Electronic device

Abstract

The present application belongs to the field of electronic devices. Disclosed is an electronic device. The electronic device comprises a circuit board, a light-emitting element and a photosensitive element. The circuit board comprises a dielectric layer and a plurality of conductive layers arranged at intervals, wherein the dielectric layer is arranged between adjacent conductive layers in an insulating manner; and a first electrode, a second electrode and a charging coil are provided in the plurality of conductive layers. The circuit board has a first mounting slot where the first electrode is exposed, a second mounting slot where the second electrode is exposed, and a slot wall arranged between the first mounting slot and the second mounting slot, wherein the light-emitting element is accommodated in the first mounting slot and is electrically connected to the first electrode; the photosensitive element is accommodated in the second mounting slot and is electrically connected to the second electrode; and the slot wall plays a role of shading between the light-emitting element and the photosensitive element.

Description

electronic devices

[0001] Cross-references

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on July 17, 2023, with application number 202310876682.1 and invention name “Electronic Device”. The entire contents of the application are incorporated by reference into this application. Technical Field

[0003] The present application belongs to the field of electronic equipment, and specifically relates to an electronic equipment. Background Art

[0004] Electronic devices are equipped with various photoelectric sensors that convert optical and electrical signals. The light-emitting element in a photoelectric sensor emits light. This light, upon encountering an object, is then reflected back to the sensor and received by the photosensitive element. The sensor then converts the received light signal into an electrical signal, which can then be analyzed to detect and obtain information.

[0005] In electronic devices of the related art, the light-emitting element and the photosensitive element are arranged together on a first circuit board, and a light-shielding cover is provided on the light-emitting element and the photosensitive element to prevent or reduce the emitted light of the light-emitting element from directly entering the photosensitive element and interfering with the photosensitive element's reception of reflected light. A second circuit board and a wound charging coil are provided on the side of the first circuit board away from the light-emitting element and the photosensitive element. The charging coil is used to charge the electronic device, and the second circuit board is used to set components such as a control chip that controls the charging of the charging coil. When assembling the electronic device, it is necessary to wind the charging coil and solder the second circuit board and the charging coil, making the assembly steps cumbersome.

[0006] Summary of the Invention

[0007] The purpose of the embodiments of the present application is to provide an electronic device that can solve the technical problem of complicated assembly steps of electronic devices in related technologies.

[0008] In order to solve the above technical problems, this application is implemented as follows:

[0009] In a first aspect, an embodiment of the present application provides an electronic device, including:

[0010] The circuit board includes a dielectric layer and a plurality of conductive layers spaced apart, wherein the dielectric layer is insulated and spaced apart between adjacent conductive layers, wherein the plurality of conductive layers are provided with a first electrode, a second electrode, and a charging coil, and wherein the circuit board has a first mounting groove exposing the first electrode, a second mounting groove exposing the second electrode, and a groove wall spaced between the first mounting groove and the second mounting groove;

[0011] a light-emitting element received in the first mounting groove and electrically connected to the first electrode;

[0012] The photosensitive element is accommodated in the second mounting groove and electrically connected to the second electrode, and the groove wall is shielded between the light-emitting element and the photosensitive element.

[0013] In the embodiment provided in the present application, the light-emitting component is arranged in the first installation groove and the photosensitive component is arranged in the second installation groove, so that the light-emitting component and the photosensitive component are shielded by the groove wall, and the outgoing light emitted by the light-emitting component can be partially blocked by the circuit board, thereby avoiding the outgoing light emitted by the light-emitting component from directly entering the photosensitive component, improving the accuracy of the electrical signal generated by the photosensitive component, eliminating the step of additionally installing a light shield, and simplifying the assembly steps of the electronic device; the circuit board can protect the light-emitting component and the photosensitive component, and to a certain extent avoid or reduce external forces directly acting on the light-emitting component and the photosensitive component to damage the light-emitting component and the photosensitive component; by laying the charging coil on at least one layer among the multiple conductive layers, when assembling the electronic device, it is unnecessary to wind the charging coil on one side of the circuit board and weld the charging coil and the circuit board, thereby simplifying the assembly steps of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] FIG1 is a schematic diagram of a structure of an electronic device according to an embodiment of the present application;

[0015] FIG2 is a schematic diagram of a cross-sectional structure of an electronic device provided in one embodiment of the present application;

[0016] FIG3 is a second schematic cross-sectional structural diagram of an electronic device provided in one embodiment of the present application;

[0017] FIG4 is a third schematic diagram of a cross-sectional structure of an electronic device provided in one embodiment of the present application;

[0018] FIG5 is a fourth schematic cross-sectional structural diagram of an electronic device provided in one embodiment of the present application;

[0019] FIG6 is a second structural diagram of an electronic device provided by an embodiment of the present application. DETAILED DESCRIPTION

[0020] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0021] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0022] The electronic device provided in the embodiments of the present application is described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0023] As shown in Figures 1, 2 and 3, an embodiment of the present application provides an electronic device 100, which includes: a circuit board 1, a photosensitive element 3 and a light-emitting element 2, the circuit board 1 includes a dielectric layer 11 and a plurality of conductive layers 12 arranged at intervals, the dielectric layer 11 is insulated and spaced between adjacent conductive layers 12, a first electrode 121, a second electrode 122 and a charging coil 123 are arranged in the plurality of conductive layers 12, the circuit board 1 has a first mounting groove 13 exposing the first electrode 121 and a second mounting groove 14 exposing the second electrode 122, and a groove wall 17 spaced between the first mounting groove 13 and the second mounting groove 14; the light-emitting element 2 is accommodated in the first mounting groove 13 and electrically connected to the first electrode 121; the photosensitive element 3 is accommodated in the second mounting groove 14 and electrically connected to the second electrode 122, and the groove wall 17 is between the light-emitting element 2 and the photosensitive element 3.

[0024] Light emitted by the light-emitting element 2 can be emitted through the opening of the first mounting slot 13, and the light-sensing element 3 can receive reflected light from the emitted light through the opening of the second mounting slot 14. The light-sensing element 3 and the light-emitting element 2 in the electronic device 100 provided herein can be combined to form an optical distance sensor, a biometric information collector, an optical air detector, a photoelectric counter, and the like. If the electronic device 100 is a biometric information collector, the biometric information collector can be used to collect biometric information such as heart rate, respiratory rate, blood oxygen, and blood pressure.

[0025] The light-emitting element 2 can be an element that can convert an electrical signal into an optical signal, such as an LED lamp bead (light-emitting diode). The photosensitive element 3, as a photosensitive element, can convert the optical signal into an electrical signal. The emitted light of the light-emitting element 2 is physically reflected, and the reflected light is projected onto the photosensitive element 3, causing the resistance value of the photosensitive element 3 to change. Through this resistance change, a one-step analysis can be performed to obtain the required biological information, distance information, air information, etc. The electronic device 100 can be provided with only one light-emitting element 2 and one photosensitive element 3, or the electronic device 100 can be provided with multiple light-emitting elements 2 and multiple photosensitive elements 3. The light-emitting elements 2 and the photosensitive elements 3 can be provided in a one-to-one correspondence or a one-to-many arrangement.

[0026] Optionally, the light-emitting element 2 and the photosensitive element 3 cooperate to collect biometric information based on photoplethysmography (PPG). The light-emitting element 2 and the photosensitive element 3 are placed close to the skin. The light-emitting element 2 emits light waves of a specific wavelength toward the skin. The skin absorbs light waves of a specific wavelength at different rates under different conditions, so the photosensitive element 3 receives reflected light of varying intensities. The photosensitive element 3 converts the reflected light into an electrical signal. The resulting electrical signal can be used to calculate biometric information such as changes in blood flow rate, changes in skin melanin, changes in skin water content, and blood oxygen content.

[0027] The circuit board 1 includes a dielectric layer 11 and multiple conductive layers 12. The patterned conductive layers 12 can form a variety of conductive structures, including a first electrode 121 for connecting to the photosensitive element 3, a second electrode 122 for connecting to the light-emitting element 2, and a charging coil 123. The first electrode 121, the second electrode 122, and the charging coil 123 can be provided on the same conductive layer 12, that is, the same conductive material is patterned to obtain the first electrode 121, the second electrode 122, and the charging coil 123 at the same time. The first electrode 121, the second electrode 122, and the charging coil 123 can also be provided on different conductive layers 12, that is, different conductive materials are patterned to obtain the first electrode 121, the second electrode 122, and the charging coil 123 respectively on each conductive layer 12. The light-emitting component 2 and the photosensitive component 3 are arranged on one side of the circuit board 1, and the electrical connection end of the light-emitting component 2 and the electrical connection end of the photosensitive component 3 are electrically connected to the first electrode 121 and the second electrode 122 respectively, so that the light emission of the light-emitting component 2 can be controlled by the first electrode 121, and the electrical signal generated by the photosensitive component 3 can be transmitted through the second electrode 122.

[0028] The first and second mounting slots 13, 14 can be recessed portions formed from the surface of the circuit board 1. The unrecessed portion of the circuit board 1 separating the first and second mounting slots 13, 14 forms a slot wall 17. Two opposing walls of the slot wall 17 define the first and second mounting slots 13, 14, respectively. The first mounting slot 13 exposes a first electrode 121 to facilitate connection between the light-emitting element 2 housed therein and the first electrode 121. The second mounting slot 14 exposes a second electrode 122 to facilitate connection between the photosensitive element 3 housed therein and the second electrode 122. With the light-emitting element 2 and the photosensitive element 3 housed within the first and second mounting slots 13, 14, respectively, and the slot wall 17 positioned between them, the circuit board 1 can replace a light shield, shielding or reducing the amount of emitted light directly incident on the photosensitive element 3 to a certain extent. This eliminates the need for a separate light shield on the circuit board 1 and simplifies the assembly steps of the electronic device 100. Since the light-emitting component 2 and the photosensitive component 3 are respectively accommodated in the first mounting groove 13 and the second mounting groove 14, the circuit board 1 can protect the light-emitting component 2 and the photosensitive component 3, and to a certain extent avoid or reduce external forces directly acting on the light-emitting component 2 and the photosensitive component 3 to damage the light-emitting component 2 and the photosensitive component 3.

[0029] A single conductive layer 12 in the circuit board 1 is patterned to form a wound charging coil 123, or multiple conductive layers 12 are patterned to form multiple wound charging coils 123. The charging coil 123 is used to charge the electronic device. The charging coil 123 can be electrically connected to an external charging device through electromagnetic coupling, thereby receiving electrical energy from the external charging device through electromagnetic induction. The electronic device 100 may be provided with a battery to store electrical energy received from the external charging device. The charging coil 123 being used to charge the electronic device 100 can be understood as the external charging device charging the battery in the electronic device 100 via the charging coil 123. It is understood that the external charging device may also include a charging coil. The charging coil in the external charging device can be used to radiate electrical energy. When the charging coil 123 in the electronic device 100 is sufficiently close to the charging coil in the external charging device, the charging coil 123 in the electronic device 100 can establish electromagnetic coupling with the charging coil in the external charging device, allowing the charging coil 123 in the electronic device 100 to receive electrical energy from the external charging device through electromagnetic induction.

[0030] When the conductive layer 12 is a single layer, the light-emitting element 2 and the photosensitive element 3 are arranged on the first side of the circuit board 1. The light waves emitted by the light-emitting element 2 are emitted from the first side, and the photosensitive element 3 receives the light waves incident from the first side. The first component 4 of the electronic device 100, excluding the light-emitting element 2 and the photosensitive element 3, can be arranged on the second side of the circuit board 1, thereby avoiding or reducing, to a certain extent, interference between the light-emitting element 2, the photosensitive element 3, and the first component 4. The first side and the second side can be arranged along the first direction X, and the dielectric layer 11 and the conductive layer 12 can also be arranged along the first direction X. Optionally, the first component 4 is a wireless charging management chip that controls the charging of the charging coil 123, or a data processing chip that processes the electrical signals generated by the photosensitive element 3.

[0031] When the conductive layer 12 is multi-layered, the dielectric layer 11 is spaced between adjacent conductive layers 12 to avoid unwanted electrical connectivity between adjacent conductive layers 12. In the multi-layered conductive layer 12, the first conductive layer 12 is patterned to form a first electrode 121, and the photosensitive element 3 is connected to the first electrode 121; in the multi-layered conductive layer 12, the second conductive layer 12 is patterned to form a second electrode 122, and the light-emitting element 2 is connected to the second electrode 122; in the multi-layered conductive layer 12, the third conductive layer 12 is patterned to form a conductive circuit, which is used to connect to the first component 4 in the electronic device 100 other than the light-emitting element 2 and the photosensitive element 3. The first conductive layer 12 and the second conductive layer 12 can be the same conductive layer 12 or different conductive layers 12, and the first conductive layer 12 and the second conductive layer 12 are respectively located on the side of the third conductive layer 12 facing away from the first component 4.

[0032] In the embodiment provided in the present application, the light-emitting component 2 is arranged in the first mounting groove 13 and the photosensitive component 3 is arranged in the second mounting groove 14, so that the light-emitting component 2 and the photosensitive component 3 are shielded by the groove wall 17, and the outgoing light emitted by the light-emitting component 2 can be partially blocked by the circuit board 1, thereby preventing the outgoing light emitted by the light-emitting component 2 from directly entering the photosensitive component 3, improving the accuracy of the electrical signal generated by the photosensitive component 3, eliminating the step of additionally installing a light shield, and simplifying the assembly steps of the electronic device 100; the circuit board 1 can protect the light-emitting component 2 and the photosensitive component 3, to a certain extent avoiding or reducing external forces directly acting on the light-emitting component 2 and the photosensitive component 3 to damage the light-emitting component 2 and the photosensitive component 3; by laying the charging coil 123 on at least one layer of the multiple conductive layers 12, when assembling the electronic device 100, it is unnecessary to wind the charging coil 123 on one side of the circuit board 1 and weld the charging coil 123 and the circuit board 1, thereby simplifying the assembly steps of the electronic device 100.

[0033] In some embodiments, the charging coil 123 is disposed around the first mounting slot 13 and the second mounting slot 14 .

[0034] The charging coil 123 surrounds the first and second mounting slots 13 and 14, giving it a larger diameter. Given a constant external magnetic field, a larger diameter allows for greater magnetic flux through the charging coil 123, which in turn increases the charging power of the charging coil 123.

[0035] The charging coil 123 in a conductive layer 12 can be arranged spirally around the first mounting slot 13 and the second mounting slot 14 in a plane as needed to increase the number of turns of the charging coil 123 in that conductive layer 12. If charging coils 123 are provided on multiple conductive layers 12, the multiple charging coils 123 can be arranged sequentially along a first direction X. The first direction X can be the thickness direction of the circuit board 1. The charging coil 123 spirally surrounds a plane, which can be perpendicular to the first direction X.

[0036] The first mounting groove 13 and the second mounting groove 14 can be spaced apart along the second direction Y. Conductive structures can be distributed in the dielectric layer 11 between the first mounting groove 13 and the second mounting groove 14 as needed to increase the density of circuit distribution in the circuit board 1 .

[0037] In some embodiments, the circuit board 1 also includes a first shielding layer 15 and a second shielding layer 16. The first shielding layer 15 is arranged along the wall of the first mounting groove 13 and surrounds the light-emitting component 2. The first shielding layer 15 separates the light-emitting component 2 and the charging coil 123. The second shielding layer 16 is arranged along the wall of the second mounting groove 14 and surrounds the photosensitive component 3. The second shielding layer 16 separates the photosensitive component 3 and the charging coil 123.

[0038] Both first shielding layer 15 and second shielding layer 16 can be made of metal. When charging coil 123 is used to charge electronic device 100, first shielding layer 15 and second shielding layer 16 can reduce or prevent the magnetic field generated by the external charging device and the electric field generated by charging coil 123 from affecting the operation of light-emitting element 2 and light-sensitive element 3.

[0039] Optionally, the first shielding layer 15 and the second shielding layer 16 may be formed on the wall surface of the first installation groove 13 and the wall surface of the second installation groove 14 respectively by copper electroplating technology.

[0040] To ensure the normal operation of the electrodes, the electrodes are spaced apart from the shielding layer. Since the first shielding layer 15 covers the side walls of the first mounting groove 13 defined by the circuit board 1, and the second shielding layer 16 covers the side walls of the second mounting groove 14 defined by the circuit board 1, the first electrode 121 can be set on the bottom wall of the first mounting groove 13 defined by the circuit board 1, and the second electrode 122 can be set on the bottom wall of the second mounting groove 14 defined by the circuit board 1. One first mounting groove 13 can expose multiple first electrodes 121, and the multiple first electrodes 121 can be electrically connected to the same light-emitting component 2, or they can be electrically connected to different light-emitting components 2 respectively. One second mounting groove 14 can expose multiple second electrodes 122, and the multiple second electrodes 122 can be electrically connected to the same photosensitive component 3, or they can be electrically connected to different photosensitive components 3 respectively. In the embodiment shown in Figure 4, one first mounting groove 13 exposes two first electrodes 121, and the positive and negative poles of the same light-emitting component 2 are electrically connected to the two first electrodes 121 respectively. One second mounting groove 14 exposes two second electrodes 122 , and the positive electrode and the negative electrode of the same photosensitive element 3 are electrically connected to the two second electrodes 122 respectively.

[0041] Referring to FIG. 5 , in some embodiments, the circuit board 1 includes a plurality of dielectric layers 11 stacked sequentially along a first direction X, the first mounting slot 13 penetrates at least one dielectric layer 11 , and the second mounting slot 14 penetrates at least one dielectric layer 11 .

[0042] The first mounting groove 13 and the second mounting groove 14 can respectively penetrate one dielectric layer 11, or respectively penetrate multiple dielectric layers 11. The number of dielectric layers 11 penetrated by the first mounting groove 13 and the number of dielectric layers 11 penetrated by the second mounting groove 14 can be determined based on the thickness of the dielectric layer 11, the length of the light-emitting component 2 along the first direction X, the length of the photosensitive component 3 along the first direction X, etc.

[0043] The depths of the first mounting groove 13 and the second mounting groove 14 along the first direction X can be different, that is, the number of dielectric layers 11 penetrated by the first mounting groove 13 and the second mounting groove 14 can be different. Since the sizes of the light-emitting element 2 and the photosensitive element 3 are different, the sizes of the first mounting groove 13 adapted to the light-emitting element 2 and the second mounting groove 14 adapted to the photosensitive element 3 can also be different. Therefore, the depths of the first mounting groove 13 and the second mounting groove 14 can be adjusted according to the sizes of the light-emitting element 2 and the photosensitive element 3, so that the light-emitting element 2 is accommodated in the first mounting groove 13 and the distance from the light-emitting element 2 to the opening of the first mounting groove 13 meets the requirements, and the photosensitive element 3 is accommodated in the second mounting groove 14 and the distance from the photosensitive element 3 to the opening of the second mounting groove 14 meets the requirements.

[0044] In some embodiments, the plurality of dielectric layers 11 include at least one first dielectric layer 111 and at least one second dielectric layer 112 . The first dielectric layer 111 and the second dielectric layer 112 are stacked along a first direction X. At least one of the first mounting groove 13 or the second mounting groove 14 penetrates the first dielectric layer 111 and exposes the second dielectric layer 112 .

[0045] When the second dielectric layer 112 is exposed in the first mounting groove 13, the exposed second dielectric layer 112 supports the light-emitting element 2. When the second dielectric layer 112 is exposed in the second mounting groove 14, the exposed second dielectric layer 112 supports the photosensitive element 3. The first dielectric layer 111 and the second dielectric layer 112 can be made of the same material, except that the second dielectric layer 112 does not penetrate at least a portion of the first mounting groove 13 or at least a portion of the second mounting groove 14. When providing the first mounting groove 13 or the second mounting groove 14, the already prepared first dielectric layer 111 can be opened until the second dielectric layer 112 is exposed.

[0046] In some embodiments, the first electrode 121 is embedded in the second dielectric layer 112 exposed from the first mounting groove 13 , or the second electrode 122 is embedded in the second dielectric layer 112 exposed from the second mounting groove 14 .

[0047] When the first mounting groove 13 exposes the second dielectric layer 112, the exposed second dielectric layer 112 supports the light-emitting element 2, and the first electrode 121 is embedded in the exposed second dielectric layer 112. The exposed surface of the first electrode 121 and the exposed surface of the second dielectric layer 112 can be in the same reference plane. When the second mounting groove 14 exposes the second dielectric layer 112, the exposed second dielectric layer 112 supports the photosensitive element 3, and the second electrode 122 is embedded in the exposed second dielectric layer 112. The exposed surface of the second electrode 122 and the exposed surface of the second dielectric layer 112 can be in the same reference plane.

[0048] In the conductive layer 12 having any one of the first electrode 121, the second electrode 122 and the charging coil 123, other conductive structures may be arranged as needed, such as: conductive lines connecting the electrodes, capacitors, etc. The first electrode 121, the second electrode 122, the charging coil 123 and the other conductive structures may be obtained by patterning the same layer of conductive material. When preparing the circuit board 1, a dielectric layer, a patterned conductive layer 12, a dielectric layer 11, a patterned conductive layer 12, etc. may be prepared in sequence. When setting the first mounting groove 13 or the second mounting groove 14, the prepared first dielectric layer 111 may be opened until the second dielectric layer 112 and the electrode embedded in the second dielectric layer 112 are exposed, thereby obtaining a first mounting groove 13 exposing the first electrode 121 or a second mounting groove 14 exposing the second electrode 122.

[0049] In some embodiments, there are multiple charging coils 123 , which are spaced apart along the first direction X. The dielectric layer 11 has through holes, and adjacent charging coils 123 are connected in series via the through holes.

[0050] Those skilled in the art will appreciate that, since the charging coils 123 are used to charge the electronic device 100, circuit design is employed to ensure that the current flows in each layer of the charging coils 123 in the same direction when the charging coils 123 are arranged. Multiple charging coils 123 are connected in series via through-holes to increase the number of turns of the distributed charging coils 123 on the circuit board 1.

[0051] In some embodiments, the electronic device 100 includes:

[0052] A plurality of first components 4 are arranged on a side of the circuit board 1 away from the photosensitive element 3 , and the first components 4 are electrically connected to at least one conductive layer 12 .

[0053] Optionally, the conductive layer 12 located away from the photosensitive element 3 among the multiple layers of conductive layers 12 arranged at intervals is electrically connected to the first component 4. By providing multiple conductive layers 12, the photosensitive element 3, the light-emitting element 2, and the first component 4 can all be attached to the same circuit board 1, thereby eliminating the step of soldering multiple circuit boards 1 and facilitating a reduction in the size of the electronic device 100.

[0054] Referring to Figure 6 , the number of light-emitting elements 2 and photosensitive elements 3 can be set to multiple as needed. In some embodiments, there are multiple first mounting slots 13 and multiple light-emitting elements 2, and the multiple light-emitting elements 2 form a light-emitting group, and the multiple light-emitting groups are arranged in a one-to-one correspondence within the multiple first mounting slots 13. In another mounting slot, there are multiple second mounting slots 14 and multiple photosensitive elements 3, and the multiple photosensitive elements 3 are arranged in a one-to-one correspondence within the multiple second mounting slots 14.

[0055] By setting up multiple light-emitting elements 2, different light-emitting elements 2 can be controlled to emit light of different colors. By setting up multiple photosensitive elements 3, different photosensitive elements 3 can receive reflected light of different colors. The electronic device 100 can analyze the electrical signals generated by different photosensitive elements 3 receiving reflected light of different colors to obtain more information.

[0056] Optionally, a light-emitting group includes a red light-emitting element 2R for emitting red light, a green light-emitting element 2G for emitting green light, and a blue light-emitting element 2B for emitting blue light. In the embodiment shown in FIG6 , there are twelve light-emitting elements 2 and four photosensitive elements 3. The red light-emitting elements 2R, the green light-emitting elements 2G, and the blue light-emitting elements 2B form a group and are placed in the same first mounting groove 13. The twelve light-emitting elements 2 form four light-emitting groups and are placed in four first mounting grooves 13. The four photosensitive elements 3 are placed in four second mounting grooves 14, respectively. The first mounting grooves 13 and the second mounting grooves 14 are arranged in a circular pattern with intervals therebetween.

[0057] When preparing the electronic device 100 provided in this application, the circuit board 1 can be prepared first, and then the light-emitting element 2 and the photosensitive element 3 can be respectively assembled into the first mounting groove 13 and the second mounting groove 14, and the light-emitting element 2 and the first electrode 121 are bonded together, and the photosensitive element 3 and the second electrode 122 are bonded together. The circuit board 1 is flipped over, and one or more first components 4 are bonded to the surface of the circuit board 1 facing away from the light-emitting element 2 and the photosensitive element 3.

[0058] When preparing the circuit board 1, a dielectric layer 11 can be provided first, a conductive material is arranged on the dielectric layer 11, and the conductive material is patterned to form the desired conductive layer 12. In the case where the circuit board 1 has multiple dielectric layers, a dielectric material is arranged on the prepared conductive layer 12 to form another dielectric layer, and the dielectric layer covers the conductive layer 12. Then, a conductive material is arranged on the newly prepared dielectric layer 11, and the conductive material is patterned to form another desired conductive layer 12, and so on, until the desired number of dielectric layers 11 and conductive layers 12 are completed. The circuit board 1 is grooved by controlled depth milling, laser, etc. to form a first mounting groove 13 exposing the first electrode 121, and a second mounting groove 14 exposing the second electrode 122. The grooved circuit board 1 is subjected to copper plating to form a shielding layer attached to the first mounting groove 13 and the second mounting groove 14.

[0059] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. An electronic device, comprising: A circuit board, comprising a dielectric layer and a plurality of conductive layers arranged at intervals, wherein the dielectric layer is insulated and spaced between adjacent conductive layers, a first electrode, a second electrode and a charging coil are arranged in the plurality of conductive layers, and the circuit board has a first mounting groove exposing the first electrode, a second mounting groove exposing the second electrode, and a groove wall spaced between the first mounting groove and the second mounting groove; a light emitting element, received in the first mounting groove and electrically connected to the first electrode; The photosensitive member is received in the second mounting groove and electrically connected to the second electrode, and the groove wall is shielded between the light-emitting member and the photosensitive member.

2. The electronic device according to claim 1, wherein: The charging coil is disposed around the first mounting groove and the second mounting groove.

3. The electronic device according to claim 2, wherein: The circuit board also includes a first shielding layer and a second shielding layer, the first shielding layer is arranged along the wall of the first mounting groove and surrounds the light-emitting component, the first shielding layer separates the light-emitting component and the charging coil, the second shielding layer is arranged along the wall of the second mounting groove and surrounds the photosensitive component, the second shielding layer separates the photosensitive component and the charging coil.

4. The electronic device according to claim 1, wherein: The circuit board includes a plurality of dielectric layers stacked in sequence along a first direction, the first mounting groove penetrates at least one of the dielectric layers, and the second mounting groove penetrates at least one of the dielectric layers.

5. The electronic device according to claim 4, wherein: The plurality of dielectric layers include at least one first dielectric layer and at least one second dielectric layer, and at least one of the first mounting groove or the second mounting groove penetrates through the first dielectric layer and exposes the second dielectric layer.

6. The electronic device according to claim 5, wherein: The first electrode is embedded in the second dielectric layer exposed from the first mounting groove, or the second electrode is embedded in the second dielectric layer exposed from the second mounting groove.

7. The electronic device according to claim 1, wherein: There are multiple charging coils, which are spaced apart along a first direction. The dielectric layer has through holes, and adjacent charging coils are connected in series via the through holes.

8. The electronic device according to claim 1, wherein: The electronic device comprises: A plurality of first components are arranged on a side of the circuit board away from the photosensitive element, and the first components are electrically connected to at least one layer of the conductive layer.

9. The electronic device according to claim 1, wherein: There are multiple first mounting grooves, and there are multiple light-emitting components. The multiple light-emitting components form a light-emitting group, and the multiple light-emitting groups are arranged in the multiple first mounting grooves in a one-to-one correspondence.

10. The electronic device according to claim 1, wherein: There are multiple second installation grooves, and there are multiple photosensitive members. The multiple photosensitive members are arranged in the multiple second installation grooves in a one-to-one correspondence.

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