Wafer cleaning apparatus and method

Abstract

The present invention relates to the field of semiconductor devices. Disclosed are a wafer cleaning apparatus and method. The wafer cleaning apparatus comprises: a first tank body used for accommodating a cleaning fluid and a wafer; a second tank body used for accommodating the cleaning fluid; a spraying mechanism used for spraying the cleaning fluid to the wafer; and a second circulating filtration pipeline, wherein a liquid inlet of the second circulating filtration pipeline can be communicated with the first tank body, the second tank body is arranged in the second circulating filtration pipeline, a liquid outlet of the second circulating filtration pipeline is communicated with the spraying mechanism, and the second circulating filtration pipeline can discharge the cleaning fluid in the first tank body into the second tank body and convey the cleaning fluid from the second tank body to the spraying mechanism. The cleaning fluid in the first tank body can be discharged into the second tank body through the second circulating filtration pipeline, and the wafer is sprayed and cleaned by means of the second circulating filtration pipeline and the spraying mechanism, thereby improving the cleaning effect of the wafer.

Description

Wafer cleaning device and cleaning method Technical Field

[0001] The present invention relates to the field of semiconductor equipment, and in particular to a wafer cleaning device and a cleaning method. Background Art

[0002] Cleaning is an essential step in the semiconductor manufacturing process. Tank-type cleaning machines, with their significant advantages of high throughput and minimal cleaning fluid consumption, have become the mainstream tool for circulating wafer cleaning. A significant difference between tank cleaning and single-wafer cleaning is the repeated use of circulating chemical solutions. To ensure the relative cleanliness of the chemical solution within the tank, it must be continuously filtered and recycled to remove contaminants such as particles and metal ions generated after the process.

[0003] Existing tank cleaning processes mostly utilize a dual-tank structure. When the inner tank is full, the liquid overflows into the outer tank by gravity. The cleaning liquid in the outer tank is then filtered through a circulating filter line and ultimately returns to the inner tank. This filtration cycle removes most impurities, including particulate matter. However, of the particles generated during the inner tank process, only those that reach the liquid surface can overflow into the outer tank; the majority of the remaining particles will settle downward due to gravity. Consequently, as the number of wafers cleaned increases, impurities in the tank accumulate, resulting in poor cleaning results.

[0004] Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a wafer cleaning device and a cleaning method in order to overcome the defects of the existing tank-type cleaning device in that the tank body contains a lot of impurities and the cleaning effect is poor.

[0006] The present invention solves the above technical problems through the following technical solutions:

[0007] A wafer cleaning device, comprising:

[0008] a first tank body, the first tank body being used to accommodate a cleaning liquid and a wafer;

[0009] a second tank body, the second tank body being used to contain a cleaning liquid;

[0010] A spraying mechanism, the spraying mechanism being used to spray a cleaning liquid onto the wafer;

[0011] The second circulation filter pipeline, the liquid inlet of the second circulation filter pipeline can be connected with the first tank body, the second tank body is arranged in the second circulation filter pipeline, the liquid outlet of the second circulation filter pipeline is connected with the spray mechanism, and the second circulation filter pipeline can discharge the cleaning liquid in the first tank body into the second tank body, and transport it from the second tank body to the spray mechanism.

[0012] Preferably, the second circulation filtration pipeline further includes an auxiliary circulation filtration pipeline, which is communicated with the second tank body and is used for circulating and filtering the cleaning liquid in the second tank body.

[0013] Preferably, the second tank body includes a second inner tank and a second outer tank, the auxiliary circulation filtering pipeline connects the second inner tank and the second outer tank, and the cleaning liquid in the second inner tank overflows into the second outer tank and returns to the second inner tank through the auxiliary circulation filtering pipeline.

[0014] Preferably, the second circulation filtering pipeline outputs the cleaning liquid from the middle area or the upper area of ​​the second inner tank.

[0015] Preferably, the second tank body is further provided with a second liquid discharge pipeline and a second liquid replenishment pipeline, the second liquid discharge pipeline is communicated with the second inner tank, and the second liquid replenishment pipeline is communicated with the second outer tank.

[0016] Preferably, the second circulation filtration pipeline includes a second circulation filtration segmented pipeline located between the first tank body and the second tank body and a second circulation filtration segmented pipeline located between the second tank body and the spray mechanism, wherein at least one pipeline is provided with a circulation pump and a filter.

[0017] Preferably, the second circulation filtration pipeline includes a second circulation filtration segmented pipeline located between the first tank body and the second tank body, a second circulation filtration segmented pipeline located between the second tank body and the spray mechanism, and an auxiliary circulation filtration pipeline, wherein at least one pipeline is provided with a circulation pump and a filter.

[0018] Preferably, the second tank body is a single tank body structure, and the auxiliary circulation filtration pipeline and the second circulation filtration pipeline share the circulation pump and the filter.

[0019] Preferably, the wafer cleaning device further includes a first circulation filtering pipeline, which is connected to the first tank body and is used for circulating and filtering the cleaning liquid in the first tank body.

[0020] Preferably, the first tank body includes a first inner tank and a first outer tank, the first circulating filtration pipeline connects the first inner tank and the first outer tank, and the cleaning liquid in the first inner tank overflows into the first outer tank and returns to the first inner tank through the first circulating filtration pipeline.

[0021] Preferably, a first liquid infusion pipeline and a first liquid discharge pipeline are further provided on the first tank body, the first liquid infusion pipeline is communicated with the first outer tank, and the first liquid discharge pipeline is communicated with the first inner tank.

[0022] Preferably, the wafer cleaning device further comprises a liquid level sensor, which is disposed in the first tank body and is used to detect the liquid level of the cleaning liquid in the first tank body.

[0023] A wafer cleaning method, which uses the wafer cleaning device as described above, the cleaning method comprising:

[0024] Immersing and cleaning the wafer in the first tank;

[0025] Drain the cleaning fluid in the first tank;

[0026] During the process of draining the cleaning liquid in the first tank body, at least a portion of the cleaning liquid in the first tank body is discharged into the second tank body through the second circulation filter pipeline;

[0027] The wafer is spray cleaned through the second circulation filter pipeline and the spray mechanism.

[0028] Preferably, during the immersion cleaning of the wafers, the cleaning liquid in the first tank is drained while the cleaning liquid is replenished into the first tank to replace the cleaning liquid in the first tank.

[0029] Preferably, the method further comprises: performing self-circulating filtration on the cleaning liquid in the first tank body and / or the cleaning liquid in the second tank body.

[0030] Preferably, in the step of draining the cleaning liquid in the first tank, before the wafer is exposed to the cleaning liquid, the wafer is soaked and sprayed by a spray mechanism to ensure that the wafer can always remain wet.

[0031] A wafer cleaning method, which uses the wafer cleaning device as described above, the cleaning method comprising:

[0032] Immersing and cleaning the wafer in the first tank;

[0033] Drain the cleaning fluid in the first tank;

[0034] After the cleaning liquid in the first tank body is emptied, the second circulation filter pipeline between the first tank body and the second tank body is opened, and the cleaning liquid is supplied to the spray mechanism through the second circulation filter pipeline to spray clean the wafer.

[0035] Preferably, the cleaning method further comprises:

[0036] The cleaning liquid in the first tank body and / or the cleaning liquid in the second tank body are subjected to self-circulation filtration.

[0037] Preferably, in the step of draining the cleaning liquid in the first tank, before the wafer is exposed to the cleaning liquid, the wafer is soaked and sprayed by a spray mechanism to ensure that the wafer can always remain wet.

[0038] The positive and progressive effect of the present invention lies in that, by providing a second tank body and a second circulating filter pipeline, the cleaning liquid in the first tank body can be discharged into the second tank body through the second circulating filter pipeline, and the wafers are spray-cleaned through the second circulating filter pipeline and the spray mechanism. Before being supplied to the spray mechanism, the cleaning liquid in the first tank body can be filtered again through the second circulating filter pipeline, thereby removing impurities remaining in the first tank body and improving cleanliness. The clean cleaning liquid filtered through the second circulating filter pipeline is then sprayed onto the wafers through the spray mechanism to spray-clean the wafers, thereby improving the cleaning effect of the wafers.

[0039] Summary of the Figures

[0040] The features and properties of the present invention are further described by the following examples and accompanying drawings.

[0041] FIG1 is a schematic structural diagram of a wafer cleaning device according to Embodiment 1 of the present invention;

[0042] FIG2 is a schematic structural diagram of a wafer cleaning device according to Embodiment 2 of the present invention;

[0043] FIG3 is a flow chart of a wafer cleaning method according to Embodiment 3 of the present invention;

[0044] FIG4 is a flow chart of a wafer cleaning method according to a fourth embodiment of the present invention.

[0045] Preferred embodiments of the present invention

[0046] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0047] Example 1

[0048] With the continuous development of semiconductor manufacturing processes, the use of wafer cleaning equipment is becoming more and more extensive. For different applications and liquid chemicals, such as the application of degumming process, the traditional internal and external tank self-circulation or single tank self-circulation operation mode can no longer meet the needs. As the number of wafers to be cleaned increases, the colloid and other impurities remaining in the tank cannot be discharged, which in turn affects the wafer cleaning effect.

[0049] In response to this situation, the present embodiment provides a wafer cleaning device, as shown in FIG1 , which includes a first tank body 110 and a first circulation filter pipeline 120. The first tank body 110 is used to hold cleaning liquid and wafers. The first circulation filter pipeline 120 is connected to the first tank body 110 and is used to circulate and filter the cleaning liquid in the first tank body 110. The wafer cleaning device also includes a second tank body 210, a spray mechanism 300, and a second circulation filter pipeline 220. The second tank body 210 is used to hold cleaning liquid, and the spray mechanism 300 is used to spray the cleaning liquid onto the wafers. The liquid inlet of the second circulation filter pipeline 220 can be connected to the first tank body 110. The second tank body 210 is disposed in the second circulation filter pipeline 220. The liquid outlet of the second circulation filter pipeline 220 is connected to the spray mechanism 300. The second circulation filter pipeline 220 can discharge the cleaning liquid in the first tank body 110 into the second tank body 210, and transport it from the second tank body 210 to the spray mechanism 300.

[0050] Specifically, in this embodiment, the first tank body 110 includes a first inner tank 111 and a first outer tank 112. The first circulation filter pipeline 120 connects the first inner tank 111 and the first outer tank 112. The cleaning liquid in the first inner tank 111 overflows into the first outer tank 112 and returns to the first inner tank 111 through the first circulation filter pipeline 120. The first circulation filter pipeline 120 is provided with a circulation pump 410 and a filter 510. The liquid inlet of the first circulation filter pipeline 120 is connected to the first outer tank 112, and the liquid outlet is connected to the first inner tank 111. Of course, in other embodiments, the first tank body 110 can also be a single tank structure.

[0051] The first tank body 110 can be used to soak and dissolve impurities such as colloids on the wafer. When the impurities floating in the first inner tank 111 reach the overflow position, they will overflow into the first outer tank 112 and be filtered through the first circulation filter pipe 120 to remove most of the impurities such as colloids and return to the first inner tank 111. During the wafer cleaning process, the impurities in the first tank body 110 will increase. Some impurities such as residual glue that have not reached the overflow position will sink under the action of gravity and cannot be filtered. They will accumulate at the bottom of the first tank body 110, such as the bottom of the first inner tank 111, resulting in a deterioration in the soaking and cleaning effect of the first tank body 110 on the wafer. By setting up the second tank body 210 and the second circulation filter pipe 220, the cleaning liquid in the first tank body 110 can be discharged into the second tank body 210 through the second circulation filter pipe 220, and the wafers are spray-cleaned through the second circulation filter pipe 220 and the spray mechanism 300. Before being supplied to the spray mechanism 300, the cleaning liquid in the first tank 110 can be filtered again through the second circulation filter pipe 220 to remove impurities, especially impurities deposited in the first tank 110, thereby improving the cleanliness of the cleaning liquid. The clean cleaning liquid filtered by the second circulation filter pipe 220 is then sprayed onto the wafers through the spray mechanism 300 to spray clean the wafers, thereby improving the wafer cleaning effect.

[0052] In this embodiment, a circulation pump 420 and a filter 520 are provided on the second circulation filtration pipeline segment 220a located between the first tank body 110 and the second tank body 210. The cleaning liquid in the first tank body 110 is filtered by the filter 520 and then discharged into the second tank body 210. This removes impurities in the cleaning liquid and improves the spray cleaning effect of the wafers.

[0053] In addition, a circulation pump 430 and a filter 530 are also provided on the second circulation and filtration segmented pipeline 220b located between the second tank 210 and the spray mechanism 300. The cleaning liquid in the second tank 210 is filtered through the filter 530 before reaching the spray mechanism 300 to clean the wafers. This can further improve the cleanliness of the cleaning liquid supplied to the spray mechanism 300, thereby improving the spray cleaning effect of the wafers.

[0054] To further enhance the cleanliness of the cleaning liquid supplied to the spray mechanism 300, the second circulation filter line 220 further includes an auxiliary circulation filter line 230. The auxiliary circulation filter line 230 communicates with the second tank 210 and is used to circulate and filter the cleaning liquid within the second tank 210. The auxiliary circulation filter line 230 further filters impurities from the cleaning liquid within the second tank 210, ensuring even greater cleanliness of the cleaning liquid supplied to the spray mechanism 300. This clean cleaning liquid can effectively remove impurities from the wafer surface, ensuring wafer cleanliness and quality.

[0055] It should be noted that, in other embodiments, the circulation pump and filter may be provided only on the second circulation filtration pipeline segment 220a located between the first tank body 110 and the second tank body 210; or only on the second circulation filtration segment pipeline 220b located between the second tank body 210 and the spray mechanism 300; or only on the auxiliary circulation filtration pipeline 230. Furthermore, the circulation pump and filter may be provided simultaneously on any two of the second circulation filtration segment pipelines 220a, 220b, and the auxiliary circulation filtration pipeline 230. For example, the circulation pump and filter may be provided simultaneously on the auxiliary circulation filtration pipeline 230 and the second circulation filtration segment pipeline 220a located between the first tank body 110 and the second tank body 210.

[0056] In this embodiment, the second tank body 210 includes a second inner tank 211 and a second outer tank 212, and the auxiliary circulation filter pipeline 230 connects the second inner tank 211 and the second outer tank 212. The cleaning liquid in the second inner tank 211 overflows into the second outer tank 212 and returns to the second inner tank 211 through the auxiliary circulation filter pipeline 230. The cleaning liquid in the second inner tank 211 overflows into the second outer tank 212, which can remove floating impurities in the second inner tank 211. A circulation pump 440 and a filter 540 are provided on the auxiliary circulation filter pipeline 230. The liquid inlet of the auxiliary circulation filter pipeline 230 is connected to the second outer tank 212, and the liquid outlet is connected to the second inner tank 211. Of course, in other embodiments, the second tank body 210 can also be a single tank structure. The second tank body 210 adopts a single tank structure, which takes up little space.

[0057] Furthermore, the second circulation filtration line 220 discharges the cleaning liquid from the middle or upper region of the second inner tank 211. Some impurities in the second inner tank 211 float upward and overflow into the second outer tank 212, while some impurities settle downward under the influence of gravity at the bottom of the second inner tank 211. As a result, the cleaning liquid in the middle or upper region of the second inner tank 211 has a higher degree of cleanliness. Therefore, discharging the cleaning liquid from the middle or upper region of the second inner tank 211 further improves the wafer cleaning effect.

[0058] To prevent impurities from being filtered out of the second tank 210, the second tank 210 is further provided with a second drainage line 250 and a second replenishment line 240. The second drainage line 250 is in communication with the second inner tank 211, and the second replenishment line 240 is in communication with the second outer tank 212. The provision of the second drainage line 250 and the second replenishment line 240 allows the cleaning liquid in the second tank 210 to be drained while being replenished, thereby completing the replacement of the cleaning liquid in the second tank 210 and further improving the cleanliness of the cleaning liquid in the second tank 210. Furthermore, the second liquid replenishment line 240 is connected to the second outer tank 212, enabling real-time replenishment of the cleaning fluid in the second tank 210. Furthermore, the fresh cleaning fluid replenished via the second liquid replenishment line 240 is buffered in the second outer tank 212 before flowing through the auxiliary circulation filtration line 230 into the second inner tank 211, thereby minimizing changes in the concentration and temperature of the cleaning fluid in the second inner tank 211. A valve 650 is provided on the second liquid discharge line 250.

[0059] To reduce impurities in the cleaning liquid reaching the second tank 210, the first tank 110 is further provided with a first liquid replenishment line 130 and a first liquid drain line 140. The first liquid replenishment line 130 is in communication with the first outer tank 112, and the first liquid drain line 140 is in communication with the first inner tank 111. When the wafers are immersed and cleaned in the first tank 110, the first liquid drain line 140 and the first liquid replenishment line 130 can be provided to simultaneously drain the cleaning liquid in the first tank 110 and replenish the cleaning liquid therein. This allows the cleaning liquid in the first tank 110 to be replaced while the wafers are immersed and cleaned, thereby reducing impurities in the cleaning liquid reaching the second tank 210. In addition, the first fluid replenishment pipeline 130 is connected to the first outer tank 112, which not only can replenish the cleaning fluid in the first tank body 110 in real time, but also can allow the fresh cleaning fluid replenished through the first fluid replenishment pipeline 130 to be buffered through the first outer tank 112, and then flow into the first inner tank 111 through the first circulation filter pipeline 120, thereby not easily causing changes in the concentration and temperature of the cleaning fluid in the first inner tank 111.

[0060] The first liquid discharge pipeline 140 and the first circulating filtration pipeline 120 share a circulating pump 410 , and liquid discharge can be completed by opening valves 610 and 620 and closing valves 630 and 640 .

[0061] In this embodiment, the above-mentioned filters are all arranged on the output side of the circulation pump. The output pressure of the circulation pump is higher, which is conducive to improving the filtering effect. Of course, in other embodiments, the filter can also be arranged on the input side of the circulation pump, thereby reducing the entry of impurities into the circulation pump and extending the service life of the circulation pump.

[0062] In this embodiment, the wafer cleaning apparatus further includes a liquid level sensor (not shown in the figure), which is disposed in the first tank body 110 and is used to detect the liquid level of the cleaning liquid in the first tank body 110. The liquid level sensor can obtain the liquid level of the cleaning liquid in the first tank body 110. On the one hand, during the process of immersion cleaning of the wafers in the first tank body 110, it is convenient to replenish the cleaning liquid in real time according to the liquid level; on the other hand, when the valve 640 is opened to pass the cleaning liquid in the first tank body 110 into the second tank body 210 for spray cleaning of the wafers, it can be determined whether the cleaning liquid in the first tank body 110 has been completely drained.

[0063] Example 2

[0064] As shown in FIG2 , the structure of this embodiment is substantially the same as that of embodiment 1, and the similarities are not repeated here. The differences are as follows:

[0065] The circulation pump and filter are only provided on the second circulation and filtration segmented pipeline 220b located between the second tank body 210 and the spray mechanism 300. Furthermore, the second tank body 210 is a single tank structure, and the auxiliary circulation and filtration pipeline 230 and the second circulation and filtration segmented pipeline 220b share the circulation pump 530 and filter 430, which helps to reduce costs.

[0066] Example 3

[0067] This embodiment also provides a wafer cleaning method, which uses the wafer cleaning device of embodiment 1 or embodiment 2. As shown in FIG3 , the cleaning method includes the following steps:

[0068] S11, soaking and cleaning the wafer in the first tank.

[0069] S12, draining the cleaning liquid in the first tank.

[0070] S13. During the process of draining the cleaning liquid in the first tank body, at least a portion of the cleaning liquid in the first tank body is discharged into the second tank body through the second circulation filtration pipeline.

[0071] S14. The wafer is spray-cleaned through the second circulation filter pipeline and the spray mechanism.

[0072] In the process of draining the cleaning liquid in the first tank, before the wafer is exposed to the cleaning liquid, the wafer is soaked and sprayed by the spray mechanism to ensure that the wafer can always remain wet.

[0073] In some embodiments, after the cleaning liquid in the first tank is drained, the spray mechanism continues to spray the wafer for a predetermined time to ensure that impurities and residues on the surface of the wafer are effectively rinsed away.

[0074] By circulating and filtering the cleaning liquid through the second circulation filter pipeline, impurities and contaminants in the cleaning liquid can be removed, the cleanliness of the cleaning liquid can be maintained, and the service life of the cleaning liquid can be extended. This not only saves the cost of the cleaning liquid, but is also more environmentally friendly. By immersing the wafer in the first tank body, most of the dirt and impurities on the wafer surface can be effectively removed. Immersion cleaning allows the cleaning liquid to fully contact the wafer, thoroughly cleaning the dirt and impurities remaining on the wafer surface, thereby improving the cleaning effect. The cleaning liquid is discharged into the second tank body through the second circulation filter pipeline, and the cleaning liquid can be further filtered and recycled, which is conducive to saving cleaning liquid. The filtered cleaning liquid is sprayed on the wafer through the spray mechanism. Spray cleaning can effectively rinse away impurities and residues on the wafer surface, thereby further improving the cleaning effect of the wafer.

[0075] During step S11 , old cleaning liquid in the first tank may be discharged while new cleaning liquid is added to the first tank to replace the old cleaning liquid in the first tank and improve the cleanliness of the cleaning liquid in the first tank.

[0076] In addition, the cleaning method further includes: performing self-circulating filtration on the cleaning liquid in the second tank. Of course, in some embodiments, the cleaning liquid in the first tank can also be self-circulating filtered through the first circulation pipeline, or the cleaning liquid in the first tank and the cleaning liquid in the second tank can also be self-circulating filtered. The above self-circulating filtration operations are conducive to further improving the cleanliness of the cleaning liquid.

[0077] Example 4

[0078] This embodiment provides a wafer cleaning method different from that of embodiment 3, which uses the wafer cleaning device of embodiment 1 or embodiment 2. As shown in FIG4 , the cleaning method includes:

[0079] S21, soaking and cleaning the wafer in the first tank.

[0080] S22, draining the cleaning liquid in the first tank.

[0081] S23. After the cleaning liquid in the first tank body is drained, the second circulation filter pipeline between the first tank body and the second tank body is opened, and the cleaning liquid is supplied to the spray mechanism through the second circulation filter pipeline to spray clean the wafer.

[0082] Wherein, during the process of draining the cleaning liquid in the first tank, before the wafer is exposed to the cleaning liquid, the wafer is immersed and sprayed by the spray mechanism.

[0083] By circulating and filtering the cleaning liquid through the second circulation filter pipeline, impurities and pollutants in the cleaning liquid can be removed, the cleanliness of the cleaning liquid can be maintained, and the service life of the cleaning liquid can be extended, which not only saves the cost of the cleaning liquid, but is also more environmentally friendly. Before the cleaning liquid in the first tank body is emptied, by closing the second circulation filter pipeline between the first tank body and the second tank body, it is possible to prevent the cleaning liquid used for soaking wafers in the first tank body (the cleaning liquid has a high content of impurities and pollutants) from being discharged into the second tank body, thereby preventing the cleaning liquid used for spraying wafers in the second tank body (the cleaning liquid is a fresh and clean cleaning liquid, or a cleaning liquid recycled after spraying the wafers, and its impurity and pollutant content is relatively low) from being contaminated. Before the cleaning liquid in the first tank body is emptied, the wafers are immersion sprayed to keep the wafers wet at all times. After the cleaning liquid in the first tank body is emptied, the second circulation filter pipeline between the first tank body and the second tank body is opened. The cleaning liquid (high impurity content) after soaking the wafers in the first tank body will not be mixed with the cleaning liquid (no impurities or low impurity content) used for spraying the wafers in the second tank body, so that the cleaning liquid of the wafers during the spray cleaning process is cleaner. In addition, after opening the second circulation filter pipeline between the first tank body and the second tank body, the cleaning liquid can circulate between the first tank body and the second tank body, which is beneficial to saving cleaning liquid.

[0084] In addition, the cleaning method further includes: performing self-circulating filtration on the cleaning liquid in the second tank. Of course, in some embodiments, the cleaning liquid in the first tank may also be self-circulating filtered, or the cleaning liquid in both the first tank and the second tank may be self-circulating filtered. The above self-circulating filtration operations are conducive to further improving the cleanliness of the cleaning liquid.

[0085] Although specific embodiments of the present invention have been described above, those skilled in the art will appreciate that these are merely illustrative and that the scope of the present invention is defined by the appended claims. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, and such changes and modifications are intended to fall within the scope of the present invention.

Claims

1. A wafer cleaning device, characterized in that: It includes: A first tank body, the first tank body is used to contain a cleaning solution and a wafer; a second tank body, the second tank body being used to contain a cleaning liquid; A spray mechanism, the spray mechanism being used to spray a cleaning liquid onto the wafer; A second circulation filter pipeline, the liquid inlet of the second circulation filter pipeline can be connected to the first tank body, the second tank body is arranged in the second circulation filter pipeline, the liquid outlet of the second circulation filter pipeline is connected to the spray mechanism, and the second circulation filter pipeline can discharge the cleaning liquid in the first tank body into the second tank body, and transport it from the second tank body to the spray mechanism.

2. The wafer cleaning device according to claim 1, characterized in that: The second circulation filtering pipeline also includes an auxiliary circulation filtering pipeline, which is connected to the second tank body and is used for circulating and filtering the cleaning liquid in the second tank body.

3. The wafer cleaning device according to claim 2, characterized in that: The second tank body includes a second inner tank and a second outer tank, the auxiliary circulation filtering pipeline connects the second inner tank and the second outer tank, and the cleaning liquid in the second inner tank overflows to the second outer tank and returns to the second inner tank through the auxiliary circulation filtering pipeline.

4. The wafer cleaning device according to claim 3, characterized in that: The second circulation filtering pipeline outputs the cleaning liquid from the middle area or the upper area of ​​the second inner tank.

5. The wafer cleaning device according to claim 3, characterized in that: The second tank body is further provided with a second liquid discharge pipeline and a second liquid replenishment pipeline, wherein the second liquid discharge pipeline is communicated with the second inner tank, and the second liquid replenishment pipeline is communicated with the second outer tank.

6. The wafer cleaning device according to claim 1, characterized in that: The second circulation filtering pipeline includes a second circulation filtering segmented pipeline located between the first tank body and the second tank body and a second circulation filtering segmented pipeline located between the second tank body and the spray mechanism, wherein at least one pipeline is provided with a circulation pump and a filter.

7. The wafer cleaning device according to claim 2, characterized in that: The second circulation filtration pipeline includes a second circulation filtration segmented pipeline located between the first tank body and the second tank body, a second circulation filtration segmented pipeline located between the second tank body and the spray mechanism, and an auxiliary circulation filtration pipeline, at least one of which is provided with a circulation pump and a filter.

8. The wafer cleaning device according to claim 7, characterized in that: The second tank body is a single tank body structure, and the auxiliary circulation filtering pipeline and the second circulation filtering pipeline share the circulation pump and the filter.

9. The wafer cleaning device according to claim 1, characterized in that: The wafer cleaning device also includes a first circulation filtering pipeline, which is connected to the first tank body and is used for circulating and filtering the cleaning liquid in the first tank body.

10. The wafer cleaning device according to claim 9, characterized in that: The first tank body includes a first inner tank and a first outer tank, the first circulating filtering pipeline connects the first inner tank and the first outer tank, and the cleaning liquid in the first inner tank overflows into the first outer tank and returns to the first inner tank through the first circulating filtering pipeline.

11. The wafer cleaning device according to claim 10, characterized in that: The first tank body is also provided with a first liquid replenishment pipeline and a first liquid discharge pipeline. The first liquid replenishment pipeline is communicated with the first outer tank, and the first liquid discharge pipeline is communicated with the first inner tank.

12. The wafer cleaning device according to claim 1, characterized in that: The wafer cleaning device further includes a liquid level sensor, which is disposed in the first tank body and is used to detect the liquid level of the cleaning liquid in the first tank body.

13. A wafer cleaning method, characterized in that: It adopts the wafer cleaning device according to any one of claims 1 to 12, and the cleaning method comprises: Immersing and cleaning the wafer in the first tank; Drain the cleaning liquid in the first tank; During the process of draining the cleaning liquid in the first tank body, at least a portion of the cleaning liquid in the first tank body is discharged into the second tank body through the second circulation filtration pipeline; The wafer is spray cleaned through the second circulation filtering pipeline and the spray mechanism.

14. The wafer cleaning method according to claim 13, characterized in that: During the immersion cleaning of the wafer, the cleaning liquid in the first tank is discharged while the cleaning liquid is replenished into the first tank to replace the cleaning liquid in the first tank.

15. The wafer cleaning method according to claim 13, wherein: The method further comprises: The cleaning liquid in the first tank body and / or the cleaning liquid in the second tank body is / are subjected to self-circulation filtration.

16. The wafer cleaning method according to claim 13, characterized in that: In the step of draining the cleaning liquid in the first tank, before the wafer is exposed to the cleaning liquid, the wafer is sprayed and soaked by the spray mechanism to ensure that the wafer can always remain wet.

17. A wafer cleaning method, characterized in that: It adopts the wafer cleaning device according to any one of claims 1 to 12, and the cleaning method comprises: Immersing and cleaning the wafer in the first tank; Drain the cleaning liquid in the first tank; After the cleaning liquid in the first tank body is emptied, the second circulation filter pipeline between the first tank body and the second tank body is opened, and the cleaning liquid is supplied to the spray mechanism through the second circulation filter pipeline to spray clean the wafer.

18. The wafer cleaning method according to claim 17, characterized in that: The cleaning method further comprises: The cleaning liquid in the first tank body and / or the cleaning liquid in the second tank body is / are subjected to self-circulation filtration.

19. The wafer cleaning method according to claim 17, wherein: In the step of draining the cleaning liquid in the first tank, before the wafer is exposed to the cleaning liquid, the wafer is sprayed and soaked by the spray mechanism to ensure that the wafer can always remain wet.

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