Antenna structure

Abstract

The antenna structure includes: an antenna element including an antenna conductive layer and an antenna ground layer; a circuit board having one end electrically connected to the antenna conductive layer and the other end electrically connected to the antenna ground layer; and a connector coupled to the circuit board and electrically connected to the antenna conductive layer. Radiation directivity can be improved through the circuit board, and the connector can be stably coupled.

Description

antenna structure

[0001] The present invention relates to an antenna structure. More particularly, it relates to an antenna structure including an antenna element and a circuit board.

[0002]

[0003] With the recent development of the information society, wireless communication technologies such as Wi-Fi and Bluetooth are being applied or built into display devices, electronic devices, and buildings.

[0004] In addition, as mobile communication technology has evolved recently, antennas for performing high-frequency or ultra-high-frequency communication are being applied to public transportation such as buses and subways, building structures, and various mobile devices.

[0005] For example, repeater antennas can be applied to public transportation such as buses and subways, building structures, windows, etc. to facilitate signal transmission and reception in image display devices, electronic devices, etc. having high frequency or ultra-high frequency communication bands such as 3G, 4G, 5G, or higher.

[0006] For example, a film-shaped antenna can be attached to a target object and connected to an external power source via a circuit board and connector. However, signal and power loss may occur on the circuit board, as well as at the connection points between the circuit board and the connector. Furthermore, the antenna's directivity may be disrupted depending on the material, structure, etc. of the target object.

[0007] Therefore, it is necessary to design an antenna structure that can avoid / reduce signal loss and radiation characteristic disturbance caused by the target and connecting structures.

[0008] For example, Korean Patent Publication No. 2019-0009232 discloses an antenna module integrated into a display panel.

[0009]

[0010] An object of the present invention is to provide an antenna structure having improved operational reliability and signal efficiency.

[0011]

[0012] 1. An antenna structure comprising: an antenna element including an antenna conductive layer and an antenna ground layer; a circuit board having one end electrically connected to the antenna conductive layer and the other end electrically connected to the antenna ground layer; and a connector coupled to the circuit board and electrically connected to the antenna conductive layer.

[0013] 2. An antenna structure in the above 1, wherein the circuit board includes a first bonding region including the first end, a second bonding region including the other end, a connection region where the connector is coupled, and a folding region.

[0014] 3. An antenna structure in the above 2, wherein the connection area is located between the first bonding area and the folding area.

[0015] 4. In the above 3, the antenna structure, wherein the connection area is closer to the first bonding area than the folding area.

[0016] 5. An antenna structure further comprising an insulating blocking structure disposed between the circuit board portions facing each other by the folding area in the above 2.

[0017] 6. In the above 5, the circuit board includes a signal wiring electrically connected to the antenna conductive layer, and the insulating blocking structure is arranged so as not to overlap the signal wiring in the thickness direction, an antenna structure.

[0018] 7. In the above 1, the circuit board comprises a core layer; an inner conductive layer formed on one surface of the core layer adjacent to the antenna conductive layer and the antenna ground layer and including a signal wiring electrically connected to the antenna conductive layer; and an outer conductive layer formed on the other surface opposite to the one surface of the core layer and facing the inner conductive layer.

[0019] 8. An antenna structure according to 7 above, wherein the inner conductive layer further includes a co-planar ground disposed around the signal wiring on the one surface of the core layer.

[0020] 9. An antenna structure according to 8 above, wherein the circuit board further includes a via structure penetrating the core layer to electrically connect the outer conductive layer and the co-planar ground.

[0021] 10. In the above 8, the co-planar ground has a slit area formed in a portion where the circuit board is folded and faces the signal wiring. An antenna structure.

[0022] 11. An antenna structure according to the above 8, wherein the connector includes a signal / power supply pin connected to the signal wiring and a ground pin connected to the co-planar ground.

[0023] 12. An antenna structure according to 11 above, wherein the connector includes a plurality of co-planar grounds arranged around the signal / power supply pin.

[0024] 13. An antenna structure according to the above 1, wherein the antenna element further includes an antenna dielectric layer disposed between the antenna conductive layer and the antenna ground layer.

[0025] 14. An antenna structure according to the above 1, wherein the antenna conductive layer includes an antenna unit including a radiator, a transmission line connected to one end of the radiator, and a signal pad connected to a terminal end of the transmission line, and the circuit board includes a signal wiring bonded to the signal pad of the antenna unit.

[0026] 15. An antenna structure according to the above 14, wherein the radiator has a mesh structure and the signal pad is a solid metal or alloy pattern.

[0027] 16. In the above 14, the antenna structure further includes a ground pad disposed around the signal pad and electrically and physically separated from the signal pad, and the circuit board further includes a co-planar ground spaced from the signal wiring around the signal wiring and bonded to the ground pad of the antenna unit.

[0028]

[0029] An antenna structure according to embodiments of the present invention may include a circuit board connected together to an antenna unit and an antenna ground layer. The circuit board may be connected to an external power source or an external circuit via a connector.

[0030] As the above circuit board is connected together with the antenna ground layer and the connector, the ground efficiency through the antenna ground layer is increased, and the directivity of the antenna unit can be enhanced.

[0031] The connector is coupled to a portion between the first bonding region and the folding region of the circuit board, and the signal wiring of the circuit board may not extend into the folding region. Accordingly, parasitic capacitance and antenna signal disturbance due to folding of the signal wiring can be prevented, and the connection reliability of the connector can be improved.

[0032] In some embodiments, a barrier structure may be inserted between the second bonding region and the folding region of the circuit board. The barrier structure can prevent short circuits within the circuit board and ensure stable connector connection.

[0033]

[0034] FIG. 1 is a schematic cross-sectional view showing an antenna structure according to exemplary embodiments.

[0035] FIG. 2 is a partially enlarged cross-sectional view showing a circuit board and connector included in an antenna structure according to exemplary embodiments.

[0036] FIG. 3 is a plan view of a circuit board of an antenna structure according to exemplary embodiments in the first surface direction.

[0037] FIG. 4 is a plan view of a second surface of a circuit board of an antenna structure according to exemplary embodiments.

[0038] FIG. 5 is a plan view in the first surface direction of a circuit board according to some exemplary embodiments.

[0039] FIG. 6 is a schematic plan view showing an antenna unit included in an antenna structure according to exemplary embodiments.

[0040]

[0041] Embodiments of the present invention provide an antenna structure including an antenna element and a circuit board.

[0042] Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. However, the following drawings attached to this specification illustrate preferred embodiments of the present invention and, together with the contents of the invention described above, serve to further understand the technical concept of the present invention. Therefore, the present invention should not be interpreted as being limited to the matters described in such drawings.

[0043] The terms “first,” “second,” “upper,” “lower,” “top,” “bottom,” etc. used in this application are not used to designate absolute positions, but rather to distinguish different configurations or to distinguish relative positions between configurations.

[0044] The sizes of the components / structures illustrated in the attached drawings may be exaggerated for convenience of explanation and are not limited to the sizes illustrated in the drawings.

[0045] FIG. 1 is a schematic cross-sectional view showing an antenna structure according to exemplary embodiments.

[0046] Referring to FIG. 1, the antenna structure may include an antenna element (100), a circuit board (200), and a connector (300).

[0047] The antenna element (100) may include an antenna conductive layer (120), a dielectric layer (antenna dielectric layer) (110), and an antenna ground layer (130). The antenna conductive layer (120) and the antenna ground layer (130) may be formed on the upper and lower surfaces of the dielectric layer (110), respectively.

[0048] The antenna conductive layer (120) and the antenna ground layer (130) may include a metal or an alloy. For example, the antenna conductive layer (120) and the antenna ground layer (130) may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these. These may be used alone or in combination of two or more thereof.

[0049] In one embodiment, the antenna conductive layer (120) and the antenna ground layer (130) may include silver (Ag) or a silver alloy (e.g., a silver-palladium-copper (APC) alloy), or copper (Cu) or a copper alloy (e.g., a copper-calcium (CuCa) alloy) for low resistance implementation and fine linewidth patterning.

[0050] In some embodiments, the antenna conductive layer (120) may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (ITZO), zinc oxide (ZnOx), or the like.

[0051] In some embodiments, the antenna conductive layer (120) may include a laminated structure of a transparent conductive oxide layer and a metal layer, for example, a two-layer structure of a transparent conductive oxide layer-metal layer, or a three-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer. In this case, the flexible characteristics may be improved by the metal layer, while the resistance may be lowered, thereby improving the signal transmission speed, and the corrosion resistance and transparency may be improved by the transparent conductive oxide layer.

[0052] The antenna conductive layer (120) may include a blackening treatment portion. Accordingly, the reflectivity on the surface of the antenna unit may be reduced, thereby reducing pattern visibility due to light reflection.

[0053] In one embodiment, the surface of the metal layer included in the antenna unit may be converted into a metal oxide or metal sulfide to form a blackening layer. In one embodiment, a blackening layer such as a black material coating layer or a plating layer may be formed on the antenna unit or the metal layer. The black material or plating layer may include an oxide, sulfide, alloy, or the like containing silicon, carbon, copper, molybdenum, tin, chromium, molybdenum, nickel, cobalt, or at least one of these.

[0054] The composition and thickness of the blackening layer can be adjusted taking into account the reflectivity reduction effect and antenna radiation characteristics.

[0055] The dielectric layer (110) may include, for example, a transparent resin material. For example, the dielectric layer (110) may include a polyester resin such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, or polybutylene terephthalate; a cellulose resin such as diacetyl cellulose or triacetyl cellulose; a polycarbonate resin; an acrylic resin such as polymethyl (meth)acrylate or polyethyl (meth)acrylate; a styrene resin such as polystyrene or an acrylonitrile-styrene copolymer; a polyolefin resin such as polyethylene, polypropylene, a polyolefin having a cyclo- or norbornene structure, or an ethylene-propylene copolymer; a vinyl chloride resin; an amide resin such as nylon or an aromatic polyamide; an imide resin; a polyethersulfone resin; a sulfone resin; a polyetheretherketone resin; a sulfated polyphenylene resin; a vinyl alcohol resin; It may include vinylidene chloride resin; vinyl butyral resin; allylate resin; polyoxymethylene resin; epoxy resin; urethane or acrylic urethane resin; silicone resin, etc. These may be used alone or in combination of two or more.

[0056] In some embodiments, an adhesive film such as an optically clear adhesive (OCA), an optically clear resin (OCR), or the like may also be included in the dielectric layer (110).

[0057] In some embodiments, the dielectric layer (110) may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, glass, or the like.

[0058] The dielectric layer (110) may have a single-layer structure or a double-layer structure.

[0059] The dielectric layer (110) forms an impedance or inductance for the antenna unit, so that the frequency band that the antenna element can drive or sense can be adjusted. In some embodiments, the dielectric constant of the dielectric layer (110) can be adjusted to a range of about 1.5 to 12. If the dielectric constant exceeds about 12, the driving frequency may be excessively reduced, so that driving in a high-frequency band may not be realized.

[0060] In one embodiment, the thickness of the dielectric layer (110) may be 1 mm or less. For example, the thickness of the dielectric layer (110) may be 0.1 mm to 1 mm, 0.3 mm to 1 mm, or 0.5 to 1 mm.

[0061] The circuit board (200) may be electrically connected to the antenna conductive layer (120) or the antenna unit. The circuit board (200) may also be electrically connected to the antenna ground layer (130).

[0062] According to exemplary embodiments, one end of the circuit board (200) may be electrically connected to the antenna conductive layer (120) in a first bonding area (BR1). The other end of the circuit board (200) may be electrically connected to the antenna ground layer (130) in a second bonding area (BR2).

[0063] In some embodiments, the antenna unit and the one end of the circuit board (200) may be electrically connected to each other using a first conductive bonding film (160) in a first bonding area (BR1). The antenna ground layer (130) and the other end of the circuit board (200) may be electrically connected to each other using a second conductive bonding film (170) in a second bonding area (BR2).

[0064] The first conductive bonding film (160) and the second conductive bonding film (170) can each be formed from an anisotropic conductive film (ACF).

[0065] According to exemplary embodiments, the circuit board (200) can be bent through the folding region (FR). Accordingly, the connection of the antenna conductive layer (120) and the antenna ground layer (130) can be implemented together using a single circuit board (200).

[0066] The antenna conductive layer (120) or the antenna unit can be electrically connected to an external power source / antenna driving integrated circuit (IC) through a connector (300) coupled or mounted on the circuit board (200). Accordingly, power supply and driving signal transmission to the antenna unit can be performed through the circuit board (200).

[0067] According to the exemplary embodiments described above, the antenna ground layer (130) may be connected to the circuit board (200), so that the grounding efficiency through the antenna ground layer (130) may be improved. In addition, the radiation directivity of the antenna conductive layer (120) may be enhanced in the direction opposite to the antenna ground layer (130). According to the exemplary embodiments, the antenna element (100) may be provided as a vertical radiating antenna having radiation directivity above the upper surface of the antenna conductive layer (120).

[0068] In some embodiments, the circuit board (200) may include a connection region (CR) in which a connector (CR) is coupled between a first bonding region (BR1) and a folding region (FR). The connection region (CR) may be adjacent to the first bonding region (BR1). For example, the distance between the connection region (CR) and the folding region (FR) may be greater than the distance between the connection region (CR) and the first bonding region (BR1).

[0069] Accordingly, sagging, wrinkling, etc. of the circuit board (200) due to the weight of the connector (300) can be prevented or reduced.

[0070] For example, when the connector (300) is coupled to or positioned adjacent to the folding area (FR), the weight of the connector (300) may cause the circuit board (200) to bend outside the folding area (FR). In this case, the conductive layers included in the circuit board (200) may face each other, causing parasitic capacitance, which may cause antenna signal disturbance.

[0071] However, according to embodiments of the present application, the connector (300) can be positioned adjacent to the first bonding region (BR1) to suppress the occurrence of the parasitic capacitance described above.

[0072] In some embodiments, a blocking structure (290) may be disposed on a portion between the second bonding region (BR2) and the folding region (FR) of the circuit board (200). The blocking structure (290) may include an insulating material, such as a resin material. Accordingly, a short circuit occurring when portions of the circuit board (200) facing each other by the folding region (FR) come into contact with each other can be prevented.

[0073] In addition, even when a relatively large-sized connector (300) is used in a thin antenna element (100) using a thin dielectric layer (110) of the thickness range described above, it is possible to reduce defects due to stretching or bending of the circuit board (200) and provide stable connector (300) connection.

[0074] In one embodiment, the blocking structure (290) may be attached to a portion of the circuit board (200) between the connection region (CR) and the folding region (FR).

[0075] In one embodiment, the connector (300) and the blocking structure (290) may not overlap each other in the thickness direction. Accordingly, variations in dielectric properties around the connector (300) due to the blocking structure (290) can be suppressed.

[0076] For example, the blocking structure (290) may be formed in the form of an insulating printed pattern, an adhesive film, or a tape.

[0077] FIG. 2 is a partially enlarged cross-sectional view showing a circuit board and connector included in an antenna structure according to exemplary embodiments.

[0078] Referring to FIG. 2, the circuit board (200) may include a core layer (215), an inner conductive layer (220), and an outer conductive layer (230). The inner conductive layer (220) and the outer conductive layer (230) may be disposed on the lower surface and the upper surface of the core layer (215).

[0079] The core layer (215) may be a surface adjacent to the antenna conductive layer (120) and the antenna ground layer (130) on the lower surface. The upper surface of the core layer (215) may be an opposite surface of the antenna conductive layer (120) and the antenna ground layer (130).

[0080] The inner conductive layer (220) of the circuit board (200) may include conductive layers that are bonded and electrically connected to the antenna conductive layer (120) and the antenna ground layer (130).

[0081] The core layer (215) may include a flexible resin such as a polyimide resin, a modified polyimide (MPI), an epoxy resin, a polyester, a cycloolefin polymer (COP), a liquid crystal polymer (LCP), etc. In a preferred embodiment, the core layer (215) may include a polyimide resin or an MPI.

[0082] The conductive layers (220, 230) of the circuit board may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), tin (Sn), zinc (Zn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these metals. In some embodiments, the conductive layers (220, 230) may include copper or a copper alloy in consideration of signal efficiency and ground efficiency.

[0083] In one embodiment, the circuit board (200) may be manufactured from a copper clad laminate (CCL). The circuit board (200) may be provided as a flexible printed circuit board (FPCB).

[0084] As described above, the connector (300) can be coupled or mounted to the connection area (CR) of the circuit board (200).

[0085] The connector (300) may include a signal / power supply pin (310) and a ground pin (320). The signal / power supply pin (310) may be in contact with or connected to a signal wire included in an inner conductive layer (220) of a circuit board (200). The connector (300) includes an external connection terminal (330), and a power cable may be connected through the external connection terminal (330). Accordingly, power supply and signal transmission may be performed to the antenna conductive layer (120) through the power cable, the external connection terminal (330), the signal / power supply pin (310), and the signal wire of the inner conductive layer (220).

[0086] The ground pin (320) may contact or be connected to a co-planar ground included in the inner conductive layer (220) of the circuit board (200). In some embodiments, the connector (300) may include a plurality of ground pins (320).

[0087] Fig. 3 is a plan view of a circuit board of an antenna structure according to exemplary embodiments in a first surface direction. Fig. 4 is a plan view of a circuit board of an antenna structure according to exemplary embodiments in a second surface direction. Figs. 3 and 4 are plan views each showing a state before folding of the circuit board (200).

[0088] As illustrated in Fig. 1, the first surface (200a) of the circuit board (200) may correspond to the inner surface facing the antenna element (100). As described with reference to Fig. 2, an inner conductive layer (220) may be arranged on the lower surface of the core layer (215) toward the inner surface.

[0089] The second surface (200b) of the circuit board (200) may correspond to an outer surface facing the antenna element (100). As described with reference to Fig. 2, an outer conductive layer (230) may be arranged on the upper surface of the core layer (215) toward the outer surface.

[0090] Referring to FIG. 3, the inner conductive layer (220) may include a signal wire (222). One end of the signal wire (222) may be bonded or electrically connected to the antenna conductive layer (120) or the antenna unit in the first bonding area (BR1).

[0091] The other end of the signal wire (222) may be connected to the signal / power supply pin (310) of the connector (300) in the connection area (CR). According to exemplary embodiments, the signal wire (222) may not extend to the folding area (FR). Accordingly, mechanical / electrical side effects such as parasitic capacitance and wire cracking occurring during folding of the signal wire (222) can be prevented.

[0092] In some embodiments, the inner conductive layer (220) may further include a co-planar ground (224) extending together with the signal wire (222) at the same level as the signal wire (222). The co-planar ground (224) may be physically spaced from the signal wire (222) by a predetermined distance.

[0093] For example, a pair of ends of a co-planar ground (224) can be arranged facing each other with a signal wire (222) between them. The noise around the signal wire (222) can be blocked by the co-planar ground (224), and the power supply concentration through the signal wire (222) can be improved.

[0094] A slit region (228) may be formed at the other end of the nose planar ground (224). The slit region (228) may be a vacancy region from which a conductive layer or conductive material is removed.

[0095] The slit region (228) can face the signal wire (222) in the folded circuit board (200) through the folding region (FR). Contact or short circuit between the signal wire (222) and the co-planar ground (224) in the folded circuit board (200) can be prevented by the slit region (228).

[0096] The other end of the co-planar ground (224) can be bonded or electrically connected to the antenna ground layer (130) in the second bonding region (BR2).

[0097] Referring to FIG. 4, the outer conductive layer (230) faces the signal wire (222) and the co-planar ground (224) with the core layer (215) interposed therebetween and can serve as a vertical ground for the signal wire (222). An electric field is formed in the core layer (215) between the outer conductive layer (230) and the signal wire (222), and the power supply efficiency through the signal wire (222) can be increased.

[0098] In some embodiments, the co-planar ground (224) and the outer conductive layer (230) may be connected to each other through a via structure (240). The via structure (240) may penetrate the core layer (215) and connect the co-planar ground (224) and the outer conductive layer (230) to each other. Accordingly, absorption and emission of noise around the signal wire (222) may be promoted.

[0099] As illustrated in FIGS. 3 and 4, a plurality of via structures (240) may be arranged to form a via row. For example, the via structures (240) may be arranged along a peripheral area of ​​the coplanar ground (224) or the outer conductive layer (230). The via structures (240) may also be arranged along the periphery of the signal wiring (222) and the slit area (228).

[0100] For example, a via structure (240) can be formed by forming a via hole penetrating the core layer (215) and then filling the via hole through a copper plating process.

[0101] Through ports (TP1, TP2) can be formed in the connection area (CR) of the circuit board (200). The through ports (TP1, TP2) have a through hole shape, and a connector (300) can be inserted and fixed therein.

[0102] In some embodiments, the through port may include a first through port (TP1) and a second through port (TP2).

[0103] The signal / power supply pin (310) of the connector (300) can be inserted into the first through port (TP1) and brought into contact with or connected to the other end of the signal wire (222). The ground pin (320) of the connector (300) can be inserted into the second through port (TP2) and brought into contact with or connected to the co-planar ground (224) and the outer conductive layer (230).

[0104] In one embodiment, the pins (310, 320) of the connector (300) can be secured in the through ports (TP1, TP2) by soldering or welding.

[0105] The ground pin (320) can be connected to the co-planar ground (224) and the outer conductive layer (230) through the second through port (TP2). As described above, a plurality of ground pins (320) can be included in the connector (300), each of which can be inserted into the second through port (TP2).

[0106] In one embodiment, four ground pins (320) (or second through ports (TP2)) may be arranged around a signal / power pin (310) (or first through port (TP1)).

[0107] FIG. 5 is a plan view in the first surface direction of a circuit board according to some exemplary embodiments.

[0108] Referring to FIG. 5, the position of the blocking structure (290) illustrated in FIG. 3 may be appropriately changed. According to exemplary embodiments, the blocking structure (290) may be positioned so as not to overlap the signal wiring (222) and the connector (300) in the thickness direction or vertical direction depending on the folding of the circuit board (200).

[0109] In one embodiment, the blocking structure (290a) may be positioned or attached on a portion of the first side (200a) of the circuit board (100) between the connection area (CR) and the folding area (FR).

[0110] In one embodiment, the blocking structure (290b) may be formed on a portion of the co-planar ground (224) around the signal wiring (222) between the first bonding region (BR1) and the folding region (FR).

[0111] In one embodiment, the blocking structure (290c) can be formed on a portion of the co-planar ground (224) around the slit region (228) between the second bonding region (BR2) and the folding region (FR).

[0112] As described above, by using the blocking structure (290, 290a, 290b, 290c), it is possible to prevent short circuits of the conductive layer and mechanical failure due to folding of the circuit board (220) without affecting electrical connection / signal transmission through the signal wiring (222) and connector (300).

[0113] FIG. 6 is a schematic plan view showing an antenna unit included in an antenna structure according to exemplary embodiments.

[0114] Referring to FIG. 6, the antenna unit may include a radiator (122), a transmission line (124), and a signal pad (126).

[0115] For example, the radiator (122) has a polygonal plate shape, and the transmission line (124) has a width smaller than the radiator (122) and can be connected to one end or one side of the radiator (122). The radiator (122) and the transmission line (124) can be formed as a single member integrally connected to each other.

[0116] The target resonant frequency of the antenna element (100) can be adjusted depending on the shape / size of the radiator (122). In a non-limiting embodiment, the radiator (122) can be designed to be capable of radiating in a high frequency / ultra-high frequency band of 3G, 4G, 5G or higher. For example, a radiation band of a frequency band of 0.5 GHz or higher, 1 GHz or higher, 10 GHz or higher, 20 GHz or higher, 30 GHz or higher, or 40 GHz or higher can be implemented through the radiator (122).

[0117] The signal pad (126) may be positioned in the first bonding region (BR1) and connected to the end of the transmission line (124). In one embodiment, the signal pad (126) may be a single member substantially integral with the transmission line (124). In this case, the end of the transmission line (124) may also be provided as the signal pad (126).

[0118] The radiator (122) may be positioned within the visible area of ​​the target object. The radiator (122) may be formed in a mesh structure to prevent the radiator (122) from being visually recognized. The transmission line (124) may also be formed at least partially in the mesh structure.

[0119] In one embodiment, a dummy mesh layer (125) may be formed around the radiator (122) and the transmission line (124). The dummy mesh layer (125) may include a mesh structure substantially identical to the mesh structure included in the radiator (122) and the transmission line (124). Accordingly, the spatial distribution of the conductive pattern around the radiator (122) and the transmission line (124) may be uniform, thereby preventing the radiator (122) and the transmission line (124) from being visually recognized.

[0120] The dummy mesh layer (125) can be formed together with the radiator (122) and the transmission line (124) by etching the same mesh layer. The dummy mesh layer (125) can be physically separated / separated from the radiator (122) and the transmission line (124) through a separation region (SR).

[0121] The signal pad (126) positioned in the first bonding region (BR1) may be a solid metal or alloy pattern. Accordingly, an increase in resistance due to bonding with the circuit board (200) can be suppressed, thereby improving power supply efficiency.

[0122] In some embodiments, a ground pad (128) may be disposed around the signal pad (126) in the first bonding region (BR1). For example, a pair of ground pads (128) may be disposed facing each other with the signal pad (126) interposed therebetween. The ground pad (128) may be formed of a solid metal or alloy pattern. The ground pad (128) may be physically and electrically separated / separated from the signal pad (126).

[0123] For example, an anisotropic conductive film (ACF) can be attached together to the signal pad (126) and the ground pad (128) in the first bonding region (BR1). Thereafter, one end of the signal wire (222) and the co-planar ground (224) can be bonded onto the signal pad (126) and the ground pad (128), respectively, through a heating / pressure process.

[0124] Accordingly, the signal pad (126) is electrically connected to the signal wiring (222), and the ground pad (128) can be electrically connected to the co-planar ground (224). The ground pad (128) is provided as a bonding pad to enhance bonding stability, and can absorb noise around the signal pad (126) and discharge it through the co-planar ground (224).

[0125] In one embodiment, the ground pad (128) may be omitted.

[0126] The antenna structure according to the embodiments described above can be attached or fixed to, for example, a building structure such as a window, wall or ceiling of a public transportation, a window, a vehicle, a sign, etc.

[0127] The antenna cable can be buried in objects such as public transportation such as buses and subways, building interior walls, windows, and signs, and connected or inserted into the external connection terminal (330) of the connector (300). Accordingly, power can be supplied to the antenna unit, and antenna radiation can be performed.

[0128] For example, the antenna element (100) can be electrically connected to a public Wi-Fi repeater in a public transportation or building via the antenna cable and used as a repeater antenna.

[0129] However, the application of the above-described antenna structure is not limited to a repeater antenna, and can also be applied to an antenna of an image display device combined with a communication function, such as a smartphone.

Claims

1. An antenna element including an antenna conductive layer and an antenna ground layer; A circuit board having one end electrically connected to the antenna conductive layer and the other end electrically connected to the antenna ground layer; and An antenna structure comprising a connector coupled to the circuit board and electrically connected to the antenna conductive layer.

2. An antenna structure according to claim 1, wherein the circuit board includes a first bonding region including the one end, a second bonding region including the other end, a connection region to which the connector is coupled, and a folding region.

3. An antenna structure according to claim 2, wherein the connection region is located between the first bonding region and the folding region.

4. An antenna structure according to claim 3, wherein the connection region is closer to the first bonding region than to the folding region.

5. An antenna structure according to claim 2, further comprising an insulating blocking structure disposed between the circuit board portions facing each other by the folding area.

6. In claim 5, the circuit board includes a signal wiring electrically connected to the antenna conductive layer, An antenna structure in which the insulating blocking structure is arranged so as not to overlap the signal wiring in the thickness direction.

7. In claim 1, the circuit board core layer; An inner conductive layer formed on one surface of the core layer adjacent to the antenna conductive layer and the antenna ground layer and including a signal wiring electrically connected to the antenna conductive layer; and An antenna structure comprising an outer conductive layer formed on the other side of the core layer opposite to the one side thereof and facing the inner conductive layer.

8. An antenna structure according to claim 7, wherein the inner conductive layer further includes a co-planar ground arranged around the signal wiring on the one surface of the core layer.

9. An antenna structure according to claim 8, wherein the circuit board further includes a via structure penetrating the core layer and electrically connecting the outer conductive layer and the co-planar ground.

10. An antenna structure according to claim 8, wherein the co-planar ground has a slit area formed in a portion of the circuit board that faces the signal wiring when folded.

11. An antenna structure according to claim 8, wherein the connector includes a signal / power supply pin connected to the signal wiring and a ground pin connected to the co-planar ground.

12. An antenna structure according to claim 11, wherein the connector comprises a plurality of co-planar grounds arranged around the signal / power supply pin.

13. An antenna structure according to claim 1, wherein the antenna element further includes an antenna dielectric layer disposed between the antenna conductive layer and the antenna ground layer.

14. In claim 1, the antenna conductive layer includes an antenna unit including a radiator, a transmission line connected to one end of the radiator, and a signal pad connected to a terminal end of the transmission line, An antenna structure, wherein the circuit board includes signal wiring bonded to signal pads of the antenna unit.

15. An antenna structure according to claim 14, wherein the radiator has a mesh structure, and the signal pad is a solid metal or alloy pattern.

16. In claim 14, the antenna unit further includes a ground pad disposed around the signal pad and electrically and physically separated from the signal pad, An antenna structure, wherein the circuit board further includes a co-planar ground spaced from the signal wiring around the signal wiring and bonded to the ground pad of the antenna unit.

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