Resin molding system and method for producing resin molded product

Abstract

This resin molding system comprises: a molding die (C) which includes a positioning part (37a) for positioning a molding target object (Sa) having a positioning hole (49a) and on which the molding target object (Sa) is placed in a state in which the positioning part (37a) is passed through the positioning hole (49a); and a transport device having a shift mechanism (16) for bringing the positioning hole (49a) into contact with the positioning part (37a) to thereby position the molding target object (Sa) with respect to the positioning part (37a).

Description

Resin molding system and method for manufacturing resin molded product

[0001] The present disclosure relates to a resin molding system and a method for manufacturing a resin molded product.

[0002] A substrate on which a semiconductor chip or the like is fixed is generally used as an electronic component by being resin-encapsulated. Conventionally, a resin molding system for resin-encapsulating a substrate or the like that includes a molding die has been known (see, for example, Patent Document 1).

[0003] Patent Document 1 discloses a resin molding system (referred to as a semiconductor device in Patent Document 1) having a molding die including an upper die and a lower die. The resin molding system in Patent Document 1 describes a configuration for positioning a substrate relative to the lower die. The substrate has a main positioning hole (referred to as a hole in Patent Document 1) with a circular opening that serves as a reference point in the longitudinal center of the substrate, and two sub-positioning holes with elongated openings on either side of the main positioning hole in the longitudinal direction. The lower die has three positioning portions (referred to as pins in Patent Document 1) with circular planar shapes that correspond to the three positioning holes in the substrate. The substrate is positioned relative to the lower die by passing the three positioning portions corresponding to the three positioning holes. In particular, the substrate is positioned by the main positioning hole and the corresponding positioning portions.

[0004] JP 2011-077267 A

[0005] In the resin molding system described in Patent Document 1, the inner diameter of the main positioning hole is slightly larger than the outer diameter of the corresponding positioning part to make it easier to place the substrate on the lower mold. Furthermore, the length of the elongated opening of the sub-positioning hole along the short side of the substrate is larger than the inner diameter of the main positioning hole. Therefore, even when the substrate is placed on the lower mold, i.e., when the positioning part is inserted through the main positioning hole, the substrate can move slightly in any direction relative to the lower mold. This may result in insufficient positioning accuracy depending on the type of semiconductor chip.

[0006] Therefore, there is a demand for a resin molding system and a method for manufacturing a resin molded product that can position a substrate relative to a molding die with high precision.

[0007] One embodiment of the resin molding system according to the present disclosure comprises a mold having a positioning section for positioning a molded object having a positioning hole, on which the molded object is placed with the positioning section passed through the positioning hole, and a conveying device having a pushing mechanism for positioning the molded object relative to the positioning section by bringing the positioning hole into contact with the positioning section.

[0008] One embodiment of the method for manufacturing a resin molded product according to the present disclosure is a method for manufacturing a resin molded product using the resin molding system described above, and includes a supply step in which the object to be molded is placed on the molding mold so that the positioning portion passes through the positioning hole, and then the positioning hole is brought into contact with the positioning portion by the alignment mechanism to position the object to be molded relative to the positioning portion and supply resin material, a mold clamping step in which the molding mold is clamped by a mold clamping mechanism, and a molding step in which the object to be molded is resin molded.

[0009] According to the embodiments of the present disclosure, it is possible to provide a resin molding system and a method for manufacturing a resin molded product that can position a substrate with respect to a molding die with high precision.

[0010] Fig. 1 is a schematic plan view showing a resin molding system; Fig. 2 is a schematic front view showing a molding mold; Fig. 3 is a schematic front view showing a loader; Fig. 4 is a cross-sectional view showing the movement of the loader when placing the pre-molded substrate on the lower mold; Fig. 5 is a cross-sectional view showing the movement of the loader when placing the pre-molded substrate on the lower mold; Fig. 6 is a cross-sectional view showing the movement of the loader when placing the pre-molded substrate on the lower mold; Fig. 7 is a schematic view showing the movement of the shifting mechanism when positioning the pre-molded substrate relative to the lower mold.

[0011] Hereinafter, embodiments of a resin molding system and a method for manufacturing a resin molded product according to the present disclosure will be described with reference to the drawings. However, the present disclosure is not limited to the following embodiments, and various modifications are possible without departing from the spirit and scope of the present disclosure.

[0012] Substrates (molding objects) with semiconductor chips or the like fixed thereto can be resin-encapsulated for use as electronic components. Techniques for resin-encapsulating molding objects include the transfer method. One transfer method involves supplying a release film to the upper die of a molding die, placing the molding object on the lower die, supplying a resin tablet made of solidified powdered resin to the mold pot, heating and melting it, and then supplying the molten resin into the cavity to resin-mold the molding object.

[0013] The resin tablet is formed of a solid resin obtained by compressing powdered resin and melting it into a liquid molten resin when heated. The resin tablet may be a thermoplastic resin or a thermosetting resin. The viscosity of a thermosetting resin decreases when heated, and when heated further, it polymerizes and hardens to become a hardened resin. As explained below, when a pre-molded substrate on which a semiconductor chip or the like is fixed is resin-molded and sealed, it is desirable to use a thermosetting resin.

[0014] [Overall Configuration] A transfer-type resin molding system 30 will be described below as an example. FIG. 1 shows a schematic plan view of the resin molding system 30 in this embodiment. The resin molding system 30 includes a storage module 2, a molding module 3, a supply module 4, a control unit 6, a loader 10 (an example of a conveying device), and an unloader 42. The molding module 3 is a part that resin-encapsulates the molding object, and has a molding die C that holds a pre-molded substrate Sa (an example of a molding object). The molding die C has an upper die UM and a lower die LM. The resin molding system 30 in this embodiment is an apparatus that resin-moldes a pre-molded substrate Sa to which a semiconductor chip 48 is fixed.

[0015] The supply module 4 is for supplying pre-molded substrates Sa and resin tablets T (an example of a resin material) to the molding module 3, and includes a substrate supply mechanism 43 and a resin supply mechanism 45. The substrate supply mechanism 43 stocks pre-molded substrates Sa and arranges the pre-molded substrates Sa in a state suitable for transport. A plurality of semiconductor chips 48 are aligned vertically and / or horizontally and fixed to the pre-molded substrate Sa. The resin supply mechanism 45 stocks resin tablets T and arranges the resin tablets T in a state suitable for transport. Note that the pre-molded substrate Sa may have only one semiconductor chip 48 fixed thereto.

[0016] The loader 10 is on standby in the supply module 4. Inside the supply module 4, the loader 10 receives a pre-molded substrate Sa from the substrate supply mechanism 43 and also receives a resin tablet T from the resin supply mechanism 45, and moves from the supply module 4 to the molding module 3 on rails (not shown) arranged on the rear side (upper side in FIG. 1 ) from the supply module 4 to the molding module 3. The loader 10 then delivers the pre-molded substrate Sa and the resin tablet T to the lower mold LM of the molding module 3. Thereafter, the loader 10 moves again on the rails to the supply module 4.

[0017] The molding module 3 resin-seals the pre-molded substrate Sa using the molding die C to form a molded substrate Sb (an example of a resin molded product). In this embodiment, one molding module 3 is provided, but two or more may be provided. In the case of two or more molding modules, each molding module 3 can be attached or detached independently.

[0018] The storage module 2 has a substrate storage section 46. The unloader 42 waits inside the storage module 2, moves along rails (not shown) arranged on the rear side (upper side in FIG. 1 ) from the storage module 2 to the molding module 3, removes the molded substrate Sb from the molding module 3, and then moves along the rails again to the storage module 2 to store the molded substrate Sb in the substrate storage section 46. In the molded substrate Sb, the semiconductor chip 48 is sealed with a cured resin formed by solidifying molten resin Ta (an example of a resin material).

[0019] The control unit 6 includes a processor such as a CPU (Central Processing Unit) and a storage device such as a RAM (Random Access Memory). The control unit 6 controls the operation of the resin molding system 30 by executing a control program stored in the storage device with the processor. The operation of the resin molding system 30 described below is performed based on operation commands from the control unit 6, unless otherwise specified. In the following description, explanation of the operation commands from the control unit 6 will be omitted in principle, and the operation commands from the control unit 6 will be explained as necessary.

[0020] The resin molding system 30 of the molding module 3 will be described in detail below.

[0021] 2, the molding module 3 has a lower mold LM of the molding die C equipped with a transfer mechanism 72, an upper mold UM disposed opposite the lower mold LM and having an upper mold cavity MCa into which molten resin Ta is injected, and a mold clamping mechanism 5 that clamps the lower mold LM and the upper mold UM together. The lower mold LM is mounted via a lower mold holder 34 on a movable platen 35 that is raised and lowered by the mold clamping mechanism 5. The upper mold UM is mounted via an upper platen 32 on an upper fixed platen (not shown). The mold clamping mechanism 5 may be, for example, a combination of a servo motor and a ball screw mechanism, or a combination of an air cylinder or hydraulic cylinder and a rod.

[0022] In the molding die C of this embodiment, two pre-molded substrates Sa are placed on either side of the pot block 71 of the lower die LM, and two pre-molded substrates Sa are resin molded in one resin molding operation. However, this configuration is not particularly limited, and a configuration in which one pre-molded substrate Sa is resin molded in one resin molding operation may also be used. The operation of the mold clamping mechanism 5 is controlled by the control unit 6. The pre-molded substrate Sa is transported between the upper die UM and the lower die LM by the loader 10, and then placed on the lower die LM. A release film F is placed on the upper die UM in which the upper die cavity MCa is formed. As the material for the release film F, a resin material having properties such as heat resistance, releasability, flexibility, and extensibility is used, and examples thereof include PTFE (polytetrafluoroethylene), ETFE (ethylene / tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene / hexafluoropropylene copolymer), polypropylene, polystyrene, and polyvinylidene chloride.

[0023] The resin injection mechanism 7 includes a pot block 71 having a pot 71a for accommodating a resin tablet T, and a transfer mechanism 72 having a plunger 72a provided in the pot 71a. The transfer mechanism 72 includes the plunger 72a and a plunger drive mechanism 72c for driving the plunger 72a. The plunger 72a pressure-feeds the molten resin Ta that is formed when the resin tablet T accommodated in the pot 71a is heated and melted. The operation of the plunger drive mechanism 72c is controlled by the control unit 6.

[0024] The plunger drive mechanism 72c moves the plungers 72a up and down collectively by the same amount relative to the pots 71a. In this embodiment, the plunger drive mechanism 72c is provided below the plungers 72a. For example, the plunger drive mechanism 72c may be a combination of a servo motor and a ball screw mechanism, or a combination of an air cylinder or hydraulic cylinder and a rod.

[0025] The pot block 71 is disposed so as to be at the same height as the pre-molded substrate Sa when the pre-molded substrate Sa is placed on the lower mold LM. In other words, the end surface 71b of the pot block 71 protrudes further toward the upper mold UM than the upper surface 36 of the lower mold LM.

[0026] The upper mold UM has an upper mold cavity MCa formed therein, which accommodates the semiconductor chip 48 fixed to the pre-molding substrate Sa and into which the molten resin Ta is injected. The upper mold UM also has a cull portion 81, which is a recess, formed in a portion facing the pot 71a, and a runner portion 82 connecting the cull portion 81 and the upper mold cavity MCa. The upper mold UM also has an air vent (not shown) formed on the opposite side of the upper mold cavity MCa from the pot 71a.

[0027] When the upper mold UM and lower mold LM are clamped by the mold clamping mechanism 5, a resin flow path formed by the cull portion 81 and the runner portion 82 connects the multiple pots 71a to the upper mold cavity MCa. At this time, the pre-molded substrate Sa is sandwiched between the lower surface of the upper mold UM and the upper surface 36 of the lower mold LM. In this state, the plunger 72a is raised by the plunger drive mechanism 72c to inject molten resin Ta into the upper mold cavity MCa, thereby resin-sealing the semiconductor chip 48 of the pre-molded substrate Sa.

[0028] On the surface of the lower mold LM facing the upper mold UM, multiple (three in this embodiment) positioning pins 37 (an example of a positioning portion) are arranged facing the upper mold UM. The three positioning pins 37 are arranged on the upper surface 36 of the lower mold LM. More specifically, one of the three positioning pins 37 is arranged on the side closer to the pot block 71 with respect to the upper mold cavity MCa, in the center of the upper surface 36 of the lower mold LM. The other two positioning pins 37 are arranged along the pot block 71, sandwiching the one positioning pin 37 arranged in the center of the upper surface 36 of the lower mold LM. Each of the three positioning pins 37 has a cylindrical shape (circular cross section) with a diameter of 1.5 mm and a height of 1.5 mm, for example. Each of the three positioning pins 37 has a pin shape with a C-chamfered tip, resulting in a pointed tip.

[0029] Hereinafter, one positioning pin 37 arranged in the center of the upper surface 36 of the lower mold LM on the side closer to the pot block 71 will be referred to as a first positioning pin 37a (an example of a positioning portion). The two positioning pins 37 arranged on either side of the first positioning pin 37a will be referred to as second positioning pins 37b (see FIG. 7 ). When there is no need to distinguish between the one first positioning pin 37a and the two second positioning pins 37b, they will simply be referred to as positioning pins 37. The three positioning pins 37 are inserted into multiple (three in this embodiment) positioning holes 49 formed on the outer edge of the pre-molded substrate Sa, thereby positioning the pre-molded substrate Sa relative to the lower mold LM. The positioning pin 37 may be a stepped pin including a thick, large-diameter portion at the bottom and a thin, small-diameter portion at the top.

[0030] Of the three positioning holes 49 of the pre-molding substrate Sa, the one positioning hole 49 through which the first positioning pin 37a passes is referred to as the first positioning hole 49a (an example of a positioning hole), and the two positioning holes 49 through which the second positioning pin 37b passes are referred to as the second positioning holes 49b (see FIG. 7 ). When there is no need to distinguish between the one first positioning hole 49a and the two second positioning holes 49b, they are simply referred to as the positioning holes 49. In this embodiment, the plate surface of the pre-molding substrate Sa is rectangular. Hereinafter, of the four sides that make up the plate surface of the pre-molding substrate Sa, the two sides along the arrangement direction of the three positioning holes 49 are referred to as the long sides 47a, and the two sides perpendicular to the long sides 47a are referred to as the short sides 47b. The first positioning hole 49a has a square shape when viewed in a direction perpendicular to the surface of the pre-molded substrate Sa (a direction perpendicular to the upper surface 36 of the lower mold LM when the pre-molded substrate Sa is placed on the lower mold LM), and each side (each inner surface) of the first positioning hole 49a is parallel to the long side 47a and short side 47b of the pre-molded substrate Sa. The second positioning hole 49b has two sides parallel to the long side 47a, and the ends of one side and the other side of the two sides are connected by concave curves (e.g., arcs) that bulge outward relative to the two parallel sides. The distance between the two parallel sides of the second positioning hole 49b is sufficient to allow the second positioning pin 37b to fit in without any gaps (e.g., just over 1.5 mm). The distance between the two opposing sides of the first positioning hole 49a is greater (e.g., 1.8 mm). Hereinafter, the direction parallel to the long sides 47 a of the pre-molding substrate Sa will be referred to as the longitudinal direction, and the direction parallel to the short sides 47 b will be referred to as the short direction. Note that the shape of the first positioning hole 49 a when viewed along a direction perpendicular to the plate surface of the pre-molding substrate Sa may be rectangular as long as each side is parallel to the long sides 47 a and short sides 47 b of the pre-molding substrate Sa.

[0031] [Loader Configuration] Next, a specific configuration of the loader 10 in this embodiment will be described with reference to Figures 3 and 4. In Figures 3 to 6, the semiconductor chips 48 fixed to the pre-molded substrates Sa are not shown. Also, in Figures 3 to 6, the configuration of the loader 10 for one of the two pre-molded substrates Sa placed on either side of the lower mold LM with the pot block 71 sandwiched between them will be described. As described above, the molding mold C of this embodiment is a molding mold C that resin-moldes two pre-molded substrates Sa in a single resin molding operation. Therefore, a similar configuration is provided for the other of the two pre-molded substrates Sa (see Figure 2) placed on either side of the lower mold LM with the pot block 71 sandwiched between them in the portion of the base member 11 indicated by the omitted lines in Figures 3 to 6.

[0032] 3, the loader 10 includes a base member 11 that is movably mounted along a rail (not shown), and a base member lifting / moving mechanism (not shown) that raises and lowers the base member 11. The base member 11 includes a substrate holding section 13 that holds the pre-molded substrate Sa, a presser section 14 that presses down the pre-molded substrate Sa placed on the lower mold LM, a moving mechanism 16 that positions the pre-molded substrate Sa, and a presser section lifting / moving mechanism (not shown) that raises and lowers the presser section 14. The base member 11 also includes a resin holding section (not shown) that holds a resin tablet T.

[0033] The substrate holder 13 has a holding claw 13a, a drive unit 13b, a lever 13c, a link 13d, and a shaft 13e.

[0034] The holding claws 13a according to this embodiment are configured to hold the rectangular pre-molded substrate Sa in the loader 10 by hooking opposing long sides 47a of the pre-molded substrate Sa (see FIG. 4). A plurality of holding claws 13a (four in this embodiment) are arranged at the end on the pot 71a side, and a plurality of holding claws 13a (four in this embodiment) are arranged at the end opposite the end on the pot 71a side. The holding claws 13a are configured to be openable and closable by swinging about a shaft 13e. When the holding claws 13a are closed, they hook the long sides 47a of the pre-molded substrate Sa to hold the pre-molded substrate Sa in the loader 10. When the holding claws 13a are opened, the pre-molded substrate Sa is released from the hook and released from the hold. The released pre-molded substrate Sa falls from the loader 10 and is placed on the mold surface of the lower mold LM (see FIG. 5).

[0035] The drive unit 13b is, for example, an air cylinder, and can move the lever 13c up and down. The lever 13c connects the drive unit 13b to a link 13d. The link 13d connects the lever 13c to the holding claw 13a and is configured to be swingable relative to the lever 13c and the holding claw 13a. The shaft 13e passes through the multiple holding claws 13a arranged at the pot-side end and the multiple holding claws 13a arranged at the opposite end, and serves as a swing fulcrum for the holding claw 13a.

[0036] The presser 14 is arranged to press the pre-molded substrate Sa, which is placed on the lower mold LM with the positioning pins 37 formed in the lower mold LM inserted through the positioning holes 49, toward the lower mold LM by pressing the outer edge of the pre-molded substrate Sa toward the lower mold LM. The presser 14b is connected to two connecting shafts 14a and moves up and down (up and down) together with the connecting shafts 14a. In this embodiment, both connecting shafts 14a pass through the base member 11 and are connected to each other above the base member 11. The pre-molded substrate Sa is held by being sandwiched between the holding claws 13a of the substrate holder 13 and the presser 14.

[0037] The pressing section 14 includes a pressing member 14b. The pressing member 14b is formed in a frame shape so that it can press the outer edge of the pre-molded substrate Sa toward the lower mold LM. The inside of the frame is recessed, and the semiconductor chip 48 fixed to the pre-molded substrate Sa is disposed in the recess.

[0038] The lifting mechanism (not shown) adjusts the height position of the pressing portion 14 relative to the base member 11. The lifting mechanism is composed of an air cylinder or the like. The lifting mechanism moves the connecting shaft 14a up and down relative to the base member 11, thereby changing the height position of the pressing portion 14 relative to the base member 11.

[0039] The pushing mechanism 16 is a mechanism for positioning the pre-molded substrate Sa relative to the lower mold LM by pushing the pre-molded substrate Sa placed on the lower mold LM. The pushing mechanism 16 includes a substrate pushing unit 16a (an example of a molding object pushing unit) that pushes the short side 47b of the pre-molded substrate Sa, and a drive unit 16b that drives the substrate pushing unit 16a. The pushing mechanism 16 is controlled by the control unit 6.

[0040] The drive unit 16b is an electric actuator and is disposed on the base member 11. The substrate pressing units 16a are a pair of rod-shaped members, one end of which is attached to the drive unit 16b and extends through the base member 11. The other end of each substrate pressing unit 16a is located below the upper surface 36 of the lower mold LM. Each of the pair of substrate pressing units 16a is disposed so as to press both ends (near the long side 47a) of one short side 47b of the pre-molded substrate Sa, and is moved simultaneously and in the same manner by the drive unit 16b. The portion of each substrate pressing unit 16a facing the short side 47b of the pre-molded substrate Sa is curved (see FIG. 7). The lower mold LM is formed with a pair of grooves 38 to avoid interference with the other end of each pair of substrate pressing units 16a.

[0041] 1 to 7, a method for manufacturing a resin molded product (molded substrate Sb) will be described. The manufacturing method according to this embodiment includes a substrate supplying process (an example of a supplying process) in which the pre-molded substrate Sa, released from the substrate holding unit 13 of the loader 10, is placed on the lower mold LM so that the positioning pins 37 of the lower mold LM pass through the positioning holes 49. The first positioning pins 37a are then pushed by the alignment mechanism 16 until they contact the contact surfaces 49c (an example of surfaces) of the first positioning holes 49a to position the pre-molded substrate Sa and supply a resin tablet T. The mold clamping process involves clamping the mold C with the mold clamping mechanism 5. Finally, the molding process involves supplying molten resin Ta into the upper mold cavity MCa to resin mold the pre-molded substrate Sa. The contact surfaces 49c of the first positioning holes 49a are planar.

[0042] The molding process is a process in which the resin molding system 30 resin-moldes the pre-molded substrate Sa from the time the pre-molded substrate Sa is carried into the molding module 3 to the time the molded substrate Sb is carried out from the molding module 3. In the molding process in this embodiment, molten resin Ta is supplied to the upper mold cavity MCa, and the molten resin Ta is supplied to the surface of the pre-molded substrate Sa to mold it, thereby producing the molded substrate Sb. Note that the semiconductor chip 48 fixed to the pre-molded substrate Sa is not shown in FIGS. 1 and 3 to 6. Also, in FIGS. 4 to 6, only one side (the right side in FIG. 2) of the lower mold LM relative to the pot block 71 is shown. The configuration of the parts not shown is the same as the configuration of the parts shown. Furthermore, the upper mold UM is not shown in FIGS. 4 to 6.

[0043] As shown in FIG. 1 , the loader 10 is heated in advance with the resin tablet T storage space insulated, and the mold C is also heated. Then, a pre-molded substrate Sa removed from the substrate supply mechanism 43 is placed on the loader 10. The resin tablets T aligned by the resin supply mechanism 45 are stored in the resin tablet T storage space of the loader 10. The loader 10 then transports the pre-molded substrate Sa and the resin tablets T to the molding module 3. As shown by the two-dot chain line in FIG. 2 , the loader 10 places the pre-molded substrate Sa on the lower mold LM while positioned between the upper mold UM and the lower mold LM of the mold C. The placement of the pre-molded substrate Sa on the lower mold LM will be described in detail later. A release film F is supplied to the lower surface of the upper mold UM before the pre-molded substrate Sa is placed on the lower mold LM, and is adsorbed and fixed to the lower surface of the upper mold UM by a release film suction mechanism (not shown) provided in the upper mold UM (see FIG. 4 ). FIG. 2 shows the state after the pre-molding substrate Sa has been placed on the lower mold LM.

[0044] As shown in Figure 4, with the loader 10 positioned between the upper mold UM and lower mold LM of the mold C, the control unit 6 uses a base member lifting and moving mechanism (not shown) to lower the base member 11 and the presser 14 including the connecting shaft 14a. At this time, the substrate holder 13, the pre-molded substrate Sa, and the pushing mechanism 16 also lower together with the base member 11. As a result, the end of the substrate pushing portion 16a of the pushing mechanism 16 enters the groove 38 of the lower mold LM. Figure 4 shows the state in which the base member 11 has been lowered. At this time, the presser 14 is above the lower mold LM, and the pre-molded substrate Sa held by the loader 10 is not in contact with the upper surface 36 of the lower mold LM.

[0045] Next, as shown in FIG. 5 , the substrate holder 13 uses the drive unit 13b to move the lever 13c downward (toward the lower mold LM). When the lever 13c is moved downward, the end of the link 13d connected to the lever 13c moves downward. This causes the holding claw 13a connected to the other end of the link 13d to swing open around the shaft 13e. When the holding claw 13a opens, the pre-molded substrate Sa is released from its engagement, and the pre-molded substrate Sa is released from its hold. The released pre-molded substrate Sa falls from the loader 10 and is placed on the lower mold LM. At this time, the first positioning pin 37a arranged in the lower mold LM is inserted into the first positioning hole 49a formed in the pre-molded substrate Sa, and the second positioning pin 37b arranged in the lower mold LM is inserted into the second positioning hole 49b.

[0046] 6, the presser section lifting and moving mechanism lowers the presser section 14 including the connecting shaft 14a to press the pre-molded substrate Sa placed on the lower mold LM toward the lower mold LM, thereby ensuring that the entire pre-molded substrate Sa comes into contact with the upper surface 36 of the lower mold LM.

[0047] The presser 14 is then raised to the state shown in FIG. 5 by the presser lifting mechanism. Then, as shown in FIG. 7 , the drive unit 16b of the pushing mechanism 16 is driven to cause the substrate pusher 16a to push one short side 47b of the pre-molding substrate Sa. At this time, the movement speed of the substrate pusher 16a is initially set to a first movement speed, and is decelerated to a second movement speed slower than the first movement speed just before contacting the short side 47b of the pre-molding substrate Sa. The substrate pusher 16a is then brought into contact with the short side 47b of the pre-molding substrate Sa at the second movement speed to push the pre-molding substrate Sa until the first positioning pin 37a contacts the contact surface 49c of the first positioning hole 49a formed in the pre-molding substrate Sa. When the first positioning pin 37a contacts the contact surface 49c of the first positioning hole 49a, the drive unit 16b can no longer push the substrate pusher 16a, and the drive current flowing through the drive unit 16b increases. When the control unit 6 detects a drive current exceeding a predetermined value, it stops supplying power to the drive unit 16b. Note that when the first positioning pin 37a contacts the contact surface 49c of the first positioning hole 49a, the two second positioning pins 37b are not in contact with the concave curved surface 49d of the second positioning hole 49b.

[0048] As described above, the distance between the two parallel sides of the second positioning hole 49b is such that the second positioning pin 37b can be inserted without any gap (for example, a little over 1.5 mm). Therefore, when the pre-molding substrate Sa is pushed by the pushing mechanism 16, the pre-molding substrate Sa can be moved along the longitudinal direction without moving or rotating in the lateral direction.

[0049] 6, the presser lifting / moving mechanism (not shown) lowers the presser 14 including the connecting shaft 14a again, and presses the pre-molded substrate Sa placed on the lower mold LM toward the lower mold LM. A suction mechanism (not shown) provided in the lower mold LM suctions and fixes the pre-molded substrate Sa to the upper surface 36 of the lower mold LM.

[0050] Then, the loader 10 places the resin tablet T in the pot 71a of the lower mold LM while pressing the pre-molded substrate Sa against the mold surface of the lower mold LM with the pressing portion 14 (supply process). By placing the resin tablet T in the pot 71a, a heater built in the lower mold LM heats the resin tablet T, turning it into molten resin Ta.

[0051] Next, the presser unit 14 is raised again by the presser unit lifting and moving mechanism to the state shown in Figure 5. Thereafter, the presser unit 14, including the connecting shaft 14a, is raised by the base member lifting and moving mechanism. At this time, as the base member 11 rises, the substrate holder 13 and the pushing mechanism 16 also rise. As a result, the end of the substrate pushing unit 16a of the pushing mechanism 16 comes out of the groove 38 in the lower mold LM. The loader 10 then moves from between the upper mold UM and lower mold LM to the outside of the forming mold C and returns to the supply module 4.

[0052] Next, the upper mold UM and the lower mold LM are moved closer to each other by the mold clamping mechanism 5, whose driving force is controlled by the control unit 6, and the upper mold UM and the lower mold LM are clamped together. At this time, the lower surface of the upper mold UM comes into contact with the peripheral edge of the surface of the pre-molded substrate Sa on the side where the semiconductor chip 48 is fixed, and the pre-molded substrate Sa is held by the lower mold LM and the upper mold UM (mold clamping process).

[0053] Next, the molten resin Ta obtained by melting the resin tablet T accommodated in the lower mold LM is injected into the upper mold cavity MCa by the transfer mechanism 72, the drive force of which is controlled by the control unit 6. This causes the pre-molding substrate Sa to be resin-molded (molding process). After the resin molding, the lower mold LM is moved downward to open the molding die C.

[0054] Thereafter, the unnecessary resin and molded substrate Sb are carried out of the molding die C by the unloader 42, the unnecessary resin is disposed of in an unnecessary resin storage section (not shown), and the molded substrate Sb is stored in the substrate storage section 46 of the storage module 2 (see FIG. 1 ). The package substrate (molded substrate Sb) manufactured by this resin molding system 30 is then cut into individual pieces by a cutting device, whereby the unnecessary portions of the package substrate are removed, and the cut pieces are used as electronic components after undergoing quality inspection.

[0055] As described above, in the resin molding system 30 of this embodiment, the loader 10 includes the biasing mechanism 16. Therefore, the pre-molded substrate Sa can be accurately positioned relative to the lower mold LM. Specifically, the pre-molded substrate Sa placed on the lower mold LM is pressed by the substrate pressing unit 16a, causing the first positioning pins 37a to contact the contact surfaces 49c of the first positioning holes 49a, thereby positioning the substrate. The first positioning pins 37a are cylindrical, with the surfaces facing the first positioning holes 49a being convexly curved, and the contact surfaces 49c of the first positioning holes 49a being flat. Therefore, the first positioning pins 37a and the contact surfaces 49c contact at a single point. This allows the pre-molded substrate Sa to be positioned with high precision. Therefore, for example, even when resin-encapsulating multiple rows of semiconductor chips 48 arranged at equal intervals along the longitudinal direction of the pre-molded substrate Sa as shown in FIG. 7, the pre-molded substrate Sa can be positioned with high precision in the longitudinal direction before resin-encapsulating.

[0056] In particular, in this embodiment, an electric actuator is used as the drive unit 16b of the pushing mechanism 16. Because electric actuators have high controllability, the position, movement speed, and pressing force of the substrate pushing unit 16a can be accurately controlled. Specifically, as described above, the movement speed of the substrate pushing unit 16a is decelerated just before contacting the short side 47b of the pre-molding substrate Sa, and the substrate pushing unit 16a is brought into contact with the short side 47b of the pre-molding substrate Sa at the low speed to push the pre-molding substrate Sa, bringing the first positioning pin 37a into contact with the contact surface 49c of the first positioning hole 49a. Therefore, deformation of the contact surface 49c, which occurs when the first positioning pin 37a contacts the contact surface 49c of the first positioning hole 49a at high speed, does not occur. Furthermore, because deformation of the contact surface 49c is prevented when the position of the substrate pushing unit 16a is not controlled, there is no risk of insufficient pressing force, resulting in reduced positioning accuracy.

[0057] Another embodiment of the present invention will be described below, in which the same components as those in the above embodiment will be described using the same terms and symbols to facilitate understanding.

[0058] <1> In the above-described embodiment, the speed and position are controlled by an electric actuator, but the pressing force may also be controlled. In this case, only the pressing force may be controlled from the start of control, or the speed and position may be controlled as in the above embodiment until partway through, and then the control of the pressing force may be switched to immediately before the first positioning pin 37a contacts the contact surface 49c or at a certain position. Specifically, it is preferable to set the pressing force to a value that does not cause deformation of the pre-molding substrate Sa immediately before contact or at a certain position. This makes it possible to shorten the time until the first positioning pin 37a contacts the pre-molding substrate Sa without deforming the pre-molding substrate Sa, and ultimately shorten the time required for resin molding.

[0059] <2> In the above-described embodiment, the control unit 6 detects that the drive current flowing through the drive unit 16b has exceeded a predetermined value and stops the supply of current to the drive unit 16b, but this is not limited to this. Because the drive unit 16b uses an electric actuator with high controllability, the control unit 6 may be configured to stop the supply of current to the drive unit 16b when it detects that the board pushing unit 16a has reached a position where the first positioning pin 37a contacts the contact surface 49c of the first positioning hole 49a.

[0060] <3> In the above-described embodiment, the control unit 6 detects that the drive current flowing through the drive unit 16b has exceeded a predetermined value and stops the supply of power to the drive unit 16b. However, at this time, the first positioning pin 37a may not be in contact with the contact surface 49c of the first positioning hole 49a. Specifically, this may occur, for example, when the drive current flowing through the drive unit 16b exceeds the predetermined value due to at least one positioning pin 37 getting caught on the inner surface of the positioning hole 49 before the first positioning pin 37a contacts the contact surface 49c of the first positioning hole 49a. Therefore, the control unit 6 may be configured to detect that the drive current flowing through the drive unit 16b has exceeded the predetermined value for the first time, stop the supply of power to the drive unit 16b, and then supply power to the drive unit 16b again. Immediately after current is applied to the drive unit 16b again, the output torque of the drive unit 16b increases, so the substrate pushing unit 16a can overcome the snag and push the pre-molded substrate Sa again until the first positioning pin 37a contacts the contact surface 49c of the first positioning hole 49a.

[0061] <4> In the above-described embodiment, the positioning holes 49 are arranged along the long side 47a of the pre-molded substrate Sa, but if it is necessary to perform positioning in the direction of the short side 47b with high precision, multiple positioning holes 49 may be arranged along the short side 47b, and a pushing mechanism 16 may be arranged so that the pre-molded substrate Sa can be pushed in the direction along the short side 47b.

[0062] <5> In the above-described embodiment, the plate surface of the pre-molding substrate Sa is rectangular, but this is not limited thereto and any shape such as a circle can be used. In this case, a plurality of positioning holes 49 may be arranged along a direction in which positioning accuracy is required, and the alignment mechanism 16 may be provided.

[0063] <6> In the above-described embodiment, the first positioning hole 49a has a square or rectangular shape when viewed in a direction perpendicular to the plate surface of the pre-molding substrate Sa, but this is not limited thereto. As long as the contact surface 49c of the first positioning hole 49a with which the first positioning pin 37a contacts is flat and parallel to the short side 47b, the shape of other portions of the first positioning hole 49a may be any shape, such as a curved surface. Furthermore, as long as the portion of the first positioning pin 37a that contacts the contact surface 49c of the first positioning hole 49a is a convex curved surface, the cross section perpendicular to the height direction of the first positioning pin 37a may have any shape, such as an elliptical shape. Furthermore, as long as the first positioning hole 49a and the first positioning pin 37a contact each other at a flat surface and a convex curved surface, the first positioning hole 49a may have a convex curved surface and the first positioning pin 37a may have a flat surface.

[0064] <7> In the above-described embodiment, the distance between the two parallel sides of the second positioning hole 49b is set to a value (e.g., just over 1.5 mm) that allows the second positioning pin 37b to fit in without a gap, but this is not limited to this. For example, the distance between the two parallel sides of the second positioning hole 49b may be set to 1.5 mm to eliminate the clearance between the second positioning pin 37b and the hole. Similarly, the length of the first positioning hole 49a in the direction along the short side 47b may be set to 1.5 mm to eliminate the clearance between the first positioning pin 37a and the hole.

[0065] <8> In the above-described embodiment, the positioning pin 37 is disposed on the side closer to the pot block 71 with respect to the upper die cavity MCa, but this is not limitative. The positioning pin 37 may be configured to be disposed on the side farther from the pot block 71 with respect to the cavity.

[0066] <9> In the above-described embodiment, the resin tablet T is accommodated in the pot 71a of the lower mold LM when the presser 14 presses the pre-molded substrate Sa toward the lower mold LM for the second time, but this is not limited to this. The resin tablet T may be accommodated in the pot 71a of the lower mold LM when the presser 14 presses the pre-molded substrate Sa toward the lower mold LM for the first time. Furthermore, the resin tablet T may be accommodated in the pot 71a of the lower mold LM when the presser 14 presses the pre-molded substrate Sa against the lower mold LM and then the presser 14 is raised from the pre-molded substrate Sa.

[0067] <10> In the above-described embodiment, the movement speed of the substrate pressing unit 16a is initially set to a first movement speed and then reduced to a second movement speed slower than the first movement speed just before contacting the short side 47b of the pre-molded substrate Sa. However, this is not limited to this. The movement speed of the substrate pressing unit 16a may be constant as long as the contact surface 49c of the first positioning hole 49a is not deformed when the substrate pressing unit 16a contacts the short side 47b of the pre-molded substrate Sa, or the molding time of the pre-molded substrate Sa is not prolonged. Furthermore, the movement speed of the substrate pressing unit 16a may be configured to be changed in three or more stages.

[0068] <11> In the above-described embodiment, the resin injection mechanism 7 clamps the pre-molded substrate Sa placed on the lower mold LM between the upper mold UM and the lower mold LM to perform resin molding, and the molten resin Ta supplied from the pot 71a passes through the edge of the pre-molded substrate Sa and is supplied to the upper mold cavity MCa (sometimes referred to as a side gate system). However, the resin injection mechanism 7 may clamp the pre-molded substrate Sa placed on the lower mold LM between the lower mold LM and the protruding portion of the pot block to perform resin molding, and the molten resin Ta supplied from the pot 71a is supplied to the cavity without passing through the edge of the pre-molded substrate Sa (sometimes referred to as an edge gate system). Even in the edge gate system, the pre-molded substrate Sa can be positioned relative to the lower mold LM by the alignment mechanism 16 before the mold C is clamped. Furthermore, the mold C may include an intermediate mold in addition to the lower mold LM and upper mold UM, and unnecessary resin may be removed by the intermediate mold when the mold is opened after resin molding (sometimes referred to as a top gate system).

[0069] <12> In the above-described embodiment, single-sided molding was performed by supplying molten resin Ta to only one side of the pre-molded substrate Sa, but double-sided molding may also be performed by providing a lower mold cavity in the lower mold LM and injecting molten resin Ta into the lower mold LM as well as into the upper mold cavity MCa provided in the upper mold UM.

[0070] <13> In the above-described embodiment, the pushing mechanism 16 is applied to a transfer type resin molding system 30, but it can also be applied when a pre-molded substrate Sa is placed on the lower mold LM in a compression type resin molding system 30.

[0071] <14> In the above-described embodiment, the pre-molded substrate Sa is configured by fixing the semiconductor chip 48 to the substrate, but this is not limited to this. The pre-molded substrate Sa may be configured by fixing any type of chip other than the semiconductor chip 48, such as a resistor element or a capacitor element, to the substrate.

[0072] <15> The substrates used for the pre-molded substrate Sa that is resin molded in the resin molding system 30 in the above-described embodiment are, for example, semiconductor substrates (silicon wafers, etc.), metal substrates (lead frames, etc.), glass substrates, ceramic substrates, resin substrates, or printed wiring boards, and also include carriers that do not have wiring.

[0073] [Outline of the Above-Described Embodiment] Hereinafter, an outline of the resin molding system 30 and the method for manufacturing the resin molded product (molded substrate Sb) described in the above-described embodiment will be described.

[0074] (1) The characteristic configuration of the resin molding system 30 is that it includes a mold C having a positioning section (first positioning pin 37a) that positions the molding object (pre-molding substrate Sa) having a positioning hole (first positioning hole 49a), on which the molding object (pre-molding substrate Sa) is placed with the positioning section (first positioning pin 37a) passed through the positioning hole (first positioning hole 49a), and a conveying device (loader 10) having a pushing mechanism 16 that positions the molding object (pre-molding substrate Sa) relative to the positioning section (first positioning pin 37a) by bringing the positioning hole (first positioning hole 49a) into contact with the positioning section (first positioning pin 37a).

[0075] The resin molding system 30 according to this characteristic configuration includes a biasing mechanism 16. Therefore, with a positioning portion (first positioning pin 37 a) formed in the mold C inserted into a positioning hole (first positioning hole 49 a) formed in the object (pre-molded substrate Sa), the biasing mechanism 16 presses the object (pre-molded substrate Sa) to bring the positioning hole (first positioning hole 49 a) into contact with the positioning portion (first positioning pin 37 a). This simple method allows highly accurate positioning of the object (pre-molded substrate Sa) relative to the positioning portion (first positioning pin 37 a). Furthermore, because the biasing mechanism 16 does not press down on the object (pre-molded substrate Sa), the object (pre-molded substrate Sa) is not deformed. Therefore, if the object (pre-molded substrate Sa) is a carrier, the object (pre-molded substrate Sa) can be reused.

[0076] (2) The resin molding system 30 described in (1) above further includes a control unit 6 that controls the gathering mechanism 16, and the gathering mechanism 16 may have a molding object pushing unit (substrate pushing unit 16a) that pushes the molding object (pre-molding substrate Sa) and a drive unit 16b that moves the molding object pushing unit (substrate pushing unit 16a).

[0077] With this configuration, by controlling the object to be molded (substrate pushing section 16a) and the drive section 16b with the control section 6, the object to be molded (pre-molding substrate Sa) can be pushed by the object to be molded (substrate pushing section 16a), and the object to be molded (pre-molding substrate Sa) can be positioned with high precision.

[0078] (3) In the resin molding system 30 described in (2) above, the control unit 6 may control the drive unit 16b to bring the molding object pushing unit (substrate pushing unit 16a) close to the molding object (pre-molding substrate Sa) at a first moving speed, slow down to a second moving speed slower than the first moving speed just before contacting the molding object (pre-molding substrate Sa), and bring it into contact with the molding object (pre-molding substrate Sa) at the second moving speed to perform positioning.

[0079] With this configuration, the control unit 6 controls the workpiece pressing unit (substrate pressing unit 16a) to approach the workpiece (pre-molding substrate Sa) at a first moving speed, slow down to a second moving speed slower than the first moving speed just before contacting the workpiece (pre-molding substrate Sa), and contact the workpiece (pre-molding substrate Sa) at the second moving speed to perform positioning. Therefore, there is no risk of the positioning hole (first positioning hole 49a) being deformed when the positioning unit (first positioning pin 37a) is brought into contact with the positioning hole. Furthermore, the molding time for the workpiece (pre-molding substrate Sa) can be shortened compared to when the workpiece pressing unit (substrate pressing unit 16a) is moved only at the slow second moving speed.

[0080] (4) In the resin molding system 30 described in (2) above, the control unit 6 may control the drive unit 16b to perform speed control up to a position just before contact with the molding object (pre-molding substrate Sa), and to perform pressing force control at a position just before contact with the molding object (pre-molding substrate Sa) to perform positioning.

[0081] The control unit 6 controls the pressing force at a position just before contact with the molding object (pre-molding substrate Sa) to, for example, set the pressing force to a value that does not cause deformation of the molding object (pre-molding substrate Sa). This makes it possible to shorten the time until the positioning unit (first positioning pin 37 a) comes into contact with the molding object (pre-molding substrate Sa) without deforming the molding object (pre-molding substrate Sa), and ultimately shorten the time required for resin molding.

[0082] (5) In the resin molding system 30 described in any one of (2) to (4) above, the drive unit 16b is an electric actuator, and the control unit 6 may stop the movement of the molding object pushing unit (substrate pushing unit 16a) by stopping the supply of electricity to the electric actuator when the driving current of the electric actuator exceeds a predetermined value.

[0083] When the positioning hole (first positioning hole 49 a) comes into contact with the positioning portion (first positioning pin 37 a), the object pushing portion (substrate pushing portion 16 a) cannot push the object (pre-molding substrate Sa) any further, and the drive current of the electric actuator increases. Therefore, with this configuration, the control portion 6 stops the supply of electricity to the electric actuator when the drive current of the electric actuator exceeds a predetermined value, thereby enabling the object (pre-molding substrate Sa) to be positioned with high precision without deforming the positioning hole (first positioning hole 49 a).

[0084] (6) In the resin molding system 30 described in (5) above, the control unit 6 may stop supplying electricity to the electric actuator when the drive current of the electric actuator exceeds a predetermined value, and then may supply electricity to the electric actuator again.

[0085] For example, while the object pushing section (substrate pushing section 16a) is pushing the object (pre-molding substrate Sa), the positioning section (first positioning pin 37a) may get caught on the inner surface of the positioning hole (first positioning hole 49a), causing the drive current flowing through drive section 16b to exceed a predetermined value. In such a case, control section 6 temporarily stops driving drive section 16b, but with this configuration, by subsequently passing current through drive section 16b again, the object (pre-molding substrate Sa) can be pushed until the positioning hole (first positioning hole 49a) comes into contact with the positioning section (first positioning pin 37a).

[0086] (7) In the resin molding system 30 described in any one of (1) to (6) above, the positioning portion (first positioning pin 37a) is a pin having a circular cross section, and at least the surface (contact surface 49c) of the positioning hole (first positioning hole 49a) that contacts the positioning portion (first positioning pin 37a) is flat.

[0087] With this configuration, the positioning portion (first positioning pin 37a) and the contact surface 49c of the positioning hole (first positioning hole 49a) contact at one point, so the object to be molded (pre-molding substrate Sa) can be positioned with high precision relative to the molding die C.

[0088] (8) In the resin molding system 30 described in any one of (1) to (7) above, the positioning hole (first positioning hole 49a) may be rectangular when viewed along a direction perpendicular to the surface (top surface 36) of the mold C on which the molding object (pre-molding substrate Sa) is placed.

[0089] With this configuration, the resin molding system 30 can align the molding object (pre-molding substrate Sa) with high precision and perform resin molding.

[0090] (9) The method for manufacturing a resin molded product (molded substrate Sb) using the resin molding system 30 described in any one of (1) to (8) above is characterized in that it includes a supply process in which the object to be molded (pre-molded substrate Sa) is placed on the molding mold C so that the positioning portion (first positioning pin 37a) passes through the positioning hole (first positioning hole 49a), and then the positioning hole (first positioning hole 49a) is brought into contact with the positioning portion (first positioning pin 37a) by the alignment mechanism 16 to position the object to be molded (pre-molded substrate Sa) relative to the positioning portion (first positioning pin 37a) and supply resin material (resin tablet T, molten resin Ta), a mold clamping process in which the mold C is clamped by the mold clamping mechanism 5, and a molding process in which the object to be molded (pre-molded substrate Sa) is resin molded.

[0091] In the method for manufacturing a resin molded product (molded substrate Sb) having this characteristic, the object to be molded (pre-molded substrate Sa) is placed in mold C so that the positioning portion (first positioning pin 37a) passes through the positioning hole (first positioning hole 49a), and then the positioning hole (first positioning hole 49a) is brought into contact with the positioning portion (first positioning pin 37a) by the alignment mechanism 16 to position the object to be molded (pre-molded substrate Sa) relative to the positioning portion (first positioning pin 37a) and a resin material (resin tablet T, molten resin Ta) is supplied, a mold clamping process is performed to clamp mold C with mold clamping mechanism 5, and a molding process is performed to resin mold the object to be molded (pre-molded substrate Sa), thereby manufacturing the resin molded product (molded substrate Sb). This allows the resin molded product (molded substrate Sb) to be manufactured with high precision, as the object to be molded (pre-molded substrate Sa) can be positioned relative to mold C.

[0092] The present disclosure can be used in a resin molding system and a method for manufacturing a resin molded product.

[0093] DESCRIPTION OF SYMBOLS 5: Mold clamping mechanism 6: Control unit 10: Loader (transport device) 16: Pulling mechanism 16a: Substrate pushing unit (molding object pushing unit) 16b: Drive unit 30: Resin molding system 36: Upper surface (surface) 37a: First positioning pin (positioning unit) 49a: First positioning hole (positioning hole) 49c: Contact surface (surface) C: Molding mold Sa: Pre-molded substrate (molding object) Sb: Molded substrate (resin molded product) T: Resin tablet (resin material) Ta: Molten resin (resin material)

Claims

1. A resin molding system comprising: a molding die having a positioning section which positions an object to be molded having a positioning hole, on which the object to be molded is placed with the positioning section passing through the positioning hole; and a conveying device having a pushing mechanism which positions the object to be molded relative to the positioning section by bringing the positioning hole into contact with the positioning section.

2. A resin molding system as described in claim 1, further comprising a control unit that controls the pushing mechanism, the pushing mechanism having a molding object pushing unit that pushes the molding object, and a drive unit that moves the molding object pushing unit.

3. The resin molding system of claim 2, wherein the control unit controls the drive unit so as to bring the molding object pushing unit close to the molding object at a first moving speed, decelerate the molding object pushing unit to a second moving speed slower than the first moving speed just before contacting the molding object, and contact the molding object at the second moving speed to position it.

4. A resin molding system as described in claim 2, wherein the control unit controls the drive unit to perform speed control up to a position just before contacting the molded object, and to perform pressing force control at a position just before contacting the molded object to perform positioning.

5. A resin molding system as described in any one of claims 2 to 4, wherein the drive unit is an electric actuator, and the control unit stops the movement of the molding object pushing unit by cutting off the supply of electricity to the electric actuator when the drive current of the electric actuator exceeds a predetermined value.

6. A resin molding system as described in claim 5, wherein the control unit stops supplying current to the electric actuator when the drive current of the electric actuator exceeds the predetermined value, and then again supplies current to the electric actuator.

7. A resin molding system according to any one of claims 1 to 6, wherein the positioning portion is a pin having a circular cross section, and at least the surface of the positioning hole that contacts the positioning portion is flat.

8. A resin molding system according to any one of claims 1 to 7, wherein the positioning hole is rectangular when viewed along a direction perpendicular to the surface of the mold on which the object to be molded is placed.

9. A method for manufacturing a resin molded product using a resin molding system described in any one of claims 1 to 8, comprising: a supply step in which the object to be molded is placed on the molding die so that the positioning portion passes through the positioning hole, and then the positioning hole is brought into contact with the positioning portion by the alignment mechanism to position the object to be molded relative to the positioning portion and a resin material is supplied; a mold clamping step in which the molding die is clamped by a mold clamping mechanism; and a molding step in which the object to be molded is resin molded.

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