Electronic device

Abstract

This electronic device comprises: a plurality of electronic components that each include a pair of terminals; a support member that has a support surface which supports the plurality of electronic components; a wiring layer that is formed on the support surface; and a sealing resin that covers each of the plurality of electronic components. The wiring layer includes a first wiring part to which is joined one of the pair of terminals of each of the plurality of electronic components. In a circuit diagram, the electrical characteristics of the plurality of electronic components are equivalent to one circuit symbol.

Description

electronic equipment

[0001] The present disclosure relates to electronic devices.

[0002] Conventionally, electronic devices including multiple electronic components have been known. For example, Patent Document 1 discloses an example of a conventional electronic device. The electronic device (semiconductor device) described in Patent Document 1 includes an insulating layer, a wiring layer, multiple bonding layers, multiple electronic components, and a sealing resin. The wiring layer is disposed on the insulating layer. Each of the multiple electronic components is either a passive element such as a resistor, a capacitor, or an inductor, or a diode. The multiple electronic components are surface-mounted and chip-type. Each electronic component is bonded to the wiring layer via a bonding layer. The sealing resin is formed on the insulating layer and covers the wiring layer, the multiple bonding layers, and the multiple electronic components.

[0003] Japanese Patent Application Laid-Open No. 2021-34600

[0004] The electronic devices (semiconductor devices) are used in a variety of applications, such as automobiles such as electric vehicles and hybrid vehicles, industrial equipment, and home appliances, and the requirements placed on the electronic devices vary depending on the application.

[0005] An object of the present disclosure is to provide an electronic device that is improved over conventional devices. In particular, in view of the above circumstances, an object of the present disclosure is to provide an electronic device that allows for greater freedom in module design.

[0006] An electronic device provided by one aspect of the present disclosure includes a plurality of electronic components, each including a pair of terminals, a support member having a support surface that supports the plurality of electronic components, a wiring layer formed on the support surface, and a sealing resin that covers each of the plurality of electronic components. The wiring layer includes first wiring portions to which one of the pair of terminals of each of the plurality of electronic components is respectively connected. The plurality of electronic components are represented by a single circuit symbol in a circuit diagram, with their electrical characteristics being equivalent to each other.

[0007] According to the above configuration, it is possible to increase the degree of freedom in module design.

[0008] FIG. 1 is a perspective view of an electronic device according to a first embodiment, as seen from the bottom side. FIG. 2 is a plan view of the electronic device according to the first embodiment, with the sealing resin indicated by imaginary lines. FIG. 3 is a partially enlarged view of a portion of FIG. 2. FIG. 4 is a diagram of the plan view of FIG. 2, with the sealing resin omitted and with a semiconductor element and multiple electronic components indicated by imaginary lines. FIG. 5 is a bottom view of a semiconductor device according to the first embodiment. FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 2. FIG. 7 is a partially enlarged view of a portion of FIG. 6. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 2. FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. 2. FIG. 10 is a partially enlarged view of a portion of FIG. 9. FIG. 11 is a circuit diagram showing a portion (two first electronic components and two second electronic components) of the electronic device according to the first embodiment. FIG. 12 is a circuit diagram equivalently summarizing the circuit configuration shown in FIG. 11. FIG. 13 is a cross-sectional view showing a step of a manufacturing method for an electronic device according to the first embodiment. FIG. 14 is a cross-sectional view showing a step of a manufacturing method for an electronic device according to the first embodiment. FIG. 15 is a cross-sectional view showing a step of a manufacturing method for an electronic device according to the first embodiment. FIG. 16 is a cross-sectional view showing a step of a manufacturing method for an electronic device according to the first embodiment. FIG. 17 is a cross-sectional view showing a step of a manufacturing method for an electronic device according to the first embodiment. FIG. 18 is a cross-sectional view showing a step of a manufacturing method for an electronic device according to the first embodiment. FIG. 19 is a cross-sectional view showing a step of a manufacturing method for an electronic device according to the first embodiment. FIG. 20 is a cross-sectional view showing a step of a manufacturing method for an electronic device according to the first embodiment. FIG. 21 is a cross-sectional view showing a step of a manufacturing method for an electronic device according to the first embodiment. FIG. 22 is a cross-sectional view showing a step of a manufacturing method for an electronic device according to the first embodiment. FIG. 23 is a cross-sectional view showing a step of a manufacturing method for an electronic device according to the first embodiment. FIG. 24 is an enlarged plan view of a main part of an electronic device according to a first modified example of the first embodiment, and corresponds to FIG. 3 . FIG. 25 is a cross-sectional view showing an electronic device according to a second modified example of the first embodiment, and corresponds to the cross section of FIG. 6 . Fig. 26 is a schematic diagram showing an electronic device according to a third modified example of the first embodiment. Fig. 27 is an enlarged plan view of a main part showing an electronic device according to the second embodiment, and corresponds to Fig. 3 .FIG. 28 is a cross-sectional view showing an electronic device according to a second embodiment, corresponding to the cross section of FIG. 6 . FIG. 29 is an enlarged cross-sectional view showing a main portion of the electronic device according to the second embodiment, which is an enlarged view of a portion of FIG. 28 . FIG. 30 is an enlarged plan view showing a main portion of an electronic device according to a modified example of the second embodiment, corresponding to FIG. 3 . FIG. 31 is an enlarged cross-sectional view showing a main portion of an electronic device according to a modified example of the second embodiment, corresponding to the cross section of FIG. 10 . FIG. 32 is an enlarged plan view showing a main portion of an electronic device according to a third embodiment, corresponding to FIG. 3 . FIG. 33 is an enlarged cross-sectional view showing a main portion of the electronic device according to the third embodiment, corresponding to the cross section of FIG. 10 . FIG. 34 is a schematic diagram showing an electronic device according to another embodiment. FIG. 35 is a cross-sectional view showing an electronic device according to another embodiment, corresponding to the cross section of FIG. 6 .

[0009] Preferred embodiments of the electronic device of the present disclosure will be described below with reference to the drawings. Hereinafter, identical or similar components will be designated by the same reference numerals, and redundant description will be omitted. Terms such as "first," "second," and "third" in this disclosure are merely used as labels and are not intended to necessarily assign any order to their objects.

[0010] In this disclosure, unless otherwise specified, "a certain object A is formed on a certain object B" and "a certain object A is formed on (an) object B" include "a certain object A is formed directly on a certain object B" and "a certain object A is formed on a certain object B with another object interposed between the certain object A and the certain object B." Similarly, "a certain object A is disposed on a certain object B" and "a certain object A is disposed on (an) object B" include "a certain object A is disposed directly on a certain object B" and "a certain object A is disposed on (an) object B with another object interposed between the certain object A and the certain object B" unless otherwise specified. Similarly, "a certain object A is located on (an) object B" includes "a certain object A is in contact with a certain object B and is located on (an) object B" and "a certain object A is located on (an) object B with another object interposed between the certain object A and the certain object B." Furthermore, "object A overlaps object B when viewed in a certain direction" includes "object A overlaps the entire object B" and "object A overlaps a part of object B," unless otherwise specified. Furthermore, "object A (its material) contains material C" includes "object A (its material) is made of material C" and "object A (its material) is mainly composed of material C." Furthermore, "a surface A faces in a certain direction B (one side or the other side of a certain direction B)," unless otherwise specified, is not limited to the case where surface A is at a 90° angle with respect to direction B, but also includes the case where surface A is tilted with respect to direction B. Furthermore, "a surface A is perpendicular to a surface B," unless otherwise specified, is not limited to the case where surface A is at a 90° angle with respect to surface B, but also includes the case where surface A is tilted with respect to surface B.

[0011] 1 to 10 show an electronic device A10 according to a first embodiment. The electronic device A10 includes a semiconductor element 1, a plurality of electronic components 19, a support member 2, a wiring layer 3, a plurality of conductive bonding materials 41 and 42, a plurality of external terminals 5, and a sealing resin 6.

[0012] For ease of explanation, the following refers to a thickness direction z, a first direction x, and a second direction y, which are perpendicular to each other. For example, the thickness direction z is an example of the thickness direction of the electronic device A10. In the following explanation, one side of the thickness direction z may be referred to as the upper side, and the other side may be referred to as the lower side. Note that terms such as "upper," "lower," "upper," "lower," "top surface," and "bottom surface" indicate the relative positional relationship of each component in the thickness direction z, and do not necessarily define the relationship with the direction of gravity. Furthermore, "planar view" refers to the view in the thickness direction z.

[0013] The electronic device A10 is a device to be surface-mounted on a wiring board of an electronic device, an electric vehicle, etc. The electronic device A10 is a leadless package type, particularly a QFN (Quad Flat Non-leaded Package) type. The electronic device A10 has a rectangular shape in a plan view.

[0014] The semiconductor element 1 is a component that is the core of the electronic device A10's functions. The semiconductor element 1 is, for example, an integrated circuit such as an LSI. Unlike this example, the semiconductor element 1 may be a voltage control element such as an LDO (Low Drop Out), an amplification element such as an operational amplifier, or a discrete element such as a transistor or diode. The semiconductor element 1 is rectangular in plan view. The semiconductor element 1 is supported by a support member 2. The semiconductor element 1 overlaps the support member 2 in plan view.

[0015] 6 and 8 , the semiconductor element 1 has an element main surface 10a and an element back surface 10b. The element main surface 10a and the element back surface 10b are spaced apart in the thickness direction z. The element main surface 10a and the element back surface 10b face in opposite directions. The element main surface 10a faces the support member 2.

[0016] 6 and 8, the semiconductor element 1 has a plurality of electrode pads 14. The plurality of electrode pads 14 are each arranged on the element's main surface 10a. Each of the plurality of electrode pads 14 is electrically connected to an internal circuit (not shown) of the semiconductor element 1. The plurality of electrode pads 14 is each bonded to the wiring layer 3 via one of a plurality of conductive bonding materials 41. With this configuration, the semiconductor element 1 is bonded to the wiring layer 3 with the surface on which the plurality of electrode pads 14 are arranged (i.e., the element's main surface 10a) facing downward in the thickness direction z. In other words, the semiconductor element 1 is flip-chip mounted.

[0017] As shown in Figures 2, 6, 8, and 9, the plurality of electronic components 19 are supported by the support member 2. Each of the plurality of electronic components 19 is an SMD (Surface Mount Device). Each of the plurality of electronic components 19 is, for example, a resistor, a capacitor, or an inductor. The plurality of electronic components 19, together with the semiconductor element 1, are functional elements of the electronic device A10. The plurality of electronic components 19 are arranged around the semiconductor element 1 in a plan view.

[0018] 2 and 3 , the plurality of electronic components 19 includes at least one first electronic component 19A and at least one second electronic component 19B, and in the illustrated example, includes two first electronic components 19A and two second electronic components 19B. As will be understood from the configuration described in detail later, the two first electronic components 19A are electrically connected in parallel to each other. The two second electronic components 19B are electrically connected in parallel to each other. The two first electronic components 19A and the two second electronic components 19B are electrically connected in series.

[0019] In this embodiment, the two first electronic components 19A and the two second electronic components 19B have the same performance with respect to each electrical characteristic. The electrical characteristic is a resistance value when the electronic component 19 is a resistor, a capacitance value when the electronic component 19 is a capacitor, and an inductance value when the electronic component 19 is an inductor. That is, in the electronic device A10, when the two first electronic components 19A and the two second electronic components 19B are resistors, their resistance values ​​are the same (or approximately the same); when they are capacitors, their capacitance values ​​are the same (or approximately the same); and when they are inductors, their inductance values ​​are the same (or approximately the same). In configurations different from the electronic device A10, the performance with respect to each electrical characteristic of the two first electronic components 19A and the two second electronic components 19B may be different from each other.

[0020] 2 , the plurality of electronic components 19 includes a plurality of electronic components 19C and 19D, and in the illustrated example, includes two electronic components 19C and two electronic components 19D. As will be understood from the configuration described later, the two electronic components 19C are electrically connected in parallel to each other. The two electronic components 19D are electrically connected in parallel to each other. The two electronic components 19C and the two electronic components 19D are electrically connected in series.

[0021] In this embodiment, the performance of each electrical characteristic of the two electronic components 19C and the two electronic components 19D is the same. In a configuration different from that of the electronic device A10, the performance of each electrical characteristic of the two electronic components 19C and the two electronic components 19D may be different from each other.

[0022] 2, 3, 6, 7, and 9, each of the plurality of electronic components 19 (including each of the first electronic components 19A, each of the second electronic components 19B, and each of the electronic components 19C and 19D) includes a main body 190 and a pair of terminals 191 and 192. Unless otherwise specified, the main body 190 and the pair of terminals 191 and 192 described below are common to each of the electronic components 19 (including each of the first electronic components 19A, each of the second electronic components 19B, and each of the electronic components 19C and 19D).

[0023] The main body 190 is the functional center of the electronic component 19, and operates as a resistor, a capacitor, an inductor, etc. when electricity is applied to the electronic component 19. As shown in Fig. 3, the main body 190 is rectangular in plan view.

[0024] As shown in FIGS. 7 and 8 , the main body 190 has a pair of side surfaces 190a, 190b and a bottom surface 190c. As shown in FIG. 7 , the pair of side surfaces 190a, 190b are spaced apart from each other in the longitudinal direction of each electronic component 19 and face opposite sides in the longitudinal direction of each electronic component 19. In the illustrated example, the multiple electronic components 19 include those whose orthogonal direction is the first direction x and those whose orthogonal direction is the second direction y. Of the multiple electronic components 19, the longitudinal direction of each of the first electronic components 19A, each of the second electronic components 19B, and each of the electronic components 19C and 19D is the first direction x. As shown in FIG. 7 , the bottom surface 190c is connected to and sandwiched between the pair of side surfaces 190a, 190b. The bottom surface 190c faces downward in the thickness direction z and faces the support member 2. The main body 190 has a pair of side surfaces 190a and 190b and a bottom surface 190c, as well as a top surface facing upward in the thickness direction z, a side surface facing one side in the short side direction, and a side surface facing the other side in the short side direction.

[0025] 2, 3, 6, and 7, a pair of terminals 191, 192 are arranged on both longitudinal sides of the main body 190. In each electronic component 19, the terminal 191 is arranged at one longitudinal end, and the terminal 192 is arranged at the other longitudinal end.

[0026] As shown in FIG. 7 , the terminal 191 includes a side electrode 191a and a bottom electrode 191b. The side electrode 191a covers the entire side surface 190a. Therefore, the side electrode 191a connects from the upper (one) edge of the side surface 190a in the thickness direction z to the lower (other) edge of the side surface 190a in the thickness direction z. The bottom electrode 191b covers a portion of the bottom surface 190c. The bottom electrode 191b covers the vicinity of one longitudinal edge of the bottom surface 190c. The bottom electrode 191b is connected to the side electrode 191a. In addition to the side electrode 191a and the bottom electrode 191b, the terminal 191 includes a portion covering a portion of the top surface of the main body 190, a portion of a side surface facing one side in the short direction of the main body 190, and a portion covering a portion of a side surface facing the other side in the short direction of the main body 190. In this disclosure, the boundary between the side electrode 191a and the bottom electrode 191b is based on the bottom surface 190c, with the side electrode 191a on the upper side in the thickness direction z and the bottom electrode 191b on the lower side in the thickness direction z.

[0027] As shown in FIG. 7 , the terminal 192 includes a side electrode 192a and a bottom electrode 192b. The side electrode 192a covers the entire side surface 190b. Therefore, the side electrode 192a connects from the upper (one) edge of the side surface 190b in the thickness direction z to the lower (other) edge of the side surface 190b in the thickness direction z. The bottom electrode 192b covers a portion of the bottom surface 190c. The bottom electrode 192b covers the vicinity of the other longitudinal edge of the bottom surface 190c. The bottom electrode 192b is connected to the side electrode 192a. In addition to the side electrode 192a and the bottom electrode 192b, the terminal 192 includes a portion covering a portion of the top surface of the main body 190, a portion of a side surface facing one side of the main body 190 in the short direction, and a portion covering a portion of a side surface facing the other side of the main body 190 in the short direction. In this disclosure, the boundary between the side electrode 192a and the bottom electrode 192b is based on the bottom surface 190c, with the side electrode 192a on the upper side in the thickness direction z and the bottom electrode 192b on the lower side in the thickness direction z.

[0028] As shown in FIGS. 2 and 6 to 10 , the support member 2 supports the semiconductor element 1 and multiple electronic components 19. The support member 2 includes, for example, a resin material. The resin material may be the same as or different from the sealing resin 6. The support member 2 may also include a filler such as silica mixed into the aforementioned resin material. The support member 2 may be configured to include a single-crystal intrinsic semiconductor (e.g., silicon (Si)) instead of a resin material. As shown in FIGS. 2 , 4 , and 5 , the support member 2 has a rectangular shape in a plan view. The thickness of the support member 2 (the dimension along the thickness direction z) is not limited in any way and is, for example, 30 μm or more and 200 μm or less. The support member 2 has a support surface 21, a back surface 22, and multiple side surfaces 23.

[0029] 6 , 8 , and 9 , the support surface 21 and the back surface 22 are spaced apart in the thickness direction z. The support surface 21 and the back surface 22 face opposite each other. The support surface 21 is the upper surface of the support member 2, and the back surface 22 is the lower surface of the support member 2. The support surface 21 faces the semiconductor element 1 (element main surface 10 a). The back surface 22 faces the wiring board when the electronic device A10 is mounted on the wiring board. In this embodiment, the support surface 21 is covered with the sealing resin 6, and the back surface 22 is exposed from the sealing resin 6.

[0030] 2 , 4 to 6 , 8 and 9 , each of the multiple side surfaces 23 is sandwiched between the support surface 21 and the back surface 22. The upper end of each side surface 23 in the thickness direction z is connected to the support surface 21, and the lower end of each side surface 23 in the thickness direction z is connected to the back surface 22. Each side surface 23 is flat and perpendicular to both the support surface 21 and the back surface 22.

[0031] The wiring layer 3 is a conductor disposed inside the electronic device A10. The wiring layer 3 contains, for example, Cu. The wiring layer 3 is, for example, a laminate of a seed layer (containing, for example, titanium (Ti)) and a metal layer (containing, for example, Cu), but may also be a single layer made of a conductor. As shown in FIGS. 2 and 3 , the wiring layer 3 includes multiple wiring portions 30. The multiple wiring portions 30 are spaced apart from one another. The multiple wiring portions 30 include one that is electrically connected to the semiconductor element 1, one that is electrically connected to one of the multiple electronic components 19, and one that is not electrically connected to either the semiconductor element 1 or the multiple electronic components 19. In this embodiment, the wiring layer 3 is formed on the support surface 21 and is in contact with the support surface 21. The thickness of the wiring layer 3 (the dimension along the thickness direction z) is 3 μm or more and 100 μm or less.

[0032] 2 to 4, 6 and 7, the plurality of wiring portions 30 include a first wiring portion 31, a second wiring portion 32 and a third wiring portion 33. The first wiring portion 31, the second wiring portion 32 and the third wiring portion 33 are spaced apart from one another.

[0033] The terminals 191 of the two first electronic components 19A are bonded to the first wiring portion 31 with the conductive bonding material 42. As a result, the terminals 191 of the two first electronic components 19A are electrically connected via the first wiring portion 31. The terminals 192 of the two second electronic components 19B are bonded to the first wiring portion 31 with the conductive bonding material 42. As a result, the terminals 192 of the two second electronic components 19B are electrically connected via the first wiring portion 31. The terminals 191 of the two first electronic components 19A and the terminals 192 of the two second electronic components 19B are electrically connected via the first wiring portion 31. As shown in FIGS. 2 to 4 , the first wiring portion 31 is not electrically connected to either the semiconductor element 1 or the external terminals 5 without passing through either the two first electronic components 19A or the two second electronic components 19B. That is, the first wiring portion 31 is electrically connected to the semiconductor element 1 and the external terminals 5 via either the two first electronic components 19A or the two second electronic components 19B.

[0034] As shown in FIGS. 3 and 10 , the first wiring portion 31 includes a plurality of partitions 311 and connecting portions 312. In this embodiment, the first wiring portion 31 includes two partitions 311. The two partitions 311 are spaced apart from each other. A terminal 191 of one of the two first electronic components 19A and a terminal 192 of one of the two second electronic components 19B are bonded to one of the two partitions 311. A terminal 191 of the other of the two first electronic components 19A and a terminal 192 of the other of the two second electronic components 19B are bonded to the other of the two partitions 311. In the example shown in FIGS. 3 and 10 , the two partitions 311 are spaced apart in the second direction y. The connecting portion 312 is sandwiched between the two partitions 311. The connecting portion 312 is connected to each of the two partitions 311 and electrically connects the two partitions 311 together.

[0035] The terminals 192 of the two first electronic components 19A are respectively joined to the second wiring portion 32 by the conductive bonding material 42. This allows the terminals 192 of the two first electronic components 19A to be electrically connected via the second wiring portion 32. In the example shown in Figures 2 to 4, the second wiring portion 32 is electrically connected to any of the multiple external terminals 5.

[0036] The terminals 191 of the two second electronic components 19B are respectively joined to the third wiring portion 33 by the conductive bonding material 42. This allows the terminals 191 of the two second electronic components 19B to be electrically connected via the third wiring portion 33. In the example shown in Figures 2 to 4, the third wiring portion 33 is electrically connected to one of the multiple external terminals 5 and the semiconductor element 1.

[0037] In the illustrated example, the first wiring portion 31, the second wiring portion 32, and the third wiring portion 33 are arranged along the first direction x. The first wiring portion 31 is located between the second wiring portion 32 and the third wiring portion 33 in the first direction x. The second wiring portion 32 is arranged on the other side of the first wiring portion 31 in the first direction x, and the third wiring portion 33 is arranged on one side of the first wiring portion 31 in the first direction x.

[0038] The two first electronic components 19A are each arranged across the first wiring portion 31 and the second wiring portion 32. The two first electronic components 19A are arranged along the second direction y and overlap each other when viewed in the second direction y. The two second electronic components 19B are each arranged across the first wiring portion 31 and the third wiring portion 33. The two second electronic components 19B are arranged along the second direction y and overlap each other when viewed in the second direction y. The two first electronic components 19A and the two second electronic components 19B are arranged along the first direction x and overlap each other when viewed in the first direction x. Note that the positions of the two first electronic components 19A and the two second electronic components 19B may be misaligned as long as the electrical connection relationship between the two first electronic components 19A and the two second electronic components 19B is the same. For example, misalignment between the two first electronic components 19A and the two second electronic components 19B may occur due to manufacturing errors.

[0039] 2, the plurality of wiring portions 30 includes a plurality of wiring portions 34, 35, and 36. The plurality of wiring portions 34, 35, and 36 are spaced apart from one another.

[0040] The terminals 191 of the two electronic components 19C are bonded to the wiring portion 34 with conductive bonding material 42. As a result, the terminals 191 of the two electronic components 19C are electrically connected via the wiring portion 34. The terminals 192 of the two electronic components 19D are bonded to the wiring portion 34 with conductive bonding material 42. As a result, the terminals 192 of the two electronic components 19D are electrically connected via the wiring portion 34. The terminals 191 of the two electronic components 19C are electrically connected to the terminals 192 of the two electronic components 19D via the wiring portion 34. As shown in FIGS. 2 and 4 , the wiring portion 34 is not electrically connected to either the semiconductor element 1 or the external terminals 5 without passing through any of the multiple electronic components 19C, 19D. In other words, the wiring portion 34 is electrically connected to the semiconductor element 1 and the external terminals 5 via one of the multiple electronic components 19C, 19D. Although details are omitted, the wiring portion 34 includes a plurality of partition portions and connecting portions, similar to the first wiring portion 31 .

[0041] The terminals 192 of the two electronic components 19C are respectively joined to the wiring portion 35 by the conductive bonding material 42. As a result, the terminals 192 of the two electronic components 19C are electrically connected via the wiring portion 35. In the examples shown in FIGS. 2 and 4, the wiring portion 35 is electrically connected to the semiconductor element 1.

[0042] The terminals 191 of the two electronic components 19D are respectively joined to the wiring portion 36 by conductive bonding material 42. As a result, the terminals 191 of the two electronic components 19D are electrically connected via the wiring portion 36. In the examples shown in FIGS. 2 and 4, the wiring portion 36 is electrically connected to the semiconductor element 1.

[0043] In the illustrated example, the multiple wiring portions 34, 35, and 36 are arranged along the first direction x. The wiring portion 34 is located between the wiring portion 35 and the wiring portion 36 in the first direction x. The wiring portion 35 is arranged on the other side of the wiring portion 34 in the first direction x, and the wiring portion 36 is arranged on one side of the wiring portion 34 in the first direction x.

[0044] The two electronic components 19C are each arranged across the wiring portion 34 and the wiring portion 35. The two electronic components 19C are arranged along the second direction y and overlap each other when viewed in the second direction y. The two electronic components 19D are each arranged across the wiring portion 34 and the wiring portion 36. The two electronic components 19D are arranged along the second direction y and overlap each other when viewed in the second direction y. The two electronic components 19C and the two electronic components 19D are arranged along the first direction x and overlap each other when viewed in the first direction x. Note that the positions of the two electronic components 19C and the two electronic components 19D may be misaligned as long as the electrical connection relationship between the two electronic components 19C and the two electronic components 19D is the same. For example, misalignment between the two electronic components 19C and the two electronic components 19D may occur due to manufacturing errors.

[0045] As can be seen from FIGS. 4 , 6 , and 8 , each of the plurality of conductive bonding materials 41 bonds the wiring layer 3 to one of the plurality of electrode pads 14 of the semiconductor element 1. The semiconductor element 1 is electrically connected to the wiring layer 3 via the plurality of conductive bonding materials 41. Each of the plurality of conductive bonding materials 41 is a conductive bonding material. The plurality of conductive bonding materials 41 is, for example, solder. The solder contains an alloy containing tin (Sn) in its composition (for example, an Sn-silver (Ag) alloy) and also contains flux. Note that the composition of each of the plurality of conductive bonding materials 41 is not limited to this example. The thickness (dimension along the thickness direction z) of each conductive bonding material 41 is not limited in any way, but is, for example, 15 μm or more and 100 μm or less.

[0046] As shown in FIGS. 4 , 6 , 8 , and 9 , the plurality of conductive bonding materials 42 bond the wiring layer 3 (any of the plurality of wiring portions 30) to a corresponding one of the pair of terminals 191, 192 of each of the plurality of electronic components 19. Each of the plurality of conductive bonding materials 42 is a conductive bonding material. Each conductive bonding material 42 is, for example, solder. The solder includes an alloy containing tin (Sn) in its composition (for example, an Sn-silver (Ag) alloy). Each conductive bonding material 42 may or may not contain flux. The thickness (dimension along the thickness direction z) of each conductive bonding material 42 is not limited in any way and is, for example, 1 μm or more and 20 μm or less.

[0047] 7 or 10, each of the plurality of conductive bonding materials 42 includes a fillet portion 421. The fillet portion 421 contacts either the lateral electrode 191a of the terminal 191 or the lateral electrode 192a of the terminal 192 of each electronic component 19. In the example shown in FIG. 7 or 10, the side surface of the fillet portion 421 is convexly curved, but it may be concavely curved or may not be curved.

[0048] Each of the multiple external terminals 5 is electrically connected to the wiring layer 3 and is a conductor exposed to the outside of the electronic device A10. Each of the multiple external terminals 5 serves as a terminal when the electronic device A10 is mounted on a wiring board. As shown in FIGS. 6 and 8 to 10 , each of the multiple external terminals 5 penetrates the support member 2 in the thickness direction z. The multiple external terminals 5 include those that are electrically connected to the semiconductor element 1 via the wiring layer 3, those that are electrically connected to one of the multiple electronic components 19 and the semiconductor element 1 via the wiring layer 3, those that are electrically connected to one of the multiple electronic components 19 via the wiring layer 3, and those that are not electrically connected to either the semiconductor element 1 or the multiple electronic components 19. In the illustrated example, all of the multiple external terminals 5 are disposed outside the semiconductor element 1 in a planar view and do not overlap either the semiconductor element 1 or the multiple electronic components 19 in a planar view. Unlike this example, some of the multiple external terminals 5 may overlap either the semiconductor element 1 or the multiple electronic components 19 in a planar view.

[0049] 6 and 8 to 10, each of the plurality of external terminals 5 includes a columnar portion 51 and an external electrode portion 52. The columnar portion 51 and the external electrode portion 52 described below are common to all external terminals 5 unless otherwise specified.

[0050] As shown in FIGS. 6 and 8 to 10 , the columnar portion 51 penetrates the support member 2 in the thickness direction z. The columnar portion 51 includes, for example, a metal material. The metal material is not limited to, but is, for example, Cu. The planar shape of the columnar portion 51 is not limited to, but is rectangular or polygonal in the illustrated example. The upper surface of the columnar portion 51 (the surface facing upward in the thickness direction z) is, for example, flush with the support surface 21 of the support member 2. The upper surface of this columnar portion 51 contacts the wiring layer 3. Note that, among the multiple external terminals 5, some columnar portions 51 may have upper surfaces that do not contact the wiring layer 3. Such external terminals 5 serve as dummy terminals. The lower surface of the columnar portion 51 (the surface facing downward in the thickness direction z) is exposed from the support member 2. The lower surface of this columnar portion 51 is, for example, flush with the back surface 22 of the support member 2. In this embodiment, in all external terminals 5, the side surfaces of the columnar portions 51 (the surfaces facing the first direction x or the second direction y) are covered by the support member 2, but unlike this example, some external terminals 5 may have exposed side surfaces of the columnar portions 51.

[0051] As shown in FIGS. 6 and 8 to 10 , the external electrode portion 52 contacts a portion of the columnar portion 51 that is exposed from the rear surface 22 of the support member 2. The external electrode portion 52 protrudes from the rear surface 22. The external electrode portion 52 is formed by electroless plating. For example, the external electrode portion 52 is composed of multiple metal layers stacked in this order from the side that contacts the columnar portion 51: a Ni layer, a palladium (Pd) layer, and a gold (Au) layer. The external electrode portion 52 can also be configured as multiple metal layers stacked in this order from the side that contacts the columnar portion 51: a Ni layer and an Au layer, or multiple metal layers stacked in this order from the side that contacts the columnar portion 51. The material and formation method of the external electrode portion 52 are not limited to these examples.

[0052] The sealing resin 6 is a synthetic resin whose main component is, for example, a black epoxy resin. The sealing resin 6 may contain a filler such as silica mixed into the epoxy resin. As shown in FIGS. 2 and 6 to 10, the sealing resin 6 covers the semiconductor element 1, the plurality of electronic components 19, the wiring layer 3, and the like. As shown in FIGS. 2 and 6 to 10, the sealing resin 6 also covers a portion of the support member 2, the plurality of conductive bonding materials 41, and the plurality of conductive bonding materials 42. The sealing resin 6 is formed on the support surface 21. The sealing resin 6 is rectangular in plan view. As shown in FIGS. 1, 2, and 5 to 10, the sealing resin 6 has a resin main surface 61, a resin back surface 62, and a plurality of resin side surfaces 63.

[0053] As shown in FIGS. 6 to 10 , the resin main surface 61 and the resin back surface 62 are spaced apart in the thickness direction z. The resin main surface 61 and the resin back surface 62 face opposite each other in the thickness direction z. The resin main surface 61 faces the same direction as the support surface 21 in the thickness direction z, and the resin back surface 62 faces the same direction as the back surface 22 in the thickness direction z. The resin back surface 62 is in contact with the support surface 21. The resin back surface 62 has irregularities according to the shape of the wiring layer 3. As shown in FIGS. 6 , 8 , and 9 , each of the multiple resin side surfaces 63 is sandwiched between the resin main surface 61 and the resin back surface 62 in the thickness direction z and is connected to them. The multiple resin side surfaces 63 are flush with a corresponding one of the multiple side surfaces 23.

[0054] Next, an example of a circuit configuration of the electronic device A10 will be described with reference to Figures 11 and 12. Each of the circuit configuration examples shown in Figures 11 and 12 shows the connection relationship between two first electronic components 19A and two second electronic components 19B, with each electronic component 19 being a capacitor. The circuit diagram shown in Figure 11 depicts the aforementioned connection relationship in accordance with the structural examples shown in Figures 1 to 10, and the circuit diagram shown in Figure 12 is an equivalent representation of the circuit diagram shown in Figure 11.

[0055] 11 , in the electronic device A10, two first electronic components 19A are electrically connected in parallel between the first wiring portion 31 and the second wiring portion 32. Two second electronic components 19B are electrically connected in parallel between the first wiring portion 31 and the third wiring portion 33. The two first electronic components 19A and the two second electronic components 19B are connected in series via the first wiring portion 31.

[0056] 12, the electrical characteristics (capacitances) of the two first electronic components 19A and the two second electronic components 19B are combined and equivalently grouped as a single electronic component 19X between the second wiring portion 32 and the third wiring portion 33. That is, in the electronic device A10, the electrical characteristics of the two first electronic components 19A and the two second electronic components 19B are equivalent to a single circuit symbol (electronic component 19X) in the circuit diagram.

[0057] Next, an example of a method for manufacturing the electronic device A10 will be described with reference to Figures 13 to 23. Figures 13 to 23 are cross-sectional views showing a step in the method for manufacturing the electronic device A10. These cross-sectional views correspond to the cross-section shown in Figure 6. Note that the thickness direction z in the cross-sectional views shown in Figures 22 and 23 is opposite to that in the cross-sectional views shown in Figures 13 to 21.

[0058] First, as shown in FIG. 13 , a support substrate 80 is prepared, and multiple columnar conductors 851 are formed on the support substrate 80. The support substrate 80 includes, for example, a single-crystal intrinsic semiconductor material. The semiconductor material is, for example, Si. In the process of preparing the support substrate 80, for example, a silicon wafer is prepared as the support substrate 80. The support substrate 80 has a substrate main surface 80a and a substrate back surface 80b facing opposite sides in the thickness direction z. The multiple columnar conductors 851 are formed, for example, by the following process. First, a seed layer is formed on the substrate main surface 80a. The seed layer is formed by, for example, sputtering. Then, a resist is patterned on the seed layer, and the multiple columnar conductors 851 are formed by electrolytic plating. Thereafter, the resist layer and any unnecessary seed layer are removed. Through these processes, multiple columnar conductors 851 are formed on the substrate main surface 80a of the support substrate 80. The columnar conductors 851 are portions that will later become the columnar portions 51 of the external terminals 5.

[0059] Next, as shown in FIG. 14 , a first resin layer 82 covering the columnar conductors 851 is formed on the substrate main surface 80a of the support substrate 80. The first resin layer 82 is formed, for example, by molding. The first resin layer 82 is a synthetic resin whose main component is, for example, a black epoxy resin. The first resin layer 82 may be made of another insulating resin material instead of the synthetic resin. The first resin layer 82 has a main surface 821 and a bottom surface 822 that face opposite each other in the thickness direction z. The main surface 821 faces the same direction as the substrate main surface 80a, and the bottom surface 822 faces the substrate main surface 80a. The first resin layer 82 is a component that will later become the support member 2.

[0060] 15 , the first resin layer 82 is ground. The first resin layer 82 is ground from the main surface 821 side until the columnar conductors 851 are exposed from the main surface 821. The grinding method is not particularly limited. The height of the first resin layer 82 may also be reduced by a method other than grinding. As a result, the columnar portions 51 are formed from the columnar conductors 851.

[0061] Next, as shown in FIG. 16 , the wiring layer 3 is formed. The wiring layer 3 is formed, for example, by the following process. First, a seed layer is formed on the main surface 821 and each columnar section 51. The seed layer is formed, for example, by sputtering. For example, a Ti layer and a Cu layer are laminated in this order as the seed layer. Then, a resist is patterned on the seed layer, and a metal layer is formed by electrolytic plating. For example, the metal layer contains Cu. After that, the resist and unnecessary seed layer (seed layer exposed from the metal layer) are removed. Through these processes, the wiring layer 3 is formed.

[0062] 17 , a plurality of conductive bonding materials 420 are formed. In the process of forming the plurality of conductive bonding materials 420, for example, a solder paste as each conductive bonding material 420 is formed on the corresponding wiring portion 30 (wiring layer 3) by screen printing. Note that the method of forming the plurality of conductive bonding materials 420 is not limited to this. The corresponding wiring portion 30 is one of the plurality of wiring portions 30 to which the plurality of electronic components 19 will be bonded later.

[0063] Next, as shown in FIGS. 18 and 19 , a plurality of electronic components 19 are mounted, and then the plurality of electronic components 19 are bonded together. As shown in FIG. 18 , in the process of mounting the plurality of electronic components 19, terminals 191 of the electronic components 19 are placed in correspondence with conductive bonding materials 420. Next, reflow is performed with each electronic component 19 placed. The heat from this reflow melts each conductive bonding material 420. Next, the molten conductive bonding materials 420 are cooled, solidifying each conductive bonding material 420 and becoming each conductive bonding material 42. As a result, each electronic component 19 is bonded together with each conductive bonding material 42. As shown in FIG. 19 , fillet portions 421 are formed in each of the formed conductive bonding materials 42.

[0064] Next, as shown in FIGS. 19 and 20 , the semiconductor element 1 is mounted, and then the semiconductor element 1 is bonded. In the mounting process of the semiconductor element 1, as shown in FIG. 19 , each conductive bonding material 410 formed on the semiconductor element 1 is placed in correspondence with the wiring layer 3 (any of the multiple wiring portions 30). Note that, in this embodiment, an example is shown in which each conductive bonding material 410 is formed on the electrode pad 14 of the semiconductor element 1, but it may also be formed on the corresponding wiring portion 30 (wiring layer 3). In this case, the corresponding wiring portion 30 refers to one of the multiple wiring portions 30 to which the semiconductor element 1 will later be bonded. Flux is also added to each conductive bonding material 410 formed on the semiconductor element 1. Next, reflow is performed with the semiconductor element 1 placed in place. The heat from this reflow melts each conductive bonding material 410. Next, the molten conductive bonding material 410 is cooled, solidifying each conductive bonding material 410 and becoming each conductive bonding material 41. As a result, the semiconductor element 1 is bonded by each conductive bonding material 41.

[0065] Next, as shown in FIG. 21 , a second resin layer 86 is formed. The second resin layer 86 is formed above the support member 2 so as to cover the semiconductor element 1, the plurality of electronic components 19, and the wiring layer 3. The second resin layer 86 is formed, for example, by molding. The second resin layer 86 is a synthetic resin whose main component is, for example, a black epoxy resin. The second resin layer 86 may be made of another insulating resin material instead of the synthetic resin. The second resin layer 86 is a component that will later become the sealing resin 6. The second resin layer 86 has a top surface 861 facing one side in the thickness direction z. The top surface 861 corresponds to the resin main surface 61 of the sealing resin 6.

[0066] Next, as shown in Fig. 22, the support substrate 80 is removed. To remove the support substrate 80, for example, in the state shown in Fig. 21, the support substrate 80 is ground from the rear surface 80b side of the substrate. In this grinding, the support substrate 80 is ground from the rear surface 80b side of the substrate. In the illustrated example, the grinding is continued even after the support substrate 80 is removed, thereby reducing the height of the support member 2 and the columnar portion 51. This reduction in height does not have to be performed.

[0067] Next, as shown in Fig. 23, the external electrode portion 52 is formed. The external electrode portion 52 is formed on the top surface of the columnar portion 51 exposed from the back surface 22. The external electrode portion 52 is formed by, for example, electroless plating. In this electroless plating, a Ni layer, a Pd layer, and an Au layer are laminated in this order from the side in contact with the columnar portion 51. In this way, a plurality of external terminals 5 are formed, each including a columnar portion 51 and an external electrode portion 52.

[0068] 23 , the second resin layer 86 is cut along the cutting lines CL to separate the electronic device A10. The second resin layer 86 is cut by cutting using a dicing blade, for example. The sealing resin 6 of the electronic device A10 is formed by dividing the second resin layer 86 along the cutting lines CL.

[0069] Through the above steps, the electronic device A10 shown in FIGS. 1 to 10 is manufactured. Note that the manufacturing method of the electronic device A10 is not limited to the above example. For example, when the support member 2 includes a single-crystal intrinsic semiconductor (e.g., Si), the electronic device A10 is manufactured as follows. That is, grooves are formed in the support substrate 80 (silicon wafer) by etching or the like. Next, a plurality of columnar conductors 851 are formed in the grooves. Next, the wiring layer 3 is formed without forming the first resin layer 82. Furthermore, after forming the second resin layer 86, the support substrate 80 is not removed, but is ground until the plurality of columnar conductors 851 formed in the grooves are exposed.

[0070] The functions and effects of the electronic device A10 are as follows.

[0071] In the electronic device A10, the wiring layer 3 includes a first wiring portion 31 to which one of the pair of terminals 191, 192 of each of the plurality of electronic components 19 is connected. The electrical characteristics of the plurality of electronic components 19 are represented by a single circuit symbol in the circuit diagram. With this configuration, the electrical characteristics of a single electronic component are designed as a composite value of the electrical characteristics of the plurality of electronic components 19 (two first electronic components 19A and two second electronic components 19B in this embodiment). This allows various electrical characteristic values ​​to be obtained by combining the plurality of electronic components 19, enabling the electronic device A10 to design highly accurate electrical specifications. Furthermore, in a configuration different from the electronic device A10, in the circuit configuration shown in FIG. 12, the required electrical characteristics may be achieved with a single electronic component 19X between the second wiring portion 32 and the third wiring portion 33. In this case, the size (e.g., thickness) of the electronic component 19X increases. As a result, the thickness (dimension in the thickness direction z) of the sealing resin 6 increases, and the stress applied to the support member 2 from the sealing resin 6 may cause warping of the support member 2. In other words, the thinner the sealing resin 6, the less warping of the support member 2. In contrast, in the electronic device A10, the electrical characteristics of a single electronic component are designed as a composite value of the electrical characteristics of multiple electronic components 19, making it possible to replace a single electronic component 19X with multiple electronic components 19 that are thinner (thicker) than the electronic component 19X. Therefore, the electronic device A10 can be designed to reduce the thickness of the sealing resin 6. As described above, such a reduction in thickness is preferable for reducing warping of the support member 2. As a result, the electronic device A10 allows for greater flexibility in module design.

[0072] In the electronic device A10, the wiring layer 3 includes a first wiring portion 31, a second wiring portion 32, and a third wiring portion 33. The multiple electronic components 19 include a first electronic component 19A and a second electronic component 19B. The first electronic component 19A has a pair of terminals 191, 192 bonded to the first wiring portion 31 and the second wiring portion 32, respectively, and the second electronic component 19B has a pair of terminals 191, 192 bonded to the first wiring portion 31 and the third wiring portion 33, respectively. With this configuration, the second wiring portion 32 and the third wiring portion 33 are electrically connected to the first electronic component 19A and the second electronic component 19B via the first wiring portion 31. In other words, between the second wiring portion 32 and the third wiring portion 33, it is possible to design electrical characteristics equivalent to one circuit symbol using at least one first electronic component 19A and at least one second electronic component 19B.

[0073] In the electronic device A10, the first wiring portion 31 is electrically connected to the semiconductor element 1 or to multiple external terminals 5 via one of multiple electronic components 19 (two first electronic components 19A and two second electronic components 19B). With this configuration, the first wiring portion 31 is not directly connected to either the semiconductor element 1 or the multiple external terminals 5. Therefore, in a configuration in which electrical continuity between the second wiring portion 32 and the third wiring portion 33 can be achieved through a single electronic component, providing the first wiring portion 31 enables electrical continuity between the second wiring portion 32 and the third wiring portion 33 through a series circuit of at least two electronic components 19 (one first electronic component 19A and one second electronic component 19B). In other words, electrical characteristics equivalent to a single circuit symbol can be designed using multiple electronic components 19 between the second wiring portion 32 and the third wiring portion 33. This is advantageous in terms of increasing the degree of freedom in module design for the electronic device A10.

[0074] In the electronic device A10, the first wiring portion 31 includes two partitions 311 and a connecting portion 312. The connecting portion 312 connects the two partitions 311 that are spaced apart from each other. With this configuration, the terminals 191 of the two first electronic components 19A are electrically connected via the first wiring portion 31. Therefore, the two first electronic components 19A can be electrically connected in parallel. Similarly, the terminals 192 of the two second electronic components 19B are electrically connected via the first wiring portion 31. Therefore, the two second electronic components 19B can be electrically connected in parallel.

[0075] In the electronic device A10, the first wiring portion 31 has a rectangular shape in a plan view. Furthermore, two first electronic components 19A overlap each other when viewed in the first direction x, and two second electronic components 19B overlap each other when viewed in the first direction x. Furthermore, two first electronic components 19A individually overlap two second electronic components 19B when viewed in the second direction y. This configuration can reduce the following distance difference. For example, this distance difference is the distance difference between the conduction path in the first wiring portion 31 between the terminals 191 of two first electronic components 19A and the conduction path in the first wiring portion 31 between the terminals 192 of two second electronic components 19B. Furthermore, for example, the distance difference is the difference in distance between the conduction path in the first wiring portion 31 between a terminal 191 included in one of the two first electronic components 19A and a terminal 192 included in one of the two second electronic components 19B, and the conduction path in the first wiring portion 31 between a terminal 191 included in the other of the two first electronic components 19A and a terminal 192 included in the other of the two second electronic components 19B. This makes it possible to suppress the difference in the conduction path in the first wiring portion 31 between the two first electronic components 19A and the two second electronic components 19B, thereby suppressing electrical variations between the two first electronic components 19A and the two second electronic components 19B.

[0076] In the electronic device A10, the performance of each of the multiple electronic components 19 in terms of electrical characteristics is the same. This configuration, for example, makes it possible to equalize the sizes (thickness and planar size) of the multiple electronic components 19 (first electronic component 19A and second electronic component 19B), thereby suppressing variations in the thickness of each of the multiple electronic components 19. This makes it easier to design the thickness (dimension in the thickness direction z) of the sealing resin 6 in the electronic device A10. Furthermore, the electronic device A10 makes it easier to calculate the composite component of the electrical characteristics of the multiple electronic components 19.

[0077] In the electronic device A10, the support member 2 includes a resin material, and this resin material is the same as the sealing resin 6. With this configuration, the difference between the linear expansion coefficient of the support member 2 and the linear expansion coefficient of the sealing resin 6 can be reduced, thereby suppressing thermal stress generated in the electronic device A10.

[0078] In the electronic device A10, the wiring layer 3 includes a plurality of wiring portions 34, 35, and 36. The plurality of electronic components 19 include a plurality of electronic components 19C and 19D. The relative positional relationship and electrical connection relationship between the plurality of wiring portions 34, 35, and 36 and the plurality of electronic components 19C and 19D is similar to the relative positional relationship and electrical connection relationship between the first wiring portion 31, the second wiring portion 32, and the third wiring portion 33 and at least one first electronic component 19A and at least one second electronic component 19B. Therefore, these functions and effects are common to both.

[0079] Other embodiments and modifications of the electronic device of the present disclosure will be described below. The configurations of the components in each embodiment and each modification can be combined with each other to the extent that no technical contradiction occurs.

[0080] 24 shows an electronic device A11 according to a first modified example of the first embodiment. The electronic device A11 differs from the electronic device A10 in the following respects. First, each terminal 191 of two first electronic components 19A and each terminal 192 of two second electronic components 19B are joined to the first wiring portion 31 by a single conductive bonding material 42. Second, each terminal 192 of two first electronic components 19A are joined to the second wiring portion 32 by a single conductive bonding material 42. Third, each terminal 191 of two second electronic components 19B are joined to the third wiring portion 33 by a single conductive bonding material 42.

[0081] In the electronic device A11, two first electronic components 19A and two second electronic components 19B are bonded to the first wiring portion 31 with a single conductive bonding material 42. As such, the electronic device of the present disclosure is not limited to a configuration in which each first electronic component 19A and each second electronic component 19B is bonded individually to the first wiring portion 31, but also includes a configuration in which they are bonded collectively to the first wiring portion 31. Similarly, two first electronic components 19A are bonded to the second wiring portion 32 with a single conductive bonding material 42. As such, the electronic device of the present disclosure is not limited to a configuration in which two first electronic components 19A are bonded individually to the second wiring portion 32, but also includes a configuration in which they are bonded collectively to the second wiring portion 32. Similarly, two second electronic components 19B are bonded to the third wiring portion 33 with a single conductive bonding material 42. Thus, in the electronic device of the present disclosure, the two second electronic components 19B are not limited to a configuration in which they are each individually joined to the third wiring portion 33, but also include a configuration in which they are joined to the third wiring portion 33 collectively.

[0082] 25 shows an electronic device A12 according to a second modification of the first embodiment. The electronic device A12 differs from the electronic device A10 in the following respect: the thickness (dimension in the thickness direction z) of the semiconductor element 1 of the electronic device A12 is greater than the thickness of the semiconductor element 1 of the electronic device A10.

[0083] In the electronic device A12, similarly to the electronic device A10, the height of each electronic component 19 is reduced. Even after the height of each electronic component 19 is reduced, if there is a difference between the thickness (dimension in the thickness direction z) of each electronic component 19 and the thickness (dimension in the thickness direction z) of the semiconductor element 1, the thickness of the semiconductor element 1 may be increased to approximately the same thickness as the thickness of each electronic component 19. Increasing the volume of the semiconductor element 1 in this manner allows the volume (formation amount) of the sealing resin 6 to be reduced. This reduces the volume (formation amount) of the sealing resin 6, thereby suppressing the stress applied from the sealing resin 6 to the support member 2. Therefore, the electronic device A12 can reduce warping of the support member 2 more than the electronic device A10.

[0084] 26 shows an electronic device A13 according to a third modified example of the first embodiment. The electronic device A13 differs from the electronic device A10 in the following respects: First, the plurality of electronic components 19 includes three first electronic components 19A. Second, the plurality of electronic components 19 includes three second electronic components 19B.

[0085] In the electronic device A13, three first electronic components 19A are electrically connected in parallel, and three second electronic components 19B are electrically connected in parallel. The three first electronic components 19A and three second electronic components 19B are electrically connected in series. Thus, in the electronic device of the present disclosure, the number of first electronic components 19A and the number of second electronic components 19B are not limited in any way. Note that, although the number of first electronic components 19A and the number of second electronic components 19B are the same in each of the electronic devices A10 and A13, they may be different.

[0086] Like the electronic device A10, each of the electronic devices A11 to A13 includes a first wiring portion 31 to which one of a pair of terminals 191, 192 of each of a plurality of electronic components 19 (at least one first electronic component 19A and at least one second electronic component 19B) is connected, and the electrical characteristics of the plurality of electronic components 19 are represented by a single circuit symbol in a circuit diagram. Therefore, like the electronic device A10, each of the electronic devices A11 to A13 can be designed with high-precision electrical specifications and a thin design, thereby increasing the degree of freedom in module design. Additionally, each of the electronic devices A11 to A13 achieves similar effects due to the configuration common to the electronic device A10.

[0087] 27 to 29 show an electronic device A20 according to the second embodiment. The electronic device A20 differs from the electronic device A10 in the following respect: the first wiring portion 31, the second wiring portion 32, and the third wiring portion 33 each include a main body portion 301 and a plurality of base portions 302.

[0088] The main body 301 includes a seed layer (containing, for example, titanium (Ti)) and a metal layer (containing, for example, Cu). The base 302 is stacked on the main body 301. The base 302 is disposed in a portion where each electronic component 19 is bonded, and is disposed between the main body 301 and the corresponding conductive bonding material 42. Each base 302 contains the same metal (for example, Cu) as the metal layer of the main body 301. Unlike this example, each base 302 may contain a metal (for example, nickel) different from the metal layer of the main body 301. For example, if each base 302 contains nickel, the base 302 functions as a barrier metal and can prevent the conductive bonding material 42 from penetrating into the wiring layer 3 (the metal layer of the main body 301).

[0089] In the electronic device A20, as shown in FIGS. 27 and 29 , the first wiring portion 31 includes a plurality of bonding surfaces 31 a and recesses 31 b. In FIG. 27 , each bonding surface 31 a is indicated by a dot. Each of the plurality of bonding surfaces 31 a is a surface of the first wiring portion 31 that contacts a corresponding conductive bonding material 42. In this embodiment, four conductive bonding materials 42 are disposed on the first wiring portion 31, and therefore the first wiring portion 31 includes four bonding surfaces 31 a. Each bonding surface 31 a corresponds to an upper surface of a plurality of base portions 302 of the first wiring portion 31. The recesses 31 b are recessed from the plurality of bonding surfaces 31 a toward the support surface 21 of the support member 2 in the thickness direction z. In this embodiment, the recesses 31 b are located between adjacent bonding surfaces 31 a in a plan view. In the illustrated example, the recess 31b has a linear portion extending in the first direction x in a plan view and a linear portion extending in the second direction y in a plan view, which intersect at the center of the first wiring portion 31. In the electronic device A20, the first wiring portion 31 includes a main body portion 301 and multiple base portions 302, so that, as shown in FIG. 29 , the portions of the first wiring portion 31 to which the electronic components 19 are bonded (portions in contact with the conductive bonding material 42) are partially elevated. This forms a recess 31b in the first wiring portion 31. Note that, although details are omitted, in the example shown in FIG. 27 , the second wiring portion 32 and the third wiring portion 33 each include a main body portion 301 and multiple base portions 302, and therefore include multiple bonding surfaces and recesses similar to the multiple bonding surfaces 31a and recesses 31b of the first wiring portion 31.

[0090] 28 , in the electronic device A20, the base portion 302 is also formed in the bonding region of the semiconductor element 1. Unlike this example, the base portion 302 does not have to be formed in the bonding region of the semiconductor element 1. Furthermore, it is sufficient that the base portion 302 is formed in at least each bonding region of the two first electronic components 19A and the two second electronic components 19B, and it does not have to be formed in the bonding region of the other electronic components 19.

[0091] Similar to the electronic device A10, the electronic device A20 includes a first wiring portion 31 to which one of a pair of terminals 191, 192 of each of a plurality of electronic components 19 (at least one first electronic component 19A and at least one second electronic component 19B) is connected, and the electrical characteristics of the plurality of electronic components 19 are represented by a single circuit symbol in a circuit diagram. Therefore, similar to the electronic device A10, the electronic device A20 can be designed with high-precision electrical specifications and a thin design, thereby increasing the degree of freedom in module design. Furthermore, the electronic device A20 achieves the same effects as the electronic device A10 due to the configuration shared with the electronic device A10.

[0092] In the electronic device A20, recesses 31b are disposed between the multiple bonding surfaces 31a. With this configuration, a step is created between each bonding surface 31a and the recesses 31b. This step prevents the conductive bonding material 42 from spreading along the wiring layer 3. This prevents the conductive bonding material 42 from flowing out, thereby preventing an insufficient thickness of the conductive bonding material 42 and tilting of the posture of each electronic component 19. In other words, the electronic device A20 can prevent poor bonding of the electronic components 19 and reduce deterioration in reliability.

[0093] 30 and 31 show an electronic device A21 according to a first modified example of the second embodiment. The electronic device A21 is different from the electronic device A20 in that the first wiring portion 31, the second wiring portion 32, and the third wiring portion 33 each include a main body portion 301 and a groove portion 303.

[0094] As shown in FIG. 31 , in the first wiring portion 31, the groove portion 303 is recessed downward from the main body portion 301 in the thickness direction z (toward the support surface 21 in the thickness direction z). This also applies to the second wiring portion 32 and the third wiring portion 33. In the electronic device A21, the first wiring portion 31, the second wiring portion 32, and the third wiring portion 33 include the groove portion 303, so that recesses are formed between the portions of the first wiring portion 31, the second wiring portion 32, and the third wiring portion 33 where the electronic components 19 are bonded. In the illustrated example, each groove portion 303 extends in the first direction x or the second direction y in a plan view. Alternatively, multiple groove portions 303 may be arranged intermittently along the first direction x or the second direction y.

[0095] As shown in FIGS. 30 and 31 , the first wiring unit 31 of the electronic device A21 includes a plurality of bonding surfaces 31 a and recesses 31 b. Note that in FIG. 30 , each bonding surface 31 a is indicated by a dot. In a plan view, the recesses 31 b are located between adjacent bonding surfaces 31 a. In the illustrated example, the recesses 31 b have a linear portion extending in the first direction x in a plan view and a linear portion extending in the second direction y in a plan view, which intersect at the center of the first wiring unit 31. Of these, the linear portion of the recesses 31 b extending in the first direction x is formed in the connecting portion 312. In the electronic device A21, the first wiring unit 31 includes a main body portion 301 and a groove portion 303. As shown in FIG. 31 , the first wiring unit 31 includes a recess between the portions of the first wiring unit 31 where the electronic components 19 are bonded (portions in contact with the conductive bonding material 42). As a result, recesses 31b are formed in the first wiring portion 31. That is, in the electronic device A21, the recesses 31b correspond to the grooves 303. In contrast to this configuration, if the multiple grooves 303 extend intermittently in a plan view, the first wiring portion 31 includes multiple recesses 31b arranged along the first direction x or the second direction y. Although details are omitted, in the example shown in FIG. 30 , the second wiring portion 32 and the third wiring portion 33 each include a main body portion 301 and grooves 303, and therefore include multiple bonding surfaces and recesses similar to the multiple bonding surfaces 31a and recesses 31b of the first wiring portion 31.

[0096] Like the electronic device A20, the electronic device A21 includes a first wiring portion 31 to which one of a pair of terminals 191, 192 of each of a plurality of electronic components 19 (at least one first electronic component 19A and at least one second electronic component 19B) is connected. In a circuit diagram, the electrical characteristics of the plurality of electronic components 19 are represented by a single circuit symbol. As in the electronic device A10, the plurality of electronic components 19 in the electronic device A20 are two first electronic components 19A and two second electronic components 19B. Therefore, like the electronic device A10, the electronic device A20 allows for highly accurate electrical specifications and a slim design, thereby increasing the degree of freedom in module design. Furthermore, the electronic device A21 achieves the same effects as the electronic device A20 due to the configuration shared with the electronic device A20.

[0097] In the electronic device A21, similar to the electronic device A20, recesses 31b are arranged between the multiple bonding surfaces 31a. Therefore, similar to the electronic device A20, the electronic device A21 can suppress tilting of the posture of each electronic component 19. Note that, unlike the electronic device A20, the electronic device A21 has grooves 303 formed in the main body 301 of each of the first wiring portion 31, the second wiring portion 32, and the third wiring portion 33, thereby providing each bonding surface 31a and recesses 31b.

[0098] 32 and 33 show an electronic device A30 according to the third embodiment. The electronic device A30 differs from the electronic device A10 in the following respect: the first wiring portion 31 of the electronic device A30 has two partition portions 311 that are separated from each other.

[0099] 32 and 33 , the first wiring portion 31 does not include a connecting portion 312. This separates the two partitions 311 from each other. In this configuration, one of the two first electronic components 19A and one of the two second electronic components 19B are electrically connected in series via one of the two partitions 311. Furthermore, the other of the two first electronic components 19A and the other of the two second electronic components 19B are electrically connected in series via the other of the two partitions 311. Then, series circuits, each including one first electronic component 19A and one second electronic component 19B, are electrically connected in parallel.

[0100] Similar to the electronic device A10, the electronic device A30 includes a first wiring portion 31 to which one of a pair of terminals 191, 192 of each of a plurality of electronic components 19 (at least one first electronic component 19A and at least one second electronic component 19B) is connected, and the electrical characteristics of the plurality of electronic components 19 are represented by a single circuit symbol in a circuit diagram. Therefore, similar to the electronic device A10, the electronic device A30 can be designed with high-precision electrical specifications and a thin design, thereby increasing the degree of freedom in module design. Furthermore, the electronic device A30 achieves the same effects as the electronic device A10 due to the configuration shared with the electronic device A10.

[0101] In each of the electronic devices A10 to A13, A20, A21, and A30 according to the first to third embodiments (including their modified examples), the first wiring portion 31, the second wiring portion 32, and the third wiring portion 33 do not have to be arranged along one direction (for example, the first direction x) perpendicular to the thickness direction z. Fig. 34 shows an example of the arrangement of the first wiring portion 31, the second wiring portion 32, and the third wiring portion 33 according to such a modified example.

[0102] In the electronic device shown in FIG. 34 , the first wiring portion 31 is disposed on one side of each of the second wiring portion 32 and the third wiring portion 33 in the second direction y. The second wiring portion 32 and the third wiring portion 33 are disposed along the first direction x. In this configuration, two first electronic components 19A are also disposed with their longitudinal directions aligned along the second direction y and are joined across the first wiring portion 31 and the second wiring portion 32. Furthermore, two second electronic components 19B are also disposed with their longitudinal directions aligned along the second direction y and are joined across the first wiring portion 31 and the third wiring portion 33. In the illustrated example, the two first electronic components 19A and two second electronic components 19B are disposed along the first direction x. 34, the two first electronic components 19A and the two second electronic components 19B are aligned without any disturbance in the first direction x, but the arrangement of the two first electronic components 19A and the two second electronic components 19B may be misaligned as long as the electrical connection relationship between the two first electronic components 19A and the two second electronic components 19B is the same. For example, the two first electronic components 19A and the two second electronic components 19B may be misaligned due to manufacturing errors.

[0103] In each of the electronic devices A10 to A13, A20, A21, and A30 according to the first to third embodiments (including their modifications), the sealing resin 6 may have a step on each resin side surface 63. For example, Fig. 35 shows an example of an electronic device according to such a modification, which is applied to the electronic device A10 according to the first embodiment. Although Fig. 35 shows an example of application to the electronic device A10 according to the first embodiment, it is also possible to apply it to electronic devices according to other embodiments.

[0104] In the electronic device shown in FIG. 35 , each resin side surface 63 has a first side portion 631 and a second side portion 632. In each resin side surface 63, the first side portion 631 and the second side portion 632 face the same direction. In a plan view, the first side portion 631 is disposed outward from the second side portion 632. The first side portion 631 is connected to the resin main surface 61, and the second side portion 632 is connected to a corresponding one of the multiple side surfaces 23. The second side portion 632 is flush with the side surface 23 connected to it. With this configuration, each resin side surface 63 has a step. Furthermore, in the electronic device shown in FIG. 35 , the multiple external terminals 5 include those whose columnar portions 51 are exposed from the side surfaces 23. In the external terminal 5 in which the columnar portion 51 is exposed from the side surface 23, the external electrode portion 52 covers the surface of the columnar portion 51 exposed from the back surface 22 of the support member 2 and the surface exposed from the side surface 23 of the support member 2.

[0105] The electronic device shown in Fig. 35 also achieves the same effects as the electronic device A10. Furthermore, in the electronic device shown in Fig. 35, the external electrode portions 52 are also formed on the surfaces of the columnar portions 51 that are exposed from the side surfaces 23 of the columnar portions 51 in some of the multiple external terminals 5. With this configuration, when the electronic device shown in Fig. 35 is mounted on a wiring board of an electronic device or the like, a fillet can be formed in the conductive bonding material (e.g., solder) used during the mounting. Therefore, the electronic device shown in Fig. 35 can be easily visually inspected to determine whether it is properly joined to the wiring board of an electronic device or the like.

[0106] In the first to third embodiments (including their modified examples), the second wiring portion 32 and the third wiring portion 33 are electrically connected to the first wiring portion 31 via the plurality of electronic components 19 (at least one first electronic component 19A and at least one second electronic component 19B). However, the electronic device of the present disclosure may be configured such that the two wiring portions 30 are electrically connected to each other via only the plurality of electronic components 19. Even in this case, the plurality of electronic components 19 are electrically connected so that their electrical characteristics are represented by a single circuit symbol in the circuit diagram. For example, in the layout example shown in FIG. 2 , two electronic components 19 arranged on one side of the support member 2 in the first direction x and in the center in the second direction y are joined across two wiring portions 30. The two wiring portions 30 are electrically connected to each other via the two electronic components 19.

[0107] In the electronic device of the present disclosure, the number and arrangement of the semiconductor elements 1 and electronic components 19, the pattern of the wiring layer 3 (the number and arrangement of the multiple wiring portions 30), and the number and arrangement of the external terminals 5 are not limited to the examples shown in the drawings. In other words, various aspects can be applied to the planar layout of the electronic device of the present disclosure depending on the specifications of the electronic device.

[0108] The electronic device of the present disclosure is not limited to a configuration including a semiconductor element 1 as a functional element, but may include at least a plurality of electronic components 19 .

[0109] The electronic device according to the present disclosure is not limited to the above-described embodiments. The specific configuration of each part of the electronic device according to the present disclosure can be freely designed in various ways. For example, the electronic device according to the present disclosure includes the embodiments described in the following appendices. Appendix 1. An electronic device comprising: a plurality of electronic components each including a pair of terminals; a support member having a support surface that supports the plurality of electronic components; a wiring layer formed on the support surface; and a sealing resin that covers each of the plurality of electronic components, wherein the wiring layer includes first wiring portions to which one of the pair of terminals of each of the plurality of electronic components is respectively joined, and wherein the electrical characteristics of the plurality of electronic components are equivalent to one circuit symbol in a circuit diagram. Appendix 2. The electronic device according to Supplementary Note 1, wherein the wiring layer includes a second wiring portion and a third wiring portion spaced apart from each other and apart from the first wiring portion, each of the plurality of electronic components being electrically connected between the second wiring portion and the third wiring portion, and the plurality of electronic components including at least one first electronic component having the pair of terminals joined to the first wiring portion and the second wiring portion, respectively, and at least one second electronic component having the pair of terminals joined to the first wiring portion and the third wiring portion, respectively.Supplementary Note 3. The electronic device according to Supplementary Note 2, wherein the at least one first electronic component includes two first electronic components, the at least one second electronic component includes two second electronic components, and the two first electronic components and the two second electronic components are electrically connected to each other in series.Supplementary Note 4. The electronic device according to Appendix 3, wherein each of the plurality of electronic components includes a main body portion, the support surface faces one side in a thickness direction of the support member, and in each of the plurality of electronic components, the pair of terminals are individually formed on both ends of the main body portion in a first direction perpendicular to the thickness direction. Appendix 5. The electronic device according to Appendix 4, wherein the first wiring portion, the second wiring portion, and the third wiring portion are arranged along the first direction, and the first wiring portion is located between the second wiring portion and the third wiring portion.Supplementary Note 6. The electronic device according to Supplementary Note 5, wherein the first wiring portion includes two partitions spaced apart from each other, one of the two first electronic components and one of the two second electronic components being joined to one of the two partitions, and the other of the two first electronic components and the other of the two second electronic components being joined to the other of the two partitions. Supplementary Note 7. The electronic device according to Supplementary Note 6, wherein the first wiring portion is sandwiched between the two partitions and includes a connecting portion connecting the two partitions. Supplementary Note 8. The electronic device according to any of Supplementary Notes 5 to 7, wherein the two first electronic components overlap each other when viewed in the first direction, the two second electronic components overlap each other when viewed in the first direction, and the two first electronic components individually overlap the two second electronic components when viewed in a second direction perpendicular to the thickness direction and the first direction. Supplementary Note 9. The electronic device according to any one of Supplementary Notes 1 to 8, further comprising a plurality of external terminals, wherein the support member has a back surface facing opposite the support surface in a thickness direction of the support member, wherein the plurality of external terminals are exposed on the back surface, and wherein the first wiring portion is electrically connected to the plurality of external terminals via the plurality of electronic components. Supplementary Note 10. The electronic device according to any one of Supplementary Notes 1 to 9, further comprising a plurality of conductive bonding materials, wherein the plurality of conductive bonding materials individually bond the first wiring portion to one of the pairs of terminals of each of the plurality of electronic components. Supplementary Note 11. The electronic device according to Supplementary Note 10, wherein the first wiring portion has a plurality of bonding surfaces individually contacting the plurality of conductive bonding materials, and at least one recess recessed from the plurality of bonding surfaces toward the support surface in the thickness direction of the support member, and the at least one recess is located between adjacent ones of the plurality of bonding surfaces as viewed in the thickness direction. Supplementary Note 12. The electronic device according to any one of claims 1 to 11, wherein the performance of each of the plurality of electronic components with respect to the electrical characteristic is the same as each other.Supplementary Note 13: The electronic device according to claim 12, wherein the electrical characteristic is one of capacitance, resistance, and inductance.Appendix 14. The electronic device according to any one of Appendix 1 to Appendix 13, further comprising a semiconductor element, wherein the semiconductor element is flip-chip mounted on the wiring layer. Appendix 15. The electronic device according to Appendix 14, wherein the plurality of electronic components are arranged around the semiconductor element when viewed in the thickness direction of the support member. Appendix 16. The electronic device according to Appendix 14 or Appendix 15, wherein the sealing resin covers the semiconductor element together with the plurality of electronic components. Appendix 17. The electronic device according to any one of Appendix 1 to Appendix 16, wherein the support member contains an insulating resin material. Appendix 18. The electronic device according to Appendix 17, wherein the support member contains the same resin material as the sealing resin.

[0110] A10, A11, A12, A13, A20, A21, A30: electronic device 1: semiconductor element 10a: element main surface 10b: element back surface 14: electrode pad 19: electronic component 19A: first electronic component 19B: second electronic component 19C, 19D, 19X: electronic components 190: main body 190a, 190b: side surface 190c: bottom surface 191, 192: terminals 191a, 192a: lateral electrodes 191b, 192b: bottom electrodes 2: support member 21: support surface 22: back surface 23: side surface 3: wiring layer 30: wiring portion 301: main body 302: base portion 303: groove portion 31: first wiring portion 31a: bonding surface 31b: recessed portion 311: partition portion 312: Connecting portion 32: Second wiring portion 33: Third wiring portion 34, 35, 36: Wiring portion 41, 42: Conductive bonding material 421: Fillet portion 5: External terminal 51: Column portion 52: External electrode portion 6: Sealing resin 61: Resin main surface 62: Resin back surface 63: Resin side surface 631: First side portion 632: Second side portion 80: Support substrate 80a: Substrate main surface 80b: Substrate back surface 82: First resin layer 86: Second resin layer 410, 420: Conductive bonding material 821: Main surface 822: Bottom surface 851: Columnar conductor 861: Top surface CL: Cutting line

Claims

1. An electronic device comprising: a plurality of electronic components, each of which includes a pair of terminals; a support member having a support surface that supports the plurality of electronic components; a wiring layer formed on the support surface; and a sealing resin that covers each of the plurality of electronic components, wherein the wiring layer includes a first wiring portion to which one of the pair of terminals of each of the plurality of electronic components is respectively joined, and the plurality of electronic components are represented in a circuit diagram by a single circuit symbol that represents electrical characteristics of the electronic components.

2. The electronic device of claim 1, wherein the wiring layer includes a second wiring portion and a third wiring portion spaced apart from each other and spaced apart from the first wiring portion, each of the plurality of electronic components is electrically connected between the second wiring portion and the third wiring portion, and the plurality of electronic components includes at least one first electronic component having the pair of terminals joined to the first wiring portion and the second wiring portion, respectively, and at least one second electronic component having the pair of terminals joined to the first wiring portion and the third wiring portion, respectively.

3. The electronic device according to claim 2, wherein the at least one first electronic component includes two first electronic components, the at least one second electronic component includes two second electronic components, and the two first electronic components and the two second electronic components are electrically connected in series with each other.

4. The electronic device described in claim 3, wherein each of the plurality of electronic components includes a main body portion, the support surface faces one side in a thickness direction of the support member, and in each of the plurality of electronic components, the pair of terminals are individually formed on both ends of the main body portion in a first direction perpendicular to the thickness direction.

5. The electronic device described in claim 4, wherein the first wiring portion, the second wiring portion, and the third wiring portion are arranged along the first direction, and the first wiring portion is located between the second wiring portion and the third wiring portion.

6. The electronic device described in claim 5, wherein the first wiring portion includes two partitions spaced apart from each other, one of the two first electronic components and one of the two second electronic components are joined to one of the two partitions, and the other of the two first electronic components and the other of the two second electronic components are joined to the other of the two partitions.

7. The electronic device according to claim 6, wherein the first wiring portion includes a connecting portion that is sandwiched between the two partitions and connects the two partitions.

8. An electronic device as described in any one of claims 5 to 7, wherein the two first electronic components overlap each other when viewed in the first direction, the two second electronic components overlap each other when viewed in the first direction, and the two first electronic components individually overlap the two second electronic components when viewed in a second direction perpendicular to the thickness direction and the first direction.

9. An electronic device as described in any one of claims 1 to 8, further comprising a plurality of external terminals, the support member having a back surface facing opposite the support surface in the thickness direction of the support member, the plurality of external terminals being exposed on the back surface, and the first wiring portion being electrically connected to the plurality of external terminals via the plurality of electronic components.

10. An electronic device as described in any one of claims 1 to 9, further comprising a plurality of conductive bonding materials, each of which individually bonds the first wiring portion to one of the pair of terminals of each of the plurality of electronic components.

11. The electronic device described in claim 10, wherein the first wiring portion has a plurality of bonding surfaces that are in contact with the plurality of conductive bonding materials individually, and at least one recess that is recessed from the plurality of bonding surfaces toward the support surface in the thickness direction of the support member, and the at least one recess is located between adjacent ones of the plurality of bonding surfaces when viewed in the thickness direction.

12. The electronic device according to any one of claims 1 to 11, wherein the performance of each of the plurality of electronic components with respect to the electrical characteristics is the same as each other.

13. The electronic device according to claim 12, wherein the electrical characteristic is one of a capacitance, a resistance value, and an inductance value.

14. The electronic device according to any one of claims 1 to 13, further comprising a semiconductor element, said semiconductor element being flip-chip mounted on said wiring layer.

15. The electronic device according to claim 14, wherein the plurality of electronic components are arranged around the semiconductor element when viewed in the thickness direction of the support member.

16. The electronic device according to claim 14 or 15, wherein the sealing resin covers the semiconductor element as well as the plurality of electronic components.

17. The electronic device according to any one of claims 1 to 16, wherein the support member includes an insulating resin material.

18. The electronic device according to claim 17, wherein the support member contains the same resin material as the sealing resin.

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