Sensor device and cooking appliance including same

Abstract

The sensor device according to an embodiment can be mounted on a cooking container to measure the temperature of cooked materials contained in the cooking container which is heated by a heating device. The sensor device comprises: a heat transfer unit for receiving heat from the cooking container when the sensor device is mounted on the cooking container; a thermoelectric element provided to produce electric currents and electric energy on the basis of the heat transferred from the heat transfer unit; a printed circuit board to which electric currents generated by the thermoelectric element are applied; an energy storage unit electrically connected to the printed circuit board to store electrical energy transmitted from the printed circuit board; a sensor body in which the printed circuit board and the energy storage unit are disposed; and a probe mounted on the sensor body, the probe comprising a temperature sensor provided to measure the temperature of cooked materials contained in the cooking container.

Description

Sensor device and cooking appliance including same

[0001] The present disclosure relates to a sensor device for measuring the temperature of food and a cooking appliance including the same.

[0002] Cooking appliances may include heating devices, such as induction cooktops. Typically, heating devices utilize the principles of induction heating to heat and cook food in a cooking vessel.

[0003] Food in a cooking vessel can boil over or burn if overheated. Sensor devices can detect the temperature of the food and control the heat output of the heating device to prevent this.

[0004] The sensor device can be used to measure the temperature of food. The sensor device can be charged by a wired connection or by a wireless charging device connected to a power source by a wired connection.

[0005] Therefore, the sensor device must be used after charging, and since it is used in a high-temperature environment, the wired cable or the cable of the wireless charging device may be exposed to the risk of fire.

[0006] According to one aspect of the present disclosure, a sensor device capable of measuring the temperature of a food can be provided.

[0007] According to one aspect of the present disclosure, a sensor device that is charged by receiving heat generated from an external source can be provided.

[0008] According to one aspect of the present disclosure, a sensor device capable of being charged while simultaneously measuring temperature can be provided.

[0009] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0010] A sensor device according to one embodiment is a sensor device that can be mounted on a cooking vessel to measure the temperature of food contained inside the cooking vessel heated by a heating device, wherein the sensor device includes a heat transfer unit that receives heat from the cooking vessel when the sensor device is mounted on the cooking vessel, a thermoelectric element that is arranged to produce current and electrical energy based on the heat transferred from the heat transfer unit, a printed circuit board to which current generated from the thermoelectric element is applied, an energy storage unit that is electrically connected to the printed circuit board to store the electrical energy transferred from the printed circuit board, a sensor body on which the printed circuit board and the energy storage unit are disposed, and a probe that is mounted on the sensor body and includes a temperature sensor that is arranged to measure the temperature of food contained in the cooking vessel.

[0011] According to one embodiment, a cooking appliance is provided, wherein a cooking vessel is placed thereon, and includes a heating device for heating the cooking vessel, and a sensor device for being placed on the cooking vessel, wherein the sensor device includes a thermoelectric element for generating a potential difference due to a temperature difference, a printed circuit board to which a current generated from the thermoelectric element is applied, an energy storage unit electrically connected to the printed circuit board, a sensor body in which the printed circuit board and the energy storage unit are disposed, a probe including a temperature sensor mounted on the sensor body and configured to measure a temperature of food in the cooking vessel, and a heat transfer unit configured to transfer heat from the heating device or the cooking vessel heated by the heating device to the thermoelectric element.

[0012] According to one embodiment, a sensor device is a rechargeable sensor device that can be mounted on a cooking vessel to measure the temperature of food contained in the cooking vessel heated by a heating device, the sensor device comprising: a sensor body; a heat transfer unit extending from the sensor body and receiving heat from the cooking vessel when the sensor device is mounted on the cooking vessel; a thermoelectric element disposed inside the sensor body and connected to the sensor body and converting thermal energy of the received heat into electrical energy; an energy storage unit disposed inside the sensor body and storing the converted electrical energy to charge the sensor device; and a temperature sensor mounted on the sensor body and configured to measure the temperature of food contained in the cooking vessel, wherein the temperature sensor is operated by utilizing the electrical energy stored in the energy storage unit.

[0013] Figure 1 is a drawing showing a cooking vessel placed on a heating device and a sensor device mounted on the cooking vessel.

[0014] FIG. 2 is a diagram illustrating a sensor device according to one embodiment.

[0015] Figure 3 is a longitudinal cross-sectional view showing a cross-section of the sensor device of Figure 2.

[0016] Figures 4 and 5 are drawings illustrating the generation and charging process by showing a sensor device fixed to a cooking vessel and the direction of heat movement.

[0017] FIG. 6 is a control block diagram for explaining the operation of a sensor device and a heating device according to one embodiment.

[0018] Fig. 7 is a flowchart for explaining the operation of a sensor device and a heating device according to one embodiment.

[0019] FIG. 8 is a drawing illustrating a sensor device according to one embodiment in which a heat pipe is arranged within a probe.

[0020] Figure 9 is a drawing illustrating a sensor device capable of adjusting the length of a heat pipe.

[0021] Figure 10 is a drawing showing a state in which a sensor device, which is arranged so that the tip of the probe can be bent, is placed on a cooking vessel to measure the temperature of the food being cooked.

[0022] FIG. 11 is a drawing illustrating an induction heating device according to one embodiment of the present disclosure, a cooking vessel placed on the induction heating device, and a sensor device mounted on the cooking vessel.

[0023] Fig. 12 is an exploded view showing the cooking plate in the induction heating device of Fig. 11.

[0024] FIG. 13 is a perspective view illustrating a sensor device according to one embodiment of the present disclosure.

[0025] Fig. 14 is a cross-sectional view showing the sensor device of Fig. 13 mounted on a cooking vessel.

[0026] FIG. 15 is a perspective view illustrating a sensor device according to one embodiment of the present disclosure.

[0027] Fig. 16 is a cross-sectional view showing the sensor device of Fig. 15 mounted on a cooking vessel.

[0028] FIG. 17 is a cross-sectional view illustrating a state in which a sensor device according to one embodiment of the present disclosure is placed in a cooking vessel.

[0029] FIG. 18 is a cross-sectional view showing a state in which a sensor device according to one embodiment of the present disclosure is placed in a cooking vessel.

[0030] The embodiments described in this specification and the configurations illustrated in the drawings are merely preferred examples of the disclosed invention, and there may be various modified examples that can replace the embodiments and drawings of this specification at the time of filing of this application.

[0031] Additionally, the same reference numbers or symbols presented in each drawing of this specification represent parts or components that perform substantially the same function.

[0032] In addition, the terminology used in this specification is used to describe embodiments and is not intended to limit and / or restrict the disclosed invention. The singular expression includes plural expressions unless the context clearly indicates otherwise. In this specification, the terms "comprise" or "have" and the like are intended to specify the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0033] Additionally, terms including ordinal numbers such as “first,” “second,” etc. used herein may be used to describe various components, but the components are not limited by the terms, and the terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component. The term “and / or” includes any combination of a plurality of related listed items or any item among a plurality of related listed items.

[0034] Meanwhile, the terms “upper and lower directions,” “lower side,” and “front and rear directions” used in the following description are defined based on the drawings, and the shape and position of each component are not limited by these terms.

[0035] Hereinafter, embodiments according to the present invention will be described in detail with reference to the attached drawings.

[0036] Figure 1 is a drawing showing a cooking vessel placed on a heating device and a sensor device mounted on the cooking vessel.

[0037] A cooking appliance (1) may include a heating device (2) and a sensor device (10). The heating device (2) may heat a cooking vessel (C) and food contained in the cooking vessel (C). The heating device (2) may be an induction heating device, but is not limited thereto. For example, the heating device (2) may be a gas burner, a hot plate, a highlighter, etc. A hot plate is a heating device that generates heat from a high-temperature iron plate itself, and a highlighter is a heating device in which a heating wire located under a ceramic plate radiates heat. Hereinafter, the heating device (2) will be described as an induction heating device.

[0038] The heating device (2) may include a cooking plate (21) on which a cooking vessel (C) may be placed. The cooking plate (21) may have magnetism so that the cooking vessel (C) may be inductively heated. An alternating current is supplied to a coil of the cooking plate (21), and a magnetic field that varies over time is induced in the coil. When the magnetic field passes through the metal forming the cooking vessel (C), an eddy current is generated due to the resistance of the metal (e.g., iron) of the cooking vessel (C). The eddy current generated in the cooking vessel (C) may heat the cooking vessel (C) and thus heat food inside the cooking vessel.

[0039] Cooking utensils (C) may include pots, frying pans, steamers, rice cookers, etc. The types of cooking utensils (C) are not limited to these. In this section, a pot will be used as an example.

[0040] The heating device (2) may include a cooking zone (22) provided on at least a portion of the cooking plate (21). The cooking zone (22) may be provided on the upper side of the coil. A cooking vessel (C) placed in the cooking zone (22) may be heated by electromagnetic induction. A plurality of cooking zones (22) may be provided.

[0041] The upper surface of the cooking plate (21) may be provided in a flat shape so that a cooking container (C) can be placed on it. The cooking plate (21) may be made of reinforced glass such as ceramic glass so that it is not easily broken.

[0042] The heating device (2) may include a control panel (23) for controlling the heating power of the cooking zone (22). The control panel (23) may turn the power of the heating device (2) on and off. In addition, the control panel (23) may control the heating power of the cooking zone (22). The control panel (23) may be provided as a touch panel, but is not limited thereto. For example, the control panel (23) may be provided in various ways, such as a touch screen or buttons.

[0043] The control panel (23) can provide a user interface for interaction between a user and the cooking appliance (1). The user interface can be provided on one side of the cooking zone (22) of the cooking plate (21). The user interface can receive control commands from the user and display operation information of the cooking appliance (1). The user interface can include one or more input interfaces (23b) or inputters (23b) and one or more output interfaces (23a) or outputters (23a). However, the location of the user interface is not limited to the cooking plate (21), and can be provided in various locations, such as the front or side of the cooking appliance (1).

[0044] At least a portion of the sensor device (10) may be positioned inside the cooking vessel (C). The sensor device (10) may be inserted into the food to detect the temperature of the food. Specifically, the sensor device (10) may be inserted into the food while being placed on the side of the cooking vessel (C) to detect the temperature of the food.

[0045] The sensor device (10) can be used while mounted on a cooking vessel (C). Therefore, user convenience can be improved since the user does not need to separately hold the sensor device (10).

[0046] Fig. 2 is a drawing illustrating a sensor device according to one embodiment. Fig. 3 is a longitudinal cross-sectional view illustrating a cross-section of the sensor device of Fig. 2.

[0047] Referring to FIGS. 2 and 3, the sensor device (10) may include a sensor body (11) that is provided to be held by a user. A power generation unit (13), which will be described later, may be installed inside the sensor body (11).

[0048] The sensor body (11) may include an input interface (111) or inputter (111) provided to enable a user to input information to pair the sensor device (10) and the heating device (2). The input interface (111) may be positioned on the upper side of the sensor body (11). The input interface (111) may be provided as a button. However, the present invention is not limited thereto, and may be provided as a touch panel, a switch, or the like.

[0049] The sensor body (11) may include a heat dissipation hole (11a) to allow steam, etc. generated from the cooking vessel (C) to be discharged. The heat dissipation hole (11a) may be formed around the input interface (111) or may be formed on the upper side of the sensor body (11). The heat dissipation hole (11a) may be formed as a hole, or may be provided in a mesh shape or a slit shape.

[0050] In this example, the heat dissipation hole (11a) is shown as being formed in a semicircular slit shape around the input interface (111), but is not limited thereto.

[0051] The sensor device (10) may include a probe (12) extending from a sensor body (11) to detect the temperature of the food. The probe (12) may include a temperature sensor (121) inside. The temperature sensor (121) may be provided at one end of the probe (12). That is, the temperature sensor (121) may be located on the opposite side from which the probe (12) is fixed to the sensor body (11).

[0052] The temperature sensor (121) may be a thermistor whose resistance value changes depending on temperature. Specifically, the temperature sensor (121) may be an NTC thermistor. However, it is not limited thereto and may be a PTC thermistor or may be provided as another type of temperature sensor.

[0053] The probe (12) may be formed of a heat-resistant metal material. For example, the probe (12) may be formed of stainless steel, but is not limited thereto. In addition, the probe (12) may be formed of a waterproof material to prevent liquids or the like from seeping into the interior.

[0054] The probe (12) can be detachably coupled to the sensor body (11). Specifically, one end of the probe (12) can be detachably coupled to the sensor body (11).

[0055] The probe (12) may be formed in a rod shape. The probe (12) may have a pointed end, i.e., the other end of the probe (12), so that it can be inserted into food ingredients such as meat or fish. Without being limited thereto, the probe (12) may also be used to measure the temperature of liquid foods such as soup.

[0056] The sensor device (10) may include a power generation unit (13) disposed inside the sensor body (11). The power generation unit (13) may include a thermoelectric element (131) that generates a potential difference due to a temperature difference. The thermoelectric element (131) may be a configuration that converts thermal energy and electrical energy. In addition, the power generation unit (13) may include a printed circuit board (PBA) (132) that increases the potential difference generated by the thermoelectric element (131), and an energy storage unit (133) that is electrically connected to the printed circuit board (132) so that the converted electrical energy is stored. For example, the energy storage unit (133) may also be called and referred to as a battery.

[0057] The thermoelectric element (131) may include a heat absorbing plate (131a) that absorbs heat and a heat dissipating plate (131b) that releases heat. The heat dissipating plate (131b) may function as a heat sink.

[0058] A heat pipe (140) to be described later may be connected to the heat absorption plate (131a). Heat may be supplied from the heat pipe (140) to form a temperature difference with the heat dissipation plate (131b). The thermoelectric element (131) may generate an electromotive force due to a temperature difference, which is known as the Seebeck effect. Electrons may move within the thermoelectric element (131). In other words, current may flow in the thermoelectric element (131).

[0059] The thermoelectric element (131) may be electrically connected to a printed circuit board (PBA) (132). Current generated from the thermoelectric element (131) may flow to the printed circuit board (PBA) (132). The printed circuit board (PBA) (132) may be a boost circuit. The electromotive force output from the thermoelectric element (131) may be relatively small. Therefore, the electromotive force generated from the thermoelectric element (131) may be increased by the boost circuit. The energy storage unit (133) may be charged by the increased electromotive force.

[0060] The energy storage unit (133) may be a capacitor. However, it is not limited thereto and may be composed of various chemical batteries. For example, the energy storage unit (133) may be composed of a lithium-ion battery, a nickel-cadmium battery, or the like. However, due to its characteristics of being used in a high-temperature environment, it is preferable to be composed of a capacitor.

[0061] The energy storage unit (133) may be a supercapacitor. A supercapacitor is a capacitor with a larger storage capacity than a typical capacitor. Furthermore, it has the advantages of very fast charging and discharging speeds, numerous charging and discharging cycles, and semi-permanent use.

[0062] The sensor device (10) may include a heat transfer unit (14) configured to transfer heat generated from an external source to a thermoelectric element (131). For example, the external source may be a heated cooking vessel (C) or a heating device (2). Without being limited thereto, the external source may be configured in any manner as long as it can generate or transfer heat.

[0063] The heat transfer unit (14) may include a heat pipe (140) provided to transfer heat from the cooking vessel (C). The heat pipe (140) may be provided to be in contact with the cooking vessel (C). That is, the heat of the cooking vessel (C) may be conducted to the heat pipe (140). The conducted heat may be transferred to the heat absorption plate (131a) of the thermoelectric element (131).

[0064] Without being limited thereto, the heat transfer member (14) may be provided in various ways, such as a metal rod capable of conducting heat. As long as it can come into contact with the cooking vessel (C) and receive heat, it may be provided in any way.

[0065] A heat pipe (140) may extend from the sensor body (11). The heat pipe (140) may extend parallel to the probe (12). The heat pipe (140) may be positioned at a predetermined distance from the probe (12).

[0066] One side of the cooking vessel (C) may be positioned between the probe (12) and the heat pipe (140). In other words, the probe (12) may be positioned inside the cooking vessel (C), and the heat pipe (140) may be positioned outside the cooking vessel (C). Since the probe (120) and the heat pipe (140) are positioned inside and outside the cooking vessel (C), respectively, they may be mounted on the side of the cooking vessel (C).

[0067] The probe (12) can measure the temperature of the food inside the cooking vessel (C). Meanwhile, the heat pipe (140) comes into contact with the heated cooking vessel (C), so that heat can be conducted to the heat pipe (140).

[0068] Heat pipes (140) can transfer heat through conduction and convection. Heat pipes (140) are comprised of a metal pipe with a vacuum interior containing a small amount of refrigerant. For example, a copper pipe with high thermal conductivity may contain a small amount of water.

[0069] Not limited thereto, the heat pipe (140) may be a metal rod that transfers heat only through conduction. The heat pipe (140) may be formed of copper or silver, etc., which have high thermal conductivity.

[0070] When a temperature difference occurs between a heated portion and a cooled portion of a heat pipe (140), heat is transferred as the refrigerant convects. In this embodiment, heat conducted from the wall surface of the cooking vessel (C) can travel along the heat pipe (140) and be transferred to the heat absorption plate (131a) of the thermoelectric element (131).

[0071] The heat pipe (140) may have a cross-section that is approximately circular or rectangular. However, the present invention is not limited thereto, and the heat pipe (140) may have a cross-section that is arc-shaped to improve contact with the cooking vessel (C).

[0072] The heat pipe (140) can maintain a high temperature because it transfers heat. In addition, since the heat pipe (140) is located outside the cooking vessel (C), there is a risk of burns if it touches the user's skin. Therefore, the sensor device (10) may include a cover member (15) provided to surround the heat pipe (140). The cover member (15) may also be referred to as a cover (15).

[0073] The cover member (15) may be made of an insulating material to prevent heat transfer. For example, the cover member (15) may be formed of a material with low thermal conductivity, such as rubber or plastic. In addition, the cover member (15) may be made of an elastic material. The wall surface of the cooking vessel (C) may be a flat surface or a curved surface with various curvatures. The cover member (15) may have a predetermined elasticity to adhere closely to the wall surface of the cooking vessel (C).

[0074] The cover member (15) may include a cover body (151). A receiving space (S) into which a heat pipe (140) can be inserted may be formed in the cover body (151). The heat pipe (140) may be inserted into the cover member (15) and come into contact with the cooking vessel (C) from the outside of the cooking vessel (C).

[0075] The cover body (151) of the cover member (15) may include a holder (152) provided so that the sensor device (10) is mounted on one side of the cooking vessel (C). A mounting slot (152a) may be formed between the cover body (151) and the holder (152).

[0076] One side of a cooking vessel (C) can be inserted into the mounting slot (152a). One side of the cooking vessel (C) is inserted into the mounting slot (152a), so that the sensor device (10) can be mounted on the cooking vessel (C).

[0077] The wall of the cooking vessel (C) can be inserted into the mounting slot (152a). In order for the sensor device (10) to be stably mounted on the cooking vessel (C), the periphery of the mounting slot (152a) may be made of a material having high friction, such as rubber. Although not shown, a hook may be provided on the inside of the mounting slot (152a) in order for the mounting slot (152a) to be fixed to the cooking vessel (C) and the wall of the cooking vessel (C) to be stably fixed.

[0078] The cover member (15) may include an opening (153) that is partially open so that the inside of the cover member (15) communicates with the mounting slot (152a). The opening (153) may include a body opening (1531) formed on the cover body (151) side, and a mounting opening (1532) formed on the mounting side. In the present invention, both the body opening (1531) and the mounting opening (1532) are shown as being formed, but this is not limited to the case, and only the body opening (1531) may be formed.

[0079] The main body opening (1531) may be partially opened so that the heat pipe (140) can be exposed through the mounting slot (152a) of the cover main body (151). The heat pipe (140) may be provided to penetrate the cover member (15) and be supported by the heating device (2).

[0080] When one side of the cooking vessel (C) is inserted into the mounting slot (152a), the heat pipe (140) can be exposed outside the cover member (15) through the main body opening (1531). That is, the receiving space (S) can be communicated with the outside through the main body opening (1531). In other words, the heat pipe (140) received in the receiving space (S) can be exposed through the opening (153) and come into contact with one side of the cooking vessel (C).

[0081] A heat-conductive member (16) may be arranged inside the cover member (15). The heat-conductive member (16) may be arranged between the heat pipe (140) and the cooking vessel (C). Specifically, the accommodation space (S) in which the cover member (15) accommodates the heat pipe (140) may be filled with a heat-conductive material. The heat-conductive member (16) may be made of high-conductivity rubber or high-conductivity silicone. However, the present invention is not limited thereto, and the heat-conductive member (16) may also be made of a metal material. For example, the heat-conductive member (16) may be made of a material having high thermal conductivity, such as copper or silver. The heat-conductive member (16) may not be filled inside the cover member (15), but may be provided as a metal piece or the like so that it is in contact with both the cooking vessel (C) and the heat pipe (140).

[0082] The heat conductive member (16) may be arranged to surround the heat pipe (140). That is, even if the heat pipe (140) is not in direct physical contact with the cooking vessel (C), it may be in thermal contact with the heat conductive member (16). In other words, the heat conductive member (16) may mediate heat conduction from the cooking vessel (C) to transfer heat to the heat pipe (140).

[0083] In order to increase the contact area between the heat-conducting member (16) and the cooking vessel (C), the heat-conducting member (16) may be filled in the main body opening (1531) and the holder opening (1532). The main body opening (1531) and the holder opening (1532) may be connected to each other. That is, the heat-conducting member (16) may be filled in both the main body opening (1531) and the holder opening (1532).

[0084] The heat conducting member (16) can receive heat from both the inside and outside of the cooking vessel (C) inserted into the mounting slot (152a). Due to this structure, the heat conduction efficiency from the cooking vessel (C) to the heat pipe (140) can be increased.

[0085] The heat-conducting member (16) may be formed in an arc shape to increase the contact area with the cooking vessel (C). In addition, since the wall surface of the cooking vessel (C) may have various curvatures, the heat-conducting member (16) may also have a predetermined elasticity.

[0086] The cover member (15) may include a handle portion (15a). The handle portion (15a) may be formed on the cover body (151). A user may hold the handle portion (15a) and detach the sensor device (10) fixed to the cooking vessel (C). In the present embodiment, the handle portion (15a) is provided in the form of a hole, but is not limited thereto.

[0087] Figures 4 and 5 are drawings illustrating the generation and charging process by showing a sensor device fixed to a cooking vessel and the direction of heat movement.

[0088] Referring to FIGS. 4 and 5, the process of charging the energy storage unit (133) by receiving heat from the cooking vessel (C) is described.

[0089] The cooking vessel (C) can be inductively heated by electromagnetic induction. The temperature of the inductively heated cooking vessel (C) can rise. As the temperature of the cooking vessel (C) rises, heat can be transferred to the heat pipe (140).

[0090] The cooking vessel (C) may comprise a metal material. That is, the cooking vessel (C) may have a lower specific heat than the food containing moisture. In other words, heat is more efficiently transferred from the cooking vessel (C) than from water, which has a higher specific heat. Accordingly, the heat pipe (140) may be placed outside the cooking vessel (C).

[0091] The heat pipe (140) can receive heat when it comes into contact with the cooking vessel (C). The portion of the heat pipe (140) that comes into contact with the cooking vessel (C) can be heated. The portion of the heat pipe (140) where the heat is conducted can be relatively hot. Conversely, the portion of the heat pipe (140) that is far from the portion where the heat is conducted can be relatively cold. Heat can be transferred from a high-temperature portion to a low-temperature portion by a temperature gradient formed within the heat pipe (140). Heat can be transferred through conduction and convection within the heat pipe (140).

[0092] The sensor device (10) of FIG. 5 can be mediated by a heat-conducting member (16). When the heat-conducting member (16) fills both the main body opening (1531) and the holder opening (1532), the contact area with the cooking vessel (C) can be expanded. Accordingly, the heat conduction efficiency can be increased, and the amount of heat transferred to the thermoelectric element (131) through the heat pipe (140) can be increased. In other words, the amount of energy converted into electrical energy can be increased, and the charging of the energy storage unit (133) can be accelerated.

[0093] The heat pipe (140) can be connected to a thermoelectric element (131). Specifically, the heat pipe (140) can be connected to a heat absorption plate (131a) of the thermoelectric element (131). That is, heat transferred through the heat pipe (140) can be transferred to the heat absorption plate (131a).

[0094] The thermoelectric element (131) may include a heat dissipation plate (131b) separately from the heat absorption plate (131a). Both the heat absorption plate (131a) and the heat dissipation plate (131b) may be metal plates. The heat dissipation plate (131b) may include fins for heat dissipation. The heat absorption plate (131a) continuously receives heat from the cooking vessel (C), and the heat dissipation plate (131b) releases heat, so a temperature difference may be formed.

[0095] The thermoelectric element (131) may include semiconductor elements (not shown) between a heat absorption plate (131a) and a heat dissipation plate (131b). Specifically, semiconductor elements (not shown) may be bonded between the heat absorption plate (131a) and the heat dissipation plate (131b) to form a closed circuit.

[0096] Semiconductor elements (not shown) may include n-type semiconductors and p-type semiconductors. In the n-type semiconductor, electrons move toward the relatively low-temperature heat-absorbing plate (131a), and in the p-type semiconductor, holes move toward the relatively low-temperature heat-absorbing plate (131a). In this way, current flows in the direction opposite to the movement of electrons. In other words, thermal energy can be converted into electrical energy by the temperature difference formed in the thermoelectric element (131).

[0097] A wire may be connected to the heat-absorbing plate (131a). The generated current may be transmitted to a printed circuit board (PBA) (132) via the wire. The printed circuit board (132) may be a boost circuit. The printed circuit board (132) may boost the voltage generated by the thermoelectric element (131) to a voltage suitable for charging the energy storage unit (133).

[0098] Electrical energy can be stored in the energy storage unit (133) by the output voltage. At this time, electrons can be attached to the positive electrode of the energy storage unit (133) and holes can be attached to the negative electrode. The energy storage unit (133) can be continuously charged while receiving heat from the cooking vessel (C). That is, the energy storage unit (133) can be charged while the sensor device (10) is placed on the cooking vessel (C) and used. When the energy storage unit (133) is a supercapacitor, the energy storage unit (133) can be fully charged in about 3 minutes.

[0099] Fig. 6 is a control block diagram for explaining the operation of a sensor device and a heating device according to one embodiment. Fig. 7 is a flowchart for explaining the operation of a sensor device and a heating device according to one embodiment.

[0100] Referring to FIGS. 6 and 7, the operation process of the sensor device (10) and the heating device (2) will be described.

[0101] The sensor device (10) may include a temperature sensor (121), an energy storage unit (133), an input interface (111), a control unit (100), a driving unit (101), and a communication unit (102). The temperature sensor (121) may detect the temperature of the food. By detecting the temperature of the food, temperature data may be obtained. If the food is meat, fish, etc., the temperature inside the food may be measured. If the food is a liquid such as soup, the temperature of the food may be measured to obtain temperature data on whether it is above the boiling point.

[0102] In the energy storage unit (133), data on the remaining energy amount charged in the energy storage unit (133) (also referred to as 'state of charge (SoC)' or 'battery level') can be measured. The remaining charge amount of the energy storage unit (133) can be measured. A voltage measurement method, a current measurement method, or the like can be used as a method for measuring the remaining charge amount of the energy storage unit (133).

[0103] The input interface (111) can receive input from a user. The input interface (111) can be provided in various ways, such as a switch, a button, or a touch pad. Without being limited thereto, the input interface (111) can include a voice recognition module.

[0104] The control unit (100) can control the overall operation of the sensor device (10). The control unit (100) can control the driving unit (101) and the communication unit (102).

[0105] The control unit (100) can receive temperature data of the food from the temperature sensor (121). The control unit (100) can control the communication unit (102) based on the temperature data received from the temperature sensor (121). In addition, the drive unit (101) can be controlled based on the remaining amount of the energy storage unit (133) and / or a signal input to the input interface (111).

[0106] The control unit (100) of the sensor device (10) can store an operation value for the drive unit (101) to turn on the power of the sensor device (10). The drive unit (101) can turn on the power of the sensor device (10) based on the remaining amount of the energy storage unit (133) if the remaining amount of the energy storage unit (133) is equal to or greater than the operation value. In addition, the drive unit (101) can turn off the power of the sensor device (10) if the remaining amount of the energy storage unit (133) is less than the operation value.

[0107] The communication unit (102) can enable communication between the sensor device (10) and the heating device (2). The communication unit (102) can communicate with the communication unit (202) of the heating device (2) via Bluetooth. However, the present invention is not limited thereto, and communication can be achieved via various methods such as NFC, WLAN, and Zigbee. Hereinafter, the communication unit (102) of the sensor device (10) and the communication unit (202) of the heating device (2) will be described as communicating via Bluetooth.

[0108] The communication unit (102) can receive temperature data of the food measured by the temperature sensor (121) of the sensor device (10) and / or remaining amount data of the energy storage unit (133). Based on the received data, the communication unit (102) can communicate with the communication unit (202) of the heating device (2).

[0109] The communication unit (102) of the sensor device (10) can transmit temperature data of the food to the communication unit (202) of the heating device (2). The control unit (200) of the heating device (2) can control the heat power of the cooking zone (22) based on the temperature data of the food received by the communication unit (202). When a user has set a desired temperature in advance through the input interface (23b), the control unit (200) of the heating device (2) can control the current applied to the coil under the cooking zone (22) to be continuously provided until the temperature of the food detected by the sensor device (10) reaches the temperature preset by the user.

[0110] Additionally, when the temperature of the food detected by the sensor device (10) reaches a temperature preset by the user, the cooking control unit can control the intensity of the current applied to the coil located below the cooking zone (22) to operate a timer to maintain the temperature of the food for a required period of time.

[0111] In addition, for example, when a user selects the “soup / tang without boiling over” or “water without boiling over” function through the input interface (23b), the cooking control unit can adjust the intensity of the current applied to the coil located below the cooking zone (22) so that the food prepared inside the cooking vessel (C) does not overflow into the cooking vessel (C).

[0112] As another example, when a user selects the “rare / medium / well-done” function of meat through the input interface (23b), the control unit (200) of the heating device (2) can adjust the intensity of the current applied to the coil located below the cooking zone (22) to cook the meat to the desired state of the user based on the temperature of the meat detected by the sensor device (10).

[0113] The communication unit (102) can receive energy remaining data of the energy storage unit (133) measured in the energy storage unit (133) of the sensor device (10) and transmit it to the communication unit (202) of the heating device (2). When the sensor device (10) is placed in the cooking vessel (C) and heated, the energy storage unit (133) of the sensor device (10) can be charged by converting thermal energy into electrical energy.

[0114] When the remaining amount of the energy storage unit (133) of the sensor device (10) becomes greater than the operating value, the driving unit (101) of the sensor device (10) can turn on the power of the sensor device (10). At this time, the communication unit (102) of the sensor device (10) can automatically be paired with the communication unit (202) of the heating device (2) via Bluetooth. However, the present invention is not limited thereto, and after the power of the sensor device (10) is turned on, the user can also operate the input interface (111) to perform Bluetooth pairing with the heating device (2).

[0115] The temperature sensor (121) of the sensor device (10) can measure the temperature of the food to obtain temperature data. The control unit (100) of the sensor device (10) can receive the temperature data and transmit it to the communication unit (102). The communication unit (102) of the sensor device (10) can transmit the temperature data to the communication unit (202) of the heating device (2). The communication unit (202) of the heating device (2) can receive the temperature data and transmit it to the control unit (200). The control unit (200) of the heating device (2) can cook the food based on the received temperature data.

[0116] Meanwhile, information on the food can be recognized on the input interface (23b) of the heating device (2). The heating device (2) can receive the information on the food and automatically perform cooking based on the stored food temperature data and / or recipe information. When the remaining battery level of the sensor device (10) is lower than the operating value and the sensor device (10) is turned off, the sensor device (10) installed on the cooking container (C) can be turned on simply by the heating device (2) heating the cooking container (C), and the sensor device (10) and the heating device (2) can be automatically paired via Bluetooth.

[0117] The heating device (2) may include a sensor unit (24) configured to detect the temperature of the cooking vessel (C) or the temperature of the cooking zone (22). When the temperature of the cooking vessel (C) or the cooking zone (22) overheats, the sensor unit (24) transmits a signal to the control unit (200), so that the control unit (200) can adjust the intensity of the current flowing in the coil.

[0118] The sensor unit (24) can detect whether a cooking vessel (C) is placed in the cooking zone (22). When a signal to heat the heating device (2) is input even though the cooking vessel (C) is not placed in the cooking zone (22), the sensor unit (24) can transmit a signal to the control unit (200) to control the intensity of the current flowing in the coil.

[0119] The output unit (203) or outputter (203) may be provided to output the remaining amount of the energy storage unit (133) of the sensor device (10). When the communication unit (102) of the sensor device (10) transmits data on the remaining amount of the energy storage unit (133) to the communication unit (202) of the heating device (2), the output unit (203) of the heating device (2) may output the remaining amount data of the energy storage unit (133). Alternatively, the output unit (203) may also output the remaining amount of the energy storage unit (133) of the sensor device (10) in voice.

[0120] Hereinafter, a description will be given of an embodiment other than the sensor device (10) of FIGS. 1 to 7. Referring to FIGS. 8 to 10, a description will be given of a sensor device according to another embodiment of the present invention. The same components as those of the embodiments illustrated in FIGS. 1 to 7 are assigned the same reference numerals, and a detailed description thereof may be omitted.

[0121] FIG. 8 is a drawing illustrating a sensor device according to one embodiment in which a heat pipe is arranged within a probe.

[0122] The sensor device (10-1) may include a plurality of heat transfer units (14-1).

[0123] The heat transfer unit (14-1) may include a first heat pipe (141) and a second heat pipe (142) extending parallel to the first heat pipe (141). The sensor device (10-1) may receive heat from the first heat pipe (141) and / or the second heat pipe (142).

[0124] The first heat pipe (141) can receive heat from the cooking vessel (C). That is, the first heat pipe (141) can be in thermal contact with the cooking vessel (C). The second heat pipe (142) can receive heat from the food to be cooked. Similarly, the second heat pipe (142) can be in thermal contact with the food to be cooked.

[0125] The second heat pipe (142) can be placed inside the probe (12). The probe (12) can be located inside the cooking vessel (C). The probe (12) can measure the temperature of the food contained in the cooking vessel (C). Since the second heat pipe (142) is located inside the food so that the probe (12) can measure the temperature, it can receive heat from the food.

[0126] That is, the sensor device (10-1) can transfer heat through the first heat pipe (141) and / or the second heat pipe (142). Specifically, the first heat pipe (141) can receive heat by coming into contact with a part of the cooking vessel (C), and the second heat pipe (142) can receive heat from food inside the cooking vessel (C).

[0127] The sensor device (10-1) may include an insulating film (134) disposed between the thermoelectric element (131) and the printed circuit board (132). The insulating film (134) may block heat transferred to the thermoelectric element (131) from being transferred to the printed circuit board (132). In the present illustration, the thermoelectric element (131) and the printed circuit board (132) are depicted as being disposed left and right, but this is not limited thereto. It is sufficient for the insulating film (134) to be disposed between the thermoelectric element (131) and the printed circuit board (132) so as to block heat transferred to the thermoelectric element (131) from being transferred to the printed circuit board (132).

[0128] The insulating film (134) may also be included in the sensor device (10) of FIGS. 1 to 7. In addition, the insulating film (134) may also be included in the sensor device (10-2) of FIG. 9 and the sensor device (10-3) of FIG. 10.

[0129] Figure 9 is a drawing illustrating a sensor device capable of adjusting the length of a heat pipe.

[0130] The sensor device (10-2) may include a heat transfer unit (14-2) that is provided to be extendable from the sensor body (11).

[0131] The heat transfer unit (14-2) may include a heat pipe (140-2) extendable from the sensor body (11). The heat pipe (140-2) needs to be provided in various lengths depending on the type of cooking vessel (C) in which the sensor device (10-2) is placed.

[0132] The heat pipe (140-2) may be long if the cooking vessel (C) is deep, and may be short if the cooking vessel (C) is shallow. The heat pipe (140-2) may be configured in multiple stages.

[0133] The heat pipe (140-2) may be configured in multiple stages with different diameters. The smaller diameter portion of the heat pipe (140-2) may be inserted or withdrawn by sliding into the larger diameter portion. In this way, the length of the heat pipe (140-2) may be adjusted.

[0134] Figure 10 is a drawing showing a state in which a sensor device, which is arranged so that the tip of the probe can be bent, is placed on a cooking vessel to measure the temperature of the food being cooked.

[0135] In order to measure the temperature of a solid food (e.g., meat, fish, etc.) rather than a liquid food using the sensor device (10-3), the probe (12-3) of the sensor device (10-3) must be inserted into the food. Therefore, the sensor device (10-3) cannot measure the temperature of a solid food unless the user moves the sensor device (10-3) while it is placed on the cooking vessel (C).

[0136] The sensor device (10-3) may include a probe (12-3) that is provided to be foldable. The probe (12-3) may be placed in a cooking vessel (C) and may measure the temperature of food, such as meat or fish.

[0137] The temperature sensor (121) of the probe (12-3) may be located at one end of the probe (12-3), that is, at the end opposite to the sensor body (11). The probe (12-3) may include a bending portion (122-3) so that the end of the probe (12-3) where the temperature sensor (121) is located may be bent. The bending portion (122-3) may be formed at a part of the probe (12-3). The bending portion (122-3) may be provided at a position adjacent to the temperature sensor (121). The bending portion (122-3) may be formed approximately in the middle along the longitudinal direction of the probe (12-3). However, the present invention is not limited thereto, and the bending portion (122-3) may be formed at any part of the probe (12-3). Even if the depth of the cooking vessel (C) is shallow, for example, in a frying pan, the temperature of the food can be measured while the sensor device (10-3) is placed in the cooking vessel (C).

[0138] The folded portion (122-3) may be formed in a folded structure, as shown in the present illustration. However, the present invention is not limited thereto, and the folded portion (122-3) may be formed in the form of a hinge or the like.

[0139] The bent portion (122-3) may be a smooth portion of the probe (12-3) that is bent. That is, the probe (12-3) may have a bent shape rather than a straight rod shape. The angle at which the probe (12-3) is bent may be approximately a right angle.

[0140] A sensor device according to one embodiment includes a sensor body (11) including a thermoelectric element (131) that generates voltage by a temperature difference, a probe (12) mounted on the body and including a temperature sensor (121) capable of measuring the temperature of food contained in a cooking vessel (C), and a heat pipe (140) arranged spaced apart from the probe and provided to transfer heat conducted from the cooking vessel to the thermoelectric element. The body may include a printed circuit board (132) to which current generated from the thermoelectric element is applied and an energy storage unit (133) electrically connected to the printed circuit board. According to the present disclosure, the sensor device can be charged by receiving heat from a heating device. According to the present disclosure, the sensor device can be charged without a separate charger. According to the present disclosure, the sensor device can measure the temperature of food.

[0141] A portion of the cooking vessel may be positioned between the probe and the heat pipe. According to the present disclosure, the sensor device may be charged by receiving heat from the heating device. According to the present disclosure, the sensor device may be charged simultaneously with temperature measurement.

[0142] The above battery may include a super capacitor. According to the present disclosure, the battery can be charged and discharged quickly.

[0143] A cover member (15) covering the heat pipe may be further included. According to the present disclosure, burns caused by the heat pipe can be prevented.

[0144] The above-described insulating cover may include a mounting slot (152a) provided to allow the sensor device to be mounted on the cooking vessel. According to the present disclosure, the sensor device can be stably fixed to the cooking vessel.

[0145] The heat pipe may be exposed through the mounting slot so as to be in contact with the cooking vessel.

[0146] A heat-conducting member (16) may be further included, which is placed inside the above-described insulating cover and is in contact with one surface of the cooking vessel to mediate heat conduction to the heat pipe. According to the present disclosure, the contact area with the cooking vessel may be increased, thereby increasing heat conduction efficiency.

[0147] An insulating film (134) may be further included, which is positioned between the thermoelectric element and the printed circuit board and blocks heat from being transferred to the printed circuit board. According to the present disclosure, overheating of the printed circuit board can be prevented.

[0148] The heat pipe may be configured to extend from the main body. According to the present disclosure, the length of the heat pipe may be adjusted.

[0149] The heat pipe is a first heat pipe (141), and may further include a second heat pipe (142) disposed inside the probe to transfer heat conducted from the food to the thermoelectric element. According to the present disclosure, heat can be transferred from not only the cooking vessel but also the food.

[0150] The temperature sensor may be positioned at one end of the probe, and the one end of the probe may include a bendable portion (122-3) that is provided to be bendable. According to the present disclosure, the temperature inside the food can be measured even when the sensor device is fixed to the cooking vessel.

[0151] The above body may be formed with a heat dissipation hole (11a). According to the present disclosure, heat inside the body can be dissipated. According to the present disclosure, overheating of the power generation unit can be prevented.

[0152] The cooking appliance on which the cooking vessel is placed heats the cooking vessel and the food, and the heat transferred to the cooking vessel is stored in the battery through the thermoelectric element and the printed circuit board, and the cooking appliance includes a control unit (100) configured to turn on and off the power of the sensor device, and the control unit can control to turn on the power of the sensor device when the remaining amount stored in the battery is equal to or greater than an operating value, and to charge the battery when the amount of energy stored in the battery is less than the operating value. According to the present disclosure, the power of the sensor device can be turned on simply by placing the sensor device on a heated cooking vessel.

[0153] The sensor device may further include a communication unit (102) configured to communicate with the cooking appliance when the power is turned on, and the communication unit may be arranged to transmit the temperature value measured by the temperature sensor to the cooking appliance.

[0154] According to one embodiment, a cooking appliance includes a heating device (2) on which a cooking vessel (C) containing food is placed, and a sensor device (10) provided to be mounted on the cooking vessel. The sensor device may include a probe (12) including a temperature sensor (121) provided to come into contact with the food to measure the temperature of the food, a power generation unit (13) including a thermoelectric element (131) that converts thermal energy into electrical energy, a printed circuit board (132) to which current generated from the thermoelectric element is applied, and an energy storage unit (133) electrically connected to the printed circuit board, and a heat pipe (140) provided to transfer heat generated in the cooking vessel to the thermoelectric element, the heat pipe extending parallel to and spaced apart from the probe and provided such that a portion of the cooking vessel is positioned between the probe and the heat pipe. According to the present disclosure, the sensor device may measure the temperature of the food. According to the present disclosure, the sensor device may be charged by receiving heat from the cooking vessel. According to the present disclosure, the sensor device can be charged simultaneously with temperature measurement.

[0155] The sensor device may further include a mounting slot (152a) provided to be mounted on the cooking vessel, and a cover member (15) provided to expose the heat pipe through the mounting slot. According to the present disclosure, the sensor device can be stably fixed to the cooking vessel. According to the present disclosure, the sensor device can be charged simultaneously with temperature measurement.

[0156] The sensor device may further include a heat-conducting member (16) that is filled inside the insulating cover and is provided to contact the cooking vessel to mediate heat conduction to the heat pipe. According to the present disclosure, the contact area with the cooking vessel may be increased, thereby increasing heat conduction efficiency.

[0157] The sensor device further includes a control unit (100) configured to turn the power of the sensor device on and off, and the control unit can control the power of the sensor device to turn on when the amount of energy stored in the battery is greater than or equal to an operating value, and to charge the battery when the amount of energy stored in the battery is less than the operating value. According to the present disclosure, the power of the sensor device can be turned on simply by placing the sensor device on a heated cooking vessel.

[0158] The sensor device further includes a communication unit (102) configured to be capable of communicating with the cooking appliance when the sensor device is powered on, and the communication unit may be arranged to transmit a temperature value measured by the temperature sensor to the cooking appliance.

[0159] The above battery is a cooking appliance including a super capacitor. According to the present disclosure, the battery can be charged and discharged quickly.

[0160] According to the present disclosure, the sensor device can measure the temperature of the food.

[0161] According to the present disclosure, the sensor device can be charged by receiving heat from the cooking vessel.

[0162] According to the present disclosure, the sensor device can be charged simultaneously with temperature measurement.

[0163] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains from the description below.

[0164] FIG. 11 is a drawing illustrating an induction heating device according to one embodiment of the present disclosure, a cooking vessel placed on the induction heating device, and a sensor device mounted on the cooking vessel. FIG. 12 is an exploded view illustrating a cooking plate in the induction heating device of FIG. 11 in an exploded view.

[0165] Referring to FIGS. 11 and 12, the cooking appliance (1) may include an induction heating device (2A) and a sensor device (10A) configured to measure the temperature of food heated by the induction heating device (2A).

[0166] A sensor device (10A) according to one embodiment of the present disclosure can be used with various types of heating devices (2). The heating device (2) may be provided in any manner as long as it can heat the heat transfer unit (14A) described below.

[0167] The heating device (2) may be, but is not limited to, a heating induction device (2A). For example, the heating device (2) may be a gas burner, a hot plate, a highlighter, etc. A hot plate is a heating device in which heat is generated from a high-temperature iron plate itself, and a highlighter is a heating device in which heat is emitted from a heating wire located under a ceramic plate.

[0168] When the heating device (2) is composed of a gas burner, hot plate, highlighter, etc., heat can be transferred to the heat transfer unit (14A), and when it is composed of an induction heating device (2A), heat can be generated by induction heating the heat transfer unit (14A).

[0169] In this way, the heat transfer unit (14A) can be provided to transfer heat generated from an external source to the thermoelectric element (131). Specifically, when the heating device (2) is a gas burner, hot plate, highlighter, etc., it can be a heat source that transfers heat to the heat transfer unit (14A). When the heating device (2) is an induction heating device (2A), it can be a source that supplies a magnetic field so that heat is generated in the heat transfer unit (14A).

[0170] Meanwhile, the heating device (2) may be configured to include a gas burner, a hot plate, a highlighter, and an induction heating device. That is, the cooking zone (22a) may be heated by induction heating, and the cooking zones (22b, 22c) may be heated by a highlighter.

[0171] Hereinafter, it will be described that the heating device (2) is an induction heating device (2A).

[0172] The induction heating device (2A) may include a main body (20) and a cooking plate (21A) placed on the upper side of the main body (20).

[0173] The main body (20) may form part of the exterior of the induction heating device (2A). Induction heating coils (24a, 24b, 24c) are accommodated inside the main body (20) and can generate a magnetic field to inductively heat the cooking vessel (C). The induction heating coils (24a, 24b, 24c) may be electrically connected to a main board (not shown) provided inside the main body (20) via a cable (25).

[0174] The cooking plate (21A) may include cooking zones (22a, 22b, 22c) corresponding to induction heating coils (24a, 24b, 24c). A cooking vessel (C) may be placed in the cooking zones (22a, 22b, 22c). That is, the cooking zones (22a, 22b, 22c) may be formed on the upper surface of the cooking plate (21A). The number and positions of the cooking zones (22a, 22b, 22c) are not limited to the present embodiment.

[0175] A control panel (23) may be provided on the cooking plate (21A). The control panel (23) may provide a user interface for interaction between a user and the induction heating device (2A). The user interface may include at least one input interface (23b) and at least one output interface (23a).

[0176] The input interface (23b) can convert sensory information received from the user into an electrical signal. For example, it can include a tact switch, a push switch, a slide switch, a toggle switch, a micro switch, a touch switch, a touch pad, a touch screen, a jog dial, and / or a microphone.

[0177] The input interface (23b) may include a power button, an operation button, a fire power control button, etc.

[0178] The output interface (23a) can visually or audibly convey information related to the operation of the cooking appliance (1) to the user.

[0179] The output interface (23a) can output to a screen, indicator, voice, etc. At least one output interface can include, for example, a liquid crystal display (LCD) panel, a light emitting diode (LED) panel, a speaker, etc.

[0180] The induction heating device (2A) may include a communication unit for communicating with the sensor device (10A) via wire and / or wirelessly. A communication method between the induction heating device (2A) and the sensor device (10A) will be described later.

[0181] The cooking vessel (C) may be formed of a magnetic metal. When a magnetic field generated by an induction heating coil (24a, 24b, 24c) passes through the metal forming the cooking vessel (C), an eddy current is generated due to the resistance of the metal (e.g., iron) of the cooking vessel (C). The eddy current generated in the cooking vessel (C) can heat the cooking vessel (C) and thus the food inside it.

[0182] Cooking utensils (C) may include pots, frying pans, steamers, rice cookers, etc. The types of cooking utensils (C) are not limited to these. In this section, a pot will be used as an example.

[0183] The cooking plate (21A) may be provided in a flat shape so that a cooking vessel (C) can be placed on its upper surface. In addition, the cooking plate (21A) may be formed of a material with a predetermined heat resistance and strength so as not to be easily damaged by impact, heat, etc. For example, the cooking plate (21A) may be formed of tempered glass such as ceramic glass.

[0184] A circuit board (26) may be placed under the cooking plate (21A). The circuit board (26) may include a display portion (26a) and a touch portion (26b).

[0185] The display unit (26a) may be arranged to correspond to the output interface (23a) of the cooking plate (21A). The display unit (26a) may display whether the cooking vessel (C) is heated by the induction heating coil (24a, 24b, 24c). Accordingly, the user can check whether the cooking vessel (C) is heated through the output interface (23a).

[0186] The touch unit (26b) may be arranged to correspond to the input interface (23b) provided on the cooking plate (21A). The touch unit (26b) may receive a touch signal from the input interface (23b). For example, the touch unit (26b) may receive input using a capacitive touch method. However, the present invention is not limited thereto, and the touch unit (26b) may also receive input using a pressure-sensitive touch method. The user may control the current flowing to the induction heating coils (24a, 24b, 24c) through the input interface (23b), and determine the degree to which the cooking vessel (C) is heated.

[0187] An induction heating coil (24a, 24b, 24c) can be mounted on the coil mounting plate (28). A coil mounting hole (28a) for mounting the induction heating coil (24a, 24b, 24c) can be provided on the coil mounting plate (28). A plurality of coil mounting holes (28a) can be provided.

[0188] The elastic member (27) can be placed on the coil mounting plate (28). For example, the elastic member (27) can maintain a distance between the coil mounting plate (28) and the cooking plate (21A).

[0189] Fig. 13 is a perspective view illustrating a sensor device according to one embodiment of the present disclosure. Fig. 14 is a cross-sectional view illustrating the sensor device of Fig. 13 mounted on a cooking vessel.

[0190] Referring to FIGS. 13 and 14, the sensor device (10A) may include a sensor body (11A) that is provided to be held by a user. A printed circuit board (132) and an energy storage unit (133), which will be described later, may be placed inside the sensor body (11A).

[0191] The sensor body (11A) may include an input interface (111) that allows a user to input information to pair the sensor device (10A) and the induction heating device (2A). The input interface (111) may be positioned on the upper side of the sensor body (11A). The input interface (111) may be provided as a button. However, the present invention is not limited thereto, and may be provided as a touch panel, a switch, or the like.

[0192] The sensor device (10A) may include a probe (12A) mounted on a sensor body (11A) to detect the temperature of the food. The probe (12A) may include a temperature sensor (121) inside. The temperature sensor (121) may be provided at one end of the probe (12A). That is, the temperature sensor (121) may be located on the opposite side from which the probe (12A) is fixed to the sensor body (11A).

[0193] The temperature sensor (121) may be a thermistor whose resistance value changes depending on temperature. Specifically, the temperature sensor (121) may be an NTC thermistor. However, it is not limited thereto and may be a PTC thermistor or may be provided as another type of temperature sensor.

[0194] The probe (12A) may be formed of a heat-resistant metal material. For example, the probe (12A) may be formed of stainless steel, but is not limited thereto. Additionally, the probe (12A) may be formed of a waterproof material to prevent liquids or the like from seeping into the interior.

[0195] The probe (12A) can be detachably coupled to the sensor body (11A). Specifically, one end of the probe (12A) can be detachably coupled to the sensor body (11A).

[0196] The probe (12A) may be formed in a rod shape. The probe (12A) may be formed with a pointed end, i.e., the portion where the temperature sensor (121) is located, so that it can be inserted into food ingredients such as meat or fish. However, the probe (12A) is not limited thereto and may also be used to measure the temperature of liquid foods such as soup.

[0197] The probe (12A) may include a probe cable (12c) that is configured to be electrically connected to a printed circuit board (132) to be described later. The probe cable (12c) may transmit temperature data measured by the temperature sensor (121) to the printed circuit board (132). The probe cable (12c) may include an insulating material to ensure heat resistance.

[0198] The sensor device (10A) may include a power generation unit (13) that generates electrical energy from a temperature difference. The power generation unit (13) may include a thermoelectric element (131) that generates a potential difference due to a temperature difference.

[0199] The sensor device (10A) may include a thermoelectric element (131) that generates a potential difference due to a temperature difference. The thermoelectric element (131) may be configured to convert thermal energy into electrical energy or electrical energy into thermal energy.

[0200] The sensor device (10A) may include a printed circuit board (PBA) (132) to which a current generated from a thermoelectric element (131) is applied, and an energy storage unit (133) electrically connected to the printed circuit board (132) so that converted electrical energy is stored.

[0201] A thermoelectric element (131) may include a heat absorbing portion (131a) that absorbs heat and a heat dissipating portion (131b) that releases heat. The heat dissipating portion (131b) may function as a heat sink and maintain a relatively low temperature.

[0202] A heat pipe (141A) to be described later may be connected to the heat absorbing portion (131a). Heat may be supplied from the heat pipe (141A) to form a temperature difference with the heat dissipating portion (131b). The thermoelectric element (131) may generate an electromotive force due to a temperature difference, which is known as the Seebeck effect. Electrons may move within the thermoelectric element (131). In other words, current may flow in the thermoelectric element (131).

[0203] The thermoelectric element (131) may be electrically connected to a printed circuit board (PBA) (132). Current generated in the thermoelectric element (131) may flow to the printed circuit board (PBA) (132). The printed circuit board (PBA) (132) may include a boosting circuit and a regulator circuit.

[0204] Additionally, the printed circuit board (132) may include a temperature processing circuit that processes temperature data detected from a temperature sensor (121), an induction heating device (2A), and / or a communication unit (102, see FIG. 6) that enables communication with an external device.

[0205] The electromotive force output from the thermoelectric element (131) may be relatively small. Therefore, the electromotive force generated from the thermoelectric element (131) may be increased by a boosting circuit. The energy storage unit (133) may be charged by the increased electromotive force.

[0206] The energy storage unit (133) may be a capacitor. However, it is not limited thereto and may be composed of various chemical batteries. For example, the energy storage unit (133) may be composed of a lithium-ion battery, a nickel-cadmium battery, or the like. However, due to its characteristics of being used in a high-temperature environment, it is preferable to be composed of a capacitor.

[0207] The energy storage unit (133) may be a supercapacitor. A supercapacitor is a capacitor with a larger storage capacity than a typical capacitor. Furthermore, it has the advantages of very fast charging and discharging speeds, numerous charging and discharging cycles, and semi-permanent use.

[0208] The sensor device (10A) may include a supporter (17) that is spaced apart from the probe (12A). A portion of the cooking vessel (C) may be positioned in the spaced apart space between the probe (12A) and the supporter (17). The probe (12A) may be positioned on the inside of the cooking vessel (C), and the supporter (17) may be positioned on the outside of the cooking vessel (C) and may be mounted on the cooking vessel (C). Specifically, the circumferential surface of the cooking vessel (C) may be positioned in the spaced apart space between the probe (12A) and the supporter (17).

[0209] The supporter (17) may be arranged to support the sensor device (10A) on the cooking plate (21A). That is, the supporter (17) may be in physical contact with the cooking plate (21A) to support the sensor device (10A).

[0210] The supporter (17) may be made of a material with high friction so that it can stably support the sensor device (10A) by contacting the cooking plate (21A). Furthermore, the supporter (17) may include a material with insulating and heat-resistant properties. For example, the supporter (17) may include silicone or rubber.

[0211] A heat generating unit (140A) and a heat pipe (141A), which will be described later, may be arranged inside the supporter (17). The supporter (17) can prevent a user from being burned by heat generated or transmitted from the heat generating unit (140A) and the heat pipe (141A).

[0212] The supporter (17) may include a supporter body (171) extending from the sensor body (11). The supporter body (171) may have a roughly rod shape. The supporter body (171) may extend parallel to the probe (12A).

[0213] The supporter body (171) can be hinge-coupled to the sensor body (11A). That is, the supporter body (171) can be rotated about the hinge coupled to the sensor body (11) as a rotation axis. In other words, the supporter (17) can be angle-adjusted with respect to the probe (12A). Since the supporter (17) is provided to be angle-adjustable with respect to the probe (12A), the sensor device (10A) can be supported on the cooking plate (21A) even if the height of the cooking vessel (C) changes.

[0214] The supporter (17) may include a contact portion (172) provided on a portion of the supporter body (171). The contact portion (172) may be provided on one end of the supporter body (171). The contact portion (172) may be provided on an end of the supporter body (171) adjacent to the cooking plate (21). The contact portion (172) may have a cross-sectional area wider than the cross-sectional area of ​​the supporter body (171). By ensuring an area where the contact portion (172) can contact the cooking plate (21A), the supporter (17) can stably support the sensor device (10A).

[0215] The sensor device (10A) may include a heat transfer unit (14A) configured to transfer heat generated from an external source to a thermoelectric element (131). For example, the external source may be a heated cooking vessel (C) or an induction heating device (2A). Without being limited thereto, the external source may be configured in any manner that generates or transfers heat.

[0216] The heat transfer unit (14A) may include a heat generating unit (140A) configured to generate heat by an induction heating device (2A). The heat generating unit (140A) may be configured to be inductively heated by a magnetic field generated by an induction heating coil (24b). That is, the heat generating unit (140A) may be a magnetic material. Specifically, the heat generating unit (140A) may be a metal having magnetism. For example, the heat generating unit (140A) may include iron or the like.

[0217] The heat generating unit (140A) may be positioned adjacent to the induction heating coil (24b) in order to be inductively heated by the induction heating coil (24b). That is, the heat generating unit (140A) may be positioned inside the contact unit (172). At least a portion of the heat generating unit (140A) may be positioned within the magnetic field area of ​​the induction heating coil (24b) while the sensor device (10A) is mounted on the cooking vessel (C).

[0218] Additionally, the magnetic field region of the induction heating coil (24b) may include a region where a magnetic field generated by the induction heating coil (24b) is formed. The magnetic field region of the induction heating coil (24b) may include a vertical region of the induction heating coil (24b) and its surroundings.

[0219] At least a portion of the heat generating unit (140A) may be positioned within a vertical region of the induction heating coil (24b). The vertical region of the induction heating coil (24b) may include a region vertically above the region where the induction heating coil (24b) is positioned. That is, at least a portion of the heat generating unit (140A) may be positioned to overlap with the induction heating coil (24b) in a vertical direction.

[0220] The heat transfer unit (14A) may include a heat pipe (141A) that is arranged to transfer heat generated from the heat generation unit (140A) to the thermoelectric element (131). The heat pipe (141A) may be placed inside the supporter (17).

[0221] The heat pipe (141A) may be thermally connected to the heat generating unit (140A). That is, the heat pipe (141A) may be connected to the heat generating unit (140A) so that heat can be transferred thereto. For example, the heat pipe (141A) may receive heat from the heat generating unit (140A) by conduction, convection, or radiation.

[0222] The heat pipe (141A) can be inserted into the heat generating unit (140A). The heat generating unit (140A) may be provided with an insertion hole (not shown) into which the end of the heat pipe (141A) can be inserted. In addition, the heat pipe (141A) may be joined to the heat generating unit (140A) through welding. For example, when the heat generating unit (140A) includes iron and the heat pipe (141A) includes copper, the two may be joined through welding between dissimilar metals.

[0223] A heat pipe (141A) can transfer heat through conduction and convection. The heat pipe (141A) may be configured as a metal pipe with a vacuum interior containing a small amount of refrigerant. For example, a copper pipe with high thermal conductivity may contain a small amount of water.

[0224] Not limited thereto, the heat pipe (141A) may be a metal rod that transfers heat only through conduction. The heat pipe (141A) may be formed of copper or silver, which have high thermal conductivity.

[0225] When a temperature difference occurs between a heated portion and a cooled portion of a heat pipe (141A), heat can be transferred as the refrigerant convects. In this embodiment, heat conducted from the wall surface of the cooking vessel (C) can travel along the heat pipe (141A) and be transferred to the heat absorbing portion (131a) of the thermoelectric element (131).

[0226] The heat pipe (141A) may have a cross-section that is approximately circular or rectangular. However, the shape of the heat pipe (141A) is not limited thereto and may be provided in various shapes.

[0227] The heat pipe (141A) can be connected to the thermoelectric element (131). Specifically, the heat pipe (141A) can be connected to the heat absorbing portion (131a) of the thermoelectric element (131). That is, heat transferred through the heat pipe (141A) can be transferred to the heat absorbing portion (131a).

[0228] The thermoelectric element (131) may include a heat dissipation portion (131b) separately from the heat absorption portion (131a). Both the heat absorption portion (131a) and the heat dissipation portion (131b) may be metal plates. The heat dissipation portion (131b) may include fins for heat dissipation. The heat absorption portion (131a) continuously receives heat from the cooking vessel (C), and the heat dissipation portion (131b) releases heat, so a temperature difference may be formed.

[0229] The thermoelectric element (131) may include semiconductor elements (not shown) between the heat absorbing portion (131a) and the heat dissipating portion (131b). Specifically, semiconductor elements (not shown) may be bonded between the heat absorbing portion (131a) and the heat dissipating portion (131b) to form a closed circuit.

[0230] Semiconductor elements (not shown) may include n-type semiconductors and p-type semiconductors. In the n-type semiconductor, electrons move toward the relatively low-temperature heat-absorbing portion (131b), and in the p-type semiconductor, holes move toward the relatively low-temperature heat-absorbing portion (131b). In this way, current flows in the direction opposite to the movement of electrons. In other words, thermal energy can be converted into electrical energy by the temperature difference formed in the thermoelectric element (131).

[0231] The thermoelectric element (131) may include a cable (131c) for applying the generated current to the printed circuit board (132). The generated current may be transmitted to the printed circuit board (PBA) (132) through the cable (131c). The printed circuit board (132) may include a boost circuit. The printed circuit board (132) may boost the voltage generated by the thermoelectric element (131) to a voltage suitable for charging the energy storage unit (133).

[0232] Electrical energy can be stored in the energy storage unit (133) by the output voltage. At this time, electrons can be attached to the anode of the energy storage unit (133) and holes can be attached to the cathode.

[0233] The energy storage unit (133) can be continuously charged only by the operation of the induction heating device (2A). The sensor device (10A) can charge the energy storage unit (133) from the magnetic field generated by the induction heating device (2A). That is, the sensor device (10A) can be charged by the heat generated from the induction heating device (2A).

[0234] Referring to FIGS. 15 to 18, a description will be given of an embodiment different from the sensor device (10A) of FIGS. 13 to 14. Hereinafter, descriptions of the same configuration as the sensor device (10A) of FIGS. 13 and 14 will be omitted, and other configurations will be described in detail.

[0235] Fig. 15 is a perspective view illustrating a sensor device according to one embodiment of the present disclosure. Fig. 16 is a cross-sectional view illustrating the sensor device of Fig. 15 mounted on a cooking vessel.

[0236] Referring to FIGS. 15 and 16, a sensor device (10A-1) according to one embodiment of the present disclosure may include a sensor body (11A-1) that can be fixed to a cooking vessel (C). The sensor body (11A-1) may include a fixing clip (112) so as to be fixed to the circumference of the cooking vessel (C).

[0237] The fixed clip (112) can be coupled to the body part (110-1) by a torsion spring (113). The fixed clip (112) can be elastically moved by the torsion spring (113). The fixed clip (112) can include a pressing portion (112a) that is provided to be pressed by a user, and a fixing portion (112b). A torsion spring (113) can be provided between the pressing portion (112a) and the fixing portion (112b) so that the pressing portion (112a) and the fixing portion (112b) can rotate in opposite directions. For example, when a user presses the pressing portion (112a), the fixing portion (112b) can be released from contact with the cooking vessel (C). In addition, when the user releases the pressure on the pressurized portion (112a), the fixed portion (112b) can be moved to come into contact with the cooking vessel (C) by the elastic force of the torsion spring (113).

[0238] The sensor body (11A-1) may include a plurality of contact protrusions (114) provided on the body portion (110-1). The plurality of contact protrusions (114) may include a first contact protrusion (114a) and a second contact protrusion (114b) provided on the fixing portion (112b). The first contact protrusion (114a) and the second contact protrusion (114b) may be provided to come into contact with the cooking vessel (C). The first contact protrusion (114a) and the second contact protrusion (114b) may be formed so that the sensor device (10A-1) is positioned perpendicular to the cooking plate (21). The first contact protrusion (114a) and the second contact protrusion (114b) may be formed of an insulating material to block heat from the heated cooking vessel (C). For example, the first contact protrusion (114a) and the second contact protrusion (114b) can be formed of silicone or rubber, etc.

[0239] The probe (12A) may be provided on a fixed clip (112). The probe (12) may be provided to be rotatable on the fixed clip (112). That is, one end of the probe (12A) may be hinge-connected to the fixed clip (112). The probe (12A) may be provided to be able to be angle-adjusted with respect to the supporter (17-1) by rotating about the hinge as an axis. Even when the sensor device (10A-1) is fixed to the cooking vessel (C), the angle of the probe (12A) may be adjusted.

[0240] The sensor device (10A-1) may include a supporter (17-1) that is fixed to the sensor body (11A-1). The supporter (17-1) may be formed integrally with the sensor body (11A-1). The sensor device (10A-1) may include a thermoelectric element (131) inside the sensor body (11A-1).

[0241] The sensor device (10A-1) may include a heat transfer member (14A-1) extending from the sensor device (10A-1) and provided to be supported on the induction heating device (2A).

[0242] The heat transfer unit (14A-1) may include a heat pipe (141A-1) fixed to a heat absorption unit (131a) of a thermoelectric element (131). The heat pipe (141A-1) may connect the thermoelectric element (131) and the heat generating unit (140A). That is, the heat generating unit (140A) may be located at one end of the heat pipe (141A-1), and the thermoelectric element (131) may be located at the other end of the heat pipe (141A-1). The heat generating unit (140A) may be located adjacent to the cooking plate (21A). Therefore, the heat pipe (141A-1) may extend between the cooking plate (21A) and the sensor body (11A-1).

[0243] The supporter (17-1) can be positioned so that the sensor device (10A-1) is positioned perpendicular to the cooking plate (21A). That is, the supporter body (171-1) can be positioned perpendicular to the cooking plate (21A). The supporter (17-1) can include a contact portion (172-1) so that the supporter (17-1) can be positioned perpendicular to the cooking plate (21A). The contact portion (172-1) can be provided perpendicular to the supporter body (171-1).

[0244] FIG. 17 is a cross-sectional view illustrating a state in which a sensor device according to one embodiment of the present disclosure is placed in a cooking vessel.

[0245] Referring to FIG. 17, the sensor device (10A-2) may include a heat transfer portion (14A-2) that is in contact with a thermoelectric element (131).

[0246] The heat transfer unit (14A-2) may be arranged to be in contact with the thermoelectric element (131). The heat transfer unit (14A-2) may include a heat generating unit (140A-2) arranged to be in contact with the thermoelectric element (131).

[0247] The heat generating unit (140A-2) can be in contact with the heat absorbing unit (131a) of the thermoelectric element (131). Specifically, the thermoelectric element (131) is disposed inside the sensor body (11A-1), and the heat generating unit (140A-2) can be fixed to the heat absorbing unit (131a) of the thermoelectric element (131). The heat generating unit (140A-2) can be located inside the supporter body (171-2).

[0248] The heat generating unit (140A-2) can extend from the heat absorbing unit (131a) of the thermoelectric element (131) toward the cooking plate (21A). One end of the heat generating unit (140A-2) can be in contact with the heat absorbing unit (131a) of the thermoelectric element (131), and the other end of the heat generating unit (140A-2) can be positioned adjacent to the cooking plate (21A).

[0249] The other end of the heat generating unit (140A-2) can be inductively heated by a magnetic field generated from an induction heating coil (24b) located below the cooking plate (21A). The heat generated at the other end of the heat generating unit (140A-2) can be transferred to one end of the heat generating unit (140A-2). The heat transferred to one end of the heat generating unit (140A-2) can be transferred to the heat absorbing unit (131a) of the thermoelectric element (131).

[0250] The thermoelectric element (131) can generate electric energy by the temperature difference between the heat absorbing portion (131a) and the heat dissipating portion (131b). In addition, the generated electric energy can be stored in the energy storage portion (133) via the printed circuit board (132).

[0251] FIG. 18 is a cross-sectional view showing a state in which a sensor device according to one embodiment of the present disclosure is placed in a cooking vessel.

[0252] Referring to FIG. 18, the sensor device (10A-3) may include a heat transfer portion (14A-3) arranged in contact with a thermoelectric element (131).

[0253] The thermoelectric element (131) and the heat generating unit (140A-3) may be arranged inside the supporter (17-3). The heat generating unit (140A-3) and the thermoelectric element (131) may be arranged inside the contact unit (172-3). The heat generating unit (140A-3) may be positioned adjacent to the induction heating coil (24b). That is, the heat generating unit (14-3) may be arranged closer to the induction heating coil (24b) than to the thermoelectric element (131).

[0254] The heat generating unit (140A-3) can be in contact with the heat absorbing unit (131a) of the thermoelectric element (131). The heat generating unit (140A-3) can be inductively heated by a magnetic field generated from the induction heating coil (24b). The heat generated in the heat generating unit (140A-3) can be transferred to the heat absorbing unit (131a) of the thermoelectric element (131).

[0255] The thermoelectric element (131) can generate electric energy based on the temperature difference between the heat absorbing portion (131a) and the heat dissipating portion (131b). The thermoelectric element (131) can be electrically connected to a printed circuit board (132) disposed on the sensor body (11A-1) via a cable (131c-3). The electric energy generated from the thermoelectric element (131) can be stored in the energy storage portion (133) via the printed circuit board (132).

[0256] A cooking appliance (1) according to one embodiment includes a main body (20) that accommodates an induction heating coil, a cooking plate (21) on which a cooking vessel is placed, the cooking plate including a cooking zone corresponding to the induction heating coil, and a sensor device (10A) that is provided to be placed on the cooking vessel. The sensor device may include a thermoelectric element (131) that generates a potential difference due to a temperature difference. The sensor device may include a printed circuit board (132) to which a current generated from the thermoelectric element is applied. The sensor device may include an energy storage unit (133) that is electrically connected to the printed circuit board. The sensor device may include a sensor body (11) on which the printed circuit board and the energy storage unit are disposed. The sensor device may include a probe (12) that is mounted on the sensor body and includes a temperature sensor (121) that is provided to measure the temperature of food in the cooking vessel. The sensor device may include a heat generating unit (140A) configured to transfer heat generated by a magnetic field generated from the induction heating coil to the thermoelectric element. According to the present disclosure, the sensor device can measure the temperature of the food. According to the present disclosure, the sensor device can be charged without a separate charger. According to the present disclosure, the sensor device can be charged using heat generated by the induction heating device. According to the present disclosure, the sensor device can be charged simultaneously with temperature measurement.

[0257] The sensor device may further include a supporter (17) that is positioned spaced apart from the probe and is provided so that a portion of the cooking vessel can be positioned between the probe and the supporter. According to the present disclosure, the sensor device may be mounted on the cooking vessel.

[0258] The supporter may be configured to support the sensor device on the cooking plate. According to the present disclosure, the sensor device may be fixed to the cooking plate.

[0259] The supporter may further include a heat pipe (141A) that connects the thermoelectric element and the heat generating unit so that heat from the heat generating unit can be transferred to the thermoelectric element.

[0260] The above heat generating unit may be located at one end of the heat pipe, and the thermoelectric element may be located at the other end of the heat pipe.

[0261] The supporter may include an insulating material. The heat generating unit may be located within the supporter. According to the present disclosure, a risk of burns can be prevented.

[0262] The supporter may be hinge-coupled to the sensor body. The supporter may be configured to be angle-adjustable relative to the probe. According to the present disclosure, the sensor device can be mounted on cooking utensils of various heights.

[0263] The above supporter may further include a contact portion (172) that is provided to be supported on the cooking plate. According to the present disclosure, the sensor device can be stably supported.

[0264] The thermoelectric element may be placed in contact with the heat generating unit so that heat generated from the heat generating unit is transferred to the thermoelectric element.

[0265] The thermoelectric element may be disposed in the sensor body. The heat generating portion may extend from the thermoelectric element toward the cooking plate.

[0266] The above thermoelectric element may include a heat dissipation unit and a heat absorption unit. The heat generation unit may be in contact with the heat absorption unit so that heat from the heat generation unit is transferred.

[0267] The sensor body may include a fixing clip (112) so that the sensor device can be fixed to the cooking vessel. According to the present disclosure, the sensor device can be fixed to the cooking vessel.

[0268] The probe may have one end hinged to the sensor body so that the angle of the probe can be adjusted. According to the present disclosure, the probe can be moved while the sensor device is fixed to the cooking vessel.

[0269] The sensor device may be arranged so that at least a portion of the heat generating unit can be positioned within the vertical region of the induction heating coil when placed on the cooking vessel.

[0270] The above energy storage unit may include a super capacitor.

[0271] A sensor device (10) according to one embodiment is a sensor device that is provided to measure the temperature of food heated by an induction heating device, and includes a probe (12) including a thermoelectric element (131) that generates a potential difference due to a temperature difference, an energy storage unit (133) that stores electric energy converted by the thermoelectric element, a temperature sensor (121) for measuring the temperature of the food, a sensor body (11) on which the probe is mounted and on which the energy storage unit is disposed, and a heat generating unit (140A) that includes a magnetic body so that heat is generated by the induction heating device and is provided to transfer heat generated by the induction heating device to the thermoelectric element. According to the present disclosure, the sensor device can measure the temperature of the food. According to the present disclosure, the sensor device can be charged without a separate charger. According to the present disclosure, the sensor device can be charged using heat generated by the induction heating device. According to the present disclosure, the sensor device can be charged simultaneously with temperature measurement.

[0272] It may further include a supporter (17) extending from the sensor body and positioned spaced apart from the probe. According to the present disclosure, the sensor device can be mounted on a cooking vessel.

[0273] The supporter may further include a heat pipe (141A) connected to the thermoelectric element and the heat generating unit so as to transfer heat from the heat generating unit to the thermoelectric element that transfers the heat.

[0274] The thermoelectric element can be brought into contact with the heat generating unit so that heat generated in the heat generating unit is transferred to the thermoelectric element.

[0275] The above energy storage unit may include a super capacitor.

[0276] A sensor device according to one embodiment is a sensor device that can be mounted on a cooking vessel to measure the temperature of food contained inside the cooking vessel heated by a heating device, and when the sensor device is mounted on the cooking vessel, the sensor device includes a heat transfer unit (14, 14A) that receives heat from the cooking vessel, a thermoelectric element (131) that is arranged to produce current and electric energy based on the heat transferred from the heat transfer unit, a printed circuit board (132) to which current generated from the thermoelectric element is applied, an energy storage unit (133) that is electrically connected to the printed circuit board to store the electric energy transferred from the printed circuit board, a sensor body (11, 11A) on which the printed circuit board and the energy storage unit are arranged, and a probe (12) that is mounted on the sensor body and includes a temperature sensor that is arranged to measure the temperature of food contained in the cooking vessel.

[0277] The heat transfer unit may be positioned apart from the probe so that a portion of the cooking vessel can be positioned between the probe and the heat transfer unit.

[0278] The heat transfer portion may be brought into contact with a portion of the cooking vessel so as to conduct heat from the cooking vessel.

[0279] The probe may extend in one direction from the sensor body, and the heat transfer portion may extend parallel to the probe from the sensor body.

[0280] The above heat transfer unit may include a heat pipe (140) that is provided to transfer heat transferred from the cooking vessel to the thermoelectric element.

[0281] It may further include a cover (15) that covers at least a portion of the heat transfer portion and is arranged to be coupled to the cooking vessel.

[0282] The above cover is arranged to be placed on the cooking vessel and may include a placing slot (152a) in which a heat-conducting member is placed to conduct heat from the cooking vessel.

[0283] The above heat transfer unit may include a heat generating unit (140A) arranged adjacent to the heating device so as to be heated by the heating device.

[0284] The above heat transfer unit may further include a heat pipe (141A) provided to transfer heat generated in the heat generating unit to the thermoelectric element.

[0285] The above heat transfer unit may be provided to extend from the sensor body and be supported on the heating device.

[0286] It may further include a supporter (17) provided to surround the above heat transfer unit.

[0287] The above thermoelectric element can be in contact with the heat transfer unit so that heat generated in the heat transfer unit is transferred to the thermoelectric element.

[0288] The above heating device includes an induction heating device (2A), and the heat transfer part may include a magnetic body so that heat is generated by the induction heating device.

[0289] The above heat transfer unit may include a heat generating unit (140A) disposed adjacent to the induction heating device and formed of the magnetic material, and a heat pipe (141A) arranged to transfer heat generated in the heat generating unit to the thermoelectric element.

[0290] The above energy storage unit may include a super capacitor.

[0291] According to one embodiment, a sensor device is a rechargeable sensor device that can be mounted on a cooking vessel to measure the temperature of food contained inside the cooking vessel heated by a heating device, the sensor device comprising a sensor body (11), a heat transfer unit (14, 14A) extending from the sensor body and receiving heat from the cooking vessel when the sensor device is mounted on the cooking vessel, a thermoelectric element (131) disposed inside the sensor body and connected to the sensor body and converting thermal energy of the received heat into electrical energy, an energy storage unit (133) disposed inside the sensor body and storing the converted electrical energy to charge the sensor device, and a probe (12) having a temperature sensor that is mounted on the sensor body and is arranged to measure the temperature of food contained in the cooking vessel, wherein the temperature sensor is operated by utilizing the electrical energy stored in the energy storage unit.

[0292] According to one embodiment, a cooking appliance is provided, which comprises a heating device (2) for placing a cooking vessel thereon and for heating the cooking vessel, and a sensor device (10) provided to be mounted on the cooking vessel, wherein the sensor device may include a thermoelectric element (131) for generating a potential difference due to a temperature difference, a printed circuit board (132) to which a current generated from the thermoelectric element is applied, an energy storage unit (133) electrically connected to the printed circuit board, a sensor body (11) on which the printed circuit board and the energy storage unit are disposed, a probe (12) mounted on the sensor body and including a temperature sensor for measuring a temperature of food in the cooking vessel, and a heat transfer unit (14A) provided for transferring heat from the heating device or the cooking vessel heated by the heating device to the thermoelectric element.

[0293] The heat transfer unit may be provided to extend parallel to the probe at a position spaced from the probe so that one surface of the cooking vessel is positioned between the heat transfer unit and the probe, and to be supported on the cooking vessel or the heating device.

[0294] The above heat transfer unit may further include a heat pipe (140, 141A) provided to transfer heat to the thermoelectric element.

[0295] The heat pipe may further include a cover member (15) that covers at least a portion of the heat pipe and is arranged to be coupled to the cooking vessel, and the heat pipe may be arranged to be supported by the heating device by penetrating the cover member.

[0296] The above energy storage unit may include a super capacitor.

[0297] According to the present disclosure, the sensor device can measure the temperature of the food.

[0298] According to the present disclosure, the sensor device can be charged without a separate charger.

[0299] According to the present disclosure, the sensor device can be charged using heat generated by an induction heating device.

[0300] According to the present disclosure, the sensor device can be charged simultaneously with temperature measurement.

[0301] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains from the description below.

[0302] The above illustrates and describes specific embodiments. However, the invention is not limited to the above-described embodiments, and those skilled in the art will readily appreciate that various modifications and implementations can be made without departing from the spirit and scope of the invention as set forth in the claims below.

Claims

1. A sensor device that can be installed in a cooking container to measure the temperature of food contained inside the cooking container heated by a heating device, A heat transfer unit that receives heat from the cooking vessel when the sensor device is placed on the cooking vessel; A thermoelectric element configured to produce current and electrical energy based on heat transferred from the above heat transfer unit; A printed circuit board to which current generated from the thermoelectric element is applied; An energy storage unit electrically connected to the printed circuit board to store electrical energy transmitted from the printed circuit board; A sensor body in which the printed circuit board and the energy storage unit are arranged; and A sensor device comprising: a probe including a temperature sensor mounted on the sensor body and configured to measure the temperature of food contained in the cooking vessel; 2. In paragraph 1, The heat transfer unit is a sensor device that is positioned spaced apart from the probe so that a part of the cooking vessel can be positioned between the probe and the heat transfer unit.

3. In paragraph 2, The above heat transfer unit is a sensor device that comes into contact with a part of the cooking vessel so that heat is conducted from the cooking vessel.

4. In paragraph 2, A sensor device in which the probe extends in one direction from the sensor body, and the heat transfer portion extends parallel to the probe from the sensor body.

5. In paragraph 2, The above heat transfer unit is a sensor device including a heat pipe arranged to transfer heat transferred from the cooking vessel to the thermoelectric element.

6. In paragraph 4, A sensor device further comprising a cover covering at least a portion of the heat transfer portion and configured to be coupled to the cooking vessel.

7. In paragraph 6, A sensor device wherein the cover is arranged to be placed on the cooking vessel and includes a placing slot in which a heat-conducting member is placed so as to conduct heat from the cooking vessel.

8. In paragraph 1, A sensor device including a heat generating unit disposed adjacent to the heating device so as to be heated by the heating device, wherein the heat transfer unit is 9. In paragraph 8, A sensor device wherein the heat transfer unit further includes a heat pipe configured to transfer heat generated from the heat generating unit to the thermoelectric element.

10. In paragraph 8, A sensor device in which the heat transfer portion extends from the sensor body and is supported on the heating device.

11. In paragraph 10, A sensor device further comprising a supporter arranged to surround the heat transfer portion.

12. In paragraph 1, The above thermoelectric element is a sensor device that comes into contact with the heat transfer unit so that heat generated in the heat transfer unit is transferred to the thermoelectric element.

13. In paragraph 1, The above heating device includes an induction heating device, The above heat transfer unit is a sensor device including a magnetic body so that heat is generated by the induction heating device.

14. In paragraph 13, The above heat transfer part, A heat generating unit formed of the magnetic body and positioned adjacent to the induction heating device, A sensor device including a heat pipe configured to transfer heat generated from the heat generating unit to the thermoelectric element.

15. In paragraph 1, The energy storage unit is a sensor device including a super capacitor.

16. A rechargeable sensor device that can be placed on a cooking vessel to measure the temperature of food contained inside the cooking vessel heated by a heating device, sensor body; A heat transfer unit extending from the sensor body and receiving heat from the cooking vessel when the sensor device is placed in the cooking vessel; A thermoelectric element disposed inside the sensor body and connected to the sensor body, which converts the thermal energy of the received heat into electrical energy; An energy storage unit disposed inside the sensor body and storing the converted electric energy to charge the sensor device; and A probe having a temperature sensor mounted on the sensor body and configured to measure the temperature of food contained in the cooking vessel; The above temperature sensor is a sensor device that operates by utilizing electric energy stored in the energy storage unit.

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