Electronic device and operating method therefor

Abstract

An electronic device according to an embodiment may be, when instructions are individually or collectively executed by a processor, caused to: transmit one or more sector sweep frames for beamforming to an external electronic device performing a multi-link operation with the electronic device, through a first frequency band corresponding to a millimeter wave wireless communication channel; receive, from the external electronic device, feedback information on the one or more sector sweep frames through a second frequency band different from the first frequency band; transmit a data frame to the external electronic device through the first frequency band on the basis of the feedback information; and receive the data frame from the external electronic device through the second frequency band.

Description

Electronic device and method of operation thereof

[0001] Embodiments of the present invention relate to an electronic device and a method of operating the same.

[0002] With the advent of electronic devices such as smartphones, tablet PCs, and laptops, the demand for high-speed wireless connectivity has exploded. Fueled by this trend and the growing demand for high-speed wireless connectivity, the IEEE 802.11 wireless communication standard has firmly established itself as a representative and universal high-speed wireless communication standard in the IT (information technology) industry. Early wireless LAN technology, developed around 1997, could support transmission speeds of up to 1-2 Mbps. Since then, driven by the demand for faster wireless connections, wireless LAN technology has steadily evolved, leading to the development of new wireless LAN technologies that improve transmission speeds, such as IEEE 802.11n, 802.11ac, and 802.11ax. The latest standard, IEEE 802.11ax, currently supports peak transmission speeds of several Gbps.

[0003] Today, wireless LANs provide high-speed wireless connectivity to users in various public spaces, including offices, airports, stadiums, and stations, in addition to private spaces like homes. Consequently, wireless LANs have had a significant impact on people's lifestyles and culture, and wireless LANs have become an integral part of modern life.

[0004] An electronic device according to one embodiment may include a wireless communication circuit configured to transmit and receive wireless signals. The electronic device may include a processor operatively connected to the wireless communication circuit. The electronic device may include a memory storing instructions. The instructions, when individually or collectively executed by the processor, may cause the electronic device to transmit one or more sector sweep frames for beamforming to an external electronic device performing a multi-link operation with the electronic device over a first frequency band corresponding to a millimeter wave wireless communication channel. The instructions, when individually or collectively executed by the processor, may cause the electronic device to receive feedback information for the one or more sector sweep frames from the external electronic device over a second frequency band different from the first frequency band. The instructions, when individually or collectively executed by the processor, may cause the electronic device to transmit a data frame to the external electronic device via the first frequency band based on the feedback information. The instructions, when individually or collectively executed by the processor, may cause the electronic device to receive a data frame from the external electronic device via the second frequency band.

[0005] According to one embodiment, a method of operating an electronic device may include an operation of transmitting one or more sector weep frames for beamforming to an external electronic device performing a multi-link operation with the electronic device through a first frequency band corresponding to a millimeter wave wireless communication channel. The method of operating the electronic device may include an operation of receiving feedback information for the one or more sector weep frames from the external electronic device through a second frequency band different from the first frequency band. The method of operating the electronic device may include an operation of transmitting a data frame to the external electronic device through the first frequency band based on the feedback information. The method of operating the electronic device may include an operation of receiving a data frame from the external electronic device through the second frequency band.

[0006] An electronic device according to one embodiment may include a wireless communication circuit configured to transmit and receive a wireless signal. The electronic device may include a processor operatively connected to the wireless communication circuit. The electronic device may include a memory storing instructions. The instructions, when individually or collectively executed by the processor, may cause the electronic device to receive, from an external electronic device performing a multi-link operation with the electronic device, one or more sector sweep frames for beamforming over a first frequency band corresponding to a millimeter wave wireless communication channel. The instructions, when individually or collectively executed by the processor, may cause the electronic device to transmit, to the external electronic device, feedback information regarding the one or more sector sweep frames over a second frequency band different from the first frequency band. The above feedback information may be included in the A-control (aggregated control) subfield of the MAC (medium access control) header of the frame transmitted by the electronic device.

[0007] According to one embodiment, a method of operating an electronic device may include receiving, from an external electronic device performing a multi-link operation with the electronic device, one or more sector sweep frames for beamforming through a first frequency band corresponding to a millimeter wave wireless communication channel. The method of operating the electronic device may include transmitting, to the external electronic device, feedback information regarding the one or more sector sweep frames through a second frequency band different from the first frequency band. The feedback information may be included in an A-control (aggregated control) subfield of a MAC (medium access control) header of a frame transmitted by the electronic device.

[0008] An electronic device according to one embodiment may include a wireless communication circuit configured to transmit and receive a wireless signal. The electronic device may include a processor operatively connected to the wireless communication circuit. The electronic device may include one or more memories storing instructions. The instructions, when individually or collectively executed by the processor, may cause the electronic device to transmit one or more sector sweep frames for beamforming to an external electronic device performing a multi-link operation with the electronic device over a first frequency band corresponding to a millimeter wave wireless communication channel. The instructions, when individually or collectively executed by the processor, may cause the electronic device to receive feedback information for the one or more sector sweep frames from the external electronic device over a second frequency band different from the first frequency band. The MAC header of the one or more sector sweep frames may include information indicating that feedback for the one or more sector sweep frames is to be transmitted via the second frequency band.

[0009] According to one embodiment, a method of operating an electronic device may include an operation of transmitting one or more sector sweep frames for beamforming to an external electronic device performing a multi-link operation with the electronic device through a first frequency band corresponding to a millimeter wave wireless communication channel. The method of operating the electronic device may include an operation of receiving feedback information for the one or more sector sweep frames from the external electronic device through a second frequency band different from the first frequency band. A MAC header of the one or more sector sweep frames may include information indicating that feedback for the one or more sector sweep frames is to be transmitted through the second frequency band.

[0010] FIG. 1 and FIG. 2 are drawings for explaining a wireless LAN system according to one embodiment.

[0011] FIG. 3 is a diagram for explaining a link setup operation according to one embodiment.

[0012] FIG. 4 is a diagram for explaining a multi-link device (MLD) according to one embodiment.

[0013] FIG. 5 is a diagram for explaining MLO (multi-link operation) according to one embodiment.

[0014] Figure 6 is a diagram for explaining sector sweep of beamforming training.

[0015] Figure 7 is a diagram for explaining the asymmetry between beamforming capabilities.

[0016] Figure 8 is a diagram to explain the asymmetry between sector sweep coverages.

[0017] FIG. 9 is a diagram illustrating a method of utilizing a millimeter wave frequency band based on MLO according to one embodiment.

[0018] Figure 10 illustrates a schematic block diagram of an AP MLD according to one embodiment.

[0019] Figure 11 shows a schematic block diagram of a non-AP MLD according to one embodiment.

[0020] FIG. 12 is a diagram illustrating a sector sweep based on MLO according to one embodiment.

[0021] FIG. 13 is a diagram illustrating an operation of directionally-selectively utilizing a millimeter wave link according to one embodiment.

[0022] FIG. 14 is a diagram for explaining a sector sweep based on MLO according to one embodiment.

[0023] FIG. 15 is a diagram for explaining an A-control (aggregated control) subfield of a MAC (medium access control) header according to one embodiment.

[0024] FIG. 16 and FIG. 17 are flowcharts of a method of operating an electronic device according to one embodiment.

[0025] FIG. 18 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0026] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same reference numerals regardless of the drawing numbers, and redundant descriptions thereof will be omitted.

[0027]

[0028] FIG. 1 and FIG. 2 are diagrams for explaining a wireless LAN system according to one embodiment.

[0029] Referring to FIG. 1, according to one embodiment, a wireless LAN system (10) may represent an infrastructure mode in which an access point (AP) exists in the structure of a wireless LAN (WLAN) of the Institute of Electrical and Electronic Engineers (IEEE) 802.11. The wireless LAN system (10) may include one or more basic service sets (BSS) (e.g., BSS1, BSS2). The BSS (BSS1, BSS2) may mean a set of access points (APs) (e.g., electronic devices (1802, 1804) of FIG. 18) and stations (STAs) (e.g., electronic devices (101) of FIG. 18) that are capable of communicating with each other by being synchronized. BSS1 may include AP1 and STA1, and BSS2 may include AP2, STA2, and STA3.

[0030] According to one embodiment, a wireless LAN system (10) may include at least one STA (STA1 to STA3), a plurality of APs (AP1, AP2) providing a distribution service, and a distribution system (100) connecting the plurality of APs (AP1, AP2). The distribution system (100) may connect a plurality of BSSs (BSS1, BSS2) to implement an extended service set (ESS). The ESS may be used as a term indicating a network formed by connecting a plurality of APs (AP1, AP2) through the distribution system (100). A plurality of APs (AP1, AP2) included in a single ESS may have the same SSID (service set identification).

[0031] According to one embodiment, STAs (STA1 to STA3) may be any functional medium including medium access control (MAC) and a physical layer interface for a wireless medium according to the Institute of Electrical and Electronics Engineers (IEEE) 802.11 standard. STAs (STA1 to STA3) may be used to mean both APs and non-AP STAs. STAs (STA1 to STA3) may also be referred to by various names, such as electronic devices, mobile terminals, wireless devices, wireless transmit / receive units (WTRUs), user equipment (UEs), mobile stations (MSs), mobile subscriber units, or simply users.

[0032] Referring to FIG. 2, according to one embodiment, unlike the wireless LAN system (10) of FIG. 1, the wireless LAN system (20) may represent an ad-hoc mode in which communication is performed by establishing a network between a plurality of STAs (STA1 to STA3) without an AP in the structure of a wireless LAN (WLAN) of the Institute of Electrical and Electronic Engineers (IEEE) 802.11. The wireless LAN system (20) may include a BSS operating in an ad-hoc mode, i.e., an independent basic service set (IBSS).

[0033] In one embodiment, an IBSS may not have a centralized management entity because it does not include APs. In an IBSS, STAs may be managed in a distributed manner. In an IBSS, all STAs may be mobile, and access to distributed systems is not permitted, creating a self-contained network.

[0034]

[0035] FIG. 3 is a diagram illustrating an example of a link setup operation according to one embodiment.

[0036] Referring to FIG. 3, according to one embodiment, a link setup operation may be performed between devices (e.g., STA (301), AP (401)) to communicate with each other. For link setup, a network may be discovered, authentication may be performed, an association may be established, and a security configuration operation may be performed. The link setup operation may be referred to as a session initiation operation or a session setup operation. In addition, the link setup operation's discovery, authentication, association, and security configuration operations may be collectively referred to as an association operation.

[0037] According to one embodiment, the network discovery operation may include operations 310 and 320. In operation 310, the STA (301) (e.g., the electronic device (1801) of FIG. 18) may transmit a probe request frame to discover whether any AP (e.g., the electronic device (1802) or the electronic device (1804) of FIG. 18) exists, and may wait for a response to the probe request frame. The STA (301) may perform a scanning operation to access a network to find a network to which it can join. The probe request frame may include information of the STA (301) (e.g., the device name and / or address of the STA (301)). The scanning operation in operation 310 may mean an active scanning operation. In operation 320, the AP (401) may transmit a probe response frame to the STA (301) that transmitted the probe request frame in response to the probe request frame. The probe response frame may include information of the AP (401) (e.g., the device name and / or network information of the AP (401)). Although the network discovery operation in FIG. 3 is illustrated as being performed through active scanning, it is not necessarily limited thereto, and if the STA (301) performs passive scanning, the operation of transmitting the probe request frame may be omitted. The STA (301) performing passive scanning may receive the beacon frame transmitted by the AP (401) and perform the following subsequent procedures.

[0038] According to one embodiment, after the STA (301) discovers a network, an authentication operation including operations 330 and 340 may be performed. In operation 330, the STA (301) may transmit an authentication request frame to the AP (401). In operation 340, the AP (401) may determine whether to allow authentication for the STA (301) based on information included in the authentication request frame. The AP (401) may provide the result of the authentication process to the STA (301) through an authentication response frame. The authentication frame used for the authentication request / response may correspond to a management frame.

[0039] According to one embodiment, the authentication frame may include information about an authentication algorithm number, an authentication transaction sequence number, a status code, a challenge text, a robust security network (RSN), or a finite cyclic group.

[0040] According to one embodiment, after STA (301) is successfully authenticated, an association operation including operations 350 and 360 may be performed. In operation 350, STA (301) may transmit an association request frame to AP (401). In operation 360, AP (401) may transmit an association response frame to STA (301) in response to the association request frame.

[0041] According to one embodiment, the association request frame and / or the association response frame may include information related to various capabilities. For example, the association request frame may include information related to various capabilities, a beacon listen interval, a service set identifier (SSID), supported rates, supported channels, an RSN, a mobility domain, supported operating classes, a traffic indication map broadcast request, and / or information about interworking service capabilities. For example, the association response frame may include information related to various capabilities, status codes, association ID (AID), supported rates, enhanced distributed channel access (EDCA) parameter sets, received channel power indicator (RCPI), received signal to noise indicator (RSNI), mobility domains, timeout interval (association comeback time), overlapping BSS scan parameters, TIM broadcast response, and / or QoS maps.

[0042] According to one embodiment, after STA (301) is successfully associated with the network, a security setup operation including operations 370 and 380 may be performed. The security setup operation may be performed via a robust security network association (RSNA) request / response. For example, the security setup operation may include an operation of setting up a private key via a four-way handshaking via an extensible authentication protocol over LAN (EAPOL) frame. The security setup operation may also be performed according to a security method not defined in the IEEE 802.11 standard.

[0043] According to one embodiment, a security session is established between STA (301) and AP (401) according to a security setup operation, and STA (301) and AP (401) can perform secure data communication.

[0044]

[0045] Figure 4 is a drawing for explaining MLD according to one embodiment.

[0046] Referring to FIG. 4, according to one embodiment, an access point multi-link device (AP MLD) (501) (e.g., electronic device 1802, electronic device 1804 of FIG. 18) and a non-AP MLD (601) (e.g., electronic device 1801 of FIG. 18) may perform multi-link operation (MLO) that communicates using multiple individual links (e.g., link 1, link 2, link 3). The AP MLD (501) may be a device including one or more APs (e.g., AP1, AP2, AP3). The AP MLD (501) may be a device connected to a logical link control (LLC) layer via one interface (e.g., MAC service access point (SAP)). One or more APs (e.g., AP1, AP2, AP3) included in the AP MLD (501) may share some functions in a medium access control (MAC) layer. APs within AP MLD (501) can operate on different links (e.g., AP1 operates via link 1, AP2 operates via link 2, AP3 operates via link 3). APs within AP MLD (501) (e.g., AP1, AP2, AP3) can each be responsible for a corresponding link and can function as independent APs.

[0047] According to one embodiment, a non-AP MLD (601) may be a device including one or more non-APs (e.g., STA1, STA2, STA3). The non-AP MLD (601) may be a device connected to a logical link control (LLC) layer via one interface (e.g., MAC service access point (SAP)). One or more non-APs (e.g., STA1, STA2, STA3) included in the non-AP MLD (501) may share some functions in the MAC layer. STAs within the non-AP MLD (601) may operate on different links (e.g., STA1 operates via link 1, STA2 operates via link 2, STA3 operates via link 3). STAs (e.g., STA1, STA2, STA3) within the non-AP MLD (601) may each be responsible for a corresponding link and may perform the role of an independent STA. Non-AP MLD may also be expressed as STA MLD.

[0048] According to one embodiment, when the AP MLD (501) includes multiple APs (e.g., AP1, AP2, AP3), each AP (e.g., AP1, AP2, AP3) may configure a separate link (e.g., link 1, link 2, link 3) and perform frame transmission and reception operations using multiple links with each STA (e.g., STA1, STA2, STA3) included in the non-AP MLD (601). The links may utilize specific channels (or bands). For example, each link may operate in the 2.4 GHz, 5 GHz, or 6 GHz bands.

[0049]

[0050] FIG. 5 is a diagram illustrating MLO according to one embodiment.

[0051] Referring to FIG. 4, according to one embodiment, a schematic diagram for communication (e.g., multi-link operation (MLO)) between an AP MLD (501) and a non-AP MLD (601) can be confirmed. The AP MLD (501) and / or the non-AP MLD (601) can transmit uplink data or downlink data through the multi-link operation. The AP MLD (501) can communicate with the non-AP MLD (601) through multiple links (e.g., link 1, link 2). STA 1 of the non-AP MLD (601) can communicate with AP 1 of the AP MLD (501) through link 1. STA 1 of the non-AP MLD (601) can receive data from AP 1 of the AP MLD (501) through link 1. Link 1 can be a downlink. STA 2 of the non-AP MLD (601) can communicate with AP 2 of the AP MLD (501) via link 2. STA 2 of the non-AP MLD (601) can transmit data to AP 2 of the AP MLD (501) via link 2. Link 2 may be an uplink.

[0052]

[0053] Figure 6 is a diagram for explaining sector sweep of beamforming training.

[0054] When electromagnetic waves are propagated through a wireless medium, signal attenuation inversely proportional to the square of the wavelength is involved. Therefore, signals in the high-frequency band with a small wavelength have a larger signal attenuation than general communication signals. In addition, signals in the high-frequency band have the characteristics that diffraction does not easily occur, the straightness becomes stronger, and the transmittance becomes smaller. In order to use signals in the high-frequency band (e.g., signals in the millimeter-wave band (e.g., 24 GHz)), it is necessary for the transmitting end and the receiving end to align the beam direction. In the IEEE (Institute of Electrical and Electronic Engineers) 802.11ad standard, a beam training protocol for obtaining the maximum beamforming gain by aligning the beam direction between the transmitting end and the receiving end is defined.

[0055] Referring to FIG. 6, an example of sector sweeping of beamforming for communication in the millimeter-wave band can be confirmed. The transmitter (602) can generate sector sweep frames (611). Each of the sector sweep frames (611) can be transmitted externally based on different beam "pinching". Different sector IDs can be assigned to each of the sector sweep frames (611). The Sector ID can correspond to the beam direction of the sector sweep frame. Each of the sector sweep frames (611) can be sequentially transmitted based on a countdown (CDOWN). Each of the sector sweep frames (611) can be transmitted through the millimeter-wave band.

[0056] The responder (603) can determine the sector sweep frame received with the strongest signal among the received sector sweep frames (611). The responder (603) can generate sector sweep frames (612) by including information about the sector sweep frame received with the strongest signal (e.g., Best sector = 25). Each of the sector sweep frames (612) can be transmitted outward based on different beams "***". Different sector IDs can be assigned to each of the sector sweep frames (612). The Sector ID can correspond to the beam direction of the sector sweep frame. Each of the sector sweep frames (612) can be transmitted sequentially based on a countdown (CDOWN). Each of the sector sweep frames (612) can be transmitted through the millimeter wave band.

[0057] The initiator (602) can determine the sector sweep frame received with the strongest signal among the received sector sweep frames (612). The initiator (602) can generate a sector sweep feedback (613) by including information about the sector sweep frame received with the strongest signal (e.g., Best sector = 1). The initiator (602) can transmit the sector sweep feedback (613) to the responder (603). The responder (603) can reply with a sector sweep ACK (614) to the initiator (602) in response to the reception of the sector sweep feedback (613).

[0058] The initiator (602) can perform beamforming (e.g., beam direction determination) after receiving at least one of the sector sweep frames (612) from the responder (603). The responder (603) can perform beamforming (e.g., beam direction determination) after receiving sector sweep feedback (613) from the initiator (602). That is, in order for the initiator (602) and the responder (603) to perform beamforming, they must normally receive at least one millimeter wave band signal (e.g., sector sweep frame) from the other party. However, whether the receiver can normally receive at least one millimeter wave band signal may depend on the capability of the transmitter. That is, the beamforming of the receiver may depend on how much the transmitter transmits the signal by subdividing the beam direction (e.g., sector). Forming a strong beam by subdividing the beam direction (e.g., sector) may be determined by the number of antennas available for beamforming.

[0059]

[0060] Figure 7 is a diagram for explaining asymmetry between beamforming capabilities, and Figure 8 is a diagram for explaining asymmetry between sector sweep coverages.

[0061] Referring to Figure 7, different antenna sectors can be identified depending on the device type. Depending on the device type, the expected reach and maximum throughput of the formed beam may also vary. APs and docking stations can include numerous antennas, significantly segmenting the beam direction (e.g., from 32 to 64 antennas) to form a powerful beam (e.g., a beam capable of reaching up to 20 m).

[0062] Mobile devices (e.g., handheld, wireless devices) can only include a limited number of antennas due to various regulations. They can only direct their beams in a limited number of directions (e.g., no more than four), and the expected range of the formed beams can also be small (e.g., up to 5 meters).

[0063] Referring to FIG. 8, depending on the asymmetry between beamforming capabilities, there may also be asymmetry in sector sweep coverage. The sector sweep coverage (e.g., the reachable range of a beam formed by the STA) (802) of an STA (e.g., a mobile device (e.g., a handheld, a wireless device)) may be smaller than the sector sweep coverage (e.g., the reachable range of a beam formed by the AP) (801) of an AP.

[0064] That is, in beamforming training for millimeter wave band communication between an AP and an STA, the sector sweep frame transmitted by the AP may be received by the STA, but the sector sweep frame transmitted by the STA may not be received by the AP. In other words, the poor sector sweep coverage (801) of the STA may become a bottleneck (e.g., an obstacle) in utilizing millimeter wave band signals.

[0065]

[0066] FIG. 9 is a diagram illustrating a method of utilizing a millimeter wave frequency band based on MLO according to one embodiment.

[0067] Referring to FIG. 9, according to one embodiment, a millimeter wave (mmWave) link (e.g., a frequency band of 24 GHz or higher) and a link utilized in multi-link operation (MLO) (e.g., a frequency band of 2.4 GHz, 5 GHz, or 6 GHz) may be used together. Since MLO has been described with reference to FIGS. 4 and 5, a redundant description will be omitted.

[0068] According to one embodiment, the AP MLD (901) (e.g., the AP (401) of FIG. 3, the AP MLD (401) of FIG. 4, or the electronic device (1804) of FIG. 18) and the non-AP MLD (1001) (e.g., the STA (301) of FIG. 3, the non-AP MLD (501) of FIG. 4, or the electronic device (1801) of FIG. 18) may be connected via a millimeter wave link and an MLO link. Through the MLO link, the AP MLD (901) and the non-AP MLD (1001) may transmit and receive data to each other. Through the millimeter wave link, the AP MLD (901) and the non-AP MLD (1001) may transmit and receive data to each other, but only the AP MLD (901) may be able to transmit data to the non-AP MLD (1001). AP MLD (901) and non-AP MLD (1001) can increase the usability of millimeter wave frequency bands through MLO links.

[0069]

[0070] Figure 10 illustrates a schematic block diagram of an AP MLD according to one embodiment.

[0071] According to one embodiment, the AP MLD (901) (e.g., the AP (401) of FIG. 3, the AP MLD (401) of FIG. 4, or the electronic device (1804) of FIG. 18) can perform multi-link operation (MLO)-based communication. The AP MLD (901) can perform millimeter wave communication. The AP MLD (901) can increase the usability of millimeter wave communication through the MLO link.

[0072] Referring to FIG. 10, according to one embodiment, the AP MLD (901) may include a wireless communication circuit (910), a processor (920), and a memory (930). The wireless communication circuit (910) may be configured to transmit and receive wireless signals. The wireless communication circuit (910) may be a Wi-Fi chipset. The wireless communication circuit (910) may support multiple bands of 2.4 GHz, 5 GHz, and / or 6 GHz. The wireless communication circuit (910) may also support a high-frequency band of 24 GHz or higher. The processor (920) may be operatively connected to the wireless communication circuit (910). The memory (930) may be electrically connected to the processor (920) and store one or more instructions executable by the processor (920). The AP MLD (901) may correspond to the electronic device described in FIG. 18 (e.g., the electronic device (1804) of FIG. 18). Therefore, any description overlapping with that described with reference to FIG. 18 will be omitted. The operations performed by the AP MLD (901) may include operations performed by the wireless communication circuit (910) and operations performed by the processor (920) via the wireless communication circuit (910).

[0073] According to one embodiment, the processor (920) may be implemented as a circuit (e.g., a processing circuit) such as a system on chip (SoC) or an integrated circuit (IC). The processor (920) may include one or more processors. For example, the processor (920) may include a combination of one or more processors such as a CPU, a GPU, an MPU, an AP, and a CP.

[0074] According to one embodiment, the memory (930) may include one or more memories. The instructions stored in the memory (930) may be stored in a single memory. The instructions stored in the memory (930) may be divided and stored in multiple memories. The instructions stored in the memory (930) may be individually or collectively executed by the processor (920) to cause the AP MLD (901) to perform a method according to one embodiment described herein.

[0075]

[0076] Figure 11 shows a schematic block diagram of a non-AP MLD according to one embodiment.

[0077] According to one embodiment, a non-AP MLD (1001) (e.g., STA (301) of FIG. 3, non-AP MLD (501) of FIG. 4, or electronic device (1801) of FIG. 18) can perform multi-link operation (MLO)-based communication. The non-AP MLD (1001) can perform millimeter wave communication. The non-AP MLD (1001) can increase the usability of millimeter wave communication through the MLO link.

[0078] Referring to FIG. 11, according to one embodiment, a non-AP MLD (1001) may include a wireless communication circuit (1010) (e.g., a wireless communication module (1892) of FIG. 18), a processor (1020) (e.g., a processor (1820) of FIG. 18), and a memory (1030) (e.g., a memory (1830) of FIG. 18). The wireless communication circuit (1010) may be configured to transmit and receive wireless signals. The wireless communication circuit (1010) may be a Wi-Fi chipset. The wireless communication circuit (1010) may support multiple bands of 2.4 GHz, 5 GHz, and / or 6 GHz. The wireless communication circuit (1010) may also support a high frequency band of 24 GHz or higher. The processor (1020) may be operatively connected to the wireless communication circuit (1010). The memory (1030) is electrically connected to the processor (1020) and can store one or more instructions executable by the processor (1020). The electronic device (1001) may correspond to the electronic device described in FIG. 18 (e.g., the electronic device (1801) of FIG. 18). Therefore, the description overlapping with the part to be described with reference to FIG. 18 is omitted. The operation performed by the electronic device (1001) may include an operation performed by a wireless communication circuit (e.g., the wireless communication circuit (1010) of FIG. 10 or the wireless communication module (1892) of FIG. 18) and an operation performed by a processor (e.g., the processor (1020) of FIG. 10 or the processor (1820) of FIG. 18) through the wireless communication circuit.

[0079] According to one embodiment, the processor (1020) may be implemented as a circuit (e.g., a processing circuit) such as a system on chip (SoC) or an integrated circuit (IC). The processor (920) may include one or more processors. For example, the processor (1020) may include a combination of one or more processors such as a CPU, a GPU, an MPU, an AP, and a CP.

[0080] According to one embodiment, the memory (1030) may include one or more memories. The instructions stored in the memory (1030) may be stored in a single memory. The instructions stored in the memory (1030) may be divided and stored in multiple memories. The instructions stored in the memory (1030) may be individually or collectively executed by the processor (920) to cause the non-AP MLD (1001) to perform a method according to one embodiment described herein.

[0081]

[0082] FIG. 12 is a diagram illustrating a sector sweep based on MLO according to one embodiment.

[0083] Referring to FIG. 12, according to one embodiment, it can be seen that multi-link operation (MLO) is utilized for sector sweep (e.g., a link in a 2.4 GHz, 5 GHz, or 6 GHz frequency band is utilized). An AP MLD (901) (e.g., an AP (401) of FIG. 3, an AP MLD (401) of FIG. 4, or an electronic device (1804) of FIG. 18) and a non-AP MLD (1001) (e.g., an STA (301) of FIG. 3, a non-AP MLD (501) of FIG. 4, or an electronic device (1801) of FIG. 18) may be connected via an MLO link.

[0084] According to one embodiment, the AP MLD (901) may transmit one or more sector sweep frames for beamforming to the non-AP MLD (1001) through a first frequency band (e.g., a millimeter wave band) corresponding to a millimeter wave wireless communication channel (e.g., a frequency band of 24 GHz or higher).

[0085] According to one embodiment, the non-AP MLD (1001) may determine a sector sweep frame received with the strongest signal among one or more sector sweep frames. The non-AP MLD (1001) may include information about the sector sweep frame received with the strongest signal (e.g., sector ID) in the sector sweep feedback. The information about the sector sweep frame received with the strongest signal (e.g., sector ID) may be included in an A-control (aggregated control) subfield of a medium access control (MAC) header of the sector sweep feedback. The non-AP MLD (1001) may determine a frequency band in which to transmit the sector sweep feedback. The MAC header of the sector sweep frame transmitted by the AP MLD (901) may include information indicating that the feedback is to be transmitted through a second frequency band (e.g., a second frequency band different from the first frequency band) (e.g., a 2.4 GHz, 5 GHz, or 6 GHz frequency band).

[0086] According to one embodiment, the non-AP MLD (1001) may transmit sector sweep feedback to the AP MLD (901) via an MLO link (e.g., a second frequency band different from the first frequency band) (e.g., a 2.4 GHz, 5 GHz, or 6 GHz frequency band).

[0087] According to one embodiment, the AP MLD (901) can receive sector sweep feedback from a non-AP MLD (1001). The AP MLD (901) can determine a beam direction (e.g., perform beamforming) based on feedback information included in the sector sweep feedback (e.g., the sector ID of the sector sweep frame received with the strongest signal).

[0088]

[0089] FIG. 13 is a diagram illustrating an operation of directionally-selectively utilizing a millimeter wave link according to one embodiment.

[0090] Referring to FIG. 13, according to one embodiment, an AP MLD (901) (e.g., the AP (401) of FIG. 3, the AP MLD (401) of FIG. 4, or the electronic device (1804) of FIG. 18) that has received sector sweep feedback may be connected to a non-AP MLD (1001) (e.g., the STA (301) of FIG. 3, the non-AP MLD (501) of FIG. 4, or the electronic device (1801) of FIG. 18) via a millimeter wave link.

[0091] According to one embodiment, the AP MLD (901) may transmit a data frame (e.g., downlink data) to the non-AP MLD (1001) over a first frequency band (e.g., a frequency band of a millimeter wave link) (e.g., a frequency band of 24 GHz or higher).

[0092] According to one embodiment, the non-AP MLD (1001) can transmit data frames (e.g., uplink data) to the AP MLD (901) via a second frequency band (e.g., a frequency band of a multi-link operation (MLO) link) (e.g., a 2.4 GHz, 5 GHz, or 6 GHz frequency band). That is, the millimeter wave link can be used directionally selectively. The non-AP MLD (1001) can also reply an acknowledgment (e.g., an ACK) for the downlink data via the second frequency band. If the downlink data includes information indicating to feed back via the second frequency band, the non-AP MLD (1001) may utilize the second frequency band.

[0093] According to one embodiment, the non-AP MLD (1001) can also perform sector sweeps over the first frequency band, as described in FIG. 14 below.

[0094]

[0095] FIG. 14 is a diagram for explaining a sector sweep based on MLO according to one embodiment.

[0096] Referring to FIG. 14, according to one embodiment, a non-AP MLD (1001) (e.g., STA (301) of FIG. 3, non-AP MLD (501) of FIG. 4, or electronic device (1801) of FIG. 18) may also perform a sector sweep.

[0097] According to one embodiment, the AP MLD (901) (e.g., the AP (401) of FIG. 3, the AP MLD (401) of FIG. 4, or the electronic device (1804) of FIG. 18) may generate sector sweep frames (1401). Each of the sector sweep frames (1401) may be transmitted externally based on a different beam direction. Each of the sector sweep frames (1401) may be assigned a different sector ID. The Sector ID may correspond to the beam direction of the sector sweep frame. Each of the sector sweep frames (1401) may be transmitted over a first frequency band (e.g., a frequency band of a millimeter wave link) (e.g., a frequency band of 24 GHz or higher).

[0098] According to one embodiment, the non-AP MLD (1001) can determine the sector sweep frame received with the strongest signal among the received sector sweep frames (1401). The non-AP MLD (1001) can generate sector sweep feedback (1402) including information (e.g., sector ID) about the sector sweep frame received with the strongest signal. The non-AP MLD (1001) can transmit the sector sweep feedback (1402) to the AP MLD (901) via a second frequency band (e.g., a frequency band of an MLO link) (e.g., a 2.4 GHz, 5 GHz, or 6 GHz frequency band).

[0099] According to one embodiment, after the non-AP MLD (1001) transmits the sector sweep feedback over a second frequency band (e.g., a frequency band of an MLO link) (e.g., a 2.4 GHz, 5 GHz, or 6 GHz frequency band), the non-AP MLD (1001) may transmit the sector sweep frames (1403) over a first frequency band (e.g., a frequency band of a millimeter wave link) (e.g., a frequency band of 24 GHz or higher).

[0100] According to one embodiment, the AP MLD (901) (e.g., the AP (401) of FIG. 3, the AP MLD (401) of FIG. 4, or the electronic device (1804) of FIG. 18) may perform reception beamforming in advance based on feedback information included in the sector sweep feedback (e.g., the sector ID of the sector sweep frame received with the strongest signal). By the AP MLD (901) performing reception beamforming in advance, the reception probability of the sector sweep frames (1403) transmitted by the non-AP MLD (1001) may be further increased.

[0101] According to one embodiment, the AP MLD (901) may reply with sector sweep feedback (1404) via a second frequency band in response to sector sweep frames (1403). However, this is not limited thereto, and the AP MLD (901) may also reply with sector sweep feedback (1404) via a first frequency band. Each device may set a frequency band in which feedback corresponding to the frame it transmitted will be replied to, as appropriate. This acknowledgment policy may be included (e.g., embedded) in the MAC header of the frame.

[0102] Below, we will first describe feedback information included in the MAC header of the frame (e.g., information about the sector sweep frame received with the strongest signal among the sector sweep frames).

[0103]

[0104] FIG. 15 is a diagram for explaining an A-control (aggregated control) subfield of a MAC (medium access control) header according to one embodiment.

[0105] Referring to FIG. 15, according to one embodiment, an A-control (aggregated control) subfield (1501) and a table (1502) indicating information that can be stored in the A-control subfield (1501) can be identified.

[0106] According to one embodiment, feedback information (e.g., information about the sector sweep frame received with the strongest signal among the sector sweep frames) may be included (e.g., embedded) in the MAC header of the frame. The feedback information may be included in the A-control subfield (1501) of the MAC header.

[0107] According to one embodiment, the A-control subfield (1501) may include various information. The A-control subfield (1501) may include different information depending on the control ID value. The control information subfield of the A-control subfield (1501) may have a different number of bits depending on the control ID value. For example, if the control ID value corresponds to 4, the control information subfield may be composed of 8 bits and may include information about uplink power headroom.

[0108] According to one embodiment, a new control ID may be defined to include feedback information in the MAC header. An optimal field for conveying feedback information (e.g., sector ID) may be defined within the control information subfield corresponding to the new control ID. By utilizing the A-control subfield (1501), a new frame does not need to be created to transmit feedback information based on a second frequency band (e.g., the frequency band of an MLO link) (e.g., 2.4 GHz, 5 GHz, or 6 GHz frequency band). Efficiency can be maximized by utilizing the spare resources included in the existing frame without creating a new frame. However, the feedback information is not limited to being embedded in the new A-control subfield (1501), and the feedback information may also be included in a new action frame.

[0109] In one embodiment, the MAC header may include information indicating that feedback for the frame is to be transmitted over a second frequency band. The information indicating that feedback for the frame is to be transmitted over a frequency band used in MLO operation may be included in an ack policy indicator subfield of the MAC header.

[0110] According to one embodiment, the acknowledgment policy indication subfield may include information about acknowledgment policies. The acknowledgment policies may include normal ACK, implicit BAR (block ACK request), no ACK, no explicit ACK, power save multi-poll (PSMP) ACK, and block ACK.

[0111] In one embodiment, the acknowledgment policy may further include a multi-link operation (MLO) ACK. The MLO ACK may be a policy that instructs that feedback for the frame be transmitted over a second frequency band (e.g., the frequency band of the MLO link) (e.g., the 2.4 GHz, 5 GHz, or 6 GHz frequency band). The default acknowledgment policy of a device (e.g., an AP MLD) that utilizes both an MLO link and a millimeter wave link may be the MLO ACK. However, if a sector sweep frame is successfully received from an external electronic device (e.g., a non-AP MLD), the device (e.g., an AP MLD) may change the acknowledgment policy of the frame it transmits.

[0112]

[0113] Figure 16 is a flowchart of an operation method of AP MLD according to one embodiment.

[0114] Referring to FIG. 16, according to one embodiment, operations 1610 to 1630 may be performed sequentially, but are not necessarily performed sequentially. For example, the order of each operation (1610 to 1630) may be changed, and at least two operations may be performed in parallel.

[0115] According to one embodiment, in operation 1610, an AP MLD (e.g., an AP (401) of FIG. 3, an AP MLD (401) of FIG. 4, an AP MLD (901) of FIG. 9, or an electronic device (1804) of FIG. 18) may transmit one or more sector weep frames for beamforming to a non-AP MLD (e.g., an STA (301) of FIG. 3, a non-AP MLD (501) of FIG. 4, a non-AP MLD (1001) of FIG. 9, or an electronic device (1801) of FIG. 18) performing a multi-link operation with the electronic device through a first frequency band corresponding to a millimeter wave wireless communication channel. The operations performed by the AP MLD may include operations performed by a wireless communication circuit (e.g., a wireless communication circuit (910) of FIG. 10) and operations performed by a processor (e.g., a processor (920) of FIG. 10) through the wireless communication circuit.

[0116] According to one embodiment, in operation 1620, the AP MLD may receive feedback information for one or more sector sweep frames from a non-AP MLD over a second frequency band different from the first frequency band.

[0117] According to one embodiment, in operation 1630, the AP MLD may transmit a data frame to the non-AP MLD over the first frequency band based on the feedback information.

[0118] According to one embodiment, at operation 1640, the AP MLD may receive a data frame from a non-AP MLD over a second frequency band. The AP MLD may also receive an acknowledgment for the data frame over a first frequency band.

[0119]

[0120] Fig. 17 is a flowchart of an operation method of a non-AP MLD according to one embodiment.

[0121] Referring to FIG. 17, according to one embodiment, operations 1710 and 1720 may be performed sequentially, but are not necessarily performed sequentially. For example, the order of each operation (1710-1720) may be changed, and the two operations may be performed in parallel.

[0122] According to one embodiment, in operation 1710, a non-AP MLD (e.g., STA (301) of FIG. 3, non-AP MLD (501) of FIG. 4, non-AP MLD (1001) of FIG. 9, or electronic device (1801) of FIG. 18) may receive one or more sector weep frames for beamforming from an AP MLD (e.g., AP (401) of FIG. 3, AP MLD (401) of FIG. 4, AP MLD (901) of FIG. 9, or electronic device (1804) of FIG. 18) performing a multi-link operation with the non-AP MLD through a first frequency band corresponding to a millimeter wave wireless communication channel. The operations performed by the Non-AP MLD may include operations performed by a wireless communication circuit (e.g., the wireless communication circuit (1010) of FIG. 11 or the wireless communication module (1892) of FIG. 18) and operations performed by a processor (e.g., the processor (1020) of FIG. 11 or the processor (1820) of FIG. 18) through the wireless communication circuit.

[0123] According to one embodiment, in operation 1720, the non-AP MLD may transmit feedback information for one or more sector sweep frames to the AP MLD via a second frequency band different from the first frequency band. The feedback information may be included in an A-control (aggregated control) subfield of a MAC (medium access control) header of the frame transmitted by the non-AP MLD.

[0124]

[0125] FIG. 18 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0126] Referring to FIG. 18, in a network environment (1800), an electronic device (1801) may communicate with an electronic device (1802) via a first network (1898) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (1804) or a server (1808) via a second network (1899) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (1801) may communicate with the electronic device (1804) via the server (1808). According to one embodiment, the electronic device (1801) may include a processor (1820), a memory (1830), an input module (1850), an audio output module (1855), a display module (1860), an audio module (1870), a sensor module (1876), an interface (1877), a connection terminal (1878), a haptic module (1879), a camera module (1880), a power management module (1888), a battery (1889), a communication module (1890), a subscriber identification module (1896), or an antenna module (1897). In some embodiments, the electronic device (1801) may omit at least one of these components (e.g., the connection terminal (1878)), or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module (1876), camera module (1880), or antenna module (1897)) may be integrated into a single component (e.g., display module (1860)).

[0127] The processor (1820) may control at least one other component (e.g., a hardware or software component) of the electronic device (1801) connected to the processor (1820) by executing, for example, software (e.g., a program (1840)), and may perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (1820) may store commands or data received from other components (e.g., a sensor module (1876) or a communication module (1890)) in a volatile memory (1832), process the commands or data stored in the volatile memory (1832), and store result data in a non-volatile memory (1834). According to one embodiment, the processor (1820) may include a main processor (1821) (e.g., a central processing unit or an application processor) or an auxiliary processor (1823) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (1821). For example, when the electronic device (1801) includes the main processor (1821) and the auxiliary processor (1823), the auxiliary processor (1823) may be configured to use less power than the main processor (1821) or to be specialized for a given function. The auxiliary processor (1823) may be implemented separately from the main processor (1821) or as a part thereof.

[0128] The auxiliary processor (1823) may control at least a portion of functions or states associated with at least one component (e.g., the display module (1860), the sensor module (1876), or the communication module (1890)) of the electronic device (1801), for example, on behalf of the main processor (1821) while the main processor (1821) is in an inactive (e.g., sleep) state, or together with the main processor (1821) while the main processor (1821) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (1823) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (1880) or a communication module (1890)). In one embodiment, the auxiliary processor (1823) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (1801) where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (1808)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0129] The memory (1830) can store various data used by at least one component (e.g., the processor (1820) or the sensor module (1876)) of the electronic device (1801). The data can include, for example, software (e.g., the program (1840)) and input data or output data for commands related thereto. The memory (1830) can include volatile memory (1832) or non-volatile memory (1834).

[0130] The program (1840) may be stored as software in memory (1830) and may include, for example, an operating system (1842), middleware (1844), or an application (1846).

[0131] The input module (1850) can receive commands or data to be used in a component of the electronic device (1801) (e.g., a processor (1820)) from an external source (e.g., a user) of the electronic device (1801). The input module (1850) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0132] The audio output module (1855) can output audio signals to the outside of the electronic device (1801). The audio output module (1855) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0133] The display module (1860) can visually provide information to an external party (e.g., a user) of the electronic device (1801). The display module (1860) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (1860) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0134] The audio module (1870) can convert sound into an electrical signal, or vice versa. According to one embodiment, the audio module (1870) can acquire sound through the input module (1850), output sound through the sound output module (1855), or an external electronic device (e.g., electronic device (1802)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (1801).

[0135] The sensor module (1876) can detect the operating status (e.g., power or temperature) of the electronic device (1801) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (1876) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0136] The interface (1877) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1801) with an external electronic device (e.g., the electronic device (1802)). In one embodiment, the interface (1877) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0137] The connection terminal (1878) may include a connector through which the electronic device (1801) may be physically connected to an external electronic device (e.g., the electronic device (1802)). In one embodiment, the connection terminal (1878) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0138] The haptic module (1879) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (1879) may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0139] The camera module (1880) can capture still images and moving images. In one embodiment, the camera module (1880) may include one or more lenses, image sensors, image signal processors, or flashes.

[0140] The power management module (1888) can manage the power supplied to the electronic device (1801). According to one embodiment, the power management module (1888) can be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

[0141] A battery (1889) may power at least one component of the electronic device (1801). In one embodiment, the battery (1889) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0142] The communication module (1890) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1801) and an external electronic device (e.g., electronic device (1802), electronic device (1804), or server (1808)), and the performance of communication through the established communication channel. The communication module (1890) may operate independently from the processor (1820) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1890) may include a wireless communication module (1892) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1894) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (1804) via a first network (1898) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (1899) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network or a wide area network)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1892) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (1896) to identify or authenticate the electronic device (1801) within a communication network such as the first network (1898) or the second network (1899).

[0143] The wireless communication module (1892) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (1892) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (1892) may support various technologies for securing performance in high-frequency bands, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (1892) may support various requirements specified in the electronic device (1801), an external electronic device (e.g., the electronic device (1804)), or a network system (e.g., the second network (1899)). According to one embodiment, the wireless communication module (1892) can support a peak data rate (e.g., 20 Gbps or more) for eMBB implementation, a loss coverage (e.g., 164 dB or less) for mMTC implementation, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC implementation.

[0144] The antenna module (1897) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (1897) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (1897) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1898) or the second network (1899), may be selected from the plurality of antennas by, for example, the communication module (1890). A signal or power may be transmitted or received between the communication module (1890) and the external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (1897).

[0145] In one embodiment, the antenna module (1897) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0146] At least some of the above components may be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0147] According to one embodiment, commands or data may be transmitted or received between the electronic device (1801) and an external electronic device (1804) via a server (1808) connected to a second network (1899). Each of the external electronic devices (1802 or 1804) may be the same or a different type of device as the electronic device (1801). According to one embodiment, all or part of the operations executed in the electronic device (1801) may be executed in one or more of the external electronic devices (1802, 1804, or 1808). For example, when the electronic device (1801) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1801) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1801). The electronic device (1801) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (1801) may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (1804) may include an Internet of Things (IoT) device. The server (1808) may be an intelligent server utilizing machine learning and / or a neural network.According to one embodiment, an external electronic device (1804) or server (1808) may be included within the second network (1899). The electronic device (1801) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0148]

[0149] An electronic device according to an embodiment disclosed in this document may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of this document is not limited to the aforementioned devices.

[0150] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0151] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0152] An embodiment of the present document may be implemented as software (e.g., a program (1840)) including one or more instructions stored in a storage medium (e.g., an internal memory (1836) or an external memory (1838)) readable by a machine (e.g., an electronic device (1801)). For example, a processor (e.g., a processor (1820)) of a peripheral device (e.g., an electronic device (1801)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0153] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0154] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0155]

[0156] An electronic device according to one embodiment (e.g., AP (401) of FIG. 3, AP MLD (401) of FIG. 4, AP MLD (901) of FIG. 9, or electronic device (1804) of FIG. 18) may include a wireless communication circuit (e.g., wireless communication circuit (910) of FIG. 10) configured to transmit and receive wireless signals. The electronic device may include a processor (e.g., processor (920) of FIG. 10) operatively connected to the wireless communication circuit. The electronic device may include a memory (e.g., memory (930) of FIG. 10) that stores instructions. The instructions, when individually or collectively executed by the processor, may cause the electronic device to transmit, over a first frequency band corresponding to a millimeter wave wireless communication channel, one or more sector weep frames for beamforming to an external electronic device performing a multi-link operation with the electronic device. The instructions, when individually or collectively executed by the processor, may cause the electronic device to receive, from the external electronic device, feedback information for the one or more sector weep frames over a second frequency band different from the first frequency band. The instructions, when individually or collectively executed by the processor, may cause the electronic device to transmit, based on the feedback information, a data frame to the external electronic device over the first frequency band. The above instructions, when individually or collectively executed by the processor, may cause the electronic device to receive a data frame from the electronic device via the second frequency band.

[0157] According to one embodiment, the second frequency band may correspond to at least one of the frequency bands used in multi-link operation.

[0158] According to one embodiment, the feedback information may include information about a sector sweep frame received with the strongest signal among the one or more sector sweep frames.

[0159] According to one embodiment, the instructions, when individually or collectively executed by the processor, may cause the electronic device to determine a beam direction based on the feedback information. The instructions, when individually or collectively executed by the processor, may cause the electronic device to transmit a data frame to the external electronic device through the first frequency band based on the beam direction.

[0160] According to one embodiment, the feedback information may be included in an A-control (aggregated control) subfield of a MAC (medium access control) header of a frame transmitted by the external electronic device.

[0161] According to one embodiment, the MAC header of a frame transmitted by the electronic device may include information instructing that feedback for the frame be transmitted via the second frequency band.

[0162] According to one embodiment, the external electronic device may transmit one or more sector sweep frames to the electronic device. The instructions, when individually or collectively executed by the processor, may cause the electronic device to determine a beam direction for receiving the sector sweep frame from the external electronic device based on the feedback information.

[0163] According to one embodiment, the instructions, when individually or collectively executed by the processor, may cause the electronic device to change an acknowledgment policy (Ack policy) of a frame transmitted by the electronic device when a sector sweep frame is received from the external electronic device.

[0164] According to one embodiment, the operation of the electronic device transmitting a data frame to the external electronic device through the first frequency band may be performed independently of whether or not the sector sweep frame transmitted by the external electronic device is received.

[0165] An electronic device (e.g., STA (301) of FIG. 3, non-AP MLD (501) of FIG. 4, non-AP MLD (1001) of FIG. 9, or electronic device (1801) of FIG. 18) according to one embodiment may include a wireless communication circuit (e.g., wireless communication circuit (1010) of FIG. 11 or wireless communication module (1892) of FIG. 18) configured to transmit and receive wireless signals. The electronic device may include a processor (e.g., processor (1020) of FIG. 11 or processor (1820) of FIG. 18) operatively connected to the wireless communication circuit. The electronic device may include a memory (e.g., memory (1030) of FIG. 11 or memory (1830) of FIG. 18) that stores instructions. The instructions, when individually or collectively executed by the processor, may cause the electronic device to receive, from an external electronic device performing a multi-link operation with the electronic device, one or more sector weep frames for beamforming over a first frequency band corresponding to a millimeter wave wireless communication channel. The instructions, when individually or collectively executed by the processor, may cause the electronic device to transmit, to the external electronic device, feedback information for the one or more sector weep frames over a second frequency band different from the first frequency band. The feedback information may be included in an A-control (aggregated control) subfield of a MAC (medium access control) header of a frame transmitted by the electronic device.

[0166] According to one embodiment, the second frequency band may correspond to at least one of the frequency bands used in multi-link operation.

[0167] According to one embodiment, the feedback information may include information about a sector sweep frame received with the strongest signal among the one or more sector sweep frames.

[0168] An electronic device according to one embodiment (e.g., AP (401) of FIG. 3, AP MLD (401) of FIG. 4, AP MLD (901) of FIG. 9, or electronic device (1804) of FIG. 18) may include a wireless communication circuit (e.g., wireless communication circuit (910) of FIG. 10) configured to transmit and receive wireless signals. The electronic device may include a processor (e.g., processor (920) of FIG. 10) operatively connected to the wireless communication circuit. The electronic device may include a memory (e.g., memory (930) of FIG. 10) that stores instructions. The instructions, when individually or collectively executed by the processor, may cause the electronic device to transmit, to an external electronic device performing a multi-link operation with the electronic device, one or more sector sweep frames for beamforming over a first frequency band corresponding to a millimeter wave wireless communication channel. The instructions, when individually or collectively executed by the processor, may cause the electronic device to receive, from the external electronic device, feedback information for the one or more sector sweep frames over a second frequency band different from the first frequency band. A MAC header of the one or more sector sweep frames may include information indicating that feedback for the one or more sector sweep frames is to be transmitted over the second frequency band.

[0169] According to one embodiment, the second frequency band may correspond to at least one of the frequency bands used in multi-link operation.

[0170] According to one embodiment, the feedback information may include information about a sector sweep frame received with the strongest signal among the one or more sector sweep frames.

[0171] In one embodiment, the instructions, when individually or collectively executed by the processor, may cause the electronic device to determine a beam direction based on the feedback information. The instructions, when individually or collectively executed by the processor, may cause the electronic device to transmit a data frame to the external electronic device through the first frequency band based on the beam direction.

[0172] According to one embodiment, the feedback information may be included in an A-control (aggregated control) subfield of a MAC (medium access control) header of a frame transmitted by the external electronic device.

[0173] According to one embodiment, the external electronic device may transmit one or more sector sweep frames to the electronic device. The instructions, when individually or collectively executed by the processor, may cause the electronic device to determine a beam direction for receiving the sector sweep frame from the external electronic device based on the feedback information.

[0174] According to one embodiment, the instructions, when individually or collectively executed by the processor, may cause the electronic device to change an acknowledgment policy (Ack policy) of a frame transmitted by the electronic device when a sector sweep frame is received from the external electronic device.

[0175] According to one embodiment, the operation of the electronic device transmitting a data frame to the external electronic device through the first frequency band may be performed independently of whether or not the sector sweep frame transmitted by the external electronic device is received.

Claims

1. In electronic devices (401; 501; 901; 1804), A wireless communication circuit (910) configured to transmit and receive wireless signals; A processor (920) operatively connected to the wireless communication circuit (910); and Memory for storing instructions (930) Including, The above instructions, when individually or collectively executed by the processor (920), cause the electronic device (401; 501; 901; 1804) to: Transmitting one or more sector weep frames for beamforming to the electronic device (401; 501; 901; 1804) and an external electronic device (301; 601; 1001; 1801) performing a multi-link operation through a first frequency band corresponding to a millimeter wave wireless communication channel, Through a second frequency band different from the first frequency band, feedback information for the one or more sector sweep frames is received from the external electronic device (301; 601; 1001; 1801), Based on the above feedback information, a data frame is transmitted to the external electronic device (301; 601; 1001; 1801) through the first frequency band, To receive a data frame from the external electronic device (301; 601; 1001; 1801) through the second frequency band. Electronic devices (401; 501; 901; 1804).

2. In paragraph 1, The above second frequency band is, Corresponding to at least one of the frequency bands used in multi-link operation, Electronic devices (401; 501; 901; 1804).

3. In either of paragraphs 1 and 2, The above feedback information is: Information about the sector sweep frame received with the strongest signal among the above one or more sector sweep frames. An electronic device (401; 501; 901; 1804) comprising:

4. In any one of paragraphs 1 to 3, The above instructions, when individually or collectively executed by the processor (920), cause the electronic device (401; 501; 901; 1804) to: Determine the beam direction based on the above feedback information, Based on the beam direction, to transmit a data frame to the external electronic device (301; 601; 1001; 1801) through the first frequency band. Electronic devices (401; 501; 901; 1804).

5. In any one of paragraphs 1 to 4, The above feedback information is: Included in the A-control (aggregated control) subfield of the MAC (medium access control) header of the frame transmitted by the above external electronic device (301; 601; 1001; 1801). Electronic devices (401; 501; 901; 1804).

6. In any one of paragraphs 1 to 5, The MAC header of the frame transmitted by the above electronic device (401; 501; 901; 1804) is including information instructing that feedback for said frame be transmitted via said second frequency band; Electronic devices (401; 501; 901; 1804).

7. In any one of paragraphs 1 to 6, The above external electronic devices (301; 601; 1001; 1801) are Transmitting one or more sector sweep frames to the electronic device (401; 501; 901; 1804), The above instructions, when individually or collectively executed by the processor (920), cause the electronic device (401; 501; 901; 1804) to: Based on the above feedback information, determine a beam direction for receiving a sector sweep frame from the external electronic device (301; 601; 1001; 1801). Electronic devices (401; 501; 901; 1804).

8. In any one of paragraphs 1 to 7, The above instructions, when individually or collectively executed by the processor (920), cause the electronic device (401; 501; 901; 1804) to: When a sector sweep frame is received from the external electronic device (301; 601; 1001; 1801), the electronic device (401; 501; 901; 1804) changes the acknowledgment policy (Ack policy) of the frame transmitted. Electronic devices (401; 501; 901; 1804).

9. In any one of paragraphs 1 to 8, The operation of transmitting a data frame to the external electronic device (301; 601; 1001; 1801) through the first frequency band by the electronic device (401; 501; 901; 1804) is as follows. It is performed independently of whether the sector sweep frame transmitted by the external electronic device (301; 601; 1001; 1801) is received. Electronic devices (401; 501; 901; 1804).

10. In electronic devices (301; 601; 1001; 1801), A wireless communication circuit (1010; 1892) configured to transmit and receive wireless signals; a processor (1020; 1820) operatively connected to the wireless communication circuit (1010; 1892); and Memory for storing instructions (1030; 1830) Including, The above instructions, when individually or collectively executed by the processor (1020; 1820), cause the electronic device (301; 601; 1001; 1801) to: A first frequency band corresponding to a millimeter wave wireless communication channel is used to receive one or more sector weep frames for beamforming from an external electronic device (401; 501; 901; 1804) performing a multi-link operation with the electronic device, Transmit feedback information for the one or more sector sweep frames to the external electronic device (401; 501; 901; 1804) through a second frequency band different from the first frequency band, The above feedback information is: Included in the A-control (aggregated control) subfield of the MAC (medium access control) header of the frame transmitted by the above electronic device (301; 601; 1001; 1801), Electronic devices (301; 601; 1001; 1801).

11. In paragraph 10, The above second frequency band is, Corresponding to at least one of the frequency bands used in multi-link operation, Electronic devices (301; 601; 1001; 1801).

12. In either of paragraphs 10 and 11, The above feedback information is: Information about the sector sweep frame received with the strongest signal among the above one or more sector sweep frames. An electronic device (301; 601; 1001; 1801) comprising:

13. In electronic devices (401; 501; 901; 1804), A wireless communication circuit (910) configured to transmit and receive wireless signals; A processor (920) operatively connected to the wireless communication circuit (910); and One or more memories (930) for storing instructions Including, The above instructions, when individually or collectively executed by the processor (920), cause the electronic device (401; 501; 901; 1804) to: Transmitting one or more sector weep frames for beamforming to the electronic device (401; 501; 901; 1804) and an external electronic device (301; 601; 1001; 1801) performing a multi-link operation through a first frequency band corresponding to a millimeter wave wireless communication channel, To receive feedback information for the one or more sector sweep frames from the external electronic device (301; 601; 1001; 1801) through a second frequency band different from the first frequency band, The MAC header of one or more of the above sector sweep frames, comprising information instructing that feedback for said one or more sector sweep frames be transmitted via said second frequency band; Electronic devices (401; 501; 901; 1804).

14. In paragraph 13, The above second frequency band is, Corresponding to at least one of the frequency bands used in multi-link operation, Electronic devices (401; 501; 901; 1804).

15. In any one of paragraphs 13 and 14, The above feedback information is: Information about the sector sweep frame received with the strongest signal among the above one or more sector sweep frames. An electronic device (401; 501; 901; 1804) comprising:

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