Substrate handling system in deposition system

Abstract

The present invention relates to a substrate handling system in a deposition system and relates to a substrate handling system that includes a substrate conveying robot and a substrate support unit, having a structure corresponding thereto, for performing a deposition process by conveying a substrate into a deposition chamber. According to an embodiment of the present invention for solving the problem, the substrate handling system comprises: a conveying robot that conveys a substrate into a deposition chamber; and a substrate support unit that is provided in the deposition chamber, receives the substrate from the transfer robot, and supports same. The conveying robot may include a support body that includes a rod-shaped stem and a plurality of branches extending from both sides of the stem, the substrate support unit may include a main support portion that includes a base and a plurality of main support members extending side by side from the base, and the main support portion may receive the substrate by contacting an unused region of the substrate not supported by the support body of the conveying robot.

Description

Substrate handling system of deposition system

[0001] The present invention relates to a substrate handling system of a deposition system, and more particularly, to a substrate handling system including a substrate transfer robot for transferring a substrate into a deposition chamber to perform a deposition process and a substrate support unit having a corresponding structure.

[0002] Most thin-film devices used in display panels (e.g., LCDs, OLEDs), semiconductors, and solar cells are manufactured by depositing thin films on substrates within a chamber. This requires specialized means for transporting the substrates during the deposition process, chucking them, and supporting them at each stage. In particular, for large-area substrates of Generation 6 and above, the likelihood of defects occurring due to positional errors or substrate sagging increases. Therefore, the need for accurate positional transfer of thin, large-area substrates and stable support without sagging is increasingly crucial.

[0003] In this regard, Korean Patent No. 0746579, “Continuous Deposition System,” discloses a system for processing a glass substrate, but does not present a transfer device suitable for a large-area substrate or a device structure for preventing sagging of the substrate.

[0004] Meanwhile, the background technology described above is technical information that the inventor possessed for the purpose of deriving the present invention or acquired during the process of deriving the present invention, and cannot necessarily be said to be publicly known technology disclosed to the general public prior to the application for the present invention.

[0005] The problem that the present invention seeks to solve is to transfer a large-area thin substrate from chamber to chamber without positional error.

[0006] The problem that the present invention seeks to solve is to stably support a large-area thin substrate during a deposition process without warping or sagging of the central portion of the substrate.

[0007] The problem to be solved by the present invention is to propose a substrate handling system that does not disturb the alignment of the substrate and the mask after receiving the substrate in the deposition chamber.

[0008] The problem to be solved by the present invention is to propose a substrate handling system that changes the arrangement of a device supporting a substrate in response to an unused area of ​​the substrate based on the fact that the location of an unused area where a device is not deposited varies depending on the panel size when performing deposition on substrates of various sizes.

[0009] The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the description below.

[0010] According to one embodiment of the present invention for solving the above-described problem, a substrate handling system includes a transfer robot for transferring a substrate to a deposition chamber, and a substrate supporter provided in the deposition chamber for receiving and supporting a substrate from the transfer robot, wherein the transfer robot includes a supporter including a rod-shaped stem and a plurality of branch parts extending from both sides of the stem, and the substrate supporter includes a main supporter including a base and a plurality of main supports extending in parallel from the base, and the main supporter can receive the substrate by contacting an idle area of ​​the substrate that is not supported by the supporter of the transfer robot.

[0011] According to one embodiment of the present invention, the substrate support further includes a rotation axis for fixing the base and a substrate support drive unit for rotating the base about the rotation axis, and the substrate support drive unit can perform an avoidance operation of rotating the substrate support unit to avoid the substrate while the main support unit takes over the substrate and an alignment process is performed in which the substrate is aligned with the mask.

[0012] According to one embodiment of the present invention, the base is detachable from the rotation axis and may include at least one of a pin and an adjusting bolt.

[0013] According to one embodiment of the present invention, the main support member supports the substrate with at least one corner corresponding to each of at least one corner of the substrate as the center, and the main support member can be arranged in a direction parallel to one of the vertical axis and the horizontal axis of the substrate passing through the center of gravity of the substrate when supporting the substrate.

[0014] According to one embodiment of the present invention, the substrate handling system may further include an anti-sag unit including a plurality of linear anti-sag supports that support the vertical and horizontal axes of the substrate passing through the center of gravity of the substrate, and a plurality of anti-sag rotation axes that secure one end of each of the anti-sag supports and are positioned at any one point on an extension line of the vertical and horizontal axes.

[0015] According to one embodiment of the present invention, the anti-sag support is positioned below the substrate support, and when the substrate support takes over the substrate and the transport robot retreats, the anti-sag support rotates around the anti-sag rotation axis to align with the vertical axis and the horizontal axis and rises to support the vertical axis and the horizontal axis.

[0016] According to one embodiment of the present invention, the anti-sagging support can perform an avoidance operation to avoid the substrate by rotating around the anti-sagging rotation axis during an alignment process in which the substrate and the mask are aligned.

[0017] According to one embodiment of the present invention, each of the main support and the anti-sag support may further include a substrate support pad arranged along the length direction of the support and in linear contact with the substrate to support the substrate.

[0018] According to one embodiment of the present invention, the substrate support pad includes a buffer portion that alleviates impact when contacting the substrate, and the buffer portion may include at least one of a bellows-shaped fluoroelastomer and a spring.

[0019] According to any one of the problem solving means of the present invention, a large-area thin substrate can be transferred from chamber to chamber without positional error.

[0020] According to one of the problem solving means of the present invention, when supporting a large-area thin substrate during a deposition process, the substrate can be stably supported without warping or sagging in the central portion.

[0021] According to one of the problem solving means of the present invention, a substrate handling system that does not disturb the alignment of a substrate and a mask after receiving the substrate in a deposition chamber can be presented.

[0022] According to one of the problem solving means of the present invention, when performing deposition on substrates of various sizes, a substrate handling system can be proposed that changes the arrangement of a device supporting a substrate in response to an unused area of ​​the substrate based on the fact that the location of an unused area where elements are not deposited varies depending on the panel size.

[0023] The effects that can be obtained from the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by a person having ordinary skill in the art to which the present invention belongs from the description below.

[0024] FIG. 1 is a plan view illustrating a substrate handling system according to one embodiment of the present invention.

[0025] Fig. 2 is a perspective view illustrating a substrate handling system according to an embodiment.

[0026] FIG. 3 is a plan view sequentially illustrating a substrate handling system transporting a substrate according to an embodiment.

[0027] FIG. 4 is an exemplary diagram illustrating the coupling of the base and the main rotation axis in the main support according to one embodiment.

[0028] Figure 5 is an exemplary drawing for explaining the shape of the main support and the anti-sagging support supporting the substrate according to the embodiment.

[0029] Fig. 6 is an exemplary diagram illustrating an embodiment of a substrate support pad according to an embodiment.

[0030] The advantages and features of the present invention, as well as the methods for achieving them, will become clearer with reference to the embodiments described in detail below, along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various different forms. These embodiments are provided solely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention. In other words, the present invention is defined solely by the scope of the claims.

[0031] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are exemplary, and therefore the present invention is not limited to the matters illustrated. In addition, in describing the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. When the terms “includes,” “has,” and “consists of” are used in this specification, other parts may be added unless “only” is used. When a component is expressed in the singular, it includes a case where the plural is included unless there is a special explicit description. In addition, when interpreting a component, it is interpreted to include a range of error even if there is no separate explicit description.

[0032] Although terms like "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, a "first" component referred to below may also be a "second" component within the technical scope of the present invention.

[0033] Unless otherwise specified, the same reference numerals refer to the same components throughout the specification.

[0034] The individual features of the various embodiments of the present invention can be partially or wholly combined or combined with each other, and as can be fully understood by those skilled in the art, various technical connections and operations are possible, and each embodiment can be implemented independently of each other or can be implemented together in a related relationship.

[0035] Hereinafter, the present invention will be described in detail with reference to the attached drawings.

[0036] First, FIG. 1 is a plan view for explaining a substrate handling system (1) according to one embodiment of the present invention. According to FIG. 1, the substrate handling system (1) includes a transfer chamber (10) and a deposition chamber (20), and operates within a deposition system that performs deposition on a substrate, and may include a transfer robot (100) provided in the transfer chamber (10) and a substrate support (200) provided in the deposition chamber (20).

[0037] Here, the transfer chamber (10) is equipped with a transfer robot (100) and connects chambers such as one or more substrate buffer chambers (not shown) for storing substrates, one or more deposition chambers (20) for performing a deposition process, and the transfer chamber (10) and the deposition chamber (20) can be connected by a gate valve (30).

[0038] At this time, the transfer robot (100) equipped in the transfer chamber (10) can transfer the substrate from the substrate buffer chamber to the deposition chamber (20) via the transfer chamber (10), or can transfer the substrate taken out from the deposition chamber (20) to another deposition chamber or another deposition position (21) in the same deposition chamber (20).

[0039] And the deposition chamber (20) may be equipped with a substrate support (200) to support the substrate (G) while performing a deposition process on the substrate (G). According to an embodiment, the substrate support (200) may be installed to support the substrate (G) at a 'deposition position (21)', which is a position of the substrate (G) while performing the deposition process. According to an embodiment, the deposition chamber (20) may be equipped with two or more deposition positions (21), and at this time, a substrate support (200) may be equipped for each deposition position (21).

[0040] In addition, the substrate support (200) may include a main support (210) and a sagging prevention member (220), and a specific description of each configuration will be described later with reference to FIG. 2.

[0041] Next, referring to FIG. 2, FIG. 2 is a perspective view for explaining a substrate handling system (1) according to an embodiment.

[0042] According to FIG. 2, the transport robot (100) may include a support (110) that directly contacts the substrate to support the substrate in order to transport the substrate to a deposition location (21), and a transport robot drive unit (120) that applies movement to the support (110).

[0043] According to an embodiment, the support (110) may include a stem (111) and branches (112). At this time, the support (110) may include a rod-shaped stem (111) and a plurality of branches (112) that extend in parallel on both sides of the stem (111). At this time, the stem (111) supports the central portion of the substrate, and the branches (112) can stably support the substrate by contacting a side portion of the substrate that is away from the central portion. In addition, the stem (111) may be implemented as one rod or two or more rods arranged in parallel, depending on the embodiment.

[0044] According to an embodiment, among the branches (112) arranged in parallel, the branches (112) located at both ends may include one or more protrusions protruding outward.

[0045] And the transport robot driving unit (120) may include an actuator that linearly drives the support (110) in at least one direction among up and down and left and right on a plane to move the support (110) to the deposition position (21) in the deposition chamber (20) and transfer the substrate. In addition, the transport robot driving unit (120) may include an up and down driving actuator that loads the substrate and lowers the support (110) that has reached the deposition position (21) to transfer the substrate to the substrate support unit (200).

[0046] And the substrate support unit (200) receives and supports the substrate from the transfer robot (100) at the deposition location (21), and may include a main support unit (210), an anti-sagging unit (220), and a substrate support unit drive unit (230) that applies movement to these.

[0047] At this time, the main support (210) may include a base (211) and a plurality of main supports (212). According to an embodiment, the base (211) is connected to the main support (212) to determine the position of the main support (212), and may be implemented as a rod or plate having a predetermined length from which the plurality of main supports (212) are formed to extend.

[0048] In addition, a plurality of main supports (212) according to the embodiment are configured in a rod shape that extends in parallel in one direction from the base (211), and can take over the substrate by contacting an idle area of ​​the substrate that is not supported by the support body (110) of the transfer robot (100). At this time, the area that the main supports (212) contact may be an unused area on the substrate where deposition does not occur.

[0049] Referring to FIG. 1 together, according to an embodiment, the substrate handling system (1) may include a plurality of main supports (210), and the main supports (210) may support the substrate with at least one corner corresponding to each of at least one corner of the substrate as the center. For example, when the substrate is rectangular, the substrate support (200) may include four main supports (210), and each of the main supports (210) may support the substrate with the corner of the substrate as the center. In addition, when the plurality of main supports (210) are aligned to support the substrate, the main supports (212) included in the plurality of main supports (210) may be arranged in a direction parallel to one of the vertical axis and the horizontal axis of the substrate.

[0050] In addition, according to an embodiment, a protrusion may be formed inwardly on the main support (212) that contacts the edge of the substrate, and at this time, the protrusion may be formed in an offset position so as not to collide with the protrusion of the branch portion (112) when receiving the substrate from the support (110).

[0051] In addition, the base (211) can be fixed to a position corresponding to the deposition position (21) by the main rotation axis (213). At this time, the main support (210) rotates around the main rotation axis (213) by the substrate support drive unit (230), but can selectively rotate according to the progress of the deposition process. To this end, the substrate support drive unit (230) may further include a rotation drive unit that causes the main support (210) to rotate.

[0052] According to an embodiment, the substrate support drive unit (230) can perform an avoidance operation to avoid the substrate by rotating the substrate support unit (200) while an alignment process is in progress in which the substrate and the mask are aligned after the substrate support unit (200) takes over the substrate.

[0053] For example, referring to FIG. 1, in the substrate support (200) supporting the substrate (G) at the left deposition position in the deposition chamber (20) in the drawing, while the main support (212) is aligned parallel to the horizontal axis of the substrate (G) to support the substrate, the main support (210) of the substrate support (200) at the right deposition position (21) can be rotated 90 degrees to avoid interference between the substrate and the mask when they are aligned.

[0054] And the substrate support member (200) may further include an anti-sagging member (220). The anti-sagging member (220) according to the embodiment is configured to prevent sagging of the substrate by supporting the substrate between the main supports (212), and may include an anti-sagging support member (221) and an anti-sagging rotation shaft (222).

[0055] According to an embodiment, the sagging prevention support (221) may be implemented in the form of a linear bar to support the vertical and horizontal axes of the substrate passing through the center of gravity of the substrate. For example, when the shape of the substrate is rectangular, when two axes passing through the center of gravity of the substrate and parallel to each side of the rectangle are defined as the vertical and horizontal axes, respectively, the sagging prevention support (221) may support the vertical and horizontal axes of the substrate. At this time, the part that the sagging prevention support (221) comes into contact with may be an unused area on the substrate where deposition does not occur.

[0056] And the anti-sagging rotation axis (222) fixes one end of the anti-sagging support (221) and serves as the center of rotational movement of the anti-sagging support (221), and can be provided at a position corresponding to any one point on the extension line of the vertical axis and horizontal axis of the substrate.

[0057] According to an embodiment, the anti-sagging support (221) is positioned below the main support (210), and when the main support (210) takes over the substrate and the transfer robot (100) retreats, the anti-sagging support (221) rotates around the anti-sagging rotation axis (222) to align the vertical and horizontal axes of the substrate and then rises to support the vertical and horizontal axes of the substrate. Thereafter, during the alignment process in which the substrate and the mask are aligned, the anti-sagging support (221) can perform an avoidance operation to avoid the substrate by rotating around the anti-sagging rotation axis (222) so as not to disturb the alignment of the substrate and the mask.

[0058] Referring to FIG. 1 here, the anti-sagging support (221) at the deposition position (21) on the left side of the drawing supports the substrate by aligning it on the vertical and horizontal axes of the substrate, and the anti-sagging support (221) at the deposition position (21) on the right side of the drawing can perform an avoidance action to avoid the substrate by rotating 90 degrees and aligning it to the outside of the deposition position (21).

[0059] Next, referring to FIG. 3, FIG. 3 is a plan view sequentially illustrating a substrate handling system (1) transporting a substrate according to an embodiment.

[0060] According to (a) of FIG. 3, the support (110) of the transport robot (100) supports the substrate (G) and can approach the substrate support (200) by the transport robot driving unit (120).

[0061] At this time, the main support (210) can be aligned to load the substrate (G) when or before the transport robot (100) approaches. For example, the main support (212) can be aligned so as to be aligned in a direction parallel to the vertical or horizontal axis of the substrate (G). In addition, the sagging prevention member (220) can be rotated to the outside of the deposition position (21) and wait at a plane lower than the main support (210).

[0062] According to (b) of FIG. 3, the transport robot (100) approaches the deposition location (21), and the branch (112) of the transport robot (100) and the main support (212) of the substrate support (200) can move to an intersecting position without colliding with each other. Thereafter, the support (110) of the transport robot (100) descends to transfer the substrate to the main support (210), so that the main support (212) can contact the idle area of ​​the substrate that is not supported by the support (110) and take over the substrate. In some embodiments, the main support (210) may also rise to load the substrate.

[0063] And according to (c) of FIG. 3, the support (110) of the transfer robot (100) that transferred the substrate retreats toward the transfer chamber (10), and then, referring to (d) of FIG. 3, each of the plurality of anti-sagging supports (221) of the anti-sagging unit (220) rotates to align to correspond to the vertical axis or horizontal axis of the substrate (G) on a plan view, and then rises to support the substrate (G) by contacting the vertical axis and horizontal axis of the substrate (G), thereby preventing sagging of the substrate (G).

[0064] Afterwards, when an alignment process for aligning the substrate (G) and the mask is performed, the main support member (210) and the anti-sagging member (220) can perform an avoidance operation to avoid interference with the alignment process by rotating outside the substrate (G) so as not to come into contact with the substrate (G), thereby avoiding the substrate (G).

[0065] Also, referring to FIG. 4, FIG. 4 is an exemplary diagram for explaining the coupling of the base (211) and the main rotation shaft (213) in the main support (210) according to one embodiment.

[0066] First, (a) of Fig. 4 is a perspective view illustrating the combination of the base (211) and the main rotational axis (213). According to (a) of Fig. 4, the rotational axis is combined with the base (211) of the main support (210), thereby fixing the main support (210) at a position corresponding to the deposition position (21), and the main support (210) can rotate around the rotational axis according to the deposition process.

[0067] And (b) of FIG. 4 is a perspective view showing a state in which the base (211) and the main rotation shaft (213) are detached. According to (b) of FIG. 4, the base (211) is provided with a hole as a coupling portion for coupling with the main rotation shaft (213), and the main rotation shaft (213) is detachable as a rod-shaped pin having a cross-section corresponding to the hole of the base (211). This form is only one embodiment, and the main rotation shaft (213) can be implemented as one of various forms that facilitate the detachment of the base (211), such as not only a pin but also an adjusting bolt, and the coupling portion of the base (211) to which the main rotation shaft (213) is coupled can also be implemented in a form corresponding to the main rotation shaft (213) as well as a hole.

[0068] Next, Fig. 4 (c) is a side view showing the base (211) of the main support (210) and the main rotation shaft (213) detached from each other. According to Fig. 4 (c), the base (211) in the form of a thin plate and the main rotation shaft (213) in the form of a vertically long bar are shown detached from each other.

[0069] And (a) of FIG. 5 is a cross-sectional view showing a cross-section of a main support (212) or an anti-sagging support (221) that supports a substrate according to an embodiment, and (b) of FIG. 5 is an exemplary view for explaining a form in which the main support (212) or the anti-sagging support (221) contacts the substrate, and shows a plan view corresponding to each cross-sectional view of (a) of FIG. 5 on the left.

[0070] According to (a) of FIG. 5, the cross-section of the main support (212) or the sagging prevention support (221) may have a trapezoidal shape with a narrow upper surface, a shape implemented with a curved side that contacts the substrate, or a bell-shaped cross-section with a curved upper surface that contacts the substrate and a wider lower surface. According to (b) of FIG. 5, the main support (212) or the sagging prevention support (221) in contact with the substrate is illustrated on a plane, and the contact surface is indicated by hatching. Referring to this, in the case of a trapezoidal cross-section with a narrow upper surface, the contact surface has a narrow area, and in the case where the side that contacts the substrate or the upper surface that contacts the substrate is curved, the contact surface may appear in a straight line shape. According to the embodiment illustrated in (b) of FIG. 5, in all three cases, the contact surface can be linear, although the widths are wide and narrow.

[0071] And Fig. 6 is an exemplary diagram showing an embodiment of a substrate support pad (240), which is a side view showing the main support (212) or the anti-sagging support (221) supporting the substrate (G).

[0072] According to FIG. 6, the substrate support pad (240) is included in at least one of the main support (212) and the anti-sagging support (221) included in the main support (210), and may include a buffer portion that alleviates impact when the substrate (G) comes into contact with the support (212, 221) that linearly supports the substrate (G) by being arranged along the length direction of the support including the main support (212) and the anti-sagging support (221).

[0073] Referring to (a) of FIG. 6, the buffer portion of the substrate support pad (240a) according to the embodiment may be formed of elastic fluoroelastomer. In addition, referring to (b) of FIG. 6, the buffer portion of the substrate support pad (240b) may be formed of bellows-shaped fluoroelastomer, and referring to (c) of FIG. 6, the buffer portion of the substrate support pad (240c) may include an elastic body such as a spring.

[0074] According to an embodiment, the vertical thickness of the main support (212) may be formed to be thicker than the vertical thickness of the support (110) of the transfer robot (100). At this time, the vertical thickness of the main support (212) may mean the thickness of the entire main support (212) including the substrate support pad (240). For example, the vertical thickness of the main support (212) may be implemented to be 10 to 20 mm thicker, preferably 15 mm thicker, than the support (110). As a result, a space wider than the thickness of the support (110) can be provided under the main support (212) so that the support (110) can retreat without interference with the main support (212) after the support (110) descends and transfers the substrate to the main support (212).

[0075] In addition, when the location of the unused area of ​​the substrate is changed, the main support (212) can change the number or location according to the changed unused area, and can be aligned accordingly so as not to collide with the branch (112) of the transfer robot (100). At this time, the transfer robot (100) can approach the deposition location (21) to transfer the substrate without colliding with the main support (212), or the main support (210) can be moved on a plane so as to align the main support (212) and the branch (112) at a position where they do not collide.

[0076] Although the embodiments of the present invention have been described in more detail with reference to the attached drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be implemented without departing from the technical spirit of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain it, and the scope of the technical spirit of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all aspects and not restrictive. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

Claims

1. A transfer robot that transfers the substrate to the deposition chamber; and A substrate support unit is provided in the deposition chamber and receives and supports the substrate from the transfer robot, The above transport robot, A support including a rod-shaped stem and a plurality of branches extending to both sides of the stem, The above substrate support part, A substrate handling system comprising a main support including a base and a plurality of main supports extending parallel from the base, wherein the main supports contact an idle area of ​​the substrate not supported by the support of the transfer robot to take over the substrate.

2. In paragraph 1, The above substrate support part, It further includes a rotation axis that fixes the base and a substrate support driving unit that rotates the base around the rotation axis, The above substrate support driving unit is, A substrate handling system, wherein the main support part takes over the substrate and performs an avoidance operation to avoid the substrate by rotating the substrate support part while an alignment process is performed in which the substrate is aligned with a mask.

3. In paragraph 2, A substrate handling system, wherein the base is detachable from the rotation axis and includes at least one of a pin and an adjustment bolt.

4. In paragraph 1, The above main support part is, A substrate handling system, wherein the substrate is supported with the at least one corner corresponding to each of the at least one corner of the substrate as the center, and the main support is arranged in a direction parallel to one of the vertical axis and horizontal axis of the substrate passing through the center of gravity of the substrate when supporting the substrate.

5. In paragraph 1, A plurality of linear anti-sag supports that support the vertical and horizontal axes of the substrate passing through the center of gravity of the substrate; and A substrate handling system further comprising an anti-sag unit including a plurality of anti-sag rotation axes positioned at any one point on an extension of the vertical axis and the horizontal axis, each of which fixes one end of the anti-sag support.

6. In paragraph 5, The above anti-sagging support is, A substrate handling system, which is positioned below the substrate support member, and when the substrate support member takes over the substrate and the transfer robot retreats, rotates around the anti-sagging rotation axis to align with the vertical axis and the horizontal axis and rises to support the vertical axis and the horizontal axis.

7. In paragraph 5, The above anti-sagging support is, A substrate handling system that performs an avoidance action to avoid the substrate by rotating around the anti-sagging rotation axis during an alignment process in which the substrate and mask are aligned.

8. In paragraph 5, Each of the above main support and the above anti-sagging support, A substrate handling system further comprising a substrate support pad arranged along the length direction of the support to support the substrate.

9. In paragraph 8, The above substrate support pad is, A substrate handling system comprising a buffer member that alleviates shock when contacting the substrate, wherein the buffer member comprises at least one of a bellows-shaped fluoroelastomer and a spring.

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