Probe device

Abstract

Disclosed is a probe device having a structure in which the elastic forces of an upper contact portion of a probe pin in contact with a terminal of an electronic component and a lower contact portion of the probe pin in contact with a terminal of a substrate do not affect each other, and thus the upper contact portion and the lower contact portion of the probe pin can operate independently of each other.

Description

probe device

[0001] The present invention relates to a probe device, and more specifically, to a probe device in which the upper contact portion of a probe pin that contacts a terminal of an electronic component and the lower contact portion of the probe pin that contacts a terminal of a substrate do not influence each other in contact force, and thus the upper contact portion and the lower contact portion of the probe pin can operate independently.

[0002]

[0003] In the manufacturing process of electronic components, probe devices are used to test their electrical characteristics. These devices electrically connect electronic components to the substrates that power them, allowing them to be tested for their electrical characteristics.

[0004] The probe pin of the probe device has one end in contact with a terminal of an electronic component and the other end in contact with a terminal of a board. In order to achieve stable electrical contact, one end of the probe pin is pressed to a certain level by contacting the terminal of the electronic component, and the other end of the probe pin is pressed to a certain level by contacting the terminal of the board.

[0005] Probe pins of various structures have been proposed to improve terminal contact with the probe pins of the probe device.

[0006] As an example, Korean Patent Registration No. 2152230 presents a technology for a probe pin and an inspection unit using the same, and Fig. 1 illustrates the probe pin presented in the prior art.

[0007] A first contact point (11) is provided on one side of the probe pin (10), and a second contact point (12) is provided on the other side. The movable pin (20) of the probe pin (10) is configured with a first curved portion (21), a straight portion (22), and a second curved portion (23) that are successively and repeatedly formed. In other words, a repetitive zigzag-shaped elastic portion is formed at the middle of the probe pin (10).

[0008] Looking at the operation of the probe pin (10) according to this prior art, when an external force is applied to each of the first contact point (11) and the second contact point (12) of the probe pin (10), the contact forces influence each other.

[0009] That is, when an external force is applied to the first contact point (11) of the probe pin (10), the elastic part of the movable pin (20) is pressed, and the contact force of the first contact point (11) is transmitted to the second contact point (12). Conversely, when an external force is applied to the second contact point (12) of the probe pin (10), the elastic part of the movable pin (20) is pressed, and the contact force of the second contact point (12) is transmitted to the first contact point (11).

[0010] Accordingly, there is a problem in that the external force applied to the first contact point (11) and the second contact point (12) of the probe pin (10) is added together, and the total contact force applied to the probe pin (10) further increases.

[0011] This contact force does not simply affect the probe pin (10), but there is a problem in that the combined contact force applied to the first contact point (11) and the second contact point (12) affects the electronic components and the substrate that come into contact with the probe pin (10).

[0012] In addition, depending on the situation, it is necessary to apply different external forces to the first contact point (11) and the second contact point (12) of the probe pin (10), but since the mutual contact force between the first contact point (11) and the second contact point (12) affects each other, there is a problem in that the first contact point (11) and the second contact point (12) cannot be operated independently.

[0013] In particular, more accurate testing of electronic components is possible only when the contact resistance for the first contact (11) and the contact resistance for the second contact (12) of the probe pin (10) are lowered. By controlling the contact resistance by adjusting the contact force applied to each contact, the contact resistance for the entire probe pin (10) can be reduced. However, since the contact force for the first contact (11) and the contact force for the second contact (12) of the probe pin (10) influence each other, there is a problem in that the contact resistance of each contact cannot be easily controlled, and because of this, there is a problem in that it is difficult to adjust the overall contact resistance of the probe pin (10) to an optimal level.

[0014]

[0015] The present invention has been devised to solve the problems of the prior art as described above, and proposes a technology in which each contact point of a probe pin can operate independently by applying a structure in which the contact force generated when a probe pin comes into contact with an electronic component and the contact force generated when a probe pin comes into contact with a substrate do not affect each other.

[0016] In particular, it is intended to solve the problem of the stress further increasing when the contact force generated when the probe pin is pressed against an electronic component and the contact force generated when the probe pin is pressed against a substrate are added together.

[0017] Furthermore, the contact resistance of each contact point must be reduced to enable more accurate testing of electronic components. However, since the contact force of each contact point influences each other, the contact resistance of each contact point cannot be easily controlled, and thus, the problem of difficulty in adjusting the overall contact resistance of the probe pin to an optimal level is to be solved.

[0018] Furthermore, we aim to solve the problem of greater external force being transmitted to electronic components and the substrate as each contact point of the probe pin influences each other.

[0019] The purpose of the present invention is not limited to what has been described above, and other purposes and advantages of the present invention that are not mentioned can be understood by the following description.

[0020]

[0021] One embodiment of a probe device according to the present invention comprises: a probe pin including an upper contact portion, a lower contact portion, and a contact force control portion connecting the upper contact portion and the lower contact portion; and a guide block on which the probe pin is seated and supported, and which supports the contact force control portion while providing a deformable bending space with respect to an upper portion and a lower portion of the contact force control portion, and by blocking the transmission of contact force between the upper contact portion and the lower contact portion of the probe pin through the guide block, the upper contact portion and the lower contact portion of the probe pin are independently operated, thereby controlling the contact resistance of the upper contact portion and the lower contact portion.

[0022] As an example, the upper contact portion may have one end in contact with a terminal of an electronic component, the lower contact portion may have one end in contact with a terminal of a substrate, the contact force control portion may have an upper portion that is bent and connected to the other side of the upper contact portion to impart elasticity, a lower portion that is bent and connected to the other side of the lower contact portion to impart elasticity, and a bending portion that is bent between the upper portion and the lower portion, and the guide block may include a body portion that includes an upper region that provides an upper bending space so that the upper portion of the contact force control portion can be deformed, a lower region that provides a lower bending space so that the lower portion of the contact force control portion can be deformed, and a support region into which the bending portion of the contact force control portion is fitted and fixed.

[0023] Furthermore, a side portion of the guide block supporting the contact force control portion of the probe pin may be inserted, and a support block may be further included that comes into contact with at least a portion of the outer surface of the contact force control portion to limit movement.

[0024] Going a step further, the guide block may include an upper slot portion having an upper slot extending to the upper portion of the body portion and having an insertion space into which a portion of the upper contact portion of the probe pin is inserted and supported; and a lower slot portion having a lower slot extending to the lower portion of the body portion and having an insertion space into which a portion of the lower contact portion of the probe pin is inserted and supported.

[0025] As an example, the contact force control portion of the probe pin may include an upper portion bent in the width direction from the upper contact portion, a lower portion bent in the width direction from the lower contact portion, and a bending portion bent in the width direction between the upper portion and the lower portion and connected to the upper portion and the lower portion, and an upper slot of the upper slot portion and a lower slot of the lower slot portion may be provided with a slot space having one open side and a width corresponding to the thickness length of the probe pin and a depth corresponding to the width length of the probe pin.

[0026] As an example, the contact force control portion of the probe pin may include an upper portion bent in the thickness direction from the upper contact portion, a lower portion bent in the thickness direction from the lower contact portion, and a bending portion bent in the thickness direction between the upper portion and the lower portion and connected to the upper portion and the lower portion, and an upper slot of the upper slot portion and a lower slot of the lower slot portion may be provided with a slot space having one open side and a width corresponding to the width length of the probe pin and a depth corresponding to the thickness length of the probe pin.

[0027] As an example, the guide block may be provided with an upper slot of the upper slot portion and an intermediate slot extending from the lower slot of the lower slot portion in the upper region, the lower region, and the support region, and the upper bending space and the lower bending space may be provided inside the intermediate slot.

[0028] As an example, the upper slot portion may have a first upper slot on one side, and a second upper slot may be provided on the other side so as to be spaced apart from the first upper slot by a first distance and opposite, and the lower slot portion may have a first lower slot on one side, and a second lower slot may be provided on the other side so as to be spaced apart from the first lower slot by a second distance, and a plurality of the probe pins may be seated facing each other on both sides of the guide block, such that upper contact portions of the probe pins facing each other may be spaced apart from each other by the first distance and lower contact portions of the probe pins facing each other may be seated facing each other by the second distance.

[0029] Furthermore, the lower slot portion of the guide block can control the amount of movement of the probe pin relative to the lower contact portion end according to contact pressure with the terminal of the substrate by adjusting at least one of the size of the insertion space of the lower slot or the size of the lower bending space of the guide block.

[0030] Going one step further, it further includes a floating plate provided with a guide hole corresponding to the upper contact end of the probe pin and arranged on the upper side of the probe pin, and by adjusting at least one of the size or position of the guide hole or the size of the lower bending space of the guide block, the amount of movement of the upper contact end of the probe pin according to the contact pressure with the terminal of the electronic component can be controlled.

[0031]

[0032] According to the present invention, each contact point of the probe pin can be operated independently by applying a structure in which the contact force generated when the probe pin comes into contact with an electronic component and the contact force generated when the probe pin comes into contact with a substrate do not affect each other.

[0033] In particular, since the upper and lower contact portions of the probe pin operate independently and do not affect each other's contact force, the degree to which the probe device contacts and presses the electronic component and the substrate can be easily and independently controlled.

[0034] Furthermore, since the contact forces between the upper and lower contacts do not affect each other, the upper and lower contacts can be operated independently, making it easy to control the contact resistance of the upper and lower contacts, thereby adjusting the overall contact resistance of the probe pin to an optimal level, enabling more accurate testing of electronic components.

[0035] The effects of the present invention are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art to which the present invention pertains from the description below.

[0036]

[0037] Figure 1 illustrates a probe pin according to the prior art.

[0038] Figures 2 to 4 illustrate one embodiment of a probe device according to the present invention.

[0039] Figures 5 to 7 illustrate one embodiment of a probe pin assembly in the present invention.

[0040] Figures 8 to 11 illustrate the operation of one embodiment of a probe device according to the present invention.

[0041] Figures 12 to 14 illustrate an example of independently operating the upper contact portion and the lower contact portion in one embodiment of a probe device according to the present invention.

[0042] Figure 15 shows the results of testing contact resistance according to the contact force of each contact point.

[0043] Figures 16 to 18 illustrate another embodiment of the probe pin assembly in the present invention.

[0044] Figures 19 and 20 illustrate another embodiment of the probe pin assembly in the present invention.

[0045] Figures 21 and 22 illustrate another embodiment of a probe pin assembly according to the present invention.

[0046] FIG. 23 illustrates another embodiment of a probe pin assembly according to the present invention.

[0047]

[0048] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings, but the present invention is not limited or restricted by the embodiments.

[0049] In order to explain the present invention, its operational advantages, and the purpose achieved by the practice of the present invention, preferred embodiments of the present invention are exemplified and examined with reference thereto below.

[0050] First, the terms used in this application are only used to describe specific embodiments and are not intended to limit the present invention, and the singular expression may include plural expressions unless the context clearly indicates otherwise. In addition, it should be understood that the terms "comprise" or "have" in this application are intended to specify the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, and do not exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0051] In describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description will be omitted.

[0052]

[0053] The present invention is a probe device for testing electrical characteristics of electronic components, and proposes a probe device in which the upper contact portion of a probe pin that contacts a terminal of an electronic component and the lower contact portion of the probe pin that contacts a terminal of a substrate do not mutually influence contact forces, thereby enabling the upper contact portion and the lower contact portion of the probe pin to operate independently.

[0054]

[0055] Figures 2 to 4 illustrate one embodiment of a probe device according to the present invention.

[0056] The probe device (100) may include a probe pin assembly (200), a support block (110), a floating plate (130), an upper cover (140), etc.

[0057] The probe pin assembly (200) can be configured by mounting a probe pin (250) on a guide block (210).

[0058] In this embodiment, the probe device (100) is an example for testing an electronic component with terminals arranged in two rows, and the probe pin assembly (200) can be configured in a form in which probe pins (250) are mounted on both left and right sides of the guide block (210) corresponding to the terminal arrangement on both left and right sides of the electronic component.

[0059] The support block (110) is provided with a support space (111) into which a portion of both sides of the probe pin assembly (200) are inserted, and a portion of the side of the probe pin assembly (200) is inserted into the support space (111) of the support block (110) so that the support block (110) and the probe pin assembly (200) can be fastened.

[0060] The probe pin (250) of the probe pin assembly (200) can be brought into contact with the inner wall of the support space (111) of the support block (110). The support block (110) restricts movement of the probe pin (250) according to the contact force, which will be described in detail below through examples.

[0061] As an example, the support block (110) may be composed of a first support block (110a) and a second support block (110b) corresponding to the left and right sides of the probe pin assembly (200). The probe pin assembly (200) may be positioned at the center, and the first support block (110a) and the second support block (110b) may be coupled to each other on the left and right sides, so that the support block (110) and the probe pin assembly (200) may be fastened. The first support block (110a) and the second support block (110b) may be provided with a fastening protrusion (115) and a fastening groove (117) on their sides so that they may be fastened to each other correspondingly.

[0062] An upper cover (140) is placed on the upper part of the support block (110), and a floating plate (130) can be placed on the upper part of the probe pin assembly (200) between the upper cover (140) and the support block (110).

[0063] The upper cover (140) may be provided with a through hole (141) into which a portion of the floating plate (130) can be inserted. The floating plate (130) is fastened to the through hole (141) of the upper cover (140) and can be lowered by an external force or raised to the height of the upper cover (140) by the elastic force of the elastic member (150).

[0064] A guide hole (131) may be formed in the floating plate (130) to correspond to the upper contact portion of the probe pin (250). As the floating plate (130) descends, the guide hole (131) guides the upper contact portion of the probe pin (250) so that the tip of the upper contact portion of the probe pin (250) may be exposed to the outside. The guide hole (131) of the floating plate (130) may be modified in various ways to correspond to the number, size, and position of the probe pins (250) of the probe pin assembly (200).

[0065] The floating plate (130) can be lowered by being pressed by the electronic component to be tested by the probe device (100). As the floating plate (130) is lowered, the probe pin (250) of the probe pin assembly (200) can come into contact with the terminal of the electronic component through the guide hole (131) of the floating plate (130).

[0066] The floating plate (130) can be restored to its position by the elastic force of the elastic member (150). The elastic member (150) can have one side connected to the lower surface of the floating plate (130) and the other side connected to the support block (110). An elastic member fastening portion (not shown) into which one side of the elastic member (150) is inserted and fastened may be provided on the lower surface of the floating plate (130), and an elastic member mounting hole (113) into which the other side of the elastic member (150) is inserted may be provided on the support block (110).

[0067] When an electronic component to be tested is placed on a floating plate (130), the floating plate (130) is pushed downward by pressure from the electronic component and an external force is applied to the elastic member (150), and when the electronic component is removed from the floating plate (130), the floating plate (130) can be pushed upward by the restoring force of the elastic member (150).

[0068] A catch (135) that comes into contact with the upper cover (140) may be provided on the outer periphery of the floating plate (130). When the floating plate (130) rises due to the restoring force of the elastic member (150), the catch (135) of the floating plate (130) comes into contact with the lower surface of the area around the through hole (141) of the upper cover (140), thereby limiting the rise of the floating plate (130), thereby allowing the rising position of the floating plate (130) to be maintained.

[0069]

[0070] FIGS. 5 to 7 illustrate an embodiment of a probe pin assembly in the present invention, and the probe pin assembly (200) will be examined in more detail with reference to FIGS. 5 to 7.

[0071] The probe pin (250) may include an upper contact portion (251), a lower contact portion (253), and a contact force control portion (255).

[0072] The upper contact portion (251) is vertically erected so that one end can come into contact with a terminal of an electronic component. In addition, the lower contact portion (253) is vertically erected so that one end can come into contact with a terminal of a substrate.

[0073] The contact force control unit (255) can connect the upper contact unit (251) and the lower contact unit (253). The contact force control unit (255) can include an upper portion (256), a bending portion (257), and a lower portion (258).

[0074] The upper portion (256) of the contact force control portion (255) extends from the other end of the upper contact portion (251) and can be bent outward to provide elasticity to the upper contact portion (251). For example, when the upper contact portion (251) is lowered by an external force, the upper portion (256) of the contact force control portion (255) bends downward to provide elasticity, and when the external force applied to the upper contact portion (251) is removed, the upper portion (256) of the contact force control portion (255) rises upward with a restoring force to push the upper contact portion (251), so that the position of the upper contact portion (251) can be restored.

[0075] Likewise, the lower portion (258) of the contact force control portion (255) extends from the other end of the lower contact portion (253) and can be bent outward to provide elasticity to the lower contact portion (253). For example, when the lower contact portion (253) is raised by an external force, the lower portion (258) of the contact force control portion (255) is bent upward to provide elasticity, and when the external force applied to the lower contact portion (253) is removed, the lower portion (258) of the contact force control portion (255) is lowered downward by a restoring force to push the lower contact portion (253), so that the position of the lower contact portion (253) can be restored.

[0076] The bending portion (257) of the contact force control portion (255) has one side connected to the upper portion (256) and bent downward, and the other side connected to the lower portion (258) and bent upward, and can connect between the upper portion (256) and the lower portion (258).

[0077] In this embodiment, the probe pin (250) has a shape in which the upper portion (256), the bending portion (257), and the lower portion (258) of the contact force control portion (255) are bent in the thickness direction.

[0078] The guide block (210) on which the probe pin (250) is mounted may include a body portion (220), an upper slot portion (230), a lower slot portion (240), etc. The body portion (220), the upper slot portion (230), and the lower slot portion (240) may be combined as separate individual components to manufacture the guide block (210), or may be formed integrally to manufacture as one block.

[0079] The body part (220) may include an upper region (221), a support region (222), a lower region (223), etc. The present embodiment is an example in which probe pins (250) are arranged in two rows facing each other, and correspondingly, an upper region (221), a support region (222), and a lower region (223) may be provided on each of the left and right sides of the body part (220) of the guide block (210).

[0080] The upper region (221) of the body portion (220) can provide an upper bending space (224) so ​​that the upper portion (256) of the contact force control portion (255) of the probe pin (250) can be deformed. For example, when the upper contact portion (251) of the probe pin (250) is pressed, the upper portion (256) of the contact force control portion (255) is pushed downward and deformed in a bending shape, and a curved sunken space can be formed in the upper region (221) of the body portion (220), and the sunken space can be provided as an upper bending space (224).

[0081] Preferably, the upper region (221) of the body portion (220) may be provided with an upper bending space (224) whose depth decreases from the upper slot portion (230) to the support region (222).

[0082] Likewise, the lower region (223) of the body portion (220) can provide a lower bending space (225) so that the lower portion (258) of the contact force control portion (255) of the probe pin (250) can be deformed. For example, as the lower contact portion (253) of the probe pin (250) is pressed, the lower portion (258) of the contact force control portion (255) is pushed upward and deformed in a bending shape, and a curved recessed space can be formed in the lower region (223) of the body portion (220), and the recessed space can be provided as the lower bending space (225).

[0083] Preferably, the lower region (223) of the body portion (220) may be provided with a lower bending space (225) whose depth decreases from the lower slot portion (240) to the support region (222).

[0084] The support area (222) of the body part (220) can support the bending portion (257) of the contact force control portion (255) of the probe pin (250) by fixing it thereto. As an example, the support area (222) of the body part (220) is formed with a thickness corresponding to the bending portion (257) of the contact force control portion (255) of the probe pin (250), so that the contact force control portion (255) of the probe pin (250) can be inserted and fitted into the support area (222) of the body part (220).

[0085] The upper slot portion (230) extends upward from the upper surface of the body portion (220) and may be formed with a height corresponding to the length of the upper contact portion (251) of the probe pin (250). Preferably, the upper slot portion (230) may be formed with a height lower than the length of the upper contact portion (251) of the probe pin (250) so that the upper contact portion (251) of the probe pin (250) can be exposed to the outside through the guide hole (131) of the floating plate (130). Furthermore, the height of the upper slot portion (230) may be adjusted to control the degree to which the upper contact portion (251) of the probe pin (250) is pushed and moved in one direction while coming into contact with the terminal of the electronic component.

[0086] The lower slot portion (240) extends downward from the lower end of the body portion (220), and the height of the lower slot portion (240) can be adjusted so that the lower contact portion (253) of the probe pin (250) can contact the terminal of the substrate. Preferably, the lower slot portion (240) can be formed to have a height lower than the length of the lower contact portion (253) of the probe pin (250) so that the lower contact portion (253) of the probe pin (250) can contact the terminal of the substrate and be sufficiently scribed. Furthermore, the height of the lower slot portion (240) can be adjusted to control the degree to which the lower contact portion (253) of the probe pin (250) is pushed and moved in one direction while making contact with the terminal of the substrate.

[0087] In response to the probe pins (250) arranged in two rows, the upper slot portion (230) may be provided with an upper slot (237) into which a portion of the upper contact portion (251) of the probe pin (250) is inserted and supported on both left and right sides. In addition, in response to the probe pins (250) arranged in two rows, the lower slot portion (240) may be provided with a lower slot (247) into which a portion of the lower contact portion (253) of the probe pin (250) is inserted and supported on both left and right sides.

[0088] And a middle slot (227) may be provided across the upper region (221), the support region (222), and the lower region (223) of the body portion (220).

[0089] The upper slot (237), the middle slot (227), and the lower slot (247) are formed as open spaces on one side and can be connected to each other. The probe pin (250) can be inserted and mounted in the thickness direction on the upper slot (237), the middle slot (227), and the lower slot (247) provided in the guide block (210). That is, the probe pin (250) can be inserted into the slot of the guide block (210) in the thickness direction and mounted in a form in which the width direction surface is exposed.

[0090] The upper slot (237) and the lower slot (247) may be formed as slot spaces having a width corresponding to the width of the probe pin (250) and a depth corresponding to the thickness of the probe pin (250). As an example, an insertion space may be formed with a width that is longer by a set length than the width of the probe pin (250) and a depth that is longer by a set length than the thickness of the probe pin (250).

[0091] As an example, the middle or lower portion of the upper contact portion (251) of the probe pin (250) may be inserted into the upper slot (237) of the upper slot portion (230). The widthwise bending deformation of the upper contact portion (251) of the probe pin (250) may be limited by the upper slot (237). In addition, the thicknesswise backward bending deformation of the upper contact portion (251) of the probe pin (250) may be limited by the upper slot (237).

[0092] As an example, the middle or upper portion of the lower contact portion (253) of the probe pin (250) may be inserted into the lower slot (247) of the lower slot portion (240). The widthwise bending deformation of the lower contact portion (253) of the probe pin (250) may be limited by the lower slot (247). In addition, the thicknesswise backward bending deformation of the lower contact portion (253) of the probe pin (250) may be limited by the lower slot (247).

[0093] In addition, the contact force control unit (255) of the probe pin (250) may be inserted into the middle slot (227) of the body part (220). The upper bending space (224) and the lower bending space (225) of the body part (220) described above may be provided inside the middle slot (227). That is, the middle slot (227) provided in the upper region (221) of the body part (220) may be formed as a curved recessed space corresponding to the shape in which the upper portion (256) of the contact force control unit (255) of the probe pin (250) is pushed downward and bent. In addition, the middle slot (227) provided in the lower region (223) of the body part (220) may be formed as a curved recessed space corresponding to the shape in which the lower portion (258) of the contact force control unit (255) of the probe pin (250) is pushed upward and bent.

[0094] And the middle slot (227) provided in the support area (222) of the body part (220) can be adjusted in width and depth so that the bending portion (257) of the contact force control portion (255) of the probe pin (250) can be inserted and fixed in a forced fit manner.

[0095] The probe device according to the present invention can operate independently of the upper and lower contact parts of the probe pin by blocking the mutual contact force between the upper and lower contact parts. Hereinafter, the operation of the probe device according to the present invention will be described through examples.

[0096] Figures 8 to 13 illustrate the operation of one embodiment of a probe device according to the present invention.

[0097] The above drawings 8 and 9 illustrate the operation when an electronic component is mounted on the probe device (100).

[0098] An electronic component (P) whose electrical characteristics are to be tested is placed on a floating plate (130) of a probe device (100), and the floating plate (130) is lowered downward by an external force applied by the electronic component (P).

[0099] As the floating plate (130) descends, the upper contact portion (251) of the probe pin (250) passes through the guide hole (131) of the floating plate (130) and is exposed to the outside, so that the end of the upper contact portion (251) can come into contact with the terminal (CT) of the electronic component (P).

[0100] When the upper contact portion (251) of the probe pin (250) is pressed by the terminal (CT) of the electronic component (P), an external force is applied to the upper contact portion (251) of the probe pin (250), causing the upper contact portion (251) to descend downward.

[0101] As the upper contact portion (251) of the probe pin (250) descends due to a contact force caused by an external force, the upper portion (256) of the contact force control portion (255) of the probe pin (250) is bent and deformed on the upper bending space (224) provided in the upper region (221) of the body portion (220) of the guide block (210). The bending deformation of the upper portion (256) of the contact force control portion (255) of the probe pin (250) changes in response to the contact force applied to the upper contact portion (251).

[0102] In addition, since the bending portion (257) of the contact force control portion (255) of the probe pin (250) is supported by the support area (222) of the body portion (220) of the guide block (210) and its movement is restricted by the inner wall of the support space (111) of the support block (110), the contact force of the upper contact portion (251) is no longer transmitted downward. That is, the contact force according to the external force applied to the upper contact portion (251) of the probe pin (250) appears as a bending deformation of the upper portion (256) of the contact force control portion (255) of the probe pin (250), and since the movement of the bending portion (257) is restricted by the guide block (210) and the support block (110), the contact force of the upper contact portion (251) is not transmitted to the lower contact portion (253).

[0103] Furthermore, in the present invention, the scribe can be controlled by controlling the amount of movement of the upper contact portion (251) with respect to the terminal (CT) of the electronic component (P), and this will be described with reference to (c) of the above-described FIG. 8.

[0104] (c) of the above Fig. 8 is an enlarged view of the position A1 of the upper contact portion (251) of the probe pin (250) in (a) of the above Fig. 8 and the position B1 of the upper contact portion (251) of the probe pin (250) in (b) of the above Fig. 8.

[0105] As the upper contact portion (251) of the probe pin (250) comes into contact with the terminal (CT) of the electronic component (P) and is pressed, it is pushed to a certain degree and moves, thereby generating a scribe, thereby further improving the contact reliability between the upper contact portion (251) and the terminal (CT).

[0106] Here, by controlling the amount of movement of the tip of the upper contact portion (251) of the probe pin (250) by adjusting the size or position of the guide hole (131) provided in the floating plate (130), the amount of scribe generated when the upper contact portion (251) comes into contact with the terminal (CT) of the electronic component (P) can be controlled.

[0107] For example, since the range of movement of the end of the upper contact portion (251) changes in proportion to the hole size of the guide hole (131), the amount of movement L1 of the end of the upper contact portion (251) can be controlled by adjusting the hole size of the guide hole (131), and accordingly, the scribe generated when the upper contact portion (251) comes into contact with the terminal (CT) of the electronic component (P) can be controlled. In addition, the scribe generated when the upper contact portion (251) comes into contact with the terminal (CT) of the electronic component (P) can also be controlled by adjusting the position of the guide hole (131) based on the vertical extension line of the probe pin (250) to the upper contact portion (251).

[0108] By adjusting the amount of scribe of the upper contact portion (251) according to the terminal (CT) contact of the electronic component (P), the contact resistance of the upper contact portion (251) can be more easily controlled.

[0109] For example, by controlling the amount of scribe by controlling the amount of movement of the end of the upper contact portion (251) along with adjusting the contact force for the upper contact portion (251) so that the contact resistance of the upper contact portion (251) is satisfied within the required range, the contact resistance of the upper contact portion (251) can be controlled to a desired level.

[0110] The above drawings 10 and 11 illustrate the operation when the probe device (100) comes into contact with the substrate.

[0111] The probe device (100) is mounted on a substrate that drives an electronic component, so that the lower contact portion (253) of the probe pin (250) comes into contact with the terminal (ST) of the substrate (S). An external force applied by the substrate is transmitted to the lower contact portion (253) of the probe pin (250), so that the lower contact portion (253) of the probe pin (250) can be pressed upward.

[0112] When the lower contact portion (253) of the probe pin (250) is pressed by the terminal (ST) of the substrate (S), an external force is applied to the lower contact portion (253) of the probe pin (250), causing the lower contact portion (253) to rise upward.

[0113] As the lower contact portion (253) of the probe pin (250) rises due to the contact force caused by the external force, the lower portion (258) of the contact force control portion (255) of the probe pin (250) is bent and deformed on the lower bending space (225) provided in the lower region (223) of the body portion (220) of the guide block (210). The bending deformation of the lower portion (258) of the contact force control portion (255) of the probe pin (250) changes in response to the contact force applied to the lower contact portion (253).

[0114] In addition, since the bending portion (257) of the contact force control portion (255) of the probe pin (250) is supported by the support area (222) of the body portion (220) of the guide block (210) and its movement is restricted by the inner wall of the support space (111) of the support block (110), the contact force of the lower contact portion (253) can no longer be transmitted upward. That is, the contact force according to the external force applied to the lower contact portion (253) of the probe pin (250) appears as a bending deformation of the lower portion (258) of the contact force control portion (255) of the probe pin (250), and since the movement of the bending portion (257) is restricted by the guide block (210) and the support block (110), the contact force of the lower contact portion (253) is not transmitted to the upper contact portion (251).

[0115] Furthermore, in the present invention, the scribe can be controlled by controlling the amount of movement of the lower contact portion (253) with respect to the terminal (ST) of the substrate (S), and this will be described with reference to (c) of the above-described FIG. 10.

[0116] (c) of the above Fig. 10 is an enlarged view of the position A2 of the lower contact portion (253) of the probe pin (250) in (a) of the above Fig. 10 and the position B2 of the lower contact portion (253) of the probe pin (250) in (b) of the above Fig. 10.

[0117] As the lower contact portion (253) of the probe pin (250) comes into contact with the terminal (ST) of the substrate (S) and is pressed, it is pushed to a certain degree and moves, thereby generating a scribe, thereby further improving the contact reliability between the lower contact portion (253) and the terminal (ST).

[0118] Here, by controlling the size of the lower slot (247) provided in the lower slot portion (240) of the guide block (210) or the size of the lower bending space (225) of the guide block (210), the amount of movement of the end of the lower contact portion (253) of the probe pin (250) can be controlled, thereby controlling the amount of scribe generated when the lower contact portion (253) comes into contact with the terminal (ST) of the substrate (S).

[0119] For example, the range of movement of the end of the lower contact portion (253) can be changed in proportion to the size of the lower slot (247) of the lower slot portion (240), and also the range of movement of the end of the lower contact portion (253) can be changed in proportion to the degree to which the lower contact portion (253) is inserted into the lower bending space (225) of the guide block (210). Therefore, in the present invention, the amount of movement L2 of the end of the lower contact portion (253) can be controlled by adjusting the size of the lower slot (247) or the size of the lower bending space (225) of the guide block (210), and accordingly, the scribe generated when the lower contact portion (253) comes into contact with the terminal (ST) of the substrate (S) can be controlled.

[0120] By adjusting the amount of scribe of the lower contact portion (253) according to the contact with the terminal (ST) of the substrate (S), the contact resistance of the lower contact portion (253) can be more easily controlled.

[0121] In this way, the present invention adopts a structure in which the contact force of the upper contact part (251) and the contact force of the lower contact part (253) do not mutually influence each other, so that the contact force of the upper contact part (251) and the contact force of the lower contact part (253) can be controlled differently by independently operating the upper contact part (251) and the lower contact part (253). In addition, the scribing degree can be controlled by controlling the amount of movement of the end of the upper contact part (251) and the amount of movement of the end of the lower contact part (253). In the present invention, the contact resistance of each contact can be easily controlled by adjusting the contact force and scribing of the upper contact part (251) and the lower contact part (253).

[0122] That is, by adjusting the contact force and scribe amount of the upper contact portion (251) while the lower contact portion (253) is in contact with the terminal of the substrate with sufficient contact force and scribe amount so that electrical connection can be made with the required contact resistance between the lower contact portion (253) and the terminal of the substrate, the contact resistance according to the contact with the terminal of the electronic component can be easily controlled.

[0123] In relation to the control of contact resistance in the present invention, FIGS. 12 to 14 illustrate an example of independently operating the upper contact portion (251) and the lower contact portion (253) of the probe pin (250) in the probe device (100).

[0124] The probe device (100) according to the present invention was mounted on a substrate (S), and the lower contact portion (253) of the probe pin (250) was brought into contact with the terminal (ST) of the substrate (S) and gradually pressurized to control the contact force according to the external force of magnitude F1. Then, while maintaining the contact force of the lower contact portion (253), an electronic component (P) was mounted on the upper portion of the probe device (100), and the upper contact portion (251) of the probe pin (250) was brought into contact with the terminal (CT) of the electronic component (P) and gradually pressurized to control the contact force according to the external force of magnitude F2 in various different cases. As described above, the contact force of the lower contact portion (253) and the contact force of the upper contact portion (215) were controlled to test the contact force for the contact portion of the probe device (100).

[0125] In the above Fig. 14, T1 is a time period in which an external force of magnitude F1 is applied to the lower contact portion (253) of the probe pin (250) in the probe device (100) to operate the lower contact portion (253), and T2 is a time period in which an external force of magnitude F2 is applied to the upper contact portion (251) of the probe pin (250) to operate the upper contact portion (251) while the contact force of the lower contact portion (253) of the probe pin (250) is maintained. In addition, in the above Fig. 14, Force-B represents a reaction force against the lower contact portion (253) of the probe pin (250), and Force-T represents a reaction force against the upper contact portion (251) of the probe pin (250).

[0126] (a) of the above Fig. 14 shows the case where F1 and F2 are of the same size, (b) of the above Fig. 14 shows the case where F1 is larger than F2, and (c) of the above Fig. 14 shows the case where F2 is larger than F1.

[0127] In the section T1 where the probe device (100) is mounted on the substrate (S), the lower contact portion (253) of the probe pin (250) is brought into contact with the terminal (ST) of the substrate (S) and an external force is applied up to F1, the contact force of the lower contact portion (253) of the probe pin (250) increases, but the contact force of the lower contact portion (253) is not transmitted to the upper contact portion (251) of the probe pin (250).

[0128] And, by mounting an electronic component (P) on the upper part of the probe device (100), the upper contact part (251) of the probe pin (250) is brought into contact with the terminal (CT) of the electronic component (P) and an external force is applied up to F2. In the section T2, the contact force for the upper contact part (251) of the probe pin (250) increases, but is not transmitted to the lower contact part (253) of the probe pin (250), so the contact force for the lower contact part (253) of the probe pin (250) remains at F1.

[0129] As shown in the above Fig. 14, in the probe device (100) according to the present invention, even when the contact force of the upper contact portion (251) is variously adjusted, the contact force of the lower contact portion (253) does not change and is maintained in that state, so that the contact force of the upper contact portion can be adjusted by changing the external force applied to the upper contact portion (251) according to various required situations.

[0130] That is, the probe device (100) according to the present invention adopts a structure in which the contact force between the upper contact portion of the probe pin that contacts the terminal of the electronic component and the lower contact portion of the probe pin that contacts the terminal of the substrate does not mutually affect each other, thereby controlling the external force applied to the lower contact portion of the probe pin and the external force applied to the upper contact portion of the probe pin differently, so that the upper contact portion and the lower contact portion of the probe pin can operate independently.

[0131] Figure 15 shows the results of testing contact resistance according to the contact force of each contact point.

[0132] (a) of the above Fig. 15 shows the contact force of the upper contact and the lower contact for the probe device according to the present invention, and (b) of the above Fig. 15 shows the contact force of the upper contact and the lower contact for the probe device applying the probe pin according to the prior art of the above Fig. 1.

[0133] Looking at (a) of the above-described Figure 15, as described above, the probe device according to the present invention can maintain a certain level of contact force by providing sufficient contact force to the lower contact point, and even if the contact force of the upper contact point is gradually changed, the contact force of the lower contact point can be maintained constant without changing.

[0134] In contrast, looking at (b) of the above-described Fig. 15, the probe device according to the prior art applies a certain level of contact force to the lower contact point, and then as the contact force is applied to the upper contact point, the contact force of the upper contact point is transmitted to the lower contact point, so that the contact force of the lower contact point also increases. In particular, since the contact force of the lower contact point is transferred to the upper contact point at the start of applying the contact force to the upper contact point, it can be seen that the contact force of the upper contact point increases rapidly for a certain period of time while the contact force of the lower contact point is reflected to the upper contact point.

[0135] That is, since the present invention can first apply sufficient contact force to the lower contact before applying contact force to the upper contact, the contact resistance of each contact can be easily controlled through contact force adjustment. However, in the case of the prior art, since the contact force between the upper and lower contacts is transmitted to each other, there is a problem in that the contact force of each contact cannot be easily adjusted to the desired level. Accordingly, the contact resistance according to the contact force of each contact cannot be controlled to a level suitable for the conditions.

[0136] (c) of the above Fig. 15 shows a graph of the results of measuring the total contact resistance of the probe pin for the upper and lower contacts by setting the time point at which contact force begins to be applied to the upper contact point in (a) and (b) of the above Fig. 15 as time 0.

[0137] In the case of the prior art, in the initial time range where the contact force begins to be applied to the upper contact, the contact force of the lower contact affects the upper contact, so the contact force of the upper contact increases rapidly from the time the terminal of the electronic component is brought into contact with the upper contact. However, in the case of the present invention, the contact force of the lower contact does not affect the upper contact, so only the external force applied to the upper contact is reflected as the contact force of the upper contact. Accordingly, it can be seen that the contact resistance of the prior art is lower than the contact resistance of the present invention in the initial certain time range.

[0138] However, as explained above, in the case of the prior art, the contact force of each contact point cannot be individually controlled, so the overall contact resistance cannot be controlled. However, in the case of the present invention, the contact force of each contact point can be individually controlled to control the overall contact resistance to a desired level, so the contact resistance can be further lowered or the contact resistance can be maintained at a required level depending on the situation.

[0139] In this way, in the present invention, since the upper and lower contact portions of the probe pin operate independently and do not affect each other in terms of contact force, the degree to which the probe device is pressed by contacting the electronic component and the substrate can be easily and independently designed to control the contact resistance of the upper and lower contact portions.

[0140] Furthermore, in the embodiment according to the present invention described above, the support blocks (110) are coupled to both sides of the probe pin assembly (200) so that the probe pin (250) comes into contact with the inner wall of the support space (111) of the support block (110) and its movement is restricted. However, depending on the situation, the support blocks (110) may be omitted and the movement of the probe pin (250) may be restricted by the probe pin assembly (200) alone, thereby independently operating the upper and lower contact portions of the probe pin (250). For example, by adjusting the size of the middle slot (227) provided in the body portion (220) of the guide block (210), the contact force control portion (255) of the probe pin (250) may be inserted in a force-fit manner, thereby restricting the movement of the contact force control portion (255) of the probe pin (250) by the middle slot (227), thereby independently operating the upper and lower contact portions of the probe pin (250).

[0141]

[0142] The probe device according to the present invention can be modified in various ways. Hereinafter, various modified examples of the probe device according to the present invention will be examined.

[0143] Figures 16 to 18 illustrate another embodiment of the probe pin assembly in the present invention.

[0144] In the probe pin assembly (300), the probe pin (350) can be modified in various ways, and the guide block (310) can also be modified accordingly.

[0145] In this embodiment, the probe pin (350) is bent in the width direction, and the upper part (356) of the contact force control part (355) can be bent in the width direction from the end of the upper contact part (351), and the lower part (358) of the contact force control part (355) can be bent in the width direction from the end of the lower contact part (353).

[0146] And the bending portion (357) of the contact force control portion (355) can be bent in the width direction from each of the upper portion (356) and the lower portion (358) of the contact force control portion (355) to connect the upper portion (356) and the lower portion (358).

[0147] The upper slot (337), middle slot (327) and lower slot (347) provided in the body portion (320), upper slot portion (330) and lower slot portion (340) of the guide block (310) can also be modified to correspond to the shape of the probe pin (350).

[0148] A probe pin (350) can be inserted and mounted in the width direction in the guide block (310). To this end, the upper slot (337) of the upper slot portion (330) and the lower slot (347) of the lower slot portion (340) can be formed as slot spaces having a width corresponding to the thickness length of the probe pin (350) and a depth corresponding to the width length of the probe pin (350).

[0149] In addition, a contact force control unit (355) of a probe pin (350) is inserted into the middle slot (327) of the body part (320), and an upper bending space (324) and a lower bending space (325) can be formed as corresponding sunken spaces in the middle slot (327) provided in the upper region (321) of the body part (320) and the middle slot (327) provided in the lower region (323) of the body part (320) so that the probe pin (350) can be bent and deformed in the width direction.

[0150] In addition, the middle slot (327) provided in the support area (322) of the body part (320) can be formed as a space having a width corresponding to the thickness length of the probe pin (350) and a depth corresponding to the width length of the probe pin (350) so that the bending portion (357) of the contact force control portion (355) of the probe pin (350) can be inserted and fixed in a forced fit manner.

[0151] As seen in the previously described embodiments and this embodiment, in the present invention, the probe pin assembly may be mounted with the probe pins arranged in the width direction or may be mounted with the probe pins arranged in the length direction.

[0152]

[0153] Figures 19 and 20 illustrate another embodiment of the probe pin assembly in the present invention.

[0154] The guide block (410) of the probe pin assembly (400) can be modified in various ways, and the present embodiment is an example in which a slot into which the probe pin (450) is inserted and mounted is selectively formed in the guide block (410).

[0155] The guide block (410) on which the probe pin (450) is mounted may include a body portion (420), an upper slot portion (430), a lower slot portion (440), etc.

[0156] The upper slot portion (430) may be provided with an upper slot (437) into which a part of the upper contact portion of the probe pin (450) is inserted and supported, and the lower slot portion (440) may be provided with a lower slot (447) into which a part of the lower contact portion of the probe pin (450) is inserted and supported.

[0157] However, the body part (420) may not be provided with a slot into which a probe pin (450) is inserted.

[0158] The upper region (421) of the body portion (420) can provide an upper bending space (424) so ​​that the upper portion (456) of the contact force control portion of the probe pin (450) can be deformed. For example, the upper bending space (424) can be formed in the entire region where the upper portion (456) of the contact force control portion (455) of the probe pin (450) is arranged in the upper region (421) of the body portion (420). Preferably, the upper bending space (424) of the upper region (421) of the body portion (420) can be provided in a form in which the depth thereof gradually decreases from the upper slot portion (430) toward the support region (427).

[0159] In addition, a lower bending space (425) may be provided in the lower region (423) of the body portion (420) so that the lower portion (458) of the contact force control portion of the probe pin (450) can be deformed. For example, the lower bending space (425) may be formed in the entire region where the lower portion (458) of the contact force control portion of the probe pin (450) is arranged in the lower region (423) of the body portion (420). Preferably, the lower bending space (425) may be provided in a form in which the depth of the lower region (423) of the body portion (420) gradually decreases from the lower slot portion (440) toward the support region (427).

[0160] In addition, the support area (422) of the body part (420) is not provided with a separate slot, and is formed with a thickness corresponding to the bending portion of the contact force control part of the probe pin (450), so that the contact force control part of the probe pin (450) can be inserted and fitted onto the surface of the support area (422) of the body part (420).

[0161]

[0162] Furthermore, to accommodate the high-speed transmission of large amounts of data, the number of terminals on electronic components is increasing, leading to further miniaturization and slimming. To achieve efficient terminal layout, these terminals are mounted in multiple rows. However, due to the narrow pitch and small size of electronic components, arranging terminals on the board in accordance with the component's terminals presents challenges due to spatial and wiring constraints. To address this issue, the Space Transformer has been proposed.

[0163] Space Transformer is a technology that converts the distance between narrow terminals into a wide one and connects them.

[0164] The present invention proposes a technique for achieving a space transformer, and in this regard, FIGS. 21 and 22 illustrate an embodiment of a probe pin assembly according to the present invention.

[0165] In this embodiment, the probe pin assembly (500) is an example of applying the configuration of the space transformer to the embodiment of FIG. 5 described above, but is not limited thereto, and the configuration of the space transformer can be applied to other embodiments described above.

[0166] In correspondence with the probe pins (550) arranged in two rows, upper slots (537a, 537b) are provided on both left and right sides of the upper slot portion (530) of the guide block (510), and a first separation distance (UD) may be formed between the upper slots (537a, 537b) on both left and right sides. In addition, lower slots (547a, 547b) are provided on both left and right sides of the lower slot portion (540) of the guide block (510), and a second separation distance (DD) may be formed between the lower slots (547a, 547b) on both left and right sides. As an example, the first upper slot (537a) and the second upper slot (537b) may be formed with a first separation distance (UD) so as to have a separation distance corresponding to the spacing between terminal rows of an electronic component having two rows of terminals. And, the first lower slot (547a) and the second lower slot (547b) may be formed with a second separation distance (DD) so as to have a separation distance corresponding to the spacing between the terminal rows of the substrate. Here, the first separation distance (UD) between the upper slots (537a, 537b) may be a relatively narrow distance corresponding to the narrow distance between the terminal rows of the electronic component, and the second separation distance (DD) between the lower slots (547a, 547b) may be spaced at a sufficiently wide distance so as to facilitate the design and manufacture of the substrate.

[0167] The two rows of probe pins (550) are mounted opposite each other on the guide block (510), so that the upper contact point separation distance and the lower contact point separation distance between the rows of probe pins (550) can be adjusted differently from each other.

[0168] The upper contact portion (551a) of the first heat probe pin may be inserted and seated in the first upper slot (537a) of the upper slot portion (530), and the upper contact portion (551b) of the second heat probe pin may be inserted and seated in the second upper slot (537b). The upper contact portions (551a, 551b) of the probe pins seated in the first upper slot (537a) and the second upper slot (537b) of the upper slot portion (530) may be spaced apart from each other by a first separation distance (UD).

[0169] In addition, the lower contact portion (553a) of the first heat probe pin may be inserted and seated in the first lower slot (547a) of the lower slot portion (540), and the lower contact portion (553b) of the second heat probe pin may be inserted and seated in the second lower slot (547b). The lower contact portions (553a, 553b) of the probe pins seated in the first lower slot (547a) and the second lower slot (547b) of the lower slot portion (540) may be spaced apart by a second separation distance (DD).

[0170] In this way, a space transformer can be achieved by implementing a lower contact point by expanding the upper contact point corresponding to the narrow gap between the terminal rows of the electronic component to the wide gap between the terminal rows of the substrate through the probe pin assembly (500) according to the present invention.

[0171]

[0172] The embodiments of the probe device according to the present invention described above have been described as having a structure corresponding to an electronic component in which terminals are arranged in two arrays on the left and right sides, but the probe device according to the present invention can be modified in various ways depending on the shape of the electronic component and the terminal arrangement.

[0173] As one embodiment, FIG. 23 illustrates another embodiment of a probe pin assembly according to the present invention.

[0174] This embodiment illustrates a probe pin assembly applied to a probe device for testing electronic components having terminals in four directions: front, back, left, and right.

[0175] The guide block (610) may have an upper slot portion (630) protruding upward from the center at a certain distance from the front, back, left, and right outer edges of the upper surface of the body portion (620), and a lower slot portion (640) protruding downward from the center at a certain distance from the front, back, left, and right outer edges of the rear surface of the body portion (620).

[0176] And, slots in which probe pins (650) are mounted can be provided in each of the four directions of the front, back, left, and right of the guide block (610), and the probe pins (650) can be mounted on the slots provided in each direction.

[0177] The embodiment of FIG. 23 can be modified by applying various embodiments described above. For example, the embodiment of FIG. 19 can be applied to selectively form slots, or the embodiment of FIG. 21 can be applied to implement a space transformer.

[0178]

[0179] According to the present invention, each contact point of the probe pin can be operated independently by applying a structure in which the contact force generated when the probe pin comes into contact with an electronic component and the contact force generated when the probe pin comes into contact with a substrate do not affect each other.

[0180] In particular, since the upper and lower contact points of the probe pin operate independently and do not influence each other's contact force, the degree to which the probe device contacts and presses the electronic component and the substrate can be easily and independently controlled. Through the independent operation of each contact point, contact resistance can be easily controlled.

[0181]

[0182] The above description is merely an illustrative illustration of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations can be made without departing from the essential characteristics of the present invention. Therefore, the embodiments described in the present invention are not intended to limit the technical idea of ​​the present invention, but rather to illustrate it, and the technical idea of ​​the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

Claims

1. A probe pin including an upper contact portion, a lower contact portion, and a contact force control portion connecting the upper contact portion and the lower contact portion; and The probe pin is supported and secured, and includes a guide block that supports the contact force control unit while providing a deformable bending space for the upper and lower portions of the contact force control unit. A probe device characterized in that the contact resistance of the upper contact portion and the lower contact portion is controlled by independently operating the upper contact portion and the lower contact portion of the probe pin by blocking the transmission of contact force between the upper contact portion and the lower contact portion of the probe pin through the guide block.

2. In paragraph 1, The upper contact portion has one end in contact with the terminal of the electronic component, The above lower contact portion has one end in contact with the terminal of the substrate, The above contact force control unit includes a bending portion that is bent and connected to the other side of the upper contact portion to impart elasticity, a lower portion that is bent and connected to the other side of the lower contact portion to impart elasticity, and a bending portion that is bent between the upper portion and the lower portion. The above guide block is, A probe device characterized in that it includes a body part including an upper region providing an upper bending space so that an upper part of the contact force control part can be deformed, a lower region providing a lower bending space so that a lower part of the contact force control part can be deformed, and a support region into which a bending part of the contact force control part is fitted and fixed.

3. In paragraph 1, A probe device characterized in that a portion of the side of the guide block supporting the contact force control portion of the probe pin is inserted, and further includes a support block that comes into contact with at least a portion of the outer surface of the contact force control portion to limit movement.

4. In paragraph 2, The above guide block is, An upper slot portion having an upper slot extending to the upper portion of the body portion and having an insertion space into which a portion of the upper contact portion of the probe pin is inserted and supported; and A probe device characterized by including a lower slot portion having a lower slot extending to the lower portion of the body portion and having an insertion space into which a portion of the lower contact portion of the probe pin is inserted and supported.

5. In paragraph 4, The contact force control unit of the above probe pin, It includes an upper portion bent in the thickness direction from the upper contact portion, a lower portion bent in the thickness direction from the lower contact portion, and a bending portion bent in the thickness direction between the upper portion and the lower portion and connected to the upper portion and the lower portion. The upper slot of the upper slot part and the lower slot of the lower slot part are, A probe device characterized in that one side is open and a slot space is provided having a width corresponding to the width length of the probe pin and a depth corresponding to the thickness length of the probe pin.

6. In paragraph 4, The contact force control unit of the above probe pin, It includes an upper portion bent in the width direction from the upper contact portion, a lower portion bent in the width direction from the lower contact portion, and a bending portion bent in the width direction between the upper portion and the lower portion and connected to the upper portion and the lower portion. The upper slot of the upper slot part and the lower slot of the lower slot part are, A probe device characterized in that one side is open and a slot space is provided having a width corresponding to the thickness length of the probe pin and a depth corresponding to the width length of the probe pin.

7. In paragraph 4, The above guide block is, A probe device characterized in that an upper slot of the upper slot part and an intermediate slot extending from the lower slot of the lower slot part are provided in the upper region, the lower region, and the support region, and the upper bending space and the lower bending space are provided inside the intermediate slot.

8. In paragraph 4, The upper slot portion above, A first upper slot is provided on one side, and a second upper slot is provided on the other side opposite to the first upper slot and spaced apart from the first upper slot by a first distance, The above lower slot portion, A first lower slot is provided on one side, and a second lower slot is provided on the other side opposite to the first lower slot and spaced a second distance apart from the first lower slot. A plurality of the above probe pins are positioned facing each other on both sides of the above guide block, A probe device characterized in that the upper contact portions of the probe pins facing each other are spaced apart by the first separation distance, and the lower contact portions of the probe pins facing each other are spaced apart by the second separation distance and are seated.

9. In paragraph 4, The lower slot portion of the above guide block, A probe device characterized in that the amount of movement of the probe pin relative to the lower contact portion end according to contact pressure with the terminal of the substrate is controlled by adjusting at least one of the size of the insertion space of the lower slot or the size of the lower bending space of the guide block.

10. In paragraph 1, It further includes a floating plate positioned on the upper portion of the probe pin and having a guide hole corresponding to the end of the upper contact portion of the probe pin. A probe device characterized in that the amount of movement of the upper contact end of the probe pin according to contact pressure with the terminal of the electronic component is controlled by adjusting either the size or position of the guide hole.

Images