Semiconductor manufacturing device and support mechanism

Abstract

A film affixing device (1) comprises: a table (2) on which a semiconductor wafer (W) is placed; a pressing roller (20) that presses a photoresist film (6) affixed to the semiconductor wafer (W) placed on the table (2); an outer peripheral-side support member (5) that is provided on the outer peripheral side of the table (2) and is disposed so as to receive a pressing force from the pressing roller (20) when the pressing roller (20) presses the photoresist film (6); and a support mechanism (50) that supports the outer peripheral-side support member (5) at least at three positions separated from each other and can adjust the heights of the at least three positions separately.

Description

Semiconductor manufacturing equipment and support mechanism

[0001] The present disclosure relates to a semiconductor manufacturing apparatus and a support mechanism.

[0002] Conventionally, a film application device has been known that includes a table on which a semiconductor wafer is placed, a pressing member that presses a film that is applied to the semiconductor wafer placed on the table, and a bumper member that serves as an outer peripheral support member that is provided on the outer periphery of the table and is positioned so as to receive the pressing force of the pressing member when the pressing member presses the film (see Patent Document 1).

[0003] Patent No. 4376250

[0004] The above-mentioned device is configured so that the bumper member is raised and lowered by the engagement of a pair of female and male screws. Therefore, if the upper surface of the bumper member becomes tilted, the device may be unable to correct the tilt. This is because the presence or degree of tilt of the upper surface of the bumper member when the bumper member is raised and lowered using the engagement of a pair of female and male screws largely depends on the machining accuracy of the pair of female and male screws.

[0005] Therefore, it is desirable to provide a semiconductor manufacturing apparatus that can eliminate the inclination of the upper surface of an outer peripheral support member such as a bumper member.

[0006] A semiconductor manufacturing apparatus according to an embodiment of the present invention includes a table on which a semiconductor wafer is placed, a pressing member that presses a film to be attached to the semiconductor wafer placed on the table, an outer peripheral support member that is provided on the outer periphery of the table and is positioned so as to receive the pressing force of the pressing member when the pressing member presses the film, and a support mechanism that supports the outer peripheral support member at at least three positions spaced apart from one another and that can separately adjust the height of the at least three positions.

[0007] The semiconductor manufacturing apparatus described above can eliminate the inclination of the upper surface of the outer peripheral support member.

[0008] FIG. 1 is a side view of a film bonding device according to an embodiment of the present disclosure. FIG. 2 is a diagram illustrating the function of a control unit mounted on the film bonding device. FIG. 3 is a diagram illustrating a pressing pattern. FIG. 4 is a side view of the film bonding device when the moving unit has moved to the left end side. FIG. 5 is a side view of the film bonding device when the moving unit has moved to the right end side. FIG. 6 is a diagram illustrating an example of a film trimmed by a cutting unit. FIG. 7 is a diagram illustrating a configuration example of a hollow structure. FIG. 8 is a diagram illustrating a configuration example of a hollow structure. FIG. 9 is a diagram illustrating a configuration example of a lifting support mechanism. FIG. 10 is a right side view of an outer periphery support member and a lifting support mechanism. FIG. 11 is a bottom view of an outer periphery support member and a lifting support mechanism. FIG. 12 is a top view of a semiconductor wafer and an outer periphery support member placed on a table. FIG. 13 is a diagram illustrating another configuration example of the lifting support mechanism.

[0009] First, a film bonding apparatus 1, which is an example of a semiconductor manufacturing apparatus according to an embodiment of the present disclosure, will be described with reference to Fig. 1. Fig. 1 is a schematic diagram of the film bonding apparatus 1.

[0010] The film bonding device 1 is an apparatus used when bonding a film such as a photoresist film 6 to a semiconductor wafer W. It includes a table 2 that is circular in plan view and on which the semiconductor wafer W, which is circular in plan view, is placed. A film supply unit 3 and a winding unit 4 are arranged diagonally above the table 2 at a predetermined distance. A three-layer film F3 is supplied from the film supply unit 3. In the illustrated example, the three-layer film F3 is formed by laminating a carrier film 7 on one surface of a heat-sensitive photoresist film 6 and a reinforcing film 8 on the other surface. The carrier film 7 is peeled off from the three-layer film F3 by a pinch roller 9, resulting in a two-layer film F2. The two-layer film F2 is then pressed and bonded to the surface of the semiconductor wafer W, and the reinforcing film 8 is then peeled off from the two-layer film F2 by horizontal movement of a moving unit (described below).

[0011] The table 2 is configured to be raised and lowered by a table lifting mechanism TLM including slide rods 10, a substrate 11, and supports 12. Specifically, the table 2 is fixed to the upper ends of four slide rods 10, which are supported on a frame (not shown) so as to be freely raised and lowered, via the substrates 11 and supports 12. The table 2 is raised and lowered by raising and lowering the slide rods 10 with the driving force of a driving source (not shown), such as an air cylinder. The table 2 also has a portion of an intake passage formed therein, one end of which opens to the mounting surface and the other end of which is connected to a suction source (not shown), such as a pump. In the illustrated example, the intake passage includes a groove 2G (see FIG. 9 ) formed in the mounting surface (top surface) of the table 2 and a plurality of through-holes (holes vertically penetrating the table 2) formed within the groove 2G. Therefore, the semiconductor wafer W is attracted to the table 2 by the suction action of the suction source.

[0012] As shown in FIG. 1 , a single slide shaft 15 extending horizontally (perpendicular to the rotation axis of the pinch roller 9) is disposed on one side of the table 2 in a direction parallel to the rotation axis of the pinch roller 9. A moving unit including a first moving unit 16, a second moving unit 17, and a third moving unit 18 is slidably supported on this slide shaft 15. The moving units are configured to move horizontally by the driving force of a driving source (not shown), such as an air cylinder. Also, above the table 2, a cutting unit 19 is provided so as to be horizontally movable, serving as a film cutting mechanism that uses a laser to trim the photoresist film 6 attached to the semiconductor wafer W. The cutting unit 19 may include a blade for cutting the film instead of a device that emits a laser to cut the film.

[0013] The third moving unit 18 has a pressure roller 20 that presses the photoresist film 6 to be applied to the front surface of the semiconductor wafer W on the table 2. The pressure roller 20 is an example of a pressing member, and at least the roller surface of the pressure roller 20 is formed of an elastic material such as rubber. The film bonding device 1 can apply the two-layer film F2 to the front surface of the semiconductor wafer W on the table 2 by moving the moving unit (see FIG. 1) located at one end (right end) of the slide shaft 15 to the other end (left end) of the slide shaft 15 as shown in FIG. 4. The film bonding device 1 can also bond the two-layer film F2 to the front surface of the semiconductor wafer W by pressing it with the pressure roller 20.

[0014] The pressure roller 20 may be configured so that its pressure is adjusted by a pressure adjustment mechanism 21 in accordance with the pressing area of ​​the semiconductor wafer W (the contact area between the pressure roller 20 and the semiconductor wafer W). In the illustrated example, the pressure adjustment mechanism 21 includes a pressing cylinder 22 having a piston rod 22a. The tip of the piston rod 22a is connected to a support member (not shown) that rotatably supports the pressure roller 20. The pressing cylinder 22 is an example of a pressing drive source, and a fluid supply source such as a pump supplies a fluid in an amount corresponding to the pressing area of ​​the semiconductor wafer W, thereby finely adjusting the extension and retraction movement of the piston rod 22a.

[0015] A rectangular, annular outer support member 5 is provided on the outer periphery of the table 2. The outer support member 5, also known as a bumper member, has an upper surface 5a that functions as a contact surface against which the pressure roller 20 contacts when pressing the photoresist film 6. The outer support member 5 is supported so as to be freely raised and lowered by a lifting support mechanism 25 including a rotation motor 35, and the heights of the four corners of the outer support member 5 can be adjusted separately. In the illustrated example, the outer support member 5 is also referred to as a digital bumper because its height level is adjusted by computer control. Between the table 2 and the outer support member 5, a portion of an exhaust passage is formed, one end of which opens to the mounting surface and the other end of which is connected to an exhaust device (not shown) such as an exhaust fan. In the illustrated example, the exhaust passage is a passage for discharging smoke and other exhaust gases generated when the film is cut by the laser-based cutting unit 19. The exhaust passage includes an annular gap 13G (see FIG. 9) between the table 2 and the outer support member 5 and a pipe 13D (see FIG. 9) connected to the side of the outer support member 5. That is, in the illustrated example, the exhaust device and exhaust passage form an air knife for removing unwanted material generated when the film is cut by the cutting unit 19. With this configuration, the air flowing through the exhaust passage can instantly cool the cut surface of the film cut by the cutting unit 19, thereby achieving a clean cut surface of the film that is free of burrs and the like.

[0016] Next, the functions of the film bonding device 1 will be described with reference to FIG. 2 . FIG. 2 is a block diagram illustrating the functions of a control unit 40 mounted on the film bonding device 1. Specifically, the film bonding device 1 has the control unit 40 that controls functions related to the bonding of the film. The control unit 40 is connected to a rotation motor 35, a pressing cylinder 22, and an input unit 41. The input unit 41 is, for example, a keyboard, a mouse, or a fingertip operation unit. The control unit 40 also has a height level memory unit 42 that stores multiple height levels of the outer periphery support member 5 that are predetermined depending on the shape or size of the semiconductor wafer W, and a pressing pattern memory unit 43 that stores multiple pressing patterns that are predetermined depending on the shape or size of the semiconductor wafer W.

[0017] In the illustrated example, the control unit 40 first determines whether or not a height level switching command has been input from the input unit 41. Then, when a height level switching command is input from the input unit 41, the control unit 40 determines a predetermined height level corresponding to the switching command from among a plurality of height levels stored in the height level storage unit 42. Thereafter, the control unit 40 drives the rotation motor 35 to achieve the determined predetermined height level.

[0018] The control unit 40 also determines whether or not a pressing pattern switching command has been input from the input unit 41. When a pressing pattern switching command is input from the input unit 41, the control unit 40 determines a predetermined pressing pattern corresponding to the switching command from among a plurality of pressing patterns stored in the pressing pattern storage unit 43. Thereafter, the control unit 40 drives the pressing cylinder 22 so as to achieve the determined predetermined pressing pattern.

[0019] In this way, in the film bonding device 1, when a height level switching command corresponding to the shape of the semiconductor wafer W to be used is input to the control unit 40, a predetermined height level corresponding to the switching command is determined, and the rotation motor 35, which is the drive source of the lifting support mechanism 25, is driven. As a result, the outer peripheral support member 5 is lifted and lowered, and the outer peripheral support member 5 is positioned at the predetermined height level.

[0020] In the film bonding device 1, when a pressure pattern switching command corresponding to the shape of the semiconductor wafer W to be used is input to the control unit 40, a predetermined pressure pattern corresponding to the switching command is determined. In the illustrated example, as shown in Figure 3, a pressure pattern P1 corresponding to a semiconductor wafer W that is circular in plan view is determined.

[0021] Next, the film laminating process will be described. First, as shown in FIG. 4 , the film laminating device 1 causes the moving units (first moving unit 16, second moving unit 17, and third moving unit 18) located at one end (right end) of the slide shaft 15 to simultaneously travel toward the other end (left end) of the slide shaft 15. Then, the two-layer film F2 supplied from the film supply unit 3 is applied to the front surface of the semiconductor wafer W on the table 2, and the pressure roller 20 of the third moving unit 18 presses the two-layer film F2 against the front surface of the semiconductor wafer W in the pressure pattern P1 (see FIG. 3 ) to be laminated. During the pressing of the two-layer film F2, the pressure roller 20 rolls over the upper surface 5a of the outer peripheral support member 5, the height of which has been adjusted, while being in contact with the upper surface 5a. The upper surface 5a of the outer peripheral support member 5 may be coated with Teflon (registered trademark) or Tosical (registered trademark) to make it easier to peel off the attached film.

[0022] Next, as shown in FIG. 5 , the film bonding apparatus 1 retracts the second moving unit 17 and the third moving unit 18 to their original positions, thereby peeling off the reinforcement film 8 from the two-layer film F2 on the semiconductor wafer W. As a result, only the photoresist film 6 remains on the surface of the semiconductor wafer W. The film bonding apparatus 1 then moves the cutting unit 19 horizontally along the outer periphery of the semiconductor wafer W and irradiates it with a laser to trim the photoresist film 6 (see FIG. 6 ). The remaining film, i.e., the portion of the photoresist film 6 other than the portion that is bonded to the surface of the semiconductor wafer W, is peeled off by the first moving unit 16, which functions as a removal head, and taken up by the take-up unit 4. As a result, the film bonding apparatus 1 can obtain the semiconductor wafer W to which the photoresist film 6 is bonded.

[0023] In the illustrated example, the photoresist film 6 attached to the surface of the semiconductor wafer W is then subjected to exposure, removal, and other processes, and a pre-cured wall portion 81 is formed on the semiconductor wafer W as shown in FIG. 7 . Next, a height level switching command corresponding to the semiconductor wafer W having the wall portion 81 is input to the control unit 40, and the outer peripheral support member 5 is adjusted to a predetermined height level. In addition, a pressing pattern switching command corresponding to the semiconductor wafer W having the wall portion 81 is input to the control unit 40, and a predetermined pressing pattern is determined. Next, the semiconductor wafer W having the wall portion 81 is again subjected to the film attachment process as described above, and a semiconductor wafer W with another photoresist film 6 attached on the wall portion 81 is obtained. Thereafter, the photoresist film 6 attached on the wall portion 81 is subjected to exposure, removal, and other processes, and a hollow structure 80 consisting of the wall portion 81 and a roof portion 82 is formed on the semiconductor wafer W as shown in FIG. 8 .

[0024] In the illustrated example, the height level and pressure pattern are different between the first film application process and the second film application process, but they may be the same, or only one may be different.

[0025] Furthermore, the film laminating device 1 is configured to abut the pressure roller 20 against the upper surface 5a of the outer peripheral support member 5, the height of which is adjusted, when pressing the photoresist film 6. Therefore, the film laminating device 1 can prevent the pressure roller 20 from excessively pressing the photoresist film 6, and can laminate the thin, soft photoresist film 6 in multiple layers while minimizing mechanical stress on the underlying layers. In particular, when laminating the photoresist film 6 that will become the wall portion 81 of the hollow structure 80, the film laminating device 1 can effectively absorb the unevenness (surface pattern) on the front surface of the semiconductor wafer W, thereby minimizing mechanical stress on the semiconductor wafer W. Furthermore, when laminating the photoresist film 6 that will become the roof portion 82 of the hollow structure 80, the film laminating device 1 can effectively absorb the unevenness (surface pattern) of the pre-cured wall portion 81, thereby minimizing mechanical stress on the semiconductor wafer W and the wall portion 81.

[0026] Furthermore, the film bonding device 1 is configured so that the outer peripheral support member 5 can be raised and lowered by the lifting support mechanism 25 including the rotation motor 35 to position the outer peripheral support member 5 at a predetermined height level. Therefore, the film bonding device 1 can stably bond a film to semiconductor wafers W of various shapes. As a result, the film bonding device 1 can form a hollow structure 80 with an extremely thin film thickness (e.g., approximately 50 μm) and excellent thickness accuracy on the semiconductor wafer W with a high yield. In particular, the film bonding device 1 can form a good hollow structure 80 over substantially the entire surface of the semiconductor wafer W. Furthermore, the film bonding device 1 can form a hollow structure 80 with an even thicker film thickness (e.g., approximately 100 μm) by bonding three or more layers of photoresist film 6.

[0027] Furthermore, the film bonding device 1 is configured so that the pressing force of the pressure roller 20 can be adjusted in accordance with the pressing area of ​​the semiconductor wafer W by a pressing force adjustment mechanism 21 including a pressing cylinder 22. Therefore, the film bonding device 1 can stably bond films to semiconductor wafers W of a wider variety of shapes.

[0028] Furthermore, the film bonding device 1 is configured such that the control unit 40 is provided with a height level memory unit 42 and a pressure pattern memory unit 43, and the height level and pressure pattern can be selected according to the shape of the semiconductor wafer W to be used, based on input information input to the control unit 40. Therefore, the film bonding device 1 can stably bond films to semiconductor wafers W of a wider variety of shapes.

[0029] Next, with reference to FIGS. 9 to 11 , an example configuration of the lifting support mechanism 25 that lifts and lowers the outer periphery support member 5 will be described. FIG. 9 is a diagram illustrating an example configuration of the lifting support mechanism 25. Specifically, the upper view of FIG. 9 is a perspective view of the table 2, the outer periphery support member 5, the tube 13D, the lifting support mechanism 25, and the table lifting mechanism TLM. The lower view of FIG. 9 is a perspective view of the outer periphery support member 5 and the lifting support mechanism 25, and corresponds to the upper view of FIG. 9 with the table 2, the tube 13D, and the table lifting mechanism TLM removed. Furthermore, for clarity, the side cover 5C, which is one of the components of the outer periphery support member 5, is not illustrated in the lower view of FIG. 9 .

[0030] In FIG. 9 , X1 represents one direction of the X axis constituting a three-dimensional Cartesian coordinate system, and X2 represents the other direction of the X axis. Furthermore, Y1 represents one direction of the Y axis constituting the three-dimensional Cartesian coordinate system, and Y2 represents the other direction of the Y axis. Similarly, Z1 represents one direction of the Z axis constituting the three-dimensional Cartesian coordinate system, and Z2 represents the other direction of the Z axis. In FIG. 9 , the X1 side of the outer peripheral support member 5 corresponds to the front side (front surface side) of the outer peripheral support member 5, and the X2 side of the outer peripheral support member 5 corresponds to the rear side (rear surface side) of the outer peripheral support member 5. Furthermore, the Y1 side of the outer peripheral support member 5 corresponds to the left side of the outer peripheral support member 5, and the Y2 side of the outer peripheral support member 5 corresponds to the right side of the outer peripheral support member 5. Furthermore, the Z1 side of the outer peripheral support member 5 corresponds to the upper side of the outer peripheral support member 5, and the Z2 side of the outer peripheral support member 5 corresponds to the lower side of the outer peripheral support member 5. The same applies to other members in other figures.

[0031] Fig. 10 is a right side view of the outer peripheral support member 5 and the lifting support mechanism 25. For clarity, Fig. 10 omits the side cover 5C, as in the lower view of Fig. 9 . Fig. 11 is a bottom view of the outer peripheral support member 5 and the lifting support mechanism 25. For clarity, Fig. 11 omits the side cover 5C and some of the components of the lifting support mechanism 25 (the mounting piece 34 and the rotation motor 35).

[0032] In the illustrated example, the outer periphery support member 5 includes a base plate 5B, a side cover 5C, a pedestal portion 5D, a top plate portion 5T, and an outer periphery wall portion 5W, as shown in Fig. 9. Note that, for clarity, in Figs. 10 and 11, a cross pattern is applied to the base plate 5B, a fine dot pattern is applied to the pedestal portion 5D, and a coarse dot pattern is applied to the top plate portion 5T and the outer periphery wall portion 5W. As shown in the lower diagram of Fig. 9, the lifting support mechanism 25 includes a lifting mechanism LM that lifts and lowers the outer periphery support member 5, and a support mechanism 50 that supports the outer periphery support member 5.

[0033] Specifically, as shown in the lower diagram of Fig. 9, the lifting mechanism LM includes an attachment piece 34, a rotation motor 35, a transmission belt 36, a drive pulley 37, a tension pulley 38, and a driven pulley 39. The driven pulley 39 includes a left front driven pulley 39LF, a right front driven pulley 39RF, a left rear driven pulley 39LB (not visible in the lower diagram of Fig. 9), and a right rear driven pulley 39RB. The tension pulley 38 includes a left tension pulley 38L arranged between the drive pulley 37 and the left front driven pulley 39LF, and a right tension pulley 38R arranged between the drive pulley 37 and the right front driven pulley 39RF.

[0034] The support mechanism 50 includes a left front support mechanism 50LF, a right front support mechanism 50RF, a left rear support mechanism 50LB (not visible in the lower view of FIG. 9 ), and a right rear support mechanism 50RB. In the illustrated example, the left front support mechanism 50LF, the right front support mechanism 50RF, the left rear support mechanism 50LB, and the right rear support mechanism 50RB each have the same structure (the same shape and the same size). Specifically, as shown in FIG. 10 , the support mechanism 50 includes a nut 51, a screw 52, ​​a bearing 53, and a spacer 54.

[0035] The base plate 5B of the outer peripheral support member 5 is a member that supports the pedestal portion 5D, the top plate portion 5T, and the outer peripheral wall portion 5W via the support mechanism 50. In the illustrated example, the base plate 5B is fixed to a support portion 12 (see FIG. 1) of the table lifting mechanism TLM and can be raised and lowered together with the support portion 12 by the table lifting mechanism TLM. Specifically, as shown in FIG. 11 , the base plate 5B is a metal plate having a substantially rectangular outer shape in a plan view, including four corners CN (first corner CN1 to fourth corner CN4) and a center portion CF in which a rectangular opening 5K is formed.

[0036] The side cover 5C of the outer periphery support member 5 is a part that forms the side surface of the outer periphery support member 5. In the illustrated example, the side cover 5C is attached to the base plate 5B so as to cover the base plate 5B and the support mechanism 50, as shown in the upper diagram of FIG.

[0037] The pedestal portion 5D of the outer periphery side support member 5 functions as a pedestal for the top plate portion 5T of the outer periphery side support member 5, and is supported by a support mechanism 50 fixed to the base plate 5B. In the illustrated example, the pedestal portion 5D is a metal plate that has a substantially rectangular ring shape in a plan view and has a circular opening for receiving the table 2.

[0038] The top plate portion 5T of the outer periphery support member 5 is a portion fixed to the upper side of the base portion 5D. In the illustrated example, the top plate portion 5T is a metal plate that has a substantially rectangular ring shape in a plan view and has a circular opening for receiving the table 2, similar to the base portion 5D.

[0039] The outer peripheral wall portion 5W of the outer peripheral support member 5 constitutes a part of the exhaust passage 13. In the illustrated example, the outer peripheral wall portion 5W is a metal member having an open-top box shape with an octagonal bottom wall and an octagonal cylindrical side wall in a plan view. The octagonal cylindrical side wall is configured to connect four pipes 13D. The upper end of the octagonal cylindrical side wall is configured to be fixed to the base portion 5D.

[0040] In this way, the outer periphery support member 5 is configured so that the pedestal portion 5D, the top plate portion 5T, and the outer periphery wall portion 5W can be raised and lowered relative to the base plate 5B by the support mechanism 50. Specifically, as shown in Fig. 10, a bearing 53 of the support mechanism 50 is fixed to the base plate 5B. In the illustrated example, the bearing 53 is a ball bearing, and the inner ring is fixed to the screw 52 and the outer ring is fixed to the base plate 5B.

[0041] 10 , a nut 51 of the support mechanism 50 is fixed to the base portion 5D by a bolt BT. In the illustrated example, the nut 51 is a trapezoidal screw nut, and constitutes a height adjustment mechanism HAM in cooperation with a trapezoidal screw 52. The height adjustment mechanism HAM is configured such that the nut 51 moves upward (toward Z1) when the screw 52 rotates in one direction around the rotation axis AX, and moves downward (toward Z2) when the screw 52 rotates in the other direction around the rotation axis AX.

[0042] In the illustrated example, as shown in the lower diagram of Figure 9, the support mechanism 50 includes a left front support mechanism 50LF fixed to a first corner CN1 of the base plate 5B, a right front support mechanism 50RF fixed to a second corner CN2 of the base plate 5B, a right rear support mechanism 50RB fixed to a third corner CN3 of the base plate 5B, and a left rear support mechanism 50LB (not visible in Figure 9) fixed to a fourth corner CN4 of the base plate 5B (not visible in the lower diagram of Figure 9, so see Figure 11).

[0043] Specifically, as shown in FIG. 11 , the left front support mechanism 50LF is configured to be able to rotate the screw 52 around a first rotation axis AX1, the right front support mechanism 50RF is configured to be able to rotate the screw 52 around a second rotation axis AX2, the right rear support mechanism 50RB is configured to be able to rotate the screw 52 around a third rotation axis AX3, and the left rear support mechanism 50LB is configured to be able to rotate the screw 52 around a fourth rotation axis AX4.

[0044] 11, the first to fourth rotation axes AX1 to AX4 are arranged so that the distances DS from the central axis CA that passes through the center of the table 2 are equal to each other. The first to fourth rotation axes AX1 to AX4 are also arranged so that the angles (central angles) between the central axis CA and each of the line segments that connects the central axis CA to each of the first to fourth rotation axes AX1 to AX4 are equal to each other, θ (90 degrees).

[0045] An operator adjusting the height of the outer peripheral support member 5 can separately adjust the height of each of the four corners 5N (first corner 5N1 to fourth corner 5N4) of the top plate portion 5T of the outer peripheral support member 5 as shown in the upper diagram of Figure 9 by, for example, manually rotating the screws 52 of the height adjustment mechanisms HAM in each of the left front support mechanism 50LF, the right front support mechanism 50RF, the left rear support mechanism 50LB, and the right rear support mechanism 50RB.

[0046] The lifting mechanism LM is configured to be able to lift and lower the outer periphery support member 5 by utilizing the height adjustment mechanism HAM of the support mechanism 50. Specifically, as described above, the lifting mechanism LM includes the attachment piece 34, the rotation motor 35, the transmission belt 36, the drive pulley 37, the tension pulley 38, and the driven pulley 39. The driven pulley 39 includes a left front driven pulley 39LF, a right front driven pulley 39RF, a left rear driven pulley 39LB, and a right rear driven pulley 39RB. The left front driven pulley 39LF, the right front driven pulley 39RF, the left rear driven pulley 39LB, and the right rear driven pulley 39RB have the same structure (the same shape and the same size). The tension pulleys 38 include a left tension pulley 38L disposed between the drive pulley 37 and the left front driven pulley 39LF, and a right tension pulley 38R disposed between the drive pulley 37 and the right front driven pulley 39RF. The left tension pulley 38L and the right tension pulley 38R have the same structure (the same shape and the same size).

[0047] In the illustrated example, the mounting piece 34 of the lifting mechanism LM is a metal plate to which a rotation motor 35, a drive pulley 37, and a tension pulley 38 are attached, and is fixed to the base plate 5B of the outer periphery support member 5 via a bracket 34a (see FIG. 10 ). The rotation motor 35 is a drive unit for rotating the drive pulley 37 and is attached to the underside of the mounting piece 34. The transmission belt 36 is a belt for transmitting the rotational force of the drive pulley 37 to the driven pulley 39. The drive pulley 37 is a member for rotating the driven pulley 39 via the transmission belt 36. The tension pulleys 38 (left tension pulley 38L and right tension pulley 38R) are members for adjusting the tension of the transmission belt 36. The drive pulley 37, left tension pulley 38L, and right tension pulley 38R are attached to the upper surface of the mounting piece 34. The driven pulley 39 is a member for transmitting the rotational force to the screw 52 of the support mechanism 50.

[0048] In the illustrated example, the driven pulleys 39 include a left front driven pulley 39LF fixed to the screw 52 of the left front support mechanism 50LF, a right front driven pulley 39RF fixed to the screw 52 of the right front support mechanism 50RF, a left rear driven pulley 39LB fixed to the screw 52 of the left rear support mechanism 50LB, and a right rear driven pulley 39RB fixed to the screw 52 of the right rear support mechanism 50RB. Specifically, the left rear driven pulley 39LB includes a fixed portion and a rotating portion that rotates relative to the fixed portion. The fixed portion is fixed to the lower surface of the base plate 5B of the outer periphery support member 5 via a spacer 54. The rotating portion is fixed to the lower end of the screw 52 so as to rotate integrally with the screw 52. The same applies to the left front driven pulley 39LF, the right front driven pulley 39RF, and the right rear driven pulley 39RB.

[0049] With this configuration, the lifting mechanism LM can rotate the four driven pulleys 39 simultaneously at the same rotational speed and in the same direction by rotating the drive pulley 37 using the rotation motor 35. That is, the lifting mechanism LM can simultaneously rotate the screws 52 of the four support mechanisms simultaneously at the same rotational speed and in the same direction. Therefore, the lifting mechanism LM can raise and lower the four corners 5N (first corner 5N1 to fourth corner 5N4) of the top plate portion 5T of the outer periphery support member 5 at the same lifting speed.

[0050] Note that height adjustment of the first corner 5N1 using the left front support mechanism 50LF is typically performed while the screws 52 of the three support mechanisms 50 other than the left front support mechanism 50LF are not rotating. This is to prevent the height of the other corners 5N from changing due to height adjustment of the first corner 5N1. The same applies to height adjustments using the right front support mechanism 50RF, the left rear support mechanism 50LB, and the right rear support mechanism 50RB. Therefore, in the illustrated example, the lifting mechanism LM is configured to be able to disengage the transmission belt 36 from the driven pulley 39. Specifically, the lifting mechanism LM is configured to adjust the position of the tension pulley 38 using the position adjustment bolt BT2 (see the lower diagram in Figure 9 ), specifically, to loosen the tension of the transmission belt 36, thereby allowing the transmission belt 36 to be removed from the driven pulley 39.

[0051] With this configuration, for example, when adjusting the height of the first corner portion 5N1 using the left front support mechanism 50LF, the worker can release the engagement between the left front driven pulley 39LF, which is fixed to the screw 52 of the left front support mechanism 50LF, and the transmission belt 36. Therefore, the worker can rotate only the screw 52 of the left front support mechanism 50LF alone, without rotating the screws 52 of the other support mechanisms 50, and can adjust the height of only the first corner portion 5N1 without changing the heights of the other corners 5N.

[0052] However, the driven pulley 39 may be configured to be switchable between a state in which the screw 52 and the driven pulley 39 can rotate integrally (a state in which they cannot rotate relative to each other) and a state in which the screw 52 and the driven pulley 39 can rotate relative to each other. In this case, the operator can rotate only the screw 52 of the remaining support mechanism 50 without rotating the screws 52 of the three support mechanisms 50, without disengaging the transmission belt 36 from the driven pulley 39.

[0053] With the above-described configuration, the support mechanism 50 including the four height adjustment mechanisms HAM provides the advantage that, for example, an operator can flexibly adjust the levelness of the upper surface 5 a of the outer periphery support member 5. Furthermore, because the rotation axis AX of the height adjustment mechanism HAM (screw 52) also functions as a support axis, the support mechanism 50 provides the advantage of being simpler in structure than a configuration in which a support axis is provided separately from the rotation axis of the height adjustment mechanism.

[0054] Furthermore, the nuts 51 and screws 52 that constitute the height adjustment mechanism HAM have a relatively small diameter (e.g., 12 mm), and therefore may be standardized products (commercially available nuts and screws). This configuration therefore has the effect of improving the accuracy of height adjustment by the height adjustment mechanism HAM while suppressing an increase in the manufacturing cost of the support mechanism 50.

[0055] In the above embodiment, a combination of a trapezoidal screw nut and a trapezoidal screw is used as the height adjustment mechanism HAM, but other mechanisms such as a ball screw may also be used.

[0056] Furthermore, with the above-described configuration, the lifting mechanism LM has the effect of enabling an operator to raise and lower the outer peripheral support member 5, for example, by using the support mechanism 50 including four height adjustment mechanisms HAM.

[0057] In the above embodiment, the lifting mechanism LM is configured to simultaneously operate the four height adjustment mechanisms HAM using one rotation motor 35. However, it may be configured to separately operate the four height adjustment mechanisms HAM using four rotation motors. In this case, the transmission belt 36, the drive pulley 37, the tension pulley 38, and the driven pulley 39 may be omitted.

[0058] Furthermore, in the above-described embodiment, the lifting mechanism LM is configured to be able to lift and lower the outer periphery side support member 5 by operating the height adjustment mechanism HAM using the driven pulley 39. Therefore, this configuration has the effect of enabling an operator to easily change the lifting resolution of the outer periphery side support member 5. This is because the lifting resolution can be changed by changing the number of teeth of the driven pulley 39.

[0059] Next, an example of the shape and size of the top plate 5T of the outer peripheral support member 5 in a plan view will be described with reference to FIG. 12 . FIG. 12 is a top view of the semiconductor wafer W placed on the table 2 and the top plate 5T of the outer peripheral support member 5. Note that in FIG. 12 , for clarity, a dot pattern is applied to the top surface of the semiconductor wafer W. Also, in FIG. 12 , the size of the pressure roller 20 in a plan view is represented by a dashed line, and a cross pattern is applied to the range CZ (contact area) where the pressure roller 20 contacts the semiconductor wafer W and the top plate 5T. Note that in the illustrated example, the pressure roller 20 is configured to be movable in the X-axis direction while rolling.

[0060] In the illustrated example, the top plate portion 5T has a substantially rectangular outer shape in a plan view, and is configured so that the width W1 in the direction along the rotation axis of the pressure roller 20 (Y-axis direction) is smaller than the width W2 of the pressure roller 20. However, the width W1 of the top plate portion 5T may be configured so that it is larger than the width W2 of the pressure roller 20, or may be configured so that it is the same as the width W2 of the pressure roller 20.

[0061] This configuration has the effect of keeping the total contact area, which is the sum of the contact area between the semiconductor wafer W and the pressure roller 20 (first contact area) and the contact area between the top plate portion 5T and the pressure roller 20 (second contact area), constant regardless of the position of the pressure roller 20 in the X-axis direction. This means that if the pressing force of the pressure roller 20 is constant, the pressing force per unit contact area within the first contact area can be kept constant regardless of the position of the pressure roller 20 in the X-axis direction. Therefore, this configuration makes it possible to uniformly apply a film such as the photoresist film 6 to the semiconductor wafer W placed on the table 2.

[0062] In the illustrated example, the top plate 5T is configured to have a shape that is line-symmetrical with respect to a dashed line L2 that passes through the central axis CA and is parallel to the X axis. This configuration has the advantage that the size of a portion of the first contact area (first left contact area) on one side of the second contact area (Y1 side, left side) and the size of the remaining portion of the first contact area (first right contact area) on the other side of the second contact area (Y2 side, right side) can be made the same, regardless of the position of the pressure roller 20 in the X axis direction. This means that variation in the pressure force of the pressure roller 20 in the Y axis direction can be suppressed. Therefore, this configuration allows a film such as the photoresist film 6 to be uniformly applied to the semiconductor wafer W placed on the table 2.

[0063] Furthermore, in the film sticking device 1, since the top panel 5T has a substantially rectangular outer shape in a plan view, compared to a case in which the top panel has a circular outer shape in a plan view, the size of the upper surface 5a of the top panel 5T can be reduced while still achieving four-point support by the support mechanism 50. However, the top panel 5T may be configured to have an outer shape other than a substantially rectangular shape in a plan view (for example, an outer shape such as a circle, a hexagon, or an octagon).

[0064] Next, referring to Fig. 13, a description will be given of a lifting support mechanism 25A, which is another example of the lifting support mechanism 25 that lifts and lowers the outer periphery support member 5. Fig. 13 is a diagram showing the example of the lifting support mechanism 25A. Specifically, Fig. 13 is a perspective view of the table 2, the outer periphery support member 5, and the lifting support mechanism 25A.

[0065] Like the lifting support mechanism 25, the lifting support mechanism 25A includes a lifting mechanism LMA that lifts and lowers the outer periphery side support member 5, and a support mechanism 50A that supports the outer periphery side support member 5 at four points.

[0066] The support mechanism 50A differs from the support mechanism 50, which includes a height adjustment mechanism HAM configured with a nut 51 and a screw 52, ​​in that it includes a height adjustment mechanism HAM configured with a linear bushing 51A and a linear shaft 52A. The linear bushing 51A is a rolling guide linear motion mechanism, and is configured so that relative movement between the linear bushing 51A and the linear shaft 52A is locked by a lock lever (not shown). In the illustrated example, the support mechanism 50A includes a left front support mechanism 50ALF for adjusting the height of the first corner 5N1, a right front support mechanism 50ARF for adjusting the height of the second corner 5N2, a right rear support mechanism 50ARB for adjusting the height of the third corner 5N3, and a left rear support mechanism 50ALB (not visible in FIG. 13 ) for adjusting the height of the fourth corner 5N4.

[0067] With such support mechanisms 50A, an operator adjusting the height of the outer periphery support member 5 can, for example, manually move the linear bushings 51A of the height adjustment mechanisms HAM in each of the left front support mechanism 50ALF, the right front support mechanism 50ARF, the left rear support mechanism 50ALB, and the right rear support mechanism 50ARB up and down along the linear shafts 52A, thereby separately adjusting the height of each of the four corners 5N (first corner 5N1 to fourth corner 5N4) of the top plate portion 5T of the outer periphery support member 5. In the illustrated example, the height of the corners 5N is the height relative to the upper surface of the base plate 5B.

[0068] The lifting mechanism LMA differs from the lifting mechanism LM, which uses a rotation motor 35, in that it uses an electric slider ES. In the illustrated example, the electric slider ES is configured to move the bracket arm BA along the X-axis direction using a stepping motor and a ball screw mechanism. A connecting plate 5P is fixed to the base plate 5B of the outer periphery support member 5, and a linear guide LG is fixed to the side of the connecting plate 5P at a predetermined inclination (e.g., a gradient of 1 / 20). A slider SD is fixed to the upper end of the bracket arm BA so that it can slide along the linear guide LG.

[0069] With this configuration, the lifting mechanism LMA can move the bracket arm BA in the direction indicated by arrow AR1 (rearward, toward X2) using the electric slider ES, thereby moving the outer periphery support member 5 including the base plate 5B in the direction indicated by arrow AR2 (upward, toward Z1). The same applies to moving the outer periphery support member 5 including the base plate 5B in the opposite direction (downward, toward Z2).

[0070] That is, the lifting mechanism LMA can move the connecting plate 5P and the base plate 5B to which the linear guide LG is fixed in the Z-axis direction by moving the bracket arm BA in the X-axis direction using the electric slider ES. Therefore, the lifting mechanism LMA can move the pedestal portion 5D, the outer peripheral wall portion 5W, and the top plate portion 5T, which are fixed to the base plate 5B via the support mechanism 50A, in the Z-axis direction. Therefore, the lifting mechanism LMA can raise and lower the four corners 5N (first corner 5N1 to fourth corner 5N4) of the top plate portion 5T at the same lifting speed.

[0071] With the above-described configuration, the film application device 1 equipped with the lifting support mechanism 25A provides the same effects as when equipped with the lifting support mechanism 25. Specifically, the film application device 1 equipped with the lifting support mechanism 25A provides the effect that an operator can flexibly adjust the horizontality of the upper surface 5a of the outer periphery support member 5. Furthermore, the film application device 1 equipped with the lifting support mechanism 25A provides the effect that the four corners 5N (first corner 5N1 to fourth corner 5N4) of the top plate portion 5T of the outer periphery support member 5 can be raised and lowered at the same lifting speed.

[0072] 1 , the semiconductor manufacturing apparatus (film bonding apparatus 1) according to the embodiment of the present disclosure includes: a table 2 on which a semiconductor wafer W is placed; a pressing member (pressing roller 20) that presses a film (photoresist film 6) to be bonded to the semiconductor wafer W placed on the table 2; an outer periphery support member 5 that is provided on the outer periphery of the table 2 and is disposed so as to receive the pressing force of the pressing member (pressing roller 20) when the pressing member (pressing roller 20) presses the film (photoresist film 6); and a support mechanism 50 that supports the outer periphery support member 5 at least three positions that are spaced apart from one another in a plan view and that can separately adjust the heights of the at least three positions. In the example shown in FIG. 1 , the support mechanism 50 includes a left front support mechanism 50LF, a right front support mechanism 50RF, a left rear support mechanism 50LB, and a right rear support mechanism 50RB. The left front support mechanism 50LF, the right front support mechanism 50RF, the left rear support mechanism 50LB, and the right rear support mechanism 50RB each have a height adjustment mechanism HAM. In the illustrated example, the semiconductor manufacturing apparatus is a film application device 1, which is an example of a laminator, but it may also be a mounter that applies a film to a ring. That is, the outer peripheral support member 5 supported by the support mechanism 50 may be mounted on the mounter as a member on which the ring is placed. The same applies to the following features. That is, the following features may also be mounted on the mounter.

[0073] With this configuration, the semiconductor manufacturing apparatus has the effect of eliminating the tilt of the upper surface of the outer peripheral support member 5. Specifically, the semiconductor manufacturing apparatus has the effect of enabling an operator to adjust the horizontality of the upper surface 5 a of the outer peripheral support member 5.

[0074] The semiconductor manufacturing apparatus (film bonding apparatus 1) may also include a lifting mechanism LM that raises and lowers the outer peripheral support member 5. In the illustrated example, the lifting mechanism LM includes a rotation motor 35, a transmission belt 36, a drive pulley 37, a tension pulley 38, and a driven pulley 39, as shown in FIGS. 10 and 11 . However, the lifting mechanism LM may also include other mechanical elements such as gears, chains, or wires. The lifting mechanism LM may also be omitted. Even in this case, the operator can adjust the levelness of the upper surface 5 a of the outer peripheral support member 5 by using the height adjustment mechanisms HAM in the left front support mechanism 50LF, the right front support mechanism 50RF, the left rear support mechanism 50LB, and the right rear support mechanism 50RB. Furthermore, by raising and lowering the table 2, the operator can make the semiconductor wafer W placed on the upper surface of the table 2 flush with the upper surface 5 a of the outer peripheral support member 5.

[0075] 9, the outer periphery support member 5 may have a substantially rectangular shape in a plan view and may be disposed so as to surround the table 2. In this case, the height adjustment mechanism HAM may be configured so as to be able to adjust the height of each of the four corners of the outer periphery support member 5 separately.

[0076] With this configuration, the semiconductor manufacturing apparatus has the advantage of being able to eliminate tilt of the upper surface of the outer peripheral support member 5, even when the outer peripheral support member 5 is supported at four points by the support mechanism 50, for example.

[0077] Furthermore, the lifting mechanism LM may be configured to simultaneously lift and lower each of the four corners of the outer periphery support member 5. In the illustrated example, the lifting mechanism LM is configured to simultaneously operate the height adjustment mechanisms HAM in the left front support mechanism 50LF, the right front support mechanism 50RF, the left rear support mechanism 50LB, and the right rear support mechanism 50RB to lift and lower the outer periphery support member 5.

[0078] With this configuration, the semiconductor manufacturing equipment can raise and lower the outer peripheral support member 5 while eliminating any tilt of the upper surface of the outer peripheral support member 5. Specifically, the semiconductor manufacturing equipment has the effect of enabling an operator to raise and lower the outer peripheral support member 5 while maintaining the horizontality of the upper surface 5 a of the outer peripheral support member 5.

[0079] The preferred embodiments of the present invention have been described above in detail. However, the present invention is not limited to the above-described embodiments. Various modifications and substitutions may be applied to the above-described embodiments without departing from the scope of the present invention. Furthermore, the features described with reference to the above-described embodiments may be combined as appropriate unless technically inconsistent.

[0080] This application claims priority based on Japanese Patent Application No. 2023-141612, filed on August 31, 2023, the entire contents of which are incorporated herein by reference.

[0081] REFERENCE SIGNS LIST 1...Film application device 2...Table 2G...Groove 3...Film supply section 4...Winding section 5...Outer peripheral support member 5a...Upper surface 5B...Base plate 5C...Side cover 5D...Pedestal section 5K...Opening 5N...Corner section 5N1...First corner section 5N2...Second corner section 5N3...Third corner section 5N4...Fourth corner section 5P...Connecting plate 5T...Top plate section 5W...Outer peripheral wall section 6...Photoresist film 7...Carrier film 8...Reinforcing film 9...Pinch roller 10...Slide rod 11...Substrate 12...Support section 13...Exhaust passage 13D...Pipe 13G...Gap 15...Slide shaft 16...First moving unit 17...Second moving unit 18...Third moving unit 19...Cutting unit 20...Pressing roller 21...Pressing force adjustment mechanism 22...Pressing cylinder 22a: Piston rod 25, 25A: Lifting support mechanism 34: Mounting piece 34a: Bracket 35: Rotation motor 36: Transmission belt 37: Drive pulley 38: Tension pulley 38L: Left tension pulley 38R: Right tension pulley 39: Driven pulley 39LB: Left rear driven pulley 39LF: Left front driven pulley 39RB: Right rear driven pulley 39RF: Right front driven pulley 40: Control unit 41: Input unit 42: Height level memory unit 43: Pressing pattern memory unit 50, 50A: Support mechanism 50LB, 50ALB: Left rear support mechanism 50LF, 50ALF: Left front support mechanism 50RB, 50ARB: Right rear support mechanism 50RF,50ARF...Right front support mechanism 51...Nut 51A...Linear bushing 52...Screw 52A...Linear shaft 53...Bearing 54...Spacer 80...Hollow structure 81...Wall section 82...Roof section AX...Rotation axis AX1...First rotation axis AX2...Second rotation axis AX3...Third rotation axis AX4...Fourth rotation axis BA...Bracket arm BT...Bolt BT2...Position adjustment bolt CA...Central axis CF...Central section CN...Corner section CN1...First corner section CN2...Second corner section CN3...Third corner section CN4...Fourth corner section CZ...Range F2...Two-layer film ES...Electric slider F3...Three-layer film HAM...Height adjustment mechanism LG...Linear guide LM, LMA...Lifting mechanism SD...Slider TLM...Table lifting mechanism W: semiconductor wafer,

Claims

1. A semiconductor manufacturing device comprising: a table on which a semiconductor wafer is placed; a pressing member that presses a film to be attached to the semiconductor wafer placed on said table; an outer periphery support member that is provided on the outer periphery of said table and is positioned so as to receive the pressing force of said pressing member when said pressing member presses said film; and a support mechanism that supports said outer periphery support member at least three positions spaced apart from one another and is capable of separately adjusting the height of said at least three positions.

2. The semiconductor manufacturing device according to claim 1, further comprising a lifting mechanism for lifting the outer periphery support member.

3. The semiconductor manufacturing apparatus of claim 2, wherein the outer periphery support member has a rectangular outer shape in a plan view and is arranged to surround the table, the support mechanism has a height adjustment mechanism, and the height adjustment mechanism is configured to be able to adjust the height of each of the four corners of the outer periphery support member separately.

4. The semiconductor manufacturing device according to claim 3, wherein the lifting mechanism is configured to simultaneously lift and lower each of the four corners of the outer periphery support member.

5. A support mechanism mounted on a semiconductor manufacturing device comprising: a table on which a semiconductor wafer is placed; a pressing member for pressing a film to be attached to the semiconductor wafer placed on the table; and an outer peripheral support member provided on the outer peripheral side of the table and positioned so as to receive the pressing force of the pressing member when the pressing member presses the film, the support mechanism being configured to support the outer peripheral support member at least at three positions spaced apart from one another and to be able to separately adjust the heights of the at least three positions.

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