Laser processing method, laser processing device, and program

Abstract

This laser processing method includes: a step for placing a plate material on a support member; a step for processing the plate material by irradiating the plate material placed on the support member with a laser; a step for detaching the processed plate material from the support member; and a step for removing, from the support member, dross adhering to the support member due to the irradiation of the plate material with the laser, by bringing the dross into contact with a tool in a rotating state.

Description

Laser processing method, laser processing device, and program

[0001] The present invention relates to a laser processing method, a laser processing apparatus, and a program.

[0002] 2. Description of the Related Art Laser processing machines that process plate materials using a laser are known.

[0003] As a related technique, Patent Document 1 discloses a laser processing machine. The laser processing machine described in Patent Document 1 has a head that is moved relative to a workpiece. The head is equipped with a clamping device to which a laser processing tool and a machine processing tool are interchangeably attached.

[0004] Patent No. 4588422

[0005] An object of the present invention is to provide a laser processing method, a laser processing apparatus, and a program that are capable of removing dross adhering to a support member from the support member.

[0006] In some embodiments, the laser processing method includes the steps of placing a plate material on a support member, processing the plate material by irradiating the plate material placed on the support member with a laser, removing the processed plate material from the support member, and removing dross from the support member by contacting a rotating tool with the dross that has adhered to the support member due to the laser irradiation of the plate material.

[0007] In some embodiments, the laser processing apparatus includes a laser irradiation device including a first head that irradiates a laser beam onto a plate material supported by a support member, a second head that rotatably supports a tool, a rotation drive device that rotates the tool, a movement device that moves the second head relative to the support member, and a control device that controls the laser irradiation device, the rotation drive device, and the movement device. The control device is capable of selectively executing a first processing mode in which the laser beam is irradiated onto the plate material from the first head, and a dross removal mode in which dross that has adhered to the support member due to the laser beam being irradiated onto the plate material is removed from the support member by bringing the rotating tool into contact with the dross.

[0008] In some embodiments, the program is a program for causing a laser processing device to execute a laser processing method including the steps of: processing a plate material placed on a support member by irradiating the plate material with a laser; and removing dross from the support member by contacting a rotating tool with the dross that has adhered to the support member due to the irradiation of the plate material with the laser.

[0009] The present invention can provide a laser processing method, a laser processing device, and a program that can remove dross adhering to a support member from the support member.

[0010] FIG. 1 is a schematic perspective view showing a support member. FIG. 2 is a schematic perspective view showing an enlarged view of a portion of the support member. FIG. 3 is a schematic plan view showing a state in which a plate material is placed on the support member. FIG. 4 is a schematic perspective view showing a state after the plate material has been placed on the support member. FIG. 5 is an enlarged view of an area indicated by a dashed-dotted circle A1 in FIG. 4. FIG. 6 is a schematic perspective view showing a state in which laser processing is being performed. FIG. 7 is an enlarged view of an area indicated by a dashed-dotted circle A2 in FIG. 6. FIG. 8 is a schematic perspective view showing a state after the plate material placed on the support member has been processed. FIG. 9 is a schematic plan view showing a state after the processed plate material has been removed from the support member. FIG. 10 is a schematic perspective view showing a laser processing apparatus in a first modified example of the first embodiment. FIG. 11 is a schematic perspective view showing an enlarged view of a state in which multiple pieces of dross adhere to the support member. FIG. 12 is a schematic perspective view showing a state after the support member has been transferred from the unloading region to the processing region. FIG. 13 is a schematic perspective view showing a state in which a dross removal step is being performed. FIG. 14 is an enlarged view of an area indicated by a dashed-dotted circle A3 in FIG. 13. FIG. 15 is a flowchart showing a laser processing method in the first embodiment. FIG. 16 is a schematic perspective view showing an enlarged view of a portion of the support member. FIG. 17 is a schematic perspective view showing a support member. FIG. 18 is a schematic side view showing a state in which dross is removed from the support member using a rotating tool. FIG. 19 is a schematic perspective view showing a state in which dross is removed from the support member using a rotating tool. FIG. 20 is a schematic perspective view showing a state in which dross is removed from the support member using a rotating tool. FIG. 21 is a schematic perspective view showing a state in which dross is removed from the support member using a rotating tool. Fig. 22 is a schematic perspective view showing a state in which dross is removed from a support member using a rotating tool. Fig. 23 is a schematic side view showing a state in which dross is removed from a support member using a rotating tool in a modified example. Fig. 24 is a schematic perspective view showing an enlarged view of a portion of a support member in a modified example.FIG. 25 is a schematic perspective view showing a state in which a plate material is being processed using a second tool attached to the second head. FIG. 26 is a schematic side view showing a laser processing apparatus according to the first embodiment. FIG. 27 is a schematic front view showing a laser processing apparatus according to the first embodiment. FIG. 28 is a schematic plan view showing a laser processing apparatus according to the first embodiment. FIG. 29 is a schematic side view showing a state in which a dross removal process is being performed. FIG. 30 is a schematic side view showing a laser processing apparatus according to a second modified example of the first embodiment. FIG. 31 is a schematic perspective view showing a laser processing apparatus according to a third modified example of the first embodiment. FIG. 32 is a schematic perspective view showing a laser irradiation device. FIG. 33 is a schematic side view showing a laser processing apparatus according to a fourth modified example of the first embodiment. FIG. 34 is a schematic side view showing a laser processing apparatus according to a fourth modified example of the first embodiment. FIG. 35 is a diagram showing a state in which a control target device can be controlled by a control device. Fig. 36 is a schematic plan view showing an example of a movement path of a tool. Fig. 37 is a schematic side view showing a state in which a plate material is machined using a second tool attached to a second head. Fig. 38 is a diagram showing an example of a storage medium on which a program is recorded. Fig. 39 is a schematic perspective view showing a state in which dross is removed using a tool having a plurality of wire rods attached to a shaft member. Fig. 40 is a schematic side view showing a state in which dross is removed using a tool having a plurality of wire rods attached to a shaft member.

[0011] Hereinafter, a laser processing method, a laser processing apparatus 1, and a program 722 according to an embodiment will be described with reference to the drawings. In the following description of the embodiment, parts and components having the same functions are denoted by the same reference numerals, and repeated description of parts and components denoted by the same reference numerals will be omitted.

[0012] First Embodiment A laser processing method, a laser processing apparatus 1, and a program 722 according to a first embodiment will be described with reference to FIGS. 1 to 38 . FIG. 1 is a schematic perspective view showing a support member 2. FIG. 2 is a schematic perspective view showing an enlarged view of a portion of the support member 2. FIG. 3 is a schematic plan view showing a state in which a plate material W is placed on the support member 2. FIG. 4 is a schematic perspective view showing a state after the plate material W has been placed on the support member 2. FIG. 5 is an enlarged view of an area indicated by a dashed-dotted circle A1 in FIG. 4. FIG. 6 is a schematic perspective view showing a state in which laser processing is being performed. FIG. 7 is an enlarged view of an area indicated by a dashed-dotted circle A2 in FIG. 6. FIG. 8 is a schematic perspective view showing a state after the plate material placed on the support member 2 has been processed. FIG. 9 is a schematic plan view showing a state after the processed plate material Wb has been removed from the support member 2. FIG. 10 is a schematic perspective view showing a laser processing apparatus 1 according to a first modified example of the first embodiment. FIG. 11 is a schematic perspective view showing, in enlarged form, a state in which multiple pieces of dross D are adhering to a support member 2. FIG. 12 is a schematic perspective view showing a state after the support member 2 has been transferred from the unloading region RG2 to the processing region RG1. FIG. 13 is a schematic perspective view showing a state in which a dross removal process is being performed. FIG. 14 is an enlarged view of the area indicated by a dashed-dotted circle A3 in FIG. 13. FIG. 15 is a flowchart showing a laser processing method according to the first embodiment. FIG. 16 is a schematic perspective view showing, in enlarged form, a portion of the support member 2. FIG. 17 is a schematic perspective view showing the support member 2. FIG. 18 is a schematic side view showing a state in which dross D is removed from the support member 2 using a tool 91 in a rotating state. FIGS. 19 and 20 are schematic perspective views showing a state in which dross D is removed from the support member 2 using a tool 91 in a rotating state. 19 and 20 are views of the support member 2 as viewed obliquely from above. Figures 21 and 22 are schematic perspective views showing how dross D is removed from the support member 2 using a rotating tool 91. Figure 23 is a schematic side view showing how dross D is removed from the support member 2 using a rotating tool 91 in a modified example.FIG. 24 is a schematic perspective view showing an enlarged portion of the support member 2 in a modified example. FIG. 25 is a schematic perspective view showing a state in which a plate material W is being processed using a second tool 92 attached to the second head 41. FIG. 26 is a schematic side view showing a laser processing apparatus 1 in the first embodiment. FIG. 27 is a schematic front view showing a laser processing apparatus 1 in the first embodiment. FIG. 28 is a schematic plan view showing a laser processing apparatus 1 in the first embodiment. FIG. 29 is a schematic side view showing a state in which a dross removal step is being performed. FIG. 30 is a schematic side view showing a laser processing apparatus 1 in a second modified example of the first embodiment. FIG. 31 is a schematic perspective view showing a laser processing apparatus 1 in a third modified example of the first embodiment. FIG. 32 is a schematic perspective view showing a laser irradiation device 3. FIGS. 33 and 34 are schematic side views showing a laser processing apparatus 1 in a fourth modified example of the first embodiment. Fig. 35 is a diagram showing a state in which controlled devices can be controlled by the control device 7. Fig. 36 is a schematic plan view showing an example of a movement path of the tool 91. Fig. 37 is a schematic side view showing a state in which the plate material W is machined using the second tool 92 attached to the second head 41. Fig. 38 is a diagram showing an example of a storage medium 72M on which a program 722 is recorded.

[0013] As illustrated in Fig. 1 , in a first step ST1, a support member 2 is prepared. The first step ST1 is a preparation process. The support member 2 supports a plate material when the plate material is laser processed. As illustrated in Fig. 2 , the support member 2 may have a plurality of tip portions TP that support the plate material. When the support member 2 includes a pin holder that supports the plate material, the pin holder has a plurality of tip portions TP that support the plate material.

[0014] 3 and 4 , in the second step ST2, the plate material W is placed on the support member 2. The second step ST2 is a placing step. The placing step (second step ST2) may be performed using a plate material transfer device 6 (e.g., a robot hand 60). The robot hand 60 has, for example, a plurality of suction cups 61 that adsorb the plate material W or a fork that supports the plate material W from below. Alternatively, the placing step (second step ST2) may be performed manually.

[0015] As illustrated in FIG. 5 , after the placement process (second step ST2) is performed, the plate material W is supported by the multiple top portions TP of the support member 2. The multiple top portions TP are preferably located on a first plane parallel to the horizontal plane. In other words, the multiple top portions TP are preferably located on a virtual plane parallel to the horizontal plane. In this case, the plate material W supported by the multiple top portions TP is arranged parallel to the horizontal plane. Note that as the plate material W placed on the support member 2 is laser processed, at least some of the multiple top portions TP may deteriorate. Therefore, in the first embodiment, the deteriorated top portions TP of the support member 2 do not need to be located on the first plane.

[0016] As illustrated in Fig. 6 , in a third step ST3, the plate material W placed on the support member 2 is processed. The third step ST3 is a plate material processing step. In the example illustrated in Fig. 7 , the plate material processing step includes processing the plate material W placed on the support member 2 by irradiating the plate material W with a laser B (i.e., a laser beam). More specifically, the plate material processing step includes cutting the plate material W placed on the support member 2 by irradiating the plate material W with the laser B. Additionally, the plate material processing step may include processing the plate material W using a second tool (e.g., a drilling tool) described below.

[0017] In this specification, an article formed from the plate material W by executing the plate material processing step (third step ST3) is collectively referred to as a processed plate material Wb. By executing the plate material processing step (third step ST3), the plate material Wa before processing becomes a processed plate material Wb.

[0018] 8, the processed plate material Wb includes a part W1 and a scrap material W2. By executing the plate material processing step, one part W1 may be formed from the plate material W, or multiple parts W1 may be formed from the plate material W.

[0019] 8, in a fourth step ST4, the processed plate material Wb is removed from the support member 2. The fourth step ST4 is a removing step.

[0020] The removing step (fourth step ST4) includes removing a part W1, which is a part of the processed plate material Wb, and an scrap material W2, which is another part of the processed plate material Wb, from the support member 2. The part W1 and the scrap material W2 may be removed sequentially from the support member 2. Alternatively, the part W1 and the scrap material W2 may be removed simultaneously from the support member 2. The processed plate material Wb may be removed from the support member 2 using a suction cup capable of adsorbing the processed plate material Wb, or may be removed from the support member 2 using a fork capable of scooping up the processed plate material Wb.

[0021] 9, the removing step (fourth step ST4) may be performed using a plate material transfer device 6 (e.g., a robot hand 60). Alternatively, the removing step (fourth step ST4) may be performed manually.

[0022] In the example shown in FIG. 9, the processed plate material Wb is removed from the support member 2 arranged in the processing region RG1 of the laser processing device 1.

[0023] Alternatively, as shown by the dashed arrow in Fig. 10, the support member 2 may be moved to the removal region RG2, and then the processed plate material Wb may be removed from the support member 2 arranged in the removal region RG2. In the example shown in Fig. 10, the transfer device 15 transfers the support member 2 from the processing region RG1 to the removal region RG2. Thereafter, the processed plate material Wb is removed from the support member 2 arranged in the removal region RG2. The removal may be performed using a suction cup capable of adsorbing the processed plate material Wb, or may be performed using a fork capable of scooping up the processed plate material Wb.

[0024] 11 shows a portion of the support member 2 after the removal step (fourth step ST4) has been performed (in other words, a portion of the support member 2 after the processed plate material Wb has been removed is shown). Dross D formed by irradiating the plate material W with the laser B adheres to the support member 2. More specifically, irradiating the plate material W with the laser B causes a portion of the plate material W to become molten, and the dross D formed by solidifying the molten material adheres to the support member 2. In this specification, dross means a mass of any shape formed by solidifying a material (more specifically, a metal material) melted by irradiating the plate material W with the laser B.

[0025] In the fifth step ST5, the dross D is removed from the support member 2. The fifth step ST5 is a dross removing step.

[0026] As illustrated in Figure 12, the dross removal process (fifth step ST5) may include transferring the support member 2 from the removal region RG2 to the processing region RG1 using the transfer device 15 after the processed plate material Wb has been removed. Alternatively, the transfer of the support member 2 using the transfer device 15 may be omitted. For example, as illustrated in Figure 9, when the processed plate material Wb is removed from the support member 2 arranged in the processing region RG1 of the laser processing device 1, the support member 2 does not move from the processing region RG1. In this case, it is not necessary to transfer the support member 2 from the removal region RG2 to the processing region RG1 using the transfer device 15.

[0027] 13 and 14 , the dross removal step (fifth step ST5) includes bringing a rotating tool 91 (e.g., a cutting tool 91 m) into contact with the dross D that has adhered to the support member 2 due to irradiation of the plate material W with the laser B. The dross D is removed from the support member 2 by the rotating tool 91 coming into contact with the dross D.

[0028] The laser processing method in the first embodiment includes a dross removal step, in which the dross D is removed from the support member 2 by bringing a rotating tool 91 into contact with the dross D. In the laser processing method in the first embodiment, the dross D is removed using the rotating tool 91, so the dross D is removed more reliably than when an operator removes the dross using a brush. In addition, the burden on the operator is reduced.

[0029] Furthermore, by more reliably removing the dross D from the support member 2, the frequency of replacement of the support member 2 is reduced, allowing the support member 2 to be used for a longer period of time, thereby reducing the burden on the environment.

[0030] Furthermore, by removing the dross D from the plurality of top portions TP of the support member 2, welding between the plurality of top portions TP and the plate material to be laser processed next is prevented or suppressed via the dross D. Furthermore, by removing the dross D from the plurality of top portions TP of the support member 2, distortion of the plate material W placed on the support member 2 is suppressed. Therefore, a decrease in the processing accuracy of the plate material W is suppressed.

[0031] In the first embodiment, the frequency with which the dross removal process (fifth step ST5) is performed may be lower than the frequency with which the plate material processing process (third step ST3) is performed. In other words, after a plurality of plate materials W are processed by irradiating them with the laser B, the dross D may be removed from the support member 2 by bringing the rotating tool 91 into contact with the dross D adhering to the support member 2. For example, the above-described second step ST2 to the above-described fourth step ST4 may be repeatedly performed during the day to process a plurality of plate materials W, and the above-described fifth step ST5 may be performed at night to remove the dross D from the support member 2.

[0032] (Optional Additional Configuration) Next, optional additional configurations that can be employed in the laser processing method in the first embodiment or the laser processing apparatus 1 in the first embodiment described below will be described with reference to FIGS. 1 to 25 .

[0033] (Support Member 2) In the example shown in FIG. 16 , the support member 2 has a plurality of plate members 21 arranged so as to stand on a horizontal plane (for example, the X-Y plane in FIG. 16 ). More specifically, the support member 2 includes a first plate member 21-1 and a second plate member 21-2 arranged so as to stand on the horizontal plane. The support member 2 may also include a third plate member 21-3 and a fourth plate member 21-4 arranged so as to stand on the horizontal plane. The support member 2 may include 10 or more plate members 21 arranged so as to stand on the horizontal plane, or may include 20 or more plate members 21 arranged so as to stand on the horizontal plane. Each plate member 21 is made of, for example, metal.

[0034] 16 , the longitudinal direction of each plate member 21 is approximately parallel to the horizontal plane, the width direction of each plate member 21 is approximately parallel to the vertical direction, and the thickness direction of each plate member 21 is approximately parallel to the horizontal plane.

[0035] 17 , the first plate member 21-1 is disposed in a region between the plate member 21E disposed at one end (more specifically, the end on the +X direction side) of the support member 2 and the plate member 21F disposed at the other end (more specifically, the end on the −X direction side) of the support member 2. Alternatively, the first plate member 21-1 may be the plate member 21E disposed at one end of the support member 2, or the plate member 21F disposed at the other end of the support member 2.

[0036] 17, the second plate member 21-2 is a plate member disposed adjacent to the first plate member 21-1. The first plate member 21-1 and the second plate member 21-2 are disposed substantially parallel to each other. The length of each of the first plate member 21-1 and the second plate member 21-2 is, for example, 50 cm or more or 100 cm or more.

[0037] In this specification, "K" is defined as any natural number equal to or greater than 2 (more specifically, "K" is 2, 3, 4, 5, 6, 7, ...), and "N" is defined as the number obtained by adding "1" to "K." In the example shown in FIG. 17 , the support member 2 includes a "K"th plate member 21-K (e.g., the second plate member 21-2) and an "N"th plate member 21-N (e.g., the third plate member 21-3) arranged adjacent to the "K"th plate member 21-K. The "K"th plate member 21-K (e.g., the second plate member 21-2) and the "N"th plate member 21-N (e.g., the third plate member 21-3) may be arranged substantially parallel to each other.

[0038] 16 , each of the plurality of plate members 21 has a sawtooth edge portion EG. The sawtooth edge portion EG of each plate member 21 has a plurality of top portions TP and a plurality of bottom portions BP. In the sawtooth edge portion EG, the top portions TP and the bottom portions BP are alternately arranged in the longitudinal direction of each plate member 21.

[0039] In the above-mentioned placing step (second step ST2), the plate material W is placed on the plurality of sawtooth edge portions EG (more specifically, the plate material W is placed on the plurality of top portions TP of the plurality of edge portions EG). Also, in the above-mentioned plate material processing step (third step ST3), the plate material W placed on the plurality of sawtooth edge portions EG is irradiated with a laser B.

[0040] 17 , the support member 2 is a movable pallet PT. The pallet PT has a plurality of plate members 21 and a frame 23 to which the plurality of plate members 21 are attached. The pallet PT may include a bottom plate 25 that prevents the dross D from falling below the pallet PT. The bottom plate 25 may be arranged to close a bottom opening of the frame 23. Alternatively, the bottom plate 25 may be omitted, and the bottom of the frame 23 may be open. In this case, in the laser processing apparatus 1, a conveyor that transports unwanted materials such as dross D may be arranged below the frame 23.

[0041] (Dross Removal Process) In the example shown in FIG. 14 , the dross removal process (fifth step ST5) described above includes removing dross D from the plurality of plate members 21. More specifically, in the example shown in FIG. 14 , the dross removal process (fifth step ST5) described above includes bringing a rotating tool 91 into contact with the dross D adhering to at least one of the plurality of plate members 21. In this manner, the dross D adhering to the plurality of plate members 21 is removed by the tool 91. For example, the dross D adhering to the first plate member 21-1 due to the irradiation of the plate material W with the laser B is brought into contact with the rotating tool 91, thereby removing the dross D from the first plate member 21-1. Furthermore, the dross D adhering to the second plate member 21-2 due to the irradiation of the plate material W with the laser B is brought into contact with the rotating tool 91, thereby removing the dross D from the second plate member 21-2.

[0042] 6 and 13, the processing of the plate material W by the laser and the removal of the dross D from the support member 2 (in other words, the process of removing the dross D from the support member 2 by bringing the rotating tool 91 into contact with the dross D) are performed in the same region in a plan view. More specifically, the removal of the dross D from the support member 2 is performed in the same region as the processing region RG1 where the processing of the plate material W is performed by the laser. Therefore, a dedicated space for removing the dross D is not required.

[0043] 18, the dross removal step (fifth step ST5) includes moving the rotating tool 91 (more specifically, the cutting tool 91m) along the longitudinal direction LD of the first plate member 21-1 so that the rotating tool 91 (more specifically, the cutting tool 91m) comes into contact with the dross D. By moving the rotating tool 91 along the longitudinal direction LD of the first plate member 21-1, multiple pieces of dross D adhering to the first plate member 21-1 are efficiently removed from the first plate member 21-1. As illustrated in FIG. 18, the rotation axis AX of the tool 91 may be approximately perpendicular to a horizontal plane.

[0044] The dross removal step (fifth step ST5) described above includes, for example, moving the rotating tool 91 along the longitudinal direction LD of the first plate member 21-1 while the rotating tool 91 is in contact with the first side surface 21 a-1 of the first plate member 21-1 or while the rotating tool 91 is slightly spaced apart from the first side surface 21 a-1 of the first plate member 21-1. The first plate member 21-1 may be attached to the frame 23 in a curved state (in other words, a bent state). In this case, when the rotating tool 91 moves along the longitudinal direction LD of the first plate member 21-1, the distance between the tool 91 and the first side surface 21 a-1 of the first plate member 21-1 may vary depending on the curvature of the first plate member 21-1.

[0045] As illustrated in FIG. 19 , the first plate member 21-1 has a first side surface 21a-1 and a second side surface 21b-1. The distance between the first side surface 21a-1 and the second side surface 21b-1 corresponds to the thickness of the first plate member 21-1. The first plate member 21-1 has a first end portion 21c and a second end portion 21d. The direction from the first end portion 21c toward the second end portion 21d (or the direction from the second end portion 21d toward the first end portion 21c) corresponds to the longitudinal direction of the first plate member 21-1. In this specification, the direction from the first end portion 21c of the first plate member 21-1 toward the second end portion 21d of the first plate member 21-1 is defined as the "first direction DR1," and the direction opposite to the first direction DR1 is defined as the "second direction DR2."

[0046] 19 , the above-described dross removal step (fifth step ST5) may include moving the rotating tool 91 in a first direction DR1 along the first side surface 21 a-1 of the first plate member 21-1. By moving the rotating tool 91 in the first direction DR1 along the first side surface 21 a-1, the pieces of dross D adhering to the first side surface 21 a-1 are efficiently removed from the first side surface 21 a-1.

[0047] 20 , the above-described dross removal step (fifth step ST5) may include moving the rotating tool 91 in the second direction DR2 (or the first direction DR1) along the second side surface 21b-1 of the first plate member 21-1. By moving the rotating tool 91 in the second direction DR2 (or the first direction DR1) along the second side surface 21b-1, the pieces of dross D adhering to the second side surface 21b-1 are efficiently removed from the second side surface 21b-1.

[0048] 21 , the dross removal process (fifth step ST5) includes moving the rotating tool 91 along a first path PA1 located between the first plate member 21-1 and the second plate member 21-2 so that the rotating tool 91 comes into contact with the dross D adhering to the first plate member 21-1. In the example shown in FIG. 21 , the space between the first plate member 21-1 and the second plate member 21-2 is used as the movement path for the tool 91. Furthermore, by moving the rotating tool 91 along the first path PA1, the pieces of dross D adhering to the second side surface 21b-1 of the first plate member 21-1 are efficiently removed from the second side surface 21b-1.

[0049] In the example shown in Figure 22, the dross removal process (fifth step ST5) includes moving the rotating tool 91 along a second path PA2 located between the first plate member 21-1 and the second plate member 21-2 so that the rotating tool 91 comes into contact with the dross D adhering to the second plate member 21-2. As can be seen from Figures 21 and 22, the first path PA1 is closer to the first plate member 21-1 than the second path PA2. Furthermore, the second path PA2 is closer to the second plate member 21-2 than the first path PA1.

[0050] In the example shown in Figures 21 and 22, a rotating tool 91 moves along two paths (PA1, PA2) located between the first plate member 21-1 and the second plate member 21-2, thereby efficiently removing multiple pieces of dross D from the side (21b-1) of the first plate member 21-1 facing the second plate member 21-2 (see Figure 21), and efficiently removing multiple pieces of dross D from the side 21a-2 of the second plate member 21-2 facing the first plate member 21-1 (see Figure 22).

[0051] In the example shown in Figure 18, the above-mentioned dross removal process (fifth step ST5) includes bringing the rotating tool 91 into contact with the dross D adhering to the first plate member 21-1 with the tip Te of the tool 91 lower than the multiple bottoms BP of the saw-tooth edge portion EG.

[0052] By making the tip Te of the tool 91 lower than the plurality of bottom portions BP of the sawtooth edge portion EG, the dross D can be effectively removed from the sawtooth edge portion EG. It is preferable that the rotating tool 91 is moved along the longitudinal direction LD of the first plate member 21-1 with the tip Te of the tool 91 being lower than the plurality of bottom portions BP of the sawtooth edge portion EG. In this case, the plurality of pieces of dross D can be efficiently and effectively removed from the entire sawtooth edge portion EG.

[0053] 18 to 22 show an example in which the dross removing step is performed by moving a rotating tool 91 along the side surface of the plate member 21 constituting the support member 2. Alternatively, as illustrated in Fig. 23, the above-mentioned dross removing step (fifth step ST5) may include moving the rotating tool 91 (more specifically, a cutting tool 91m) along a first plane PL1 on which the multiple apexes TP of the support member 2 are located, so that the rotating tool 91 comes into contact with the dross D adhering to at least one of the multiple apexes TP of the support member 2.

[0054] 23, the dross removal step (fifth step ST5) includes moving the rotating tool 91 along the longitudinal direction LD of the first plate member 21-1 on the first plane PL1. Alternatively, the dross removal step (fifth step ST5) may include removing the dross D from the plurality of top portions TP of the support member 2 by moving the rotating tool 91 on the first plane PL1 independently of the longitudinal direction of the first plate member 21-1.

[0055] In the modification shown in FIG. 23 , it is more difficult to remove dross D adhering to a low position of the plate member 21 than in the examples shown in FIGS. 18 to 22 . On the other hand, in the modification shown in FIG. 23 , even when the plate member 21 is significantly deflected, the dross D adhering to multiple apexes TP can be efficiently removed. Furthermore, in the modification shown in FIG. 23 , when multiple plate members 21 are arranged in a lattice pattern (see FIG. 24 ), the dross D adhering to multiple apexes TP can be efficiently removed without frequently moving the tool 91 up and down. Note that in the modification shown in FIG. 23 , the cutting tool 91m may be a milling tool. When a milling tool with a large outer diameter is used, the milling tool may simultaneously remove dross D from two or more apexes TP.

[0056] 6, the plate material machining step (third step ST3) is performed using a multi-tasking machine 1A. The multi-tasking machine 1A includes a first head 31 that irradiates a laser B and a second head 41 to which a tool 91 is attached.

[0057] 6, the above-described plate material processing step (i.e., the step of processing the plate material W) includes irradiating the plate material W with a laser B from the first head 31 of the multi-purpose machining center 1A. The plate material W is cut by irradiating the plate material W with the laser B from the first head 31.

[0058] In the example shown in FIG. 13, the above-mentioned dross removing step (fifth step ST5) is performed using the multi-tasking machine 1A.

[0059] 14, the above-mentioned dross removal process (i.e., the process of removing the dross D from the support member 2) includes rotating a tool 91 (more specifically, a cutting tool 91m) attached to the second head 41 of the multi-tasking machine 1A about the rotation axis AX. Also, the above-mentioned dross removal process (i.e., the process of removing the dross D from the support member 2) includes bringing the tool 91 into contact with the dross D adhering to the support member 2 (e.g., the first plate member 21-1) while the tool 91 is rotating about the rotation axis AX.

[0060] By using the multi-tasking machine 1A to perform both the plate material processing step (third step ST3) and the dross removal step (fifth step ST5), it is possible to easily switch between plate material processing and dross removal. In addition, a dedicated space for removing dross D is not required.

[0061] In the example shown in Figure 13, the above-mentioned dross removal process (i.e., the process of removing dross D from the support member 2) includes moving the second head 41, to which a tool 91 (more specifically, a cutting tool 91m) is attached, together with the first head 31.

[0062] In the dross removal process (fifth step ST5), when the second head 41 moves together with the first head 31, at least a part of the mechanism for moving the second head 41 is shared with at least a part of the mechanism for moving the first head 31. Therefore, compared to when the moving mechanism for the second head 41 and the moving mechanism for the first head 31 are provided completely separately, the overall size of the moving mechanism can be made more compact.

[0063] 25 , the plate material processing step (third step ST3) includes processing the plate material W by bringing a rotating second tool 92 into contact with the plate material W placed on the support member 2 (more specifically, a plurality of plate members 21). For example, the plate material processing step (third step ST3) includes forming a through hole Wh in the plate material W by bringing the rotating second tool 92 into contact with the plate material W placed on the support member 2. The second tool 92 may be a drill or a threading tool (for example, a tapping tool).

[0064] 25 , the second tool 92 is attached to the head 40 (more specifically, the second head 41 of the multi-tasking machine 1A). In this case, the plate material machining step (third step ST3) includes machining the plate material W by moving the head 40 (more specifically, the second head 41) so that the rotating second tool 92 comes into contact with the plate material W placed on the support member 2. In this way, the plate material W is machined by the second tool 92 (for example, a through hole is formed in the plate material W).

[0065] (Tool 91) In the dross removal process, the tool 91 that comes into contact with the dross is, for example, a cutting tool 91m. The rotating cutting tool 91m can scrape the dross D from the plate member 21. The tool 91 may be a tool that is stronger than the second tool 92. For example, the outer diameter of the tool 91 may be larger than the outer diameter of the second tool 92. Furthermore, in order to scrape off the dross D that is located lower than the plate material W placed on the support member 2, the outer diameter of the tool 91 may be larger than the outer diameter of the second tool 92, and the tool length of the tool 91 may be longer than the tool length of the second tool 92.

[0066] (Tool Replacement) The head 40 (more specifically, the second head 41 of the multi-tasking machine 1A) may be capable of selectively holding a second tool 92 for plate material processing (see FIG. 25) and a tool 91 for dross removal (see FIG. 14). In other words, the second tool 92 attached to the head 40 may be replaceable with the tool 91 for dross removal. Furthermore, the tool 91 attached to the head 40 may be replaceable with the second tool 92 for plate material processing.

[0067] The laser processing method in the first embodiment may include, in addition to (1) the step of processing the plate material W by irradiating the plate material W placed on the support member 2 with a laser B (see Figure 6), (2) the step of attaching a second tool 92 to the head 40 (more specifically, the second head 41), and (3) the step of processing the plate material W using the second tool 92 attached to the head 40 (more specifically, the second head 41) by bringing the rotating second tool 92 into contact with the plate material W placed on the support member 2 (see Figure 25). In addition, the laser processing method in the first embodiment may include the steps of (4) removing the second tool 92 from the head 40 (more specifically, the second head 41), (5) attaching a tool 91 (more specifically, a tool for removing dross) to the head 40 (more specifically, the second head 41), and (6) removing the dross D from the support member 2 by bringing the rotating tool 91 into contact with the dross D adhering to the support member 2 (see FIG. 14).

[0068] Since the second tool 92 for plate processing and the tool 91 for dross removal are separate, the dross can be removed from the support member 2 by bringing the tool 91 for dross removal into contact with the dross without bringing the second tool 92 for plate processing into contact with the dross. This prevents damage to the second tool 92 due to contact with the dross.

[0069] (Laser processing apparatus 1) As illustrated in Figure 26, the laser processing apparatus 1 in the first embodiment includes: (1) a laser irradiation device 3 including a first head 31 that irradiates a laser onto a plate material W supported by a support member 2; (2) a second head 41 that rotatably supports a tool 91 (more specifically, a cutting tool 91m); (3) a rotation drive device 44 that rotates the tool 91; (4) a moving device 5 that moves the second head 41 relative to the support member 2; and (5) a control device 7 that controls the laser irradiation device 3, the rotation drive device 44, and the moving device 5. The control device 7 can selectively execute (6) a first processing mode M1 (see Figure 6) in which a laser B is irradiated onto the plate material W from the first head 31, and (7) a dross removal mode M2 ​​(see Figure 13) in which a rotating tool 91 is brought into contact with the dross D that has adhered to the support member 2 due to the irradiation of the laser B onto the plate material W, thereby removing the dross D from the support member 2.

[0070] In the laser processing device 1 according to the first embodiment, the dross D can be removed using the rotating tool 91. Therefore, the dross D can be removed more reliably than when an operator removes the dross using a brush. In addition, the burden on the operator is reduced.

[0071] Furthermore, by more reliably removing the dross D from the support member 2, the frequency of replacement of the support member 2 is reduced, allowing the support member 2 to be used for a longer period of time, thereby reducing the burden on the environment.

[0072] Furthermore, by removing the dross D from the plurality of top portions TP of the support member 2, welding between the plurality of top portions TP and the plate material to be laser processed next is prevented or suppressed via the dross D. Furthermore, by removing the dross D from the plurality of top portions TP of the support member 2, distortion of the plate material W placed on the support member 2 is suppressed. Therefore, a decrease in the processing accuracy of the plate material W is suppressed.

[0073] Furthermore, since the laser processing apparatus 1 can perform both laser processing and dross removal, there is no need to provide a dedicated space for dross removal outside the laser processing apparatus 1. The laser processing apparatus 1 may be a multi-tasking machine 1A that can perform both laser processing of the plate material W and tool processing of the plate material W.

[0074] It should be noted that at least a part of the mechanism for moving the first head 31 may be a common mechanism, and at least a part of the mechanism for moving the second head 41. Alternatively, in the laser processing apparatus 1, the mechanism for moving the first head 31 and the mechanism for moving the second head 41 may be provided completely separately.

[0075] (Optional Additional Configuration) Next, with reference to FIGS. 1 to 37, optional additional configurations that can be employed in the laser processing apparatus 1 in the first embodiment or the laser processing method in the first embodiment described above will be described.

[0076] 26, the support member 2 is supported by the laser processing apparatus 1 (for example, the base 50 of the laser processing apparatus 1). When the above-mentioned plate material processing step (third step ST3) is performed, the support member 2 is preferably fixed to the laser processing apparatus 1 so that the support member 2 is maintained in a state where it is positioned in the processing region RG1. Furthermore, when the above-mentioned dross removal step (fifth step ST5) is performed, the support member 2 is preferably fixed to the laser processing apparatus 1 so that the support member 2 is maintained in a state where it is positioned in the processing region RG1.

[0077] 26 , the moving device 5 moves the second head 41 relative to the support member 2. In addition, the moving device 5 moves the first head 31 relative to the plate material W supported by the support member 2.

[0078] 26, the moving device 5 has a moving body (51a; 53a) that supports both the first head 31 and the second head 41, and a driving device (51b; 53b) that moves the moving body (51a; 53a). By sharing at least a part of the mechanism that moves the first head 31 and at least a part of the mechanism that moves the second head 41, it is possible to reduce the number of parts in the laser processing device and save space.

[0079] 27, the moving device 5 includes a first moving device 51. The first moving device 51 includes a first moving body 51a and a first driving device 51b (e.g., a first motor) that moves the first moving body 51a.

[0080] In the example shown in FIG. 26, the first moving body 51 a supports both the first head 31 and the second head 41 .

[0081] 26 , the first moving body 51a functions as a Z saddle, and the first driving device 51b functions as a Z-axis driving unit. The first driving device 51b moves the first moving body 51a in a direction parallel to the vertical direction (in other words, in the Z-axis direction). More specifically, the first driving device 51b can move the first moving body 51a downward so that the first moving body 51a approaches the support member 2. The first driving device 51b can also move the first moving body 51a upward so that the first moving body 51a moves away from the support member 2.

[0082] In the example shown in FIG. 26, the first driving device 51b (Z-axis driving unit) can move both the first head 31 and the second head 41 in the Z-axis direction.

[0083] 28 , the moving device 5 includes a second moving device 53. The second moving device 53 includes a second moving body 53 a and a second driving device 53 b (e.g., a second motor) that moves the second moving body 53 a. The second moving body 53 a supports the first moving body 51 a so that the first moving body 51 a can move in a direction parallel to the vertical direction.

[0084] 28, the second moving body 53a functions as a Y saddle, and the second driving device 53b functions as a Y-axis driving unit. The second driving device 53b moves the second moving body 53a in a direction parallel to the horizontal plane (more specifically, in the Y-axis direction). In the example shown in FIG. 28, the Y-axis direction is parallel to the longitudinal direction of the first plate member 21-1.

[0085] 28 , the moving device 5 includes a third moving device 55. The third moving device 55 includes a third moving body 55a and a third driving device 55b (e.g., a third motor) that moves the third moving body 55a. The third moving body 55a supports the second moving body 53a so that the second moving body 53a can move in a direction parallel to the Y-axis direction.

[0086] 28, the third movable body 55a functions as an X saddle, and the third drive unit 55b functions as an X-axis drive unit. The third drive unit 55b moves the third movable body 55a in a direction parallel to the horizontal plane (more specifically, in the X-axis direction perpendicular to the Z-axis and Y-axis). In the example shown in FIG. 28, the X-axis direction is perpendicular to the longitudinal direction of the first plate member 21-1.

[0087] As illustrated in Fig. 13, the third movable body 55a may be configured as a gate-shaped structure. In the example illustrated in Fig. 13, the third movable body 55a is movable across the processing region RG1 (more specifically, the laser processing region) in a plan view. The third movable body 55a is supported by the base 50 so as to be movable in a direction parallel to the X-axis direction.

[0088] 26, the moving device 5 includes a fourth moving device 57. The fourth moving device 57 includes a fourth moving body 57a and a fourth driving device 57b (e.g., a motor or an actuator) that moves the fourth moving body 57a.

[0089] The fourth driving device 57b moves the second head 41 relative to the first head 31. More specifically, the fourth driving device 57b moves the second head 41 relative to the first head 31 in the vertical direction.

[0090] In the examples shown in FIGS. 26 and 29 , the fourth drive device 57b can move the second head 41 relative to the first head 31 between an advanced position P1 (see FIG. 29 ) and a retracted position P2 (see FIG. 26 ). As illustrated in FIG. 29 , when the second head 41 is located at the advanced position P1, the tip of the tool 91 attached to the second head 41 is closer to the support member 2 than the tip of the first head 31 (i.e., the laser head). Therefore, the first head 31 does not get in the way when the tool 91 is used to remove the dross D. Also, as illustrated in FIG. 26 , when the second head 41 is located at the retracted position P2, the tip of the first head 31 (i.e., the laser head) is closer to the support member 2 than the tip of the second head 41 (or the tip of the tool 91 attached to the second head 41). Therefore, the second head 41 does not get in the way when the plate material W placed on the support member 2 is laser processed.

[0091] 29, the fourth movable body 57a is supported by the first movable body 51a so as to be movable in the vertical direction, and the first movable body 51a is supported by the second movable body 53a so as to be movable in the vertical direction. Alternatively, as illustrated in Fig. 30, the first movable body 51a supporting the first head 31 and the fourth movable body 57a supporting the second head 41 may be supported by the second movable body 53a so as to be movable in the vertical direction independently of each other.

[0092] 29, the second driving device 53b (Y-axis driving unit) can move both the first head 31 and the second head 41 in the Y-axis direction. By using a common mechanism to move the first head 31 in the Y-axis direction and the second head 41 in the Y-axis direction, the overall size of the moving mechanism can be made compact.

[0093] Alternatively, as illustrated in FIG. 31, the moving device 5 may have a second driving device 53b that moves the first head 31 in a direction parallel to the horizontal plane (more specifically, in the Y-axis direction), and a fifth driving device 58b that moves the second head 41 in a direction parallel to the horizontal plane (more specifically, in the Y-axis direction).

[0094] 31, the first head 31 is supported by a second moving body 53a via a first moving body 51a. A second driving device 53b moves the second moving body 53a relative to a third moving body 55a in the Y-axis direction.

[0095] 31 , the second head 41 is supported by a fifth movable body 58a via a fourth movable body 57a. A fifth driving device 58b moves the fifth movable body 58a relative to the third movable body 55a in the Y-axis direction. A fourth driving device (not shown in FIG. 31 ) moves the fourth movable body 57a and the second head 41 in the Z-axis direction (in other words, the vertical direction).

[0096] 28, the third driving device 55b (X-axis driving unit) can move both the first head 31 and the second head 41 in the X-axis direction. By using a common mechanism to move the first head 31 in the X-axis direction and the second head 41 in the X-axis direction, the overall size of the moving mechanism can be made compact.

[0097] (Laser irradiation device 3) As illustrated in Figure 32, the laser irradiation device 3 has a first head 31, a laser light source 33, and an optical component 35 (e.g., an optical fiber, etc.) that transmits laser from the laser light source 33 to the first head 31.

[0098] The first head 31 may have a head main body 31a and an attachment 31b. When the dross D is removed using the tool 91 attached to the second head 41, the attachment 31b (e.g., an attachment including a lens and a laser emission port OP) of the first head 31 may be detached from the head main body 31a. Alternatively, or additionally, when the dross D is removed using the tool 91 attached to the second head 41, a cover for protecting the optical components may be attached to the head main body 31a.

[0099] 29 , the second head 41 supports the tool 91 rotatably around the rotation axis AX. The second head 41 has a rotating body 42 and a frame 43 that rotatably supports the rotating body 42. The tool 91 can be attached to the rotating body 42.

[0100] 29 , the laser processing apparatus 1 has a rotation drive device 44 (e.g., a motor 44m) that rotates the tool 91 (e.g., a cutting tool 91m) about the rotation axis AX. The rotation drive device 44 rotates the rotating body 42 about the first axis AX1, thereby rotating the tool 91 about the rotation axis AX.

[0101] 29 , the fourth moving body 57a supports both the rotation drive device 44 and the second head 41. More specifically, the fourth moving body 57a, the rotation drive device 44, and the second head 41 are capable of moving integrally in the vertical direction.

[0102] 33 , the laser processing apparatus 1 includes a tool changer 8. The tool changer 8 changes the tool held by the second head 41 to another tool. For example, the tool changer 8 changes the second tool 92 for plate material processing held by the second head 41 (more specifically, the rotating body 42 of the second head 41) to a tool 91 for dross removal.

[0103] 34 , the tool changer 8 may replace a dummy tool 93 held by the second head 41 (more specifically, the rotating body 42 of the second head 41) with a dross removal tool 91. The dummy tool 93 protects the tool attachment portion of the rotating body 42 when the second head 41 is not in use.

[0104] In addition, the tool changer 8 can replace the dross removal tool 91 held by the second head 41 with another tool (for example, a second tool 92 for processing plate material, or a dummy tool 93).

[0105] The tool changer 8 may have a tool change arm 81 that is rotatable about a second axis AX2. The tool change arm 81 can simultaneously hold two tools to be changed.

[0106] 26, the control device 7 controls the laser irradiation device 3, the rotation drive device 44, and the moving device 5 (e.g., the first drive device 51b, the second drive device 53b, the third drive device 55b, the fourth drive device 57b, etc.). The control device 7 may also control the plate material transfer device 6 (see FIG. 3). The control device 7 may also control the tool changer 8.

[0107] 26 , the control device 7 transmits an emission command E1 to the laser irradiation device 3 (e.g., the laser light source 33), thereby causing the first head 31 to emit the laser B. More specifically, the control device 7 transmits the emission command E1 to the laser irradiation device 3 (e.g., the laser light source 33), and the laser irradiation device 3 that receives the emission command E1 emits the laser B from the first head 31 (more specifically, from the laser emission port of the first head 31).

[0108] 29 , the control device 7 transmits a rotation command R1 to the rotation drive device 44 (e.g., the motor 44 m) to rotate the tool 91 (more specifically, the cutting tool 91 m). More specifically, the control device 7 transmits the rotation command R1 to the rotation drive device 44, and the rotation drive device 44 that receives the rotation command R1 rotates the tool 91 around the rotation axis AX along the longitudinal direction of the tool 91.

[0109] 26 (or FIG. 29 ), the control device 7 moves the first head 31 and / or the second head 41 by transmitting a movement command S to the movement device 5. More specifically, the control device 7 transmits the movement command S to the movement device 5, and the movement device 5 that receives the movement command S moves the first head 31 and / or the second head 41.

[0110] 35 , the control device 7 includes a hardware processor 70 (hereinafter simply referred to as the “processor 70”), a memory 72, a communication circuit 74, and an input device 76 (for example, a touch panel display 762). The processor 70, the memory 72, the communication circuit 74, and the input device 76 are connected to one another via a bus 78.

[0111] The memory 72 stores data and a program 722. The program 722 stored in the memory 72 may include a first program 722a that executes the first machining mode M1 described above, or may include a second program 722b that executes the dross removal mode M2 ​​described above. The program 722 may also include a third program 722c that executes a second machining mode M3 described below. The program 722 may also include a fourth program 722d that executes a tool change mode M4 described below. The program 722 may also include a fifth program 722e that executes a plate material transfer mode M5 described below.

[0112] The memory 72 is a storage medium that can be read by the processor 70 of the control device 7. The memory 72 may be, for example, a non-volatile or volatile semiconductor memory such as a RAM, a ROM, or a flash memory, a magnetic disk, or any other type of memory.

[0113] Data necessary for laser processing may be input to the control device 7 via the input device 76, or may be input to the control device 7 from another computer via the communication circuit 74. Data necessary for laser processing (e.g., shape data of the plate material W, shape data of the part W1, first path data 726a that defines the first movement path along which the first head 31 should move, etc.) is stored in the memory 72.

[0114] Data necessary for dross removal (for example, second path data 726b that defines the second movement path along which the tool 91 should move) is stored in the memory 72.

[0115] Data necessary for machining the plate material using the second tool 92 may be input to the control device 7 via the input device 76, or may be input to the control device 7 from another computer via the communication circuit 74. Data necessary for machining the plate material using the second tool 92 (e.g., shape data of the plate material W, shape data of the part W1, third path data 726c that defines the third movement path along which the second tool 92 should move, etc.) is stored in the memory 72.

[0116] The input device 76 is not limited to the touch panel display 762. For example, the control device 7 may include an input device 76 such as a button, a switch, a lever, a pointing device, or a keyboard, and a display that displays data input to the input device 76 or other information. Furthermore, a plurality of computers may cooperate to function as the control device 7. Furthermore, the memory 72 may be distributed and located in a plurality of locations. For example, part of the memory 72 may be included in cloud storage.

[0117] The processor 70 of the control device 7 executes the program 722 stored in the memory 72, causing the control device 7 to generate a control command. The communication circuit 74 transmits the control command to the devices to be controlled (more specifically, the laser irradiation device 3, the rotation drive device 44, the movement device 5, the workpiece transfer device 6, the tool changer 8, etc.). In this way, the processor 70 executes the program 722, allowing the control device 7 to control the laser irradiation device 3, the rotation drive device 44, the movement device 5, the workpiece transfer device 6, and the tool changer 8.

[0118] (First machining mode M1) The control device 7 can execute the first machining mode M1 by controlling the laser irradiation device 3 and the moving device 5. The first machining mode M1 is a mode in which the first head 31 is moved while emitting the laser B from the first head 31 so as to machine the plate material W (more specifically, so as to form a part W1 from the plate material W), as exemplified in Figures 6 and 7 .

[0119] For example, in the example shown in FIG. 26 , the control device 7 executing the program 722 (more specifically, the first program 722a) sends an injection command E1 to the laser irradiation device 3. Furthermore, the control device 7 executing the program 722 (more specifically, the first program 722a) sends a movement command S to the movement device 5 based on the first path data 726a stored in the memory 72. The laser irradiation device 3 receiving the injection command E1 irradiates the laser B toward the plate material W. Furthermore, the movement device 5 receiving the movement command S moves the first head 31 along the first movement path. In this way, the laser B is irradiated onto the plate material W supported by the support member 2 (more specifically, the plurality of plate members 21) so that the part W1 is formed from the plate material W.

[0120] (Dross Removal Mode M2) The control device 7 can execute the dross removal mode M2 ​​by controlling the rotation drive device 44 and the movement device 5. As illustrated in Figures 13 to 14 and 18 to 23, the dross removal mode is a mode in which the tool 91 (more specifically, the cutting tool 91m) is rotated while the second head 41 supporting the tool 91 is moved so as to remove dross D from the support member 2 (more specifically, the plurality of plate members 21).

[0121] 29 , the control device 7 executing the program 722 (more specifically, the second program 722b) transmits a rotation command R1 to the rotation drive device 44. The control device 7 executing the program 722 (more specifically, the second program 722b) transmits a movement command S to the movement device 5 based on the second path data 726b stored in the memory 72. The rotation drive device 44 receiving the rotation command R1 rotates the tool 91 around the rotation axis AX. The movement device 5 receiving the movement command S moves the tool 91 along the second movement path. For example, the second drive device 53b receiving the movement command S moves the tool 91 in a direction parallel to the longitudinal direction LD of the plate member 21. In this way, the rotating tool 91 comes into contact with the dross D so that the dross D is removed from the support member 2 (more specifically, the plurality of plate members 21).

[0122] The second path data 726b may define a second movement path (see FIGS. 19 to 22) in which the tool 91 sequentially passes near the side surfaces of a plurality of plate members 21, or may define a second movement path (see FIG. 23) in which the tool 91 sequentially passes near a plurality of top portions TP of the support member 2. The second path data 726b may be stored in advance in the memory 72.

[0123] Alternatively, the control device 7 may derive a movement path based on data such as shape data of the workpiece W, and second path data 726b defining the derived movement path may be stored in the memory 72. For example, as illustrated in Fig. 36 , the control device 7 may derive a movement path PC of the tool 91 so that the tool 91 passes through a target region AR2 of the support member 2 for laser irradiation (e.g., an area where the workpiece W is placed) intensively, compared with a non-target region AR1 of the support member 2 for laser irradiation (e.g., an area where the workpiece W is not placed), and the second path data 726b defining the derived movement path PC may be stored in the memory 72. Note that in Fig. 36 , the area hatched with dots corresponds to the target region AR2 of the laser irradiation (more specifically, the area where the workpiece W is placed).

[0124] The rotating tool 91 moves along the movement path PC calculated by the control device 7, thereby selectively removing dross D from the support member 2 in the target area AR2 of laser irradiation.

[0125] As illustrated in FIG. 18, the dross removal mode M2 ​​may be a mode that includes removing dross D from the first plate member 21-1 by moving a rotating tool 91 (e.g., a cutting tool 91m) along the longitudinal direction LD of the first plate member 21-1.

[0126] As illustrated in Figures 19 and 20, the dross removal mode M2 ​​(or the dross removal process as the above-mentioned fifth step ST5) may include moving a rotating tool 91 along the first side surface 21a-1 of the first plate member 21-1, and then moving the rotating tool 91 along the second side surface 21b-1 of the first plate member 21-1.

[0127] 21 and 22 , the dross removal mode M2 ​​(or the dross removal process as the fifth step ST5 described above) may include moving the rotating tool 91 along a first path PA1 and a second path PA2. The first path PA1 is adjacent to the first plate member 21-1, is located between the first plate member 21-1 and the second plate member 21-2, and extends along the longitudinal direction of the first plate member 21-1. The second path PA2 is adjacent to the second plate member 21-2, is located between the first plate member 21-1 and the second plate member 21-2, and extends along the longitudinal direction of the second plate member 21-2.

[0128] As the rotating tool 91 passes through both the first path PA1 and the second path PA2, multiple pieces of dross D are efficiently removed from the side of the first plate member 21-1 facing the second plate member 21-2, and multiple pieces of dross D are efficiently removed from the side of the second plate member 21-2 facing the first plate member 21-1.

[0129] 36, the dross removal mode M2 ​​(or the dross removal process as the fifth step ST5 described above) may include moving the rotating tool 91 along a third path PA3 and a fourth path PA4. The third path PA3 is adjacent to the second plate member 21-2, is located between the second plate member 21-2 and the third plate member 21-3, and extends along the longitudinal direction of the second plate member 21-2. The fourth path PA4 is adjacent to the third plate member 21-3, is located between the second plate member 21-2 and the third plate member 21-3, and extends along the longitudinal direction of the third plate member 21-3.

[0130] By the rotating tool 91 passing through both the third path PA3 and the fourth path PA4, multiple pieces of dross D are efficiently removed from the side of the second plate member 21-2 facing the third plate member 21-3, and multiple pieces of dross D are efficiently removed from the side of the third plate member 21-3 facing the second plate member 21-2.

[0131] As illustrated in Figure 36, the dross removal mode M2 ​​(or the dross removal process as the above-mentioned fifth step ST5) may include moving a rotating tool 91 along a path PA that, in a planar view, corresponds to the shape of a rectangular wave extended in a direction parallel to the first direction DR1, so that multiple pieces of dross D are sequentially removed from multiple plate members 21.

[0132] In the example shown in FIG. 36 , when the tool 91 moves across the first plate member 21-1 (see arrow F3), the control device 7 may send an elevation command to the movement device 5 (more specifically, the first drive device 51b) and then a descending command. The movement device 5 (more specifically, the first drive device 51b) receiving the elevation command temporarily elevates the tool 91. In this way, interference between the tool 91 and the first plate member 21-1 is prevented when the tool 91 moves across the first plate member 21-1. Furthermore, the movement device 5 (more specifically, the first drive device 51b) receiving the descending command lowers the tool 91. In this way, dross removal by the tool 91 continues.

[0133] Alternatively, or additionally, as illustrated in FIG. 23, the dross removal mode M2 ​​may be a mode that includes removing dross D from the multiple top portions TP of the support member 2 by moving a rotating tool 91 (e.g., a cutting tool 91m) along a first plane PL1 on which the multiple top portions TP of the support member 2 are located.

[0134] During execution of the dross removal mode M2 ​​(or during execution of the dross removal process as the fifth step ST5 described above), it is preferable that the control device 7 fully automatically controls the position of the rotating tool 91. In this case, the operator is not constrained by the dross removal work. For example, the dross removal work can be performed unmanned. The time required for the dross removal mode (in other words, the time from when the removal of dross from the support member 2 begins to when the removal of dross from the support member 2 is completed) is, for example, 30 minutes or more, 45 minutes or more, or 60 minutes or more. By automating the time-consuming dross removal work, the burden on the operator is reduced.

[0135] (Second machining mode M3) The control device 7 may be able to execute a second machining mode M3 in which the plate material W is machined by the second tool 92 held by the second head 41. The control device 7 executes the second machining mode M3 by controlling the rotation drive device 44 and the movement device 5. As illustrated in Fig. 25 , the second machining mode M3 is a mode in which the second head 41 supporting the second tool 92 is moved while the second tool 92 is rotated so that the plate material W supported by the support member 2 is machined (for example, so that the plate material W supported by the support member 2 is drilled).

[0136] For example, in the example shown in FIG. 37 , the control device 7 executing the program 722 (more specifically, the third program 722c) transmits a rotation command R1 to the rotation drive device 44. The control device 7 executing the program 722 (more specifically, the third program 722c) transmits a movement command S to the movement device 5 based on the third path data 726c stored in the memory 72. The rotation drive device 44, which receives the rotation command R1, rotates the second tool 92 around the rotation axis AX. The movement device 5, which receives the movement command S, moves the second tool 92 along the third movement path. For example, the first drive device 51b, which receives the movement command S, moves the second tool 92 in a direction perpendicular to the plate material W. In this way, the rotating second tool 92 comes into contact with the plate material W so that the plate material W placed on the support member 2 (more specifically, the plurality of plate members 21) is machined. The second tool 92 may be a drill or a threading tool (e.g., a tapping tool).

[0137] (Tool Change Mode M4) The control device 7 may be capable of executing a tool change mode M4 in which the tool supported by the second head 41 is replaced with another tool. The control device 7 executes the tool change mode M4 by controlling the moving device 5 and the tool change device 8.

[0138] In the example shown in Figure 33 or 34, tool change mode M4 may include replacing the second tool 92 or dummy tool 93 held by the second head 41 with a tool 91 for removing dross.

[0139] For example, the control device 7 executing the program 722 (more specifically, the fourth program 722d) transmits a movement command S to the movement device 5. Furthermore, the control device 7 executing the program 722 (more specifically, the fourth program 722d) transmits a tool change command C1 to the tool change device 8. The movement device 5 receiving the movement command S moves the second head 41 to the tool change position P3. Furthermore, the tool change device 8 receiving the tool change command C1 replaces the second tool 92 or the dummy tool 93 held by the second head 41 with the tool 91 for removing dross.

[0140] (Work plate transport mode M5) The control device 7 may be capable of executing a work plate transport mode M5 for transporting the work plate W. The control device 7 executes the work plate transport mode M5 by controlling the work plate transport device 6 (see FIGS. 3 and 9).

[0141] For example, the control device 7 executing the program 722 (more specifically, the fifth program 722e) transmits a first transfer command to the workpiece transfer device 6. Upon receiving the first transfer command, the workpiece transfer device 6 places the workpiece W on the support member 2 (see arrow F1 in FIG. 3 ).

[0142] Furthermore, the control device 7 executing the program 722 (more specifically, the fifth program 722e) transmits a second transfer command to the workpiece transfer device 6. Upon receiving the second transfer command, the workpiece transfer device 6 removes the processed workpiece Wb from the support member 2 (see arrow F2 in FIG. 9 ).

[0143] (Laser processing method) The above-mentioned loading process (second step ST2) may include the control device 7 sending a first transfer command to the plate material transfer device 6, and the plate material transfer device 6 receiving the first transfer command loading the plate material W onto the support member 2.

[0144] As illustrated in Figure 26, the above-mentioned plate material processing process (third step ST3) may include the control device 7 sending an injection command E1 to the laser irradiation device 3, the laser irradiation device 3 receiving the injection command E1 emitting a laser from the laser emission port, the control device 7 sending a movement command S to the moving device 5, and the moving device 5 receiving the movement command S moving the first head 31 along the first movement path.

[0145] As illustrated in Figure 37, the above-mentioned plate processing process (third step ST3) may include the control device 7 sending a rotation command R1 to the rotation drive device 44, the rotation drive device 44 receiving the rotation command R1 rotating the second tool 92 around the rotation axis AX, the control device 7 sending a movement command S to the moving device 5, and the moving device 5 receiving the movement command S moving the second tool 92 along the third movement path.

[0146] The above-mentioned removal process (fourth step ST4) may include the control device 7 sending a second transfer command to the plate material transfer device 6, and the plate material transfer device 6 receiving the second transfer command removing the processed plate material Wb from the support member 2.

[0147] The laser processing method may include a step of replacing the tool held by the second head 41 with another tool (in other words, a tool changing step). The tool changing step may be performed between the removing step (fourth step ST4) and the dross removing step (fifth step ST5).

[0148] 33 , the tool changing process includes replacing the second tool 92 held by the second head 41 with the tool 91. In the example shown in FIG. 34 , the tool changing process includes replacing the dummy tool 93 held by the second head 41 with the tool 91.

[0149] The above-mentioned tool changing process may include the control device 7 sending a movement command S to the moving device 5, the moving device 5 receiving the movement command S moving the second head 41 to the tool changing position P3, the control device 7 sending a tool changing command C1 to the tool changing device 8, and the tool changing device 8 receiving the tool changing command C1 replacing the second tool 92 or dummy tool 93 held by the second head 41 with the tool 91.

[0150] As illustrated in Figure 29, the above-mentioned dross removal process (fifth step ST5) may include the control device 7 sending a rotation command R1 to the rotation drive device 44, the rotation drive device 44 receiving the rotation command R1 rotating the tool 91 around the rotation axis AX, the control device 7 sending a movement command S to the moving device 5, and the moving device 5 receiving the movement command S moving the tool 91 along the second movement path.

[0151] (Program 722) Program 722 in the embodiment (more specifically, program 722 including first program 722a, second program 722b, third program 722c, fourth program 722d, and fifth program 722e) is a program for causing the laser processing apparatus 1 (more specifically, the control device 7 of the laser processing apparatus 1) to execute at least the plate material processing step (third step ST3) and the dross removal step (fifth step ST5) of the above-mentioned laser processing method.

[0152] More specifically, the program 722 in the embodiment is a program for causing the laser processing apparatus 1 (more specifically, the control device 7 of the laser processing apparatus 1) to execute a laser processing method including: (1) a step of processing the plate material W by irradiating the plate material W placed on the support member 2 with a laser (third step ST3); and (2) a step of removing the dross D from the support member 2 by bringing a rotating tool 91 into contact with the dross D that has adhered to the support member 2 due to the irradiation of the plate material W with the laser (fifth step ST5).

[0153] The program 722 in the embodiment may be a program for causing the laser processing apparatus 1 (more specifically, the control device 7 of the laser processing apparatus 1) to execute a laser processing method including: (1) a step of placing the plate material W on the support member 2 (second step ST2); (2) a step of processing the plate material W by irradiating the plate material W placed on the support member 2 with a laser (third step ST3); (3) a step of removing the processed plate material Wb from the support member 2 (fourth step ST4); and (4) a step of removing the dross D from the support member 2 by bringing a rotating tool 91 into contact with the dross D that has adhered to the support member 2 due to the laser irradiation of the plate material W (fifth step ST5).

[0154] The program 722 in the embodiment includes: (1) a step of placing the plate material W on the support member 2 (placing step); (2) a step of processing the plate material W by irradiating the plate material W placed on the support member 2 with a laser (plate material processing step); (3) a step of processing the plate material W placed on the support member 2 with a second tool 92 held by the second head 41 (plate material processing step); (4) a step of removing the processed plate material Wb from the support member 2 (removing step); and (5) a step of removing the second tool 92 from the second head 41. The program may be a program for causing the laser processing apparatus 1 (more specifically, the control device 7 of the laser processing apparatus 1) to execute a laser processing method including: (6) a step of removing the tool 91 from the support member 2 (tool changing step); (7) a step of removing the tool 91 from the support member 2 (dross removing step) by bringing the rotating tool 91 held by the second head 41 into contact with the dross D that has adhered to the support member 2 due to the laser being irradiated onto the plate material W.

[0155] The details of the loading process (second step ST2), the plate processing process (third step ST3), the removal process (fourth step ST4), the tool replacement process, and the dross removal process (fifth step ST5) have already been explained in the first embodiment above, so the details of these processes will not be explained here.

[0156] The memory 72 in the embodiment may be a nonvolatile storage medium on which the above-described program 722 (more specifically, the program 722 including a first program 722a, a second program 722b, a third program 722c, a fourth program 722d, and a fifth program 722e) is recorded. The nonvolatile storage medium on which the above-described program 722 is recorded may be a portable storage medium 72M, as illustrated in FIG. 38 .

[0157] The present invention is not limited to the above-described embodiments or modifications, and it is clear that each embodiment or modification can be appropriately modified or changed within the scope of the technical concept of the present invention. Furthermore, various techniques used in each embodiment or modification can be applied to other embodiments or modifications as long as no technical contradiction occurs. Furthermore, optional additional configurations in each embodiment or modification can be omitted as appropriate.

[0158] For example, in the above-described embodiment, the tool 91 attached to the head 40 (more specifically, the second head 41) is a cutting tool 91m, and the cutting tool 91m has a cutting edge 910m that comes into contact with the dross D (see FIGS. 18 and 23 if necessary). Alternatively, as illustrated in FIGS. 39 and 40, the tool 91 attached to the head 40 (more specifically, the second head 41) may include a shaft member 911 and at least one wire rod 913 attached to the shaft member 911. The wire rod 913 is made of, for example, metal.

[0159] 39 and 40 , the shaft member 911 and at least one wire rod 913 are rotated around the rotation axis AX. Furthermore, while the tool 91 is rotating around the rotation axis AX (more specifically, while the shaft member 911 and at least one wire rod 913 are rotating around the rotation axis AX), the at least one wire rod 913 comes into contact with the dross D, thereby removing the dross D from the support member 2 (more specifically, from the plate member 21).

[0160] As illustrated in Figure 39, in the dross removal process (fifth step ST5), a tool 91 rotating around a rotation axis AX moves along the longitudinal direction of the first side surface 21a-1 of the first plate member 21-1, and multiple pieces of dross D adhering to the first side surface 21a-1 may be removed from the first side surface 21a-1 using at least one wire rod 913.

[0161] Alternatively, or additionally, as illustrated in Figure 40, in the dross removal process (fifth step ST5), a tool 91 rotating around the rotation axis AX may move along a first plane PL1 on which the multiple top portions TP of the support member 2 are located, thereby removing multiple pieces of dross D attached to the multiple top portions TP from the multiple top portions TP using at least one wire 913.

[0162] 18, 23, 39, and 40, the tool 91 is a dross removal tool that rotates around the rotation axis AX. In this case, the term "tool 91" in this specification may be read as "dross removal tool."

[0163] 39 and 40 , a plurality of hair-like wires 913 are attached to the shaft member 911. Alternatively, or additionally, the wires 913 may include a coiled wire attached to the shaft member 911. In the example shown in FIGS. 39 and 40 , a proximal end of the wires 913 is attached to the shaft member 911. Alternatively, or additionally, the wires 913 may be wound around the shaft member 911.

[0164] 1...laser processing device, 1A...combined processing machine, 2...support member, 3...laser irradiation device, 5...moving device, 6...plate material transfer device, 7...control device, 8...tool change device, 15...transfer device, 21, 21E, 21F...plate member, 21-1...first plate member, 21-2...second plate member, 21-3...third plate member, 21-4...fourth plate member, 21a-1...first side surface, 21a-2...side surface, 21b-1...second side surface, 21c...first end portion, 21d...second end portion, 23...frame body, 25...bottom plate, 31...first head, 31a...head main body, 31b...attachment, 33...re Laser light source, 35...optical component, 40...head, 41...second head, 42...rotating body, 43...frame, 44...rotation drive device, 44m...motor, 50...base, 51...first moving device, 51a...first moving body, 51b...first drive device, 53...second moving device, 53a...second moving body, 53b...second drive device, 55...third moving device, 55a...third moving body, 55b...third drive device, 57...fourth moving device, 57a...fourth moving body, 57b...fourth drive device, 58a...fifth moving body, 58b...fifth drive device, 60...robot hand, 61...suction cup, 70...Hardware processor, 72...Memory, 72M...Storage medium, 74...Communication circuit, 76...Input device, 78...Bus, 81...Tool change arm, 91...Tool, 91m...Cutting tool, 92...Second tool, 93...Dummy tool, 722...Program, 722a...First program, 722b...Second program, 722c...Third program, 722d...Fourth program, 722e...Fifth program, 726a...First path data, 726b...Second path data, 726c...Third path data, 762...Touch panel display, 91 0m...cutting edge, 911...shaft member, 913...wire rod, AR1...non-target area of ​​laser irradiation, AR2...target area of ​​laser irradiation, AX...rotation axis, AX1...first axis, AX2...second axis, B...laser, BP...bottom, C1...tool change command, D...dross, E1...injection command, EG...edge portion, OP...laser injection port, PT...pallet, R1...rotation command, RG1...machining area, RG2...removal area, S...movement command, TP...top, Te...tip, W...plate material, W1...part, W2...scrap material, Wa...plate material before machining, Wb...machined plate material, Wh...through hole

Claims

1. A laser processing method comprising the steps of: placing a plate material on a support member; processing the plate material by irradiating the plate material placed on the support member with a laser; removing the processed plate material from the support member; and removing dross from the support member by contacting a rotating tool with the dross that has adhered to the support member as a result of the laser being irradiated onto the plate material.

2. The laser processing method according to claim 1, wherein the step of processing the plate material includes irradiating the laser from a first head of a multi-purpose machining center to the plate material, and the step of removing the dross from the support member includes contacting the tool attached to a second head of the multi-purpose machining center with the dross adhering to the support member while the tool is rotating around a rotation axis.

3. A laser processing method as claimed in claim 1 or 2, wherein the processing of the plate material by the laser and the removal of the dross from the support member are carried out in the same area in a plan view.

4. A laser processing method according to any one of claims 1 to 3, wherein the support member has a plurality of plate members arranged in an upright position relative to a horizontal plane, and the step of removing the dross from the support member includes bringing the tool in a rotating state into contact with the dross adhering to at least one of the plurality of plate members.

5. A laser processing method according to any one of claims 1 to 4, wherein the support member includes a first plate member, and the step of removing the dross from the support member includes moving the tool in a rotating state along the longitudinal direction of the first plate member so that the tool in a rotating state comes into contact with the dross adhering to the first plate member.

6. A laser processing method according to any one of claims 1 to 4, wherein the support member includes a first plate member and a second plate member, and the step of removing the dross from the support member includes moving the tool in a rotating state along a first path located between the first plate member and the second plate member so that the tool in a rotating state comes into contact with the dross adhering to the first plate member.

7. The laser processing method described in claim 6, wherein the step of removing the dross from the support member includes moving the tool in a rotating state along a second path located between the first plate member and the second plate member so that the tool in a rotating state contacts the dross adhering to the second plate member, the first path being a path closer to the first plate member than the second path, and the second path being a path closer to the second plate member than the first path.

8. A laser processing method according to any one of claims 1 to 5, wherein the support member has a plurality of apexes supporting the plate material, and the step of removing the dross from the support member includes moving the tool in a rotating state along a first plane on which the plurality of apexes are located, so that the tool in a rotating state contacts the dross adhering to at least one of the plurality of apexes.

9. A laser processing method as described in any one of claims 1 to 8, further comprising the steps of: attaching a second tool to a head; contacting the rotating second tool with the plate material placed on the support member, thereby processing the plate material with the second tool attached to the head; removing the second tool from the head; and attaching the tool for dross removal to the head, wherein the step of removing the dross from the support member includes contacting the rotating tool for dross removal with the dross adhering to the support member.

10. A laser processing method according to any one of claims 1 to 9, wherein the tool includes a shaft member and at least one wire attached to the shaft member, and the dross is removed from the support member by contacting the at least one wire with the dross.

11. A laser processing apparatus comprising: a laser irradiation device including a first head which irradiates a laser onto a plate material supported by a support member; a second head which rotatably supports a tool; a rotary drive device which rotates the tool; a moving device which moves the second head relatively to the support member; and a control device which controls the laser irradiation device, the rotary drive device, and the moving device, wherein the control device is capable of selectively executing a first processing mode in which the laser is irradiated onto the plate material from the first head; and a dross removal mode in which dross adhering to the support member due to the laser being irradiated onto the plate material is removed from the support member by bringing the rotating tool into contact with the dross.

12. The laser processing apparatus according to claim 11, wherein the moving device comprises: a moving body that supports both the first head and the second head; and a driving device that moves the moving body.

13. The laser processing device according to claim 11 or 12, wherein the control device is capable of executing a second processing mode in which the plate material is processed by a second tool held by the second head.

14. A laser processing apparatus as claimed in any one of claims 11 to 13, wherein the control device derives a movement path of the tool such that the tool passes through a region of the support member that is a target region of the laser irradiation in a concentrated manner compared to a region of the support member that is not a target region of the laser irradiation, and the dross removal mode includes moving the tool in a rotating state along the movement path.

15. A program for causing a laser processing device to execute a laser processing method comprising: a step of processing a plate material placed on a support member by irradiating the plate material with a laser; and a step of removing dross from the support member by contacting a rotating tool with the dross that has adhered to the support member as a result of the plate material being irradiated with the laser.

Images