Organopolysiloxane, organopolysiloxane composition, cured product thereof, organopolysiloxane for near-infrared optical waveguide, organopolysiloxane composition for near-infrared optical waveguide, cured product for near-infrared optical waveguide, near-infrared optical waveguide, near-infrared optical transmission member, and near-infrared optical waveguide production method

Abstract

Provided are: an organopolysiloxane having a specific structure, and having a polymerizable alkenyl group-containing organic group and Q unit silicon (SiO4 / 2); and a non-linear organopolysiloxane having a specific structure, having a polymerizable alkenyl group-containing organic group, and having no aromatic structure.

Description

Organopolysiloxane, organopolysiloxane composition and cured product thereof, organopolysiloxane for near-infrared optical waveguide, organopolysiloxane composition for near-infrared optical waveguide, cured product for near-infrared optical waveguide, near-infrared optical waveguide and near-infrared optical transmission component, and method for producing near-infrared optical waveguide

[0001] The present invention relates to an organopolysiloxane, an organopolysiloxane composition and a cured product thereof, an organopolysiloxane for a near-infrared optical waveguide, an organopolysiloxane composition for a near-infrared optical waveguide, a cured product for a near-infrared optical waveguide, a near-infrared optical waveguide and a near-infrared light transmission component, and a method for producing a near-infrared optical waveguide.

[0002] In recent years, there has been an increasing demand for faster, larger capacity, and lower power consumption communications and signal transmission, and technology that transmits signals using light instead of conventional electricity has also attracted attention in the internal wiring of devices. Such short-distance optical communication technology is called optical interconnect, and its components include replacing part of the copper electrical wiring on a printed wiring board with optical wiring using optical fiber or optical waveguides.

[0003] The development of such optical-electrical composite substrates is actively underway, and optical waveguides that can be connected to near-infrared single-mode silica-based optical fibers are particularly sought after in data center equipment. Materials used to fabricate such optical waveguides are required to be microfabricable using photolithography, heat-resistant enough to withstand the reflow process during assembly, and have low transmission loss at near-infrared wavelengths of 700 to 2500 nm. In addition, in order to reduce connection loss due to reflection at the silica-based optical fiber / optical waveguide interface, the materials must have a refractive index of approximately 1.4 to 1.5 at near-infrared wavelengths after curing, which is equivalent to that of the core-forming material of near-infrared single-mode silica-based optical fibers. Furthermore, in the case of single-mode waveguides, the difference in refractive index between the core material and the cladding material constituting the optical waveguide is approximately 0.01 to 0.02, and the cladding material used around the core material is also required to have a refractive index of approximately 1.4 to 1.5 at near-infrared wavelengths, which is equivalent to that of the core-forming material of near-infrared single-mode silica-based optical fibers. One possible material that meets these requirements is organopolysiloxanes that have reactive groups, but it is difficult to achieve both heat resistance after curing and a refractive index of approximately 1.4 to 1.5 at near-infrared wavelengths.

[0004] For example, Patent Document 1 discloses an organopolysiloxane having an aromatic ring structure, and the cured resin exhibits excellent heat resistance. However, the organopolysiloxane disclosed in Patent Document 1 adjusts the refractive index by adjusting the ratio of aliphatic hydrocarbon groups to aromatic hydrocarbon groups, and the presence of an aromatic ring structure allows the cured resin to exhibit excellent heat resistance. However, no organopolysiloxane has been obtained that maintains heat resistance while having a refractive index of less than 1.5. Furthermore, Patent Document 2 discloses an organopolysiloxane having fluorine atoms, and it is believed that by adjusting the amount of fluorine atoms introduced, it is possible to achieve a refractive index of 1.463 to 1.467 after curing. However, there are concerns about deterioration in heat resistance and even adhesion to the substrate.

[0005] Japanese Patent Application Laid-Open No. 2005-163009 International Publication No. 2001 / 004186

[0006] In response to the above-mentioned problems, the present invention aims to provide a core material that is suitable for fine processing by photolithography, has heat resistance sufficient to withstand the reflow process during mounting, and can reduce connection loss due to reflection at the silica-based optical fiber / optical waveguide interface, and a clad material to be used around the core material, and an organopolysiloxane having a polymerizable alkenyl group. The present invention also relates to a method for producing a near-infrared optical waveguide having one or more layers containing a cured product of the organopolysiloxane.

[0007] As a result of extensive research aimed at solving these problems, the present inventors have discovered that organopolysiloxanes having specific structures and compositions can solve the problems of the present application. The present invention was completed based on this finding. Specifically, the present invention relates to the following:

[0008] (1) An organopolysiloxane represented by the following general formula [1]: (R １ R ２ R ３ SiO １／２ ) Ｍ１ (R ４ R ５ R ６ SiO １／２ ) Ｍ２ (R ７ R ８ SiO ２／２ ) Ｄ１ (R ９ R ６ SiO ２／２ ) Ｄ２ (R １０ SiO ３／２ ) Ｔ１ (R ６ SiO ３／２ ) Ｔ２ (SiO ４／２ ) Ｑ (O １／２ R １１ ) Ｙ１ (O １／２ R ６ ) Ｙ２ ... [1] [In the above formula [1], R １ ~R ５ , R ７ ~R １１R are each independently one or more groups selected from an organic group, a reactive functional group, or a hydrogen atom. １ ~R ３ , R ７ , R ８ , R １０ and R １１ does not contain a polymerizable alkenyl group. ６ are one or more organic groups containing a polymerizable alkenyl group, and may be the same or different, and 0≦M1, D1, T1, Y1, Y2, 0<Q, 0<M2+D2+T2≦0.25, 0.05<Y1, and M1+M2+D1+D2+T1+T2+Q=1.] (2) A non-linear organopolysiloxane represented by the following general formula

[21] , which does not have an aromatic structure. (R ２－１ R ２－２ R ２－３ SiO １／２ ) Ｍ１ (R ２－４ R ２－５ R ２－６ SiO １／２ ) Ｍ２ (R ２－７ R ２－８ SiO ２／２ ) Ｄ１ (R ２－９ R ２－６ SiO ２／２ ) Ｄ２ (R ２－１０ SiO ３／２ ) Ｔ１ (R ２－６ SiO ３／２ ) Ｔ２ (SiO ４／２ ) Ｑ１ (O １／２ R ２－１１ ) Ｙ１ (O １／２ R ２－６ ) Ｙ２ ...

[21] [In the above formula

[21] , R ２－１ ~R ２－５ , R ２－７ ~R ２－１１ R are each independently one or more groups selected from an organic group, a reactive functional group, or a hydrogen atom. ２－１ ~R ２－３ , R ２－７ , R２－８ , R ２－１０ and R ２－１１ does not contain a polymerizable alkenyl group. ２－６ are one or more organic groups containing a polymerizable alkenyl group, which may be the same or different, and 0≦M1, D1, T1, Y1, Y2, 0<M2+D2+T2≦0.25, 0.05<Y1, M1+M2+D1+D2+T1+T2+Q=1.] (3) An organopolysiloxane according to item (1) or (2) above, wherein in formula [1] or formula

[21] , 0.12<M2+D2+T2≦0.25. (4) An organopolysiloxane according to any one of items (1) to (3) above, wherein in formula [1] or formula

[21] , Y1≦0.25. (5) An organopolysiloxane according to any one of items (2) to (4) above, wherein in formula

[21] , 0<Q. (6) An organopolysiloxane according to any one of the above items (1) to (5), wherein Q satisfies 0.04≦Q in the formula [1] or formula

[21] . (7) An organopolysiloxane according to any one of the above items (1) to (6), wherein M1+M2<0.50 in the formula [1] or formula

[21] . (8) An organopolysiloxane according to any one of the above items (1), (3) to (7), which does not have an aromatic structure. (9) In the formula [1] or formula

[21] , the R ６ or R ２－６ and wherein the organopolysiloxane according to any one of items (1) to (8) above has in one molecule one or more functional groups selected from the group represented by the following formulas [2] to [5]: (In the above formula, X is a divalent organic group, and may have a branched structure and / or a cyclic structure. When X is bonded to a silicon atom, the atom at the end of X that is directly bonded to the silicon is a carbon atom. When X is bonded to an oxygen atom that is directly bonded to the silicon, the atom at the end of X that is directly bonded to the oxygen atom is a carbon atom. * indicates a bond.) (10) ６ or R ２－６is a (meth)acryloyloxypropyl group. (11) An organopolysiloxane composition comprising the organopolysiloxane according to any one of items (1) to (10) above and at least a polymerization initiator. (12) A cured product obtained by curing the organopolysiloxane composition according to item (11) above. (13) A near-infrared optical waveguide produced using the organopolysiloxane composition according to item (11) above. (14) A near-infrared optical waveguide comprising a core and a clad, the core and the clad being produced using the organopolysiloxane composition according to item (11) above. (15) A near-infrared optical transmission component comprising at least the near-infrared optical waveguide according to item (13) above. (16) A near-infrared light transmission component comprising at least the near-infrared light waveguide according to item (14).

[0009] (17) A method for producing a near-infrared optical waveguide comprising, in this order: a step (i-1) of applying a first curable polymer composition to a substrate surface to form a first polymer layer, a step (i-2) of irradiating at least one selected region of the first polymer layer with actinic energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region, and a step (i-3) of removing the unexposed region of the partially exposed layer with a solvent to form a patterned core, wherein the first curable polymer composition is the organopolysiloxane composition according to item (11). (18) A method for producing a near-infrared optical waveguide according to item (17), further comprising: a step (i-4) of coating the substrate surface and the core with a second curable polymer composition to form a second polymer layer, and a step (i-5) of curing the second polymer layer to form an upper clad. (19) The method for producing a near-infrared optical waveguide according to the above item (18), wherein the second curable polymer composition is the organopolysiloxane composition according to the above item (11). (20) A method for producing a near-infrared optical waveguide, comprising the steps of: (ii-1) applying a third curable polymer composition to a substrate surface to form a third polymer layer; (ii-2) irradiating at least one selected region of the third polymer layer with active energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region; (ii-3) removing the unexposed region of the partially exposed layer with a solvent to form a patterned core; (ii-4) coating the substrate surface and the core with a fourth curable polymer composition to form a fourth polymer layer; and (ii-5) curing the fourth polymer layer to form an upper clad, in this order; wherein at least one of the third curable polymer composition and the fourth curable polymer composition is the organopolysiloxane composition according to item (11). (21) The method for producing a near-infrared optical waveguide according to item (20), wherein both the third curable polymer composition and the fourth curable polymer composition are the organopolysiloxane composition according to item (11).(22) A method for producing a near-infrared optical waveguide, comprising the steps of: (iii-1) applying a fifth curable polymer composition to a substrate surface to form a fifth polymer layer; (iii-2) curing the fifth polymer layer to form a lower clad; (iii-3) applying a sixth curable polymer composition onto the lower clad to form a sixth polymer layer; (iii-4) irradiating at least one selected region of the sixth polymer layer with active energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region; and (iii-5) removing the unexposed region of the partially exposed layer with a solvent to form a patterned core, in this order; wherein at least one of the fifth curable polymer composition and the sixth curable polymer composition is the organopolysiloxane composition according to item (11). (23) The method for producing a near-infrared optical waveguide according to item (22), wherein both the fifth curable polymer composition and the sixth curable polymer composition are the organopolysiloxane composition according to item (11).(24) A method for manufacturing a photoresist-receiving layer, comprising the steps of: (iv-1) applying a fifth curable polymer composition to a substrate surface to form a fifth polymer layer; (iv-2) curing the fifth polymer layer to form a lower clad; (iv-3) applying a sixth curable polymer composition onto the lower clad to form a sixth polymer layer; (iv-4) irradiating at least one selected region of the sixth polymer layer with active energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region; (iv-5) removing the unexposed region of the partially exposed layer with a solvent to form a patterned core; (iv-6) covering the lower clad and the core with a seventh curable polymer composition to form a seventh polymer layer; and (iv-7) curing the seventh polymer layer to form an upper clad, A method for producing a near-infrared optical waveguide, wherein at least one of the fifth curable polymer composition, the sixth curable polymer composition, and the seventh curable polymer composition is the organopolysiloxane composition described in item (11) above. (25) A method for producing a near-infrared optical waveguide, according to item (24) above, wherein all of the fifth curable polymer composition, the sixth curable polymer composition, and the seventh curable polymer composition are the organopolysiloxane compositions described in item (11) above.

[0010] (26) A polymerizable alkenyl-containing organic group and a silicon (SiO ４／２ (27) An organopolysiloxane for a near-infrared optical waveguide according to the above item (26), which is represented by the following general formula [1]: (R １ R ２ R ３ SiO １／２ ) Ｍ１ (R ４ R ５ R ６ SiO １／２ ) Ｍ２ (R ７ R ８ SiO ２／２ ) Ｄ１ (R９ R ６ SiO ２／２ ) Ｄ２ (R １０ SiO ３／２ ) Ｔ１ (R ６ SiO ３／２ ) Ｔ２ (SiO ４／２ ) Ｑ (O １／２ R １１ ) Ｙ１ (O １／２ R ６ ) Ｙ２ ... [1] [In the above formula [1], R １ ~R ５ , R ７ ~R １１ R are each independently one or more groups selected from an organic group, a reactive functional group, or a hydrogen atom. １ ~R ３ , R ７ , R ８ , R １０ and R １１ does not contain a polymerizable alkenyl group. ６ are one or more organic groups containing a polymerizable alkenyl group, which may be the same or different, and 0≦M1, D1, T1, Y1, Y2, 0<Q, 0<M2+D2+T2, and M1+M2+D1+D2+T1+T2+Q=1.] (28) An organopolysiloxane for a near-infrared optical waveguide according to item (27) above, wherein in formula [1], 0<M2+D2+T2≦0.25. (29) An organopolysiloxane for a near-infrared optical waveguide according to item (27) or (28) above, wherein in formula [1], 0.02≦Y1≦0.25. (30) An organopolysiloxane for a near-infrared optical waveguide according to any one of items (27) to (29) above, wherein in formula [1], 0.04≦Q. (31) The organopolysiloxane for a near-infrared optical waveguide according to any one of the above items (27) to (30), wherein in the formula [1], M1+M2<0.50. (32) In the formula [1], ６and wherein the organopolysiloxane for near-infrared optical waveguides according to any one of items (27) to (31) above has one or more functional groups selected from the group represented by the following formulas [2] to [5] in one molecule: (In the formula, X is a divalent organic group which may have a branched structure and / or a cyclic structure. When X is bonded to a silicon atom, the atom at the end of X which is directly bonded to the silicon is a carbon atom. When X is bonded to an oxygen atom which is directly bonded to the silicon, the atom at the end of X which is directly bonded to the oxygen atom is a carbon atom. * indicates a bond.) (33) ６ is a (meth)acryloyloxypropyl group. (34) An organopolysiloxane composition for near-infrared optical waveguides, comprising the organopolysiloxane for near-infrared optical waveguides according to any one of items (26) to (33) above and at least a polymerization initiator. (35) A cured product for near-infrared optical waveguides, obtained by curing the organopolysiloxane composition for near-infrared optical waveguides according to item (34) above. (36) A near-infrared optical waveguide produced using the organopolysiloxane composition for near-infrared optical waveguides according to item (34) above. (37) A near-infrared optical waveguide comprising a core and a clad, wherein the core and the clad are produced using the organopolysiloxane composition for near-infrared optical waveguides according to item (34). (38) A near-infrared optical transmission component comprising at least the near-infrared optical waveguide according to item (36). (39) A near-infrared optical transmission component comprising at least the near-infrared optical waveguide according to item (37).

[0011] (40) A method for producing a near-infrared optical waveguide, comprising, in this order: a step (i-1) of applying a first curable polymer composition to a substrate surface to form a first polymer layer; a step (i-2) of irradiating at least one selected region of the first polymer layer with active energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region; and a step (i-3) of removing the unexposed region of the partially exposed layer with a solvent to form a patterned core, wherein the first curable polymer composition is the organopolysiloxane composition for near-infrared optical waveguides according to item (34). (41) A method for producing a near-infrared optical waveguide according to item (40), further comprising: a step (i-4) of coating the substrate surface and the core with a second curable polymer composition to form a second polymer layer; and a step (i-5) of curing the second polymer layer to form an upper clad. (42) The method for producing a near-infrared optical waveguide according to the above item (41), wherein the second curable polymer composition is the organopolysiloxane composition for a near-infrared waveguide according to the above item (34). (43) A method for producing a near-infrared optical waveguide, comprising the steps of: (ii-1) applying a third curable polymer composition to a substrate surface to form a third polymer layer; (ii-2) irradiating at least one selected region of the third polymer layer with active energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region; (ii-3) removing the unexposed region of the partially exposed layer with a solvent to form a patterned core; (ii-4) coating the substrate surface and the core with a fourth curable polymer composition to form a fourth polymer layer; and (ii-5) curing the fourth polymer layer to form an upper clad, in this order; wherein at least one of the third curable polymer composition and the fourth curable polymer composition is the organopolysiloxane composition for near-infrared waveguides according to item (34).(44) The method for producing a near-infrared optical waveguide according to item (43), wherein both the third curable polymer composition and the fourth curable polymer composition are the organopolysiloxane composition for near-infrared waveguides according to item (34). (45) A method for producing a near-infrared optical waveguide, comprising the steps of: (iii-1) applying a fifth curable polymer composition to a substrate surface to form a fifth polymer layer; (iii-2) curing the fifth polymer layer to form a lower clad; (iii-3) applying a sixth curable polymer composition onto the lower clad to form a sixth polymer layer; (iii-4) irradiating at least one selected region of the sixth polymer layer with active energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region; and (iii-5) removing the unexposed region of the partially exposed layer with a solvent to form a patterned core, in this order; wherein at least one of the fifth curable polymer composition and the sixth curable polymer composition is the organopolysiloxane composition for near-infrared optical waveguides according to item (34). (46) The method for producing a near-infrared optical waveguide according to item (45), wherein both the fifth curable polymer composition and the sixth curable polymer composition are the organopolysiloxane composition for near-infrared optical waveguides according to item (34).(47) A method for manufacturing a photoresist-receiving layer, comprising the steps of: (iv-1) applying a fifth curable polymer composition to a substrate surface to form a fifth polymer layer; (iv-2) curing the fifth polymer layer to form a lower clad; (iv-3) applying a sixth curable polymer composition onto the lower clad to form a sixth polymer layer; (iv-4) irradiating at least one selected region of the sixth polymer layer with active energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region; (iv-5) removing the unexposed region of the partially exposed layer with a solvent to form a patterned core; (iv-6) coating the lower clad and the core with a seventh curable polymer composition to form a seventh polymer layer; and (iv-7) curing the seventh polymer layer to form an upper clad, A method for producing a near-infrared optical waveguide, wherein at least one of the fifth curable polymer composition, the sixth curable polymer composition, and the seventh curable polymer composition is the organopolysiloxane composition for near-infrared optical waveguides described in item (34) above. (48) A method for producing a near-infrared optical waveguide according to item (47) above, wherein all of the fifth curable polymer composition, the sixth curable polymer composition, and the seventh curable polymer composition are the organopolysiloxane compositions for near-infrared optical waveguides described in item (34) above.

[0012] According to the present invention, it is possible to provide an organopolysiloxane having a polymerizable alkenyl group, which is suitable for a core material that has fine processability by photolithography, heat resistance sufficient to withstand the reflow process during mounting, and that can reduce connection loss due to reflection at the interface between a silica-based optical fiber and an optical waveguide, as well as a cladding material used around the core material.

[0013] Fig. 1 is a schematic cross-sectional view of an optical waveguide in which a core is formed on a substrate. Fig. 2 is a schematic cross-sectional view of an optical waveguide in which a core and an upper clad are formed on a substrate. Fig. 3 is a schematic cross-sectional view of an optical waveguide in which a lower clad and a core are formed on a substrate. Fig. 4 is a schematic cross-sectional view of an optical waveguide in which a lower clad, a core, and an upper clad are formed on a substrate.

[0014] The present invention will be described in detail below. Note that the following description is an example of an embodiment of the present invention, and the present invention is not limited to these unless it exceeds the gist of the invention. Furthermore, in the present invention, "(meth)acrylic" means "either one or both of acrylic and methacrylic." In the present invention, a numerical range expressed using "to" means a range that includes the numerical values ​​written before and after "to" as the lower and upper limits.

[0015] [Organopolysiloxane] Hereinafter, the organopolysiloxane of the present invention will be described in terms of a first embodiment and a second embodiment. The first embodiment and the second embodiment may be collectively referred to as "both embodiments."

[0016] <First Aspect> In the first aspect of the present invention (hereinafter, sometimes abbreviated as the present first aspect), the organopolysiloxane contains an organic group containing a polymerizable alkenyl group and a silicon Q unit (SiO ４／２ ) and is used to form near-infrared optical waveguides. By using an organopolysiloxane containing a polymerizable alkenyl group in its structure, a cured product can be easily obtained using a polymerization initiator. Furthermore, by including silicon Q units, the refractive index of the cured product at near-infrared wavelengths can be adjusted to 1.4 to 1.5, and heat resistance can be improved to provide reflow resistance. It is surprising that the above-mentioned effects can be achieved by including a silicon Q unit structure of a multi-branched component, which is generally avoided in most cases because its introduction promotes gelation during synthesis. The organopolysiloxane of this first aspect preferably does not include an aromatic structure, as this would increase the refractive index of the cured product.

[0017] <Second Aspect> In a second aspect of the present invention (hereinafter sometimes abbreviated as "the second aspect"), the organopolysiloxane has an organic group containing a polymerizable alkenyl group and does not have an aromatic structure, and is used to form a near-infrared optical waveguide. By using an organopolysiloxane containing a polymerizable alkenyl group in its structure, a cured product can be easily obtained using a polymerization initiator. Furthermore, by not having an aromatic structure, the refractive index of the cured product at near-infrared wavelengths can be set to 1.40 to 1.48. Furthermore, while maintaining the refractive index of the cured product at near-infrared wavelengths at 1.40 to 1.48, the heat resistance can be improved and the cured product can have reflow resistance. Therefore, the organopolysiloxane of the present invention is a polysiloxane containing a Q silicon unit (SiO ４／２ ) is preferably present.

[0018] The organopolysiloxane of the first embodiment is represented by the following formula [1]: (R １ R ２ R ３ SiO １／２ ) Ｍ１ (R ４ R ５ R ６ SiO １／２ ) Ｍ２ (R ７ R ８ SiO ２／２ ) Ｄ１ (R ９ R ６ SiO ２／２ ) Ｄ２ (R １０ SiO ３／２ ) Ｔ１ (R ６ SiO ３／２ ) Ｔ２ (SiO ４／２ ) Ｑ (O １／２ R １１ ) Ｙ１ (O １／２ R ６ ) Ｙ２ ...[1]

[0019] In the above formula [1], R １ ~R ５ , R ７ ~R １１R are each independently one or more groups selected from an organic group, a reactive functional group, or a hydrogen atom. １ ~R ３ , R ７ , R ８ , R １０ and R １１ does not contain a polymerizable alkenyl group. ６ represents one or more organic groups containing a polymerizable alkenyl group, and may be the same or different.

[0020] The organopolysiloxane of the second embodiment is represented by the following general formula

[21] , and is a non-linear organopolysiloxane that does not have an aromatic structure. (R ２－１ R ２－２ R ２－３ SiO １／２ ) Ｍ１ (R ２－４ R ２－５ R ２－６ SiO １／２ ) Ｍ２ (R ２－７ R ２－８ SiO ２／２ ) Ｄ１ (R ２－９ R ２－６ SiO ２／２ ) Ｄ２ (R ２－１０ SiO ３／２ ) Ｔ１ (R ２－６ SiO ３／２ ) Ｔ２ (SiO ４／２ ) Ｑ (O １／２ R ２－１１ ) Ｙ１ (O １／２ R ２－６ ) Ｙ２ ...

[21]

[0021] In the above formula

[21] , R ２－１ ~R ２－５ , R ２－７ ~R ２－１１ R are each independently one or more groups selected from an organic group, a reactive functional group, or a hydrogen atom, and do not have an aromatic structure. ２－１ ~R ２－３ , R ２－７, R ２－８ , R ２－１０ and R ２－１１ does not contain a polymerizable alkenyl group. ２－６ is one or more organic groups that do not have an aromatic structure and contain a polymerizable alkenyl group, and may be the same or different. In this second embodiment, the organopolysiloxane is nonlinear. This means that at least one of T units and Q units is present.

[0022] The coefficients in formula [1] or formula

[21] respectively have the following values: 0≦M1, D1, T1, Y1, Y2, 0<M2+D2+T2≦0.25, 0.05<Y1, M1+M2+D1+D2+T1+T2+Q=1, and in formula [1], 0<Q.

[0023] In the general formula [1] or formula

[21] , the coefficients M1, M2, D1, D2, T1, T2, and Q represent the proportions (based on the number of moles) of each structure when M1 + M2 + D1 + D2 + T1 + T2 + Q = 1. In the general formula [1] or formula

[21] , the coefficients Y1 and Y2 represent the proportions (based on the number of moles) of each structure when M1 + M2 + D1 + D2 + T1 + T2 + Q = 1. １／２ R １１ ) and (O １／２ R ６ In the general formula [1] or formula

[21] , the coefficients M1 and M2 represent the relative content of silicon atoms, which are so-called M-unit silicon atoms (SiO １／２ Similarly, D1 and D2 represent the proportion of D unit silicon (SiO ２／２ ) (hereinafter sometimes simply referred to as "D units"), and T1 and T2 represent the proportion of T unit silicon (SiO ３／２ ) (hereinafter, sometimes simply referred to as "T units"), and Q represents the proportion of Q-unit silicon (SiO ４／２ M2, D2, and T2 represent the ratio of R to silicon atoms (hereinafter, sometimes simply referred to as "Q units"). ６ or R ２－６, that is, the proportions of M units, D units, and T units to which organic groups containing polymerizable alkenyl groups are bonded. Y1 means the content ratio of alkoxy groups or silanol groups bonded to silicon, and Y2 means the content ratio of organic groups containing polymerizable alkenyl groups bonded to silicon. 0≦M1, 0≦D1, 0≦T1, 0≦Y1, 0≦Y2 means that M1, D1, T1, Y1, and Y2 are each 0 or more, and may be 0, that is, the structural unit may not be present. 0<M2+D2+T2 means that R is not bonded to a silicon atom. ６ or R ２－６ That is, this means that the organopolysiloxane of the present invention has at least one of M units, D units, and T units to which an organic group containing a polymerizable alkenyl group is bonded.

[0024] <Q unit> Q unit silicon (SiO ４／２) is an essential structural unit in the first embodiment, but not in the second embodiment. Q units are the most oxidized form of silicon, and their inclusion in the organopolysiloxane structure can enhance the heat resistance of the cured product. Q units are also contained in quartz, and an organopolysiloxane composition containing Q units, as described below, can be used to obtain a cured product having a refractive index close to that of the core material of a near-infrared single-mode silica-based optical fiber. In the first embodiment, the coefficient Q, which is the content ratio of Q units, is greater than 0, preferably 0.04 or greater, more preferably 0.10 or greater, and even more preferably 0.30 or greater. In the second embodiment, the coefficient Q, which is the content ratio of Q units, is preferably 0 or greater, more preferably 0.04 or greater, even more preferably 0.25 or greater, even more preferably 0.30 or greater, and even more preferably 0.35 or greater, and may even be greater than 0.38. On the other hand, if the Q units are present in a large amount, the composition will become solid or the viscosity will increase, resulting in poor handleability. Therefore, the upper limit of the coefficient Q in both embodiments is usually 0.65 or less, more preferably 0.6 or less, and even more preferably 0.45 or less. As described above, the Q unit in the first embodiment is preferably 0<Q≦0.65, more preferably 0.04≦Q≦0.6, and even more preferably 0.04≦Q≦0.45, and the Q unit in the second embodiment is preferably 0≦Q≦0.65, more preferably 0.04≦Q≦0.6, and even more preferably 0.04≦Q≦0.45.

[0025] <M2 + D2 + T2> In both organopolysiloxane embodiments, when M2 + D2 + T2 is 0<M2 + D2 + T2, the organopolysiloxane contains polymerizable alkenyl groups, making it possible to easily obtain a cured product using a composition containing a polymerization initiator, as described below. If the content of polymerizable alkenyl groups is too low, poor curing may occur during preparation of the cured product, and compatibility with other components added to the organopolysiloxane composition, as described below, may be poor. From these perspectives, it is preferable that M2 + D2 + T2 be 0.10 or less, and it is preferable that M2 + D2 + T2 be 0.12 or less. In the present invention, there are two embodiments for the upper limit of M2 + D2 + T2, as described below, in both embodiments. In the first embodiment, from the viewpoints of micromachining ability, heat resistance, and the effect of reducing connection loss due to reflection at the silica-based optical fiber / optical waveguide interface, M2 + D2 + T2 is preferably set to 0.75 or less, and more preferably M2 + D2 + T2 0.60 or less. By setting the ratio of polymerizable alkenyl groups in this range, it is possible to maintain an appropriate content ratio of polymerizable alkenyl groups and achieve an appropriate crosslink density that does not make the cured product brittle. In the second embodiment, in addition to the above effects, from the viewpoint of obtaining an organopolysiloxane with better heat resistance and a refractive index in the near-infrared wavelength region that is close to the refractive index of the core material of a silica-based optical fiber, M2 + D2 + T2 ≦ 0.25.

[0026] As described above, in the first embodiment of both aspects, preferably 0<M2+D2+T2≦0.75, more preferably 0.10≦M2+D2+T2≦0.75, and even more preferably 0.12≦M2+D2+T2≦0.60; and in the second embodiment of both aspects, 0<M2+D2+T2≦0.25, preferably 0.10≦M2+D2+T2≦0.25, more preferably 0.12≦M2+D2+T2≦0.25, even more preferably 0.12<M2+D2+T2≦0.25, and still more preferably 0.12<M2+D2+T2≦0.20.

[0027] <O １／２ R １１ and O １／２ R ２－１１ > In the first aspect, (O １／２ R １１), and (O １／２ R ２－１１ ) has a structure that does not contain a polymerizable alkenyl group but has a group selected from the group consisting of an organic group, a reactive functional group, and a hydrogen atom, specifically an alkoxy group or a silanol group bonded to a silicon atom, each of which can control the viscosity of the organopolysiloxane and adjust it to a viscosity suitable for molding. Silanol groups have the effect of increasing viscosity, while converting silanol groups to alkoxy groups has the effect of decreasing viscosity. Furthermore, when the total amount of alkoxy groups and silanol groups is low, the amount of highly mobile terminal groups is low, and the siloxane skeleton becomes rigid due to its cage structure, resulting in increased viscosity. Conversely, when the total amount of alkoxy groups and silanol groups is high, the amount of highly mobile terminal groups is high, and the siloxane skeleton becomes a flexible random structure rather than a cage structure, resulting in decreased viscosity.

[0028] <Coefficient Y1> (O １／２ R １１ ), and (O １／２ R ２－１１ The coefficient Y1, which represents the content ratio of R, is 0 or a positive value. １１ and R ２－１１ From the definition of (1), it indicates the total content of silanol groups and alkoxy groups in the organopolysiloxane. In the third embodiment of both aspects, from the viewpoints of the synthesis of the organopolysiloxane, the viscosity adjustment required for preparing the organopolysiloxane composition, and the toughness of the cured product, as described below, the range of coefficient Y1 is greater than 0.05, preferably 0.07 or more. In the fourth embodiment of both aspects, from the viewpoints of the synthesis of the organopolysiloxane, the viscosity adjustment required for preparing the organopolysiloxane composition, and the toughness of the cured product, as described below, the range of coefficient Y1 is usually 0 or more, preferably 0.02 or more, more preferably 0.025 or more, and even more preferably 0.03 or more. On the other hand, from the viewpoint of storage stability, the upper limit of coefficient Y1 is usually 0.25 or less, preferably 0.2 or less, and more preferably 0.1 or less.

[0029] Therefore, in the third embodiment of both aspects, 0.05<Y, preferably 0.05<Y≦0.25, more preferably 0.05<Y1≦0.2, and even more preferably 0.07≦Y1≦0.1. In the fourth embodiment of both aspects, preferably 0.02≦Y1≦0.25, more preferably 0.025≦Y1≦0.2, and even more preferably 0.03≦Y1≦0.1. Note that Y1 is expressed as a relative value with respect to M1+M2+D1+D2+T1+T2+Q=1.

[0030] <Coefficient Y2> The coefficient Y2 is the content ratio of organic groups containing polymerizable alkenyl groups bonded to silicon via oxygen atoms, and it is preferable that Y2 > 0.25. When Y2 > 0.25, compatibility with other resins is improved. Note that compounds in which polymerizable alkenyl groups are bonded to silicon are easily hydrolyzed and detached by water, which can lead to high water absorption, and it is therefore preferable to use them in a manner that is less susceptible to moisture. On the other hand, in environments affected by moisture, if Y2 is large, the cured product is likely to become brittle due to moisture, so Y2 < 0.4 is preferable, Y2 < 0.3 is more preferable, and Y2 < 0.2 is even more preferable. It is also preferable that Y2 is 0. Note that Y2 is expressed as a relative value to M1 + M2 + D1 + D2 + T1 + T2 + Q = 1.

[0031] <Coefficient M1> R ６ or R ２－６ Although the M unit not having R is not an essential constituent element in the organopolysiloxanes of both embodiments, it is preferable that the M unit not having R ６ or R ２－６ The coefficient M1, which is the proportion of M units that do not have M, preferably satisfies M1 > 0. By substituting alkoxy groups and silanol groups of the organopolysiloxane with M units, the storage stability of the organopolysiloxane can be improved and the viscosity can be reduced. From the viewpoint of storage stability, the coefficient M1 is preferably 0.09 or more, and is usually 0.6 or less, preferably 0.5 or less, and more preferably 0.4 or less.

[0032] <M1+M2> In both of these embodiments, it is preferable that M1+M2, the coefficient of the M units, is less than 0.50 (M1+M2<0.50). When the value of the coefficient M1+M2 is within the above range, the storage stability of the organopolysiloxane can be improved, the viscosity can be reduced, and compatibility with other components added to the organopolysiloxane composition described below can be maintained well. M1+M2 is more preferably 0.49 or less.

[0033] <Coefficient D1> R ６ or R ２－６ Although the D unit not having R is not an essential constituent element in the organopolysiloxanes of both embodiments, its introduction can impart toughness to the cured product. ６ or R ２－６ If the content of D units not having R is too high, the heat resistance of the cured product will decrease. ６ or R ２－６ The coefficient D1, which is the proportion of D units that do not have D, is preferably D1≦0.7, more preferably D1≦0.6, and even more preferably D1≦0.3.

[0034] <Coefficient T1> R ６ or R ２－６ Although the T unit not having R is not an essential constituent element in the organopolysiloxanes of both embodiments, its introduction can improve compatibility with other components added to the organopolysiloxane composition, as described below. ６ or R ２－６ If the content of T units not having R is too high, the steric hindrance of the introduced organic group tends to cause poor curing. ６ or R ２－６ The coefficient T1, which is the proportion of T units that do not have T, is preferably T1≦0.5, more preferably T1≦0.4, and even more preferably T1≦0.3.

[0035] The first to fourth embodiments in both aspects described above can be combined in any way as long as the effects of the present invention are not hindered. From the above, the coefficients in the above formula [1] or formula

[21] are, for example, as follows: In one aspect of both embodiments, it is preferable that 0<Q≦0.65, 0<M2+D2+T2≦0.25, 0.05<Y1≦0.25, Y2<0.4, 0<M1+M2≦0.6, D1≦0.7, T1≦0.5, and it is more preferable that 0.04≦Q≦0.60, 0.10≦M2+D2+T2≦0.25, 0.05<Y1≦0.2, Y2<0.3, 0.09≦M1+M2≦0.5, D1≦0.6, T1≦0.4, and it is more preferable that 0.04≦Q≦0.45, 0.10≦M2+D2+T2≦0.20, 0.07≦Y1≦0.1, Y2<0.2, 0.09≦M1+M2≦0.4, It is more preferable that D1≦0.3 and T1≦0.3. In other aspects of both embodiments, it is preferred that 0<Q≦0.65, 0<M2+D2+T2≦0.75, 0.02≦Y1≦0.25, Y2<0.4, 0<M1+M2≦0.6, D1≦0.7, T1≦0.5, and it is more preferred that 0.04≦Q≦0.60, 0.10≦M2+D2+T2≦0.75, 0.025≦Y1≦0.20, Y2<0.3, 0.09≦M1+M2≦0.5, D1≦0.6, T1≦0.4, and it is more preferred that 0.04≦Q≦0.45, 0.12≦M2+D2+T2≦0.6, 0.03≦Y1≦0.1, Y2<0.2, 0.09≦M1+M2≦0.4, It is more preferable that D1≦0.3 and T1≦0.3.

[0036] <R ６ or R ２－６ > R in this first aspect ６ and R in this second aspect ２－６ is an organic group substituted with a polymerizable alkenyl group. Specific examples include those having an acryloyl group, a methacryloyl group, a vinyl group, a styryl group, etc., but preferred are those having one or more functional groups selected from the group represented by the following formulas [2] to [5] in one molecule:

[0037] (In the above formula, * indicates a bond.)

[0038] More preferably, R ６ and R ２－６ has at least one functional group selected from the group consisting of an acryloyloxypropyl group, an acryloyloxyoctyl group, a methacryloyloxypropyl group, and a methacryloyloxyoctyl group in one molecule, and among these, it is particularly preferred that the compound has an acryloyloxypropyl group and / or a methacryloyloxypropyl group in one molecule.

[0039] In formulas [3] and [5], X is a divalent organic group which may have a branched structure and / or a cyclic structure. In addition to carbon and hydrogen, X may contain any one selected from the group consisting of oxygen, nitrogen, phosphorus, sulfur, and halogen. Furthermore, when X is bonded to a silicon atom, the atom at the end of X which is directly bonded to the silicon is preferably a carbon atom. Furthermore, when X is bonded to an oxygen atom directly bonded to the silicon, the atom at the end of X which is directly bonded to the oxygen atom is preferably a carbon atom. For example, a divalent hydrocarbon group having 1 to 20 carbon atoms which may have a branched structure or a cyclic structure, or a polyalkylene glycol, etc. are preferably used. The organopolysiloxane of the second embodiment is required to have no aromatic structure, but since the refractive index of the cured product becomes high even in the organopolysiloxane of the first embodiment, the proportion of aromatic groups in the total of all groups bonded to silicon atoms is preferably 20 mol% or less, more preferably 15 mol% or less, even more preferably 10 mol% or less, even more preferably 5 mol% or less, and especially preferably 1 mol% or less, and it is particularly preferable to use one that does not contain an aromatic structure. When the organopolysiloxane of the first embodiment has aromatic groups, the lower limit is not limited as long as it does not impair the effects of the present invention, but may be, for example, 0.01 mol% or 0.1 mol%. The content of aromatic groups is １ H-NMR, ２９ This can be confirmed by Si-NMR. "Nothing at all" means that there is no clear peak in the NMR chart that can be identified as an aromatic group.

[0040] In both embodiments, the units constituting the M unit, D unit, and T unit do not all need to be the same. For example, the unit having the coefficient M1 (R １ R ２ R ３ SiO １／２ ), and (R ２－１ R ２－２ R ２－３ SiO １／２ ), for example, a certain R １ and R ２－１ is a hydrogen atom, and a certain R １ and R ２－１ may have a different structure, such as a methyl group. This is also true for other R and X.

[0041] R in this first aspect １ ~R ５ , R ７ ~R １０ and R in this second aspect ２－１ ~R ２－５ , R ２－７ ~R ２－１０ are each independently a group selected from an organic group, a reactive functional group, and a hydrogen atom, and in the second embodiment, do not have an aromatic structure. １ ~R ５ , R ７ ~R １０ and R ２－１ ~R ２－５ , R ２－７ ~R ２－１０ are each independently preferably an alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a sec-butyl group, a tert-butyl group, an octyl group, or a cyclohexyl group, or an ether group such as a polyalkylene glycol group, and more preferably a methyl group or a hydrogen atom. １ ~R ５ , R ７ ~R １０ R may be an aromatic group such as a phenyl group, a naphthyl group, a carbazole group, a phenethylene group, or a furanyl group. １１ and R ２－１１represents a group selected from an organic group having 1 to 20 carbon atoms and a hydrogen atom, and does not contain a polymerizable alkenyl group, and R ２－１１ does not have an aromatic structure. Among these, a methyl group is preferred.

[0042] The reactive functional group is preferably a SiH group, a hydroxyl group such as an alcohol group, a carboxyl group, an aldehyde group, an epoxy group, etc. １ ~R ３ , R ７ , R ８ , R １０ , and R ２－１ ~R ２－３ , R ２－７ , R ２－８ , R ２－１０ does not contain a polymerizable alkenyl group. １ ~R ３ and R ２－１ ~R ２－３ When R is an organic group containing a polymerizable alkenyl group, it becomes difficult to distinguish between the M1 proportion and the M2 proportion, so this is specified. ４ , R ５ and R ２－４ , R ２－５ Since such a problem does not occur even when the organic group contains a polymerizable alkenyl group, this limitation does not apply to the D1 proportion portion and the T1 proportion portion. ７ , R ８ , R １０ and R ２－７ , R ２－８ , R ２－１０ is defined as not containing polymerizable alkenyl groups.

[0043] The organopolysiloxanes of both of the above aspects are particularly suitable for use in near-infrared optical waveguides. Therefore, in another embodiment of the present invention, an organopolysiloxane for near-infrared optical waveguides is also provided. The various aspects and requirements of the organopolysiloxane for near-infrared optical waveguides are as described above for the organopolysiloxanes of both aspects. In this specification, the term "organopolysiloxane" refers to both the organopolysiloxane and the organopolysiloxane for near-infrared optical waveguides.

[0044] <Method for Producing Organopolysiloxane> The method for producing the organopolysiloxane in both of the above embodiments is not particularly limited as long as it can produce the organopolysiloxane represented by the formula [1] and the formula

[21] . For example, any method may be used, such as a method of simultaneously condensing one or more disiloxane compounds, disilazane compounds, and their hydrolysates, alkoxysilane compounds, and their hydrolysates, and partial hydrolyzed condensates, a method of condensing a chlorosilane compound, and its hydrolysates, and partial hydrolyzed condensates, a method of ring-opening polymerization of a cyclic siloxane compound, or chain polymerization such as anionic polymerization, or a combination of two or more of these methods. Furthermore, the method for introducing the polymerizable alkenyl group is not particularly limited, and any method may be used, such as a method of simultaneously condensing one or more alkoxysilane compounds, disiloxane compounds, or disilazane compounds having a polymerizable alkenyl group, or their hydrolysates or partial hydrolysis condensates, or a method of converting a reactive organic group introduced into an organopolysiloxane into a polymerizable alkenyl group by a chemical method, or a combination of these methods. Examples of raw materials that can be used to produce the organopolysiloxane of the present invention by hydrolysis condensation are given below.

[0045] (Source of M Units) Examples of sources of M units in both aspects include trimethylsilanol, trimethylmethoxysilane, hexamethyldisiloxane, hexamethyldisilazane, dimethylsilanol, dimethylmethoxysilane, tetramethyldisiloxane, tetramethyldisilazane, dimethylvinylsilanol, dimethylvinylmethoxysilane, 1,3-divinyltetramethyldisiloxane, 1,3-divinyltetramethyldisilazane, dimethyl(meth)acryloyloxypropylsilanol, dimethyl(meth)acryloyloxypropylmethoxysilane, 1,3-di(meth)acryloyloxypropyl Examples of compounds that can be used include glycidyltetramethyldisiloxane, 3-(meth)acryloyloxypropyldimethylmethoxysilane, 1,3-bis((meth)acryloyloxypropyl)-1,1,3,3-tetramethyldisiloxane, tetramethyldisiloxane, dimethylglycidyloxypropylmethoxysilane, 1,3-bis(3-glycidyloxypropyl)tetramethyldisiloxane, and compounds in which a halogen is bonded to the silanol hydroxyl group or alkoxy group in place of the silanol hydroxyl group or alkoxy group among the compounds listed above can be used. In the first aspect, further usable compounds include 1,3-diphenyltetramethyldisiloxane, 1,3-diphenyltetramethyldisilazane, dimethylphenylsilanol, dimethylmethoxyphenylsilane, 1,4-bis(dimethylmethoxysilyl)benzene, 1,4-bis(dimethylethoxysilyl)benzene, and, among the listed compounds, compounds containing a silanol hydroxyl group or an alkoxy group, in which a halogen is bonded in place of the silanol hydroxyl group or the alkoxy group. In particular, hexamethyldisiloxane is suitable for use in both aspects. Furthermore, in the first aspect, it is preferable to use a compound that does not contain an aromatic structure, since this increases the refractive index of the cured product.

[0046] (D Unit Source) Examples of D unit sources that can be used in both embodiments include dimethyldisilanol, dimethyldimethoxysilane, 3-(meth)acryloyloxypropyldimethoxymethylsilane, 3-glycidoxypropylmethyldimethoxysilane, and compounds in which halogen atoms are bonded in place of the silanol hydroxyl or alkoxy groups of the above-listed compounds, and polymers thereof. In the first embodiment, further examples include diphenyldisilanol, diphenyldimethoxysilane, methyldimethoxyphenylsilane, diethoxymethylphenylsilane, methylphenyldisilanol, 1,4-bis(methyldimethoxysilyl)benzene, 1,4-bis(methyldiethoxysilyl)benzene, dimethoxy(methyl)(3,3,3-trifluoropropyl)silane, and compounds in which halogen atoms are bonded in place of the silanol hydroxyl or alkoxy groups of the above-listed compounds, and polymers thereof. In both embodiments, dimethyldimethoxysilane is particularly suitable. In addition, since the refractive index of the cured product becomes high, it is preferable to use a compound that does not contain an aromatic structure, also in this first embodiment.

[0047] (T Unit Source) Examples of T unit sources in both aspects include C trimethoxysilane, methyltrimethoxysilane, ethyltrimethoxysilane, propyltrimethoxysilane, hexyltrimethoxysilane, and decyltrimethoxysilane. １ ~C ２０In addition to trimethoxysilane modified with a long-chain alkoxy group, vinyltrimethoxysilane, 3,3,3-trifluoropropyltrimethoxysilane, 3-(meth)acryloyloxypropyltrimethoxysilane, 8-(meth)acryloyloxyoctyltrimethoxysilane, p-styryltrimethoxysilane, 3-glycidyloxypropyltrimethoxysilane, 8-glycidyloxyoctyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and these methoxysilane compounds, alkoxysilane compounds such as ethoxysilane, silanol compounds, chlorosilane compounds, hydrosilylsilane compounds, and polymers thereof can also be used. In the first aspect, phenyltrimethoxysilane, 1,4-bis(trimethoxysilyl)benzene, and these alkoxysilane compounds, silanol compounds, chlorosilane compounds, hydrosilylsilane compounds, and polymers thereof can also be used. In both embodiments, 3-methacryloyloxypropyltrimethoxysilane, 8-methacryloyloxyoctyltrimethoxysilane, 3-acryloyloxypropyltrimethoxysilane, and 8-acryloyloxyoctyltrimethoxysilane are particularly suitable. Note that, in the first embodiment, it is also preferable to use a compound that does not contain an aromatic structure, since the refractive index of the cured product would be high if such a compound is used.

[0048] (Q Unit Source) Examples of Q unit sources in both aspects include tetrachlorosilane, tetramethoxysilane, tetraethoxysilane, tetraisopropoxysilane, tetrapropoxysilane, tetrabutoxysilane, tetrapentyloxysilane, trimethoxymonoethoxysilane, dimethoxydiethoxysilane, triethoxymonomethoxysilane, trimethoxymonopropoxysilane, monomethoxytributoxysilane, monomethoxytripentyloxysilane, dimethoxydipropoxysilane, tripropoxymonomethoxysilane, trimethoxymonobutoxysilane, dimethoxydibutoxysilane, triethoxymonopropoxysilane, diethoxydipropoxysilane, tributoxymonopropoxysilane, dimethoxymonoethoxymonobutoxysilane, diethoxydipropoxysilane, Alkoxysilanes such as dimethoxymonobutoxysilane, diethoxymonopropoxymonobutoxysilane, dipropoxymonomethoxymonoethoxysilane, dipropoxymonomethoxymonobutoxysilane, dipropoxymonoethoxymonobutoxysilane, dibutoxymonomethoxymonoethoxysilane, dibutoxymonoethoxymonopropoxysilane, and monomethoxymonoethoxymonopropoxymonobutoxysilane can also be used; or tetramethoxysilane oligomers such as Methyl Silicate MS51, MS56, MS57, and MS60 manufactured by Mitsubishi Chemical Corporation, and tetraethoxysilane oligomers such as Ethyl Silicate Oligomer ES40 and ES48 manufactured by Tama Chemicals Co., Ltd. can be used; and methyl silicate MS51 is particularly preferred. In the first embodiment, in addition to the above, aryloxysilanes such as tetraphenyloxysilane and monomethoxytriphenyloxysilane can also be used. However, since the refractive index of the cured product becomes high, it is more preferable to use those that do not contain an aromatic structure, even in the first embodiment.

[0049] In both embodiments, the above M, D, T and Q unit sources can be used singly or in combination of two or more.

[0050] As a catalyst for hydrolysis and condensation of these silicon raw materials, an acid catalyst, a base catalyst, or an inorganic salt can be used, and an acid catalyst is particularly preferably used. Examples of acid catalysts include hydrochloric acid, sulfuric acid, trifluoroacetic acid, acetic acid, methacrylic acid, acrylic acid, etc., and hydrochloric acid is particularly preferably used. Examples of base catalysts include ammonia, hexamethyldisilazane, triethylamine, tetraethylammonium hydroxide, diazabicycloundecene, potassium hydroxide, sodium hydroxide, barium hydroxide, potassium carbonate, sodium carbonate, etc., and potassium hydroxide is particularly preferred. Examples of inorganic salts include sodium chloride, potassium chloride, magnesium chloride, calcium chloride, sodium bromide, potassium bromide, magnesium bromide, calcium bromide, etc., and sodium chloride is particularly preferred.

[0051] Examples of the solvent that can be used in the hydrolysis condensation reaction include tetrahydrofuran, toluene, methanol, ethanol, isopropanol, hexane, and heptane. Tetrahydrofuran is particularly preferred. Depending on the solubility of the product, two or more solvents may be used. A mixed solution of toluene and methanol, or a mixed solution of tetrahydrofuran and methanol is particularly preferred.

[0052] The alkoxy groups and silanol groups remaining without hydrolysis and condensation may be substituted with an organic acid or alcohol, as necessary. Examples of the organic acid that can be used include acetic acid, acrylic acid, and methacrylic acid. Examples of the alcohol that does not contain a polymerizable alkenyl group include methanol, ethanol, propanol, butyl alcohol, pentanol, hexanol, heptanol, and structural isomers thereof. Examples of the alcohol that does contain a polymerizable alkenyl group include 2-hydroxyethyl acrylate and 2-hydroxyethyl methacrylate. From the viewpoint of stability, 2-hydroxyethyl acrylate and 2-hydroxyethyl methacrylate are preferred.

[0053] Furthermore, if the organopolysiloxane has a rigid structure such as a complete cage silsesquioxane, the cured product will be hard and brittle, so it is preferable that the organopolysiloxane does not have a complete cage structure. As long as it is not a complete cage silsesquioxane, for example, it may contain a random structure or ladder structure as a higher-order structure, as long as the effects of the present invention are not impaired.

[0054] <Water> The amount of water used for hydrolysis is preferably 0.5 equivalents or more, more preferably 0.8 equivalents or more, and even more preferably 1.1 equivalents or more, relative to the total amount of alkoxy groups contained in the MDTQ unit source. Examples of the type of water include water contained in commercially available hydrochloric acid, and water purified by distillation or ion exchange resin.

[0055] [Organopolysiloxane Composition] The organopolysiloxane composition of this embodiment is used to form a near-infrared optical waveguide. In addition to the organopolysiloxane of the first embodiment or the organopolysiloxane of the second embodiment described above, the composition may contain a monofunctional polymerizable alkenyl compound, a polyfunctional polymerizable alkenyl compound, and / or an alkenyl polymer, etc., to an extent that does not impair the properties described below of the cured product obtained from the composition. Furthermore, a polymerization initiator may be contained to polymerize and easily cure the organopolysiloxane and polymerizable alkenyl compound. While it is possible to cure the organopolysiloxane or organopolysiloxane composition by electron beam irradiation or the like without using a polymerization initiator, a large amount of energy is required for curing. Therefore, in a preferred aspect of this embodiment, the organopolysiloxane composition contains at least a polymerization initiator in addition to the organopolysiloxane. In addition, the organopolysiloxane composition may contain chain transfer agents, antioxidants, ultraviolet absorbers, light stabilizers, leveling agents, rheology modifiers, adhesion aids such as silane coupling agents, dyes, antifoaming agents, sensitizers, other components, solvents, etc., within limits that do not impair the properties described below of the cured product obtained from the composition. The components that may be contained in the organopolysiloxane composition are described below.

[0056] <Monofunctional Polymerizable Alkenyl Compound> Specific examples of the monofunctional polymerizable alkenyl compound include (meth)acrylates containing a carboxy group, such as (meth)acrylic acid, 2-(meth)acryloyloxyethyl succinate, 2-(meth)acryloyloxyethyl maleate, 2-(meth)acryloyloxyethyl phthalate, and 2-(meth)acryloyloxyethyl hexahydrophthalate; (meth)acrylates having a hydroxyl group, such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, and 6-hydroxyhexyl (meth)acrylate; Alkyl (meth)acrylates such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, n-butyl (meth)acrylate, i-butyl (meth)acrylate, tert-butyl (meth)acrylate, pentyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, n-nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, lauryl (meth)acrylate, tridecyl (meth)acrylate, and stearyl (meth)acrylate; (meth)acrylates containing an alicyclic structure, such as cyclohexyl (meth)acrylate, dicyclopentenyl (meth)acrylate, 2-dicyclopentenoxyethyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentanyl (meth)acrylate, adamantyl (meth)acrylate, and 4-tert-butylcyclohexyl (meth)acrylate;(Meth)acrylates containing an aromatic ring structure such as phenyl (meth)acrylate, benzyl (meth)acrylate, phenoxyethyl (meth)acrylate, phenoxydiethylene glycol (meth)acrylate, phenoxypolyethylene glycol (meth)acrylate, nonylphenoxypolyethylene glycol (meth)acrylate, phenoxypolypropylene glycol (meth)acrylate, phenylphenyl (meth)acrylate, phenylphenoxyethyl (meth)acrylate, phenoxybenzyl (meth)acrylate, phenylbenzyl (meth)acrylate, naphthyl (meth)acrylate, and (1-naphthyl)methyl (meth)acrylate; (meth)acrylates containing a heterocyclic structure such as tetrahydrofurfuryl (meth)acrylate, glycidyl (meth)acrylate, and (meth)acryloylmorpholine; alkoxy (meth)acrylates such as methoxyethyl (meth)acrylate, ethoxyethyl (meth)acrylate, and butoxyethyl (meth)acrylate; Examples of suitable compounds include 3-(meth)acryloxypropyltrimethoxysilane, 3-(meth)acryloxypropyltriethoxysilane, 2-(meth)acryloyloxyethyl acid phosphate, trifluoroethyl (meth)acrylate and heptadecafluorodecyl (meth)acrylate, and 2-(meth)acryloyloxyethyl isocyanate; styrene derivatives such as styrene, α-methylstyrene, 2-vinylpyridine, 4-vinylpyridine, 1,1-diphenylethylene, and aromatic ring hydrogen-substituted derivatives thereof; and vinyl compounds such as vinyl acetate, vinyl octanoate, vinyl decanoate, vinyl hexanoate, acrylonitrile, and vinyl benzoate. It is preferable to use compounds that do not contain an aromatic structure, as this increases the refractive index of the cured product.

[0057] <Polyfunctional Polymerizable Alkenyl Compound> Specific examples of the polyfunctional polymerizable alkenyl compound include alkylene glycol di(meth)acrylates such as ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, butylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, and neopentyl glycol di(meth)acrylate; polyalkylene glycol di(meth)acrylates such as polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, and polybutylene glycol di(meth)acrylate; Di(meth)acrylates containing an alicyclic structure such as cyclohexanedimethanol di(meth)acrylate, tricyclodecanedimethanol di(meth)acrylate, ethoxylated hydrogenated bisphenol A di(meth)acrylate, propoxylated hydrogenated bisphenol A di(meth)acrylate, and adamantanediol di(meth)acrylate; bifunctional (meth)acrylates such as polycarbonate diol di(meth)acrylate, polyester diol di(meth)acrylate, ethoxylated bisphenol A di(meth)acrylate, propoxylated bisphenol A di(meth)acrylate, 9,9-bis(4-acryloyloxyethoxyphenyl)fluorene, and polyurethane di(meth)acrylate; Examples of suitable monomers include trifunctional (meth)acrylates such as trimethylolpropane tri(meth)acrylate, ethoxylated isocyanuric acid tri(meth)acrylate, and ε-caprolactone-modified tris((meth)acryloxyethyl)isocyanurate; tetrafunctional (meth)acrylates such as ditrimethylolpropane tetra(meth)acrylate; pentafunctional (meth)acrylates such as dipentaerythritol penta(meth)acrylate; and polyfunctional monomers such as hexafunctional (meth)acrylates such as dipentaerythritol hexa(meth)acrylate; 1,4-divinylbenzene, 1,3-divinylbenzene, and the like. It is preferable to use a monomer that does not contain an aromatic structure, as this increases the refractive index of the cured product.

[0058] <Alkenyl Polymer> An alkenyl polymer is a polymer containing 50% by mass or more of alkenyl monomer units in its composition. In this specification, "unit" refers to a repeating unit constituting a polymer. The polymerizable alkenyl compound may be monofunctional or polyfunctional. Furthermore, it is preferable to use one that does not contain an aromatic structure, as this increases the refractive index. The alkenyl polymer may contain one or more types of alkenyl monomer units. The polymerization method for obtaining an alkenyl polymer is not particularly limited, and the polymer can be polymerized by known methods such as solution polymerization, suspension polymerization, emulsion polymerization, and partial polymerization. In the present invention, suspension polymerization is preferred because it is relatively easy to control the polymerization reaction and separate the produced polymer.

[0059] Alternatively, the alkenyl polymer may be modified by introducing a double bond-containing functional group, such as a (meth)acryloyl group or a vinyl group, into the side chain through chemical modification. Examples of chemical modification methods include the reaction of a carboxy group with a glycidyl group and the reaction of a hydroxyl group with an isocyanate group. When the reaction of a carboxy group with a glycidyl group is used as the chemical modification method, for example, an alkenyl polymer containing an alkenyl monomer unit having a carboxy group is produced, and the resulting alkenyl polymer is then reacted with a compound having a glycidyl group and a double bond, such as glycidyl (meth)acrylate.

[0060] In order to shorten the reaction time, it is preferable to use a reaction catalyst when reacting an alkenyl polymer containing an alkenyl monomer unit having a carboxy group with a compound having a glycidyl group and a double bond. Examples of the reaction catalyst include quaternary ammonium salts such as tetrabutylammonium bromide, quaternary phosphonium salts such as ethyltriphenylphosphonium bromide, and phosphine compounds such as triphenylphosphine. Quaternary ammonium salts are particularly preferred because they are less likely to discolor the organopolysiloxane composition of this embodiment.

[0061] The weight-average molecular weight (Mw) of the alkenyl polymer is preferably 5,000 to 500,000, and more preferably 10,000 to 200,000. When the weight-average molecular weight is 5,000 or more, the strength of the cured product is improved. When the weight-average molecular weight is 500,000 or less, the viscosity of the organopolysiloxane composition of this embodiment is reduced, thereby improving workability.

[0062] <Polymerization initiator> Examples of the polymerization initiator include a photopolymerization initiator, a thermal polymerization initiator, a peroxide used in redox polymerization, etc. The type of polymerization initiator can be appropriately selected depending on the polymerization method.

[0063] (Photopolymerization initiator) The photopolymerization initiator is a radical polymerization initiator used for photopolymerization. Specific examples of the photopolymerization initiator include benzophenone-type compounds such as benzophenone, 4-methylbenzophenone, 2,4,6-trimethylbenzophenone, methyl 2-benzoylbenzoate, and 4-phenylbenzophenone; anthraquinone-type compounds such as tert-butylanthraquinone and 2-ethylanthraquinone; 2-hydroxy-2-methyl-1-phenylpropan-1-one, oligo{2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone}, benzyl dimethyl ketal, and 1-methyl-2-methyl-1-phenylpropan-1-one. alkylphenone compounds such as 4-hydroxycyclohexyl phenyl ketone, benzoin methyl ether, 2-methyl-[4-(methylthio)phenyl]-2-morpholino-1-propanone, and 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropionyl)benzyl]phenyl}-2-methylpropan-1-one; thioxanthone compounds such as 2-benzyl-2-dimethylamino-4'-morpholinobutyrophenone, diethylthioxanthone, and isopropylthioxanthone; 2,4,6-trimethyl-4'-dimethylamino-4'-morpholinobutyrophenone, diethylthioxanthone, and isopropylthioxanthone; Acylphosphine oxide compounds such as methylbenzoyldiphenylphosphine oxide, bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide, and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; phenylglyoxylate compounds such as phenylglyoxylic acid methyl ester; N-acetoxy-N-{4-acetoxyimino-4-[9-ethyl-6-(o-toluoyl)-9H-carbazol-3-yl]butane-2- yl}acetamide, N-acetoxy-N-{3-(acetoxyimino)-3-[9-ethyl-6-(1-naphthoyl)-9H-carbazol-3-yl]-1-methylpropyl}acetamide, 4-acetoxyimino-5-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-5-oxopentanoate, methyl 4-acetoxyimino-5-oxo-5-(4-(phenylthio)phenyl)pentanoate, and other oxime ester compounds, as well as combinations thereof.

[0064] Among these, alkylphenone-type compounds are preferred in terms of their ability to suppress discoloration of the cured product, with 2-hydroxy-2-methyl-1-phenylpropan-1-one and 1-hydroxycyclohexyl phenyl ketone being more preferred. Furthermore, acylphosphine oxide-type compounds are preferred in terms of their ability to facilitate sufficient curing deep into the cured product, with 2,4,6-trimethylbenzoyldiphenylphosphine oxide being more preferred in terms of their ability to suppress discoloration of the cured product. Furthermore, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and methyl 4-acetoxyimino-5-oxo-5-(4-(phenylthio)phenyl)pentanoate are more preferred, as they have high sensitivity to light with longer wavelengths. 2-benzyl-2-dimethylamino-4'-morpholinobutyrophenone is also preferred in terms of its high reactivity to light with a wavelength of around 365 nm. These photopolymerization initiators may be used alone, or two or more may be used in combination.

[0065] When the organopolysiloxane composition of this embodiment (hereinafter sometimes simply referred to as the "curable composition") is cured by photopolymerization to obtain a cured product, the wavelength of the light irradiated onto the curable composition is not particularly limited, but it is preferable to irradiate it with ultraviolet light having a wavelength of 200 to 500 nm. Specific examples of ultraviolet light sources include ultra-high pressure mercury lamps, high pressure mercury lamps, metal halide lamps, high-power metal halide lamps, UV-LED lamps, chemical lamps, and black lights. After photopolymerization of the curable composition, an aftercure may be further performed. This reduces the amount of unreacted polymerizable alkenyl groups remaining in the cured product, thereby further increasing the strength of the cured product. Examples of aftercure conditions include a temperature of 50°C to 200°C for several tens of seconds to 60 minutes, or a temperature of 80°C to 150°C for several tens of seconds to 60 minutes.

[0066] (Thermal Polymerization Initiator) The thermal polymerization initiator is a radical polymerization initiator used in thermal polymerization. Examples of the thermal polymerization initiator include organic peroxides and azo compounds. Specific examples of organic peroxides include ketone peroxides such as methyl ethyl ketone peroxide; peroxyketals such as 1,1-di(tert-hexylperoxy)-3,3,5-trimethylcyclohexane, 1,1-di(tert-hexylperoxy)cyclohexane, and 1,1-di(tert-butylperoxy)cyclohexane; hydroperoxides such as 1,1,3,3-tetramethylbutyl hydroperoxide, cumene hydroperoxide, and p-menthane hydroperoxide; dicumyl peroxide, di-tert-butyl peroxide, etc. diacyl peroxides such as dilauroyl peroxide and dibenzoyl peroxide; peroxydicarbonates such as di(4-tert-butylcyclohexyl)peroxydicarbonate and di(2-ethylhexyl)peroxydicarbonate; and peroxyesters such as tert-butylperoxy-2-ethylhexanoate, tert-hexylperoxyisopropyl monocarbonate, tert-butylperoxybenzoate, and 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate.

[0067] Specific examples of azo compounds include 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), 1,1'-azobis-1-cyclohexanecarbonitrile, dimethyl-2,2'-azobisisobutyrate, 4,4'-azobis-4-cyanovaleric acid, and 2,2'-azobis-(2-amidinopropane) dihydrochloride.

[0068] These thermal polymerization initiators may be used alone or in combination of two or more. As the thermal polymerization initiator, organic peroxides are preferred because they are less likely to produce bubbles in the cured product. Considering the balance between the curing time and pot life of the curable composition, the 10-hour half-life temperature of the organic peroxide is preferably 35 to 80°C, more preferably 40 to 75°C, and even more preferably 45 to 70°C. If the 10-hour half-life temperature is 35°C or higher, the curable composition is less likely to gel at room temperature, resulting in a good pot life. On the other hand, if the 10-hour half-life temperature is 80°C or lower, the curing time of the curable composition can be shortened.

[0069] Examples of such organic peroxides include 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, tert-butylperoxy-2-ethylhexanoate, and di(4-tert-butylcyclohexyl)peroxydicarbonate. Commercially available 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate includes, for example, Perocta O (trade name, manufactured by NOF Corporation, 10-hour half-life temperature: 65.3°C). Commercially available tert-butylperoxy-2-ethylhexanoate includes, for example, Perbutyl O (trade name, manufactured by NOF Corporation, 10-hour half-life temperature: 72.1°C). Commercially available di(4-tert-butylcyclohexyl)peroxydicarbonate includes, for example, Peroyl TCP (trade name, manufactured by NOF Corporation, 10-hour half-life temperature: 40.8°C).

[0070] When a curable composition is cured by thermal polymerization to obtain a cured product, the curing conditions are not particularly limited. However, from the viewpoint of easily obtaining a resin for optical components with suppressed coloration, the curing temperature is preferably 40 to 200°C, more preferably 60 to 150°C. The curing time (heating time) varies depending on the curing temperature, but is preferably 1 to 120 minutes, more preferably 1 to 60 minutes. After thermal polymerization of the curable composition, it is preferable to further perform after-cure. Examples of after-cure conditions include a temperature of 50°C to 200°C for several tens of seconds to 60 minutes, or a temperature of 80°C to 150°C for several tens of seconds to 60 minutes.

[0071] (Redox Polymerization) Redox polymerization typically uses a redox polymerization initiator. A redox polymerization initiator is a polymerization initiator that uses a peroxide and a reducing agent in combination. Examples of peroxides used in redox polymerization include dibenzoyl peroxide and hydroperoxide. These peroxides may be used alone or in combination of two or more. When using the above-mentioned peroxides as redox polymerization initiators, examples of combinations with reducing agents include the following: (1) A combination of dibenzoyl peroxide (peroxide) with an aromatic tertiary amine (reducing agent) such as N,N-dimethylaniline, N,N-dimethyl-p-toluidine, or N,N-bis(2-hydroxypropyl)-p-toluidine. (2) A combination of a hydroperoxide (peroxide) with a metal soap (reducing agent). (3) A combination of a hydroperoxide (peroxide) with a thiourea (reducing agent).

[0072] When a curable composition is cured by redox polymerization to obtain a cured product, the use of a redox polymerization initiator allows curing at a temperature of 5 to 40°C. A curing temperature of 15 to 40°C is preferred, as this reduces the amount of unreacted (meth)acryloyl groups remaining in the resulting resin for optical components and further increases the strength of the resin for optical components. Furthermore, because the curable composition is less likely to gel and can be handled stably, a preferred method involves dissolving a reducing agent in the curable composition in advance and then adding a peroxide to the composition to carry out curing. When curing the curable composition, it is preferable to cure the curable composition in a sealed state to prevent curing inhibition by oxygen. Examples of sealing methods include sandwiching the curable composition between glass or PET film.

[0073] <Chain Transfer Agent> When the curing reaction of an organopolysiloxane composition is carried out in air, oxygen traps active radicals as peroxide radicals, inhibiting polymerization. However, by adding a chain transfer agent that donates hydrogen, polymerization inhibition by oxygen can be suppressed. Examples of the chain transfer agent include thiol compounds such as methyl mercaptoacetate, methyl 3-mercaptopropionate, 2-ethylhexyl 3-mercaptopropionate, 3-methoxybutyl 3-mercaptopropionate, n-octyl 3-mercaptopropionate, stearyl 3-mercaptopropionate, 1,4-bis(3-mercaptopropionyloxy)butane, 1,4-bis(3-mercaptobutyryloxy)butane, trimethylolethane tris(3-mercaptopropione), and the like. ester), trimethylolethane tris(3-mercaptobutyrate), trimethylolpropane tris(3-mercaptopropionate), trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakis(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptobutyrate), dipentaerythritol hexakis(3-mercaptopropionate), dipentaerythritol hexakis(3-mercaptobutyrate), Mercaptocarboxylic acid esters such as tris[2-(3-mercaptopropionyloxy)ethyl]isocyanurate and tris[2-(3-mercaptobutyryloxy)ethyl]isocyanurate; alkyl thiols such as ethanethiol, 2-methylpropane-2-thiol, n-dodecanethiol, 2,3,3,4,4,5-hexamethylhexane-2-thiol (tert-dodecanethiol), ethane-1,2-dithiol, propane-1,3-dithiol, and benzylthiol aromatic thiols such as benzenethiol, 3-methylbenzenethiol, 4-methylbenzenethiol, naphthalene-2-thiol, pyridine-2-thiol, benzimidazole-2-thiol, and benzothiazole-2-thiol; mercaptoalcohols such as 2-mercaptoethanol and 4-mercapto-1-butanol; and silane-containing thiols such as 3-(trimethoxysilyl)propane-1-thiol and 3-(triethoxysilyl)propane-1-thiol.Among these, from the viewpoint of the reactivity and storage stability of the curable composition, it is preferable to use a secondary thiol compound. When a chain transfer agent is added, the chain transfer agent may be used alone or in combination of two or more. The amount added is preferably 0.01 to 20 parts by mass, more preferably 0.1 to 10 parts by mass, and even more preferably 0.5 to 10 parts by mass, per 100 parts by mass of the total amount of the polymerizable components. When two or more types are used in combination, the total amount of the chain transfer agents falls within the above range.

[0074] <Solvent> A solvent can be added to dilute the organopolysiloxane and its composition. The type of solvent is not particularly limited as long as it does not impair the physical properties required for the cured product of the organopolysiloxane and its composition. Examples of solvents include aromatic hydrocarbons (e.g., toluene, xylene, ethyl benzoate, ethylbenzene, benzyl alcohol), ketones (e.g., acetone, methyl ethyl ketone, methyl isobutyl ketone, diisobutyl ketone, cyclohexanone, diacetone alcohol), esters (e.g., methyl acetate, ethyl acetate, butyl acetate, sec-butyl acetate, methoxybutyl acetate, amyl acetate, normal propyl acetate, ethyl lactate, methyl lactate, butyl lactate, propylene glycol monomethyl ether acetate, γ-butyrolactone), and ethers (e.g., For example, isopropyl ether, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, ethylene glycol monobutyl ether, 1,4-dioxane, methyl tert-butyl ether, tetrahydrofuran), alcohols (for example, methanol, ethanol, normal propanol, isopropanol, butanol, sec-butanol, tert-butanol, normal pentanol), halogenated solvents (for example, methylene chloride, trichloroethylene, tetrachloroethylene, bromopropane, chloroform), and others (for example, dimethyl sulfoxide, N,N-dimethylformamide, water), and two or more types of solvents may be used.

[0075] The content is not particularly limited as long as it does not impair the physical properties required for the organopolysiloxane and the cured product of the composition, but when it is desired to reduce the viscosity while keeping the volatile content low, it is preferably more than 0% by mass and not more than 25% by mass of the organopolysiloxane or the entire composition. Furthermore, when it is desired to obtain a thin-film cured product, it is preferably 75% by mass or more and less than 100% by mass of the organopolysiloxane or the entire composition.

[0076] (Antioxidant) The curable composition preferably further contains an antioxidant. When the curable composition contains an antioxidant, coloration due to heat, such as heating during soldering of the cured product or heat generation in a device, can be suppressed. Specific examples of the antioxidant include phenols such as 2,6-di-tert-butylphenol, 2,6-di-tert-butyl-p-cresol, n-octadecyl-3-(3',5'-di-tert-butyl-4'-hydroxyphenyl)propionate, tetrakis-[methylene-3-(3',5'-di-tert-butyl-4'-hydroxyphenyl)propionate]methane, triethylene glycol bis[3-(3-tert-butyl-5-methyl-4-hydroxyphenyl)propionate], and 1,6-hexanediol bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]. Examples of such antioxidants include phosphorus-based antioxidants such as triphenyl phosphite, trisisodecyl phosphite, tristridecyl phosphite, tris(2,4-di-tert-butylphenyl)phosphite, and tetra(C12-15 alkyl)-4,4'-isopropylidene diphenyl diphosphite; and sulfur-based antioxidants such as dilauryl-3,3'-thiodipropionate, ditridecyl-3,3'-thiodipropionate, dimyristyl-3,3'-thiodipropionate, distearic-3,3'-thiodipropionate, and pentaerythritol tetrakis(β-laurylthiopropionate). These antioxidants may be used alone or in combination of two or more.

[0077] (Other Components) The curable composition of this embodiment may contain other components such as a filler, a cure regulator, a viscosity modifier, etc. These components may be contained as appropriate to the extent that they do not affect the transmission loss, heat resistance, or refractive index of the cured product of the organopolysiloxane composition of this embodiment.

[0078] <Curing of Organopolysiloxane Composition> Another embodiment of the present invention is a cured product obtained by curing the above-described organopolysiloxane composition (curable composition) with heat or light. The curing conditions for the organopolysiloxane composition are not particularly limited, and the organopolysiloxane composition can be cured under conditions that are appropriately used for curing silicone resins, depending on the type of polymerization initiator, etc.

[0079] <Characteristics of the cured product> Polymerizable alkenyl group and Q unit (SiO ４／２ When the organopolysiloxane of the first aspect having a unit containing a hydroxyl group, or a composition thereof, is cured as described above, a cured product having the following properties can be obtained.

[0080] Heat Resistance A cured product with high reflow resistance can be obtained, with a 1% weight loss temperature of preferably 285° C. or higher, more preferably 290° C. or higher. The weight loss temperature is measured by the method described in the examples below.

[0081] Transmission Loss A cured product can be obtained that is suitable as a core material for an optical waveguide, having a transmission loss at near-infrared wavelengths of preferably 0.30 dB / cm or less, more preferably 0.25 dB / cm or less. The transmission loss is measured by the method described in the examples below.

[0082] When the organopolysiloxane of the second embodiment, which has an organic group containing a polymerizable alkenyl group and does not have an aromatic structure, or a composition thereof, is cured as described above, a cured product having the following properties can be obtained.

[0083] Heat Resistance A cured product with high reflow resistance can be obtained, with a 5% weight loss temperature of preferably 330° C. or higher, more preferably 333° C. or higher. The weight loss temperature is measured by the method described in the examples below.

[0084] The organopolysiloxane composition of this embodiment is particularly suitable for use in near-infrared optical waveguides. Therefore, in another embodiment of the present invention, an organopolysiloxane composition for near-infrared optical waveguides is also provided. The various aspects and requirements of the organopolysiloxane composition for near-infrared optical waveguides are as described above for the organopolysiloxane composition. Hereinafter, when referring to the "organopolysiloxane composition," this refers to both the organopolysiloxane composition and the organopolysiloxane composition for near-infrared optical waveguides.

[0085] [Near-infrared light waveguide and near-infrared light transmission component] Near-infrared light waveguides produced using the above-mentioned organopolysiloxane composition and near-infrared light transmission components comprising at least the near-infrared light waveguide are also within the scope of the present invention. Furthermore, as will be described later, near-infrared light waveguides having a cured product obtained by curing the above-mentioned organopolysiloxane composition and near-infrared light transmission components comprising at least the near-infrared light waveguide are also within the scope of the present invention. Furthermore, as will be described later, a method for producing a near-infrared light waveguide produced using the above-mentioned organopolysiloxane composition is also within the scope of the present invention.

[0086] The near-infrared optical waveguide of the present invention comprises at least a core and / or a cladding formed by curing the organopolysiloxane composition, and may also comprise a base material (also referred to as a "substrate"). The near-infrared optical waveguide of the present invention preferably comprises a core and a cladding made using the organopolysiloxane composition. The cladding may also be composed of a lower cladding and an upper cladding. The near-infrared optical transmission component of the present invention may also comprise, in addition to the near-infrared optical waveguide described above, optical fibers such as mirrors and connectors, and connecting members for connecting to silicon photonics optical circuits, etc.

[0087] The organopolysiloxane composition described above can be used as both a clad-forming material for forming the clad of an optical waveguide and a core-forming material for forming the core. However, the refractive index of the core material must be higher than the refractive index of the clad material for forming the clad. The refractive index of the cured product can be controlled by changing the proportion of the structural units of the organopolysiloxane. For example, increasing the value of M2 + D2 + T2 in the above formula [1] in the first embodiment or the above formula

[21] in the second embodiment, i.e., increasing the proportion of polymerizable alkenyl groups, can increase the density of the resulting cured product and increase the refractive index. Conversely, decreasing the value of M2 + D2 + T2, i.e., decreasing the proportion of polymerizable alkenyl groups, can decrease the density of the resulting cured product and lower the refractive index. The refractive index of the cured product can also be controlled by changing the proportion of components in the organopolysiloxane composition.

[0088] Furthermore, by adjusting the content (volume %) of polymerizable alkenyl groups in the polymerizable alkenyl compound and / or alkenyl polymer contained in the organopolysiloxane composition, the crosslink density of the cured product can be controlled in the same manner as described above, thereby controlling the refractive index. In addition, in the organopolysiloxane of the first aspect, the refractive index can be increased by increasing the aromatic group content (volume %) of the cured product, and decreased by increasing the fluorine content (volume %). Furthermore, the refractive index of the cured product can be controlled by combining these techniques. For near-infrared single-mode optical signals, the difference in refractive index between the core material and the cladding material is preferably 0.01 to 0.05, more preferably 0.01 to 0.04, even more preferably 0.01 to 0.03, and even more preferably 0.01 to 0.02.

[0089] When connecting to a near-infrared single-mode silica-based optical fiber in a device, a smaller difference in refractive index between the core material of the silica-based optical fiber and the core material of the optical waveguide reduces interfacial reflection of light at the connection portion and can further reduce connection loss. Generally, the refractive index of the core material of a near-infrared single-mode silica-based optical fiber is 1.4 to 1.5 at near-infrared wavelengths. If the refractive index of the core material of the optical waveguide is 1.400 to 1.500 at a wavelength of 589 nm and 1.400 to 1.500 at a wavelength of 1300 nm, more preferably 1.430 to 1.490 at a wavelength of 589 nm and 1.420 to 1.480 at a wavelength of 1300 nm, and even more preferably 1.435 to 1.480 at a wavelength of 589 nm and 1.425 to 1.470 at a wavelength of 1300 nm, the difference in refractive index between the two materials can be reduced, and connection loss can be further reduced.

[0090] The method for producing the near-infrared optical waveguide of the present invention is not particularly limited. For example, the optical waveguide can be formed through a process of curing the above-mentioned organopolysiloxane composition by exposure (photocuring) or heating (thermocuring). As a typical example, the optical waveguide can be formed through an etching process and a development process using a lithography technique using a photomask. When producing an optical waveguide by photolithography, it is preferable to use an organopolysiloxane composition containing at least an organopolysiloxane and a photopolymerization initiator. If necessary, an organopolysiloxane composition containing further added solvents, chain transfer agents, etc. can be used. It is also possible to produce the optical waveguide by a method such as nanoimprinting. The above-mentioned method for forming an optical waveguide using photolithography is particularly preferred because it allows the production of optical waveguides with small line widths and pitches.

[0091] The substrate of the near-infrared optical waveguide can be a silicon wafer, a silicon wafer with an oxide film, a polyimide resin, an epoxy resin, a PEEK resin, a liquid crystal polymer, glass, a glass epoxy substrate, or the like. When using photolithography, the core of the optical waveguide can be prepared on the substrate by applying an organopolysiloxane composition to the substrate, exposing the substrate to light through a photomask, and washing the unexposed areas with a solvent. Furthermore, an overclad can be prepared by applying and curing an organopolysiloxane composition to the core prepared on the substrate. Before preparing the core on the substrate, an underclad can be prepared in advance by applying and curing an organopolysiloxane composition to the substrate. Alternatively, after the core and clad of the optical waveguide are prepared on the substrate, the waveguide can be peeled off from the substrate.

[0092] In another embodiment, the present invention provides the following method for producing a near-infrared optical waveguide (sometimes referred to as the present production method). A first aspect of the present production method comprises the following steps, in this order: step (i-1) of applying a first curable polymer composition to a substrate surface to form a first polymer layer; step (i-2) of irradiating at least one selected region of the first polymer layer with active energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region; and step (i-3) of removing the unexposed region of the partially exposed layer with a solvent to form a patterned core, wherein the first curable polymer composition is the organopolysiloxane composition of the present invention or the organopolysiloxane composition for a near-infrared optical waveguide. In the first aspect, it is preferable that the method further comprises a step (i-4) of coating the substrate surface and the core with a second curable polymer composition to form a second polymer layer, and a step (i-5) of curing the second polymer layer to form an upper clad.

[0093] The second curable polymer composition is not particularly limited as long as it is a curable composition, but is preferably the organopolysiloxane composition of the present invention.

[0094] A second aspect of the present production method comprises the steps of: (ii-1) applying a third curable polymer composition to a substrate surface to form a third polymer layer; (ii-2) irradiating at least one selected region of the third polymer layer with actinic energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region; (ii-3) removing the unexposed region of the partially exposed layer with a solvent to form a patterned core; (ii-4) coating the substrate surface and the core with a fourth curable polymer composition to form a fourth polymer layer; and (ii-5) curing the fourth polymer layer to form an upper clad, in this order; and at least one of the third curable polymer and the fourth curable polymer composition must be the organopolysiloxane composition.

[0095] As described above, as long as at least one of the third curable polymer composition and the fourth curable polymer composition is the organopolysiloxane composition, the other curable polymer composition is not particularly limited as long as it is a curable composition. In this aspect, it is preferable that both the third curable polymer composition and the fourth curable polymer composition are the organopolysiloxane composition.

[0096] A third aspect of the present production method comprises the following steps, in this order: (iii-1) applying a fifth curable polymer composition to a substrate surface to form a fifth polymer layer; (iii-2) curing the fifth polymer layer to form a lower cladding; (iii-3) applying a sixth curable polymer composition onto the lower cladding to form a sixth polymer layer; (iii-4) irradiating at least one selected region of the sixth polymer layer with active energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region; and (iii-5) removing the unexposed region of the partially exposed layer with a solvent to form a patterned core; wherein at least one of the fifth curable polymer composition and the sixth curable polymer composition is the organopolysiloxane composition.

[0097] As described above, as long as at least one of the fifth curable polymer composition and the sixth curable polymer composition is the organopolysiloxane composition, there are no particular restrictions on the other curable polymer composition as long as it is a curable composition. In this aspect, it is preferable that both the fifth curable polymer composition and the sixth curable polymer composition are the organopolysiloxane compositions.

[0098] A fourth aspect of the present manufacturing method comprises the steps of: (iv-1) applying a fifth curable polymer composition to a substrate surface to form a fifth polymer layer; (iv-2) curing the fifth polymer layer to form a lower cladding; (iv-3) applying a sixth curable polymer composition onto the lower cladding to form a sixth polymer layer; (iv-4) irradiating at least one selected region of the sixth polymer layer with active energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region; (iv-5) removing the unexposed region of the partially exposed layer with a solvent to form a patterned core; (iv-6) coating the lower cladding and the core with a seventh curable polymer composition to form a seventh polymer layer; and (iv-7) curing the seventh polymer layer to form an upper cladding. At least one of the fifth, sixth and seventh curable polymer compositions is the organopolysiloxane composition.

[0099] In this embodiment, it is preferable that all of the fifth curable polymer composition, the sixth curable polymer composition, and the seventh curable polymer composition are the organopolysiloxane composition for near-infrared optical waveguides of the present invention. The substrate can be any of the above-mentioned base materials. The surface of the substrate to be used is preferably subjected to ozone treatment, plasma treatment, corona treatment, or the like in advance to remove any deposits on the surface, prevent the curable polymer composition to be applied from being repelled, and improve adhesion. Similarly, before forming the core and the upper cladding, it is also preferable to subject the surfaces on which the core and upper cladding will be formed to ozone treatment, plasma treatment, corona treatment, or the like in advance.

[0100] As described above, in each embodiment, at least a portion of the first to seventh curable polymer compositions must be the above-described organopolysiloxane composition, but the other curable polymer composition may be any other polymer composition that forms the core, lower clad, or upper clad. Examples of the optional other polymer composition include, but are not limited to, curable silicone compositions other than the above-described organopolysiloxane compositions, curable polyolefin compositions, curable polyamide compositions, curable epoxy resin compositions, curable amino resin compositions, curable polyurethane compositions, curable polyimide compositions, curable polyester compositions, and curable acrylic resin compositions.

[0101] The curable polymer composition can be applied to a substrate using any common method, such as spin coating, die coating, gravure coating, dipping, spraying, brushing, or screen printing. The curable polymer composition is typically applied by spin coating. The spin speed and spin time, as well as the solids content and viscosity of the curable polymer composition, can be adjusted so that the polymer layer has a desired thickness.

[0102] When the curable polymer composition contains a solvent, the production method may further include a step of removing at least a portion of the solvent from the formed polymer layer. The solvent can be removed by heating the polymer layer at a temperature of 50°C to 200°C for several tens of seconds to 60 minutes, or at a temperature of 80°C to 150°C for several tens of seconds to 60 minutes. Alternatively, the solvent may be removed under reduced pressure, or the solvent may be removed under reduced pressure and then further removed by heating.

[0103] The polymer layer can be cured by various means depending on the curing mechanism of the curable polymer composition. Such means include heating, exposure (to active energy rays such as radiation or ultraviolet radiation), and exposure to steam. The conditions for each can be selected appropriately. For example, curing can be performed using an exposure device with a high-pressure mercury lamp light source. The exposure atmosphere may be air or an inert atmosphere. Exposure in an inert atmosphere can reduce the amount of uncured layer formed on the surface of the polymer layer. However, the polymer layer forming the core is prepared by irradiating at least one selected region with active energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region. Similarly, the polymer layer forming the cladding may be prepared by irradiating at least one selected region with active energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region. After curing the polymer layer, the cured layer may be further heated or re-exposed. These treatments may promote curing, improve adhesion between the polymer layer and the substrate, and improve adhesion between polymer layers themselves. Conditions for the heat treatment include, for example, a temperature of 50°C to 200°C for several tens of seconds to 60 minutes, or a temperature of 80°C to 150°C for several tens of seconds to 60 minutes.

[0104] In the step of forming the core, after curing the curable polymer composition, a so-called development process is performed in which the non-exposed region is removed with a solvent to remove the non-exposed region. There are no limitations on the solvent or development method used for development. Any solvent may be used as long as the curable polymer composition is soluble in the solvent, and the curable polymer composition in the non-exposed region is dissolved by any method such as dipping or spraying. In the step of forming the clad, after curing the curable polymer composition, a so-called development process may be performed in which the non-exposed region is removed with a solvent to remove the non-exposed region. There are no limitations on the solvent or development method used for development. Any solvent may be used as long as the curable polymer composition is soluble in the solvent, and the curable polymer composition in the non-exposed region is dissolved by any method such as dipping or spraying. Furthermore, in the step of forming the core or the upper and lower clads, a process similar to the above-mentioned development may be used to remove the uncured layer on the surface of the polymer layer. After removing the non-exposed region with a solvent, it is preferable to remove the solvent by air drying or heating.

[0105] Generally, the lower cladding and upper cladding have a thickness of about 1 to 100 μm, and the core has a thickness of 1 to 50 μm. The refractive index of the core is preferably higher than that of the cladding, and light can be transmitted in a desired propagation mode depending on the size and refractive index of the core.

[0106] This fabrication method can be expanded to a high-throughput manufacturing method. Multiple optical waveguides can be simultaneously fabricated on a single substrate. Furthermore, this method can utilize conventional wafer fabrication techniques (e.g., coating, exposing, developing, and curing) and equipment. Optical waveguides fabricated according to this fabrication method have superior microfabrication properties, heat resistance, low transmission loss at near-infrared wavelengths, and reduced connection loss due to reflection at the optical fiber / optical waveguide interface compared to optical waveguides containing other known materials.

[0107] Next, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples.

[0108] [Evaluation method] (1) １H-NMR measurement method: 60 mg of the organopolysiloxane to be measured was weighed out, and 12 mg of N,N-dimethylformamide was added as an internal standard. Deuterated chloroform was added to dissolve the mixture in 1 g of the organopolysiloxane, and the solution was placed in an NMR sample tube. １ Measurement was performed using H-NMR (Bruker AVANCE NEO 400, BBFO Probe (5 mm diameter)) with a pulse repetition time of 5 seconds, scan count of 16, measurement mode of single pulse, measurement temperature of 25°C, flip angle of 30°, spin of 20 Hz, and a measurement temperature of 25°C. The functional group content was estimated from the ratio of the signal intensity of each component to the signal intensity of the internal standard N,N-dimethylformamide, and the weighing value.

[0109] (2) ２９ Si-NMR measurement method Apparatus: JNM-ECS400 manufactured by JEOL Ltd., TUNABLE Probe (10 mm diameter): Si-free, AT10 probe Measurement conditions: Pulse repetition time / 16 seconds, Scan number / 1024 times, Measurement mode / non-gated decoupled pulse method (NNE), Flip angle / 90°, Spin / none, Measurement temperature / 25°C Sample preparation: Tris(2,4-pentanedionato)chromium III was added to deuterated chloroform to give a concentration of 0.5% by mass, ２９ A solvent for Si-NMR measurement was obtained. 1.5 g of the organopolysiloxane to be measured was weighed out and ２９ 2.5 ml of a solvent for Si-NMR measurement was added to dissolve the solution, and the solution was placed in an NMR sample tube. Calculation of structural units: The signal intensity of each silicon unit was measured, and the above １ The constituent ratio of silicon units was calculated from the ratio to the signal intensity measured by H-NMR and the ratio to the functional group content.

[0110] (3) Measurement of refractive index of cured product Using a Kalnew Precision Refractometer KPR2000 manufactured by Shimadzu Corporation, the refractive index of the cured product at a wavelength of 589 nm was measured at a temperature of 23° C. using a mixture of diiodomethane, monobromonaphthalene, and liquid paraffin as an intermediate liquid. Alternatively, using a Prism Coupler Model 2010 / M manufactured by Metricon, the refractive index of a thin film cured product prepared on a substrate at wavelengths of 1300 nm and 1550 nm was measured.

[0111] (4) Thermogravimetric Loss Temperature: Measurement was performed using a thermogravimetric analyzer STA200 manufactured by Hitachi High-Tech Corporation under air conditions at a temperature increase rate of 10° C. / min.

[0112] (5) Transmission Loss Using a spectrophotometer U-4000 manufactured by Hitachi High-Tech Corporation, the transmittance at a wavelength of 1,310 nm of each of approximately 0.5 mm thick and approximately 1 mm thick cured products was measured, and the transmission loss L (dB / cm) was calculated using equation [6]: L = -(10 / Δd) × log １０ (T １．０ / T ０．５ ) ... [6] Δd (cm) ... film thickness difference between two samples T １．０ (%): Transmittance of a sample with a film thickness of approximately 1.0 mm T ０．５ (%): Transmittance of a sample with a film thickness of approximately 0.5 mm

[0113] [Method of Synthesizing Organopolysiloxanes] [Synthesis Example 1] Method of Synthesizing Organopolysiloxanes A to E Using 1.600 g of methyl silicate MS51 manufactured by Mitsubishi Chemical Corporation, 40.00 g of 3-methacryloyloxypropyltrimethoxysilane KBM503 manufactured by Shin-Etsu Chemical Co., Ltd., and 17.92 g of hexamethyldisiloxane manufactured by Nacalai Tesque, Inc. as organopolysiloxane raw materials, 23.04 g of toluene and 23.04 g of methanol as solvents, and a mixture of 10.62 g of 1N hydrochloric acid and 10.62 g of methanol as catalyst and water, hydrolysis and condensation were carried out while maintaining the temperature at 15° C. to 40° C. Thereafter, the reaction liquid was neutralized and washed with demineralized water, and then the solvent and water were removed and filtered to obtain 34 g of the target liquid organopolysiloxane A. Organopolysiloxanes B to E were obtained by synthesizing in the same manner, but changing the amounts of organopolysiloxane raw materials as appropriate.

[0114] Synthesis Example 2 Method for Synthesizing Organopolysiloxane F Organopolysiloxane F was obtained in the same manner as in Synthesis Example 1, except that p-styryltrimethoxysilane KBM1403 manufactured by Shin-Etsu Chemical Co., Ltd. was used as the organopolysiloxane raw material instead of 3-methacryloyloxypropyltrimethoxysilane KBM503 manufactured by Shin-Etsu Chemical Co., Ltd.

[0115] Synthesis Example 3 Method for Synthesizing Organopolysiloxane H Organopolysiloxane H was obtained in the same manner as in Synthesis Example 1, except that 3-methacryloyloxypropyltrimethoxysilane KBM503 manufactured by Shin-Etsu Chemical Co., Ltd. and dimethoxydimethylsilane manufactured by Tokyo Chemical Industry Co., Ltd. were used as organopolysiloxane raw materials.

[0116] Synthesis Example 4 Method for Synthesizing Organopolysiloxane G With reference to JP-A-2014-510159, organopolysiloxane G was obtained using 3-methacryloyloxypropyltrimethoxysilane KBM503 manufactured by Shin-Etsu Chemical Co., Ltd. and diphenylsilanediol manufactured by Tokyo Chemical Industry Co., Ltd. as organopolysiloxane raw materials.

[0117] [Method of Producing a Cured Product] For 100 parts by mass of each of the liquid organopolysiloxanes A to H obtained in Synthesis Examples 1 to 4, 2.0 parts by mass of 2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenone (Omnirad 369) manufactured by iGM Resins B.V. was added as a photopolymerization initiator, and for 100 parts by mass of organopolysiloxane G, 0.5 parts by mass of Omnirad 369 was added and stirred to dissolve the photopolymerization initiator, thereby preparing a composition. Furthermore, for 100 parts by mass of organopolysiloxane B, 2.0 parts by mass of 2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenone (Omnirad 369) manufactured by iGM Resins B.V. was added as a photopolymerization initiator. A composition was also prepared by adding 2.0 parts by mass of 2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenone (Omnirad 369) manufactured by Co., Ltd. and 10 parts by mass of pentaerythritol tetrakis(3-mercaptobutyrate) (PE1, manufactured by Resonac Co., Ltd.) as a chain transfer agent. In addition, a composition was prepared in which 2.0 parts by mass of 2,4,6-trimethylbenzoyldiphenylphosphine oxide (Omnirad TPO H, manufactured by iGM Resins B.V.) was added as a photopolymerization initiator instead of Omnirad 369 per 100 parts by mass of organopolysiloxane C, and a composition was also prepared in which 2 parts by mass of bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide (Omnirad 819, manufactured by iGM Resins B.V.) was used as a photopolymerization initiator instead of Omnirad 369 per 100 parts by mass of organopolysiloxane C. These compositions were sandwiched between two sheets of glass via a 1 mm thick silicone spacer and exposed to an LED with a wavelength of 365 nm (integrated light intensity: 6,000 mJ / cm). ２ ) to obtain a test piece with a thickness of about 1 mm. The composition for evaluating the transmission loss was sandwiched between two pieces of glass with a 0.5 mm thick silicone spacer in between, and exposed to an LED with a wavelength of 365 nm (integrated light amount: 6,000 mJ / cm ２ ), and test specimens approximately 0.5 mm thick were also obtained.

[0118] [Method for Producing a Thin Film Cured on a Substrate] To 100 parts by mass of organopolysiloxanes A to H, 2.0 parts by mass of 2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenone (Omnirad 369, manufactured by iGM Resins B.V.) as a photopolymerization initiator and 60 parts by mass of propylene glycol monomethyl ether acetate as an organic solvent were added, and the mixture was stirred at room temperature to prepare a composition. A composition containing the above organopolysiloxane B was also prepared by further adding 10 parts by mass of pentaerythritol tetrakis(3-mercaptobutyrate) (PE1, manufactured by Resonac Co., Ltd.) as a chain transfer agent. As compositions containing the organopolysiloxane C, a composition in which 2.0 parts by mass of Omnirad TPO H was added as a photopolymerization initiator instead of Omnirad 369, a composition in which 2.0 parts by mass of Omnirad 819 was added as a photopolymerization initiator instead of Omnirad 369, and a composition in which 2.0 parts by mass of methyl 4-acetoxyimino-5-oxo-5-(4-(phenylthio)phenyl)pentanoate (photopolymerization initiator-1) was added as a photopolymerization initiator instead of Omnirad 369 were also prepared. These compositions were spin-coated onto a glass substrate, and the solvent was removed by treatment under reduced pressure. Thereafter, the composition was exposed to an LED with a wavelength of 365 nm (integrated light intensity: 1,000 mJ / cm). ２ ) A thin film cured product was prepared on the substrate.

[0119] Examples 1 to 6, Comparative Examples 1 to 3, Reference Examples 1 to 3 [Molecular composition ratio of liquid organopolysiloxanes, physical properties of cured products] In Examples 1 to 6, liquid organopolysiloxanes C to E were used to prepare cured products and thin-film cured products on glass substrates by the methods described above. In Comparative Examples 1 to 3, liquid organopolysiloxanes G, H, and F were used to prepare cured products and thin-film cured products on glass substrates by the methods described above. In Reference Examples 1 to 3, liquid organopolysiloxanes A and B were used to prepare cured products and thin-film cured products on glass substrates by the methods described above. For each example, １ H-NMR and ２９ The molecular composition ratio of the liquid organopolysiloxane before curing, calculated by Si-NMR measurement, and the physical properties of the cured product are shown in Tables 1, 2-1, and 2-2.

[0120]

[0121]

[0122]

[0123] An optical waveguide was prepared using the organopolysiloxane for near-infrared optical waveguides described below. [Example 7] [Method 1 for preparing an optical waveguide having a core on a substrate] To 100 parts by mass of the above organopolysiloxane B, 2.0 parts by mass of 2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenone (Omnirad 369, manufactured by iGM Resins B.V.) as a photopolymerization initiator, 10 parts by mass of pentaerythritol tetrakis(3-mercaptobutyrate) (PE1, manufactured by Resonac Co., Ltd.) as a chain transfer agent, and 20 parts by mass of propylene glycol monomethyl ether acetate as an organic solvent were added, and the mixture was stirred at room temperature. This composition was designated as a first curable polymer composition. The first curable polymer composition was applied by spin coating onto a silicon wafer substrate whose surface had been treated with ozone, and then the solvent was removed by a reduced pressure treatment, followed by exposure to light using a mask in an exposure machine (intensity at a wavelength of 365 nm: 500 mW / cm ２ , cumulative light intensity: 2,000 mJ / cm ２ After heating at 130°C for 10 minutes, the composition in the unexposed areas was washed away using propylene glycol monomethyl ether acetate and then 2-propanol, and the substrate was heated in a heating furnace at 130°C for 30 seconds and then at 150°C for 1 hour to produce an optical waveguide core on the silicon wafer substrate. Figure 1 is a schematic cross-sectional view of the optical waveguide produced in Example 7.

[0124] Example 8 [Method 2 for Producing an Optical Waveguide Having a Core / Upper Cladding on a Substrate] To 100 parts by mass of the organopolysiloxane C, 2.0 parts by mass of 2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenone (Omnirad 369, manufactured by iGM Resins B.V.) as a photopolymerization initiator and 20 parts by mass of propylene glycol monomethyl ether acetate as an organic solvent were added, and the mixture was stirred at room temperature. This composition was designated as a second curable polymer composition. The surface of the silicon wafer substrate on which the optical waveguide core had been produced, obtained in Example 7, was plasma-treated, and the second curable polymer composition was spin-coated. After that, the solvent was removed by reduced pressure treatment, and the substrate was exposed with an exposure machine (intensity at a wavelength of 365 nm: 40 mW / cm ２ , cumulative light intensity: 1,000 mJ / cm ２ After heating at 130°C for 10 minutes, insufficiently cured portions of the coating surface were washed away with propylene glycol monomethyl ether acetate and then with 2-propanol, and the coating was heated in a heating furnace at 130°C for 30 seconds and then further heated in a heating furnace at 150°C for 1 hour to produce an optical waveguide having a core and an upper clad on a silicon wafer substrate. Figure 2 is a schematic cross-sectional view of the optical waveguide produced in Example 8.

[0125] Example 9 [Method 3 for Producing an Optical Waveguide Having a Lower Cladding / Core on a Substrate] To 100 parts by mass of the organopolysiloxane C, 2.0 parts by mass of 2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenone (Omnirad 369, manufactured by iGM Resins B.V.) as a photopolymerization initiator and 20 parts by mass of propylene glycol monomethyl ether acetate as an organic solvent were added, and the mixture was stirred at room temperature. This composition was designated as a fifth curable polymer composition. The fifth curable polymer composition was spin-coated onto a silicon wafer substrate whose surface had been treated with ozone, followed by removing the solvent by reduced pressure treatment and exposing the composition to light using an exposure machine (intensity at a wavelength of 365 nm: 40 mW / cm ２ , cumulative light intensity: 1,000 mJ / cm ２After heating at 130°C for 10 minutes, insufficiently cured portions of the coating surface were washed away using propylene glycol monomethyl ether acetate and then 2-propanol. The coating was then heated in a heating furnace at 130°C for 30 seconds to produce a lower clad layer made of the fifth curable polymer composition on a silicon wafer substrate. To 100 parts by mass of the organopolysiloxane B, 2.0 parts by mass of 2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenone (Omnirad 369, manufactured by iGM Resins B.V.) as a photopolymerization initiator, 10 parts by mass of pentaerythritol tetrakis(3-mercaptobutyrate) (PE1, manufactured by Resonac Co., Ltd.) as a chain transfer agent, and 20 parts by mass of propylene glycol monomethyl ether acetate as an organic solvent were added, and the mixture was stirred at room temperature. This composition was designated the sixth curable polymer composition. The surface of the silicon wafer substrate on which the lower cladding was formed was subjected to plasma treatment, and the sixth curable polymer composition was spin-coated thereon. After that, the solvent was removed by reduced pressure treatment, and the resulting layer was exposed to light using a mask in an exposure machine (intensity at a wavelength of 365 nm: 500 mW / cm ２ , cumulative light intensity: 2,000 mJ / cm ２ After heating at 130°C for 10 minutes, the composition in the unexposed areas was washed away using propylene glycol monomethyl ether acetate and then 2-propanol, and the substrate was heated in a heating furnace at 130°C for 30 seconds and further heated in a heating furnace at 150°C for 1 hour to produce an optical waveguide having a lower cladding made of the fifth curable polymer composition and a core made of the sixth curable polymer composition on a silicon wafer substrate. Figure 3 is a schematic cross-sectional view of the optical waveguide produced in Example 9.

[0126] Example 10 [Method 4 for Producing an Optical Waveguide Having Lower Cladding / Core / Upper Cladding on a Substrate] To 100 parts by mass of the organopolysiloxane C, 2.0 parts by mass of 2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenone (Omnirad 369, manufactured by iGM Resins B.V.) as a photopolymerization initiator and 20 parts by mass of propylene glycol monomethyl ether acetate as an organic solvent were added, and the mixture was stirred at room temperature. This composition was designated as the seventh curable polymer composition. The surface of the silicon wafer substrate on which the lower cladding and core had been produced in Example 9 was plasma-treated, and the seventh curable polymer composition was spin-coated. After that, the solvent was removed by reduced pressure treatment, and the mixture was exposed with an exposure machine (intensity at a wavelength of 365 nm: 40 mW / cm ２ , cumulative light intensity: 1,000 mJ / cm ２ After heating at 130°C for 10 minutes, insufficiently cured portions of the coating surface were washed away using propylene glycol monomethyl ether acetate and then 2-propanol, and the coating was heated in a heating furnace at 130°C for 30 seconds and further heated in a heating furnace at 150°C for 1 hour to produce an optical waveguide having a lower cladding made of the fifth curable polymer composition, a core made of the sixth curable polymer composition, and an upper cladding made of the seventh curable polymer composition on a silicon wafer substrate. Figure 4 is a schematic cross-sectional view of the optical waveguide produced in Example 10.

[0127] [Discussion of Results] In Examples 1 to 3, where the coefficient Q in Equation [1] is greater than 0, the cured products have a refractive index of 1.437 to 1.452 at a wavelength of 589 nm, which can reduce loss when spliced ​​with a near-infrared single-mode silica-based optical fiber. The cured products produced from the organopolysiloxane compositions of Examples 1 to 6 have a refractive index of 1.429 to 1.453 at a wavelength of 1300 nm and a refractive index of 1.426 to 1.452 at a wavelength of 1550 nm, and when used as a core material for a near-infrared optical waveguide, can reduce splice loss when spliced ​​with a near-infrared single-mode silica-based optical fiber. They are also useful as cladding materials used around core materials with a refractive index of approximately 1.400 to 1.500 at a wavelength of 1300 nm. Furthermore, it was confirmed that the cured products prepared from the organopolysiloxane compositions of Examples 1 to 6 had a 1% weight loss temperature of 284°C or higher or a 5% weight loss temperature of 330°C or higher and had high reflow resistance, making it possible to form optical waveguides using photolithography. In Examples 7 to 10, various optical waveguides were actually prepared.

[0128] Reference Examples 1 to 3 confirmed that compositions containing organopolysiloxanes having the above composition have a refractive index of 1.470 or less at a wavelength of 1300 nm, excellent heat resistance, and are suitable for near-infrared optical waveguide applications. Reference Example 3 also confirmed that the addition of a chain transfer agent improves curability and the heat resistance of the cured product. In Comparative Example 1, where the coefficient Q = 0 in formula [1], the refractive index of the cured product is greater than 1.5, which can increase loss when splicing with a near-infrared single-mode silica-based optical fiber. In addition, the 1% weight loss temperature of the cured product is 285°C or less, which indicates insufficient reflow resistance. In Comparative Example 2, where the coefficient Q = 0 in formula [1], the refractive index of the cured product is 1.476 at a wavelength of 589 nm, which can reduce loss when splicing with a near-infrared single-mode silica-based optical fiber, but the 1% weight loss temperature of the cured product is 285°C or less, which indicates insufficient reflow resistance.

[0129] Optical waveguides fabricated according to this manufacturing method have excellent microfabrication properties, heat resistance, and the ability to reduce connection loss due to reflection at the optical fiber / optical waveguide interface. Therefore, the organopolysiloxanes of both aspects of the present invention are useful as materials for forming near-infrared optical waveguides. In addition, from the standpoints of optical properties, heat resistance, and lithographic patterning, they are also expected to be used in optical waveguides connected to non-silica optical fibers whose core materials have a refractive index of approximately 1.4 to 1.5, and as optical adhesives used in the connection between optical waveguides and optical fibers.

[0130] 10 Substrate 20 Lower cladding layer 30 Upper cladding layer 40 Core

Claims

1. An organopolysiloxane represented by the following general formula [1]. (R １ R ２ R ３ SiO １／２ ) Ｍ１ (R ４ R ５ R ６ SiO １／２ ) Ｍ２ (R ７ R ８ SiO ２／２ ) Ｄ１ (R ９ R ６ SiO ２／２ ) Ｄ２ (R １０ SiO ３／２ ) Ｔ１ (R ６ SiO ３／２ ) Ｔ２ (SiO ４／２ ) Ｑ (O １／２ R １１ ) Ｙ１ (O １／２ R ６ ) Ｙ２ [In the above formula [1], R １ ~R ５ , R ７ ~R １１ R is independently one or more groups selected from an organic group, a reactive functional group, or a hydrogen atom. １ ~R ３ , R ７ , R ８ , R １０ and R １１ does not contain a polymerizable alkenyl group. ６ are one or more organic groups containing a polymerizable alkenyl group, which may be the same or different from one another, 0≦M1, D1, T1, Y1, Y2, 0<Q, 0<M2+D2+T2≦0.25, 0.05<Y1, M1+M2+D1+D2+T1+T2+Q=1.] 2. A non-linear organopolysiloxane having no aromatic structure, represented by the following general formula [21]. (R ２－１ R ２－２ R ２－３ SiO １／２ ) Ｍ１ (R ２－４ R ２－５ R ２－６ SiO １／２ ) Ｍ２ (R ２－７ R ２－８ SiO ２／２ ) Ｄ１ (R ２－９ R ２－６ SiO ２／２ ) Ｄ２ (R ２－１０ SiO ３／２ ) Ｔ１ (R ２－６ SiO ３／２ ) Ｔ２ (SiO ４／２ ) Ｑ１ (O １／２ R ２－１１ ) Ｙ１ (O １／２ R ２－６ ) Ｙ２ ...[21] [In the above formula [21], R ２－１ ~R ２－５ , R ２－７ ~R ２－１１ R is independently one or more groups selected from an organic group, a reactive functional group, or a hydrogen atom. ２－１ ~R ２－３ , R ２－７ , R ２－８ , R ２－１０ and R ２－１１ does not contain a polymerizable alkenyl group. ２－６ are one or more organic groups containing a polymerizable alkenyl group, which may be the same or different from one another, 0≦M1, D1, T1, Y1, Y2, 0<M2+D2+T2≦0.25, 0.05<Y1, M1+M2+D1+D2+T1+T2+Q=1.

3. The organopolysiloxane according to claim 1 or 2, wherein in formula [1] or formula [21], 0.12<M2+D2+T2≦0.

25.

4. The organopolysiloxane according to claim 1 or 2, wherein in formula [1] or formula [21], Y1≦0.

25.

5. The organopolysiloxane according to claim 2, wherein in formula [21], 0<Q.

6. The organopolysiloxane according to claim 1 or 5, wherein in formula [1] or formula [21], Q is 0.04 or less.

7. The organopolysiloxane according to claim 1 or 2, wherein in formula [1] or formula [21], M1+M2<0.

50.

8. The organopolysiloxane according to claim 1, which does not have an aromatic structure.

9. In the formula [1] or [21], the R ６ Or R ２－６ The organopolysiloxane according to claim 1 or 2, wherein each molecule contains one or more functional groups selected from the group represented by the following formulas [2] to [5]: (In the above formula, X is a divalent organic group, which may have a branched structure and / or a cyclic structure. When X is bonded to a silicon atom, the atom at the end of X that is directly bonded to the silicon is a carbon atom. When X is bonded to an oxygen atom directly bonded to the silicon, the atom at the end of X that is directly bonded to the oxygen atom is a carbon atom. * indicates a bond.) 10. The above R ６ Or R ２－６ 3. The organopolysiloxane according to claim 1 or 2, wherein is a (meth)acryloyloxypropyl group.

11. An organopolysiloxane composition comprising the organopolysiloxane according to claim 1 or 2 and at least a polymerization initiator.

12. A cured product obtained by curing the organopolysiloxane composition according to claim 11.

13. A near-infrared optical waveguide produced using the organopolysiloxane composition according to claim 11.

14. A near-infrared optical waveguide comprising a core and a clad, said core and said clad being made using the organopolysiloxane composition of claim 11.

15. A near-infrared light transmission component comprising at least the near-infrared light waveguide according to claim 13.

16. A near-infrared light transmission component comprising at least the near-infrared light waveguide according to claim 14.

17. A method for producing a near-infrared optical waveguide, comprising the steps of: (i-1) applying a first curable polymer composition to a surface of a substrate to form a first polymer layer; (i-2) irradiating at least one selected region of the first polymer layer with active energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region; and (i-3) removing the unexposed region of the partially exposed layer with a solvent to form a patterned core, in this order; wherein the first curable polymer composition is the organopolysiloxane composition according to claim 11.

18. The method for producing a near-infrared optical waveguide according to claim 17, further comprising: a step (i-4) of coating the substrate surface and the core with a second curable polymer composition to form a second polymer layer; and a step (i-5) of curing the second polymer layer to form an upper clad.

19. A method for producing a near-infrared optical waveguide according to claim 18, wherein the second curable polymer composition is the organopolysiloxane composition according to claim 11.

20. A method for producing a near-infrared optical waveguide, comprising the steps of: (ii-1) applying a third curable polymer composition to a surface of a substrate to form a third polymer layer; (ii-2) irradiating at least one selected region of the third polymer layer with active energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region; (ii-3) removing the unexposed region of the partially exposed layer with a solvent to form a patterned core; (ii-4) coating the surface of the substrate and the core with a fourth curable polymer composition to form a fourth polymer layer; and (ii-5) curing the fourth polymer layer to form an upper clad, in this order; wherein at least one of the third curable polymer composition and the fourth curable polymer composition is the organopolysiloxane composition according to claim 11.

21. A method for producing a near-infrared optical waveguide as described in claim 20, wherein both the third curable polymer composition and the fourth curable polymer composition are the organopolysiloxane composition as described in claim 11.

22. A method for producing a near-infrared optical waveguide, comprising the steps of: (iii-1) applying a fifth curable polymer composition to a surface of a substrate to form a fifth polymer layer; (iii-2) curing the fifth polymer layer to form a lower clad; (iii-3) applying a sixth curable polymer composition onto the lower clad to form a sixth polymer layer; (iii-4) irradiating at least one selected region of the sixth polymer layer with active energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region; and (iii-5) removing the unexposed region of the partially exposed layer with a solvent to form a patterned core, in this order; wherein at least one of the fifth curable polymer composition and the sixth curable polymer composition is the organopolysiloxane composition according to claim 11.

23. A method for producing a near-infrared optical waveguide as described in claim 22, wherein both the fifth curable polymer composition and the sixth curable polymer composition are the organopolysiloxane composition as described in claim 11.

24. A method for manufacturing a semiconductor device comprising the steps of: applying a fifth curable polymer composition onto a substrate surface to form a fifth polymer layer; curing the fifth polymer layer to form a lower cladding; applying a sixth curable polymer composition onto the lower cladding to form a sixth polymer layer; irradiating at least one selected region of the sixth polymer layer with active energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region; removing the unexposed region of the partially exposed layer with a solvent to form a patterned core; covering the lower cladding and the core with a seventh curable polymer composition to form a seventh polymer layer; and curing the seventh polymer layer to form an upper cladding, in this order; 12. A method for producing a near-infrared optical waveguide, wherein at least one of the fifth curable polymer composition, the sixth curable polymer composition, and the seventh curable polymer composition is the organopolysiloxane composition according to claim 11.

25. A method for producing a near-infrared optical waveguide as described in claim 24, wherein the fifth curable polymer composition, the sixth curable polymer composition and the seventh curable polymer composition are all the organopolysiloxane composition as described in claim 11.

26. Organic groups containing polymerizable alkenyl groups and Q units silicon (SiO ４／２ ) and having no aromatic structure.

27. The organopolysiloxane for near-infrared optical waveguide according to claim 26, which is represented by the following general formula [1]. (R １ R ２ R ３ SiO １／２ ) Ｍ１ (R ４ R ５ R ６ SiO １／２ ) Ｍ２ (R ７ R ８ SiO ２／２ ) Ｄ１ (R ９ R ６ SiO ２／２ ) Ｄ２ (R １０ SiO ３／２ ) Ｔ１ (R ６ SiO ３／２ ) Ｔ２ (SiO ４／２ ) Ｑ (O １／２ R １１ ) Ｙ１ (O １／２ R ６ ) Ｙ２ [In the above formula [1], R １ ~R ５ , R ７ ~R １１ R is independently one or more groups selected from an organic group, a reactive functional group, or a hydrogen atom. １ ~R ３ , R ７ , R ８ , R １０ and R １１ does not contain a polymerizable alkenyl group. ６ are one or more organic groups containing a polymerizable alkenyl group, which may be the same or different, 0≦M1, D1, T1, Y1, Y2, 0<Q, 0<M2+D2+T2, and M1+M2+D1+D2+T1+T2+Q=1.

28. The organopolysiloxane for use in a near-infrared optical waveguide according to claim 27, wherein in the formula [1], 0<M2+D2+T2≦0.

25.

29. The organopolysiloxane for use in a near-infrared optical waveguide according to claim 27, wherein in the formula [1], 0.02≦Y1≦0.

25.

30. The organopolysiloxane for use in a near-infrared optical waveguide according to claim 27, wherein Q in formula [1] satisfies 0.04≦Q.

31. The organopolysiloxane for use in a near-infrared optical waveguide according to claim 27, wherein in the formula [1], M1+M2<0.

50.

32. In the formula [1], ６ The organopolysiloxane for near-infrared optical waveguide according to claim 27, wherein the organopolysiloxane has one or more functional groups selected from the group represented by the following formulas [2] to [5] in one molecule: (In the formula, X is a divalent organic group which may have a branched structure and / or a cyclic structure. When X is bonded to a silicon atom, the atom at the end of X which is directly bonded to the silicon is a carbon atom. When X is bonded to an oxygen atom which is directly bonded to the silicon, the atom at the end of X which is directly bonded to the oxygen atom is a carbon atom. * indicates a bond.) 33. The above R ６ The organopolysiloxane for a near-infrared optical waveguide according to claim 27, wherein is a (meth)acryloyloxypropyl group.

34. An organopolysiloxane composition for near-infrared optical waveguides, comprising the organopolysiloxane for near-infrared optical waveguides according to any one of claims 26 to 33, and at least a polymerization initiator.

35. A cured product for near-infrared optical waveguide, obtained by curing the organopolysiloxane composition for near-infrared optical waveguide according to claim 34.

36. A near-infrared optical waveguide produced using the organopolysiloxane composition for near-infrared optical waveguides according to claim 34.

37. A near-infrared optical waveguide having a core and a clad, said core and said clad being produced using the organopolysiloxane composition for near-infrared optical waveguides according to claim 34.

38. A near-infrared light transmission component comprising at least the near-infrared light waveguide according to claim 36.

39. A near-infrared light transmission component comprising at least the near-infrared light waveguide according to claim 37.

40. A method for producing a near-infrared optical waveguide, comprising the steps of: (i-1) applying a first curable polymer composition to a surface of a substrate to form a first polymer layer; (i-2) irradiating at least one selected region of the first polymer layer with active energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region; and (i-3) removing the unexposed region of the partially exposed layer with a solvent to form a patterned core, in this order; wherein the first curable polymer composition is the organopolysiloxane composition for near-infrared optical waveguides according to claim 34.

41. A method for producing a near-infrared optical waveguide according to claim 40, further comprising: a step (i-4) of coating the substrate surface and the core with a second curable polymer composition to form a second polymer layer; and a step (i-5) of curing the second polymer layer to form an upper clad.

42. A method for producing a near-infrared optical waveguide according to claim 41, wherein the second curable polymer composition is the organopolysiloxane composition for near-infrared waveguide according to claim 34.

43. A method for producing a near-infrared optical waveguide, comprising the steps of: (ii-1) applying a third curable polymer composition to a surface of a substrate to form a third polymer layer; (ii-2) irradiating at least one selected region of the third polymer layer with active energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region; (ii-3) removing the unexposed region of the partially exposed layer with a solvent to form a patterned core; (ii-4) coating the surface of the substrate and the core with a fourth curable polymer composition to form a fourth polymer layer; and (ii-5) curing the fourth polymer layer to form an upper clad, in this order; wherein at least one of the third curable polymer composition and the fourth curable polymer composition is the organopolysiloxane composition for near-infrared waveguides according to claim 34.

44. A method for producing a near-infrared optical waveguide as described in claim 43, wherein both the third curable polymer composition and the fourth curable polymer composition are the organopolysiloxane composition for near-infrared waveguides as described in claim 34.

45. A method for producing a near-infrared optical waveguide, comprising the steps of: (iii-1) applying a fifth curable polymer composition to a surface of a substrate to form a fifth polymer layer; (iii-2) curing the fifth polymer layer to form a lower clad; (iii-3) applying a sixth curable polymer composition onto the lower clad to form a sixth polymer layer; (iii-4) irradiating at least one selected region of the sixth polymer layer with active energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region; and (iii-5) removing the unexposed region of the partially exposed layer with a solvent to form a patterned core, in this order; wherein at least one of the fifth curable polymer composition and the sixth curable polymer composition is the organopolysiloxane composition for near-infrared optical waveguides according to claim 34.

46. ​​A method for producing a near-infrared optical waveguide as described in claim 45, wherein both the fifth curable polymer composition and the sixth curable polymer composition are the organopolysiloxane composition for near-infrared optical waveguide as described in claim 34.

47. A method for manufacturing a semiconductor device comprising the steps of: applying a fifth curable polymer composition onto a substrate surface to form a fifth polymer layer; curing the fifth polymer layer to form a lower cladding; applying a sixth curable polymer composition onto the lower cladding to form a sixth polymer layer; irradiating at least one selected region of the sixth polymer layer with active energy rays having a wavelength of 150 to 800 nm to produce a partially exposed layer having at least one exposed region and at least one unexposed region; removing the unexposed region of the partially exposed layer with a solvent to form a patterned core; covering the lower cladding and the core with a seventh curable polymer composition to form a seventh polymer layer; and curing the seventh polymer layer to form an upper cladding.

35. A method for producing a near-infrared optical waveguide, wherein at least one of the fifth curable polymer composition, the sixth curable polymer composition, and the seventh curable polymer composition is the organopolysiloxane composition for near-infrared optical waveguide according to claim 34.

48. A method for producing a near-infrared optical waveguide as described in claim 47, wherein all of the fifth curable polymer composition, the sixth curable polymer composition and the seventh curable polymer composition are organopolysiloxane compositions for near-infrared optical waveguides as described in claim 34.

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