Electronic device comprising heat dissipation structure

Abstract

An embodiment of the present disclosure may provide an electronic device comprising: a housing forming the exterior of the electronic device; a printed circuit board on which at least one component is disposed; and a heat dissipation member which is in contact with the at least one component or in contact with the at least one component through a thermally conductive material, and comprises a first plate, a second plate, and a wick. The wick may be disposed at the second plate inside the heat dissipation member and may include a first portion and a second portion. The first portion may be thicker than the second portion.

Description

Electronic devices including heat dissipation structures

[0001] The present disclosure relates to electronic devices, and for example, to electronic devices including a heat dissipation structure for moving, dissipating, and / or radiating heat generated therein.

[0002] Typically, electronic devices can refer to devices that perform specific functions depending on the programs installed on them, ranging from home appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes more widespread, a single mobile communication terminal is now equipped with various functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device.

[0003] The dramatic improvement in the performance of electronic components, such as integrated circuit chips (ICs) equipped with processors and communication modules, has opened the door to integrating these diverse functions into a single electronic device. This advancement in electronic component performance not only allows for the integration of diverse functions into a single electronic device, but also enhances data communication and processing speeds.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0005] According to one embodiment of the present disclosure, an electronic device may be provided, including: a housing forming an exterior of an electronic device; a printed circuit board having at least one component disposed thereon; and a heat dissipation member contacting the at least one component or contacting the at least one component through a thermally conductive material, the heat dissipation member including a first plate, a second plate, and a wick. The wick may be disposed at the second plate within the heat dissipation member and may include a first portion and a second portion. In addition, the first portion may have a thicker thickness than the second portion.

[0006] According to one embodiment of the present disclosure, an electronic device may be provided, comprising: a housing including a first surface and a second surface facing in an opposite direction of the first surface; a support member accommodated in the housing between the first surface and the second surface; a heat dissipation member disposed on one surface of the support member, the heat dissipation member including a wick; a printed circuit board accommodated in the housing between the first surface and the second surface, the printed circuit board having at least one component disposed thereon; and a heat-conductive material disposed between the at least one component and the heat dissipation member. The wick may include a first portion disposed in a heat-receiving portion and a second portion disposed in a heat-dissipating portion. One of the first portion and the second portion may further include a reinforced portion compared to the other portion.

[0007] According to one embodiment of the present disclosure, an electronic device may be provided, comprising: a housing including a first surface and a second surface facing in an opposite direction to the first surface; a support member accommodated in the housing between the first surface and the second surface; and a heat dissipation member supported by the support member, the heat receiving portion being configured to vaporize a working fluid based on absorption of heat from a heat source disposed within the electronic device; a heat dissipation portion being configured to liquefy the working fluid based on release of heat; and a wick disposed on the heat dissipation portion and the heat receiving portion. The wick may include a first portion disposed on the heat receiving portion and a second portion disposed on the heat dissipation portion. One of the first portion and the second portion may further include a reinforced portion compared to the other portion.

[0008] The above-described aspects or other aspects, configurations and / or advantages of any embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0009] FIG. 1 is a block diagram illustrating an electronic device within a network environment according to one embodiment of the present disclosure.

[0010] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 3 is a perspective view showing the rear side of the electronic device illustrated in FIG. 2 according to one embodiment of the present disclosure.

[0012] FIG. 4 is an exploded perspective view showing the front side of the electronic device illustrated in FIG. 2, according to one embodiment of the present disclosure.

[0013] FIG. 5 is an exploded perspective view showing the rear side of the electronic device illustrated in FIG. 2, according to one embodiment of the present disclosure.

[0014] FIG. 6 is a drawing showing a heat dissipation member and a heat dissipation member arranged within a housing according to one embodiment of the present disclosure.

[0015] FIG. 7 is a cross-sectional view showing a heat dissipation structure of an electronic device according to one embodiment of the present disclosure.

[0016] FIG. 8 is a cross-sectional view showing a heat dissipation member according to one embodiment of the present disclosure.

[0017] FIG. 9 is a cross-sectional view showing the operating principle of a heat dissipation member according to one embodiment of the present disclosure.

[0018] FIG. 10 is a cross-sectional view showing a heat dissipation structure of an electronic device according to one embodiment of the present disclosure.

[0019] Fig. 11 is a cross-sectional view showing a heat dissipation member according to one embodiment of the present disclosure.

[0020] FIG. 12 is a drawing showing a heat dissipation member according to one embodiment of the present disclosure.

[0021] FIG. 13 is a drawing showing a heat dissipation member according to one embodiment of the present disclosure.

[0022] FIG. 14 is a drawing showing a heat conductive block arranged on the back surface of a heat dissipation member according to one embodiment of the present disclosure.

[0023] FIG. 15 is a cross-sectional view showing a shielding sheet according to one embodiment of the present disclosure.

[0024] FIG. 16 is a graph showing the temperature improvement effect of a heat dissipation structure according to one embodiment of the present disclosure.

[0025] FIG. 17a and FIG. 17b are diagrams showing the temperature improvement effect of an electronic device according to one embodiment of the present disclosure.

[0026] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0027] Heat generated from electronic components, such as integrated circuit chips, can degrade the operating environment of electronic devices. As the performance of various electronic components improves, the integration density of electronic devices increases, and / or the capacity of image and audio data increases, the problem of degraded operating environment due to heat generation may worsen. Integrated circuit chips equipped with circuit devices, such as processors, can generate more heat than other electronic components. Furthermore, the development of electronic devices, such as smartphones, is moving toward reducing the thickness of electronic devices. This can further degrade the operating environment of electronic components when more heat is generated in a narrow area and / or when the generated heat accumulates within the electronic device. To improve the heat dissipation performance of electronic devices, heat dissipation components (e.g., vapor chambers) that utilize phase transitions between liquid and gas are being employed. However, even if the heat dissipation performance of electronic devices is somewhat improved, the temperature of the heat source (e.g., processor) may not improve due to the thermal resistance between the heat dissipation component and the heat source.

[0028] One embodiment of the present disclosure is intended to at least resolve the above-described problems and / or disadvantages and provide at least the advantages described below, and may provide an electronic device including a heat dissipation structure that rapidly moves, disperses, and / or releases heat generated therein.

[0029] One embodiment of the present disclosure can provide an electronic device including a heat dissipation member having reduced thermal resistance between the heat dissipation member and a heat source (e.g., a processor).

[0030] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present disclosure belongs from the description below.

[0031] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0032] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe embodiments of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided solely for illustrative purposes and not for the purpose of limiting the disclosure, which defines the scope of the claims and their equivalents.

[0033] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0034] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0035] The processor (120) may include various processing circuits and / or multiple processors. For example, the term "processor" as used herein, including in the claims, may include various processing circuits, including one or more processors, wherein one or more of the one or more processors may be individually and / or collectively configured to perform various functions described herein. When the terms "processor," "at least one processor," and "one or more processors" as used herein are described as being configured to perform a number of functions, these terms encompass, for example, without limitation, a situation where one processor performs some of the recited functions and other processor(s) perform other of the recited functions, and also a situation where a single processor may perform all of the recited functions. Furthermore, the one or more processors may include a combination of processors that perform various recited / disclosed functions (e.g., in a distributed manner). The one or more processors may execute program instructions to achieve or perform various functions. The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134).According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor), or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0036] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0037] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0041] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0042] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0043] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0047] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0049] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0052] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0053] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0054] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] FIG. 2 is a perspective view showing the front side of an electronic device (101) according to various embodiments of the present disclosure. FIG. 3 is a perspective view showing the rear side of an electronic device (101) according to various embodiments of the present disclosure.

[0057] In the detailed description below, the length direction of the electronic device (101) may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the height direction (thickness direction) as the 'Z-axis direction'. In the detailed description below, references to the length direction, the width direction, and / or the height direction (or thickness direction) may indicate the length direction, the width direction, and / or the height direction (or thickness direction) of the electronic device. In some embodiments, with respect to the direction in which a component is oriented, 'negative / positive (- / +)' may be mentioned together with the rectangular coordinate system illustrated in the drawing. For example, referring to FIG. 2, the front of the electronic device (101) or the housing (201) may be defined as the 'surface facing the -Z-axis direction', and the rear side may be defined as the 'surface facing the +Z-axis direction'. According to one embodiment, the arrangement relationship in the height direction of a component or another component, i.e., the reference of up / down, may follow the +Z-axis direction / -Z-axis direction. That is, when a component is said to be arranged on top of another component, it may mean that the component is arranged in the -Z-axis direction with respect to the other component, and when a component is said to be arranged under another component, it may mean that the component is arranged in the +Z-axis direction with respect to the other component. Meanwhile, it should be noted that even if a component is arranged on top or below another component, it does not mean that the entire component is located on top or below all of the components of the other component. For example, a part of a component may be arranged on top of a part of another component, but another part of the component may be arranged below another part of the other component. In one embodiment, when a component is said to be 'viewed from above', it may mean looking at the component from the -Z-axis direction toward the +Z-axis direction from a place that is a predetermined distance away from the component.In one embodiment, the fact that a component is 'oriented in a certain direction' can be understood to include not only that a component is oriented in the 'same direction as the certain direction' but also that a component is oriented in a 'direction parallel to the certain direction'. It should be noted that in the following description, when a component is said to overlap (or stacked) with another component, the description of the arrangement relationship in the height direction described above can be applied. In the description of the direction, if 'yin / yang (- / +)' is not described, it can be interpreted to include both the + direction and the - direction unless defined separately. For example, 'Z-axis direction' can be interpreted to include both the +Z direction and the -Z direction. Similarly, 'X-axis direction' can be interpreted to include both the +X direction and the -X direction, and 'Y-axis direction' can be interpreted to include both the +Y direction and the -Y direction. In describing a direction, facing one of the three axes of the orthogonal coordinate system may include facing in a direction parallel to the axis. Hereinafter, in the description to be described later, the 'first direction' may mean the Z-axis direction or a direction parallel to the Z-axis, and the 'second direction' may mean the X-axis direction or a direction parallel to the X-axis. In addition, the 'third direction' may mean the Y-axis direction or a direction parallel to the Y-axis. It should be noted that the above description is based on the orthogonal coordinate system described in the drawings for the sake of brevity of description, and the description of such directions or components does not limit the various embodiments of the present disclosure.

[0058] Referring to FIGS. 2 and 3 , an electronic device (101) according to one embodiment may include a housing (201) including a front surface (201A), a back surface (201B), and a side surface (201C) surrounding a space between the front surface (201A) and the back surface (201B). In one embodiment (not shown), the housing (201) may refer to a structure forming a portion of the front surface (201A) of FIG. 2 , the back surface (201B) of FIG. 3 , and the side surface (201C). According to one embodiment, at least a portion of the front surface (201A) may be formed by a substantially transparent front plate (202) (e.g., a glass plate including various coating layers, or a polymer plate). The back surface (201B) may be formed by a back plate (211). The rear plate (211) may be formed of, for example, glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (201C) may be formed by a side bezel structure (or “side member”) (212) that is coupled to the front plate (202) and the rear plate (211) and includes metal and / or polymer. In some embodiments, the front plate (202) and the side bezel structure (212) may be formed as one body and include the same material. Alternatively, the rear plate (211) and the side bezel structure (212) may be formed as one body and include the same material (e.g., a metal material such as glass or aluminum, or a ceramic). In another embodiment, the front surface (201A) and / or the front plate (202) may be interpreted as a part of the display (210). According to one embodiment, the housing (201) may include a front plate (202) and a back plate (211).

[0059] According to one embodiment, the electronic device (101) may include at least one of a display (210), an audio module (203, 204, 205) (e.g., the audio module (170) of FIG. 1), a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (206, 207) (e.g., the camera module (180) of FIG. 1), a key input device (216, 217) (e.g., the input module (150) of FIG. 1), and a connector hole (213, 214) (e.g., the connection terminal (178) of FIG. 1). In some embodiments, the electronic device (101) may omit at least one of the components (e.g., the connector hole (214)) or may additionally include other components.

[0060] In one embodiment, the display (210) may be visible through, for example, a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (210) may be exposed through the front plate (202) forming the front surface (201A). In one embodiment, the display (210) may be a flexible display or a foldable display.

[0061] In one embodiment, the surface (or front plate (202)) of the housing (201) may include a screen display area formed by visually exposing the display (210). As an example, the screen display area may include the front surface (201A).

[0062] In one embodiment (not shown), the electronic device (101) may include a recess or opening formed in a portion of a screen display area (e.g., front surface (201A)) of the display (210), and may include at least one of an audio module (205), a sensor module (not shown), a light-emitting element (not shown), and a camera module (206) aligned with the recess or opening. In one embodiment (not shown), the electronic device (101) may include at least one of an audio module (205), a sensor module (not shown), a camera module (206), a fingerprint sensor (not shown), and a light-emitting element (not shown) on a back surface of the screen display area of ​​the display (210).

[0063] In one embodiment (not shown), the display (210) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen (215).

[0064] In various embodiments, at least a portion of the key input device (216, 217) may be disposed in the side bezel structure (212).

[0065] According to one embodiment, the audio module (203, 204, 205) may include, for example, a microphone hole (203) and a speaker hole (204, 205). The microphone hole (203) may have a microphone disposed therein for acquiring external sound, and in various embodiments, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole (204, 205) may include an external speaker hole (204) and a receiver hole (205) for calls. In some embodiments, the speaker hole (204, 205) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (204, 205) (e.g., a piezo speaker). The audio modules (203, 204, 205) are not limited to the above structure, and may be designed in various ways, such as by mounting only some audio modules or adding new audio modules, depending on the structure of the electronic device (101).

[0066] According to one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to, for example, an internal operating state of the electronic device (101) or an external environmental state. The sensor module (not shown) may include, for example, a first sensor module (not shown) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the front side (201A) of the housing (201), and / or a third sensor module (not shown) (e.g., a heart rate monitor (HRM) sensor) and / or a fourth sensor module (not shown) (e.g., a fingerprint sensor) disposed on the rear side (201B) of the housing (201). In some embodiments (not shown), the fingerprint sensor may be disposed on the front side (201A) (e.g., the display (210)) as well as the rear side (201B) of the housing (201). The electronic device (101) may further include at least one sensor module (not shown), for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (not shown). The sensor module (not shown) is not limited to the above structure, and may be designed in various ways, such as by mounting only some sensor modules or adding new sensor modules, depending on the structure of the electronic device (101).

[0067] According to one embodiment, the camera modules (206, 207) may include, for example, a front camera module (206) disposed on the front (201A) of the electronic device (101), a rear camera module (207) disposed on the rear (201B), a flash (208), and / or an IR sensor (209). The camera modules (206, 207) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (208) may include, for example, a light-emitting diode or a xenon lamp. The camera modules (206, 207) are not limited to the above structure, and may be designed in various ways, such as by mounting only some camera modules or adding new camera modules, depending on the structure of the electronic device (101).

[0068] According to one embodiment, the electronic device (101) may include a plurality of camera modules (e.g., a dual camera or a triple camera) each having different properties (e.g., an angle of view) or functions. For example, the rear camera module (207) may include a plurality of camera modules including lenses having different angles of view. For example, the plurality of camera modules may include at least one of a wide-angle camera, an ultra-wide-angle camera, a telephoto camera, or an infrared (IR) camera (e.g., a time of flight (TOF) camera, a structured light camera). In addition, for example, the plurality of camera modules may include an optical zoom camera with adjustable magnification. According to one embodiment, the electronic device (101) may be configured to operate a designated camera module or another camera module among the plurality of camera modules based on a user's selection or under a pre-designated environment. According to one embodiment, the IR camera may be operated as at least a part of a sensor module. For example, a TOF camera may be operated as at least part of a sensor module (not shown) for detecting a distance to a subject.

[0069] According to one embodiment, the camera module (206, 207) may include a vertical camera module and / or a folded camera module. The vertical camera module may be a module including a camera in which the path of light incident on the lens assembly to reach the image sensor is formed in a straight line without being bent. The vertical camera module may perform relative movement between the lens barrel and the camera housing surrounding the lens barrel (or perform relative movement between the image sensor and the camera housing) during an auto focus (AF) operation or an optical image stabilization (OIS) operation. In addition, the vertical camera module may also include a camera module of the fixed focus type in which the lens barrel and the camera housing do not move relatively and their positions are fixed. The above-described curved camera module may refer to a camera module in which the path of light incident on the lens assembly is bent at least once before reaching the image sensor, and may typically include a member (e.g., a prism or a mirror) that causes the light to reflect or refraction at least once. Here, whether the path of the light reaching the image sensor is bent may be determined not based on whether the light is bent by each lens included in the lens assembly, but based on whether the light is bent by the member (e.g., a prism or a mirror). According to one embodiment, some of the camera modules (206, 207) (e.g., a front camera) may include a direct-type camera module, and other some (e.g., a rear camera) may include a curved camera module.

[0070] According to one embodiment, some of the camera modules (206, 207) (e.g., front camera module (206)) may be implemented as an under display camera (UDC).

[0071] In one embodiment, the key input devices (216, 217) may be disposed on a side (201C) of the housing (201). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (216, 217), and the key input devices (216, 217) that are not included may be implemented in other forms, such as soft keys, on the display (210). In some embodiments, the key input devices (216, 217) may include a sensor module (not shown) disposed on the rear (201B) of the housing (201).

[0072] According to one embodiment, a light-emitting element (not shown) may be disposed, for example, on the front surface (201A) of the housing (201). The light-emitting element (not shown) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (not shown) may provide, for example, a light source that is linked to the operation of the front camera module (206). The light-emitting element (not shown) may include, for example, a light emitting diode (LED), an infrared (IR) LED, and / or a xenon lamp.

[0073] According to one embodiment, the connector holes (213, 214) may include a first connector hole (213) that can accommodate, for example, a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device or a connector (e.g., an earphone jack) for transmitting and receiving audio signals with an external electronic device, and / or a second connector hole (214) that can accommodate a storage device (e.g., a subscriber identification module (SIM) card, a secure digital (SD) memory card). According to one embodiment, the first connector hole (213) and / or the second connector hole (214) may be omitted. The connector holes (213, 214) are not limited to the above structure, and may be designed in various ways, such as by mounting only some connector holes or adding new connector holes, depending on the structure of the electronic device (101).

[0074] A pen input device (215) (e.g., a stylus pen) can be inserted or removed into the interior of the housing (201) through a hole formed on a side of the housing (201) and can include a button to facilitate removal. A separate resonance circuit is built into the pen input device (215) so that it can be linked with an electromagnetic induction panel (e.g., a digitizer) included in the electronic device (101). The pen input device (215) can include an EMR (electro-magnetic resonance) method, an AES (active electrical stylus), and an ECR (electric coupled resonance) method.

[0075] The electronic device (101) disclosed in FIGS. 2 and 3 has a bar-type or plate-type exterior, but is not limited thereto. For example, the illustrated electronic device may be a part of a rollable electronic device or a foldable electronic device. The term "rollable electronic device" may refer to an electronic device whose display is capable of bending deformation, such that at least a portion thereof can be wound or rolled and stored inside a housing (201). Depending on the user's needs, the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a wider area of ​​the display to the outside. The term "foldable electronic device" may refer to an electronic device that can be folded so that two different areas of the display face each other or face opposite to each other. Typically, in a portable state, the display of a foldable electronic device is folded so that the two different areas face each other or face each other, and in an actual use state, the user can unfold the display so that the two different areas form a substantially flat shape. In some embodiments, the electronic device (101) according to various embodiments of the present disclosure may be interpreted to mean not only portable electronic devices such as smart phones, but also other various electronic devices such as notebook computers and home appliances.

[0076] FIG. 4 is an exploded perspective view showing a front side of the electronic device illustrated in FIG. 2 according to one embodiment of the present disclosure. FIG. 5 is an exploded perspective view showing a rear side of the electronic device illustrated in FIG. 2 according to one embodiment of the present disclosure.

[0077] Referring to FIGS. 4 and 5, the electronic device (200) (e.g., the electronic device (101) of FIG. 1, 2, or 3) may include a side bezel structure (212), a first support member (220) (e.g., a bracket), a front plate (202), a display (210), a printed circuit board (or board assembly) (240), a battery (250), a second support member (260) (e.g., a rear case), an antenna, a camera module (207), and a rear plate (211). In one embodiment, the electronic device (200) may omit at least one of the components (e.g., the first support member (220) or the second support member (260)) or may additionally include other components. At least one of the components of the electronic device (200) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any overlapping description will be omitted below.

[0078] The first support member (220) may be disposed inside the electronic device (200) and connected to the side bezel structure (212), or may be formed integrally with the side bezel structure (212). The first support member (220) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. When formed at least partially of a metallic material, the side bezel structure (212) or a portion of the first support member (220) may function as an antenna. The first support member (220) may have a display (210) coupled to one surface and a printed circuit board (240) coupled to the other surface. The printed circuit board (240) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. In one embodiment, the processor and / or memory may refer to one of the circuit devices mounted on an integrated circuit chip.

[0079] In one embodiment, the first support member (220) and the side bezel structure (212) may be combined to be referred to as a housing (201) (or front case). In one embodiment, the housing (201) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (240) or a battery (250). In one embodiment, the housing (201) may be understood as including structures that can be visually or tactilely perceived by a user in the appearance of the electronic device (200), for example, a side bezel structure (212), a front plate (202), and / or a rear plate (211). In one embodiment, the 'front or rear side of the housing (201)' may refer to the first side (201A) of FIG. 2 or the second side (201B) of FIG. 3. In one embodiment, the first support member (220) is positioned between the front plate (202) (e.g., the first side (201A) of FIG. 2) and the back plate (211) (e.g., the second side (201B) of FIG. 3) and may function as a structure for positioning electrical / electronic components such as a printed circuit board (240) or a camera assembly (207).

[0080] The display (210) may include a display panel and a flexible printed circuit board extending from the display panel. The flexible printed circuit board may be understood to be electrically connected to the display panel while being disposed, for example, at least partially on the rear surface of the display panel. In one embodiment, the display may further include a protective sheet. In one embodiment, the protective sheet may function as a buffer structure (e.g., a low-density elastomer such as a sponge) that absorbs external forces or as an electromagnetic shielding structure (e.g., a copper sheet).

[0081] According to one embodiment, the display (210) may be disposed on the inner surface of the front plate (202) and may output a screen through at least a portion of the first surface (201A) or the front plate (202) of FIG. 2 by including a light-emitting layer. As mentioned above, the display (210) may output a screen through substantially the entire area of ​​the first surface (201A) or the front plate (202) of FIG. 2.

[0082] The memory may include, for example, volatile memory or non-volatile memory.

[0083] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0084] The second support member (260) may include, for example, an upper support member (260a) and a lower support member (260b). In one embodiment, the upper support member (260a) may be arranged to surround the printed circuit board (240) together with a portion of the first support member (220). For example, the printed circuit board (240) may be substantially disposed between the first support member (220) and the second support member (260) (e.g., the upper support member (260a). A circuit device implemented in the form of an integrated circuit chip (e.g., a processor, a communication module, or a memory) or various electric / electronic components may be disposed on the printed circuit board (240), and according to an embodiment, the printed circuit board (240) may be provided with an electromagnetic shielding environment from the upper support member (260a). In one embodiment, a shield can (249) (hereinafter, the shield can (249) of FIG. 7, which will be described later) may be disposed on the printed circuit board (240). For example, the shield can (249) may provide an electromagnetic shielding environment to a portion or space on the printed circuit board (240). In one embodiment, the shield can (249) may be disposed on at least one component (e.g., an integrated circuit having a processor, a memory, and / or a communication module). (chip) can be arranged to surround at least a portion of the chip.

[0085] In one embodiment, the lower support member (260b) may be utilized as a structure for arranging electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector). In one embodiment, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged on an additional printed circuit board (not shown). For example, the lower support member (260b) may be arranged to surround the additional printed circuit board together with another portion of the first support member (220). A speaker module or interface arranged on an additional printed circuit board or lower support member (260b) not shown may be arranged corresponding to an audio module (e.g., a microphone hole (203) or a speaker hole (e.g., an external speaker hole (204), a call receiver hole (205))) or a connector hole (e.g., a first connector hole (213), a second connector hole (214)) of FIG. 2.

[0086] The battery (250) is a device for supplying power to at least one component of the electronic device (200), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the printed circuit board (240). The battery (250) may be disposed integrally within the electronic device (200), or may be disposed detachably from the electronic device (200).

[0087] Although not shown, the antenna may include a conductive pattern implemented on the surface of the first support member (220) and / or the surface of the second support member (260), for example, through a laser direct structuring (LDS) process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (211) and the battery (250). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side bezel structure (212) and / or a portion of the first support member (220), or a combination thereof.

[0088] The camera assembly (207) may include at least one camera module. Within the electronic device (200), the camera assembly (207) may receive at least a portion of light incident through optical holes or camera windows (218a, 218b, 218c, 218d, 219). In one embodiment, the camera assembly (207) may be disposed on the first support member (220) at a location adjacent to the printed circuit board (240). In one embodiment, the camera module(s) of the camera assembly (207) may be generally aligned with any one of the camera windows (218a, 218b, 218c, 218d, 219) and may be at least partially wrapped around the second support member (260) (e.g., the upper support member (260a)).

[0089] In examining the embodiments described below, the configuration of the electronic device (101, 200) described above may be referred to. Even if not directly mentioned, the configuration of the various embodiments described above may be similarly applied to the embodiments described below. It should be noted that the rectangular coordinate system referred to in the embodiments described above and / or below is an example for the sake of brevity of explanation, and the various embodiments(s) of the present disclosure are not limited thereto. For example, the rectangular coordinate system mentioned in the present disclosure may be defined differently depending on the shape of the electronic device to be actually manufactured (e.g., bar type, foldable type, rollable type, and / or slide type), the user's usage habits, and / or the orientation direction of the electronic device. In the illustrated embodiments, the X-axis direction may refer to the width direction of the electronic device, the Y-axis direction may refer to the length direction of the electronic device, and / or the Z-axis direction may refer to the thickness direction of the electronic device. In the embodiments described below, when the integrated circuit chip generates heat, the heat may move to the heat dissipation member through the thermally conductive material, and the direction of movement of the heat may be understood to be substantially parallel to the Z-axis direction.

[0090] FIG. 6 is a drawing showing a heat dissipation member and a heat dissipation member arranged within a housing according to one embodiment of the present disclosure. FIG. 7 is a cross-sectional view showing a heat dissipation structure of an electronic device according to one embodiment of the present disclosure. FIG. 8 is a drawing showing a heat dissipation member according to one embodiment of the present disclosure. FIG. 9 is a cross-sectional view showing the operating principle of a heat dissipation member according to one embodiment of the present disclosure.

[0091] FIG. 7 may be a cross-sectional view illustrating a heat dissipation structure of an electronic device (200) taken along line A-A' of FIG. 6 according to one embodiment of the present disclosure. FIG. 8 and FIG. 9 may be cross-sectional views illustrating a heat dissipation member taken along line B-B' of FIG. 6 according to one embodiment of the present disclosure.

[0092] Referring to FIGS. 6 and 7, in the electronic device (200), a heat dissipation structure may be formed between the display (210) and the printed circuit board (240). According to one embodiment, a first support member (220) may be provided as a part of the heat dissipation structure. In the description below FIG. 6, since the second support member (260) is not mentioned, the first support member (220) may be simply referred to as a “support member (220).” For example, the electronic device (200) and / or the heat dissipation structure may include a support member (220) provided within a housing (e.g., the housing (201) of FIGS. 2 to 5) and a heat dissipation member (230) supported by the support member (220). The heat dissipation member (230) may be referred to as a configuration for dissipating heat accumulated in a high-temperature region inside an electronic device to a low-temperature region through a change in the state and circulation of a working fluid, and may include, for example, a vapor chamber or a heat pipe. According to one embodiment, the support member (220) may include a high-temperature region (220-1) and a low-temperature region (220-2) due to various electronic components arranged on the support member (220), and the heat dissipation member (230) may be referred to as a configuration for dissipating heat of the high-temperature region (220-1) on the support member (220) to the low-temperature region (220-2). It should be noted that although the high-temperature region (220-1) and the low-temperature region (220-2) are illustrated with dotted lines of a specific size in FIG. 6, this is merely an example. Referring to FIG. 7, the heat dissipation structure of the present disclosure is illustrated as being positioned between the display (210) and the printed circuit board (240), but the location of the heat dissipation structure may not necessarily be limited thereto. For example, the heat dissipation structure may be positioned between the printed circuit board (240) and the back plate (e.g., the back plate (211) of FIG. 3). Various other embodiments are also possible.Extensions of this embodiment can be applied to embodiments for other drawings as well as FIG. 7.

[0093] In one embodiment, the support member (220) (e.g., the first support member (220) of FIG. 4 or FIG. 5) may have a substantially flat shape and may be disposed at least partially in a space between the first side (or front side) (201A) of FIG. 2 or the second side (or back side) (201B) of FIG. 3. In one embodiment, the support member (220) may include a first side (220a) facing the display (210) and a second side (220b) facing the printed circuit board (240). In one embodiment, the heat dissipation member (230) may be secured to the first side (220a) of the support member (220) by a bonding member (221), such as a double-sided tape. In one embodiment, the heat dissipation member (230) may also be secured to the support member (220) by welding. At least one component (241) may be arranged on the second surface (220b) of the support member (220). The at least one component (241) may be arranged on the second surface (220b) of the support member (220) while being arranged on one side of the printed circuit board (240). Some of the at least one component may be a heat generating source, for example, at least one chip arranged on at least one side of the printed circuit board (240). The at least one chip may include at least one of a power management integrated circuit (PMIC), a power amplifier (PAM), an application processor (AP), a communication processor (CP), a charger integrated circuit (IC), or a DC converter. Hereinafter, an integrated circuit chip may be described as an example of the at least one component (241).

[0094] A first surface (220a) of the support member (220) is, for example, a surface facing the display (210), and a heat dissipation member (230) may be disposed on the first surface (220a). A second surface (220b) of the support member (220) is, for example, a surface facing the rear plate (211), and a printed circuit board (240) may be disposed on the second surface (220b) of the support member (220). FIG. 6 illustrates that the support member (220) is laminated on a printed circuit board (240), and the heat dissipation member (230) is disposed on the first surface (220a) of the support member (220).

[0095] In one embodiment, the heat dissipation member (230) can absorb heat from at least one component (241) (e.g., an integrated circuit chip) disposed on a printed circuit board (240) and move or distribute the heat to a wider area. In one embodiment, the at least one component (241) can be disposed inside a shield can (249), thereby providing an electromagnetically isolated environment. The shield can (249) surrounds at least a portion of the at least one component (241), thereby shielding electromagnetic waves generated from the at least one component (241). In one embodiment, the heat transfer efficiency can be reduced by disposing the shield can (249) in a heat transfer path from the at least one component (241) to the heat dissipation member (230).

[0096] In one embodiment, the electronic device (200) and / or the heat dissipation structure may include a thermal interface material (TIM) (243). For example, the thermal interface material (TIM) may further include a thermal interface material (TIM) that protrudes outward from at least one component (241) while being in contact with the at least one component (241) within the shield can (249). The thermal interface material (243) may be, for example, a contact thermal interface material, and may be manufactured by coating or plating a thermal interface material on a nano-foam. The material of the thermal interface material may include, for example, a high thermal interface material such as graphite, carbon nanotubes, a natural renewable material, silicon, silicon, or graphite. The thermally conductive material (243) may include, for example, at least one of a carbon fiber thermal interface material (TIM), a liquid phase thermal interface material (TIM), an acrylic thermal interface material (TIM), and / or a solid phase thermal interface material (TIM). The thermally conductive material (243) may be configured to transfer heat between at least one component (241) and the heat dissipation member (230) by contacting another structure, for example, a shielding sheet (245), within the shield can (249).

[0097] A shielding sheet (245) may be laminated and arranged on at least a portion of the shield can (249). In one embodiment, the shielding sheet (245) may provide a function of shielding electromagnetic waves that may be generated by at least one component (241). The shielding sheet (245) may be provided for the purpose of securing electromagnetic shielding performance when the shield can (249) is partially opened in a structure in which a thermally conductive material (243) is arranged, for example. In one embodiment, the shielding sheet (245) may be pre-formed to cover components and / or the shield can (249) having different heights, and may provide a structure including an inclined surface or a curved surface through the pre-forming. As another example, the shielding sheet (245) may provide a three-dimensional (e.g., conformal) structure to encapsulate components of various sizes and shapes placed on a printed circuit board (240) into a single sheet, thereby providing a shielding function. According to one embodiment, the shielding sheet (245) may include a shielding film. According to one embodiment, the shielding sheet (245) may be a sheet made of a metallic material such as copper (Cu) to which an adhesive is attached. According to another embodiment, the shielding film may be composed of a fiber film made of a nanostructure to shield electromagnetic waves. The fiber film may be formed thinly and long by processing fibers based on an electrospinning method, and the fibers formed in this manner may be formed through an operation of plating with copper (Cu), then with nickel (Ni), and finally with copper (Cu) again. In addition to the above shielding function, the shielding sheet (245) can provide a heat transfer function for transferring heat that may be generated by at least one component (241) to the outside of at least one component (241).In one embodiment, the shielding sheet (245) may include a conductive adhesive film. In one embodiment, the shielding sheet (245) may be manufactured by laminating a plurality of layers.

[0098] According to one embodiment, heat generated from at least one component (241) can be transferred to another portion (e.g., support member (220)) through the opening of the shield can (249) and / or the heat-conductive material (243) and shield sheet (245) positioned on the opening. The heat transferred to the support member (220) can be transferred to a low-temperature region inside the electronic device (200) through the heat dissipation member (230).

[0099] Referring to FIG. 8, the heat dissipation member (230) may include a first plate (231) (e.g., an upper plate) and a second plate (232) (e.g., a lower plate). The first plate (231) and the second plate (232) may, when coupled together, form a chamber in which a working fluid may flow. For example, the heat dissipation member (230) may include a chamber portion (231a, 232a) and a flange portion (231b, 232b) provided at least at a portion of an edge of the chamber portion (231a, 232a). According to one embodiment, the flange portion (231b, 232b) is welded onto the support member (220), so that the heat dissipation member (230) may be stably fixed to the support member (220).

[0100] The heat dissipation member (230) may include a wick (or wick structure) (233) arranged inside the chamber and a plurality of fillers (231c). The plurality of fillers (231c) may serve to increase the durability of the heat dissipation member (230) and to guide the working fluid by partitioning at least a portion of the space of the chamber inside the heat dissipation member (230). The wick (233) may be a component such as a metal mesh, a metal ultra-fine fiber, or a sintered body of metal powder, and may be configured so that the liquid working fluid can flow inside the wick by a capillary phenomenon. In Fig. 8, a plurality of fillers (231c) are formed on the first plate (231) and the wick (233) is formed on the second plate (232), but this is merely an example and it should be noted that other forms of application are also possible. In one embodiment, the wick (233) may be disposed on the second plate (232) inside the heat dissipation member. Here, the wick (233) being disposed on the second plate (232) may mean, for example, that the wick (233) is disposed further on the second plate (232) than on the first plate (231). When the wick (233) is disposed on the second plate (232), for example, a portion of the wick (233) may come into contact with the inner surface of the second plate (232).

[0101] Referring to FIGS. 8 and 9 together, the heat dissipation member (230) may include a heat receiving portion (230-1), which is a portion where the working fluid is vaporized when heat is absorbed from a heat source disposed within the electronic device (200), and a heat dissipation portion (230-2), which is a portion where the working fluid is liquefied when heat is released. According to one embodiment, the wick (233) may be disposed across the heat dissipation portion (230-2) and the heat receiving portion (230-1). For example, the wick (233) may include a first portion (234) disposed in the heat receiving portion (230-1) and a second portion (235) disposed in the heat dissipation portion (230-2). In FIGS. 8 and 9, the heat dissipation member (230) is illustrated as being divided into a heat receiving portion (230-1) and a heat dissipation portion (230-2) based on an imaginary line C-C'. The heat dissipation member (230) may absorb heat from the entire heat receiving portion (230-1) divided based on the line C-C', but is not necessarily limited thereto, and may also absorb heat from a specific point. In addition, the heat dissipation member (230) may emit heat from the entire heat dissipation portion (230-2) divided based on the line C-C', but is not necessarily limited thereto, and may emit heat from a specific point.

[0102] Referring to Fig. 9, when heat is generated in the heat receiving portion (230-1), the working fluid is vaporized, and the vaporized working fluid (F1) can move to the heat dissipation portion (230-2) due to the pressure generated at this time. The working fluid that has moved to the heat dissipation portion (230-2) can be liquefied in the relatively cold heat dissipation portion (230-2), and the liquefied working fluid (F2) can move to the heat receiving portion (230-1) by the capillary force of the wick (233).

[0103] Fig. 10 is a cross-sectional view showing a heat dissipation structure of an electronic device according to one embodiment of the present disclosure. Fig. 11 is a cross-sectional view showing a heat dissipation member of an electronic device according to one embodiment of the present disclosure.

[0104] Referring to FIG. 10, an electronic device (300) according to an embodiment of the present disclosure may include a housing (e.g., housing (201) of FIG. 2), a display (310), and a printed circuit board (340). At least one component (341) (e.g., an integrated circuit chip) may be disposed on the printed circuit board (340). The electronic device (300) may include a heat dissipation structure disposed inside the housing (301), for example, between the display (310) and the printed circuit board (340). However, the present invention is not necessarily limited thereto, and an embodiment in which the heat dissipation structure is disposed between the printed circuit board (340) and a rear plate (e.g., the rear plate (211) of FIG. 3) may also be possible, as mentioned above in FIG. 7. For convenience of explanation, the following description will be based on an embodiment in which the heat dissipation structure is disposed between the display (310) and the printed circuit board (340). Hereinafter, in describing the electronic device (300) and / or the heat dissipation structure of FIG. 10, a detailed description thereof may be omitted to the extent that it overlaps with the electronic device (200) and / or the heat dissipation structure described above in FIG. 7.

[0105] The electronic device (300) and / or the heat dissipation structure may be configured to include at least a portion of a support member (320) disposed between the display (310) and the printed circuit board (340). The support member (320) (e.g., the first support member (220) of FIG. 4 or FIG. 5) may have a substantially flat shape and may be disposed at least partially in the space between the first side (or front side) (201A) of FIG. 2 or the second side (or back side) (201B) of FIG. 3. In one embodiment, the support member (320) may include a first side (320a) facing the display (310) and a second side (320b) facing the printed circuit board (340). According to one embodiment, the heat dissipation member (330) may be fixed on the first side (320a) of the support member (320) by a bonding member (321), such as a double-sided tape. In one embodiment, the heat dissipation member (330) may be secured to the support member (320) by welding. At least one component (341) may be disposed on a second surface (320b) of the support member (320). The at least one component (341) may be disposed on the second surface (320b) of the support member (320) while being disposed on one side of the printed circuit board (340). The electronic device (300) and / or the heat dissipation structure may include a heat dissipation member (330) disposed on one surface of the support member (e.g., the first surface (320a) of the support member (320)) and including a wick. The electronic device (300) and / or the heat dissipation structure may include a thermally conductive material (343) disposed in contact with the at least one component (341). The thermally conductive material (343) may include a thermal interface material (TIM). The thermal conductive material (343) may correspond to, for example, the thermal conductive material (243) described above in FIG. 7. The thermal conductive material (343) may be laminated on at least one component (341) in a space surrounded by a shield can (349) (e.g., the shield can (249) of FIG. 7).According to one embodiment, the thermally conductive material (343) may include a thermal interface material (TIM) and a thermally conductive block (347). In FIG. 10, the thermally conductive block (347) may be illustrated as being positioned between the thermally conductive material (343) formed of the TIM and the heat dissipation member (330). The thermally conductive block (347) is a block-shaped structure made of a material with high thermal conductivity, such as copper, and may transfer heat between the thermally conductive material (343) and the heat dissipation member (330). According to one embodiment, according to the embodiment illustrated in FIG. 10, an opening (322) may be formed in the support member (320) at a position corresponding to at least one component (341). The opening (322) may be formed by penetrating the shielding sheet (345) and the shield can (349). In addition, according to FIG. 10, a heat conductive block (347) may be placed in the opening (332). In FIG. 10, instead of the support member (320), a member having higher thermal conductivity than the support member (320), for example, a heat conductive block (347), is directly laminated and placed on at least one component (341) and a heat conductive material (343), thereby simplifying the laminated structure between the at least one component (341) and the heat dissipation member (330), and lowering the thermal resistance. Accordingly, a temperature improvement effect of lowering the high temperature formed in the at least one component (341) may be achieved. Referring to FIG. 11, the heat dissipation member (330) may include a first plate (331) (e.g., an upper plate) and a second plate (332) (e.g., a lower plate). The first plate (331) and the second plate (332) can be combined to form a chamber in which a working fluid can flow.For example, the heat dissipation member (330) may include a chamber portion (331a, 332a) and a flange portion (331b, 332b) provided on at least a portion of the edge of the chamber portion (331a, 332a). For example, the heat dissipation member (330) may include a plurality of fillers (331c).

[0106] An electronic device (300) and / or a heat dissipation structure according to one embodiment of the present disclosure may include a first portion (334) disposed in a heat receiving portion (330-1) as a wick (333) and a second portion (335) disposed in a heat dissipation portion (330-2). One of the first portion (334) or the second portion (335) may further include a reinforced wick portion (336) compared to the other portion. For example, the first portion (334) or the second portion (335) may be formed to be thicker than the second portion (335). According to one embodiment, the thicker first portion (334) may further include the reinforced portion (336) and thus be thicker than the second portion (335). Alternatively, the first portion (334) may be formed thicker than the second portion (335) itself. The reinforcing portion (336) may, according to one embodiment, be a third portion (336) that is different from the first portion (334) and / or the second portion (335). For example, the third portion (336) may be a portion that is physically distinct from the first portion (334) and / or the second portion (335). For example, when the first portion (334) and the second portion (335) are provided as substantially one wick (e.g., a first metal mesh), the third portion (336) may be provided as a wick (e.g., a second metal mesh) that is provided separately from the first portion (334) and the second portion (335). According to one embodiment, the third portion (336) may be made of a different material from the first portion (334) and / or the second portion (335). According to one embodiment, the reinforcing portion (e.g., the third portion (336)) may be formed by extending integrally from the first portion (334) or the second portion (335). For example, the reinforcing portion (336) may not be a physically separate portion from the first portion (334) and / or the second portion (335), but may be a portion that is substantially formed integrally with the first portion (334) and / or the second portion (335).For example, referring to FIG. 11, the reinforcing portion (336) may be laminated on the first portion (334) to provide an effect in which the first portion (334) is formed to be substantially thicker than the second portion (335). By including the reinforced wick (336), the electronic device (300) and / or the heat dissipation structure may increase the volume occupied by the element (wick (333)) for enhancing heat dissipation performance per unit volume of the space in which the working fluid flows within the heat dissipation member (330) at the location where the wick (333) is formed, thereby facilitating smoother movement of the liquid working fluid.

[0107] Fig. 12 is a drawing showing a heat dissipation member according to one embodiment of the present disclosure. Fig. 13 is a drawing showing a heat dissipation member according to one embodiment of the present disclosure. Fig. 14 is a drawing showing a heat conductive block arranged on the back surface of a heat dissipation member according to one embodiment of the present disclosure.

[0108] Fig. 12 is a drawing showing a heat dissipation member included in the electronic device (200) and / or heat dissipation structure shown in Fig. 7. Fig. 13 is a drawing showing a heat dissipation member included in the electronic device (300) and / or heat dissipation structure shown in Fig. 10. Figs. 12 and 13 may each show a form in which the first plate and the second plate of the heat dissipation member are separated. When Figs. 12 and 13 show the first plate and the second plate included in the heat dissipation member as viewed from above, Fig. 14 may show the heat dissipation member of Fig. 13 as viewed from below.

[0109] In the heat dissipation member, the heat receiving portion may have a first width (W1) (or a first cross-sectional area in the X-axis direction), and the heat dissipation portion may have a second width (W2) (or a second cross-sectional area in the X-axis direction). For example, in the heat dissipation member (230) illustrated in FIG. 12, the first width (W1) of the heat receiving portion and the second width (W2) of the heat dissipation portion may be formed to be substantially the same. In this case, the working fluid (e.g., liquefied working fluid (F2)) may flow without obstruction within the wick (333). In contrast, the heat dissipation member (330) illustrated in FIG. 13 may have the second width (W2) of the heat dissipation portion formed larger than the first width (W1) of the heat receiving portion to expand the heat dissipation area, thereby improving the performance of spreading heat of the heat dissipation member. In Fig. 13, the working fluid (e.g., liquefied working fluid (F2)) may not flow smoothly due to flow resistance when passing through the bottleneck portion (NP) within the wick (333). For example, when the working fluid moves from the heat dissipation portion to the heat receiving portion, the flow resistance may be high at the bottleneck portion (NP). According to one embodiment of the present disclosure, by arranging a reinforced wick (333) in a narrow portion (or a portion with a small cross-sectional area in the X-axis direction), the flow of the working fluid can be made smooth even when the widths (or cross-sectional areas) of the heat dissipation portion and the heat receiving portion are formed differently. For reference, Fig. 13 illustrates a case where the width of the heat dissipation portion corresponding to a position where a battery is arranged is wider than the width of the heat receiving portion corresponding to a position where at least one component is arranged, but the present invention is not necessarily limited thereto. For example, the width of the heat receiving portion may be wider than the width of the heat dissipation portion, and in this case, the reinforced wick may be arranged in the heat dissipation portion.

[0110] Additionally, the reinforced wick may be positioned over the entire area of ​​the heat-receiving portion or the heat-radiating portion, but is not necessarily limited thereto. For example, referring to FIGS. 13 and 14 together, the reinforced wick may be positioned only at a location corresponding to at least one component (341).

[0111] FIG. 15 is a cross-sectional view showing a shielding sheet according to one embodiment of the present disclosure.

[0112] Referring to FIGS. 10 and 15 together, the electronic device (300) and / or the heat dissipation structure of the present disclosure may further include a thermally conductive block (347) instead of the support member (320), and the thermally conductive block (347) may be positioned in at least a portion of the opening (322) formed in the support member (320). Accordingly, the shielding sheet (345) may not be formed at a position corresponding to at least one component (341). In order to ensure shielding performance in the electronic device (300) and / or the heat dissipation structure of the present disclosure, according to one embodiment of the present disclosure, a conductive shielding sheet may be further included as the shielding sheet (345). For example, the electronic device (300) and / or the heat dissipation structure may include a conductive shielding sheet including a compressible foam (345b) as a shielding sheet (345), a shielding film (345a) disposed on both sides of the compressible foam, and a conductive double-sided tape (345c). In addition, according to one embodiment, the electronic device (300) and / or the heat dissipation structure may apply a conductive double-sided tape as a double-sided tape (321) disposed between the support member (320) and the heat dissipation member (330). By including the conductive shielding sheet (345) and the conductive double-sided tape (321), when applying the electronic device (300) and / or the heat dissipation structure of the present disclosure, it is possible to compensate for a step difference between components, and prevent and / or reduce noise leakage.

[0113] Fig. 16 is a graph showing the temperature improvement effect of a heat dissipation structure according to one embodiment of the present disclosure. Figs. 17a and 17b are diagrams showing the temperature improvement effect of an electronic device according to one embodiment of the present disclosure.

[0114] FIG. 16 shows the time it takes for a target component to reach a controlled temperature when the electronic device (200) and / or the heat dissipation structure according to the embodiment of FIG. 7 are applied (G1), and the time it takes for a target component to reach a controlled temperature when the electronic device (300) and / or the heat dissipation structure according to the embodiment of FIG. 10 are applied (G2). The horizontal axis of FIG. 16 may represent the required time (sec), and the vertical axis may represent the reached temperature (°C). Referring to FIG. 16, it can be confirmed that the G2 graph has a faster time it takes to reach the controlled temperature than the G1 graph, thereby improving the response speed in controlling the target product. That is, the electronic device (300) according to the embodiment of FIG. 10 may have a superior heat dissipation effect compared to the electronic device (200) according to the embodiment of FIG. 7.

[0115] FIG. 17a illustrates the front temperature of an electronic device when the electronic device (200) and / or the heat dissipation structure according to the embodiment of FIG. 7 are applied. FIG. 17b may illustrate the front temperature of an electronic device when the electronic device (300) and / or the heat dissipation structure according to the embodiment of FIG. 10 are applied, and a heat dissipation member having a width of a heat dissipation portion greater than a width of a heat receiving portion according to the embodiment of FIG. 13 is applied. In the case of the electronic device (300) and / or the heat dissipation structure according to the embodiment of FIG. 10, the heat dissipation performance of at least one component can be improved since the thermal resistance performance is higher than that of the electronic device (200) and / or the heat dissipation structure. However, as the thermal resistance is lowered, the amount of heat transferred to the front surface of the electronic device increases, so the front temperature of the electronic device can be further increased. In order to prevent and / or avoid this, by applying a heat dissipation member (e.g., a large-area heat dissipation member) having a width of a heat dissipation member wider than a width of a heat receiving member, as in the embodiment illustrated in Fig. 13, it can be confirmed that the temperature improvement effect for the front surface of the electronic device is also achieved.

[0116] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains from the description of the above-described embodiment(s).

[0117] Electronic devices according to various embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, and home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0118] The various embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In the present disclosure, each of the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0119] The term "module" used in various embodiments of the present disclosure may include a unit implemented as hardware, software, firmware, or a combination thereof, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integrally configured component or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0120] Various embodiments of the present disclosure may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, "non-transitory" only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily in the storage medium.

[0121] According to one embodiment, the method according to various embodiments of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smartphones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0122] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0123] According to one embodiment of the present disclosure, an electronic device (101; 200; 300) may include: a housing (301) forming an exterior of the electronic device; a printed circuit board (340) having at least one component (341) disposed thereon; and a heat dissipation member (330) that contacts the at least one component or contacts the at least one component through a heat-conductive material (343) and includes a first plate (331), a second plate (332), and a wick (333). The wick (333) may be disposed at the second plate within the heat dissipation member and include a first portion (334) and a second portion (335), and the first portion may include a thickness that is thicker than the second portion.

[0124] According to one embodiment, the housing further includes a support member (320); wherein the heat dissipation member can be arranged on one surface of the support member.

[0125] In one embodiment, the thermally conductive material may include a thermal interface material (TIM) and a thermal conductive bloc.

[0126] According to one embodiment, the thermally conductive block may be placed on an opening (322) formed in the support member.

[0127] In one embodiment, the at least one component may contact the second plate, or the at least one component may contact the second plate through the thermally conductive material.

[0128] In one embodiment, the first portion may be in contact with the at least one component or the thermally conductive material, and the second portion may not be in contact with the at least one component or the thermally conductive material.

[0129] According to one embodiment, the first portion may further include a reinforced portion (336).

[0130] According to one embodiment, the first portion may be disposed on a portion having a relatively narrow width among a heat-receiving portion of the heat-dissipating member having a first width and a heat-dissipating portion of the heat-dissipating member having a second width.

[0131] According to one embodiment, the first portion may be arranged to include a bottleneck portion where the width of the heat dissipation member is narrowed.

[0132] According to one embodiment, the heat dissipation member may include a battery at least partially disposed on the same plane as the circuit board, a heat-receiving portion of the heat dissipation member may be disposed at a position corresponding to the at least one component, and a heat dissipation portion of the heat dissipation member may be disposed at a position corresponding to the battery.

[0133] According to one embodiment, the shield can (349) may be disposed on a printed circuit board and arranged to surround at least a portion of at least one component, and may include a shield sheet (345) laminated over at least a portion of the shield can.

[0134] In one embodiment, the shielding sheet may be a conductive shielding sheet.

[0135] In one embodiment, the shielding sheet may include a compressible foam, a shielding film disposed on both sides of the compressible foam, and a conductive double-sided tape.

[0136] According to one embodiment, a conductive double-sided tape may be included between the support member and the heat dissipation member.

[0137] According to one embodiment, the heat dissipation member may include at least one of copper, stainless steel, aluminum, titanium, or magnesium.

[0138] According to one embodiment of the present disclosure, an electronic device (101; 200; 300) may include: a housing (301) including a first surface and a second surface facing in an opposite direction to the first surface; a support member (320) accommodated in the housing between the first surface and the second surface; a heat dissipation member (330) disposed on one surface of the support member and including a wick structure; a printed circuit board (340) accommodated in the housing between the first surface and the second surface and having at least one component (341) disposed thereon; and a thermal conductive block (347) disposed between the at least one component (341) and the heat dissipation member (330). The wick includes a first portion (334) arranged in the heat-conducting portion and a second portion (335) arranged in the heat-radiating portion, and one of the first portion or the second portion may further include a reinforced wick portion (336) compared to the other portion.

[0139] According to one embodiment, the heat receiving portion has a first width, the heat dissipating portion has a second width, and the reinforcing portion can be disposed at a portion having a relatively narrower width among the first width of the heat receiving portion or the second width of the heat dissipating portion.

[0140] According to one embodiment, the reinforcing portion may be arranged to include a bottleneck portion where the width of the heat dissipation member is narrowed.

[0141] According to one embodiment, the heat dissipation member may include a battery at least partially disposed on the same plane as the circuit board, a heat-receiving portion of the heat dissipation member may be disposed at a position corresponding to the at least one component, and a heat dissipation portion of the heat dissipation member may be disposed at a position corresponding to the battery.

[0142] According to one embodiment, the device may further include a thermal interface material (343) disposed between the at least one component (341) and the thermally conductive block and in contact with the at least one component (341).

[0143] According to one embodiment, the thermally conductive block may be placed on an opening (322) formed in the support member.

[0144] In one embodiment, the thermally conductive block may be configured to contact the heat dissipating member and the thermally conductive material.

[0145] According to one embodiment, the shield can may include a shield sheet (345) laminated over at least a portion of the shield can.

[0146] In one embodiment, the shielding sheet may be a conductive shielding sheet.

[0147] In one embodiment, the shielding sheet may include a compressible foam, a shielding film disposed on both sides of the compressible foam, and a conductive double-sided tape.

[0148] According to one embodiment, a conductive double-sided tape may be included between the support member and the heat dissipation member.

[0149] According to one embodiment, the heat dissipation member may include at least one of copper, stainless steel, aluminum, titanium, or magnesium.

[0150] According to one embodiment, the heat dissipation member includes a first plate (331) and a second plate (332) that provide a space for the working fluid to flow, and the wick may be disposed adjacent to the second plate (332) and the filler may be formed adjacent to the first plate (331).

[0151] In one embodiment, the reinforced wick may be a third portion different from the first portion and / or the second portion.

[0152] In one embodiment, the reinforced wick may be formed by extending integrally from the first portion or the second portion.

[0153] According to one embodiment of the present disclosure, an electronic device (101; 300) may include a housing (301) including a first surface and a second surface facing in an opposite direction of the first surface; a support member (320) accommodated in the housing between the first surface and the second surface; and a heat receiving portion (330-1) supported by the support member and configured to vaporize a working fluid based on absorption of heat from a heat source disposed within the electronic device, a heat dissipation portion (330-2) configured to liquefy a working fluid based on release of heat, and a heat dissipation portion (330) including a wick structure disposed in the heat receiving portion and the heat dissipation portion. The wick includes a first portion (334) arranged in the heat-conducting portion and a second portion (335) arranged in the heat-dissipating portion, and one of the first portion or the second portion may further include a reinforced wick portion (336) compared to the other portion.

[0154] According to one embodiment, the heat dissipation portion has a first width, the heat receiving portion has a second width, and the reinforcing portion can be disposed in a portion having a relatively narrower width among the first width of the heat dissipation portion or the second width of the heat receiving portion.

[0155] According to one embodiment, it may include a printed circuit board (340) having at least one component (341) disposed between the first side and the second side and accommodated in the housing and at least partially surrounded by a shield can (349); a thermally conductive material (343) disposed in contact with the at least one component (341); and a thermally conductive block (347) disposed between the thermally conductive material (343) and a heat dissipation member (330).

[0156] According to one embodiment, the shield can may include a conductive shielding sheet (345) laminated over at least a portion of the shield can.

[0157] According to one embodiment, a conductive double-sided tape may be included between the support member and the heat dissipation member.

[0158] While this disclosure has been described by way of example and example, it should be understood that the example is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

Claims

1. In an electronic device (101; 200; 300), A housing (301) forming the appearance of the electronic device; A printed circuit board (340) having at least one component (341) arranged thereon; and A heat dissipation member (330) that is in contact with at least one of the above components or is in contact through a heat-conducting material (343), and includes a first plate (331), a second plate (332) and a wick (333); An electronic device in which the wick (333) is disposed at the second plate inside the heat dissipation member and includes a first portion (334) and a second portion (335), the first portion having a thicker thickness than the second portion.

2. In paragraph 1, Further comprising a support member (320) accommodated in the housing; The above heat dissipation member is an electronic device arranged on one side of the above support member.

3. In paragraph 1 or 2, The above thermally conductive material is an electronic device including a TIM (Thermal Interface Material) and a thermally conductive bloc.

4. In paragraph 3, The above thermally conductive block is an electronic device placed on an opening (322) formed in the above support member.

5. In any one of paragraphs 1 to 4, An electronic device wherein at least one component contacts the second plate, or wherein the at least one component contacts the second plate through the thermally conductive material.

6. In any one of paragraphs 1 to 5, The above first part is in contact with the at least one component or the heat-conducting material, The second part is an electronic device that does not contact the at least one component and the thermally conductive material.

7. In any one of paragraphs 1 to 6, An electronic device wherein the first portion further includes a reinforced portion (336).

8. In any one of paragraphs 1 to 7, An electronic device in which the first part is arranged on a part having a relatively narrow width among the heat-receiving part of the heat-dissipating member having the first width and the heat-dissipating part of the heat-dissipating member having the second width.

9. In any one of paragraphs 1 to 8, An electronic device in which the first portion is arranged including a bottleneck portion in which the width of the heat dissipation member is narrowed.

10. In any one of paragraphs 1 to 9, An electronic device comprising a battery at least partly disposed on the same plane as the circuit board, the heat-receiving portion of the heat-dissipating member being disposed at a position corresponding to the at least one component, and the heat-dissipating portion of the heat-dissipating member being disposed at a position corresponding to the battery.

11. In any one of paragraphs 2 to 10, A shield can (349) disposed on a printed circuit board and arranged to surround at least a portion of at least one component, An electronic device comprising a shielding sheet (345) laminated over at least a portion of the shield can.

12. In paragraph 11, The above shielding sheet is an electronic device which is a conductive shielding sheet 13. In clause 11 or 12, An electronic device comprising the above shielding sheet, a compressible foam, a shielding film disposed on both sides of the compressible foam, and / or a conductive double-sided tape.

14. In any one of paragraphs 2 to 13, An electronic device comprising a conductive double-sided tape disposed between the support member and the heat dissipation member.

15. In any one of paragraphs 1 to 14, An electronic device wherein the heat dissipation member comprises at least one of copper, stainless steel, aluminum, titanium, or magnesium.

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