Wiring circuit board and wiring circuit board assembly sheet

Abstract

Disclosed is a wiring circuit board on which an electrical element is mounted. The wiring circuit board has a support. The support has an upper surface and a lower surface. The support is provided with a first through hole that extends in the thickness direction. The wiring circuit board additionally has an insulating layer that covers the outer surface of the support. A portion of the insulating layer that covers the inner peripheral surface of the first through hole forms a second through hole that extends in the thickness direction within the first through hole. The second through hole is formed so as to be capable of housing at least a part of the electrical element. A first conductor layer and a second conductor layer are formed in a predetermined pattern so as to extend from the inner peripheral surface of the second through hole to the upper surface and the lower surface of the insulating layer.

Description

Wired circuit board and wired circuit board assembly sheet

[0001] The present invention relates to a wired circuit board on which electrical elements can be mounted and a wired circuit board assembly sheet including a plurality of wired circuit boards.

[0002] For example, a wired circuit board is used to transmit and receive electrical signals or supply power between multiple electronic components. The wired circuit board has two surfaces facing in opposite directions. In the wired circuit board, for example, electrical elements are mounted on at least one of the two surfaces.

[0003] In the printed wiring board (wired circuit board) described in Patent Document 1, wiring patterns (predetermined patterns of wiring) are formed on two surfaces of a plate-shaped insulating substrate. The wiring pattern formed on one of the two surfaces includes a plurality of pads. A plurality of terminals of an electrolytic capacitor (electrical element) are soldered to the plurality of pads. In this way, the electrolytic capacitor is mounted on the printed wiring board.

[0004] JP 2013-45919 A

[0005] As described above, electrical components are mounted on the wired circuit board. Therefore, the wired circuit board and the electrical components mounted thereon are treated as a single unit called an electrical component mounting board. Electrical component mounting boards are used in various products such as mobile terminals and in-vehicle devices. Therefore, electrical component mounting boards are required to be thinned in accordance with the miniaturization of the products in which they are used. Furthermore, even if electrical component mounting boards are made thinner, if the mechanical strength of the electrical component mounting board decreases as the thickness decreases, the reliability of the electrical component mounting board decreases.

[0006] An object of the present invention is to provide a wiring circuit board and a wiring circuit board assembly sheet including a plurality of wiring circuit boards, which enable a configuration including electrical elements to be made thinner when the electrical elements are mounted and which can achieve high reliability in terms of mechanical strength.

[0007] A wired circuit board according to one aspect of the present invention is a wired circuit board on which electrical elements are mounted, and comprises: a support layer having a first surface and a second surface facing in opposite directions and having a first through hole extending in a thickness direction intersecting the first surface and the second surface; an insulating layer covering at least a portion of the first surface, at least a portion of the second surface, and an inner surface of the first through hole; and a conductor layer formed in a predetermined pattern on the insulating layer, wherein the support layer has higher rigidity than the insulating layer and the conductor layer; a portion of the insulating layer covering the inner surface of the first through hole forms a second through hole extending in the thickness direction inside the first through hole, the second through hole being formed so that at least a portion of the electrical element can be accommodated inside the second through hole, and the inner surface of the second through hole includes a conductor layer forming region where the conductor layer is formed and a conductor layer non-forming region where the conductor layer is not formed.

[0008] A wired circuit board according to another aspect of the present invention is a wired circuit board on which electrical elements are mounted, and comprises: a support layer formed of an insulating material and having a first surface and a second surface facing in opposite directions and having a through hole extending from the first surface to the second surface; and a conductor layer formed in a predetermined pattern on the support layer, wherein the support layer has higher rigidity than the conductor layer, the through hole is formed so that at least a portion of the electrical element can be accommodated inside the through hole, and the inner surface of the through hole includes a conductor layer formation region where the conductor layer is formed and a conductor layer non-formation region where the conductor layer is not formed.

[0009] A wired circuit board assembly sheet according to still another aspect of the present invention includes a plurality of the above-described wired circuit boards, and has a configuration in which the plurality of wired circuit boards are integrally provided.

[0010] According to the present invention, when an electrical element is mounted, it is possible to reduce the thickness of the structure including the electrical element and to obtain high reliability in terms of mechanical strength.

[0011] FIG. 1 is a top view of a wired circuit board according to one embodiment of the present invention. FIG. 2 is a bottom view of the wired circuit board of FIG. 1. FIG. 3 is a cross-sectional view of the wired circuit board of FIG. 1 along line A-A. FIG. 4 is a cross-sectional view of the wired circuit board of FIG. 1 along line B-B. FIG. 5 is a diagram for explaining a method of mounting a mounting target on the wired circuit board of FIG. 1. FIG. 6 is a top view of the mounting board of FIG. 5. FIG. 7 is a schematic side view showing an example of a roll-to-roll apparatus used in a manufacturing process for a wired circuit board. FIG. 8 is a perspective view showing an example of an assembly sheet according to one embodiment of the present invention. FIG. 9 is a partially enlarged top view of the assembly sheet of FIG. 8. FIG. 10 is a process diagram for explaining an example of a manufacturing method for the assembly sheet of FIG. 8. FIG. 11 is a process diagram for explaining an example of a manufacturing method for the assembly sheet of FIG. 8. FIG. 12 is a process diagram for explaining an example of a manufacturing method for the assembly sheet of FIG. 8. FIG. 13 is a process diagram for explaining an example of a manufacturing method for the assembly sheet of FIG. 8. FIG. 14 is a process diagram for explaining an example of a manufacturing method for the assembly sheet of FIG. 8. Fig. 15 is a partially enlarged top view showing a state in which a plurality of mounting targets are mounted on each of a plurality of wired circuit boards of an assembly sheet. Fig. 16 is a partially enlarged top view of an assembly sheet according to another embodiment of the present invention. Fig. 17 is a top view and a cross-sectional view of a wired circuit board according to another embodiment of the present invention. Fig. 18 is a top view and a cross-sectional view of a wired circuit board according to yet another embodiment of the present invention.

[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A wired circuit board and a wired circuit board assembly sheet according to an embodiment of the present invention will now be described with reference to the drawings.

[0013] 1. Basic Configuration of Wired Circuit Board A wired circuit board according to one embodiment of the present invention is a flexible printed circuit (FPC) board configured to mount electrical components and manufactured, for example, by a roll-to-roll process. Therefore, the wired circuit board according to this embodiment is flexible enough to be wound around a roll used in the roll-to-roll process. The wired circuit board according to this embodiment also has two surfaces facing in opposite directions. In the following description, one of the two surfaces of the wired circuit board will be referred to as the top surface of the wired circuit board, and the other of the two surfaces will be referred to as the bottom surface of the wired circuit board. Furthermore, in the following description, an electrical component intended to be mounted on a wired circuit board and an electrical component mounted on a wired circuit board will be referred to as a mounting target corresponding to the wired circuit board. The mounting target may be, for example, a semiconductor chip or various chip electronic components such as chip capacitors and chip resistors.

[0014] Fig. 1 is a top view of a wired circuit board according to one embodiment of the present invention, and Fig. 2 is a bottom view of the wired circuit board of Fig. 1. Fig. 3 is a cross-sectional view of the wired circuit board 100 of Fig. 1 taken along line A-A, and Fig. 4 is a cross-sectional view of the wired circuit board 100 of Fig. 1 taken along line B-B.

[0015] The wired circuit board 100 according to this embodiment generally has a configuration in which an insulating layer 20 is formed so as to cover the outer surface of a sheet-like support 10, and a first conductor layer 30 and a second conductor layer 40 are formed in a predetermined pattern on the insulating layer 20. In Figures 1 and 2, the outline of the support 10 covered by the insulating layer 20 is indicated by a dashed line.

[0016] As shown in Figures 3 and 4, the support 10 has a support upper surface 11 and a support lower surface 12 that face in opposite directions in the thickness direction of the wired circuit board 100. A first through hole 19 is formed in the center of the support 10, extending from the support upper surface 11 to the support lower surface 12. As shown in Figure 1, the first through hole 19 has a rectangular shape in a top view. The thickness of the support 10 is, for example, 10 µm or more and 500 µm or less.

[0017] In the wired circuit board 100, the support 10 has higher rigidity than the insulating layer 20, the first conductor layer 30, and the second conductor layer 40, and is formed of, for example, a metal material. Examples of the metal material forming the support 10 include stainless steel, copper, a copper alloy, aluminum, titanium, and an alloy containing iron and nickel.

[0018] The support 10 only needs to have higher rigidity than the insulating layer 20, the first conductor layer 30, and the second conductor layer 40, and may be formed of a resin or a material containing a resin instead of a metal material. In this case, the resin may be a polyimide resin, an epoxy resin, an acrylic resin, or the like. The resin-containing material may also be a material composed of an epoxy resin and a silica filler, or a material composed of an epoxy resin and a glass fiber, or the like.

[0019] 3 and 4 , insulating layer 20 is formed over the entire outer surface of support body 10 so as to cover support body upper surface 11 and support body lower surface 12 and also cover the inner circumferential surfaces of first through holes 19. A portion of insulating layer 20 located inside first through holes 19 forms a second through hole 29 extending in the thickness direction of wired circuit board 100 inside first through hole 19. First through hole 19 and second through hole 29 of support body 10 are formed so that at least a portion of an item to be mounted corresponding to wired circuit board 100 can be accommodated inside second through hole 29.

[0020] 1, the second through hole 29 has a rectangular shape in a top view. A step is formed on the inner surface 28 of the second through hole 29 at approximately the center in the thickness direction of the wired circuit board 100, over the entire circumference of the inner surface 28. Due to this step, the opening area of ​​the upper part of the second through hole 29 is larger than the opening area of ​​the lower part of the second through hole 29.

[0021] The thickness of the portion of the insulating layer 20 located on the upper surface 11 of the support and the portion of the insulating layer 20 located on the lower surface 12 of the support is, for example, 2 μm or more and 30 μm or less. The thickness of the portion of the insulating layer 20 that forms the second through hole 29 inside the first through hole 19 (thickness in a direction perpendicular to the thickness direction of the wired circuit board 100) is, for example, 2 μm or more and 30 μm or less.

[0022] The insulating layer 20 is formed of, for example, a photosensitive material. Photosensitive polyimide can be used as the photosensitive material for forming the insulating layer 20. Note that the insulating layer 20 may be formed of other photosensitive resins instead of photosensitive polyimide. In this case, examples of the other photosensitive resins include acrylic resin, epoxy resin, polyamide resin, polybenzoxazole resin, and polyvinyl chloride resin. Alternatively, the insulating layer 20 may be formed of an inorganic insulating material or an organic insulating material other than a photosensitive material. Specifically, silicon carbide, silicon dioxide, aluminum nitride, aluminum oxide, or the like can also be used as the material for the insulating layer 20.

[0023] The first conductor layer 30 and the second conductor layer 40 are formed in a predetermined pattern on the upper surface 11 and the lower surface 12 of the support via the insulating layer 20. Furthermore, the first conductor layer 30 and the second conductor layer 40 are formed in a predetermined pattern on the inner circumferential surface 28 of the second through hole 29, as shown in Figures 3 and 4 .

[0024] Here, on the inner circumferential surface 28 of the second through hole 29, the two conductor layers (30, 40) are formed only on a partial region of the inner circumferential surface 28, and are not formed on other regions of the inner circumferential surface 28. Therefore, the two conductor layers (30, 40) do not cover the entire inner circumferential surface 28. In the following description, the region of the inner circumferential surface 28 of the second through hole 29 where the two conductor layers (30, 40) are formed will be referred to as the target region 28a, and the region where the two conductor layers (30, 40) are not formed will be referred to as the non-target region 28b.

[0025] The specific configuration of the first conductor layer 30 will be described. The first conductor layer 30 has a mounting terminal portion 31 ( FIGS. 1 and 2 ), an upper wiring portion 32 a ( FIG. 1 ), a lower wiring portion 32 b ( FIG. 2 ), an upper pad portion 33 a ( FIG. 1 ), and a lower pad portion 33 b ( FIG. 2 ). The mounting terminal portion 31 is formed on the target region 28 a ( FIGS. 3 and 4 ) inside the second through-hole 29 of the insulating layer 20, and overlaps one of the four short sides of the rectangle that forms the inner edge of the second through-hole 29 in a top view, as shown in FIG. 1 . When the mounting target 200 ( FIG. 5 ), which will be described later, is mounted, a first terminal portion 201 ( FIG. 5 ) of the mounting target 200 is joined to the mounting terminal portion 31.

[0026] 1, the upper wiring portion 32a is formed on the upper surface side of the wired circuit board 100 so as to extend a predetermined distance from the mounting terminal portion 31 to one side of the second through-hole 29. The upper pad portion 33a is formed in a substantially circular shape at the tip portion of the upper wiring portion 32a. The upper pad portion 33a is formed so as to be able to join a terminal portion of an electrical element other than the mounting target device 200 described below.

[0027] 2, the mounting terminal portion 31 overlaps one of the four short sides of a rectangle that forms the inner edge of the second through hole 29 when viewed from below. The lower wiring portion 32b is formed on the underside of the wired circuit board 100 so as to extend a predetermined distance from the mounting terminal portion 31 to one side of the second through hole 29. The lower pad portion 33b is formed in a substantially circular shape at the tip of the lower wiring portion 32b. The lower pad portion 33b is formed so as to be able to join a terminal portion of an electrical element other than the mounting target device 200, which will be described later.

[0028] The specific configuration of the second conductor layer 40 will be described. The second conductor layer 40 has a mounting terminal portion 41 ( FIGS. 1 and 2 ), an upper wiring portion 42 a ( FIG. 1 ), a lower wiring portion 42 b ( FIG. 2 ), an upper pad portion 43 a ( FIG. 1 ), and a lower pad portion 43 b ( FIG. 2 ). The mounting terminal portion 41 is formed on the target region 28 a inside the second through-hole 29 of the insulating layer 20, and as shown in FIG. 1 , overlaps the other short side of the four sides of the rectangle that forms the inner edge of the second through-hole 29 in a top view. Therefore, the mounting terminal portion 41 of the second conductor layer 40 faces the mounting terminal portion 31 of the first conductor layer 30 across the internal space of the second through-hole 29. When the mounting target 200 ( FIG. 5 ) described below is mounted, a second terminal portion 202 ( FIG. 5 ) of the mounting target 200 is joined to the mounting terminal portion 41.

[0029] 1, the upper wiring portion 42a is formed on the upper surface side of the wired circuit board 100 so as to extend a predetermined distance from the mounting terminal portion 41 to the other side of the second through-hole 29. The upper pad portion 43a is formed in a substantially circular shape at the tip of the upper wiring portion 42a. The upper pad portion 43a is formed so as to be able to join a terminal portion of an electrical element other than the mounting target device 200 described below.

[0030] 2, the mounting terminal portion 41 overlaps the other short side of the four sides of the rectangle that forms the inner edge of the second through hole 29 when viewed from below. The lower wiring portion 42b is formed on the underside of the wired circuit board 100 so as to extend a predetermined distance from the mounting terminal portion 41 to the other side of the second through hole 29. The lower pad portion 43b is formed in a substantially circular shape at the tip of the lower wiring portion 42b. The lower pad portion 43b is formed so as to be able to join a terminal portion of an electrical element other than the mounting target device 200, which will be described later.

[0031] The thickness of each portion of the first conductor layer 30 and the second conductor layer 40 is, for example, 2 μm to 50 μm. The width of each of the upper wiring portions 32 a, 42 a and the lower wiring portions 32 b, 42 b of the first conductor layer 30 and the second conductor layer 40 (the width of the wiring perpendicular to the direction in which the wiring extends) is, for example, 3 μm to 100 μm.

[0032] Each of the first conductor layer 30 and the second conductor layer 40 is formed, for example, by forming a plating resist of a predetermined pattern on a seed layer and then performing electrolytic plating. The seed layer forming the conductor layer is made of, for example, a thin chromium film and a thin copper film. Alternatively, the seed layer is made of a thin copper film. Alternatively, the seed layer may contain either nickel or palladium. On the other hand, the plating layer is formed of a metal or alloy containing one or more of copper, gold, silver, platinum, lead, tin, nickel, cobalt, indium, rhodium, chromium, tungsten, ruthenium, etc. In this embodiment, the plating layer is copper.

[0033] As shown by dashed-dotted lines in Figures 3 and 4, a cover insulating layer 50 is further formed on the upper surface of the wired circuit board 100, excluding the areas where the second through-hole 29 and the upper pad portions 33a, 43a are formed. The cover insulating layer 50 protects the upper wiring portions 32a, 42a by covering the upper wiring portions 32a, 42a located on the upper surface of the wired circuit board 100. Furthermore, as shown by dashed-dotted lines in Figures 3 and 4, a cover insulating layer 60 is formed on the lower surface of the wired circuit board 100, excluding the areas where the second through-hole 29 is formed and the lower pad portions 33b, 43b are formed. The cover insulating layer 60 protects the lower wiring portions 32b, 42b by covering the lower wiring portions 32b, 42b located on the lower surface of the wired circuit board 100.

[0034] The cover insulating layers 50, 60 may be formed of the same material as the insulating layer 20, or may be formed of an insulating material different from that of the insulating layer 20. Specifically, when the insulating layer 20 is formed of a photosensitive polyimide, the cover insulating layers 50, 60 may also be formed of a photosensitive polyimide. Alternatively, regardless of the material of the insulating layer 20, the cover insulating layers 50, 60 may be formed of a photosensitive resin such as a polyimide resin, an acrylic resin, an epoxy resin, a polyamide resin, a polybenzoxazole resin, or a polyvinyl chloride resin.

[0035] In addition, in Figures 1 and 2 and Figure 5 and subsequent figures, the cover insulating layers 50 and 60 in Figures 3 and 4 are omitted from the illustration so that the structures of the support 10, insulating layer 20, first conductor layer 30, and second conductor layer 40 can be easily understood.

[0036] 2. Mounting of an item to be mounted on the wired circuit board 100 of Fig. 1 An item to be mounted is mounted on the wired circuit board 100 having the above-described configuration. Fig. 5 is a diagram for explaining a method for mounting an item to be mounted on the wired circuit board 100 of Fig. 1. In Fig. 5, the method for mounting an item to be mounted 200 on the wired circuit board 100 is shown in chronological order using two perspective views arranged one above the other.

[0037] For this mounting, a mounting target 200 corresponding to the wired circuit board 100 of FIG. 1 is prepared. As shown in the upper part of FIG. 5 , the mounting target 200 of this example has a rectangular parallelepiped shape. Furthermore, a first terminal portion 201 and a second terminal portion 202 are formed at both longitudinal ends of the mounting target 200. In FIG. 5 , dot patterns are applied to the first terminal portion 201 and the second terminal portion 202 to make it easier to understand the positions and shapes of the first terminal portion 201 and the second terminal portion 202 of the mounting target 200. In FIG. 5 , hatching is applied to the first conductor layer 30 and the second conductor layer 40 to make it easier to understand the positions and shapes of the first conductor layer 30 and the second conductor layer 40 of the wired circuit board 100.

[0038] As described above, the second through hole 29 of the wired circuit board 100 is formed so as to be able to accommodate at least a portion of the item to be mounted 200 inside the second through hole 29. In this example, the second through hole 29 is formed so as to be able to accommodate the entire item to be mounted 200. In other words, in this example, the size of the area surrounded by the inner edge of the second through hole 29 in top view is larger than the item to be mounted 200.

[0039] As indicated by the thick solid arrows in Fig. 5 , the mounting target 200 is inserted into the second through-hole 29 so that the first terminal 201 is adjacent to the mounting terminal 31 of the first conductor layer 30 and the second terminal 202 is adjacent to the mounting terminal 41 of the second conductor layer 40. In this state, the first terminal 201 and the first conductor layer 30, which are arranged opposite each other, are joined using solder, and the second terminal 202 and the second conductor layer 40, which are also arranged opposite each other, are joined using solder. As a result, as shown in the lower part of Fig. 5 , the mounting target 200 is mounted on the wired circuit board 100 while being accommodated in the second through-hole 29 of the wired circuit board 100. In this manner, a mounting board 120 is completed in which the mounting target 200 and the wired circuit board 100 are integrated.

[0040] In this mounting board 120, the mounting target 200 is accommodated in the second through-hole 29 of the wiring circuit board 100. Therefore, compared to when the mounting target 200 is mounted on the upper surface or the lower surface of the wiring circuit board 100, the mounting board 120 can be made thinner.

[0041] Fig. 6 is a top view of the mounting board 120 of Fig. 5. As shown in Fig. 6, in the mounting board 120, a first terminal portion 201 located at one end of the mounting target 200 is joined to the first conductor layer 30 of the wired circuit board 100 via solder 210. Also, a second terminal portion 202 located at the other end of the mounting target 200 is joined to the second conductor layer 40 of the wired circuit board 100 via solder 210.

[0042] In contrast, both side edges of the component to be mounted 200 are spaced from the inner circumferential surface 28 (non-target region 28b of the inner circumferential surface 28) of the second through hole 29 of the wired circuit board 100 in a top view. That is, when the component to be mounted 200 is mounted on the wired circuit board 100, two gaps 29G are formed between a portion of the component to be mounted 200 and the wired circuit board 100. These gaps 29G can be used as working spaces when mounting the component to be mounted 200 on the wired circuit board 100. Furthermore, the above-mentioned gaps 29G can also be used as working spaces when removing the component to be mounted 200 from the wired circuit board 100, for example, to replace the old component to be mounted 200 incorporated in the mounting board 120 with a new component to be mounted 200. In this way, the formation of one or more gaps 29G between the component to be mounted 200 and the wired circuit board 100 facilitates mounting and removing the component to be mounted 200 on the wired circuit board 100. In addition to the above examples, there are other cases in which the mounting target item 200 may be removed from the wiring circuit board 100, such as when it is desired to replace a defective mounting target item 200, or when it is desired to remount a mounting target item 200 that has been mounted in a posture different from the predetermined posture.

[0043] 3. Wired Circuit Board Assembly Sheet and Manufacturing Method Thereof As described above, the wired circuit board 100 according to the present embodiment is manufactured by, for example, a roll-to-roll method. In the roll-to-roll method, a wired circuit board assembly sheet (hereinafter simply referred to as assembly sheet) including a plurality of wired circuit boards 100 is manufactured. A roll-to-roll apparatus is used to manufacture this assembly sheet.

[0044] 7 is a schematic side view showing an example of a roll-to-roll apparatus used in the manufacturing process of the wired circuit board 100. As shown in Fig. 7, the roll-to-roll apparatus 900 includes an unwinding section 901, a winding section 902, and a plurality of processing sections 910, 920, .... First, a roll (unwinding roll) R1 around which a long base member BM is wound is prepared and set in the unwinding section 901 of the roll-to-roll apparatus 900.

[0045] A base member BM is unwound from a prepared unwound roll R1, and then wound onto another roll (winding roll) R2 set in a winding section 902, as indicated by the dotted arrow in FIG.

[0046] In the roll-to-roll apparatus 900, a plurality of processing sections 910, 920, ... are arranged between two rolls (R1, R2) in the direction of movement of the base member BM. The plurality of processing sections 910, 920, ... perform various processes on respective regions of the long base member BM moving between the two rolls (R1, R2). As a result, an assembly sheet 500 is produced as each region of the base member BM passes through the plurality of processing sections 910, 920, ..., and the produced assembly sheet 500 is taken up on the take-up roll R2.

[0047] Fig. 8 is a perspective view showing an example of an assembly sheet 500 according to an embodiment of the present invention. Fig. 8 shows the assembly sheet 500 in a state in which it is wound around the winding roll R2 of Fig. 7. The assembly sheet 500 has a plurality of wired circuit boards 100 regularly arranged thereon.

[0048] Figure 9 is a partially enlarged top view of the assembly sheet 500 in Figure 8. As shown in Figure 9, the assembly sheet 500 unrolled from the winding roll R2 has a long shape. In the following description, the direction parallel to a pair of short sides of the assembly sheet 500 (the short-side direction of the assembly sheet 500) is referred to as the X direction. Furthermore, the direction parallel to the other pair of long sides of the assembly sheet 500 (the long-side direction of the assembly sheet 500) is referred to as the Y direction. Furthermore, the direction perpendicular to the assembly sheet 500 is referred to as the Z direction. In Figures 8 and 9, the X direction, Y direction, and Z direction are indicated by arrows X, Y, and Z, respectively.

[0049] The assembly sheet 500 includes a plurality of wired circuit boards 100, a frame 510, and an insulating layer 600. The assembly sheet 500 also includes a cover insulating layer (not shown). The frame 510 is formed from the same material as the support 10 of the wired circuit board 100, and includes an outer frame 511 and a plurality of inner frames 512. The outer frame 511 is a rectangular frame having a pair of short sides extending in the X direction and a pair of long sides extending in the Y direction. The plurality of inner frames 512 are formed in a mesh pattern so as to divide the interior area of ​​the outer frame 511 into a plurality of squares corresponding to the sizes of the respective wired circuit boards 100.

[0050] Insulating layer 600 is formed from the same material as insulating layer 20 of wired circuit board 100, and is provided so as to cover frame body 510. In assembly sheet 500, a plurality of wired circuit boards 100 are arranged in a plurality of rectangular regions (compartment regions) defined by outer frame 511 and inner frame 512 of frame body 510. Cover insulating layers (not shown) are formed so as to cover partial regions of the upper and lower surfaces of wired circuit board 100.

[0051] In each partitioned region, both ends of the wired circuit board 100 in the Y direction are supported by a pair of bridges 513, either on the short sides of the outer frame 511 or on the plurality of inner frames 512. After the assembly sheet 500 is manufactured, the bridges 513 are cut to remove the wired circuit boards 100 in each partitioned region, thereby separating each wired circuit board 100 from the frame body 510.

[0052] 10 to 14 are process diagrams illustrating an example of a manufacturing method for the assembly sheet 500 of Fig. 8. In Fig. 10 to 14, a partially enlarged top view of the assembly sheet 500 is shown in the upper left portion, a cross-sectional view of the assembly sheet 500 taken along line CC is shown in the upper center portion, and a cross-sectional view of the assembly sheet 500 taken along line DD is shown in the upper right portion. Furthermore, a cross-sectional view of the assembly sheet 500 taken along line EE is shown in the lower left portion.

[0053] First, as shown in Fig. 10, a two-layer base material consisting of a support layer LA1 and a lower insulating layer LA2 is prepared as the base member BM. The support layer LA1 is made of the same material as the support body 10 of the wiring circuit board 100. The lower insulating layer LA2 is made of the same material as the insulating layer 20 of the wiring circuit board 100.

[0054] Next, as shown in FIG. 11 , unnecessary portions of the support layer LA1 in FIG. 10 are removed to form a frame body 510, a plurality of bridges 513, and a plurality of supports 10 (supports 10 of the printed circuit board 100). If the support layer LA1 is made of a metal material, the unnecessary portions of the support layer LA1 can be removed by etching using an etching resist, for example. Note that if the support layer LA1 is made of a photosensitive resin or the like, the frame body 510, the plurality of bridges 513, and the plurality of supports 10 may be formed using photolithography techniques. In FIG. 11 , the frame body 510, the plurality of bridges 513, and the plurality of supports 10 are hatched to make their shapes easier to understand.

[0055] 12, an upper insulating layer LA3 is formed on the upper surface of the lower insulating layer LA2 so as to cover the frame 510, the plurality of bridges 513, and the plurality of supports 10 (supports 10 of the wired circuit board 100). The upper insulating layer LA3 can be formed, for example, by applying a photosensitive resin precursor to the upper surface of the lower insulating layer LA2, and exposing and developing the photosensitive resin precursor.

[0056] As a result, the lower insulating layer LA2 and the upper insulating layer LA3 located inside the partitioned regions constitute the insulating layer 20 of the multiple wired circuit boards 100. The lower insulating layer LA2 and the upper insulating layer LA3 located outside the partitioned regions constitute the insulating layer 600 in Fig. 9. In Figs. 12, 13, and 14, the outer edge of the portion of each partitioned region where the wired circuit boards 100 are to be formed, i.e., the boundary between the portion where each wired circuit board 100 is to be removed from the assembly sheet 500 and the remaining portion, is indicated by a two-dot chain line.

[0057] The plurality of support bodies 10 constituting the plurality of wired circuit boards 100 each have a first through hole 19 in the center. Therefore, when the upper insulating layer LA3 is formed, the upper insulating layer LA3 is formed in a concave shape inside the first through hole 19 of the support body 10, as shown in the cross section of line CC in Figure 12. In other words, a depression in the upper insulating layer LA3 (insulating layer 20) is formed inside the first through hole 19.

[0058] After the upper insulating layer LA3 is formed in the step of Fig. 12, second through holes 29 are formed in the insulating layer 20 so as to pass through the inside of the first through holes 19 of each support body 10, as shown in Fig. 13. The second through holes 29 are formed by, for example, laser processing. The second through holes 29 may also be formed by mechanical processing such as cutting or punching. In this case, the second through holes 29 are formed to have a size slightly smaller than the recesses in the first through holes 19 of the upper insulating layer LA3 (insulating layer 20) of Fig. 12, for example.

[0059] 14 , a conductor layer is formed in a predetermined pattern on the surface of the insulating layer 20 in each partitioned region to form the first conductor layer 30 and the second conductor layer 40 of each printed circuit board 100. The first conductor layer 30 and the second conductor layer 40 are formed, for example, by a semi-additive method using the above-mentioned seed layer. The first conductor layer 30 and the second conductor layer 40 may be formed by either an additive method or a semi-additive method.

[0060] Thereafter, in each partitioned region, cover insulating layers 50, 60 are formed on the upper and lower surfaces of the insulating layer 20, respectively, excluding the areas where the second through-holes 29 and the pads (33a, 33b, 43a, 43b) are formed. This completes the formation of multiple wired circuit boards 100, which are integrally supported by the insulating layer 600 and the frame 510. In other words, the assembly sheet 500 of FIG. 1 is completed. The assembly sheet 500 allows the multiple wired circuit boards 100 to be handled as a single unit.

[0061] On each of the plurality of wired circuit boards 100 integrated by the assembly sheet 500, a mounting target 200 can be mounted before being separated from the assembly sheet 500. In this case, mounting of the mounting target 200 on each wired circuit board 100 is also performed by the roll-to-roll method, thereby improving the manufacturing efficiency of the plurality of mounting boards 120 ( FIG. 5 ).

[0062] Fig. 15 is a partially enlarged top view showing a state in which a plurality of devices to be mounted 200 are mounted on each of a plurality of wired circuit boards 100 of the assembly sheet 500. The top view of Fig. 15 corresponds to the top view of Fig. 9. As shown in Fig. 15, the assembly sheet 500 of this example makes it possible to handle a plurality of mounting boards 120 as a unit. As shown by the two-dot chain lines in Fig. 15, the plurality of mounting boards 120 can be separated from the assembly sheet 500 by cutting the outer edges of the mounting boards 120 within each partitioned area.

[0063] 4. Effects of the Embodiment (a) In the above-described wired circuit board 100, the component to be mounted 200 can be placed inside the second through hole 29 of the insulating layer 20. Furthermore, the mounting terminal portion 31 of the first conductor layer 30 and the mounting terminal portion 41 of the second conductor layer 40 are formed on part of the inner circumferential surface 28 of the second through hole 29. This allows the component to be mounted 200 to be electrically connected to the first conductor layer 30 and the second conductor layer 40 inside the second through hole 29. In this manner, the component to be mounted 200 is mounted inside the second through hole 29. In this case, compared to when the component to be mounted 200 is mounted on the upper or lower surface of the wired circuit board 100, a thinner mounting board 120 is achieved in which the wired circuit board 100 and the component to be mounted 200 are integrally connected.

[0064] Furthermore, in the above-described wired circuit board 100, the support 10 has higher rigidity than the insulating layer 20, the first conductor layer 30, and the second conductor layer 40. Therefore, the wired circuit board 100 has higher reliability in terms of mechanical strength than a wired circuit board consisting of only the insulating layer 20, the first conductor layer 30, and the second conductor layer 40.

[0065] As a result, the printed circuit board 100 makes it possible to reduce the thickness of the mounting board 120 produced by mounting the mounting target item 200, and also makes it possible to obtain high reliability in terms of mechanical strength.

[0066] (b) As described above, the support 10 may be formed of a metal material. When the support 10 is formed of a metal material, it is easier to ensure the strength of the support 10 compared to when the support 10 is formed of a resin. Alternatively, the support 10 may be formed of a resin. When the support 10 is formed of a resin, using an insulating resin as the resin makes it possible to directly form the first conductor layer 30 and the second conductor layer 40 on the support 10.

[0067] (c) A mounting terminal portion 31 of the first conductor layer 30 and a mounting terminal portion 41 of the second conductor layer 40 are formed opposite each other on the inner peripheral surface 28 of the second through hole 29 of the wired circuit board 100. The mounting terminal portions 31, 41 are arranged opposite the first terminal portion 201 and the second terminal portion 202 of the mounting target 200, respectively, when the mounting target 200 is accommodated in the second through hole 29.

[0068] This makes it easier to connect the first terminal portion 201 and the second terminal portion 202 of the mounting target 200 to the mounting terminal portions 31 and 41 when the mounting target 200 is mounted on the wired circuit board 100 .

[0069] (d) In the above-described wired circuit board 100, two wiring portions (32a, 32b) are formed so as to extend from the mounting terminal portion 31 in the second through hole 29 to the upper and lower surfaces of the wired circuit board 100. In addition, two wiring portions (42a, 42b) are formed so as to extend from the mounting terminal portion 41 in the second through hole 29 to the upper and lower surfaces of the wired circuit board 100. This ensures multiple conductive paths to the mounting target 200 to be mounted in the second through hole 29. Therefore, the degree of freedom in the layout of wiring for the mounting target 200 is improved. Furthermore, according to the above-described configuration, the mounting terminal portions 31, 41 are formed on part of the inner circumferential surface 28 of the second through hole 29, so that the area of ​​the connection portion for the mounting target 200 is ensured, and the reliability of the connection between the wired circuit board 100 and the mounting target 200 is also improved.

[0070] 5. Other Embodiments (a) In the assembly sheet 500 according to the above embodiment, the support 10 and frame 510 of each wired circuit board 100 are connected by two bridges 513, but the present invention is not limited to this. The support 10 and frame 510 of each wired circuit board 100 are formed on a common lower insulating layer LA2 ( FIG. 12 ) and are covered by a common upper insulating layer LA3 ( FIG. 12 ). Therefore, as long as the lower insulating layer LA2 and the upper insulating layer LA3 have sufficient rigidity to support the support 10 and frame 510 in a roll-to-roll manufacturing process, the bridges 513 do not have to be provided.

[0071] Fig. 16 is a partially enlarged top view of an assembly sheet 500 according to another embodiment of the present invention. The top view of Fig. 16 corresponds to the top view of Fig. 9. As shown in Fig. 16, in the assembly sheet 500 of this example, there are no bridges 513 between each of the multiple wired circuit boards 100 and the frame 510. Therefore, when each wired circuit board 100 is removed from the assembly sheet 500, mechanical loads, work loads, etc. are reduced.

[0072] (b) In the wired circuit board 100 according to the above embodiment, a step is formed on the inner circumferential surface 28 of the second through hole 29 in the insulating layer 20, but the present invention is not limited to this. The inner circumferential surface 28 of the second through hole 29 does not necessarily have to have a step.

[0073] 17 is a top view and a cross-sectional view of a printed circuit board 100 according to another embodiment of the present invention. In FIG. 17, a top view of the printed circuit board 100 is shown in the upper part, and a cross-sectional view of the printed circuit board 100 on the upper part taken along line F-F is shown in the lower part.

[0074] 17 , no steps are formed on the inner peripheral surface 28 of the second through hole 29 in this example. In this case, the surfaces (surfaces facing inward of the second through hole 29) of the mounting terminal portion 31 of the first conductor layer 30 and the mounting terminal portion 41 of the second conductor layer 40 formed on the inner peripheral surface 28 can be flattened over a wider range. This makes it easier to join the terminal portions when mounting the mounting target 200.

[0075] (c) In the wired circuit board 100 according to the above embodiment, the insulating layer 20 is provided so as to cover the outer surface of the support 10, but the present invention is not limited to this. When an insulating material is used as the material of the support 10, the insulating layer 20 does not need to be provided on the wired circuit board 100.

[0076] 18 is a top view and a cross-sectional view of a printed circuit board 100 according to still another embodiment of the present invention. In Fig. 18, a top view of the printed circuit board 100 is shown in the upper part, and a cross-sectional view of the printed circuit board 100 on the upper part taken along line G-G is shown in the lower part.

[0077] In the wired circuit board 100 of this example, the support 10 is made of, for example, an insulating resin or an insulating material containing a resin. In this case, as shown in Fig. 18, it is possible to form the first conductor layer 30 and the second conductor layer 40 directly on the surface of the support 10. This makes it possible to further reduce the thickness of the wired circuit board 100 and to reduce the number of manufacturing steps for the wired circuit board 100.

[0078] (d) In the wired circuit board 100 according to the above embodiment, the insulating layer 20 is formed so as to cover the entire outer surface of the support 10, but the present invention is not limited to this. For example, when the support 10 is formed of a conductive material, the insulating layer 20 only needs to ensure insulation between the two conductor layers (30, 40) and the support 10. Therefore, the insulating layer 20 only needs to be formed on at least the portion of the outer surface of the support 10 where the two conductor layers (30, 40) are formed. In other words, the insulating layer 20 may be formed only on a portion of the outer surface of the support 10.

[0079] (e) In the wired circuit board 100 according to the above embodiment, the cover insulating layers 50, 60 that cover parts of the first conductor layer 30 and the second conductor layer 40 are formed on the upper and lower surfaces of the insulating layer 20, but the present invention is not limited to this. If a material with excellent corrosion resistance is used for the first conductor layer 30 and the second conductor layer 40, the cover insulating layers 50, 60 may not be provided.

[0080] (f) In the wired circuit board 100 before the mounting target 200 is mounted, the surfaces of the mounting terminal portions 31, 41 facing inward of the second through-hole 29 may be subjected to a treatment to impart corrosion resistance. For example, the outer surfaces of the mounting terminal portions 31, 41 may be subjected to a plating treatment with gold or the like.

[0081] (g) Although the wired circuit board 100 according to the above embodiment is an FPC board, the present invention is not limited to this. The wired circuit board 100 may be a rigid board that cannot be wound around a roll and is used in a roll-to-roll system.

[0082] (h) In the wired circuit board 100 according to the above embodiment, the upper wiring portion 32a of the first conductor layer 30 and the upper wiring portion 42a of the second conductor layer 40 are formed on the upper surface. In addition, the lower wiring portion 32b of the first conductor layer 30 and the lower wiring portion 42b of the second conductor layer 40 are formed on the lower surface. However, the present invention is not limited to this. In the wired circuit board 100, it is sufficient that the wiring portion of either the first conductor layer 30 or the second conductor layer 40 is formed on at least one of the upper surface and the lower surface.

[0083] (i) In the wired circuit board 100 according to the above embodiment, when the component to be mounted 200 is mounted, a gap 29G is formed between a part of the inner circumferential surface 28 of the second through hole 29 and the component to be mounted 200, but the present invention is not limited to this. The second through hole 29 of the wired circuit board 100 may be formed so that no gap is formed between the inner circumferential surface 28 and the component to be mounted 200 when the component to be mounted 200 is mounted.

[0084] (j) In the wired circuit board 100 according to the above embodiment, the first through hole 19 and the second through hole 29 have a rectangular shape in top view, but the present invention is not limited to this. The first through hole 19 and the second through hole 29 may have a shape other than a rectangular shape in top view, such as a circular shape, an elliptical shape, or a triangular shape.

[0085] (k) In one roll-to-roll apparatus 900 used in the above embodiment, all steps for producing the assembly sheet 500 are performed. That is, one roll-to-roll apparatus 900 includes a plurality of devices corresponding to all steps for producing the wired circuit board 100. However, the present invention is not limited to this.

[0086] The multiple steps for producing the assembly sheet 500 may be performed by multiple roll-to-roll devices. For example, the first half of the series of steps for producing the wired circuit board 100 may be performed by one roll-to-roll device, and the second half of the steps may be performed by another roll-to-roll device. Also, the multiple steps for producing the assembly sheet 500 may be performed using three or more roll-to-roll devices. Furthermore, only some of the multiple steps for producing the assembly sheet 500 may be performed by a roll-to-roll device.

[0087] (l) In the above embodiment, the wired circuit board 100 is manufactured by a roll-to-roll process, but the present invention is not limited to this. The wired circuit board 100 may be manufactured by a process other than the roll-to-roll process. For example, the wired circuit board 100 may be manufactured by a sheet-by-sheet process in which processing is performed sequentially on a single sheet.

[0088] 6. Correspondence between each element of the claims and each part of the embodiment Examples of correspondence between each element of the claims and each element of the embodiment are described below, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each element of the claims.

[0089] In the above embodiment, the mounting target 200 is an example of an electrical element, the wired circuit board 100 is an example of a wired circuit board, the support upper surface 11 of the support 10 is an example of a first surface, the support lower surface 12 of the support 10 is an example of a second surface, the first through hole 19 is an example of a first through hole, and the support 10 is an example of a support layer.

[0090] Furthermore, the insulating layer 20 is an example of an insulating layer, the first conductor layer 30 and the second conductor layer 40 are examples of conductor layers, the second through hole 29 is an example of a second through hole, the inner surface 28 of the second through hole 29 is an example of the inner surface of a second through hole, the target region 28a is an example of a conductor layer forming region, and the non-target region 28b is an example of a conductor layer non-forming region.

[0091] Furthermore, the first terminal portion 201 and the second terminal portion 202 of the mounting target item 200 are examples of terminal portions of electrical elements, the mounting terminal portions 31, 41 are examples of portions of the conductor layer formed in the conductor layer formation region and intermediate conductor layers, the upper wiring portions 32a, 42a are examples of the first wiring portion, the lower wiring portions 32b, 42b are examples of the second wiring portion, the first through hole 19 in Figure 18 is an example of a through hole, and the assembly sheet 500 is an example of a wiring circuit board assembly sheet.

[0092] 7. Summary of Embodiments (Item 1) A wired circuit board according to item 1 is a wired circuit board on which electrical elements are mounted, comprising: a support layer having a first surface and a second surface facing in opposite directions and having a first through hole extending in a thickness direction intersecting the first surface and the second surface; an insulating layer covering at least a part of the first surface, at least a part of the second surface, and an inner circumferential surface of the first through hole; and a conductor layer formed in a predetermined pattern on the insulating layer, wherein the support layer has higher rigidity than the insulating layer and the conductor layer; a portion of the insulating layer covering the inner circumferential surface of the first through hole forms a second through hole extending in the thickness direction inside the first through hole, and the second through hole is formed so that at least a part of the electrical element can be accommodated inside the second through hole, and the inner circumferential surface of the second through hole includes a conductor layer-formed region where the conductor layer is formed and a conductor layer-non-formed region where the conductor layer is not formed.

[0093] In the wired circuit board, at least a portion of the electrical element can be disposed inside the second through hole in the insulating layer. Furthermore, since a conductor layer is formed on a portion of the inner circumferential surface of the second through hole, the electrical element can be electrically connected to the conductor layer inside the second through hole. By mounting the electrical element inside the second through hole in this manner, a thinner configuration (electrical element mounting board) in which the electrical element and the wired circuit board are integrally connected can be achieved compared to mounting the electrical element on the first surface or the second surface.

[0094] Furthermore, since the support layer of the above-described wired circuit board has higher rigidity than the insulating layer and the conductor layer, the wired circuit board has higher reliability in terms of mechanical strength than a wired circuit board consisting only of an insulating layer and a conductor layer.

[0095] As a result, when the electrical elements are mounted, the structure including the electrical elements can be made thinner and can be made highly reliable in terms of mechanical strength.

[0096] (Item 2) In the wired circuit board according to item 1, the support layer may be formed of metal or resin.

[0097] When the support layer is made of metal, it is easier to ensure the strength of the support layer compared to when the support layer is made of resin. On the other hand, when the support layer is made of resin, by using an insulating resin as the resin, it becomes possible to form a conductor layer directly on the support layer.

[0098] (Clause 3) In the wired circuit board according to clause 1 or 2, the electrical element may have a terminal portion, and the portion of the conductor layer formed in the conductor layer formation region may face the terminal portion of the electrical element with at least a portion of the electrical element housed within the second through hole.

[0099] In this case, with at least a portion of the electrical element placed inside the second through hole of the insulating layer, the terminal portion of the electrical element can be easily connected to the portion of the conductor layer formed on the inner surface of the second through hole.

[0100] (4) In the wired circuit board according to any one of paragraphs 1 to 3, the conductor layer may include a first wiring portion formed on the first surface via the insulating layer, a second wiring portion formed on the second surface via the insulating layer, and an intermediate conductor portion formed inside the second through hole, and the first wiring portion and the second wiring portion may be electrically connected to the intermediate conductor portion.

[0101] In this case, with the electrical element mounted inside the second through hole, an electrical conduction path for the electrical element can be secured on the first surface and the second surface of the support layer, thereby improving the degree of freedom in the layout of the wiring for the electrical element to be mounted.

[0102] (Item 5) In the wired circuit board according to any one of items 1 to 4, the conductive layer non-forming area may be spaced apart from the electrical element with at least a portion of the electrical element housed in the second through hole.

[0103] In this case, when mounting an electrical component on the wiring circuit board, a gap is formed between the conductive layer-free region of the second through hole and the electrical component. This gap can be used as a working space when mounting the electrical component on the wiring circuit board. Furthermore, this gap can also be used as a working space when removing the electrical component from the wiring circuit board on which the electrical component is mounted. This facilitates mounting and removing electrical components on the wiring circuit board.

[0104] (Item 6) The wired circuit board according to item 6 is a wired circuit board on which electrical elements are mounted, and comprises: a support layer formed of an insulating material, having a first surface and a second surface facing in opposite directions and having a through hole extending from the first surface to the second surface; and a conductor layer formed in a predetermined pattern on the support layer, wherein the support layer has higher rigidity than the conductor layer, the through hole is formed so that at least a part of the electrical element can be accommodated inside the through hole, and the inner surface of the through hole includes a conductor layer forming region where the conductor layer is formed and a conductor layer non-forming region where the conductor layer is not formed.

[0105] In the wired circuit board, at least a portion of the electrical element can be disposed inside the through hole of the support layer. Furthermore, since a conductor layer is formed on a portion of the inner circumferential surface of the through hole, the electrical element can be electrically connected to the conductor layer inside the through hole. By mounting the electrical element inside the through hole in this manner, a thinner configuration (electrical element mounting board) in which the electrical element and the wired circuit board are integrally connected can be achieved compared to mounting the electrical element on the first or second surface.

[0106] Furthermore, since the support layer of the above-mentioned wired circuit board has higher rigidity than the conductor layer, it has higher reliability in terms of mechanical strength than a wired circuit board consisting only of an insulating layer and a conductor layer, which has lower rigidity than the conductor layer.

[0107] As a result, when the electrical elements are mounted, the structure including the electrical elements can be made thinner and can be made highly reliable in terms of mechanical strength.

[0108] (Item 7) A wired circuit board assembly sheet according to Item 7 includes a plurality of the wired circuit boards according to any one of Items 1 to 6, and has a configuration in which the plurality of wired circuit boards are integrally provided.

[0109] In this case, a plurality of printed circuit boards can be handled as a single unit.

Claims

1. A wired circuit board on which an electrical element is mounted, comprising: a support layer having a first surface and a second surface facing in opposite directions and having a first through hole extending in a thickness direction intersecting the first surface and the second surface; an insulating layer covering at least a portion of the first surface, at least a portion of the second surface, and an inner surface of the first through hole; and a conductor layer formed in a predetermined pattern on the insulating layer, wherein the support layer has a higher rigidity than the insulating layer and the conductor layer; a portion of the insulating layer covering the inner surface of the first through hole forms a second through hole extending in the thickness direction inside the first through hole, the second through hole being formed so that at least a portion of the electrical element can be accommodated inside the second through hole, and the inner surface of the second through hole includes a conductor layer formed region where the conductor layer is formed and a conductor layer non-formed region where the conductor layer is not formed.

2. The printed circuit board according to claim 1, wherein said support layer is made of metal or resin.

3. A wired circuit board as claimed in claim 1 or 2, wherein the electrical element has a terminal portion, and a portion of the conductor layer formed in the conductor layer formation region faces the terminal portion of the electrical element with at least a portion of the electrical element accommodated within the second through hole.

4. A wired circuit board as claimed in any one of claims 1 to 3, wherein the conductor layer includes a first wiring portion formed on the first surface via the insulating layer, a second wiring portion formed on the second surface via the insulating layer, and an intermediate conductor portion formed inside the second through hole, and the first wiring portion and the second wiring portion are electrically connected to the intermediate conductor portion.

5. A wired circuit board according to any one of claims 1 to 4, wherein the non-conductor layer forming area is spaced apart from the electrical element with at least a portion of the electrical element accommodated in the second through hole.

6. A wired circuit board on which an electrical element is mounted, comprising: a support layer formed of an insulating material and having a first surface and a second surface facing in opposite directions and having a through hole extending from the first surface to the second surface; and a conductor layer formed in a predetermined pattern on the support layer, wherein the support layer has a higher rigidity than the conductor layer, the through hole is formed so that at least a part of the electrical element can be accommodated inside the through hole, and the inner surface of the through hole includes a conductor layer formation region where the conductor layer is formed and a conductor layer non-formation region where the conductor layer is not formed.

7. A wired circuit board assembly sheet comprising a plurality of the wired circuit boards according to any one of claims 1 to 6, said plurality of wired circuit boards being integrally arranged.

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