Pickup system, joining device, sorting device, and pickup method

Abstract

A pickup system (100) comprises: a push-up unit (34) that pushes up a chip (6a) that is stuck on an adhesive sheet (6b), with the adhesive sheet (6b) being interposed therebetween; a component holding unit (15) that has a vertically movable pickup nozzle (14a) having an opening (14b), and holds the chip (6a) in a non-contact manner by using the pickup nozzle (14a); a negative pressure generation part (153) that generates a negative pressure around the opening (14b) of the pickup nozzle (14a); an ultrasonic wave generation unit (152) that generates an ultrasonic wave by vibrating the pickup nozzle (14a); and a control unit (101), wherein the control unit (101) causes the ultrasonic wave generation unit (152) to generate an ultrasonic wave, then causes the push-up unit (34) to push up the chip (6a), causes the negative pressure generation unit (153) to generate a negative pressure in a state in which the ultrasonic wave is being generated, and causes the component holding unit (15) to hold the chip (6a) in a non-contact manner.

Description

Pickup system, joining device, sorting device, and pickup method

[0001] The present disclosure relates to a system for picking up parts and the like.

[0002] To improve the functionality of semiconductor packages, hybrid bonding that does not use bumps or bonding materials is required. In hybrid bonding, the semiconductor chip is bonded to a substrate or other device using hydrogen bonding or other methods while the surface of the semiconductor chip is kept clean. Therefore, in hybrid bonding, the surface of the semiconductor chip must be kept highly clean from the time it is picked up from the adhesive sheet dicing tape until it is bonded.

[0003] To address this issue, a manufacturing device has been proposed that holds the semiconductor chips, which have been pushed up by the push-up pins, in a non-contact manner (see, for example, Patent Document 1). Such a manufacturing device can be said to be equipped with a pickup system that picks up the semiconductor chips as components. The pickup system in Patent Document 1 holds the pushed-up semiconductor chips in a non-contact manner using ultrasonic holding force and suction force.

[0004] Japanese Patent Application Laid-Open No. 2023-45216

[0005] However, the pickup system of Patent Document 1 has a problem in that poor bonding is likely to occur.

[0006] For example, if a semiconductor chip with particles adhering thereto is bonded to a substrate, the particles will become trapped between the semiconductor chip and the substrate, causing voids and resulting in poor bonding.

[0007] Therefore, the present disclosure provides a pickup system that can suppress the occurrence of poor bonding.

[0008] A pickup system according to one aspect of the present disclosure comprises a push-up unit that pushes up a component attached to an adhesive sheet through the adhesive sheet, a component holding unit that has a holding tool with an opening that can be raised and lowered and that uses the holding tool to hold the component in a non-contact manner, a negative pressure generating unit that generates negative pressure around the opening of the holding tool, an ultrasonic wave generating unit that generates ultrasonic waves by vibrating the holding tool, and a control unit that controls the push-up unit, the component holding unit, the negative pressure generating unit, and the ultrasonic wave generating unit, wherein the control unit causes the ultrasonic wave generating unit to generate the ultrasonic waves and then causes the push-up unit to push up the component, and while the ultrasonic waves are being generated, causes the negative pressure generating unit to generate the negative pressure, thereby causing the component holding unit to hold the component in a non-contact manner.

[0009] These comprehensive or specific aspects may be realized as a system, a method, an integrated circuit, a computer program, or a computer-readable recording medium such as a CD-ROM, or may be realized as any combination of a system, a method, an integrated circuit, a computer program, and a recording medium. The recording medium may also be a non-transitory recording medium.

[0010] The pickup system of the present disclosure can suppress the occurrence of poor bonding.

[0011] Further advantages and effects of one aspect of the present disclosure will become apparent from the specification and drawings. Such advantages and / or effects are provided by some of the embodiments and configurations described in the specification and drawings, but not necessarily all of the configurations.

[0012] FIG. 1 is a perspective view of a component mounting apparatus according to an embodiment. FIG. 2 is a diagram illustrating an operation of the component mounting apparatus according to an embodiment to mount a chip on a substrate. FIG. 3 is a diagram illustrating an example of the configuration of a pickup system according to an embodiment. FIG. 4 is a diagram illustrating an example of a case where a chip having particles attached thereto is picked up. FIG. 5A is a diagram illustrating an example of an operation of a pickup nozzle according to an embodiment to pick up a chip. FIG. 5B is a diagram illustrating an example of an operation of a pickup nozzle according to an embodiment to pick up a chip. FIG. 6 is a diagram illustrating that the magnitude of air vibration at a position around the pickup nozzle varies depending on the position. FIG. 7 is a diagram illustrating an example of the movement of a pickup nozzle according to a first modification of an embodiment. FIG. 8 is a diagram illustrating charge removal according to a second modification of an embodiment. FIG. 9 is a diagram illustrating air blowing according to a third modification of an embodiment. FIG. 10 is a diagram illustrating control of the descent speed of the pickup nozzle according to a fourth modification of an embodiment. FIG. 11 is a diagram illustrating an example of the configuration of a pickup system according to a fifth modification of an embodiment. FIG. 12 is a flowchart illustrating an example of a schematic processing operation performed by a control unit according to an embodiment.

[0013] A pickup system according to a first aspect of the present disclosure comprises a push-up unit that pushes up a component affixed to an adhesive sheet through the adhesive sheet, a component holding unit that has a holding tool with an opening that can be raised and lowered and that uses the holding tool to hold the component in a non-contact manner, a negative pressure generating unit that generates negative pressure around the opening of the holding tool, an ultrasonic wave generating unit that generates ultrasonic waves by vibrating the holding tool, and a control unit that controls the push-up unit, the component holding unit, the negative pressure generating unit, and the ultrasonic wave generating unit, wherein the control unit causes the ultrasonic wave generating unit to generate the ultrasonic waves and then causes the push-up unit to push up the component, and while the ultrasonic waves are being generated, causes the negative pressure generating unit to generate the negative pressure, thereby causing the component holding unit to hold the component in a non-contact manner.

[0014] As a result, ultrasonic waves are generated when the component is not being pushed up and is in a stable state, so that particles adhering to the component can be removed by the ultrasonic waves. In other words, ultrasonic waves with a large sound pressure or output can be generated while suppressing tilt of the component, and particles can be effectively removed by the ultrasonic waves. Therefore, when the component is held in a non-contact state and bonded to a substrate, etc., it is possible to suppress the generation of voids caused by particles getting caught between the component and the substrate, and as a result, it is possible to suppress the occurrence of bonding defects. Note that the generation of ultrasonic waves may be started at any timing as long as it is before the component is pushed up. Also, if negative pressure is generated when the component is held in a non-contact state, the generation of the negative pressure may be started at any timing. Also, ultrasonic waves and negative pressure may be generated continuously.

[0015] In a second aspect, the control unit may cause the ultrasonic generator to generate a first ultrasonic wave as the ultrasonic wave, and then cause the push-up unit to push up the component, and cause the negative pressure generator to generate the negative pressure while generating a second ultrasonic wave as the ultrasonic wave, thereby causing the component holder to hold the component in a non-contact manner, wherein the first ultrasonic wave is generated by vibrating the holding tool at a first vibration velocity, and the second ultrasonic wave is generated by vibrating the holding tool at a second vibration velocity that is slower than the first vibration velocity. Note that the second aspect may be dependent on the first aspect.

[0016] As a result, when a component is held in a non-contact manner, the generated ultrasonic waves are switched from the first ultrasonic waves to the second ultrasonic waves, i.e., the sound pressure or output of the ultrasonic waves is reduced, thereby reducing the negative pressure generated by the negative pressure generating unit and enabling efficient non-contact holding of the component. Furthermore, when the component is pushed up by the push-up unit while the second ultrasonic waves are being generated, tilting of a component that becomes unstable due to the push-up due to high output ultrasonic waves can be prevented. In other words, component holding errors or improper component holding can be prevented. The generated ultrasonic waves may be switched from the first ultrasonic waves to the second ultrasonic waves before the component is pushed up.

[0017] In a third aspect, the control unit may gradually change the vibration speed of the holding tool from the first vibration speed to the second vibration speed by controlling the ultrasonic generator. Note that the third aspect may be dependent on the second aspect.

[0018] This suppresses sudden changes in the vibration velocity of the holding tool, thereby stabilizing the operation of the pickup system. Furthermore, if the sound pressure and output of the ultrasonic waves change suddenly, particles that have been removed may re-adhere to the component. However, in the third aspect, sudden changes in the sound pressure and output of the ultrasonic waves can be suppressed, thereby preventing particles from re-adhering to the component.

[0019] In the fourth aspect, the first vibration velocity may be 100 mm / s or more and 3000 mm / s or less. The fourth aspect may be dependent on the second or third aspect.

[0020] This allows ultrasonic waves with a high sound pressure to be output, effectively removing particles adhering to components.

[0021] In the fifth aspect, the second vibration velocity may be equal to or greater than 10 mm / s and equal to or less than 1000 mm / s. Note that the fifth aspect may be dependent on the second or third aspect.

[0022] This allows the part to be, for example, 1 to 10 mm３ In the case of a silicon chip having a volume of 1000 rpm, the silicon chip can be held appropriately without contact. Note that the larger the silicon chip, the heavier it becomes, so it is necessary to increase the negative pressure generated by the negative pressure generating unit to increase the suction force that attracts the silicon chip. Therefore, the larger the silicon chip, the greater the repulsive force that separates the silicon chips using ultrasonic waves must be, so the second vibration speed may be increased within the above-mentioned range.

[0023] In a sixth aspect, the control unit may control the component holder to alternately move the holding tool upward and downward while the ultrasonic generator is generating the ultrasonic waves. Note that the sixth aspect may be dependent on any one of the first to fifth aspects.

[0024] This increases the likelihood that a large sound pressure will be applied to the component, even if the sound pressure of the ultrasonic wave at a position at a distance varies depending on the distance from the holding tool, as the holding tool moves up and down, thereby effectively removing particles adhering to the component.

[0025] In a seventh aspect, the control unit may move the holding tool by a distance equal to or greater than half the wavelength of the ultrasonic wave between the upward movement and the downward movement. Note that the seventh aspect may be dependent on the sixth aspect.

[0026] This makes it possible to increase or decrease the sound pressure applied to the component, i.e., to increase the fluctuation range of the sound pressure, thereby shaking particles adhering to the component and making them easier to remove from the component. Furthermore, if a standing wave is generated by the ultrasonic waves, it is possible to increase the possibility of setting the antinode of the standing wave at the position of the particle, thereby making it possible to remove the particle more effectively.

[0027] In an eighth aspect, the pickup system may further include a static eliminator that supplies ions to the component, and the control unit may cause the static eliminator to supply the ions while the ultrasonic waves are being generated before causing the push-up unit to push up the component. Note that the eighth aspect may be dependent on any one of the first to seventh aspects.

[0028] This allows the ions supplied from the static eliminator to eliminate static electricity from the components and particles adhering to those components, so that in cases where particles have adhered to the components due to static electricity, the particles can be more easily removed from the components, thereby making it possible to remove particles more effectively.

[0029] In a ninth aspect, the pickup system may further include a positive pressure generating unit that generates a positive pressure around the opening of the holding tool, and the control unit may cause the positive pressure generating unit to generate a positive pressure around the opening of the holding tool while the ultrasonic waves are being generated before causing the push-up unit to push up the component. Note that the ninth aspect may be dependent on any one of the first to eighth aspects.

[0030] This generates positive pressure and blows air onto the component, effectively removing particles adhering to the component.

[0031] In a tenth aspect, when the control unit causes the positive pressure generating unit to stop generating the positive pressure, the control unit may control the positive pressure generating unit to gradually reduce the positive pressure. Note that the tenth aspect may be dependent on the ninth aspect.

[0032] In an eleventh aspect, the control unit may bring the holding tool close to the component while the ultrasonic waves are being generated before causing the push-up unit to push up the component. Note that the eleventh aspect may be dependent on any one of the first to tenth aspects.

[0033] This allows the holding tool to approach the component, thereby applying air pressure to the component, which effectively removes particles adhering to the component.

[0034] For example, if the generation of positive pressure is suddenly stopped, particles that were once removed may re-adhere to the component. However, in the eleventh aspect, the generation of positive pressure is not suddenly stopped, so that particles can be prevented from re-adhering to the component.

[0035] In a twelfth aspect, the pickup system may further include an air supply device that supplies air toward the component. Note that the twelfth aspect may be dependent on any one of the first to eleventh aspects.

[0036] This allows particles adhering to the parts to be removed more effectively.

[0037] In a thirteenth aspect, the pickup system may further include a collection box disposed to surround the component for collecting particles scattered by the air. Note that the thirteenth aspect may be dependent on the twelfth aspect.

[0038] As a result, the removed particles are collected in the collection box, and the particles can be appropriately prevented from adhering again to the components.

[0039] In a fourteenth aspect, the collection box may have a ring shape. Note that the fourteenth aspect may be dependent on the thirteenth aspect.

[0040] This makes it possible to collect particles regardless of the direction in which the particles scatter from the component, and more appropriately prevent the particles from adhering to the component again.

[0041] In a fifteenth aspect, the control unit may start lowering the holding tool while the ultrasonic generator is generating the ultrasonic waves. Note that the fifteenth aspect may be dependent on any one of the first to fourteenth aspects.

[0042] As a result, after the holding tool is lowered, ultrasonic waves are already generated, so the component can be held by the holding tool smoothly and without contact.

[0043] In a sixteenth aspect, the control unit may start lowering the holding tool while the negative pressure generating unit is generating the negative pressure. Note that the sixteenth aspect may be dependent on any one of the first to fifteenth aspects.

[0044] As a result, after the holding tool is lowered, a negative pressure is already generated, so that the holding tool can smoothly hold the component without contacting it.

[0045] A joining device according to a seventeenth aspect of the present disclosure includes the pickup system according to any one of the first to sixteenth aspects, and a joining unit that joins the component held by the component holder to another component, which may be a substrate.

[0046] As a result, the joining device according to the seventeenth aspect can achieve the same effect as that achieved by any one of the first to sixteenth aspects.

[0047] A sorting device according to an eighteenth aspect of the present disclosure includes the pickup system according to any one of the first to sixteenth aspects, and holds the components. The sorting device is, for example, a semiconductor chip sorter.

[0048] As a result, the sorting device according to the eighteenth aspect can achieve the same effect as that achieved by any one of the first to sixteenth aspects.

[0049] Hereinafter, the embodiments will be specifically described with reference to the drawings.

[0050] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, component placement and connection configurations, steps, and step order shown in the following embodiments are merely examples and are not intended to limit the present disclosure. Furthermore, among the components in the following embodiments, components that are not described in the independent claims that represent the highest concepts are described as optional components. Furthermore, each drawing is a schematic diagram and is not necessarily an exact illustration. Furthermore, the same components are designated by the same reference numerals in each drawing.

[0051] (Embodiment) FIG. 1 is a perspective view of a component mounting apparatus according to the present embodiment.

[0052] The component mounting apparatus 1 in this embodiment picks up components and mounts the picked-up components on the substrate 7. Therefore, the component mounting apparatus 1 in this embodiment is equipped with a pickup system that picks up components. Mounting components on the substrate 7 is also referred to as bonding the components to the substrate 7. Therefore, the component mounting apparatus 1 is also referred to as a bonding apparatus. The substrate 7 in this embodiment is not limited to a specific type of substrate and may be a silicon substrate, a component, a silicon chip, or the like. In this disclosure, the vertical direction is referred to as the Z-axis direction or up-down direction, a direction in a plane perpendicular to the vertical direction is referred to as the Y-axis direction, left-right direction, or lateral direction, and a direction perpendicular to the Y-axis direction in the perpendicular plane is referred to as the X-axis direction or depth direction. In this disclosure, the positive side of the Z-axis direction is upward or up, and the negative side of the Z-axis direction is downward or down. In this disclosure, the positive side of the Y-axis direction is the right side or right, and the negative side of the Y-axis direction is the left side or left. In addition, in the present disclosure, the positive side in the X-axis direction is the rear side or the back, and the negative side in the X-axis direction is the front side or the front.

[0053] The component mounting device 1 includes a base 2, a component supply unit 3, a board holding unit 5, a component holding unit 15, a frame 11, a Y-axis drive mechanism 12, a component mounting unit 13, and a pickup camera 21. The base 2 is the base of the component mounting device 1 and supports each of the components included in the component mounting device 1.

[0054] The component supply unit 3 is placed on the base 2 and supplies components to the component holder 15. The component supply unit 3 includes a holding table 3a, an XY table mechanism 31, a movable plate 32, and multiple support members 33. The holding table 3a holds the semiconductor wafer unit 6 aligned horizontally. The semiconductor wafer unit 6 includes an adhesive sheet 6b and multiple chips 6a. The multiple chips 6a are individual pieces or semiconductor chips obtained by dicing a semiconductor wafer, and are components supplied by the component supply unit 3 and mounted on the substrate 7. The adhesive sheet 6b is an adhesive sheet. The multiple chips 6a are affixed to the upper surface of the adhesive sheet 6b. Each of the multiple support members 33 is a columnar member placed on the movable plate 32 so as to stand upright from the movable plate 32. The multiple support members 33 support the holding table 3a while separating the semiconductor wafer unit 6 held by the holding table 3a above the movable plate 32. The movable plate 32 is a plate placed on the XY table mechanism 31. The XY table mechanism 31 moves the movable plate 32 in the X-axis direction and the Y-axis direction. As the movable plate 32 moves, the semiconductor wafer unit 6 moves in the X-axis direction and the Y-axis direction. In other words, the multiple chips 6a move along the XY plane.

[0055] The pickup camera 21 is disposed above the component supply section 3 and captures an image of the chip 6 a to be picked up from the semiconductor wafer unit 6 .

[0056] The substrate holder 5 holds the substrate 7 in a horizontally aligned state. Such a substrate holder 5 is provided with transport rails 5a. The substrate holder 5 positions and holds the substrate 7 transported by the transport rails 5a at a mounting position. The mounting position is a position where the chip 6a is mounted.

[0057] The component holder 15 includes an arm 15a, a PHDM mechanism 15b, and the PHDM 14. The arm 15a is a columnar member attached to the PHDM mechanism 15b along the X-axis. That is, one longitudinal end (i.e., the base end) of the arm 15a is attached to the PHDM mechanism 15b. The PHDM 14 is attached to the other end (i.e., the tip end) of the arm 15a.

[0058] The PHDM mechanism 15b is suspended from the Y-axis frame 11b of the frame 11 and moves the arm 15a in the X-axis, Y-axis, and Z-axis directions. Furthermore, the PHDM mechanism 15b rotates the arm 15a around a central axis along the longitudinal direction of the arm 15a. That is, the PHDM mechanism 15b rotates the arm 15a around the X-axis. The PHDM 14 is attached to the tip of the arm 15a as described above. The PHDM 14 also includes a metal pickup nozzle 14a that holds the chip 6a in a non-contact manner using vacuum suction and ultrasonic waves. Note that vacuum suction is an operation of sucking air. Therefore, the PHDM nozzle 14a is driven by the PHDM mechanism 15b to move in the X-axis, Y-axis, and Z-axis directions and rotate around the X-axis. The PHDM mechanism 15b also moves the pickup nozzle 14a based on the image captured by the pickup camera 21. This allows the pickup head moving mechanism 15b to lower the pickup nozzle 14a and bring it accurately close to the top surface of the chip 6a to be picked up. The pickup nozzle 14a in this embodiment is also called simply a nozzle and is an example of a holding tool having an opening for holding the chip 6a in a non-contact manner by vacuum suction and ultrasonic waves.

[0059] As described above, the component holder 15 in this embodiment has a holding tool, which is a pickup nozzle 14a with an opening that can be raised and lowered, and holds the chip 6a attached to the adhesive sheet 6b from above. Specifically, the component holder 15 uses the holding tool to hold the chip 6a without contact. In other words, the chip 6a is picked up without contact.

[0060] The frame 11 is disposed on the positive side of the X-axis direction on the base 2, and includes two support posts 11a and a long Y-axis frame 11b. The two support posts 11a support the Y-axis frame 11b while the Y-axis frame 11b is aligned along the Y-axis direction and spaced above the top surface of the base 2. In other words, the Y-axis frame 11b is suspended by the two support posts 11a. As described above, the pickup head moving mechanism 15b is suspended from this Y-axis frame 11b.

[0061] The Y-axis drive mechanism 12 is attached to the surface of the Y-axis frame 11b on the negative side in the X-axis direction, and moves the component mounting unit 13 in the Y-axis direction. The component mounting unit 13 includes a mounting unit 20. The component mounting unit 13 receives the chip 6a held by the pickup nozzle 14a using the mounting unit 20, and mounts the chip 6a on the board 7 positioned at the mounting position. The component mounting unit 13 is an example of a joining unit that joins the chip 6a held by the component holder 15 to another component, such as the board 7.

[0062] FIG. 2 is a diagram for explaining the operation of component mounting apparatus 1 to mount chip 6 a on substrate 7 .

[0063] The component mounting device 1 picks up a chip 6a that is positioned at a predetermined pick-up work position P in the XY plane from among multiple chips 6a attached to an adhesive sheet 6b, and mounts the chip 6a on a substrate 7.

[0064] Specifically, the XY table mechanism 31 moves the moving plate 32 in the X-axis direction and the Y-axis direction to place the chip 6 a to be picked up at the pick-up work position P. The chip 6 a to be picked up that has been placed at the pick-up work position P is pushed up by the push-up section 34.

[0065] 2, the component mounting apparatus 1 in this embodiment is provided with a push-up unit 34 arranged at the pick-up operation position P. The push-up unit 34 may also be provided in the component supply unit 3. The push-up unit 34 pushes up the chip 6a attached to the adhesive sheet 6b from below to above via the adhesive sheet 6b. Specifically, the push-up unit 34 pushes up the chip 6a to be picked up that is arranged at the pick-up operation position P.

[0066] The pickup camera 21 is disposed above the component supply unit 3 and at the pickup operation position P. The pickup camera 21 captures an image of the pickup operation position P and its surroundings among the multiple chips 6a attached to the adhesive sheet 6b from above the component supply unit 3. This captures an image of the chip 6a to be picked up, and the position of the chip 6a to be picked up is recognized based on the image capture result. In other words, the position of the chip 6a is recognized.

[0067] The pickup nozzle 14a of the pickup head 14 is lowered by the drive of the pickup head movement mechanism 15b, approaches from above the chip 6a whose position has been recognized based on the image capture results of the pickup camera 21, and holds the chip 6a. The pickup nozzle 14a then rises while holding the chip 6a, and further moves, for example, to the negative side in the Y-axis direction. Here, the pickup nozzle 14a faces upward with the lower surface (i.e., the bottom surface) of the held chip 6a as a result of the rotation of the arm 15a by the pickup head movement mechanism 15b. As a result, the chip 6a is held upside down by the pickup nozzle 14a.

[0068] 2, the component mounting section 13 includes not only the mounting unit 20 but also a movable plate 13a, an elevating mechanism 13b, and an elevating plate 13c. The movable plate 13a is attached to the Y-axis driving mechanism 12 so as to be movable in the Y-axis direction. In other words, the movable plate 13a moves in the Y-axis direction by being driven by the Y-axis driving mechanism 12.

[0069] The lifting mechanism 13b is attached to the front of the moving plate 13a and raises and lowers the lifting plate 13c. A mounting unit 20 is attached to the lower part of the lifting plate 13c. The mounting unit 20 has a component mounting nozzle 20a. The component mounting nozzle 20a receives the chip 6a from the pickup nozzle 14a, which holds the chip 6a in an upside-down state, for example. For example, the component mounting nozzle 20a is moved above the chip 6a by the driving of the Y-axis drive mechanism 12 and the lifting mechanism 13b, and holds the chip 6a by, for example, vacuum suction. Then, while holding the chip 6a, the component mounting nozzle 20a moves toward the substrate 7 along the Y-axis direction and mounts the chip 6a on the substrate 7.

[0070] FIG. 3 is a diagram showing an example of the configuration of a pickup system according to this embodiment.

[0071] The pickup system 100 in this embodiment is a system provided in the component mounting apparatus 1, and includes, for example, the component holding unit 15, the push-up unit 34, and the control unit 101 described above.

[0072] The component holder 15 includes a holder body 15c and a pickup nozzle 14a. The holder body 15c is composed of, for example, the arm 15a, the pickup head moving mechanism 15b, and the pickup head 14 except for the pickup nozzle 14a. The holder body 15c includes an ultrasonic generator 152, a negative pressure generator 153, and a driver 154.

[0073] The ultrasonic wave generator 152 vibrates the pick-up nozzle 14a (i.e., ultrasonic vibrations), thereby generating ultrasonic waves from around the opening 14b of the pick-up nozzle 14a. In other words, the pick-up nozzle 14a ultrasonically vibrates in the up-and-down direction, and the vibrations are transmitted to the air in contact with the underside of the pick-up nozzle 14a. For example, the ultrasonic wave generator 152 ultrasonically vibrates the pick-up nozzle 14a with a maximum amplitude of about 10 to 20 μm.

[0074] Negative pressure generator 153 generates negative pressure around opening 14b of pick-up nozzle 14a. In this embodiment, negative pressure generator 153 is configured as, for example, a vacuum pump. Negative pressure generator 153 generates negative pressure around opening 14b by creating a negative pressure in air flow path 14c, which is a flow path formed in pick-up nozzle 14a and communicates with opening 14b. In other words, negative pressure generator 153 generates negative pressure around opening 14b by sucking air around opening 14b through flow path 14c.

[0075] The drive unit 154 includes, for example, a motor and moves the pickup nozzle 14a in the X-axis, Y-axis, and Z-axis directions. The drive unit 154 also rotates the arm 15a, thereby rotating the pickup nozzle 14a of the pickup head 14 attached to the tip of the arm 15a. The drive unit 154 is incorporated into, for example, the pickup head moving mechanism 15b.

[0076] The push-up unit 34 has a plurality of push-up pins 34a, and raises and lowers the plurality of push-up pins 34a. The plurality of push-up pins 34a rise and push up the adhesive sheet 6b, thereby pushing up the chips 6a attached to the adhesive sheet 6b.

[0077] The control unit 101 controls the push-up unit 34 and the component holder 15. That is, the control unit 101 controls the push-up unit 34, the ultrasonic generator 152, the negative pressure generator 153, and the driver 154.

[0078] In this embodiment, the component holding unit 15 includes an ultrasonic wave generating unit 152 and a negative pressure generating unit 153, but the ultrasonic wave generating unit 152 and the negative pressure generating unit 153 do not have to be included in the component holding unit 15.

[0079] FIG. 4 is a diagram showing an example of a case where a chip 6a having particles attached thereto is picked up.

[0080] For example, as shown in FIG. 4A, a chip 6a to be picked up is placed at the pick-up operation position P. At this time, particles 91 adhere to the upper surface of the chip 6a to be picked up. Next, as shown in FIG. 4B, the push-up unit 34 raises multiple push-up pins 34a to push up the chip 6a through the adhesive sheet 6b. Thereafter, as shown in FIG. 4C, the pickup nozzle 14a descends, the ultrasonic generator 152 generates ultrasonic waves, and the negative pressure generator 153 generates negative pressure. As a result, the pickup nozzle 14a holds the chip 6a to be picked up without contact. Here, the ultrasonic waves generated by the ultrasonic generator 152 are generated by the pickup nozzle 14a vibrating at a vibration velocity of, for example, 1 to 3 mm / s. Because the sound pressure of the ultrasonic waves generated at this vibration velocity is low, it is highly likely that particles 91 will not be removed from the upper surface of the chip 6a, and the chip 6a may be held by the pickup nozzle 14a without the particles 91 being removed.

[0081] 4(d), the pickup nozzle 14a rises while holding the chip 6a with the particles 91 adhering thereto. The chip 6a held by the pickup nozzle 14a is then mounted on the substrate 7 by the component mounting nozzle 20a of the component mounting unit 13. At this time, the top surface of the chip 6a is bonded to the substrate 7. Therefore, the particles 91 adhering to the top surface of the chip 6a are sandwiched between the top surface of the chip 6a and the substrate 7. This results in the formation of voids. When voids are formed, the bonding strength between the chip 6a and the substrate 7 decreases. In other words, the reliability of the substrate 7 on which the chip 6a is mounted decreases. Furthermore, the electrodes of the chip 6a and the electrodes of the substrate 7 may not be able to contact each other, resulting in poor electrical bonding. Thus, ultrasonic waves with low sound pressure may not remove the particles 91, resulting in poor bonding.

[0082] Therefore, in this embodiment, the control unit 101 causes the ultrasonic wave generating unit 152 to generate ultrasonic waves with a high sound pressure.

[0083] 5A and 5B are diagrams for explaining an example of the operation of pick-up nozzle 14a in this embodiment to pick up tip 6a.

[0084] First, the XY table mechanism 31 moves the movable plate 32, thereby moving the adhesive sheet 6b held on the holding table 3a in the X-axis and Y-axis directions. This movement of the adhesive sheet 6b positions the chip 6a to be picked up at the pick-up operation position P, as shown in (a) of FIG. 5A. That is, the chip 6a to be picked up is positioned on the multiple push-up pins 34a of the push-up unit 34. In the example of FIG. 5A, particles 91 are attached to the upper surface of the chip 6a to be picked up. The particles 91 are particles such as foreign matter and dust. Specifically, the particles 91 are cutting chips generated during dicing of a semiconductor wafer. More specifically, cutting chips may adhere to grooves formed by dicing. In such a case, when a chip 6a adjacent to the groove is picked up, the cutting chips may fall onto the upper surfaces of other chips 6a attached to the adhesive sheet 6b. As a result, particles 91 adhere to the upper surfaces of the other chips 6a.

[0085] Next, as shown in FIG. 5A (b), the control unit 101 controls the drive unit 154 to lower the pickup nozzle 14a to a position, for example, approximately 50 μm above the chip 6a, and causes the ultrasonic generator 152 to generate ultrasonic waves. Specifically, the ultrasonic generator 152 vibrates the pickup nozzle 14a to generate ultrasonic waves from around the opening 14b of the pickup nozzle 14a. At this time, the ultrasonic generator 152 generates ultrasonic waves with high sound pressure or high output as the first ultrasonic waves. In other words, to generate the first ultrasonic waves, the ultrasonic generator 152 vibrates the pickup nozzle 14a at a first vibration velocity. The first vibration velocity is, for example, 100 mm / s or more and 3000 mm / s or less. This allows the output of first ultrasonic waves with high sound pressure. Then, because the high sound pressure of the first ultrasonic waves is applied to the chip 6a to be picked up, the particles 91 adhering to the chip 6a can be effectively removed from the chip 6a by the sound pressure.

[0086] Next, as shown in (c) of FIG. 5A , the control unit 101 controls the ultrasonic generator 152 to reduce the ultrasonic output. This causes the ultrasonic generator 152 to generate ultrasonic waves with a lower sound pressure or a lower output as the second ultrasonic waves. In other words, the ultrasonic generator 152 vibrates the pick-up nozzle 14a at a second vibration velocity to generate the second ultrasonic waves. The second vibration velocity is slower than the first vibration velocity, for example, between 10 mm / s and 1000 mm / s. For example, the ultrasonic generator 152 reduces the vibration velocity of the pick-up nozzle 14a from the first vibration velocity to the second vibration velocity while shortening the amplitude of the vibration without changing the frequency of the vibration.

[0087] Next, as shown in (d) of FIG. 5A, the control unit 101 controls the push-up unit 34 to raise the multiple push-up pins 34a. This causes the chip 6a to be pushed up through the adhesive sheet 6b. When the chip 6a is pushed up through the adhesive sheet 6b in this manner, the chip 6a becomes more easily peeled off from the adhesive sheet 6b. In other words, peeling of the chip 6a from the adhesive sheet 6b is promoted. At this time, the pickup nozzle 14a may be raised in synchronization with the multiple push-up pins 34a. In other words, when raising the multiple push-up pins 34a, the control unit 101 may raise the pickup nozzle 14a by controlling the drive unit 154 so that the distance between the chip 6a and the pickup nozzle 14a is maintained constant.

[0088] Next, as shown in FIG. 5B (e), the control unit 101 causes the negative pressure generator 153 to begin suctioning air. This generates negative pressure around the opening 14b of the pick-up nozzle 14a. As a result, the control unit 101 causes the pick-up nozzle 14a to hold the tip 6a in a non-contact manner, using the suction force caused by the negative pressure around the opening 14b and the repulsive force caused by the ultrasonic waves around the opening 14b. In other words, the pick-up nozzle 14a holds the tip 6a in a non-contact manner using the suction force that draws the tip 6a toward the opening 14b of the pick-up nozzle 14a and the repulsive force that moves the tip 6a away from the opening 14b. The suction force is obtained by generating negative pressure using the negative pressure generator 153. The repulsive force is obtained by generating ultrasonic waves using the ultrasonic wave generator 152. In this non-contact holding, a gap of, for example, approximately 20 to 60 μm in width is created between the pick-up nozzle 14a and the tip 6a.

[0089] Thereafter, as shown in (f) of FIG. 5B, control unit 101 controls drive unit 154 to raise pick-up nozzle 14a.

[0090] As described above, in this embodiment, the control unit 101 causes the ultrasonic wave generating unit 152 to generate ultrasonic waves, and then causes the push-up unit 34 to push up the chip 6 a. Then, while the ultrasonic waves are being generated, the control unit 101 causes the negative pressure generating unit 153 to generate negative pressure, and causes the component holder 15 to hold the chip 6 a in a non-contact manner.

[0091] As a result, ultrasonic waves are generated when the chip 6a is not pushed up and is in a stable state, and the particles 91 adhering to the chip 6a can be removed by the ultrasonic waves. In other words, ultrasonic waves with a large sound pressure or output can be generated while suppressing the tilt of the chip 6a, and the particles 91 can be effectively removed by the ultrasonic waves. Therefore, when the chip 6a is held in a non-contact manner and bonded to the substrate 7 by the component mounting device 1, it is possible to suppress the generation of voids caused by particles 91 getting caught between the chip 6a and the substrate 7, and as a result, it is possible to suppress the occurrence of bonding defects.

[0092] In the example of FIG. 5A (b), the ultrasonic generator 152 begins generating ultrasonic waves after the pick-up nozzle 14a descends, but the ultrasonic generator 152 may begin generating ultrasonic waves before the pick-up nozzle 14a descends. For example, the control unit 101 controls the drive unit 154 while the ultrasonic generator 152 is generating ultrasonic waves to begin the descent of the pick-up nozzle 14a. This allows the pick-up nozzle 14a to smoothly hold the tip 6a without contact, since ultrasonic waves are already being generated after the pick-up nozzle 14a descends. In other words, the ultrasonic generator 152 may begin generating ultrasonic waves at any time before the tip 6a is thrust up. In addition, in the examples of FIGS. 5A and 5B, the negative pressure generator 153 begins generating negative pressure after the tip 6a is thrust up, but the negative pressure generator 153 may begin generating negative pressure before the tip 6a is thrust up. For example, the control unit 101 may start the descent of the pickup nozzle 14a while the negative pressure generator 153 is generating negative pressure. This allows the pickup nozzle 14a to smoothly hold the chip 6a without contact, since negative pressure is already generated after the pickup nozzle 14a is lowered. In other words, the negative pressure generator 153 may start generating negative pressure at any timing, as long as negative pressure is generated when the chip 6a is picked up. The generation of negative pressure may be started simultaneously with the lifting of the chip 6a or the generation of ultrasonic waves. Alternatively, the ultrasonic waves and negative pressure may be generated continuously. By continuously generating the ultrasonic waves and negative pressure, there is no need to switch between generating and stopping them, which shortens the takt time, which is the time it takes to pick up and mount the chip 6a.

[0093] In this embodiment, control unit 101 causes ultrasonic generator 152 to generate a first ultrasonic wave, and then causes push-up unit 34 to push up chip 6a. Then, while ultrasonic generator 152 is generating a second ultrasonic wave, control unit 101 causes negative pressure generator 153 to generate a negative pressure, causing component holder 15 to hold chip 6a in a non-contact manner. Here, the first ultrasonic wave is an ultrasonic wave generated by pick-up nozzle 14a, which is a holding tool, vibrating at a first vibration velocity, and the second ultrasonic wave is an ultrasonic wave generated by pick-up nozzle 14a vibrating at a second vibration velocity that is slower than the first vibration velocity.

[0094] As a result, when the tip 6a is held in a non-contact state, the generated ultrasonic waves are switched from the first ultrasonic waves to the second ultrasonic waves, i.e., the sound pressure or output of the ultrasonic waves is reduced, so that the tip 6a can be held in a non-contact state efficiently without requiring a large negative pressure or suction force. Furthermore, when the tip 6a is pushed up by the push-up unit 34 while the second ultrasonic waves are being generated, it is possible to prevent the tip 6a, which becomes unstable due to the pushing up, from being tilted by the high-output ultrasonic waves. In other words, it is possible to prevent holding errors of the tip 6a or the tip 6a from being held improperly.

[0095] In this embodiment, as described above, when pick-up nozzle 14a holds tip 6a in a non-contact manner, pick-up nozzle 14a vibrates at a second vibration speed of 10 mm / s or more and 1000 mm / s or less. ３ In the case of a silicon chip having a volume of 1000 rpm, the silicon chip can be held appropriately without contact. Note that the larger the silicon chip, the heavier the silicon chip, so it is necessary to increase the negative pressure generated by the negative pressure generator 153 to increase the suction force that attracts the silicon chip. Therefore, the larger the silicon chip, the greater the repulsive force that separates the silicon chips by the ultrasonic waves must be, so the second vibration speed may be increased within the above-mentioned range.

[0096] 5A and 5B, the ultrasonic generator 152 changes the output or sound pressure of the ultrasonic waves it generates, but the output or sound pressure of the ultrasonic waves does not have to be changed. That is, the controller 101 switches the vibration speed of the pickup nozzle 14a from the first vibration speed to the second vibration speed by lowering the vibration speed, but the vibration speed does not have to be lowered. For example, if the tip 6a is a relatively large component, the raised tip 6a can be stabilized and the tip 6a can be held appropriately without contact without lowering the ultrasonic output.

[0097] Furthermore, control unit 101 may control ultrasonic generator 152 to gradually change the vibration speed of pickup nozzle 14a, which is the holding tool, from a first vibration speed to a second vibration speed. For example, the vibration speed may be set to a value ranging from about −100 to 1000 mm / s. ２ The vibration velocity is changed at an acceleration of 1 / 20 Hz. This suppresses sudden changes in the vibration velocity of the pickup nozzle 14a, thereby stabilizing the operation of the pickup system 100. Furthermore, if the sound pressure and output of the ultrasonic waves change suddenly, there is a possibility that particles 91 that have been removed will re-adhere to the tip 6a. However, if the vibration velocity is changed gradually, it is possible to suppress sudden changes in the sound pressure and output of the ultrasonic waves, and it is possible to prevent particles 91 from re-adhering to the tip 6a.

[0098] (Modification 1) In this modification, the control unit 101 further raises and lowers the pick-up nozzle 14a while ultrasonic waves are being generated, thereby removing the particles 91 from the tip 6a.

[0099] FIG. 6 is a diagram showing that the magnitude of air vibration at a position varies depending on the position around pick-up nozzle 14a.

[0100] For example, as shown in FIG. 6A, when the vibration of the pick-up nozzle 14a causes ultrasonic waves to be generated from several points on the pick-up nozzle 14a, these ultrasonic waves overlap, and as a result, a position p1 appears around the pick-up nozzle 14a where the ultrasonic waves cancel each other out, and a position p2 where the amplitude of the ultrasonic waves is amplified.

[0101] 6B and 6C, the control unit 101 in this modification raises and lowers the pickup nozzle 14a by controlling the drive unit 154 while ultrasonic waves are being generated by the vibration of the pickup nozzle 14a. In other words, while the ultrasonic wave generator 152 is generating ultrasonic waves, the control unit 101 controls the component holder 15 to alternately move the pickup nozzle 14a, which is the holding tool, upward and downward. This increases the likelihood that particles 91 adhering to the chip 6a will be located at the positions p1 and p2.

[0102] FIG. 7 is a diagram showing an example of the movement of pick-up nozzle 14a in this modified example.

[0103] Before tip 6a is pushed up by push-up unit 34, control unit 101 causes ultrasonic generator 152 to generate ultrasonic waves. Then, while the ultrasonic waves are being generated, control unit 101 controls drive unit 154 to lower pick-up nozzle 14a, as shown in FIG. 7A, for example. Furthermore, while the ultrasonic waves are being generated, control unit 101 controls drive unit 154 to raise lowered pick-up nozzle 14a, as shown in FIG. 7B, for example. The ultrasonic waves may be the first ultrasonic waves or the second ultrasonic waves.

[0104] The pickup nozzle 14a repeatedly moves up and down in this manner, thereby effectively increasing or decreasing the sound pressure applied to the particle 91, and shaking the particle 91 to facilitate removal from the tip 6a.

[0105] That is, even if the sound pressure of the ultrasonic waves at a position at a distance from the pickup nozzle 14a changes depending on the distance from the nozzle, the pickup nozzle 14a moves up and down, increasing the possibility that a large sound pressure will be applied to the tip 6a, thereby effectively removing particles adhering to the tip 6a.

[0106] Furthermore, the control unit 101 may move the pickup nozzle 14a, which is the holding tool, by more than half the wavelength of the ultrasonic waves between the upward movement shown in FIG. 7A and the downward movement shown in FIG. 7B. The ultrasonic waves are generated from the vicinity of the opening 14b of the pickup nozzle 14a by the ultrasonic wave generator 152. Furthermore, when the ultrasonic frequency is 35.2 kHz, the half wavelength of the ultrasonic waves is, for example, approximately 5 mm. This allows for more effective strengthening or weakening of the sound pressure applied to the upper surface of the chip 6a. For example, this increases the likelihood that particles 91 will be located at the antinode of the standing wave generated by the ultrasonic waves, thereby effectively removing particles 91 adhering to the chip 6a.

[0107] The period during which pickup nozzle 14a moves up and down, i.e., the period during which pickup nozzle 14a moves upward and downward, is, for example, 0.1 to 10 seconds, and the frequency is 0.1 to 10 Hz. Alternatively, the period may be 0.5 to 2 seconds.

[0108] (Modification 2) In this modification, the control unit 101 neutralizes the tip 6a and the particle 91 by generating ions from an ionizer.

[0109] FIG. 8 is a diagram for explaining static elimination in this modified example.

[0110] The pickup system 100 in this modified example includes an ionizer 155. The ionizer 155 simultaneously emits, for example, positive ions and negative ions together with air. The air flow rate at this time is, for example, 50 to 200 L / min. That is, the pickup system 100 in this modified example includes the ionizer 155 as a static eliminator that supplies ions. Then, before causing the push-up unit 34 to push up the tip 6a, the control unit 101 causes the ionizer 155 to supply ions while ultrasonic waves are being generated. Note that the ultrasonic waves may be the first ultrasonic waves or the second ultrasonic waves.

[0111] For example, even if the top surface of the tip 6a is negatively charged and the particle 91 is positively charged, in this modification, the charge on the tip 6a and the particle 91 can be removed by the ions supplied from the ionizer 155. In other words, the ions supplied from the ionizer 155 remove electricity from the tip 6a and the particle 91 attached to the tip 6a. Therefore, if the particle 91 is attached to the tip 6a due to static electricity, the particle 91 can be easily removed from the tip 6a. As a result, the particle 91 can be effectively removed.

[0112] (Modification 3) In this modification, the control unit 101 blows air onto the tip 6a.

[0113] FIG. 9 is a diagram for explaining the blowing of air in this modified example.

[0114] The pickup system 100 in this modified example includes a positive pressure generator 156. The positive pressure generator 156 generates positive pressure around the opening 14b of the pickup nozzle 14a, which is a holding tool. For example, the positive pressure generator 156 generates positive pressure around the opening 14b by creating a positive pressure in an air flow path 14c, which is a flow path formed in the pickup nozzle 14a and communicates with the opening 14b. In other words, the positive pressure generator 156 expels air from the opening 14b via the flow path 14c. Note that the flow path connected to the negative pressure generator 153 and the flow path connected to the positive pressure generator 156 may merge with the flow path 14c of the pickup nozzle 14a via a switching valve. In this case, the switching valve may be used to switch between generating negative pressure (i.e., vacuum suction) and generating positive pressure (i.e., air blowing).

[0115] Then, before causing push-up unit 34 to push up tip 6a, control unit 101 causes positive pressure generator 156 to generate positive pressure around opening 14b of pickup nozzle 14a while ultrasonic waves are being generated. Note that the ultrasonic waves may be the first ultrasonic waves or the second ultrasonic waves.

[0116] This causes air to be blown onto the tip 6a from the pick-up nozzle 14a, thereby effectively removing particles 91 adhering to the tip 6a.

[0117] Furthermore, when the control unit 101 causes the positive pressure generating unit 156 to stop generating the positive pressure, the control unit 101 may gradually reduce the positive pressure by controlling the positive pressure generating unit 156. For example, the positive pressure decreases at a rate of change of approximately 0.2 to 1.0 MPa / s. If the generation of the positive pressure is suddenly stopped, the particles 91 that were once removed may reattach to the tip 6a. However, in the above case, since the generation of the positive pressure is not suddenly stopped, it is possible to prevent the particles 91 from reattaching to the tip 6a.

[0118] (Modification 4) In this modification, the control unit 101 applies air pressure to the tip 6a by controlling the descending speed of the pick-up nozzle 14a.

[0119] FIG. 10 is a diagram for explaining the control of the descending speed of pick-up nozzle 14a in this modified example.

[0120] Before causing the push-up unit 34 to push up the chip 6 a, the control unit 101 brings the pickup nozzle 14 a, which is a holding tool, close to the chip 6 a while generating ultrasonic waves. The ultrasonic waves may be the first ultrasonic waves or the second ultrasonic waves.

[0121] For example, as shown in Figure 10(a), the pick-up nozzle 14a descends to the vicinity of the tip 6a at a first descending speed, and then, as shown in Figure 10(b), descends at a second descending speed that is slower than the first descending speed so as to approach the tip 6a even closer. When descending at the first descending speed, the pick-up nozzle 14a descends to a position that is, for example, 0.5 to 2 mm above the tip 6a. When descending at the second descending speed, the pick-up nozzle 14a descends to a position that is, for example, 0.05 to 0.2 mm above the tip 6a.

[0122] Typically, the first descent speed is 10 to 30 mm / s, and the second descent speed is 0.5 to 5 mm / s. However, the first descent speed in this modified example may be faster than the normal speed, for example, 50 mm / s or more. Also, the second descent speed in this modified example may be faster than 5 mm / s. In other words, it is sufficient that at least one of the first descent speed and the second descent speed is faster than the normal descent speed.

[0123] As a result, when the pickup nozzle 14a approaches the tip 6a, wind pressure can be applied to the tip 6a, which results in effective removal of particles 91 adhering to the tip 6a.

[0124] (Modification 5) In this modification, air is blown onto the semiconductor wafer including the chip 6a before the chip 6a is held.

[0125] Fig. 11 is a diagram showing an example of the configuration of the pickup system 100 in this modified example, in which (a) of Fig. 11 shows the pickup system 100 as viewed from the negative side in the X-axis direction, and (b) of Fig. 11 shows the pickup system 100 as viewed from the positive side in the Z-axis direction.

[0126] 11A, the pickup system 100 in this modified example includes an air blower 157 and a particle collection box 158. Note that the holding table 3a in this embodiment includes an expander 3aa and a wafer ring 3ab. The expander 3aa and the wafer ring 3ab are jigs for expanding the adhesive sheet 6b in the X-axis direction and the Y-axis direction, thereby widening the gaps between the chips 6a included in the diced semiconductor wafer.

[0127] The air blower 157 is an air supply device that supplies air toward the chips 6a. Specifically, as shown in FIG. 11A , the air blower 157 is disposed above the diced semiconductor wafer (i.e., the plurality of chips 6a) and blows air downward in accordance with control by the control unit 101. For example, the air blower 157 blows air onto the entire semiconductor wafer. The air blower 157 may be fixed above the pickup nozzle 14a. Alternatively, the air blower 157 may be configured to be movable. For example, before the pickup nozzle 14a holds the chips 6a, the air blower 157 moves in accordance with control by the control unit 101 to position itself above the semiconductor wafer. Then, when the pickup nozzle 14a holds the chips 6a, the air blower 157 moves in accordance with control by the control unit 101 to retract to a location other than above the semiconductor wafer.

[0128] The particle collection box 158 is a collection box arranged to surround the chip 6a and to collect particles 91 scattered by the air from the air blow device 157. Specifically, the particle collection box 158 is arranged, for example, on the expander 3aa, as shown in FIG. 11B. Such a particle collection box 158 has, for example, a ring shape so as to surround the diced semiconductor wafer in the XY plane. An opening is provided in the surface of the particle collection box 158 facing the semiconductor wafer, and a filter 158a is attached inside the particle collection box 158 to cover the opening.

[0129] Therefore, when the air blown from air blow device 157 hits the upper surface of the semiconductor wafer, it flows along the upper surface and adhesive sheet 6b, passes through the opening of particle collection box 158 and filter 158a, and enters the interior of particle collection box 158. In this way, air blow device 157 creates a flow of air around the semiconductor wafer.

[0130] As a result, when particles 91 adhere to chips 6a included in a semiconductor wafer and air is blown from the air blowing device 157, the particles 91 are removed from the chips 6a by the air from the air blowing device 157 and collected together with the air in the particle collection box 158. The filter 158a of the particle collection box 158 also functions as a check valve that prevents the collected particles 91 from being discharged outside the particle collection box 158. The particle collection box 158 may also have a function of actively sucking in outside air through the opening described above.

[0131] In this modification, the control unit 101 causes the air blowing device 157 to blow air before the pickup nozzle 14a holds the chip 6a. At this time, the control unit 101 may also cause the particle collection box 158 to suck air. Then, the control unit 101 may cause the ultrasonic generator 152 to generate ultrasonic waves after the air blowing device 157 has blown air.

[0132] This allows the particles 91 adhering to the tip 6a to be more effectively removed. Furthermore, the removed particles 91 are collected in the particle collection box 158, which makes it possible to appropriately prevent the particles 91 from adhering to the tip 6a again. Furthermore, since the particle collection box 158 has a ring shape, it is possible to collect the particles 91 regardless of the direction in which the particles 91 scatter from the tip 6a, and it is possible to more appropriately prevent the particles 91 from adhering to the tip 6a again. Note that the air blow device 157 may constantly blow air downward.

[0133] In this modification, the pickup system 100 includes an air blowing device 157 and a particle collection box 158. However, the pickup system 100 may include the air blowing device 157 but not the particle collection box 158. In this case, the air blown by the air blowing device 157 is exhausted to the outside of the pickup system 100 by a fan disposed on the side or bottom of the pickup system 100. The exhausted air is then collected by a collection device in the clean room in which the pickup system 100 is disposed. If particles 91 adhere to the chip 6a, the particles 91 flow with the air and are collected by the collection device in the clean room. In such a case, the pickup system 100 does not need to include the particle collection box 158, thereby simplifying the configuration of the pickup system 100. On the other hand, if the pickup system 100 includes the air blowing device 157 and the particle collection box 158, particles can be effectively collected regardless of the complex airflow within the pickup system 100 or the clean room.

[0134] [Processing Flow] FIG. 12 is a flowchart showing an example of a schematic processing operation by the control unit 101 in this embodiment.

[0135] First, the control unit 101 controls the drive unit 154 to lower the pickup nozzle 14a, and then controls the ultrasonic generator 152 to generate ultrasonic waves from around the opening 14b of the pickup nozzle 14a (step S1). The ultrasonic waves generated at this time are generated by the vibration speed of the pickup nozzle 14a, which is faster than normal. Therefore, if particles 91 are attached to the tip 6a, the particles 91 are removed from the tip 6a by the ultrasonic waves.

[0136] Next, the control unit 101 controls the push-up unit 34 to push up the tip 6a (step S2).

[0137] Then, control unit 101 generates a negative pressure around opening 14b of pick-up nozzle 14a by controlling negative pressure generator 153. As a result, tip 6a is held in a non-contact state by pick-up nozzle 14a due to the repulsive force of the ultrasonic waves and the suction force of the negative pressure (step S3).

[0138] Thereafter, control unit 101 controls drive unit 154 to raise pick-up nozzle 14a (step S4).

[0139] In this way, pickup system 100 in this embodiment can remove particles 91 adhering to chip 6a, thereby suppressing the occurrence of poor bonding. Also, the bonding device that is component mounting device 1 in this embodiment includes pickup system 100 and a bonding unit that is component mounting section 13 that bonds chip 6a held by component holding section 15 to another component. This allows the bonding device to achieve the same effects as pickup system 100 described above.

[0140] While the pickup system 100 according to one or more aspects has been described above based on the embodiments and several modified examples, the present disclosure is not limited to these embodiments and several modified examples. As long as it does not deviate from the spirit of the present disclosure, various modifications that a person skilled in the art may make to the above embodiments and several modified examples, or forms constructed by combining several modified examples of the embodiments, may also be included in the present disclosure.

[0141] For example, the above embodiment may be combined with the first and second modifications, or may be combined with the third modification.

[0142] Furthermore, in the above embodiment and some of the modified examples, the chip 6a is pushed upward by the push-up portion 34, but the chip 6a may also be pushed downward. In this case, the chip 6a is attached to the lower surface side of the adhesive sheet 6b, and the push-up portion 34 is disposed above the adhesive sheet 6b. The push-up portion 34 then pushes down the chip 6a via the adhesive sheet 6b by lowering the multiple push-up pins 34a.

[0143] In addition, in the above-described embodiment and some of the modified examples, the vibration speed of pickup nozzle 14a may be changed depending on the size of tip 6a, the size of particle 91, and the like.

[0144] Furthermore, in the above embodiment and some of the modified examples, the pickup nozzle 14a holds the chip 6a in a non-contact manner, but the component mounting nozzle 20a may also hold the chip 6a in a non-contact manner, similar to the pickup nozzle 14a.

[0145] Furthermore, in the above embodiment and some modified examples, the pickup nozzle 14a or the pickup head 14 is provided in the component mounting apparatus 1, which is a bonding apparatus. However, the pickup nozzle 14a or the pickup head 14 may be provided in another apparatus. An example of the other apparatus is a semiconductor chip sorter, but this is not limiting. When the other apparatus is a semiconductor chip sorter, the term "pickup" in the above embodiment and some modified examples refers to, for example, picking up semiconductor chips from a tray. Thus, even when the pickup nozzle 14a or the pickup head 14 is provided in another apparatus, such as a semiconductor chip sorter, it can appropriately hold components without contact by having a configuration similar to that of the above embodiment and some modified examples. The semiconductor chip sorter may also be a sorting apparatus that includes a pickup system 100 and holds semiconductor chips using the pickup system 100.

[0146] In the above-described embodiment and some modified examples, the control unit 101 and the like may be configured with dedicated hardware, or may be realized by executing a software program suitable for the control unit 101. The control unit 101 may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory. Here, the software realizing the control unit 101 and the like causes a computer to execute, for example, each step of the flowchart shown in FIG. 12.

[0147] The following cases are also included in this disclosure:

[0148] (1) Specifically, the control unit 101 may be a computer system including a microprocessor, a ROM (Read Only Memory), a RAM (Random Access Memory), a hard disk unit, a display unit, a keyboard, a mouse, etc. A computer program is stored in the RAM or hard disk unit. The control unit 101 achieves its functions by the microprocessor operating in accordance with the computer program. Here, the computer program is composed of a combination of multiple instruction codes that indicate commands to the computer to achieve a predetermined function.

[0149] (2) The control unit 101 may be configured as a single system LSI (Large Scale Integration). A system LSI is an ultra-multifunctional LSI manufactured by integrating multiple components on a single chip, and specifically, is a computer system configured to include a microprocessor, ROM, RAM, etc. A computer program is stored in the RAM. The system LSI achieves its functions by the microprocessor operating in accordance with the computer program.

[0150] (3) The control unit 101 may be configured as a removable IC card or a standalone module. The IC card or module is a computer system configured with a microprocessor, ROM, RAM, etc. The IC card or module may include the ultra-multifunctional LSI described above. The IC card or module achieves its functions when the microprocessor operates in accordance with a computer program. This IC card or module may be tamper-resistant.

[0151] (4) The present disclosure may be embodied as the methods described above, a computer program that implements these methods on a computer, or a digital signal that includes the computer program.

[0152] The present disclosure may also be a computer program or a digital signal recorded on a computer-readable recording medium, such as a flexible disk, a hard disk, a CD (Compact Disc)-ROM, a DVD, a DVD-ROM, a DVD-RAM, a BD (Blu-ray (registered trademark) Disc), a semiconductor memory, etc. Alternatively, the present disclosure may be a digital signal recorded on such a recording medium.

[0153] The present disclosure may also be applied to transmitting a computer program or digital signal via a telecommunications line, a wireless or wired communication line, a network such as the Internet, data broadcasting, or the like.

[0154] Furthermore, the program or digital signal may be recorded on a recording medium and transferred, or the program or digital signal may be transferred via a network or the like, so that the program or digital signal may be implemented by another independent computer system.

[0155] The present disclosure can be used, for example, in a system that picks up a part and performs a task using that part.

[0156] REFERENCE SIGNS LIST 1 Component mounting device (bonding device) 2 Base 3 Component supply unit 3a Holding table 3aa Expander 3ab Wafer ring 5 Substrate holding unit 5a Transport rail 6 Semiconductor wafer unit 6a Chip (component) 6b ​​Adhesive sheet 7 Substrate 11 Frame 11a Support post 11b Y-axis frame 12 Y-axis drive mechanism 13 Component mounting unit 13a Moving plate 13b Lifting mechanism 13c Lifting plate 14 Pickup head 14a Pickup nozzle (holding tool) 14b Opening 14c Flow path 15 Component holding unit 15a Arm 15b Pickup head moving mechanism 15c Holding main body 20 Mounting unit 20a Component mounting nozzle 21 Pickup camera 31 XY table mechanism 32 Moving plate 33 Support member 34 Push-up unit 34a Push-up pin 91 Particle 100 Pick-up system 101 Control unit 152 Ultrasonic wave generating unit 153 Negative pressure generating unit 154 Driving unit 155 Ionizer (static eliminator) 156 Positive pressure generating unit 157 Air blow device 158 Particle collection box 158a Filter

Claims

1. A pickup system comprising: a push-up unit that pushes up a component affixed to an adhesive sheet, through the adhesive sheet; a component holding unit that has a holding tool with an opening that can be raised and lowered, and uses the holding tool to hold the component in a non-contact manner; a negative pressure generating unit that generates negative pressure around the opening of the holding tool; an ultrasonic generating unit that generates ultrasonic waves by vibrating the holding tool; and a control unit that controls the push-up unit, the component holding unit, the negative pressure generating unit and the ultrasonic generating unit, wherein the control unit causes the push-up unit to push up the component after generating the ultrasonic waves, and causes the negative pressure generating unit to generate the negative pressure while the ultrasonic waves are being generated, causing the component holding unit to hold the component in a non-contact manner.

2. The pickup system described in claim 1, wherein the control unit causes the ultrasonic generating unit to generate a first ultrasonic wave as the ultrasonic wave, and then causes the pushing-up unit to push up the component, and causes the negative pressure generating unit to generate the negative pressure while a second ultrasonic wave is being generated as the ultrasonic wave, thereby causing the component holding unit to hold the component in a non-contact manner, the first ultrasonic wave being an ultrasonic wave generated by the holding tool vibrating at a first vibration velocity, and the second ultrasonic wave being an ultrasonic wave generated by the holding tool vibrating at a second vibration velocity slower than the first vibration velocity.

3. A pickup system as described in claim 2, wherein the control unit gradually changes the vibration speed of the holding tool from the first vibration speed to the second vibration speed by controlling the ultrasonic generating unit.

4. The pickup system according to claim 2, wherein the first vibration velocity is equal to or greater than 100 mm / s and equal to or less than 3000 mm / s.

5. The pickup system according to claim 2, wherein the second vibration velocity is equal to or greater than 10 mm / s and equal to or less than 1000 mm / s.

6. The pickup system of claim 1, wherein the control unit controls the component holding unit to alternately move the holding tool upward and downward while the ultrasonic generating unit is generating the ultrasonic waves.

7. The pickup system according to claim 6, wherein the control unit moves the holding tool by at least 1 / 2 the wavelength of the ultrasonic wave during the upward movement and the downward movement.

8. The pickup system according to claim 1, further comprising a static eliminator that supplies ions to the component, wherein the control unit causes the static eliminator to supply the ions while the ultrasonic waves are being generated before causing the push-up section to push up the component.

9. The pickup system of claim 1, further comprising a positive pressure generating unit that generates positive pressure around the opening of the holding tool, wherein the control unit causes the positive pressure generating unit to generate positive pressure around the opening of the holding tool while the ultrasonic waves are being generated before causing the pushing-up unit to push up the component.

10. The pickup system according to claim 9, wherein the control unit, when causing the positive pressure generating unit to stop generating the positive pressure, controls the positive pressure generating unit to gradually reduce the positive pressure.

11. The pickup system according to claim 1, wherein the control unit brings the holding tool close to the component while the ultrasonic waves are being generated before causing the push-up section to push up the component.

12. The pickup system of claim 1, further comprising an air supply device that supplies air toward the component.

13. The pickup system according to claim 12, further comprising a collection box arranged to surround the component for collecting particles scattered by the air.

14. The pickup system according to claim 13, wherein the collection box has a ring shape.

15. The pickup system according to claim 1, wherein the control unit starts lowering the holding tool while the ultrasonic generating unit is generating the ultrasonic waves.

16. The pickup system according to claim 1, wherein the control unit starts lowering the holding tool while the negative pressure generating unit is generating the negative pressure.

17. A joining device comprising: a pickup system according to any one of claims 1 to 16; and a joining unit that joins the component held by the component holding section to another component.

18. A sorting device comprising a pickup system according to any one of claims 1 to 16, the pickup system holding the parts.

19. A pick-up method for a pick-up system comprising a push-up section which pushes up a component affixed to an adhesive sheet, through the adhesive sheet; a component holding section which has a holding tool with an opening which can be raised and lowered and which holds the component in a non-contact manner using the holding tool; a negative pressure generating section which generates negative pressure around the opening of the holding tool; and an ultrasonic generating section which generates ultrasonic waves by vibrating the holding tool, the pick-up method comprising the steps of: causing the push-up section to push up the component after generating ultrasonic waves in the ultrasonic generating section; and generating the negative pressure in the negative pressure generating section while the ultrasonic waves are being generated, thereby causing the component holding section to hold the component in a non-contact manner.

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