Machining method, machining device, and machining program

Abstract

This machining method is executed by a machining device capable of performing additive machining for supplying a powder material to a workpiece while irradiating the same with a laser beam and removal machining on a workpiece using a tool, the method comprising: a step for forming an unnecessary part on the workpiece through the additive machining or the removal machining; a step for performing additive machining to a part of the workpiece different from the unnecessary part; a step for irradiating the unnecessary part with the laser beam after completion of the step for performing the additive machining; and a step for removing the unnecessary part through the removal machining after completion of the irradiating step.

Description

Machining method, machining device, and machining program

[0001] The present disclosure relates to a workpiece machining method, a workpiece machining device, and a workpiece machining program.

[0002] JP 2020-530528 A (Patent Document 1) discloses an additive manufacturing device that performs additive processing using the selective laser melting (SLM) method. The SLM method is a method of achieving layered manufacturing by irradiating a spread metal powder with laser light and locally melting and solidifying the metal powder.

[0003] The additive manufacturing device disclosed in Patent Document 1 includes an energy source for irradiating a laser beam and a heat source such as an infrared lamp. The heat source heats the area irradiated with the laser beam. In this way, the additive manufacturing device performs heat treatment on the additively manufactured object. Heat treatment is a process that changes the properties of the additively manufactured object by heating and cooling.

[0004] Special Publication No. 2020-530528

[0005] In addition to the SLM method, there is also the Directed Energy Deposition (DED) method, which is a method for manufacturing a workpiece by melting and layering supplied powder material with a laser beam. There is a demand for a processing technology that can perform heat treatment on workpieces manufactured by this DED method.

[0006] In one example of the present disclosure, there is provided a processing method executed by a processing device capable of performing additive processing in which a powder material is supplied to a workpiece while irradiating the workpiece with a laser beam, and removing the workpiece using a tool, the processing method including the steps of forming an unnecessary portion in the workpiece by the additive processing or the removing processing, performing the additional processing on a portion of the workpiece different from the unnecessary portion, irradiating the unnecessary portion with the laser beam after completing the additional processing step, and removing the unnecessary portion by the removing processing after completing the irradiating step.

[0007] In one example of the present disclosure, the supply of the powder material is stopped during the irradiating step.

[0008] In one example of the present disclosure, the step of performing the additional processing on the location includes performing a coating process to coat the powder material on the surface of the workpiece.

[0009] In one example of the present disclosure, the irradiating step is performed after a predetermined time has elapsed since additional processing on the location has been completed.

[0010] In one example of the present disclosure, in the irradiating step, the laser light is irradiated onto the unnecessary portion while an irradiation point of the laser light is moved.

[0011] In one example of the present disclosure, in the irradiating step, the laser head is driven so that an irradiation point of the laser light on the unnecessary portion repeatedly passes through a predetermined path.

[0012] In one example of the present disclosure, in the irradiating step, the laser head is driven so that an irradiation point of the laser light on the unnecessary portion repeatedly passes through a predetermined path.

[0013] In one example of the present disclosure, in the irradiating step, the laser light is irradiated onto the unnecessary portion such that an irradiation point of the laser light on the unnecessary portion is different from a focus of the laser light.

[0014] Another example of the present disclosure provides a processing apparatus capable of performing additive processing by supplying a powder material to a workpiece while irradiating the workpiece with a laser beam, and removing the workpiece using a tool. The processing apparatus includes a control unit for controlling the processing apparatus. The control unit executes the following processes: forming an unnecessary portion in the workpiece by the additive processing or the removing processing; performing the additional processing on a portion of the workpiece different from the unnecessary portion; irradiating the unnecessary portion with the laser beam after completing the additional processing; and removing the unnecessary portion by the removing processing after completing the irradiation.

[0015] In another example of the present disclosure, there is provided a processing program executed by a processing device capable of performing additive processing by supplying a powder material while irradiating a workpiece with a laser beam and removing the workpiece using a tool. The processing program causes the processing device to perform the steps of forming an unnecessary portion in the workpiece by the additive processing or the removing processing, performing the additional processing on a portion of the workpiece different from the unnecessary portion, irradiating the unnecessary portion with the laser beam after completing the additional processing step, and removing the unnecessary portion by the removing processing after completing the irradiating step.

[0016] The above and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description of the invention taken in conjunction with the accompanying drawings.

[0017] FIG. 1 is a diagram showing an example of the appearance of a processing device. FIG. 2 is a diagram showing an example of the device configuration of a processing device. FIG. 3 is a cross-sectional view of a laser head during additional processing. FIG. 4 is a diagram showing the processing steps performed by the processing device in chronological order. FIG. 5 is a diagram showing the processing steps performed by the processing device in chronological order. FIG. 6 is a diagram showing an example of a drive mechanism for the processing device. FIG. 7 is a diagram showing an example of the hardware configuration of a control unit. FIG. 8 is a flowchart showing the flow of the processing steps performed by the processing device. FIG. 9 is a diagram showing a workpiece used in an experiment.

[0018] Hereinafter, each embodiment according to the present invention will be described with reference to the drawings. In the following description, the same parts and components are denoted by the same reference numerals. Their names and functions are also the same. Therefore, detailed description thereof will not be repeated. Note that each embodiment and each modified example described below may be selectively combined as appropriate.

[0019] <A. Appearance of Processing Apparatus 100> First, a processing apparatus 100 according to an embodiment will be described with reference to Fig. 1. Fig. 1 is a diagram showing an example of the appearance of processing apparatus 100.

[0020] The processing apparatus 100 is a processing machine capable of additive manufacturing (AM) processing, in which a powder material is supplied to a workpiece while irradiating the workpiece with a laser beam, and subtractive manufacturing (SM) processing, in which a workpiece is subtracted using a tool. The subtractive processing function of the processing apparatus 100 includes, for example, at least one of a milling function and a turning function using a fixed tool.

[0021] The processing device 100 includes, for example, a cover body 130 and an operation panel 200 .

[0022] The cover body 130 is a mechanism for protecting components provided inside the processing apparatus 100. The cover body 130 is provided with a door DR. The door DR is, for example, a sliding door. The door DR may be configured to be openable and closable by a drive source such as a motor, or may be configured to be openable and closable manually.

[0023] The operation panel 200 is a general-purpose computer and has a display for displaying various pieces of information related to machining. The display may be, for example, a liquid crystal display, an organic electroluminescence (EL) display, or other display device. The display also has a touch panel that accepts various operations for the machining apparatus 100 by touch operation.

[0024] <B. Device Configuration of Processing Apparatus 100> Next, the device configuration of the processing apparatus 100 will be described with reference to Fig. 2. Fig. 2 is a diagram showing an example of the device configuration of the processing apparatus 100.

[0025] As described above, the processing apparatus 100 includes the cover body 130. The cover body 130 forms the exterior of the processing apparatus 100 and defines the processing area AR in which additional processing of the workpiece W is performed.

[0026] The processing device 100 also includes a bed 11 , a tool rest 16 , a workpiece spindle 22 , a tailstock 25 , a tool spindle 30 , and a laser head 140 .

[0027] For ease of explanation, the direction of the rotation axis of the workpiece spindle 22 will also be referred to as the "Z-axis direction." The Z-axis direction is parallel to the axes AX1 to AX3 shown in FIG. 2. A direction on a horizontal plane perpendicular to the Z-axis direction will also be referred to as the "X-axis direction." A direction perpendicular to both the X-axis and Z-axis directions will be referred to as the "Y-axis direction." In the example of FIG. 2, the Y-axis direction corresponds to the direction of gravity.

[0028] The bed 11 is a base member for supporting various devices provided in the processing apparatus 100. In the example of Fig. 2, the bed 11 supports the tool rest 16, the workpiece spindle 22, the tailstock 25, and the laser head 140. The bed 11 is installed on the floor of a factory or the like. The bed 11 is made of metal such as cast iron.

[0029] The tool rest 16 has a turret 18. The turret 18 is configured to be rotatable about an axis AX1. The turret 18 holds a plurality of tools spaced apart in the circumferential direction around the axis AX1. The tool rest 16 is also configured to be movable in the X-axis and Y-axis directions by various drive mechanisms such as motors. The tool rest 16 performs turning by bringing a fixed tool held by the turret 18 into contact with a workpiece W that is rotationally driven by a workpiece spindle 22.

[0030] The work spindle 22 is configured to be rotatable while holding the workpiece W. More specifically, the work spindle 22 is provided with a chuck mechanism 23. The chuck mechanism 23 is a mechanism for fixing the workpiece W to the work spindle 22. The work spindle 22 is also configured to be rotatable about an axis AX2 that extends along its axial direction.

[0031] The tailstock 25 is configured to be movable along the axis AX3 by various drive mechanisms such as a motor. As a result, the tailstock 25 supports the long workpiece W from the side opposite to the workpiece spindle 22. Typically, the axis AX3 is coaxial with the axis AX2. The tailstock 25 is also configured to be rotatable about the axis AX3.

[0032] It should be noted that a second work spindle (not shown) may be provided instead of the tailstock 25. The second work spindle is provided opposite the work spindle 22 and is configured to be able to hold the workpiece W from the side opposite to the work spindle 22.

[0033] The tool spindle 30 is provided, for example, at a position higher than the workpiece spindle 22 and the tailstock 25. The tool spindle 30 is configured to allow tools and a laser head 140 to be detachably attached. Fig. 2 shows an example in which the laser head 140 is attached to the tool spindle 30.

[0034] The laser head 140 is attached to and detached from the tool spindle 30 by, for example, a dedicated attachment / detachment mechanism (not shown) for the laser head 140, which is separate from an automatic tool changer (ATC) used for automatically changing cutting tools. The processing device 100 attaches the laser head 140 to the tool spindle 30 when performing additional processing on the workpiece W. On the other hand, the processing device 100 attaches a tool to the tool spindle 30 when performing subtractive processing on the workpiece W.

[0035] An example of the removal process is milling, in which a rotating tool is brought into contact with the workpiece W fixed to the workpiece spindle 22. Another example of the removal process is turning, in which a tool is pressed against the workpiece W rotating about the axis AX2.

[0036] The laser head 140 performs additional machining by the DED method while attached to the tool spindle 30. The laser head 140 has a head body 142 and a laser nozzle 146 as a mechanism for realizing the additional machining.

[0037] A powder material is supplied via a cable (not shown) to the head body 142. The supplied powder material may be metal powder, resin powder, or any other type of powder that melts when irradiated with laser light.

[0038] The laser nozzle 146 irradiates the workpiece W with laser light and determines an irradiation area of ​​the laser light on the workpiece W. The powder material supplied to the laser head 140 is ejected toward the workpiece W through the laser nozzle 146.

[0039] <C. Additional Processing> Next, the additional processing by the laser head 140 will be described in more detail with reference to Fig. 3. Fig. 3 shows a cross-sectional view of the laser head 140 during additional processing.

[0040] While at least one of the laser head 140 and the workpiece W is being driven, the laser head 140 irradiates the surface of the workpiece W with laser light LS. As an example, the laser head 140 irradiates the rotating workpiece W with laser light LS while moving in the axial direction of the workpiece spindle 22 (i.e., the Z-axis direction). As a result, the workpiece W melts in the area irradiated with the laser light LS, and a molten pool MP is formed on the surface of the workpiece W.

[0041] In parallel, the laser head 140 supplies powder material PM to the molten pool MP. The powder material PM is guided to the molten pool MP by gas GS discharged from the laser head 140. As a result, the powder material PM melts and liquefies in the molten pool MP. The molten pool MP then solidifies, forming a layer SL on the workpiece W. The gas GS also functions as a shielding gas, preventing oxidation of the workpiece W, which is a laminated structure.

[0042] The processing device 100 can realize various additive processes by controlling the laser head 140. Types of additive processes include lamination processing and coating processing. Lamination processing is processing in which layers SL are stacked on the workpiece W. Coating processing is processing in which the surface of the workpiece W is covered with layers SL.

[0043] <D. Heat Treatment of Workpiece> Next, heat treatment of a workpiece by the processing apparatus 100 will be described with reference to Figures 4 and 5. Figures 4 and 5 are diagrams showing the processing steps by the processing apparatus 100 in chronological order.

[0044] 4 and 5 show a workpiece W to be machined. The type of workpiece W is arbitrary. In the example of Fig. 4 and Fig. 5, a cylindrical workpiece W is shown. As another example, the workpiece W may be a cylindrical shaft.

[0045] In step S1, the processing apparatus 100 forms an unnecessary portion PB in a base material portion PA of the workpiece W. The unnecessary portion PB refers to an unnecessary portion that will ultimately be removed from the workpiece W. The unnecessary portion PB may be formed in the workpiece W by additive processing or by subtractive processing. In the example of Fig. 4, the processing apparatus 100 forms the unnecessary portion PB in the base material portion PA by supplying a powder material PM and irradiating the workpiece W with a laser beam LS.

[0046] Next, in step S2, the processing device 100 performs additional processing on an additional processing location PC of the workpiece W that is different from the unnecessary portion PB. The additional processing is performed, for example, according to a pre-designed additional processing program. In the example of Fig. 4, a coating process is performed to coat the surface of the workpiece W with powder material PM. Note that instead of the coating process, a layer-by-layer process may be performed to build up layers.

[0047] Next, in step S3, the processing device 100 irradiates the unnecessary portion PB formed in step S1 with laser light LS. As a result, heat is transmitted in the order of the unnecessary portion PB → base material portion PA → additional processing portion PC, thereby realizing heat treatment of the additional processing portion PC. The heat treatment changes the properties of the additional processing portion PC. Examples of properties that can be changed include hardness, strength, and toughness.

[0048] Next, in step S4, the processing device 100 performs removal processing to remove the unnecessary portion PB from the workpiece W. The removal processing of the unnecessary portion PB may be achieved by a tool attached to the tool spindle 30, or may be achieved by a tool attached to the tool rest 16 (see FIG. 2 ). In the example of FIG. 5 , the laser head 140 is removed from the tool spindle 30, and then the tool T is attached to the tool spindle 30, and the unnecessary portion PB is removed by the tool T.

[0049] As described above, the processing device 100 heats the additional processing area PC via the unnecessary portion PB by irradiating the laser light LS onto the unnecessary portion PB. Since the laser light LS is not directly irradiated onto the base material portion PA or the additional processing area PC, it is possible to realize heat treatment of the additional processing area PC without degrading the processing quality of the necessary portion of the workpiece W.

[0050] Such heat treatment is particularly effective when additional processing is performed using high-hardness materials such as high-speed steel. If heat treatment is not performed, the hardness of the additional processing area PC may be insufficient, but in the processing device 100 according to the embodiment, high-temperature heat treatment is achieved by irradiating the laser light LS in step S3. The hardness of the additional processing area PC is sufficiently improved. In addition, the toughness of the additional processing area PC is also improved, making the additional processing area PC less likely to crack.

[0051] Furthermore, in the processing apparatus 100 according to the embodiment, the additional processing of the workpiece W and the heat treatment of the workpiece W are performed within the same machine. Therefore, the operator can perform the heat treatment of the workpiece W without removing the workpiece W from the processing apparatus 100. This significantly improves work efficiency.

[0052] In step S3, the processing apparatus 100 may perform the heat treatment while supplying the powder material PM to the unnecessary portion PB, or may perform the heat treatment after stopping the supply of the powder material PM to the unnecessary portion PB. Preferably, the processing apparatus 100 irradiates only the laser light LS onto the unnecessary portion PB and stops the supply of the powder material PM. This allows the processing apparatus 100 to reduce the amount of powder material PM used.

[0053] Preferably, the heat treatment in step S3 is performed a predetermined time after the completion of the additional processing in step S2. This allows the processing device 100 to perform the heat treatment after the workpiece W heated by the additional processing in step S2 has cooled. As a result, the hardness and toughness of the additional processing area PC are further improved.

[0054] The time from the completion of the additional processing in step S2 to the start of the heat treatment in step S3 may be set in advance or may be set arbitrarily by the user. This time is set so that the temperature of the workpiece W decreases to a predetermined temperature. The predetermined temperature is, for example, the room temperature inside the processing apparatus 100.

[0055] Preferably, during the heat treatment in step S3, the processing apparatus 100 irradiates the unnecessary portion PB with the laser beam LS while moving the irradiation point of the laser beam LS. At this time, as long as the irradiation point of the laser beam LS moves relative to the unnecessary portion PB, the laser head 140 may be driven, the workpiece W may be driven, or the irradiation direction of the laser beam LS may be changed by a galvanometer mirror or the like.

[0056] In one aspect, the laser beam LS is irradiated onto the unnecessary portion PB while driving the laser head 140. This prevents the irradiation of the laser beam LS from concentrating on one point on the unnecessary portion PB, and the processing apparatus 100 can prevent the unnecessary portion PB from melting.

[0057] At this time, the laser head 140 is driven so that the irradiation point of the laser light LS on the unnecessary portion PB repeatedly passes through a predetermined path. The shape of the path is arbitrary. For example, the shape of the path may be circular, elliptical, rectangular, or any other shape. This allows the laser head 140 to heat the entire workpiece W more uniformly.

[0058] Preferably, the unnecessary portion PB is formed as far away as possible from the additional processing location PC. As an example, if the additional processing location PC is on a first surface of the workpiece W, the unnecessary portion PB is formed on a second surface of the workpiece W. The second surface may be a surface perpendicular to the first surface, or may be a surface opposite to the first surface. In this way, by separating the unnecessary portion PB as far as possible from the additional processing location PC, heat is uniformly transferred to the additional processing location PC during the heat treatment in step S3, and the properties of the additional processing location PC can be uniformly changed.

[0059] Furthermore, during the heat treatment in step S3, the processing apparatus 100 may irradiate the laser light LS so that the focal point of the laser light LS is located on the surface of the unnecessary portion PB, or may irradiate the laser light LS so that the focal point of the laser light LS is not located on the surface of the unnecessary portion PB. Preferably, the processing apparatus 100 irradiates the unnecessary portion PB with the laser light LS so that the irradiation point of the laser light LS on the unnecessary portion PB is different from the focal point of the laser light LS. This allows the processing apparatus 100 to prevent the temperature of the workpiece W from becoming too high during the heat treatment.

[0060] Although the above description has been given of an example in which the process of forming the unnecessary portion PB in step S1 is performed before the start of the additional processing process in step S2, the timing of forming the unnecessary portion PB is not limited to this. For example, the process of forming the unnecessary portion PB in step S1 may be performed after the completion of the additional processing process in step S2.

[0061] <E. Drive Mechanism of Processing Apparatus 100> Next, a drive mechanism in the processing apparatus 100 will be described with reference to Fig. 6. Fig. 6 is a diagram showing an example of the drive mechanism of the processing apparatus 100.

[0062] As shown in FIG. 6, the processing apparatus 100 includes a control unit 50 and drive units 210, 220, 230A, 230B, and 240.

[0063] The control unit 50 controls various devices within the processing apparatus 100. The control unit 50 may have any configuration. The control unit 50 may be configured with a single control unit or multiple control units. As an example, the control unit 50 includes at least one of a CNC (Computer Numerical Control) and a PLC (Programmable Logic Controller).

[0064] The drive unit 210 is a drive mechanism for rotationally driving the workpiece spindle 22. The drive unit 210 may be composed of a single drive unit or multiple drive units. In the example of Fig. 6, the drive unit 210 is composed of a motor driver 211C and a motor 212C.

[0065] The motor driver 211C sequentially receives input of the target rotation angle or target rotation speed of the work spindle 22 from the control unit 50, and outputs a current corresponding to the target rotation angle or target rotation speed to the motor 212C. This causes the work held by the work spindle 22 to rotate around the Z-axis direction as the center of rotation. The motor 212C may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0066] The drive unit 220 is a drive mechanism for driving the tailstock 25. The drive unit 220 may be composed of a single drive unit or multiple drive units. In the example of Fig. 6, the drive unit 220 is composed of a motor driver 221Z and a motor 222Z.

[0067] The motor driver 221Z sequentially receives input of target positions for the workpiece spindle 22 from the control unit 50 and outputs a current corresponding to the target positions to the motor 222Z. This causes the motor 222Z to move the tailstock 25 to any position in the Z-axis direction. The motor 222Z may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0068] The drive unit 230A is a drive mechanism for moving the position of the tool spindle 30. The above-mentioned laser head 140 is driven by being attached to the tool spindle 30. The drive unit 230A may be composed of a single drive unit or multiple drive units. In the example of FIG. 6, the drive unit 230A is composed of motor drivers 231X to 231Z and motors 232X to 232Z.

[0069] The motor driver 231X sequentially receives input of target positions of the tool spindle 30 in the X-axis direction from the control unit 50, and outputs a current corresponding to the target positions to the motor 232X. In this way, the motor 232X drives the tool spindle 30 to any position in the X-axis direction. The motor 232X may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0070] The motor driver 231Y sequentially receives input of target positions of the tool spindle 30 in the Y-axis direction from the control unit 50, and outputs a current corresponding to the target positions to the motor 232Y. In this way, the motor 232Y drives the tool spindle 30 to any position in the Y-axis direction. The motor 232Y may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0071] The motor driver 231Z sequentially receives input of target positions of the tool spindle 30 in the Z-axis direction from the control unit 50, and outputs a current corresponding to the target positions to the motor 232Z. This causes the motor 232Z to move the tool spindle 30 to any position in the Z-axis direction. The motor 232Z may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0072] The drive unit 230B is a drive mechanism for rotationally driving the tool spindle 30. The drive unit 230B may be configured with a single drive unit or multiple drive units. In the example of Fig. 6, the drive unit 230B is configured with motor drivers 231A and 231B and motors 232A and 232B.

[0073] The motor driver 231A sequentially receives input of a target rotation angle or a target rotation speed of the tool spindle 30 about the X-axis direction from the control unit 50, and outputs a current corresponding to the target rotation angle or the target rotation speed to the motor 232A. The motor 232A drives the tool spindle 30 to rotate about the X-axis direction. The motor 232A may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0074] The motor driver 231B sequentially receives input of a target rotation angle or a target rotation speed of the tool spindle 30 around the axial direction of the tool spindle 30 as a rotation center from the control unit 50, and outputs a current corresponding to the target rotation angle or the target rotation speed to the motor 232B. The motor 232B drives the tool spindle 30 to rotate around the axial direction of the tool spindle 30 as a rotation center. The motor 232B may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0075] The drive unit 240 is a drive mechanism for driving the tool post 16 and the turret 18. The drive unit 240 may be composed of a single drive unit or multiple drive units. In the example of Fig. 6, the drive unit 240 is composed of motor drivers 241C, 241Y, and 241Z and motors 242C, 242Y, and 242Z.

[0076] The motor driver 241C receives a target value for the rotation angle of the turret 18 about the Z-axis direction, and outputs a current corresponding to the target value to the motor 242C. In this way, the motor driver 241C controls the rotation angle of the turret 18 about the Z-axis direction. The motor 242C may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0077] The motor driver 241Y sequentially receives input of target positions of the tool post 16 in the Y-axis direction from the control unit 50, and outputs a current corresponding to the target positions to the motor 242Y. This causes the motor 242Y to move the tool post 16 to any position in the Y-axis direction. The motor 242Y may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0078] The motor driver 241Z sequentially receives input of target positions of the tool post 16 in the Z-axis direction from the control unit 50, and outputs a current corresponding to the target position to the motor 242Z. This causes the motor 242Z to move the tool post 16 to any position in the Z-axis direction. The motor 242Z may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0079] <F. Hardware Configuration of Control Unit 50> Next, the hardware configuration of the control unit 50 shown in Fig. 6 will be described with reference to Fig. 7. Fig. 7 is a diagram showing an example of the hardware configuration of the control unit 50.

[0080] As described above, the control unit 50 may be a CNC or a PLC. Fig. 7 shows the hardware configuration of the control unit 50 as a CNC.

[0081] The control unit 50 includes, for example, a control circuit 101, a read only memory (ROM) 102, a random access memory (RAM) 103, a communication interface 104, and an auxiliary storage device 120. These components are connected to an internal bus 109.

[0082] The control circuit 101 is configured, for example, by at least one integrated circuit, which may be configured, for example, by at least one central processing unit (CPU), at least one graphics processing unit (GPU), at least one application specific integrated circuit (ASIC), at least one field programmable gate array (FPGA), or a combination thereof.

[0083] The control circuit 101 controls the operation of the control unit 50 by executing various programs such as a machining program 122. The machining program 122 is a program for realizing various processes described in this specification. Upon receiving an execution command for the machining program 122, the control circuit 101 reads the machining program 122 from the ROM 102 to the RAM 103. The RAM 103 functions as a working memory and temporarily stores various data required for executing the machining program 122.

[0084] The communication interface 104 is an interface for realizing communication with various devices. For example, the machining device 100 communicates with various drive units (e.g., the above-mentioned drive units 210, 220, 230A, 230B, 240, etc.) for realizing additional machining of the workpiece via the communication interface 104.

[0085] The auxiliary storage device 120 is a storage medium such as a hard disk or a flash memory. The auxiliary storage device 120 stores a machining program 122 and the like. The machining program 122 may be stored in a storage area of ​​the control circuit 101 (for example, a cache memory), the ROM 102, the RAM 103, an external device (for example, a server), or the like, without being limited to the auxiliary storage device 120.

[0086] Furthermore, the machining program 122 may be provided not as a standalone program but as part of an arbitrary program. In this case, various processes according to this embodiment are realized in cooperation with the arbitrary program. Even a program that does not include some of these modules does not deviate from the spirit of the machining program 122 according to this embodiment. Furthermore, some or all of the functions provided by the machining program 122 may be realized by dedicated hardware. Furthermore, the control unit 50 may be configured in the form of a so-called cloud service in which at least one server executes part of the processing of the machining program 122.

[0087] <G. Control Flow> Next, the control flow of the processing device 100 will be described with reference to Fig. 8. Fig. 8 is a flowchart showing the flow of processing steps performed by the processing device 100.

[0088] 8 is realized by the control unit 50 of the machining device 100 executing the above-described machining program 122. In another aspect, a part or all of the process may be executed by circuit elements or other hardware.

[0089] In step S110, the control unit 50 determines whether or not an instruction to perform additional machining has been received. An instruction to perform additional machining is, for example, an instruction to attach the laser head 140 to the tool spindle 30, or an instruction to move the tool spindle 30 to which the laser head 140 is attached before emitting the laser light LS. If the control unit 50 determines that an instruction to perform additional machining has been received (YES in step S110), it switches control to step S112. If not (NO in step S110), the control unit 50 executes the process of step S110 again.

[0090] In step S112, the control unit 50 controls the laser head 140 to form an unnecessary portion PB in the base material portion PA of the workpiece W. The unnecessary portion PB may be formed in the workpiece W by additive processing or by subtractive processing.

[0091] In step S114, the control unit 50 controls the laser head 140 to perform additional processing on the additional processing location PC of the workpiece W that is different from the unnecessary portion PB. The additional processing is performed, for example, according to a pre-designed additional processing program.

[0092] In step S120, the control unit 50 determines whether a predetermined time has elapsed since the completion of the additional machining. As an example, the control unit 50 determines that the additional machining of the workpiece has been completed based on the completion of execution of the additional machining program. If the control unit 50 determines that the predetermined time has elapsed since the completion of the additional machining (YES in step S120), it switches control to step S122. If not (NO in step S120), the control unit 50 executes the process of step S120 again.

[0093] In step S122, the control unit 50 performs heat treatment on the workpiece W. More specifically, the control unit 50 controls the laser head 140 to irradiate the laser light LS onto the unnecessary portion PB formed in step S112. At this time, preferably, the control unit 50 causes the laser head 140 to irradiate the laser light LS while stopping the supply of the powder material PM. The heat treatment in step S122 is performed for a predetermined time.

[0094] In step S130, the control unit 50 determines whether a predetermined time has elapsed since the heat treatment in step S122 was completed. If the control unit 50 determines that the predetermined time has elapsed since the heat treatment in step S122 was completed (YES in step S130), the control unit 50 switches control to step S132. If not (NO in step S130), the control unit 50 executes the process of step S130 again.

[0095] In step S132, the control unit 50 removes the laser head 140 from the tool spindle 30 and mounts the tool T on the tool spindle 30. Thereafter, the control unit 50 controls the tool spindle 30 to perform the removal processing of the unnecessary portion PB.

[0096] <H. Experimental Results> The inventors have confirmed the effectiveness of the heat treatment according to the above-described embodiment through experiments. The results of the experiments will be described below with reference to Fig. 9. Fig. 9 is a diagram showing the workpiece W used in the experiments.

[0097] The workpiece W used in this experiment consisted of a base material portion PA, an unnecessary portion PB, and an additional processing portion PC. The base material portion PA of the workpiece W was fixed by fixing jigs JA and JB. The unnecessary portion PB was formed on one side of the base material portion PA. The additional processing portion PC was formed on the other side of the base material portion PA by coating powdered high-speed steel.

[0098] In this experiment, the inventors measured the Vickers hardness of the additional processing area PC when the heat treatment was not performed and when the heat treatment was performed. The Vickers hardness of the additional processing area PC when the heat treatment was not performed was approximately 860 HV. In contrast, the Vickers hardness of the additional processing area PC when the heat treatment was performed was 950 HV to 980 HV. This confirmed that the heat treatment improved the hardness of the additional processing area PC.

[0099] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the above description, and is intended to include all modifications within the meaning and scope of the claims.

[0100] DESCRIPTION OF SYMBOLS 11 Bed, 16 Tool rest, 18 Turret, 22 Work spindle, 23 Chuck mechanism, 25 Tailstock, 30 Tool spindle, 50 Control unit, 100 Machining device, 101 Control circuit, 102 ROM, 103 RAM, 104 Communication interface, 109 Internal bus, 120 Auxiliary storage device, 122 Machining program, 130 Cover body, 140 Laser head, 142 Head body, 146 Laser nozzle, 200 Operation panel, 210 Drive unit, 211C Motor driver, 212C Motor, 220 Drive unit, 221Z Motor driver, 222Z Motor, 230A Drive unit, 230B Drive unit, 231A Motor driver, 231B Motor driver, 231X Motor driver, 231Y Motor driver, 231Z Motor driver, 232A Motor, 232B motor, 232X motor, 232Y motor, 232Z motor, 240 drive unit, 241C motor driver, 241Y motor driver, 241Z motor driver, 242C motor, 242Y motor, 242Z motor, AR processing area, AX1 axis, AX2 axis, AX3 axis, DR door, GS gas, JA fixing jig, JB fixing jig, LS laser light, MP molten pool, PA base material part, PB unnecessary part, PC additional processing area, PM powder material, SL layer, T tool, W workpiece.

Claims

1. A processing method carried out by a processing device capable of performing additional processing of supplying powder material while irradiating a workpiece with laser light, and removing processing of the workpiece using a tool, comprising the steps of: forming an unnecessary portion in the workpiece by the additional processing or the removing processing; performing the additional processing on a portion of the workpiece other than the unnecessary portion; irradiating the unnecessary portion with the laser light after completion of the step of performing the additional processing; and removing the unnecessary portion by the removing processing after completion of the step of irradiating.

2. The processing method according to claim 1, wherein the supply of the powder material is stopped during the irradiating step.

3. The processing method according to claim 1 or 2, wherein in the step of performing the additional processing on the portion, a coating process is carried out to coat the powder material on the surface of the workpiece.

4. The processing method according to claim 1 or 2, wherein the irradiating step is carried out a predetermined time after additional processing on the portion is completed.

5. The processing method according to claim 1 or 2, wherein in the irradiating step, the laser light is irradiated onto the unnecessary portion while the irradiation point of the laser light is moved.

6. The processing method according to claim 5, wherein the processing device includes a laser head for performing the additional processing, and in the irradiating step, the laser light is irradiated onto the unnecessary portion while the laser head is driven.

7. The processing method according to claim 6, wherein in the irradiating step, the laser head is driven so that the irradiation point of the laser light on the unnecessary portion repeatedly follows a predetermined path.

8. A processing method according to claim 1 or 2, wherein in the irradiating step, the laser light is irradiated onto the unnecessary portion so that the irradiation point of the laser light on the unnecessary portion is different from the focus of the laser light.

9. A processing device capable of performing additional processing of supplying powder material while irradiating a workpiece with laser light, and removing processing of the workpiece using a tool, comprising a control unit for controlling the processing device, wherein the control unit executes the following processes: forming an unnecessary portion in the workpiece by the additional processing or the removing processing; performing the additional processing on a portion of the workpiece other than the unnecessary portion; irradiating the unnecessary portion with the laser light after the additional processing process is completed; and removing the unnecessary portion by the removing processing after the irradiation process is completed.

10. A processing program executed by a processing device capable of performing additional processing of supplying powder material while irradiating a workpiece with a laser beam, and removing processing of the workpiece using a tool, the processing program causing the processing device to execute the following steps: forming an unnecessary portion in the workpiece by the additional processing or the removing processing; performing the additional processing on a portion of the workpiece other than the unnecessary portion; irradiating the unnecessary portion with the laser beam after completion of the additional processing step; and removing the unnecessary portion by the removing processing after completion of the irradiating step.

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