Printed circuit board assembly and manufacturing method therefor

Abstract

A printed circuit board assembly according to an embodiment of the present disclosure may include an electronic component. The printed circuit board assembly may include a printed circuit board (PCB) on which the electronic component is disposed. The printed circuit board assembly may include a plurality of solder members electrically connecting the electronic component with the printed circuit board between the electronic component and the printed circuit board. The printed circuit board assembly may include a plurality of protrusions disposed on the printed circuit board to be spaced apart from the plurality of solder members and positioned near an edge of the electronic component. The printed circuit board assembly may include a filling member filling the edge of the electronic component between the printed circuit board and the electronic component. The distribution of the filling member may be promoted by an adhesive force between the filling member and the plurality of protrusions and a cohesive force of the filling member while the filling member in a liquid state is filled between the printed circuit board and the electronic component.

Description

Printed circuit board assembly and method for manufacturing the same

[0001] The present disclosure relates to a printed circuit board assembly including an electronic component and a circuit board on which the electronic component is mounted, and a method for manufacturing the same.

[0002] Electronic devices are becoming increasingly smaller and more multifunctional, driven by the rapid advancements in the electronics industry and user demands. Consequently, the need for miniaturization and multifunctionality in electronic components (e.g., semiconductor devices) used in electronic devices is also increasing.

[0003] Electronic components can be mounted (or placed) on a circuit board (e.g., a printed circuit board (PCB)) using surface mount technology (SMT). Electronic components can be physically and electrically connected to the circuit board via multiple solder joints.

[0004] Typically, multiple solder joints may be positioned in the inner region between the circuit board and the electronic component. Depending on the design structure, multiple solder joints may not be positioned in the edge region between the circuit board and the electronic component. In this case, the reliability of the electronic component may be somewhat lower than that of electronic components having a different design structure.

[0005] Various embodiments of the present disclosure can provide a printed circuit board assembly including a plurality of protrusions formed in an edge region of a circuit board where a plurality of solder members are not arranged, and a filling member filled in the edge region of the circuit board along the plurality of protrusions.

[0006] A printed circuit board assembly according to one embodiment of the present disclosure may include an electronic component. The printed circuit board assembly may include a printed circuit board (PCB) on which the electronic component is mounted. The printed circuit board assembly may include a plurality of solder members electrically connecting the electronic component and the printed circuit board between the electronic component and the printed circuit board. The printed circuit board assembly may include a plurality of protrusions disposed on the printed circuit board spaced apart from the plurality of solder members and positioned near an edge of the electronic component. The printed circuit board assembly may include a filling member that fills an edge of the electronic component between the printed circuit board and the electronic component. Distribution of the filling member may be promoted by an adhesive force between the filling member and the plurality of protrusions and a cohesive force of the filling member while a liquid filling member is filled between the printed circuit board and the electronic component.

[0007] According to an example of the present disclosure, a method for manufacturing a printed circuit board assembly including a printed circuit board on which an electronic component is disposed may include a step of forming a plurality of protrusions in an edge region of the printed circuit board spaced apart from a soldering region of the printed circuit board on which a plurality of solder members are disposed. The method for manufacturing the printed circuit board assembly may include a step of applying a soldering material to a plurality of connection pads disposed in the soldering region. The method for manufacturing the printed circuit board assembly may include a step of disposing the electronic component on the printed circuit board such that the plurality of protrusions and an edge of the electronic component face each other. The method for manufacturing the printed circuit board assembly may include a step of filling a filling member between the plurality of protrusions. Distribution of the filling member may be promoted by an adhesive force between the filling member and the plurality of protrusions and a cohesive force of the filling member (B) while the liquid filling member is filled between the printed circuit board and the electronic component.

[0008] Various embodiments of the present disclosure can be implemented such that a plurality of protrusions are formed in an edge region of a circuit board where a plurality of solder members are not arranged, and thus a filling member can be evenly filled (or applied) in the edge region along the plurality of protrusions. In this case, electronic components can be firmly mounted on the board by the plurality of solder members and the filling member, thereby improving the reliability of the printed circuit board assembly.

[0009] The effects that can be achieved by the exemplary embodiments of the present disclosure can be clearly derived and understood by those skilled in the art to which the exemplary embodiments of the present disclosure pertain, from the following description. In other words, unintended effects resulting from the implementation of the exemplary embodiments of the present disclosure can also be derived by those skilled in the art from the exemplary embodiments of the present disclosure.

[0010] In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0011] FIG. 1 is a plan view of a printed circuit board assembly according to an example of the present disclosure.

[0012] FIG. 2a is a cross-sectional view of a printed circuit board assembly taken along line I-I' shown in FIG. 1.

[0013] FIG. 2b is a partial cross-sectional view of a printed circuit board assembly showing a state before a filling member is filled, according to an example of the present disclosure.

[0014] FIG. 3 is a partial cross-sectional view of a printed circuit board assembly showing a state in which a filling member is filled, according to an example of the present disclosure.

[0015] Figure 4 is an enlarged view of part A shown in Figure 1.

[0016] FIG. 5 is a cross-sectional view showing the cross-sectional shape of a plurality of protrusions according to an example of the present disclosure.

[0017] FIG. 6 is a drawing showing an arrangement of a plurality of protrusions according to an example of the present disclosure.

[0018] FIG. 7 is a drawing showing an arrangement of a plurality of protrusions according to an example of the present disclosure.

[0019] FIG. 8 is a drawing showing an arrangement of a plurality of protrusions according to an example of the present disclosure.

[0020] FIG. 9 is a drawing showing an arrangement of a plurality of protrusions according to an example of the present disclosure.

[0021] FIG. 10 is a drawing showing an arrangement of a plurality of protrusions according to an example of the present disclosure.

[0022] FIG. 11 is a drawing showing an arrangement of a plurality of protrusions according to an example of the present disclosure.

[0023] FIG. 12 is a drawing showing an arrangement of a plurality of protrusions according to an example of the present disclosure.

[0024] FIG. 13 is a drawing showing an arrangement of a plurality of protrusions according to an example of the present disclosure.

[0025] FIG. 14 is a drawing showing an arrangement of a plurality of protrusions according to an example of the present disclosure.

[0026] FIG. 15 is a drawing showing an arrangement of a plurality of protrusions according to an example of the present disclosure.

[0027] FIG. 16 is a drawing showing an arrangement of a plurality of protrusions according to an example of the present disclosure.

[0028] Fig. 17 is a drawing showing the filling range of a filling member on a circuit board according to an example.

[0029] Figure 18 is a manufacturing process diagram of a printed circuit board assembly according to an example of the present disclosure.

[0030] Figure 19 is a process diagram showing a process of forming a plurality of protrusions according to an example of the present disclosure.

[0031] Figure 20 is a process diagram showing a forming process of a plurality of protrusions according to an example of the present disclosure.

[0032] Figure 21 is a plan view of a printed circuit board assembly according to a comparative example of the present disclosure.

[0033] Fig. 22 is a cross-sectional view of a printed circuit board assembly according to a comparative example cut along line II-II' illustrated in Fig. 21.

[0034] Fig. 23 is a drawing showing the filling range of a filling member in a circuit board according to a comparative example of the present disclosure.

[0035] Figure 24 is a drawing showing a crack state of a solder member that occurs when the filler member is underfilled.

[0036] Fig. 25 is a drawing showing the filling range of a filling member on a circuit board according to a comparative example of the present disclosure.

[0037] Figure 26 is a drawing showing a crack state of a solder member that occurs when a filling member is overfilled.

[0038] It should be understood that the various embodiments and terms used in this document are not intended to limit the technical features described in this document to specific embodiments, but rather to include various modifications, equivalents, or substitutes of the embodiments.

[0039] In connection with the description of the drawings, similar reference numerals may be used for similar or related components.

[0040] The singular form of a noun corresponding to an item may include one or more items, unless the context clearly indicates otherwise.

[0041] In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof.

[0042] Terms such as "first," "second," or "first" or "second" may be used simply to distinguish one component from another and do not qualify the components in any other respect (e.g., importance or order).

[0043] When a component (e.g., a first component) is referred to as being “coupled” or “connected” to another component (e.g., a second component), with or without the terms “functionally” or “communicatively,” it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0044] The terms “include” or “have” are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in this document, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0045] When a component is said to be “connected,” “coupled,” “supported,” or “in contact with” another component, this includes not only cases where the components are directly connected, coupled, supported, or in contact, but also cases where the components are indirectly connected, coupled, supported, or in contact through a third component.

[0046] When we say that a component is “on” another component, this includes not only cases where the component is in contact with the other component, but also cases where there is another component between the two components.

[0047] The term “and / or” includes any combination of a plurality of related described elements or any one of a plurality of related described elements.

[0048] The operating principle and embodiments of the present invention will be described with reference to the attached drawings below.

[0049] FIG. 1 is a plan view of a printed circuit board assembly according to an example of the present disclosure.

[0050] FIG. 2a is a cross-sectional view of a printed circuit board assembly taken along line I-I' shown in FIG. 1.

[0051] FIG. 2b is a partial cross-sectional view of a printed circuit board assembly showing a state before a filling member is filled, according to an example of the present disclosure.

[0052] FIG. 3 is a partial cross-sectional view of a printed circuit board assembly showing a state in which a filling member is filled, according to an example of the present disclosure.

[0053] Figure 4 is an enlarged view of part A shown in Figure 1.

[0054] FIG. 5 is a cross-sectional view showing the cross-sectional shape of a plurality of protrusions according to an example of the present disclosure.

[0055] A printed circuit board assembly (100) according to an example of the present disclosure may be implemented as various types of modules, such as a solid state drive (SSD) module, a memory module, a computer system module, and a mobile system module. For example, the printed circuit board assembly (100) may correspond to a semiconductor module.

[0056] Hereinafter, in explaining the present disclosure, a printed circuit board assembly (100) implemented as a semiconductor module is described as an example, but the present disclosure is not limited thereto.

[0057] Referring to FIGS. 1 to 5, a printed circuit board assembly (100) (PBA) according to an example may include a circuit board (e.g., printed circuit board) (110), at least one electronic component (120), a plurality of solder members (130), a plurality of protrusions (140), and / or a filling member (B).

[0058] According to one example, various components (e.g., electronic components) that constitute a printed circuit board assembly (100) may be mounted or arranged on a circuit board (110).

[0059] According to one example, the circuit board (110) may have circuit wiring provided on at least one surface to electrically connect various components mounted on the circuit board (110). In one example, the circuit board (110) may be configured as a single-layer PCB substrate in which the circuit wiring is formed on only one surface. In one example, the circuit board (110) may be configured as a double-layer PCB substrate in which the circuit wiring is formed on both surfaces. For example, when the circuit board (110) is configured for a double-layer PCB, the circuit wiring on the upper and lower surfaces may be electrically connected through a conductive current-carrying structure (e.g., a conductive via hole) penetrating the circuit board (110) (specifically, a substrate body (111) described below).

[0060] According to one example, a circuit board (110) may include a board body (111), a protective layer (112), and / or a plurality of board pads (113).

[0061] According to one example, the substrate body (111) may include a body layer in which various resins, such as glass epoxy (or FR-4) resin, phenol resin, or BT resin, are compressed to a predetermined thickness, and circuit wiring formed on the body layer. The circuit wiring may be formed, for example, by patterning copper foil coated on the body layer.

[0062] In one example, the substrate body (111) may have a structure in which the number of layers of copper foil is formed in three or more layers using an insulator called prepreg, and circuit wiring is formed in three or more layers depending on the number of layers of copper foil, but the present disclosure is not limited thereto.

[0063] According to one example, the protective layer (112) may be arranged on the upper side (e.g., in the +z-axis direction) of the substrate body (111). In one example, the protective layer (112) may be configured to protect circuit wiring formed on the substrate body (111). The protective layer (112) may be formed of, for example, a solder resist (SR) that covers the circuit wiring. The protective layer (112) may have a structure that covers the circuit wiring while opening a plurality of substrate pads (113) portions to the outside.

[0064] According to one example, a plurality of substrate pads (113) may be arranged on at least an upper surface (e.g., a surface facing the +z-axis direction) or a lower surface (e.g., a surface facing the -z-axis direction) of a circuit board (110). Although not specifically illustrated in the drawing, the plurality of substrate pads (113) may be electrically connected to other substrates in addition to the electronic component (120). In one example, the plurality of substrate pads (113) may be provided on a substrate body (111). In one example, the plurality of substrate pads (113) may be arranged on substantially the same plane (e.g., an XY plane) as the protective layer (112), but the present disclosure is not limited thereto.

[0065] According to an example, the plurality of substrate pads (113) may have various shapes. For example, the plurality of substrate pads (113) may have shapes such as circular, polygonal, and ring-shaped, but the present disclosure is not limited thereto.

[0066] According to one example, the plurality of substrate pads (113) may include a plurality of connection pads (113a) and / or a plurality of dummy pads (113b).

[0067] In one example, a plurality of connection pads (113a) may be electrically connected to at least one electronic component (120). In one example, each of the plurality of connection pads (113a) may electrically connect the electronic component (120) and the circuit board (110) via a plurality of solder members (130).

[0068] According to one example, the plurality of connection pads (113a) may be provided as a part of the circuit wiring and integrated with the circuit wiring, or may be provided as separate components on the circuit wiring. The plurality of connection pads (113a) may be referred to as, for example, electrode pads, contact pads, solder pads, or soldering pads. The plurality of connection pads (113a) may be formed of, for example, at least one of aluminum (Al), copper (Cu), nickel (Ni), tungsten (W), platinum (Pt), or gold (Au).

[0069] According to one example, a plurality of connection pads (113a) may be arranged on the lower side (e.g., in the -z-axis direction) of the electronic component (120). In one example, the plurality of connection pads (113a) may be arranged on the circuit board (110) to overlap with the electronic component (120). In one example, the plurality of connection pads (113a) may be arranged in a soldering region (SR) where a plurality of solder members (130) are arranged. In this case, the plurality of connection pads (113a) are covered by the electronic component (120) when the printed circuit board assembly (100) is viewed from above, as illustrated in FIG. 1.

[0070] According to one example, a plurality of dummy pads (113b) may be formed on the circuit board (110) to serve as a medium for fixing the protrusion (140), regardless of electrical connection with the electronic component (120).

[0071] According to an example, a plurality of dummy pads (113b) may be formed in a single process together with a plurality of connection pads (113a). However, the present disclosure is not limited thereto, and the plurality of dummy pads (113b) may be deleted in consideration of the forming process of the plurality of protrusions (140) and the design conditions of the circuit board (110). For example, when forming the plurality of protrusions (140) using the bonding member (P) described below, the plurality of dummy pads (113b) may be deleted. Hereinafter, the forming process of the plurality of protrusions (140) using the bonding member (P) will be described in detail with reference to FIGS. 19 and 20.

[0072] According to one example, a plurality of dummy pads (113b) may be arranged on the lower side (e.g., in the -z-axis direction) of the electronic component (120). In one example, the plurality of dummy pads (113b) may be arranged on the circuit board (110) to overlap with the electronic component (120) (e.g., the second electronic component (122)). In one example, the plurality of dummy pads (113b) may be arranged on the periphery (or near) of the soldering area (SR). For example, the plurality of dummy pads (113b) may be spaced apart from the plurality of connection pads (113a). In one example, the plurality of dummy pads (113b) may be arranged in an edge area (PA) where the plurality of solder members (130) are not arranged. The edge area (PA) may mean an area adjacent to or facing the border or edge of the second electronic component (122) when the second electronic component (122) is mounted (or arranged) on the circuit board (110), and formed between the second electronic component (122) and the circuit board (110).

[0073] According to an example, the edge region (PA) may include a first edge region (PA_l) formed to the left (e.g., in the -x-axis direction) with respect to the soldering region (SR) and a second edge region (PA_r) formed to the right (e.g., in the +x-axis direction) with respect to the soldering region (SR).

[0074] In one example, the first edge area (PA_l) may be formed to extend along a vertical direction (e.g., ±y-axis direction) on the circuit board (110). In one example, the second edge area (PA_r) may be formed to extend along a vertical direction (e.g., ±y-axis direction) on the circuit board (110).

[0075] Although not specifically illustrated in the drawing, the edge area (PA) may be formed in various shapes to overlap with the second electronic component (122) depending on the electrical connection structure of the second electronic component (122), for example, the arrangement of the plurality of solder members (130) and / or the arrangement of the plurality of contact points (125) to be described later. For example, unlike as illustrated in FIG. 1, the edge area (PA) may be formed on all sides of the soldering area (SR) so as to surround the soldering area (SR). In this case, the plurality of dummy pads (113b) are covered by the electronic component (120) when the printed circuit board assembly (100) is viewed from above as illustrated in FIG. 1.

[0076] According to one example, at least one electronic component (120) may be mounted (or arranged) on a circuit board (110). For example, at least one electronic component (120) may be mounted on at least one surface (e.g., a top surface or a bottom surface) of the circuit board (110). In one example, at least one electronic component (120) may be electrically / physically connected to the circuit board (110) via a plurality of solder members (130).

[0077] According to an example, at least one electronic component (120) may include various components such as passive components and / or active components. Any component that can be mounted (or arranged) on a circuit board (110) may be used as the electronic component.

[0078] In one example, at least one electronic component (120) may include a plurality of contact points (125) formed on one surface (e.g., a lower surface) facing the circuit board (110) when the electronic component (120) is mounted (or arranged) on the circuit board (110). In one example, the plurality of contact points (125) may be in contact with a plurality of solder members (130). The plurality of contact points (125) may be electrically connected to a plurality of connection pads (113a) provided on the circuit board (110) through the plurality of solder members (130).

[0079] According to one example, at least one electronic component (120) may be a chip package including at least one semiconductor chip. For example, the electronic component (120) may include at least one memory chip or logic chip therein. For example, when the electronic component (120) includes a memory chip, the electronic component (120) may be a memory device including a memory such as DRAM, SRAM, flash memory, EEPROM, PRAM, MRAM, or RRAM. For example, when the electronic component (120) includes a logic chip, the electronic component (120) may be a logic device including a logic chip of a relatively small size.

[0080] In one example, at least one electronic component (120) may include a component such as a connector, a controller, or an electrolytic cap. Here, the electrolytic cap is a unipolar capacitor, has a large electrostatic capacitance, and can be used as a low-frequency filter or bypass.

[0081] In one example, at least one electronic component (120) may include a chip package, such as a generally large microprocessor, a central processing unit (CPU), a controller, or an application specific integrated circuit (ASIC).

[0082] In one example, at least one electronic component (120) may include an application processor (AP) of the SoC (system on chip) type used in a mobile electronic device.

[0083] The type of at least one electronic component (120) is not limited to the aforementioned elements.

[0084] In one example, at least one electronic component (120) may be mounted (or placed) on a circuit board (110) through SMT (surface mount technology). SMT may refer to a so-called automatic soldering technology that automatically mounts electronic components on the surface of a circuit board (110) using a solder material (or solder paste). For example, SMT may refer to a technology that automatically mounts (or places) electronic components, such as semiconductors, diodes, and chips, on a board using a chip mounter or a multi-mounter, and then hardens them using a solder material. In SMT, heat and pressure may be applied to the electronic components so that they can be easily joined using the solder material.

[0085] According to one example, at least one electronic component (120) may include a first electronic component (121) and a second electronic component (122).

[0086] For example, the first electronic component (121) may correspond to an electronic component having a soldering area (SA) in which a plurality of solder members (130) are arranged and a size of the electronic component that is substantially the same. The first electronic component (121) may correspond to, for example, an AP-related component.

[0087] In one example, the second electronic component (122) may correspond to a component of a different size from the first electronic component (121). For example, the second electronic component (122) may have a larger size than the first electronic component (121).

[0088] According to an example, the second electronic component (122) may correspond to an electronic component having a soldering area (SA) in which a plurality of solder members (130) are arranged and an electronic component of different sizes. The second electronic component (122) may correspond to an electronic component including, for example, a soldering area (SA) and an edge area (PA). The second electronic component (122) may correspond to, for example, a memory-related component.

[0089] According to one example, a plurality of solder members (130) may be disposed on the circuit board (110) to overlap with the electronic component (120). In one example, the plurality of solder members (130) may be disposed on a plurality of connection pads (113a). In one example, the plurality of solder members (130) may be disposed in the soldering area (SA). In one example, the plurality of solder members (130) may physically / electrically connect at least one electronic component (120) and the circuit board (110). For example, the second electronic component (122) may be firmly mounted (or disposed) on the circuit board (110) by the plurality of solder members (130) and the filling member (B) described below. In one example, the plurality of solder members (130) may include solder balls.

[0090] According to one example, a plurality of protrusions (140) may be arranged on the circuit board (110) to overlap with the second electronic component (122). In one example, the plurality of protrusions (140) may be arranged on a plurality of dummy pads (113b). For example, the plurality of protrusions (140) may be formed by a soldering process so as to be arranged on the plurality of dummy pads (113b). The plurality of protrusions (140) may be formed of a soldering material, but the present disclosure is not limited thereto. For example, the plurality of protrusions (140) may also be formed by a bonding member (P) to be described later, and in this regard, this will be described later with reference to FIGS. 19 and 20.

[0091] In one example, a plurality of protrusions (140) may be arranged in the edge area (PA). In one example, a plurality of protrusions (140) may be arranged in the edge area (PA) in at least one row.

[0092] According to an example, the plurality of protrusions (140) may have various shapes such as a hemispherical shape, a cylindrical shape, and a polyhedral shape, but the present disclosure is not limited thereto. For example, the shape of the plurality of protrusions (140) may be designed in consideration of the filling amount and / or the filling area (or filling range) of the filling member (B) when filling the filling member (B). This is because, when filling the filling member (B), the resistance to the flow of the filling member (B) varies depending on the shape of the plurality of protrusions (140). For example, the plurality of protrusions (140a) may be designed such that a cross-section cut along the XY plane has a circular shape, as illustrated in (a) of FIG. 5. For example, the plurality of protrusions (140b) may be designed such that a cross-section cut along the XY plane has a bar shape with a convex central portion, as illustrated in (b) of FIG. 5.

[0093] According to an example, a plurality of protrusions (140) may be arranged to be spaced apart from each other by a predetermined interval. For example, the interval (d) between the plurality of protrusions (140) may be 0.4 mm or more, but the present disclosure is not limited thereto. The interval (d) between the plurality of protrusions (140) may be designed in consideration of the filling amount and / or the filling area (or filling range) of the filling member (B) when filling the filling member (B). The filling area of ​​the filling member (B) may be referred to as an overlapping area or a bonding area, as it is an area where the filling member (B) comes into contact with the second electronic component (122) and the circuit board (110). For example, when the interval (d) between the plurality of protrusions (140) decreases, the capillary action may be activated, so that the filling amount and / or the filling area of ​​the filling member (B) may increase. Here, the capillary phenomenon may mean a phenomenon in which the filling member (B) flows from the edge area (PA) to the soldering area (SA) along the gap between the plurality of protrusions (140) due to the cohesive force of the filling member (B) and the adhesive force between the filling member (B) and the plurality of protrusions (140). In this case, the second electronic component (122) can be firmly mounted (or, placed or fixed) on the circuit board (110).

[0094] According to an example, a plurality of protrusions (140) may be arranged to be spaced apart from a plurality of solder members (130) by a predetermined distance. For example, the distance (l) between the plurality of protrusions (140) and the plurality of solder members (130) may be designed within a range from 0.9 mm to 2.0 mm, but the present disclosure is not limited thereto. The distance (l) between the plurality of protrusions (140) and the plurality of solder members (130) may be designed in consideration of the filling amount and / or the filling area (or filling range) of the filling member (B) when filling the filling member (B). For example, the distance (l) may be designed within a range in which, when filling the filling member (B), the filled filling member (B) does not come into contact with the plurality of solder members (130).

[0095] According to one example, the plurality of protrusions (140) may protrude from the surface of the circuit board (110) to a predetermined height (h). In one example, the protrusion height (h) of the plurality of protrusions (140) may be designed to be lower than the gap (g) between the circuit board (110) and the second electronic component (122) (see FIGS. 2B and 3 ). For example, the plurality of protrusions (140) may be designed not to contact the lower surface of the second electronic component (122). For example, the protrusion height (h) of the plurality of protrusions (140) may be designed to be within a range from 70 um to 100 um, but the present disclosure is not limited thereto. For example, the gap (g) between the second electronic component (122) and the circuit board (110) may be designed to be within a range from 140 um to 160 um. For example, the gap between the plurality of protrusions (140) and the second electronic component (122) can be designed to be within the range of 80 um to 90 um. In this case, interference between the plurality of protrusions (140) and the second electronic component (122) does not occur, so that damage to the second electronic component (122) due to the formation of the plurality of protrusions (140) can be prevented. However, the present disclosure is not limited thereto, and in some examples, the protrusion height (h) of the plurality of protrusions (140) may be designed such that the gap (g) between the circuit board (110) and the second electronic component (122) is substantially the same as that of the plurality of protrusions (140) so that the plurality of protrusions (140) connect the circuit board (110) and the second electronic component (122).

[0096] According to one example, the size of the plurality of protrusions (140) may be formed to be smaller than the plurality of solder members (130). For example, the diameter of the plurality of protrusions (140) may be designed to be within a range of 0.1 mm to 0.2 mm, and the diameter of the plurality of solder members (130) may be designed to be about 0.3 mm, but the present disclosure is not limited thereto. In this case, the plurality of protrusions (140) may be arranged in greater numbers than the plurality of solder members (130) within a limited area (e.g., the edge area (PA)), so that the capillary phenomenon may be made smoother.

[0097] In one example, the plurality of protrusions (140) can be designed in various ways, such as the spacing between the protrusions, the arrangement of the protrusions, and / or the shape of the protrusions, to control the filling amount and / or the filling area (or the filling range) of the filling member (B) filled in the space between the second electronic component (122) and the circuit board (110), and also to improve the uniformity of the filling member (B). Here, the uniformity of the filling member (B) can mean the degree to which the filling member (B) is evenly applied on the circuit board (110).

[0098] In one example, the filling member (B) can physically connect the second electronic component (122) to the circuit board (110). In one example, the filling member (B) can be filled in a liquid state in a gap between the circuit board (110) and the second electronic component (122) by an underfill process and / or a sidefill process. Thereafter, the filled filling member (B) can be cured by heat and / or pressure. In one example, the filling member (B) can be composed of a non-conductive material. For example, the filling member (B) can be composed of a thermosetting resin such as an epoxy series, a silicone series, a polyurethane series, an acrylic series, and a polyamide series having insulating properties.

[0099] In one example, the filling member (B) can be evenly filled across the edge area (PA) along a plurality of protrusions (140) provided on the circuit board (110).

[0100] According to an example, a plurality of protrusions (140) may be arranged on a circuit board (110) in at least one row. Hereinafter, various arrangement structures of the plurality of protrusions (140) will be described with reference to FIGS. 6 to 16.

[0101] FIGS. 6 to 16 are drawings showing the arrangement of a plurality of protrusions according to various examples of the present disclosure.

[0102] FIGS. 6 to 16 are drawings showing a plurality of protrusions (140) arranged in at least one row, for example, two or more rows, in a horizontal direction (e.g., ±x direction) on a circuit board (110).

[0103] Fig. 6 (a) is a drawing showing a state in which a plurality of protrusions (140) are arranged in a grid pattern shape in an edge area (PA) of a circuit board (110) when the circuit board (110) is viewed from above (e.g., in the +z-axis direction). Fig. 6 (b) is a drawing showing a filling state of a filling member (B) when a plurality of protrusions (140) are arranged as shown in Fig. 6 (a).

[0104] Referring to (a) of FIG. 6, a plurality of protrusions (140) according to an example may be arranged to have at least two rows. In an example, each row of the plurality of protrusions (140) may be spaced apart by a predetermined interval along the horizontal direction (e.g., ±x-axis direction) of the circuit board (110).

[0105] In one example, a plurality of protrusions (140) may be arranged on each of the left and right sides of the soldering area (SA) spaced apart from the soldering area (SA) where a plurality of solder members (130) or connection pads (113a) are arranged. An edge area (PA) may also be formed on each of the left and right sides of the soldering area (SA) corresponding to the arrangement structure of the plurality of protrusions (140).

[0106] According to one example, the plurality of protrusions (140) may be arranged to have a grid pattern overall in the edge area (PA) when the circuit board (110) is viewed from above (e.g., in the +z-axis direction). For example, the plurality of protrusions (140) included in each row may be arranged to face the plurality of protrusions (140) included in another adjacent row. The plurality of protrusions (140) in each row may be spaced apart from each other by a predetermined interval (da). The interval (da) between the plurality of protrusions (140) may be designed to be, for example, about 0.4 mm, but the present disclosure is not limited thereto.

[0107] In the grid-patterned arrangement structure of a plurality of protrusions (140), the distance (la) between the soldering area (SA) and the edge area (PA) can be designed to be, for example, within the range of 0.9 mm to 2.0 mm, but the present disclosure is not limited thereto.

[0108] Referring to (b) of FIG. 6, when a filling member (B) is filled into the edge area (PA) corresponding to the arrangement structure illustrated in (a) of FIG. 6, the filling member (B) may flow inward (e.g., in the direction toward the soldering area (SA)) along the space between the second electronic component (e.g., the second electronic component (122) of FIG. 2a) and the circuit board (110), for example, the gap formed between the plurality of protrusions (140), and then be hardened by a capillary phenomenon. At this time, the filling member (B) may not come into contact with the plurality of solder members (130) due to the arrangement structure of the plurality of protrusions (140) and may be evenly filled within the periphery of the edge area (PA).

[0109] Fig. 7 (a) is a drawing showing a state in which at least some of a plurality of protrusions (140) are arranged in a cross pattern shape in an edge area (PA) of a circuit board (110) when the circuit board (110) is viewed from above (e.g., in the +z-axis direction). Fig. 7 (b) is a drawing showing a filling state of a filling member (B) when a plurality of protrusions (140) are arranged as shown in Fig. 7 (a).

[0110] Referring to (a) of FIG. 7, a plurality of protrusions (140) according to an example may be arranged to have at least two rows, for example, three rows. In an example, each row of the plurality of protrusions (140) may be spaced apart by a predetermined interval along the horizontal direction (e.g., ±x-axis direction) of the circuit board (110).

[0111] In one example, a plurality of protrusions (140) may be arranged on each of the left and right sides of the soldering area (SA) spaced apart from the soldering area (SA) where a plurality of solder members (130) are arranged. In this case, an edge area (PA) may also be formed on each of the left and right sides of the soldering area (SA) corresponding to the arrangement structure of the plurality of protrusions (140).

[0112] According to one example, at least some of the plurality of protrusions (140) may be arranged to have a cross pattern (e.g., an X pattern) that repeats along a vertical direction (e.g., a ±y-axis direction) when the circuit board (110) is viewed from above (e.g., a +z-axis direction). For example, at least some of the plurality of protrusions (140) included in each row may be arranged so as not to face the plurality of protrusions (140) included in another adjacent row. For example, the plurality of protrusions (140) included in each row may be arranged alternately with the plurality of protrusions (140) included in another adjacent row.

[0113] In the cross-pattern arrangement structure of a plurality of protrusions (140), each of the plurality of protrusions (140) included in each row can be spaced apart from each other by a predetermined interval (db). The interval (db) of the plurality of protrusions (140) can be designed to be, for example, about 1.0 mm, but the present disclosure is not limited thereto.

[0114] In the cross-patterned array structure, the distance (lb) between the soldering area (SA) and the edge area (PA) can be designed, for example, within a range of 0.1 mm to 0.5 mm. The distance (lc) between the solder member (130) arranged at the inner edge of the soldering area (SA) and the edge area (PA) can be designed, for example, within a range of 1.0 mm to 2.0 mm. However, the present disclosure is not limited thereto.

[0115] Comparing the arrangement structure of the plurality of protrusions (140) illustrated in each drawing with reference to (b) of FIG. 7 and (b) of FIG. 6, as the number of rows of the arrangement structure of the plurality of protrusions (140) illustrated in (b) of FIG. 7 increases compared to the arrangement structure of the plurality of protrusions (140) illustrated in (b) of FIG. 6, the amount of filling material (B) filled between the second electronic component (122) and the circuit board (110) may increase. Accordingly, the second electronic component (122) may be firmly mounted on the circuit board (110).

[0116] Fig. 8 (a) is a drawing showing a state in which a plurality of protrusions (140) are arranged in an overall “ㄷ” shape or a left-right inverted “ㄷ” shape on each left and right of the soldering area (SA) when the circuit board (110) is viewed from above (e.g., in the +z-axis direction). Fig. 8 (b) is a drawing showing a filling state of a filling member (B) when a plurality of protrusions (140) are arranged as shown in Fig. 8 (a).

[0117] Referring to (a) of FIG. 8, a plurality of protrusions (140) according to an example may be arranged to have at least two rows, for example, three rows. In an example, each row of the plurality of protrusions (140) may be spaced apart by a predetermined interval along the horizontal direction (e.g., ±x-axis direction) of the circuit board (110).

[0118] In one example, a plurality of protrusions (140) may be arranged on each of the left and right sides of the soldering area (SA) spaced apart from the soldering area (SA) where a plurality of solder members (130) are arranged. In this case, an edge area (PA) may also be formed on each of the left and right sides of the soldering area (SA) corresponding to the arrangement structure of the plurality of protrusions (140).

[0119] According to one example, the plurality of protrusions (140) may be arranged to have an overall “ㄷ” shape or a left-right inverted “ㄷ” shape on each of the left and right sides of the soldering area (SA) when the circuit board (110) is viewed from above (e.g., in the +z-axis direction). For example, the plurality of protrusions (140) may not be arranged in the central right area or the central left area of ​​the edge area (PA). The plurality of protrusions (140) may be arranged to have a concave shape in the center portion toward the soldering area (SA) when the circuit board (110) is viewed from above.

[0120] In the arrangement structure of the plurality of protrusions (140) illustrated in FIG. 8, the distance (ld) between the solder member (130) arranged at the inner edge of the soldering area (SA) and the protrusion (140) arranged at the outermost side of the edge area (PA) can be designed to be, for example, within the range of 1.5 mm to 3.0 mm, but the present disclosure is not limited thereto.

[0121] The distance (dc) between the upper region (e.g., +y-axis region) and the lower region (e.g., -y-axis region) of the edge region (PA) can be designed to be about 10 mm, but the present disclosure is not limited thereto.

[0122] Referring to (b) of FIG. 8, by designing the arrangement structure of a plurality of protrusions (140) corresponding to various arrangement structures of a plurality of solder members (130) within a soldering area (SA), the filling direction (or flow direction) of the filling member (B) filled between the second electronic component (122) and the circuit board (110) can be controlled.

[0123] Referring to FIGS. 9 and 10, a plurality of protrusions (140) according to an example may be arranged in at least one group in an area of ​​the circuit board (110) facing the edge corner of the second electronic component (122). The plurality of protrusions (140) may be arranged to have an overall X shape within the group.

[0124] Referring to (a) of FIG. 9, a plurality of protrusions (140) may be arranged in groups at the upper left, lower left, upper right, and lower right, respectively, with respect to the soldering area (SA) when the circuit board (110) is viewed from above (e.g., in the +z-axis direction). In this case, the edge area (PA) may also be divided into an upper left edge area (PA_l1), a lower left edge area (PA_l2), an upper right edge area (PA_r1), and a lower right edge area (PA_r2) corresponding to the arrangement structure of the plurality of protrusions (140). The upper left edge area (PA_l1) and the lower left edge area (PA_l2) may be spaced apart from each other by a predetermined distance in the vertical direction (e.g., in the ±y-axis direction) from the left side (e.g., in the -x-axis direction) of the soldering area (SA). The upper right edge area (PA_r1) and the lower right edge area (PA_r2) can be spaced apart from each other by a predetermined distance in the vertical direction (e.g., ±y-axis direction) from the right side (e.g., +x-axis direction) of the soldering area (SA).

[0125] Referring to (b) of FIG. 9, when the filling member (B) is filled into the edge area (PA) corresponding to the array structure illustrated in (a) of FIG. 9, it can be confirmed that the filling member (B) is not filled into the empty area formed between the edge areas (PA_l1, PA_l2, PA_r1, PA_r2) as they are spaced apart from each other. In this case, the filling member (B) can be filled between the second electronic component (122) and the circuit board (110) near the four corners of the second electronic component (122).

[0126] Referring to (a) of FIG. 10, unlike as shown in (a) of FIG. 9, a plurality of protrusions (140) may be arranged in groups in a diagonal direction with respect to the soldering area (SA) when the circuit board (110) is viewed from above (e.g., in the +z-axis direction). For example, a plurality of protrusions (140) may be arranged in the upper left edge area (PA_l1) and the lower right edge area (PA_r2).

[0127] Referring to (b) of FIG. 10, when the filling member (B) is filled into the edge area (PA) corresponding to the array structure illustrated in (a) of FIG. 10, it can be confirmed that the filling member (B) is filled centered on the upper left edge area (PA_l1) and the lower right edge area (PA_r2). In this case, the filling member (B) can be filled between the second electronic component (122) and the circuit board (110) near the diagonal vertex of the second electronic component (122).

[0128] Referring to FIG. 11, the plurality of protrusions (140) may have an array structure in which the number of the plurality of protrusions (140) gradually decreases in a certain direction (e.g., -y-axis direction or +y-axis direction).

[0129] Referring to (a) of FIG. 11, a plurality of protrusions (140) according to an example may have an arrangement structure in which the number of protrusions decreases in a first direction (e.g., -y-axis direction) from a first edge area (PA_l) when the circuit board (110) is viewed from above (e.g., +z-axis direction). In an example, a plurality of protrusions (140) may have an arrangement structure in which the number of protrusions decreases in a second direction (e.g., +y-axis direction) opposite to the first direction from a second edge area (PA_r) when the circuit board (110) is viewed from above (e.g., +z-axis direction). For example, a plurality of protrusions (140) may have an inclined arrangement structure or a right-angled triangular arrangement structure in which the number of protrusions decreases or increases in each edge area (PA) when the circuit board (110) is viewed from above.

[0130] Referring to (b) of FIG. 11, when the filling member (B) is filled in the edge area (PA) corresponding to the array structure illustrated in (a) of FIG. 11, the filling member (B) is filled centered on a plurality of protrusions (140), and can be distributed in an oblique direction on the XY plane when the circuit board (110) is viewed from above.

[0131] Referring to Fig. 12, a plurality of protrusions (140) according to an example may be arranged to have an asymmetrical structure on the left and right with respect to the soldering area (SA). In this case, the areas of the first edge area (PA_l) and the second edge area (PA_r) formed on the left and right sides of the soldering area (SA) may be different from each other.

[0132] Referring to (a) of FIG. 12, a plurality of protrusions (140) according to an example may be arranged in four rows in the first edge area (PA_l). In an example, the plurality of protrusions (140) may be arranged so as to have an overall “ㅏ” shape in the first edge area (PA_l) when the circuit board (110) is viewed from above (e.g., in the +z-axis direction). For example, the plurality of protrusions (140) may be arranged in four rows, and may be arranged so as to have a convex shape in the central portion of the first edge area (PA_r) toward the soldering area (SA). In an example, the plurality of protrusions (140) may be arranged so as to have an overall “ㅓ” shape in the second edge area (PA_r) when the circuit board (110) is viewed from above (e.g., in the +z-axis direction). For example, a plurality of protrusions (140) may be arranged in two rows, such that the central portion of the second edge region (PA_r) has a convex shape toward the soldering region (SA). In this case, the area of ​​the first edge region (PA_l) may be larger than that of the second edge (PA_r).

[0133] Referring to (b) of FIG. 12, when a filling member (B) is filled into an edge area (PA) corresponding to the arrangement structure illustrated in (a) of FIG. 12, the filling member (B) is distributed toward the center of each edge area (PA_l, PA_r), and it can be confirmed that the distribution range of the filling member (B) is wider in the first edge area (PA_l) where a greater number of protrusions are formed than in the second edge area (PA_r).

[0134] Referring to FIGS. 13 and 14, a plurality of protrusions (140) according to an example can control the distribution range of the filling member (B) to be filled by controlling the size of the protrusions and / or the spacing between the protrusions.

[0135] Referring to (a) of FIG. 13 and (a) of FIG. 14, the diameter (or size) (sa) of the plurality of protrusions (140) illustrated in (a) of FIG. 13 may be designed to be smaller than the diameter (or size) (sb) of the plurality of protrusions (140) illustrated in (a) of FIG. 14. On the other hand, the spacing (dd) between the plurality of protrusions (140) illustrated in (a) of FIG. 13 may be designed to be wider than the spacing (de) between the plurality of protrusions (140) illustrated in (a) of FIG. 14.

[0136] In this case, the capillary effect by the plurality of protrusions (140) having the arrangement structure of Fig. 14 (b) can be more smoothly achieved than the arrangement structure of Fig. 13 (a). Accordingly, it can be confirmed that the distribution range of the filling member (B) filled into the edge area (PA) is more widely distributed in Fig. 14 (b) than in Fig. 13 (a).

[0137] Referring to FIG. 15, according to an example, a plurality of protrusions (140) may be arranged alternately in each row arranged in the edge area (PA) with protrusions of different sizes. In an example, the sizes of the protrusions included in each row in each edge area (PA_l, PA_r) may vary in the vertical direction (e.g., ±y-axis direction). For example, the plurality of protrusions (140) included in each row may be arranged alternately in the vertical direction with protrusions of smaller sizes and larger sizes. When the filling member (B) is filled in the edge area (PA) corresponding to the arrangement structure illustrated in (a) of FIG. 15, it can be confirmed that the filling member (B) is distributed centered on the protrusions of relatively larger sizes, as illustrated in (b) of FIG. 15. This distribution pattern of the filling member (B) may be caused by a difference in the bonding area between the filling member (B) and the protrusions.

[0138] Referring to FIG. 16, a soldering area (SA') according to an example may be formed to have an overall asymmetrical left-right shape as the arrangement structure of the plurality of connection pads (113a) is different when the circuit board (110) is viewed from above (e.g., in the +z-axis direction). In this case, a plurality of protrusions (140) according to an example may be arranged to have an asymmetrical left-right structure based on the soldering area (SA'). In addition, the areas of the first edge area (PA_l) and the second edge area (PA_r) formed on the left and right sides of the soldering area (SA') may be different from each other.

[0139] Referring to (a) of FIG. 16, a plurality of protrusions (140) according to an example may be arranged in three rows in the first edge area (PA_l), but the present disclosure is not limited thereto. In an example, the plurality of protrusions (140) may be arranged in a grid pattern in the first edge area (PA_l). According to an example, the plurality of protrusions (140) may be arranged in five rows in the second edge area (PA_r), but the present disclosure is not limited thereto. In an example, the plurality of protrusions (140) may be arranged in a grid pattern in the second edge area (PA_r). In addition, the plurality of protrusions (140) arranged in the first edge area (PA_l) may be designed to be smaller in size than the plurality of protrusions (140) arranged in the second edge area (PA_r).

[0140] In this case, as shown in (b) of Fig. 16, when the filling member (B) is filled in the edge area (PA), it can be confirmed that the distribution range of the filling member (B) is wider in the second edge area (PA_r) than in the first edge area (PA_l).

[0141] FIG. 17 is a drawing showing a filling range of a filling member on a circuit board according to an example of the present disclosure.

[0142] Referring to FIG. 17, as described above, by arranging a plurality of protrusions (140) in the edge area (PA) of the circuit board (110), the filling member (B) can be evenly filled throughout the edge area (PA) by a capillary phenomenon when filling the filling member (B). In addition, the filled filling member (B) can be prevented from contacting the plurality of solder members (130) arranged in the soldering area (SA) as much as possible. In this case, the electrical performance of the solder member (130) can be guaranteed, and at the same time, the reliability of the second electronic component (120) and the circuit board (110) in situations such as thermal shock or dropping can be improved.

[0143] Figure 18 is a manufacturing process diagram of a printed circuit board assembly according to an example of the present disclosure.

[0144] Figure 19 is a process diagram showing a process of forming a plurality of protrusions according to an example of the present disclosure.

[0145] Figure 20 is a process diagram showing a forming process of a plurality of protrusions according to an example of the present disclosure.

[0146] Referring to FIG. 18, a method for manufacturing a printed circuit board assembly (100) according to an example may include a step of forming a plurality of protrusions (140) in an edge area (PA) spaced apart from a soldering area (SA) of a circuit board (110) (1810). For example, as described above, the plurality of protrusions (140) may be formed by a soldering process of applying and / or curing a soldering material on a plurality of dummy pads (113b) provided on the circuit board (110).

[0147] According to an example, a plurality of protrusions (140) may be formed not only by the soldering process, but also by a bonding member (P) composed of a material different from the soldering material. Hereinafter, a process for forming protrusions (140) using a bonding member (or bonding solution) (P) will be described with reference to FIGS. 19 and 20.

[0148] Fig. 19 (a) is a drawing showing a state in which a bonding member (P) is dispensed onto a circuit board (110) by a dispensing device (200). Fig. 19 (b) is a drawing showing a state in which the bonding member (P) dispensed onto the circuit board (110) in Fig. 19 (a) is cured and formed into a plurality of protrusions (140), and then a second electronic component (122) is mounted (or placed) on the circuit board (110).

[0149] Referring to (a) of FIG. 19, a worker can apply a bonding member (P) to an area of ​​a circuit board (110) where a plurality of solder members (130) are not arranged before mounting a second electronic component (122) using a dispensing device (or dispenser) (200).

[0150] Referring to (b) of FIG. 19, a worker can apply a bonding member (P) to a circuit board (110) and then harden it to form a plurality of protrusions (140), and then mount (or place) the second electronic component (120) on the circuit board (110) so that the edges of the plurality of protrusions (140) and the second electronic component (120) face each other and at the same time, the plurality of solder members (130) are seated on the connection pads (113a) of the circuit board (110).

[0151] Thereafter, although not specifically illustrated in the drawing, the worker can fill the filling member (B) into the edge of the second electronic component (122) and the circuit board (110). In this case, the filled filling member (B) can flow into the inner space between the second electronic component (122) and the circuit board (110) through the plurality of protrusions (140) and then be hardened.

[0152] FIG. 20 (a) is a drawing showing a state in which a bonding member (P) is dipped from an external storage container by a stamping device (300) and stamped onto a circuit board (110). FIG. 20 (b) is a drawing showing a state in which the bonding member (P) stamped onto the circuit board (110) in FIG. 20 (a) is hardened and formed into a plurality of protrusions (140), and then a second electronic component (122) is mounted (or placed) on the circuit board (110).

[0153] Referring to (a) of FIG. 20, a worker can use a stamping device (300) to dipping a bonding member (P) from an external container in which the bonding member (P) is stored, and then, before mounting the second electronic component (122), apply the bonding member (P) to an area of ​​a circuit board (110) where a plurality of solder members (130) are not arranged.

[0154] Referring to (b) of FIG. 20, a worker can apply a bonding member (P) to a circuit board (110), harden it to form a plurality of protrusions (140), and then mount (or place) the second electronic component (122) on the circuit board (110) so that the edges of the plurality of protrusions (140) and the second electronic component (122) face each other and at the same time, the plurality of solder members (130) are seated on the connection pads (113a) of the circuit board (110).

[0155] Thereafter, although not specifically illustrated in the drawing, the worker can fill the filling member (B) into the edge of the second electronic component (122) and the circuit board (110). In this case, the filled filling member (B) can flow into the inner space between the second electronic component (122) and the circuit board (110) through the plurality of protrusions (140) and then be hardened.

[0156] When forming a plurality of protrusions (140) using a bonding member (P) as described with reference to FIGS. 19 and 20, the design freedom of the circuit board (110) can be improved as the dummy pad (113b) for fixing the soldering material required during the soldering process becomes unnecessary.

[0157] According to one example, a method of manufacturing a printed circuit board assembly (100) may include a step (1820) of applying a soldering material to a plurality of connection pads (113a) arranged in a soldering area (SA).

[0158] According to one example, a method for manufacturing a printed circuit board assembly (100) may mount (or place) an electronic component (122) on a circuit board (110) such that edges of a plurality of protrusions (140) and the electronic component (e.g., a second electronic component (122)) face each other. In this case, each of a plurality of contact points (125) of the electronic component (122) and a plurality of connection pads (113a) of the circuit board (110) may be in contact with the upper / lower portions of a plurality of solder members (130).

[0159] According to one example, a method for manufacturing a printed circuit board assembly (100) may include a step of applying heat toward a plurality of solder members (130) to melt and reflow a soldering material while an electronic component (122) is mounted (or arranged) on a circuit board (110) (1840). In this case, the soldering material is melted and then hardened, so that the electronic component (122) and the circuit board (110) can be physically and / or electrically connected through the plurality of solder members (130).

[0160] According to an example, a method for manufacturing a printed circuit board assembly (100) may include a step of filling a filling material (B) between a circuit board (110) and an electronic component (122) (1850). For example, a worker may perform an underfill or sidefill process to fill the filling material (B) into a space between an edge of an electronic component (e.g., a second electronic component (122)) on which a plurality of protrusions (140) are positioned and the circuit board (110). In this case, the filling material (B) may permeate along a narrow gap formed between the plurality of protrusions (140) by a capillary phenomenon and be evenly distributed in an edge area where the plurality of protrusions (140) are formed.

[0161] Figure 21 is a plan view of a printed circuit board assembly according to a comparative example of the present disclosure.

[0162] Fig. 22 is a cross-sectional view of a printed circuit board assembly according to a comparative example cut along line II-II' illustrated in Fig. 21.

[0163] Fig. 23 is a drawing showing the filling range of a filling member in a circuit board according to a comparative example of the present disclosure.

[0164] Figure 24 is a drawing showing a crack state of a solder member that occurs when the filler member is underfilled.

[0165] Fig. 25 is a drawing showing the filling range of a filling member on a circuit board according to a comparative example of the present disclosure.

[0166] Figure 26 is a drawing showing a crack state of a solder member that occurs when a filling member is overfilled.

[0167] Referring to FIGS. 21 and 22, a printed circuit board assembly (100') according to a comparative example may include a circuit board (110), at least one electronic component (120), and / or a plurality of solder members (130). In describing the printed circuit board assembly (100') illustrated in FIGS. 21 and 22, the same reference numerals are given to components that are substantially the same or similar to those of the printed circuit board assembly (100) illustrated in FIGS. 1 and 2, and the description of the components may be replaced with the description of the printed circuit board assembly (100).

[0168] In the printed circuit board assembly (100') according to the comparative example, the soldering area (SA) in which a plurality of solder members (130) connecting the second electronic component (122) and the circuit board (110) are arranged may be smaller than the overall size of the second electronic component (122).

[0169] Unlike the printed circuit board assembly (100') according to the comparative example, a plurality of protrusions (e.g., a plurality of protrusions (140) of FIG. 1) are not provided around the soldering area (SA) on the circuit board (110), specifically, the edge area (e.g., the edge area (PA) of FIG. 1), unlike the printed circuit board assembly (100) according to the example of the present disclosure illustrated in FIGS. 1 and 2.

[0170] Referring to FIGS. 23 to 26, in a printed circuit board assembly (100') according to a comparative example, when a filling member (B) is filled in the space between the second electronic component (122) and the circuit board (110) after the second electronic component (122) is mounted (or placed) on the circuit board (110), the filling member (B) frequently fails to be uniformly applied to the overlapping area between the second electronic component (122) and the circuit board (110), which includes the soldering area (SA).

[0171] As illustrated in FIG. 23, when the filling member (B) is underfilled, the filling member (B) cannot sufficiently protect the plurality of solder members (130), and cracks (C1, C2 of FIG. 24) occur in the solder members (130) due to repeated external impact or stress. As a result, in the case of the printed circuit board assembly (100') according to the comparative example, the reliability with respect to situations such as dropping is lowered compared to the printed circuit board assembly (100) according to the present disclosure.

[0172] In contrast, when the filling member (B) is overfilled as illustrated in FIG. 25, cracks (C3, C4, C5 in FIG. 26) in the solder member (130) occur due to thermal expansion / contraction of the filling member (B) caused by heat generation of the solder member (130) during operation of the printed circuit board assembly. As a result, the reliability of the printed circuit board assembly (100') according to the comparative example with respect to thermal shock is lowered compared to the printed circuit board assembly (100) according to the present disclosure.

[0173] A printed circuit board assembly (100) according to an example of the present disclosure may include an electronic component (120). The printed circuit board assembly (100) may include a printed circuit board (PCB) (110) on which the electronic component (120) is disposed. The printed circuit board assembly (100) may include a plurality of solder members (130) between the electronic component (120) and the printed circuit board (110) to electrically connect the electronic component (120) and the printed circuit board (110). The printed circuit board assembly (100) may include a plurality of protrusions (140) disposed on the printed circuit board (110) spaced apart from the plurality of solder members (130) and positioned near an edge of the electronic component (120). The printed circuit board assembly (100) may include a filling member (B) that fills the edge of the electronic component (120) between the printed circuit board (110) and the electronic component (120). Distribution of the filling member (B) may be promoted by adhesive force between the filling member (B) and the plurality of protrusions (140) and cohesive force of the filling member (B) while the liquid filling member (B) is filled between the printed circuit board (110) and the electronic component (120).

[0174] According to one example, the distribution of the filling member (B) can be controlled by at least one of the sizes of the plurality of protrusions (140), the distance between the plurality of solder members (130) and the plurality of protrusions (140), and the spacing between the plurality of protrusions (140) so that the filling member (B) does not come into contact with the plurality of solder members (130).

[0175] According to an example, the filling member (B) may be composed of at least one of non-conductive materials such as epoxy, silicone, polyurethane, acrylic, and polyamide.

[0176] According to one example, the distance between the plurality of protrusions (140) and the plurality of solder members (130) may be set to 0.1 mm or more so that the filling member (B) does not come into contact with the plurality of solder members (130) when the filling member (B) is distributed.

[0177] According to one example, the plurality of solder members (130) may be placed on the inner side of the edge of the electronic component (120) on the printed circuit board (110).

[0178] According to one example, the plurality of protrusions (140) may have a size smaller than the plurality of solder members (130) so that the filling member (B) does not come into contact with the plurality of solder members (130) when the filling member (B) is distributed.

[0179] According to an example, each of the plurality of protrusions (140) may have one of the shapes of a hemisphere, a cylinder, and a polyhedron.

[0180] According to one example, the plurality of protrusions (140) may have a height (h) lower than the plurality of solder members (130) so as not to come into contact with the electronic component (120).

[0181] According to one example, the plurality of protrusions (140) are arranged in two or more rows, and the plurality of protrusions (140) included in each row can be arranged alternately with the plurality of protrusions (140) included in another adjacent row.

[0182] According to one example, the plurality of protrusions (140) are arranged in two or more rows, and the plurality of protrusions (140) included in each row can be arranged to face the plurality of protrusions (140) included in another adjacent row.

[0183] According to one example, the plurality of protrusions (140) are arranged at a predetermined interval from each other, and the interval (d) between the plurality of protrusions can be set to 0.4 mm or more so that the filling member (B) does not come into contact with the plurality of solder members (130) when the filling member (B) is distributed.

[0184] According to one example, the printed circuit board (110) may include a plurality of connection pads (113a) on which each of the plurality of solder members (130) is disposed, and a plurality of dummy pads (113b) on which each of the plurality of protrusions (140) is disposed. Each of the plurality of protrusions (140) may be formed by a soldering process of disposing a solder material on each of the plurality of dummy pads (113b).

[0185] According to one example, the plurality of protrusions (140) can be formed by dispensing a bonding member (P) at a predetermined interval along the outer area of ​​the plurality of solder members (130) on the printed circuit board (110) by a dispensing device (200).

[0186] According to one example, the plurality of protrusions (140) may be formed by dipping a bonding member (P) from an external storage container by a stamping device (300), and then stamping the bonding member (P) along the outer area of ​​the plurality of solder members (130) by the stamping device (300) at a predetermined interval.

[0187] A method for manufacturing a printed circuit board assembly (100) including a printed circuit board (110) on which an electronic component (120) is arranged according to an example of the present disclosure may include a step (1810) of forming a plurality of protrusions (140) in an edge area (PA) of the printed circuit board (110) spaced apart from a soldering area (SR) of the printed circuit board (110) on which a plurality of solder members (130) are arranged. The method for manufacturing the printed circuit board assembly (100) may include a step (1820) of applying a soldering material to a plurality of connection pads (113a) arranged in the soldering area (SR). The method for manufacturing the printed circuit board assembly (100) may include a step (1830) of arranging the electronic component (120) on the printed circuit board (110) such that the plurality of protrusions (140) and the edge of the electronic component (120) face each other. The method for manufacturing the printed circuit board assembly (100) may include a step (1850) of filling a filling member (B) between the plurality of protrusions (140). Distribution of the filling member (B) may be promoted by adhesive force between the filling member (B) and the plurality of protrusions (140) and cohesive force of the filling member (B) while the liquid filling member (B) is filled between the printed circuit board (110) and the electronic component (120).

[0188] According to one example, the method for manufacturing the printed circuit board assembly (100) may further include a step (1840) of melting and reflowing the soldering material to electrically connect the electronic component (120) mounted on the printed circuit board (110) and the printed circuit board (110).

[0189] According to one example, the distribution of the filling member (B) can be controlled by at least one of the sizes of the plurality of protrusions (140), the distance between the plurality of solder members (130) and the plurality of protrusions (140), and the spacing between the plurality of protrusions (140) so that the filling member (B) does not come into contact with the plurality of solder members (130).

[0190] According to one example, the printed circuit board (110) may include a plurality of connection pads (113a) on which each of the plurality of solder members (130) is disposed, and a plurality of dummy pads (113b) on which each of the plurality of protrusions (140) is disposed. Each of the plurality of protrusions (140) may be formed by a soldering process of disposing a solder material on each of the plurality of dummy pads (113b).

[0191] According to one example, the plurality of protrusions (140) can be formed by dispensing a bonding member (P) at a predetermined interval along the outer area of ​​the plurality of solder members (130) on the printed circuit board (110) by a dispensing device (200).

[0192] According to one example, the plurality of protrusions (140) may be formed by dipping a bonding member (P) from an external storage container by a stamping device (300), and then stamping the bonding member (P) along the outer area of ​​the plurality of solder members (130) by the stamping device (300) at a predetermined interval.

Claims

1. In a printed circuit board assembly (100), Electronic components (120); A printed circuit board (110) on which the above electronic components (120) are placed; A plurality of solder members (130) electrically connecting the electronic component (120) and the printed circuit board (110) between the electronic component (120) and the printed circuit board (110); A plurality of protrusions (140) arranged on the printed circuit board (110) spaced apart from the plurality of solder members (130) and positioned near the edge of the electronic component (120); and It includes a filling member (B) that fills the edge of the electronic component (120) between the printed circuit board (110) and the electronic component (120), A printed circuit board assembly, wherein the distribution of the filling member (B) is promoted by the adhesive force between the filling member (B) and the plurality of protrusions (140) and the cohesive force of the filling member (B) while the liquid filling member (B) is filled between the printed circuit board (110) and the electronic component (120).

2. In paragraph 1, A printed circuit board assembly, wherein the distribution of the filling member (B) is controlled by at least one of the sizes of the plurality of protrusions (140), the distance between the plurality of solder members (130) and the plurality of protrusions (140), and the spacing between the plurality of protrusions (140) so that the filling member (B) does not come into contact with the plurality of solder members (130).

3. In paragraph 1 or 2, A printed circuit board assembly, wherein the above-mentioned filling member (B) is composed of at least one of non-conductive materials such as epoxy, silicone, polyurethane, acrylic, and polyamide.

4. In any one of paragraphs 1 to 3, A printed circuit board assembly, wherein the distance between the plurality of protrusions (140) and the plurality of solder members (130) is set to 0.1 mm or more so that the filling member (B) does not come into contact with the plurality of solder members (130) when the filling member (B) is distributed.

5. In any one of paragraphs 1 to 4, A printed circuit board assembly, wherein the plurality of solder members (130) are arranged on the inner side of the edge of the electronic component (120) on the printed circuit board (110).

6. In any one of paragraphs 1 to 5, A printed circuit board assembly in which the plurality of protrusions (140) have a size smaller than the plurality of solder members (130) so that the filling member (B) does not come into contact with the plurality of solder members (130) when the filling member (B) is distributed.

7. In any one of paragraphs 1 to 6, A printed circuit board assembly, wherein each of the plurality of protrusions (140) has a shape of one of a hemisphere, a cylinder, and a polyhedron.

8. In any one of paragraphs 1 to 7, A printed circuit board assembly, wherein the plurality of protrusions (140) have a height (h) lower than the plurality of solder members (130) so as not to come into contact with the electronic component (120).

9. In any one of paragraphs 1 to 8, A printed circuit board assembly, wherein the above-mentioned plurality of protrusions (140) are arranged in two or more rows, and the plurality of protrusions (140) included in each row are arranged alternately with the plurality of protrusions (140) included in another adjacent row.

10. In any one of paragraphs 1 to 8, A printed circuit board assembly, wherein the above-mentioned plurality of protrusions (140) are arranged in two or more rows, and the plurality of protrusions (140) included in each row are arranged to face the plurality of protrusions (140) included in another adjacent row.

11. In any one of paragraphs 1 to 10, A printed circuit board assembly, wherein the plurality of protrusions (140) are arranged at a predetermined interval from each other, and the interval (d) between the plurality of protrusions is set to 0.4 mm or more so that the filling member (B) does not come into contact with the plurality of solder members (130) when the filling member (B) is distributed.

12. In any one of paragraphs 1 to 11, The printed circuit board (110) includes a plurality of connection pads (113a) on which each of the plurality of solder members (130) is placed, and a plurality of dummy pads (113b) on which each of the plurality of protrusions (140) is placed. A printed circuit board assembly, wherein each of the plurality of protrusions (140) is formed by a soldering process that places solder material on each of the plurality of dummy pads (113b).

13. In any one of paragraphs 1 to 11, The above-mentioned plurality of protrusions (140) are formed by dispensing a bonding member (P) at a predetermined interval along the outer area of ​​the above-mentioned plurality of solder members (130) on the above-mentioned printed circuit board (110) by a dispensing device (200).

14. In any one of paragraphs 1 to 11, A printed circuit board assembly in which the above plurality of protrusions (140) are formed by dipping a bonding member (P) from an external storage container by a stamping device (300), and then stamping the bonding member (P) along the outer area of ​​the plurality of solder members (130) at a predetermined interval by the stamping device (300).

15. A method for manufacturing a printed circuit board assembly (100) including a printed circuit board (110) on which electronic components (120) are arranged, A step (1810) of forming a plurality of protrusions (140) in an edge area (PA) of a printed circuit board (110) spaced apart from a soldering area (SR) of a printed circuit board (110) on which a plurality of solder members (130) are arranged; A step (1820) of applying a soldering material to a plurality of connection pads (113a) arranged in the above soldering area (SR); A step (1830) of placing the electronic component (120) on a printed circuit board (110) so that the edges of the plurality of protrusions (140) and the electronic component (120) face each other; It includes a step (1850) of filling a filling member (B) between the plurality of protrusions (140), A method for manufacturing a printed circuit board assembly, wherein the distribution of the filling member (B) is promoted by the adhesive force between the filling member (B) and the plurality of protrusions (140) and the cohesive force of the filling member (B) while the liquid filling member (B) is filled between the printed circuit board (110) and the electronic component (120).

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