Sensor arrangement and method for producing a sensor arrangement

Abstract

The invention relates to a sensor arrangement having a temperature sensor head with a temperature sensor element. The sensor arrangement also has a carrier with two connection points on a carrier top side, wherein the carrier is flexible at least in a sub-region. A connection wiring comprising a first connection wire and a second connection wire, which electrically and mechanically connects the temperature sensor element to the connection points. The carrier mechanically supports at least parts of the connection wires and / or the carrier head.

Description

[0001] Sensor arrangement and method for producing a

[0002] Sensor arrangement

[0003] The invention relates to a sensor arrangement and a method for producing a sensor arrangement.

[0004] Temperature sensors, and in particular NTC thermistors, are used in a wide variety of applications, such as temperature control of exhaust gases, liquid media, or even in medical applications. Previous solutions often use thermistors mounted in a leadframe design. Alternatively, sensor systems using SMD (surface-mounted devices) components are used.

[0005] In certain installation situations, a flexible or bendable sensor arrangement is preferred. The mechanical or chemical resistance of the sensor arrangement may also be relevant.

[0006] With a sensor arrangement according to claim 1, some of the above-mentioned objects are at least partially achieved.

[0007] A sensor arrangement according to a first embodiment has a temperature sensor head with a temperature sensor element. Furthermore, the sensor arrangement has a carrier with two connection points, wherein the connection points are arranged on a carrier upper side. The carrier is flexible at least in one partial area or areas. The carrier is bendable in such a partial area. Furthermore, the sensor arrangement has connection wiring which makes electrical contact with the temperature sensor head. The connection wiring comprises a first connection wire and a second connection wire which electrically connect the temperature sensor element to the connection points on the carrier. In this case, a mechanical connection of the carrier head is also achieved. Furthermore, the carrier mechanically supports at least parts of the connection wires and / or the carrier head.In particular, the carrier can provide additional support in addition to the mechanical fastening via the contact.

[0008] The connecting wires are wires in the general technical sense. They are preferably not conductor tracks arranged on a circuit board.

[0009] The wired NTC thermistor can have wires made of metals or metal alloys that primarily contain Ni, Fe, Cr, or Cu. So-called sheathed wires can also be used, for example, an Fe-Ni wire with a Cu sheath. The Cu layer can have a thickness of 1 pm to 100 pm.

[0010] Additionally, the wire can have another electroplated layer that at least partially covers the surface of the wire. The wires can be silver- or nickel-plated, for example. A tin layer or layers of Sn-Cu or Sn-Ag-Cu can also be applied in the connection area.

[0011] In the sensor arrangement, the temperature sensor head preferably has a temperature sensor element with a casing or encapsulation. The temperature sensor element preferably has a ceramic material. The temperature sensor element preferably has an NTC sensor chip. The sensor arrangement preferably has at least two electrodes in the temperature sensor head, more preferably exactly two electrodes (a first electrode and a second electrode). The electrodes serve to make electrical contact with the sensor element. For this purpose, the electrodes can be firmly connected to a surface of the sensor element. The electrodes are preferably applied to a top side and a bottom side of the sensor element. The electrodes preferably comprise or consist of Au, Ag, or layers of Ni-Au or Ni-Ag.

[0012] The wires are electrically and mechanically connected to the sensor element, preferably via the respective electrodes. The connection can be formed, for example, by soldering, welding, or sintering with a metal paste.

[0013] The correspondingly wired temperature sensor element preferably has the above-mentioned encapsulation in the head region, which surrounds the temperature sensor element. In other words, the temperature sensor head has an encapsulation. The temperature sensor head can thus be formed from the encapsulated temperature sensor element. The encapsulation allows the temperature sensor head to be chemically and mechanically protected, similar to a classic leadframe design.

[0014] According to a further embodiment, the encapsulation material can be glass or a polymer material. A composite material comprising glass and / or a polymer material is also generally considered. The advantage of glass encapsulation lies in the high chemical resistance of glass. A polymer material can also exhibit sufficient chemical resistance, but is lighter and can be applied at lower temperatures. This protects the temperature sensor element. The polymer can be, for example, epoxy, polyurethane, silicone, PEEK, PFA, or Teflon, or even a combination of these materials.

[0015] The wired temperature sensor element can additionally have an additional insulating layer made of a polymer. In the case of a glass-encapsulated temperature sensor head, the temperature sensor head and the connecting wires can have a layer made of a polymer, for example, PFA, PEEK, or silicone.

[0016] It is preferred that the carrier be flat or planar. The carrier is preferably non-electrically conductive, i.e., insulating.

[0017] The terms bendable and flexible can be understood here according to general technical understanding.

[0018] This arrangement has the advantage that mechanical stability does not have to be provided exclusively by the wires. Thus, in a structure according to the invention, the connecting wires can be thinner. The wires can have a thickness of 0.1 to 0.3 mm. Particularly thin wires can have a thickness of 0.05 to 0.15 mm.

[0019] Furthermore, the sensor arrangement according to the invention can be flexible or bendable. Thus, the carrier is at least partially flexible or bendable. The wires can also be selected to be so thin that the entire arrangement is flexible or bendable. In principle, the arrangement can be resiliently bendable. However, the arrangement preferably retains a shape induced by bending at least partially after the bending force no longer acts on the sensor arrangement. Thus, the temperature sensor element can be installed in applications in which deformation of the sensor arrangement is necessary.

[0020] The advantage of this design over a leadframe design is that, due to the flexibility explained above, there is a lower risk of the temperature sensor element being damaged or the connection points becoming detached if it is bent or deformed. On the other hand, similar measures to protect the temperature sensor element can be taken in the design according to the invention as in a leadframe design. A design according to the invention can be as flexible as a printed circuit board foil with an SMD-mounted temperature sensor. However, the disadvantage of SMD temperature sensors can be avoided, namely that the temperature sensor is influenced by a soldering process in the vicinity of the functional sensor unit. In an SMD design, a sensor arrangement can have a drifting standard resistance due to soldering, which is why the temperature measurement is less accurate and wider tolerance ranges have to be specified for a corresponding component.In addition, the risk that flux residues from a soldering process lead to contamination in the sensor system can be minimized.

[0021] A sensor arrangement according to the invention can, for example, have a length of 5 to 100 mm and a width of 1 to 10 mm. The invention is not limited to these dimensions, although longer and / or wider embodiments are also possible, depending on the application. The sensor head can have a width of 0.5 to 3.0 mm and preferably of 0.6 to 1.3 mm.

[0022] According to a further embodiment, the carrier extends from the connection points in a flat manner toward the temperature sensor head. The connecting wires are in contact with the carrier's upper surface at several points or even over the entire surface.

[0023] The connection points can, for example, be formed at one end of the carrier.

[0024] The carrier can extend along the connecting wires, i.e., if the connecting wires are straight and not yet deformed, they can extend parallel to the surface of the carrier. If the carrier extends along the connecting wires, the connecting wires can be in contact with the upper surface of the carrier at least at several points or over the entire surface.

[0025] The latter embodiment has the advantage that the contact provides mechanical support for the connecting wires. In the area where the carrier supports the connecting wires in the appropriate manner, the carrier is preferably completely flexible.

[0026] An adhesive layer can be applied to the upper side of the carrier. This can assist in the mechanical stabilization of the carrier. This also allows the sensor to be fixed in place during installation in the system. This is particularly preferred in conjunction with a cover layer. According to a further embodiment, the carrier extends from the connection points to at most the temperature sensor head. This leaves the temperature sensor head exposed. This can enable faster response times of the temperature sensor element.

[0027] According to an alternative to this embodiment, the carrier can extend from the connection points toward the temperature sensor head to such an extent that the temperature sensor head at least partially overlaps with the carrier. This partial overlap can be observed, in particular, in a local projected plan view of the carrier's upper side in the region of the temperature sensor head. The carrier can thus provide mechanical support for the head. Furthermore, the carrier can mechanically or chemically protect the temperature sensor head.

[0028] According to a further embodiment, a flexible cover layer can be arranged over the upper side of the carrier in such a way that at least parts of the connecting wires are embedded in a sandwich-like manner between the carrier and the cover layer.

[0029] This has the advantage that the cover layer can provide additional mechanical stabilization. It can also provide additional protection for the wires. The flexibility of the cover layer maintains the bendability and flexibility of the sensor arrangement.

[0030] In addition to or as an alternative to the topcoat, a varnish can be applied over the top surface of the substrate. This can cover the connecting wires from the side not in contact with the substrate. The varnish can provide additional protection.

[0031] According to a further aspect, the cover layer can be designed as a flexible film. The flexible film can in particular be a PI film (polyimide film), such as a Kapton film or PET film (polyethylene terephthalate film). PI films are particularly preferred for application temperatures above 80°C due to their heat resistance. For other applications, inexpensive PET may be preferred. The cover layer can generally comprise PI or PET or consist of PI or PET.

[0032] PI or PET is well suited as a cover layer material because it is flexible, sufficiently chemically inert, easy to install, and electrically insulating. The cover layer, in the form of a flexible film, can have a thickness of 0.005 to 0.1 mm.

[0033] According to a further embodiment, the temperature sensor head is free-standing and is not covered by a carrier and / or cover layer. It is preferred that the temperature sensor head according to this embodiment is not covered by a carrier or cover layer.

[0034] This offers the advantage already mentioned for the support. On the one hand, the connecting wiring can be supported and protected over a large area, while on the other hand, the temperature sensor head is exposed, allowing for a rapid response time.

[0035] According to a further embodiment, the temperature sensor head is partially or preferably completely encased by the carrier and / or cover layer. For example, the temperature sensor head can be sandwiched between the carrier and cover layer, with both extending beyond the temperature sensor head in the direction of extension but also laterally. Alternatively, the carrier and cover layer can have different lengths or widths, such that one of the two components ends in front of the temperature sensor head or only partially covers it, and the other component is folded around the temperature sensor head. In general, the type of encasing by the carrier and / or cover layer is not limited.

[0036] According to a further embodiment, the spacing of the wires at the connection points is greater than in the area of ​​the temperature sensor head. In particular, similar to a leadframe design, the connecting wires can extend from the head to the connection points in a spread or V-shaped manner. The spreading does not have to be uniform across the entire length of the connecting wire.

[0037] In particular, such a wire guide can define a two-dimensional surface. If the sensor arrangement is bent, this surface is correspondingly curved. Preferably, the surface contour is also reproduced by the carrier and any cover layer.

[0038] According to a further embodiment, the carrier is a flexible carrier film or a flexible printed circuit board. The printed circuit board can also be designed as a film. In these embodiments, the carrier does not have to be flexible over its entire surface, but can have flexible regions and less flexible regions. The flexible regions of the carrier can preferably have a thickness of 0.005 to 0.2 mm and particularly preferably of 0.05 to 0.15 mm. A flexible PCB board, also referred to as a flexboard, can be considered in particular as a flexible printed circuit board.

[0039] The carrier is preferably made of a flexible insulating material. PI or PET are particularly suitable here. The material of the carrier and any cover film can differ. However, it is generally preferred that they be the same. In this case, temperature-related distortion of the sensor arrangement can be avoided by different expansion coefficients of the carrier and cover film.

[0040] According to a further embodiment, external connection contacts are formed in a connection region of the carrier. The external connection contacts are electrically connected to the connection points. Thus, the temperature sensor element can be externally electrically contacted in an application via the connection region thus formed. The connection region can be, for example, 3 to 7 mm long in the direction of extension. If required for the application, the connection region can also have other dimensions.

[0041] The connection region can, for example, be formed at one end of a carrier. The other end of the carrier can be formed in the region of the temperature sensor head.

[0042] The connection between the connection points and the external connection contacts can be made in any way. In particular, measures such as conductor tracks, solder pads, plug contacts, holes or vias, or rewiring are considered. External connection can be made in any way, depending on the design of the connection area. In particular, plugging, soldering, welding, or even gluing with electrical contact are possible for integrating the sensor arrangement into an application.

[0043] Due to the flexibility or bendability of the sensor arrangement according to the invention, the connection area can be oriented differently than the temperature sensor head during or after installation in an application. The direction can be adjusted by bending.

[0044] The external connection contacts can be arranged on a carrier underside. The carrier underside is the side of the flat carrier opposite the carrier top. This can contribute to spatial equalization of external connection contacts and connection points.

[0045] According to a further embodiment, the carrier has reduced flexibility in the connection area compared to other parts of the carrier. The carrier can be stiffened, particularly in this area. The reduced flexibility in the connection area can facilitate installation and electrical contacting. The stiffening can also improve the overall stability of the sensor arrangement.

[0046] The non-stiffened part of the support can, for example, have a length of 5 to 100 mm in the direction of extension. Other lengths are also possible, depending on the application. According to a variation of the last embodiment, the reduced flexibility or the stiffening in the connection area can be achieved at least in part by the support having an increased thickness in this area. The thickness can be increased by any desired measures. For example, several layers of the support material can be applied to one another. Alternatively, the thickness of an individual material layer can expand in this area. The thickness can also be increased by applying or gluing other materials. Increasing the thickness represents a technically simple measure for increasing stiffness. A thickness in the thickened connection area can be from 0.2 to 2 mm.The thickness of the support in the flexible, non-thickened area can correspond to the values ​​given above.

[0047] According to a further embodiment, structures are provided in the support and, if appropriate, in any cover layer that are designed to temporarily or permanently secure the sensor arrangement. Structures that allow mechanical intervention are particularly preferred, for example, to enable temporary fixation during installation or permanent fixation in the installed state.

[0048] In particular, bulges in the carrier and / or the cover layer come into consideration here, which enable manual intervention or intervention by means of a correspondingly complementary structure. Furthermore, punched outs or holes can be introduced, which enable such intervention, as an alternative or in addition. The holes can particularly preferably be formed in the connection area or in the area of ​​the temperature sensor head. The holes are preferably not formed exactly above the temperature sensor head. They are preferably formed in the above-mentioned direction of extension either in front of, behind or next to the temperature sensor head. The holes can, for example, have a diameter of 0.5 to 3 mm. Depending on the application, the holes can also have other diameters or shapes (oval, elongated hole, rectangular).

[0049] According to a further embodiment, a method for producing a sensor arrangement is provided. The sensor arrangement can have all of the above-mentioned properties. According to the method, a temperature sensor head with connecting wiring is first provided. This can be the above-mentioned connecting wiring. The connecting wiring is attached electrically and mechanically to two connection points on the upper side of a carrier. The carrier has the above-mentioned properties and is flexible at least in one partial area(s). In the finished component, the carrier mechanically supports at least parts of the connecting wires and / or the carrier head.

[0050] The carrier can be provided in strip form or pre-punched as a card. Several carriers can be connected to each other via thin tabs, which are then cut free after assembly.

[0051] Furthermore, the carrier can have an adhesive layer, or a process step can be performed in which an adhesive layer is applied to the carrier's upper surface before the sensor head with the connecting wires is attached. The adhesive layer can hold the subsequently applied components in position before the connecting wires are electrically and mechanically contacted.

[0052] The adhesive layer can be applied to the inside of the carrier or the cover layer to secure the wires during sensor assembly. Furthermore, the adhesive layer supports the joining of the carrier and the cover layer to bond the two films. For example, in one process step, the sensor can be bonded to the carrier with the connecting wires spread out, and then the cover layer can be bonded to the carrier.

[0053] The connection between the terminals and the connecting wires can be established by any means. In particular, welding or soldering can be used. If soldering is used, a solder paste is first applied and then soldering is performed. Soldering can be performed by induction, IR radiation, or laser. Welding can be performed by laser welding, thermode welding, or resistance welding.

[0054] Furthermore, a flexible topcoat can optionally be applied. Alternatively or additionally, a topcoat can be sprayed on. The topcoat is preferably applied before any topcoat is applied.

[0055] Furthermore, the method can comprise a step of electrical contact testing and quality control. Production can in particular also comprise the step of packaging the NTC sensor arrangement. Alternatively or additionally, the above-mentioned punching and subsequent packaging can be carried out. The invention is explained in more detail below with reference to exemplary embodiments and associated figures. The figures are schematic and not to scale. Neither absolute nor relative size information can be derived from them. Components that are identical or have the same effect are provided with the same reference symbols in the various figures.

[0056] Figure 1 shows a first embodiment of a sensor arrangement.

[0057] Figure 2 shows a second embodiment of a sensor arrangement.

[0058] Figure 3 shows a third embodiment of a sensor arrangement.

[0059] Figure 4 shows a fourth embodiment of a sensor arrangement.

[0060] Figure 1 shows a first exemplary embodiment of a sensor arrangement. The sensor arrangement comprises a temperature sensor head 1. The temperature sensor head 1 comprises an NTC temperature sensor as the temperature sensor element and an encapsulation (not explicitly shown). A first connecting wire 2 and a second connecting wire 3 are arranged on the temperature sensor head 1. Together these form the connecting wiring of the temperature sensor head 1. The first connecting wire 2 and the second connecting wire 3 lead away from the temperature sensor head 1 in a V-shape or spread out. In the plan view according to Figure 1 it can be seen that the connecting wires 2 and 3 lie flat on a carrier 4. Only a small area in the vicinity of the temperature sensor head 1 is not in contact with the carrier 4.

[0061] On a top side of the carrier 4, which is the side facing the viewer in Figure 1, a first connection point 6 and a second connection point 7 are formed in a connection region 5. The first connection wire 2 and the second connection wire 3 are each in electrical and mechanical contact with one of the two connection points 6 and 7. The connection points 6 and 7 are formed as metallized pads on the carrier 4. Contact can be made by soldering or welding. A soldered connection can be made in particular with the aid of a solder paste and induction soldering, IR beam soldering or laser soldering. Welding can be carried out by means of laser welding, thermode welding or resistance welding. Optionally, an adhesive layer (not explicitly shown) can be applied to the top side of the carrier to improve the mechanical contact between the connection wires and the carrier.

[0062] As shown, the shape of the carrier 4 largely follows the shape of the connecting wires 2 and 3. This prevents large protruding areas of the carrier 4 in the sensor arrangement and still allows a mechanical stabilization of the connecting wires.

[0063] The carrier 4 supports the connecting wires in an area in which physical contact is formed. This helps to ensure that comparatively thin connecting wires of 0.15 mm can be used. This means that thinner wires can be used than is possible in a leadframe design. The carrier 4 is mechanically flexible in the area which is not the external connection area 5. Together with the thin wires, this enables the sensor arrangement to be bent perpendicular to the representation plane. Bending within the representation plane is restricted by the V-shaped structure of the wires.

[0064] As shown, the temperature sensor head 1 is completely exposed and does not overlap with the carrier 4. This enables particularly good and direct thermal coupling, e.g., of a medium to be measured in an application, which is why short response times can be achieved. The encapsulation adequately protects the carrier against chemical influences or similar, and in particular against corrosion.

[0065] The connecting wires may be uninsulated. Alternatively, they may be insulated (not shown), in which case the electrical contact areas are at least partially stripped.

[0066] Alternatively or additionally, a varnish can be applied, which has the advantages explained above.

[0067] Furthermore, external connection contacts are preferably formed in the connection area 5. These are not explicitly shown here. These can be formed in addition to the connection points on the upper side of the carrier. The external connection contacts are preferably formed on the underside of the carrier, i.e. on the side of the carrier 4 facing away from the viewer. The external connection contacts can enable a soldered contact, a welded contact or a plug-in contact when the sensor arrangement is installed in an application. The electrical connection of the external connection contacts to the connection points can be achieved by any desired measures such as conductor tracks, edge-encompassing

[0068] Metallizations, vias / holes or rewiring.

[0069] Carrier 4 is designed as a flexible PCB carrier board. This board has a reinforcement or thickening in the connection area, which reduces flexibility. Here, the carrier has a thickness of approximately 0.8 mm. In the remaining area, carrier 4 is largely designed as a foil and has a thickness of 0.08 mm.

[0070] The sensor array is approximately 30 mm long, the connection area is approximately 5 mm long. The flexible area is approximately 25 mm long. The width is approximately 8 mm. The temperature sensor head has a width of 0.8 ± 0.1 mm. The rated resistance (RR) is 100 kΩ ± 1.5 %. The rated temperature (T) is 25 °C. The B-value (B (25 / 100)) is 4092 K ± 1.0 %.

[0071] The sensor arrangement shown can be manufactured as follows: First, the encapsulated and wired NTC thermistor is prepared. This means that all components 1, 2 and 3 of Figure 1 are provided. Furthermore, the carrier 4 is provided with a reinforced connection area 5 and contact pads as the first connection point 6 and second connection point 7 as well as external connection contacts in the connection area (not shown). The contact pads are suitable for soldering or welding the connection wires 2 and 3 and thus for the electrical connection of the NTC thermistor. The carrier 4 can be provided in strip form or pre-punched as a card. It can be connected via thin tabs that are later cut free after assembly. In preparation for mounting the NTC thermistor or the connection wires on the flexible carrier 4, the carrier 4 can be provided or have been provided with an adhesive layer on its upper side.This fixes the aforementioned components to the carrier surface. If soldering is used as the connection method, a solder paste is applied to the contact pads. Soldering is then carried out using induction, IR radiation or laser. Alternatively, a connection can be made by welding. In particular, laser welding, thermode welding or resistance welding can be used. A topcoat can be sprayed on. Finally, a quality control with contact testing can be carried out. The tape or card can be separated from other elements in production.

[0072] If connecting wires 2 and 3 are provided as insulated wires, they must be stripped before contacting the contact pads. This can be performed as an additional process step.

[0073] Figure 2 shows a second exemplary embodiment of a sensor arrangement. The second exemplary embodiment of the sensor arrangement is largely identical to the first exemplary embodiment in Figure 1. As shown, however, the carrier 4 has a different, namely more rectangular shape. In addition, the sensor arrangement is designed such that the carrier overlaps the temperature sensor head 1 in the direction away from the connection contacts 6 and 7. The temperature sensor head 1 is therefore not completely free. The temperature sensor head 1 can therefore be mechanically stabilized by the carrier 4. In addition, the carrier 4 offers mechanical and chemical protection. The sensor arrangement according to the second exemplary embodiment has a length of approximately 30 mm; the connection region has a length of approximately 5 mm in this length or extension direction. The flexible region has a length of approximately 25 mm.

[0074] A manufacturing process can be carried out in accordance with that shown in Figure 1.

[0075] Figure 3 shows a third exemplary embodiment of a sensor arrangement. This has all the mandatory features of the sensor arrangement according to Figure 1. Optionally, it can also have the features described there as optional. In addition, a cover layer 8 is formed. This is in the form of a polyimide film (e.g. Kapton) with a thickness of 0.08 mm. The connecting wires are sandwiched between the carrier 4 and the cover layer 8 over a large part of their length. This offers further mechanical stabilization as well as chemical protection.

[0076] The provision of an adhesive layer on the upper side of the carrier can improve the bond between the cover layer 8 and the carrier 4. An adhesive layer can also be applied exclusively to the cover layer 8. Both components can also be provided with an adhesive layer, so that the connecting wires are bonded on both sides.

[0077] As shown, the temperature sensor head is completely exposed in this example, which enables a particularly fast response time.

[0078] The manufacturing process corresponds to the process explained for the first embodiment. It also includes applying the cover layer after attaching the terminating wires.

[0079] Figure 4 shows a fourth exemplary embodiment of a sensor arrangement. This basically has all the features explained in relation to Figure 3. However, it differs in that both the carrier 4 and the cover layer 8 completely cover the temperature sensor head in the plan view. The sensor head is not visible in the illustration. The cover layer and also the carrier can be at least partially transparent, which is why the sensor head can also be visible. Only one sensor head region 1' is addressable. In the current exemplary embodiment, the carrier 4 and the cover layer 8 have the same shape, at least in the sensor head region 1'. Alternatively, however, one of the two components can have a different shape and the temperature sensor head can be completely enclosed by folding over or something similar of one of the two components.

[0080] Completely enclosing the temperature sensor head provides additional protection against external influences.

[0081] Additionally, in the exemplary embodiment, holes 9a and 9b are provided in the connection area 5 and in the sensor head area 1'. The diameter of the holes is 1 mm. The holes allow mechanical intervention during installation or, in the installed state, for fastening.

[0082] The sensor assembly of the present embodiment has a length of approximately 35 mm. The connection area has a length of approximately 5 mm. The flexible area has a length of approximately 30 mm. The width is approximately 8 mm in the connection area and approximately 3 mm in the sensor head area. List of reference symbols

[0083] 1 temperature sensor head

[0084] 1 ' Sensor head area 2 first connecting wire

[0085] 3 second connecting wire

[0086] 4 carriers

[0087] 5 Connection area

[0088] 6 first junction 7 second junction

[0089] 8 top layer

[0090] 9a, 9b hole

Claims

Patent claims 1. Sensor arrangement comprising a temperature sensor head with a temperature sensor element, a carrier with two connection points on a carrier top side, wherein the carrier is flexible at least in a partial area, a connection wiring comprising a first connection wire and a second connection wire which electrically and mechanically connect the temperature sensor element to the connection points, wherein the carrier mechanically supports at least parts of the connection wires and / or the carrier head.

2. Sensor arrangement according to claim 1, wherein the carrier extends from the connection points in a planar manner in the direction of the sensor head, wherein the connecting wires are in contact with the upper side of the carrier at several points or in a planar manner.

3. Sensor arrangement according to claim 2, wherein a flexible cover layer is arranged over the upper side of the carrier such that at least parts of the connecting wires are embedded in a sandwich-like manner between the carrier and the cover layer.

4. Sensor arrangement according to claim 3, wherein the cover layer is designed as a flexible film.

5. Sensor arrangement according to claim 3 or 4, wherein the sensor head is free-standing and is not covered by a carrier and / or cover layer.

6. Sensor arrangement according to claim 3 or 4, wherein the sensor head is completely enclosed by the carrier and / or cover layer.

7. Sensor arrangement according to one of claims 1 to 6, wherein the distance between the wires at the connection points is greater than in the region of the temperature sensor head.

8. Sensor arrangement according to one of claims 1 to 7, wherein the carrier is a flexible carrier film or a flexible printed circuit board.

9. Sensor arrangement according to one of claims 1 to 8, wherein external connection contacts are formed in a connection region of the carrier and the external connection contacts are electrically connected to the connection points, so that the sensor element can be electrically contacted via the connection region and by means of the external connection contacts.

10. Sensor arrangement according to claim 9, wherein the carrier has a reduced flexibility in the connection region compared to other parts of the carrier.

11. Sensor arrangement according to claim 10, wherein the reduced flexibility in the connection region is achieved at least partially by an increased thickness compared to other parts of the carrier.

12. Sensor arrangement according to one of claims 1 to 11, wherein the temperature sensor head additionally comprises an encapsulation which encloses the temperature sensor element.

13. Sensor arrangement according to claim 12, wherein the material of the encapsulation is selected from glass and / or polymer material.

14. Sensor arrangement according to one of claims 1 to 13, wherein the connecting wires are at least partially insulated.

15. Sensor arrangement according to one of claims 1 to 14, wherein structures are provided in the carrier which are designed to temporarily or permanently fasten the sensor arrangement.

16. Sensor arrangement according to one of claims 1 to 15, wherein an adhesive layer is applied to the upper side of the carrier.

17. Method for producing a sensor arrangement comprising the steps Providing a temperature sensor head with connecting wiring comprising a first connecting wire and a second connecting wire, electrically and mechanically connecting the connecting wires to two connection points which are formed on a carrier top side of a carrier, wherein the carrier is flexible at least in a partial area and mechanically supports at least parts of the connecting wires and / or the carrier head.

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