packaging component 10. External light reaches the packaging component 10 through the optical lens 80. Furthermore, the packaging component 10 structure in the present application, due to the arrangement of a front molding portion 511 and a back molding portion 512, can bond the chip 301 to the circuit board 201 through a molding process, effectively reducing the volume and weight of the packaging component 10. Specifically, the weight of the package assembly 10 in the present application can be controlled at about 0.266g. Compared with the conventional COB (chip of board) packaging method, the weight of the package assembly 10 can be reduced by about 13%. Under the existing size of the camera module, the driving force provided by the chip driver remains unchanged, so that the camera module 1 using the package assembly 10 structure can significantly improve the adjustable stroke of the chip 301. Under the current trend of miniaturization of camera modules, the package assembly 10 structure provided in this solution can not only meet the requirements of large chip movement stroke, but also has certain advantages in the miniaturization of the overall structure. It is a commonly selected chip anti-shake direction in the industry.

[0116] Furthermore, as shown in FIG11 , the camera module 1 may further include a lens motor 70, which is disposed on the optical lens 80, wherein the lens motor 70 is mainly used to drive the optical lens 80 to move, wherein the lens motor 70 can drive the optical lens 80 to move along the direction of the optical axis, i.e., the Z-axis direction, to achieve focusing during the shooting process of the camera module 1. In a specific embodiment, the chip driver can drive the chip 301 to move in a plane perpendicular to the optical axis, i.e., in the X / Y direction, and the lens motor 70 can drive the optical lens 80 to move along the Z-axis direction (i.e., in the direction of the optical axis). The mutual cooperation between the optical lens 80 and the chip 301 can effectively improve the imaging quality of the camera module 1. In another specific embodiment, the lens motor 70 can drive the optical lens 80 to move along the direction of the optical axis, that is, the Z-axis direction, and can also drive the optical lens 80 to move in the plane perpendicular to the optical axis, that is, the X / Y direction, wherein the chip driver can also drive the chip 301 to move along the X / Y direction. The optical lens 80 and the chip 301 cooperate with each other to achieve anti-shake of a larger stroke of the camera module 1.

[0117] Specifically, the lens motor 70 in the camera module 1 can be a spring-type structure, and the optical lens 80 is disposed inside the lens motor 70 to drive the optical lens 80 to move. In a specific embodiment, the lens motor 70 may include a magnet 704, a coil 703, a spring, a lens carrier 702, and a base 705. The optical lens 80 is fixed to the lens carrier 702, the coil 703 structure is fixed to the lens carrier 702, the magnet 704 is disposed around the coil 703, and the spring is disposed between the base 705 and the lens carrier 702. Furthermore, the lens motor 70 also includes a motor housing 701, which encloses the other components of the lens motor 70 to provide corresponding protection for the components of the lens motor 70. In order to better utilize the internal space of the lens motor 70, the magnet 704 can be arranged inside the motor housing 701 and around the coil 703 on the lens carrier 702 to achieve better fit between the magnet 704 and the coil 703.

[0118] Furthermore, as shown in FIG11 , the package assembly 10 structure provided herein can be mounted on the lower surface of the base 705 of the lens motor 70, wherein the lower surface of the base 705 of the lens motor 70 is secured to the upper surface of the package assembly 10. Specifically, the upper surface of the package assembly 10 is located on the first step 521 of the front molding 511. The front molding 511 is molded to maintain a certain degree of flatness on its upper surface, facilitating the securing of the first step 521 of the front molding 511 to the base 705 of the lens motor 70. For example, gluing or other securing methods can be used to secure the lens motor 70 to the package assembly 10. The motor housing 701 covers the exterior of the package assembly 10 to provide protection for the package assembly 10. The packaging component 10 structure adopted in this solution has the advantages of miniaturization and lightness. Setting it at the bottom of the lens motor 70 can significantly reduce the height of the camera module 1 and meet the requirements of miniaturization of the camera module 1 packaging.

[0119] As shown in FIG11 , specifically, the camera module 1 provided in the present application and provided with the packaging component 10 structure has an optical axis of the optical lens 80 provided on the lens motor 70 that is consistent with the center of the chip 301 on the packaging component 10 structure, so that the chip 301 can receive the light entering the optical lens 80. During the imaging process of the camera module 1, according to a pre-set program, the lens motor 70 can drive the optical lens 80 to perform position correction so that as much light as possible passing through the optical lens 80 reaches the chip 301 of the packaging component 10. Furthermore, by utilizing the packaging component 10 structure provided in this solution, the size of the chip 301 can be increased to about 1 / 1.7 inches. By utilizing the packaging method and conduction method provided above, while improving the imaging quality of the camera module, the miniaturization of its overall structure can be effectively guaranteed, catering to the trend of miniaturization of camera modules.

[0120] The above describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the foregoing embodiments. The foregoing embodiments and description merely illustrate the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A packaging component, comprising a circuit board and a chip, wherein the circuit board has a through hole, and the chip is arranged corresponding to the through hole of the circuit board, characterized in that: The circuit board has a plurality of circuit board pads, at least one solder ball is arranged on each of the circuit board pads, the chip has a plurality of chip pads, at least one gold ball is arranged on the chip pad, the chip pad corresponds to the circuit board pad, and at least one gold ball is melted with at least one solder ball to form a conductive bonding area to conduct the circuit board and the chip; There are gaps between the conductive bonding areas where the plurality of gold balls are melted with the solder balls, and the gaps are filled with glue.

2. The packaging assembly according to claim 1, characterized in that: The glue contains flux and covers the solder balls.

3. The packaging assembly according to claim 2, characterized in that: The glue connects the circuit board and the chip and completely fills the gaps between the conductive bonding areas where the gold balls are melted with the solder balls.

4. The packaging assembly according to claim 2, characterized in that: The glue is arranged around the through hole of the circuit board and covers the pad of the circuit board, wherein the glue has a glue width, and the solder ball is arranged on the side of the midline of the glue width close to the through hole of the circuit board, so that the glue can cover the solder ball inside.

5. The packaging assembly according to claim 4, characterized in that: The glue thickness is greater than the solder ball height, and the glue thickness is greater than or equal to 20 μm.

6. The packaging assembly according to claim 1, characterized in that: An ink structure is provided on the circuit board, and the ink is respectively provided on both sides close to and away from the circuit board through hole, wherein the ink is protrudingly provided on the circuit board pad and forms a groove, and the circuit board pad is at least partially accommodated in the groove.

7. The packaging assembly according to claim 6, characterized in that: The solder ball is arranged on the pad of the circuit board, and the solder ball covers at least 80% of the area of ​​the pad of the circuit board, so that the solder ball is accommodated in the groove formed by the ink structure.

8. The packaging assembly according to claim 1, characterized in that: The gold ball on the chip pad has a protrusion, wherein the protrusion extends into the interior of the solder ball on the circuit board pad to increase the contact area between the solder ball and the gold ball.

9. The packaging assembly according to claim 8, characterized in that: The circuit board pads are arranged corresponding to the chip pads, wherein the center distance between at least some adjacent circuit board pads is less than 150 μm.

10. The packaging assembly according to claim 1, characterized in that: The package body also has a molding part, which is integrally formed on the circuit board, wherein the molding part includes a front molding part and a back molding part formed on the front and back sides of the circuit board.

11. The packaging assembly according to claim 10, characterized in that: The back molding part is disposed on the back side of the circuit board, and the back molding part can be used to strengthen the strength of the circuit board, wherein the lower surface of the back molding part is lower than the back side of the chip.

12. The packaging assembly according to claim 11, characterized in that: The front molding part is arranged in a ring shape around the through hole of the circuit board, and the front side of the circuit board provided with the circuit board pad is covered by the front molding part.

13. A camera module, characterized in that: include: Lens motor; and According to any one of claims 1-12, the lens motor is arranged on the upper surface of the packaging component so that external light can reach the inside of the packaging component through the lens motor.

14. A method for assembling a packaging component, characterized in that: Includes steps: a: providing a circuit board, wherein a plurality of circuit board pads are provided on one surface of the circuit board, and at least one solder ball is implanted into the circuit board pad; b: providing a chip, wherein a plurality of chip pads are provided on the chip, and at least one gold ball is implanted into the chip pad; c: applying glue to the solder balls of the circuit board pads; d: Align the chip pad with the circuit board pad, and bond and fix the solder ball of the circuit board pad with the gold ball of the chip pad to conduct the circuit board and the chip.

15. The method for assembling a packaging component according to claim 14, characterized in that: The glue in step c contains flux, and the glue is applied to the circuit board pad and covers the solder ball.

16. The method for assembling a packaging component according to claim 14, characterized in that: The step c specifically includes the steps of: applying the glue to the pad of the circuit board through a glue painting process, so that the solder ball is located on the side of the glue width midline close to the center of the circuit board, so that the glue covers the solder ball inside.

17. The method for assembling a packaging component according to claim 16, characterized in that: The glue thickness is greater than the solder ball height.

18. The method for assembling a packaging component according to claim 14, characterized in that: The step d specifically includes the steps of: fixing the solder balls of the circuit board pad and the gold balls of the chip pad by means of thermal compression bonding, so that at least one of the solder balls and at least one of the gold balls melt to form a conductive bonding area, and at the same time the glue is filled in the gap of the conductive bonding area.

19. The method for assembling a packaging component according to claim 18, characterized in that: The temperature of the hot-press bonding of the solder ball and the gold ball is controlled, and the bonding process is step-wise heated with a first bonding temperature and a second bonding temperature so that the glue fills the conductive bonding area between the chip and the circuit board.

20. The method for assembling a packaging component according to claim 18, characterized in that: The step d specifically includes: forming a protrusion on the gold ball of the chip pad, aligning it with the solder ball of the circuit board pad and extending the protrusion of the gold ball into the solder ball of the circuit board pad to increase the contact area between the solder ball and the gold ball.

21. The method for assembling a packaging component according to claim 14, characterized in that: The step a specifically includes the steps of: depositing solder paste on the circuit board pad by means of steel screen printing, forming the solder paste into solder balls by means of reflow soldering and implanting them into the circuit board pad.

22. The method for assembling a packaging component according to claim 21, characterized in that: The step a specifically includes: protrudingly setting an ink structure on the circuit board and forming a groove, so that the circuit board pad is at least partially accommodated in the groove, and the solder ball covers at least 80% of the area of ​​the circuit board pad, so that the solder ball can be accommodated in the groove formed by the ink structure on the circuit board.

23. The method for assembling a packaging assembly according to any one of claims 14 to 22, characterized in that: The step a further includes step a1: integrally forming a circuit board front molding part on the front side of the circuit board, and integrally forming a circuit board back molding part on the back side of the circuit board, so that the circuit board back molding part is arranged outside the circuit board pad.

24. The method for assembling a packaging component according to claim 23, characterized in that: The step a also includes step a2: opening a through hole on the circuit board, wherein the through hole passes through a central area of ​​the circuit board, and the front molding portion of the circuit board is arranged annularly around the through hole.

25. The method for assembling a packaging component according to claim 24, characterized in that: The method further comprises step e: installing a color filter on a color filter installation position on the front molding portion of the circuit board to filter out stray light.

26. A camera module, characterized in that: include: Lens motor; and A packaging component manufactured according to the packaging component assembly method according to any one of claims 14-25, wherein the lens motor is arranged on the upper surface of the packaging component so that external light can reach the inside of the packaging component through the lens motor.

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